CN103173158A - Manufacturing process of hot-melting textured adhesive tape - Google Patents
Manufacturing process of hot-melting textured adhesive tape Download PDFInfo
- Publication number
- CN103173158A CN103173158A CN2013101386033A CN201310138603A CN103173158A CN 103173158 A CN103173158 A CN 103173158A CN 2013101386033 A CN2013101386033 A CN 2013101386033A CN 201310138603 A CN201310138603 A CN 201310138603A CN 103173158 A CN103173158 A CN 103173158A
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- Prior art keywords
- hot melt
- line paper
- glue
- line
- adhesive tape
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- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a manufacturing process of a hot-melting textured adhesive tape. The manufacturing process comprises the steps of: firstly, utilizing a humidity controller to enable textured paper to have a certain amount of water; uniformly coating glue on the surface of the textured paper containing the water; and then enabling water steam to penetrate through a glue layer and evaporate through heating equipment so as to obtain one porous glue layer which is similar to foaming. According to the manufacturing process disclosed by the invention, the sticking base force of hot melt glue is improved, the production cost is reduced and environmental pollution cannot be caused.
Description
Technical field
The present invention relates to a kind of manufacture craft of hot melt masking tape, relate in particular to a kind of manufacture craft of not adding the hot melt masking tape of any whipping agent.
Background technology
U.S. line paper is that a kind of high-tech is decorated, spraying paper using (because of the property of its purposes, claiming again a minute ribbon paper), is widely used in spraying paint and the spraying of high-grade limousine of upholstery, household electrical appliance.Masking tape is take U.S. line paper and pressure-sensitive glue as main raw material, applies pressure-sensitive adhesive on U.S. line paper, and another side is coated with non-stick material and the web-like sealing tape made.Industries such as being mainly used in decorateing, spraying paint, the application of baking vanish etc. is covered and semiconductor element is fixing.Masking tape need to have the characteristics such as high temperature resistant, anti-chemical solvents is good, high clinging power because of the singularity of its use occasion.
And the hot melt masking tape is with U.S. line paper as substrate, coating hot-melt adhesive on its one side.And in existing manufacture craft, at first need the hot melt adhesive processing of foaming, and then it is supreme that it is coated on U.S. line paper.And in the process of foam process, need to add solvent in glue, can cause environmental pollution.Process by foam process the hot melt adhesive density that obtains large, for solvent cement and the hot melt adhesive of same consumption, the volume of hot melt film is much smaller than the hot melt film.Relative price due to hot melt adhesive is higher in addition, and therefore, the hot melt masking tape cost compare of making for existing technique is high.
For defects, be badly in need of a kind of brand-new manufacture craft of invention and solve the deficiencies in the prior art.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of manufacture craft of hot melt masking tape, this manufacture craft need not that hot melt glue is carried out chemical foaming and processes.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of manufacture craft of hot melt masking tape, it specifically comprises the following steps:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 0.5%～11% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, the complete adhesive tape of gluing is heated, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
As a further improvement on the present invention, to blow high wind or warming mill, the complete adhesive tape of gluing is heated in described step c.
As a further improvement on the present invention, with the high temperature of 150 ℃～250 ℃, the complete adhesive tape of gluing is heated in described step c.
The present invention compared with prior art has following beneficial effect:
The manufacture craft of hot melt masking tape provided by the invention need not before gluing the hot melt glue processing of foaming, but allow U.S. line paper contain a certain amount of moisture content by simple physical method, glue evenly is coated in the U.S. line paper surface of containing moisture, then pass through the equipment of heating, make water vapor pass glue-line and evaporate, thereby obtaining the glue-line that a kind of porous is similar to foaming.Improve the base adhesion force of hot melt adhesive, reduced production cost, and can not cause environmental pollution.
Embodiment
The present invention will be further elaborated below by embodiment:
Embodiment one:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 0.5% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, to blow high wind or warming mill, the complete adhesive tape of gluing is heated, maintain the temperature at 200 ℃, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
Embodiment two:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 2% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, to blow high wind or warming mill, the complete adhesive tape of gluing is heated, maintain the temperature at 220 ℃, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
Embodiment three:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 5% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, to blow high wind or warming mill, the complete adhesive tape of gluing is heated, maintain the temperature at 230 ℃, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
Embodiment four:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 9% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, to blow high wind or warming mill, the complete adhesive tape of gluing is heated, maintain the temperature at 240 ℃, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
Embodiment five:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 11% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, to blow high wind or warming mill, the complete adhesive tape of gluing is heated, maintain the temperature at 250 ℃, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
In the above-described embodiment, glue-line similarly be through similar foaming process, but this similar foaming processes and do not add any whipping agent, also can not use foaming machine or other physical foaming methods bubble that degass.but at first the water content of U.S. line paper is controlled at certain scope in making processes within, hot melt adhesive is coated on U.S. line paper in the mode of extruding, the gluing temperature is low, moisture content in the guarantee base does not evaporate like this, then the adhesive tape of gluing heats it by blowing strong hot air or warming mill, water in base will evaporate, air in the middle of glue-line and base is evaporation or diffusion thereupon also, at this moment pass through glue-line with regard to the gas that part is arranged, make glue form the structure of similar foaming, so the water in base is equivalent to whipping agent, save like this equipment of whipping agent and foaming.Heat-processed can strengthen the contact surface of glue and base in addition, has strengthened bonding force.
In addition, the substrate in the present invention is through dipping, release U.S. line paper, and release of U.S. line paper can stop that a part of water vapor runs away from the one side that glue-line is arranged by it, and dipping can stop parting agent to be penetrated into coated face.Thereby make in the heat-processed of adhesive tape after gluing, make glue-line form the structure that foams thereby water evaporates, air diffuser is run away by glue-line, and hot melt adhesive at high temperature flows, and glue is formed with base engage closely.
Although be the example purpose, the preferred embodiment of the present invention is disclosed, but those of ordinary skill in the art will recognize, in the situation that do not break away from by the disclosed scope and spirit of the present invention of appending claims, various improvement, increase and replacement are possible.
Claims (3)
1. the manufacture craft of a hot melt masking tape, it is characterized in that: it specifically comprises the following steps:
A, adopt U.S. line paper through dipping and release processing as substrate, control water-content in U.S. line paper 0.5%～11% by humidity regulator;
B, hot melt adhesive is coated in the mode of extruding on non-release of U.S. line paper, guarantees that the moisture in substrate does not evaporate;
C, the complete adhesive tape of gluing is heated, make the moisture evaporation in U.S. line paper, make glue-line form foaming structure, make described hot melt masking tape.
2. the manufacture craft of masking tape according to claim 1 is characterized in that: to blow high wind or warming mill, the complete adhesive tape of gluing is heated in described step c.
3. the manufacture craft of masking tape according to claim 1 is characterized in that: with the high temperature of 150 ℃～250 ℃, the complete adhesive tape of gluing is heated in described step c.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101386033A CN103173158A (en) | 2013-04-18 | 2013-04-18 | Manufacturing process of hot-melting textured adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101386033A CN103173158A (en) | 2013-04-18 | 2013-04-18 | Manufacturing process of hot-melting textured adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103173158A true CN103173158A (en) | 2013-06-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101386033A Pending CN103173158A (en) | 2013-04-18 | 2013-04-18 | Manufacturing process of hot-melting textured adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103173158A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897627A (en) * | 2014-04-22 | 2014-07-02 | 苏州华周胶带有限公司 | Manufacturing process of pressure-sensitive masking tape |
| CN105802530A (en) * | 2015-01-20 | 2016-07-27 | 广东晶华科技有限公司 | Manufacturing process for hot-melt textured adhesive tape |
| CN106010350A (en) * | 2016-07-26 | 2016-10-12 | 常熟市长江胶带有限公司 | High-temperature-resistant adhesive tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09310049A (en) * | 1996-03-18 | 1997-12-02 | Sekisui Chem Co Ltd | Production of adhesive tape |
| EP1126002A2 (en) * | 2000-02-10 | 2001-08-22 | Shurtape Technologies, Inc. | Process for making masking tape |
| CN1454231A (en) * | 2000-09-13 | 2003-11-05 | 宝洁公司 | Process for making a foam component |
| CN1706904A (en) * | 2004-06-04 | 2005-12-14 | 蒂萨股份公司 | Use of a single-sided self-adhesive tape as venting tape |
-
2013
- 2013-04-18 CN CN2013101386033A patent/CN103173158A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09310049A (en) * | 1996-03-18 | 1997-12-02 | Sekisui Chem Co Ltd | Production of adhesive tape |
| EP1126002A2 (en) * | 2000-02-10 | 2001-08-22 | Shurtape Technologies, Inc. | Process for making masking tape |
| CN1454231A (en) * | 2000-09-13 | 2003-11-05 | 宝洁公司 | Process for making a foam component |
| CN1706904A (en) * | 2004-06-04 | 2005-12-14 | 蒂萨股份公司 | Use of a single-sided self-adhesive tape as venting tape |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103897627A (en) * | 2014-04-22 | 2014-07-02 | 苏州华周胶带有限公司 | Manufacturing process of pressure-sensitive masking tape |
| CN105802530A (en) * | 2015-01-20 | 2016-07-27 | 广东晶华科技有限公司 | Manufacturing process for hot-melt textured adhesive tape |
| CN106010350A (en) * | 2016-07-26 | 2016-10-12 | 常熟市长江胶带有限公司 | High-temperature-resistant adhesive tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 201600 Shanghai city Songjiang District street Yongfeng River Road No. 89 Applicant after: SHANGHAI SMITH ADHESIVE NEW MATERIAL CO., LTD. Address before: 201600 Shanghai city Songjiang District street Yongfeng River Road No. 89 Applicant before: Shanghai Smith Adhesive Tape Development Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SHANGHAI SMITH ADHESIVE TAPE DEVELOPMENT CO., LTD. TO: SHANGHAI JINGHUA ADHESIVE NEW MATERIALS CO., LTD. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130626 |