WO2018098801A1 - 一种利用室温转移压印技术图案化热塑性聚合物的方法 - Google Patents

一种利用室温转移压印技术图案化热塑性聚合物的方法 Download PDF

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WO2018098801A1
WO2018098801A1 PCT/CN2016/108343 CN2016108343W WO2018098801A1 WO 2018098801 A1 WO2018098801 A1 WO 2018098801A1 CN 2016108343 W CN2016108343 W CN 2016108343W WO 2018098801 A1 WO2018098801 A1 WO 2018098801A1
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thermoplastic polymer
substrate
template
patterning
room temperature
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French (fr)
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石刚
车友新
李赢
王大伟
倪才华
王利魁
桑欣欣
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Jiangnan University
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Jiangnan University
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

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  • the present invention relates to the field of material micro/nano processing techniques, and more particularly to a method of patterning a thermoplastic polymer using room temperature transfer imprinting techniques.
  • Patterned functional materials are increasingly used in electronics, optics, bionics, energy, etc. So far, there are a variety of techniques for patterning materials, such as lithography, nanoimprinting, Scanning probe technology, interface assembly technology, etc.
  • thermoplastic polymers are typically achieved by nanoimprinting methods.
  • the traditional nanoimprinting is hot stamping. It is a layer of thermoplastic polymer material, such as polymethyl methacrylate or polystyrene, which is heated onto the glass transition temperature (T g ). The polymer is filled into the template cavity by mechanical pressurization; and then cooled to a pressure below Tg to release the patterned material.
  • T g glass transition temperature
  • CN105487151A reports a method for preparing a grating based on nanoimprinting pattern transfer
  • CN105619774A reports a method for preparing a superhydrophobic material based on hot stamping.
  • thermoplastic materials high temperature and high pressure, high energy consumption, long inter-turn cycle, which is not conducive to mass production; and high temperature environment limits the patterning of thermoplastic materials on the surface of polymer substrates; Since the thermoplastic material is attached to the planar substrate by spin coating, the process is difficult to achieve on a non-flat substrate such as a curved surface, which affects subsequent imprinting.
  • the object of the present invention is to overcome the shortcomings of high temperature and high pressure, long power consumption and expensive equipment in the conventional thermoplastic polymer patterning process, and to provide a method for efficiently patterning a thermoplastic polymer at room temperature. It realizes the normal temperature, normal pressure and rapid patterning of thermoplastic polymers, and is suitable for soft substrates, hard substrates, flat substrates and curved substrates, which is beneficial to the popularization of this method.
  • the one is patterned by using room temperature transfer imprint technology.
  • the method of polymer characterized in that it comprises the following steps:
  • thermoplastic polymer solid is dissolved into a solvent by ultrasonication and heating, and the solvent is selected according to a similarly compatible polarity principle to obtain a thermoplastic polymer solution;
  • thermoplastic polymer solution spin coating or spraying a thermoplastic polymer solution on the surface of the soft template of the convex-concave structure, after the solvent is evaporated, to obtain a soft template with a thermoplastic polymer attached to the surface;
  • the soft template coated with the thermoplastic polymer on the surface treated by the step (3) is brought into contact with the hydrophilic substrate at room temperature, and the hydroxyl group on the surface of the thermoplastic polymer hydrogen bonds with the hydroxyl group on the surface of the substrate.
  • the soft template is separated from the surface of the substrate, and the thermoplastic polymer on the surface of the soft template is transferred to the surface of the substrate.
  • thermoplastic polymer in the step (1) includes polymethyl methacrylate, polystyrene, polyurethane, polyethylene, polypropylene, polyvinyl chloride, polydibutylene, polyvinyl alcohol, polyphenylene. Ethylene-butadiene copolymer, poly-p-styrene-polyethylene oxide copolymer, ABS resin, polyacrylamide, polyethylene oxide
  • the soft template in the steps (2), (3) and (4) comprises a polydimethylsiloxane template, an ethylene propylene diene rubber template, a perfluoropolyether template, and a urethane acrylate template.
  • the substrate in the step (4) comprises a planar and curved silicon wafer, a silicon oxide wafer, a gallium arsenide wafer, a quartz wafer, a conductive glass sheet, and a polymer sheet.
  • the hydrophilic substrate in the step (4) is obtained by treating the substrate with oxygen plasma, ultraviolet ozone or a hydrophilic aqueous solution.
  • the hydrophilic method of the solution treatment in the step (4) is to place the substrate in a mixed aqueous solution of ammonia water and hydrogen peroxide, or to place the substrate in a mixed solution of concentrated sulfuric acid and hydrogen peroxide, and heat at 50 to 90 ° C. Processing under conditions.
  • the room temperature in the step (4) is 0 to 40 °C.
  • the present invention has the following advantages: [0017] (1) The thermoplastic polymer is patterned at normal temperature and pressure to avoid the process of high temperature and high pressure energy consumption; [0018] (2) The thermoplastic polymer is not required to be expensive in the patterning process, and the power consumption is short. Improve the efficiency of patterning;
  • thermoplastic polymer on the surfaces of the planar substrate, the curved substrate, the hard substrate, and the soft substrate can be achieved.
  • FIG. 1 is a schematic view of a process for patterning a thermoplastic polymer using a room temperature transfer imprint technique
  • Example 2 is an atomic force microscope photograph of a polymethyl methacrylate strip obtained in Example 1;
  • Example 3 is a micrograph of a polymethyl methacrylate strip obtained on the outer wall surface of the capillary tube in Example 2, wherein the inset is an enlarged view.
  • Step 1 Dissolution of the thermoplastic polymer
  • PMMA Polymethyl methacrylate
  • the PDMS is separated from the silicon template to obtain a PDMS soft template.
  • Step 3 Spin coating thermoplastic polymer on the surface of the soft template
  • the PMMA solution was spin-coated on the surface of the PDMS soft template to obtain PD with PMMA on the surface.
  • Step 4 The hydrophilicity of the thermoplastic polymer on the surface of the soft template
  • the PMMA on the surface of the PDMS is treated with oxygen plasma to ensure that the surface of the PMMA is hydrophilic, with the following conditions:
  • the oxygen flow rate is 100 m! Jmin, the power is 45 W, and the daytime is 30 s.
  • Step 5 Hydrophilic treatment of the substrate
  • the silicon substrate is hydrolyzed by a solution method, specifically, a silicon wafer is placed in a mixed solution of concentrated sulfuric acid and hydrogen peroxide in a volume ratio of 7:3, and heated at 90 ° C for 2 h. After taking out, rinse with distilled water and blow dry with nitrogen.
  • Step 6 Transfer of the polymer to the surface of the substrate
  • the PDMS soft template with the hydrophilic PMMA attached to the surface obtained in the fourth step is contacted with the hydrophilic silicon substrate obtained in the step 5 at room temperature, after passing through 60
  • the PDMS is separated from the surface of the wafer substrate, and the PMMA on the PDMS surface is transferred to the surface of the substrate.
  • Step 1 Dissolution of the thermoplastic polymer
  • PMMA Polymethyl methacrylate
  • Step 2 Preparation of soft template
  • the PDMS is separated from the silicon template to obtain a PDMS soft template.
  • Step 3 Spin coating thermoplastic polymer on the surface of the soft template
  • the PMMA solution was spin-coated on the surface of the PDMS soft template to obtain PD with PMMA on the surface.
  • Step 4 The hydrophilicity of the thermoplastic polymer on the surface of the soft template
  • the PMMA on the surface of the PDMS is treated with oxygen plasma to ensure the hydrophilicity of the PMMA surface under the following conditions:
  • the oxygen flow rate is lOO m! Jmin, the power is 45 W, and the daytime is 30 s.
  • Step 5 Hydrophilic treatment of the substrate
  • the outer wall of the capillary having a diameter of 10 mm was hydrolyzed by a solution method, specifically, a capillary solution was placed in a mixed solution of concentrated sulfuric acid and hydrogen peroxide in a volume ratio of 7:3, and heated at 90 ° C for 2 h. After taking out, rinse with distilled water and blow dry with nitrogen.
  • Step 6 Transfer of the polymer to the surface of the substrate
  • step four at room temperature, the surface obtained in step four is attached with a hydrophilic PMMA PDMS soft template and step 5 The resulting hydrophilic capillary is in contact with the outer wall, after passing through 200
  • the PDMS is separated from the surface of the outer wall of the capillary, and the PMMA on the surface of the PDMS is transferred to the surface of the outer wall of the capillary.
  • Step 1 Dissolution of the thermoplastic polymer
  • the polystyrene (PS) solid was ultrasonically dissolved in an acetone solution to prepare a Ps solution having a mass concentration of 2%.
  • Step 3 Spin coating thermoplastic polymer on the surface of the soft template
  • the PS solution was spin-coated on the surface of the PDMS soft template to obtain a PDMS soft template with PS attached to the surface.
  • Step 4 Hydrophilic surface of the thermoplastic polymer on the soft template
  • the PS of the surface of the PDMS is treated with oxygen plasma to ensure the hydrophilicity of the PMMA surface under the following conditions: the oxygen flow is 100 m! Jmin, the power is 45 W, and the daytime is 30 s.
  • Step 5 Hydrophilic treatment of the substrate
  • the silicon substrate is hydrolyzed by a solution method, specifically, a silicon wafer is placed in a mixed solution of concentrated sulfuric acid and hydrogen peroxide in a volume ratio of 7:3, and heated at 90 ° C for 2 h. After taking out, rinse with distilled water and blow dry with nitrogen.
  • Step 6 Transfer of the polymer to the surface of the substrate
  • the PDMS soft template with the hydrophilic PS attached to the surface obtained in the step 4 is contacted with the hydrophilic silicon substrate obtained in the step 5 at room temperature, and after 30 s, the PDMS is separated from the surface of the silicon substrate.
  • the PS of the PDMS surface is transferred to the surface of the substrate.
  • Step 1 Dissolution of the thermoplastic polymer
  • the PDMS is separated from the silicon template to obtain a PDMS soft template.
  • Step 3 Spin coating thermoplastic polymer on the surface of the soft template
  • the PMMA solution was spin-coated on the surface of the PDMS soft template to obtain PD with PMMA on the surface.
  • the PMMA on the surface of the PDMS is treated with oxygen plasma to ensure the hydrophilicity of the PMMA surface under the following conditions:
  • the oxygen flow rate is 100 m! Jmin, the power is 45 W, and the daytime is 30 s.
  • Step 5 Hydrophilic treatment of the substrate
  • the conductive glass substrate is hydrophilic by a solution method, specifically, a conductive glass substrate is placed in a mixed solution of concentrated sulfuric acid and hydrogen peroxide in a volume ratio of 7:3, and heated at 90 ° C for 2 h. After taking out, rinse with distilled water and blow dry with nitrogen.
  • Step 6 Transfer of the polymer to the surface of the substrate
  • the PDMS soft template with the hydrophilic PMMA attached to the surface obtained in the step 4 is contacted with the hydrophilic conductive glass substrate obtained in the step 5 at room temperature, and after 5 s, the PDMS is separated from the surface of the conductive glass substrate. The PMMA on the PDMS surface is transferred to the surface of the substrate.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

一种利用室温转移压印技术图案化热塑性聚合物的方法,该方法包括以下步骤:首先将热塑性聚合物固体溶解到溶剂中;然后将热塑性聚合物溶液旋涂或喷涂在软模板表面;再使得软模板上的热塑性聚合物表面亲水;最后在室温环境中将上一步得到的软模板与亲水基底接触,软模板表面的聚合物转移到基底表面。本发明涉及的室温转移压印技术可以在常温、常压下快速图案化热塑性聚合物,并且可以实现在多种基底表面的压印。

Description

一种利用室温转移压印技术图案化热塑性聚合物的方法 技术领域
[0001] 本发明涉及材料微纳加工技术领域, 尤其涉及一种利用室温转移压印技术图案 化热塑性聚合物的方法。
背景技术
[0002] 图案化的功能材料在电子学、 光学、 仿生学、 能源等领域的应用日益广泛, 到 目前为止, 有多种技术可以实现材料表面图案化, 例如, 光刻技术、 纳米压印 、 扫描探针技术、 界面组装技术等。
[0003] 通常热塑性聚合物的图案化是通过纳米压印方法实现的。 传统的纳米压印也就 是热压印, 是在基底上旋涂一层具有热塑性的聚合物材料, 如聚甲基丙烯酸甲 酯、 聚苯乙烯等, 加热到玻璃转化温度 (T g) 以上后通过机械加压使聚合物填 充进模板空腔; 再冷却到 T g以下脱模即可得到图案化的材料。 CN105487151A报 道了一种基于纳米压印的图形转移制备光栅的方法; CN105619774A报道了一种 基于热压印的超疏水材料的制备方法。 但这些方法只适用于热塑性较好的材料 , 需要高温高压, 耗能较高, 吋间周期较长, 不利于批量生产的进行; 并且高 温环境限制了在聚合物基底表面图案化热塑性材料; 同吋由于热塑性材料是通 过旋涂附着在平面基底上, 但该过程很难在曲面等非平整的基底上实现, 影响 后续的压印。
技术问题
[0004] 本发明目的是为了克服传统热塑性聚合物图案化过程中高温高压、 耗吋长及设 备昂贵的缺点, 提供一种室温条件下高效图案化热塑性聚合物的方法。 实现热 塑性聚合物常温、 常压、 快速的图案化, 适用于软基底、 硬基底、 平面基底及 曲面基底, 利于该方法的推广。
问题的解决方案
技术解决方案
[0005] 按照本发明提供的技术方案, 所述的一种利用室温转移压印技术图案化热塑性 聚合物的方法, 其特征是, 包括以下步骤:
[0006] (1) 首先通过超声和加热, 将热塑性聚合物固体溶解到溶剂中, 溶剂的选择 遵循相似相容的极性原则, 得到热塑性聚合物溶液;
[0007] (2) 然后在凸凹结构的软模板表面旋涂或喷涂热塑性聚合物溶液, 待溶剂挥 发完毕, 得到表面附有热塑性聚合物的软模板;
[0008] (3) 然后过氧等离子体或紫外臭氧处理, 使得步骤 (2) 中软模板上的热塑性 聚合物表面产生大量羟基, 从而达到亲水效果;
[0009] (4) 最后在室温下将经过步骤 (3) 处理后的表面附有热塑性聚合物的软模板 与亲水基底接触, 热塑性聚合物表面的羟基与基底表面的羟基发生氢键作用, 经过 5 ~ 600 s后, 将软模板从基底表面分离幵, 软模板表面的热塑性聚合物转移 到基底表面。
[0010] 进一步的, 步骤 (1) 中的热塑性聚合物包括聚甲基丙烯酸甲酯、 聚苯乙烯、 聚氨酯、 聚乙烯、 聚丙烯、 聚氯乙烯、 聚二丁烯、 聚乙烯醇、 聚苯乙烯-丁二烯 共聚物、 聚对苯乙烯-聚氧化乙烯共聚物、 ABS树脂、 聚丙烯酰胺、 聚环氧乙烷
[0011] 进一步的, 步骤 (2) 、 (3) 及 (4) 中的软模板包括聚二甲基硅氧烷模板、 三元乙丙橡胶模板、 全氟聚醚模板、 聚氨酯丙烯酸酯模板。
[0012] 进一步的, 步骤 (4) 中的基底包括平面及曲面的硅片、 氧化硅片、 砷化镓片 、 石英片、 导电玻璃片、 聚合物片。
[0013] 进一步的, 步骤 (4) 中的亲水基底是通过氧等离子体、 紫外臭氧或亲水溶液 处理基底而得到的。
[0014] 进一步的, 步骤 (4) 中溶液处理亲水方法是将基底放在氨水和双氧水的混合 水溶液中, 或将基底放在浓硫酸和双氧水的混合溶液中, 在 50 ~ 90 °C加热条件 下进行处理。
[0015] 进一步的, 步骤 (4) 中的室温为 0 ~ 40 °C。
发明的有益效果
有益效果
[0016] 本发明具有以下优越性: [0017] (1) 热塑性聚合物在常温常压下进行图案化, 避免了高温高压耗能的过程; [0018] (2) 热塑性聚合物图案化过程中无需价格高昂的设备, 耗吋短, 提高图案化 效率;
[0019] (3) 可以实现热塑性聚合物在平面基底、 曲面基底、 硬基底及软基底表面的 图案化。
对附图的简要说明
附图说明
[0020] 图 1为一种利用室温转移压印技术图案化热塑性聚合物的工艺示意图;
[0021] 图 2为实施例 1中得到的聚甲基丙烯酸甲酯条带的原子力显微镜照片;
[0022] 图 3为实施例 2中在毛细管外壁表面上得到的聚甲基丙烯酸甲酯条带的显微镜图 片, 其中插图为放大图。
本发明的实施方式
[0023] 实施例 1
[0024] 步骤一: 热塑性聚合物的溶解
[0025] 将聚甲基丙烯酸甲酯 (PMMA) 固体超声加热溶解到丙酮溶液中, 配制成质量 浓度为 2.5%的 PMMA溶液。
[0026] 步骤二: 软模板的制备
[0027] 称取聚二甲基硅氧烷 (PDMS) 的预聚体和引发剂, 质量比为 10: 1, 搅拌混合
; 然后浇铸在条带宽度为 3 μηι、 间距为 Ι μηι的硅模板上, 在 60 °C的环境下固化
; 固化后将 PDMS与硅模板分离, 即得到 PDMS软模板。
[0028] 步骤三: 在软模板表面旋涂热塑性聚合物
[0029] 在旋转速度为 4000 rpm、 旋转吋间为 30
s的条件下, 将 PMMA溶液旋涂在 PDMS软模板表面, 得到表面附有 PMMA的 PD
MS软模板。
[0030] 步骤四: 软模板表面热塑性聚合物的亲水
[0031] 用氧等离子体处理 PDMS表面的 PMMA, 保证 PMMA表面亲水, 其条件为: 氧 气流量是 lOO m!Jmin, 功率为 45 W, 吋间为 30 s。 [0032] 步骤五: 基底的亲水处理
[0033] 采用溶液法对硅基底进行亲水, 具体是将硅片放在体积比为 7: 3的浓硫酸和双 氧水的混合溶液, 在 90 °C加热 2 h。 取出后蒸馏水冲洗, 氮气吹干待用。
[0034] 步骤六: 聚合物转移到基底表面
[0035] 在室温下, 将步骤四中得到的表面附有亲水 PMMA的 PDMS软模板与步骤五中 得到的亲水硅片基底接触, 经过 60
s后, 将 PDMS从硅片基底表面分离幵, PDMS表面的 PMMA转移到基底表面。
[0036] 实施例 2
[0037] 步骤一: 热塑性聚合物的溶解
[0038] 将聚甲基丙烯酸甲酯 (PMMA) 固体超声加热溶解到丙酮溶液中, 配制成质量 浓度为 2.5%的 PMMA溶液。
[0039] 步骤二: 软模板的制备
[0040] 称取聚二甲基硅氧烷 (PDMS) 的预聚体和引发剂, 质量比为 10: 1, 搅拌混合
; 然后浇铸在条带宽度为 3 μηι、 间距为 Ι μηι的硅模板上, 在 60 °C的环境下固化
; 固化后将 PDMS与硅模板分离, 即得到 PDMS软模板。
[0041] 步骤三: 在软模板表面旋涂热塑性聚合物
[0042] 在旋转速度为 4000 rpm、 旋转吋间为 30
s的条件下, 将 PMMA溶液旋涂在 PDMS软模板表面, 得到表面附有 PMMA的 PD
MS软模板。
[0043] 步骤四: 软模板表面热塑性聚合物的亲水
[0044] 用氧等离子体处理 PDMS表面的 PMMA, 保证 PMMA表面亲水, 其条件为: 氧 气流量是 lOO m!Jmin, 功率为 45 W, 吋间为 30 s。
[0045] 步骤五: 基底的亲水处理
[0046] 采用溶液法对直径为 10mm毛细管外壁进行亲水, 具体是将毛细管放在体积比 为 7: 3的浓硫酸和双氧水的混合溶液, 在 90 °C加热 2 h。 取出后蒸馏水冲洗, 氮 气吹干待用。
[0047] 步骤六: 聚合物转移到基底表面
[0048] 在室温下, 将步骤四中得到的表面附有亲水 PMMA的 PDMS软模板与步骤五中 得到的亲水毛细管外壁接触, 经过 200
s后, 将 PDMS从毛细管外壁表面分离幵, PDMS表面的 PMMA转移到毛细管外壁 表面上。
[0049] 实施例 3
[0050] 步骤一: 热塑性聚合物的溶解
[0051] 将聚苯乙烯 (PS) 固体超声加热溶解到丙酮溶液中, 配制成质量浓度为 2%的 P s溶液。
[0052] 步骤二: 软模板的制备
[0053] 称取聚二甲基硅氧烷 (PDMS) 的预聚体和引发剂, 质量比为 10: 1, 搅拌混合 ; 然后浇铸在条带宽度为 1 μηι、 间距为 Ι μηι的硅模板上, 在 60 °C的环境下固化 ; 固化后将 PDMS与硅模板分离, 即得到 PDMS软模板。
[0054] 步骤三: 在软模板表面旋涂热塑性聚合物
[0055] 在旋转速度为 6000 rpm、 旋转吋间为 60 s的条件下, 将 PS溶液旋涂在 PDMS软 模板表面, 得到表面附有 PS的 PDMS软模板。
[0056] 步骤四: 软模板表面热塑性聚合物的亲水
[0057] 用氧等离子体处理 PDMS表面的 PS, 保证 PMMA表面亲水, 其条件为: 氧气流 量是 lOO m!Jmin, 功率为 45 W, 吋间为 30 s。
[0058] 步骤五: 基底的亲水处理
[0059] 采用溶液法对硅基底进行亲水, 具体是将硅片放在体积比为 7: 3的浓硫酸和双 氧水的混合溶液, 在 90 °C加热 2 h。 取出后蒸馏水冲洗, 氮气吹干待用。
[0060] 步骤六: 聚合物转移到基底表面
[0061] 在室温下, 将步骤四中得到的表面附有亲水 PS的 PDMS软模板与步骤五中得到 的亲水硅片基底接触, 经过 30 s后, 将 PDMS从硅片基底表面分离幵, PDMS表 面的 PS转移到基底表面。
[0062] 实施例 4
[0063] 步骤一: 热塑性聚合物的溶解
[0064] 将聚甲基丙烯酸甲酯 (PMMA) 固体超声加热溶解到丙酮溶液中, 配制成质量 浓度为 3%的 PMMA溶液。 [0065] 步骤二: 软模板的制备
[0066] 称取聚二甲基硅氧烷 (PDMS) 的预聚体和引发剂, 质量比为 10: 1, 搅拌混合
; 然后浇铸在方格宽度为 1 μηι、 间距为 Ι μηι的硅模板上, 在 60 °C的环境下固化
; 固化后将 PDMS与硅模板分离, 即得到 PDMS软模板。
[0067] 步骤三: 在软模板表面旋涂热塑性聚合物
[0068] 在旋转速度为 3000 rpm、 旋转吋间为 60
s的条件下, 将 PMMA溶液旋涂在 PDMS软模板表面, 得到表面附有 PMMA的 PD
MS软模板。
[0069] 步骤四: 软模板表面热塑性聚合物的亲水
[0070] 用氧等离子体处理 PDMS表面的 PMMA, 保证 PMMA表面亲水, 其条件为: 氧 气流量是 lOO m!Jmin, 功率为 45 W, 吋间为 30 s。
[0071] 步骤五: 基底的亲水处理
[0072] 采用溶液法对导电玻璃基底进行亲水, 具体是将导电玻璃基底放在体积比为 7 : 3的浓硫酸和双氧水的混合溶液, 在 90 °C加热 2 h。 取出后蒸馏水冲洗, 氮气吹 干待用。
[0073] 步骤六: 聚合物转移到基底表面
[0074] 在室温下, 将步骤四中得到的表面附有亲水 PMMA的 PDMS软模板与步骤五中 得到的亲水导电玻璃基底接触, 经过 5 s后, 将 PDMS从导电玻璃基底表面分离幵 , PDMS表面的 PMMA转移到基底表面。
[0075] 以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明, 不能认 定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的人员来说 , 在不脱离本发明构思的前提下, 还可做出很多简单推演或替换, 都应当视为 属于本发明的保护范围。

Claims

权利要求书
一种利用室温转移压印技术图案化热塑性聚合物的方法, 其特征是, 包括以下步骤:
( 1) 首先通过超声和加热, 将热塑性聚合物固体溶解到溶剂中;
(2) 然后将热塑性聚合物溶液旋涂或喷涂在具有凸凹结构的软模板 表面;
(3) 然后通过氧等离子体或紫外臭氧对步骤 (2) 中软模板表面的热 塑性聚合物进行亲水处理;
(4) 最后在室温下将步骤 (3) 得到的表面附有热塑性聚合物的软模 板与亲水基底接触, 经过 5 ~ 600 s后, 将软模板从基底表面分离, 软 模板表面的聚合物转移到基底表面。
根据权利要求 1所述的利用室温转移压印技术图案化热塑性聚合物的 方法, 其特征在于: 步骤 (1) 中的热塑性聚合物包括聚甲基丙烯酸 甲酯、 聚苯乙烯、 聚氨酯、 聚乙烯、 聚丙烯、 聚氯乙烯、 聚二丁烯、 聚乙烯醇、 聚苯乙烯-丁二烯共聚物、 聚对苯乙烯 -聚氧化乙烯共聚物 、 ABS树脂、 聚丙烯酰胺、 聚环氧乙烷。
根据权利要求 1所述的利用室温转移压印技术图案化热塑性聚合物的 方法, 其特征在于: 步骤 (2) 、 (3) 及 (4) 中的软模板包括聚二 甲基硅氧烷模板、 三元乙丙橡胶模板、 全氟聚醚模板、 聚氨酯丙烯酸 酯模板。
根据权利要求 1所述的利用室温转移压印技术图案化热塑性聚合物的 方法, 其特征在于: 步骤 (4) 中的基底包括平面及曲面的硅片、 氧 化硅片、 砷化镓片、 石英片、 导电玻璃片、 聚合物片。
根据权利要求 1所述的利用室温转移压印技术图案化热塑性聚合物的 方法, 其特征在于: 步骤 (4) 中的亲水基底是通过氧等离子体、 紫 外臭氧或亲水溶液处理基底而得到的。
根据权利要求 5所述的亲水溶液处理基底, 其特征在于: 将基底放在 氨水和双氧水的混合水溶液中, 或将基底放在浓硫酸和双氧水的混合 溶液中, 在 50 ~ 90 °C加热条件下进行处理。
[权利要求 7] 根据权利要求 1所述的利用室温转移压印技术图案化热塑性聚合物的 方法, 其特征在于: 步骤 (4) 中的室温为 0~40°C。
PCT/CN2016/108343 2016-12-02 2016-12-02 一种利用室温转移压印技术图案化热塑性聚合物的方法 Ceased WO2018098801A1 (zh)

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WO2006036409A2 (en) * 2004-09-24 2006-04-06 Arkema, Inc. Process for coating extruded thermoplastic substrates and objects formed thereby
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