WO2018077319A1 - Dispositif de thermorégulation pour convertisseur de tension - Google Patents

Dispositif de thermorégulation pour convertisseur de tension Download PDF

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Publication number
WO2018077319A1
WO2018077319A1 PCT/DE2017/000338 DE2017000338W WO2018077319A1 WO 2018077319 A1 WO2018077319 A1 WO 2018077319A1 DE 2017000338 W DE2017000338 W DE 2017000338W WO 2018077319 A1 WO2018077319 A1 WO 2018077319A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat exchange
converter
voltage converter
tempering
Prior art date
Application number
PCT/DE2017/000338
Other languages
German (de)
English (en)
Inventor
Benjamin SCHRAFF
Manuel Weber
Original Assignee
Gentherm Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gentherm Gmbh filed Critical Gentherm Gmbh
Publication of WO2018077319A1 publication Critical patent/WO2018077319A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/025—Constructional details relating to cooling

Definitions

  • the invention relates to a temperature control device for a voltage converter, in particular for a DC-DC converter, with a heat exchange device, and one or more thermoelectric devices, wherein in each case a first side of the one or more thermoelectric devices is heat-transmitting connected to the heat exchange device.
  • the invention relates to a voltage converter, in particular a DC-DC converter, with a tempering device and one or more ceramic and / or semiconductor components.
  • the invention relates to a vehicle, in particular an electric vehicle or a hybrid vehicle.
  • the voltage conversion usually occurs using an electronic switch and at least one energy store.
  • an energy storage come in particular on inductance-based energy storage, such as coils or transformer transformers, and capacity-based energy storage, such as capacitors or charge pumps, into consideration. These components are often based on ceramic or semiconductor components, which are housed accordingly and contacted on boards.
  • the function is regularly distributed over a multiplicity of identical circuits.
  • Such a circuit distribution is also referred to as a multi-phase arrangement.
  • the power of voltage converters depends crucially on the temperature of the voltage converter. It is therefore desirable to temper the heat-generating components such that their temperature is within an optimum operating range. This often requires a strong cooling of these components.
  • the waste heat generating elements of voltage converters such as film capacitors, coils and
  • the object underlying the invention is therefore to improve the temperature of components of a voltage converter, in particular a DC-DC converter.
  • thermoelectric devices are adapted to each heat-transmitting connected at a second side with a ceramic or a semiconductor component of the voltage converter and disposed within a converter housing ,
  • the invention makes use of the finding that the arrangement of the one or more thermoelectric devices within the converter housing no longer serves as a layer of insulation between the one or more thermoelectric devices and the ceramic and / or semiconductor components of the converter housingppskonverters acts, which is to be overcome in a heat exchange between the one or more thermoelectric devices and the tempering ceramic and / or semiconductor components.
  • the arrangement according to the invention of the one or more thermoelectric devices consequently improves the heat flow between the one or more thermoelectric devices and the ceramic and / or semiconductor components to be tempered, since the usual packaging of the ceramic and / or semiconductor components in FIG corresponding housing deleted.
  • the one or more thermoelectric devices are formed as a Peltier element and have a cold side and a warm side.
  • the first side of the one or more thermoelectric devices corresponds to the hot side and the second side of the one or more thermoelectric devices of the cold side.
  • the heat flow is improved because between the cold side of the one or more Peltier Elements and the ceramic and / or semiconductor components no longer acts as a base plate of the converter housing as insulation.
  • the converter housing can also be referred to as a converter housing.
  • the temperature control device is adapted for use with a DC-DC converter, it is preferred that the DC-DC converter is designed to convert a voltage from 12 volts to 48 volts and / or vice versa.
  • a DC-DC converter may also be referred to as a DC-DC converter or a DC-DC converter, wherein a DC-DC converter is an electrical circuit which converts a first DC voltage supplied into a second, recovered DC voltage with higher, lower or reverse voltage level.
  • the tempering of the ceramic and / or the semiconductor components may include the cooling and / or the heating of the ceramic and / or the semiconductor components.
  • the one or the plurality of thermoelectric devices is configured to be soldered directly to a ceramic or a semiconductor component of the voltage converter on the second side in each case.
  • the heat transferring connection between the one or more thermoelectric devices and the respective ceramic and / or semiconductor component is thus a solder connection.
  • the direct soldering significantly improves the heat conduction between the one or more thermoelectric devices and the respective ceramic and / or semiconductor component, as a result of which the energy required for tempering the ceramic and / or semiconductor components is further reduced.
  • the one or more thermoelectric devices are each connected at the second side to a first side of a heat distribution device, in particular soldered, wherein the heat distribution device is adapted to a second side with a plurality of ceramic and / or semiconductor components of the voltage converter connected heat-transmitting, in particular soldered, and to be arranged within the converter housing.
  • the heat distribution device thus serves as an intermediate between the one or more thermoelectric devices and the tempering ceramic and / or semiconductor components.
  • the heat distribution device can be formed, for example, from a heat-conducting metal or a heat-conductive metal alloy, such as aluminum or an aluminum alloy.
  • the tempering device according to the invention is advantageously further developed in that the heat exchange device is adapted to heat transfer connected to the converter housing, in particular soldered, and to be arranged outside the converter housing.
  • the heat exchange device may be formed as an integral part of the converter housing.
  • the one or more thermoelectric devices are disposed within the converter housing, heat transfer beyond the converter housing is necessary in order for the one or more thermoelectric devices to permanently provide sufficient tempering performance.
  • This heat exchange can be implemented particularly effectively in that the heat exchange device is heat-transfer-connected to the converter housing or is formed as an integral part of the converter housing.
  • the heat exchange device is located outside the converter housing, the charging of the heat exchange device with a heat exchange fluid can be implemented particularly easily and effectively.
  • the heat exchange device has heat exchange fins and / or heat exchange fins, which are adapted to exchange heat with a heat exchange fluid.
  • the heat exchange fins and / or heat exchange fins are also an integral part of Converter housing.
  • the converter housing can also be profiled in this case. Heat exchange fins and heat exchange fins lead to a significant increase in the surface, which flows through a heat exchange fluid and / or can be flowed. The heat exchange of the heat exchange device with a heat exchange fluid can thus be increased considerably.
  • the tempering device according to the invention is also advantageously further developed in that the heat exchange ribs and / or heat exchange fins are arranged in a liquid chamber, which is designed to receive a liquid heat exchange fluid.
  • a liquid temperature control such as a liquid cooling.
  • the external fluid chamber does not present the risk of the converter electronics coming into contact with the liquid heat exchange fluid, effectively preventing damage and / or corrosion of the converter electronics.
  • the heat exchange device comprises a flow generator, which is configured to flow the heat exchange fluid in such a way that the heat exchange fluid flows against the heat exchange fins, the heat exchange fins and / or the one or more thermoelectric devices and / or flows through.
  • the heat exchange fluid is formed in gaseous form, for example as air
  • the flow generator can be designed as a ventilator or fan.
  • the heat exchange fluid is liquid, for example as water or as a special tempering liquid, the flow generator can be designed as a pump.
  • thermoelectric device in the vicinity of the flow generator is arranged and adapted to heat with the Exchange heat exchange fluid.
  • the converter housing may have a common interior for the converter electronics and the heat exchange device, so that the converter electronics, the flow generator and the at least one arranged in the vicinity of the flow generator thermoelectric device are arranged in the common interior.
  • the converter housing may have a plurality of separate interior sections, wherein the converter electronics are arranged in a first interior section and the heat exchange device at least partially in a second interior section, so that the converter electronics in another interior portion of the converter housing as the flow generator and the at least one arranged in the vicinity of the flow generator Thermoelectric device is arranged.
  • the heat exchange device comprises a tempering and a réelleabrioskanal
  • the tempering is preferably heat transfer connected to the second side of the one or more thermoelectric devices and / or the heat distribution device and / or the saukeal preferably with heat transfer the first side of the one or more thermoelectric devices is connected. Due to the fact that the temperature control channel is heat-transfer-connected to the second side of the one or more thermoelectric devices, this can be the tempering channel flowing through heat exchange fluid are tempered by the one or more thermoelectric devices. The tempered heat exchange fluid can then be transported to the heat distribution device, which in turn is adapted to temper the ceramic and / or semiconductor components.
  • the tempered heat exchange fluid may be transported directly to the ceramic and / or semiconductor components to cause direct heat exchange between the heat exchange fluid and the ceramic and / or semiconductor devices.
  • a fluid guide such as an air baffle, arranged, which prevents or reduces the transport of the ceramic and / or semiconductor components supplied heat exchange fluid in housing areas that do not require temperature control.
  • an insulation is arranged between the tempering channel and the heat removal channel, which prevents or inhibits the heat exchange between the tempering channel and the heat removal channel.
  • the heat exchange fluid flowing in the temperature control channel and the exhaust air flowing in the heat removal channel have a temperature difference. In order for this temperature difference can be maintained, a heat exchange between the heat exchange fluid and the exhaust air is to be avoided as possible.
  • the insulation layer provides for prevention or inhibition of such heat exchange.
  • the object underlying the invention is further achieved by a voltage converter of the type mentioned above, wherein the temperature control device is designed according to one of the embodiments described above and the one or more thermoelectric devices each on the second side with a ceramic or a semiconductor Component of the voltage converter connected to heat transfer and are arranged within the converter housing.
  • the one or more ceramic and / or semiconductor components are each soldered directly to the second side of a thermoelectric device.
  • the heat transferring connection between the one or more thermoelectric devices and the respective ceramic and / or semiconductor component is thus a solder connection.
  • the direct soldering significantly improves the heat conduction between the one or more thermoelectric devices and the respective ceramic and / or semiconductor component, as a result of which the energy required for tempering the ceramic and / or semiconductor components is further reduced.
  • the one or more ceramic and / or semiconductor components are each connected to the second side of the heat distribution device of the tempering device in a heat-transmitting manner, in particular soldered.
  • the heat distribution device thus serves as an intermediate element between the one or more thermoelectric devices and the ceramic and / or semiconductor components to be tempered.
  • a heat distribution takes place, so that even with only local tempering several or all thermoelectric devices for temperature control can be used.
  • a plurality of ceramic and / or semiconductor components have a different Temperier collar, is reduced by the intermediate heat distribution device of the necessary energy requirements and increased the maximum local temperature control.
  • the heat exchange device of the temperature control device is heat-transmitting connected to the converter housing, in particular soldered, and arranged outside or inside the converter housing. If the heat exchange device is arranged outside the converter housing or on the outside of the converter housing, a liquid temperature control, such as a liquid cooling, can be implemented in a particularly simple manner since there is no risk that the converter electronics will come into contact with the liquid heat exchange fluid, thus damaging it and / or corrosion of the Converter electronics is effectively prevented.
  • the heat exchange device is disposed within the converter housing, the heat exchange between the heat exchange device and the one or more ceramic and / or semiconductor components is particularly effective since the walling of the converter housing is eliminated as heat insulation to be overcome.
  • the heat exchange device is designed as an outer and partially or completely as an integral part of the converter housing. If the heat exchange device is designed as an outer and partially or completely as an integral part of the converter housing, the application of a heat exchange fluid to the heat exchanger device can be implemented in a particularly simple and effective manner. Furthermore, there is no increased risk of damage in an external heat exchange device when a liquid is used as a heat exchange fluid, since the heat exchange fluid is separated by the external heat exchange device of the internal converter electronics, so that, for example, there is no increased tendency to corrosion despite the use of a liquid heat exchange fluid.
  • a voltage converter according to the invention is preferred in which the first side of the one or more thermoelectric devices of the temperature control device is in contact with the wall of the converter housing. Due to the direct contact with the wall, on the one hand, the heat exchange is conveyed to a heat exchange device, which is also in contact with the wall, and on the other hand, the space within the converter housing is effectively utilized, so that space-saving voltage converters can be realized.
  • the converter housing is partially or completely formed from a heat-conducting metal or a heat-conducting metal alloy.
  • the converter housing is partially or completely formed of aluminum, an aluminum alloy or another alloy, which has a suitably high thermal conductivity.
  • an inventive voltage converter is advantageous, which pursues a hybrid approach, wherein only individual ceramic and / or semiconductor components are heat transfer connected to one or more thermoelectric devices and individual ceramic and / or semiconductor components via a parallel tempering F ad, such about a ventilation, to be tempered. In particular, this can lead to a considerable increase in energy efficiency without simultaneous power losses if individual ceramic and / or semiconductor components are less temperature-sensitive than others, and thus result in different temperature control requirements.
  • the object underlying the invention is further achieved by a vehicle of the type mentioned, wherein the vehicle comprises a temperature control device according to one of the embodiments described above or a voltage converter according to one of the embodiments described above.
  • the vehicle comprises a temperature control device according to one of the embodiments described above or a voltage converter according to one of the embodiments described above.
  • the voltage converter of the vehicle is a DC-to-DC converter which converts the voltage of a 12 volt alternator to 48 volts of a vehicle battery and / or converts the voltage of a 48 volt vehicle battery to 12 volts of standard loads.
  • the voltage converter can be used in a power source, in particular a vehicle battery, wherein the voltage converter is configured to provide a plurality of electrical potentials and voltage values.
  • FIG. 2 shows an embodiment of the invention
  • Fig. 3 shows an embodiment of the invention
  • Fig. 4 shows an embodiment of the invention
  • Fig. 5 shows an embodiment of the invention
  • Fig. 6 parts of a vehicle electronics of a vehicle according to the invention in a schematic representation.
  • Fig. 1 shows a voltage converter 100, which is designed as a DC-DC converter.
  • the voltage converter 100 has a tempering device 10 and a plurality of ceramic and / or semiconductor components 106a-106h.
  • the tempering device 10 comprises a heat exchange device 12 and a plurality of thermoelectric devices 14a-14h formed as Peltier elements, wherein a first side of the thermoelectric devices 14a-14h heat transfer with the heat exchange device 12 and a second side of the thermoelectric devices 14a-14h heat transfer is connected to a ceramic or a semiconductor component 106a-106h of the voltage converter 100. All thermoelectric devices 14a-14h are disposed within a converter housing 102.
  • thermoelectric devices 14a-14h of the temperature control device 10 are in contact with the inner wall of the converter housing 102 and the outer wall of the converter housing 102 is in contact with the heat exchanger device 12, the heat exchanger device 12 is heat-transferring with the first Side of the thermoelectric devices 14a-14h connected.
  • the heat exchanger 12 has heat exchange fins 18 which are adapted to heat with a heat exchange fluid 22 exchange. Characterized in that the heat exchange fins 18 are part of the converter housing 102, the heat exchange device 12 is formed as an external and partially integral part of the converter housing 102.
  • the converter housing 102 is formed entirely of a heat conductive metal, namely, an aluminum alloy.
  • the ceramic and / or semiconductor devices 106a-106h are soldered directly to the second sides of the thermoelectric devices 14a-14h.
  • the component 106a is part of an input intermediate circuit.
  • the component 106h is part of an output intermediate circuit.
  • the components 106b-106e are unhindered semiconductor devices of an electronic package 104.
  • the components 106f, 106g are components of power chokes.
  • the heat exchange device 12 comprises a fan-shaped flow generator 26, which is adapted to make a formed as air heat exchange fluid 22 in flow such that the heat exchange fluid 22, the heat exchange fins 18 flows against and flows through.
  • a computing unit 108 and a gate driver 1 10 are also arranged.
  • the voltage converter 100 shown in FIG. 2 essentially corresponds to the voltage converter 100 shown in FIG. 1, but a heat distribution device 16 is arranged between the thermoelectric devices 14a-14h and the ceramic and / or semiconductor components 106a-106h.
  • a first side of the heat distribution device 16 is heat-transmittingly connected to the second sides of the thermoelectric devices 14a-14h via solder joints.
  • a second side of the heat distribution device 16 is connected in a heat-transmitting manner to the ceramic and / or semiconductor components 106a-106h via solder joints.
  • the heat distribution device 16 improves the heat distribution. Due to the improved heat distribution, even if only a local temperature demand is required, a plurality or all of the thermoelectric devices 14a-14a can be used. 14h are used for temperature control of the ceramic and / or semiconductor components 106a-106h, which have an increased temperature requirement. Furthermore, the necessary energy requirement is reduced by the interposed heat distribution device 16 and the maximum local tempering capacity is increased.
  • the voltage converter 100 shown in FIG. 3 substantially corresponds to the voltage converter 100 shown in FIG. 2, but the heat exchange device 12 has heat exchange fins 20 instead of heat exchange fins 18.
  • the heat exchange fins 20 are arranged in a liquid chamber 24, which is designed to receive a liquid heat exchange fluid 22. Furthermore, it lacks a flow generator.
  • the liquid chamber 24 of the heat exchanger 12 may be integrated into a liquid circuit in which the liquid heat exchange fluid 22 is circulated so that heat exchange takes place between the heat exchange fins 20 and the liquid heat exchange fluid 22.
  • FIG 4 shows a voltage converter 100 whose tempering device 10 has an alternative heat exchange device 12.
  • thermoelectric device 14 is disposed in the vicinity of the flow generator 26 and configured to exchange heat with the heat exchange fluid 22.
  • the flow generator 26 is designed as a fan, wherein the heat exchange fluid 22 is formed as air. Due to the temperature of the heat exchange fluid 22 at the same heat exchange takes place with a discharged air 34.
  • the heat exchange device 12 comprises a tempering channel 28 and a heat removal channel 30.
  • the tempering channel 28 is connected directly to the second side of the thermoelectric device 14 and via the heat exchange fins 20, which are integral parts of the converter housing 102a, 102b are formed, heat transfer connected to the heat distribution device 16.
  • the heat removal channel 30 is connected directly to the first side of the thermoelectric devices 14 in a heat-transmitting manner. Between the tempering channel 28 and the heat removal channel 30, an insulation 32 is arranged, which the Heat exchange between the temperature control channel 28 and the sauceabloomal 30 inhibits.
  • the converter housing 102a, 102b has two separate interior sections, the converter electronics being surrounded in sections by a first housing section 102a and the heat exchanger device 12 by a second housing section 102b.
  • the converter electronics is surrounded by another housing portion of the converter housing 102a, 102b as the flow generator 26 and the arranged in the vicinity of the flow generator 26 thermoelectric device 14.
  • the housing section 102b has a fluid inlet and a fluid outlet, so that the flow generator 26 can suck in air from the environment and blow it back into the environment after the heat exchange has taken place.
  • the voltage converter 100 shown in FIG. 5 substantially corresponds to the voltage converter 100 shown in FIG. 4, but it lacks heat exchange fins and a heat distribution device.
  • converter electronics and the heat exchange device 12 are arranged in a common interior of the converter housing 102.
  • the heat exchange fluid 22 produced by the flow generator 26 and tempered by the thermoelectric device 14 is transported directly toward the ceramic and / or semiconductor components 106a-106h to bypass the ceramic and / or semiconductor components 106a-106h.
  • a fluid guide device 12 designed as an air guide plate, which reduces the transport of the heat exchange fluid 22 supplied to the ceramic and / or semiconductor components 106a-106g into housing regions which require no temperature control.
  • the heat exchange fluid together with the exhaust air 34 is blown through a fluid outlet into the environment.
  • Fig. 6 shows parts of the vehicle electronics 200 of an electric vehicle.
  • the vehicle electronics 200 includes a voltage converter 100 which measures the voltage of a 12 volt battery 202 to the voltage of a 48 volt battery 204 converted.
  • 12 volt battery 202 12 volt consumers 206 are connected.
  • 48 volt battery 204 48 volt consumers 208 are connected.
  • the 48 volt battery 204 is connected to an electric motor 220 via an inverter 216 and an integrated starter generator 218.
  • the voltage converter 100 is also connected to a fluid temperature control 210, a communication bus 212 for the direct retrieval of data, a vehicle port 214 and a controller 222.
  • the vehicle port 214 may be, for example, a clamp that is switched via the ignition. When the ignition is activated, for example, 12 volts are applied to the vehicle connection 214, with no voltage applied to the vehicle connection 214 when the ignition is deactivated. Alternatively, 12 volts may permanently be applied to the vehicle connection 214. Alternatively, the vehicle port 214 may be a clamp that is switched over the battery state.
  • the controller 222 is configured to control the voltage converter 100.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de thermorégulation (10) pour un convertisseur (100) de tension, en particulier pour un convertisseur continu-continu. Le dispositif comprend un dispositif d'échange de chaleur (12) et un ou plusieurs dispositifs thermoélectriques (14, 14a-14h). Une première face respective du ou des différents dispositifs thermoélectriques (14, 14a-14h) est reliée de manière thermoconductrice au dispositif d'échange de chaleur (12) et le ou les différents dispositifs thermoélectriques (14, 14a-14h) sont conçus pour être reliés respectivement par une deuxième face à un composant céramique ou à un composant à semi-conducteur (106a-106h) du convertisseur (100) de tension et pour être agencés à l'intérieur d'un boîtier (102, 102a, 102b) de convertisseur.
PCT/DE2017/000338 2016-10-28 2017-10-12 Dispositif de thermorégulation pour convertisseur de tension WO2018077319A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102016012942 2016-10-28
DE102016012942.5 2016-10-28
DE202017002775.5 2017-05-24
DE202017002775.5U DE202017002775U1 (de) 2016-10-28 2017-05-24 Temperier-Einrichtung für einen Spannungskonverter

Publications (1)

Publication Number Publication Date
WO2018077319A1 true WO2018077319A1 (fr) 2018-05-03

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PCT/DE2017/000338 WO2018077319A1 (fr) 2016-10-28 2017-10-12 Dispositif de thermorégulation pour convertisseur de tension

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WO (1) WO2018077319A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113251691A (zh) * 2021-06-18 2021-08-13 北京百度网讯科技有限公司 制冷设备及车辆

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050126184A1 (en) * 2003-12-12 2005-06-16 Cauchy Matt J. Thermoelectric heat pump with direct cold sink support
DE202007018397U1 (de) * 2007-04-12 2008-07-10 Rittal Gmbh & Co. Kg Thermoelektrische Temperiervorrichtung
US20120293962A1 (en) * 2011-02-23 2012-11-22 University Of Maryland,College Park Trench-assisted thermoelectric isothermalization of power switching chips
DE102012208745A1 (de) * 2011-05-27 2012-11-29 Lear Corporation Elektrisch gekühltes Stromversorgungsmodul
DE102013205014A1 (de) * 2012-05-22 2013-11-28 Lear Corp. Kühlplatte zum Einsatz in einem Elektrofahrzeug (EV) oder einem Hybrid-Elektrofahrzeug (HEV)

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050126184A1 (en) * 2003-12-12 2005-06-16 Cauchy Matt J. Thermoelectric heat pump with direct cold sink support
DE202007018397U1 (de) * 2007-04-12 2008-07-10 Rittal Gmbh & Co. Kg Thermoelektrische Temperiervorrichtung
US20120293962A1 (en) * 2011-02-23 2012-11-22 University Of Maryland,College Park Trench-assisted thermoelectric isothermalization of power switching chips
DE102012208745A1 (de) * 2011-05-27 2012-11-29 Lear Corporation Elektrisch gekühltes Stromversorgungsmodul
DE102013205014A1 (de) * 2012-05-22 2013-11-28 Lear Corp. Kühlplatte zum Einsatz in einem Elektrofahrzeug (EV) oder einem Hybrid-Elektrofahrzeug (HEV)

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DE102017004975A1 (de) 2018-05-03
DE202017002775U1 (de) 2018-01-31

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