WO2018034449A1 - Carte métallique ayant une fonction de carte de type sans contact, plaque métallique et ensemble plaque métallique utilisés à cet effet, et son procédé de fabrication - Google Patents

Carte métallique ayant une fonction de carte de type sans contact, plaque métallique et ensemble plaque métallique utilisés à cet effet, et son procédé de fabrication Download PDF

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Publication number
WO2018034449A1
WO2018034449A1 PCT/KR2017/008255 KR2017008255W WO2018034449A1 WO 2018034449 A1 WO2018034449 A1 WO 2018034449A1 KR 2017008255 W KR2017008255 W KR 2017008255W WO 2018034449 A1 WO2018034449 A1 WO 2018034449A1
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WO
WIPO (PCT)
Prior art keywords
metal
inlay
card
slit
chip module
Prior art date
Application number
PCT/KR2017/008255
Other languages
English (en)
Korean (ko)
Inventor
김기현
김남주
황희철
Original Assignee
주식회사 아이씨케이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160104358A external-priority patent/KR101868478B1/ko
Application filed by 주식회사 아이씨케이 filed Critical 주식회사 아이씨케이
Publication of WO2018034449A1 publication Critical patent/WO2018034449A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/22—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/475—Cutting cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/48—Controlling the manufacturing process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to a metal card having a non-contact card function and a method of manufacturing the same, and more particularly, at least one side of the metal is not easily bent and has a beautiful appearance, but also has a non-contact card function such as RF or NFC,
  • the present invention relates to a metal card having a contactless card function, a metal plate and a metal plate assembly used therein, and a method of manufacturing the same.
  • cards are classified into magnetic cards using magnetic strips, smart cards using IC chips, and combination cards combining them according to recording methods, and smart cards are classified into contact and contactless types according to reading methods. It is classified into a near field communication (NFC) card that can be read only within a distance of ⁇ 10 cm and an RF card that can be read at a far distance. In general, these methods are often provided with overlap.
  • NFC near field communication
  • RF radio frequency
  • plastic cards are generally issued to suspend the collection of goods and services for a certain period of time to a specific member, and are mainly cash, such as credit cards, cash cards, and transportation cards.
  • cash such as credit cards, cash cards, and transportation cards.
  • Hyundai has provided various types of plastic cards differentiated according to the customer's credit rating.
  • the above-mentioned special cards are used to print gold and silver by mixing the powdered gold or silver powder on the pigment so that the gold and silver color are mixed with the pure gold or pure silver. Not only that, but also a mixture of other pigments and adhesives could not obtain a high gloss texture emitted from pure metal.
  • the metal thin film 12 is attached to the upper surface of the core sheet 13 made of synthetic resin such as PVC, and the metal thin film 12 is smaller in size than the core sheet 13.
  • the blank 13a is formed around the upper surface of the core sheet 13 while forming a corresponding shape.
  • An antenna coil 21 is installed along the circumference of the upper surface margin 13a of the core sheet 13, and the antenna coil 21 is installed in a continuously wound state.
  • Both ends of the antenna coil 21 are connected to the IC chip 20 fixed inside the core sheet 13 to communicate with a reader (not shown) while the reader reads various information stored in the IC chip 20. I can figure it out.
  • a transparent upper coated paper 11 is attached to an upper surface of the core sheet 13, and a printing layer 11a is formed on a lower surface of the upper coated paper 11.
  • Various pictures or characters associated with the card company are printed on the printed layer 11a.
  • a transparent lower coated paper 14 is attached to a lower surface of the core sheet 13, and a printing layer 14a is formed on an upper surface of the lower coated paper 14.
  • Various pictures and characters associated with the card company are also printed on the printed layer 14a.
  • the metal material was formed into a thin film having a thickness.
  • the metal material is a noble metal having good ductility and malleability and high gloss such as pure gold (Au), platinum (Pt), silver (Ag), and nickel (Ni). Used. Of course, in some cases, two or more of the metal materials may be alloyed.
  • the present invention having the above-described configuration emits high gloss in a state where the metal thin films 12 thermally bonded to the upper and lower surfaces of the core sheet 13 are protected by the transparent upper and lower coated papers 11 and 14.
  • plastic cards that can be more elegant and feel of high quality can be realized, and the metal thin film 12 made of pure metal material can prevent discoloration and deterioration even after long-term use, so that it can always maintain high gloss of plastic.
  • the metal thin film 12 made of pure metal material can prevent discoloration and deterioration even after long-term use, so that it can always maintain high gloss of plastic.
  • the antenna coil 21 is installed in the margin 13a of the core sheet 13 formed around the metal thin film 12 so that the antenna coil 21 can communicate with the reader without being disturbed by the metal thin film 12.
  • the plastic card (1) to which the magnetic tape (30) is attached is attached
  • the high gloss metal thin film 12 can also be applied to the plastic card 1 in which the IC chip 20 is embedded.
  • a margin 13a must be formed around the upper surface of the core sheet 13 while the metal thin film 12 is smaller than the core sheet 13.
  • the antenna coil 21 can only be wound around the upper surface margin 13a. Therefore, the metallic aesthetics due to the margin are halved, and the coupling force between the core sheet and the upper coated paper is also due to the antenna coil of the margin portion. It was lowered and above all, there was not enough consideration of the bonding between the metal thin film and the core sheet and the coated paper, which was only an idea and was not actually mass produced.
  • the edge of the color corresponding to the metal thin film 12 is printed by printing with ink mixed with metal powder around the upper and lower coated papers 11 and 14.
  • Forming the printed layers 11b and 14b prevents the antenna coil 21 fixed around the core sheet 13 from being exposed to the outside through the upper and lower coated papers 11 and 14 to prevent the entire plastic card 1 from being formed.
  • the proposal is made to keep the appearance of) beautifully, in order to allow the antenna coil 21 to communicate with the reader, the metal powder content must be 30% or less, so that the metal made of the actual metal layer You can never follow the beautiful texture and durability of the card.
  • Korean Patent No. 0516106 credit card with a gold foil layer and a method of manufacturing the same
  • the size of the gold foil is equal to the size of the card.
  • the Republic of Korea Patent Publication No. 2013-0006358 metal card and its manufacturing method
  • the actual metal layer is formed without forming a transparent plastic coating layer on the outermost side, but maximizes the visual effect by the anodizing technique
  • the technique of anodizing and insulating the stepped etching region accommodating the IC chip, but the technique related to the contact card accommodating the contact IC chip to the last.
  • Japanese Patent Laid-Open No. 2006-270681 is a portable device capable of suppressing fluctuations in communication characteristics between both in close proximity with an antenna module and a reader / writer.
  • the metal layer 30 is placed on the incidence side of electromagnetic waves emitted from the reader / writer, rather than the communication surface CS of the antenna module 10 embedded in the terminal body 22.
  • induces the communication magnetic field to the antenna coil 15 of the antenna module 10 by this metal layer 30 is disclosed.
  • the metal layer 30 is attached to predetermined positions inside and outside the terminal to be made of copper foil or the like. Therefore, when the reader / writer and the terminal main body 22 are close to each other, there is an advantage that a defect in communication due to a positional relationship with each other can be suppressed.
  • FIG. 2 is a diagram showing a state of communication in proximity between the portable information terminal 21 and the reader / writer of the second prior art.
  • some magnetic fields H of the electromagnetic waves emitted from the transmitting / receiving antenna 26 of the reader / writer are affected by metal objects such as the battery pack 25 in the terminal body 22, and thus are attenuated by reflection and absorption.
  • the generated magnetic field H1 generates an induced current in the antenna coil 15 of the antenna module 10.
  • the metal layer 30 is disposed close to the antenna module 10 so as to cover a part of the antenna coil 15, thereby providing a reader / writer through the magnetic field component H1 generated in the metal layer 30. Inductive coupling between the transmission and reception antenna 26 and the antenna coil 15 of the antenna module 10.
  • the second prior art antenna device shown in Fig. 2 attempts to solve the problem that the communication characteristics fluctuate greatly depending on the magnitude of the positional difference between the centers of the antennas when the distance between the antennas of the communication counterparts is very close. will be.
  • the magnetic flux which tries to bridge between the antenna coil 15 of the antenna module 10 on the side of the portable information terminal 21 and the reader / writer side transceiver antenna 26 is a metal object such as a battery pack 25 inside the case.
  • the metal layer 30 for inducing magnetic flux is provided, but it cannot be said that a great effect can be obtained depending on the positional relationship of obstacles such as the battery pack 25.
  • the metal layer 30 does not act effectively to increase the communication distance in a state where the antenna device and the antenna on the communication counterpart are separated.
  • the third conventional technology is an antenna device installed inside or outside of the mobile phone case (1) to allow a relatively small and stable communication, and to increase the maximum distance that can be communicated compared to the antenna of the communication counterpart 3A, as shown in FIG. 3A, a conductor having a loop-shaped or helical coil conductor with a coil opening as a coil opening, a conductor opening CA, and a slit portion SL connected between the conductor opening and an outer edge thereof.
  • the area of the conductor layer is greater than the area of the formation region of the coil conductor, and in plan view, the The distance from the outer edge of the conductor opening to the outer edge of the coil conductor is greater than the distance from the inner edge of the conductor opening to the inner edge of the coil conductor,
  • the slit portion is disposed in close proximity to the end portion so as to face the end of the case, and is connected between the outer edges of the conductor layer closest to the outside of the conductor opening, wherein the conductor layer is formed on the inner or outer surface of the case. It is characterized by consisting of the case made of a metal film or a metal foil or metal.
  • a current flows in the conductor layer so that the magnetic field generated by the current flows in the coil conductor, and a current flowing around the opening of the conductor layer passes through the slit portion and is edged.
  • the effect is that an electric current flows around the conductor layer, and thus a magnetic field is generated in the conductor layer, thereby extending the communication distance.
  • the conductor layer turns the magnetic flux largely, the maximum distance that can be communicated with the antenna device and the communication counterpart antenna where the magnetic flux arrives from the antenna device to the antenna of the communication counterpart or from the antenna of the communication counterpart to the antenna equipment becomes large.
  • the planar conductor 2 of the third conventional technology is provided with a conductor opening CA and a slit 2S, and the coil opening 31 has a coil opening of the conductor opening.
  • CA conductor opening
  • a current represented by a broken arrow is induced in the planar conductor 2
  • the regions A1, A2 and A3 are arranged so as to overlap with CA, and when a current represented by a solid arrow flows through the coil-shaped conductor 31, a current represented by a broken arrow is induced in the planar conductor 2, and the regions A1, A2 and A3.
  • the current flowing in the coil-like conductor 31 and the direction of the current flowing in the planar conductor 2 coincide, but in the region B, the current flowing in the coil-shaped conductor 31 and the current flowing in the planar conductor 2 flow.
  • Korean Patent No. 1470341 (antenna device and wireless communication device) solves the problem of lowering and inductance of the inductance of the antenna device in the power feeding circuit.
  • the power supply coil 3 and the planar conductor 2 are provided.
  • the power supply coil 3 is provided with the magnetic core 32 and the coil-shaped conductor 31 wound by this magnetic core 32.
  • the coil-shaped conductor 31 may be a conductive wire (wound conductor) wound on the magnetic core 32, a laminate formed by laminating a plurality of dielectric layers, a laminate formed by laminating a plurality of magnetic layers, or one or more layers. It may be a conductor pattern formed in a laminate obtained by laminating a dielectric layer and one or more magnetic layers.
  • a coil-shaped conductor 31 is formed in an in-plane conductor pattern and an interlayer conductor pattern on a laminate formed by laminating a plurality of magnetic body layers (for example, ferrite ceramic layers). It is preferable that it is a chip
  • the power supply coil 3 is connected to an RFIC 13 which is a power supply circuit. That is, one end and the other end of the coil-shaped conductor 31 are connected to two input / output terminals of the RFIC 13, respectively.
  • the RFIC 13 is an NFC RFIC chip, a semiconductor IC chip for processing a high frequency signal for NFC.
  • the planar conductor 2 has a larger area than the feed coil 3. That is, when viewed from the normal direction of the planar conductor 2, the outer dimension of the planar conductor is larger than the outer dimension of the feed coil.
  • the planar conductor 2 is formed with slits 2S extending inwardly from a part of the outer edges. In the fourth prior art, the slit 2S has a certain width from one end to the other end, but the width does not necessarily need to be constant.
  • the planar conductor 2 is a metal housing part (metal cover part) of the communication terminal housing, and in the state shown in Fig. 4, on the lower surface of the planar conductor 2, that is, inside the communication terminal housing.
  • the power supply coil 3 is arranged at.
  • the winding axis direction of the coil-shaped conductor 31 is arranged differently from the normal direction of the planar conductor 2. More specifically, the winding axis of the coil-shaped conductor 31 is arrange
  • the power supply coil 3 is arrange
  • the planar conductor 2 is not limited to the metal housing portion, and may be a conductor film formed on an insulating substrate or a conductor layer formed on an insulating substrate. That is, the planar conductor 2 may be various metal plates, such as a ground conductor mounted in a communication terminal, a metal chassis, a shield case, the metal cover of a battery pack, or the planar pattern by the metal thin film provided in the flexible sheet. When the planar conductor 2 is a metal thin film pattern provided on the flexible sheet, what is necessary is just to adhere to the inside of the back cover of a communication terminal with an adhesive agent. In addition, the planar conductor 2 may be a conductor having a surface widened in a planar shape, and does not necessarily have to be flat (it may be a curved surface).
  • the RFIC 14 is connected to the antenna coil 4 on the communication counterpart of the fourth conventional technology.
  • the planar conductor 2 When the planar conductor 2 is close to the antenna coil 4 of the communication partner, an induced current is generated in the planar conductor 2, and this current is mainly formed at the edge of the planar conductor 2 according to the edge effect. Flows along. That is, a current (overcurrent) flows in a direction that prevents passage of the magnetic flux generated by the antenna coil 4.
  • the magnetic flux ⁇ 1 in FIG. 1 represents the magnetic flux passing through the antenna coil 4.
  • the slit 2S is also part of the edge, and the current density of the portion along the edge of the slit 2S is increased.
  • the magnetic flux ⁇ 2 in FIG. 4 represents the magnetic flux passing through the slit 2S. Part of the magnetic flux ⁇ 2 is interlinked with the power supply coil 3.
  • the planar conductor 2 acts as a magnetic field capture element (radiation plate), and the feed coil 3 is magnetically coupled to the communication partner antenna coil 4 via the planar conductor 2.
  • the coil opening surface of the coil-shaped conductor constituting the feed coil does not face the planar conductor, and only a part of the coil-shaped conductor is close to the planar conductor, more specifically, when viewed from the winding axis direction of the coil-shaped conductor Since the coil-shaped conductor has a portion far from the plane-shaped conductor and a part far from the coil-shaped conductor, the inductance value of the power feeding coil 3 is maintained even if the relative positional relationship between the feed coil 3 and the planar conductor 2 is slightly changed. It doesn't change much. Therefore, the antenna device with small manufacturing variation can be realized.
  • the coil opening of the power supply coil 3 should just be arrange
  • the fourth conventional technique provides a solution in a relatively large communication device such as a mobile terminal, and is difficult to apply when the thickness of the existing credit card is only 1 mm. It is difficult.
  • Patent Document 1 Registered Utility Model No. 0382725 (Metal Thin Film Plastic Card)
  • Patent Document 2 Japanese Patent Publication No. 2006-270681 (Portable Device)
  • Patent Document 3 Japanese Patent No. 4947217 (Antenna Device and Mobile Phone)
  • Patent Document 4 Korean Patent No. 1470341 (Antenna device and wireless communication device)
  • the present invention is to solve the above problems, the object is to provide a metal card having a contactless card function of at least one side of the entire thick metal plate for the VVIP customer, the highest level of customer base, and a method of manufacturing the same.
  • the present invention provides a metal card having a non-contact card function, a metal plate and a metal plate assembly used therein, and a method of manufacturing the same.
  • Metal card having a contactless card function for achieving the above object, as a metal card (100,100 ', 100 ") having a contactless card function that incorporates one or more chips, performs a contactless card function
  • the chip module through-hole 12 is formed with slit (15, 15', 85) to open to the outside, the first in the slit
  • the conductivity of the metal layer is cut off, and the inlay 40 has a winding 42 as an antenna wound in a coil shape.
  • the second layer is a metal layer 80, and the slit 15 formed in the first metal layer 10 and the slit 85 formed in the second layer are shifted in the width direction of the slit. It is done.
  • both electrodes 41 and 41 ′ of the inlay 40 are formed on both sides of the inlay 40 so as to penetrate the substrate of the inlay, and the first winding 42 formed on the upper side of the first electrode 41. And the second winding 42 ′ formed on the lower side is electrically connected through the via hole 43.
  • the PVC thin film 50 is positioned, the inlay 40 is again placed thereon, and the inlay seating groove 11 is positioned thereon. While laminating the first metal layer 10 is characterized in that.
  • it further comprises inserts 90, 90 ', 90 "of non-RF interference material inserted into the slits 15, 15', 85.
  • the insert 90 ' has a shape having left and right wings 90b on the rod-shaped body 90a, wherein the left and right wings 90b have a thickness of the rod-shaped body 90a.
  • the shape is relatively lower, and the slit 15 'of the first metal layer 10' is also shaped to correspond to the insert 90 '.
  • the insert 90 ' is characterized in that a thin film portion 90c of the same material is added to the rod-shaped body 90a and the left and right wings 90b.
  • the first metal layer further includes an auxiliary hole 215 'on at least one side of the slit, wherein the auxiliary hole is inserted with an auxiliary insert of a non-RF interference material.
  • the insert body inserted into the slit and the auxiliary insert inserted into the auxiliary hole are integrally formed by the thin film 250 between the first metal layer and the second layer.
  • the metal plate used for the metal card having a contactless card function is a metal plate used for a metal card having a contactless card function that incorporates one or more chips, the contactless card A chip module insertion hole into which a chip module for performing a function can be inserted; An inlay seating groove in which an inlay formed with an antenna for directly performing contactless communication of the chip module may be seated; And a slit for opening the chip module insertion hole to the outside; It includes, characterized in that the conductivity of the metal plate is cut off or the conductivity is weakened in the slit portion formed on one side of the metal plate.
  • it further comprises an auxiliary hole (215 ') on at least one side of the slit.
  • the left and right sliders into which the inserts of the non-RF interference materials are inserted are formed in the sliding grooves that are inserted into the sidewalls of the slits.
  • the metal plate An insert of a non-RF interference material inserted into the slit of the metal plate; It includes, but is provided with a metal plate assembly for use in a metal card having a contactless card function, characterized in that the slider of the slit is pressed into the sliding groove,
  • the metal plate assembly A chip module inserted into the chip module insertion hole of the metal plate to perform a contactless card function; And an inlay seated in the inlay seating groove of the metal plate and having an antenna for directly performing contactless communication of the chip module.
  • a metal card having a contactless card function including a.
  • the method of manufacturing a metal card having the contactless card function for achieving the above object, the chip module through hole 12 and the first metal layer 10, Forming the inlay seating groove (11); After stacking the dummy chips 20 'having the same shape as the inlay 40, the first metal layer 10, and the chip module 20 on the second layers 60 and 80, heat compression, etc. Filling the slit with a non-conductive material while laminating in a method; And removing the dummy chip 20 'and mounting the chip module 20 in place. Characterized in that it comprises a.
  • the metal card having a non-contact card function According to the metal card having a non-contact card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance, but also has a non-contact card function such as RF or NFC, due to the slit formed on one side of the metal layer
  • the maximum curvature of the card can be prevented, and at the same time, the slit-filled PVC insert can be prevented as much as possible, so that the card has a more stable non-contact card function, such as the card bent due to slits formed on one side of the metal layer.
  • a metal card having a non-contact card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance, yet stable production of a metal card having a non-contact card function, such as RF or NFC function Provide a method.
  • the metal plate used in the manufacture of a metal card having a contactless card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance, but also has a non-contact card function such as RF or NFC, It is possible to manufacture a metal card having a more stable, non-contact card function while minimizing card bending.
  • the metal plate assembly used in the manufacture of a metal card having a contactless card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance while having a non-contact card function such as RF or NFC function, Furthermore, it becomes possible to manufacture a metal card having a contactless card function, which further strengthens the strength of the card.
  • FIG. 1 is an exploded perspective view of a metal thin film plastic card of the first prior art
  • FIG. 2 is a cross-sectional view showing a state of communication in proximity between a portable information terminal and a reader / writer of the second prior art
  • 3A is a mobile phone having an antenna device according to the third prior art, where (A) is the back of the mobile phone and (B) is an internal plan view of the rear lower case.
  • 3b is a plan view of an antenna device according to a third prior art
  • FIG. 4 is a perspective view of an antenna device according to a fourth prior art and an antenna coil of a communication counterpart;
  • FIG. 5 is a view showing the structure of the metal layer and the inlay structure of the metal card having a contactless card function according to the first embodiment of the present invention
  • (a) is a plan view of the metal layer
  • (b) is a VB-VB line of the metal layer
  • (C) is a VC-VC longitudinal cross-sectional view of a metal layer
  • (d) is a top view of an inlay.
  • Fig. 6 is a cross-sectional view of a detached state of a metal card having a contactless card function according to the first embodiment of the present invention.
  • Fig. 7 is a cross sectional view of a combined state of a metal card having a contactless card function according to the first embodiment of the present invention, (a) is a cross sectional view of a partially engaged state, and (b) is a sectional view of an entire engaged state.
  • FIG. 8 is an actual photograph of an inlay of a metal card having a contactless card function according to the first embodiment of the present invention, where (a) is a photograph of an upper surface and (b) is a photograph of a lower surface.
  • 9A to 9D are actual photographs showing the manufacturing steps of a metal card having a contactless card function according to the first embodiment of the present invention.
  • FIG. 10 is a view showing the structure of a metal layer of a metal card having a contactless card function according to a second embodiment of the present invention, (a) is a plan view of the upper metal layer, (b) is an XB-XB cross-sectional view of the upper metal layer, (c) is a top view of a lower metal layer, (d) is XD-XD cross-sectional view of a lower metal layer.
  • FIG. 11 is a view showing the alignment relationship between the slits of the metal layer of the metal card having a non-contact card function according to the second embodiment of the present invention, (a) is a horizontal alignment relationship of the upper and lower metal layers, (b) / Shows the vertical alignment of the bottom metal layer.
  • Fig. 12 is a cross-sectional view of a detached state of a metal card having a contactless card function according to a second embodiment of the present invention.
  • Fig. 13 is a cross sectional view of a combined state of a metal card having a contactless card function according to a second embodiment of the present invention, (a) is a cross sectional view of a partially engaged state, and (b) is a cross sectional view of an entire engaged state.
  • Fig. 14 is a bottom view of the lower side of a metal card having a contactless card function according to a second embodiment of the present invention.
  • FIG. 15 is a view showing the structure of a metal layer of a metal card having a non-contact card function according to a third embodiment of the present invention, (a) is a plan view of the metal layer, and (b) is an XVB-XVB line of the metal layer in which the injection molding is inserted (C) is a XVC-XVC line longitudinal cross-sectional view of a metal layer, (d) is a top view of an injection molding.
  • Fig. 16 is a detailed view of an injection molded product of a metal card having a contactless card function according to the third embodiment of the present invention, (a) is a plan view, (b) is a front view, and (c) is a left side view.
  • Fig. 17 is a perspective view of a detached state of a metal card having a contactless card function according to the third embodiment of the present invention.
  • Fig. 18 is a perspective view of a detached state of a metal card having a contactless card function according to a modification of the third embodiment of the present invention.
  • Fig. 19 is a partial detailed view of an antenna portion of a metal card having a contactless card function according to a third embodiment of the present invention, (a) is a plan view in a coupled state, (b) is a sectional view taken along line BB, and (c) is a CC Line section.
  • Fig. 20 is an assembly view of a metal card having a contactless card function according to the third embodiment of the present invention, (a) is a bottom view of the metal layer, (b) is a sectional view of the IIXB-IIXB line, and (c) is an IIXC- Sectional drawing of line IIXC, (d) is a bottom view of an inlay seated.
  • Fig. 21 is a perspective view of a detached state of a metal card having a contactless card function according to the fourth embodiment of the present invention.
  • Fig. 22 is a cross sectional view of a combined state of a metal card having a contactless card function according to the fourth embodiment of the present invention, (a) is a sectional view of a partially engaged state, and (b) is a sectional view of an entire engaged state.
  • Fig. 23 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function with a contactless card function according to the fourth embodiment of the present invention.
  • FIG. 24 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function having a contactless card function according to the fifth embodiment of the present invention.
  • 25 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function having a contactless card function according to the sixth embodiment of the present invention.
  • 26A and 26B are top and bottom views, respectively, of a separated state of a metal plate assembly used for a metal card having a contactless card function according to the seventh embodiment of the present invention.
  • 27A and 27B are top and bottom views, respectively, of a separated state of a metal plate assembly used for a metal card having a contactless card function according to the seventh embodiment of the present invention.
  • 28A and 28B are side views and partially enlarged views, respectively, of a detached state of a metal plate assembly used in a metal card having a contactless card function according to the seventh embodiment of the present invention.
  • 29A to 29C are top and bottom side photographs during the joining of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.
  • 30A and 30B are top and bottom side photographs of the assembled state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.
  • 31A and 31B are top and bottom views of the assembled state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.
  • FIG. 5 is a view showing the structure of the metal layer and the inlay structure of the metal card having a contactless card function according to the first embodiment of the present invention
  • (a) is a plan view of the metal layer
  • (b) is a VB-VB line of the metal layer
  • (C) is a longitudinal cross-sectional view of the VC-VC line of the metal layer
  • (d) is a plan view of the inlay
  • FIG. 6 is a cross-sectional view of the detached state of the metal card having a contactless card function according to the first embodiment of the present invention, Fig.
  • FIG. 7 is a cross sectional view of a combined state of a metal card having a contactless card function according to the first embodiment of the present invention, (a) is a cross sectional view of a partially engaged state, and (b) is a sectional view of an entire engaged state.
  • FIGS. 9A to 9D Is a real picture showing the manufacturing steps of a metal card having a contactless card function according to the first embodiment of the present invention.
  • the PVC layer 60 as the second layer is padded under the metal layer 10 as the first layer.
  • the PVC layer as the second layer is not necessarily limited to this, but may be another synthetic resin layer or even a layer of other non-conductive material having properties similar to those of the synthetic resin.
  • the synthetic resin layer, such as the PVC layer may be directly laminated on the metal layer by heat compression, or may be laminated through a separate adhesive therebetween.
  • a chip module through hole 12 into which the RFIC chip module 20 can be inserted is drilled on one side thereof.
  • the inlay seating groove 11 may be formed on the outer circumference of the chip module through hole 12 to allow the inlay 40 to be seated.
  • the slit 15 is formed to allow the chip module through hole 12 to be opened to the outside.
  • the width of the slit is too wide, the bending strength of the metal layer is deteriorated, so it is preferable to form a narrow one, and if too narrow, the radiation property is deteriorated, so that it is preferably about 0.1 to 3 mm, more preferably 1 to 2 mm. It is good to be.
  • the dotted line indicated by the member number 13 indicates the protrusion 22 of the chip module 20, and the member numbers 14 and 14 'indicate both connection terminals of the chip module.
  • the slit is formed anywhere in the metal layer 10
  • the chip module through hole 12 is to be opened to the outside so that the conductivity of the metal layer in the slit portion may be disconnected, but less than 0.1mm function of the capacitor element In this case, it is not preferable, and if possible, it is preferable to install at a position where the width of the chip module through-hole 12 and the edge of the metal layer 10 is short so that the length of the slit can be reduced.
  • the inlay 40 has a winding 42 as an antenna wound in a coil shape and is electrically connected to the terminals 14 and 14 'of the chip module.
  • the inlay in FIG. 5D is moved to the inlay seating groove 11 of the metal layer 10 in FIG. 5A in the direction of the arrow. While seated, the terminals 14 and 14 'of the chip module and the inlay terminals 41 and 41' are electrically connected to each other.
  • the PVC thin film 50 is placed at the portion where the inlay 40 on the PVC layer 60 is positioned, and the inlay 40 is again placed thereon. ) And the metal layer 10 is placed on the inlay seating groove 11 thereon.
  • the PVC thin film 50 is not necessarily required, but was used for the purpose of matching the thickness of each layer and protecting the inlay.
  • a square loop-shaped chip segment coupling PVC segment 30 is inserted, and a conductive adhesive or conductive solder is applied to the terminals 41 and 41 ′ of the inlay.
  • the conductive material 35 as the connecting means is buried (or the conductive material may be buried in the terminals 14 and 14 'of the chip module) and the chip module 20 is matched therefor.
  • the PVC insert 90 made of a non-conductive material for slit 15 of the metal layer 10 is inserted into the slit 15.
  • Final hot pressing is a conventional technique, so detailed description thereof will be omitted.
  • the thickness of each component is variable depending on the situation, but for example, when the total thickness of the card is 0.84 ⁇ 0.04mm, the thickness of the metal layer 10 is 0.6mm, the PVC layer 60 is 0.24mm ( When using a separate adhesive layer 0.2mm), the depth of the inlay seating groove 11 is 0.24mm, the inlay 40 is 0.04mm, the PVC thin film is 0.15mm, the chip module through hole 12 A depth of 0.36 mm is suitable.
  • the present invention is not limited thereto, and the PVC thin film, the PVC fragment, or the PVC insert also serves to fill a gap between the hard parts, so that some tolerance must be provided.
  • the PVC thin film or PVC fragments are not necessarily limited to PVC, but may be made of other synthetic resins such as PET or PC, or other non-conductive materials having a similar function.
  • the electrodes 41, 41 ′ of the inlay are located at positions of the terminals 14, 14 ′ of the chip module on at least an upper side of the inlay 40.
  • a winding 42 is wound around the electrode to serve as an antenna.
  • the antenna is not necessarily wound with a winding, but may be printed or etched in a pattern, or may be attached to a copper foil or other conductive thin film.
  • the electrodes 41 and 41 ' are formed on both sides such that both electrodes 41 and 41' penetrate the FPCB substrate of the inlay.
  • the first winding 42 is wound in a clockwise direction along the upper side of the first electrode 41 (see FIG. 8A), and is connected to the lower side through the via hole 43, and again counterclockwise.
  • the second winding 42 ' is wound by an appropriate length (clockwise when viewed from above), it is connected to the second electrode 41' (see Fig. 8B).
  • a portion of the first winding 42 of the upper surface of the inlay 40 is formed of a wide portion 42a
  • Some of the capacitors may be connected in parallel with the second winding 42 'to form a capacitor with the wider portion 42a, and others may be blocked to adjust the overall capacitance value, thereby facilitating impedance matching.
  • the metal layer 10 of the metal card having the non-contact card function of the present invention is cut out.
  • an appropriate surface treatment such as anodizing the surface is performed (see FIG. 9A).
  • the electrical connection may be performed using a bonding method using conductive glue, solder, or the initiator of Patent No. 1073440.
  • FIG. 9C is a top side photograph of a metal card having a contactless card function according to a first embodiment of the present invention
  • FIG. 9D is a bottom view of a metal card having a contactless card function according to a first embodiment of the present invention.
  • Side picture As shown in Fig. 9D, the magnet strip 62, the signature portion 63 and the hologram portion 64 are formed on the surface of the PVC layer 60, which is the back side of the card, in the manner of a conventional plastic card.
  • the insert to be inserted into the slit is not manufactured separately and inserted in advance, in the form of the plastic processing or non-conductive material is filled with any non-conductive material in the finishing step It may be done.
  • FIG. 10 is a view showing the structure of a metal layer of a metal card having a contactless card function according to a second embodiment of the present invention
  • (a) is a plan view of the upper metal layer
  • (b) is an XB-XB cross-sectional view of the upper metal layer
  • (c) is a plan view of the lower metal layer
  • (d) is a cross sectional view taken along the XD-XD line of the lower metal layer
  • FIG. 11 shows the alignment relationship between the slits of the metal layers of the metal card having the contactless card function according to the second embodiment of the present invention.
  • (a) shows the horizontal alignment of the upper and lower metal layers
  • (b) shows the vertical alignment of the upper and lower metal layers.
  • FIG. 12 is a cross-sectional view of a detached state of a metal card having a contactless card function according to a second embodiment of the present invention
  • FIG. 13 is a cross-sectional view of an engaged state of a metal card having a contactless card function according to a second embodiment of the present invention.
  • (A) is a sectional view of a partly engaged state
  • (b) is a sectional view of an overall engaged state
  • FIG. 14 is a bottom view of the lower side of a metal card having a contactless card function according to a second embodiment of the present invention. to be.
  • the difference between the second embodiment and the first embodiment is that in the case of the first embodiment, the upper layer is formed of a metal layer and the lower layer is formed of a PVC layer. Therefore, it can be more faithful to the function of the metal card.
  • the upper metal layer 10 will be described, which is the same as the metal layer 10 of the first embodiment of FIG. 5.
  • the first and second metal layers 10 and 80 of the upper and lower layers are both metal layers, it is preferable that only the thickness of the first metal layer 10 is 0.4 mm so that the thicknesses of both metal layers are the same. Therefore, as shown in (b) of FIG. 10 along the XB-XB line of FIG. 10 (a), the depth of the inlay seating groove 11 is milled to about 0.04 mm, which is the thickness of the inlay 40. .
  • the lower metal layer 80 As described above, the thickness is about 0.4 mm thicker than that of the PVC layer 60 of the first embodiment of FIG. 5. Instead, the chip protrusion mounting groove 81 is milled to a depth of about 0.2 mm so that the chip protrusion 22 of the chip module 20 is seated therein.
  • the second metal layer 80 which is the lower metal layer, should also be formed with the same second slit 85 at a position corresponding to the first slit 15 of the first metal layer 10.
  • the first slit 15 and the second slit 85 are formed at exactly the same positions, only a portion thereof is punctured and the PVC insert to be inserted therebetween ( 90: there may be a durability problem due to the possibility of departure (see FIG. 12), more preferably formed to shift slightly in the width direction (in the vertical direction in Figure 11 (a)), but in this case also the first And the slit width d of both the second metal layers 10 and 80 is preferably 0.1 mm or more.
  • the cross section of the slit is crank-formed, and the cross-sectional shape of the PVC insert 90 to be inserted therein also has a crank shape, so that the PVC insert does not easily leave the slit after card completion.
  • connection layer 70 since the upper and lower layers are both metal layers, the connection layer 70 must be formed between the two metal layers.
  • the connection layer may be laminated by hot pressing after inserting a synthetic resin thin film (sheet) such as thin PVC, or may be bonded using a separate adhesive.
  • the chip protrusion 22 may be directly seated in the chip protrusion mounting recess 81 of the second metal layer 80, but more preferably, the chip protrusion mounting recess 81 may be used for buffering.
  • the PVC thin film 50 ' may be seated thereon, and the chip protrusion 22 may be seated on the groove formed in the PVC thin film 50'.
  • the magnet strip 82, the signature portion 83 such as a conventional plastic card
  • the hologram portion 84 as shown in (b) of FIG. 14, the magnet strip 82, the signature portion 83 and the hologram portion at a suitable depth on the outer surface of the second metal layer 80).
  • the grooves 82, 83, and 84 having a depth of about 0.15 mm are formed in the desired size and position so as to form the 84, and the necessary functions are formed in the grooves.
  • the PVC thin film 50 ′ may be formed in the chip protrusion mounting recess 81 on the second metal layer 80. ), And in order to stack the connection layer 70, inlay 40, PVC insert 90, metal layer 10, PVC slice 30, and dummy chip 20 ', The dummy chips 20 'are stacked while the chip protrusions 22 of the dummy chips 20' are seated in the grooves formed in the thin film 50 ', and laminated together by a method such as hot pressing. The rest of the process is the same as the manufacturing method of the first embodiment.
  • the rod-shaped PVC insert 90 of the first embodiment is attached to the slit 85 of the second metal layer 80 and the slit 15 of the first metal layer 10.
  • the rod-shaped PVC inserts 90 of the first embodiment may be respectively inserted, and the sheets may be laminated by heating and pressing them.
  • the manufacturing process may be simplified, but for durability, the cross section is crank-shaped as described above. It is preferred to use an integral PVC insert 90.
  • FIG. 15 is a view showing the structure of a metal layer of a metal card having a non-contact card function according to a third embodiment of the present invention
  • (a) is a plan view of the metal layer
  • (b) is an XVB-XVB line of the metal layer in which the injection is injected
  • C) is a longitudinal cross-sectional view of the XVC-XVC line of the metal layer
  • (d) is a plan view of the injection molding
  • FIG. 16 is a detail view of the injection molding of the metal card having a contactless card function according to the third embodiment of the present invention.
  • (a) is a top view
  • (b) is a front view
  • (c) is a left side view.
  • Fig. 17 is a perspective view of a detached state of a metal card having a contactless card function according to a third embodiment of the present invention
  • Fig. 19 is a part of an antenna portion of a metal card having a contactless card function according to a third embodiment of the present invention.
  • (a) is a plan view of an engaged state
  • (b) is a sectional view taken along line BB
  • (c) is a sectional view taken along line CC
  • FIG. 20 is a metal card having a contactless card function according to the third embodiment of the present invention.
  • (A) is a bottom view of a metal layer
  • (b) is a sectional view of the IIXB-IIXB line
  • (c) is a sectional view of the IIXC-IIXC line
  • (d) is a bottom view with the inlay seated.
  • This third embodiment is similar to the first embodiment, but different in the PVC insert 90 '. That is, since the PVC insert 90 of the first embodiment is a straight bar, there is a possibility that the slit 15 of the metal layer 10 is separated when the card is severely bent, so that it is detached.
  • the PVC insert 90 'of the third embodiment has a rod-shaped body (like the slit 15 of the metal layer 10 of the first embodiment, as shown in Figs. 15 (d) and 16).
  • 90a) has a left and right wing (90b), the thickness of the left and right wing (90b) is relatively lower than the thickness of the body portion (90a).
  • the slit 15 'of the metal layer 10' of the third embodiment also has an upper side (a portion corresponding to the chip module insertion hole 12) as shown in Figs. 15B and 15C.
  • the narrow part 15a and the extension part 15b of the lower side are processed stepwise, and the body 90a and the wing of the slit 15 'of this embodiment are respectively It should be machined to correspond to 90b.
  • the length of the body 90a is the chip module insertion hole 12 at the left edge of the metal layer Length
  • the thickness is about 0.36mm corresponding to the depth of the chip module insertion hole 12
  • the width is preferably at least 0.1mm
  • the length of the wing (90b) is the inlay seating groove ( 11)
  • the thickness is preferably about 0.24mm corresponding to the depth of the inlay seating groove (11).
  • an antenna 42 is formed along the edge of the inlay 40, and as shown in FIGS. 7, 10-13, and 15-17, the projection is orthogonal from above.
  • part or all of the coil shape of the slit (insert) side of the coil of the antenna formed in the inlay 40 is placed outside the inlay (Fig. 5, 10 and 15) It is formed between the left end of the groove 11 and the left end of the chip module through hole 12, that is, between the right end of the wing 90b and the right end of the body 90a in FIG.
  • the boundary between the body and the wing does not necessarily have to be stepped, but may be made of an oblique plane, a curved surface, or a combination thereof.
  • FIG. 17, which is an exploded perspective view of the third embodiment, corresponds to FIG. 6, which is a cross-sectional view of the separated state of the first embodiment.
  • the difference is that the PVC insert 90 is placed on the inlay 40 in the third embodiment. Is stacked first, and then the metal layer 10 'must be laminated.
  • the method of assembling the metal card having the non-contact card function according to the third embodiment will be described.
  • the PVC thin film 50 and the inlay 40 are described.
  • the PVC insert 90 ', the metal layer 10', the PVC segment 30, and the dummy chip 20 ' are sequentially laminated, and then laminated by a method such as hot pressing. The rest of the process is the same as the manufacturing method of the first embodiment.
  • FIG. 20 (a) is a bottom view of the metal layer 10 'viewed from below, (b) is a sectional view of the IIXB-IIXB line, and (c) is a sectional view of the IIXC-IIXC line. It is also possible to temporarily join the PVC insert 90 'and the inlay 40 in a stacked state (see FIG. 20 (d)), and invert it to be laminated with the PVC layer 60.
  • FIG. 18 is a perspective view of a detached state of a metal card having a contactless card function according to a modification of the third embodiment of the present invention.
  • FIG. 21 is a perspective view of a detached state of a metal card having a contactless card function according to a fourth embodiment of the present invention
  • FIG. 22 is a cross-sectional view of a coupled state of a metal card having a contactless card function according to a fourth embodiment of the present invention.
  • (A) is a sectional view of a partly coupled state
  • (b) is a sectional view of a full engagement state
  • FIG. 23 is used for a metal card having a contactless card function having a contactless card function according to the fourth embodiment of the present invention.
  • the PVC layer 260 as the second layer is padded under the metal layer 210 as the first layer.
  • the PVC layer as the second layer is not necessarily limited to this, but may be another synthetic resin layer or even a layer of other non-conductive material having properties similar to those of the synthetic resin.
  • the synthetic resin layer, such as the PVC layer may be directly laminated on the metal layer by heat compression, or may be laminated through a separate adhesive therebetween.
  • a 2nd layer may also be a metal layer.
  • a chip module insertion hole 212 into which the RFIC chip module 20 can be inserted is drilled on one side thereof, and the chip module insertion hole 212 is formed.
  • Inlay seating grooves (211 of FIG. 21) are formed on which outer inlays 40 may be seated.
  • the slit 215 is formed to allow the chip module insertion hole 212 to be opened to the outside. It was found to have a radiation characteristic. In other words, if the width of the slit is too wide, the bending strength of the metal layer is deteriorated, so it is preferable to form a narrow one, and if too narrow, the radiation property is deteriorated, so that it is preferably about 0.1 to 3 mm, more preferably 1 to 2 mm. It is good to be.
  • the chip module insertion hole 212 is to be opened to the outside so that the conductivity of the metal layer in the slit portion may be disconnected, but less than 0.1mm function of the capacitor element This is not desirable, and it is preferable to install the chip module insertion hole 212 and the edge portion of the metal layer 210 at a short width where possible to reduce the length of the slit.
  • auxiliary hole 215 ′ is formed at the left, right, or left and right sides in contact with or spaced from the slit 215.
  • the auxiliary hole 215 ′ is preferably formed to be symmetrical, and more preferably, spaced apart from the slit 215.
  • the chip module 20 or the protrusion 22 of the chip module 20, both connecting terminals 14, 14 'of the chip module, inlay 40 or inlay mounting groove (see 11 in Fig. 5), etc. It may be the same as those of the prior application which concerns on this invention of FIG.
  • the inlay 40 also has a winding (42 in FIG. 5) as an antenna wound in a coil shape and electrically connected to the terminals 14 and 14 'of the chip module.
  • the inlay terminals 41 and 41 ' have an inlay 40, and the inlay 40 is seated in the inlay seating groove 211 of the metal layer 210, thereby providing the terminals 214 and 214 ′ of the chip module and the inlay terminals 41, 41. 41 ') are each electrically connected.
  • one side of the PVC thin film 250 has a protrusion 250a, and the slit 215 and the auxiliary hole 215 on the protrusion. ') Is positioned so that the protrusion 250a of the PVC thin film 250, the slit 215 and the auxiliary hole 215' are integrally bonded at the time of card bonding.
  • a square loop-shaped chip segment coupling PVC segment 30 is inserted, and a conductive adhesive or conductive solder is formed on the terminals 41 and 41 'of the inlay.
  • the conductive material 35 as the connecting means may be buried (or the conductive material may be buried in the terminals 214 and 214 'of the chip module) and the chip module 20 is matched therefor.
  • a PVC insert 290 of a non-conductive material for forming the slits 215 and the left and right auxiliary holes 215 'of the metal layer 210 is formed in the slits 215 and the left and right auxiliary holes 215'.
  • the non-conductive material PVC insert 290 includes a main body 290a to be inserted into the slit 215 and a left and right auxiliary insert 290b to be inserted into the left and right auxiliary holes 215 '. do.
  • Final hot pressing is a conventional technique, so detailed description thereof will be omitted.
  • the insert 290 and the left and right auxiliary inserts 290b are not necessarily non-conductive, and in the proximity, a conductive material such as a metal may be a metal having lower electrical conductivity than copper.
  • a conductive material such as a metal
  • the electrical conductivity is higher than that of copper, considerable electricity is conducted to both ends of the slit, so that magnetic fluxes in opposite directions are generated in the vicinity of the slit, and thus the magnetic fluxes cancel each other, making it difficult to achieve a contactless card function.
  • ferromagnetic materials such as iron, are not suitable.
  • the ferromagnetic materials will have a magnetic field remaining upon the extinction of the flux during wireless communication and will affect the fluxes generated afterwards.
  • aluminum and their alloys are particularly preferred.
  • the thickness of each component is variable depending on the situation, but for example, when the total thickness of the card is 0.84 ⁇ 0.04mm, the thickness of the metal layer 210 is 0.6mm, the PVC layer 260 is 0.24mm ( When using a separate adhesive layer 0.2mm), the depth of the inlay seating groove 211 is 0.24mm, the inlay 40 is 0.04mm, the PVC thin film 250 is 0.15mm, the chip module insertion hole ( The depth of 212) is suitably 0.36 mm.
  • the present invention is not limited thereto, and the PVC thin film, the PVC fragment, or the PVC insert also serves to fill a gap between the hard parts, so that some tolerance must be provided.
  • the PVC thin film or PVC fragments are not necessarily limited to PVC, but may be made of other synthetic resins such as PET or PC, or other non-conductive materials having a similar function.
  • the inlay 40 also has electrodes 41, 41 ′ of the inlay at positions of terminals 14, 14 ′ of the chip module on at least an upper side of the inlay 40. Is formed, and the winding 42 which serves as an antenna while connecting both electrodes is wound.
  • the antenna is not necessarily wound with a winding, but may be printed or etched in a pattern, or may be attached to a copper foil or other conductive thin film.
  • the electrodes 41 and 41 ' are formed on both sides such that both electrodes 41 and 41' penetrate the FPCB substrate of the inlay.
  • the first winding 42 is wound in a clockwise direction along the upper side of the first electrode 41 (see FIG. 8A), and is connected to the lower side through the via hole 43, and again counterclockwise.
  • the second winding 42 ' is wound by an appropriate length (clockwise when viewed from above), it is connected to the second electrode 41' (see Fig. 8B).
  • a portion of the first winding 42 of the upper surface of the inlay 40 is formed of a wide portion 42a
  • Some of the capacitors may be connected in parallel with the second winding 42 'to form a capacitor with the wider portion 42a, and others may be blocked to adjust the overall capacitance value, thereby facilitating impedance matching.
  • the metal layer 210 of the metal card having the non-contact card function of the present invention is cut.
  • an appropriate surface treatment such as anodizing the surface is performed (see FIGS. 9A and 23).
  • Fig. 22 (b) similar to Fig. 9c is a cross-sectional view of a metal card having a contactless card function according to the fourth embodiment of the present invention completed.
  • the magnet strip 62, the signature portion 63 and the hologram portion 64 are formed on the surface of the PVC layer 60, which is the back side of the card, in the manner of a conventional plastic card.
  • the insert to be inserted into the slit is not prepared separately and inserted in advance, in the form of the plastic processing or the non-conductive material is filled with any non-conductive material in the finishing step It may be done.
  • the present invention in addition to the main body 290a of the PVC insert 290 inserted into the slit 215, the left and right auxiliary inserts 290b, respectively, the left and right auxiliary holes of the slit 215 ( 215 ′) and integrally coupled to each other, the maximum amount of bending of the card due to the slit 215 formed on one side of the metal layer 210 is minimized, and at the same time, the PVC insert 290 filling the slit 215 is filled. This can prevent the escape of the maximum, a metal card with a more stable contactless card function is possible.
  • FIG. 24 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function with a contactless card function according to a fifth embodiment of the present invention
  • FIG. 25 is a contactless type according to a sixth embodiment of the present invention.
  • Figure shows a metal plate and a PVC insert used in a metal card having a contactless card function with a card function.
  • the difference between the fifth and sixth embodiments and the fourth embodiment is that, in the fourth embodiment, the slit 215 and the left and right auxiliary holes 215 'are spaced apart and the PVC insert 290 inserted therein as well.
  • the main body 290a and the left and right auxiliary inserts 290b are integrally coupled through the PVC thin film 250, in the fifth and sixth embodiments, the slit 215 and the left and right auxiliary holes ( 215 ') is in contact with each other, and the main body 290a and the left and right auxiliary inserts 290b of the PVC insert 290 inserted therein are directly contacted and integrated.
  • the left and right auxiliary holes 215 ′ are formed in contact with the center left and right of the slit 215.
  • the left and right auxiliary holes 215 ′ are formed.
  • Auxiliary holes 215 ' are formed in contact with the left and right at both ends of the slit 215.
  • the main body 290a and the left and right auxiliary inserts 290b of the PVC insert 290 are inserted into the slit 215 and the left and right auxiliary holes 215 ', and at the same time, the PVC thin film 250 Since it is combined integrally with the), the maximum bending of the card due to the slit 215 formed on one side of the metal layer 210, while suppressing the separation of the PVC insert 290 filled with the slit 215 at the same time. This can be prevented as much as possible.
  • the lower layer (second layer) may be a metal layer instead of a PVC layer, as described above. 10, (a) and (b), those skilled in the art can easily reproduce.
  • FIGS. 26A and 26B are planar and bottom photographs of the detached state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively, and FIGS. 27A and 27B are the present invention, respectively.
  • Plan view and bottom view of a detached state of a metal plate assembly used in a metal card having a contactless card function according to a seventh embodiment of FIGS. 28A and 28B are contactless card functions according to the seventh embodiment of the present invention, respectively.
  • Side view and a partially enlarged view of a detached state of a metal plate assembly used for a metal card having a metal plate, and FIGS. 29A to 29C are each a metal plate assembly used for a metal card having a contactless card function according to the seventh embodiment of the present invention.
  • FIGS. 30A and 30B Is a top side photograph and a bottom side photograph during the coupling of FIGS. 30A and 30B are used for a metal card having a contactless card function according to the seventh embodiment of the present invention, respectively.
  • Top and bottom side photographs of the assembled state of the metal plate assembly, and FIGS. 31A and 31B are plan views of the assembled state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.
  • Bottom view Is a top side photograph and a bottom side photograph during the coupling of FIGS. 30A and 30B are used for a metal card having a contactless card function according to the seventh embodiment of the present invention, respectively.
  • the RFIC chip module 20 is inserted into the lower side of a single metal plate 1 having a general card thickness.
  • the chip module insertion hole 12 is drilled, and an inlay seating groove 11 is formed on the outer circumference of the chip module insertion hole 12 in which a slightly larger inlay 40 may be seated.
  • Grooves are formed on the upper side of the metal plate 1 by milling, etc., on the site where the card logo enters. Similarly, grooves by milling, etc., are also formed on the other side of the metal plate, such as magnets or signatures, in advance.
  • the surface is subjected to other suitable surface treatment such as anodizing or coating.
  • the slit 15 for opening the chip module insertion hole 12 to the outside should be formed, there is a difference depending on the situation, but the width is generally more than 0.1 mm It was confirmed that it had sufficient radiation characteristics. In other words, if the width of the slit is too wide, the bending strength of the metal layer is deteriorated, so it is preferable to form a narrow one, and if too narrow, the radiation property is deteriorated, so that it is preferably about 0.1 to 3 mm, more preferably 1 to 2 mm. It is good to be.
  • the chip module insertion hole 12 is to be opened to the outside so that the conductivity of the metal layer in the slit portion may be disconnected, but less than 0.1mm function of the capacitor element In this case, it is not preferable, and if possible, it is preferable to install at a position where the width of the chip module insertion hole 12 and the edge of the metal plate 1 is short so that the length of the slit can be reduced.
  • sliding grooves 15a and 15b having cross-sections of 'c'-shaped,' v'-shaped, semi-circular or other arcs on both sides of the slit 15 are shown. It is formed long in the longitudinal direction of this slit. Therefore, the cross section of the side wall of the slit is made of ' ⁇ ' type or 'U' type, not straight. Again, preferably, it is desirable to be formed symmetrically.
  • the insert 9 is inserted into the slit, as shown in Figure 29a to 29c, the sliding groove (left and right sides of the left-right side of the main body 9a is inserted into the center of the slit and inserted into the inlay crimping groove ( And insert sliders 9b and 9b 'coupled with 15a and 15b.
  • the object of the present invention is that the insert 9 is firmly fitted and coupled to the slit 15, in fact, the size of the cross section of the insert sliders 9b, 9b 'is such that the sliding groove 15a, Slightly larger than the size of the groove of 15b), it is desirable to be interference fit.
  • the material of the insert 9 preferably has a certain strength or more, since the insert 9 itself must have a certain degree of strength to ensure the strength of the entire metal card.
  • a material having a certain strength of a non-conductive material such as ceramic may be used.
  • a conductive material such as a metal may be a metal having a lower electrical conductivity than copper.
  • the electrical conductivity is higher than that of copper, considerable electricity is conducted to both ends of the slit 15 so that magnetic fluxes in opposite directions are generated in the vicinity of the slit, and thus the magnetic fluxes cancel each other, making it difficult to achieve a contactless card function.
  • ferromagnetic materials such as iron, are not suitable. Of course, the ferromagnetic materials will have a magnetic field remaining upon the extinction of the flux during wireless communication and will affect the fluxes generated afterwards.
  • aluminum and their alloys are particularly preferred.
  • the chip module 20 or the protrusion 22 of the chip module 20, both connecting terminals 14, 14 'of the chip module, inlay 40 or inlay mounting groove (see 11 in Fig. 5), etc. It may be the same as those of the prior application which concerns on this invention of FIG.
  • the inlay 40 also includes an inlay terminal 41, 41 'wound as a coil (42 in FIG. 5) wound in a coil shape and electrically connected to the terminals 14, 14' of the chip module.
  • an inlay terminal 41, 41 'wound as a coil (42 in FIG. 5) wound in a coil shape and electrically connected to the terminals 14, 14' of the chip module.
  • a square loop-shaped PVC segment coupling 30 is inserted into the chip module, and a conductive adhesive or conductive solder is formed on the terminals 41 and 41 'of the inlay.
  • the conductive material 35 as the connecting means is buried (or the conductive material may be buried in the terminals 14 and 14 'of the chip module) and the chip module 20 is matched therefor.
  • the step of forcing the insert 9 for slit 15 of the metal plate 1 into the slit 15 may be performed at this point.
  • the thickness of each component is variable depending on the situation, but, for example, when the total thickness of the card is 0.84 ⁇ 0.04mm, the thickness of the metal plate 1 is close to this, and the thickness of the inlay seating groove 11
  • the depth is 0.48mm
  • the inlay 40 is 0.04mm
  • the PVC thin film 50 is 0.39mm
  • the depth of the chip module insertion hole 12 is 0.36mm is suitable.
  • the present invention is not limited thereto, and the PVC thin film, the PVC fragment, or the PVC insert also serves to fill a gap between the hard parts, so that some tolerance must be provided.
  • the PVC thin film or PVC fragment is not necessarily limited to PVC, but may be made of other synthetic resins such as PET or PC, or other materials having a similar function.
  • the inlay 40 also has electrodes 41, 41 ′ of the inlay at positions of terminals 14, 14 ′ of the chip module on at least an upper side of the inlay 40. Is formed, and the winding 42 which serves as an antenna while connecting both electrodes is wound.
  • the antenna is not necessarily wound with a winding, but may be printed or etched in a pattern, or may be attached to a copper foil or other conductive thin film.
  • the electrodes 41 and 41 ' are formed on both sides such that both electrodes 41 and 41' penetrate the FPCB substrate of the inlay.
  • the first winding 42 is wound in a clockwise direction along the upper side of the first electrode 41 (see FIG. 8A), and is connected to the lower side through the via hole 43, and again counterclockwise.
  • the second winding 42 ' is wound by an appropriate length (clockwise when viewed from above), it is connected to the second electrode 41' (see Fig. 8B).
  • a portion of the first winding 42 of the upper surface of the inlay 40 is formed of a wide portion 42a
  • Some of the capacitors may be connected in parallel with the second winding 42 'to form a capacitor with the wider portion 42a, and others may be blocked to adjust the overall capacitance value, thereby facilitating impedance matching.
  • the metal plate 1 of the metal card having the non-contact card function of the present invention is cut to form a slit 15 or the like.
  • an appropriate surface treatment such as anodizing the surface is performed (see FIGS. 9A and 26A to 27B).
  • the insert (9) is forcibly fitted to the slit (15) of the metal plate (1).
  • 15a to 31b show a metal plate assembly in which the insert 9 and the metal plate 1 are combined.
  • a magnet strip 82, a signature portion 83, and a hologram portion 84 should be formed on the lower side of the metal plate 1, the lower side of the metal plate 1.
  • Grooves 82, 83, 84 approximately 0.15 mm deep, such as by NC machining, at desired sizes and locations, such that magnet strips 82, signatures 83, and holograms 84 are formed at a suitable depth on the sides. And form the necessary function in the groove portion.
  • the metal plate is composed of two layers, and the two layers are formed of two metal plates of the upper layer and the lower layer while laminating them.
  • the sliding groove may be implemented, which can be easily reproduced by those skilled in the art with reference to the embodiments of FIGS. 5 to 20 having two layers as described above, and in this case, the sliding groove is easier to manufacture. something to do.
  • the case of implementing a single metal plate to the last will be more preferable in terms of strength.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne : une carte métallique, qui a une fonction de carte de type sans contact, a au moins un côté entier constitué d'une plaque métallique réellement épaisse, et est destinée à un client VVIP, le niveau de classe le plus élevé des clients ; et son procédé de fabrication. Une carte métallique (100, 100', 100'') ayant une fonction de carte de type sans contact et ayant au moins une puce incorporée dans celle-ci, de la présente invention, comprend : un module de puce RFIC (20) pour réaliser une fonction de carte de type sans contact ; une incrustation (40) ayant une antenne pour réaliser directement une communication de type sans contact du module de puce RFIC (20); une première couche métallique (10, 10') ayant un trou traversant de module de puce (12), dans lequel le module de puce RFIC (20) peut être inséré, et une rainure de chargement d'incrustation (11) dans laquelle l'incrustation (40) peut être chargée ; et une seconde couche (60, 80) liée à un côté inférieur de la première couche métallique, une fente (15, 15', 85) est formée sur un côté de la première couche métallique (10, 10') de telle sorte que le trou traversant de module de puce (12) doit être ouverte vers l'extérieur de celle-ci de manière à bloquer la conductivité de la première couche métallique au niveau de la fente, l'incrustation (40) a un enroulement (42), en tant qu'antenne, enroulé autour de celui-ci dans une forme de bobine, et un terminal d'incrustation (41, 41') qui est électriquement connectée à un terminal (14, 14') du module de puce, et la partie en forme de bobine à l'exclusion d'une partie formée vers l'intérieur de celui-ci est formée plus vers l'extérieur que le module de puce (20) pour être reliée au terminal d'incrustation (41, 41') de l'antenne formée au niveau de l'incrustation (40).
PCT/KR2017/008255 2016-08-17 2017-07-31 Carte métallique ayant une fonction de carte de type sans contact, plaque métallique et ensemble plaque métallique utilisés à cet effet, et son procédé de fabrication WO2018034449A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2016-0104358 2016-08-17
KR10-2016-0104360 2016-08-17
KR1020160104358A KR101868478B1 (ko) 2016-08-17 2016-08-17 비접촉식 카드 기능을 갖는 메탈 카드
KR20160104360 2016-08-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021001579A1 (de) 2021-03-25 2022-09-29 Giesecke+Devrient Mobile Security Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte
US11755873B1 (en) * 2020-02-01 2023-09-12 Federal Card Services, LLC RFID enabled metal transaction cards

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140131453A1 (en) * 2011-05-17 2014-05-15 Gemalto Sa Radiofrequency transponder device with optimized passive resonant circuit
US20140263655A1 (en) * 2013-03-13 2014-09-18 Avery Dennison Corporation RFID Inlay Incorporating a Ground Plane
US20150324683A1 (en) * 2014-05-06 2015-11-12 Johnson Electric S.A. Smart Card Module
WO2016035771A1 (fr) * 2014-09-01 2016-03-10 株式会社イーガルド Unité de terminal de communication d'informations sans contact, dispositif de type carte, téléphone portable et dispositif pouvant être porté
WO2016046184A1 (fr) * 2014-09-22 2016-03-31 Féinics Amatech Teoranta Cartes intelligentes passives, cartes métalliques, objets de paiement et bijoux intelligents

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140131453A1 (en) * 2011-05-17 2014-05-15 Gemalto Sa Radiofrequency transponder device with optimized passive resonant circuit
US20140263655A1 (en) * 2013-03-13 2014-09-18 Avery Dennison Corporation RFID Inlay Incorporating a Ground Plane
US20150324683A1 (en) * 2014-05-06 2015-11-12 Johnson Electric S.A. Smart Card Module
WO2016035771A1 (fr) * 2014-09-01 2016-03-10 株式会社イーガルド Unité de terminal de communication d'informations sans contact, dispositif de type carte, téléphone portable et dispositif pouvant être porté
WO2016046184A1 (fr) * 2014-09-22 2016-03-31 Féinics Amatech Teoranta Cartes intelligentes passives, cartes métalliques, objets de paiement et bijoux intelligents

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11755873B1 (en) * 2020-02-01 2023-09-12 Federal Card Services, LLC RFID enabled metal transaction cards
DE102021001579A1 (de) 2021-03-25 2022-09-29 Giesecke+Devrient Mobile Security Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte

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