WO2018082099A1 - 灯具及其散热机构 - Google Patents

灯具及其散热机构 Download PDF

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Publication number
WO2018082099A1
WO2018082099A1 PCT/CN2016/104920 CN2016104920W WO2018082099A1 WO 2018082099 A1 WO2018082099 A1 WO 2018082099A1 CN 2016104920 W CN2016104920 W CN 2016104920W WO 2018082099 A1 WO2018082099 A1 WO 2018082099A1
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WO
WIPO (PCT)
Prior art keywords
heat
insulating block
connecting post
conducting layer
layer
Prior art date
Application number
PCT/CN2016/104920
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English (en)
French (fr)
Inventor
李彬
Original Assignee
深圳市益科光电技术有限公司
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Priority to PCT/CN2016/104920 priority Critical patent/WO2018082099A1/zh
Publication of WO2018082099A1 publication Critical patent/WO2018082099A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals

Definitions

  • the invention relates to a lamp and a heat dissipating mechanism thereof.
  • the lamp of the lamp of a general automobile is disposed on the substrate, the heat generated by the lamp bead is transmitted from the front surface of the substrate to the reverse side of the substrate, and the heat on the reverse side of the substrate is conducted to the heat dissipation structure via the heat conduction column having a high thermal conductivity. Cooling.
  • the middle layer needs to pass through a multi-layer structure, so the heat conduction path of the above-mentioned lamp is long, and there is a problem that the heat conduction efficiency is low, so that the heat in the lamp bead cannot be fast. Conduction greatly reduces the service life of the lights.
  • a heat dissipating mechanism for dissipating heat generated by the lamp bead including:
  • the substrate includes a substrate body and a heat conducting layer, the heat conducting layer is disposed on an outer wall of the substrate body, and the lamp bead is disposed on the heat conducting layer;
  • connecting post having thermal conductivity, the connecting post being located between the substrate and the heat sink;
  • the insulating block has thermal conductivity, and the insulating block is located between the substrate and the heat sink to insulate between the heat conducting layer and the heat sink.
  • a luminaire includes a lamp bead and the above-described heat dissipating mechanism, and the lamp bead is disposed on the heat conducting layer.
  • FIG. 1 is a schematic structural view of a lamp of an embodiment
  • FIG. 2 is a schematic structural view of a lamp of another embodiment.
  • FIG. 3 is a schematic structural view of a lamp according to still another embodiment.
  • the luminaire and its heat dissipation mechanism will be described more fully hereinafter with reference to the associated drawings.
  • a preferred embodiment of the luminaire and its heat dissipation mechanism is shown in the drawings.
  • the luminaire and its heat dissipation mechanism can be implemented in many different forms and are not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to make the disclosure of the luminaire and its heat dissipation mechanism more thorough and comprehensive.
  • the luminaire 10 of an embodiment includes a heat dissipation mechanism 100 and a bead 200.
  • the luminaire 10 is a vehicle light.
  • the light fixture 10 can also be a tunnel light or a home light or other light fixture.
  • the heat dissipation mechanism 100 is for dissipating heat generated by the lamp bead 200.
  • the heat dissipation mechanism 100 includes a substrate 110, a heat sink 120, a connecting post 130, and an insulating block 140.
  • the substrate 110 includes a substrate body 112 and a heat conduction layer 114.
  • the heat conduction layer 114 is disposed on the outer wall of the substrate body 112, and the lamp bead 200 is disposed on the heat conduction layer 114.
  • the thermally conductive layer 114 is electrically conductive.
  • the connecting post 130 has thermal conductivity, and the connecting post 130 is located between the substrate 110 and the heat sink 120.
  • the insulating block 140 has insulation and thermal conductivity, and the insulating block 140 is located between the substrate 110 and the heat sink 120 to insulate the heat conducting layer 114 from the heat sink 120.
  • the insulating block 140 is connected between the heat conducting layer 114 and the connecting post 130, and the end of the connecting post 130 away from the insulating block 140 is connected to the heat sink 120.
  • the connecting post 130 and the insulating block 140 are both cylindrical. In other embodiments, the connecting post 130 and the insulating block 140 may also have a rectangular parallelepiped shape. One end of the insulating block 140 is connected to the heat conducting layer 114, and the other end is connected to the connecting post 130. The end of the connecting post 130 away from the insulating block 140 is fixed to the heat sink 120.
  • the heat conductive layer 114 includes a first heat conductive layer 114 a and a second heat conductive layer 114 b , and the first heat conductive layer 114 a and the second heat conductive layer 114 b are respectively fixed to both sides of the substrate body 112 .
  • the connecting post 130 includes a first connecting post 132 and a second connecting post 134.
  • the number of the insulating blocks 140 is two, and two ends of one insulating block 140 are respectively connected to the first heat conducting layer 114a and the first connecting pillar 132, and the other one. Both ends of the insulating block 140 are respectively connected to the second heat conductive layer 114b and the second connection pillar 134.
  • the end of the first connecting post 132 away from the first heat conducting layer 114a is fixed on the heat sink 120, and the end of the second connecting post 134 away from the second heat conducting layer 114b is fixed on the heat sink 120 to generate heat on the lamp bead 200.
  • the transfer to the heat sink 120 through the first heat conductive layer 114a or the second heat conductive layer 114b, respectively, increases the rate of heat conduction.
  • the insulating block 140 is soldered between the heat conducting layer 114 and the connecting post 130.
  • the number of the connecting post 130 and the insulating block 140 are multiple, and the plurality of connecting posts 130 are connected to the plurality of insulating blocks 140 one by one, and each insulating block 140 is fixed away from the end of the connecting post 130.
  • the connecting post 130 is integrally formed with the heat sink 120, and the end of the connecting post 130 away from the insulating block 140 is connected to the heat sink 120, so that the overall structure of the heat dissipating mechanism 100 is more compact.
  • the connecting post 130 is soldered to the heat sink 120 such that the end of the connecting post 130 away from the insulating block 140 is coupled to the heat sink 120.
  • the insulating block 140 is connected between the connecting post 130 and the heat sink 120, and the end of the connecting post 130 away from the insulating block 140 is connected to the heat conducting layer 114.
  • One end of the insulating block 140 is connected to the connecting post 130, and the other end is connected to the heat sink 120.
  • the end of the connecting post 130 away from the insulating block 140 is fixed to the heat conducting layer 114.
  • the insulating block 140 is soldered between the connecting post 130 and the heat sink 120.
  • the lamp bead 200 is fixed to the heat conductive layer 114. Specifically, in the embodiment, the number of the lamp beads 200 is plural. The plurality of lamp beads 200 are evenly distributed on the surface of the heat conductive layer 114.
  • the heat conductive layer 114 includes a first heat conductive layer 114a and a second heat conductive layer 114b, and the first heat conductive layer 114a and the second heat conductive layer 114b are respectively fixed to both sides of the substrate body 112.
  • the connecting post 130 includes a first connecting post 132 and a second connecting post 134.
  • the number of the insulating blocks 140 is two, and two ends of one insulating block 140 are respectively connected to the heat sink 120 and the first connecting post 132, and another insulating block. Both ends of the 140 are connected to the heat sink 120 and the second connecting post 134, respectively.
  • the end of the first connecting post 132 away from the insulating block 140 is fixed on the first heat conducting layer 114a, and the end of the second connecting post 134 away from the insulating block 140 is fixed on the second heat conducting layer 114b to generate heat generated on the lamp bead 200.
  • the transfer to the heat sink 120 through the first heat conductive layer 114a or the second heat conductive layer 114b, respectively, increases the rate of heat conduction.
  • the heat dissipation mechanism 100 is configured to dissipate heat generated by the lamp bead 200.
  • the heat dissipation mechanism 100 includes a substrate 110, a heat sink 120, an insulating block 140, and a connecting post 130.
  • the substrate 110 includes a substrate body 112 and a heat conductive layer 114.
  • the heat conductive layer 114 is disposed on the outer wall of the substrate body 112.
  • the heat conductive layer 114 has electrical conductivity, and the heat conductive layer 114 is used to set the light bulb 200.
  • the insulating block 140 has insulation and thermal conductivity.
  • the number of the connecting posts 130 is at least two, the connecting post 130 has thermal conductivity, and the insulating block 140 is disposed between the two connecting posts 130.
  • One connecting post 130 is connected to the heat conducting layer 114, and the other connecting post 130 is connected to the heat sink. 120.
  • the number of the insulating blocks 140 is one, and the number of the connecting posts 130 is two, one of the connecting posts 130 is connected to the heat conducting layer 114, and the other connecting post 130 is connected to the heat sink 120, and the two connections are
  • the post 130 is coupled to the body by an insulating block 140.
  • the heat conductive layer 114 includes a first heat conductive layer 114a and a second heat conductive layer 114b, and the first heat conductive layer 114a and the second heat conductive layer 114b are respectively fixed to both sides of the substrate body 112.
  • the number of the connecting posts 130 is four, and the insulating block 140 includes a first insulating block 142 and a second insulating block 144.
  • the two ends of the first insulating block 142 are respectively connected to the first connecting post 130 and the second connecting post, An end of the connecting post 130 away from the first insulating block 142 is fixed to the first heat conducting layer 114a, and an end of the second connecting post 130 away from the first insulating block 142 is fixed on the heat sink 120.
  • the two ends of the second insulating block 144 are respectively connected to the third connecting post 130 and the fourth connecting post 130, and the end of the third connecting post away from the second insulating block 144 is fixed to the second heat conducting layer 114b, the fourth The end of the connecting post 130 away from the second insulating block 144 is fixed on the heat sink 120, so that the heat generated on the lamp bead 200 is transmitted to the heat sink 120 through the first heat conducting layer 114a or the second heat conducting layer 114b, respectively, thereby improving heat.
  • the rate of conduction is provided.
  • the connecting post 130 and the insulating block 140 are both cylindrical. In other embodiments, the connecting post 130 and the insulating block 140 may also have a rectangular parallelepiped shape. In one of the embodiments, one of the heat conducting columns is soldered to the heat conducting layer 114, and the other connecting post 130 is soldered to the heat sink 120 to make the heat dissipating mechanism 100 more compact. In other embodiments, the number of the insulating blocks 140 is n (n>1), and the number of the connecting posts 130 is 2n, wherein the n connecting posts 130 are connected to the heat conducting layer 114, and the other n connecting posts 130 are connected to the heat dissipation. On the sheet 120. The n connecting posts 130 connected to the heat conducting layer 114 are in one-to-one correspondence with the n connecting posts 130 connected to the heat sink 120. The two ends of each insulating block 140 respectively connect the two corresponding connecting posts 130.
  • the thermally conductive layer 114 is an aluminum layer or a copper layer.
  • the material of the insulating block 140 is selected from at least one of a thermal paste, a thermal grease, a thermal silica gel, a graphite flake, and diamond. In this embodiment, the material of the insulating block 140 is a thermal conductive paste.
  • the heat generated by the lamp bead 200 sequentially passes through the heat conduction layer 114, the connection post 130, the insulation block 140, and the heat sink 120.
  • the heat generated by the lamp bead 200 passes through the heat conducting layer 114, the insulating block 140, the connecting post 130, and the heat sink 120 in sequence.
  • the heat generated by the lamp bead 200 passes through the heat conducting layer 114, the connecting post 130, the insulating block 140, the connecting post 130, and the heat sink 120 in sequence.
  • the heat conduction path is short, and the heat conduction efficiency is high, which solves the problem that the lamp has low heat conduction efficiency, thereby improving the service life of the lamp. Since the insulating block 140 insulates between the heat conducting layer 114 and the heat sink 120, current on the lamp bead 200 can be prevented from being conducted to the heat sink 120 to affect the electrical performance of the lamp 10.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种灯具(10)及其散热机构(100)。散热机构(100)用于对灯珠(200)产生的热量进行散热，包括基板(110)、散热片(120)、连接柱(130)以及绝缘块(140)；基板(110)包括基板本体(112)和导热层(114)，导热层(114)设置于基板本体(112)的外壁上，导热层(114)具有导电性，导热层(114)用于设置灯珠(200)；连接柱(130)具有导热性，连接柱(130)位于基板(110)与散热片(120)之间；绝缘块(140)具有绝缘性和导热性，绝缘块(140)位于基板(110)与散热片(120)之间，使导热层(114)与散热片(120)之间绝缘。

Description

灯具及其散热机构
【技术领域】
本发明涉及一种灯具及其散热机构。
【背景技术】
一般的汽车的车灯的灯珠设置于基板上，灯珠产生的热量由基板的正面传递至基板的反面，位于基板的反面的热量再经由导热率较高的导热柱传导至散热结构上进行散热。然而，热量从基板的正面传递至反面的过程中，中间需经过多层结构，所以上述的车灯的热量的传导路径较长，存在导热效率较低的问题，使灯珠内的热量无法快速传导，大大降低了车灯的使用寿命。
【发明内容】
基于此，有必要提供一种导热效率较高的灯具及其散热机构。
一种散热机构，用于对灯珠产生的热量进行散热，包括：
基板，包括基板本体和导热层，所述导热层设置于所述基板本体的外壁上，所述灯珠设置于所述导热层上；
散热片；
连接柱，具有导热性，所述连接柱位于所述基板与所述散热片之间；以及
绝缘块，具有导热性，所述绝缘块位于所述基板与所述散热片之间，使所述导热层与所述散热片之间绝缘。
一种灯具，包括灯珠和上述的散热机构，所述灯珠设置于所述导热层上。
本发明的一个或多个实施例的细节在下面的附图和描述中提出。本发明的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
【附图说明】
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为一实施例的灯具的结构示意图；
图2为另一实施例的灯具的结构示意图；及
图3为又一实施例的灯具的结构示意图。
【具体实施方式】
为了便于理解本发明，下面将参照相关附图对灯具及其散热机构进行更全面的描述。附图中给出了灯具及其散热机构的首选实施例。但是，灯具及其散热机构可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对灯具及其散热机构的公开内容更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在灯具及其散热机构的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及／或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1所示，一实施例的灯具10包括散热机构100和灯珠200。在本实施例中，灯具10为车灯。在其他实施例中，灯具10还可以为隧道灯或家用照明灯或其他灯具。散热机构100用于对灯珠200产生的热量进行散热。散热机构100包括基板110、散热片120、连接柱130以及绝缘块140。基板110包括基板本体112和导热层114，导热层114设置于基板本体112的外壁上，灯珠200设置于导热层114上。在其中一个实施例中，导热层114具有导电性。连接柱130具有导热性，连接柱130位于基板110与散热片120之间。绝缘块140具有绝缘性和导热性，绝缘块140位于基板110与散热片120之间，使导热层114与散热片120之间绝缘。在其中一个实施例中，绝缘块140连接于导热层114与连接柱130之间，连接柱130远离绝缘块140的端部连接于散热片120。在本实施例中，连接柱130和绝缘块140均呈圆柱状。在其他实施例中，连接柱130和绝缘块140还可以呈长方体状。绝缘块140的一端连接于导热层114，另一端连接于连接柱130。连接柱130远离绝缘块140的端部固定于散热片120上。
如图1所示，在其中一个实施例中，导热层114包括第一导热层114a和第二导热层114b，第一导热层114a和第二导热层114b分别固定于基板本体112的两侧。连接柱130包括第一连接柱132和第二连接柱134，绝缘块140的数目为两个，其中一个绝缘块140的两端分别连接于第一导热层114a和第一连接柱132，另外一个绝缘块140的两端分别连接于第二导热层114b和第二连接柱134。第一连接柱132远离第一导热层114a的端部固定于散热片120上，第二连接柱134远离第二导热层114b的端部固定于散热片120上，使灯珠200上产生的热量分别通过第一导热层114a或第二导热层114b传递至散热片120上，提高了热量传导的速率。
如图1所示，在其中一个实施例中，绝缘块140焊接于导热层114与连接柱130之间。在其中一个实施例中，连接柱130和绝缘块140的数目均为多个，多个连接柱130一一连接于多个绝缘块140上，每个绝缘块140远离连接柱130的端部固定于导热层114上。在其中一个实施例中，连接柱130与散热片120一体成型，使连接柱130远离绝缘块140的端部连接于散热片120，使散热机构100的整体结构更加紧凑。在其他实施例中，连接柱130焊接于散热片120上，使连接柱130远离绝缘块140的端部连接于散热片120。
如图2所示，在另一个实施例中，绝缘块140连接于连接柱130与散热片120之间，连接柱130远离绝缘块140的端部连接于导热层114。绝缘块140的一端连接于连接柱130，另一端连接于散热片120。连接柱130远离绝缘块140的端部固定于导热层114上。在其中一个实施例中，绝缘块140焊接于连接柱130与散热片120之间。灯珠200固定于导热层114上。具体在本实施例中，灯珠200的数目为多个。多个灯珠200均匀分布于导热层114表面上。
如图2所示，在其中一个实施例中，导热层114包括第一导热层114a和第二导热层114b，第一导热层114a和第二导热层114b分别固定于基板本体112的两侧。连接柱130包括第一连接柱132和第二连接柱134，绝缘块140的数目为两个，其中一个绝缘块140的两端分别连接于散热片120和第一连接柱132，另外一个绝缘块140的两端分别连接于散热片120和第二连接柱134。第一连接柱132远离绝缘块140的端部固定于第一导热层114a上，第二连接柱134远离绝缘块140的端部固定于第二导热层114b上，使灯珠200上产生的热量分别通过第一导热层114a或第二导热层114b传递至散热片120上，提高了热量传导的速率。
如图3所示，在又一个实施例中，散热机构100用于对灯珠200产生的热量进行散热。散热机构100包括基板110、散热片120、绝缘块140以及连接柱130。基板110包括基板本体112和导热层114，导热层114设置于基板本体112的外壁上，导热层114具有导电性，导热层114用于设置灯珠200。绝缘块140具有绝缘性和导热性。连接柱130的数目至少为两个，连接柱130具有导热性，绝缘块140设置于两个连接柱130之间，其中一个连接柱130连接于导热层114，另外一个连接柱130连接于散热片120。在本实施例中，绝缘块140的数目为一个，连接柱130的数目为两个，其中一个连接柱130连接于导热层114上，另外一个连接柱130连接于散热片120上，两个连接柱130通过绝缘块140连接于一体。
如图3所示，在其中一个实施例中，导热层114包括第一导热层114a和第二导热层114b，第一导热层114a和第二导热层114b分别固定于基板本体112的两侧。连接柱130的数目为四个，绝缘块140包括第一绝缘块142和第二绝缘块144，第一绝缘块142的两端分别连接于第一个连接柱130和第二个连接柱，第一个连接柱130远离第一绝缘块142的端部固定于第一导热层114a，第二个连接柱130远离第一绝缘块142的端部固定于散热片120上。第二绝缘块144的两端分别连接于第三个连接柱130和第四个连接柱130，第三个连接柱远离第二绝缘块144的端部固定于第二导热层114b，第四个连接柱130远离第二绝缘块144的端部固定于散热片120上，使灯珠200上产生的热量分别通过第一导热层114a或第二导热层114b传递至散热片120上，提高了热量传导的速率。
在本实施例中，连接柱130和绝缘块140均呈圆柱状。在其他实施例中，连接柱130和绝缘块140还可以呈长方体状。在其中一个实施例中，其中一个导热柱焊接于导热层114上，另外一个连接柱130焊接于散热片120上，使散热机构100的结构更加紧凑。在其他实施例中，绝缘块140的数目为n（n＞1）个，连接柱130的数目为2n个，其中n个连接柱130连接于导热层114，另外n个连接柱130连接于散热片120上。连接于导热层114的n个连接柱130与连接于散热片120的n个连接柱130一一对应，每个绝缘块140的两端分别将两个对应的连接柱130连接于一体。
在其中一个实施例中，导热层114为铝层或铜层。在其中一个实施例中，绝缘块140的材料选自导热膏、导热硅脂、导热硅胶、石墨片及金刚石中的至少一种。在本实施例中，绝缘块140的材料为导热膏。
上述的灯具10及其散热机构100，灯珠200产生的热量依次经过导热层114、连接柱130、绝缘块140和散热片120。或灯珠200产生的热量依次经过导热层114、绝缘块140、连接柱130和散热片120。或灯珠200产生的热量依次经过导热层114、连接柱130、绝缘块140、连接柱130和散热片120。相对于一般的灯珠200的热量的传导路径较短，导热效率较高，解决了车灯存在导热效率较低的问题，从而可以提高车灯的使用寿命。由于绝缘块140使导热层114与散热片120之间绝缘，可以避免灯珠200上的电流传导至散热片120上而影响灯具10的电气性能。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (11)

  1. 一种散热机构，用于对灯珠产生的热量进行散热，包括：
    基板，包括基板本体和导热层，所述导热层设置于所述基板本体的外壁上，所述灯珠设置于所述导热层上；
    散热片；
    连接柱，具有导热性，所述连接柱位于所述基板与所述散热片之间；以及
    绝缘块，具有导热性，所述绝缘块位于所述基板与所述散热片之间，使所述导热层与所述散热片之间绝缘。
  2. 根据权利要求1所述的散热机构，其特征在于，所述绝缘块连接于所述导热层与所述连接柱之间，所述连接柱远离所述绝缘块的端部连接于所述散热片。
  3. 根据权利要求2所述的散热机构，其特征在于，所述连接柱与所述散热片一体成型，使所述连接柱远离所述绝缘块的端部连接于所述散热片。
  4. 根据权利要求2所述的散热机构，其特征在于，所述连接柱焊接于所述散热片上，使所述连接柱远离所述绝缘块的端部连接于所述散热片。
  5. 根据权利要求2所述的散热机构，其特征在于，所述导热层包括第一导热层和第二导热层，所述第一导热层和所述第二导热层分别固定于所述基板本体的两侧；
    所述连接柱包括第一连接柱和第二连接柱，所述绝缘块的数目为两个，其中一个所述绝缘块的两端分别连接于所述第一导热层和所述第一连接柱，另外一个所述绝缘块的两端分别连接于所述第二导热层和所述第二连接柱；
    所述第一连接柱远离所述第一导热层的端部固定于所述散热片上，所述第二连接柱远离所述第二导热层的端部固定于所述散热片上。
  6. 根据权利要求1所述的散热机构，其特征在于，所述绝缘块连接于所述连接柱与所述散热片之间，所述连接柱远离所述绝缘块的端部连接于所述导热层。
  7. 根据权利要求1所述的散热机构，其特征在于，所述连接柱的数目至少为两个，所述绝缘块设置于两个所述连接柱之间，其中一个所述连接柱连接于所述导热层，另外一个所述连接柱连接于所述散热片。
  8. 根据权利要求7所述的散热机构，其特征在于，所述导热层包括第一导热层和第二导热层，所述第一导热层和所述第二导热层分别固定于所述基板本体的两侧；
    所述连接柱的数目四个，所述绝缘块包括第一绝缘块和第二绝缘块，所述第一绝缘块的两端分别连接于第一个所述连接柱和第二个所述连接柱，第一个所述连接柱远离所述第一绝缘块的端部固定于所述第一导热层，第二个所述连接柱远离所述第一绝缘块的端部固定于所述散热片上；
    所述第二绝缘块的两端分别连接于第三个所述连接柱和第四个所述连接柱，第三个所述连接柱远离所述第二绝缘块的端部固定于所述第二导热层，第四个所述连接柱远离所述第二绝缘块的端部固定于所述散热片上。
  9. 根据权利要求1所述的散热机构，其特征在于，所述导热层为铝层或铜层。
  10. 根据权利要求1所述的散热机构，其特征在于，所述绝缘块的材料选自导热膏、导热硅脂、导热硅胶、石墨片及金刚石中的至少一种。
  11. 一种灯具，包括灯珠和权利要求1至10任一项所述的散热机构，所述灯珠设置于所述导热层上。
PCT/CN2016/104920 2016-11-07 2016-11-07 灯具及其散热机构 WO2018082099A1 (zh)

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