WO2018068418A1 - Procédé et système de détection d'état de montage de composant - Google Patents

Procédé et système de détection d'état de montage de composant Download PDF

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Publication number
WO2018068418A1
WO2018068418A1 PCT/CN2016/113150 CN2016113150W WO2018068418A1 WO 2018068418 A1 WO2018068418 A1 WO 2018068418A1 CN 2016113150 W CN2016113150 W CN 2016113150W WO 2018068418 A1 WO2018068418 A1 WO 2018068418A1
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WIPO (PCT)
Prior art keywords
component
information
tested
icon
unique identifier
Prior art date
Application number
PCT/CN2016/113150
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English (en)
Chinese (zh)
Inventor
李红匣
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广州视源电子科技股份有限公司
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Publication date
Application filed by 广州视源电子科技股份有限公司 filed Critical 广州视源电子科技股份有限公司
Publication of WO2018068418A1 publication Critical patent/WO2018068418A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
    • G06K7/1404—Methods for optical code recognition
    • G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
    • G06K7/1417—2D bar codes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/09—Recognition of logos

Definitions

  • the present invention relates to the field of automatic optical detection technology, and in particular, to a component mounting state detecting method and system.
  • AOI Automatic Optic Inspection
  • common defect detection includes missing parts detection, wrong part detection, reverse part detection, multi-piece detection, and the like.
  • the wrong component detection refers to extracting the features of the component to be detected and comparing with the template to determine whether the components inserted into the circuit board are correct.
  • the wrong component detection of components is mainly detected by manual, but this detection method is inefficient, and the detection result is easy to make mistakes, and the detection accuracy is low.
  • a component mounting state detecting method includes the following steps:
  • the component to be tested does not match the component corresponding to the unique identifier, it is determined that the component to be tested is incorrectly installed.
  • a component mounting state detecting system includes the following steps:
  • a scanning module for scanning a first icon on the circuit board; wherein the first icon is associated with installation information of components mounted on the circuit board, the installation information including a unique identifier of the component and Position information of the component on the circuit board;
  • a comparison module configured to locate an element to be tested from the circuit board according to the position information, and compare the component to be tested Comparing the components corresponding to the unique identifier for comparison;
  • the determining module is configured to determine that the component to be tested is incorrectly installed if the component to be tested does not match the component corresponding to the unique identifier.
  • the component mounting state detecting method and system wherein the mounting information of the component mounted on the circuit board is associated with the first icon on the circuit board, and when detecting, directly positioning the component to be tested according to the position information in the mounting information, and The component corresponding to the unique identifier in the installation information is compared with the located component to be tested. If the two do not match, the installation error can be determined, the component installation state is automatically detected, and the detection efficiency and accuracy are high.
  • FIG. 1 is a flow chart of a component mounting state detecting method of an embodiment
  • Fig. 2 is a block diagram showing the structure of a component mounting state detecting system of an embodiment.
  • the component mounting state detecting method may include the following steps:
  • S1 scanning a first icon on the circuit board; wherein the first icon is associated with installation information of an element mounted on the circuit board, the installation information including a unique identifier of the component, and the component is Location information on the circuit board;
  • the first icon may be a two-dimensional code or a barcode, or may be other graphics or symbols capable of carrying the installation information.
  • the installation information may be directly recorded in the first icon, and a link may be recorded.
  • the link may correspond to a webpage or a storage space, and the installation information may be stored in the webpage or the storage space.
  • the function of the mounting information is to uniquely identify the components mounted at corresponding locations on the circuit board.
  • the installation information may carry only the installation information of one component, and may also carry the installation information of multiple components.
  • the unique identifier may be the model number, name, or a combination thereof of the component, or may be other identifiers that uniquely determine the component.
  • the location information may be a coordinate (eg, may be the coordinates of the upper left corner of the component on the board) or a coordinate range (eg, the coordinate range of the body region of the component on the board).
  • an image of the device to be tested corresponding to the position information may be captured, and feature information (eg, color, shape feature, etc.) of the device to be tested is extracted from the image, and the feature information and the unique The feature information identifying the corresponding component is compared.
  • a unique identifier eg, name, model, etc.
  • the unique identifier of the component to be tested is compared with the unique identifier in the installation information.
  • comparing information such as a name, a model number, and the like on the body area may be read, and the above information may be compared with corresponding information in the installation information.
  • a second icon eg, a two-dimensional code, a barcode, etc.
  • a second icon disposed on the body area of the device under test may be read, the unique identifier is obtained from the second icon, and the unique identifier is compared with corresponding information in the installation information.
  • the body area image of the body area of the device to be tested may be acquired first, and the feature information (including characters, symbols, identification codes, or An image or the like), and acquiring the second icon of the component information from the feature information.
  • the body region image may be binarized, and the body region image subjected to the binarization process may be enlarged. After the enlargement, the feature information is read again.
  • the unique identifier (eg, name, model) of the component is compared in step S2
  • the component to be tested may be determined to be installed. error.
  • the unique identifier of the device to be tested is the same as the unique identifier in the installation information, it may be determined that the component to be tested is correctly installed.
  • the color, shape, and the like of the component are compared in step S2 when the information such as the color, the shape, and the like of the component to be tested is different from the color, shape, and the like in the installation information, It can be determined that the component to be tested is installed incorrectly.
  • the information of the color, shape, and the like of the device to be tested is the same as the color, shape, and the like in the installation information, it may be determined that the device to be tested is correctly installed.
  • the component can be detected as a wrong component, that is, whether the components on the circuit board are inserted incorrectly.
  • the component can also be reversed using the method described above.
  • Reverse detection refers to the detection of polarized components such as diodes, capacitors, and sockets to determine whether there is a reverse phenomenon in the board.
  • the mounting information may also carry polarity information of the component, the polarity information being used to indicate location information of the polarity region of the component on the circuit board.
  • the polar region may be a region of a certain pole of the component (eg, positive, anode, etc.) on the circuit board.
  • the first polarity information of the polarity region of the device under test on the circuit board may be obtained, and the first polarity information is compared with the polarity information, if the first The polarity information does not match the polarity information, and the component to be tested is determined to be incorrectly installed, that is, the reverse component, otherwise, the component to be tested is not inverted. It is also possible to generate a third icon according to the polarity information of the device to be tested (for example, the positive icon is represented by “+”), and set the third icon in the body region of the device to be tested. When acquiring the first polarity information, location information of the third icon on the body area may be obtained, according to location information of the device under test on the circuit board and the third icon The position information on the body area calculates the first polarity information.
  • the above component mounting state detecting method realizes automatic detection of the component mounting state (including the reverse component and the wrong component), and has high detection efficiency and high accuracy.
  • the present invention further provides a component mounting state detecting system.
  • the component mounting state detecting system may include:
  • a scanning module 10 for scanning a first icon on a circuit board; wherein the first icon is associated with installation information of components mounted on the circuit board, the installation information including a unique identifier of the component and Position information of the component on the circuit board;
  • the first icon may be a two-dimensional code or a barcode, or may be other graphics or symbols capable of carrying the installation information.
  • the installation information may be directly recorded in the first icon, and a link may be recorded.
  • the link may correspond to a webpage or a storage space, and the installation information may be stored in the webpage or the storage space.
  • the function of the mounting information is to uniquely identify the components mounted at corresponding locations on the circuit board.
  • the installation information may carry only the installation information of one component, and may also carry the installation information of multiple components.
  • the unique identifier may be the model number, name, or a combination thereof of the component, or may be other identifiers that uniquely determine the component.
  • the location information may be a coordinate (eg, may be the coordinates of the upper left corner of the component on the board) or a coordinate range (eg, the coordinate range of the body region of the component on the board).
  • the comparison module 20 is configured to locate an element to be tested from the circuit board according to the position information, and compare the element to be tested with the element corresponding to the unique identifier;
  • an image of the device to be tested corresponding to the position information may be captured, and feature information (eg, color, shape feature, etc.) of the device to be tested is extracted from the image, and the feature information and the unique Identify the corresponding element
  • feature information of the pieces is compared.
  • a unique identifier (eg, name, model, etc.) of the component to be tested may also be obtained, and the unique identifier of the component to be tested is compared with the unique identifier in the installation information.
  • comparing information such as a name, a model number, and the like on the body area may be read, and the above information may be compared with corresponding information in the installation information.
  • a second icon eg, a two-dimensional code, a barcode, etc.
  • a second icon disposed on the body area of the device under test may be read, the unique identifier is obtained from the second icon, and the unique identifier is compared with corresponding information in the installation information.
  • the body area image of the body area of the device to be tested may be acquired first, and the feature information (including characters, symbols, identification codes, or An image or the like), and acquiring the second icon of the component information from the feature information.
  • the body region image may be binarized, and the body region image subjected to the binarization process may be enlarged. After the enlargement, the feature information is read again.
  • the determining module 30 is configured to determine that the component to be tested is incorrectly installed if the component to be tested does not match the component corresponding to the unique identifier.
  • the comparison module 20 compares the unique identifier (eg, name, model) of the component, when the unique identifier of the component to be tested is different from the unique identifier in the installation information, the component to be tested may be determined. Installation error. When the unique identifier of the device to be tested is the same as the unique identifier in the installation information, it may be determined that the component to be tested is correctly installed. Similarly, if the comparison module 20 compares information such as the color, shape, and the like of the component, when determining, when the color, shape, and the like of the component to be tested are not related to the color, shape, and the like in the installation information. At the same time, it can be determined that the component to be tested is installed incorrectly. When the information of the color, shape, and the like of the device to be tested is the same as the color, shape, and the like in the installation information, it may be determined that the device to be tested is correctly installed.
  • the unique identifier eg, name, model
  • the component can be detected as a wrong component, that is, whether the components on the circuit board are inserted incorrectly.
  • the above system can also be used to perform reverse component detection.
  • Reverse detection refers to the detection of polarized components such as diodes, capacitors, and sockets to determine whether there is a reverse phenomenon in the board.
  • the installation information may further carry polarity information of the component, and the polarity information is used to indicate location information of the polarity region of the component on the circuit board.
  • the polar region may be a certain pole of the component (eg, positive, anode, etc.) The area on the board.
  • the first polarity information of the polarity region of the device under test on the circuit board may be obtained, and the first polarity information is compared with the polarity information, if the first The polarity information does not match the polarity information, and the component to be tested is determined to be incorrectly installed, that is, the reverse component, otherwise, the component to be tested is not inverted. It is also possible to generate a third icon according to the polarity information of the device to be tested (for example, the positive icon is represented by “+”), and set the third icon in the body region of the device to be tested. When acquiring the first polarity information, location information of the third icon on the body area may be obtained, according to location information of the device under test on the circuit board and the third icon The position information on the body area calculates the first polarity information.
  • the above component mounting state detecting system realizes automatic detection of component mounting state (including reverse parts and wrong parts), and has high detection efficiency and high accuracy.
  • the component mounting state detecting system of the present invention has a one-to-one correspondence with the component mounting state detecting method of the present invention, and the technical features and advantageous effects thereof in the embodiment of the component mounting state detecting method are applicable to the embodiment of the component mounting state detecting system. In this regard, hereby declare.

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Abstract

La présente invention concerne un procédé et un système de détection d'état de montage de composant. Le procédé comprend les étapes consistant : à balayer un premier repère graphique sur une carte de circuit imprimé, le repère graphique étant associé à des informations de montage d'un composant monté sur la carte de circuit imprimé, et les informations de montage comprenant un identificateur unique du composant ainsi que des informations de position du composant sur la carte de circuit imprimé ; à localiser un composant à l'essai sur la carte de circuit imprimé en fonction des informations de position, et à comparer le composant à l'essai au composant correspondant à l'identificateur unique ; et, si le composant à l'essai ne coïncide pas avec le composant correspondant à l'identificateur unique, à déterminer que le composant à l'essai est monté de manière incorrecte.
PCT/CN2016/113150 2016-10-11 2016-12-29 Procédé et système de détection d'état de montage de composant WO2018068418A1 (fr)

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CN201610887899.2 2016-10-11
CN201610887899.2A CN106529369A (zh) 2016-10-11 2016-10-11 元件安装状态检测方法和系统

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DE102019108108A1 (de) * 2018-04-17 2019-10-17 Weidmüller Interface GmbH & Co. KG Verfahren zur automatisierten Montage und Verdrahtung von anreihbaren elektrischen Geräten
CN110533998A (zh) * 2018-05-24 2019-12-03 江苏开放大学（江苏城市职业学院） 一种自助式智能电工实训台
CN110517260A (zh) * 2019-08-30 2019-11-29 北京地平线机器人技术研发有限公司 电路板的检测方法和装置、存储介质、电子设备
CN111289537A (zh) * 2020-02-21 2020-06-16 杭州海兴电力科技股份有限公司 电路板有极性电子元器件的检测方法、装置、设备及介质
CN112435222A (zh) * 2020-11-11 2021-03-02 深圳技术大学 一种电路板检测方法、装置及计算机可读存储介质
CN113486739B (zh) * 2021-06-22 2024-05-24 深圳无境创新科技有限公司 螺钉检测方法、装置、电子设备和存储介质
CN113435908A (zh) * 2021-06-28 2021-09-24 杭州加速科技有限公司 生成pcba板的溯源信息的方法
CN115018476B (zh) * 2022-08-08 2022-11-18 四川新迎顺信息技术股份有限公司 基于大数据场景下的机电设备安装智能预警方法及装置

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