WO2018076395A1

WO2018076395A1 - Pcb board heating method and apparatus, pcb board component and electronic device

Info

Publication number: WO2018076395A1
Application number: PCT/CN2016/104929
Authority: WO
Inventors: 周仕贤; 张兴
Original assignee: 邦彦技术股份有限公司
Priority date: 2016-10-26
Filing date: 2016-11-07
Publication date: 2018-05-03
Also published as: CN106304621A

Abstract

A PCB board (6) heating method and apparatus (100), a PCB board component (60) and an electronic device. In the PCB board (6) heating method, a heating element (2) is embedded in a middle layer of the PCB board (6), and the heating method of the PCB board (6) comprises the following steps: collecting an ambient temperature where the PCB board (6) is located; and controlling the heating element (2) to heat the PCB board (6) when the ambient temperature is less than a pre-set ambient temperature. The PCB board (6) heating method can effectively improve the ability of an electronic device with the PCB board (6) to start normally or work normally in a low temperature environment.

Description

PCB board heating method and device, PCB board assembly and electronic device

Technical field

The present invention relates to the field of PCB board technology, and in particular, to a method and device for heating a PCB board, a PCB board assembly, and an electronic device.

Background technique

PCB boards (printed circuit boards) are extremely versatile and have become an integral part of most electronic devices. However, when using an electronic device having a PCB board in a low-temperature environment, for example, in the winter in the north, a communication device used outdoors, or a server used in an indoor space requiring low-temperature cooling (such as a cryogenic laboratory) , gateway, etc., because the chip on the PCB is affected by the ambient temperature, when starting or using the electronic device with the PCB board, the chip of the PCB board is often not working properly, and the electronic device cannot be started normally. Or a problem that doesn't work properly.

Summary of the invention

The main object of the present invention is to provide a heating method for a PCB board, which aims to improve the ability of an electronic device having a PCB board to be normally started or operated normally in a low temperature environment.

In order to achieve the above object, a heating method for a PCB board according to the present invention, wherein a heating element is embedded in an intermediate layer of the PCB board, the PCB board heating method includes the following steps: collecting an environment in which the PCB board is located a temperature; controlling the heating element to heat the PCB board when the ambient temperature is less than the preset ambient temperature.

Preferably, the step of controlling the heating element to heat the PCB board further comprises the steps of: collecting a temperature of the PCB board; when the temperature of the PCB board is greater than the preset PCB board temperature, Controlling the heating element to stop heating the PCB board; wherein the preset ambient temperature is less than the preset PCB board temperature.

Preferably, the heating element is a heating layer, and the heating layer comprises a metal wire having electrical resistance.

The present invention also provides a heating device for a PCB board, comprising: a temperature sensor for being disposed on the PCB board for collecting an ambient temperature at which the PCB board is located; and a heating element for embedding in the PCB a middle layer of the board for heating the PCB board; and a controller electrically connecting the temperature sensor and the heating element, the controller for when the ambient temperature is less than the preset ambient temperature The heating element is controlled to heat the PCB board.

Preferably, the temperature sensor is further configured to collect the temperature of the PCB after being heated, and the controller is further configured to control the heating element when a temperature of the PCB is greater than a temperature of the preset PCB Stop heating the PCB board; wherein the preset ambient temperature is less than the preset PCB board temperature.

Preferably, the heating element is a heating layer, the heating layer comprises a metal wire having a resistance, the PCB board has a chip, and the metal wire with a resistance surrounds the periphery of the chip.

Preferably, the method further includes a MOS transistor switching circuit connected between the heating element and the controller, wherein the controller controls the conduction state by controlling the conduction state of the MOS transistor switching circuit The energization state of the heating element.

Preferably, a temperature overload protection circuit is further included, and the temperature overload protection circuit is connected in series with the heating element.

The invention also provides a PCB board assembly, comprising a PCB board and the above-mentioned heating device of the PCB board, the heating device comprising: a temperature sensor disposed on the PCB board for collecting an ambient temperature of the PCB board a heating element embedded in an intermediate layer of the PCB for heating the PCB; a controller electrically connecting the temperature sensor and the heating element, respectively, the controller when the ambient temperature When the preset ambient temperature is less than, the heating element is controlled to heat the PCB board.

The present invention also provides an electronic device comprising the above-mentioned PCB board assembly, the PCB board assembly comprising a PCB board and the above-mentioned heating device of the PCB board, the heating device comprising: a temperature sensor disposed on the PCB board for Collecting an ambient temperature at which the PCB board is located; a heating element embedded in an intermediate layer of the PCB board for heating the PCB board; and a controller electrically connecting the temperature sensor and the heating element And the controller controls the heating element to heat the PCB board when the ambient temperature is less than the preset ambient temperature.

The technical scheme of the invention heats the PCB board by controlling the heating element, thereby providing a suitable starting environment temperature or working environment temperature for the chip on the PCB board, thereby effectively improving the electronic equipment having the PCB board in a low temperature environment, and normal. The ability to start or work normally.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and those skilled in the art can obtain other drawings according to the structures shown in the drawings without any creative work.

1 is a flow chart of an embodiment of a method for heating a PCB board of the present invention;

2 is a flow chart of another embodiment of a method for heating a PCB board of the present invention;

3 is a schematic structural view of an embodiment of a heating device for a PCB board according to the present invention;

4 is a schematic structural view of another embodiment of a heating device for a PCB board according to the present invention;

5 is a schematic structural view of still another embodiment of a heating device for a PCB board according to the present invention;

FIG. 6 is a schematic structural view of an embodiment of a PCB board assembly according to the present invention.

Description of the reference numerals:

The implementation, functional features, and advantages of the present invention will be further described in conjunction with the embodiments.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present invention are only used to explain between components in a certain posture (as shown in the drawing). Relative positional relationship, motion situation, etc., if the specific posture changes, the directional indication also changes accordingly.

In addition, the descriptions of "first", "second", and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In addition, the technical solutions between the various embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the combination of the technical solutions is contradictory or impossible to implement, it should be considered that the combination of the technical solutions does not exist. It is also within the scope of protection required by the present invention.

1 is a flow chart of an embodiment of a method of heating a PCB board of the present invention. Referring to FIG. 1, in the process 101 of the embodiment of the present invention, before the implementation of the heating method of the PCB, it is necessary to embed the heating element in the intermediate layer of the PCB 6. FIG. 6 is a schematic structural view of an embodiment of a PCB board assembly according to the present invention. Referring to FIG. 6, in the embodiment, the heating element 2 is a heating layer, and the heating layer comprises a metal wire 21 having electrical resistance, such as an aluminum wire or a copper wire. In other embodiments, the heating element 2 may be after other energization. A component that can generate heat. The flow 101 of the heating method of the PCB includes the following steps:

S10: collecting the ambient temperature at which the PCB board 6 is located;

S20: When the ambient temperature is less than the preset ambient temperature, the heating element 2 is controlled to enter the PCB board 6 Line heating.

In the heating method of the embodiment, the PCB board 6 is heated by controlling the heating element 2, thereby providing a suitable starting environment temperature or working environment temperature for the chip on the PCB board, thereby effectively improving the electrons having the PCB board. The ability of the device to start normally or work normally in a low temperature environment.

2 is a flow chart of another embodiment of a method of heating a PCB board of the present invention. Referring to FIG. 2, the same steps as the embodiment shown in FIG. 1 are not described herein again. The flow 102 of the present embodiment is different from the flow 101 of the embodiment shown in FIG. 1 in controlling the heating element. 2 After the step of heating the PCB board 6, the process 102 further includes the following steps:

S30: collecting the temperature of the PCB board 6;

S40: When the temperature of the PCB board 6 is greater than the preset PCB board temperature, the control heating element 2 stops heating the PCB board 6; wherein the preset ambient temperature is less than the preset PCB board temperature.

In the process 102 in this embodiment, a preset PCB temperature is set to the PCB board 6. When the temperature of the PCB board 6 reaches or exceeds the preset preset PCB board temperature, the heating of the PCB board 6 is stopped. The operation can effectively prevent the PCB board 6 from being overheated and burn out the PCB board 6, thereby ensuring the reliability of the operation of the electronic equipment having the PCB board.

The present invention also provides a heating device that realizes the heating method of the above PCB board. 3 is a schematic structural view of an embodiment of a heating device for a PCB board according to the present invention. Referring to FIG. 3 and FIG. 6, the heating device 100 of the PCB board of the present embodiment includes a temperature sensor 1, a heating element 2, and a controller 3. The controller 3 is electrically connected to the temperature sensor 1 and the heating element 2, respectively.

The temperature sensor 1 is used to collect the ambient temperature at which the PCB board 6 is located. The temperature sensor 1 can be a digital temperature sensor, and can be connected to the controller 3 through an I2C bus.

The heating element 2 is for embedding in the intermediate layer of the PCB board 6 for heating the PCB board 6.

The controller 3 is configured to control the heating element 2 to heat the PCB board 6 when the ambient temperature is less than the preset ambient temperature. The controller 3 may specifically be a BMC controller. The temperature sensor 1 is also used to collect the temperature of the PCB board 6 after being heated, and the controller 3 is further configured to control the heating element 2 to stop heating the PCB board 6 when the temperature of the PCB board 6 is greater than the temperature of the preset PCB board 6; The preset ambient temperature is less than the preset PCB board 6 temperature.

In this embodiment, the heating element 2 is a heating layer, and the heating layer comprises a metal conductor having electrical resistance. The wire 21, which may be an aluminum wire or a copper wire, has a chip 61, and a metal wire 21 having a resistance surrounds the periphery of the chip 61, so that the chip 61 can be concentratedly heated.

In the heating device 100 of the PCB board of the embodiment, the PCB board 6 is heated by controlling the heating element 2, thereby providing a suitable starting environment temperature or working environment temperature for the chip 61 on the PCB board 6, thereby effectively improving The ability of an electronic device having the PCB board 6 to start normally or operate normally in a low temperature environment. In addition, a predetermined PCB board temperature can be set on the PCB board 6. When the temperature of the PCB board 6 reaches or exceeds the preset PCB board temperature, by stopping the heating of the PCB board 6, the temperature of the PCB board 6 can be effectively avoided. The PCB board 6 is burned high, thereby ensuring the reliability of the operation of the electronic device having the PCB board 6.

4 is a schematic structural view of another embodiment of a heating device for a PCB board according to the present invention. Please refer to FIG. 4 , the heating device 200 of the PCB board provided in this embodiment is the same as the heating device 100 of the PCB board provided in FIG. 3 , and the heating device of the PCB board provided in this embodiment is not described herein. The difference between the 200 and the heating device 100 of the PCB board provided in FIG. 3 is that the heating device 200 of the PCB board provided in this embodiment further includes a MOS transistor switching circuit 4, and the MOS transistor switching circuit 4 is connected to the heating element. Between the controller 2 and the controller 3, the controller 3 controls the energization state of the heating element 2 by controlling the conduction state of the MOS transistor switching circuit 4.

In the present embodiment, the energization state of the heating element 2 can be conveniently controlled by controlling the MOS transistor switching circuit 4, and the MOS transistor switching circuit 4 is small in size, and is particularly suitable for use in the heating device 100 of the PCB of the present embodiment.

FIG. 5 is a schematic structural view of still another embodiment of a heating device for a PCB board according to the present invention. Referring to FIG. 5, the heating device 300 of the PCB board provided in this embodiment is the same as the heating device 200 of the PCB board provided in FIG. 4, and the heating of the PCB board provided in this embodiment is omitted. The device 300 differs from the heating device 200 of the PCB board provided in FIG. 4 in that the heating device 300 of the PCB board provided in this embodiment further includes a temperature overload protection circuit 5, a temperature overload protection circuit 5 and a heating element 2 In series.

In this embodiment, the protection state of the overload protection circuit 5 can cut off the energization state of the heating element 2 in time, thereby effectively preventing the heating element 2 from heating and overloading the PCB, thereby effectively preventing the PCB board 6 from being overheated and burning. The PCB board 6 is broken, thereby ensuring the electronic equipment worker having the PCB board Reliability. In other embodiments, a self-recovering temperature fuse may be employed instead of the temperature overload protection circuit 5.

The present invention also provides a PCB board assembly. Referring to FIG. 6, the PCB board assembly 60 includes a PCB board and a heating device for the PCB board described above, and the heating element is embedded in an intermediate layer of the PCB board for heating the PCB board.

The specific structure of the heating device of the PCB board refers to the above embodiment. Since the present PCB board assembly adopts all the technical solutions of all the embodiments of the heating device of the above PCB board, at least all the technical solutions of the above embodiments are provided. The beneficial effects will not be repeated here.

The present invention also provides an electronic device (not shown) including the above described PCB board assembly. The specific structure of the PCB board assembly refers to the above embodiment. Since the electronic device adopts all the technical solutions of all the embodiments of the above PCB board assembly, at least all the beneficial effects brought by the technical solutions of the above embodiments are I will not repeat them one by one.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structural transformation, or direct/indirect use, of the present invention and the contents of the drawings are used in the inventive concept of the present invention. It is included in the scope of the patent protection of the present invention in other related technical fields.

Claims

A heating method for a PCB board, characterized in that a heating element is embedded in an intermediate layer of the PCB board, and the PCB board heating method comprises the following steps:

Collecting an ambient temperature at which the PCB board is located;

The heating element is controlled to heat the PCB board when the ambient temperature is less than the preset ambient temperature.
The PCB board heating method according to claim 1, wherein the step of controlling the heating element to heat the PCB board further comprises the following steps:

Collecting the temperature of the PCB board;

When the temperature of the PCB board is greater than the preset PCB board temperature, the heating element is controlled to stop heating the PCB board; wherein the preset ambient temperature is less than the preset PCB board temperature.
A method of heating a PCB according to claim 1, wherein said heating element is a heating layer, and said heating layer comprises a metal wire having a resistance.
A heating device for a PCB board, comprising:

a temperature sensor is disposed on the PCB board for collecting an ambient temperature of the PCB board;

a heating element for embedding in an intermediate layer of the PCB board for heating the PCB board;

And a controller electrically connecting the temperature sensor and the heating element, and the controller is configured to control the heating element to heat the PCB board when the ambient temperature is less than the preset ambient temperature.
The heating device of claim 4, wherein the temperature sensor is further configured to collect the temperature of the PCB after being heated, and the controller is further configured to: when the temperature of the PCB is greater than the Controlling the heating element to stop heating the PCB board when the PCB board temperature is set; The preset ambient temperature is less than the preset PCB temperature.
A heating apparatus according to claim 4, wherein said heating element is a heating layer, said heating layer comprises a metal wire having a resistance, said PCB board has a chip, and said metal wire having a resistance surrounds Around the chip.
A heating device according to claim 4, further comprising a MOS transistor switching circuit, said MOS transistor switching circuit being coupled between said heating element and said controller, said controller controlling said The conduction state of the MOS transistor switching circuit controls the energization state of the heating element.
A heating apparatus according to claim 4, further comprising a temperature overload protection circuit, said temperature overload protection circuit being in series with said heating element.
A PCB board assembly characterized by comprising a PCB board and a heating device for the PCB board according to any one of claims 4-8, wherein the heating element is embedded in an intermediate layer of the PCB board for The PCB board is heated.
An electronic device comprising the PCB board assembly of claim 9.