WO2018028994A1 - Dispositif et procédé pour transférer un composant électronique d'un support à un substrat - Google Patents

Dispositif et procédé pour transférer un composant électronique d'un support à un substrat Download PDF

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Publication number
WO2018028994A1
WO2018028994A1 PCT/EP2017/068916 EP2017068916W WO2018028994A1 WO 2018028994 A1 WO2018028994 A1 WO 2018028994A1 EP 2017068916 W EP2017068916 W EP 2017068916W WO 2018028994 A1 WO2018028994 A1 WO 2018028994A1
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WO
WIPO (PCT)
Prior art keywords
carrier
substrate
components
alignment
passage
Prior art date
Application number
PCT/EP2017/068916
Other languages
German (de)
English (en)
Inventor
Hans-Peter Monser
Franz Brandl
Sigmund Niklas
Original Assignee
Muehlbauer GmbH & Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH & Co. KG filed Critical Muehlbauer GmbH & Co. KG
Publication of WO2018028994A1 publication Critical patent/WO2018028994A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Definitions

  • WO 2012/171633 A1 describes a device for positioning electronic components to be transferred relative to an ejection device.
  • the ejection device has a slide for at least one electronic component and a housing surrounding the slider, wherein the housing has a first light-permeable region.
  • a first carrier providing the electronic components to be transmitted comprises a first side facing the ejection device and a second side facing away from the ejection device, a plurality of the electronic components being provided on the second side.
  • At least one image data acquisition device is configured to detect image data of a region through which the slider is to be interacted with the at least one electronic component through the first translucent region of the housing.
  • a controller is set up to determine position data of the electronic component to be transmitted from the acquired image data and to generate control commands based on the position data.
  • At least one first actuator is adapted to the first carrier and the ejector relative to each other due to the control commands move to change an offset between a longitudinal axis of the slider and a central axis of the electronic component to be transmitted.
  • DE 103 49 847 B3 describes a positioning device and a positioning method for the transmission of electronic components.
  • a semiconductor wafer arranged on a carrier foil is arranged above and parallel to a ribbon-like substrate.
  • the wafer can be displaced by means of a wafer holder within the wafer plane and additionally rotated about an axis of rotation perpendicular to the wafer plane.
  • An ejection device comprises a knock-out needle, which acts by means of a downward movement on the back of a chip to be detached and removes it from the carrier film. The detached from the carrier film chip is thereby deposited on a bonding position on the belt-like substrate.
  • the published patent application EP 2 688 093 A1 discloses a method and a device for self-alignment and self-assembly of electronic components on a carrier substrate.
  • a surface tension of an at least partially liquefied solder arrangement is used in order to convey the correct alignment of the component on the carrier substrate.
  • the transfer of a plurality of electronic components is made possible on the substrate, which can be passed as a quasi-endless substrate at one or more dispensers.
  • the transfer of the electronic components takes place here without an alignment device.
  • the object is to provide an apparatus and a method for carrying out the transfer of an electronic component from a carrier to a substrate with high precision and high speed.
  • the device comprises a power supply device and a receptacle for the carrier carrying components on a first side surface in order to support it in relation to the energy supply device. at least one orientation, and a carrier actuator to position the carrier relative to the power supply.
  • the device comprises a carrier with a passage.
  • the energy supply device is adapted to emit energy in the direction of the components located on the first side surface through the carrier from a second side surface of the carrier located in the holder, in order at least to separate one of the components from the carrier towards the transition carrier support.
  • an alignment tape with through openings for receiving components separated from the carrier and for aligning these components is arranged.
  • the alignment band is configured to transport components into its passage openings to the passage of the transition carrier.
  • the passageway of the transition carrier extends from its side facing the alignment tape to its side facing a substrate for passing a respective aligned component in its attained alignment with the substrate at the passageway of the transition carrier.
  • the arrangement disclosed and claimed here allows currently to exceed the maximum possible transfer rates of about 20,000 to 30,000 components per hour from the carrier to the substrate significantly.
  • a stepwise clocked conveying movement of the substrate (tape) with respective position detection, braking, settling of the component, and re-starting of the substrate (tape) is no longer required.
  • the substrate (ribbon) may be continuously conveyed, with slight positioning / retardation of the substrate (ribbon) for accurate positioning of the component on the substrate (ribbon), and / or minimal displacement of the transition carrier with its passage relative to the substrate (tape) is sufficient to settle the respective component exactly at the intended location and in the correct orientation on the on the substrate (tape) applied adhesion promoter.
  • the substrate is slightly delayed or accelerated by its drive, while the transition carrier is not displaced.
  • RFID transponders have an electronic data memory which can be read out by a reading device when the transponder is located in the receiving area of the reading device.
  • the transponder and the reader each have an antenna.
  • the component with the electronic data memory with a high throughput rate is placed correctly on the connections of the antenna of the RFID transponder for the production of the RFID transponder.
  • the carrier actuator for positioning the carrier relative to the energy supply device is set up and driven to convey the carrier directly or at least in sections continuously or stepwise, in order to position the carrier relative to the energy supply device.
  • the carrier actuator is set up and driven, for the positioning of the carrier relative to the energy supply device to promote the carrier by its recording at least partially continuously or stepwise.
  • the energy supply device can be designed as a heat radiator or as a heat conduction source.
  • the energy supply device may have the form of an infrared laser light source / laser light source, a hot gas nozzle, or a radiant heater element.
  • the energy source can be set up to touch the carrier located in the receptacle on its second side surface or to be positionable at a distance from the second side surface of the carrier, for example by a corresponding actuator or a corresponding adjusting device.
  • the transition carrier is coupled in a variant with a transition carrier actuator drive.
  • the transition carrier actuator is adapted to position the passage of the transition carrier relative to the substrate in one or more orientations.
  • the alignment tape is designed in a variant as an endless belt with a plurality of passage openings.
  • the alignment band of the present arrangement in one variant has the shape of an endless loop.
  • the alignment strip has the shape of an annular or plate-shaped disc, in the edge region of the passage openings for receiving from the carrier of separate components are arranged.
  • the passage openings may be configured with alignment structures in the form of corners, points and / or edges for aligning the components.
  • the location at which the energy supply delivers energy to one of the components through the carrier so that the respective component enters one of the passage openings of the alignment band, and the passage of the transition carrier towards the substrate are in a variant a distance from each other to space. This distance is to be such that a component dispensed into one of the passage openings of the alignment tape aligns with the alignment structures of the respective passage opening of the alignment tape, while the alignment tape transports the component from this location to the passage of the transition carrier.
  • a preferably lateral or supporting guide is provided to pass the continuous band substrate past a transfer point for the components at the passage of the transition carrier at a predefined angle to the alignment band to lead.
  • This allows the substrate to be loaded with the components in a continuous roll-to-roll process.
  • the substrate can be conveyed at at least approximately constant speed without stopping and in the process be charged with components B.
  • the transfer rate is increased and, on the other hand, the components can be exposed to less acceleration / deceleration forces, so that, after settling on the substrate, they retain their once more precisely taken position.
  • a dispenser for a bonding agent to be applied to the substrate is provided upstream of the transfer point for the components relative to the path of the substrate.
  • This dispenser serves to deliver a correspondingly metered amount of adhesion promoter to the substrate in order to fix the components passed through at the transfer point to the substrate through the passage of the transition carrier to the substrate.
  • the aligning belt drive is set up to guide the alignment belt substantially gap-free to the transition carrier relative to this continuously or stepwise to transport.
  • a controller is provided for (i) to apply control signals to the energy supply device, (ii) to apply control signals to the carrier actuator, (iii) to supply the alignment belt drive with control signals
  • the controller is also supplied with signals from sensors that are configured to (i) detect energy emitted by the energy supply device, (ii) detect a position and / or a travel speed of the carrier actuator, (iii) a Position and / or one
  • Detecting travel speed of the alignment belt drive (iv) detecting a position and / or a travel speed of the transfer carriage actuator, (v) detecting a position and / or a travel speed of the substrate drive, and / or (vi) a position to detect a given to the substrate adhesion promoter and / or a distance between two issued on the substrate adhesion promoter.
  • the detection of the position of the adhesion promoter dispensed on the substrate and the detection of the distance between two adhesion promoters deposited on the substrate are each optional.
  • the method comprises the steps:
  • the carrier in a variant of the carrier directly, or the carrier can be supported by its recording relative to the energy supply at least in sections continuously or stepwise.
  • the energy can be supplied from a (i) heat radiator or a (ii) heat conduction source in the form of an infrared laser light source / laser light source, a hot gas nozzle, or a Schustrahlele ⁇ ment ment.
  • the energy supply device from which the energy is supplied may (i) contact the in-receptacle carrier at its second side surface or (ii) be positioned at a distance from the second side surface of the carrier.
  • the transition carrier may be stationary or movable. In the case of a moveable transition carrier, the passageway of the transition carrier is positioned relative to the substrate in one or more orientations.
  • a component may be transferred to one of a plurality of through openings of the endless belt alignment belt, and / or align in the respective one of the through openings with alignment structures in the form of corners, points, and / or edges for aligning the components.
  • a location where the energy supply delivers energy to one of the components and the passageway of the transition carrier towards the substrate are spaced so far apart in a variant that a component dispensed into one of the passage openings of the alignment band contacts the alignment structures aligning the respective through holes of the alignment tape, while the alignment tape transports the component to the passage of the transition carrier.
  • the designed as a continuous belt substrate is guided at a transfer point for the components in the passage of the transition carrier, preferably laterally or supportively, and / or guided at a predefined angle (alpha) to the alignment.
  • Upstream of the transfer point for the components relative to the path of the substrate adhesion promoter is applied to the substrate, which serves to fix the transmitted at the transfer point to the substrate components to the substrate.
  • the alignment tape is transported substantially gap-free to the transition carrier relative to this continuously or stepwise.
  • the alignment band in one variant has the shape of an endless loop or in another variant the shape of an annular or plate-shaped disc which has in its edge region the passage openings for receiving components separated from the carrier.
  • Fig.l shows an embodiment of an apparatus for transferring an electronic component from a carrier to a substrate in a schematic side view.
  • 2a to 2d respectively show a schematic plan view of one of the passage openings of the alignment belt and how a component aligns therein, while the alignment belt transports the component to the passage of the transition carrier.
  • FIG. 1 shows an exemplary embodiment of a device 10 for transferring an electronic component from a carrier T to a substrate S.
  • the device 10 has a receptacle 12 for the carrier T.
  • This carrier T is usually a frame with a film F, which carries on a first - in Fig. 1 lower - side surface components B.
  • a carrier actuator 14 serves to translate the carrier T in multiple directions (along the X, Y, and / or Z axes) and one or more axes (X, Y, and / or Z To swing).
  • the receptacle 12 for the carrier T is at least partially positioned continuously or stepwise relative to an energy supply device 14.
  • the energy supply device 14 is in the illustrated variant, a laser light source with an associated - not further illustrated - optics.
  • the laser light source is adapted to a second - in Fig. 1 upper - side surface of the in the receptacle 12th located carrier T forth (heat) energy in the direction of the located on the first side surface of the carrier T components B through the carrier T therethrough.
  • the energy supply device 14 is designed as a heat radiator or as a heat conduction source. It may also be a hot gas nozzle or a radiant heater element instead of the laser light source. In the variant illustrated in FIG. 1, the energy supply device 14 is set up to be positionable or adjustable at a distance from the second side surface of the carrier by a setting device (not further illustrated in FIG. 1). Alternatively, the energy supply device 14 is configured such that it touches the carrier T located in the receptacle on its second side surface, which is upper in FIG. 1.
  • the components B are semiconductor chips of a semiconductor wafer which are separated from one another and are fastened to the film F with a pressure-sensitive adhesive coating (not further illustrated in FIG. 1).
  • This pressure-sensitive adhesive coating may at least partially decompose under the action of at least part of the energy directed to the individual semiconductor chips in order to exert a mechanical impulse on the respective semiconductor chip, which moves the respective semiconductor chip away from the film F.
  • small particles may be contained in the pressure-sensitive adhesive coating, for example small capsules with an incorporated liquid which expand when exposed to energy, become bubbles and lift the semiconductor chip and thus detach it from the pressure-sensitive adhesive coating.
  • the energy introduced locally in the manner described above is partially or completely converted into heat in the semiconductor chip to be separated from the foil F of the carrier T and / or in the foil F of the carrier T.
  • This heat causes the located between the semiconductor chip and the foil F of the carrier T, heat responsive adhesive ⁇ adhesive coating are the semiconductor chip from the pressure-sensitive adhesive coating free.
  • the pressure-sensitive adhesive coating itself or the film F of the carrier T or the semiconductor chip to be separated from the film F) converts the energy input into heat, depending on the absorption of the wavelength of the energy radiation, and thus accelerates the thermal reaction.
  • transition carrier 18 is a flat and smooth board on which the components B can slide smoothly.
  • the transition carrier 18 is coupled in the variant shown with an optional transition carrier actuator 20 geared.
  • Transition carrier actuator 20 serves to translate transition carrier 18 in multiple directions (along the X, Y, and / or Z axes) and one or more axes (X, Y, and / or Z) To swing).
  • the Transitional support 18, and with it a located in the transition support 18 passage 22 relative to a spaced-apart substrate S at least partially continuously or stepwise positioned.
  • an alignment tape 24 is passed through openings 26 for receiving separated from the carrier T components B and for aligning these components B.
  • the alignment belt 24 is operatively coupled to an alignment belt drive 28.
  • the alignment belt drive 28 is adapted to transport the alignment belt 24 with components B in its passage openings 26 to the passage 22 of the transition support 18 substantially gap- ⁇ freely to the transition support 18 relative thereto continuously or stepwise.
  • the alignment tape 24 is in the variant of FIG. 1 as several
  • Umlenkrollen 32 circulating endless belt with a plurality of equally spaced apart beabstan- determinate through-openings 26 configured.
  • the passage openings 26 are rectangular in the variant shown.
  • the in the conveying direction of the alignment tape 24 rearward inner sides s / the passage openings 26 form with their adjacent inner sides w alignment structures for aligning the components B.
  • the substrate S is designed as a continuous belt.
  • a guide 34 is provided to the substrate S at a transfer point 36 for the components B at the passage 22 of the transition carrier 18 at a predefined angle alpha of about 10 ° - 80 ° (see Fig. 2a) to the alignment 24 to pass by.
  • FIG. 1 sensor A not further illustrated in Fig. 1 sensor is provided in a variant above, with offset to the transfer point to recognize for the placement of the electronic components on the substrate S existing conductor structures to possibly influence the transition carrier and / or the drive for the substrate ,
  • the substrate and / or the guide are transparent.
  • the sensor below the transfer parts can detect the conductor structures on the substrate S for the placement of the electronic components in order to possibly influence the transition carrier and / or the drive for the substrate.
  • the rectangular passage openings 26 are inclined in the variant shown by this angle alpha to the conveying direction of the alignment tape 24.
  • the passage 22 of the transition carrier 18 extends from its side facing the alignment tape 24 - in FIG. 1 upper side - to its side facing the substrate S - in Fig. 1 lower - side.
  • the passageway 22 of the transition carrier 18 passes a respective component B aligned on the insides v, w of one of the passageway openings 26 of the alignment tape 24 in alignment with the substrate S when the alignment tape 24 passes the component B into engagement with the passage 22 of the transition carrier 18 has brought (see the sequence in Figs. 2a - 2d).
  • a substrate drive 38 is provided which conveys the ribbon-shaped endless substrate S in a roll-to-roll assembly process.
  • the location at which the energy supply device 14 delivers energy to one of the components B through the film F of the carrier T and the passage 22 of the transfer carrier 18 to the substrate S are spaced apart by a distance D.
  • This distance D is such that a component B dispensed into one of the passage openings 26 of the alignment belt 24 has sufficient time and opportunity to align with the inner sides v, w of the respective passage openings 26 of the alignment belt 24 the alignment belt 24 transports the component B to the passage 22 of the transition carrier 18.
  • Adjacent passage openings 26 of the alignment tape 24 are all equidistant from one another.
  • FIGS. 2 a to 2 d illustrate the alignment process of a component B dispensed in one of the passage openings 26 of the alignment belt 24.
  • the friction between the component B and the bearing surface of the transition carrier 18 is very low because of the surface coating of the transition carrier 18.
  • a component B is detached from the wafer into one of the through openings 26 of the alignment tape 24, it rests on the support surface of the transition carrier 18. If the alignment tape 24 moves in the direction of the passage 22 of the transition carrier 18, the component B is taken along by the edges located in the passage opening 26 of the alignment tape 24 at the rear. At the end of its movement within the passage opening 26, the component B is aligned with its corners on the inner sides v f w.
  • the distance of the components B from each other is no longer determined by the reproducibility of the detachment process, but essentially by the mechanical manufacturing accuracy of the alignment tape 24.
  • a dispenser 40 is provided for a bonding agent H to be applied to the substrate S. hen is.
  • the bonding agent H serves to fix the components B transmitted to the substrate S at the transfer point 36 to the substrate S.
  • an electronic control 50 is provided.
  • This electronic control 50 provides control signals a, b, c, d, e for the energizer, the carrier actuator, the registration belt drive, the transition carrier actuator, the substrate drive and the primer dispenser.
  • the electronic controller 50 is fed with signals from sensors not further illustrated in FIG.
  • These sensors detect an energy output by the energy supply device, a position and / or a travel speed of the carrier actuator, a position and / or a travel speed of the alignment belt drive, a position and / or a travel speed of the transfer carrier actuator, a position and / or a Trace speed of the substrate drive to detect a position of a dispensed on the substrate adhesion promoter depot or a distance between two issued on the substrate adhesive deposits.
  • the dispenser of the adhesion promoter provides adhesion promoters of such type and / or in such an amount to the substrate S, that the component B with the substrate S, more precisely with a conductor structure on the substrate S can form a connection.
  • the primer may be an adhesive or flux containing reflowable solder.
  • the bonding agent is a solder
  • a heating device for melting the solder may be provided, which melts the solder when moving the substrate S, so that the electronic component B electrically and mechanically connects to the conductor structure on the substrate.
  • the roll-to-roll assembly process described here is particularly characterized in that a substrate, which is moved past the transfer point 36 for the components B, ideally never has to be stopped or slowed down to carry out the transfer step.
  • This process allows a significant increase in throughput compared to today's clocked processes for assembly of components.
  • the variants described here also allow mounting of particularly small electronic components with few electrical connection devices, in particular also in connection with transponder interposers or inlays for RFID. It can be ensured by the contactless mounting of the components even in the assembly of very small and / or very thin components high production speed with high reliability.
  • the electronic component may have more than one electrical connection, for example two to four electrical contacts.
  • the component can also have fewer than ten electrical connections, preferably less than five electrical connections. It does not matter whether the electrical contacts are only on a single chip side, such as currently available RFID chips, or on two chip sides, such as the currently available LED chips.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif pour transférer un composant électronique d'un support à un substrat. Ledit dispositif comprend à cet effet un dispositif d'alimentation en énergie et un logement pour le support portant des composants sur une première surface latérale, de manière à positionner ledit support relativement au dispositif d'alimentation en énergie, dans au moins une orientation, ainsi qu'un mécanisme de commande de support, de manière à positionner le support relativement au dispositif d'alimentation en énergie. Ledit dispositif comprend également un support muni d'un passage. Le dispositif d'alimentation en énergie est conçu de manière à dégager, à travers le support, de l'énergie de la seconde surface latérale du support situé dans le logement, en direction des composants situés sur la première surface latérale, de manière à au moins soutenir un détachement dans chaque cas d'un des composants, du support au support de transition. Une bande d'alignement dotée d'ouvertures de passage pour recevoir les composants détachés du support et pour orienter ces composants est disposée entre le support situé dans le logement et le support de transition. La bande d'alignement est conçue de manière à transporter des composants dans ses ouvertures de passage jusqu'au passage du support de transition. Le passage du support de transition s'étend de sa face tournée vers la bande d'alignement jusqu'à sa face tournée vers un substrat, pour permettre à chacun des composants sur une ouverture de passage du support de transition de pouvoir passer dans un alignement voulu par rapport au substrat.
PCT/EP2017/068916 2016-08-11 2017-07-26 Dispositif et procédé pour transférer un composant électronique d'un support à un substrat WO2018028994A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016009765.5A DE102016009765B4 (de) 2016-08-11 2016-08-11 Vorrichtung und Verfahren zum Übertragen eines elektronischen Bauteils von einem Träger zu einem Substrat
DE102016009765.5 2016-08-11

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WO2018028994A1 true WO2018028994A1 (fr) 2018-02-15

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US10414872B2 (en) 2017-08-01 2019-09-17 Evonik Degussa Gmbh Production of SiOC-bonded polyether siloxanes
US20230056420A1 (en) * 2020-02-21 2023-02-23 Muehlbauer GmbH & Co. KG Apparatus and method for transferring electronic components from a first carrier to a second carrier
CN116631929A (zh) * 2023-07-24 2023-08-22 广东工业大学 一种基于摆臂固晶机的芯片转移方法、系统、设备和介质

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EP4394851A1 (fr) * 2022-12-30 2024-07-03 ASML Netherlands B.V. Saisie et placement basés sur un évidement pour intégration hétérogène

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