WO2018003398A1 - Module de bobine - Google Patents

Module de bobine Download PDF

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Publication number
WO2018003398A1
WO2018003398A1 PCT/JP2017/020537 JP2017020537W WO2018003398A1 WO 2018003398 A1 WO2018003398 A1 WO 2018003398A1 JP 2017020537 W JP2017020537 W JP 2017020537W WO 2018003398 A1 WO2018003398 A1 WO 2018003398A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
circuit board
electronic component
resin layer
conductor
Prior art date
Application number
PCT/JP2017/020537
Other languages
English (en)
Japanese (ja)
Inventor
番場　真一郎
一樹 江島
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2018524982A priority Critical patent/JP6648830B2/ja
Publication of WO2018003398A1 publication Critical patent/WO2018003398A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/02—Fixed inductances of the signal type  without magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to a coil module including a coil and a circuit connected to the coil.
  • FIG. 9 is a diagram showing the structure of the RFID tag disclosed in Patent Document 1.
  • the RFID tag 91 includes a coil 92, an insulator 93 and a metal plate 94.
  • a resonance capacitor 96 and an RFID IC 97 are mounted on the core of the coil.
  • the coil opening is relatively small compared to the size of the entire tag. Therefore, the readable distance as an RFID tag is limited.
  • the above-mentioned problem is not limited to the RFID tag but is common to a coil module including a coil and a module circuit connected to the coil.
  • An object of the present invention is to provide a coil module having a large effective coil opening for the entire size.
  • the coil module of the present invention includes: A circuit board on which a conductor pattern is formed; Electronic components mounted on the circuit board and constituting a module circuit with the conductor pattern; A resin layer that seals the electronic component on the circuit board and forms a laminate together with the circuit board; A conductor coil wound around the laminate and connected to the module circuit; It is characterized by providing.
  • the conductor coil is wound around the entire laminate of the circuit board and the resin layer that seals the electronic components mounted on the circuit board. Therefore, an effective coil for the entire size.
  • a coil module having a coil with a large opening is obtained.
  • the resin layer has a top surface parallel to the circuit board and a side surface perpendicular to the circuit board, and the conductor coil is in contact with the top surface and the side surface of the resin layer. It is preferable. Thereby, the external shape of the laminated body by a circuit board and a resin layer is simplified, and winding of a conductor coil becomes easy.
  • the top surface of the resin layer has substantially the same shape as the surface of the circuit board on which the electronic component is mounted. Therefore, the external shape of the laminated body by a circuit board and a resin layer is simplified, and winding of a conductor coil becomes easy.
  • the electronic component is mounted on the first surface of the circuit board, and the conductor pattern is a terminal electrode formed on the second surface of the circuit board. Preferably, both ends of the conductor coil are connected to the terminal electrode. This structure facilitates connection and winding of the conductor coil to the module circuit.
  • the coil module of the present invention includes: An electronic component having a terminal; A resin layer for sealing the electronic component with the terminal of the electronic component exposed; A conductor coil wound around the resin layer and connected to the terminal of the electronic component; It is characterized by providing.
  • the coil module having a coil having a large effective coil opening for the entire size. Is obtained.
  • the electronic component has a rectangular parallelepiped shape having a first main surface and a second main surface facing the first main surface, and the resin layer is the first main surface of the electronic component.
  • the conductor coil is in contact with the top surface, the bottom surface, and the two side surfaces of the resin layer.
  • the conductor coil is preferably a Cu wire having an insulating film.
  • the conductor coil can be wound in close proximity, or can be wound in an overlapping manner, whereby the self-inductance inductance can be increased and a predetermined inductance can be obtained with a small number of turns.
  • a coil antenna is configured by the conductor coil, and the electronic component includes an RFID IC connected to the coil antenna.
  • the electronic component includes an RFID IC connected to the coil antenna.
  • the conductor coil is wound around the entire laminate including the circuit board and the resin layer that seals the electronic component mounted on the circuit board. Therefore, it is effective for the entire size.
  • a coil module having a coil with a large coil opening can be obtained.
  • FIG. 1 is a four-side view of an RFID tag 101 as an example of a coil module according to the first embodiment.
  • FIG. 2 is a two-side view of a circuit board provided in the RFID tag 101.
  • FIG. 3 is a diagram showing a circuit of the RFID tag 101 and a circuit of the communication partner antenna.
  • FIG. 4 is a partial plan view of a state in which a conductor pattern is formed in each circuit formation region of the collective substrate 1M, the electronic component 13 is mounted, and the entire collective substrate 1M is covered with the resin layer 2.
  • FIG. 5A is a perspective view of an RFID tag 102 as an example of a coil module according to the second embodiment.
  • FIG. 5B is a plan view of the circuit board 1 included in the RFID tag 102.
  • FIG. 5C is a side view of the RFID tag 102.
  • FIG. 6 is a four-side view of an RFID tag 103 as an example of a coil module according to the third embodiment.
  • 7A, 7 ⁇ / b> B, and 7 ⁇ / b> C are diagrams illustrating a state during the manufacturing of the RFID tag 103.
  • FIG. 8 is a three-side view of an RFID tag 104 as an example of a coil module according to the fourth embodiment.
  • FIG. 9 is a diagram showing the structure of the RFID tag disclosed in Patent Document 1. In FIG.
  • the “coil module” shown in the following embodiments is used for near-field communication such as NFC (Near Field Communication) using magnetic field coupling with the communication partner antenna device.
  • NFC Near Field Communication
  • FIG. 1 is a four-side view of an RFID tag 101 as an example of a coil module according to the first embodiment.
  • FIG. 2 is a two-side view of a circuit board provided in the RFID tag 101.
  • the RFID tag 101 includes a circuit board 1 and a resin layer 2.
  • the circuit board 1 includes a base material 10, wiring conductors 11A and 11B and terminal electrodes 12A and 12B formed on the base material 10.
  • the wiring conductors 11A and 11B are electrically connected to the terminal electrodes 12A and 12B through through holes, respectively.
  • An electronic component 13 is connected (mounted) to the wiring conductors 11A and 11B.
  • the electronic component 13 is an RFID IC.
  • the circuit board 1 is, for example, a glass / epoxy board.
  • the joining of the electronic component 13 to the wiring conductors 11A and 11B of the circuit board 1 is, for example, solder joining or Au—Au joining.
  • a module circuit is configured by the conductor patterns such as the wiring conductors 11A and 11B, the terminal electrodes 12A and 12B, and the electronic component 13. As described above, the electronic component 13 is mounted on the first surface S1 of the circuit board 1, and the terminal electrodes 12A and 12B are formed on the second surface S2 of the circuit board 1.
  • the electronic component 13 mounted on the circuit board 1 is sealed with a resin layer 2 made of a thermosetting resin such as an epoxy resin.
  • a laminate 123 is constituted by the circuit board 1 and the resin layer 2.
  • the conductor coil 4 is wound around the multilayer body 123 in a direction in which the multilayer body 123 is bundled.
  • the resin layer 2 has a top surface TS parallel to the circuit board 1 and a side surface SS perpendicular to the circuit board 1, and the conductor coil 4 is in contact with the top surface TS and the side surface SS of the resin layer 2.
  • the conductor coil 4 is a Cu wire having a polyurethane film (Cu wire coated with polyurethane).
  • the conductor coil 4 is wound about 8 turns in this example.
  • the conductor coil 4 acts as a coil antenna.
  • Both ends of the conductor coil 4 are connected to the terminal electrodes 12A and 12B.
  • the terminal electrodes 12A and 12B are Cu electrode patterns, for example, and are Cu—Cu welded with Cu which is a core material of the conductor coil. Thereby, the conductor coil 4 is connected to the module circuit.
  • the magnetic flux ⁇ schematically represents the magnetic flux passing through the coil antenna by the conductor coil 4.
  • the coil opening of the conductor coil 4 there are electronic components and conductor patterns in the coil opening of the conductor coil 4, which partially shield the magnetic flux, but the coil opening has a height H, as shown in FIG.
  • the width W is larger than the cross section of the circuit board 1 or the resin layer 2 alone.
  • the conductor coil 4 can be wound in close proximity or wound in an overlapping manner, whereby the self-inductance inductance can be increased and a predetermined inductance can be obtained with a small number of turns.
  • the number of turns or the conductor interval of the conductor coil 4 can be easily adjusted and set without changing the circuit board 1, so that an RFID tag 101 having a coil antenna having a predetermined inductance can be obtained. It is done.
  • a magnetic core made of ferrite or the like since a magnetic core made of ferrite or the like is not provided, a magnetic loss does not occur, and a low loss characteristic can be obtained even in a high frequency band above the UHF band, for example.
  • FIG. 3 is a diagram showing a circuit of the RFID tag 101 and a circuit of the communication partner antenna.
  • the inductor L ⁇ b> 1 corresponds to the conductor coil 4.
  • the RFID circuit and the capacitors C1A, C1B, C2A, and C2B are circuits configured in the electronic component 13 mounted on the circuit board 1.
  • the capacitors C1A, C1B, C2A, C2B and the inductor L1 constitute an LC resonance circuit and an impedance matching circuit with the RFID-IC.
  • the resonance frequency band of this LC resonance circuit is a frequency band used for communication. For example, in the case of NFC, it is 13.56 MHz or a frequency in the vicinity thereof.
  • the inductor L2 is an element that represents the coil antenna on the communication partner side as a lumped constant circuit.
  • a reader / writer circuit is connected to the inductor L2.
  • the inductor L1 by the conductor coil 4 of the RFID tag 101 and the inductor L2 of the communication partner antenna are magnetically coupled.
  • FIG. 4 is a partial plan view of a state in which a conductor pattern is formed in each circuit formation region of the collective substrate 1M, the electronic component 13 is mounted, and the entire collective substrate 1M is covered with the resin layer 2.
  • the collective board 1M is in a state before being separated into the circuit boards 1 (pieces) shown in FIG.
  • the RFID tag 101 is manufactured by the following procedure.
  • the resin layer 2 is formed by applying a sealing resin such as an epoxy resin on the electronic component mounting surface of the collective substrate 1M. Moreover, an underfill is formed between the collective substrate 1M and the electronic component 13 (gap on the lower surface of the electronic component) by vacuum degassing.
  • a sealing resin such as an epoxy resin
  • the collective substrate 1M is cut with a dicer and divided into individual pieces. Thereby, the some laminated body 123 is obtained.
  • a broken line extending vertically and horizontally is a cutting line by a dicer.
  • the conductor coil 4 is formed by winding the insulation coating Cu wire around each laminated body 123 using a coil winding machine.
  • a coil winding machine a winding machine for manufacturing a chip-shaped winding inductor can be used.
  • the RFID tag 101 shown in FIG. 1 is dipped in a liquid resin, pulled up, and cured by heating to apply a resin coating around the RFID tag 101.
  • the RFID tag 101 is manufactured by the above procedure.
  • the completed RFID tag 101 is attached to an article such as a toy, for example.
  • the article is a resin molded product
  • the RFID tag 101 is integrated with the article so that the RFID tag 101 is embedded in the resin during injection molding of the resin.
  • Second Embodiment An example in which the configuration of the resin layer is different from that of the first embodiment is shown.
  • FIG. 5A is a perspective view of an RFID tag 102 as an example of a coil module according to the second embodiment.
  • FIG. 5B is a plan view of the circuit board 1 included in the RFID tag 102.
  • FIG. 5C is a side view of the RFID tag 102.
  • the RFID tag 102 includes a circuit board 1 and a resin layer 2.
  • the basic configuration of the circuit board 1 and the conductor coil 4 is the same as that of the RFID tag 101 shown in the first embodiment.
  • the laminate of the circuit board 1 and the resin layer 2 is a regular quadrangular prism.
  • the longitudinal dimension of this laminated body is three times or more the height dimension or the width dimension, and it can also be said to be a form like a shaft of a match rod. Therefore, a region where the conductor coil 4 is not wound (non-winding region) is long in the coil axis direction.
  • the external size of the RFID tag 102 is, for example, 4 mm ⁇ 1 mm ⁇ 1 mm.
  • the coil winding machine can easily chuck the laminate. Further, since the laminated body is in the shape of a regular quadrangular prism, vibration during winding of the conductor coil 4 is suppressed, and accordingly, high-speed winding is possible.
  • FIG. 6 is a four-side view of an RFID tag 103 as an example of a coil module according to the third embodiment.
  • 7A, 7 ⁇ / b> B, and 7 ⁇ / b> C are diagrams illustrating a state during the manufacturing of the RFID tag 103.
  • the RFID tag 103 includes a resin layer 2 and an electronic component 13 embedded in the resin layer 2.
  • a conductor coil 4 is wound around the resin layer 2 around the resin layer 2.
  • the terminals 14A, 14B, 14C, and 14D are exposed on the bottom surface of the resin layer 2, and the conductor coil 4 is connected to the terminals 14A and 14B.
  • the terminals 14C and 14D are dummy terminals generated in the manufacturing process described later.
  • the method for embedding the electronic component 13 in the resin layer 2 is as follows.
  • the electronic component 13 is mounted on the substrate 10 via the solder bumps SB.
  • the thickness dimension of the resin layer 2 may be made highly accurate by grinding the top surface TS of the resin layer 2.
  • Each process described above is processed in a collective substrate state, and is cut into pieces as shown in FIG. 7C by cutting with a dicer in the final process.
  • FIG. 8 is a three-side view of an RFID tag 104 as an example of a coil module according to the fourth embodiment.
  • the RFID tag 104 includes a circuit board 1 and a resin layer 2.
  • the circuit board 1 has a conductor pattern formed only on its upper surface.
  • the electronic component 13 and the columnar conductors 15A and 15B are mounted on the upper surface of the circuit board 1.
  • the electronic component 13 and the columnar conductors 15A and 15B are connected via the wiring conductors 11A and 11B.
  • the columnar conductors 15A and 15B are exposed on the upper surface of the resin layer 2.
  • the conductor coil 4 is connected to the exposed portions of the columnar conductors 15A and 15B.
  • columnar conductors 15A and 15B for example, conductor pins can be used.
  • a hole is formed in the resin layer 2 by laser processing, a method of plating a conductor film on the inner surface, or a method of injecting a conductive member into the hole, and using this hole as a columnar conductor You may make it act.
  • the conductor coil may be polyester, polyimide, polyamide, or the like. It may be a coil of a conductor wire covered with.
  • the magnetic loss is small, and therefore a part or all of the base material of the circuit board 1 may be a magnetic material. If it is a magnetic body, since the circuit board 1 acts as a magnetic body core, an effective coil opening becomes large.
  • the RFID tag is taken as an example in the embodiment described above, it can be similarly applied to a coil module having a coil having a large effective coil opening.
  • the present invention can be applied to a communication module including a coil antenna and a high-frequency circuit connected to the coil antenna.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une étiquette RFID (101), qui est un module de bobine, comprenant : un substrat de circuit (1) dans lequel un motif conducteur est formé ; un composant électronique (13) qui est monté sur le substrat de circuit (1) et qui constitue un circuit de module avec le motif conducteur ; une couche de résine (2) qui scelle le composant électronique (13) sur le substrat de circuit (1) et, conjointement avec le substrat de circuit (1), forme un stratifié ; et une bobine conductrice (4) qui s'enroule autour de la périphérie du stratifié (123) et qui est connectée au circuit de module. En raison d'une telle configuration, on obtient un module de bobine pour lequel le flux magnétique passant à travers l'ouverture de la bobine n'est pas facilement protégé, et l'ouverture effective de la bobine est relativement grande par rapport à la taille globale.
PCT/JP2017/020537 2016-07-01 2017-06-02 Module de bobine WO2018003398A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018524982A JP6648830B2 (ja) 2016-07-01 2017-06-02 コイルモジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-131899 2016-07-01
JP2016131899 2016-07-01

Publications (1)

Publication Number Publication Date
WO2018003398A1 true WO2018003398A1 (fr) 2018-01-04

Family

ID=60786040

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/020537 WO2018003398A1 (fr) 2016-07-01 2017-06-02 Module de bobine

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JP (1) JP6648830B2 (fr)
WO (1) WO2018003398A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6562193B1 (ja) * 2018-01-23 2019-08-21 株式会社村田製作所 Ｒｆｉｄタグ、ｒｆｉｄタグを備えた物品、および物品の製造方法
JP6590128B1 (ja) * 2018-04-17 2019-10-16 株式会社村田製作所 Ｒｆｉｄタグ
WO2019202817A1 (fr) * 2018-04-17 2019-10-24 株式会社村田製作所 Étiquette rfid

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001510914A (ja) * 1997-07-14 2001-08-07 アーエーゲー イデンティフィカツィオーンスジステーメ ゲゼルシャフト ミット ベシュレンクテル ハフツング トランスポンダ装置およびその製造方法
WO2009145218A1 (fr) * 2008-05-28 2009-12-03 株式会社村田製作所 Dispositif à circuit intégré sans fil et composant pour dispositif à circuit intégré sans fil

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001510914A (ja) * 1997-07-14 2001-08-07 アーエーゲー イデンティフィカツィオーンスジステーメ ゲゼルシャフト ミット ベシュレンクテル ハフツング トランスポンダ装置およびその製造方法
WO2009145218A1 (fr) * 2008-05-28 2009-12-03 株式会社村田製作所 Dispositif à circuit intégré sans fil et composant pour dispositif à circuit intégré sans fil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6562193B1 (ja) * 2018-01-23 2019-08-21 株式会社村田製作所 Ｒｆｉｄタグ、ｒｆｉｄタグを備えた物品、および物品の製造方法
JP6590128B1 (ja) * 2018-04-17 2019-10-16 株式会社村田製作所 Ｒｆｉｄタグ
WO2019202817A1 (fr) * 2018-04-17 2019-10-24 株式会社村田製作所 Étiquette rfid

Also Published As

Publication number Publication date
JP6648830B2 (ja) 2020-02-14
JPWO2018003398A1 (ja) 2019-05-16

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