WO2018068418A1 - 元件安装状态检测方法和系统 - Google Patents

元件安装状态检测方法和系统 Download PDF

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Publication number
WO2018068418A1
WO2018068418A1 PCT/CN2016/113150 CN2016113150W WO2018068418A1 WO 2018068418 A1 WO2018068418 A1 WO 2018068418A1 CN 2016113150 W CN2016113150 W CN 2016113150W WO 2018068418 A1 WO2018068418 A1 WO 2018068418A1
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component
information
tested
icon
unique identifier
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French (fr)
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李红匣
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
    • G06K7/1404—Methods for optical code recognition
    • G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
    • G06K7/1417—2D bar codes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/09—Recognition of logos

Definitions

  • the present invention relates to the field of automatic optical detection technology, and in particular, to a component mounting state detecting method and system.
  • AOI Automatic Optic Inspection
  • common defect detection includes missing parts detection, wrong part detection, reverse part detection, multi-piece detection, and the like.
  • the wrong component detection refers to extracting the features of the component to be detected and comparing with the template to determine whether the components inserted into the circuit board are correct.
  • the wrong component detection of components is mainly detected by manual, but this detection method is inefficient, and the detection result is easy to make mistakes, and the detection accuracy is low.
  • a component mounting state detecting method includes the following steps:
  • the component to be tested does not match the component corresponding to the unique identifier, it is determined that the component to be tested is incorrectly installed.
  • a component mounting state detecting system includes the following steps:
  • a scanning module for scanning a first icon on the circuit board; wherein the first icon is associated with installation information of components mounted on the circuit board, the installation information including a unique identifier of the component and Position information of the component on the circuit board;
  • a comparison module configured to locate an element to be tested from the circuit board according to the position information, and compare the component to be tested Comparing the components corresponding to the unique identifier for comparison;
  • the determining module is configured to determine that the component to be tested is incorrectly installed if the component to be tested does not match the component corresponding to the unique identifier.
  • the component mounting state detecting method and system wherein the mounting information of the component mounted on the circuit board is associated with the first icon on the circuit board, and when detecting, directly positioning the component to be tested according to the position information in the mounting information, and The component corresponding to the unique identifier in the installation information is compared with the located component to be tested. If the two do not match, the installation error can be determined, the component installation state is automatically detected, and the detection efficiency and accuracy are high.
  • FIG. 1 is a flow chart of a component mounting state detecting method of an embodiment
  • Fig. 2 is a block diagram showing the structure of a component mounting state detecting system of an embodiment.
  • the component mounting state detecting method may include the following steps:
  • S1 scanning a first icon on the circuit board; wherein the first icon is associated with installation information of an element mounted on the circuit board, the installation information including a unique identifier of the component, and the component is Location information on the circuit board;
  • the first icon may be a two-dimensional code or a barcode, or may be other graphics or symbols capable of carrying the installation information.
  • the installation information may be directly recorded in the first icon, and a link may be recorded.
  • the link may correspond to a webpage or a storage space, and the installation information may be stored in the webpage or the storage space.
  • the function of the mounting information is to uniquely identify the components mounted at corresponding locations on the circuit board.
  • the installation information may carry only the installation information of one component, and may also carry the installation information of multiple components.
  • the unique identifier may be the model number, name, or a combination thereof of the component, or may be other identifiers that uniquely determine the component.
  • the location information may be a coordinate (eg, may be the coordinates of the upper left corner of the component on the board) or a coordinate range (eg, the coordinate range of the body region of the component on the board).
  • an image of the device to be tested corresponding to the position information may be captured, and feature information (eg, color, shape feature, etc.) of the device to be tested is extracted from the image, and the feature information and the unique The feature information identifying the corresponding component is compared.
  • a unique identifier eg, name, model, etc.
  • the unique identifier of the component to be tested is compared with the unique identifier in the installation information.
  • comparing information such as a name, a model number, and the like on the body area may be read, and the above information may be compared with corresponding information in the installation information.
  • a second icon eg, a two-dimensional code, a barcode, etc.
  • a second icon disposed on the body area of the device under test may be read, the unique identifier is obtained from the second icon, and the unique identifier is compared with corresponding information in the installation information.
  • the body area image of the body area of the device to be tested may be acquired first, and the feature information (including characters, symbols, identification codes, or An image or the like), and acquiring the second icon of the component information from the feature information.
  • the body region image may be binarized, and the body region image subjected to the binarization process may be enlarged. After the enlargement, the feature information is read again.
  • the unique identifier (eg, name, model) of the component is compared in step S2
  • the component to be tested may be determined to be installed. error.
  • the unique identifier of the device to be tested is the same as the unique identifier in the installation information, it may be determined that the component to be tested is correctly installed.
  • the color, shape, and the like of the component are compared in step S2 when the information such as the color, the shape, and the like of the component to be tested is different from the color, shape, and the like in the installation information, It can be determined that the component to be tested is installed incorrectly.
  • the information of the color, shape, and the like of the device to be tested is the same as the color, shape, and the like in the installation information, it may be determined that the device to be tested is correctly installed.
  • the component can be detected as a wrong component, that is, whether the components on the circuit board are inserted incorrectly.
  • the component can also be reversed using the method described above.
  • Reverse detection refers to the detection of polarized components such as diodes, capacitors, and sockets to determine whether there is a reverse phenomenon in the board.
  • the mounting information may also carry polarity information of the component, the polarity information being used to indicate location information of the polarity region of the component on the circuit board.
  • the polar region may be a region of a certain pole of the component (eg, positive, anode, etc.) on the circuit board.
  • the first polarity information of the polarity region of the device under test on the circuit board may be obtained, and the first polarity information is compared with the polarity information, if the first The polarity information does not match the polarity information, and the component to be tested is determined to be incorrectly installed, that is, the reverse component, otherwise, the component to be tested is not inverted. It is also possible to generate a third icon according to the polarity information of the device to be tested (for example, the positive icon is represented by “+”), and set the third icon in the body region of the device to be tested. When acquiring the first polarity information, location information of the third icon on the body area may be obtained, according to location information of the device under test on the circuit board and the third icon The position information on the body area calculates the first polarity information.
  • the above component mounting state detecting method realizes automatic detection of the component mounting state (including the reverse component and the wrong component), and has high detection efficiency and high accuracy.
  • the present invention further provides a component mounting state detecting system.
  • the component mounting state detecting system may include:
  • a scanning module 10 for scanning a first icon on a circuit board; wherein the first icon is associated with installation information of components mounted on the circuit board, the installation information including a unique identifier of the component and Position information of the component on the circuit board;
  • the first icon may be a two-dimensional code or a barcode, or may be other graphics or symbols capable of carrying the installation information.
  • the installation information may be directly recorded in the first icon, and a link may be recorded.
  • the link may correspond to a webpage or a storage space, and the installation information may be stored in the webpage or the storage space.
  • the function of the mounting information is to uniquely identify the components mounted at corresponding locations on the circuit board.
  • the installation information may carry only the installation information of one component, and may also carry the installation information of multiple components.
  • the unique identifier may be the model number, name, or a combination thereof of the component, or may be other identifiers that uniquely determine the component.
  • the location information may be a coordinate (eg, may be the coordinates of the upper left corner of the component on the board) or a coordinate range (eg, the coordinate range of the body region of the component on the board).
  • the comparison module 20 is configured to locate an element to be tested from the circuit board according to the position information, and compare the element to be tested with the element corresponding to the unique identifier;
  • an image of the device to be tested corresponding to the position information may be captured, and feature information (eg, color, shape feature, etc.) of the device to be tested is extracted from the image, and the feature information and the unique Identify the corresponding element
  • feature information of the pieces is compared.
  • a unique identifier (eg, name, model, etc.) of the component to be tested may also be obtained, and the unique identifier of the component to be tested is compared with the unique identifier in the installation information.
  • comparing information such as a name, a model number, and the like on the body area may be read, and the above information may be compared with corresponding information in the installation information.
  • a second icon eg, a two-dimensional code, a barcode, etc.
  • a second icon disposed on the body area of the device under test may be read, the unique identifier is obtained from the second icon, and the unique identifier is compared with corresponding information in the installation information.
  • the body area image of the body area of the device to be tested may be acquired first, and the feature information (including characters, symbols, identification codes, or An image or the like), and acquiring the second icon of the component information from the feature information.
  • the body region image may be binarized, and the body region image subjected to the binarization process may be enlarged. After the enlargement, the feature information is read again.
  • the determining module 30 is configured to determine that the component to be tested is incorrectly installed if the component to be tested does not match the component corresponding to the unique identifier.
  • the comparison module 20 compares the unique identifier (eg, name, model) of the component, when the unique identifier of the component to be tested is different from the unique identifier in the installation information, the component to be tested may be determined. Installation error. When the unique identifier of the device to be tested is the same as the unique identifier in the installation information, it may be determined that the component to be tested is correctly installed. Similarly, if the comparison module 20 compares information such as the color, shape, and the like of the component, when determining, when the color, shape, and the like of the component to be tested are not related to the color, shape, and the like in the installation information. At the same time, it can be determined that the component to be tested is installed incorrectly. When the information of the color, shape, and the like of the device to be tested is the same as the color, shape, and the like in the installation information, it may be determined that the device to be tested is correctly installed.
  • the unique identifier eg, name, model
  • the component can be detected as a wrong component, that is, whether the components on the circuit board are inserted incorrectly.
  • the above system can also be used to perform reverse component detection.
  • Reverse detection refers to the detection of polarized components such as diodes, capacitors, and sockets to determine whether there is a reverse phenomenon in the board.
  • the installation information may further carry polarity information of the component, and the polarity information is used to indicate location information of the polarity region of the component on the circuit board.
  • the polar region may be a certain pole of the component (eg, positive, anode, etc.) The area on the board.
  • the first polarity information of the polarity region of the device under test on the circuit board may be obtained, and the first polarity information is compared with the polarity information, if the first The polarity information does not match the polarity information, and the component to be tested is determined to be incorrectly installed, that is, the reverse component, otherwise, the component to be tested is not inverted. It is also possible to generate a third icon according to the polarity information of the device to be tested (for example, the positive icon is represented by “+”), and set the third icon in the body region of the device to be tested. When acquiring the first polarity information, location information of the third icon on the body area may be obtained, according to location information of the device under test on the circuit board and the third icon The position information on the body area calculates the first polarity information.
  • the above component mounting state detecting system realizes automatic detection of component mounting state (including reverse parts and wrong parts), and has high detection efficiency and high accuracy.
  • the component mounting state detecting system of the present invention has a one-to-one correspondence with the component mounting state detecting method of the present invention, and the technical features and advantageous effects thereof in the embodiment of the component mounting state detecting method are applicable to the embodiment of the component mounting state detecting system. In this regard, hereby declare.

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Abstract

一种元件安装状态检测方法和系统，方法包括以下步骤：扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所述唯一标识对应的元件进行比较；若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元件安装错误。

Description

元件安装状态检测方法和系统 技术领域
本发明涉及自动光学检测技术领域，特别是涉及一种元件安装状态检测方法和系统。
背景技术
AOI(Automatic Optic Inspection，自动光学检测)，是利用光学原理对电路板焊接生产中出现的常见缺陷进行检测的设备。对于插件的电路板来说，常见的缺陷检测包括漏件检测、错件检测、反件检测、多件检测等。其中，错件检测是指提取待检测元件的特征，并与模板进行比较，从而判断插入电路板的元件是否正确。
目前，元件的错件检测主要由人工进行检测，但是，这种检测方式效率较低，而且，检测结果容易出错，检测正确率较低。
发明内容
基于此，有必要针对检测效率和正确率低的问题，提供一种元件安装状态检测方法和系统。
一种元件安装状态检测方法，包括以下步骤：
扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；
根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所述唯一标识对应的元件进行比较；
若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元件安装错误。
一种元件安装状态检测系统，包括以下步骤：
扫描模块，用于扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；
比较模块，用于根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所 述唯一标识对应的元件进行比较；
判断模块，用于若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元件安装错误。
上述元件安装状态检测方法和系统，将安装在电路板上的元件的安装信息与电路板上的第一图标相关联，在检测时，直接根据安装信息中的位置信息定位待测元件，并将安装信息中的唯一标识对应的元件与定位出的待测元件进行比较，若二者不匹配，可判定安装错误，实现了元件安装状态自动检测，检测效率和准确率高。
附图说明
图1为一个实施例的元件安装状态检测方法流程图；
图2为一个实施例的元件安装状态检测系统的结构示意图。
具体实施方式
下面结合附图对本发明的技术方案进行说明。
图1为一个实施例的元件安装状态检测方法流程图。如图1所示，所述元件安装状态检测方法可包括以下步骤：
S1，扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；
所述第一图标可以是二维码或条形码，也可以是其他能够携带所述安装信息的图形或符号。所述第一图标中可以直接记录所述安装信息，也可以记录一个链接，该链接可对应一个网页或一个存储空间，可将所述安装信息存储在该网页或存储空间中。所述安装信息的作用是唯一确定安装在所述电路板上相应位置处的元件。所述安装信息中可以仅携带一个元件的安装信息，也可以携带多个元件的安装信息。所述唯一标识可以是元件的型号、名称或其组合，也可以是其他能够唯一确定所述元件的标识。所述位置信息可以是一个坐标(例如，可以是元件的左上角在电路板上的坐标)，也可以是一个坐标范围(例如，元件的主体区域在电路板上的坐标范围)。
S2，根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所述唯一标识 对应的元件进行比较；
比较时，可以拍摄所述位置信息对应的待测元件的图像，从所述图像中提取所述待测元件的特征信息(例如，颜色、形状特征等)，将所述特征信息与所述唯一标识对应的元件的特征信息进行比较。还可以获取所述待测元件的唯一标识(例如，名称、型号等)，将所述待测元件的唯一标识与所述安装信息中的唯一标识进行比较。元件在生产时，一种常见的做法是将元件的名称、型号等设置在元件的主体区域上。在进行比较时，可以读取所述主体区域上的名称、型号等信息，并将上述信息与所述安装信息中的对应信息进行比较。或者，也可以根据所述待测元件的唯一标识生成第二图标(例如，二维码、条形码等)，将所述第二图标设置在所述待测元件的主体区域，在比对时，可以读取设置在所述待测元件的主体区域上的第二图标，从所述第二图标中获取所述唯一标识，并将该唯一标识与所述安装信息中的对应信息进行比较。
在读取所述主体区域上的第二图标时，可以先获取所述待测元件的主体区域的主体区域图像，读取所述主体区域图像中的特征信息(包括文字、符号、识别码或图像等)，并从所述特征信息中获取所述元件信息第二图标。
为了便于读取所述特征信息，在获取到所述主体区域图像之后，还可以对所述主体区域图像进行二值化处理，并对经二值化处理的所述主体区域图像进行放大处理。在放大之后，再读取所述特征信息。
S3，若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元件安装错误。
若步骤S2中比对的是元件的唯一标识(例如，名称、型号)，当所述待测元件的唯一标识与所述安装信息中的唯一标识不相同时，可判定所述待测元件安装错误。当所述待测元件的唯一标识与所述安装信息中的唯一标识相同时，可判定所述待测元件安装正确。类似地，若步骤S2中比对的是元件的颜色、形状等信息，在判定时，当所述待测元件的颜色、形状等信息与所述安装信息中的颜色、形状等信息不相同时，可判定所述待测元件安装错误。当所述待测元件的颜色、形状等信息与所述安装信息中的颜色、形状等信息相同时，可判定所述待测元件安装正确。
通过上述方法可以对元件进行错件检测，即检测电路板上的元件是否插错。
在一个实施例中，还可以采用上述方法对元件进行反件检测。反件检测是指对二极管、电容、插座等有极性的元件进行检测，判断其在电路板中是否存在反向的现象。具体地， 所述安装信息中还可以携带元件的极性信息，所述极性信息用于表示所述元件的极性区域在所述电路板上的位置信息。所述极性区域可以是元件的某个极(例如，正极、阳极等)在所述电路板上的区域。在比较时，可以获取所述待测元件的极性区域在所述电路板上的第一极性信息，将所述第一极性信息与所述极性信息进行比较，若所述第一极性信息与所述极性信息不匹配，判定所述待测元件安装错误，即反件，否则，判定待测元件未反件。还可以根据所述待测元件的极性信息生成第三图标(例如，正极图标用“+”表示)，将所述第三图标设置在所述待测元件的主体区域。在获取所述第一极性信息时，可以获取所述第三图标在所述主体区域上的位置信息，根据所述待测元件在所述电路板上的位置信息和所述第三图标在所述主体区域上的位置信息计算所述第一极性信息。
上述元件安装状态检测方法，实现了元件安装状态(包括反件和错件)自动检测，检测效率和准确率高。
与上述元件安装状态检测方法相对应地，本发明还提供一种元件安装状态检测系统，如图2所示，所述元件安装状态检测系统可包括：
扫描模块10，用于扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；
所述第一图标可以是二维码或条形码，也可以是其他能够携带所述安装信息的图形或符号。所述第一图标中可以直接记录所述安装信息，也可以记录一个链接，该链接可对应一个网页或一个存储空间，可将所述安装信息存储在该网页或存储空间中。所述安装信息的作用是唯一确定安装在所述电路板上相应位置处的元件。所述安装信息中可以仅携带一个元件的安装信息，也可以携带多个元件的安装信息。所述唯一标识可以是元件的型号、名称或其组合，也可以是其他能够唯一确定所述元件的标识。所述位置信息可以是一个坐标(例如，可以是元件的左上角在电路板上的坐标)，也可以是一个坐标范围(例如，元件的主体区域在电路板上的坐标范围)。
比较模块20，用于根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所述唯一标识对应的元件进行比较；
比较时，可以拍摄所述位置信息对应的待测元件的图像，从所述图像中提取所述待测元件的特征信息(例如，颜色、形状特征等)，将所述特征信息与所述唯一标识对应的元 件的特征信息进行比较。还可以获取所述待测元件的唯一标识(例如，名称、型号等)，将所述待测元件的唯一标识与所述安装信息中的唯一标识进行比较。元件在生产时，一种常见的做法是将元件的名称、型号等设置在元件的主体区域上。在进行比较时，可以读取所述主体区域上的名称、型号等信息，并将上述信息与所述安装信息中的对应信息进行比较。或者，也可以根据所述待测元件的唯一标识生成第二图标(例如，二维码、条形码等)，将所述第二图标设置在所述待测元件的主体区域，在比对时，可以读取设置在所述待测元件的主体区域上的第二图标，从所述第二图标中获取所述唯一标识，并将该唯一标识与所述安装信息中的对应信息进行比较。
在读取所述主体区域上的第二图标时，可以先获取所述待测元件的主体区域的主体区域图像，读取所述主体区域图像中的特征信息(包括文字、符号、识别码或图像等)，并从所述特征信息中获取所述元件信息第二图标。
为了便于读取所述特征信息，在获取到所述主体区域图像之后，还可以对所述主体区域图像进行二值化处理，并对经二值化处理的所述主体区域图像进行放大处理。在放大之后，再读取所述特征信息。
判断模块30，用于若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元件安装错误。
若比较模块20中比对的是元件的唯一标识(例如，名称、型号)，当所述待测元件的唯一标识与所述安装信息中的唯一标识不相同时，可判定所述待测元件安装错误。当所述待测元件的唯一标识与所述安装信息中的唯一标识相同时，可判定所述待测元件安装正确。类似地，若比较模块20中比对的是元件的颜色、形状等信息，在判定时，当所述待测元件的颜色、形状等信息与所述安装信息中的颜色、形状等信息不相同时，可判定所述待测元件安装错误。当所述待测元件的颜色、形状等信息与所述安装信息中的颜色、形状等信息相同时，可判定所述待测元件安装正确。
通过上述系统可以对元件进行错件检测，即检测电路板上的元件是否插错。
在一个实施例中，还可以采用上述系统对元件进行反件检测。反件检测是指对二极管、电容、插座等有极性的元件进行检测，判断其在电路板中是否存在反向的现象。具体地，所述安装信息中还可以携带元件的极性信息，所述极性信息用于表示所述元件的极性区域在所述电路板上的位置信息。所述极性区域可以是元件的某个极(例如，正极、阳极等) 在所述电路板上的区域。在比较时，可以获取所述待测元件的极性区域在所述电路板上的第一极性信息，将所述第一极性信息与所述极性信息进行比较，若所述第一极性信息与所述极性信息不匹配，判定所述待测元件安装错误，即反件，否则，判定待测元件未反件。还可以根据所述待测元件的极性信息生成第三图标(例如，正极图标用“+”表示)，将所述第三图标设置在所述待测元件的主体区域。在获取所述第一极性信息时，可以获取所述第三图标在所述主体区域上的位置信息，根据所述待测元件在所述电路板上的位置信息和所述第三图标在所述主体区域上的位置信息计算所述第一极性信息。
上述元件安装状态检测系统，实现了元件安装状态(包括反件和错件)自动检测，检测效率和准确率高。
本发明的元件安装状态检测系统与本发明的元件安装状态检测方法一一对应，在上述元件安装状态检测方法的实施例阐述的技术特征及其有益效果均适用于元件安装状态检测系统的实施例中，特此声明。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种元件安装状态检测方法，其特征在于，包括以下步骤：
    扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；
    根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所述唯一标识对应的元件进行比较；
    若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元件安装错误。
  2. 根据权利要求1所述的元件安装状态检测方法，其特征在于，将所述待测元件与所述唯一标识对应的元件进行比较的步骤包括：
    获取所述待测元件的唯一标识；
    将所述待测元件的唯一标识与所述安装信息中的唯一标识进行比较；
    若所述待测元件与所述元件不匹配，判定所述待测元件安装错误的步骤包括：
    若所述待测元件的唯一标识与所述安装信息中的唯一标识不相同，判定所述待测元件安装错误。
  3. 根据权利要求2所述的元件安装状态检测方法，其特征在于，还包括以下步骤：
    根据所述待测元件的唯一标识生成第二图标；
    将所述第二图标设置在所述待测元件的主体区域；
    获取所述待测元件的唯一标识的步骤包括：
    读取设置在所述待测元件的主体区域上的第二图标；
    从所述第二图标中获取所述唯一标识。
  4. 根据权利要求3所述的元件安装状态检测方法，其特征在于，读取设置在所述待测元件的主体区域上的第二图标的步骤包括：
    获取所述待测元件的主体区域的主体区域图像；
    读取所述主体区域图像中的特征信息；
    从所述特征信息中获取所述元件信息第二图标。
  5. 根据权利要求4所述的元件安装状态检测方法，其特征在于，在读取所述主体区域图像中的特征信息之前，还包括以下步骤：
    对所述主体区域图像进行二值化处理；
    对经二值化处理的所述主体区域图像进行放大处理。
  6. 根据权利要求1所述的元件安装状态检测方法，其特征在于，所述安装信息还包括所述元件的极性信息；其中，所述极性信息用于表示所述元件的极性区域在所述电路板上的位置信息；
    将所述待测元件与所述唯一标识对应的元件进行比较的步骤包括：
    获取所述待测元件的极性区域在所述电路板上的第一极性信息；
    将所述第一极性信息与所述极性信息进行比较；
    若所述第一极性信息与所述极性信息不匹配，判定所述待测元件安装错误。
  7. 根据权利要求6所述的元件安装状态检测方法，其特征在于，还包括以下步骤：
    根据所述待测元件的极性信息生成第三图标；
    将所述第三图标设置在所述待测元件的主体区域；
    获取所述待测元件的极性区域在所述电路板上的第一极性信息的步骤包括：
    获取所述第三图标在所述主体区域上的位置信息；
    根据所述待测元件在所述电路板上的位置信息和所述第三图标在所述主体区域上的位置信息计算所述第一极性信息。
  8. 根据权利要求1所述的元件安装状态检测方法，其特征在于，所述第一图标为二维码或条形码，和/或
    所述第二图标为二维码或条形码。
  9. 根据权利要求4所述的元件安装状态检测方法，其特征在于，所述特征信息为文字、符号、识别码或图像。
  10. 一种元件安装状态检测系统，其特征在于，包括以下步骤：
    扫描模块，用于扫描电路板上的第一图标；其中，所述第一图标与安装在所述电路板上的元件的安装信息相关联，所述安装信息包括所述元件的唯一标识以及所述元件在所述电路板上的位置信息；
    比较模块，用于根据所述位置信息从电路板上定位待测元件，并将所述待测元件与所述唯一标识对应的元件进行比较；
    判断模块，用于若所述待测元件与所述唯一标识对应的元件不匹配，判定所述待测元 件安装错误。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378908A (zh) * 2020-11-09 2021-02-19 日立楼宇技术（广州）有限公司 一种电容极性安装检测装置及检测方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107610088B (zh) * 2017-07-03 2021-05-04 刘胜贤 一种电路板识别方法及系统
DE102019108108A1 (de) * 2018-04-17 2019-10-17 Weidmüller Interface GmbH & Co. KG Verfahren zur automatisierten Montage und Verdrahtung von anreihbaren elektrischen Geräten
CN110533998A (zh) * 2018-05-24 2019-12-03 江苏开放大学（江苏城市职业学院） 一种自助式智能电工实训台
CN110517260A (zh) * 2019-08-30 2019-11-29 北京地平线机器人技术研发有限公司 电路板的检测方法和装置、存储介质、电子设备
CN111289537A (zh) * 2020-02-21 2020-06-16 杭州海兴电力科技股份有限公司 电路板有极性电子元器件的检测方法、装置、设备及介质
CN112435222A (zh) * 2020-11-11 2021-03-02 深圳技术大学 一种电路板检测方法、装置及计算机可读存储介质
CN113486739B (zh) * 2021-06-22 2024-05-24 深圳无境创新科技有限公司 螺钉检测方法、装置、电子设备和存储介质
CN113435908A (zh) * 2021-06-28 2021-09-24 杭州加速科技有限公司 生成pcba板的溯源信息的方法
CN113989475A (zh) * 2021-09-23 2022-01-28 西门子电力自动化有限公司 识别继电保护装置的电路板上的元器件的方法与装置
CN115018476B (zh) * 2022-08-08 2022-11-18 四川新迎顺信息技术股份有限公司 基于大数据场景下的机电设备安装智能预警方法及装置
CN116593850A (zh) * 2023-04-11 2023-08-15 深圳同兴达科技股份有限公司 模组fpc二极管及单向tvs管错贴检测方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002183712A (ja) * 2000-12-12 2002-06-28 Saki Corp:Kk 外観検査方法および外観検査装置
JP2004235582A (ja) * 2003-01-31 2004-08-19 Omron Corp 実装間違い検査方法およびこの方法を用いた基板検査装置
CN1662132A (zh) * 2004-02-26 2005-08-31 欧姆龙株式会社 安装错误检测方法和采用该方法的基板检测装置
CN102164474A (zh) * 2010-02-18 2011-08-24 株式会社日立高新技术仪器 零部件安装错误的检测方法和零部件安装错误的检测系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004016064A1 (en) * 2002-08-08 2004-02-19 Matsushita Electric Industrial Co., Ltd. Device and method for detecting whether or not component holder is good, and apparatus and method for mounting electronic component
CN101118263A (zh) * 2006-08-04 2008-02-06 华硕电脑股份有限公司 极性元件的极性方向自动检测方法
CN102590228A (zh) * 2012-02-10 2012-07-18 台达电子企业管理（上海）有限公司 检测带有电解电容的电路板的方法以及设备
CN103675588B (zh) * 2013-11-20 2016-01-20 中国矿业大学 印刷电路元件极性的机器视觉检测方法及设备
CN105139399A (zh) * 2015-08-25 2015-12-09 广州视源电子科技股份有限公司 一种二极管极性检测方法及装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002183712A (ja) * 2000-12-12 2002-06-28 Saki Corp:Kk 外観検査方法および外観検査装置
JP2004235582A (ja) * 2003-01-31 2004-08-19 Omron Corp 実装間違い検査方法およびこの方法を用いた基板検査装置
CN1662132A (zh) * 2004-02-26 2005-08-31 欧姆龙株式会社 安装错误检测方法和采用该方法的基板检测装置
CN102164474A (zh) * 2010-02-18 2011-08-24 株式会社日立高新技术仪器 零部件安装错误的检测方法和零部件安装错误的检测系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378908A (zh) * 2020-11-09 2021-02-19 日立楼宇技术（广州）有限公司 一种电容极性安装检测装置及检测方法

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