WO2018025318A1

WO2018025318A1 - Heat pump device

Info

Publication number: WO2018025318A1
Application number: PCT/JP2016/072587
Authority: WO
Inventors: 悟梁池; 大林　誠善; 仁隆門脇; 七種　哲二; 大坪　祐介
Original assignee: 三菱電機株式会社
Priority date: 2016-08-02
Filing date: 2016-08-02
Publication date: 2018-02-08
Also published as: JPWO2018025318A1; JP6537733B2; GB201819892D0; CN109511272A; GB2567333B; GB2567333A; DE112016007113T5; DE112016007113B4; CN109511272B

Abstract

This heat pump device is provided with a first refrigerant circuit, second refrigerant circuit, heat storage circuit, and water circuit, the first refrigerant circuit has a configuration wherein a first heat exchanger, second heat exchanger, third heat exchanger, and fourth heat exchanger are connected, and the second refrigerant circuit has a configuration wherein a fifth heat exchanger and the second heat exchanger are connected. The water circuit has: a first water circuit, in which a pump, the first heat exchanger, and the fifth heat exchanger are connected; a second water circuit, which is branched from, between the pump and the first heat exchanger, the first water circuit, and connected to, between the first heat exchanger and the fifth heat exchanger, the first water circuit; and a third water circuit, which is branched from the first water circuit in the downstream of the fifth heat exchanger, and connected to the first water circuit in the upstream of the pump via the sixth heat exchanger.

Description

Heat pump equipment

The present invention relates to a heat pump device including a dual heat pump circuit.

Patent Document 1 describes a hot water supply device. This hot water supply apparatus includes a hot water supply refrigerant circuit in which a compressor, a first heat exchanger, an expansion mechanism, and a second heat exchanger are sequentially connected and filled with carbon dioxide refrigerant. The first heat exchanger is a heat exchanger for generating hot water, and the second heat exchanger is a cascade heat exchanger in which heat is exchanged between the refrigerant in the low-stage refrigerant circuit such as an air conditioner and the carbon dioxide refrigerant. . Thereby, in the hot water supply device, a dual heat pump cycle operation is performed.

Japanese Patent No. 3925383

13 and 14 are ph diagrams showing the operation of the CO ₂ refrigerant in the conventional hot water supply apparatus. As shown in FIGS. 13 and 14, in the case of the CO ₂ refrigerant operating above the critical pressure, since there is no condensation temperature, the enthalpy difference in the heat release stroke changes approximately in proportion to the temperature difference in the heat release stroke. Therefore, as shown in FIG. 13, when the incoming water temperature is low (for example, 20 ° C.), the enthalpy difference in the heat dissipation process can be increased, so that a high COP is obtained. On the other hand, as shown in FIG. 14, when the incoming water temperature rises (for example, 40 ° C.), the enthalpy difference in the heat release process is reduced, and the COP is lowered. Therefore, the conventional hot water supply apparatus has a problem that it is difficult to increase the operation efficiency in both the hot water supply operation with a low incoming water temperature and the heat insulation operation with a high incoming water temperature.

Also, the conventional hot water supply apparatus has a problem that it is necessary to increase the unit size in order to improve the maximum capacity.

The present invention has been made in order to solve at least one of the above-described problems, and is a heat pump that can improve operating efficiency and improve maximum capacity while suppressing increase in unit size. An object is to provide an apparatus.

The heat pump device according to the present invention includes a first refrigerant circuit for circulating the first refrigerant, a second refrigerant circuit for circulating the second refrigerant, a heat storage circuit for circulating the first fluid, a water circuit for circulating water, The first refrigerant circuit performs heat exchange between the first compressor, a first heat exchanger that exchanges heat between the first refrigerant and water, and the first refrigerant and the second refrigerant. A second heat exchanger, a first expansion valve, a third heat exchanger for exchanging heat between the first refrigerant and the second fluid, and a first for exchanging heat between the first refrigerant and the first fluid. 4 heat exchangers are connected in this order via pipes, and the second refrigerant circuit performs fifth heat exchange between the second compressor and the second refrigerant and water. A heat exchanger, a second expansion valve, and the second heat exchanger have a configuration connected in this order via piping, and the heat storage circuit A heat storage tank, a first circulation circuit that circulates the first fluid between the heat storage tank and the fourth heat exchanger, a sixth heat exchanger that performs heat exchange between the heat storage tank, the first fluid, and water. And a second circulation circuit for circulating the first fluid between the heat exchanger, the water circuit, a pump for pumping water, the first heat exchanger, and the fifth heat exchange. Branching from the first circuit between the first circuit to which the heat exchanger is connected, the pump and the first heat exchanger, and between the first heat exchanger and the fifth heat exchanger A second circuit connected to the first circuit; a branch from the first circuit on the downstream side of the fifth heat exchanger; the first circuit on the upstream side of the pump via the sixth heat exchanger; And a third circuit connected to.

According to the present invention, the operating efficiency can be increased and the maximum capacity can be improved while suppressing an increase in unit size.

It is a circuit diagram which shows the schematic circuit structure of the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the hot water supply mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the heat retention mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the heat storage mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the capability enhancement mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the hot water supply and heat storage mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the heat retention and heat storage mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the state in the quick start mode in the heat pump apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows schematic structure of the capsule-type heat storage material used with the heat pump apparatus which concerns on Embodiment 4 of this invention. It is a circuit diagram which shows the schematic circuit structure of the heat pump apparatus which concerns on Embodiment 6 of this invention. It is a circuit diagram which shows the schematic circuit structure of the heat pump apparatus which concerns on Embodiment 7 of this invention. It is a schematic diagram which shows the physical structure of the heat pump apparatus which concerns on Embodiment 10 of this invention. It is a ph diagram showing the operation of CO ₂ refrigerant in a conventional hot water supply apparatus. It is a ph diagram showing the operation of CO ₂ refrigerant in a conventional hot water supply apparatus.

Embodiment 1 FIG.
A heat pump device according to Embodiment 1 of the present invention will be described. FIG. 1 is a circuit diagram showing a schematic circuit configuration of the heat pump device according to the present embodiment. As shown in FIG. 1, the heat pump apparatus includes a binary circuit including a low-side first refrigerant circuit 101 that circulates a first refrigerant and a high-side second refrigerant circuit 102 that circulates a second refrigerant. A heat pump circuit 103 is included. Moreover, the heat pump apparatus has a heat storage circuit 110 that circulates the first fluid and a water circuit 120 that circulates water.

(First refrigerant circuit 101)
In the first refrigerant circuit 101, the first compressor 1, the first heat exchanger 2, the second heat exchanger 3, the first expansion valve 4, the third heat exchanger 5, and the fourth heat exchanger 6 are connected to the refrigerant pipe. Through the ring in this order. As the first refrigerant circulating in the first refrigerant circuit 101, for example, a refrigerant that operates in a supercritical region when operating at least the first refrigerant circuit 101 alone (for example, a refrigerant containing at least one component of CO ₂ ). Is used. That is, at least when the first refrigerant circuit 101 is operated alone, the high-pressure side pressure of the first refrigerant circuit 101 is equal to or higher than the critical pressure of the first refrigerant.

The first compressor 1 is a fluid machine that sucks and compresses a low-pressure first refrigerant and discharges it as a high-pressure refrigerant.

Each of the first heat exchanger 2 and the second heat exchanger 3 is a high-pressure side heat exchanger in the first refrigerant circuit 101, and functions as a radiator that radiates heat from the first refrigerant. The first heat exchanger 2 is a water-refrigerant heat exchanger that performs heat exchange between water and the first refrigerant. In the first heat exchanger 2, heat is radiated from the first refrigerant to the water, the water is heated and the first refrigerant is cooled. The second heat exchanger 3 is a cascade heat exchanger that performs heat exchange between the first refrigerant on the lower side and the second refrigerant on the higher side. In the second heat exchanger 3, heat is radiated from the first refrigerant to the second refrigerant, the second refrigerant is heated, and the first refrigerant is further cooled.

The first expansion valve 4 decompresses the high-pressure first refrigerant in an enthalpy manner and causes it to flow out as a low-pressure refrigerant. As the first expansion valve 4, an electronic expansion valve or the like whose opening degree can be adjusted by the control of the control device is used.

Each of the third heat exchanger 5 and the fourth heat exchanger 6 is a low-pressure heat exchanger in the first refrigerant circuit 101, and is an evaporator that absorbs heat to the first refrigerant and evaporates the first refrigerant. Function. The third heat exchanger 5 is a heat exchanger that performs heat exchange between the first refrigerant and the second fluid. In this example, outdoor air supplied by a blower fan (not shown) is used as the second fluid. Therefore, the third heat exchanger 5 is an air-refrigerant heat exchanger that performs heat exchange between the outdoor air and the first refrigerant. In the third heat exchanger 5, heat is radiated from the second fluid to the first refrigerant, and the first refrigerant is heated. The fourth heat exchanger 6 is a heat exchanger that performs heat exchange between the first refrigerant and the first fluid. In the fourth heat exchanger 6, heat is radiated from the first fluid to the first refrigerant, and the first refrigerant is heated and the first fluid is cooled.

(Second refrigerant circuit 102)
The second refrigerant circuit 102 has a configuration in which the second compressor 7, the fifth heat exchanger 8, the second expansion valve 9, and the second heat exchanger 3 are annularly connected in this order via a refrigerant pipe. is doing. As the second refrigerant circulating in the second refrigerant circuit 102, for example, a refrigerant that operates in a supercritical region or less is used. That is, the high-pressure side pressure of the second refrigerant circuit 102 is equal to or lower than the critical pressure of the second refrigerant.

The second compressor 7 is a fluid machine that sucks in and compresses the low-pressure second refrigerant and discharges it as a high-pressure refrigerant.

The fifth heat exchanger 8 is a high-pressure heat exchanger in the second refrigerant circuit 102, and functions as a radiator (condenser) that dissipates heat from the second refrigerant and condenses the second refrigerant. The fifth heat exchanger 8 is a water-refrigerant heat exchanger that performs heat exchange between water and the second refrigerant. In the fifth heat exchanger 8, heat is radiated from the second refrigerant to the water, the water is heated and the second refrigerant is cooled.

The second expansion valve 9 decompresses the high-pressure second refrigerant in an enthalpy manner and causes it to flow out as a low-pressure refrigerant. As the second expansion valve 9, an electronic expansion valve whose opening degree can be adjusted by the control of a control device is used.

The second heat exchanger 3 is a low-pressure heat exchanger in the second refrigerant circuit 102, and functions as an evaporator that absorbs heat by the second refrigerant and evaporates the second refrigerant. As described above, the second heat exchanger 3 is a cascade heat exchanger that performs heat exchange between the first refrigerant and the second refrigerant.

(Heat storage circuit 110)
The heat storage circuit 110 includes the heat storage tank 10 and a first circulation circuit 111 and a second circulation circuit 112 that circulate the first fluid, respectively. A gel-like heat storage material is enclosed in the heat storage tank 10 of this example. As the heat storage material, a material having a heat capacity larger than that of water is used. In the heat storage tank 10, heat exchange between the first fluid and the heat storage material is performed. As the first fluid in this example, a liquid heat medium such as water or brine is used.

The first circulation circuit 111 circulates the first fluid between the heat storage tank 10 and the fourth heat exchanger 6. The first circulation circuit 111 is provided with a pump 11 that pumps the first fluid. As described above, the fourth heat exchanger 6 is a heat exchanger that performs heat exchange between the first refrigerant and the first fluid. In the fourth heat exchanger 6, heat is radiated from the first fluid to the first refrigerant, and the first refrigerant is heated and the first fluid is cooled.

The second circulation circuit 112 circulates the first fluid between the heat storage tank 10 and the sixth heat exchanger 17. In this example, the second circulation circuit 112 shares the pump 11 with the first circulation circuit 111 and is provided to be branched from the first circulation circuit 111. A flow path switching device 16 is provided at a branch portion between the first circulation circuit 111 and the second circulation circuit 112. The flow path switching device 16 is configured by, for example, a three-way valve or a plurality of two-way valves. In the flow path switching device 16, it is switched whether the first fluid pumped by the pump 11 circulates in the first circulation circuit 111 or the second circulation circuit 112. That is, in the flow path switching device 16, it is switched whether the first fluid flows into the fourth heat exchanger 6 or the sixth heat exchanger 17.

The sixth heat exchanger 17 is a heat exchanger that performs heat exchange between the first fluid and water. In the sixth heat exchanger 17, heat is radiated from water to the first fluid, and the first fluid is heated.

(Water circuit 120)
The water circuit 120 includes a first circuit 121, a second circuit 122, and a third circuit 123 through which water flows. In addition, as a fluid which distribute | circulates the water circuit 120, liquid heat media, such as not only water but brine, can be used.

The first circuit 121 has a configuration in which the pump 12 that pumps water, the first heat exchanger 2, and the fifth heat exchanger 8 are connected in this order via a water pipe. Yes. An upstream portion of the first circuit 121 is provided with an inflow portion 120a (water intake portion) through which water or low-temperature hot water flows from the outside of the heat pump device. At the downstream end of the first circuit 121, an outflow part 120b (outflow part) for allowing hot water to flow out of the heat pump device is provided.

The second circuit 122 branches from the first circuit 121 between the pump 12 and the first heat exchanger 2, and the first circuit 121 is between the first heat exchanger 2 and the fifth heat exchanger 8. It is connected to the. That is, the second circuit 122 is a circuit that connects the pump 12 and the fifth heat exchanger 8 in the first circuit 121 without passing through the first heat exchanger 2. A flow path switching device 14 is provided at a branch portion between the first circuit 121 and the second circuit 122. The flow path switching device 14 is configured by, for example, a three-way valve or a plurality of two-way valves. In the flow path switching device 14, it is switched whether the water pumped by the pump 12 passes through the first heat exchanger 2 or the second circuit 122.

The third circuit 123 branches from the first circuit 121 on the downstream side of the fifth heat exchanger 8, passes through the sixth heat exchanger 17, and is connected to the first circuit 121 on the upstream side of the pump 12. Has been.

A flow path switching device 15 is provided at a branch portion between the first circuit 121 and the third circuit 123. The flow path switching device 15 is configured by, for example, a three-way valve or a plurality of two-way valves. In the flow path switching device 15, whether the water that has passed through the fifth heat exchanger 8 flows out to the outside via the outflow portion 120b or returns to the upstream side of the pump 12 through the sixth heat exchanger 17 Is switched. In addition, the flow path switching device 15 does not simply switch the flow path, but returns to the upstream side of the pump 12 via the flow rate of water flowing out to the outside via the outflow portion 120 b and the sixth heat exchanger 17. The flow rate of water and the flow rate ratio can be adjusted. For example, the flow path switching device 15 may have a configuration in which a switching valve that switches the flow path and a flow rate adjustment valve that adjusts the flow rate are combined.

The flow path switching device 13 is provided at the connection between the first circuit 121 and the third circuit 123. The flow path switching device 13 is configured by, for example, a three-way valve or a plurality of two-way valves. In the flow path switching device 13, which of water that flows in from the outside through the inflow portion 120 a and water that returns to the upstream side of the pump 12 through the sixth heat exchanger 17 is sucked into the pump 12. Is switched. In addition, the flow path switching device 13 not only simply switches the flow path, but also returns to the upstream side of the pump 12 via the flow rate of water flowing from the outside via the inflow portion 120 a and the sixth heat exchanger 17. The flow rate of water and the flow rate ratio can be adjusted. The flow path switching device 13 may have a configuration in which, for example, a switching valve that switches the flow path and a flow rate adjustment valve that adjusts the flow rate are combined.

(Control device 200)
Further, the heat pump device has a control device 200 that controls the entire heat pump device including the first refrigerant circuit 101, the second refrigerant circuit 102, the heat storage circuit 110, and the water circuit 120. The control device 200 has a microcomputer provided with a CPU, ROM, RAM, I / O port, timer, and the like. In the control device 200, the first compressor 1, the second compressor 7, the first expansion valve 4, the second expansion valve 9, and the pump 11 are set based on operation mode settings or detection signals from sensors (not shown). The operations of various actuators such as the flow path switching device 16, the pump 12, the flow

path switching devices

13, 14, 15 and a blower fan (not shown) are controlled.

The control device 200 has, as operation modes of the heat pump device, a hot water supply mode (an example of the first operation mode), a heat retention mode (an example of the second operation mode), a heat storage mode (an example of the third operation mode), and a capacity enhancement mode (the first 4 example of operation mode), hot water supply and heat storage mode (example of fifth operation mode), heat retention and heat storage mode (example of sixth operation mode), and quick start mode (example of seventh operation mode) can be executed. . Each operation mode is switched based on a user operation, an external command, a detection signal from a sensor, or the like. Hereinafter, each operation mode will be described. Note that the operations of the various actuators described below are examples for executing each operation mode.

(Hot water supply mode)
FIG. 2 is a diagram showing a state in the hot water supply mode in the heat pump device according to the present embodiment. In the hot water supply mode, the first compressor 1 is controlled so that the hot water temperature approaches the target value. The first expansion valve 4 is controlled such that the degree of superheat, the discharge temperature, or the discharge pressure of the first refrigerant circuit 101 approaches the target value. In the third heat exchanger 5, heat exchange between the outdoor air blown by the blower fan and the first refrigerant is performed. The second compressor 7 and the pump 11 are stopped. The pump 12 is operating. In the flow

path switching devices

13, 14, and 15, the water flowing in from the outside through the inflow portion 120a passes through the first heat exchanger 2 and the fifth heat exchanger 8 in series in this order, and passes through the outflow portion 120b. Is set to flow outside. In addition, since the 2nd compressor 7 has stopped, in the 5th heat exchanger 8, heat exchange with a 2nd refrigerant | coolant and water is not performed.

In the hot water supply mode, water flowing from the outside is heated by heat exchange in the first heat exchanger 2 and flows out to the outside as hot water. Thereby, in the hot water supply mode, hot water can be supplied by collecting heat from outdoor air. Since the first refrigerant circuit 101 operates at a critical pressure or higher, it can be operated at a high COP.

(Insulation mode)
FIG. 3 is a diagram showing a state in the heat retention mode in the heat pump apparatus according to the present embodiment. The heat retention mode is an operation mode that is executed when the temperature difference between the incoming water temperature and the outgoing hot water temperature becomes smaller due to an increase in incoming water temperature. The heat retention mode is executed, for example, when the incoming water temperature is equal to or higher than a predetermined temperature or the temperature difference between the incoming water temperature and the target hot water temperature is lower than a predetermined value during execution of the hot water supply mode.

In the heat retention mode, the first compressor 1 is controlled so that the discharge pressure of the first refrigerant circuit 101 approaches the target value. The first expansion valve 4 is controlled such that the degree of superheat or the discharge temperature of the first refrigerant circuit 101 approaches the target value. In the third heat exchanger 5, heat exchange between the outdoor air blown by the blower fan and the first refrigerant is performed. The second compressor 7 is controlled so that the tapping temperature approaches the target value. The control target of the first compressor 1 and the control target of the second compressor 7 may be reversed. That is, the first compressor 1 is controlled such that the tapping temperature approaches the target value, and the second compressor 7 is controlled so that the discharge pressure of the first refrigerant circuit 101 approaches the target value. Good. The second expansion valve 9 is controlled so that the degree of superheat, the discharge temperature, or the discharge pressure of the second refrigerant circuit 102 approaches the target value. The pump 11 is stopped. The pump 12 is operating. The flow

path switching devices

13, 14, and 15 are configured such that water flowing in from the outside through the inflow portion 120 a passes through the fifth heat exchanger 8 through the second circuit 122, and passes through the outflow portion 120 b to the outside. Set to spill.

In the heat retention mode, the first refrigerant circuit 101 and the second refrigerant circuit 102 constitute a dual cycle. Therefore, both the first refrigerant circuit 101 and the second refrigerant circuit 102 can be operated at a critical pressure or less, and the refrigerant can be condensed in both the first refrigerant circuit 101 and the second refrigerant circuit 102. Therefore, even if the incoming water temperature rises and the temperature difference between the incoming water temperature and the outgoing hot water temperature becomes smaller, the difference in enthalpy can be increased, so that operation with a high COP can be performed.

(Heat storage mode)
FIG. 4 is a diagram showing a state in the heat storage mode in the heat pump device according to the present embodiment. The heat storage mode is, for example, when there is no necessary heat amount on the load side and the operation in the hot water supply mode and the heat insulation mode is not performed, when the residual heat storage amount of the heat storage tank 10 is insufficient, or the residual heat storage amount of the heat storage tank 10 is insufficient It is executed when is predicted.

In the heat storage mode, the first compressor 1 is controlled so that the discharge pressure of the first refrigerant circuit 101 approaches the target value. The first expansion valve 4 is controlled such that the degree of superheat or the discharge temperature of the first refrigerant circuit 101 approaches the target value. In the third heat exchanger 5, heat exchange between the outdoor air blown by the blower fan and the first refrigerant is performed. The second compressor 7 is controlled so that the tapping temperature approaches the target value. The control target of the first compressor 1 and the control target of the second compressor 7 may be reversed. The second expansion valve 9 is controlled so that the degree of superheat, the discharge temperature, or the discharge pressure of the second refrigerant circuit 102 approaches the target value. The pump 11 is operating. The flow path switching device 16 is set so that the first fluid circulates through the second circulation circuit 112. The pump 12 is operating. The flow

path switching devices

13, 14, 15 are formed so as to form a closed circuit in which water circulates through the pump 12, the second circuit 122, the fifth heat exchanger 8, the third circuit 123, and the sixth heat exchanger 17. Is set. Thereby, in the 6th heat exchanger 17, the 1st fluid is heated by heat absorption from water. In the heat storage tank 10, the heat radiated from the first fluid is stored in the heat storage material.

In the heat storage mode, the first refrigerant circuit 101 and the second refrigerant circuit 102 constitute a dual cycle. Therefore, both the first refrigerant circuit 101 and the second refrigerant circuit 102 can be operated at a critical pressure or less, and the refrigerant can be condensed in both the first refrigerant circuit 101 and the second refrigerant circuit 102. Therefore, since the enthalpy difference can be increased even in the heat storage operation in which the incoming water temperature rises, the operation can be performed with a high COP.

(Capacity enhancement mode)
FIG. 5 is a diagram showing a state in the capacity enhancement mode in the heat pump device according to the present embodiment. In the capacity enhancement mode, for example, when the frequency of the first compressor 1 has reached the upper limit, the hot water temperature does not reach the target hot water temperature even when the high pressure side pressure of the first refrigerant circuit 101 reaches a predetermined value, or It is executed when the amount of hot water does not reach the target amount of hot water.

In the capacity enhancement mode, the first compressor 1 is controlled so that the discharge pressure of the first refrigerant circuit 101 approaches the target value. The first expansion valve 4 is controlled such that the degree of superheat or the discharge temperature of the first refrigerant circuit 101 approaches the target value. In the third heat exchanger 5, heat exchange between the outdoor air and the first refrigerant is not performed. That is, the blower fan is stopped. The second compressor 7 is controlled so that the tapping temperature approaches the target value. The control target of the first compressor 1 and the control target of the second compressor 7 may be reversed. The second expansion valve 9 is controlled so that the degree of superheat, the discharge temperature, or the discharge pressure of the second refrigerant circuit 102 approaches the target value. The pump 11 is operating. The flow path switching device 16 is set so that the first fluid circulates through the first circulation circuit 111. Thereby, in the 4th heat exchanger 6, a 1st refrigerant | coolant evaporates by the heat absorption from a 1st fluid. The pump 12 is operating. In the flow

path switching devices

13, 14, and 15, the water flowing in from the outside through the inflow portion 120a passes through the first heat exchanger 2 and the fifth heat exchanger 8 in series in this order, and passes through the outflow portion 120b. Is set to flow outside.

In the capacity enhancement mode, water is heated in two stages by the first heat exchanger 2 and the fifth heat exchanger 8. Thereby, since hot water supply capability can be improved, it becomes possible to raise the hot water temperature or to increase the amount of hot water. Further, in the capacity enhancement mode, the suction pressure of the first compressor 1 can be increased by supplying heat from the heat storage material to the first refrigerant circuit 101, so that a high capacity can be exhibited regardless of the outside air temperature. it can. Further, by cooling the low refrigerant side first refrigerant circuit 101 with the high refrigerant side second refrigerant circuit 102, an increase in discharge pressure can be suppressed even if the suction pressure of the first refrigerant circuit 101 increases. For this reason, the design pressure of the 1st refrigerant circuit 101 can be made low, and thickness, such as piping and a container, can be made thin. Further, in the capacity enhancement mode, the heat stored in the high COP is used as a heat source, so that the operation can be performed with the high COP. As described above, since a high capability can be obtained in the capability enhancement mode, the number of units and the installation area of the heat pump device can be reduced.

(Hot water supply and heat storage mode)
FIG. 6 is a diagram illustrating a state in the hot water supply and heat storage modes in the heat pump device according to the present embodiment. In the hot water supply and heat storage mode, for example, when the remaining heat storage amount of the heat storage tank 10 is insufficient during execution of the hot water supply mode, or when the shortage of the remaining heat storage amount of the heat storage tank 10 is predicted during execution of the hot water supply mode. Executed.

In the hot water supply and heat storage mode, the first compressor 1 is controlled so that the tapping temperature approaches the target value. The first expansion valve 4 is controlled such that the degree of superheat or the discharge temperature of the first refrigerant circuit 101 approaches the target value. In the third heat exchanger 5, heat exchange between the outdoor air blown by the blower fan and the first refrigerant is performed. The second compressor 7 is stopped. The pump 11 is operating. The flow path switching device 16 is set so that the first fluid circulates through the second circulation circuit 112. The pump 12 is operating. In the flow

path switching devices

13, 14, and 15, the water flowing in from the outside through the inflow portion 120a passes through the first heat exchanger 2 and the fifth heat exchanger 8 in series in this order, and passes through the outflow portion 120b. And a part of the water that has passed through the fifth heat exchanger 8 is diverted to the third circuit 123. The flow rate of water flowing out through the outflow portion 120b is adjusted according to the required heat amount from the load side. In addition, since the 2nd compressor 7 has stopped, in the 5th heat exchanger 8, heat exchange with a 2nd refrigerant | coolant and water is not performed.

In the hot water supply and heat storage mode, a surplus amount of heat can be stored while supplying a required amount of hot water to the load side. Therefore, it is not necessary to separately perform the operation in the heat storage mode, so that waste of energy can be reduced. Further, since the first refrigerant circuit 101 operates at a critical pressure or higher, it can be operated at a high COP.

(Heat retention and heat storage mode)
FIG. 7 is a diagram showing a state in the heat retention and heat storage mode in the heat pump apparatus according to the present embodiment. In the heat retention and heat storage mode, for example, when the remaining heat storage amount of the heat storage tank 10 is insufficient during execution of the heat retention mode, or when the shortage of the remaining heat storage amount of the heat storage tank 10 is predicted during execution of the heat retention mode. Executed. The heat retention and heat storage mode is executed, for example, when the incoming water temperature is equal to or higher than a predetermined temperature or the temperature difference between the incoming water temperature and the target hot water temperature is equal to or lower than a predetermined value during execution of the hot water supply and heat storage modes. The

In the heat retention and heat storage mode, the first compressor 1 is controlled such that the discharge pressure of the first refrigerant circuit 101 approaches the target value. The first expansion valve 4 is controlled such that the degree of superheat or the discharge temperature of the first refrigerant circuit 101 approaches the target value. In the third heat exchanger 5, heat exchange between the outdoor air blown by the blower fan and the first refrigerant is performed. The second compressor 7 is controlled so that the tapping temperature approaches the target value. The control target of the first compressor 1 and the control target of the second compressor 7 may be reversed. That is, the first compressor 1 is controlled such that the tapping temperature approaches the target value, and the second compressor 7 is controlled so that the discharge pressure of the first refrigerant circuit 101 approaches the target value. Good. The second expansion valve 9 is controlled so that the degree of superheat, the discharge temperature, or the discharge pressure of the second refrigerant circuit 102 approaches the target value. The pump 11 is operating. The flow path switching device 16 is controlled so that the first fluid circulates through the second circulation circuit 112. The pump 12 is operating. The flow

path switching devices

13, 14, and 15 are configured such that water flowing in from the outside through the inflow portion 120 a passes through the fifth heat exchanger 8 through the second circuit 122, and passes through the outflow portion 120 b to the outside. While flowing out, a part of the water that has passed through the fifth heat exchanger 8 is set to be diverted to the third circuit 123. The flow rate of water flowing out through the outflow portion 120b is adjusted according to the required heat amount from the load side.

In the heat retention and heat storage mode, it is possible to store a surplus amount of heat while supplying hot water of a necessary amount of heat to the load side. Therefore, it is not necessary to separately perform the operation in the heat storage mode, so that waste of energy can be reduced. In addition, since both the first refrigerant circuit 101 and the second refrigerant circuit 102 can be operated at a critical pressure or lower, even if the incoming water temperature rises and the temperature difference between the incoming water temperature and the outgoing hot water temperature becomes smaller, it is high. Can operate with COP.

(Quick start mode)
FIG. 8 is a diagram showing a state in the quick start mode in the heat pump apparatus according to the present embodiment. The quick start mode is executed when starting at least one of the first compressor 1 and the second compressor 7, for example. After the quick start mode is executed, it is possible to shift to any one of a hot water supply mode, a heat retention mode, a heat storage mode, a capacity enhancement mode, a hot water supply and a heat storage mode, or a heat retention and a heat storage mode.

In the quick start mode, the pump 11 of the heat storage circuit 110 is operated, and the flow path switching device 16 is set so that the first fluid circulates through the first circulation circuit 111. Further, in the quick start mode, the first refrigerant circuit 101, the second refrigerant circuit 102, and the water circuit 120 are in any one of the hot water supply mode, the heat retention mode, the heat storage mode, the capacity enhancement mode, the hot water supply and the heat storage mode, or the heat retention and the heat storage mode. It is controlled in the same way. In the example shown in FIG. 8, the first refrigerant circuit 101, the second refrigerant circuit 102, and the water circuit 120 are controlled in the same manner as in the hot water supply mode.

In the quick start mode, the heat storage material is used as the heat source, so the start-up time can be shortened. In addition, the necessary hot water temperature can be obtained immediately by executing the quick start mode. Therefore, since it is not necessary to provide a large hot water storage tank in the heat pump device, the installation area of the heat pump device can be reduced and the cost can be reduced. Further, if a circuit is configured in the same manner as the quick start mode when a liquid back occurs, the liquid back can be eliminated immediately. Therefore, the reliability of the heat pump device can be improved.

As described above, the heat pump device according to the present embodiment includes the first refrigerant circuit 101 that circulates the first refrigerant, the second refrigerant circuit 102 that circulates the second refrigerant, and the heat storage circuit that circulates the first fluid. 110, a water circuit 120 for circulating water, and a control device 200 for controlling the first refrigerant circuit 101, the second refrigerant circuit 102, the heat storage circuit 110, and the water circuit 120. The first refrigerant circuit 101 is a first heat exchanger 2 that performs heat exchange between the first compressor 1, the first refrigerant and water, and a second heat exchange that performs heat exchange between the first refrigerant and the second refrigerant. 3, first expansion valve 4, third heat exchanger 5 that performs heat exchange between the first refrigerant and the second fluid, and a fourth heat exchanger that performs heat exchange between the first refrigerant and the first fluid. 6 are connected in this order via piping. The second refrigerant circuit 102 includes a second compressor 7, a fifth heat exchanger 8 that performs heat exchange between the second refrigerant and water, a second expansion valve 9, and a second heat exchanger 3. Are connected in this order via the. The heat storage circuit 110 includes heat storage tank 10, first circulation circuit 111 that circulates the first fluid between heat storage tank 10 and fourth heat exchanger 6, heat storage tank 10, heat of the first fluid and water. A sixth heat exchanger 17 that performs the exchange, and a second circulation circuit 112 that circulates the first fluid therebetween. The water circuit 120 includes a first circuit 121 in which a pump 12 for pumping water, a first heat exchanger 2 and a fifth heat exchanger 8 are connected in this order via a pipe, and the pump 12 and the first heat exchanger. 2, the second circuit 122 branched from the first circuit 121 and connected to the first circuit 121 between the first heat exchanger 2 and the fifth heat exchanger 8, and the fifth heat exchanger 8. And a third circuit 123 branched from the first circuit 121 on the downstream side of the first circuit 121 and connected to the first circuit 121 on the upstream side of the pump 12 via the sixth heat exchanger 17.

According to this configuration, in the heat retention mode, both the first refrigerant circuit 101 and the second refrigerant circuit 102 can be operated at a critical pressure or lower. Therefore, according to the present embodiment, a high COP can be obtained not only in the hot water supply mode but also in the heat retention mode. Further, according to this configuration, in the capacity enhancement mode, water can be heated in two stages by the first heat exchanger 2 and the fifth heat exchanger 8. Therefore, according to the present embodiment, the maximum capacity can be improved while suppressing an increase in the unit size of the heat pump apparatus. In other words, it is possible to reduce the number of units and the installation area while maintaining the maximum capacity of the heat pump device. Further, according to this configuration, it is possible to store an excessive amount of heat in the hot water supply and heat storage mode and the heat retention and heat storage mode. Therefore, according to the present embodiment, waste of energy can be reduced. Moreover, according to this structure, the heat exchange between the heat storage material in the heat storage tank 10 and water is performed via the first fluid. Thereby, since heat exchange with a heat storage material and water is not performed by a heat exchanger, it can prevent that a heat storage material flows out to the load side.

Further, in the heat pump device according to the present embodiment, control device 200 can execute a first operation mode (for example, a hot water supply mode). In first operation mode, first compressor 1 is operated and second operation is performed. The compressor 7 is stopped, and the water circuit 120 is controlled so that the water pumped by the pump 12 flows out through the first heat exchanger 2 and the fifth heat exchanger 8.

In the heat pump device according to the present embodiment, the control device 200 can execute the second operation mode (for example, the heat retention mode), and in the second operation mode, the first compressor 1 and the second compressor 7. The water circuit 120 is controlled so that the water pumped by the pump 12 flows out through the second circuit 122 and the fifth heat exchanger 8.

Moreover, in the heat pump device according to the present embodiment, control device 200 has a case where the water temperature of the inflowing water is equal to or higher than a predetermined temperature, or the difference between the water temperature of the inflowing water and the target hot water temperature is equal to or lower than the predetermined value. Then, the second operation mode is executed.

In the heat pump device according to the present embodiment, the control device 200 can execute the third operation mode (for example, the heat storage mode), and in the third operation mode, the first compressor 1 and the second compressor 7. The heat storage circuit 110 is controlled so that the first fluid circulates in the second circulation circuit 112, and the water pumped by the pump 12 passes through the second circuit 122, the fifth heat exchanger 8, and the third circuit 123. The water circuit 120 is controlled to circulate.

In the heat pump device according to the present embodiment, the control device 200 is configured to operate in the third operation mode when the remaining heat storage amount of the heat storage tank 10 is insufficient or when the remaining heat storage amount of the heat storage tank 10 is predicted to be insufficient. Execute.

In the heat pump device according to the present embodiment, the control device 200 can execute the fourth operation mode (for example, the capacity enhancement mode). In the fourth operation mode, the first compressor 1 and the second compressor 7 is operated, the heat storage circuit 110 is controlled so that the first fluid circulates through the first circulation circuit 111, and the water pumped by the pump 12 passes through the first heat exchanger 2 and the fifth heat exchanger 8. The water circuit 120 is controlled to flow out.

Moreover, in the heat pump device according to the present embodiment, the control device 200 sets the target hot water temperature even when the frequency of the first compressor 1 reaches the upper limit or the high-pressure side pressure of the first refrigerant circuit 101 reaches a predetermined value. When the tapping temperature is not reached or the tapping water amount does not reach the target tapping water amount, the fourth operation mode is executed.

Further, in the heat pump device according to the present embodiment, control device 200 can execute the fifth operation mode (for example, hot water supply and heat storage mode), and in the fifth operation mode, first compressor 1 operates. The heat storage circuit 110 is controlled so that the second compressor 7 is stopped and the first fluid circulates through the second circulation circuit 112, and water pumped by the pump 12 is used for the first heat exchanger 2 and the fifth heat exchanger. The water circuit 120 is controlled so that a part of the water that has flowed out through the water 8 and passed through the fifth heat exchanger 8 is diverted to the third circuit 123.

Further, in the heat pump device according to the present embodiment, the control device 200 is the fifth operation mode when the remaining heat storage amount of the heat storage tank 10 is insufficient or when the remaining heat storage amount of the heat storage tank 10 is predicted to be insufficient. Execute.

In the heat pump device according to the present embodiment, the control device 200 can execute the sixth operation mode (for example, the heat retention and heat storage mode), and in the sixth operation mode, the first compressor 1 and the second compression are performed. The heat storage circuit 110 is controlled so that the first fluid circulates through the second circulation circuit 112, and the water pumped by the pump 12 passes through the second circuit 122 and the fifth heat exchanger 8. While flowing out, the water circuit 120 is controlled so that a part of the water that has passed through the fifth heat exchanger 8 is diverted to the third circuit 123.

Moreover, in the heat pump device according to the present embodiment, the control device 200 switches the sixth operation mode when the incoming water temperature is equal to or higher than a predetermined temperature or when the difference between the incoming water temperature and the target hot water temperature is equal to or lower than a predetermined value. Execute.

Further, in the heat pump device according to the present embodiment, the control device 200 is configured to operate in the sixth operation mode when the residual heat storage amount of the heat storage tank 10 is insufficient or when the residual heat storage amount of the heat storage tank 10 is predicted to be insufficient. Execute.

In the heat pump device according to the present embodiment, the control device 200 can execute the seventh operation mode (for example, the quick start mode) when starting at least one of the first compressor 1 and the second compressor 7. In the seventh operation mode, the heat storage circuit 110 is controlled so that the first fluid circulates through the first circulation circuit 111.

Further, in the heat pump device according to the present embodiment, the first fluid is a heat medium that exchanges heat with the heat storage material in the heat storage tank 10.

Further, in the heat pump device according to the present embodiment, the first refrigerant operates at a critical pressure or higher in an operating state where at least the first compressor 1 is operating and the second compressor 7 is stopped.

In the heat pump device according to the present embodiment, the first refrigerant includes CO ₂ in at least one component.

Further, in the heat pump device according to the present embodiment, the second refrigerant operates at a critical pressure or lower.

In the heat pump device according to the present embodiment, the operating pressure of the second refrigerant is lower than the operating pressure of the first refrigerant.

Embodiment 2. FIG.
A heat pump device according to Embodiment 2 of the present invention will be described. In the present embodiment, a latent heat storage material having a melting point higher than 0 ° C. is used as the heat storage material sealed in the heat storage tank 10. For example, when the heat storage material is used as a heat source in the capacity enhancement mode, the solidification temperature is kept constant until the entire heat storage material becomes solid. Therefore, the evaporation temperature in the first refrigerant circuit 101 does not decrease, and the capacity can be kept constant.

Embodiment 3 FIG.
A heat pump device according to Embodiment 3 of the present invention will be described. In the present embodiment, a fluid heat storage material is used as the heat storage material. As the first fluid circulating through the heat storage circuit 110, a heat storage material having fluidity is used. As a result, the heat storage material can be flowed by the pump 11.

Embodiment 4 FIG.
A heat pump device according to Embodiment 4 of the present invention will be described. In the present embodiment, a capsule-type heat storage material is used as the heat storage material. FIG. 9 is a diagram showing a schematic configuration of a capsule-type heat storage material used in the heat pump device according to the present embodiment. As illustrated in FIG. 9, the capsule-type heat storage material includes a capsule 131 (for example, a microcapsule) that encloses a heat storage material 130 (for example, a latent heat storage material). In the present embodiment, a liquid in which a plurality of capsules 131 containing the heat storage material 130 are dispersed is used as the first fluid circulating in the heat storage circuit 110.

Since the capsule-type heat storage material is not handled as a dangerous material, according to the present embodiment, the safety of the heat pump device can be improved. Further, since the heat storage material is covered with the capsule, the heat storage material is not laminated on the cooling surface even if the heat storage material is solidified. For this reason, the thermal resistance is unlikely to increase and the heat transfer performance can be kept high.

Embodiment 5 FIG.
A heat pump apparatus according to Embodiment 5 of the present invention will be described. The first circuit 121 in the present embodiment is connected to a hot water storage tank (not shown) on the downstream side of the branch portion (flow path switching device 15) with the third circuit 123. The hot water storage tank may be provided as a part of the heat pump device, or may be provided separately from the heat pump device. The hot water storage tank has such a size that a predetermined amount of heat can be supplied to the load side during the time from the start of the heat pump device to the arrival of a predetermined hot water temperature. The heat storage capacity of the hot water storage tank is smaller than the heat storage capacity of the heat storage tank 10. In the present embodiment, the hot water is discharged from the hot water storage tank during the time from when the heat pump device is activated until the predetermined hot water temperature or the predetermined discharge pressure is reached. According to the present embodiment, it is possible to obtain a predetermined hot water temperature earlier than in the quick start mode.

Embodiment 6 FIG.
A heat pump device according to Embodiment 6 of the present invention will be described. FIG. 10 is a circuit diagram showing a schematic circuit configuration of the heat pump device according to the present embodiment. As shown in FIG. 10, the first refrigerant circuit 101 is provided with a bypass circuit 20 as a defrost circuit for defrosting the third heat exchanger 5. The bypass circuit 20 branches from the first refrigerant circuit 101 between the first compressor 1 and the first heat exchanger 2, and the first refrigerant circuit between the first expansion valve 4 and the third heat exchanger 5. 101. The bypass circuit 20 is provided with a bypass valve 21 that is opened during the defrosting operation.

During the defrosting operation, the first compressor 1 and the pump 11 are operated, and the second compressor 7 and the pump 12 are stopped. The first expansion valve 4 is set to the minimum opening. The bypass valve 21 is opened. The flow path switching device 16 is set so that the first fluid circulates through the first circulation circuit 111. The flow path switching device 13 is set so that the inflow portion 120a side is closed. Thereby, hot gas flows into the 3rd heat exchanger 5, and the frost adhering to the 3rd heat exchanger 5 melts. The refrigerant condensed in the third heat exchanger 5 evaporates in the fourth heat exchanger 6 using the heat storage material as a heat source. Therefore, since the liquid back | bag to the 1st compressor 1 can be suppressed, the reliability of a heat pump apparatus can be improved. Moreover, defrosting time can be shortened by using a heat storage material as a heat source. Furthermore, since defrosting is performed using the amount of heat stored in a high COP, high operating efficiency can be obtained.

Embodiment 7 FIG.
A heat pump apparatus according to Embodiment 7 of the present invention will be described. FIG. 11 is a circuit diagram showing a schematic circuit configuration of the heat pump device according to the present embodiment. As shown in FIG. 11, a third expansion valve 22 is provided between the third heat exchanger 5 and the fourth heat exchanger 6 of the first refrigerant circuit 101. Other configurations are the same as those in the sixth embodiment.

In the defrosting operation, in addition to the same operation as in the sixth embodiment, the third expansion valve 22 is controlled such that the suction superheat degree, the discharge temperature, or the discharge superheat degree of the first compressor 1 approaches the target value. Or a predetermined opening. Thereby, the discharge pressure of the 1st compressor 1 rises and the temperature of the refrigerant | coolant which flows in into the 3rd heat exchanger 5 rises. Therefore, defrosting of the 3rd heat exchanger 5 can be performed efficiently.

Embodiment 8 FIG.
A heat pump apparatus according to Embodiment 8 of the present invention will be described. In the present embodiment, the control device 200 estimates the remaining heat storage amount in the heat storage tank 10 based on the heat amount discharged from the heat pump device or the heat amount stored in the heat storage tank 10. For example, the control device 200 estimates the remaining heat storage amount in the heat storage tank 10 based on the flow rate of the first fluid in the heat storage circuit 110 and the inlet temperature and outlet temperature of the heat storage tank 10. Alternatively, the control device 200 may calculate the remaining heat storage amount in the heat storage tank 10 based on the temperature distribution in the heat storage tank 10. The control device 200 performs a heat storage operation (for example, an operation in the heat storage mode, the hot water supply and heat storage mode, or the heat retention and heat storage mode) based on the estimated or calculated remaining heat storage amount. Thereby, since the shortage of the heat storage amount can be prevented, it is possible to always cope with the capacity enhancement mode or the quick start mode.

Embodiment 9 FIG.
A heat pump device according to Embodiment 9 of the present invention will be described. In this Embodiment, the control apparatus 200 learns required heat storage amount from the daily operation | movement condition of a heat pump apparatus, and performs heat storage operation so that heat storage amount may not run short. Thereby, since the shortage of the heat storage amount can be prevented, it is possible to always cope with the capacity enhancement mode or the quick start mode.

Embodiment 10 FIG.
A heat pump apparatus according to Embodiment 10 of the present invention will be described. FIG. 12 is a schematic diagram showing a physical configuration of the heat pump device according to the present embodiment. As shown in FIG. 12, the heat pump apparatus includes a first housing 105 that houses at least the first refrigerant circuit 101 and a second housing 106 that houses at least the second refrigerant circuit 102. The first housing 105 and the second housing 106 are arranged in a stacked manner, and the first housing 105 is stacked on top of the second housing 106.

The first refrigerant circuit 101 is provided with a third heat exchanger 5 that is an air-refrigerant heat exchanger and a blower fan 107 that blows air to the third heat exchanger 5. The third heat exchanger 5 is disposed on the side portion of the first housing 105, and the blower fan 107 is disposed on the top portion of the first housing 105. As shown by the arrows in FIG. 12, the air blown by the blower fan 107 flows from the side portion of the first housing 105 toward the top portion. According to the present embodiment, the air flow in the first housing 105 can be prevented from being obstructed by the second housing 106, and the installation area of the heat pump device can be reduced.

The above embodiments can be implemented in combination with each other.

1 1st compressor, 2nd 1st heat exchanger, 3rd 2nd heat exchanger, 4th 1st expansion valve, 5th 3rd heat exchanger, 6th 4th heat exchanger, 7th 2nd compressor, 8th 5th heat Exchanger, 9 Second expansion valve, 10 Heat storage tank, 11, 12, Pump, 13, 14, 15, 16 Channel switching device, 17 Sixth heat exchanger, 20 Bypass circuit, 21 Bypass valve, 22 Third expansion valve 101 First refrigerant circuit, 102 Second refrigerant circuit, 103 Dual heat pump circuit, 105 First housing, 106 Second housing, 107 Blower fan, 110 Heat storage circuit, 111 First circulation circuit, 112 Second circulation circuit , 120 water circuit, 120a inflow part, 120b outflow part, 121 first circuit, 122 second circuit, 123 third circuit, 130 heat storage material, 131 capsule, 200 control device.

Claims

A first refrigerant circuit for circulating the first refrigerant;
A second refrigerant circuit for circulating the second refrigerant;
A heat storage circuit for circulating the first fluid;
A water circuit for circulating water,
The first refrigerant circuit includes
A first compressor;
A first heat exchanger for exchanging heat between the first refrigerant and water;
A second heat exchanger for exchanging heat between the first refrigerant and the second refrigerant;
A first expansion valve;
A third heat exchanger for exchanging heat between the first refrigerant and the second fluid;
A fourth heat exchanger for exchanging heat between the first refrigerant and the first fluid, and having a configuration connected in this order via a pipe;
The second refrigerant circuit includes
A second compressor;
A fifth heat exchanger for exchanging heat between the second refrigerant and water;
A second expansion valve;
The second heat exchanger and the second heat exchanger are connected in this order through a pipe,
The heat storage circuit is
A heat storage tank,
A first circulation circuit for circulating the first fluid between the heat storage tank and the fourth heat exchanger;
A second circulation circuit that circulates the first fluid between the heat storage tank and a sixth heat exchanger that exchanges heat between the first fluid and water;
The water circuit is
A first circuit in which a pump for pumping water, the first heat exchanger, and the fifth heat exchanger are connected;
A second circuit branched from the first circuit between the pump and the first heat exchanger and connected to the first circuit between the first heat exchanger and the fifth heat exchanger; ,
A third circuit branched from the first circuit on the downstream side of the fifth heat exchanger, connected to the first circuit on the upstream side of the pump via the sixth heat exchanger, and Heat pump device.
The heat pump device according to claim 1, further comprising a control device that controls the first refrigerant circuit, the second refrigerant circuit, the heat storage circuit, and the water circuit.
The control device is capable of executing a first operation mode,
In the first operation mode,
The first compressor is operated and the second compressor is stopped;
The heat pump device according to claim 2, wherein the water circuit is controlled such that water pumped by the pump flows out through the first heat exchanger and the fifth heat exchanger.
The control device is capable of executing a second operation mode;
In the second operation mode,
The first compressor and the second compressor are operated,
The heat pump device according to claim 2 or 3, wherein the water circuit is controlled so that water pumped by the pump flows out through the second circuit and the fifth heat exchanger.
The said control apparatus performs said 2nd operation mode, when the water temperature of inflowing water is more than predetermined temperature, or the difference of the water temperature of inflowing water and target hot-water temperature is below a predetermined value. The heat pump device described in 1.
The control device is capable of executing a third operation mode;
In the third operation mode,
The first compressor and the second compressor are operated,
The heat storage circuit is controlled so that the first fluid circulates through the second circulation circuit;
6. The water circuit according to claim 2, wherein the water circuit is controlled such that water pumped by the pump circulates through the second circuit, the fifth heat exchanger, and the third circuit. Heat pump device.
The heat pump device according to claim 6, wherein the control device executes the third operation mode when the remaining heat storage amount of the heat storage tank is insufficient or when the remaining heat storage amount of the heat storage tank is predicted to be insufficient. .
The control device is capable of executing a fourth operation mode;
In the fourth operation mode,
The first compressor and the second compressor are operated,
The heat storage circuit is controlled so that the first fluid circulates in the first circulation circuit;
The water circuit is controlled according to any one of claims 2 to 7, wherein the water circuit is controlled so that water pumped by the pump flows out through the first heat exchanger and the fifth heat exchanger. Heat pump device.
In the control device, the tapping temperature does not reach the target tapping temperature even if the frequency of the first compressor reaches the upper limit, the high pressure side pressure of the first refrigerant circuit reaches a predetermined value, or the tapping water amount is The heat pump device according to claim 8, wherein the fourth operation mode is executed when the target amount of hot water is not reached.
The control device is capable of executing a fifth operation mode;
In the fifth operation mode,
The first compressor is operated and the second compressor is stopped;
The heat storage circuit is controlled so that the first fluid circulates through the second circulation circuit;
Water pumped by the pump flows out through the first heat exchanger and the fifth heat exchanger, and part of the water that has passed through the fifth heat exchanger is diverted to the third circuit. The heat pump device according to any one of claims 2 to 9, wherein the water circuit is controlled as described above.
11. The heat pump device according to claim 10, wherein the control device executes the fifth operation mode when a residual heat storage amount of the heat storage tank is insufficient or a shortage of a residual heat storage amount of the heat storage tank is predicted. .
The control device is capable of executing a sixth operation mode;
In the sixth operation mode,
The first compressor and the second compressor are operated,
The heat storage circuit is controlled so that the first fluid circulates through the second circulation circuit;
The water pumped by the pump flows out through the second circuit and the fifth heat exchanger, and part of the water that has passed through the fifth heat exchanger is diverted to the third circuit. The heat pump device according to any one of claims 2 to 11, wherein the water circuit is controlled.
The heat pump device according to claim 12, wherein the control device executes the sixth operation mode when the incoming water temperature is equal to or higher than a predetermined temperature, or when the difference between the incoming water temperature and the target hot water temperature is equal to or lower than a predetermined value.
The heat pump device according to claim 12, wherein the control device executes the sixth operation mode when the remaining heat storage amount of the heat storage tank is insufficient or when the remaining heat storage amount of the heat storage tank is predicted to be insufficient. .
The control device is capable of executing a seventh operation mode when starting at least one of the first compressor and the second compressor;
In the seventh operation mode,
The heat pump device according to any one of claims 2 to 14, wherein the heat storage circuit is controlled so that the first fluid circulates in the first circulation circuit.
The heat pump device according to any one of claims 2 to 15, wherein the control device calculates a remaining heat storage amount of the heat storage tank based on a heat output amount or a heat amount stored in the heat storage tank.
The heat pump device according to any one of claims 2 to 15, wherein the control device calculates a remaining heat storage amount of the heat storage tank based on a temperature distribution in the heat storage tank.
Branched from the first refrigerant circuit between the first compressor and the first heat exchanger, and connected to the first refrigerant circuit between the first expansion valve and the third heat exchanger A further bypass circuit;
The heat pump device according to any one of claims 1 to 17, wherein the bypass circuit includes a bypass valve.
The heat pump device according to claim 18, wherein the first refrigerant circuit has a third expansion valve provided between the third heat exchanger and the fourth heat exchanger.
The heat pump device according to any one of claims 1 to 19, wherein the first fluid is a heat storage material having fluidity.
The heat pump device according to any one of claims 1 to 20, wherein the first fluid is a liquid in which a plurality of capsules containing a heat storage material are dispersed.
The heat pump device according to any one of claims 1 to 19, wherein the first fluid is a heat medium that exchanges heat with a heat storage material in the heat storage tank.
The heat pump device according to any one of claims 20 to 22, wherein the heat storage material is a latent heat storage material.
The first refrigerant operates at a critical pressure or higher in at least an operation state in which the first compressor is operated and the second compressor is stopped. Heat pump device.
The heat pump device according to any one of claims 1 to 24, wherein the first refrigerant includes CO 2 as at least one component.
The heat pump device according to any one of claims 1 to 25, wherein the second refrigerant operates at a critical pressure or less.
The heat pump device according to any one of claims 1 to 26, wherein an operating pressure of the second refrigerant is lower than an operating pressure of the first refrigerant.
The heat pump device according to any one of claims 1 to 27, wherein the first circuit is connected to a hot water storage tank on a downstream side of a branch portion with the third circuit.
The heat pump device according to claim 28, wherein a heat storage capacity of the hot water storage tank is smaller than a heat storage capacity of the heat storage tank.
A first housing containing at least the first refrigerant circuit;
A second housing that houses at least the second refrigerant circuit;
The heat pump device according to any one of claims 1 to 29, wherein the first housing is stacked on top of the second housing.