WO2018003725A1

WO2018003725A1 - Negative photosensitive resin composition, cured film, method for producing cured film, semiconductor device, method for producing laminate, method for producing semiconductor device, and polyimide precursor

Info

Publication number: WO2018003725A1
Application number: PCT/JP2017/023341
Authority: WO
Inventors: 健太吉田; 悠岩井; 渋谷　明規
Original assignee: 富士フイルム株式会社
Priority date: 2016-06-29
Filing date: 2017-06-26
Publication date: 2018-01-04
Also published as: TWI728137B; JPWO2018003725A1; TW201807497A; KR20190010614A; KR102187513B1; JP6837063B2

Abstract

Provided is a negative photosensitive resin composition having excellent resolution. Also provided are a cured film using the negative photosensitive resin composition, a method for producing cured film, a semiconductor device, a method for producing a laminate, a method for producing a semiconductor device, and a polyimide precursor. The negative photosensitive composition contains a polyimide precursor, a photo polymerization initiator, and a solvent. The polyimide precursor has a repeating unit represented by formula (1), has a structure represented by "(A)_l-L¹-*" on at least one of the terminals, and a weight-average molecular weight not exceeding 50000. In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R¹ and R² each independently represent nonpolymerizable organic groups. In the abovementioned structure, A represents a polymerizable group, L¹ represents a single bond or an l+1-valent organic group, l represents an integer from 1 to 10, and * represents a binding site with another site.

Description

Negative photosensitive resin composition, cured film, method for producing cured film, semiconductor device, method for producing laminate, method for producing semiconductor device, and polyimide precursor

The present invention relates to a negative photosensitive resin composition, a cured film, a method for producing a cured film, a semiconductor device, a method for producing a laminate, a method for producing a semiconductor device, and a polyimide precursor.

Thermosetting resins that are cured by cyclization, such as polyimide resins, are used for insulating layers of semiconductor devices and the like because they are excellent in heat resistance and insulation. Moreover, since polyimide resin has low solubility in a solvent, it is used in the state of a precursor (polyimide precursor) before cyclization reaction, applied to a substrate, etc., and then heated to cyclize the polyimide precursor. A cured film is also formed.

For example, Patent Document 1 discloses (A) a substituent having a repeating unit represented by the general formula (1) in the main chain and a photopolymerizable carbon-carbon double bond at both molecular ends. A polyimide precursor having an actinic functional group having a structure modified with an aminobenzene or a trimellitic acid derivative, (B) a photo-assisting agent having a photopolymerizable functional group, and (C) N-aryl A resin composition containing a photopolymerization initiator containing an α-amino acid and a thioxanthone, wherein the content of the photopolymerization initiator is 7 to 15 parts by mass with respect to 100 parts by mass of the polyimide precursor Part of the photosensitive resin composition is described.

In the formula, R ¹ is a tetravalent organic group, and R ² is a divalent organic group.

JP 2013-76845 A

Since Patent Document 1 has a polyamic acid structure, it is susceptible to hydrolysis by water. Therefore, the stability over time is low, and furthermore, the synthesized resin cannot be purified in an aqueous system, so that it is difficult to apply it in semiconductor applications that require high quality.

Therefore, an object of the present invention is to provide a negative photosensitive resin composition excellent in resolution. Moreover, it is providing the cured film using said negative photosensitive resin composition, the manufacturing method of a cured film, a semiconductor device, the manufacturing method of a laminated body, the manufacturing method of a semiconductor device, and a polyimide precursor.

As a result of intensive studies, the present inventors can improve the resolution by providing a polymerizable group at the end of the polyimide precursor and setting the weight average molecular weight of the polyimide precursor to 50000 or less. As a result, the present invention has been completed. Accordingly, the present invention provides the following.
<1> includes a polyimide precursor, a photopolymerization initiator, and a solvent,
The polyimide precursor has a repeating unit represented by the formula (1), has a structure represented by the formula (2) at at least one end, and has a weight average molecular weight of 50000 or less, and is a negative photosensitive. Resin composition;

In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R ¹ and R ² are each independently a non-polymerizable organic group;
(A) _l -L ^1- * (2)
In the formula (2), A represents a polymerizable group, L ¹ represents a single bond or an l + 1 valent organic group, l represents an integer of 1 to 10, and * represents a bonding site with another site.
<2> The negative photosensitive resin composition according to <1>, wherein l in formula (2) is an integer of 2 to 5.
<3> The negative photosensitive resin composition according to <1> or <2>, wherein R ¹ and R ² are each independently a non-polymerizable organic group having 1 to 4 carbon atoms.
<4> The negative photosensitive resin composition according to any one of <1> to <3>, wherein A in the formula (2) is a group containing a carbon-carbon unsaturated double bond.
<5> The negative photosensitive resin according to any one of <1> to <4>, wherein the structure represented by formula (2) is a structure represented by formula (3) or formula (4): Composition;
In the formula (3), R ³ represents a hydrogen atom or a methyl group, Z represents an oxygen atom or NH, L ² represents a single bond or an m + 1 valent organic group, and m represents an integer of 1 to 10. , * Indicates a binding site with another site;
In the formula (4), L ³ represents a single bond or an n + 1 valent organic group, n represents an integer of 1 to 10, and * represents a bonding site with another site.
<6> The negative photosensitive resin composition according to any one of <1> to <5>, wherein the polyimide precursor has a weight average molecular weight of 5000 or more.
<7> The negative photosensitive resin composition according to any one of <1> to <6>, further comprising a polyfunctional radical polymerizable monomer.
<8> The negative photosensitive resin composition according to any one of <1> to <7>, further comprising a thermal base generator.
<9> The negative photosensitive resin composition according to any one of <1> to <8>, wherein the photopolymerization initiator is at least one selected from an oxime compound and a metallocene compound.
<10> The negative photosensitive resin composition according to any one of <1> to <9>, which is used for forming an interlayer insulating film for a rewiring layer.
<11> A cured film obtained by curing the negative photosensitive resin composition according to any one of <1> to <10>.
<12> The cured film according to <11>, wherein the film thickness is 1 to 30 μm.
<13> a photosensitive resin composition layer forming step in which the negative photosensitive resin composition according to any one of <1> to <10> is applied to a substrate to form a layer;
An exposure step of exposing the negative photosensitive resin composition layer;
A development processing step of performing development processing on the exposed photosensitive resin composition layer;
The manufacturing method of the cured film which has this.
<14> The method for producing a cured film according to <13>, further comprising a heating step of heating the developed negative photosensitive resin composition layer at a temperature of 50 to 500 ° C. after the development processing step.
<15> A semiconductor device having the cured film according to <11> or <12>.
<16> A method for producing a laminate including the method for producing a cured film according to <13> or <14>.
<17> A method for producing a semiconductor device, comprising the method for producing a cured film according to <13> or <14>.
<18> A polyimide precursor having a repeating unit represented by formula (1), having a structure represented by formula (2) at at least one end, and having a weight average molecular weight of 50,000 or less;

In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R ¹ and R ² are each independently a non-polymerizable organic group;
(A) _l -L ^1- * (2)
In the formula (2), A represents a polymerizable group, L ¹ represents a single bond or an l + 1 valent organic group, l represents an integer of 1 to 10, and * represents a bonding site with another site.
<19> The polyimide precursor according to <18>, wherein R ¹ and R ² are each independently a non-polymerizable organic group having 1 to 4 carbon atoms.
<20> The polyimide precursor according to <18> or <19>, wherein A in the formula (2) is a group containing a carbon-carbon unsaturated double bond.
<21> The polyimide precursor according to any one of <18> to <20>, wherein l in formula (2) is an integer of 2 to 5.

According to the present invention, it has become possible to provide a negative photosensitive resin composition excellent in resolution. Moreover, it has become possible to provide a cured film, a cured film manufacturing method, a semiconductor device, a laminate manufacturing method, a semiconductor device manufacturing method, and a polyimide precursor using the negative photosensitive resin composition. .

It is the schematic which shows the structure of one Embodiment of a semiconductor device.

The description of the components in the present invention described below may be made based on representative embodiments of the present invention, but the present invention is not limited to such embodiments.
In the notation of a group (atomic group) in this specification, the notation which does not describe substitution and unsubstituted includes the group which has a substituent with the group which does not have a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In this specification, unless otherwise specified, “exposure” includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. The light used for exposure generally includes active rays or radiation such as an emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer laser, extreme ultraviolet rays (EUV light), X-rays, and electron beams.
In the present specification, a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
In the present specification, “(meth) acrylate” represents both and / or “acrylate” and “methacrylate”, and “(meth) acryl” represents both “acryl” and “methacryl”, or “(Meth) acryloyl” represents either or both of “acryloyl” and “methacryloyl”.
In this specification, the term “process” is not limited to an independent process, and is included in the term if the intended action of the process is achieved even when it cannot be clearly distinguished from other processes. .
In this specification, solid content concentration is the mass percentage of the other component except a solvent with respect to the gross mass of a composition. Moreover, solid content concentration says the density | concentration in 25 degreeC unless there is particular mention.
In the present specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are defined as polystyrene conversion values according to gel permeation chromatography (GPC) measurement unless otherwise specified. In this specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are HLC-8220 (manufactured by Tosoh Corporation), and guard columns TSK guard column Super AW-H and TSK Super AWM-H (Tosoh Corporation) ))). The eluent was measured using N-methyl-2-pyrrolidone (NMP) unless otherwise stated. Unless otherwise stated, a differential refractive index (RI) detector is used for detection.

<Negative photosensitive resin composition>
The negative photosensitive resin composition of the present invention (hereinafter also referred to as the composition of the present invention) includes a polyimide precursor, a photopolymerization initiator, and a solvent. It has a structure represented by Formula (2) mentioned later at least at one terminal, and has a weight average molecular weight of 50000 or less.

According to the composition of this invention, it can be set as the negative photosensitive resin composition excellent in resolution. It is assumed that the mechanism for obtaining such an effect is as follows.
According to the study by the present inventors, it was found that the glass transition temperature (Tg) can be improved by providing a polymerizable group at the terminal of the polyimide precursor. So far, polyimide precursors have generally been provided with a polymerizable group in the side chain because the polymerizable group can be introduced at a high density. However, it has been found that when a polymerizable group is added to the side chain of the polyimide precursor, the polymerizable group of the side chain may be detached during the cyclization of the polyimide precursor. In contrast, when a polymerizable group is introduced at the end of the polyimide precursor, the polymerizable group is not eliminated even when cyclized.
However, it was found that when only the polymerizable group was provided at the terminal, the resolution during development was inferior. This was thought to be due to the relatively small amount of polymerizable groups relative to the polyimide precursor. Therefore, by setting the weight average molecular weight of the polyimide precursor to 50000 or less, the amount of the polymerizable group relative to the polyimide precursor can be relatively increased, and as a result, the resolution has been successfully improved. is there.
Furthermore, according to the present invention, it is possible to improve the resolution while maintaining a high Tg of the cured film of the negative photosensitive resin composition.

In addition, in the present invention, R ¹ and R ² in the formula (1) are non-polymerizable groups having 1 to 4 carbon atoms, whereby the rate of remaining film after thermosetting can be improved. That is, when polyimide is cyclized, the R ¹ and R ² portions of the formula (1) are easily detached, and the film is reduced when it is detached. In the present invention, the R ¹ and R ² portions of the formula (1) are non-polymerizable groups having 1 to 4 carbon atoms, so that even when these groups are eliminated by cyclization, the film can be more effectively reduced. Can be suppressed. That is, the remaining film ratio after thermosetting can be maintained higher.

In the composition of the present invention, the lower limit value of the glass transition temperature measured by the method described in Examples described later is preferably 226 ° C or higher, more preferably 228 ° C or higher, and 230 ° C or higher. Is more preferable. If the glass transition temperature is equal to or higher than the above value, an improvement in reliability in a high temperature process such as a vapor deposition process for forming a metal wiring or a bonding process between electrodes can be expected. The upper limit value of the glass transition temperature is not particularly defined, but for example, the desired performance is sufficiently exhibited even at 350 ° C. or lower.

In the composition of the present invention, the exposed film residual film ratio is preferably 50% or more, more preferably 70% or more, and further preferably 90% or more. The exposed portion residual film ratio is a value defined as follows. The details of the measurement method can be referred to the description of Examples described later.
Exposed part residual film ratio (%) = [film thickness after development of exposed part / film thickness of unexposed part before development] × 100

In the composition of the present invention, the residual film ratio after thermosetting is preferably 70% or more, more preferably 80% or more, and further preferably 85% or more. In addition, the remaining film rate after thermosetting is a value defined by the following. The details of the measurement method can be referred to the description of Examples described later.
Residual film ratio after thermosetting (%) = [film thickness after thermosetting / film thickness before thermosetting] × 100

Hereinafter, each component of the composition of the present invention will be described in detail.

<< Polyimide precursor >>
The composition of the present invention has a repeating unit represented by the formula (1), has a structure represented by the formula (2) at at least one end, and has a weight average molecular weight of 50,000 or less. Containing. This polyimide precursor is also the polyimide precursor of the present invention.

In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R ¹ and R ² are each independently a non-polymerizable organic group;
(A) _l -L ^1- * (2)
In the formula (2), A represents a polymerizable group, L ¹ represents a single bond or an l + 1 valent organic group, l represents an integer of 1 to 10, and * represents a bonding site with another site.

Examples of the divalent organic group represented by X in the formula (1) include a linear or branched aliphatic group, a group containing a cyclic aliphatic group, and an aromatic group. A branched aliphatic group, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 6 to 20 carbon atoms, or a combination thereof is preferable, and includes an aromatic group having 6 to 20 carbon atoms. Groups are more preferred. A particularly preferred embodiment includes a group represented by “—Ar—L—Ar—”. Here, Ar is each independently an aromatic group, L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, —O—, —CO—, —S —, —SO ₂ — or —NHCO—, and a group consisting of a combination of two or more of the above. Ar is preferably a phenylene group. L is preferably an aliphatic hydrocarbon group having 1 or 2 carbon atoms which may be substituted with a fluorine atom, —O—, —CO—, —S— or —SO ₂ —. The aliphatic hydrocarbon group here is preferably an alkylene group.

The divalent organic group represented by X in the formula (1) is preferably a group derived from diamine. Examples of the diamine used in the production of the polyimide precursor include linear or branched aliphatic, cyclic aliphatic or aromatic diamine. One type of diamine may be used, or two or more types may be used.
Specifically, the divalent organic group represented by X is a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 6 to 20 carbon atoms, or an aromatic group having 6 to 20 carbon atoms. A diamine containing a group or a group consisting of a combination thereof is preferred, and a diamine containing an aromatic group having 6 to 20 carbon atoms is more preferred. The following aromatic groups are mentioned as an example of an aromatic group.

In the aromatic group, A represents a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, —O—, —C (═O) —, —S—. , —S (═O) ₂ —, —NHCO—, and a group selected from a combination thereof, a single bond, an alkylene group having 1 to 3 carbon atoms which may be substituted with a fluorine atom, It is more preferably a group selected from —O—, —C (═O) —, —S—, —SO ₂ —, —CH ₂ —, —O—, —S—, —SO ₂ —, More preferably, it is a divalent group selected from the group consisting of —C (CF ₃ ) ₂ — and —C (CH ₃ ) ₂ —.

Specific examples of the diamine include 1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane and 1,6-diaminohexane; 1,2- or 1 , 3-diaminocyclopentane, 1,2-, 1,3- or 1,4-diaminocyclohexane, 1,2-, 1,3- or 1,4-bis (aminomethyl) cyclohexane, bis- (4- Aminocyclohexyl) methane, bis- (3-aminocyclohexyl) methane, 4,4'-diamino-3,3'-dimethylcyclohexylmethane and isophoronediamine; meta and paraphenylenediamine, diaminotoluene, 4,4'- and 3 , 3'-diaminobiphenyl, 4,4'-diaminodiphenyl ether, 3,3-diaminodiphenyl ether 4,4'- and 3,3'-diaminodiphenylmethane, 4,4'- and 3,3'-diaminodiphenyl sulfone, 4,4'- and 3,3'-diaminodiphenyl sulfide, 4,4 ' -And 3,3'-diaminobenzophenone, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2-bis (4-amino) Phenyl) propane, 2,2-bis (4-aminophenyl) hexafluoropropane, 2,2-bis (3-hydroxy-4-aminophenyl) propane, 2,2-bis (3-hydroxy-4-aminophenyl) ) Hexafluoropropane, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 2,2-bis (3-amino-4-hydroxyphenyl) Xafluoropropane, bis (3-amino-4-hydroxyphenyl) sulfone, bis (4-amino-3-hydroxyphenyl) sulfone, 4,4′-diaminoparaterphenyl, 4,4′-bis (4-amino) Phenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (2-aminophenoxy) phenyl] sulfone, 1,4- Bis (4-aminophenoxy) benzene, 9,10-bis (4-aminophenyl) anthracene, 3,3′-dimethyl-4,4′-diaminodiphenylsulfone, 1,3-bis (4-aminophenoxy) benzene 1,3-bis (3-aminophenoxy) benzene, 1,3-bis (4-aminophenyl) benzene, 3 , 3′-diethyl-4,4′-diaminodiphenylmethane, 3,3′-dimethyl-4,4′-diaminodiphenylmethane, 4,4′-diaminooctafluorobiphenyl, 2,2-bis [4- (4- Aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, 9,9-bis (4-aminophenyl) -10-hydroanthracene, 3,3 ′, 4 , 4′-tetraaminobiphenyl, 3,3 ′, 4,4′-tetraaminodiphenyl ether, 1,4-diaminoanthraquinone, 1,5-diaminoanthraquinone, 3,3-dihydroxy-4,4′-diaminobiphenyl, 9,9'-bis (4-aminophenyl) fluorene, 4,4'-dimethyl-3,3'-diaminodiphenylsulfur 3,3 ′, 5,5′-tetramethyl-4,4′-diaminodiphenylmethane, 2,4- and 2,5-diaminocumene, 2,5-dimethyl-paraphenylenediamine, acetoguanamine, 2, 3,5,6-tetramethyl-paraphenylenediamine, 2,4,6-trimethyl-metaphenylenediamine, bis (3-aminopropyl) tetramethyldisiloxane, 2,7-diaminofluorene, 2,5-diaminopyridine 1,2-bis (4-aminophenyl) ethane, diaminobenzanilide, ester of diaminobenzoic acid, 1,5-diaminonaphthalene, diaminobenzotrifluoride, 1,3-bis (4-aminophenyl) hexafluoropropane 1,4-bis (4-aminophenyl) octafluorobutane, 1,5-bis (4 Aminophenyl) decafluoropentane, 1,7-bis (4-aminophenyl) tetradecafluoroheptane, 2,2-bis [4- (3-aminophenoxy) phenyl] hexafluoropropane, 2,2-bis [4 -(2-aminophenoxy) phenyl] hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) -3,5-dimethylphenyl] hexafluoropropane, 2,2-bis [4- (4- Aminophenoxy) -3,5-bis (trifluoromethyl) phenyl] hexafluoropropane, parabis (4-amino-2-trifluoromethylphenoxy) benzene, 4,4'-bis (4-amino-2-trifluoro) Methylphenoxy) biphenyl, 4,4'-bis (4-amino-3-trifluoromethylphenoxy) biphe Nyl, 4,4′-bis (4-amino-2-trifluoromethylphenoxy) diphenylsulfone, 4,4′-bis (3-amino-5-trifluoromethylphenoxy) diphenylsulfone, 2,2-bis [ 4- (4-Amino-3-trifluoromethylphenoxy) phenyl] hexafluoropropane, 3,3 ′, 5,5′-tetramethyl-4,4′-diaminobiphenyl, 3,3′-dimethoxy-4, 4′-diaminobiphenyl, 4,4′-diamino-2,2′-bis (trifluoromethyl) biphenyl, 2,2 ′, 5,5 ′, 6,6′-hexafluorotolidine and 4,4 ″ And at least one diamine selected from '-diaminoquaterphenyl.

Further, diamines (DA-1) to (DA-18) shown below are also preferable.

A diamine having at least two alkylene glycol units in the main chain is also a preferred example. Preferred is a diamine containing two or more ethylene glycol chains or propylene glycol chains in one molecule, and more preferred is a diamine containing no aromatic ring. Specific examples include Jeffermin (registered trademark) KH-511, Jeffermin (registered trademark) ED-600, Jeffermin (registered trademark) ED-900, Jeffermin (registered trademark) ED-2003, Jeffermin (registered trademark). ) EDR-148, Jeffamine (registered trademark) EDR-176, D-200, D-400, D-2000, D-4000 (above trade names, manufactured by HUNTSMAN), 1- (2- (2- (2- (2- Aminopropoxy) ethoxy) propoxy) propan-2-amine, 1- (1- (1- (2-aminopropoxy) propan-2-yl) oxy) propan-2-amine, and the like, but is not limited thereto. .
Jeffermin (registered trademark) KH-511, Jeffermin (registered trademark) ED-600, Jeffermin (registered trademark) ED-900, Jeffermin (registered trademark) ED-2003, Jeffermin (registered trademark) EDR-148, The structure of Jeffamine (registered trademark) EDR-176 is shown below.

In the above, x, y, and z are average values.

The divalent organic group represented by X in the formula (1) is also preferably a divalent organic group represented by the following formula (51) or formula (61) from the viewpoint of i-line transmittance. In particular, a divalent organic group represented by the formula (61) is more preferable from the viewpoint of i-line transmittance and availability.
Formula (51)

In the formula (51), R ¹⁰ to R ¹⁷ are each independently a hydrogen atom, a fluorine atom or a monovalent organic group, and at least one of R ¹⁰ to R ¹⁷ is a fluorine atom, a methyl group or a trifluoromethyl group. It is.
Examples of the monovalent organic group represented by R ¹⁰ to R ¹⁷ include an unsubstituted alkyl group having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms) and a fluorine atom having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms). Alkyl group and the like.
Formula (61)

In formula (61), R ¹⁸ and R ¹⁹ are each independently a fluorine atom or a trifluoromethyl group.
Examples of the diamine compound that gives the structure of formula (51) or (61) include 2,2′-dimethyl-4,4′-diaminobiphenyl, 2,2′-bis (trifluoromethyl) -4,4′-diamino. Biphenyl, 2,2′-bis (fluoro) -4,4′-diaminobiphenyl, 4,4′-diaminooctafluorobiphenyl and the like can be mentioned. These may be used alone or in combination of two or more.

As a tetravalent organic group which Y of Formula (1) represents, the tetravalent organic group containing an aromatic ring is preferable, and group represented by following formula (5) or Formula (6) is more preferable.
Formula (5)

In the formula (5), R ¹¹² represents a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, —O—, —CO—, —S—, —SO. ₂ -, - NHCO- and is preferably a group selected from these combinations, a single bond, an alkylene group which ~ 1 carbon atoms which may be 3-substituted by fluorine atoms, -O -, - CO- More preferably a group selected from -S- and -SO _2- , -CH _2- , -C (CF ₃ ) _2- , -C (CH ₃ ) _2- , -O-, -CO More preferred is a divalent group selected from the group consisting of —, —S— and —SO ₂ —.

Formula (6)

Specific examples of the tetravalent organic group represented by Y in Formula (1) include a tetracarboxylic acid residue remaining after the removal of the acid dianhydride group from tetracarboxylic dianhydride. Only one tetracarboxylic dianhydride may be used, or two or more tetracarboxylic dianhydrides may be used. The tetracarboxylic dianhydride is preferably a compound represented by the following formula (O).
Formula (O)

In formula (O), R ¹¹⁵ represents a tetravalent organic group. R ¹¹⁵ has the same meaning as the tetravalent organic group represented by Y in Formula (1), and the preferred range is also the same.

Specific examples of tetracarboxylic dianhydride include pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenyl sulfide tetra Carboxylic dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4 4'-diphenylmethanetetracarboxylic dianhydride, 2,2 ', 3,3'-diphenylmethanetetracarboxylic dianhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, 2,3 , 3 ′, 4′-benzophenonetetracarboxylic dianhydride, 4,4′-oxydiphthalic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,7- Naphthale Tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 1,3-diphenylhexafluoropropane-3,3,4,4-tetracarboxylic dianhydride, 1,4,5,6-naphthalenetetra Carboxylic dianhydride, 2,2 ', 3,3'-diphenyltetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetra Carboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,8,9,10-phenanthrenetetracarboxylic dianhydride, 1,1-bis (2,3-dicarboxyl) Phenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, and those having 1 to Examples thereof include at least one selected from alkyl derivatives having 6 and alkoxy derivatives having 1 to 6 carbon atoms.

Further, tetracarboxylic dianhydrides (DAA-1) to (DAA-5) shown below are also preferable examples.

It is also preferable that at least one of X and Y in the formula (1) has a hydroxyl group.

The non-polymerizable organic group represented by R ¹ and R ^{2 in} the formula (1) is preferably a group not containing a carbon-carbon unsaturated double bond. For example, a linear or branched alkyl group, a cyclic alkyl group, and an aromatic group are preferable. Examples of the aromatic group include an aryl group and an aralkyl group. The non-polymerizable organic group represented by R ¹ and R ² is more preferably a non-polymerizable organic group having 1 to 4 carbon atoms, and is a linear or branched alkyl group having 1 to 4 carbon atoms. Is more preferable. Preferred specific examples of the non-polymerizable organic group include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group, tetradecyl group, octadecyl group. Group, isopropyl group, isobutyl group, sec-butyl group, t-butyl group, 1-ethylpentyl group, and 2-ethylhexyl group. Group, sec-butyl group and tert-butyl group are preferable, methyl group and ethyl group are more preferable, and methyl group is more preferable.

The polyimide precursor of the present invention has a structure represented by the formula (2) at least at one end.
(A) _l -L ^1- * (2)
In the formula (2), A represents a polymerizable group, L ¹ represents a single bond or an l + 1 valent organic group, l represents an integer of 1 to 10, and * represents a bonding site with another site.

The polymerizable group represented by A in the formula (2) is preferably a group containing a carbon-carbon unsaturated double bond. Specific examples include a vinyl group, a (meth) allyl group, a (meth) acryloyl group, a group represented by the following formula (A-1), and a group represented by the formula (A-2).

In the above formulas, * represents a bonding site with L ¹ and equation (2). R ³ represents a hydrogen atom or a methyl group, and Z represents an oxygen atom or NH.

In the formula (2), L ¹ represents a single bond or an l + 1 valent organic group, preferably an l + 1 valent organic group. The l + 1 valent organic group is composed of 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms. Groups.
Specific examples of the l + 1 valent organic group include the following structural units or a group formed by combining two or more of the following structural units (which may form a ring structure).

In the formula (2), l represents an integer of 1 to 10, preferably an integer of 2 to 10, more preferably an integer of 2 to 8, and further preferably an integer of 2 to 5. According to this aspect, the remaining film ratio after development in the exposed portion can be increased.

The structure represented by Formula (2) is preferably a structure represented by Formula (3) or Formula (4), and more preferably a structure represented by Formula (3). According to this aspect, the remaining film ratio after development in the exposed portion can be increased.

In the formula (3), R ³ represents a hydrogen atom or a methyl group, Z represents an oxygen atom or NH, L ² represents a single bond or an m + 1 valent organic group, and m represents an integer of 1 to 10. , * Indicates a binding site with another site.
In the formula (4), L ³ represents a single bond or an n + 1 valent organic group, n represents an integer of 1 to 10, and * represents a bonding site with another site.

The m + 1 valent organic group represented by L ^{2 in} Formula (3) and the n + 1 valent organic group represented by L ^{3 in} Formula (4) are the groups described for the l + 1 valent organic group represented by L ^{1 in} Formula (2). The preferable range is also the same.

In the formula (3), m represents an integer of 1 to 10, preferably an integer of 2 to 10, more preferably an integer of 2 to 8, and further preferably an integer of 2 to 5. According to this aspect, the remaining film ratio in the exposed portion can be increased. In the formula (4), n represents an integer of 1 to 10, preferably an integer of 2 to 10, more preferably an integer of 2 to 8, and further preferably an integer of 2 to 5. According to this aspect, the remaining film ratio in the exposed portion can be increased.

It is also preferred that the polyimide precursor of the present invention has a fluorine atom in the repeating unit. The fluorine atom content in the polyimide precursor is preferably 10% by mass or more, and more preferably 20% by mass or less.

The polyimide precursor of the present invention may further contain a repeating unit containing an aliphatic group having a siloxane structure for the purpose of improving adhesion to the substrate. Examples of the diamine component for introducing an aliphatic group having a siloxane structure include bis (3-aminopropyl) tetramethyldisiloxane and bis (paraaminophenyl) octamethylpentasiloxane.

In the polyimide precursor, the repeating unit represented by the formula (1) may be one type or two or more types. Moreover, the polyimide precursor may contain the structural isomer of the repeating unit represented by Formula (1). The polyimide precursor may also contain other types of repeating units in addition to the repeating unit represented by the formula (1).

The polyimide precursor of the present invention preferably contains 50 mol% or more of the repeating units represented by the formula (1), more preferably 70 mol% or more, more preferably 90 mol% or more of all repeating units. More preferably.

The weight average molecular weight (Mw) of the polyimide precursor is 50000 or less, preferably 40000 or less, and more preferably 35000 or less. The lower limit is preferably more than 2000, more preferably 5000 or more, further preferably 6000 or more, and further preferably 7000 or more. If the weight average molecular weight of a polyimide precursor is 50000 or less, it is excellent in developability. Moreover, if the weight average molecular weight of a polyimide precursor is 5000 or more, the mechanical strength of the obtained cured film is favorable.

The degree of dispersion (Mw / Mn) of the polyimide precursor is preferably 2.5 or more, more preferably 2.7 or more, and further preferably 2.8 or more. The upper limit of the degree of dispersion of the polyimide precursor is not particularly defined, but is, for example, preferably 4.5 or less, more preferably 4.0 or less, still more preferably 3.8 or less, and still more preferably 3.2 or less, 3.1 or less is even more preferable, 3.0 or less is even more preferable, and 2.95 or less is even more preferable.

The content of the polyimide precursor in the composition of the present invention is preferably 10 to 99% by mass, more preferably 50 to 98% by mass, and further preferably 70 to 96% by mass of the total solid content of the composition of the present invention. .
The composition of the present invention has a repeating unit represented by the formula (1), and has a structure represented by “(A) ₁ -L ^1- *” at least at one end; The content of the polyimide precursor having a weight average molecular weight of 50000 or less is preferably 10 to 99% by mass, more preferably 50 to 98% by mass, and further 70 to 96% by mass based on the total solid content of the composition of the present invention. preferable.

In the polyimide precursor of the present invention, after reacting a diamine with tetracarboxylic dianhydride or a derivative thereof, and further reacting a compound having a polymerizable group with this reaction product, the carboxyl group is esterified. Can be manufactured. As another method, after reacting a diamine with an ester of a tetracarboxylic dianhydride or the like and an alcohol, the reaction product is further reacted with a compound having a polymerizable group. it can.
In the present invention, the molar ratio of tetracarboxylic dianhydride or derivative thereof to the above alcohol (tetracarboxylic dianhydride or derivative thereof: alcohol) is 0.9 to 1.1: 2.1 to 1. 9 is preferred.
In the present invention, the molar ratio of tetracarboxylic dianhydride or derivative thereof to diamine (tetracarboxylic dianhydride or derivative thereof: diamine) is 0.8 to 1.2: 1.2 to 0. .8 is preferable, and 1.001 to 1.2: 0.999 to 0.8 is more preferable. Thus, by slightly enriching the tetracarboxylic dianhydride or its derivative, the terminal before addition of the compound having a polymerizable group becomes an acid anhydride structure, and the compound having a hydroxyl group or an amino group and a polymerizable group Thus, the polymerizable group can be reliably introduced.
The reaction temperature of the above reaction is preferably −20 to 60 ° C. The reaction time is preferably 30 minutes to 10 hours.

Further, the molecular weight of the alcohol to be reacted with tetracarboxylic dianhydride is preferably 30 to 150, more preferably 30 to 80, and further preferably 30 to 65. When the molecular weight of the alcohol to be reacted with tetracarboxylic dianhydride is in the above range, a polyimide precursor having excellent resolution is easily obtained.
The alcohol to be reacted with tetracarboxylic dianhydride is preferably an alcohol having 1 to 8 carbon atoms, more preferably an alcohol having 1 to 4 carbon atoms, still more preferably an alcohol having 1 to 3 carbon atoms, and an alcohol having 1 or 2 carbon atoms. Alcohol is more preferable, and alcohol having 1 carbon (methanol) is even more preferable.
Specific examples of the alcohol include methanol, ethanol, propanol, and n-butanol, and methanol is particularly preferable.

The compound having a polymerizable group is preferably a compound having 1 to 10 polymerizable groups, more preferably a compound having 2 to 8 polymerizable groups, and still more preferably a compound having 2 to 5 polymerizable groups. As the polymerizable group, a group containing a carbon-carbon unsaturated double bond is preferable. Specifically, a vinyl group, a (meth) allyl group, a (meth) acryloyl group, a styryl group, a group represented by the above formula (A-1) and a group represented by the above formula (A-2) Is mentioned.
The molecular weight of the compound having a polymerizable group is preferably from 100 to 2000, more preferably from 100 to 1500, and further preferably from 100 to 1000. If the molecular weight of the compound having a polymerizable group is within the above range, specific examples of the compound in which a polyimide precursor excellent in resolution can be easily obtained include pentaerythritol trimethyl when an acid dianhydride is excessively used. (Meth) acrylate, glycerol di (meth) acrylate, isocyanuric acid ethylene oxide (EO) modified di (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxypropyl (meth) Examples include acrylate and 4-aminostyrene. When diamine is used in excess, 2-isocyanatoethyl (meth) acrylate and 1,1- (bisacryloyloxymethyl) ethyl isocyanate are exemplified.

In the method for producing a polyimide precursor, an organic solvent is preferably used for the reaction. One or more organic solvents may be used.
The organic solvent can be appropriately determined according to the raw material, and examples thereof include pyridine, diethylene glycol dimethyl ether (diglyme), N-methylpyrrolidone and N-ethylpyrrolidone.

In the production of a polyimide precursor, one end of the main chain of the precursor is sealed with an end-capping agent such as an acid anhydride, monocarboxylic acid, monoacid chloride compound, or monoactive ester compound in order to further improve storage stability. You may stop. Of these, it is more preferable to use a monoamine. Preferred examples of the monoamine include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, and 1-hydroxy-7. -Aminonaphthalene, 1-hydroxy-6-aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2, -Hydroxy-5-aminonaphthalene, 1-carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6- Aminonaphthalene, 2-carbo Ci-5-aminonaphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminobenzoic acid, 4-aminosalicylic acid, 5-aminosalicylic acid, 6-aminosalicylic acid, 2-aminobenzenesulfonic acid, 3-amino Benzenesulfonic acid, 4-aminobenzenesulfonic acid, 3-amino-4,6-dihydroxypyrimidine, 2-aminophenol, 3-aminophenol, 4-aminophenol, 2-aminothiophenol, 3-aminothiophenol, 4 -Aminothiophenol and the like. Two or more of these may be used, and a plurality of different terminal groups may be introduced by reacting a plurality of terminal blocking agents.

In the production of the polyimide precursor, a step of depositing a solid may be included. Specifically, solid precipitation can be performed by precipitating the polyimide precursor in the reaction solution in a poor solvent such as water or alcohol. Then, a polyimide precursor can be dried and a powdery polyimide precursor can be obtained.

<< photopolymerization initiator >>
The composition of the present invention contains a photopolymerization initiator. Examples of the photopolymerization initiator include a photocationic polymerization initiator and a photoradical polymerization initiator, and a photoradical polymerization initiator is preferred. When the composition of the present invention contains a photo radical polymerization initiator, the composition of the present invention is applied to a substrate such as a semiconductor wafer to form a negative photosensitive resin composition layer, and then irradiated with light. Curing due to radicals occurs, and the solubility in the light irradiation part can be reduced. For this reason, for example, by exposing a negative photosensitive resin composition layer through a photomask having a pattern for masking only the electrode portion, it is possible to easily produce regions having different solubility according to the electrode pattern. There are advantages.

There is no restriction | limiting in particular as a photoinitiator, It can select suitably from well-known photoinitiators. For example, a photopolymerization initiator having photosensitivity to light in the ultraviolet region to the visible region is preferable. Further, it may be an activator that generates some active radicals by generating some action with the photoexcited sensitizer.
The photopolymerization initiator preferably contains at least one compound having a molar extinction coefficient of at least about 50 within a range of about 300 to 800 nm (preferably 330 to 500 nm). The molar extinction coefficient of the compound can be measured using a known method. For example, it is preferable to measure with an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian) using an ethyl acetate solvent at a concentration of 0.01 g / L.

As the photopolymerization initiator, known compounds can be arbitrarily used. For example, halogenated hydrocarbon derivatives (for example, compounds having a triazine skeleton, compounds having an oxadiazole skeleton, compounds having a trihalomethyl group), acylphosphine compounds such as acylphosphine oxide, hexaarylbiimidazoles, oxime derivatives, etc. Oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ketoxime ethers, aminoacetophenone compounds, hydroxyacetophenone, azo compounds, azide compounds, metallocene compounds, organoboron compounds, iron arene complexes, etc. Can be mentioned. With respect to these details, reference can be made to the descriptions in paragraphs 0165 to 0182 of JP-A-2016-027357, the contents of which are incorporated herein.

Examples of ketone compounds include the compounds described in paragraph 0087 of JP-A-2015-087611, the contents of which are incorporated herein. As a commercial product, Kaya Cure DETX (manufactured by Nippon Kayaku Co., Ltd.) is also preferably used.

As the photopolymerization initiator, hydroxyacetophenone compounds, aminoacetophenone compounds, and acylphosphine compounds can also be suitably used. More specifically, for example, aminoacetophenone initiators described in JP-A-10-291969 and acylphosphine oxide initiators described in Japanese Patent No. 4225898 can also be used.
As the hydroxyacetophenone-based initiator, IRGACURE-184 (IRGACURE is a registered trademark), DAROCUR-1173, IRGACURE-500, IRGACURE-2959, and IRGACURE-127 (trade names: all manufactured by BASF) can be used.
As the aminoacetophenone-based initiator, commercially available products IRGACURE-907, IRGACURE-369, and IRGACURE-379 (trade names: all manufactured by BASF) can be used.
As the aminoacetophenone-based initiator, compounds described in JP-A-2009-191179 in which the absorption maximum wavelength is matched with a wavelength light source of 365 nm or 405 nm can also be used.
Examples of the acylphosphine initiator include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide. Further, IRGACURE-819 and IRGACURE-TPO (trade names: both manufactured by BASF) which are commercially available products can be used.
Examples of the metallocene compound include IRGACURE-784 (manufactured by BASF).

More preferred examples of the photopolymerization initiator include oxime compounds. By using the oxime compound, the exposure latitude can be improved more effectively. Oxime compounds are particularly preferred because they have a wide exposure latitude (exposure margin) and also act as a thermal base generator.
Specific examples of the oxime compound include compounds described in JP-A No. 2001-233842, compounds described in JP-A No. 2000-80068, and compounds described in JP-A No. 2006-342166.
Preferable oxime compounds include, for example, compounds having the following structures, 3-benzooxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxy Iminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3- (4-toluenesulfonyloxy) iminobutan-2-one And 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one.

Among the commercially available products, IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE OXE 03, IRGACURE OXE 04 (above, manufactured by BASF), Adekaoptomer N-1919 (manufactured by ADEKA Corporation, light described in JP2012-14052A) A polymerization initiator 2) is also preferably used. Also, TR-PBG-304 (manufactured by Changzhou Powerful Electronic New Materials Co., Ltd.), Adeka Arkles NCI-831 and Adeka Arkles NCI-930 (made by ADEKA) can be used. Further, DFI-091 (manufactured by Daitokemix Co., Ltd.) can be used.
Furthermore, it is also possible to use an oxime compound having a fluorine atom. Specific examples of such oxime compounds include compounds described in JP 2010-262028 A, compounds 24, 36 to 40 described in paragraph 0345 of JP 2014-500852 A, and JP 2013. And the compound (C-3) described in paragraph 0101 of JP-A No. 164471.
As the most preferred oxime compounds, there are oxime compounds having a specific substituent as disclosed in JP-A-2007-267979, oxime compounds having a thioaryl group as disclosed in JP-A-2009-191061, and the like.

Photopolymerization initiators are trihalomethyltriazine compounds, benzyldimethylketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triaryls from the viewpoint of exposure sensitivity. Selected from the group consisting of imidazole dimers, onium salt compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and derivatives thereof, cyclopentadiene-benzene-iron complexes and salts thereof, halomethyloxadiazole compounds, and 3-aryl substituted coumarin compounds. Are preferred.
More preferred photopolymerization initiators are trihalomethyltriazine compounds, α-aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, onium salt compounds, benzophenone compounds, acetophenone compounds, At least one compound selected from the group consisting of a trihalomethyltriazine compound, an α-aminoketone compound, an oxime compound, a triarylimidazole dimer, and a benzophenone compound is more preferable, and a metallocene compound or an oxime compound is more preferable, and an oxime compound. Is particularly preferred.
Photopolymerization initiators include N, N′-tetraalkyl-4,4′-diaminobenzophenone, 2-benzyl-, such as benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), and the like. Aromatic ketones such as 2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1, alkyl anthraquinones, etc. It is also possible to use quinones fused with an aromatic ring, benzoin ether compounds such as benzoin alkyl ether, benzoin compounds such as benzoin and alkylbenzoin, and benzyl derivatives such as benzyldimethyl ketal. A compound represented by the following formula (I) can also be used.

In the formula (I), R ⁵⁰ represents an alkyl group having 1 to 20 carbon atoms; an alkyl group having 2 to 20 carbon atoms interrupted by one or more oxygen atoms; an alkoxy group having 1 to 12 carbon atoms; a phenyl group; An alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a halogen atom, a cyclopentyl group, a cyclohexyl group, an alkenyl group having 2 to 12 carbon atoms, and 2 to 2 carbon atoms interrupted by one or more oxygen atoms A phenyl group substituted with at least one of 18 alkyl groups and an alkyl group having 1 to 4 carbon atoms; or biphenylyl, and R ⁵¹ is the group represented by formula (II) or the same as R ⁵⁰ Each of R ⁵² to R ⁵⁴ is independently alkyl having 1 to 12 carbons, alkoxy having 1 to 12 carbons or halogen.

In the formula, R ⁵⁵ to R ⁵⁷ are the same as R ⁵² to R ^{54 in} the above formula (I).

As the photopolymerization initiator, compounds described in paragraphs 0048 to 0055 of International Publication No. WO2015 / 125469 can also be used.

The content of the photopolymerization initiator is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and still more preferably 0.1 to 30% by mass with respect to the total solid content of the composition of the present invention. 10% by mass. The photoinitiator may contain only 1 type and may contain 2 or more types. When two or more photopolymerization initiators are contained, the total is preferably in the above range.

<< Solvent >>
The composition of the present invention contains a solvent. A known solvent can be arbitrarily used as the solvent. The solvent is preferably an organic solvent. Examples of the organic solvent include compounds such as esters, ethers, ketones, aromatic hydrocarbons, sulfoxides, and amides.
Examples of esters include ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ-butyrolactone, and ε-caprolactone , Δ-valerolactone, alkyl oxyacetates (for example, methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (for example, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc. )), 3-alkyloxypropionic acid alkyl esters (for example, methyl 3-alkyloxypropionate, ethyl 3-alkyloxypropionate, etc. (for example, methyl 3-methoxypropionate, 3-methoxypropionate)) Ethyl acetate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, etc.)), 2-alkyloxypropionic acid alkyl esters (for example, methyl 2-alkyloxypropionate, ethyl 2-alkyloxypropionate, 2 -Propyl alkyloxypropionate and the like (for example, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate)), 2-alkyl Methyl oxy-2-methylpropionate and ethyl 2-alkyloxy-2-methylpropionate (for example, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate), methyl pyruvate , Pyruvic acid Chill, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, 2-ethyl-oxobutanoate can be preferably used.
Examples of ethers include diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol Preferred examples include monomethyl ether acetate, propylene glycol monoethyl ether acetate, and propylene glycol monopropyl ether acetate.
Preferred examples of ketones include methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, and 3-heptanone.
Preferable examples of aromatic hydrocarbons include toluene, xylene, anisole, limonene and the like.
Suitable examples of the sulfoxides include dimethyl sulfoxide.
Preferable examples of amides include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide and the like.

The solvent is preferably in the form of a mixture of two or more from the viewpoint of improving the properties of the coated surface. Among them, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclopentanone, γ-butyrolactone A mixed solution composed of two or more selected from dimethyl sulfoxide, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol methyl ether, and propylene glycol methyl ether acetate is preferable. The combined use of dimethyl sulfoxide and γ-butyrolactone is particularly preferred.

The content of the solvent is preferably such that the total solid concentration of the composition of the present invention is 5 to 80% by mass, more preferably 5 to 70% by mass, and more preferably 10 to 60% by mass from the viewpoint of applicability. % Is particularly preferred. The solvent content may be adjusted depending on the desired thickness and coating method. For example, if the coating method is spin coating or slit coating, the content of the solvent having a solid content concentration in the above range is preferable. In the case of spray coating, the amount is preferably 0.1% by mass to 50% by mass, and more preferably 1.0% by mass to 25% by mass. A photosensitive resin composition layer having a desired thickness can be uniformly formed by adjusting the amount of solvent by the coating method.
The solvent may contain only 1 type and may contain 2 or more types. When two or more solvents are contained, the total is preferably in the above range.

<< Polyfunctional radical polymerizable monomer >>
The composition of the present invention preferably contains a polyfunctional radically polymerizable monomer (hereinafter also referred to as a polymerizable monomer). By setting it as such a structure, the cured film excellent in heat resistance can be formed.

As the polymerizable monomer, a compound having a radical polymerizable group can be used. Examples of the radical polymerizable group include groups having an ethylenically unsaturated bond such as a styryl group, a vinyl group, a (meth) acryloyl group, and a (meth) allyl group. The radical polymerizable group is preferably a (meth) acryloyl group.

The polymerizable monomer preferably has two or more radical polymerizable groups, more preferably three or more. The upper limit is preferably 15 or less, more preferably 10 or less, and even more preferably 8 or less.

The molecular weight of the polymerizable monomer is preferably 2000 or less, more preferably 1500 or less, and even more preferably 900 or less. The lower limit of the molecular weight of the polymerizable monomer is preferably 100 or more.

From the viewpoint of developability, the composition of the present invention preferably contains at least one bifunctional or higher polymerizable monomer containing two or more polymerizable groups, and preferably contains at least one trifunctional or higher polymerizable monomer. Is more preferable. Further, it may be a mixture of a bifunctional polymerizable monomer and a trifunctional or higher functional polymerizable monomer. The number of functional groups of the polymerizable monomer means the number of radical polymerizable groups in one molecule.

Specific examples of the polymerizable monomer include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters thereof, and amides. These are esters of saturated carboxylic acids and polyhydric alcohol compounds, and amides of unsaturated carboxylic acids and polyvalent amine compounds. Also, addition reaction products of monofunctional or polyfunctional isocyanates or epoxies with unsaturated carboxylic acid esters or amides having a nucleophilic substituent such as hydroxyl group, amino group, mercapto group, monofunctional or polyfunctional. A dehydration condensation reaction product with a functional carboxylic acid is also preferably used. In addition, an addition reaction product of an unsaturated carboxylic acid ester or amide having an electrophilic substituent such as an isocyanate group or an epoxy group with a monofunctional or polyfunctional alcohol, amine, or thiol, and a halogen group A substitution reaction product of an unsaturated carboxylic acid ester or amide having a detachable substituent such as a tosyloxy group and a monofunctional or polyfunctional alcohol, amine or thiol is also suitable. As another example, it is also possible to use a compound group in which an unsaturated phosphonic acid, a vinylbenzene derivative such as styrene, vinyl ether, allyl ether or the like is used instead of the unsaturated carboxylic acid. As specific examples, the description in paragraphs 0113 to 0122 of JP-A-2016-027357 can be referred to, and the contents thereof are incorporated in the present specification.

The polymerizable monomer is also preferably a compound having a boiling point of 100 ° C. or higher under normal pressure. Examples include polyethylene glycol di (meth) acrylate, trimethylolethane tri (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol. Many such as penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, hexanediol (meth) acrylate, trimethylolpropane tri (acryloyloxypropyl) ether, tri (acryloyloxyethyl) isocyanurate, glycerin and trimethylolethane A compound obtained by adding ethylene oxide or propylene oxide to a functional alcohol and then (meth) acrylated, JP-B-48-4170 Urethane (meth) acrylates, as described in JP-A Nos. 50-6034 and 51-37193, JP-A 48-64183, JP-B 49-43191, Mention may be made of polyfunctional acrylates and methacrylates such as polyester acrylates and epoxy acrylates which are reaction products of epoxy resins and (meth) acrylic acid, and mixtures thereof described in JP-B 52-30490. it can. Also suitable are the compounds described in paragraphs 0254 to 0257 of JP-A-2008-292970. Moreover, the polyfunctional (meth) acrylate etc. which are obtained by making the compound which has cyclic ether groups, such as glycidyl (meth) acrylate, and an ethylenically unsaturated group, react with polyfunctional carboxylic acid can also be mentioned.
Other preferable polymerizable monomers include groups having a fluorene ring and an ethylenically unsaturated bond described in JP2010-160418A, JP2010-129825A, Japanese Patent No. 4364216, and the like. It is also possible to use a compound having two or more or a cardo resin.
Other examples include specific unsaturated compounds described in JP-B-46-43946, JP-B-1-40337, JP-B-1-40336, and JP-A-2-25493. And vinyl phosphonic acid compounds. Also, compounds containing a perfluoroalkyl group described in JP-A-61-22048 can be used. Furthermore, Journal of Japan Adhesion Association vol. 20, no. 7, pages 300 to 308 (1984), which are introduced as photopolymerizable monomers and oligomers, can also be used.

In addition to the above, polymerizable monomers represented by the following formulas (MO-1) to (MO-5) can also be suitably used. In the formula, when T is an oxyalkylene group, the terminal on the carbon atom side is bonded to R.

In the above formulas, n is an integer from 0 to 14, and m is an integer from 0 to 8. A plurality of R and T present in the molecule may be the same or different.
In each of the polymerizable compounds represented by the above formulas (MO-1) to (MO-5), at least one of a plurality of R is —OC (═O) CH═CH ₂ or —OC (= O) represents a group represented by C (CH ₃ ) ═CH ₂ .
As specific examples of the polymerizable monomer represented by the above formulas (MO-1) to (MO-5), the compounds described in paragraphs 0248 to 0251 of JP-A No. 2007-267979 can be used. .

In addition, compounds described in JP-A-10-62986 as formulas (1) and (2) together with specific examples thereof, which are (meth) acrylated after adding ethylene oxide or propylene oxide to a polyfunctional alcohol, It can be used as a polymerizable monomer.

Furthermore, the compounds described in paragraphs 0104 to 0131 of JP-A No. 2015-187211 can also be used as the polymerizable monomer, the contents of which are incorporated herein.

As a polymerizable monomer, dipentaerythritol triacrylate (as a commercially available product, KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (as a commercially available product, as KAYARAD D-320; Nippon Kayaku Co., Ltd.) ), A-TMMT: Shin-Nakamura Chemical Co., Ltd.), dipentaerythritol penta (meth) acrylate (as a commercial product, KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa (meth) acrylate (As commercial products, KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., A-DPH; manufactured by Shin-Nakamura Chemical Co., Ltd.), and these (meth) acryloyl groups are bonded via ethylene glycol and propylene glycol residues. A structure is preferred. These oligomer types can also be used.
Further, preferred examples include pentaerythritol derivatives and / or dipentaerythritol derivatives of the above formulas (MO-1) and (MO-2).

Examples of commercially available polymerizable monomers include SR-494, a tetrafunctional acrylate having four ethyleneoxy chains, manufactured by Sartomer, SR-209, manufactured by Sartomer, which is a bifunctional methacrylate having four ethyleneoxy chains, DPCA-60, a 6-functional acrylate having 6 pentyleneoxy chains, TPA-330, a 3-functional acrylate having 3 isobutyleneoxy chains, urethane oligomer UAS-10, UAB-140 manufactured by Nippon Kayaku Co., Ltd. (Manufactured by Sanyo Kokusaku Pulp), NK ester M-40G, NK ester 4G, NK ester M-9300, NK ester A-9300, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (Nippon Kayaku ( UA-306H, UA-306T, UA-306I, AH-600 T-600, AI-600 (manufactured by Kyoeisha Chemical Co., Ltd.), Blemmer PME400 (NOF Co., Ltd.), and the like.

Polymerizable monomers include urethane acrylates such as those described in JP-B-48-41708, JP-A-51-37193, JP-B-2-32293, and JP-B-2-16765. Urethane compounds having an ethylene oxide skeleton described in JP-B-58-49860, JP-B-56-17654, JP-B-62-39417, and JP-B-62-39418 are also suitable. Further, compounds having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-1-105238 are used as polymerizable monomers. You can also.

The polymerizable monomer may be a polymerizable monomer having an acid group such as a carboxyl group, a sulfo group, or a phosphoric acid group. The polymerizable monomer having an acid group is preferably an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, and a non-aromatic carboxylic acid anhydride is reacted with an unreacted hydroxyl group of the aliphatic polyhydroxy compound. More preferred is a polymerizable monomer. Particularly preferably, in the polymerizable monomer in which a non-aromatic carboxylic acid anhydride is reacted with an unreacted hydroxyl group of the aliphatic polyhydroxy compound to give an acid group, the aliphatic polyhydroxy compound is pentaerythritol and / or diester. It is a compound that is pentaerythritol. Examples of commercially available products include M-510 and M-520 as polybasic acid-modified acrylic oligomers manufactured by Toagosei Co., Ltd.
As the polymerizable monomer having an acid group, one kind may be used alone, or two or more kinds may be mixed and used. Moreover, you may use together the polymerizable monomer which does not have an acid group, and the polymerizable monomer which has an acid group as needed.
A preferable acid value of the polymerizable monomer having an acid group is 0.1 to 40 mgKOH / g, and particularly preferably 5 to 30 mgKOH / g. When the acid value of the polymerizable monomer is within the above range, the production and handling properties are excellent, and further, the developability is excellent. Also, the polymerizability is good.

The content of the polymerizable monomer is preferably 1 to 50% by mass with respect to the total solid content of the composition of the present invention from the viewpoint of good polymerizability and heat resistance. The lower limit is more preferably 5% by mass or more. The upper limit is more preferably 30% by mass or less. As the polymerizable monomer, one kind may be used alone, or two or more kinds may be mixed and used.
The mass ratio of the polyimide precursor to the polymerizable monomer (polyimide precursor / polymerizable monomer) is preferably 98/2 to 10/90, more preferably 95/5 to 30/70, and 90/10 to 50 / 50 is most preferred. If the mass ratio of a polyimide precursor and a polymerizable monomer is in the above range, a cured film that is superior in polymerizability and heat resistance can be formed.

In the composition of the present invention, a monofunctional polymerizable monomer can be preferably used from the viewpoint of warpage suppression by controlling the elastic modulus of the cured film. Monofunctional polymerizable monomers include n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, carbitol (meth) acrylate, cyclohexyl (meth) ) Acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, N-methylol (meth) acrylamide, glycidyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, etc. Allylation of acrylic acid derivatives, N-vinyl compounds such as N-vinylpyrrolidone, N-vinylcaprolactam, allyl glycidyl ether, diallyl phthalate, triallyl trimellitate, etc. Goods and the like are preferably used. As the monofunctional polymerizable monomer, a compound having a boiling point of 100 ° C. or higher under normal pressure is also preferable in order to suppress volatilization before exposure.

<< Other polymerizable compounds >>
The composition of this invention can further contain other polymerizable compounds other than the polyimide precursor and polymerizable monomer mentioned above. Other polymerizable compounds include compounds having a hydroxymethyl group, alkoxymethyl group or acyloxymethyl group; epoxy compounds; oxetane compounds; benzoxazine compounds.

(Compound having a hydroxymethyl group, an alkoxymethyl group or an acyloxymethyl group)
As the compound having a hydroxymethyl group, an alkoxymethyl group or an acyloxymethyl group, a compound represented by the following formula (AM1) is preferable.

(Wherein t represents an integer of 1 to 20, R ⁴ represents a t-valent organic group having 1 to 200 carbon atoms, and R ⁵ represents a group represented by —OR ⁶ or —OCO—R ^7. R ⁶ represents a hydrogen atom or an organic group having 1 to 10 carbon atoms, and R ⁷ represents an organic group having 1 to 10 carbon atoms.)

The content of the compound represented by the formula (AM1) is preferably 5 to 40 parts by mass with respect to 100 parts by mass of the polyimide precursor. More preferably, it is 10 to 35 parts by mass. Further, the compound represented by the following formula (AM4) is contained in the total amount of other polymerizable compounds in an amount of 10 to 90% by mass, and the compound represented by the following formula (AM5) is contained in an amount of 10 to 90% by mass. Is also preferable.

(Wherein R ⁴ represents a divalent organic group having 1 to 200 carbon atoms, R ⁵ represents a group represented by —OR ⁶ or —OCO—R ⁷ , and R ⁶ represents a hydrogen atom or a carbon atom. An organic group having 1 to 10 carbon atoms, and R ⁷ represents an organic group having 1 to 10 carbon atoms.

(Wherein u represents an integer of 3 to 8, R ⁴ represents a u-valent organic group having 1 to 200 carbon atoms, and R ⁵ represents a group represented by —OR ⁶ or —OCO—R ^7. R ⁶ represents a hydrogen atom or an organic group having 1 to 10 carbon atoms, and R ⁷ represents an organic group having 1 to 10 carbon atoms.)

By using the above-mentioned compound having a hydroxymethyl group or the like, the occurrence of cracks can be more effectively suppressed when the composition of the present invention is applied to an uneven substrate. Moreover, it is excellent in pattern workability and can form the cured film which has high heat resistance from which 5% mass reduction | decrease temperature becomes 350 degreeC or more, More preferably, it is 380 degreeC or more. Specific examples of the compound represented by the formula (AM4) include 46DMOC, 46DMOEP (trade name, manufactured by Asahi Organic Materials Co., Ltd.), DML-MBPC, DML-MBOC, DML-OCHP, DML-PCHP, DML. -PC, DML-PTBP, DML-34X, DML-EP, DML-POP, dimethylolBisOC-P, DML-PFP, DML-PSBP, DML-MTrisPC (above, trade name, manufactured by Honshu Chemical Industry Co., Ltd.), NIKACALAC MX-290 (trade name, manufactured by Sanwa Chemical Co., Ltd.), 2,6-dimethylmethyl-4-t-butylphenol, 2,6-dimethylmethyl-p-cresol, 2,6-diaxymethyl-p-cresol, etc. It is done.

Specific examples of the compound represented by the formula (AM5) include TriML-P, TriML-35XL, TML-HQ, TML-BP, TML-pp-BPF, TML-BPA, TMOM-BP, HML-TPPHBA, HML-TPHAP, HMOM-TPPHBA, HMOM-TPPHAP (trade name, manufactured by Honshu Chemical Industry Co., Ltd.), TM-BIP-A (trade name, manufactured by Asahi Organic Materials Co., Ltd.), NIKALAC MX-280, NIKALAC MX-270, NIKALAC MW-100LM (trade name, manufactured by Sanwa Chemical Co., Ltd.).

(Epoxy compound (compound having an epoxy group))
The epoxy compound is preferably a compound having two or more epoxy groups in one molecule. The epoxy group undergoes a cross-linking reaction at 200 ° C. or less and does not cause a dehydration reaction derived from the cross-linking, so that film shrinkage hardly occurs. For this reason, containing an epoxy compound is effective for low-temperature curing and warping of the composition.

The epoxy compound preferably contains a polyethylene oxide group. Thereby, an elasticity modulus falls more and also curvature can be suppressed. Moreover, the film | membrane flexibility can be made high and the cured film excellent in elongation etc. can be obtained. The polyethylene oxide group means that the number of repeating units of ethylene oxide is 2 or more, and the number of repeating units is preferably 2 to 15.

Examples of the epoxy compound include bisphenol A type epoxy resin; bisphenol F type epoxy resin; alkylene glycol type epoxy resin such as propylene glycol diglycidyl ether; polyalkylene glycol type epoxy resin such as polypropylene glycol diglycidyl ether; polymethyl (glycidyl Examples include, but are not limited to, epoxy group-containing silicones such as (roxypropyl) siloxane. Specifically, Epicron (registered trademark) 850-S, Epicron (registered trademark) HP-4032, Epicron (registered trademark) HP-7200, Epicron (registered trademark) HP-820, Epicron (registered trademark) HP-4700, Epicron (registered trademark) EXA-4710, Epicron (registered trademark) HP-4770, Epicron (registered trademark) EXA-859CRP, Epicron (registered trademark) EXA-1514, Epicron (registered trademark) EXA-4880, Epicron (registered trademark) EXA-4850-150, Epicron EXA-4850-1000, Epicron (registered trademark) EXA-4816, Epicron (registered trademark) EXA-4822 (trade name, manufactured by Dainippon Ink & Chemicals, Inc.), Rica Resin (registered trademark) ) BEO-60E (trade name, Shin Nippon Rika ( )), EP-4003S, EP-4000S (trade name, manufactured by ADEKA Corporation), and the like. Among these, an epoxy resin containing a polyethylene oxide group is preferable in terms of suppressing warpage and excellent heat resistance. For example, Epicron (registered trademark) EXA-4880, Epicron (registered trademark) EXA-4822, and Licaredin (registered trademark) BEO-60E are preferable because they contain a polyethylene oxide group.

The content of the epoxy compound is preferably 5 to 50 parts by mass, more preferably 10 to 50 parts by mass, and still more preferably 10 to 40 parts by mass with respect to 100 parts by mass of the polyimide precursor. If the content of the epoxy compound is 5 parts by mass or more, warpage of the obtained cured film can be further suppressed, and if it is 50 parts by mass or less, pattern filling caused by reflow during curing can be further suppressed.

(Oxetane compound (compound having oxetanyl group))
Examples of the oxetane compound include compounds having two or more oxetane rings in one molecule, 3-ethyl-3-hydroxymethyloxetane, 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, Examples include 3-ethyl-3- (2-ethylhexylmethyl) oxetane and 1,4-benzenedicarboxylic acid-bis [(3-ethyl-3-oxetanyl) methyl] ester. As specific examples, Aron Oxetane series (for example, OXT-121, OXT-221, OXT-191, OXT-223) manufactured by Toagosei Co., Ltd. can be preferably used. Two or more kinds may be mixed.

The content of the oxetane compound is preferably 5 to 50 parts by mass, more preferably 10 to 50 parts by mass, and still more preferably 10 to 40 parts by mass with respect to 100 parts by mass of the polyimide precursor.

(Benzoxazine compound (compound having a benzoxazolyl group))
A benzoxazine compound is preferable because it is a cross-linking reaction derived from a ring-opening addition reaction, so that degassing does not occur during curing, and thermal contraction is further reduced to suppress warpage.

Preferred examples of the benzoxazine compound include Ba type benzoxazine, Bm type benzoxazine (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.), benzoxazine adduct of polyhydroxystyrene resin, phenol novolac type dihydrobenzoxazine. Compounds. These may be used alone or in combination of two or more.

The content of the benzoxazine compound is preferably 5 to 50 parts by mass, more preferably 10 to 50 parts by mass, and still more preferably 10 to 40 parts by mass with respect to 100 parts by mass of the polyimide precursor.

<< Metal discoloration inhibitor >>
The composition of the present invention preferably further contains a metal discoloration inhibitor. When the composition of this invention contains a metal discoloration prevention agent, it can suppress effectively that the metal ion derived from a metal layer (metal wiring) moves into a negative photosensitive resin composition layer.
The metal discoloration inhibitor is not particularly limited, but a heterocyclic ring (pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring, isoxazole ring, isothiazole ring, tetrazole ring, pyridine ring , Pyridazine ring, pyrimidine ring, pyrazine ring, piperidine ring, piperazine ring, morpholine ring, 2H-pyran ring and 6H-pyran ring, triazine ring), compounds having thioureas and mercapto groups, hindered phenols Compounds, salicylic acid derivative compounds, and hydrazide derivative compounds. In particular, triazole compounds such as triazole and benzotriazole, and tetrazole compounds such as tetrazole and benzotetrazole can be preferably used.

Also, an ion trapping agent that traps anions such as halogen ions can be used.

Examples of other metal discoloration inhibitors include rust preventives described in paragraph 0094 of JP2013-15701A, compounds described in paragraphs 0073 to 0076 of JP2009-283711A, and JP2011-59656A. And the compounds described in paragraphs 0114, 0116 and 0118 of JP 2012-194520 A, and the like.

Specific examples of the metal discoloration inhibitor include the following compounds.

When the composition of the present invention has a metal discoloration inhibitor, the content of the metal discoloration inhibitor is preferably 0.01 to 5.0% by mass relative to the total solid content of the composition of the present invention. 05 to 2.0% by mass is more preferable, and 0.1 to 1.0% by mass is more preferable. Only one type of metal discoloration inhibitor may be used, or two or more types may be used. When two or more metal discoloration inhibitors are used, the total is preferably within the above range.

<< Polymerization inhibitor >>
The composition of the present invention preferably contains a polymerization inhibitor.
Examples of the polymerization inhibitor include hydroquinone, paramethoxyphenol, di-tert-butyl-paracresol, pyrogallol, para-tert-butylcatechol, parabenzoquinone, diphenyl-parabenzoquinone, 4,4′-thiobis (3-methyl). -6-tert-butylphenol), 2,2'-methylenebis (4-methyl-6-tert-butylphenol), N-nitroso-N-phenylhydroxyamine aluminum salt, phenothiazine, N-nitrosodiphenylamine, N-phenylnaphthylamine, Ethylenediaminetetraacetic acid, 1,2-cyclohexanediaminetetraacetic acid, glycol etherdiaminetetraacetic acid, 2,6-di-tert-butyl-4-methylphenol, 5-nitroso-8-hydroxyquinoline, 1-nitroso 2-naphthol, 2-nitroso-1-naphthol, 2-nitroso-5- (N-ethyl-N-sulfopropylamino) phenol, N-nitroso-N- (1-naphthyl) hydroxyamine ammonium salt, bis ( 4-hydroxy-3,5-tert-butyl) phenylmethane and the like are preferably used. In addition, a polymerization inhibitor described in paragraph 0060 of JP-A-2015-127817 and compounds described in paragraphs 0031 to 0046 of international publication WO2015 / 125469 can also be used.
Further, the following compounds can be used (Me is a methyl group).

When the composition of the present invention has a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 5% by mass relative to the total solid content of the composition of the present invention.
Only one polymerization inhibitor may be used, or two or more polymerization inhibitors may be used. When two or more polymerization inhibitors are used, the total is preferably within the above range.

<< thermal base generator >>
The composition of the present invention preferably contains a thermal base generator.
The type of the thermal base generator is not particularly defined, but is selected from an acidic compound that generates a base when heated to 40 ° C. or higher, and an ammonium salt having an anion having an pKa1 of 0 to 4 and an ammonium cation. It is preferable to include a thermal base generator containing at least one kind. Here, pKa1 represents the logarithm (−Log ₁₀ Ka) of the reciprocal of the dissociation constant (Ka) of the first proton of the acid, and will be described in detail later.

Since the acidic compound (A1) and the ammonium salt (A2) generate a base when heated, the base generated from these compounds can promote the cyclization reaction of the polyimide precursor and the like. Can be carried out at low temperatures. In addition, even if these compounds coexist with a polyimide precursor that is cured by cyclization with a base, since the cyclization of the polyimide precursor hardly proceeds unless heated, a composition having excellent storage stability can be obtained. Can be prepared.
In the present specification, an acidic compound means that 1 g of a compound is collected in a container, and 50 mL of a mixed solution of ion-exchanged water and tetrahydrofuran (mass ratio is water / tetrahydrofuran = 1/4) is added to the mixture at room temperature for 1 hour. The solution obtained by stirring means a compound having a value measured at 20 ° C. of less than 7 using a pH (power of hydrogen) meter.

In this embodiment, the base generation temperature of the acidic compound (A1) and the ammonium salt (A2) is preferably 40 ° C. or higher, more preferably 120 to 200 ° C. The upper limit of the base generation temperature is preferably 190 ° C. or lower, more preferably 180 ° C. or lower, and further preferably 165 ° C. or lower. The lower limit of the base generation temperature is preferably 130 ° C or higher, and more preferably 135 ° C or higher.
If the base generation temperature of the acidic compound (A1) and the ammonium salt (A2) is 120 ° C. or higher, a base is unlikely to be generated during storage, so that a composition having excellent stability can be prepared. If the base generation temperature of the acidic compound (A1) and ammonium salt (A2) is 200 ° C. or lower, the cyclization temperature of the polyimide precursor or the like can be lowered. The base generation temperature is measured, for example, by using differential scanning calorimetry, heating the compound to 250 ° C. at 5 ° C./min in a pressure capsule, reading the peak temperature of the lowest exothermic peak, and measuring the peak temperature as the base generation temperature. can do.

In this embodiment, the base generated by the thermal base generator is preferably a secondary amine or a tertiary amine, more preferably a tertiary amine. Since tertiary amine has high basicity, cyclization temperature of a polyimide precursor, a polybenzoxazole precursor, etc. can be made lower. The base generated by the thermal base generator preferably has a boiling point of 80 ° C. or higher, more preferably 100 ° C. or higher, and further preferably 140 ° C. or higher. The molecular weight of the generated base is preferably 80 to 2000. The lower limit is more preferably 100 or more. The upper limit is more preferably 500 or less. The molecular weight value is a theoretical value obtained from the structural formula.

In the present embodiment, the acidic compound (A1) preferably contains one or more selected from an ammonium salt and a compound represented by the formula (101) or (102) described later.

In the present embodiment, the ammonium salt (A2) is preferably an acidic compound. The ammonium salt (A2) may be a compound containing an acidic compound that generates a base when heated to 40 ° C. or higher (preferably 120 to 200 ° C.), or 40 ° C. or higher (preferably 120 to 200 ° C.). ) May be a compound excluding an acidic compound that generates a base when heated.

In the present embodiment, the ammonium salt means a salt of an ammonium cation represented by the following formula (101) or formula (102) and an anion. The anion may be bonded to any part of the ammonium cation via a covalent bond, and may be outside the molecule of the ammonium cation, but may be outside the molecule of the ammonium cation. preferable. In addition, that an anion has outside the molecule | numerator of an ammonium cation means the case where an ammonium cation and an anion are not couple | bonded through a covalent bond. Hereinafter, the anion outside the molecule of the cation moiety is also referred to as a counter anion.
Formula (101) Formula (102)

In formula (101) and formula (102), R ¹ to R ⁶ each independently represents a hydrogen atom or a hydrocarbon group, and R ⁷ represents a hydrocarbon group. R ¹ and R ² , R ³ and R ⁴ , R ⁵ and R ⁶ , R ⁵ and R ⁷ in Formula (101) and Formula (102) may be bonded to form a ring.

The ammonium cation is preferably represented by any of the following formulas (Y1-1) to (Y1-5).

In formulas (Y1-1) to (Y1-5), R ¹⁰¹ represents an n-valent organic group, and R ¹ and R ⁷ have the same meanings as in formula (101) or formula (102).
In formulas (Y1-1) to (Y1-4), Ar ¹⁰¹ and Ar ¹⁰² each independently represent an aryl group, n represents an integer of 1 or more, and m represents an integer of 0 to 5 .

In this embodiment, the ammonium salt preferably has an anion having an pKa1 of 0 to 4 and an ammonium cation. The upper limit of the anion pKa1 is more preferably 3.5 or less, and even more preferably 3.2 or less. The lower limit is preferably 0.5 or more, and more preferably 1.0 or more. If the pKa1 of the anion is in the above range, a polyimide precursor or the like can be cyclized at a low temperature, and the stability of the composition can be improved. If pKa1 is 4 or less, the stability of the thermal base generator is good, the generation of a base without heating can be suppressed, and the stability of the composition is good. If pKa1 is 0 or more, the generated base is hardly neutralized, and the cyclization efficiency of the polyimide precursor or the like is good.
The kind of anion is preferably one selected from a carboxylate anion, a phenol anion, a phosphate anion, and a sulfate anion, and a carboxylate anion is more preferable because both the stability of the salt and the thermal decomposability can be achieved. That is, the ammonium salt is more preferably a salt of an ammonium cation and a carboxylate anion.
The carboxylic acid anion is preferably a divalent or higher carboxylic acid anion having two or more carboxyl groups, and more preferably a divalent carboxylic acid anion. According to this aspect, it is possible to provide a thermal base generator that can further improve the stability, curability and developability of the composition. In particular, the stability, curability and developability of the composition can be further improved by using an anion of a divalent carboxylic acid.
In the present embodiment, the carboxylic acid anion is preferably a carboxylic acid anion having a pKa1 of 4 or less. pKa1 is more preferably 3.5 or less, and even more preferably 3.2 or less. According to this aspect, the stability of the composition can be further improved.
Here, pKa1 represents the logarithm of the reciprocal of the dissociation constant of the first proton of the acid, and the determination of Organic Structures by Physical Methods (author: Brown, HC, McDaniel, D.H., Hafliger Ed .: Braude, EA, Nachod, FC; Academic Press, New York, 1955), and Data for Biochemical Research (author: Dawson, R. M.). al; Oxford, Clarendon Press, 1959). For compounds not described in these documents, values calculated from the structural formula using software of ACD / pKa (manufactured by ACD / Labs) are used.

The carboxylate anion is preferably represented by the following formula (X1).

In the formula (X1), EWG represents an electron withdrawing group.

In the present embodiment, the electron-withdrawing group means a group in which Hammett's substituent constant σm exhibits a positive value. Here, σm is a review by Yusuke Tono, Journal of Synthetic Organic Chemistry, Vol. 23, No. 8 (1965) p. 631-642. In addition, the electron withdrawing group in this embodiment is not limited to the substituent described in the said literature.
Examples of substituents in which σm has a positive value include, for example, CF ₃ group (σm = 0.43), CF ₃ CO group (σm = 0.63), HC≡C group (σm = 0.21), CH ₂ ═CH group (σm = 0.06), Ac group (σm = 0.38), MeOCO group (σm = 0.37), MeCOCH═CH group (σm = 0.21), PhCO group (σm = 0.34), H ₂ NCOCH ₂ group (σm = 0.06), and the like. Me represents a methyl group, Ac represents an acetyl group, and Ph represents a phenyl group.

EWG is preferably a group represented by the following formulas (EWG-1) to (EWG-6).

In the formulas (EWG-1) to (EWG-6), R ^x1 to R ^x3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, a hydroxyl group or a carboxyl group, and Ar represents an aromatic group Represents.

In the present embodiment, the carboxylate anion is preferably represented by the following formula (XA).
Formula (XA)

In the formula (XA), L ¹⁰ represents a single bond or a divalent linking group selected from an alkylene group, an alkenylene group, an aromatic group, —NR ^X —, and a combination thereof, and R ^X represents a hydrogen atom Represents an alkyl group, an alkenyl group or an aryl group.

Specific examples of the carboxylate anion include a maleate anion, a phthalate anion, an N-phenyliminodiacetic acid anion, and an oxalate anion. These can be preferably used.

Specific examples of the thermal base generator include the following compounds.

When the composition of the present invention contains a thermal base generator, the content of the thermal base generator is preferably 0.1 to 50% by mass relative to the total solid content of the composition of the present invention. The lower limit is more preferably 0.5% by mass or more, and further preferably 1% by mass or more. The upper limit is more preferably 30% by mass or less, and further preferably 20% by mass or less.
1 type (s) or 2 or more types can be used for a thermal base generator. When using 2 or more types, it is preferable that a total amount is the said range.

<< Metal adhesion improver >>
It is preferable that the composition of this invention contains the metal adhesive improvement agent for improving the adhesiveness with the metal material used for an electrode, wiring, etc. Examples of metal adhesion improvers include silane coupling agents.

Examples of the silane coupling agent include compounds described in paragraphs 0062 to 0073 of JP-A No. 2014-191002, compounds described in paragraphs 0063 to 0071 of international publication WO 2011 / 080992A1, and JP-A No. 2014-191252. Examples thereof include compounds described in paragraphs 0060 to 0061, compounds described in paragraphs 0045 to 0052 of JP 2014-41264 A, and compounds described in paragraph 0055 of international publication WO 2014/097594. It is also preferable to use two or more different silane coupling agents as described in paragraphs 0050 to 0058 of JP2011-128358A. Moreover, it is also preferable to use the following compound for a silane coupling agent. In the following formula, Et represents an ethyl group.

As the metal adhesion improver, compounds described in paragraphs 0046 to 0049 of JP-A-2014-186186 and sulfide-based compounds described in paragraphs 0032 to 0043 of JP-A-2013-072935 can also be used.

The content of the metal adhesion improving agent is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 15 parts by mass with respect to 100 parts by mass of the polyimide precursor. Adhesiveness between the cured film and the metal layer after the curing process becomes good by setting it to 0.1 parts by mass or more, and heat resistance and mechanical properties of the cured film after the curing process are good by setting it to 30 parts by mass or less. Become. Only one type of metal adhesion improver may be used, or two or more types may be used. When using 2 or more types, it is preferable that the sum total is the said range.

<< Other additives >>
The composition of the present invention is various additives, for example, a photobase generator, a thermal polymerization initiator, a thermal acid generator, a sensitizing dye, a chain transfer, as necessary, as long as the effects of the present invention are not impaired. An agent, a surfactant, a higher fatty acid derivative, inorganic particles, a curing agent, a curing catalyst, a filler, an antioxidant, an ultraviolet absorber, an aggregation inhibitor, and the like can be blended. When these additives are blended, the total blending amount is preferably 3% by mass or less of the solid content of the composition.

(Photobase generator)
The composition of the present invention may contain a photobase generator. A photobase generator is a compound that generates a base upon exposure and does not exhibit activity under normal conditions of room temperature and normal pressure. However, when an electromagnetic wave is irradiated and heated as an external stimulus, a base (basic substance) is generated. If it is a compound which generate | occur | produces), it will not specifically limit. Since the base generated by exposure works as a catalyst for curing the polyimide precursor or the like by heating, it can be suitably used in a negative type.

The content of the photobase generator is not particularly limited as long as a desired resin pattern can be formed, and can be a general content. The photobase generator is preferably in the range of 0.01 parts by weight to less than 30 parts by weight with respect to 100 parts by weight of the polyimide precursor, and is in the range of 0.05 parts by weight to 25 parts by weight. Is more preferable, and is more preferably in the range of 0.1 to 20 parts by mass.
Only one photobase generator may be used, or two or more photobase generators may be used. When there are two or more photobase generators, the total is preferably in the above range.

In the present invention, a known compound can be used as a photobase generator. For example, M.M. Shirai, and M.M. Tsunooka, Prog. Polym. Sci. , 21, 1 (1996); Masahiro Kadooka, polymer processing, 46, 2 (1997); Kutal, Coord. Chem. Rev. , 211, 353 (2001); Kaneko, A .; Sarker, and D. Neckers, Chem. Mater. 11, 170 (1999); Tachi, M .; Shirai, and M.M. Tsunooka, J. et al. Photopolym. Sci. Technol. , 13, 153 (2000); Winkle, and K.K. Graziano, J. et al. Photopolym. Sci. Technol. 3,419 (1990); Tsunooka, H .; Tachi, and S. Yoshitaka, J. et al. Photopolym. Sci. Technol. , 9, 13 (1996); Suyama, H .; Araki, M .; Shirai, J. et al. Photopolym. Sci. Technol. , 19, 81 (2006), such as those having a structure such as a transition metal compound complex, an ammonium salt, or the like that is latentized by forming a salt with a carboxylic acid in the amidine moiety. An ionic compound neutralized by forming a salt with a base component, or a nonionic compound in which the base component is made latent by a urethane bond or an oxime bond such as a carbamate derivative, an oxime ester derivative, or an acyl compound Can be mentioned.

As the photobase generator, carbamate derivatives, amide derivatives, imide derivatives, α-cobalt complexes, imidazole derivatives, cinnamic acid amide derivatives, oxime derivatives, and the like can also be used. Further, the photobase generator having a cinnamic acid amide structure described in Japanese Patent Application Laid-Open No. 2009-80452 and International Publication No. WO2009 / 123122, and Japanese Patent Application Laid-Open No. 2006-189591 and Japanese Patent Application Laid-Open No. 2008-247747. A photobase generator having a carbamate structure, or a photobase generator having an oxime structure or a carbamoyloxime structure described in JP2007-249013A and JP2008-003581A can also be used.
Other photobase generators include compounds described in paragraphs 0185 to 0188, 0199 to 0200 and 0202 of JP2012-93746A, compounds described in paragraphs 0022 to 0069 of JP2013-194205, Examples thereof include the compounds described in paragraphs 0026 to 0074 of JP2013-204019A and the compound described in paragraph 0052 of WO2010 / 064631.

(Thermal polymerization initiator)
The composition of the present invention may contain a thermal polymerization initiator (preferably a thermal radical polymerization initiator). As the thermal radical polymerization initiator, a known thermal radical polymerization initiator can be used.
The thermal radical polymerization initiator is a compound that generates radicals by heat energy and initiates or accelerates a polymerization reaction of a polymerizable compound. By adding the thermal radical polymerization initiator, the polymerization reaction of the polyimide precursor can be advanced together with the cyclization of the polyimide precursor, so that higher heat resistance can be achieved.
Specific examples of the thermal radical polymerization initiator include compounds described in paragraphs 0074 to 0118 of JP-A-2008-63554.

When the composition of the present invention has a thermal radical polymerization initiator, the content of the thermal radical polymerization initiator is preferably 0.1 to 50% by mass, based on the total solid content of the composition of the present invention, 0.1 to 30% by mass is more preferable, and 0.1-20% by mass is particularly preferable. Further, the thermal radical polymerization initiator is preferably contained in an amount of 0.1 to 50 parts by mass, more preferably 0.5 to 30 parts by mass with respect to 100 parts by mass of the polyimide precursor. According to this aspect, it is easy to form a cured film having more excellent heat resistance. Only one type of thermal radical polymerization initiator may be used, or two or more types may be used. When there are two or more thermal radical polymerization initiators, the total is preferably in the above range.

(Thermal acid generator)
The composition of the present invention may contain a thermal acid generator. The thermal acid generator generates an acid by heating, promotes cyclization of the polyimide precursor, and further improves the mechanical properties of the cured film. Examples of the thermal acid generator include compounds described in paragraph 0059 of JP2013-167742A.

0.01 mass part or more is preferable with respect to 100 mass parts of polyimide precursors, and, as for content of a thermal acid generator, 0.1 mass part or more is more preferable. By containing 0.01 parts by mass or more of the thermal acid generator, the cross-linking reaction and the cyclization of the polyimide precursor are promoted, so that the mechanical properties and chemical resistance of the cured film can be further improved. In addition, the content of the thermal acid generator is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and particularly preferably 10 parts by mass or less from the viewpoint of electrical insulation of the cured film.
One type of thermal acid generator may be used, or two or more types may be used. When using 2 or more types, it is preferable that a total amount becomes the said range.

(Sensitizing dye)
The composition of the present invention may contain a sensitizing dye. A sensitizing dye absorbs specific actinic radiation and enters an electronically excited state. The sensitizing dye in an electronically excited state comes into contact with a base generator, a thermal radical polymerization initiator, a photopolymerization initiator, and the like, and effects such as electron transfer, energy transfer, and heat generation occur. Thereby, the base generator, the thermal radical polymerization initiator, and the photopolymerization initiator are decomposed by causing a chemical change to generate radicals, acids, or bases. Details of the sensitizing dye can be referred to the descriptions in paragraphs 0161 to 0163 of JP-A-2016-027357, the contents of which are incorporated herein.

When the composition of the present invention contains a sensitizing dye, the content of the sensitizing dye is preferably 0.01 to 20% by mass, and preferably 0.1 to 15% by mass with respect to the total solid content of the composition of the present invention. Is more preferable, and 0.5 to 10% by mass is even more preferable. A sensitizing dye may be used individually by 1 type, and may use 2 or more types together.

(Chain transfer agent)
The composition of the present invention may contain a chain transfer agent. The chain transfer agent is defined, for example, in Polymer Dictionary 3rd Edition (edited by the Polymer Society, 2005) pages 683-684. As the chain transfer agent, for example, a compound group having SH, PH, SiH, GeH in the molecule is used. These can generate hydrogen by donating hydrogen to a low activity radical to generate a radical, or after being oxidized and deprotonated. In particular, thiol compounds (for example, 2-mercaptobenzimidazoles, 2-mercaptobenzthiazoles, 2-mercaptobenzoxazoles, 3-mercaptotriazoles, 5-mercaptotetrazoles, etc.) can be preferably used.

When the composition of the present invention has a chain transfer agent, the content of the chain transfer agent is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the total solid content of the composition of the present invention, and 1 to 10 parts by mass. Part is more preferable, and 1 to 5 parts by mass is more preferable. Only one type of chain transfer agent may be used, or two or more types may be used. When there are two or more chain transfer agents, the total is preferably in the above range.

(Surfactant)
Various kinds of surfactants may be added to the composition of the present invention from the viewpoint of further improving applicability. As the surfactant, various types of surfactants such as a fluorosurfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone surfactant can be used. The following surfactants are also preferable.

When the composition of the present invention has a surfactant, the content of the surfactant is preferably 0.001 to 2.0% by mass, more preferably 0%, based on the total solid content of the composition of the present invention. 0.005 to 1.0 mass%. Only one surfactant may be used, or two or more surfactants may be used. When there are two or more surfactants, the total is preferably in the above range.

(Higher fatty acid derivatives)
In order to prevent polymerization inhibition due to oxygen, the composition of the present invention is added with a higher fatty acid derivative such as behenic acid or behenic acid amide, and is unevenly distributed on the surface of the composition in the process of drying after coating. May be.
When the composition of the present invention has a higher fatty acid derivative, the content of the higher fatty acid derivative is preferably 0.1 to 10% by mass with respect to the total solid content of the composition of the present invention. Only one higher fatty acid derivative may be used, or two or more higher fatty acid derivatives may be used. When two or more higher fatty acid derivatives are used, the total is preferably within the above range.

<< Restrictions on other contained substances >>
The water content of the composition of the present invention is preferably less than 5% by mass, more preferably less than 1% by mass, and particularly preferably less than 0.6% by mass from the viewpoint of the coated surface properties.

The metal content of the composition of the present invention is preferably less than 5 ppm by weight (parts per million), more preferably less than 1 ppm by weight, and particularly preferably less than 0.5 ppm by weight from the viewpoint of insulation. Examples of the metal include sodium, potassium, magnesium, calcium, iron, chromium, nickel and the like. When a plurality of metals are included, the total of these metals is preferably in the above range.
Further, as a method for reducing metal impurities unintentionally contained in the composition of the present invention, a raw material having a low metal content is selected as a raw material constituting the composition of the present invention. For example, the raw material to be filtered may be filtered, or the inside of the apparatus may be lined with polytetrafluoroethylene or the like, and distillation may be performed under a condition in which contamination is suppressed as much as possible.

In the composition of the present invention, the halogen atom content is preferably less than 500 ppm by mass, more preferably less than 300 ppm by mass, and particularly preferably less than 200 ppm by mass from the viewpoint of wiring corrosion. Especially, what exists in the state of a halogen ion is less than 5 mass ppm, More preferably, it is less than 1 mass ppm, Especially less than 0.5 mass ppm is preferable. Examples of the halogen atom include a chlorine atom and a bromine atom. The total of chlorine atoms and bromine atoms, or chloride ions and bromide ions is preferably in the above range.

<Preparation of composition>
The composition of the present invention can be prepared by mixing the above components. The mixing method is not particularly limited, and can be performed by a conventionally known method.
Moreover, it is preferable to perform filtration using a filter for the purpose of removing foreign substances such as dust and fine particles in the composition. The filter pore size is preferably 1 μm or less, more preferably 0.5 μm or less, and even more preferably 0.1 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon. A filter that has been washed in advance with an organic solvent may be used. In the filter filtration step, a plurality of types of filters may be connected in series or in parallel. When a plurality of types of filters are used, filters having different pore diameters and / or materials may be used in combination. Various materials may be filtered a plurality of times. When filtering a plurality of times, circulation filtration may be used. Moreover, you may pressurize and filter. When the pressure is applied for filtration, the pressure applied is preferably 0.05 MPa or more and 0.3 MPa or less.
In addition to filtration using a filter, impurities may be removed using an adsorbent. Filter filtration and impurity removal treatment using an adsorbent may be combined. As the adsorbent, a known adsorbent can be used. Examples thereof include inorganic adsorbents such as silica gel and zeolite, and organic adsorbents such as activated carbon.

<Curing Film, Semiconductor Device, Cured Film Manufacturing Method, Semiconductor Device, Laminate Manufacturing Method, and Semiconductor Device Manufacturing Method>
Next, a cured film, a semiconductor device, a cured film manufacturing method, a semiconductor device, a laminate manufacturing method, and a semiconductor device manufacturing method of the present invention will be described.
The cured film of the present invention is formed by curing the composition of the present invention. The thickness of the cured film of the present invention can be, for example, 1 μm or more, and can be 5 μm or more. Moreover, as an upper limit, it can be set to 100 micrometers or less, and can also be set to 30 micrometers or less.

A laminate may be obtained by laminating two or more cured films of the present invention. Such a laminate preferably has a metal layer between the cured films. Such a metal layer is preferably used as a metal wiring such as a rewiring layer.

Fields to which the cured film of the present invention can be applied include insulating films for semiconductor devices, interlayer insulating films for rewiring layers, and the like. Particularly, since the resolution is good, it can be preferably used for an interlayer insulating film for a rewiring layer in a three-dimensional mounting device.
The cured film in the present invention can also be used for electronic photoresists, galvanic resists, galvanic resists, etching resists, solder top resists, and the like.
The cured film of the present invention can also be used for the production of printing plates such as offset printing plates or screen printing plates, the use for etching molded parts, the production of protective lacquers and dielectric layers in electronics, in particular microelectronics.

The method for producing a cured film of the present invention includes using the composition of the present invention. Preferably, the negative photosensitive resin composition of the present invention is applied to a substrate to form a layer, a negative photosensitive resin composition layer forming step, an exposure step of exposing the negative photosensitive resin composition layer, And a development process for the exposed negative photosensitive resin composition layer. The production method of the present invention may include a step of heating the developed negative photosensitive resin composition layer at a temperature of 50 to 500 ° C. after the development processing step. Since the cured film of the present invention has excellent heat resistance, good performance can be maintained even when heated at 150 to 500 ° C.

The method for producing a laminate of the present invention includes the method for producing a cured film of the present invention. According to the method for producing a laminate of the present invention, after forming a cured film according to the method for producing a cured film of the present invention, a negative photosensitive resin composition layer forming step, an exposure step, and a development processing step are performed again. It is preferable to carry out again in the above order. In particular, the negative photosensitive resin composition layer forming step, the exposure step, and the development processing step are preferably performed 2 to 5 times in the above order (that is, 3 to 6 times in total). Thus, a laminated body can be obtained by laminating a cured film. In the present invention, in particular, it is preferable to provide a metal layer in a portion that has been developed and removed after providing a cured film.

The present invention also discloses a semiconductor device including the cured film of the present invention. Hereinafter, an embodiment of a semiconductor device using the composition of the present invention as an interlayer insulating film for a rewiring layer will be described.

A semiconductor device 100 shown in FIG. 1 is a so-called three-dimensional mounting device, and a stacked body 101 in which a plurality of semiconductor elements (semiconductor chips) 101 a to 101 d are stacked is arranged on a wiring board 120. In this embodiment, the case where the number of stacked semiconductor elements (semiconductor chips) is four will be mainly described. However, the number of stacked semiconductor elements (semiconductor chips) is not particularly limited. It may be a layer, 8 layers, 16 layers, 32 layers, or the like. Moreover, one layer may be sufficient.

The plurality of semiconductor elements 101a to 101d are each made of a semiconductor wafer such as a silicon substrate. The uppermost semiconductor element 101a does not have a through electrode, and an electrode pad (not shown) is formed on one surface thereof. The semiconductor elements 101b to 101d have through electrodes 102b to 102d, and connection pads (not shown) provided integrally with the through electrodes are provided on both surfaces of each semiconductor element.

The stacked body 101 has a structure in which a semiconductor element 101a having no through electrode and flip-chip connection of semiconductor elements 101b to 101d having through electrodes 102b to 102d are connected. That is, the electrode pad of the semiconductor element 101a having no through electrode and the connection pad on the semiconductor element 101a side of the semiconductor element 101b having the adjacent through electrode 102b are connected by the metal bump 103a such as a solder bump, The connection pad on the other side of the semiconductor element 101b having the electrode 102b is connected to the connection pad on the semiconductor element 101b side of the semiconductor element 101c having the adjacent through electrode 102c by a metal bump 103b such as a solder bump. Similarly, the connection pad on the other side of the semiconductor element 101c having the through electrode 102c is connected to the connection pad on the semiconductor element 101c side of the semiconductor element 101d having the adjacent through electrode 102d by the metal bump 103c such as a solder bump. Has been.

An underfill layer 110 is formed in the gaps between the semiconductor elements 101a to 101d, and the semiconductor elements 101a to 101d are stacked via the underfill layer 110.

The laminated body 101 is laminated on the wiring board 120. As the wiring substrate 120, for example, a multilayer wiring substrate using an insulating substrate such as a resin substrate, a ceramic substrate, or a glass substrate as a base material is used. Examples of the wiring board 120 to which the resin board is applied include a multilayer copper-clad laminate (multilayer printed wiring board).

A surface electrode 120 a is provided on one surface of the wiring board 120.
An insulating layer 115 in which a rewiring layer 105 is formed is disposed between the wiring substrate 120 and the stacked body 101, and the wiring substrate 120 and the stacked body 101 are electrically connected via the rewiring layer 105. It is connected. The insulating layer 115 is formed using the composition of the present invention.
That is, one end of the rewiring layer 105 is connected to an electrode pad formed on the surface of the semiconductor element 101d on the rewiring layer 105 side through a metal bump 103d such as a solder bump. The other end of the rewiring layer 105 is connected to the surface electrode 120a of the wiring board via a metal bump 103e such as a solder bump.
An underfill layer 110 a is formed between the insulating layer 115 and the stacked body 101. In addition, an underfill layer 110 b is formed between the insulating layer 115 and the wiring substrate 120.

In addition to the above, the cured film of the present invention can be widely used in various applications using polyimide.
In addition, since polyimide is resistant to heat, the cured film in the present invention is used for plastic substrates and interlayer insulation films for liquid crystal displays, organic EL displays, electronic paper and other display devices, automotive parts, heat resistant paints, coating agents, and films. Can also be suitably used.
Furthermore, the polyimide precursor of this invention can also be used for a positive photosensitive resin composition.

The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. “Parts” and “%” are based on mass unless otherwise specified.

Synthesis of polyimide precursor <Synthesis of polyimide precursor P-1>
2. 20.00 g (64.5 mmol) of 4,4′-oxydiphthalic dianhydride (ODPA, 4,4′-oxydiphthalic acid dried at 140 ° C. for 12 hours, bifunctional anhydride); 13 g (129 mmol) of methanol (side chain compound), 0.05 g of hydroquinone, 10.7 g of pyridine and 140 g of diglyme (diethylene glycol dimethyl ether) are mixed and stirred at a temperature of 60 ° C. for 18 hours. 4,4′-oxydiphthalic dianhydride and methanol diester were prepared. The reaction mixture was then cooled to −10 ° C. and 16.12 g (135.5 mmol) of SOCl ₂ was added over 10 minutes while maintaining the temperature at −10 ± 4 ° C. After dilution with 50 mL of N-methylpyrrolidone, the reaction mixture was stirred at room temperature for 2 hours. Next, a solution of 11.88 g (59.3 mmol) of 4,4′-oxydianiline (ODA, diamine) dissolved in 100 mL of N-methylpyrrolidone was added to the reaction mixture at 20-23 ° C. over 20 minutes. It was dripped in. Next, 23.9 g (15.5 mmol) of dipentaerythritol hexaacrylate (DPHA, Nippon Kayaku, compound for terminal) was added to the reaction mixture, and the reaction mixture was stirred at room temperature overnight. Next, the polyimide precursor was precipitated in a mixed solvent of 3 liters of water and 3 liters of acetone. The polyimide precursor was filtered off and stirred again in 4 liters of water for 30 minutes and filtered again. Next, the obtained polyimide precursor was dried at room temperature under reduced pressure for 2 days to obtain a polyimide precursor (P-1). The structure of the obtained polyimide precursor (P-1) was confirmed by ¹ H-NMR (nuclear magnetic resonance spectrum) (DMSO (dimethyl sulfoxide) -d6 solution).
10.6 to 10.3 ppm (m, 2H), 8.2 to 6.7 ppm (m, 14 H), 6.4 to 6.2 ppm (m, 1 H), 6.2 to 6.0 ppm (m, 1 H) ), 6.0 to 5.8 ppm (m, 0.9H), 4.4 to 4.0 ppm (m, 3H), 3.9 to 3.6 ppm (s, 6H).
The weight average molecular weight of the obtained P-1 (gel permeation chromatography (eluent: NMP (N-methyl-2-pyrrolidone) converted to polystyrene)) was 50,000.
The measurement conditions are as follows.
Column: 1 TSK guardcolumn Super AW-H (4.6 mm ID. × 35 mm) 1 TSK Super AWM-H (6.0 mm ID. × 150 mm) 2 developing solvents: NMP (10 mmol / L lithium bromide, 10 mmol / L phosphoric acid solution)
Column temperature: 50 ° C
Flow rate: 0.35 mL / min Sample injection volume: 20 μL
Sample concentration: 0.1% by mass
Device name: HLC-8220GPC (manufactured by Tosoh)
Calibration curve base resin: polystyrene

<Synthesis of polyimide precursors P-2 to P-16, P-18>
In the synthesis of the polyimide precursor P-1, the bifunctional acid anhydride, the diamine, the side chain compound and the terminal compound were changed as shown in Table 1 below, and others were performed in the same manner. Forms P-2 to P-16 and P-18 were respectively synthesized.

<Synthesis of P-17>
To a three-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 4,4′-oxydiphthalic dianhydride (15.51 g) and N-methylpyrrolidone (114 g) were added and stirred at room temperature. To this suspension, 4,4′-oxydianiline (9.21 g) was added and stirred at 30 ° C. After 1 hour, a mixture of N-methylpyrrolidone (15.27 g) and DPHA (18.51 g) was added and stirred at 30 ° C. After 6 hours, it was cooled to room temperature. The obtained mixed solution was diluted with NMP, and the weight average molecular weight measured by GPC was 50,000. Next, the polyimide precursor was precipitated in a mixed solvent of 3 liters of water and 3 liters of acetone. The polyimide precursor was filtered off and stirred again in 4 liters of water for 30 minutes and filtered again. Next, the obtained polyimide precursor was dried at room temperature under reduced pressure for 2 days. The obtained solid was dissolved in NMP, and the weight average molecular weight measured by GPC was 20000. It was thought that it decomposed in the purification process.

ODPA: Tokyo Chemical Industry BPDA: 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, Tokyo Chemical Industry ODA: Tokyo Chemical Industry Benzidine (4,4′-diaminobiphenyl): Tokyo Chemical Industry Manufactured by Ethanol: Wako Pure Chemical Industries, Ltd. n-Butanol: Wako Pure Chemical Industries, Ltd. n-Octanol: Wako Pure Chemical Industries, Ltd. DPHA: Nippon Kayaku, KAYARAD DPHA
M-305: Pentaerythritol triacrylate, manufactured by Toagosei Co., Ltd., Aronix M-305
701: Glycerol dimethacrylate, Shin-Nakamura Chemical Co., Ltd. Hydroxyethyl acrylate: Wako Pure Chemical Industries, Ltd. M-215: Isocyanuric acid ethylene oxide (EO) modified diacrylate, manufactured by Toagosei Co., Ltd., Aronix M-215
Karenz BEI: 1,1- (bisacryloyloxymethyl) ethyl isocyanate, manufactured by Showa Denko Karenz MOI: 2-isocyanatoethyl methacrylate, manufactured by Showa Denko 4-Aminostyrene: manufactured by Tokyo Chemical Industry

The structure of the obtained polyimide precursor is shown below. In the following, [] means a repeating unit. Me represents a methyl group.

<Example 1>
<< Preparation of negative photosensitive resin composition >>
As shown in the following Table 4, a polyimide precursor, a photopolymerization initiator, a radical polymerizable monomer, a polymerization inhibitor, a metal discoloration inhibitor, a silane coupling agent, and a solvent are mixed to form a negative photosensitive resin as a uniform solution. A composition was prepared.

<< Resolution >>
<<< exposed part remaining film ratio >>>
The negative photosensitive resin composition is filtered under pressure at a pressure of 3.0 MPa through a filter having a pore width of 0.8 μm, and then the negative photosensitive resin composition is applied onto a silicon wafer by spin coating. A negative photosensitive resin composition layer was formed by applying in layers. The obtained silicon wafer to which the negative photosensitive resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to form a uniform negative photosensitive resin composition layer having a thickness of 15 μm on the silicon wafer. Obtained. The negative photosensitive resin composition layer on the silicon wafer was exposed with an exposure energy of 500 mJ / cm ² using a stepper (Nikon NSR 2005 i9C). After standing at room temperature for 30 minutes, development was performed with cyclopentanone for 60 seconds, and the exposed area remaining film ratio was determined from the change in film thickness before and after development.
Exposed part residual film ratio (%) = [film thickness after development of exposed part / film thickness of unexposed part before development] × 100
5: 90% or more 4: 70% or more and less than 90% 3: 50% or more and less than 70% 2: 30% or more and less than 50% 1: less than 30% Evaluation of 3 or more is practically preferable.

<<< Remaining film ratio of unexposed part >>>
The negative photosensitive resin composition is filtered under pressure at a pressure of 3.0 MPa through a filter having a pore width of 0.8 μm, and then the negative photosensitive resin composition is applied onto a silicon wafer by spin coating. A negative photosensitive resin composition layer was formed by applying in layers. The silicon wafer to which the obtained negative photosensitive resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes, and a uniform negative photosensitive resin composition layer having a thickness of 15 μm was formed on the silicon wafer. did. This was developed with cyclopentanone for 60 seconds, and the unexposed portion residual film ratio was determined from the change in film thickness before and after development.
Unexposed area remaining film ratio (%) = [(film thickness after development of unexposed area) / film thickness before development of unexposed area] × 100
5: Less than 5% 4: 5% or more but less than 20% 3: 20% or more but less than 50% 2: 50% or more but less than 90% 1: 90% or more Evaluation of 3 or more is practically preferable.

<< Residual film ratio after thermosetting >>
The negative photosensitive resin composition is filtered under pressure at a pressure of 3.0 MPa through a filter having a pore width of 0.8 μm, and then the negative photosensitive resin composition is applied onto a silicon wafer by spin coating. A negative photosensitive resin composition layer was formed by applying in layers. The silicon wafer to which the obtained negative photosensitive resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes, and a uniform negative photosensitive resin composition layer having a thickness of 15 μm was formed on the silicon wafer. did. The negative photosensitive resin composition layer on the silicon wafer was exposed at an exposure energy of 500 mJ / cm ² using a stepper (Nikon NSR 2005 i9C), and the exposed negative photosensitive resin composition layer (resin layer) Was heated at a rate of temperature increase of 10 ° C./min in a nitrogen atmosphere, and was maintained for 3 hours after reaching 230 ° C., and the remaining film ratio after heating was determined from the change in film thickness before and after heating.
Residual film ratio after thermosetting (%) = [film thickness after thermosetting / film thickness before thermosetting] × 100
5: 85% or more 4: 80% or more and less than 85% 3: 70% or more and less than 80% 2: 60% or more and less than 70% 1: less than 60% Evaluation of 2 or more is practically preferable.

<< Glass Transition Temperature (Tg) >>
The negative photosensitive resin composition is filtered under pressure at a pressure of 3.0 MPa through a filter having a pore width of 0.8 μm, and then the negative photosensitive resin composition is applied onto a silicon wafer by spin coating. A negative photosensitive resin composition layer was formed by applying in layers. The obtained silicon wafer to which the negative photosensitive resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to form a uniform negative photosensitive resin composition layer having a thickness of 15 μm on the silicon wafer. Obtained. The negative photosensitive resin composition layer on the silicon wafer was exposed at an exposure energy of 500 mJ / cm ² using a stepper (Nikon NSR 2005 i9C), and the exposed negative photosensitive resin composition layer (resin layer) Was heated at a rate of temperature increase of 10 ° C./min in a nitrogen atmosphere, and was maintained for 3 hours after reaching 230 ° C. The cured resin layer was immersed in a 4.9% by mass hydrofluoric acid solution, and the resin layer was peeled off from the silicon wafer to obtain a resin film. The obtained resin film was set in a viscoelasticity measuring device (Rhegel E4000, manufactured by UBM Co., Ltd.), and the temperature was increased from 0 ° C. to 350 ° C. at a frequency of 1 Hz and a temperature increase rate of 10 ° C./min. , Tg (° C.) was determined from the peak temperature of tan δ.

<Other Examples and Comparative Examples>
In Example 1, one or more of the polyimide precursor, photopolymerization initiator, radical polymerizable monomer, polymerization inhibitor, metal discoloration inhibitor, silane coupling agent, and solvent are changed as shown in Table 4 or Table 5. In addition, as shown in Table 5, some examples were blended with a thermal base generator, and others were performed in the same manner.

The obtained results are shown in Table 4 and Table 5 below.

The detail of each component of the said Table 4 and Table 5 is as follows.
<Radical radical polymerization initiator>
OXE-01: IRGACURE OXE 01 (oxime compound, manufactured by BASF)
IRGACURE-784: IRGACURE-784 (metallocene compound, manufactured by BASF)
<Radically polymerizable monomer>
SR209: SR-209 (bifunctional methacrylate having four ethyleneoxy chains, manufactured by Sartomer)
A-9300: NK ester A-9300 (trifunctional acrylate having three isobutyleneoxy chains, manufactured by Shin-Nakamura Chemical Co., Ltd.)
A-TMMT: Shin-Nakamura Chemical, Pentaerythritol tetraacrylate A-DPH: Shin-Nakamura Chemical, Dipentaerythritol hexaacrylate

<Heat base generator>
E-1: The following compound E-2: The following compound E-3: The following compound

<Polymerization inhibitor>
F-1: the following compound F-2: the following compound F-3: the following compound

<Metal discoloration inhibitor>
G-1: the following compound G-2: the following compound G-3: the following compound G-4: the following compound

<Silane coupling agent>
H-1: the following compound H-2: the following compound H-3: the following compound

<Solvent>
DMSO: dimethyl sulfoxide GBL: γ-butyrolactone NMP: N-methyl-2-pyrrolidone ethyl lactate

As apparent from the above results, when the negative photosensitive resin composition of the present invention was used, the Tg was high and the resolution was excellent.
In the present invention, the glass transition temperature was 230 ° C. or higher, which was 5 ° C. higher than those of Comparative Examples 1 and 2. An increase in Tg of 5 ° C. can be said to be a very remarkable effect from the viewpoint of improving reliability in a high-temperature process such as a vapor deposition process for forming a metal wiring or a bonding process between electrodes.
Further, by shortening the side chain of the polyimide precursor (by making R ¹ and R ² of formula (1) an organic group of a non-polymerizable group having 1 to 4 carbon atoms), The remaining film rate was remarkably improved.

Example 100
<Manufacture of laminated body 1>
The photosensitive resin composition of Example 3 was subjected to pressure filtration through a filter having a pore width of 0.8 μm, and then a photosensitive resin composition layer was formed on a silicon wafer by spin coating. The obtained silicon wafer to which the photosensitive resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to obtain a uniform photosensitive resin composition layer having a thickness of 15 μm on the silicon wafer. Next, the photosensitive resin composition layer on the silicon wafer was exposed with an exposure energy of 500 mJ / cm ² using a stepper (Nikon NSR 2005 i9C), and the exposed photosensitive resin composition layer (resin layer) was Development was performed with cyclopentanone for 60 seconds to form a 10 μm diameter hole. Next, the temperature was raised at a rate of 10 ° C./min in a nitrogen atmosphere, and after reaching 230 ° C., the temperature was maintained for 3 hours. After cooling to room temperature, again using the same type of photosensitive resin composition as the photosensitive resin composition on the surface of the resin layer, filtration of the photosensitive resin composition in the same manner as described above, 3 of the patterned film was performed. The procedure up to the time heating was performed again to form a laminate 1 having two resin layers.

<Manufacture of laminated body 2>
On the surface of the laminate 1 obtained above, the same procedure as in the production of the laminate 1 is performed again using the photosensitive resin composition of Example 3, so that the laminate 2 having four resin layers. Was made.

<Manufacture of laminated body 3>
The photosensitive resin composition of Example 3 was subjected to pressure filtration through a filter having a pore width of 0.8 μm, and then a photosensitive resin composition layer was formed on a silicon wafer by spin coating. The obtained silicon wafer to which the photosensitive resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to obtain a uniform photosensitive resin composition layer having a thickness of 15 μm on the silicon wafer. The photosensitive resin composition layer on the silicon wafer was exposed with an exposure energy of 500 mJ / cm ² using a stepper (Nikon NSR 2005 i9C), and the exposed photosensitive resin composition layer (resin layer) was subjected to cyclopenta A hole having a diameter of 10 μm was formed by developing for 60 seconds in a non-process. Next, the temperature was raised at a rate of 10 ° C./min in a nitrogen atmosphere, and after reaching 230 ° C., the temperature was maintained for 3 hours. After cooling to room temperature, a 2 μm thick copper thin film (metal layer) was applied to a part of the surface of the photosensitive resin composition layer by vapor deposition so as to cover the hole portion. Further, again using the photosensitive resin composition of Example 3 on the surfaces of the metal layer and the photosensitive resin composition layer, the photosensitive resin composition was filtered in the same manner as described above, and then the patterned film was used for 3 hours. The procedure up to the heating was performed again to produce a laminate 3 composed of resin layer / metal layer / resin layer.

100: Semiconductor devices 101a to 101d: Semiconductor element 101: Stacked bodies 102b to 102d: Through electrodes 103a to 103e: Metal bump 105: Rewiring layers 110, 110a, 110b: Underfill layer 115: Insulating layer 120: Wiring substrate 120a: Surface electrode

Claims

Including a polyimide precursor, a photopolymerization initiator, and a solvent,
The polyimide precursor has a repeating unit represented by the formula (1), has a structure represented by the formula (2) at least at one end, and has a weight average molecular weight of 50000 or less. Functional resin composition;

In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R 1 and R 2 are each independently a non-polymerizable organic group;
(A) l -L 1- * (2)
In the formula (2), A represents a polymerizable group, L 1 represents a single bond or an l + 1 valent organic group, l represents an integer of 1 to 10, and * represents a bonding site with another site.
The negative photosensitive resin composition according to claim 1, wherein l in formula (2) is an integer of 2 to 5.
3. The negative photosensitive resin composition according to claim 1, wherein R 1 and R 2 are each independently a non-polymerizable organic group having 1 to 4 carbon atoms.
The negative photosensitive resin composition according to any one of claims 1 to 3, wherein A in the formula (2) is a group containing a carbon-carbon unsaturated double bond.
The negative photosensitive resin composition according to any one of claims 1 to 4, wherein the structure represented by the formula (2) is a structure represented by the formula (3) or the formula (4);

In the formula (3), R 3 represents a hydrogen atom or a methyl group, Z represents an oxygen atom or NH, L 2 represents a single bond or an m + 1 valent organic group, and m represents an integer of 1 to 10. , * Indicates a binding site with another site;
In the formula (4), L 3 represents a single bond or an n + 1 valent organic group, n represents an integer of 1 to 10, and * represents a bonding site with another site.
The negative photosensitive resin composition according to any one of claims 1 to 5, wherein the polyimide precursor has a weight average molecular weight of 5,000 or more.
The negative photosensitive resin composition according to claim 1, further comprising a polyfunctional radical polymerizable monomer.
The negative photosensitive resin composition according to any one of claims 1 to 7, further comprising a thermal base generator.
The negative photosensitive resin composition according to any one of claims 1 to 8, wherein the photopolymerization initiator is at least one selected from an oxime compound and a metallocene compound.
The negative photosensitive resin composition according to any one of claims 1 to 9, which is used for forming an interlayer insulating film for a rewiring layer.
A cured film obtained by curing the negative photosensitive resin composition according to any one of claims 1 to 10.
The cured film according to claim 11, wherein the film thickness is 1 to 30 μm.
A photosensitive resin composition layer forming step of applying a negative photosensitive resin composition according to any one of claims 1 to 10 to a substrate to form a layer,
An exposure step of exposing the negative photosensitive resin composition layer;
A development processing step of performing development processing on the exposed photosensitive resin composition layer;
The manufacturing method of the cured film which has this.
The method for producing a cured film according to claim 13, further comprising a heating step of heating the developed negative photosensitive resin composition layer at a temperature of 50 to 500 ° C after the development processing step.
A semiconductor device having the cured film according to claim 11 or 12.
The manufacturing method of a laminated body containing the manufacturing method of the cured film of Claim 13 or 14.
A method for manufacturing a semiconductor device, including the method for manufacturing a cured film according to claim 13 or 14.
A polyimide precursor having a repeating unit represented by the formula (1), having a structure represented by the formula (2) at at least one end, and having a weight average molecular weight of 50,000 or less;

In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R 1 and R 2 are each independently a non-polymerizable organic group;
(A) l -L 1- * (2)
In the formula (2), A represents a polymerizable group, L 1 represents a single bond or an l + 1 valent organic group, l represents an integer of 1 to 10, and * represents a bonding site with another site.
The polyimide precursor according to claim 18, wherein R 1 and R 2 are each independently a non-polymerizable organic group having 1 to 4 carbon atoms.
The polyimide precursor according to claim 18 or 19, wherein A in the formula (2) is a group containing a carbon-carbon unsaturated double bond.
The polyimide precursor according to any one of claims 18 to 20, wherein l in formula (2) is an integer of 2 to 5.