WO2018006440A1 - 电磁屏蔽保护膜与fpc - Google Patents

电磁屏蔽保护膜与fpc Download PDF

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Publication number
WO2018006440A1
WO2018006440A1 PCT/CN2016/090578 CN2016090578W WO2018006440A1 WO 2018006440 A1 WO2018006440 A1 WO 2018006440A1 CN 2016090578 W CN2016090578 W CN 2016090578W WO 2018006440 A1 WO2018006440 A1 WO 2018006440A1
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WIPO (PCT)
Prior art keywords
electromagnetic shielding
film
layer
thickness
fpc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/090578
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English (en)
French (fr)
Inventor
曹洪睿
周锦杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US15/122,409 priority Critical patent/US20180206330A1/en
Publication of WO2018006440A1 publication Critical patent/WO2018006440A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/04—4 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/408—Matt, dull surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an electromagnetic shielding protective film and an FPC.
  • Flexible printed circuit also known as flexible circuit board, is made of polyester film or polyimide and is formed by etching on copper foil. Excellently flexible printed circuit.
  • the FPC is made of a flexible substrate, it has many advantages that the rigid printed circuit board does not have, for example, it can be freely bent, wound, folded, can be arbitrarily arranged according to the spatial layout requirements, and can be arbitrarily moved and expanded in a three-dimensional space, thereby The integration of component assembly and wire connection is achieved.
  • the use of FPC can greatly reduce the volume of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDAs, digital cameras and other fields or products.
  • the application of FPC on the smartphone is mainly to connect the mobile phone motherboard and the display module to complete the signal transmission.
  • the FPC used in the mobile phone display industry needs to be pressed onto the glass and then bent to the back of the glass. Therefore, it is necessary to provide at least a soft and easily bendable region, that is, a bending region, on the FPC.
  • the existing FPC generally includes a bending zone 200 and a gold finger zone 100 and a signal line zone 300 respectively disposed on both sides of the bending zone 200.
  • the FPC is connected to the display module through the gold finger area 100, and the signal line area 300 of the FPC is connected to the mobile phone main board through the connector, thereby realizing the function of connecting the mobile phone main board and the display module.
  • an electromagnetic shielding composite film 500 is usually applied on the signal line area 300 of the FPC to shield the interference.
  • the electromagnetic shielding composite The film 500 generally includes an adhesive layer 510, a polyimide film 520, and an electromagnetic shielding film (EMI film) 530 which are sequentially laminated, and the thickness of the adhesive layer 510 is usually 15 ⁇ m.
  • the thickness of the amine film 520 is usually 12.5 micrometers
  • the electromagnetic shielding film 530 is a commercially available product, which generally includes a conductive adhesive layer 531, a silver layer 532, and an insulating layer 533 which are sequentially laminated, and the electromagnetic shielding film 530.
  • the thickness is usually 22 ⁇ m, so the total thickness of the electromagnetic shielding composite film 500 is 49.5 ⁇ m.
  • An object of the present invention is to provide an electromagnetic shielding protective film which has a simple structure, a thin thickness, and excellent electromagnetic shielding performance.
  • the thickness of the bending zone is thin, so that it has good bending performance.
  • the present invention provides an electromagnetic shielding protective film comprising an adhesive layer, a conductive material layer, and an insulating protective layer which are sequentially laminated.
  • the conductive material layer is a metal thin film or a plurality of metal particles uniformly distributed.
  • the material of the metal thin film and the metal particles is silver.
  • the conductive material layer has a thickness of 1 to 15 ⁇ m
  • the adhesive layer has a thickness of 1 to 20 ⁇ m
  • the insulating protective layer has a thickness of 2 to 15 ⁇ m.
  • the electromagnetic shielding protective film further includes a first release film attached to a surface of the adhesive layer, and a second release film attached to a surface of the insulation protection layer.
  • the invention also provides an FPC, comprising a bending zone, and a gold finger zone and a signal line zone respectively disposed on two sides of the bending zone, the bending zone being covered with an electromagnetic shielding protective film, the electromagnetic shielding
  • the protective film includes an adhesive layer, a conductive material layer, and an insulating protective layer which are sequentially laminated, and the electromagnetic shielding protective film is attached to the bending region with an adhesive layer.
  • the conductive material layer is a metal thin film or a plurality of metal particles uniformly distributed.
  • the material of the metal thin film and the metal particles is silver.
  • the conductive material layer has a thickness of 1 to 15 ⁇ m
  • the adhesive layer has a thickness of 1 to 20 ⁇ m
  • the insulating protective layer has a thickness of 2 to 15 ⁇ m.
  • the signal line region is covered with the electromagnetic shielding protective film or the electromagnetic shielding composite film, and the electromagnetic shielding composite film comprises an adhesive layer, a polyimide film, and an electromagnetic shielding film which are sequentially laminated, and the electromagnetic shielding film
  • the shielding film comprises a conductive adhesive layer, a silver layer and an insulating layer which are sequentially laminated on the polyimide film; the electromagnetic shielding protective film and the electromagnetic shielding composite film are attached to the signal line region by an adhesive layer. on.
  • the present invention also provides an electromagnetic shielding protective film comprising an adhesive layer sequentially laminated, a conductive material layer, an insulating protective layer, a first release film attached to the surface of the adhesive layer, and a sticker a second release film on the surface of the insulating protective layer;
  • the conductive material layer is a metal thin film or a plurality of metal particles uniformly distributed.
  • the invention has the beneficial effects that the electromagnetic shielding protective film provided by the invention has the advantages of simple structure, thin thickness and excellent electromagnetic shielding performance, and is especially suitable for covering the bending region of the FPC, thereby ensuring the bending zone.
  • the electromagnetic shielding effect ensures that the thickness of the bending zone is thin, so that it has good bending performance.
  • the FPC provided by the invention can cover the electromagnetic shielding protective film on the bending zone instead of the traditional electromagnetic shielding composite film with larger thickness, thereby ensuring the electromagnetic shielding effect of the bending zone and ensuring the bending zone.
  • the thinner thickness makes it have better bending performance.
  • FIG. 1 is a schematic structural view of a conventional FPC
  • FIG. 2 is a schematic structural view of a conventional electromagnetic shielding composite film
  • FIG. 3 is a schematic structural view of an electromagnetic shielding protective film of the present invention.
  • FIG. 4 is a schematic structural view of a first embodiment of an FPC of the present invention.
  • Figure 5 is a schematic view showing the structure of a second embodiment of the FPC of the present invention.
  • the present invention provides an electromagnetic shielding protective film 40 comprising an adhesive layer 41, a conductive material layer 42, and an insulating protective layer 43 which are sequentially laminated.
  • the conductive material layer 42 is a metal thin film or a plurality of metal particles uniformly distributed.
  • the material of the metal thin film and the metal particles is silver (Ag).
  • the conductive material layer 42 has a thickness of 1 to 15 ⁇ m, preferably 5 ⁇ m.
  • the material of the adhesive layer 41 includes an epoxy resin, an acrylic resin, a urethane resin, a silicone rubber resin, a poly-p-xylene resin, and a bismaleimide tree. At least one of a grease and a polyimide resin, the adhesive layer 41 has a thickness of 1 to 20 ⁇ m, preferably 15 ⁇ m.
  • the insulating protective layer 43 is a polyimide film, and the insulating protective layer 43 has a thickness of 2 to 15 ⁇ m, preferably 12.5 ⁇ m.
  • the electromagnetic shielding protection film 40 further includes a first release film 44 attached to the surface of the adhesive layer 41, the first release film 44 is a PET fluoroplastic release film, and the PET silicone oil One of a release film, a PET matte release film, and a PE release film, the first release film 44 having a thickness of 25 to 100 ⁇ m.
  • the electromagnetic shielding protective film 40 is used, the first release film 44 needs to be torn off, and the adhesive layer 41 is attached to the surface of the object to be attached.
  • the electromagnetic shielding protection film 40 further includes a second release film 45 attached to the surface of the insulating protection layer 43.
  • the second release film 45 is a PET fluoroplastic release film, and the PET contains silicone oil.
  • the electromagnetic shielding protective film 40 is used, the second release film 45 needs to be torn off.
  • the electromagnetic shielding protective film Compared with the conventional electromagnetic shielding composite film, the electromagnetic shielding protective film has the advantages of simple structure, thin thickness and excellent electromagnetic shielding performance, and is particularly suitable for covering the bending region of the FPC, thereby ensuring the bending zone.
  • the electromagnetic shielding effect ensures that the thickness of the bending zone is thin, so that it has good bending performance.
  • the present invention further provides an FPC including a bending area 22 and a gold finger area 21 and a signal line area 23 respectively disposed on both sides of the bending area 22, the bending area
  • the electromagnetic shielding protective film 40 includes an adhesive layer 41, a conductive material layer 42 and an insulating protective layer 43 which are sequentially laminated, and the electromagnetic shielding protective film 40 is made of an adhesive. Layer 41 is attached to the bend zone 22.
  • the gold finger area 21 is connected to the display module, and the signal line area 23 is connected to the mobile phone main board through the connector, so that the connection between the mobile phone main board and the display module is realized by the FPC. .
  • the conductive material layer 42 is a metal thin film or a plurality of metal particles uniformly distributed.
  • the material of the metal thin film and the metal particles is silver.
  • the conductive material layer 42 has a thickness of 1 to 15 ⁇ m, preferably 5 ⁇ m.
  • the material of the adhesive layer 41 includes an epoxy resin, an acrylic resin, a urethane resin, a silicone rubber resin, a poly-p-xylene resin, and a bismaleimide resin.
  • the adhesive layer 41 has a thickness of 1 to 20 ⁇ m, preferably 15 ⁇ m, and at least one of polyimide resins.
  • the insulating protective layer 43 is a polyimide film, and the insulating protective layer 43 The thickness is from 2 to 15 microns, preferably 12.5 microns.
  • the electromagnetic shielding protection film 40 further includes a first release film 44 attached to the surface of the adhesive layer 41, the first release film 44 is a PET fluoroplastic release film, and the PET silicone oil One of a release film, a PET matte release film, and a PE release film, the first release film 44 having a thickness of 25 to 100 ⁇ m.
  • the electromagnetic shielding protective film 40 is used, the first release film 44 needs to be torn off, and the adhesive layer 41 is attached to the surface of the object to be attached.
  • the electromagnetic shielding protection film 40 further includes a second release film 45 attached to the surface of the insulating protection layer 43.
  • the second release film 45 is a PET fluoroplastic release film, and the PET contains silicone oil.
  • the electromagnetic shielding protective film 40 is used, the second release film 45 needs to be torn off.
  • the signal line area 23 is covered with the electromagnetic shielding protection film 40 (shown in FIG. 4) or a conventional electromagnetic shielding composite film 500 (shown in FIG. 5), as shown in FIG.
  • the electromagnetic shielding composite film 500 includes an adhesive layer 510, a polyimide film 520, and an electromagnetic shielding film 530 which are sequentially laminated, and the electromagnetic shielding film 530 includes a conductive adhesive which is sequentially laminated on the polyimide film 520.
  • the layer 531, the silver layer 532, and the insulating layer 533; the electromagnetic shielding protective film 40 and the electromagnetic shielding composite film 500 are attached to the signal line region 23 with an adhesive layer 41/510.
  • the insulating layer 533 is an organic insulating material.
  • the adhesive layer 510 has a thickness of 15 micrometers
  • the polyimide film 520 has a thickness of 12.5 micrometers
  • the electromagnetic shielding film 530 has a thickness of 22 micrometers.
  • the FPC can cover the electromagnetic shielding protective film 40 having a thin thickness on the bending region 22 instead of the conventional electromagnetic shielding composite film 500 having a large thickness, thereby ensuring the electromagnetic shielding effect of the bending region 22 and ensuring the bending.
  • the thickness of the folding area 22 is relatively thin, so that it has better bending performance, thereby reducing the assembly difficulty of the display module and the mobile phone main board.
  • the present invention provides an electromagnetic shielding protective film and an FPC.
  • the electromagnetic shielding protective film of the invention has the advantages of simple structure, thin thickness and excellent electromagnetic shielding performance, and is especially suitable for covering the bending region of the FPC, thereby ensuring the electromagnetic shielding effect of the bending zone and ensuring the bending
  • the thickness of the fold zone is relatively thin, so that it has good bending properties.
  • the FPC of the invention can not only ensure the electromagnetic shielding effect of the bending zone but also ensure the thickness of the bending zone by covering the electromagnetic shielding protective film on the bending zone instead of the traditional electromagnetic shielding composite film with a large thickness. Thin, so that it has better bending performance.
  • the FPC of the present invention is used to connect the display module to the mobile phone motherboard, the assembly difficulty of the display module and the mobile phone motherboard can be significantly reduced.

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Abstract

一种电磁屏蔽保护膜（40）与FPC，电磁屏蔽保护膜（40），结构简单，厚度较薄，且具有优异的电磁屏蔽性能，尤其适用于对FPC的弯折区（22）进行覆盖，既能保证弯折区（22）的电磁屏蔽效果，又能保证弯折区（22）的厚度较薄，使其具有较好的弯折性能。FPC通过在弯折区（22）上覆盖上述电磁屏蔽保护膜（40），代替传统的厚度较大的电磁屏蔽复合膜（500），既能保证弯折区（22）的电磁屏蔽效果，又能保证弯折区（22）的厚度较薄，使其具有较好的弯折性能，采用该FPC来连接显示模组与手机主板时，可显著降低显示模组与手机主板的组装难度。

Description

电磁屏蔽保护膜与FPC 技术领域
本发明涉及显示技术领域，尤其涉及一种电磁屏蔽保护膜与FPC。
背景技术
挠性电路板(FPC，Flexible Printed Circuit)又称软性电路板，是以聚脂薄膜或聚酰亚胺为基材，通过蚀刻在铜箔上形成线路而制成的一种具有高度可靠性，绝佳挠曲性的印刷电路。
由于FPC使用柔性基材制成，其具有许多硬性印刷电路板不具备的优点，例如它可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用FPC可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠方向发展的需要。因此，FPC在航天、军事、移动通讯、手提电脑、计算机外设、PDA、数字相机等领域或产品上得到了广泛的应用。
FPC在智能手机上的应用主要是连接手机主板和显示模组，进而完成信号的传递。在FPC板上有很多像金色手指一样由众多金黄色的导电触片组成的区域，因其表面镀金而且导电触片排列如手指状，所以称为“金手指”。目前在手机显示屏行业所使用的FPC需要压合到玻璃上面之后再弯折到玻璃的背面，因此需要在FPC上至少设置一柔软且易于反复弯折的区域，即弯折区。如图1所示，现有的FPC通常包括弯折区200、及分别设于所述弯折区200两侧的金手指区100与信号线路区300。所述FPC通过金手指区100与显示模组相连接，所述FPC的信号线路区300通过连接器与手机主板相连接，从而实现连接手机主板和显示模组的功能。为防止电磁干扰信号对FPC的信号传递造成干扰，通常会在FPC的信号线路区300上贴一层电磁屏蔽复合膜500，起到屏蔽干扰的作用，如图2所示，所述电磁屏蔽复合膜500通常包括依次叠合的粘合胶层510、聚酰亚胺薄膜520、及电磁屏蔽膜(EMI膜)530，所述粘合胶层510的厚度通常为15微米，所述聚酰亚胺薄膜520的厚度通常为12.5微米，所述电磁屏蔽膜530为市场上购买的商品，其通常包括依次叠合的导电胶层531、银层532、及绝缘层533，所述电磁屏蔽膜530的厚度通常为22微米，因此所述电磁屏蔽复合膜500的总厚度为49.5微米。近年来，有些制造商为了使FPC的弯折区200的屏蔽效果更好在弯折区200也贴附一层电磁屏蔽复合膜500，但是，由于弯折 区200对于硬度及反弹力的要求比较高，而上述电磁屏蔽复合膜500的厚度较大，从而在贴附该电磁屏蔽复合膜500后弯折区200的厚度变的较大，硬度及反弹力也变大，不利于弯折，采用该FPC连接显示模组与手机主板时，会增加显示模组与手机主板的组装难度。
发明内容
本发明的目的在于提供一种电磁屏蔽保护膜，结构简单，厚度较薄，且具有优异的电磁屏蔽性能。
本发明的目的还在于提供一种FPC，通过在弯折区上覆盖上述电磁屏蔽保护膜，代替传统的厚度较大的电磁屏蔽复合膜，既能保证弯折区的电磁屏蔽效果，又能保证弯折区的厚度较薄，使其具有较好的弯折性能。
为实现上述目的，本发明提供一种电磁屏蔽保护膜，包括依次叠合的粘合胶层、导电材料层、及绝缘保护层。
所述导电材料层为金属薄膜或者均匀分布的多个金属粒子。
所述金属薄膜及金属粒子的材料为银。
所述导电材料层的厚度为1至15微米，所述粘合胶层的厚度为1至20微米，所述绝缘保护层的厚度为2至15微米。
所述电磁屏蔽保护膜还包括贴覆于所述粘合胶层表面的第一离型膜、以及贴覆于所述绝缘保护层表面的第二离型膜。
本发明还提供一种FPC，包括弯折区、以及分别设于所述弯折区两侧的金手指区与信号线路区，所述弯折区上覆盖有电磁屏蔽保护膜，所述电磁屏蔽保护膜包括依次叠合的粘合胶层、导电材料层、及绝缘保护层，所述电磁屏蔽保护膜以粘合胶层贴附于所述弯折区上。
所述导电材料层为金属薄膜或者均匀分布的多个金属粒子。
所述金属薄膜及金属粒子的材料为银。
所述导电材料层的厚度为1至15微米，所述粘合胶层的厚度为1至20微米，所述绝缘保护层的厚度为2至15微米。
所述信号线路区上覆盖有所述电磁屏蔽保护膜或者电磁屏蔽复合膜，所述电磁屏蔽复合膜包括依次叠合的粘合胶层、聚酰亚胺薄膜、及电磁屏蔽膜，所述电磁屏蔽膜包括在聚酰亚胺薄膜上方依次层叠设置的导电胶层、银层、及绝缘层；所述电磁屏蔽保护膜与电磁屏蔽复合膜均以粘合胶层贴附于所述信号线路区上。
本发明还提供一种电磁屏蔽保护膜，包括依次叠合的粘合胶层、导电材料层、绝缘保护层、贴覆于所述粘合胶层表面的第一离型膜、以及贴覆 于所述绝缘保护层表面的第二离型膜；
其中，所述导电材料层为金属薄膜或者均匀分布的多个金属粒子。
本发明的有益效果：本发明提供的一种电磁屏蔽保护膜，结构简单，厚度较薄，且具有优异的电磁屏蔽性能，尤其适用于对FPC的弯折区进行覆盖，既能保证弯折区的电磁屏蔽效果，又能保证弯折区的厚度较薄，使其具有较好的弯折性能。本发明提供的一种FPC，通过在弯折区上覆盖上述电磁屏蔽保护膜，代替传统的厚度较大的电磁屏蔽复合膜，既能保证弯折区的电磁屏蔽效果，又能保证弯折区的厚度较薄，使其具有较好的弯折性能，采用本发明的FPC来连接显示模组与手机主板时，可显著降低显示模组与手机主板的组装难度。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的FPC的结构示意图；
图2为现有的电磁屏蔽复合膜的结构示意图；
图3为本发明的电磁屏蔽保护膜的结构示意图；
图4为本发明的FPC的第一实施例的结构示意图；
图5为本发明的FPC的第二实施例的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3，本发明提供一种电磁屏蔽保护膜40，包括依次叠合的粘合胶层41、导电材料层42、及绝缘保护层43。
具体的，所述导电材料层42为金属薄膜或者均匀分布的多个金属粒子，优选的，所述金属薄膜及金属粒子的材料为银(Ag)。所述导电材料层42的厚度为1至15微米，优选为5微米。
具体的，所述粘合胶层41的材料包括环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树 脂和聚酰亚胺树脂中的至少一种，所述粘合胶层41的厚度为1至20微米，优选为15微米。
具体的，所述绝缘保护层43为聚酰亚胺薄膜，所述绝缘保护层43的厚度为2至15微米，优选为12.5微米。
优选的，所述电磁屏蔽保护膜40还包括贴覆于所述粘合胶层41表面的第一离型膜44，所述第一离型膜44为PET氟塑离型膜、PET含硅油离型膜、PET亚光离型膜和PE离型膜中的一种，所述第一离型膜44的厚度为25至100微米。使用所述电磁屏蔽保护膜40时需要将第一离型膜44撕掉，将粘合胶层41贴合于待贴附物体表面。
优选的，所述电磁屏蔽保护膜40还包括贴覆于所述绝缘保护层43表面的第二离型膜45，所述第二离型膜45为PET氟塑离型膜、PET含硅油离型膜、PET亚光离型膜和PE离型膜中的一种，所述第二离型膜45的厚度为25至100微米。使用所述电磁屏蔽保护膜40时需要撕掉该第二离型膜45。
上述电磁屏蔽保护膜，与传统的电磁屏蔽复合膜相比，结构简单，厚度较薄，且具有优异的电磁屏蔽性能，尤其适用于对FPC的弯折区进行覆盖，既能保证弯折区的电磁屏蔽效果，又能保证弯折区的厚度较薄，使其具有较好的弯折性能。
请参阅图4和图5，本发明还提供一种FPC，包括弯折区22、以及分别设于所述弯折区22两侧的金手指区21与信号线路区23，所述弯折区22上覆盖有电磁屏蔽保护膜40，所述电磁屏蔽保护膜40包括依次叠合的粘合胶层41、导电材料层42、及绝缘保护层43，所述电磁屏蔽保护膜40以粘合胶层41贴附于所述弯折区22上。
该FPC应用于手机时，所述金手指区21与显示模组相连接，所述信号线路区23通过连接器与手机主板相连接，从而通过该FPC实现手机主板与显示模组之间的连接。
具体的，所述导电材料层42为金属薄膜或者均匀分布的多个金属粒子，优选的，所述金属薄膜及金属粒子的材料为银。所述导电材料层42的厚度为1至15微米，优选为5微米。
具体的，所述粘合胶层41的材料包括环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和聚酰亚胺树脂中的至少一种，所述粘合胶层41的厚度为1至20微米，优选为15微米。
具体的，所述绝缘保护层43为聚酰亚胺薄膜，所述绝缘保护层43的 厚度为2至15微米，优选为12.5微米。
优选的，所述电磁屏蔽保护膜40还包括贴覆于所述粘合胶层41表面的第一离型膜44，所述第一离型膜44为PET氟塑离型膜、PET含硅油离型膜、PET亚光离型膜和PE离型膜中的一种，所述第一离型膜44的厚度为25至100微米。使用所述电磁屏蔽保护膜40时需要将第一离型膜44撕掉，将粘合胶层41贴合于待贴附物体表面。
优选的，所述电磁屏蔽保护膜40还包括贴覆于所述绝缘保护层43表面的第二离型膜45，所述第二离型膜45为PET氟塑离型膜、PET含硅油离型膜、PET亚光离型膜和PE离型膜中的一种，所述第二离型膜45的厚度为25至100微米。使用所述电磁屏蔽保护膜40时需要撕掉该第二离型膜45。
具体的，所述信号线路区23上覆盖有所述电磁屏蔽保护膜40(如图4所示)或者传统的电磁屏蔽复合膜500(如图5所示)，如图2所示，所述电磁屏蔽复合膜500包括依次叠合的粘合胶层510、聚酰亚胺薄膜520、及电磁屏蔽膜530，所述电磁屏蔽膜530包括在聚酰亚胺薄膜520上方依次层叠设置的导电胶层531、银层532、及绝缘层533；所述电磁屏蔽保护膜40与电磁屏蔽复合膜500均以粘合胶层41/510贴附于所述信号线路区23上。具体的，所述绝缘层533为有机绝缘材料。
具体的，所述电磁屏蔽复合膜500中，所述粘合胶层510的厚度为15微米，所述聚酰亚胺薄膜520的厚度为12.5微米，所述电磁屏蔽膜530的厚度为22微米。
上述FPC，通过在弯折区22上覆盖厚度较薄的电磁屏蔽保护膜40，代替传统的厚度较大的电磁屏蔽复合膜500，既能保证弯折区22的电磁屏蔽效果，又能保证弯折区22的厚度较薄，使其具有较好的弯折性能，从而降低显示模组与手机主板的组装难度。
综上所述，本发明提供一种电磁屏蔽保护膜与FPC。本发明的电磁屏蔽保护膜，结构简单，厚度较薄，且具有优异的电磁屏蔽性能，尤其适用于对FPC的弯折区进行覆盖，既能保证弯折区的电磁屏蔽效果，又能保证弯折区的厚度较薄，使其具有较好的弯折性能。本发明的FPC，通过在弯折区上覆盖上述电磁屏蔽保护膜，代替传统的厚度较大的电磁屏蔽复合膜，既能保证弯折区的电磁屏蔽效果，又能保证弯折区的厚度较薄，使其具有较好的弯折性能，采用本发明的FPC来连接显示模组与手机主板时，可显著降低显示模组与手机主板的组装难度。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种电磁屏蔽保护膜，包括依次叠合的粘合胶层、导电材料层、及绝缘保护层。
  2. 如权利要求1所述的电磁屏蔽保护膜，其中，所述导电材料层为金属薄膜或者均匀分布的多个金属粒子。
  3. 如权利要求2所述的电磁屏蔽保护膜，其中，所述金属薄膜及金属粒子的材料为银。
  4. 如权利要求1所述的电磁屏蔽保护膜，其中，所述导电材料层的厚度为1至15微米，所述粘合胶层的厚度为1至20微米，所述绝缘保护层的厚度为2至15微米。
  5. 如权利要求1所述的电磁屏蔽保护膜，还包括贴覆于所述粘合胶层表面的第一离型膜、以及贴覆于所述绝缘保护层表面的第二离型膜。
  6. 一种FPC，包括弯折区、以及分别设于所述弯折区两侧的金手指区与信号线路区，所述弯折区上覆盖有电磁屏蔽保护膜，所述电磁屏蔽保护膜包括依次叠合的粘合胶层、导电材料层、及绝缘保护层，所述电磁屏蔽保护膜以粘合胶层贴附于所述弯折区上。
  7. 如权利要求6所述的FPC，其中，所述导电材料层为金属薄膜或者均匀分布的多个金属粒子。
  8. 如权利要求7所述的FPC，其中，所述金属薄膜及金属粒子的材料为银。
  9. 如权利要求6所述的FPC，其中，所述导电材料层的厚度为1至15微米，所述粘合胶层的厚度为1至20微米，所述绝缘保护层的厚度为2至15微米。
  10. 如权利要求6所述的FPC，其中，所述信号线路区上覆盖有所述电磁屏蔽保护膜或者电磁屏蔽复合膜，所述电磁屏蔽复合膜包括依次叠合的粘合胶层、聚酰亚胺薄膜、及电磁屏蔽膜，所述电磁屏蔽膜包括在聚酰亚胺薄膜上方依次层叠设置的导电胶层、银层、及绝缘层；所述电磁屏蔽保护膜与电磁屏蔽复合膜均以粘合胶层贴附于所述信号线路区上。
  11. 一种电磁屏蔽保护膜，包括依次叠合的粘合胶层、导电材料层、绝缘保护层、贴覆于所述粘合胶层表面的第一离型膜、以及贴覆于所述绝缘保护层表面的第二离型膜；
    其中，所述导电材料层为金属薄膜或者均匀分布的多个金属粒子。
  12. 如权利要求11所述的电磁屏蔽保护膜，其中，所述金属薄膜及金属粒子的材料为银。
  13. 如权利要求11所述的电磁屏蔽保护膜，其中，所述导电材料层的厚度为1至15微米，所述粘合胶层的厚度为1至20微米，所述绝缘保护层的厚度为2至15微米。
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