WO2018094798A1 - 双面oled显示器及其封装方法 - Google Patents

双面oled显示器及其封装方法 Download PDF

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Publication number
WO2018094798A1
WO2018094798A1 PCT/CN2016/111614 CN2016111614W WO2018094798A1 WO 2018094798 A1 WO2018094798 A1 WO 2018094798A1 CN 2016111614 W CN2016111614 W CN 2016111614W WO 2018094798 A1 WO2018094798 A1 WO 2018094798A1
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WO
WIPO (PCT)
Prior art keywords
emitting display
light emitting
display portion
package cover
bending structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/111614
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English (en)
French (fr)
Inventor
唐岳军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US15/322,747 priority Critical patent/US10355065B2/en
Publication of WO2018094798A1 publication Critical patent/WO2018094798A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a double-sided OLED display and a packaging method thereof.
  • OLED displays are becoming more and more popular, and are most prominent in mobile phones, media players, and small entry-level TVs.
  • OLED displays are self-illuminating devices with bright colors, high luminous efficiency, and light weight. Wide viewing angle, fast response, flexible preparation, etc.
  • OLED devices need to inject electrons from the cathode when working, which requires the cathode function to be as low as possible, but these metals such as aluminum, magnesium and calcium are used as cathodes.
  • Etc. generally compares the active wave, and easily reacts with the infiltrated water vapor, thereby affecting the working life of the OLED device. Therefore, the OLED device needs to be packaged during production to avoid entering moisture.
  • the double-sided display becomes a display feature; however, the prior art OLED substrate package is to adhere the adhesive surface of the organic light-emitting diode on the OLED substrate to the package cover, and the distance of the sealant is The luminescent layer is relatively close. When the sealing agent is treated with high temperature, the luminescent layer is damaged, thereby affecting the display life of the OLED.
  • the prior art has the following technical problems: the existing double-sided OLED display device has a relatively conventional packaging method, which is disadvantageous for the long-term use of the display panel and needs improvement.
  • the present invention provides a double-sided OLED display in which a light-emitting display portion is disposed in a transparent package, and a side portion of the light-emitting display portion is bonded to the transparent package shell, which can solve the problem that the display surface is damaged by applying the sealant on the surface of the light-emitting display portion. technical problem.
  • the present invention provides a double-sided OLED display, comprising:
  • a second light emitting display portion located at a lower portion of the first light emitting display portion
  • the upper package cover is configured to package the first light emitting display portion, including:
  • An upper plate body located above the first light emitting display portion
  • a first bending structure formed on the three edges of the upper plate body and extending downward
  • a lower package cover for encapsulating the second light emitting display portion comprising:
  • a second bending structure formed on the three edges of the lower plate body and extending upward
  • the upper package cover and the lower package cover are combined to form a package chamber, and the first light emitting display portion and the second light emitting display portion are encapsulated in the package cavity;
  • the thickness of the first bending structure and the second bending structure is thinner than the thickness of the upper plate body and the lower plate body.
  • the upper package cover is in abutment with the lower package cover, and the bottom end of the first bending structure is in contact with the top end of the second bending structure.
  • the first bending structure extends downward to a bottom side of the first light emitting display portion, and the first light emitting display portion side portion and the first bending structure inner side pass Bonding the first adhesive layer;
  • the lower plate body is wider than the upper plate body, the second bending structure extends upward to an upper side of the second light emitting display portion, the second light emitting display portion side portion and the second bending portion
  • the inside of the structure is bonded by a second adhesive layer.
  • the upper package cover is engaged with the lower package cover, the upper package cover is located in the lower package cover, and the outer side of the first bending structure is The inner side of the second bending structure is fitted.
  • the first bending structure extends downward to a bottom side of the second light emitting display portion, and sides of the first light emitting display portion and the second light emitting display portion are The inner side of the first bending structure is bonded by the first adhesive layer;
  • the second bending structure extends upward to the upper side of the first bending structure, and the outer side of the first bending structure and the inner side of the second bending structure are bonded by the second adhesive layer.
  • the upper and lower package covers are infused by liquid glass or plastic.
  • an insulating layer is disposed in the upper package cover and the lower package cover, and the insulating layer is formed on surfaces of the first light emitting display portion and the second light emitting display portion.
  • the insulating layer is a composite layer of inorganic material or any combination of silicon nitride, silicon oxide or aluminum oxide.
  • the present invention also provides a double-sided OLED display comprising:
  • a second light emitting display portion located at a lower portion of the first light emitting display portion
  • the upper package cover is configured to package the first light emitting display portion, including:
  • An upper plate body located above the first light emitting display portion
  • a first bending structure formed on three sides of the upper plate body and extending downward;
  • a lower package cover for encapsulating the second light emitting display portion comprising:
  • a second bending structure formed on three sides of the lower plate body and extending upward;
  • the upper package cover and the lower package cover are combined to form a package chamber, and the first light emitting display portion and the second light emitting display portion are encapsulated in the package cavity.
  • the upper package cover is in abutment with the lower package cover, and the bottom end of the first bending structure is in contact with the top end of the second bending structure.
  • the first bending structure extends downward to a bottom side of the first light emitting display portion, and the first light emitting display portion side portion and the first bending structure inner side pass Bonding the first adhesive layer;
  • the lower plate body is wider than the upper plate body, the second bending structure extends upward to an upper side of the second light emitting display portion, the second light emitting display portion side portion and the second bending portion
  • the inside of the structure is bonded by a second adhesive layer.
  • the upper package cover is engaged with the lower package cover, the upper package cover is located in the lower package cover, and the outer side of the first bending structure is The inner side of the second bending structure is fitted.
  • the first bending structure extends downward to a bottom side of the second light emitting display portion, and sides of the first light emitting display portion and the second light emitting display portion are The inner side of the first bending structure is bonded by the first adhesive layer;
  • the second bending structure extends upward to the upper side of the first bending structure, and the outer side of the first bending structure and the inner side of the second bending structure are bonded by the second adhesive layer.
  • the upper and lower package covers are infused by liquid glass or plastic.
  • an insulating layer is disposed in the upper package cover and the lower package cover, and the insulating layer is formed on surfaces of the first light emitting display portion and the second light emitting display portion.
  • the insulating layer is a composite layer of inorganic material or any combination of silicon nitride, silicon oxide or aluminum oxide.
  • the invention also provides a double-sided OLED display packaging method, comprising the following steps:
  • the light-emitting display unit includes a first light-emitting display unit and a second light-emitting display unit that are attached to each other, and a first glue layer is disposed on a side of the first light-emitting display unit. a second adhesive layer is disposed on a side of the two light emitting display portions;
  • the light emitting display portion is placed in the lower package cover, and the second light emitting display portion side portion and the lower package cover inner side are adhered through the second adhesive layer;
  • the upper package cover is closed on the upper portion of the lower package cover, and the first light-emitting display portion side portion and the upper package cover inner side are bonded through the first adhesive layer.
  • the invention has the beneficial effects that the double-sided OLED display of the invention has the adhesive disposed on the side of the package cover and away from the light-emitting surface, thereby protecting the display from high temperature damage and prolonging the display life, and the side of the package cover can be thinned.
  • the processing helps to reduce the edge width of the double-sided display.
  • FIG. 1 is a plan view of a first embodiment of a double-sided OLED display of the present invention
  • Figure 2 is a cross-sectional view of the double-sided OLED display of Figure 1 taken along line A-A';
  • FIG. 3 is a top plan view of a first embodiment of a double-sided OLED display of the present invention.
  • Figure 4 is a cross-sectional view of the double-sided OLED display of Figure 3 taken along line B-B';
  • FIG. 5 is a top plan view of a first embodiment of a double-sided OLED display of the present invention.
  • Figure 6 is a cross-sectional view of the double-sided OLED display of Figure 5 taken along line C-C';
  • FIG. 7 is a flow chart of a packaging method of a double-sided OLED display of the present invention.
  • the present invention provides a novel OLED display device package structure for the existing OLED display device packaging method, which can effectively overcome the defect.
  • the first light-emitting display unit and the second light-emitting display unit are combined to form a double-sided display portion;
  • the first light-emitting display portion includes a first light-emitting layer and a first substrate, and the first light-emitting layer is disposed at the The first substrate upper surface
  • the second light emitting display portion includes a second light emitting layer and a second substrate, the second light emitting layer is disposed on the second substrate lower surface; the first substrate and the first The two substrates are bonded.
  • the luminescent layer includes an OLED display device array, and the OLED display device includes an electric TFT switch layer for controlling, an anode electrode, a cathode electrode, and a luminescent material is disposed between the anode electrode and the cathode electrode to form a luminescent material layer; wherein the anode and the cathode are
  • the luminescent material layer may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and the like; when a driving voltage is applied to the anode and the cathode, holes and traversing through the hole transport layer Electrons of the electron transport layer move toward the luminescent material layer to form excitons, and as a result, the luminescent material layer emits visible light; in the OLED display device, pixels having an OLED (having the foregoing structure) are arranged in a matrix form, and pass data voltage and scan The voltage is selectively controlled to display an image.
  • the package structure of the present invention is used for packaging the double-sided display portion; the package structure includes: an upper package cover for encapsulating the first light-emitting display portion, the upper package cover comprising: an upper plate body, located at the first a light-emitting display portion; a first bending structure formed on a three-sided edge of the upper plate body and extending downward; a lower package cover for encapsulating the second light-emitting display portion, the lower package cover comprising: a plate body, located below the second light emitting display portion; a second bending structure formed on the three edges of the lower plate body and extending upward; the upper package cover is combined with the lower package cover, the upper package The cover and the inner space of the lower package cover form a package chamber, and the first light emitting display portion and the second light emitting display portion are encapsulated in the package cavity.
  • the upper and lower package covers are respectively made of a transparent material, for example, by liquid glass or plastic.
  • an insulating layer is disposed in the upper package cover and the lower package cover, and the insulating layer is formed on surfaces of the first luminescent layer and the second luminescent layer; to avoid O L E D shows that the device is in contact with water vapor/oxygen to cause a short circuit.
  • the insulating layer may be a composite layer of one or any combination of inorganic materials such as silicon nitride, silicon oxide or aluminum oxide, and may also be applied. Organic layer.
  • FIG. 1 there is shown a top view of a double-sided OLED display of the present invention.
  • an upper package cover 101 is included, and a first light emitting display portion is fixed in the upper package cover 101.
  • the first light emitting display portion includes a first light emitting layer and is located at the bottom of the first light emitting layer.
  • the first substrate 103 has an end portion of the first substrate 103 extending from one end of the upper package cover 101 for binding the display control device.
  • a cross-sectional view taken along line A-A' of FIG. 1 includes an upper package cover 101 and a lower package cover 104, and the lower surface of the upper package cover 101 is closely attached to the upper surface of the lower package cover 104.
  • the upper package cover 101 and the lower package cover 104 are combined to form an accommodating chamber for accommodating the first light emitting display portion and the second light emitting display portion, and the upper package cover 101 and the lower package cover 104
  • the opening 105 is disposed on the same side, and the opening 105 can be encapsulated by the second encapsulant 106.
  • the first light emitting display portion includes a first light emitting layer 102 and a first substrate 103
  • the second light emitting display portion includes a second light emitting layer 107 and a second substrate 108, the first substrate 103 and the second substrate 108 bonding, one end of the first substrate 103 and the second substrate 108 protrudes from the opening 105; preferably, the first substrate 103 and the second substrate 108 may be fixed by an adhesive/adhesive layer Together, for example, a transparent or opaque bonding material such as an OCA/OCR bonding material is used.
  • the first light emitting display portion and the second light emitting display portion are bonded to the package cover by the first encapsulant, wherein the first encapsulant comprises a first adhesive layer 1091 and a second adhesive layer 1092.
  • the upper package cover 101 includes an upper plate body 1011. The three sides of the upper plate body 1011 extend downward to form a first bending structure 1012, so that an opening 105 is formed on one side of the upper package cover 101.
  • a substrate 103 is extended from the upper package cover 101; a first adhesive layer 1091 is disposed on a side of the first light-emitting display portion, and the first light-emitting display portion and the inner side of the first bent structure 1012 pass through The first adhesive layer 1091 is bonded.
  • the lower package cover 104 includes a lower plate body 1041, and the three sides of the lower plate body 1041 extend upward to form a second bending structure 1042, so that an opening 105 is formed on one side of the lower package cover 104 for the second
  • the base 108 extends out of the lower package cover 104; a second adhesive layer 1092 is disposed on a side of the second light-emitting display portion, and the second light-emitting display portion and the inner side of the second bent structure 1042 pass through the The second adhesive layer 1092 is bonded.
  • the lower package cover 104 When packaging, the lower package cover 104 is laid flat on the package platform, and then the double-sided display portion composed of the first light-emitting display portion and the second light-emitting display portion is placed in the lower package cover 104, so that the The side of the second light-emitting display portion is bonded to the inner side of the second bending structure 1042, and then the upper package cover 101 is placed on the first light-emitting display portion, and the upper package cover is One end of the opening 105 having the opening 105 is the same as the one end of the lower package cover 104 having the opening 105, and then the bottom of the first bending structure 1012 is attached to the top of the second bending structure 1042, and at the same time, The side of the first light emitting display portion is bonded to the inner side of the first bending structure 1012; finally, the opening 105 of the upper package cover 101 and the lower package cover 104 is sealed by using the second encapsulant 106. deal with.
  • the double-sided OLED display package structure of the embodiment is convenient for packaging, and the bonding portion of the double-sided display portion and the package housing is located at the side of the double-sided display portion, compared to the layer of the glue layer being disposed.
  • the problem that the OLED light-emitting layer is damaged due to excessive temperature during the packaging process can be avoided.
  • FIG. 3 a top view of a double-sided OLED display of the present invention is shown.
  • the upper package cover 201 includes a first light emitting display portion, and the first light emitting display portion includes a first light emitting layer and a bottom portion of the first light emitting layer.
  • the first substrate 203 has an end portion of the first substrate 203 protruding from one end of the upper package cover 201 for binding the display control device.
  • a cross-sectional view taken along line BB' of FIG. 3 includes an upper package cover 201 and a lower package cover 204.
  • the lower surface of the upper package cover 201 is closely attached to the upper surface of the lower package cover 204.
  • the upper package cover 201 and the lower package cover 204 are combined to form an accommodating chamber for accommodating the first light emitting display portion and the second light emitting display portion, the upper package cover 201 and the lower package cover 204.
  • the opening 205 is disposed on the same side, and the opening 205 can be encapsulated by the second encapsulant 206.
  • the side of the light-emitting display portion is bonded to the inner side of the package cover by the first encapsulant, and the first encapsulant comprises a first adhesive layer 2091 and a second adhesive layer 2092.
  • the first light emitting display portion includes a first light emitting layer 202 and a first substrate 203
  • the second light emitting display portion includes a second light emitting layer 207 and a second substrate 208, the first substrate 203 and the second substrate 208 is bonded, and one ends of the first substrate 203 and the second substrate 208 protrude from the opening 205.
  • the upper package cover 201 includes an upper plate body 2011 and a first bending structure 2012 formed on three sides of the upper plate body 2011.
  • the lower package cover 204 includes a lower plate body 2041 and is formed on the lower plate body.
  • the second bending structure 2042 of the three-sided edge of the 2041, the bottom of the first bending structure 2012 is in contact with the top of the second bending structure 2042.
  • a first adhesive layer 2091 is disposed on a side of the first light emitting display portion, and the first light emitting display portion and the inner side of the first bent structure 2012 are bonded by the first adhesive layer 2091.
  • a second adhesive layer 2092 is disposed on a side of the second light emitting display portion, and the second light emitting display portion and the inner side of the second bent structure 2042 are bonded by the second adhesive layer 2092.
  • first bending structure 2012 and the second bending structure 2042 are thinned to realize a double-sided OLED display with a narrow bezel.
  • FIG. 5 a top view of a double-sided OLED display of the present invention is shown.
  • the upper package cover 301 includes a first light-emitting display portion, and the first light-emitting display portion includes a first light-emitting layer and a bottom portion of the first light-emitting layer.
  • the first substrate 303 has an end portion of the first substrate 303 extending from one end of the upper package cover 301 for binding the display control device.
  • a cross-sectional view taken along line C-C of FIG. 5 includes an upper package cover 301 and a lower package cover 304.
  • the upper package cover 301 is engaged with the lower package cover 304, that is, the upper package. Part or all of the cover 301 is disposed inside the lower package cover 304.
  • the upper package cover 301 and the lower package cover 304 are combined to form a receiving chamber for accommodating the first light emitting display portion and the second light emitting portion.
  • the display portion is provided with an opening 305 on the same side of the upper package cover 301 and the lower package cover 304.
  • the opening 305 can be encapsulated by the second encapsulant 306.
  • the first light emitting display portion includes a first light emitting layer 302 and a first substrate 303
  • the second light emitting display portion includes a second light emitting layer 307 and a second substrate 308, the first substrate 303 and the second substrate 308 is bonded, and one ends of the first substrate 303 and the second substrate 308 protrude from the opening 305.
  • the upper package cover 301 includes an upper plate body 3011. The three sides of the upper plate body 3011 extend downward to form a first bending structure 3012, so that an opening 305 is formed on one side of the upper package cover 301.
  • a base 303 extends out of the upper package cover 301.
  • the lower package cover 304 includes a lower plate body 3041, and the three sides of the lower plate body 3041 extend upward to form a second bending structure 3042, so that an opening 305 is formed on one side of the lower package cover 304 for the second
  • the substrate 308 extends out of the lower package cover 304.
  • the first bending structure 3012 extends downward to a bottom of the double-sided display composed of the first light emitting display portion and the second light emitting display portion, and the lower plate body 3041 is slightly wider than the upper plate body 3011.
  • the inner side of the second bending structure 3042 is extended upwardly adjacent to the outer side of the first bending structure 3012, and the second bending structure 3042 is extended to the end of the upper plate body 3011.
  • the package structure further includes a first encapsulant, and the first encapsulant includes a first adhesive layer 3091 and a second adhesive layer 3092.
  • the upper package cover 301 When encapsulating, the upper package cover 301 has a side of the first bending structure 3012 facing up, lying flat on the package platform, and then placing the double-sided display in the upper package cover 301, and then, The side of the double-sided display portion is bonded to the inner side of the first bending structure 3012 by the first adhesive layer 3091, and then the second package cover is turned over and fastened to the upper package cover 301, so that The outer side of the first bending structure 3012 and the inner side of the second bending structure 3042 are bonded by the second adhesive layer 3092. Finally, the upper and lower package covers 301 and 301 are used by the second encapsulant 306. The opening 305 is sealed.
  • thinning the one of the first bending structure 3012 and the second bending structure 3042, or thinning both, helps to reduce the width of the double-sided display. .
  • the double-sided OLED display package structure of the embodiment has a larger package encapsulation area than the prior art, so that the double-sided display portion can be fixedly fixed in the package casing, and at the same time, the upper package
  • the interleaved portion of the cover 301 and the lower package cover 304 form a double-layer package sidewall, further protecting the inside of the package cover from moisture and oxygen intrusion to damage the OLED display device.
  • the present invention further provides a double-sided OLED display packaging method, comprising the following steps:
  • the light-emitting display unit includes a first light-emitting display unit and a second light-emitting display unit that are attached to each other, and a first glue layer is disposed on a side of the first light-emitting display unit.
  • a second adhesive layer is disposed on a side of the two light emitting display portions.
  • the light emitting display portion is placed in the lower package cover, and the second light emitting display portion side portion and the lower package cover inner side are bonded through the second adhesive layer.
  • the upper package cover is closed on the upper portion of the lower package cover, and the first light-emitting display portion side portion and the upper package cover inner side are bonded through the first adhesive layer.

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Abstract

一种双面OLED封装结构，包括上板体（1011）、下板体（1041），上板体（1011）与下板体（1041）边缘设置折弯结构（1012，1042），在折弯结构（1012，1042）内侧设置封装胶（1091，1092），使两发光显示部分（102，107）分别通过封装胶（1091，1092）与折弯结构（1012，1042）对应连接。有益效果为：双面OLED封装结构将封装胶（1091，1092）设置于封装盖（101，104）的侧部，远离发光面，能够保护有机发光层免受高温损害，延长显示寿命。

Description

双面OLED显示器及其封装方法 技术领域
本发明涉及显示技术领域，特别是涉及一种双面OLED显示器及其封装方法。
 背景技术
有机发光二极管(OLED)显示器越来越普遍，在手机、媒体播放器及小型入门级电视等产品中最为显著；OLED显示器是一种自主发光的器件，具备颜色鲜艳、发光效率高、质量轻、可视角度广、响应速度快、可柔性制备等优点；同时，OLED器件工作时要从阴极注入电子,这就要求阴极功函数越低越好,但做阴极的这些金属如铝、镁、钙等,一般比较活波,易与渗透进来的水汽发生反应，从而影响OLED器件的工作寿命，因此，生产时需要对OLED器件进行封装以避免进入水汽。
随着电子产品的多样化，双面显示器成为一种显示特点；然而，现有技术的OLED基底封装，是将OLED基底上的有机发光二极管表面涂抹粘胶与封装盖粘贴固定，封胶部位距离发光层较近，当采用高温对封胶进行处理时，会对发光层造成破坏，进而影响有机发光二极管的显示寿命。
因此，现有技术存在以下技术问题：现有的双面OLED显示器件，封装方式较为传统，不利于显示面板的长久使用，需要改进。
 技术问题
本发明提供一种双面OLED显示器，将发光显示部设置于透明封装壳内，发光显示部的侧部与透明封装壳粘接，能够解决在发光显示部表面涂抹封胶导致显示面受损的技术问题。
 技术解决方案
为了解决上述技术问题，本发明提供一种双面OLED显示器,其包括：
第一发光显示部；
第二发光显示部，位于所述第一发光显示部下部；以及
上封装盖，用于封装所述第一发光显示部，包括：
上板体，位于所述第一发光显示部上方；
第一折弯结构，形成于所述上板体的三边边缘并向下延
伸；
下封装盖，用于封装所述第二发光显示部，包括：
下板体，位于所述第二发光显示部下方；
第二折弯结构，形成于所述下板体的三边边缘并向上延
伸；
所述上封装盖与下封装盖相结合形成一封装腔室，所述第一发光显示部与所述第二发光显示部封装于所述封装腔室内；
所述第一折弯结构与第二折弯结构的厚度薄于所述上板体与下板体的厚度。
根据本发明的一优选实施例，所述上封装盖与下封装盖对接，所述第一折弯结构底端与所述第二折弯结构顶端相贴合。
根据本发明的一优选实施例，所述第一折弯结构向下延伸至所述第一发光显示部的底侧，所述第一发光显示部侧部与所述第一折弯结构内侧通过第一胶层粘接；
所述下板体宽于所述上板体，所述第二折弯结构向上延伸至所述第二发光显示部的上侧，所述第二发光显示部侧部与所述第二折弯结构内侧通过第二胶层粘接。
根据本发明的一优选实施例，所述上封装盖与所述下封装盖相扣合，所述上封装盖位于所述下封装盖内，并且，所述第一折弯结构外侧与所述第二折弯结构内侧相贴合。
根据本发明的一优选实施例，所述第一折弯结构向下延伸至所述第二发光显示部的底侧，所述第一发光显示部及第二发光显示部的侧部与所述第一折弯结构内侧通过第一胶层粘接；
所述第二折弯结构向上延伸至所述第一折弯结构的上侧，所述第一折弯结构外侧与所述第二折弯结构内侧通过第二胶层粘接。
根据本发明的一优选实施例，所述上封装盖与下封装盖通过液体玻璃或塑料灌注成型。
根据本发明的一优选实施例，所述上封装盖与下封装盖内设置有绝缘层，所述绝缘层形成于所述第一发光显示部与所述第二发光显示部的表面。
根据本发明的一优选实施例，所述绝缘层为氮化硅、氧化硅或三氧化二铝中的一种无机材料层或任意组合的复合层。
本发明还提供了一种双面OLED显示器，其包括：
第一发光显示部；
第二发光显示部，位于所述第一发光显示部下部；以及
上封装盖，用于封装所述第一发光显示部，包括：
上板体，位于所述第一发光显示部上方；
第一折弯结构，形成于所述上板体的三边边缘并向下延伸；
下封装盖，用于封装所述第二发光显示部，包括：
下板体，位于所述第二发光显示部下方；
第二折弯结构，形成于所述下板体的三边边缘并向上延伸；
所述上封装盖与下封装盖相结合形成一封装腔室，所述第一发光显示部与所述第二发光显示部封装于所述封装腔室内。
根据本发明的一优选实施例，所述上封装盖与下封装盖对接，所述第一折弯结构底端与所述第二折弯结构顶端相贴合。
根据本发明的一优选实施例，所述第一折弯结构向下延伸至所述第一发光显示部的底侧，所述第一发光显示部侧部与所述第一折弯结构内侧通过第一胶层粘接；
所述下板体宽于所述上板体，所述第二折弯结构向上延伸至所述第二发光显示部的上侧，所述第二发光显示部侧部与所述第二折弯结构内侧通过第二胶层粘接。
根据本发明的一优选实施例，所述上封装盖与所述下封装盖相扣合，所述上封装盖位于所述下封装盖内，并且，所述第一折弯结构外侧与所述第二折弯结构内侧相贴合。
根据本发明的一优选实施例，所述第一折弯结构向下延伸至所述第二发光显示部的底侧，所述第一发光显示部及第二发光显示部的侧部与所述第一折弯结构内侧通过第一胶层粘接；
所述第二折弯结构向上延伸至所述第一折弯结构的上侧，所述第一折弯结构外侧与所述第二折弯结构内侧通过第二胶层粘接。
根据本发明的一优选实施例，所述上封装盖与下封装盖通过液体玻璃或塑料灌注成型。
根据本发明的一优选实施例，所述上封装盖与下封装盖内设置有绝缘层，所述绝缘层形成于所述第一发光显示部与所述第二发光显示部的表面。
根据本发明的一优选实施例，所述绝缘层为氮化硅、氧化硅或三氧化二铝中的一种无机材料层或任意组合的复合层。
本发明还提供一种双面OLED显示器封装方法，包括以下步骤：
S101，提供下封装盖；
S102，提供一发光显示部，所述发光显示部包括上下粘贴设置的第一发光显示部与第二发光显示部，在所述第一发光显示部侧部设置第一胶层，在所述第二发光显示部侧部设置第二胶层；
S103，将所述发光显示部置于所述下封装盖内，并将所述第二发光显示部侧部与所述下封装盖内侧通过所述第二胶层粘接；
S104，提供上封装盖；
S105，将所述上封装盖盖合于所述下封装盖上部，并将所述第一发光显示部侧部与所述上封装盖内侧通过所述第一胶层粘接。
 有益效果
本发明的有益效果为：本发明的双面OLED显示器，将粘胶设置于封装盖的侧部，远离发光面，从而保护显示器免受高温损害，延长显示寿命，封装盖的侧部可进行薄化处理，有助于减小双面显示器的边缘宽度。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明双面OLED显示器的实施例一的俯视图；
图2为图1的双面OLED显示器沿A-A’的剖面图；
图3为本发明双面OLED显示器的实施例一的俯视图；
图4为图3的双面OLED显示器沿B-B’的剖面图；
图5为本发明双面OLED显示器的实施例一的俯视图；
图6为图5的双面OLED显示器沿C-C’的剖面图；
图7为本发明双面OLED显示器的封装方法流程图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的OLED显示器件封装方式存在对显示面造成损害的技术问题，提供一种新型的OLED显示器件的封装结构，可以有效地克服该缺陷。
本发明所述的第一发光显示部与第二发光显示部组合形成双面显示部；所述第一发光显示部包括有第一发光层及第一基底，所述第一发光层设置于所述第一基底上表面，所述第二发光显示部包括有第二发光层及第二基底，所述第二发光层设置于所述第二基底下表面；所述第一基底与所述第二基底相粘合。
发光层包括OLED显示器件阵列，所述OLED显示器件包括有用于控制的电性TFT开关层，阳极电极、阴极电极，阳极电极与阴极电极之间设置发光材料形成发光材料层；其中阳极与阴极之间除了发光材料层还可以包括空穴注入层、空穴传输层、电子传输层和电子注入层等；当将驱动电压施加至阳极和阴极时,穿过空穴传输层的空穴和穿过电子传输层的电子移向发光材料层以形成激子,结果发光材料层发出可见光线；在OLED显示装置中,将具有OLED(具有前述结构)的像素按矩阵形式布置,并且通过数据电压和扫描电压选择性地进行控制,因而显示图像。
本发明的封装结构用于封装上述双面显示部；该封装结构包括：上封装盖，用于封装所述第一发光显示部，所述上封装盖包括：上板体，位于所述第一发光显示部上方；第一折弯结构，形成于所述上板体的三边边缘并向下延伸；下封装盖，用于封装所述第二发光显示部，所述下封装盖包括：下板体，位于所述第二发光显示部下方；第二折弯结构，形成于所述下板体的三边边缘并向上延伸；所述上封装盖与下封装盖相结合，所述上封装盖与下封装盖的内部空间形成一封装腔室，所述第一发光显示部与所述第二发光显示部封装于所述封装腔室内。
所述上封装盖与下封装盖分别由透明材质制成，例如通过液体玻璃或塑料灌注成型。
优选的，在所述上封装盖与下封装盖内设置绝缘层，所述绝缘层形成于所述第一发光层与所述第二发光层的表面；以避免O L E D显示器件与水汽/氧气接触而出现短路现象，进一步，所述绝缘层可以为氮化硅、氧化硅或三氧化二铝等无机材料中的一层或任意组合的复合层，还可以包含适用的有机层。
下面通过以下几种实施例对上述封装结构进行具体说明。
实施例一
参见图1，为本发明的双面OLED显示器的俯视图。
如图1所示，包括有上封装盖101，所述上封装盖101内固定有第一发光显示部，所述第一发光显示部包括有第一发光层及位于所述第一发光层底部的第一基底103，所述第一基底103的端部从所述上封装盖101的一端伸出，用以绑定显示控制器件。
如图2所示，为图1沿A-A’的剖面图，包括有上封装盖101与下封装盖104，所述上封装盖101的下表面与下封装盖104的上表面紧密贴合，所述上封装盖101与下封装盖104组合形成一容置腔室，用以容置所述第一发光显示部与第二发光显示部，所述上封装盖101与下封装盖104的同侧设置开口105，所述开口105可通过第二封装胶106进行封装。
所述第一发光显示部包括有第一发光层102及第一基底103，所述第二发光显示部包括有第二发光层107及第二基底108，所述第一基底103与第二基底108粘合，所述第一基底103与第二基底108的一端从所述开口105伸出；优选的，所述第一基底103与第二基底108可以通过粘附剂／粘合层固定在一起，例如使用OCA／OCR粘合材料等透明或不透明粘合材料。
所述第一发光显示部与第二发光显示部通过第一封装胶与封装盖粘接，其中，所述第一封装胶包括第一胶层1091与第二胶层1092。
所述上封装盖101包括有上板体1011，所述上板体1011三边边缘向下延伸形成第一折弯结构1012，使得所述上封装盖101一侧形成开口105,便于所述第一基底103伸出所述上封装盖101；在所述第一发光显示部的侧部设置第一胶层1091，所述第一发光显示部与所述第一折弯结构1012的内侧通过所述第一胶层1091粘接。
所述下封装盖104包括有下板体1041，所述下板体1041三边边缘向上延伸形成第二折弯结构1042，使得所述下封装盖104一侧形成开口105，便于所述第二基底108伸出所述下封装盖104；在所述第二发光显示部的侧部设置第二胶层1092，所述第二发光显示部与所述第二折弯结构1042的内侧通过所述第二胶层1092粘接。
封装时，将所述下封装盖104平放于封装平台，然后将所述第一发光显示部与第二发光显示部组成的双面显示部置于所述下封装盖104中，使得所述第二发光显示部的侧部与所述第二折弯结构1042的内侧粘接，接下来，将所述上封装盖101盖在所述第一发光显示部上，并使所述上封装盖101具有开口105的一端与所述下封装盖104具有开口105的一端朝向相同，紧接着，使所述第一折弯结构1012底部与所述第二折弯结构1042顶部贴合，同时，使所述第一发光显示部的侧部与所述第一折弯结构1012的内侧粘接；最后，使用第二封装胶106对所述上封装盖101与下封装盖104的开口105部进行密封处理。
本实施例的双面OLED显示器封装结构，与现有技术相比，封装较便捷，双面显示部与封装外壳的粘接处位于双面显示部的侧部，相较于将胶层设置于双面显示部的显示面上，能够避免封装工艺过程中由于温度过高而使OLED发光层受损的问题。
实施例二
参见图3，为本发明的双面OLED显示器的俯视图。
如图3所示，包括有上封装盖201，所述上封装盖201内固定有第一发光显示部，所述第一发光显示部包括有第一发光层及位于所述第一发光层底部的第一基底203，所述第一基底203的端部从所述上封装盖201的一端伸出，用以绑定显示控制器件。
如图4所示，为图3沿B-B’的剖面图，包括有上封装盖201与下封装盖204，所述上封装盖201的下表面与下封装盖204的上表面紧密贴合，所述上封装盖201与下封装盖204组合形成一容置腔室，用以容置所述第一发光显示部与第二发光显示部，所述上封装盖201与下封装盖204的同侧设置开口205，所述开口205可通过第二封装胶206进行封装。
发光显示部的侧部通过第一封装胶与封装盖内侧粘接，所述第一封装胶包括第一胶层2091与第二胶层2092。
所述第一发光显示部包括有第一发光层202及第一基底203，所述第二发光显示部包括有第二发光层207及第二基底208，所述第一基底203与第二基底208粘合，所述第一基底203与第二基底208的一端从所述开口205伸出。
所述上封装盖201包括上板体2011及形成于所述上板体2011三边边缘的第一折弯结构2012，所述下封装盖204包括下板体2041及形成于所述下板体2041三边边缘的第二折弯结构2042，所述第一折弯结构2012的底部与所述第二折弯结构2042的顶部贴合。
在所述第一发光显示部的侧部设置第一胶层2091，所述第一发光显示部与所述第一折弯结构2012的内侧通过所述第一胶层2091粘接。
在所述第二发光显示部的侧部设置第二胶层2092，所述第二发光显示部与所述第二折弯结构2042的内侧通过所述第二胶层2092粘接。
本实施例与实施例一的区别在于，对所述第一折弯结构2012与第二折弯结构2042进行薄化处理，以实现窄边框的双面OLED显示器。
实施例三
参见图5，为本发明的双面OLED显示器的俯视图。
如图5所示，包括有上封装盖301，所述上封装盖301内固定有第一发光显示部，所述第一发光显示部包括有第一发光层及位于所述第一发光层底部的第一基底303，所述第一基底303的端部从所述上封装盖301的一端伸出，用以绑定显示控制器件。
如图6所示，为图5沿C-C’的剖面图，包括有上封装盖301与下封装盖304，所述上封装盖301与下封装盖304相扣合，即所述上封装盖301的部分或全部置于所述下封装盖304内部，所述上封装盖301与下封装盖304组合形成一容置腔室，用以容置所述第一发光显示部与第二发光显示部，所述上封装盖301与下封装盖304的同侧设置开口305，所述开口305可通过第二封装胶306进行封装。
所述第一发光显示部包括有第一发光层302及第一基底303，所述第二发光显示部包括有第二发光层307及第二基底308，所述第一基底303与第二基底308粘合，所述第一基底303与第二基底308的一端从所述开口305伸出。
所述上封装盖301包括有上板体3011，所述上板体3011三边边缘向下延伸形成第一折弯结构3012，使得所述上封装盖301一侧形成开口305，便于所述第一基底303伸出所述上封装盖301。
所述下封装盖304包括有下板体3041，所述下板体3041三边边缘向上延伸形成第二折弯结构3042，使得所述下封装盖304一侧形成开口305，便于所述第二基底308伸出所述下封装盖304。
所述第一折弯结构3012向下延伸至由所述第一发光显示部与第二发光显示部组成的双面显示器的底部，所述下板体3041略宽于所述上板体3011，使得所述第二折弯结构3042内侧紧贴着所述第一折弯结构3012外侧向上延伸，所述第二折弯结构3042延伸至所述上板体3011端部。
封装结构还包括第一封装胶，所述第一封装胶包括第一胶层3091与第二胶层3092。
封装时，将所述上封装盖301具有第一折弯结构3012的一侧朝上，平置于封装平台，然后将所述双面显示器置于所述上封装盖301内，随后，所述双面显示部的侧部与所述第一折弯结构3012的内侧通过第一胶层3091粘接，接着，将所述第二封装盖翻面并扣在所述上封装盖301上，使得所述第一折弯结构3012外侧与所述第二弯折结构3042内侧通过第二胶层3092粘接，最后，使用所述第二封装胶306对所述上封装盖301与下封装盖304的开口305部进行密封处理。
优选的，将所述第一折弯结构3012与所述第二弯折结构3042的其中一个进行薄化处理，或者将两者均进行薄化处理，有助于减小双面显示器的边框宽度。
本实施例的双面OLED显示器封装结构，与现有技术相比，具有较大的封装层封装面积，使得所述双面显示部能够劳固地固定于封装壳内，同时，所述上封装盖301与所述下封装盖304的交错部分形成双层封装侧壁，进一步保护封装盖内部免受水汽和氧气侵入而损害OLED显示器件。
如图7所示，本发明还提供一种双面OLED显示器封装方法，包括以下步骤：
S101，提供下封装盖。
S102，提供一发光显示部，所述发光显示部包括上下粘贴设置的第一发光显示部与第二发光显示部，在所述第一发光显示部侧部设置第一胶层，在所述第二发光显示部侧部设置第二胶层。
S103，将所述发光显示部置于所述下封装盖内，并将所述第二发光显示部侧部与所述下封装盖内侧通过所述第二胶层粘接。
S104，提供上封装盖。
S105，将所述上封装盖盖合于所述下封装盖上部，并将所述第一发光显示部侧部与所述上封装盖内侧通过所述第一胶层粘接。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种双面OLED显示器，其包括：
    第一发光显示部；
    第二发光显示部，位于所述第一发光显示部下部；以及
    上封装盖，用于封装所述第一发光显示部，包括：
    上板体，位于所述第一发光显示部上方；
    第一折弯结构，形成于所述上板体的三边边缘并向下延
    伸；
    下封装盖，用于封装所述第二发光显示部，包括：
    下板体，位于所述第二发光显示部下方；
    第二折弯结构，形成于所述下板体的三边边缘并向上延
    伸；
    所述上封装盖与下封装盖相结合形成一封装腔室，所述第一发光显示部与所述第二发光显示部封装于所述封装腔室内；
    所述第一折弯结构与第二折弯结构的厚度薄于所述上板体与下板体的厚度。
  2. 根据权利要求1所述的双面OLED显示器，其中，所述上封装盖与下封装盖对接，所述第一折弯结构底端与所述第二折弯结构顶端相贴合。
  3. 根据权利要求2所述的双面OLED显示器，其中，
    所述第一折弯结构向下延伸至所述第一发光显示部的底侧，所述第一发光显示部侧部与所述第一折弯结构内侧通过第一胶层粘接；
    所述第二折弯结构向上延伸至所述第二发光显示部的上侧，所述第二发光显示部侧部与所述第二折弯结构内侧通过第二胶层粘接。
  4. 根据权利要求1所述的双面OLED显示器，其中，所述上封装盖与所述下封装盖相扣合，所述上封装盖位于所述下封装盖内，并且，所述第一折弯结构外侧与所述第二折弯结构内侧相贴合。
  5. 根据权利要求4所述的双面OLED显示器，其中，
    所述第一折弯结构向下延伸至所述第二发光显示部的底侧，所述第一发光显示部及第二发光显示部的侧部与所述第一折弯结构内侧通过第一胶层粘接；
    所述下板体宽于所述上板体，所述第二折弯结构向上延伸至所述第一折弯结构的上侧，所述第一折弯结构外侧与所述第二折弯结构内侧通过第二胶层粘接。
  6. 根据权利要求1所述的双面OLED显示器，其中，所述上封装盖与下封装盖通过液体玻璃或塑料灌注成型。
  7. 根据权利要求1所述的双面OLED显示器，其中，所述上封装盖与下封装盖内设置有绝缘层，所述绝缘层形成于所述第一发光显示部与所述第二发光显示部的表面。
  8. 根据权利要求7所述的双面OLED显示器，其中，所述绝缘层为氮化硅、氧化硅或三氧化二铝中的一种无机材料层或任意组合的复合层。
  9. 一种双面OLED显示器，其包括：
    第一发光显示部；
    第二发光显示部，位于所述第一发光显示部下部；以及
    上封装盖，用于封装所述第一发光显示部，包括：
    上板体，位于所述第一发光显示部上方；
    第一折弯结构，形成于所述上板体的三边边缘并向下延
    伸；
    下封装盖，用于封装所述第二发光显示部，包括：
    下板体，位于所述第二发光显示部下方；
    第二折弯结构，形成于所述下板体的三边边缘并向上延
    伸；
    所述上封装盖与下封装盖相结合形成一封装腔室，所述第一发光显示部与所述第二发光显示部封装于所述封装腔室内。
  10. 根据权利要求9所述的双面OLED显示器，其中，所述上封装盖与下封装盖对接，所述第一折弯结构底端与所述第二折弯结构顶端相贴合。
  11. 根据权利要求10所述的双面OLED显示器，其中，
    所述第一折弯结构向下延伸至所述第一发光显示部的底侧，所述第一发光显示部侧部与所述第一折弯结构内侧通过第一胶层粘接；
    所述第二折弯结构向上延伸至所述第二发光显示部的上侧，所述第二发光显示部侧部与所述第二折弯结构内侧通过第二胶层粘接。
  12. 根据权利要求9所述的双面OLED显示器，其中，所述上封装盖与所述下封装盖相扣合，所述上封装盖位于所述下封装盖内，并且，所述第一折弯结构外侧与所述第二折弯结构内侧相贴合。
  13. 根据权利要求12所述的双面OLED显示器，其中，
    所述第一折弯结构向下延伸至所述第二发光显示部的底侧，所述第一发光显示部及第二发光显示部的侧部与所述第一折弯结构内侧通过第一胶层粘接；
    所述下板体宽于所述上板体，所述第二折弯结构向上延伸至所述第一折弯结构的上侧，所述第一折弯结构外侧与所述第二折弯结构内侧通过第二胶层粘接。
  14. 根据权利要求9所述的双面OLED显示器，其中，所述上封装盖与下封装盖通过液体玻璃或塑料灌注成型。
  15. 根据权利要求9所述的双面OLED显示器，其中，所述上封装盖与下封装盖内设置有绝缘层，所述绝缘层形成于所述第一发光显示部与所述第二发光显示部的表面。
  16. 根据权利要求15所述的双面OLED显示器，其中，所述绝缘层为氮化硅、氧化硅或三氧化二铝中的一种无机材料层或任意组合的复合层。
  17. 双面OLED显示器封装方法，其中，包括以下步骤：
    S101，提供下封装盖；
    S102，提供一发光显示部，所述发光显示部包括上下粘贴设置的第一发光显示部与第二发光显示部，在所述第一发光显示部侧部设置第一胶层，在所述第二发光显示部侧部设置第二胶层；
    S103，将发光显示部置于所述下封装盖内，并将所述第二发光显示部侧部与所述下封装盖内侧通过所述第二胶层粘接；
    S104，提供上封装盖；
    S105，将所述上封装盖盖合于所述下封装盖上部，并将所述第一发光显示部侧部与所述上封装盖内侧通过所述第一胶层粘接。
PCT/CN2016/111614 2016-11-28 2016-12-23 双面oled显示器及其封装方法 Ceased WO2018094798A1 (zh)

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