WO2018032795A1 - Laminated cloth for 4g or 5g network circuit board substrate and manufacturing process of same - Google Patents

Laminated cloth for 4g or 5g network circuit board substrate and manufacturing process of same Download PDF

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WO2018032795A1
WO2018032795A1 PCT/CN2017/081251 CN2017081251W WO2018032795A1 WO 2018032795 A1 WO2018032795 A1 WO 2018032795A1 CN 2017081251 W CN2017081251 W CN 2017081251W WO 2018032795 A1 WO2018032795 A1 WO 2018032795A1
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glass fiber
cloth
alkali
laminate
circuit board
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PCT/CN2017/081251
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French (fr)
Chinese (zh)
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赵文杰
赵晖
侯金国
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江苏泰氟隆科技有限公司
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Publication of WO2018032795A1 publication Critical patent/WO2018032795A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/712—Weather resistant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

A laminated cloth for 4G or 5G network circuit board substrate and a manufacturing process of the same, wherein the laminated cloth comprises an alkali-free glass fiber base fabric and a polytetrafluoroethylene coating. Both sides of the alkali-free glass fiber base fabric are covered with polytetrafluoroethylene coating, the polytetrafluoroethylene coating having two or more layers, the thickness of the laminated cloth being between 0.05 mm and 0.15 mm. The manufacturing process of the laminated cloth comprises: (1) fabric dewaxing; (2) low temperature dipped processing; (3) high temperature sintering; and (4) winding to obtain a finished product of polytetrafluoroethylene coated glass fiber laminated cloth.

Description

用于4G或5G网络电路板基材的层压布及其制造工艺Laminate for 4G or 5G network circuit board substrate and manufacturing process thereof 技术领域Technical field
本发明涉及无线通信电路板技术领域，尤其是一种用于4G或5G网络电路板基材的层压布，以及该电路板基材层压布的制造工艺。The present invention relates to the field of wireless communication circuit board technology, and more particularly to a laminate for a 4G or 5G network circuit board substrate, and a manufacturing process of the circuit board substrate laminate.
背景技术Background technique
现有的无线通信网络电路板基材多为具有较好性能的聚酰亚胺或聚酯薄膜片。随着无线通信技术的快速发展，4G网络基站已经逐步遍布全国各地，4G网络收发设备使用的电路板基材不仅要有较高的电性能，而且还要求介电性能稳定，可承受高海拔、高温、高湿度以及海边等气候环境，电路板基材不易老化。目前，聚四氟乙烯(PTFE)材料作为一种新型工程材料，具有高稳定性能、耐气候性良好、介电性能稳定等优异特性，应用十分广泛，经过深入的研究和试验表明，PTFE材料同样也适用于制作与4G或5G网络配套的电路板基材。但是，采用传统工艺制成的聚四氟乙烯基材极易卷曲，不能在生产过程平铺使用，操作不方便，基材损耗多，产品质量也受到较大的影响。Existing wireless communication network circuit board substrates are mostly polyimide or polyester film sheets with better performance. With the rapid development of wireless communication technology, 4G network base stations have gradually spread all over the country. The circuit board substrates used in 4G network transceiver equipment not only have high electrical performance, but also require stable dielectric properties and can withstand high altitude. High temperature, high humidity, and the climatic environment such as the sea, the circuit board substrate is not easy to age. At present, polytetrafluoroethylene (PTFE) material, as a new engineering material, has excellent properties such as high stability, good weather resistance and stable dielectric properties. It is widely used. After intensive research and experiments, PTFE materials are also the same. Also suitable for making circuit board substrates for 4G or 5G networks. However, the polytetrafluoroethylene material produced by the conventional process is extremely easy to curl, cannot be used in the production process, is inconvenient to operate, has a large loss of the substrate, and the product quality is also greatly affected.
发明内容Summary of the invention
本发明的目的是提供一种用于4G或5G网络电路板基材的层压布，以及该电路板基材层压布的制造工艺，能够大幅度提高基材面的平整度，产品不卷曲，用作与4G或5G网络配套的电路板基材，介电性能稳定，耐候性良好，适用于各类环境使用。It is an object of the present invention to provide a laminate for a 4G or 5G network circuit board substrate, and a manufacturing process of the circuit board substrate laminate, which can greatly improve the flatness of the substrate surface without curling the product. It is used as a circuit board substrate for 4G or 5G networks. It has stable dielectric properties and good weather resistance, and is suitable for use in various environments.
本发明的目的是通过采用以下技术方案来实现的：The object of the present invention is achieved by adopting the following technical solutions:
用于4G或5G网络电路板基材的层压布，所述层压布由无碱玻璃纤维基布和聚四氟乙烯涂层构成，所述无碱玻璃纤维基布的两面覆盖有聚四氟乙烯涂层。a laminate for a 4G or 5G network circuit board substrate, the laminate comprising an alkali-free glass fiber-based cloth and a polytetrafluoroethylene coating, the two sides of the alkali-free glass fiber-based cloth being covered with a polytetra Vinyl fluoride coating.
作为本发明的优选技术方案，所述无碱玻璃纤维基布的两面覆盖有两层或两层以上聚四氟乙烯涂层。As a preferred technical solution of the present invention, the two sides of the alkali-free glass fiber-based cloth are covered with two or more layers of polytetrafluoroethylene coating.
作为本发明的优选技术方案，所述层压布包括两层或两层以上无碱玻璃纤维基布，每层玻璃纤维基布的两面均覆盖有聚四氟乙烯涂层。 As a preferred technical solution of the present invention, the laminate comprises two or more layers of alkali-free glass fiber-based cloth, and each side of the glass fiber-based cloth is covered with a polytetrafluoroethylene coating.
作为本发明的优选技术方案，所述无碱玻璃纤维基布的厚度是0.03毫米、0.06毫米或0.095毫米。As a preferred embodiment of the present invention, the alkali-free glass fiber-based cloth has a thickness of 0.03 mm, 0.06 mm or 0.095 mm.
作为本发明的优选技术方案，所述层压布的厚度在0.05毫米至0.15毫米之间。As a preferred embodiment of the present invention, the laminate has a thickness of between 0.05 mm and 0.15 mm.
用于4G或5G网络电路板基材的层压布的制造工艺，包括以下步骤：A manufacturing process for a laminate of a 4G or 5G network circuit board substrate, comprising the steps of:
(1)坯布脱蜡，将无碱玻璃纤维坯布通过脱蜡仓进行脱蜡处理，脱蜡温度分别设置为415℃、395℃、350℃、210℃；(1) dewaxing the fabric, and the alkali-free glass fiber fabric is dewaxed through a dewaxing chamber, and the dewaxing temperatures are respectively set to 415 ° C, 395 ° C, 350 ° C, 210 ° C;
(2)低温浸胶处理，在浸胶机的胶槽中注入聚四氟乙烯(PTFE)乳液，对于玻璃纤维布至少分别进行三次浸胶处理，同时对玻璃纤维布进行烘培，烘培区设置四个温区，四个温区的温度分别设置为265℃、216℃、110℃、35℃；(2) Low temperature dipping treatment, injecting polytetrafluoroethylene (PTFE) emulsion into the glue tank of the dipping machine, performing at least three times of dipping treatment on the glass fiber cloth, and baking the glass fiber cloth at the same time, baking area Set four temperature zones, the temperature of each of the four temperature zones is set to 265 ° C, 216 ° C, 110 ° C, 35 ° C;
(3)高温烧结，将经过浸胶处理的玻璃纤维布输送到烧结区进行高温烧结，烧结区设置四个温区，四个温区的温度分别设置为363℃、285℃、178℃、35℃；(3) High-temperature sintering, the dipped glass fiber cloth is sent to the sintering zone for high-temperature sintering, and four temperature zones are set in the sintering zone. The temperatures of the four temperature zones are set to 363 ° C, 285 ° C, 178 ° C, 35 respectively. °C;
(4)收卷，将经过高温烧结的玻璃纤维布输送经过张力辊张紧，然后输送到收卷辊，收卷后即得到涂覆有聚四氟乙烯涂层的玻璃纤维层压布成品。(4) Winding, the high-temperature sintered glass fiber cloth is conveyed and tensioned by a tension roller, and then conveyed to a winding roller, and after winding, a glass fiber laminated cloth coated with a polytetrafluoroethylene coating is obtained.
作为本发明的优选技术方案，所述步骤(1)玻璃纤维布运转的速度为30米/分钟；所述步骤(4)玻璃纤维布收卷的速度为0.8-0.95米/分钟。As a preferred technical solution of the present invention, the step (1) the operation speed of the glass fiber cloth is 30 m/min; and the speed of the step (4) glass fiber cloth winding is 0.8-0.95 m/min.
作为本发明的优选技术方案，所述步骤(2)三次浸胶处理的PTFE乳液浓度分别是35-45％、45-50％、50-55％。As a preferred technical solution of the present invention, the concentration of the PTFE emulsion of the three steps of the step (2) is 35-45%, 45-50%, 50-55%, respectively.
作为本发明的优选技术方案，所述步骤(1)无碱玻璃纤维坯布的厚度是0.03毫米、0.06毫米或0.095毫米，其宽度相应为900毫米、1050毫米、1270毫米。As a preferred technical solution of the present invention, the thickness of the alkali-free glass fiber blank of the step (1) is 0.03 mm, 0.06 mm or 0.095 mm, and the width thereof is 900 mm, 1050 mm, 1270 mm.
作为本发明的优选技术方案，所述步骤(4)获得的聚四氟乙烯玻璃纤维层压布的厚度在0.05毫米至0.15毫米之间。As a preferred technical solution of the present invention, the polytetrafluoroethylene glass fiber laminate obtained in the step (4) has a thickness of between 0.05 mm and 0.15 mm.
本发明的有益效果是：相对于现有技术，本发明制造工艺生产的PTFE玻璃纤维层压布可以用作与4G或5G网络配套的电路板基材，基材面平整光滑，产品边缘不卷曲，易于操作，同时可对基材膜进行裁切，从而提高生产效率。本发明能够大幅度提高基材面的平整度，避免因卷曲问题无法使用而造成大量的损耗；用作与4G或5G网络配套的电路板基材，介电性能稳定，耐候性良好，适用于各类环境使用。 The invention has the beneficial effects that: compared with the prior art, the PTFE glass fiber laminate produced by the manufacturing process of the invention can be used as a circuit board substrate matched with a 4G or 5G network, the substrate surface is smooth and smooth, and the product edges are not curled. Easy to handle, and the substrate film can be cut to improve production efficiency. The invention can greatly improve the flatness of the surface of the substrate, avoids a large loss caused by the failure to use the curling problem, and is used as a circuit board substrate matched with the 4G or 5G network, has stable dielectric properties and good weather resistance, and is suitable for use in Use in all types of environments.
附图说明DRAWINGS
图1是本发明的结构示意图。Figure 1 is a schematic view of the structure of the present invention.
图中：1、玻璃纤维基布，2、聚四氟乙烯涂层。In the figure: 1, glass fiber base cloth, 2, Teflon coating.
具体实施方式detailed description
下面结合附图与具体实施例对本发明作进一步说明：The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:
如图1所示，用于4G或5G网络电路板基材的层压布，层压布由无碱玻璃纤维基布1和聚四氟乙烯涂层2构成，无碱玻璃纤维基布1的两面覆盖有聚四氟乙烯涂层2。本实施例中，所述无碱玻璃纤维基布1的两面覆盖有两层或两层以上聚四氟乙烯涂层2。作为另一种实施例，所述层压布包括两层或两层以上无碱玻璃纤维基布1，每层玻璃纤维基布1的两面均覆盖有聚四氟乙烯涂层2。As shown in FIG. 1 , a laminate for a 4G or 5G network circuit board substrate, the laminate is composed of an alkali-free glass fiber base cloth 1 and a polytetrafluoroethylene coating 2, and the alkali-free glass fiber base cloth 1 Both sides are covered with a Teflon coating 2. In this embodiment, the two sides of the alkali-free glass fiber base fabric 1 are covered with two or more layers of polytetrafluoroethylene coating 2. As another embodiment, the laminate comprises two or more layers of an alkali-free glass fiber-based cloth 1, each of which is covered with a Teflon coating 2 on both sides.
本实施例中，所述无碱玻璃纤维基布1的厚度是0.03毫米、0.06毫米或0.095毫米。所述层压布的厚度在0.05毫米至0.15毫米之间。In the present embodiment, the thickness of the alkali-free glass fiber base fabric 1 is 0.03 mm, 0.06 mm or 0.095 mm. The laminate has a thickness of between 0.05 mm and 0.15 mm.
用于4G或5G网络电路板基材的层压布的制造工艺，包括以下步骤：A manufacturing process for a laminate of a 4G or 5G network circuit board substrate, comprising the steps of:
(1)坯布脱蜡，将无碱玻璃纤维坯布通过脱蜡仓进行脱蜡处理，脱蜡温度分别设置为415℃、395℃、350℃、210℃；(1) dewaxing the fabric, and the alkali-free glass fiber fabric is dewaxed through a dewaxing chamber, and the dewaxing temperatures are respectively set to 415 ° C, 395 ° C, 350 ° C, 210 ° C;
(2)低温浸胶处理，在浸胶机的胶槽中注入聚四氟乙烯(PTFE)乳液，对于玻璃纤维布至少分别进行三次浸胶处理，同时对玻璃纤维布进行烘培，烘培区设置四个温区，四个温区的温度分别设置为265℃、216℃、110℃、35℃；(2) Low temperature dipping treatment, injecting polytetrafluoroethylene (PTFE) emulsion into the glue tank of the dipping machine, performing at least three times of dipping treatment on the glass fiber cloth, and baking the glass fiber cloth at the same time, baking area Set four temperature zones, the temperature of each of the four temperature zones is set to 265 ° C, 216 ° C, 110 ° C, 35 ° C;
(3)高温烧结，将经过浸胶处理的玻璃纤维布输送到烧结区进行高温烧结，烧结区设置四个温区，四个温区的温度分别设置为363℃、285℃、178℃、35℃；(3) High-temperature sintering, the dipped glass fiber cloth is sent to the sintering zone for high-temperature sintering, and four temperature zones are set in the sintering zone. The temperatures of the four temperature zones are set to 363 ° C, 285 ° C, 178 ° C, 35 respectively. °C;
(4)收卷，将经过高温烧结的玻璃纤维布输送经过张力辊张紧，然后输送到收卷辊，收卷后即得到涂覆有聚四氟乙烯涂层的玻璃纤维层压布成品。(4) Winding, the high-temperature sintered glass fiber cloth is conveyed and tensioned by a tension roller, and then conveyed to a winding roller, and after winding, a glass fiber laminated cloth coated with a polytetrafluoroethylene coating is obtained.
本实施例中，所述步骤(1)玻璃纤维布运转的速度为30米/分钟；步骤(4)玻璃纤维布收卷的速度为0.8-0.95米/分钟。所述步骤(2)三次浸胶处理的PTFE乳液浓度分别是35-45％、45-50％、50-55％。步骤(1)无碱玻璃纤维坯布的厚度是0.03毫米、0.06毫米或0.095毫米，其宽度相应为900毫米、1050毫米、1270毫米。步骤(4)获得的聚四氟乙烯玻璃纤维层压布的厚度在0.05毫米至0.15 毫米之间。In this embodiment, the speed of the operation of the glass fiber cloth in the step (1) is 30 m/min; and the speed of winding the glass fiber cloth in the step (4) is 0.8-0.95 m/min. The PTFE emulsion concentration of the three times of the dipping treatment in the step (2) is 35-45%, 45-50%, 50-55%, respectively. Step (1) The thickness of the alkali-free glass fiber woven fabric is 0.03 mm, 0.06 mm or 0.095 mm, and the width thereof is 900 mm, 1050 mm, and 1270 mm. The thickness of the polytetrafluoroethylene glass fiber laminate obtained in the step (4) is from 0.05 mm to 0.15. Between millimeters.
上述实施例仅限于说明本发明的构思和技术特征，其目的在于让本领域的技术人员了解发明的技术方案和实施方式，并不能据此限制本发明的保护范围。凡是根据本发明技术方案所作的等同替换或等效变化，都应涵盖在本发明的保护范围之内。 The embodiments described above are only intended to illustrate the concept and technical features of the present invention, and the purpose of the present invention is to understand the technical scope and the embodiments of the invention. Equivalent substitutions or equivalent changes made in accordance with the technical solutions of the present invention are intended to be included within the scope of the present invention.

Claims (11)

  1. 一种用于4G或5G网络电路板基材的层压布，其特征是：所述层压布由至少一层无碱玻璃纤维基布及聚四氟乙烯涂层构成，所述至少一层无碱玻璃纤维基布的两面均覆盖聚四氟乙烯涂层。A laminate for a 4G or 5G network circuit board substrate, characterized in that the laminate is composed of at least one layer of an alkali-free glass fiber base cloth and a polytetrafluoroethylene coating, the at least one layer Both sides of the alkali-free glass fiber base cloth are covered with a polytetrafluoroethylene coating.
  2. 根据权利要求1所述的用于4G或5G网络电路板基材的层压布，其特征是：所述至少一层无碱玻璃纤维基布的两面覆盖有两层或两层以上的所述聚四氟乙烯涂层。The laminate for a 4G or 5G network circuit board substrate according to claim 1, wherein said at least one layer of the alkali-free glass fiber-based base fabric is covered with two or more layers. Teflon coating.
  3. 根据权利要求1所述的用于4G或5G网络电路板基材的层压布，其特征是：所述至少一层无碱玻璃纤维基布的厚度为0.03毫米、0.06毫米或0.095毫米。A laminate for a 4G or 5G network circuit board substrate according to claim 1 wherein said at least one layer of alkali-free glass fiber based cloth has a thickness of 0.03 mm, 0.06 mm or 0.095 mm.
  4. 根据权利要求1或4所述的用于4G或5G网络电路板基材的层压布，其特征是：所述层压布的厚度在0.05毫米至0.15毫米之间。A laminate for a 4G or 5G network circuit board substrate according to claim 1 or 4, wherein the laminate has a thickness of between 0.05 mm and 0.15 mm.
  5. 一种制备权利要求1所述的层压布的方法，包括：A method of preparing the laminate of claim 1 comprising:
    a.坯布脱蜡，将无碱玻璃纤维坯布通过脱蜡仓进行四次脱蜡处理，所述脱蜡处理温度分别设置为415℃、395℃、350℃、210℃；a. The fabric is dewaxed, and the alkali-free glass fiber preform is subjected to four dewaxing treatments through a dewaxing chamber, and the dewaxing treatment temperatures are respectively set to 415 ° C, 395 ° C, 350 ° C, 210 ° C;
    b.低温浸胶处理，在浸胶机的胶槽中注入聚四氟乙烯(PTFE)乳液，对于玻璃纤维布至少分别进行三次浸胶处理，同时对玻璃纤维布进行烘培，烘培区设置四个温区，四个温区的温度分别设置为265℃、216℃、110℃、35℃；b. Low temperature dipping treatment, injecting polytetrafluoroethylene (PTFE) emulsion into the glue tank of the dipping machine, performing at least three times of dipping treatment on the glass fiber cloth, baking the glass fiber cloth at the same time, and setting the baking area The temperature in the four temperature zones and the four temperature zones are set to 265 ° C, 216 ° C, 110 ° C, and 35 ° C, respectively;
    c.高温烧结，将经过浸胶处理的玻璃纤维布输送到烧结区进行高温烧结获得玻璃纤维布；烧结区设置四个温区，四个温区的温度分别设置为363℃、285℃、178℃、35℃；c. High-temperature sintering, the dipped glass fiber cloth is sent to the sintering zone for high-temperature sintering to obtain the glass fiber cloth; the sintering zone is provided with four temperature zones, and the temperature of the four temperature zones is set to 363 ° C, 285 ° C, 178 respectively. °C, 35 ° C;
    d.收卷，将经过高温烧结的玻璃纤维布输送经过张力辊张紧，然后输送到收卷辊，收卷后即得到涂覆有聚四氟乙烯涂层的玻璃纤维层压布成品。d. Winding, the high-temperature sintered glass fiber cloth is conveyed and tensioned by a tension roller, and then conveyed to a winding roller, and after winding, a glass fiber laminated cloth coated with a polytetrafluoroethylene coating is obtained.
  6. 根据权利要求5所述的方法，其特征是：所述步骤(d)中所述玻璃纤维布收卷的速度为0.8-0.95米/分钟。 The method according to claim 5, wherein said glass fiber cloth is wound at a speed of from 0.8 to 0.95 m/min in said step (d).
  7. 根据权利要求5所述的方法，其特征是：所述步骤(b)中所述的三次浸胶处理的PTFE乳液的浓度分别是35-45％、45-50％、50-55％。The method according to claim 5, wherein the concentration of the three-dip-treated PTFE emulsion in the step (b) is 35-45%, 45-50%, 50-55%, respectively.
  8. 根据权利要求5所述的方法，其特征是：所述步骤(a)中无碱玻璃纤维坯布的厚度为0.03毫米，其宽度为900毫米。The method according to claim 5, wherein the alkali-free glass fiber grey cloth in the step (a) has a thickness of 0.03 mm and a width of 900 mm.
  9. 根据权利要求5所述的方法，其特征是：所述步骤(a)中无碱玻璃纤维坯布的厚度为0.06毫米，其宽度为1050毫米。The method of claim 5 wherein said alkali-free glass fiber woven fabric of step (a) has a thickness of 0.06 mm and a width of 1050 mm.
  10. 根据权利要求5所述的方法，其特征是：所述步骤(a)中无碱玻璃纤维坯布的厚度为0.095毫米，其宽度为1270毫米。The method according to claim 5, wherein the alkali-free glass fiber grey cloth in the step (a) has a thickness of 0.095 mm and a width of 1270 mm.
  11. 根据权利要求5所述的方法，其特征是：所述步骤(d)获得的所述玻璃纤维层压布成品的厚度在0.05毫米至0.15毫米之间。 The method according to claim 5, wherein said finished glass fiber laminate obtained in said step (d) has a thickness of between 0.05 mm and 0.15 mm.
PCT/CN2017/081251 2016-08-18 2017-04-20 Laminated cloth for 4g or 5g network circuit board substrate and manufacturing process of same WO2018032795A1 (en)

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