WO2018034449A1

WO2018034449A1 - Metal card having noncontact type card function, metal plate and metal plate assembly used therefor, and manufacturing method therefor

Info

Publication number: WO2018034449A1
Application number: PCT/KR2017/008255
Authority: WO
Inventors: 김기현; 김남주; 황희철
Original assignee: 주식회사 아이씨케이
Priority date: 2016-08-17
Filing date: 2017-07-31
Publication date: 2018-02-22

Abstract

The present invention provides: a metal card, which has a noncontact type card function, has at least an entire one side made from an actually thick metal plate, and is for a VVIP customer, the highest class level of customers; and a manufacturing method therefor. A metal card (100, 100', 100'') having a noncontact type card function and having at least one chip embedded therein, of the present invention, comprises: an RFIC chip module (20) for performing noncontact type card function; an inlay (40) having an antenna for directly performing a noncontact type communication of the RFIC chip module (20); a first metal layer (10, 10') having a chip module through-hole (12), into which the RFIC chip module (20) can be inserted, and an inlay loading groove (11) in which the inlay (40) can be loaded; and a second layer (60, 80) bound to a lower side of the first metal layer, wherein a slit (15, 15', 85) is formed at one side of the first metal layer (10, 10') such that the chip module through-hole (12) is to be opened to the outside thereof so as to block the conductivity of the first metal layer at the slit, the inlay (40) has a winding (42), as an antenna, wound therearound in a coil shape, and an inlay terminal (41, 41') which is electrically connected to a terminal (14, 14') of the chip module, and the coil-shaped part excluding a part formed toward the inside thereof is formed more outwardly than the chip module (20) in order to be connected to the inlay terminal (41, 41') of the antenna formed at the inlay (40).

Description

Metal card having contactless card function, metal plate and metal plate assembly used therefor, and method of manufacturing same

The present invention relates to a metal card having a non-contact card function and a method of manufacturing the same, and more particularly, at least one side of the metal is not easily bent and has a beautiful appearance, but also has a non-contact card function such as RF or NFC, The present invention relates to a metal card having a contactless card function, a metal plate and a metal plate assembly used therein, and a method of manufacturing the same.

In general, cards are classified into magnetic cards using magnetic strips, smart cards using IC chips, and combination cards combining them according to recording methods, and smart cards are classified into contact and contactless types according to reading methods. It is classified into a near field communication (NFC) card that can be read only within a distance of ~ 10 cm and an RF card that can be read at a far distance. In general, these methods are often provided with overlap. Hereinafter, in the present specification, the NFC for the near-field NFC or the far-field RF is not greatly distinguished, and collectively referred to as 'RF' or 'contactless', and the chip for all contactless cards including the near-field NFC chip or the far-field RF chip. Is collectively referred to as 'RFIC'.

On the other hand, plastic cards are generally issued to suspend the collection of goods and services for a certain period of time to a specific member, and are mainly cash, such as credit cards, cash cards, and transportation cards. As a substitute for or widely used as a medical card, membership card, etc., Hyundai has provided various types of plastic cards differentiated according to the customer's credit rating.

Among them, special cards such as gold cards or platinum cards, which are produced for VIP customers with high credit ratings, are painted in gold or silver to make them feel more elegant.

However, the above-mentioned special cards are used to print gold and silver by mixing the powdered gold or silver powder on the pigment so that the gold and silver color are mixed with the pure gold or pure silver. Not only that, but also a mixture of other pigments and adhesives could not obtain a high gloss texture emitted from pure metal.

In addition, unlike pure metals that never change their gloss or texture, gold powder and silver powder are deteriorated due to humidity or temperature conditions. Because of the closure, it was not possible to provide high quality plastic cards.

Moreover, in recent years there has been a move to replace plastic cards with real thick metal plates for VVIP customers, the highest customer base.

1 is for a plastic card having a metal thin film proposed to solve the above problems of the plastic card, it is related to the registered utility model No. 0382725. That is, in the first conventional technology, the metal thin film 12 is attached to the upper surface of the core sheet 13 made of synthetic resin such as PVC, and the metal thin film 12 is smaller in size than the core sheet 13. The blank 13a is formed around the upper surface of the core sheet 13 while forming a corresponding shape.

An antenna coil 21 is installed along the circumference of the upper surface margin 13a of the core sheet 13, and the antenna coil 21 is installed in a continuously wound state.

Both ends of the antenna coil 21 are connected to the IC chip 20 fixed inside the core sheet 13 to communicate with a reader (not shown) while the reader reads various information stored in the IC chip 20. I can figure it out.

A transparent upper coated paper 11 is attached to an upper surface of the core sheet 13, and a printing layer 11a is formed on a lower surface of the upper coated paper 11. Various pictures or characters associated with the card company are printed on the printed layer 11a.

A transparent lower coated paper 14 is attached to a lower surface of the core sheet 13, and a printing layer 14a is formed on an upper surface of the lower coated paper 14. Various pictures and characters associated with the card company are also printed on the printed layer 14a.

On the other hand, the metal thin film 12 attached to the upper and lower surfaces of the core sheet 13, respectively, melted and remelted a metal material, and then, using a conventional rolling mill, a thin foil form, that is, about 0.02 to 0.1 mm The metal material was formed into a thin film having a thickness. The metal material is a noble metal having good ductility and malleability and high gloss such as pure gold (Au), platinum (Pt), silver (Ag), and nickel (Ni). Used. Of course, in some cases, two or more of the metal materials may be alloyed.

The present invention having the above-described configuration emits high gloss in a state where the metal thin films 12 thermally bonded to the upper and lower surfaces of the core sheet 13 are protected by the transparent upper and lower coated

papers

11 and 14. As a result, plastic cards that can be more elegant and feel of high quality can be realized, and the metal thin film 12 made of pure metal material can prevent discoloration and deterioration even after long-term use, so that it can always maintain high gloss of plastic. There are some advantages, such as being able to maximize the external competitiveness of the card.

In addition, the antenna coil 21 is installed in the margin 13a of the core sheet 13 formed around the metal thin film 12 so that the antenna coil 21 can communicate with the reader without being disturbed by the metal thin film 12. As well as the plastic card (1) to which the magnetic tape (30) is attached

The high gloss metal thin film 12 can also be applied to the plastic card 1 in which the IC chip 20 is embedded.

However, in the first conventional technology, for the RF communication, a margin 13a must be formed around the upper surface of the core sheet 13 while the metal thin film 12 is smaller than the core sheet 13. The antenna coil 21 can only be wound around the upper surface margin 13a. Therefore, the metallic aesthetics due to the margin are halved, and the coupling force between the core sheet and the upper coated paper is also due to the antenna coil of the margin portion. It was lowered and above all, there was not enough consideration of the bonding between the metal thin film and the core sheet and the coated paper, which was only an idea and was not actually mass produced.

For reference, in the first conventional technology, the above problem is recognized, and the edge of the color corresponding to the metal thin film 12 is printed by printing with ink mixed with metal powder around the upper and lower coated

papers

11 and 14. Forming the printed layers 11b and 14b prevents the antenna coil 21 fixed around the core sheet 13 from being exposed to the outside through the upper and lower coated

papers

11 and 14 to prevent the entire plastic card 1 from being formed. Although the proposal is made to keep the appearance of) beautifully, in order to allow the antenna coil 21 to communicate with the reader, the metal powder content must be 30% or less, so that the metal made of the actual metal layer You can never follow the beautiful texture and durability of the card.

On the other hand, as a kind of such a metal card, Korean Patent No. 0516106 (credit card with a gold foil layer and a method of manufacturing the same) is disclosed in which the size of the gold foil is equal to the size of the card. It can also be seen in the first conventional art that the flux generated at the antenna on the core causes the induction flux in the opposite direction due to the gold leaf, so that the RF function cannot be actually exerted by the cancellation of the flux.

On the other hand, the Republic of Korea Patent Publication No. 2013-0006358 (metal card and its manufacturing method), the actual metal layer is formed without forming a transparent plastic coating layer on the outermost side, but maximizes the visual effect by the anodizing technique, The technique of anodizing and insulating the stepped etching region accommodating the IC chip, but the technique related to the contact card accommodating the contact IC chip to the last.

In addition, even when the metal card is used in the terminal a plurality of times, the static electricity is generated between the metal part of the card and the terminal, and there is a problem that an error may occur due to the use of the card. Anodizing is inevitably made thin at the corners of the etched area, and there is a problem that the insulation with the metal card sheet material may not be good as the contact IC chip is attached.

And, in order to solve the problems of the third prior art, the present inventor has also applied for the Republic of Korea Patent Application No. 2015-0157255 (metal card and its manufacturing method), the contents of the present invention is also taken into account in the present specification. (However, since the contents of the preceding application are not a technique disclosed at the time of the present filing date, they are not cited as a known technique for the present invention).

Above all, in the case of the prior arts including the first prior art and the above-described prior art of the present inventors, when manufactured as a metal card forming a metal layer on the entire size of the card, it is possible to exert a non-contact card function such as RF or NFC function. There was no fatal drawback.

On the other hand, as a second prior art, Japanese Patent Laid-Open No. 2006-270681 (portable device) is a portable device capable of suppressing fluctuations in communication characteristics between both in close proximity with an antenna module and a reader / writer. As shown in FIG. 2, the metal layer 30 is placed on the incidence side of electromagnetic waves emitted from the reader / writer, rather than the communication surface CS of the antenna module 10 embedded in the terminal body 22. By providing, the technique which ensures the communication state which guide | induces the communication magnetic field to the antenna coil 15 of the antenna module 10 by this metal layer 30 is disclosed. At this time, the metal layer 30 is attached to predetermined positions inside and outside the terminal to be made of copper foil or the like. Therefore, when the reader / writer and the terminal main body 22 are close to each other, there is an advantage that a defect in communication due to a positional relationship with each other can be suppressed.

That is, FIG. 2 is a diagram showing a state of communication in proximity between the portable information terminal 21 and the reader / writer of the second prior art. In FIG. 2, some magnetic fields H of the electromagnetic waves emitted from the transmitting / receiving antenna 26 of the reader / writer are affected by metal objects such as the battery pack 25 in the terminal body 22, and thus are attenuated by reflection and absorption. Receive. Since the metal layer 30 is disposed on the incident side of the electromagnetic wave than the communication surface CS of the antenna module 10, an induced current (eddy current) is generated due to the application of an external magnetic field to the surface of the metal layer 30. The generated magnetic field H1 generates an induced current in the antenna coil 15 of the antenna module 10.

In the second prior art, the metal layer 30 is disposed close to the antenna module 10 so as to cover a part of the antenna coil 15, thereby providing a reader / writer through the magnetic field component H1 generated in the metal layer 30. Inductive coupling between the transmission and reception antenna 26 and the antenna coil 15 of the antenna module 10.

Thus, the second prior art antenna device shown in Fig. 2 attempts to solve the problem that the communication characteristics fluctuate greatly depending on the magnitude of the positional difference between the centers of the antennas when the distance between the antennas of the communication counterparts is very close. will be.

However, the magnetic flux which tries to bridge between the antenna coil 15 of the antenna module 10 on the side of the portable information terminal 21 and the reader / writer side transceiver antenna 26 is a metal object such as a battery pack 25 inside the case. In order to eliminate the blocking, the metal layer 30 for inducing magnetic flux is provided, but it cannot be said that a great effect can be obtained depending on the positional relationship of obstacles such as the battery pack 25. In addition, there is a limit that the metal layer 30 does not act effectively to increase the communication distance in a state where the antenna device and the antenna on the communication counterpart are separated.

On the other hand, to solve this problem of the second prior art, as the third prior art, a technique such as Japanese Patent No. 4947217 (antenna device and mobile phone) is disclosed.

The third conventional technology is an antenna device installed inside or outside of the mobile phone case (1) to allow a relatively small and stable communication, and to increase the maximum distance that can be communicated compared to the antenna of the communication counterpart 3A, as shown in FIG. 3A, a conductor having a loop-shaped or helical coil conductor with a coil opening as a coil opening, a conductor opening CA, and a slit portion SL connected between the conductor opening and an outer edge thereof. Having a layer (2) and overlapping the coil opening with the conductor opening when the coil conductor is viewed in plan, the area of the conductor layer is greater than the area of the formation region of the coil conductor, and in plan view, the The distance from the outer edge of the conductor opening to the outer edge of the coil conductor is greater than the distance from the inner edge of the conductor opening to the inner edge of the coil conductor, The slit portion is disposed in close proximity to the end portion so as to face the end of the case, and is connected between the outer edges of the conductor layer closest to the outside of the conductor opening, wherein the conductor layer is formed on the inner or outer surface of the case. It is characterized by consisting of the case made of a metal film or a metal foil or metal.

Thus, according to the third prior art, a current flows in the conductor layer so that the magnetic field generated by the current flows in the coil conductor, and a current flowing around the opening of the conductor layer passes through the slit portion and is edged. The effect is that an electric current flows around the conductor layer, and thus a magnetic field is generated in the conductor layer, thereby extending the communication distance. In addition, since the conductor layer turns the magnetic flux largely, the maximum distance that can be communicated with the antenna device and the communication counterpart antenna where the magnetic flux arrives from the antenna device to the antenna of the communication counterpart or from the antenna of the communication counterpart to the antenna equipment becomes large.

However, as shown in FIG. 3B, the planar conductor 2 of the third conventional technology is provided with a conductor opening CA and a slit 2S, and the coil opening 31 has a coil opening of the conductor opening. Arranged so as to overlap with CA, and when a current represented by a solid arrow flows through the coil-shaped conductor 31, a current represented by a broken arrow is induced in the planar conductor 2, and the regions A1, A2 and A3. In A4, the current flowing in the coil-like conductor 31 and the direction of the current flowing in the planar conductor 2 coincide, but in the region B, the current flowing in the coil-shaped conductor 31 and the current flowing in the planar conductor 2 flow. Since the direction of the current is reversed, there exists a region in which the direction of the current is reversed in this way, so that the inductance of the antenna (coil) is reduced and the communication characteristics are deteriorated. In addition, since the generation position of the coil-shaped conductor 31 and the planar conductor 2 and the deviation of the distance between the coil-shaped conductor 31 and the planar conductor 2 at the time of attachment change the generation amount of the induced current, The problem is that the inductance value tends to be different.

In order to solve the above problems of the third conventional technology, as the fourth conventional technology, Korean Patent No. 1470341 (antenna device and wireless communication device) solves the problem of lowering and inductance of the inductance of the antenna device in the power feeding circuit. In order to provide an antenna device, as shown in FIG. 4, the power supply coil 3 and the planar conductor 2 are provided.

At this time, the power supply coil 3 is provided with the magnetic core 32 and the coil-shaped conductor 31 wound by this magnetic core 32. As shown in FIG. The coil-shaped conductor 31 may be a conductive wire (wound conductor) wound on the magnetic core 32, a laminate formed by laminating a plurality of dielectric layers, a laminate formed by laminating a plurality of magnetic layers, or one or more layers. It may be a conductor pattern formed in a laminate obtained by laminating a dielectric layer and one or more magnetic layers. In particular, since the feed coil which can be miniaturized and surface-mounted can be constituted, a coil-shaped conductor 31 is formed in an in-plane conductor pattern and an interlayer conductor pattern on a laminate formed by laminating a plurality of magnetic body layers (for example, ferrite ceramic layers). It is preferable that it is a chip | tip feed coil which comprised ().

The power supply coil 3 is connected to an RFIC 13 which is a power supply circuit. That is, one end and the other end of the coil-shaped conductor 31 are connected to two input / output terminals of the RFIC 13, respectively. The RFIC 13 is an NFC RFIC chip, a semiconductor IC chip for processing a high frequency signal for NFC.

The planar conductor 2 has a larger area than the feed coil 3. That is, when viewed from the normal direction of the planar conductor 2, the outer dimension of the planar conductor is larger than the outer dimension of the feed coil. The planar conductor 2 is formed with slits 2S extending inwardly from a part of the outer edges. In the fourth prior art, the slit 2S has a certain width from one end to the other end, but the width does not necessarily need to be constant.

In the fourth conventional technique, the planar conductor 2 is a metal housing part (metal cover part) of the communication terminal housing, and in the state shown in Fig. 4, on the lower surface of the planar conductor 2, that is, inside the communication terminal housing. The power supply coil 3 is arranged at. In the power feeding coil 3, the winding axis direction of the coil-shaped conductor 31 is arranged differently from the normal direction of the planar conductor 2. More specifically, the winding axis of the coil-shaped conductor 31 is arrange | positioned so that it may become parallel with the planar conductor 2. As shown in FIG.

Moreover, the power supply coil 3 is arrange | positioned so that the coil opening of the power supply coil 3 may face the slit 2S, while the coil opening is close to the slit 2S. That is, the feed coil 3 is arrange | positioned so that the coil opening may be seen from the slit 2S so that the magnetic flux which may pass through the slit 2S of the planar conductor 2 may pass through a coil opening.

The planar conductor 2 is not limited to the metal housing portion, and may be a conductor film formed on an insulating substrate or a conductor layer formed on an insulating substrate. That is, the planar conductor 2 may be various metal plates, such as a ground conductor mounted in a communication terminal, a metal chassis, a shield case, the metal cover of a battery pack, or the planar pattern by the metal thin film provided in the flexible sheet. When the planar conductor 2 is a metal thin film pattern provided on the flexible sheet, what is necessary is just to adhere to the inside of the back cover of a communication terminal with an adhesive agent. In addition, the planar conductor 2 may be a conductor having a surface widened in a planar shape, and does not necessarily have to be flat (it may be a curved surface).

As shown in Fig. 4, the RFIC 14 is connected to the antenna coil 4 on the communication counterpart of the fourth conventional technology. When the planar conductor 2 is close to the antenna coil 4 of the communication partner, an induced current is generated in the planar conductor 2, and this current is mainly formed at the edge of the planar conductor 2 according to the edge effect. Flows along. That is, a current (overcurrent) flows in a direction that prevents passage of the magnetic flux generated by the antenna coil 4. The magnetic flux Φ 1 in FIG. 1 represents the magnetic flux passing through the antenna coil 4.

The slit 2S is also part of the edge, and the current density of the portion along the edge of the slit 2S is increased. The narrower the gap between the slits 2S, the higher the magnetic field strength near the slits 2S. The magnetic flux Φ 2 in FIG. 4 represents the magnetic flux passing through the slit 2S. Part of the magnetic flux Φ 2 is interlinked with the power supply coil 3. Moreover, although the magnetic field by the electric current which flows along the outer peripheral edge end of the planar conductor 2 generate | occur | produces, since the feed coil 3 is far enough from the outer peripheral edge end of the planar conductor 2, it is mainly a slit 2S. Strongly combined with nearby magnetic fields. (Coupling does not cancel by coupling with a magnetic field near the outer peripheral edge end.)

In this way, the planar conductor 2 acts as a magnetic field capture element (radiation plate), and the feed coil 3 is magnetically coupled to the communication partner antenna coil 4 via the planar conductor 2. In addition, since the coil opening surface of the coil-shaped conductor constituting the feed coil does not face the planar conductor, and only a part of the coil-shaped conductor is close to the planar conductor, more specifically, when viewed from the winding axis direction of the coil-shaped conductor Since the coil-shaped conductor has a portion far from the plane-shaped conductor and a part far from the coil-shaped conductor, the inductance value of the power feeding coil 3 is maintained even if the relative positional relationship between the feed coil 3 and the planar conductor 2 is slightly changed. It doesn't change much. Therefore, the antenna device with small manufacturing variation can be realized.

Although the coil opening of the power supply coil 3 should just be arrange | positioned toward the slit 2S side, as shown in FIG. 4, the coil winding axis of the power supply coil 3 exists in the extending direction (extension of the slit 2S). Direction), the coupling efficiency with the magnetic flux Φ 2 generated in the slit 2S is maximum.

Indeed, according to the fourth prior art, it can be said to provide an effective device of an antenna device having a metal layer.

Nevertheless, however, the fourth conventional technique provides a solution in a relatively large communication device such as a mobile terminal, and is difficult to apply when the thickness of the existing credit card is only 1 mm. It is difficult.

[Preceding technical literature]

[Patent Documents]

(Patent Document 1) Registered Utility Model No. 0382725 (Metal Thin Film Plastic Card)

(Patent Document 2) Japanese Patent Publication No. 2006-270681 (Portable Device)

(Patent Document 3) Japanese Patent No. 4947217 (Antenna Device and Mobile Phone)

(Patent Document 4) Korean Patent No. 1470341 (Antenna device and wireless communication device)

The present invention is to solve the above problems, the object is to provide a metal card having a contactless card function of at least one side of the entire thick metal plate for the VVIP customer, the highest level of customer base, and a method of manufacturing the same. In addition, the present invention provides a metal card having a non-contact card function, a metal plate and a metal plate assembly used therein, and a method of manufacturing the same.

The above and other additional objects will be apparent to those skilled in the art without departing from the spirit of the invention by the appended claims.

Metal card having a contactless card function according to an aspect of the present invention for achieving the above object, as a metal card (100,100 ', 100 ") having a contactless card function that incorporates one or more chips, performs a contactless card function A chip module 20 for directing; an inlay 40 having an antenna for directly performing contactless communication of the chip module 20; a chip module through hole 12 into which the chip module 20 can be inserted; A first metal layer (10, 10 ') having an inlay seating groove (11) on which the inlay (40) can be seated; and a second layer (60, 80) laminated under the first metal layer; In one side of the first metal layer (10, 10 '), the chip module through-hole 12 is formed with slit (15, 15', 85) to open to the outside, the first in the slit The conductivity of the metal layer is cut off, and the inlay 40 has a winding 42 as an antenna wound in a coil shape. And the inlay terminals 41 and 41 'electrically connected to the terminals 14 and 14' of the chip module, and when the projection is orthogonal from above, the slit of the coil of the antenna formed in the inlay 40 Part or all of the coil shape of the side is characterized in that formed on the outer side than the chip module 20.

Preferably, the second layer is a metal layer 80, and the slit 15 formed in the first metal layer 10 and the slit 85 formed in the second layer are shifted in the width direction of the slit. It is done.

Also preferably, both

electrodes

41 and 41 ′ of the inlay 40 are formed on both sides of the inlay 40 so as to penetrate the substrate of the inlay, and the first winding 42 formed on the upper side of the first electrode 41. And the second winding 42 ′ formed on the lower side is electrically connected through the via hole 43.

Also preferably, in the portion where the inlay 40 on the second layer is located, the PVC thin film 50 is positioned, the inlay 40 is again placed thereon, and the inlay seating groove 11 is positioned thereon. While laminating the first metal layer 10 is characterized in that.

Also preferably, it further comprises

inserts

90, 90 ', 90 "of non-RF interference material inserted into the

slits

15, 15', 85.

More preferably, the insert 90 'has a shape having left and right wings 90b on the rod-shaped body 90a, wherein the left and right wings 90b have a thickness of the rod-shaped body 90a. The shape is relatively lower, and the slit 15 'of the first metal layer 10' is also shaped to correspond to the insert 90 '.

Still more preferably, the insert 90 'is characterized in that a thin film portion 90c of the same material is added to the rod-shaped body 90a and the left and right wings 90b.

Also preferably, the first metal layer further includes an auxiliary hole 215 'on at least one side of the slit, wherein the auxiliary hole is inserted with an auxiliary insert of a non-RF interference material.

More preferably, the insert body inserted into the slit and the auxiliary insert inserted into the auxiliary hole are integrally formed by the thin film 250 between the first metal layer and the second layer.

On the other hand, the metal plate used for the metal card having a contactless card function according to another aspect of the present invention for achieving the above object is a metal plate used for a metal card having a contactless card function that incorporates one or more chips, the contactless card A chip module insertion hole into which a chip module for performing a function can be inserted; An inlay seating groove in which an inlay formed with an antenna for directly performing contactless communication of the chip module may be seated; And a slit for opening the chip module insertion hole to the outside; It includes, characterized in that the conductivity of the metal plate is cut off or the conductivity is weakened in the slit portion formed on one side of the metal plate.

Preferably, it further comprises an auxiliary hole (215 ') on at least one side of the slit.

Also preferably, the left and right sliders into which the inserts of the non-RF interference materials are inserted are formed in the sliding grooves that are inserted into the sidewalls of the slits.

On the other hand, according to another aspect of the present invention for achieving the above object, the metal plate; An insert of a non-RF interference material inserted into the slit of the metal plate; It includes, but is provided with a metal plate assembly for use in a metal card having a contactless card function, characterized in that the slider of the slit is pressed into the sliding groove,

Moreover, the metal plate assembly; A chip module inserted into the chip module insertion hole of the metal plate to perform a contactless card function; And an inlay seated in the inlay seating groove of the metal plate and having an antenna for directly performing contactless communication of the chip module. Provided is a metal card having a contactless card function, including a.

On the other hand, the method of manufacturing a metal card having the contactless card function according to another aspect of the present invention for achieving the above object, the chip module through hole 12 and the first metal layer 10, Forming the inlay seating groove (11); After stacking the dummy chips 20 'having the same shape as the inlay 40, the first metal layer 10, and the chip module 20 on the

second layers

60 and 80, heat compression, etc. Filling the slit with a non-conductive material while laminating in a method; And removing the dummy chip 20 'and mounting the chip module 20 in place. Characterized in that it comprises a.

According to the metal card having a non-contact card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance, but also has a non-contact card function such as RF or NFC, due to the slit formed on one side of the metal layer The maximum curvature of the card can be prevented, and at the same time, the slit-filled PVC insert can be prevented as much as possible, so that the card has a more stable non-contact card function, such as the card bent due to slits formed on one side of the metal layer. A metal card having a non-contact card function with a further enhanced strength, which maximizes the strength degradation phenomenon, is possible.

In addition, according to the manufacturing method of a metal card having a non-contact card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance, yet stable production of a metal card having a non-contact card function, such as RF or NFC function Provide a method.

In addition, according to the metal plate used in the manufacture of a metal card having a contactless card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance, but also has a non-contact card function such as RF or NFC, It is possible to manufacture a metal card having a more stable, non-contact card function while minimizing card bending.

In addition, according to the metal plate assembly used in the manufacture of a metal card having a contactless card function according to the present invention, at least one side of the metal is not easily bent and has a beautiful appearance while having a non-contact card function such as RF or NFC function, Furthermore, it becomes possible to manufacture a metal card having a contactless card function, which further strengthens the strength of the card.

On the other hand, additional features and advantages of the present invention will become more apparent from the following description.

1 is an exploded perspective view of a metal thin film plastic card of the first prior art;

2 is a cross-sectional view showing a state of communication in proximity between a portable information terminal and a reader / writer of the second prior art;

3A is a mobile phone having an antenna device according to the third prior art, where (A) is the back of the mobile phone and (B) is an internal plan view of the rear lower case.

3b is a plan view of an antenna device according to a third prior art;

4 is a perspective view of an antenna device according to a fourth prior art and an antenna coil of a communication counterpart;

5 is a view showing the structure of the metal layer and the inlay structure of the metal card having a contactless card function according to the first embodiment of the present invention, (a) is a plan view of the metal layer, (b) is a VB-VB line of the metal layer (C) is a VC-VC longitudinal cross-sectional view of a metal layer, (d) is a top view of an inlay.

Fig. 6 is a cross-sectional view of a detached state of a metal card having a contactless card function according to the first embodiment of the present invention.

Fig. 7 is a cross sectional view of a combined state of a metal card having a contactless card function according to the first embodiment of the present invention, (a) is a cross sectional view of a partially engaged state, and (b) is a sectional view of an entire engaged state.

8 is an actual photograph of an inlay of a metal card having a contactless card function according to the first embodiment of the present invention, where (a) is a photograph of an upper surface and (b) is a photograph of a lower surface.

9A to 9D are actual photographs showing the manufacturing steps of a metal card having a contactless card function according to the first embodiment of the present invention.

10 is a view showing the structure of a metal layer of a metal card having a contactless card function according to a second embodiment of the present invention, (a) is a plan view of the upper metal layer, (b) is an XB-XB cross-sectional view of the upper metal layer, (c) is a top view of a lower metal layer, (d) is XD-XD cross-sectional view of a lower metal layer.

11 is a view showing the alignment relationship between the slits of the metal layer of the metal card having a non-contact card function according to the second embodiment of the present invention, (a) is a horizontal alignment relationship of the upper and lower metal layers, (b) / Shows the vertical alignment of the bottom metal layer.

Fig. 12 is a cross-sectional view of a detached state of a metal card having a contactless card function according to a second embodiment of the present invention.

Fig. 13 is a cross sectional view of a combined state of a metal card having a contactless card function according to a second embodiment of the present invention, (a) is a cross sectional view of a partially engaged state, and (b) is a cross sectional view of an entire engaged state.

Fig. 14 is a bottom view of the lower side of a metal card having a contactless card function according to a second embodiment of the present invention.

FIG. 15 is a view showing the structure of a metal layer of a metal card having a non-contact card function according to a third embodiment of the present invention, (a) is a plan view of the metal layer, and (b) is an XVB-XVB line of the metal layer in which the injection molding is inserted (C) is a XVC-XVC line longitudinal cross-sectional view of a metal layer, (d) is a top view of an injection molding.

Fig. 16 is a detailed view of an injection molded product of a metal card having a contactless card function according to the third embodiment of the present invention, (a) is a plan view, (b) is a front view, and (c) is a left side view.

Fig. 17 is a perspective view of a detached state of a metal card having a contactless card function according to the third embodiment of the present invention.

Fig. 18 is a perspective view of a detached state of a metal card having a contactless card function according to a modification of the third embodiment of the present invention.

Fig. 19 is a partial detailed view of an antenna portion of a metal card having a contactless card function according to a third embodiment of the present invention, (a) is a plan view in a coupled state, (b) is a sectional view taken along line BB, and (c) is a CC Line section.

Fig. 20 is an assembly view of a metal card having a contactless card function according to the third embodiment of the present invention, (a) is a bottom view of the metal layer, (b) is a sectional view of the IIXB-IIXB line, and (c) is an IIXC- Sectional drawing of line IIXC, (d) is a bottom view of an inlay seated.

Fig. 21 is a perspective view of a detached state of a metal card having a contactless card function according to the fourth embodiment of the present invention.

Fig. 22 is a cross sectional view of a combined state of a metal card having a contactless card function according to the fourth embodiment of the present invention, (a) is a sectional view of a partially engaged state, and (b) is a sectional view of an entire engaged state.

Fig. 23 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function with a contactless card function according to the fourth embodiment of the present invention.

24 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function having a contactless card function according to the fifth embodiment of the present invention.

25 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function having a contactless card function according to the sixth embodiment of the present invention.

26A and 26B are top and bottom views, respectively, of a separated state of a metal plate assembly used for a metal card having a contactless card function according to the seventh embodiment of the present invention.

27A and 27B are top and bottom views, respectively, of a separated state of a metal plate assembly used for a metal card having a contactless card function according to the seventh embodiment of the present invention.

28A and 28B are side views and partially enlarged views, respectively, of a detached state of a metal plate assembly used in a metal card having a contactless card function according to the seventh embodiment of the present invention;

29A to 29C are top and bottom side photographs during the joining of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.

30A and 30B are top and bottom side photographs of the assembled state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.

31A and 31B are top and bottom views of the assembled state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively.

Hereinafter, a metal card having a contactless card function and a method of manufacturing the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In this specification, the examples and embodiments to be described below are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein but is to be practiced with substitutions and equivalents within the scope and equivalents of the appended claims. Yes, it can be changed.

(First embodiment)

First, a metal card having a contactless card function according to the first embodiment of the present invention will be described with reference to FIGS. 5 to 9D.

5 is a view showing the structure of the metal layer and the inlay structure of the metal card having a contactless card function according to the first embodiment of the present invention, (a) is a plan view of the metal layer, (b) is a VB-VB line of the metal layer (C) is a longitudinal cross-sectional view of the VC-VC line of the metal layer, (d) is a plan view of the inlay, and FIG. 6 is a cross-sectional view of the detached state of the metal card having a contactless card function according to the first embodiment of the present invention, Fig. 7 is a cross sectional view of a combined state of a metal card having a contactless card function according to the first embodiment of the present invention, (a) is a cross sectional view of a partially engaged state, and (b) is a sectional view of an entire engaged state.

8 is an actual photograph of an inlay of a metal card having a contactless card function according to the first embodiment of the present invention, (a) is a photograph of the upper surface, (b) is a photograph of the lower surface, and FIGS. 9A to 9D , Is a real picture showing the manufacturing steps of a metal card having a contactless card function according to the first embodiment of the present invention.

In the metal card having the non-contact card function according to the first embodiment of the present invention, as shown in FIG. 6, the PVC layer 60 as the second layer is padded under the metal layer 10 as the first layer. The PVC layer as the second layer is not necessarily limited to this, but may be another synthetic resin layer or even a layer of other non-conductive material having properties similar to those of the synthetic resin. In addition, the synthetic resin layer, such as the PVC layer may be directly laminated on the metal layer by heat compression, or may be laminated through a separate adhesive therebetween.

In the metal layer 10 as the first layer, as shown in (a) to (c) of FIG. 5, a chip module through hole 12 into which the RFIC chip module 20 can be inserted is drilled on one side thereof. The inlay seating groove 11 may be formed on the outer circumference of the chip module through hole 12 to allow the inlay 40 to be seated.

Most importantly, as shown in (a) and (c) of FIG. 5, the slit 15 is formed to allow the chip module through hole 12 to be opened to the outside. In general, it was confirmed that it had sufficient radial characteristics to be more than 0.1 mm. In other words, if the width of the slit is too wide, the bending strength of the metal layer is deteriorated, so it is preferable to form a narrow one, and if too narrow, the radiation property is deteriorated, so that it is preferably about 0.1 to 3 mm, more preferably 1 to 2 mm. It is good to be. In FIG. 5A, the dotted line indicated by the member number 13 indicates the protrusion 22 of the chip module 20, and the member numbers 14 and 14 'indicate both connection terminals of the chip module. will be. Wherever the slit is formed anywhere in the metal layer 10, the chip module through hole 12 is to be opened to the outside so that the conductivity of the metal layer in the slit portion may be disconnected, but less than 0.1mm function of the capacitor element In this case, it is not preferable, and if possible, it is preferable to install at a position where the width of the chip module through-hole 12 and the edge of the metal layer 10 is short so that the length of the slit can be reduced.

On the other hand, as shown in FIGS. 5D and 8, the inlay 40 has a winding 42 as an antenna wound in a coil shape and is electrically connected to the terminals 14 and 14 'of the chip module. Inlay terminals 41 and 41 'are provided, which will be described later.

Thus, as shown in FIGS. 5A and 5D, the inlay in FIG. 5D is moved to the inlay seating groove 11 of the metal layer 10 in FIG. 5A in the direction of the arrow. While seated, the terminals 14 and 14 'of the chip module and the inlay terminals 41 and 41' are electrically connected to each other.

6 and 7, the PVC thin film 50 is placed at the portion where the inlay 40 on the PVC layer 60 is positioned, and the inlay 40 is again placed thereon. ) And the metal layer 10 is placed on the inlay seating groove 11 thereon. In this embodiment, compared with the second embodiment to be described later, the PVC thin film 50 is not necessarily required, but was used for the purpose of matching the thickness of each layer and protecting the inlay.

Subsequently, through the chip module through hole 12 of the metal layer 10, a square loop-shaped chip segment coupling PVC segment 30 is inserted, and a conductive adhesive or conductive solder is applied to the

terminals

41 and 41 ′ of the inlay. As such, the conductive material 35 as the connecting means is buried (or the conductive material may be buried in the terminals 14 and 14 'of the chip module) and the chip module 20 is matched therefor.

Finally, the PVC insert 90 made of a non-conductive material for slit 15 of the metal layer 10 is inserted into the slit 15. Final hot pressing is a conventional technique, so detailed description thereof will be omitted.

For reference, the thickness of each component is variable depending on the situation, but for example, when the total thickness of the card is 0.84 ± 0.04mm, the thickness of the metal layer 10 is 0.6mm, the PVC layer 60 is 0.24mm ( When using a separate adhesive layer 0.2mm), the depth of the inlay seating groove 11 is 0.24mm, the inlay 40 is 0.04mm, the PVC thin film is 0.15mm, the chip module through hole 12 A depth of 0.36 mm is suitable. Of course, the present invention is not limited thereto, and the PVC thin film, the PVC fragment, or the PVC insert also serves to fill a gap between the hard parts, so that some tolerance must be provided. In addition, the PVC thin film or PVC fragments are not necessarily limited to PVC, but may be made of other synthetic resins such as PET or PC, or other non-conductive materials having a similar function.

Referring now to FIG. 8, with reference to the inlay 40, the

electrodes

41, 41 ′ of the inlay are located at positions of the

terminals

14, 14 ′ of the chip module on at least an upper side of the inlay 40. ) Is formed, and a winding 42 is wound around the electrode to serve as an antenna. Of course, the antenna is not necessarily wound with a winding, but may be printed or etched in a pattern, or may be attached to a copper foil or other conductive thin film.

In this embodiment, since the length of the antenna is longer than the size of the inlay, the electrodes 41 and 41 'are formed on both sides such that both electrodes 41 and 41' penetrate the FPCB substrate of the inlay. The first winding 42 is wound in a clockwise direction along the upper side of the first electrode 41 (see FIG. 8A), and is connected to the lower side through the via hole 43, and again counterclockwise. After the second winding 42 'is wound by an appropriate length (clockwise when viewed from above), it is connected to the second electrode 41' (see Fig. 8B).

On the other hand, as shown in Figure 8 (a), a portion of the first winding 42 of the upper surface of the inlay 40 is formed of a wide portion 42a, as shown in Figure 8 (b), A plurality of island-shaped islands 44 and 44 'are formed at a corresponding portion (below the wide portion 42a) of the second winding 42' below the inlay 40 at a corresponding position. Some of the capacitors may be connected in parallel with the second winding 42 'to form a capacitor with the wider portion 42a, and others may be blocked to adjust the overall capacitance value, thereby facilitating impedance matching.

9A to 9D, a method of manufacturing a metal card 100 having a contactless card function according to a preferred embodiment of the present invention will be described.

First, the metal layer 10 of the metal card having the non-contact card function of the present invention is cut out. Preferably, an appropriate surface treatment such as anodizing the surface is performed (see FIG. 9A).

Now, as shown in Figure 6 and 7 (a), on the PVC layer 60, such as PVC thin film 50, inlay 40, metal layer 10, PVC slice 30, chip module After stacking the dummy chip 20 'and the PVC insert 90 having a shape, lamination is performed by a method such as hot pressing (see Fig. 9B).

Subsequently, the dummy chip 20 'is removed again, and the chip module 20 is mounted in place, using the conductive material 35 at the positions of the terminals, so that the electrical connection is made (see FIG. 9C). In this case, the electrical connection may be performed using a bonding method using conductive glue, solder, or the initiator of Patent No. 1073440.

9C is a top side photograph of a metal card having a contactless card function according to a first embodiment of the present invention, and FIG. 9D is a bottom view of a metal card having a contactless card function according to a first embodiment of the present invention. Side picture. As shown in Fig. 9D, the magnet strip 62, the signature portion 63 and the hologram portion 64 are formed on the surface of the PVC layer 60, which is the back side of the card, in the manner of a conventional plastic card.

On the other hand, as a modification to the first embodiment, the insert to be inserted into the slit is not manufactured separately and inserted in advance, in the form of the plastic processing or non-conductive material is filled with any non-conductive material in the finishing step It may be done.

(2nd Example)

Next, a metal card having a contactless card function according to the second embodiment of the present invention will be described with reference to FIGS.

10 is a view showing the structure of a metal layer of a metal card having a contactless card function according to a second embodiment of the present invention, (a) is a plan view of the upper metal layer, (b) is an XB-XB cross-sectional view of the upper metal layer, (c) is a plan view of the lower metal layer, (d) is a cross sectional view taken along the XD-XD line of the lower metal layer, and FIG. 11 shows the alignment relationship between the slits of the metal layers of the metal card having the contactless card function according to the second embodiment of the present invention. As shown, (a) shows the horizontal alignment of the upper and lower metal layers, and (b) shows the vertical alignment of the upper and lower metal layers.

12 is a cross-sectional view of a detached state of a metal card having a contactless card function according to a second embodiment of the present invention, and FIG. 13 is a cross-sectional view of an engaged state of a metal card having a contactless card function according to a second embodiment of the present invention. (A) is a sectional view of a partly engaged state, (b) is a sectional view of an overall engaged state, and FIG. 14 is a bottom view of the lower side of a metal card having a contactless card function according to a second embodiment of the present invention. to be.

The difference between the second embodiment and the first embodiment is that in the case of the first embodiment, the upper layer is formed of a metal layer and the lower layer is formed of a PVC layer. Therefore, it can be more faithful to the function of the metal card.

First, referring to FIGS. 10A and 10B, the upper metal layer 10 will be described, which is the same as the metal layer 10 of the first embodiment of FIG. 5. However, since the first and second metal layers 10 and 80 of the upper and lower layers are both metal layers, it is preferable that only the thickness of the first metal layer 10 is 0.4 mm so that the thicknesses of both metal layers are the same. Therefore, as shown in (b) of FIG. 10 along the XB-XB line of FIG. 10 (a), the depth of the inlay seating groove 11 is milled to about 0.04 mm, which is the thickness of the inlay 40. .

Next, referring to (c) and (d) of FIG. 10, the lower metal layer 80 will be described. As described above, the thickness is about 0.4 mm thicker than that of the PVC layer 60 of the first embodiment of FIG. 5. Instead, the chip protrusion mounting groove 81 is milled to a depth of about 0.2 mm so that the chip protrusion 22 of the chip module 20 is seated therein. On the other hand, the second metal layer 80, which is the lower metal layer, should also be formed with the same second slit 85 at a position corresponding to the first slit 15 of the first metal layer 10.

However, as shown in FIG. 11, when the first slit 15 and the second slit 85 are formed at exactly the same positions, only a portion thereof is punctured and the PVC insert to be inserted therebetween ( 90: there may be a durability problem due to the possibility of departure (see FIG. 12), more preferably formed to shift slightly in the width direction (in the vertical direction in Figure 11 (a)), but in this case also the first And the slit width d of both the second metal layers 10 and 80 is preferably 0.1 mm or more. Thus, the cross section of the slit is crank-formed, and the cross-sectional shape of the PVC insert 90 to be inserted therein also has a crank shape, so that the PVC insert does not easily leave the slit after card completion.

12 and 13, in the second embodiment, since the upper and lower layers are both metal layers, the connection layer 70 must be formed between the two metal layers. The connection layer may be laminated by hot pressing after inserting a synthetic resin thin film (sheet) such as thin PVC, or may be bonded using a separate adhesive.

For reference, the chip protrusion 22 may be directly seated in the chip protrusion mounting recess 81 of the second metal layer 80, but more preferably, the chip protrusion mounting recess 81 may be used for buffering. The PVC thin film 50 'may be seated thereon, and the chip protrusion 22 may be seated on the groove formed in the PVC thin film 50'.

In addition, in this second embodiment, as shown in Fig. 14A, the magnet strip 82, the signature portion 83, such as a conventional plastic card, is placed on the lower side of the card, which is outside of the second metal layer 80. And the hologram portion 84, as shown in (b) of FIG. 14, the magnet strip 82, the signature portion 83 and the hologram portion at a suitable depth on the outer surface of the second metal layer 80). The

grooves

82, 83, and 84 having a depth of about 0.15 mm are formed in the desired size and position so as to form the 84, and the necessary functions are formed in the grooves.

Since the rest is the same as in the first embodiment, detailed description thereof will be omitted.

Meanwhile, referring to FIGS. 12 to 14, the method of assembling the metal card having the non-contact card function according to the second embodiment will be described. The PVC thin film 50 ′ may be formed in the chip protrusion mounting recess 81 on the second metal layer 80. ), And in order to stack the connection layer 70, inlay 40, PVC insert 90, metal layer 10, PVC slice 30, and dummy chip 20 ', The dummy chips 20 'are stacked while the chip protrusions 22 of the dummy chips 20' are seated in the grooves formed in the thin film 50 ', and laminated together by a method such as hot pressing. The rest of the process is the same as the manufacturing method of the first embodiment.

If the mold of the PVC insert 90 is complicated, the rod-shaped PVC insert 90 of the first embodiment is attached to the slit 85 of the second metal layer 80 and the slit 15 of the first metal layer 10. The rod-shaped PVC inserts 90 of the first embodiment may be respectively inserted, and the sheets may be laminated by heating and pressing them. In this case, the manufacturing process may be simplified, but for durability, the cross section is crank-shaped as described above. It is preferred to use an integral PVC insert 90.

(Third Embodiment)

Now finally, a metal card having a contactless card function according to the third embodiment of the present invention will be described with reference to Figs.

FIG. 15 is a view showing the structure of a metal layer of a metal card having a non-contact card function according to a third embodiment of the present invention, (a) is a plan view of the metal layer, and (b) is an XVB-XVB line of the metal layer in which the injection is injected (C) is a longitudinal cross-sectional view of the XVC-XVC line of the metal layer, (d) is a plan view of the injection molding, and FIG. 16 is a detail view of the injection molding of the metal card having a contactless card function according to the third embodiment of the present invention. (a) is a top view, (b) is a front view, (c) is a left side view.

Fig. 17 is a perspective view of a detached state of a metal card having a contactless card function according to a third embodiment of the present invention, and Fig. 19 is a part of an antenna portion of a metal card having a contactless card function according to a third embodiment of the present invention. As a detailed view, (a) is a plan view of an engaged state, (b) is a sectional view taken along line BB, (c) is a sectional view taken along line CC, and FIG. 20 is a metal card having a contactless card function according to the third embodiment of the present invention. (A) is a bottom view of a metal layer, (b) is a sectional view of the IIXB-IIXB line, (c) is a sectional view of the IIXC-IIXC line, and (d) is a bottom view with the inlay seated.

This third embodiment is similar to the first embodiment, but different in the PVC insert 90 '. That is, since the PVC insert 90 of the first embodiment is a straight bar, there is a possibility that the slit 15 of the metal layer 10 is separated when the card is severely bent, so that it is detached. In contrast, the PVC insert 90 'of the third embodiment has a rod-shaped body (like the slit 15 of the metal layer 10 of the first embodiment, as shown in Figs. 15 (d) and 16). 90a) has a left and right wing (90b), the thickness of the left and right wing (90b) is relatively lower than the thickness of the body portion (90a).

Therefore, the slit 15 'of the metal layer 10' of the third embodiment also has an upper side (a portion corresponding to the chip module insertion hole 12) as shown in Figs. 15B and 15C. The narrow part 15a and the extension part 15b of the lower side (part corresponding to the inlay seating groove 11) are processed stepwise, and the body 90a and the wing of the slit 15 'of this embodiment are respectively It should be machined to correspond to 90b.

For reference, the specific shape of the slit 15 'of the metal layer 10' of the third embodiment, as shown in Figure 16, the length of the body 90a is the chip module insertion hole 12 at the left edge of the metal layer Length), the thickness is about 0.36mm corresponding to the depth of the chip module insertion hole 12, and the width is preferably at least 0.1mm, the length of the wing (90b) is the inlay seating groove ( 11), the thickness is preferably about 0.24mm corresponding to the depth of the inlay seating groove (11). Thus, as shown in FIG. 8, an antenna 42 is formed along the edge of the inlay 40, and as shown in FIGS. 7, 10-13, and 15-17, the projection is orthogonal from above. At this time, part or all of the coil shape of the slit (insert) side of the coil of the antenna formed in the inlay 40 is placed outside the inlay (Fig. 5, 10 and 15) It is formed between the left end of the groove 11 and the left end of the chip module through hole 12, that is, between the right end of the wing 90b and the right end of the body 90a in FIG.

However, as long as the technical concept of the stepped slit 15 'in the third embodiment takes the form of upper narrower_lower broader to prevent deviation from the outside (i.e., upward), The boundary between the body and the wing does not necessarily have to be stepped, but may be made of an oblique plane, a curved surface, or a combination thereof.

Meanwhile, FIG. 17, which is an exploded perspective view of the third embodiment, corresponds to FIG. 6, which is a cross-sectional view of the separated state of the first embodiment. The difference is that the PVC insert 90 is placed on the inlay 40 in the third embodiment. Is stacked first, and then the metal layer 10 'must be laminated.

That is, referring to FIGS. 17, 19, and 20, the method of assembling the metal card having the non-contact card function according to the third embodiment will be described. On the PVC layer 60, the PVC thin film 50 and the inlay 40 are described. ), The PVC insert 90 ', the metal layer 10', the PVC segment 30, and the dummy chip 20 'are sequentially laminated, and then laminated by a method such as hot pressing. The rest of the process is the same as the manufacturing method of the first embodiment.

In FIG. 20, (a) is a bottom view of the metal layer 10 'viewed from below, (b) is a sectional view of the IIXB-IIXB line, and (c) is a sectional view of the IIXC-IIXC line. It is also possible to temporarily join the PVC insert 90 'and the inlay 40 in a stacked state (see FIG. 20 (d)), and invert it to be laminated with the PVC layer 60.

(Modification of the third embodiment)

18 is a perspective view of a detached state of a metal card having a contactless card function according to a modification of the third embodiment of the present invention.

The difference from the above-described third embodiment is that in the PVC insert 90 ", as shown in Fig. 18, wings 90b are formed on both sides of the rod-shaped main body 90a so that By integrally forming and manufacturing the PVC insert of the third embodiment and the thin film portion 90c corresponding to the PVC thin film inserted into the lower portion of the inlay 40, the firmness and durability are improved.

However, in the case of the PVC insert (90 ") of the modification there is a disadvantage that the mold can be complicated.

(Example 4)

Now, a fourth embodiment of a metal card having a contactless card function according to the present invention will be described with reference to Figs.

21 is a perspective view of a detached state of a metal card having a contactless card function according to a fourth embodiment of the present invention, and FIG. 22 is a cross-sectional view of a coupled state of a metal card having a contactless card function according to a fourth embodiment of the present invention. (A) is a sectional view of a partly coupled state, (b) is a sectional view of a full engagement state, and FIG. 23 is used for a metal card having a contactless card function having a contactless card function according to the fourth embodiment of the present invention. Figure showing the metal plate and the PVC insert.

In the metal card having the non-contact card function according to the fourth embodiment of the present invention, as shown in Fig. 21, the PVC layer 260 as the second layer is padded under the metal layer 210 as the first layer. The PVC layer as the second layer is not necessarily limited to this, but may be another synthetic resin layer or even a layer of other non-conductive material having properties similar to those of the synthetic resin. In addition, the synthetic resin layer, such as the PVC layer may be directly laminated on the metal layer by heat compression, or may be laminated through a separate adhesive therebetween. Furthermore, when forming a slit (85 of FIG. 11) also in the said 2nd layer 260 like FIG. 11, a 2nd layer may also be a metal layer.

In the metal layer 10 serving as the first layer, as illustrated in FIG. 21, a chip module insertion hole 212 into which the RFIC chip module 20 can be inserted is drilled on one side thereof, and the chip module insertion hole 212 is formed. Inlay seating grooves (211 of FIG. 21) are formed on which outer inlays 40 may be seated.

Most importantly, as shown in FIG. 21, the slit 215 is formed to allow the chip module insertion hole 212 to be opened to the outside. It was found to have a radiation characteristic. In other words, if the width of the slit is too wide, the bending strength of the metal layer is deteriorated, so it is preferable to form a narrow one, and if too narrow, the radiation property is deteriorated, so that it is preferably about 0.1 to 3 mm, more preferably 1 to 2 mm. It is good to be.

Wherever the slit is formed anywhere in the metal layer 210, the chip module insertion hole 212 is to be opened to the outside so that the conductivity of the metal layer in the slit portion may be disconnected, but less than 0.1mm function of the capacitor element This is not desirable, and it is preferable to install the chip module insertion hole 212 and the edge portion of the metal layer 210 at a short width where possible to reduce the length of the slit.

However, in the present invention, as shown in FIG. 21, there is a difference in that the auxiliary hole 215 'is formed at the left, right, or left and right sides in contact with or spaced from the slit 215. The auxiliary hole 215 ′ is preferably formed to be symmetrical, and more preferably, spaced apart from the slit 215.

On the other hand, the chip module 20 or the protrusion 22 of the chip module 20, both connecting terminals 14, 14 'of the chip module, inlay 40 or inlay mounting groove (see 11 in Fig. 5), etc. It may be the same as those of the prior application which concerns on this invention of FIG.

21 to 23, the inlay 40 also has a winding (42 in FIG. 5) as an antenna wound in a coil shape and electrically connected to the terminals 14 and 14 'of the chip module. The inlay terminals 41 and 41 'have an inlay 40, and the inlay 40 is seated in the inlay seating groove 211 of the metal layer 210, thereby providing the

terminals

214 and 214 ′ of the chip module and the

inlay terminals

41, 41. 41 ') are each electrically connected.

The coupling relationship of these components is also similar to that of FIGS. 6 and 7, as shown in FIG. 23, where the PVC thin film 250 is placed in the portion where the inlay 40 on the PVC layer 260 is located, and again above it. The inlay 40 is positioned, and the metal layer 210 is placed on the inlay seating groove 211. In the fourth embodiment, compared to the fifth embodiment to be described later, one side of the PVC thin film 250 has a protrusion 250a, and the slit 215 and the auxiliary hole 215 on the protrusion. ') Is positioned so that the protrusion 250a of the PVC thin film 250, the slit 215 and the auxiliary hole 215' are integrally bonded at the time of card bonding. Thus, upon complete assembly of the card, the assembly of the integrally bonded PVC thin film 250, the protrusion 250a, the slit 215 and the auxiliary hole 215 'prevents the card from bending.

Subsequently, through the chip module insertion hole 212 of the metal layer 210, a square loop-shaped chip segment coupling PVC segment 30 is inserted, and a conductive adhesive or conductive solder is formed on the terminals 41 and 41 'of the inlay. As such, the conductive material 35 as the connecting means may be buried (or the conductive material may be buried in the terminals 214 and 214 'of the chip module) and the chip module 20 is matched therefor.

Finally, a PVC insert 290 of a non-conductive material for forming the slits 215 and the left and right auxiliary holes 215 'of the metal layer 210 is formed in the slits 215 and the left and right auxiliary holes 215'. The non-conductive material PVC insert 290 includes a main body 290a to be inserted into the slit 215 and a left and right auxiliary insert 290b to be inserted into the left and right auxiliary holes 215 '. do. Final hot pressing is a conventional technique, so detailed description thereof will be omitted. However, the insert 290 and the left and right auxiliary inserts 290b are not necessarily non-conductive, and in the proximity, a conductive material such as a metal may be a metal having lower electrical conductivity than copper. When the electrical conductivity is higher than that of copper, considerable electricity is conducted to both ends of the slit, so that magnetic fluxes in opposite directions are generated in the vicinity of the slit, and thus the magnetic fluxes cancel each other, making it difficult to achieve a contactless card function. In addition, even if the above conditions are met, ferromagnetic materials, such as iron, are not suitable. Of course, the ferromagnetic materials will have a magnetic field remaining upon the extinction of the flux during wireless communication and will affect the fluxes generated afterwards. In consideration of the strength and all the above conditions, aluminum and their alloys are particularly preferred.

For reference, the thickness of each component is variable depending on the situation, but for example, when the total thickness of the card is 0.84 ± 0.04mm, the thickness of the metal layer 210 is 0.6mm, the PVC layer 260 is 0.24mm ( When using a separate adhesive layer 0.2mm), the depth of the inlay seating groove 211 is 0.24mm, the inlay 40 is 0.04mm, the PVC thin film 250 is 0.15mm, the chip module insertion hole ( The depth of 212) is suitably 0.36 mm. Of course, the present invention is not limited thereto, and the PVC thin film, the PVC fragment, or the PVC insert also serves to fill a gap between the hard parts, so that some tolerance must be provided. In addition, the PVC thin film or PVC fragments are not necessarily limited to PVC, but may be made of other synthetic resins such as PET or PC, or other non-conductive materials having a similar function.

As described above with reference to FIG. 8, the inlay 40 also has

electrodes

41, 41 ′ of the inlay at positions of

terminals

14, 14 ′ of the chip module on at least an upper side of the inlay 40. Is formed, and the winding 42 which serves as an antenna while connecting both electrodes is wound. Of course, the antenna is not necessarily wound with a winding, but may be printed or etched in a pattern, or may be attached to a copper foil or other conductive thin film.

21 to 23, a method of manufacturing a metal card 200 having a contactless card function according to the fourth embodiment of the present invention will be described.

First, the metal layer 210 of the metal card having the non-contact card function of the present invention is cut. Preferably, an appropriate surface treatment such as anodizing the surface is performed (see FIGS. 9A and 23).

Now, as shown in Figure 22 (a), on the PVC layer 260, the PVC thin film 250, the inlay 40, the metal layer 210, the PVC fragment 30, a pile of the same shape as the chip module After stacking the chip 20 'and the PVC insert 290 (in this case, the main body 290a and the left and right auxiliary inserts 290b of the PVC insert 290, respectively, the slit 215 and the The left and right auxiliary holes 215 '), and heat-bonding to perform lamination (see FIG. 9B). Then, the dummy chip 20' is removed again and the chip module 20 is replaced. To be mounted, using the conductive material 35 in the position of each terminal of the chip module 20, the electrical connection is made (see Fig. 9c). In this case, the electrical connection may be performed using a bonding method using conductive glue, solder, or the initiator of Patent No. 1073440.

Fig. 22 (b) similar to Fig. 9c is a cross-sectional view of a metal card having a contactless card function according to the fourth embodiment of the present invention completed. As in FIG. 9D, the magnet strip 62, the signature portion 63 and the hologram portion 64 are formed on the surface of the PVC layer 60, which is the back side of the card, in the manner of a conventional plastic card.

On the other hand, as a modification to the fourth embodiment, the insert to be inserted into the slit is not prepared separately and inserted in advance, in the form of the plastic processing or the non-conductive material is filled with any non-conductive material in the finishing step It may be done.

Thus, according to the present invention, in addition to the main body 290a of the PVC insert 290 inserted into the slit 215, the left and right auxiliary inserts 290b, respectively, the left and right auxiliary holes of the slit 215 ( 215 ′) and integrally coupled to each other, the maximum amount of bending of the card due to the slit 215 formed on one side of the metal layer 210 is minimized, and at the same time, the PVC insert 290 filling the slit 215 is filled. This can prevent the escape of the maximum, a metal card with a more stable contactless card function is possible.

(Fifth Embodiment and Sixth Embodiment)

On the other hand, a metal card having a contactless card function according to the fifth and sixth embodiments of the present invention will be described with reference to Figs.

FIG. 24 is a view showing a metal plate and a PVC insert used in a metal card having a contactless card function with a contactless card function according to a fifth embodiment of the present invention, and FIG. 25 is a contactless type according to a sixth embodiment of the present invention. Figure shows a metal plate and a PVC insert used in a metal card having a contactless card function with a card function.

The difference between the fifth and sixth embodiments and the fourth embodiment is that, in the fourth embodiment, the slit 215 and the left and right auxiliary holes 215 'are spaced apart and the PVC insert 290 inserted therein as well. Although the main body 290a and the left and right auxiliary inserts 290b are integrally coupled through the PVC thin film 250, in the fifth and sixth embodiments, the slit 215 and the left and right auxiliary holes ( 215 ') is in contact with each other, and the main body 290a and the left and right auxiliary inserts 290b of the PVC insert 290 inserted therein are directly contacted and integrated.

In the fifth embodiment, as shown in FIG. 24, the left and right auxiliary holes 215 ′ are formed in contact with the center left and right of the slit 215. In the sixth embodiment, as shown in FIG. 25, the left and right auxiliary holes 215 ′ are formed. Auxiliary holes 215 'are formed in contact with the left and right at both ends of the slit 215. As a result, in the case of the fifth and sixth embodiments, a wide portion appears at the center and at both ends of the slit 215, and the PVC insert 290 also appears as a wide portion at the corresponding portion.

In any case, the main body 290a and the left and right auxiliary inserts 290b of the PVC insert 290 are inserted into the slit 215 and the left and right auxiliary holes 215 ', and at the same time, the PVC thin film 250 Since it is combined integrally with the), the maximum bending of the card due to the slit 215 formed on one side of the metal layer 210, while suppressing the separation of the PVC insert 290 filled with the slit 215 at the same time. This can be prevented as much as possible.

In the case of the fifth and sixth embodiments, as in the technique of the first to third embodiments, various modifications are possible, and the lower layer (second layer) may be a metal layer instead of a PVC layer, as described above. 10, (a) and (b), those skilled in the art can easily reproduce.

(Example 7)

Now, a seventh embodiment of a metal card having a contactless card function according to the present invention will be described with reference to Figs. 26A to 26B.

26A and 26B are planar and bottom photographs of the detached state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively, and FIGS. 27A and 27B are the present invention, respectively. Plan view and bottom view of a detached state of a metal plate assembly used in a metal card having a contactless card function according to a seventh embodiment of FIGS. 28A and 28B are contactless card functions according to the seventh embodiment of the present invention, respectively. Side view and a partially enlarged view of a detached state of a metal plate assembly used for a metal card having a metal plate, and FIGS. 29A to 29C are each a metal plate assembly used for a metal card having a contactless card function according to the seventh embodiment of the present invention. Is a top side photograph and a bottom side photograph during the coupling of FIGS. 30A and 30B are used for a metal card having a contactless card function according to the seventh embodiment of the present invention, respectively. Top and bottom side photographs of the assembled state of the metal plate assembly, and FIGS. 31A and 31B are plan views of the assembled state of the metal plate assembly used for the metal card having the contactless card function according to the seventh embodiment of the present invention, respectively. And bottom view.

In the metal card having the contactless card function according to the seventh embodiment of the present invention, as shown in FIGS. 26A to 27B, the RFIC chip module 20 is inserted into the lower side of a single metal plate 1 having a general card thickness. The chip module insertion hole 12 is drilled, and an inlay seating groove 11 is formed on the outer circumference of the chip module insertion hole 12 in which a slightly larger inlay 40 may be seated. Grooves are formed on the upper side of the metal plate 1 by milling, etc., on the site where the card logo enters. Similarly, grooves by milling, etc., are also formed on the other side of the metal plate, such as magnets or signatures, in advance. The surface is subjected to other suitable surface treatment such as anodizing or coating.

Most importantly, as shown in the drawings, the slit 15 for opening the chip module insertion hole 12 to the outside should be formed, there is a difference depending on the situation, but the width is generally more than 0.1 mm It was confirmed that it had sufficient radiation characteristics. In other words, if the width of the slit is too wide, the bending strength of the metal layer is deteriorated, so it is preferable to form a narrow one, and if too narrow, the radiation property is deteriorated, so that it is preferably about 0.1 to 3 mm, more preferably 1 to 2 mm. It is good to be.

Wherever the slit is formed anywhere in the metal plate 1, the chip module insertion hole 12 is to be opened to the outside so that the conductivity of the metal layer in the slit portion may be disconnected, but less than 0.1mm function of the capacitor element In this case, it is not preferable, and if possible, it is preferable to install at a position where the width of the chip module insertion hole 12 and the edge of the metal plate 1 is short so that the length of the slit can be reduced.

In particular, in the present embodiment, as shown in Figs. 28A and 28B, sliding

grooves

15a and 15b having cross-sections of 'c'-shaped,' v'-shaped, semi-circular or other arcs on both sides of the slit 15 are shown. It is formed long in the longitudinal direction of this slit. Therefore, the cross section of the side wall of the slit is made of 'Ω' type or 'U' type, not straight. Again, preferably, it is desirable to be formed symmetrically.

In addition, the insert 9 is inserted into the slit, as shown in Figure 29a to 29c, the sliding groove (left and right sides of the left-right side of the main body 9a is inserted into the center of the slit and inserted into the inlay crimping groove ( And insert

sliders

9b and 9b 'coupled with 15a and 15b. However, since the object of the present invention is that the insert 9 is firmly fitted and coupled to the slit 15, in fact, the size of the cross section of the

insert sliders

9b, 9b 'is such that the sliding groove 15a, Slightly larger than the size of the groove of 15b), it is desirable to be interference fit.

Thus, as shown in Figs. 29A to 29C, the size of the

insert sliders

9b and 9b 'on the cross section is pressed into the sliding

grooves

15a and 15b, and the insert 9 is moved to the slit ( 15), the metal plate assembly used for the metal card having the contactless card function with the reinforced strength according to the present invention is completed.

For reference, the material of the insert 9 preferably has a certain strength or more, since the insert 9 itself must have a certain degree of strength to ensure the strength of the entire metal card.

Therefore, a material having a certain strength of a non-conductive material such as ceramic may be used. For example, even a conductive material such as a metal may be a metal having a lower electrical conductivity than copper. When the electrical conductivity is higher than that of copper, considerable electricity is conducted to both ends of the slit 15 so that magnetic fluxes in opposite directions are generated in the vicinity of the slit, and thus the magnetic fluxes cancel each other, making it difficult to achieve a contactless card function. In addition, even if the above conditions are met, ferromagnetic materials, such as iron, are not suitable. Of course, the ferromagnetic materials will have a magnetic field remaining upon the extinction of the flux during wireless communication and will affect the fluxes generated afterwards. In consideration of the strength and all the above conditions, aluminum and their alloys are particularly preferred.

Also, the inlay 40 also includes an inlay terminal 41, 41 'wound as a coil (42 in FIG. 5) wound in a coil shape and electrically connected to the terminals 14, 14' of the chip module. As the inlay 40 is seated in the inlay seating groove 11 of the metal plate 1, the

terminals

14 and 14 ′ and the

inlay terminals

41 and 41 ′ of the chip module are electrically connected to each other. do.

The coupling relationship of these components is also similar to that of FIGS. 6 and 7, in which the PVC thin film (50 in FIG. 6) is placed in the position where the inlay 40 is located, and again the inlay 40 is placed thereon, The metal plate 1 is placed on the inlay seating groove 11 thereon.

Subsequently, through the chip module insertion hole 12 of the metal plate 1, a square loop-shaped PVC segment coupling 30 is inserted into the chip module, and a conductive adhesive or conductive solder is formed on the terminals 41 and 41 'of the inlay. As such, the conductive material 35 as the connecting means is buried (or the conductive material may be buried in the terminals 14 and 14 'of the chip module) and the chip module 20 is matched therefor. The step of forcing the insert 9 for slit 15 of the metal plate 1 into the slit 15 may be performed at this point.

Finally, the final hot pressing is a conventional technique, so detailed description thereof will be omitted.

For reference, the thickness of each component is variable depending on the situation, but, for example, when the total thickness of the card is 0.84 ± 0.04mm, the thickness of the metal plate 1 is close to this, and the thickness of the inlay seating groove 11 The depth is 0.48mm, the inlay 40 is 0.04mm, the PVC thin film 50 is 0.39mm, the depth of the chip module insertion hole 12 is 0.36mm is suitable. Of course, the present invention is not limited thereto, and the PVC thin film, the PVC fragment, or the PVC insert also serves to fill a gap between the hard parts, so that some tolerance must be provided. In addition, the PVC thin film or PVC fragment is not necessarily limited to PVC, but may be made of other synthetic resins such as PET or PC, or other materials having a similar function.

As described above with reference to FIG. 8, the inlay 40 also has

electrodes

41, 41 ′ of the inlay at positions of

terminals

26A to 31B, a method of manufacturing a metal card having a contactless card function according to the seventh embodiment of the present invention will be described.

First, the metal plate 1 of the metal card having the non-contact card function of the present invention is cut to form a slit 15 or the like. Preferably, an appropriate surface treatment such as anodizing the surface is performed (see FIGS. 9A and 26A to 27B).

Now, as shown in Figs. 28a to 29c, the insert (9) is forcibly fitted to the slit (15) of the metal plate (1). 15a to 31b show a metal plate assembly in which the insert 9 and the metal plate 1 are combined.

Thereafter, as in the first to third embodiments of the present invention, on the auxiliary substrate not shown, the PVC thin film 50, the inlay 40, the metal plate 1, the PVC fragment 30, the chip module and After stacking the dummy chips 20 'of the same shape (the insert 9 may be pressed against the slit 15 at this time), lamination is performed by a method such as hot pressing (see Fig. 9B), Thereafter, the dummy chip 20 'is removed again, and the chip module 20 is mounted in place. Using the conductive material 35 at the positions of the terminals of the chip module 20, the electrical connection is performed. (See FIG. 9C). In this case, the electrical connection may be performed using a bonding method using conductive glue, solder, or the initiator of Patent No. 1073440.

Similarly in FIG. 14, a magnet strip 82, a signature portion 83, and a hologram portion 84, such as a conventional plastic card, should be formed on the lower side of the metal plate 1, the lower side of the metal plate 1.

Grooves

82, 83, 84 approximately 0.15 mm deep, such as by NC machining, at desired sizes and locations, such that magnet strips 82, signatures 83, and holograms 84 are formed at a suitable depth on the sides. And form the necessary function in the groove portion.

Thus, according to this embodiment, the left and right sliding

grooves

15a and 15b and the

sliders

9b and 9b 'are engaged with the insert 9 of a material of similar strength to the slit 15. Therefore, a metal card having a contactless card function made of a manufacturing method thick and solid metal plate is possible.

Also in the present embodiment, as in the first to third embodiments, various modifications are possible, and the metal plate is composed of two layers, and the two layers are formed of two metal plates of the upper layer and the lower layer while laminating them. The sliding groove may be implemented, which can be easily reproduced by those skilled in the art with reference to the embodiments of FIGS. 5 to 20 having two layers as described above, and in this case, the sliding groove is easier to manufacture. something to do. However, the case of implementing a single metal plate to the last will be more preferable in terms of strength.

That is, the present invention has been described above according to an embodiment of the present invention. However, the present invention may be modified and modified by those skilled in the art without departing from the technical spirit of the present invention. Belonging is natural.

Claims

A metal card (100, 100 ', 100 ") having a contactless card function that incorporates one or more chips,

A chip module 20 for performing a contactless card function;

An inlay 40 having an antenna for directly performing contactless communication of the chip module 20;

First metal layers 10 and 10 ′ in which a chip module through hole 12 into which the chip module 20 can be inserted and an inlay seating groove 11 in which the inlay 40 is mounted are formed; And

Second layers 60 and 80 laminated to the lower side of the first metal layer;

Including;

On one side of the first metal layer 10, 10 ′, slits 15, 15 ′ and 85 are formed to open the chip module through hole 12 to the outside, so that the conductivity of the first metal layer in the slit is formed. Will be disconnected,

The inlay 40 has an inlay terminal 41, 41 ′, in which a winding 42 as an antenna is wound in a coil shape, and electrically connected to the terminals 14, 14 ′ of the chip module.

When projected from the orthographic projection from above, part or all of the coil shape of the slit side of the coil of the antenna formed in the inlay 40 has a non-contact card function, characterized in that formed more outward than the chip module 20 Metal card.
The method of claim 1,

The second layer is a metal layer 80,

The slit 15 formed in the first metal layer 10 and the slit 85 formed in the second layer are shifted in the width direction of the slit.
The method of claim 1,

Both electrodes 41 and 41 ′ of the inlay 40 are formed on both sides of the inlay 40 so as to penetrate through the substrate of the inlay, and are formed on the first winding 42 and the lower side of the first electrode 41. The second winding 42 'is a metal card having a contactless card function, characterized in that it is electrically connected through the via hole (43).
The method of claim 1,

In the portion where the inlay 40 on the second layer is located, the PVC thin film 50 is positioned, the inlay 40 is again placed thereon, and the first metal layer is positioned on the inlay seating groove 11 thereon. A metal card having a contactless card function, characterized by laminating (10).
The method of claim 1,

And a insert (90,90 ', 90 ") of non-RF interference material inserted into said slit (15, 15', 85).
The method of claim 5, wherein

The insert 90 'has a shape having a left and right wing 90b on the rod-shaped body 90a, wherein the left and right wings 90b have a shape that is relatively lower than the thickness of the rod-shaped body 90a. And a slit (15 ') of the first metal layer (10') also has a shape corresponding to the insert (90 ').
The method of claim 6,

The insert (90 '), in addition to the rod-shaped body (90a) and left and right wings (90b), a metal card having a contactless card function, characterized in that the thin film portion (90c) of the same material is added.
The method of claim 1,

The first metal layer further includes an auxiliary hole 215 'on at least one side of the slit.

The auxiliary hole is a metal card having a non-contact card function, characterized in that the insertion insert of the non-RF interference material.
The method of claim 8,

Metal having a contactless card function, characterized in that the insert body inserted into the slit and the auxiliary insert inserted into the auxiliary hole are integrally formed by the thin film 250 between the first metal layer and the second layer. Card.
A metal plate for use in a metal card having a contactless card function containing one or more chips,

A chip module insertion hole into which a chip module for performing a contactless card function can be inserted;

An inlay seating groove in which an inlay formed with an antenna for directly performing contactless communication of the chip module may be seated; And

A slit for opening the chip module insertion hole to the outside;

Including;

The metal plate used in the metal card having a non-contact card function, characterized in that the conductivity of the metal plate is cut off or the conductivity is weakened in the slit portion formed on one side of the metal plate.
The method of claim 10,

A metal plate for use in a metal card having a contactless card function, further comprising an auxiliary hole (215 ') on at least one side of the slit.
The method of claim 10,

The side wall of the slit is a metal plate for a metal card having a non-contact card function, characterized in that the left and right sliders into which the insert of the non-RF interference material is inserted into the sliding groove is fitted.
A metal plate of claim 12;

An insert of a non-RF interference material inserted into the slit of the metal plate;

Including,

Metal plate assembly for use in a metal card having a non-contact card function, characterized in that the slider of the slit is fitted in the sliding groove.
A metal plate assembly of claim 13;

A chip module inserted into the chip module insertion hole of the metal plate to perform a contactless card function; And

An inlay seated in an inlay seating groove of the metal plate and having an antenna for directly performing contactless communication of the chip module;

Metal card having a contactless card function, characterized in that it comprises a.
A method of manufacturing a metal card having the contactless card function of claim 1,

Forming the chip module through hole (12) and the inlay seating groove (11) in the first metal layer (10);

After stacking the dummy chips 20 'having the same shape as the inlay 40, the first metal layer 10, and the chip module 20 on the second layers 60 and 80, heat compression, etc. Filling the slit with a non-conductive material while laminating in a method; And

Removing the dummy chip 20 'and mounting the chip module 20 in place;

Method of manufacturing a metal card having a contactless card function, comprising a.