WO2018003546A1 - High-frequency heating device - Google Patents

High-frequency heating device Download PDF

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Publication number
WO2018003546A1
WO2018003546A1 PCT/JP2017/022304 JP2017022304W WO2018003546A1 WO 2018003546 A1 WO2018003546 A1 WO 2018003546A1 JP 2017022304 W JP2017022304 W JP 2017022304W WO 2018003546 A1 WO2018003546 A1 WO 2018003546A1
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WO
WIPO (PCT)
Prior art keywords
frequency
surface wave
frequency power
heated
excitation
Prior art date
Application number
PCT/JP2017/022304
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French (fr)
Japanese (ja)
Inventor
岡島　利幸
大森　義治
吉野　浩二
宇野　博之
上島　博幸
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2018525054A priority Critical patent/JP6956326B2/en
Priority to EP17819906.3A priority patent/EP3481149B1/en
Priority to CN201780035541.XA priority patent/CN109315029B/en
Publication of WO2018003546A1 publication Critical patent/WO2018003546A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides

Definitions

  • the present invention relates to a high frequency heating apparatus including a surface wave exciter using a periodic structure.
  • Patent Document 1 Conventionally, a technique relating to a high-frequency heating device that supplies high-frequency power to a surface wave exciter using a periodic structure and heats an object to be heated such as food has been disclosed (for example, see Patent Document 1).
  • the high-frequency heating device of Patent Document 1 includes an impedance variable unit that temporally changes the impedance of the terminal portion of the crossed finger tape line (surface wave line).
  • the variable impedance unit moves the portion that emits strong energy by changing the standing wave distribution with time. Thereby, the whole food is efficiently heated.
  • the high-frequency heating device changes the standing wave distribution of the cross-finger tape line (surface wave line) by changing the impedance of the terminal part of the cross-finger tape line (surface wave line), Change impedance in time. Thereby, the standing wave distribution is changed with time, and the whole food is heated.
  • the conventional high-frequency heating device cannot change the radiation distribution of the high-frequency power in the thickness direction of the object to be heated.
  • the present invention provides a high-frequency heating device that can change the heating state of the heated portion by changing the radiation distribution of the high-frequency power to the heated object.
  • the high-frequency heating device of the present invention includes a high-frequency power generator that generates high-frequency power, a surface wave exciter that propagates high-frequency power by surface waves to heat an object to be heated, and high-frequency power that is used as a surface wave exciter.
  • a high-frequency power supply unit for supplying and an installation table for installing an object to be heated are provided.
  • the high frequency power generator sets the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter according to the desired surface concentration of the high frequency power near the surface wave exciter. Then, the object to be heated is heat-treated.
  • the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter is set in the thickness direction of the object to be heated in accordance with a desired heating state.
  • FIG. 1 is a block diagram showing the basic configuration of the high-frequency heating device of the present embodiment.
  • FIG. 2 is a block diagram illustrating a configuration of a high-frequency power supply unit of the high-frequency heating device.
  • FIG. 3A is a diagram illustrating an example of the heating operation of the object to be heated when the surface concentration of the electric field by the surface wave exciter of the high-frequency heating device is high.
  • FIG. 3B is a diagram illustrating an example of the heating operation of the object to be heated when the surface concentration of the electric field by the surface wave exciter of the high-frequency heating device is low.
  • FIG. 1 is a block diagram showing the basic configuration of the high-frequency heating device of the present embodiment.
  • FIG. 2 is a block diagram illustrating a configuration of a high-frequency power supply unit of the high-frequency heating device.
  • FIG. 3A is a diagram illustrating an example of the heating operation of the object to be heated when the surface concentration of the electric field by the surface wave exciter of the high
  • FIG. 4A is a graph showing an example of a change in the surface concentration of the electric field with respect to the distance from the surface wave exciter when the frequency of the high frequency power of the high frequency heating apparatus is equal to the excitation frequency of the surface wave exciter.
  • FIG. 4B is a graph showing an example of a change in the surface concentration of the electric field with respect to the distance from the surface wave excitation body when the frequency of the high frequency power of the high frequency heating apparatus is lower than the excitation frequency of the surface wave excitation body.
  • FIG. 4C is a graph showing an example of a change in the surface concentration of the electric field with respect to the distance from the surface wave excitation body when the frequency of the high frequency power of the high frequency heating apparatus is higher than the excitation frequency of the surface wave excitation body.
  • FIG. 1 is a block diagram showing the basic configuration of the high-frequency heating device 100 of the present embodiment.
  • the high-frequency heating device 100 includes a surface wave exciter 103, a high-frequency power supply unit 110, a high-frequency power generation unit 120, an installation base 101 on which an object to be heated 102 is placed, and the like.
  • the high-frequency heating device 100 heats an object to be heated 102 installed on the installation table 101.
  • the frequency of the high-frequency power generated by the high-frequency power generation unit 120 and the excitation frequency of the surface wave exciter 103 are set so as to have a relationship between frequencies intended in advance. .
  • the intended frequency relationship is set so that the object to be heated 102 is heat-treated in a desired heating state.
  • the high frequency heating apparatus 100 shown in FIG. 1 has illustrated as an example the structure which has one surface wave excitation body, a high frequency electric power supply part, and a high frequency electric power generation part, respectively, it is not restricted to this.
  • the numbers of surface wave exciters, high frequency power supply units, and high frequency power generation units are not limited to the above numbers.
  • the high-frequency heating device 100 operates as follows.
  • the high frequency power generation unit 120 generates high frequency power.
  • the generated high frequency power is supplied to the surface wave exciter 103 through the high frequency power supply unit 110.
  • the supplied high frequency power is propagated or radiated in the vicinity of the surface wave exciter 103 by surface waves. Thereby, the article to be heated 102 placed on the installation table 101 is heated.
  • the high-frequency heating device 100 of the present embodiment is configured and operates.
  • the high-frequency power generation unit 120 includes a high-frequency transmitter that outputs a high-frequency power having a frequency (for example, a microwave) and power suitable for the heat treatment of the article to be heated 102.
  • a high-frequency transmitter that outputs a high-frequency power having a frequency (for example, a microwave) and power suitable for the heat treatment of the article to be heated 102.
  • the high-frequency transmitter includes, for example, a magnetron and an inverter power supply circuit, a solid oscillator and a power amplifier.
  • Magnetron is a type of oscillation vacuum tube that generates a powerful non-coherent microwave that is a type of radio wave, and is often used for high-power applications of several hundred watts to several kilowatts such as radar and microwave ovens. A high voltage of several kilovolts is required for driving the magnetron. Therefore, an inverter power supply circuit is generally used as a drive power source for the magnetron.
  • the inverter power supply circuit includes a converter circuit having a rectifying function, and an inverter circuit having a step-up (or step-down) function and an output frequency conversion function.
  • the inverter power supply circuit is a technique widely used for lighting devices and motor control.
  • the solid-state oscillator is composed of a semiconductor oscillation circuit including a transistor and a feedback circuit having high-frequency electronic components such as a capacitor, an inductor, and a resistor. Note that the solid-state oscillator is a technique widely used for oscillators for low power output applications such as communication devices.
  • solid-state oscillators that output high-frequency power of about 50 watts, but generally oscillators that output high-frequency power of about several tens of milliwatts to several hundred milliwatts. Therefore, it cannot be used for heat treatment applications that require output power of several hundred watts. Therefore, a solid-state oscillator is usually used with a power amplifier composed of a transistor that amplifies the output high-frequency power.
  • the high frequency power supply unit 110 corresponds to a power connection unit that supplies the high frequency power generated by the high frequency power generation unit 120 to the surface wave exciter 103.
  • the configuration of the high frequency power supply unit 110 will be described later.
  • the surface wave exciter 103 is composed of a metal periodic structure in which impedance elements are periodically arranged with a metal plate, a dielectric plate, or the like.
  • a metal periodic structure for example, a stub type surface wave exciter or an interdigital type surface wave exciter is used.
  • a stub type surface wave exciter is formed on a metal flat plate as shown in FIG. 1 by arranging a plurality of metal flat plates at regular intervals in a direction to stand toward an object to be heated.
  • the interdigital surface acoustic wave exciter is formed by punching a metal flat plate like a cross finger.
  • the dielectric plate an alumina plate or a bakelite plate is used.
  • the excitation frequency of the surface wave exciter 103 is determined by the material used, the physical structure dimensions, and the like.
  • the excitation frequency of the surface wave exciter 103 is changed by changing the height dimension of a plurality of metal flat plates arranged on the metal flat plate or the interval dimension of the metal flat plates. Can be made.
  • the excitation frequency of the surface wave exciter 103 increases as the height dimension of the metal flat plate decreases, and increases as the interval dimension of the metal flat plate decreases. Therefore, the surface wave exciter 103 having a desired excitation frequency can be formed by adjusting the height and interval of the metal flat plate.
  • the surface wave exciter 103 concentrates the high frequency power supplied from the high frequency power generation unit 120 via the high frequency power supply unit 110 in the vicinity of the surface and propagates the surface wave through the surface wave. Furthermore, the surface wave exciter 103 can also radiate high-frequency power into a space in the high-frequency heating device 100, for example. As a result, the object to be heated 102 placed on the installation base 101 in the vicinity of the surface wave exciter 103 propagates in the vicinity of the surface of the surface wave exciter 103 by surface waves or is radiated from the surface wave exciter 103. Heated by electric power.
  • FIG. 2 is a block diagram illustrating an example of the configuration of the high-frequency power supply unit 110.
  • the high frequency power supply unit 110 is arranged to guide the high frequency power generated by the high frequency power generation unit 120 to the high frequency power supply unit 110 via the rectangular waveguide 130.
  • the rectangular waveguide 130 is a hollow waveguide mainly used for transmission of electromagnetic waves such as microwaves.
  • the hollow waveguide is a general waveguide and is formed of a metal tube having a square cross section (for example, a rectangle).
  • the electromagnetic wave propagates through the rectangular waveguide 130 while forming an electromagnetic field corresponding to the shape, size, wavelength, or frequency of the rectangular waveguide 130.
  • the high-frequency power propagated from the high-frequency power generation unit 120 is supplied to the surface wave exciter 103 via the rectangular waveguide 130 and the tapered rectangular waveguide 131.
  • the tapered rectangular waveguide 131 suppresses the reflection of the propagating microwave at the junction, thereby reducing the loss.
  • the high-frequency power supply unit 110 includes a part of the rectangular waveguide 130, a tapered rectangular waveguide 131, and a part of the surface wave exciter 103 as indicated by a broken line in FIG. 2.
  • the high frequency power generated by the high frequency power generation unit 120 is guided to the high frequency power supply unit 110 via the rectangular waveguide 130, and the surface wave exciter via the tapered rectangular waveguide 131. 103 is efficiently supplied.
  • the frequency of the high-frequency power generated by the high-frequency power generation unit 120 and the excitation frequency of the surface wave exciter 103 are in a mutually intended relationship. Is set as follows. Thereby, as described later, the object to be heated 102 is heat-treated in a desired heating state.
  • the high-frequency heating device 100 of the present embodiment is configured, and the object to be heated 102 and the like is subjected to heat treatment.
  • 3A and 3B show the operation of heating the object to be heated 102 with the electric field intensity distribution in the vicinity of the surface of the surface wave exciter 103 by the supplied high frequency power when the object to be heated 102 is installed on the installation table 101.
  • An example is shown schematically.
  • FIG. 3A shows the surface wave exciter when the frequency of the high frequency power generated by the high frequency power generator 120 and the excitation frequency of the surface wave exciter 103 are set so that the surface concentration of the high frequency power becomes high.
  • An electric field strength distribution 141 formed in the vicinity of the surface 103 is shown.
  • FIG. 3B shows an electric field intensity distribution 142 formed in the vicinity of the surface of the surface wave exciter 103 when the frequency of the high frequency power and the excitation frequency are set so that the surface concentration degree of the high frequency power is low.
  • the electric field strengths of the electric field strength distributions 141 and 142 are represented by shades of color. In this case, the darker the color, the stronger the electric field.
  • the relationship between the frequency of the high-frequency power and the excitation frequency of the surface wave exciter 103 is set so that the surface concentration of the high-frequency power increases in the vicinity of the surface wave exciter 103. Therefore, the electric field strength near the surface of the surface wave exciter 103 is increased. As a result, the object to be heated 102 is heated strongly and intensively on the surface near the surface wave exciter 103 and the inside on the near side. The electric field strength suddenly decreases as the distance from the surface wave exciter 103 increases. Therefore, the degree of heating of the article 102 to be heated also becomes weak.
  • the relationship between the frequency of the high frequency power and the excitation frequency of the surface wave exciter 103 is set so that the surface concentration of the high frequency power is low in the vicinity of the surface wave exciter 103.
  • the electric field strength in the vicinity of the surface of the surface wave exciter 103 is weak, but the decrease in the electric field strength is small even when the surface wave exciter 103 is separated. Therefore, the surface of the object to be heated 102 that is in contact with the surface wave exciter 103 is not heated intensively. That is, the entire object to be heated 102 is heated relatively uniformly.
  • the high-frequency heating apparatus 100 performs the heat treatment operation of the article to be heated 102 based on the relationship between the frequency of the high-frequency power and the excitation frequency of the surface wave exciter 103.
  • 4A to 4C show the high-frequency power formed in the vicinity of the surface of the surface wave exciter 103 based on the relationship between the frequency fp of the high-frequency power supplied to the surface wave exciter 103 and the excitation frequency fc of the surface wave exciter 103.
  • An example of the change of the surface concentration degree of (electric field) is shown typically.
  • FIGS. 4A to 4C show the distance from the surface of the surface wave excitation body 103 in the relationship between the frequency fp of the high frequency power supplied to the surface wave excitation body 103 and the excitation frequency fc of the surface wave excitation body 103.
  • the change of the electric field strength with respect to is shown in a graph. 4A to 4C, the horizontal axis represents the distance from the surface of the surface wave exciter, and the vertical axis represents the electric field strength. In the figure, the larger the inclination of the graph, the more the electric field is concentrated on the surface of the surface wave exciter 103.
  • FIG. 4A shows the magnitude of the electric field strength with respect to the distance from the surface of the surface wave excitation body 103 when the frequency fp of the high frequency power supplied to the surface wave excitation body 103 is substantially equal to the excitation frequency fc of the surface wave excitation body 103.
  • FIG. 4B shown by the graph 151 shows the magnitude of the electric field strength when the frequency fp of the high-frequency power is lower than the excitation frequency fc.
  • FIG. 4C shows the magnitude of the electric field intensity with a graph 153 when the frequency fp of the high-frequency power is higher than the excitation frequency fc.
  • FIG. 4A when the frequency fp of the high-frequency power and the excitation frequency fc are set to substantially equal frequencies, a graph 151 showing the magnitude of the electric field strength with respect to the distance from the surface of the surface wave exciter 103 is shown.
  • the slope is the largest. That is, the state is similar to FIG. 3A where the electric field is strongly concentrated near the surface of the surface wave exciter 103. Thereby, the surface of the article to be heated 102 is heated intensively. Therefore, the relationship between the frequency fp and the excitation frequency fc is suitable when the surface of the object to be heated 102 is burnt.
  • the slope of the graph 152 becomes gentler than the slope of the graph 151 in FIG. 4A. That is, the concentration of the electric field on the surface of the surface wave exciter 103 is reduced, and the distance that the high frequency power reaches from the surface of the surface wave exciter 103 is increased. Therefore, although the electric field strength in the vicinity of the surface of the surface wave exciter 103 is relatively large, even if the electric field strength is far from the surface of the surface wave exciter 103, the electric field strength does not rapidly decrease. That is, the high-frequency power reaches a place slightly away from the surface of the surface wave exciter 103. Therefore, the relationship between the frequency fp and the excitation frequency fc is suitable for heating the object to be heated 102 so as not to burn.
  • the frequency fp of the high frequency power when the frequency fp of the high frequency power is set to a frequency higher than the excitation frequency fc, the slope of the graph 153 is almost eliminated and a flat electric field strength distribution is obtained. That is, the electric field does not concentrate near the surface of the surface wave exciter 103 but spreads over the entire surface. This means that the high-frequency power supplied to the surface wave exciter 103 is radiated to space without propagating through the surface wave exciter 103 by surface waves. Therefore, the relationship between the frequency fp and the excitation frequency fc is suitable for heating the entire object to be heated 102 relatively uniformly.
  • the high-frequency heating device 100 applies the surface wave exciter 103 to the surface wave exciter 103 according to the surface concentration of the high-frequency power near the surface of the surface wave exciter 103 corresponding to the heating state desired by the user.
  • the magnitude relationship between the frequency fp of the high frequency power to be supplied and the excitation frequency fc of the surface wave exciter 103 is set. Thereby, the propagation state of the high frequency power propagating through the surface wave exciter 103 by the surface wave can be changed. Then, the electric field intensity distribution near the surface of the surface wave exciter 103 changes. As a result, the object to be heated 102 can be heat-treated in a heating state desired by the user.
  • the relationship between the frequency fp and the excitation frequency fc is set so that the frequency fp of the high frequency power supplied to the surface wave excitation body 103 is equal to or lower than the excitation frequency fc of the surface wave excitation body 103.
  • the high-frequency power supplied to the surface wave exciter 103 propagates through the surface wave exciter 103 with surface waves. That is, the high frequency power propagates by the operation in the “surface wave mode”.
  • the surface concentration degree of the high-frequency power propagating through the surface wave exciter 103 with the surface wave can be adjusted by adjusting the level of the frequency fp of the high-frequency power with respect to the excitation frequency fc of the surface wave exciter 103 (difference). .
  • the to-be-heated object 102 can be optimally heat-processed according to the heating state with respect to the thickness direction of the to-be-heated object which a user desires.
  • the relationship between the frequency fp and the excitation frequency fc is set so that the frequency fp of the high frequency power supplied to the surface wave excitation body 103 is higher than the excitation frequency fc of the surface wave excitation body 103.
  • the high frequency power supplied to the surface wave exciter 103 is radiated to the space without propagating through the surface wave exciter 103 by the surface wave. That is, the high frequency power is radiated by the operation in “radiation mode”. Therefore, the whole object to be heated 102 can be heated relatively uniformly.
  • the high-frequency power generation unit 120 of the high-frequency heating device 100 is described as an example of a configuration that generates high-frequency power at a fixed frequency fp, but the present invention is not limited to this.
  • the high frequency power generator 120 may be configured with a frequency variable variable high frequency transmitter so as to generate high frequency power of a set frequency.
  • the frequency variable high frequency oscillator can be realized by using a voltage variable element (for example, a varactor diode) as an element for determining the resonance frequency of the resonance circuit constituting the semiconductor oscillation circuit described above.
  • the variable-frequency high-frequency oscillator is generally called a VCO (Voltage Controlled Oscillator).
  • VCO Voltage Controlled Oscillator
  • a control unit is provided in the high-frequency oscillator, and voltage information corresponding to the frequency is supplied to the VCO. Thereby, the frequency of the high frequency oscillator can be changed.
  • variable-frequency high-frequency oscillator may be a PLL (Phase Locked Loop) oscillator including a reference signal generator and a phase comparator. Since the technology of the PLL oscillator is known, a detailed description is omitted. In this case, a control unit is provided in the PLL oscillator, and an information signal corresponding to the frequency is supplied to the phase comparator. Thereby, the frequency of the PLL oscillator can be changed.
  • PLL Phase Locked Loop
  • the object to be heated 102 can be heat-treated with a simple configuration by changing the heating state in the thickness direction of the object to be heated 102 as desired by the user.
  • the surface wave exciter 103 may be configured with a surface wave exciter that can vary the excitation frequency and that can vary the excitation frequency.
  • the dielectric is mechanically controlled between the metal flat plates arranged at regular intervals on the metal flat plate. Insert. Thereby, the excitation frequency of a surface wave exciter can be changed.
  • the dielectric frequency of the dielectric may be changed by electrical control instead of mechanical control to change the excitation frequency of the surface wave excitation body.
  • the excitation frequency of the surface wave exciter can be changed relatively large. Therefore, the heating state in the thickness direction of the object to be heated can be greatly changed. Thereby, the range of the heating state which a user desires can be expanded and a to-be-heated material can be heat-processed variously.
  • the microwave oven includes at least a heating chamber, a high-frequency power generation unit, a waveguide, a surface wave exciter that constitutes the heating unit, a door, a door choke groove, and the like.
  • the heating chamber is formed in a substantially rectangular parallelepiped shape (including a rectangular parallelepiped shape), and an object to be heated is placed inside.
  • the high frequency power generation unit is configured by a magnetron or the like, and supplies high frequency power into the heating chamber.
  • the high-frequency power generation unit is provided at the lower part of the casing or at the side of the casing.
  • the waveguide supplies microwaves generated by the high-frequency power generator to the heating chamber.
  • the surface wave exciter is provided at the lower part, the back part, or the upper part of the heating chamber and propagates high-frequency power to heat the object to be heated.
  • the door is installed on the front surface of the housing in order to open and close the heating chamber.
  • the door choke groove is provided around the door and prevents leakage of electromagnetic waves such as microwaves.
  • the present invention is not limited to this embodiment. Unless it deviates from the meaning of this invention, the form which carried out the various deformation
  • the high-frequency heating device of the present invention includes a high-frequency power generator that generates high-frequency power, a surface wave exciter that propagates high-frequency power by surface waves and heats an object to be heated, and high-frequency power.
  • a high-frequency power supply unit that supplies the surface wave exciter and an installation table on which an object to be heated is installed.
  • the high frequency power generator sets the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter according to the desired surface concentration of the high frequency power near the surface wave exciter. Then, the object to be heated is heat-treated.
  • the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter is set in the thickness direction of the object to be heated according to the heating state desired by the user. To do.
  • a to-be-heated material can be heat-processed in a desired heating state in the thickness direction of a to-be-heated material.
  • the frequency of the high-frequency power supplied to the surface wave excitation body may be set equal to the excitation frequency of the surface wave excitation body or lower than the excitation frequency of the surface wave excitation body.
  • the high-frequency power supplied to the surface wave exciter operates in a “surface wave mode” in which the surface wave propagates in the vicinity of the surface of the surface wave exciter.
  • the side near the surface wave exciter of the object to be heated can be concentrated and heated.
  • the frequency of the high-frequency power supplied to the surface wave excitation body may be set higher than the excitation frequency of the surface wave excitation body.
  • the high-frequency power supplied to the surface wave exciter does not propagate in the vicinity of the surface of the surface wave exciter by the surface wave, but operates in a “radiation mode” that is radiated to the space. Thereby, the whole to-be-heated material can be heated uniformly.
  • the high-frequency power generation unit may be configured by a variable-frequency high-frequency oscillator that generates high-frequency power of a set frequency.
  • the frequency of the high frequency power supplied to the surface wave exciter can be varied.
  • the frequency of the high frequency power can be arbitrarily set with respect to the excitation frequency of the surface wave exciter.
  • the electric field strength distribution formed by the surface wave exciter can be arbitrarily adjusted. Therefore, the object to be heated can be heat-treated in various heating states in the thickness direction of the object to be heated.
  • the surface wave exciter may be constituted by a surface wave exciter having a variable excitation frequency, which can vary the excitation frequency.
  • the excitation frequency of the surface wave excitation body can be varied with respect to the frequency of the high frequency power supplied to the surface wave excitation body.
  • a to-be-heated material can be heat-processed in various heating states in the thickness direction of a to-be-heated material.
  • the present invention is useful for cooking appliances such as a microwave heater in which heat treatment is desired in a desired heating state in the thickness direction of the object to be heated.

Abstract

The present invention comprises: a high-frequency power generation part (120) that generates high-frequency power; a surface wave excitation body (103) that uses surface waves to propagate the high-frequency power and thereby heats an object to be heated (102); a high-frequency power supply part (110) that supplies the high-frequency power to the surface wave excitation body (103); and a mounting stand (101) for mounting the object to be heated (102). In accordance with the surface concentration desired for the high-frequency power near the surface wave excitation body (103), the high-frequency power generation part (120) establishes a magnitude correlation between the frequency of the high-frequency power supplied to the surface wave excitation body (103) and the excitation frequency of the surface wave excitation body (103) and heats the object to be heated (102). The present invention thereby provides a high-frequency heating device (100) that can change the thickness-direction heating state of the object to be heated (102).

Description

高周波加熱装置High frequency heating device
　本発明は、周期構造体を用いた表面波励振体を備える高周波加熱装置に関する。 The present invention relates to a high frequency heating apparatus including a surface wave exciter using a periodic structure.
　従来、周期構造体を用いた表面波励振体に高周波電力を給電して、食品などの被加熱物に加熱処理を施す高周波加熱装置に関する技術が開示されている（例えば、特許文献１参照）。 Conventionally, a technique relating to a high-frequency heating device that supplies high-frequency power to a surface wave exciter using a periodic structure and heats an object to be heated such as food has been disclosed (for example, see Patent Document 1).
　特許文献１の高周波加熱装置は、交叉指型テープ線路（表面波線路）の終端部のインピーダンスを時間的に変化させるインピーダンス可変部を備える。インピーダンス可変部は、定在波分布を時間的に変化させて、強いエネルギの放射を行なう部分を移動させる。これにより、食品全体を効率良く加熱する。 The high-frequency heating device of Patent Document 1 includes an impedance variable unit that temporally changes the impedance of the terminal portion of the crossed finger tape line (surface wave line). The variable impedance unit moves the portion that emits strong energy by changing the standing wave distribution with time. Thereby, the whole food is efficiently heated.
　つまり、上記高周波加熱装置は、交叉指型テープ線路（表面波線路）の終端部のインピーダンスの変化により、交叉指型テープ線路（表面波線路）の定在波分布を変化させて、終端部のインピーダンスを時間的に変化させる。これにより、定在波分布を時間的に変化させて、食品全体を加熱している。 That is, the high-frequency heating device changes the standing wave distribution of the cross-finger tape line (surface wave line) by changing the impedance of the terminal part of the cross-finger tape line (surface wave line), Change impedance in time. Thereby, the standing wave distribution is changed with time, and the whole food is heated.
　しかしながら、従来の高周波加熱装置は、被加熱物の厚み方向に対する高周波電力の放射分布を、変化させることができない。 However, the conventional high-frequency heating device cannot change the radiation distribution of the high-frequency power in the thickness direction of the object to be heated.
特開昭６１－２４０５８９号公報JP-A 61-240589
　本発明は、被加熱物への高周波電力の放射分布を変化させて、被加熱部の加熱状態を変えることができる高周波加熱装置を提供する。 The present invention provides a high-frequency heating device that can change the heating state of the heated portion by changing the radiation distribution of the high-frequency power to the heated object.
　つまり、本発明の高周波加熱装置は、高周波電力を発生させる高周波電力発生部と、高周波電力を表面波で伝播して被加熱物を加熱する表面波励振体と、高周波電力を表面波励振体に供給する高周波電力供給部と、被加熱物を設置する設置台を備える。高周波電力発生部は、所望される表面波励振体近傍の高周波電力の表面集中度に応じて、表面波励振体に供給する高周波電力の周波数と表面波励振体の励振周波数との大小関係を設定して、被加熱物を加熱処理する。 That is, the high-frequency heating device of the present invention includes a high-frequency power generator that generates high-frequency power, a surface wave exciter that propagates high-frequency power by surface waves to heat an object to be heated, and high-frequency power that is used as a surface wave exciter. A high-frequency power supply unit for supplying and an installation table for installing an object to be heated are provided. The high frequency power generator sets the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter according to the desired surface concentration of the high frequency power near the surface wave exciter. Then, the object to be heated is heat-treated.
　この構成によれば、被加熱物の厚み方向において、所望される加熱状態に応じて、表面波励振体に供給する高周波電力の周波数と、表面波励振体の励振周波数との大小関係を設定する。これにより、被加熱物の厚み方向において、所望の加熱状態で被加熱物を加熱処理できる。 According to this configuration, the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter is set in the thickness direction of the object to be heated in accordance with a desired heating state. . Thereby, a to-be-heated material can be heat-processed in a desired heating state in the thickness direction of a to-be-heated material.
図１は、本実施の形態の高周波加熱装置の基本構成を示すブロック図である。FIG. 1 is a block diagram showing the basic configuration of the high-frequency heating device of the present embodiment. 図２は、同高周波加熱装置の高周波電力供給部の構成を示すブロック図である。FIG. 2 is a block diagram illustrating a configuration of a high-frequency power supply unit of the high-frequency heating device. 図３Ａは、同高周波加熱装置の表面波励振体による電界の表面集中度が高い場合における、被加熱物の加熱動作の一例を示す図である。FIG. 3A is a diagram illustrating an example of the heating operation of the object to be heated when the surface concentration of the electric field by the surface wave exciter of the high-frequency heating device is high. 図３Ｂは、同高周波加熱装置の表面波励振体による電界の表面集中度が低い場合における、被加熱物の加熱動作の一例を示す図である。FIG. 3B is a diagram illustrating an example of the heating operation of the object to be heated when the surface concentration of the electric field by the surface wave exciter of the high-frequency heating device is low. 図４Ａは、同高周波加熱装置の高周波電力の周波数と表面波励振体の励振周波数とが等しい場合における、表面波励振体からの距離に対する電界の表面集中度の変化の一例を示すグラフである。FIG. 4A is a graph showing an example of a change in the surface concentration of the electric field with respect to the distance from the surface wave exciter when the frequency of the high frequency power of the high frequency heating apparatus is equal to the excitation frequency of the surface wave exciter. 図４Ｂは、同高周波加熱装置の高周波電力の周波数が表面波励振体の励振周波数より低い場合における、表面波励振体からの距離に対する電界の表面集中度の変化の一例を示すグラフである。FIG. 4B is a graph showing an example of a change in the surface concentration of the electric field with respect to the distance from the surface wave excitation body when the frequency of the high frequency power of the high frequency heating apparatus is lower than the excitation frequency of the surface wave excitation body. 図４Ｃは、同高周波加熱装置の高周波電力の周波数が表面波励振体の励振周波数より高い場合における、表面波励振体からの距離に対する電界の表面集中度の変化の一例を示すグラフである。FIG. 4C is a graph showing an example of a change in the surface concentration of the electric field with respect to the distance from the surface wave excitation body when the frequency of the high frequency power of the high frequency heating apparatus is higher than the excitation frequency of the surface wave excitation body.
　以下、本発明の実施の形態について、図面を参照しながら説明する。なお、この実施の形態によって本発明が限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.
　（実施の形態）
　以下、本実施の形態に係る高周波加熱装置１００について、図１を用いて説明する。 (Embodiment)
Hereinafter, the high-frequency heating apparatus 100 according to the present embodiment will be described with reference to FIG.
　図１は、本実施の形態の高周波加熱装置１００の基本構成を示すブロック図である。 FIG. 1 is a block diagram showing the basic configuration of the high-frequency heating device 100 of the present embodiment.
　図１に示すように、高周波加熱装置１００は、表面波励振体１０３と、高周波電力供給部１１０と、高周波電力発生部１２０と、被加熱物１０２を載置する設置台１０１などを備える。高周波加熱装置１００は、設置台１０１に設置された被加熱物１０２を加熱処理する。 As shown in FIG. 1, the high-frequency heating device 100 includes a surface wave exciter 103, a high-frequency power supply unit 110, a high-frequency power generation unit 120, an installation base 101 on which an object to be heated 102 is placed, and the like. The high-frequency heating device 100 heats an object to be heated 102 installed on the installation table 101.
　このとき、高周波加熱装置１００は、高周波電力発生部１２０で発生される高周波電力の周波数、および表面波励振体１０３の有する励振周波数は、互いに予め意図された周波数の関係となるように設定される。意図された周波数の関係は、被加熱物１０２に所望の加熱状態で加熱処理されるように設定される。 At this time, in the high-frequency heating device 100, the frequency of the high-frequency power generated by the high-frequency power generation unit 120 and the excitation frequency of the surface wave exciter 103 are set so as to have a relationship between frequencies intended in advance. . The intended frequency relationship is set so that the object to be heated 102 is heat-treated in a desired heating state.
　なお、図１に示す高周波加熱装置１００は、それぞれ１つの表面波励振体と高周波電力供給部と高周波電力発生部を有する構成を例に図示しているが、これに限られない。表面波励振体、高周波電力供給部および高周波電力発生部の数は、上記の数に限定されない。 In addition, although the high frequency heating apparatus 100 shown in FIG. 1 has illustrated as an example the structure which has one surface wave excitation body, a high frequency electric power supply part, and a high frequency electric power generation part, respectively, it is not restricted to this. The numbers of surface wave exciters, high frequency power supply units, and high frequency power generation units are not limited to the above numbers.
　そして、高周波加熱装置１００は、以下のように動作する。 The high-frequency heating device 100 operates as follows.
　まず、高周波電力発生部１２０は、高周波電力を発生させる。発生された高周波電力は、高周波電力供給部１１０を介して、表面波励振体１０３へ供給される。供給された高周波電力は、表面波励振体１０３の近傍を表面波で伝播、もしくは放射される。これにより、設置台１０１に載置された被加熱物１０２が加熱される。 First, the high frequency power generation unit 120 generates high frequency power. The generated high frequency power is supplied to the surface wave exciter 103 through the high frequency power supply unit 110. The supplied high frequency power is propagated or radiated in the vicinity of the surface wave exciter 103 by surface waves. Thereby, the article to be heated 102 placed on the installation table 101 is heated.
　以上のように、本実施の形態の高周波加熱装置１００は構成され、動作する。 As described above, the high-frequency heating device 100 of the present embodiment is configured and operates.
　上記高周波電力発生部１２０は、被加熱物１０２の加熱処理に適した周波数（例えば、マイクロ波）とパワーの高周波電力を出力する高周波発信器で構成される。 The high-frequency power generation unit 120 includes a high-frequency transmitter that outputs a high-frequency power having a frequency (for example, a microwave) and power suitable for the heat treatment of the article to be heated 102.
　具体的には、高周波発信器は、例えばマグネトロンとインバータ電源回路や、固体発振器と電力増幅器などで構成される。 Specifically, the high-frequency transmitter includes, for example, a magnetron and an inverter power supply circuit, a solid oscillator and a power amplifier.
　マグネトロンは、電波の一種である強力なノンコヒーレントのマイクロ波を発生する発振用真空管の一種で、レーダーや電子レンジなどの数百ワット～数キロワットの高出力用途に多く使われる。マグネトロンの駆動には、数キロボルトの高電圧が必要となる。そのため、マグネトロンの駆動電源として、一般的に、インバータ電源回路が用いられる。インバータ電源回路は、整流機能を有するコンバータ回路と、昇圧（もしくは降圧）機能と出力周波数変換機能を有するインバータ回路で構成される。なお、インバータ電源回路は、照明装置やモータ制御に広く用いられる技術である。 Magnetron is a type of oscillation vacuum tube that generates a powerful non-coherent microwave that is a type of radio wave, and is often used for high-power applications of several hundred watts to several kilowatts such as radar and microwave ovens. A high voltage of several kilovolts is required for driving the magnetron. Therefore, an inverter power supply circuit is generally used as a drive power source for the magnetron. The inverter power supply circuit includes a converter circuit having a rectifying function, and an inverter circuit having a step-up (or step-down) function and an output frequency conversion function. The inverter power supply circuit is a technique widely used for lighting devices and motor control.
　一方、固体発振器は、トランジスタと、コンデンサ、インダクタ、抵抗器などの高周波用電子部品を有する帰還回路を備える半導体発振回路で構成される。なお、固体発振器は、通信機器などの小電力出力用途の発振器に広く用いられる技術である。 On the other hand, the solid-state oscillator is composed of a semiconductor oscillation circuit including a transistor and a feedback circuit having high-frequency electronic components such as a capacitor, an inductor, and a resistor. Note that the solid-state oscillator is a technique widely used for oscillators for low power output applications such as communication devices.
　固体発振器は、近年、５０ワット程度の高周波電力を出力する発振器もあるが、一般的には数十ミリワット～数百ミリワット程度の高周波電力を出力する発振器である。そのため、数百ワットの出力パワーが必要な加熱処理の用途には使用できない。そこで、通常、固体発振器は、出力された高周波電力を増幅するトランジスタなどで構成される電力増幅器とともに使用される。 In recent years, there are solid-state oscillators that output high-frequency power of about 50 watts, but generally oscillators that output high-frequency power of about several tens of milliwatts to several hundred milliwatts. Therefore, it cannot be used for heat treatment applications that require output power of several hundred watts. Therefore, a solid-state oscillator is usually used with a power amplifier composed of a transistor that amplifies the output high-frequency power.
　高周波電力供給部１１０は、高周波電力発生部１２０で発生された高周波電力を、表面波励振体１０３に給電する電力接続部に相当する。なお、高周波電力供給部１１０の構成については、後述する。 The high frequency power supply unit 110 corresponds to a power connection unit that supplies the high frequency power generated by the high frequency power generation unit 120 to the surface wave exciter 103. The configuration of the high frequency power supply unit 110 will be described later.
　表面波励振体１０３は、金属板で周期的にインピーダンス素子を配列した金属周期構造体や、誘電体板などで構成される。金属周期構造体の場合、例えばスタブ型表面波励振体や、インターデジタル型表面波励振体が用いられる。スタブ型表面波励振体は、図１に示すような金属平板上に、複数の金属平板を一定間隔で、被加熱物に向けて立てる方向に並べて形成される。インターデジタル型表面波励振体は、金属平板を交叉指状に打ち抜いて形成される。誘電体板は、アルミナ板やベークライト板が用いられる。 The surface wave exciter 103 is composed of a metal periodic structure in which impedance elements are periodically arranged with a metal plate, a dielectric plate, or the like. In the case of a metal periodic structure, for example, a stub type surface wave exciter or an interdigital type surface wave exciter is used. A stub type surface wave exciter is formed on a metal flat plate as shown in FIG. 1 by arranging a plurality of metal flat plates at regular intervals in a direction to stand toward an object to be heated. The interdigital surface acoustic wave exciter is formed by punching a metal flat plate like a cross finger. As the dielectric plate, an alumina plate or a bakelite plate is used.
　このとき、表面波励振体１０３の励振周波数は、使用する材料や物理的な構造寸法などにより決まる。例えば、スタブ型表面波励振体の場合、金属平板上に並べられた複数の金属平板の高さ寸法や、金属平板の間隔寸法などを変化させることにより、表面波励振体１０３の励振周波数を変化させることができる。通常、表面波励振体１０３の励振周波数は、金属平板の高さ寸法を低くするほど高くなり、金属平板の間隔寸法を小さくするほど高くなる。そのため、金属平板の高さや間隔の調整により、所望の励振周波数を有する表面波励振体１０３を形成できる。 At this time, the excitation frequency of the surface wave exciter 103 is determined by the material used, the physical structure dimensions, and the like. For example, in the case of a stub type surface wave exciter, the excitation frequency of the surface wave exciter 103 is changed by changing the height dimension of a plurality of metal flat plates arranged on the metal flat plate or the interval dimension of the metal flat plates. Can be made. Usually, the excitation frequency of the surface wave exciter 103 increases as the height dimension of the metal flat plate decreases, and increases as the interval dimension of the metal flat plate decreases. Therefore, the surface wave exciter 103 having a desired excitation frequency can be formed by adjusting the height and interval of the metal flat plate.
　また、表面波励振体１０３は、表面近傍に、高周波電力供給部１１０を介して高周波電力発生部１２０から供給される高周波電力を集中させて、表面波で伝播させる。さらに、表面波励振体１０３は、高周波電力を、例えば高周波加熱装置１００内の空間に放射させることもできる。これにより、表面波励振体１０３の近傍の設置台１０１に載置された被加熱物１０２は、表面波励振体１０３の表面近傍を表面波で伝播、もしくは表面波励振体１０３から放射される高周波電力によって、加熱される。 Further, the surface wave exciter 103 concentrates the high frequency power supplied from the high frequency power generation unit 120 via the high frequency power supply unit 110 in the vicinity of the surface and propagates the surface wave through the surface wave. Furthermore, the surface wave exciter 103 can also radiate high-frequency power into a space in the high-frequency heating device 100, for example. As a result, the object to be heated 102 placed on the installation base 101 in the vicinity of the surface wave exciter 103 propagates in the vicinity of the surface of the surface wave exciter 103 by surface waves or is radiated from the surface wave exciter 103. Heated by electric power.
　つぎに、本実施の形態の高周波電力供給部１１０の構成について、図２を用いて説明する。 Next, the configuration of the high-frequency power supply unit 110 according to the present embodiment will be described with reference to FIG.
　図２は、高周波電力供給部１１０の構成の一例を示すブロック図である。 FIG. 2 is a block diagram illustrating an example of the configuration of the high-frequency power supply unit 110.
　高周波電力供給部１１０は、図２に示すように、高周波電力発生部１２０で発生される高周波電力を、方形導波管１３０を介して、高周波電力供給部１１０へ導くように配置される。 As shown in FIG. 2, the high frequency power supply unit 110 is arranged to guide the high frequency power generated by the high frequency power generation unit 120 to the high frequency power supply unit 110 via the rectangular waveguide 130.
　方形導波管１３０は、主にマイクロ波などの電磁波の伝送に用いられる中空導波管で構成される。中空導波管は、一般的な導波管で、断面形状が方形（例えば、長方形）である金属製の管で形成される。電磁波は、方形導波管１３０の形状や寸法、波長もしくは周波数に応じた電磁界を形成しながら、方形導波管１３０の中を伝播する。 The rectangular waveguide 130 is a hollow waveguide mainly used for transmission of electromagnetic waves such as microwaves. The hollow waveguide is a general waveguide and is formed of a metal tube having a square cross section (for example, a rectangle). The electromagnetic wave propagates through the rectangular waveguide 130 while forming an electromagnetic field corresponding to the shape, size, wavelength, or frequency of the rectangular waveguide 130.
　そして、高周波電力発生部１２０から伝播された高周波電力は、方形導波管１３０およびテーパ形状の方形導波管１３１を経由して、表面波励振体１０３に供給される。テーパ形状の方形導波管１３１は、伝播するマイクロ波の接合部での反射を抑制して、損失を小さくする。 The high-frequency power propagated from the high-frequency power generation unit 120 is supplied to the surface wave exciter 103 via the rectangular waveguide 130 and the tapered rectangular waveguide 131. The tapered rectangular waveguide 131 suppresses the reflection of the propagating microwave at the junction, thereby reducing the loss.
　つまり、高周波電力供給部１１０は、図２の破線で示すように、方形導波管１３０の一部と、テーパ形状の方形導波管１３１と、表面波励振体１０３の一部とで構成される。 That is, the high-frequency power supply unit 110 includes a part of the rectangular waveguide 130, a tapered rectangular waveguide 131, and a part of the surface wave exciter 103 as indicated by a broken line in FIG. 2. The
　これにより、高周波電力発生部１２０で発生される高周波電力は、方形導波管１３０を介して、高周波電力供給部１１０へ導かれ、テーパ形状の方形導波管１３１を介して、表面波励振体１０３へ効率よく供給される。 As a result, the high frequency power generated by the high frequency power generation unit 120 is guided to the high frequency power supply unit 110 via the rectangular waveguide 130, and the surface wave exciter via the tapered rectangular waveguide 131. 103 is efficiently supplied.
　このとき、本実施の形態の高周波加熱装置１００は、高周波電力発生部１２０で発生される高周波電力の周波数と、表面波励振体１０３の有する励振周波数を、互いに予め意図された周波数の関係となるように設定される。これにより、後述するように、被加熱物１０２が所望の加熱状態で加熱処理される。 At this time, in the high-frequency heating device 100 of the present embodiment, the frequency of the high-frequency power generated by the high-frequency power generation unit 120 and the excitation frequency of the surface wave exciter 103 are in a mutually intended relationship. Is set as follows. Thereby, as described later, the object to be heated 102 is heat-treated in a desired heating state.
　以上のように、本実施の形態の高周波加熱装置１００は構成され、被加熱物１０２などが加熱処理される。 As described above, the high-frequency heating device 100 of the present embodiment is configured, and the object to be heated 102 and the like is subjected to heat treatment.
　つぎに、上述の高周波加熱装置１００の、被加熱物１０２を加熱処理する動作について、図３Ａおよび図３Ｂを用いて、説明する。 Next, an operation of heat-treating the object to be heated 102 of the above-described high-frequency heating device 100 will be described with reference to FIGS. 3A and 3B.
　図３Ａおよび図３Ｂは、設置台１０１に被加熱物１０２を設置した状態において、供給される高周波電力による表面波励振体１０３の表面付近の電界強度分布で、被加熱物１０２を加熱する動作の一例を模式的に示す。 3A and 3B show the operation of heating the object to be heated 102 with the electric field intensity distribution in the vicinity of the surface of the surface wave exciter 103 by the supplied high frequency power when the object to be heated 102 is installed on the installation table 101. An example is shown schematically.
　つまり、図３Ａは、高周波電力の表面集中度が高くなるように、高周波電力発生部１２０で発生される高周波電力の周波数と表面波励振体１０３の励振周波数を設定した場合における、表面波励振体１０３の表面近傍に形成される電界強度分布１４１を示す。 That is, FIG. 3A shows the surface wave exciter when the frequency of the high frequency power generated by the high frequency power generator 120 and the excitation frequency of the surface wave exciter 103 are set so that the surface concentration of the high frequency power becomes high. An electric field strength distribution 141 formed in the vicinity of the surface 103 is shown.
　図３Ｂは、高周波電力の表面集中度が低くなるように、高周波電力の周波数と励振周波数を設定した場合における、表面波励振体１０３の表面近傍に形成される電界強度分布１４２を示す。 FIG. 3B shows an electric field intensity distribution 142 formed in the vicinity of the surface of the surface wave exciter 103 when the frequency of the high frequency power and the excitation frequency are set so that the surface concentration degree of the high frequency power is low.
　なお、図３Ａおよび図３Ｂは、電界強度分布１４１および１４２の電界の強度を、色の濃淡で表している。この場合、色が濃いほど電界が強いことを示す。 In FIGS. 3A and 3B, the electric field strengths of the electric field strength distributions 141 and 142 are represented by shades of color. In this case, the darker the color, the stronger the electric field.
　図３Ａの場合、高周波電力の周波数と表面波励振体１０３の励振周波数との関係を、表面波励振体１０３の近傍で高周波電力の表面集中度が高くなるように設定している。そのため、表面波励振体１０３の表面近傍の電界強度が強くなる。これにより、被加熱物１０２は、表面波励振体１０３に近い側の面および近い側の内部が集中的に強く加熱される。そして、表面波励振体１０３から遠のくにつれて、急激に電界強度は弱くなる。そのため、被加熱物１０２の加熱の度合いも弱くなる。 In the case of FIG. 3A, the relationship between the frequency of the high-frequency power and the excitation frequency of the surface wave exciter 103 is set so that the surface concentration of the high-frequency power increases in the vicinity of the surface wave exciter 103. Therefore, the electric field strength near the surface of the surface wave exciter 103 is increased. As a result, the object to be heated 102 is heated strongly and intensively on the surface near the surface wave exciter 103 and the inside on the near side. The electric field strength suddenly decreases as the distance from the surface wave exciter 103 increases. Therefore, the degree of heating of the article 102 to be heated also becomes weak.
　一方、図３Ｂの場合、高周波電力の周波数と表面波励振体１０３の励振周波数との関係を、表面波励振体１０３の近傍で高周波電力の表面集中度が低くなるように設定している。この場合、表面波励振体１０３の表面近傍の電界強度は弱くなるが、表面波励振体１０３から離れても電界強度の低下が小さい。そのため、被加熱物１０２は、表面波励振体１０３に接する側の面が集中的に強く加熱されることは無い。つまり、被加熱物１０２は、全体が比較的万遍なく加熱される。 On the other hand, in the case of FIG. 3B, the relationship between the frequency of the high frequency power and the excitation frequency of the surface wave exciter 103 is set so that the surface concentration of the high frequency power is low in the vicinity of the surface wave exciter 103. In this case, the electric field strength in the vicinity of the surface of the surface wave exciter 103 is weak, but the decrease in the electric field strength is small even when the surface wave exciter 103 is separated. Therefore, the surface of the object to be heated 102 that is in contact with the surface wave exciter 103 is not heated intensively. That is, the entire object to be heated 102 is heated relatively uniformly.
　以上のように、高周波加熱装置１００は、高周波電力の周波数と表面波励振体１０３の励振周波数との関係に基づいて、被加熱物１０２の加熱処理動作が実行される。 As described above, the high-frequency heating apparatus 100 performs the heat treatment operation of the article to be heated 102 based on the relationship between the frequency of the high-frequency power and the excitation frequency of the surface wave exciter 103.
　以下に、上述した高周波電力の周波数と表面波励振体１０３の励振周波数との大小関係により、表面波励振体１０３の表面からの距離と電界強度との関係について、図３Ａおよび図３Ｂを参照しながら、図４Ａから図４Ｃを用いて、説明する。 Hereinafter, the relationship between the distance from the surface of the surface wave exciter 103 and the electric field strength due to the magnitude relationship between the frequency of the high frequency power and the excitation frequency of the surface wave exciter 103 will be described with reference to FIGS. 3A and 3B. However, it demonstrates using FIG. 4A to FIG. 4C.
　図４Ａから図４Ｃは、表面波励振体１０３に供給する高周波電力の周波数ｆｐと、表面波励振体１０３の励振周波数ｆｃとの関係による、表面波励振体１０３の表面近傍に形成される高周波電力（電界）の表面集中度の変化の一例を模式的に示す。 4A to 4C show the high-frequency power formed in the vicinity of the surface of the surface wave exciter 103 based on the relationship between the frequency fp of the high-frequency power supplied to the surface wave exciter 103 and the excitation frequency fc of the surface wave exciter 103. An example of the change of the surface concentration degree of (electric field) is shown typically.
　詳細には、図４Ａから図４Ｃは、表面波励振体１０３に供給する高周波電力の周波数ｆｐと、表面波励振体１０３の励振周波数ｆｃとの関係における、表面波励振体１０３の表面からの距離に対する電界強度の大きさの変化をグラフで示す。このとき、図４Ａから図４Ｃの横軸は表面波励振体の表面からの距離、縦軸は電界強度の大きさを示す。なお、図中において、グラフの傾斜が大きいほど表面波励振体１０３の表面に電界が集中していることを意味する。 Specifically, FIGS. 4A to 4C show the distance from the surface of the surface wave excitation body 103 in the relationship between the frequency fp of the high frequency power supplied to the surface wave excitation body 103 and the excitation frequency fc of the surface wave excitation body 103. The change of the electric field strength with respect to is shown in a graph. 4A to 4C, the horizontal axis represents the distance from the surface of the surface wave exciter, and the vertical axis represents the electric field strength. In the figure, the larger the inclination of the graph, the more the electric field is concentrated on the surface of the surface wave exciter 103.
　図４Ａは、表面波励振体１０３に供給する高周波電力の周波数ｆｐが表面波励振体１０３の励振周波数ｆｃとほぼ等しい時の、表面波励振体１０３の表面からの距離に対する電界強度の大きさをグラフ１５１で示す、図４Ｂは、高周波電力の周波数ｆｐが励振周波数ｆｃよりも低い時の、電界強度の大きさをグラフ１５２で示す。さらに、図４Ｃは、高周波電力の周波数ｆｐが励振周波数ｆｃよりも高い時の、電界強度の大きさをグラフ１５３で示す。 FIG. 4A shows the magnitude of the electric field strength with respect to the distance from the surface of the surface wave excitation body 103 when the frequency fp of the high frequency power supplied to the surface wave excitation body 103 is substantially equal to the excitation frequency fc of the surface wave excitation body 103. FIG. 4B shown by the graph 151 shows the magnitude of the electric field strength when the frequency fp of the high-frequency power is lower than the excitation frequency fc. Furthermore, FIG. 4C shows the magnitude of the electric field intensity with a graph 153 when the frequency fp of the high-frequency power is higher than the excitation frequency fc.
　まず、図４Ａに示すように、高周波電力の周波数ｆｐと、励振周波数ｆｃとを、ほぼ等しい周波数に設定すると、表面波励振体１０３の表面からの距離に対する電界強度の大きさを示すグラフ１５１の傾斜が最も大きくなる。つまり、表面波励振体１０３の表面近傍に電界が強く集中する、図３Ａに近似した状態となる。これにより、被加熱物１０２の表面が集中的に加熱される。そのため、上記周波数ｆｐと励振周波数ｆｃとの関係は、被加熱物１０２の表面に焦げ目を付ける場合に適している。 First, as shown in FIG. 4A, when the frequency fp of the high-frequency power and the excitation frequency fc are set to substantially equal frequencies, a graph 151 showing the magnitude of the electric field strength with respect to the distance from the surface of the surface wave exciter 103 is shown. The slope is the largest. That is, the state is similar to FIG. 3A where the electric field is strongly concentrated near the surface of the surface wave exciter 103. Thereby, the surface of the article to be heated 102 is heated intensively. Therefore, the relationship between the frequency fp and the excitation frequency fc is suitable when the surface of the object to be heated 102 is burnt.
　また、図４Ｂに示すように、高周波電力の周波数ｆｐを励振周波数ｆｃよりも低い周波数に設定すると、グラフ１５２の傾斜が、図４Ａのグラフ１５１の傾斜に比べて、緩やかになる。つまり、表面波励振体１０３の表面での電界の集中度が下がり、表面波励振体１０３の表面から高周波電力が届く距離が遠くなる。そのため、表面波励振体１０３の表面近傍の電界強度は比較的大きいが、表面波励振体１０３の表面から遠ざかっても急激な電界強度の低下は無い。つまり、表面波励振体１０３の表面から少し離れた所まで高周波電力が届く。そのため、上記周波数ｆｐと励振周波数ｆｃとの関係は、被加熱物１０２を焦げない程度に強く加熱する場合に適している。 As shown in FIG. 4B, when the frequency fp of the high-frequency power is set to a frequency lower than the excitation frequency fc, the slope of the graph 152 becomes gentler than the slope of the graph 151 in FIG. 4A. That is, the concentration of the electric field on the surface of the surface wave exciter 103 is reduced, and the distance that the high frequency power reaches from the surface of the surface wave exciter 103 is increased. Therefore, although the electric field strength in the vicinity of the surface of the surface wave exciter 103 is relatively large, even if the electric field strength is far from the surface of the surface wave exciter 103, the electric field strength does not rapidly decrease. That is, the high-frequency power reaches a place slightly away from the surface of the surface wave exciter 103. Therefore, the relationship between the frequency fp and the excitation frequency fc is suitable for heating the object to be heated 102 so as not to burn.
　また、図４Ｃに示すように、高周波電力の周波数ｆｐを励振周波数ｆｃより高い周波数に設定すると、グラフ１５３の傾斜は殆どなくなり、フラットな電界強度分布になる。つまり、電界は表面波励振体１０３の表面近傍みに集中せずに、全体に広がって分布する。これは、表面波励振体１０３に供給される高周波電力が、表面波励振体１０３を表面波で伝播することなく、空間へ放射されている状態を意味する。そのため、上記周波数ｆｐと励振周波数ｆｃとの関係は、被加熱物１０２全体を比較的万遍なく加熱する場合に適している。 As shown in FIG. 4C, when the frequency fp of the high frequency power is set to a frequency higher than the excitation frequency fc, the slope of the graph 153 is almost eliminated and a flat electric field strength distribution is obtained. That is, the electric field does not concentrate near the surface of the surface wave exciter 103 but spreads over the entire surface. This means that the high-frequency power supplied to the surface wave exciter 103 is radiated to space without propagating through the surface wave exciter 103 by surface waves. Therefore, the relationship between the frequency fp and the excitation frequency fc is suitable for heating the entire object to be heated 102 relatively uniformly.
　上述したように、本実施の形態の高周波加熱装置１００は、ユーザが所望する加熱状態に対応する表面波励振体１０３の表面近傍の高周波電力の表面集中度に応じて、表面波励振体１０３に供給する高周波電力の周波数ｆｐと、表面波励振体１０３の励振周波数ｆｃとの大小関係を設定する。これにより、表面波励振体１０３を表面波で伝播する高周波電力の伝播状態を変化させることができる。そして、表面波励振体１０３の表面近傍の電界強度分布が変化する。その結果、ユーザが所望する加熱状態で被加熱物１０２を加熱処理できる。 As described above, the high-frequency heating device 100 according to the present embodiment applies the surface wave exciter 103 to the surface wave exciter 103 according to the surface concentration of the high-frequency power near the surface of the surface wave exciter 103 corresponding to the heating state desired by the user. The magnitude relationship between the frequency fp of the high frequency power to be supplied and the excitation frequency fc of the surface wave exciter 103 is set. Thereby, the propagation state of the high frequency power propagating through the surface wave exciter 103 by the surface wave can be changed. Then, the electric field intensity distribution near the surface of the surface wave exciter 103 changes. As a result, the object to be heated 102 can be heat-treated in a heating state desired by the user.
　つまり、表面波励振体１０３に供給する高周波電力の周波数ｆｐを、表面波励振体１０３の励振周波数ｆｃに等しい、もしくは低くなるように、周波数ｆｐと励振周波数ｆｃの関係を設定する。この場合、表面波励振体１０３に供給される高周波電力は、表面波励振体１０３を表面波で伝播する。すなわち、高周波電力は、「表面波モード」による動作で、伝播する。このとき、表面波励振体１０３の励振周波数ｆｃに対する高周波電力の周波数ｆｐの低さ加減（差分）を調整すれば、表面波励振体１０３を表面波で伝播する高周波電力の表面集中度を調整できる。これにより、ユーザが所望する被加熱物の厚み方向に対する加熱状態に応じて、被加熱物１０２を、最適に加熱処理できる。 That is, the relationship between the frequency fp and the excitation frequency fc is set so that the frequency fp of the high frequency power supplied to the surface wave excitation body 103 is equal to or lower than the excitation frequency fc of the surface wave excitation body 103. In this case, the high-frequency power supplied to the surface wave exciter 103 propagates through the surface wave exciter 103 with surface waves. That is, the high frequency power propagates by the operation in the “surface wave mode”. At this time, the surface concentration degree of the high-frequency power propagating through the surface wave exciter 103 with the surface wave can be adjusted by adjusting the level of the frequency fp of the high-frequency power with respect to the excitation frequency fc of the surface wave exciter 103 (difference). . Thereby, the to-be-heated object 102 can be optimally heat-processed according to the heating state with respect to the thickness direction of the to-be-heated object which a user desires.
　一方、表面波励振体１０３に供給する高周波電力の周波数ｆｐを、表面波励振体１０３の励振周波数ｆｃよりも高くなるように、周波数ｆｐと励振周波数ｆｃの関係を設定する。この場合、表面波励振体１０３に供給される高周波電力は、表面波励振体１０３を表面波で伝播せずに空間へ放射される。すなわち、高周波電力は、「放射モード」による動作で放射される。そのため、被加熱物１０２の全体を比較的万遍なく加熱できる。 On the other hand, the relationship between the frequency fp and the excitation frequency fc is set so that the frequency fp of the high frequency power supplied to the surface wave excitation body 103 is higher than the excitation frequency fc of the surface wave excitation body 103. In this case, the high frequency power supplied to the surface wave exciter 103 is radiated to the space without propagating through the surface wave exciter 103 by the surface wave. That is, the high frequency power is radiated by the operation in “radiation mode”. Therefore, the whole object to be heated 102 can be heated relatively uniformly.
　なお、上記実施の形態では、高周波加熱装置１００の高周波電力発生部１２０を、固定の周波数ｆｐで高周波電力を発生させる構成を例に説明したが、これに限られない。例えば、設定される周波数の高周波電力を発生するように、周波数可変の高周波発信器で、高周波電力発生部１２０を構成してもよい。 In the above-described embodiment, the high-frequency power generation unit 120 of the high-frequency heating device 100 is described as an example of a configuration that generates high-frequency power at a fixed frequency fp, but the present invention is not limited to this. For example, the high frequency power generator 120 may be configured with a frequency variable variable high frequency transmitter so as to generate high frequency power of a set frequency.
　周波数可変の高周波発振器は、前述した半導体発振回路を構成する共振回路の共振周波数を決める素子に電圧可変素子（例えば、バラクターダイオードなど）を用いることで実現できる。周波数可変の高周波発振器は、一般的に、ＶＣＯ（Ｖｏｌｔａｇｅ　Ｃｏｎｔｒｏｌｌｅｄ　Ｏｓｃｉｌｌａｔｏｒ）と呼ばれる。なお、ＶＣＯの技術は公知であるので、詳細な説明は省略する。この場合、高周波発振器に制御部を設け、ＶＣＯに、周波数に対応する電圧情報を供給する。これにより、高周波発振器の周波数を変更できる。 The frequency variable high frequency oscillator can be realized by using a voltage variable element (for example, a varactor diode) as an element for determining the resonance frequency of the resonance circuit constituting the semiconductor oscillation circuit described above. The variable-frequency high-frequency oscillator is generally called a VCO (Voltage Controlled Oscillator). In addition, since the technique of VCO is well-known, detailed description is abbreviate | omitted. In this case, a control unit is provided in the high-frequency oscillator, and voltage information corresponding to the frequency is supplied to the VCO. Thereby, the frequency of the high frequency oscillator can be changed.
　また、周波数可変の高周波発振器は、基準信号発生器と位相比較器を備えたＰＬＬ（Ｐｈａｓｅ　Ｌｏｃｋｅｄ　Ｌｏｏｐ）発振器で構成してもよい。なお、ＰＬＬ発振器の技術は公知であるので、詳細な説明は省略する。この場合、ＰＬＬ発振器に制御部を設け、位相比較器に、周波数に対応する情報信号を供給する。これにより、ＰＬＬ発振器の周波数を変更できる。 Further, the variable-frequency high-frequency oscillator may be a PLL (Phase Locked Loop) oscillator including a reference signal generator and a phase comparator. Since the technology of the PLL oscillator is known, a detailed description is omitted. In this case, a control unit is provided in the PLL oscillator, and an information signal corresponding to the frequency is supplied to the phase comparator. Thereby, the frequency of the PLL oscillator can be changed.
　これにより、１つの高周波電力発生部で複数の周波数の高周波電力を発生することができる。そのため、上述した、表面波励振体１０３へ供給する高周波電力の周波数ｆｐと、表面波励振体１０３の励振周波数ｆｃとの大小関係を、簡単で、自在に設定できる。すなわち、表面波励振体１０３に供給する高周波電力の周波数ｆｐと、表面波励振体１０３の励振周波数ｆｃとの大小関係を、自在に変化させることができる。これにより、簡単な構成で、ユーザが所望するように、被加熱物１０２の厚み方向に対する加熱状態を変化させて、被加熱物１０２を加熱処理できる。 Thereby, high frequency power having a plurality of frequencies can be generated by one high frequency power generation unit. Therefore, the above-described magnitude relationship between the frequency fp of the high-frequency power supplied to the surface wave exciter 103 and the excitation frequency fc of the surface wave exciter 103 can be set easily and freely. That is, the magnitude relationship between the frequency fp of the high frequency power supplied to the surface wave excitation body 103 and the excitation frequency fc of the surface wave excitation body 103 can be freely changed. Thus, the object to be heated 102 can be heat-treated with a simple configuration by changing the heating state in the thickness direction of the object to be heated 102 as desired by the user.
　また、本実施の形態の高周波加熱装置１００は、表面波励振体１０３を、励振周波数を可変できる、励振周波数可変の表面波励振体で構成してもよい。 Also, in the high-frequency heating device 100 of the present embodiment, the surface wave exciter 103 may be configured with a surface wave exciter that can vary the excitation frequency and that can vary the excitation frequency.
　具体的には、表面波励振体を、上述したスタブ型表面波励振体で形成する場合、金属平板上に一定間隔で並べられた金属平板と金属平板の間に、機械的な制御で誘電体を挿入する。これにより、表面波励振体の励振周波数を変化させることができる。 Specifically, when the surface wave exciter is formed of the stub type surface wave exciter described above, the dielectric is mechanically controlled between the metal flat plates arranged at regular intervals on the metal flat plate. Insert. Thereby, the excitation frequency of a surface wave exciter can be changed.
　この場合、機械的な制御ではなく、電気的な制御で誘電体の誘電率を変えて、表面波励振体の励振周波数を変化させてもよい。これにより、表面波励振体の励振周波数を、比較的大きく変化させることができる。そのため、被加熱物の厚み方向における加熱状態を、大きく変化させることができる。これにより、ユーザが所望する、加熱状態の範囲を拡大して、多彩に被加熱物を加熱処理できる。 In this case, the dielectric frequency of the dielectric may be changed by electrical control instead of mechanical control to change the excitation frequency of the surface wave excitation body. Thereby, the excitation frequency of the surface wave exciter can be changed relatively large. Therefore, the heating state in the thickness direction of the object to be heated can be greatly changed. Thereby, the range of the heating state which a user desires can be expanded and a to-be-heated material can be heat-processed variously.
　なお、上記実施の形態では、高周波加熱装置の用途に関しては、特に言及しなかったが、例えば、以下に説明する一般的な調理用の電子レンジと同様の基本構成としてもよい。 In addition, in the said embodiment, although it did not mention in particular regarding the use of a high frequency heating apparatus, it is good also as a basic structure similar to the microwave oven for general cooking demonstrated below, for example.
　すなわち、電子レンジは、少なくとも加熱室と、高周波電力発生部と、導波管と、加熱部を構成する表面波励振体と、ドアと、ドアチョーク溝などで構成される。加熱室は、略直方体状（直方体状を含む）で形成され、内部に加熱する被加熱物が載置される。高周波電力発生部は、マグネトロンなどで構成され、加熱室内に高周波電力を供給する。高周波電力発生部は、筐体下部や筐体側部に設けられる。導波管は、高周波電力発生部で発生させるマイクロ波を加熱室内に供給する。表面波励振体は、加熱室の下部や背部あるいは上部に設けられ、高周波電力を伝播させて、被加熱物を加熱する。ドアは、加熱室を開閉するために、筐体前面に設置される。ドアチョーク溝は、ドアの周囲に設けられ、マイクロ波などの電磁波漏れを防止する。 That is, the microwave oven includes at least a heating chamber, a high-frequency power generation unit, a waveguide, a surface wave exciter that constitutes the heating unit, a door, a door choke groove, and the like. The heating chamber is formed in a substantially rectangular parallelepiped shape (including a rectangular parallelepiped shape), and an object to be heated is placed inside. The high frequency power generation unit is configured by a magnetron or the like, and supplies high frequency power into the heating chamber. The high-frequency power generation unit is provided at the lower part of the casing or at the side of the casing. The waveguide supplies microwaves generated by the high-frequency power generator to the heating chamber. The surface wave exciter is provided at the lower part, the back part, or the upper part of the heating chamber and propagates high-frequency power to heat the object to be heated. The door is installed on the front surface of the housing in order to open and close the heating chamber. The door choke groove is provided around the door and prevents leakage of electromagnetic waves such as microwaves.
　以上、本発明に係る高周波加熱装置について、実施の形態に基づき説明したが、本発明はこの実施の形態に限定されるものではない。本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を各実施の形態に施したものや、異なる実施の形態における構成要素を組み合わせて構築される形態も、本発明の範囲内に含まれる。 As mentioned above, although the high-frequency heating device concerning the present invention was explained based on an embodiment, the present invention is not limited to this embodiment. Unless it deviates from the meaning of this invention, the form which carried out the various deformation | transformation which those skilled in the art will think to each embodiment, and the form constructed | assembled combining the component in different embodiment is also contained in the scope of the present invention. .
　以上で説明したように、本発明の高周波加熱装置は、高周波電力を発生させる高周波電力発生部と、高周波電力を表面波で伝播して被加熱物を加熱する表面波励振体と、高周波電力を表面波励振体に供給する高周波電力供給部と、被加熱物を設置する設置台を備える。高周波電力発生部は、所望される表面波励振体近傍の高周波電力の表面集中度に応じて、表面波励振体に供給する高周波電力の周波数と表面波励振体の励振周波数との大小関係を設定して、被加熱物を加熱処理する。 As described above, the high-frequency heating device of the present invention includes a high-frequency power generator that generates high-frequency power, a surface wave exciter that propagates high-frequency power by surface waves and heats an object to be heated, and high-frequency power. A high-frequency power supply unit that supplies the surface wave exciter and an installation table on which an object to be heated is installed. The high frequency power generator sets the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter according to the desired surface concentration of the high frequency power near the surface wave exciter. Then, the object to be heated is heat-treated.
　この構成によれば、被加熱物の厚み方向において、ユーザが所望する加熱状態に応じて、表面波励振体に供給する高周波電力の周波数と、表面波励振体の励振周波数との大小関係を設定する。これにより、被加熱物の厚み方向において、所望の加熱状態で被加熱物を加熱処理できる。 According to this configuration, the magnitude relationship between the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter is set in the thickness direction of the object to be heated according to the heating state desired by the user. To do. Thereby, a to-be-heated material can be heat-processed in a desired heating state in the thickness direction of a to-be-heated material.
　また、本発明の高周波加熱装置は、表面波励振体に供給する高周波電力の周波数を、表面波励振体の励振周波数に等しい、または表面波励振体の励振周波数よりも低く設定してもよい。 In the high-frequency heating device of the present invention, the frequency of the high-frequency power supplied to the surface wave excitation body may be set equal to the excitation frequency of the surface wave excitation body or lower than the excitation frequency of the surface wave excitation body.
　この構成によれば、表面波励振体に供給された高周波電力は、表面波励振体の表面近傍を表面波で伝播する、「表面波モード」の動作となる。これにより、被加熱物の表面波励振体に近い側を集中して加熱できる。 According to this configuration, the high-frequency power supplied to the surface wave exciter operates in a “surface wave mode” in which the surface wave propagates in the vicinity of the surface of the surface wave exciter. Thereby, the side near the surface wave exciter of the object to be heated can be concentrated and heated.
　また、本発明の高周波加熱装置は、表面波励振体に供給する高周波電力の周波数を、表面波励振体の励振周波数よりも高く設定してもよい。 In the high-frequency heating device of the present invention, the frequency of the high-frequency power supplied to the surface wave excitation body may be set higher than the excitation frequency of the surface wave excitation body.
　この構成によれば、表面波励振体に供給された高周波電力は、表面波励振体の表面近傍を表面波で伝播せず、空間に放射される「放射モード」の動作となる。これにより、被加熱物全体を万遍なく加熱できる。 According to this configuration, the high-frequency power supplied to the surface wave exciter does not propagate in the vicinity of the surface of the surface wave exciter by the surface wave, but operates in a “radiation mode” that is radiated to the space. Thereby, the whole to-be-heated material can be heated uniformly.
　また、本発明の高周波加熱装置は、高周波電力発生部を、設定された周波数の高周波電力を発生する、周波数可変の高周波発振器で構成してもよい。 In the high-frequency heating device of the present invention, the high-frequency power generation unit may be configured by a variable-frequency high-frequency oscillator that generates high-frequency power of a set frequency.
　この構成によれば、表面波励振体に供給する高周波電力の周波数を可変にできる。これにより、表面波励振体の励振周波数に対する、高周波電力の周波数を任意に設定できる。その結果、表面波励振体で形成される電界強度分布を任意に調整できる。そのため、被加熱物の厚み方向において、様々な加熱状態で被加熱物を加熱処理できる。 According to this configuration, the frequency of the high frequency power supplied to the surface wave exciter can be varied. Thereby, the frequency of the high frequency power can be arbitrarily set with respect to the excitation frequency of the surface wave exciter. As a result, the electric field strength distribution formed by the surface wave exciter can be arbitrarily adjusted. Therefore, the object to be heated can be heat-treated in various heating states in the thickness direction of the object to be heated.
　また、本発明の高周波加熱装置は、表面波励振体を、励振周波数を可変できる、励振周波数可変の表面波励振体で構成してもよい。 Further, in the high-frequency heating device of the present invention, the surface wave exciter may be constituted by a surface wave exciter having a variable excitation frequency, which can vary the excitation frequency.
　この構成によれば、表面波励振体に供給される高周波電力の周波数に対して、表面波励振体の励振周波数を可変できる。これにより、被加熱物の厚み方向において、様々な加熱状態で被加熱物を加熱処理できる。 According to this configuration, the excitation frequency of the surface wave excitation body can be varied with respect to the frequency of the high frequency power supplied to the surface wave excitation body. Thereby, a to-be-heated material can be heat-processed in various heating states in the thickness direction of a to-be-heated material.
　本発明は、被加熱物の厚み方向において、所望の加熱状態で加熱処理が要望される、マイクロ波加熱機などの調理家電などに有用である。 The present invention is useful for cooking appliances such as a microwave heater in which heat treatment is desired in a desired heating state in the thickness direction of the object to be heated.
　１００　　高周波加熱装置
　１０１　　設置台
　１０２　　被加熱物
　１０３　　表面波励振体
　１１０　　高周波電力供給部
　１２０　　高周波電力発生部
　１３０　　方形導波管
　１３１　　テーパ形状の方形導波管
　１４１，１４２　　電界強度分布 DESCRIPTION OF SYMBOLS 100 High frequency heating apparatus 101 Installation stand 102 To-be-heated object 103 Surface wave exciter 110 High frequency electric power supply part 120 High frequency electric power generation part 130 Rectangular waveguide 131 Tapered rectangular waveguide 141, 142 Electric field intensity distribution

Claims (5)

  1. 高周波電力を発生させる高周波電力発生部と、
    前記高周波電力を表面波で伝播して前記被加熱物を加熱する表面波励振体と、
    前記高周波電力を前記表面波励振体に供給する高周波電力供給部と、
    前記被加熱物を設置する設置台と、を備え、
    前記高周波電力発生部は、所望される前記表面波励振体近傍の前記高周波電力の表面集中度に応じて、前記表面波励振体に供給する前記高周波電力の周波数と前記表面波励振体の励振周波数との大小関係を設定して、前記被加熱物を加熱処理する、高周波加熱装置。     A high-frequency power generator for generating high-frequency power;
    A surface wave exciter that propagates the high-frequency power in a surface wave to heat the object to be heated;
    A high frequency power supply unit for supplying the high frequency power to the surface wave exciter;
    An installation base for installing the object to be heated;
    The high-frequency power generator generates a frequency of the high-frequency power to be supplied to the surface wave exciter and an excitation frequency of the surface wave exciter according to a desired surface concentration of the high frequency power in the vicinity of the surface wave exciter. A high-frequency heating apparatus that heats the object to be heated by setting a magnitude relationship with the object.
  2. 前記表面波励振体に供給する高周波電力の周波数は、前記表面波励振体の励振周波数に等しい、または前記表面波励振体の励振周波数よりも低い、請求項１に記載の高周波加熱装置。 2. The high-frequency heating device according to claim 1, wherein the frequency of the high-frequency power supplied to the surface wave excitation body is equal to or lower than the excitation frequency of the surface wave excitation body.
  3. 前記表面波励振体に供給する高周波電力の周波数は、前記表面波励振体の励振周波数よりも高い、請求項１に記載の高周波加熱装置。 The high frequency heating apparatus according to claim 1, wherein a frequency of the high frequency power supplied to the surface wave excitation body is higher than an excitation frequency of the surface wave excitation body.
  4. 前記高周波電力発生部は、設定された周波数の高周波電力を発生する、周波数可変の高周波発振器で構成される、請求項１に記載の高周波加熱装置。 The high-frequency heating device according to claim 1, wherein the high-frequency power generation unit includes a variable-frequency high-frequency oscillator that generates high-frequency power having a set frequency.
  5. 前記表面波励振体は、励振周波数を可変できる、励振周波数可変の表面波励振体で構成される、請求項１に記載の高周波加熱装置。 The high-frequency heating device according to claim 1, wherein the surface wave exciter is configured by a surface wave exciter having a variable excitation frequency, the excitation frequency being variable.
PCT/JP2017/022304 2016-06-30 2017-06-16 High-frequency heating device WO2018003546A1 (en)

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