WO2018000757A1 - 一种扬声器及扬声器模组 - Google Patents

一种扬声器及扬声器模组 Download PDF

Info

Publication number
WO2018000757A1
WO2018000757A1 PCT/CN2016/110299 CN2016110299W WO2018000757A1 WO 2018000757 A1 WO2018000757 A1 WO 2018000757A1 CN 2016110299 W CN2016110299 W CN 2016110299W WO 2018000757 A1 WO2018000757 A1 WO 2018000757A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
speaker
circuit board
pad portion
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/110299
Other languages
English (en)
French (fr)
Inventor
杨帆
苗青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US16/084,493 priority Critical patent/US10575077B2/en
Publication of WO2018000757A1 publication Critical patent/WO2018000757A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of sounding devices, and more particularly to a speaker; the present invention also relates to a speaker module.
  • a speaker is an important acoustic component in an electronic device that is a transducer that converts an electrical signal into an acoustic signal.
  • the speaker unit includes a mounting housing, and a magnetic circuit assembly and a vibration assembly disposed in the mounting housing.
  • the pads of the speaker units on the market are currently located in the Z-axis direction of the product.
  • a case a and a pad b provided on an upper end surface of the case a are provided; the pad b is generally provided with two, and the two pads b are distributed in the longitudinal direction or the width direction of the unit.
  • the FPCB board c connected to the speaker unit requires more installation space due to the pad position on the unit. This increases the space required for the module, and it does not provide enough space for the FPCB installation when the module size is small.
  • Today's products are moving in the direction of miniaturization, and the modules are getting smaller and smaller. Therefore, it is very urgent to replace the connection method of the pads.
  • a speaker includes a housing and two electrical connecting pieces mounted on the housing, each of the electrical connecting pieces including a second land portion exposing a side of the housing, a second pad portion is disposed in parallel with the sidewall of the housing;
  • a circuit board attached to a side of the housing is also included, the circuit board being electrically connected to the second pad portion.
  • the circuit board is an FPCB board
  • the FPCB board includes an elongated section that is approximately parallel on the upper and lower sides, and the third section is sequentially provided with two third pad parts, and the third pad section Do not electrically connect to the two second pad portions on the side of the housing.
  • the housing has a rectangular parallelepiped shape, and the two second pad portions are located on a long side or/and a short side of the housing.
  • the electrical connection piece is injection molded with the housing.
  • a groove is provided on a side of the housing corresponding to the positions of the two second pad portions, and the second pad portion is exposed by the bottom surface of the groove.
  • all or at least a portion of the second pad portion in the thickness direction is embedded in the housing, and an outer surface of the second pad portion is flush with a bottom surface of the recess or the first
  • the outer surface of the second land portion is raised above the bottom surface of the groove but not higher than the side surface of the housing.
  • an inner surface of the second pad portion is flush with a bottom surface of the recess, and an outer surface of the second pad portion is not higher than a side surface of the housing.
  • the electrical connection piece further includes:
  • a bent portion of the first land portion and the second land portion is connected, and the bent portion is molded into the casing.
  • the first pad portion and the second pad portion are on two planes that are approximately perpendicular.
  • a speaker module including a housing assembly and the above-described speaker mounted in the housing assembly.
  • the lead wire of the voice coil is connected by exposing the first land portion of the end surface of the casing
  • the circuit board is connected by exposing the second land portion of the side wall of the casing, thereby electrically connecting the voice coil to the circuit board.
  • the connecting structure of the present invention can fit the circuit board on the side wall of the housing, thereby increasing the space for operation and reducing the risk of operation.
  • the circuit board is attached to the side wall of the casing, which can also reduce the interference of the circuit board to the terminal antenna and reduce the vibration of the rear cavity in which the circuit board participates, which improves the performance of the speaker to some extent.
  • the circuit board is placed on the side wall of the casing, thereby simplifying the shape of the circuit board, enabling compact layout, thereby saving cost.
  • Figure 1 is a partial structural view of a speaker of the present invention.
  • Figure 2 is an exploded view of Figure 1.
  • FIG. 3 is a schematic view of the electrical connection piece of FIG. 1 combined with a housing.
  • Figure 4 is a cross-sectional view of Figure 1.
  • Figure 5 is a schematic view showing the structure of an electrical connecting sheet of the present invention.
  • Figure 6 is a schematic illustration of another embodiment of the electrical connection sheet of the present invention in combination with a housing.
  • Figure 7 is a cross-sectional view of Figure 6.
  • Fig. 8 is a partial structural schematic view of a speaker in the prior art.
  • the present invention provides a speaker including a housing 1 and an electrical connection piece 2 molded in the housing 1.
  • the electrical connection piece 2 may be provided with two, and the two electrical connection pieces 2 may be Distributed in the length direction or the width direction of the housing 1, specifically according to those skilled in the art The actual needs of the staff are selected.
  • Each of the electrical connection sheets 2 includes a first pad portion 21 exposing an end surface of the housing 1, a second pad portion 20 exposing a sidewall of the housing 1, and a first pad portion 21, The bent portion 22 of the second land portion 20.
  • the electrical connecting sheet 2 of the present invention may be integrally formed, for example, the first land portion 21, the second land portion 20, and the bent portion 22 may be formed on the electrical connecting sheet 2 by bending.
  • the electrical connection piece 2 is injection molded into the housing 1 in an insert manner.
  • the first pad portion 21, the edge of the second pad portion 20, and the bent portion 22 of the electrical connection piece 2 are molded.
  • the casing 1 the combination of the electrical connection piece 2 and the casing 1 is realized, and the first land portion 21 and the second land portion 20 are exposed from respective positions of the casing 1.
  • the first pad portion 21 and the second pad portion 20 are respectively on two planes that are approximately perpendicular.
  • the first pad portion 21 is exposed from the end surface of the housing 1 so that the voice coil lead on the side of the housing 1 can be connected to the first pad portion 21, thereby conducting the voice coil lead to the electrical connection piece 2
  • the second land portion 20 is exposed from the side surface of the casing 1, and the second land portion 20 is disposed in parallel with the side wall of the casing 1.
  • the circuit board 3 can be disposed on the side wall of the casing 1, the circuit board 3 is attached to the side of the casing 1, and the circuit board 3 and the second land portion 20 are electrically connected, and finally the electricity is passed.
  • the connecting piece 2 realizes the conduction of the voice coil lead and the circuit board 3.
  • the two second land portions 20 may be disposed on the long side or/and the short side of the casing 1.
  • the circuit board 3 is an FPCB board, and the FPCB board includes elongated strips that are approximately parallel on the upper and lower sides, and the third strip portion 30 is sequentially disposed on the strip section.
  • the third pad portions 30 are electrically connected to the two second pad portions 20 on the side surfaces of the housing 1, respectively.
  • the FPCB board of this shape enables compact layout at the time of production, thereby saving costs.
  • the second land portion 20 of the present invention may be flush with the side wall of the casing 1, see Figs. 6 and 7.
  • a groove 4 is provided, and the second pad portion 20 is exposed by the bottom surface of the groove 4. .
  • the manufacturing process can be simplified, so that the outer surface of the second pad portion 20 can be ensured not to be higher than the side of the casing 1.
  • the outer surface of the second pad portion 20 is flush with the bottom surface of the recess 4 or the outer surface of the second pad portion 20 is higher than the recess 4
  • the bottom surface is not higher than the side of the casing 1.
  • the inner surface of the second land portion 20 is flush with the bottom surface of the groove 4, and the outer surface of the second land portion 20 is not higher than the side surface of the casing 1.
  • the outer surface of the second pad portion 20 is lower than the side surface of the housing 1, and after the circuit board 3 is soldered on the second pad portion 20, the structure of the entire speaker can be ensured to be compact, so that the circuit board 3 The position welded to the second land portion 20 does not occupy excessive space.
  • the lead wire of the voice coil is connected by exposing the first land portion of the end surface of the casing
  • the circuit board is connected by exposing the second land portion of the side wall of the casing, thereby electrically connecting the voice coil to the circuit board.
  • the connecting structure of the present invention can fit the circuit board on the side wall of the housing, thereby increasing the space for operation and reducing the risk of operation.
  • the circuit board is attached to the side wall of the casing, which can also reduce the interference of the circuit board to the terminal antenna and reduce the vibration of the rear cavity involved in the circuit board, which improves the performance of the speaker unit to some extent.
  • the present invention also provides a speaker module including a housing assembly and the above-described speaker mounted in the housing assembly. By mounting the above-described speaker in the housing assembly, the size of the speaker module can be reduced.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明涉及一种扬声器及扬声器模组，包括壳体以及安装在壳体上的两个电连接片，所述每个电连接片包括露出壳体侧面的第二焊盘部，所述第二焊盘部与所述壳体侧壁平行设置；还包括贴合在所述壳体侧面的电路板，所述电路板与所述第二焊盘部电连接在一起。本发明的扬声器，可将电路板贴合在壳体的侧壁上，从而增大了操作的空间，降低了操作的风险。将电路板贴合在壳体的侧壁上，还可以减小电路板对终端天线的干扰，减少电路板参与的后腔振动，这在一定程度上提高了扬声器的性能。同时，将电路板设置在壳体的侧壁上，从而简化了电路板的形状，使得可以紧凑地排版，从而节省了成本。

Description

一种扬声器及扬声器模组 技术领域
本发明涉及发声装置领域，更具体地，本发明涉及一种扬声器；本发明还涉及一种扬声器模组。
背景技术
扬声器是电子设备中的重要声学部件，其为一种把电信号转变为声信号的换能器件。扬声器单体包括安装壳体，以及设置在安装壳体内的磁路组件以及振动组件等。
目前市场上扬声器单体的焊盘均位于产品的Z轴方向上。参考图8，其包括壳体a以及设置在壳体a上端面的焊盘b；焊盘b一般设置有两个，该两个焊盘b分布在单体的长度方向上或者宽度方向上。而和扬声器单体连接的FPCB板c会因为单体上焊盘位置而需要更多的安装空间。这就使得模组的需求空间增大，在模组尺寸较小时则无法为FPCB的安装提供足够的空间。现在的产品都向着体积小型化的方向发展，模组也变的越来越小。所以更换焊盘的连接方式就成为非常迫切。
发明内容
本发明的一个目的是提供了一种扬声器。
根据本发明的一个方面，提供了一种扬声器，包括壳体以及安装在壳体上的两个电连接片，所述每个电连接片包括露出壳体侧面的第二焊盘部，所述第二焊盘部与所述壳体侧壁平行设置；
还包括贴合在所述壳体侧面的电路板，所述电路板与所述第二焊盘部电连接在一起。
可选的是，所述电路板为FPCB板，所述FPCB板包括上下两边近似平行的长条段，所述长条段上依次设有两个第三焊盘部，所述第三焊盘部分 别与壳体侧面上的两个第二焊盘部电连接。
可选的是，所述壳体呈长方体型，所述两个第二焊盘部位于所述壳体的长边侧面或/和短边侧面上。
可选的是，所述电连接片与所述壳体注塑结合在一起。
可选的是，在所述壳体侧面上与两个第二焊盘部位置对应之处设有凹槽，所述第二焊盘部由所述凹槽底面上露出。
可选的是，所述第二焊盘部的厚度方向上的全部或者至少一部分嵌入所述壳体内，所述第二焊盘部的外表面与所述凹槽的底面齐平或者所述第二焊盘部的外表面高出所述凹槽的底面但不高于所述壳体的侧面。
可选的是，所述第二焊盘部的内表面与所述凹槽的底面齐平，且所述第二焊盘部的外表面不高于所述壳体的侧面。
可选的是，所述电连接片还包括：
露出壳体端面内侧的第一焊盘部，所述第一焊盘部与扬声器中的音圈的引线电连接在一起；
连接所述第一焊盘部、第二焊盘部的弯折部，所述弯折部注塑于所述壳体内。
可选的是，所述第一焊盘部、第二焊盘部处于近似垂直的两个平面上。
根据本发明的另一个方面，提供了一种扬声器模组，包括外壳组件以及安装于所述外壳组件中的上述的扬声器。
本发明的扬声器，通过露出壳体端面的第一焊盘部来连接音圈的引线，通过露出壳体侧壁的第二焊盘部来连接电路板，由此将音圈与电路板导通在一起；本发明的连接结构可将电路板贴合在壳体的侧壁上，从而增大了操作的空间，降低了操作的风险。将电路板贴合在壳体的侧壁上，还可以减小电路板对终端天线的干扰，减少电路板参与的后腔振动，这在一定程度上提高了扬声器的性能。同时，将电路板设置在壳体的侧壁上，从而简化了电路板的形状，使得可以紧凑地排版，从而节省了成本。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1是本发明扬声器的部分结构示意图。
图2是图1的爆炸图。
图3是图1中电连接片与壳体结合的示意图。
图4是图1的剖面图。
图5是本发明电连接片的结构示意图。
图6是本发明电连接片与壳体结合的另一种实施方式的示意图。
图7是图6的剖面图。
图8是现有技术中扬声器的部分结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1至图5，本发明提供了一种扬声器，包括壳体1以及注塑在壳体1内的电连接片2，电连接片2可以设置有两个，该两个电连接片2可分布在壳体1的长度方向上或者宽度方向上，具体可根据本领域技术人 员的实际需求进行选择。其中，所述每个电连接片2包括露出壳体1端面的第一焊盘部21，露出壳体1侧壁的第二焊盘部20，以及连接所述第一焊盘部21、第二焊盘部20的弯折部22。
本发明的电连接片2可以是一体成型的，例如可通过弯折的方式在电连接片2上形成第一焊盘部21、第二焊盘部20以及弯折部22。将电连接片2以嵌件的方式注塑在壳体1中，优选的是，使所述电连接片2中第一焊盘部21、第二焊盘部20的边缘以及弯折部22注塑在壳体1中，以实现电连接片2与壳体1的结合，并将第一焊盘部21、第二焊盘部20从壳体1的相应位置露出。优选的是，所述第一焊盘部21、第二焊盘部20分别处于近似垂直的两个平面上。
第一焊盘部21从壳体1的端面露出，以便可以将位于壳体1该侧的音圈引线连接在第一焊盘部21上，从而将音圈引线导通至电连接片2上；第二焊盘部20从壳体1的侧面露出，并且所述第二焊盘部20与所述壳体1的侧壁平行设置。采用这种结构方式使得可以在壳体1的侧壁设置电路板3，电路板3贴合在壳体1的侧面，并使电路板3与第二焊盘部20电连接起来，最终通过电连接片2实现了音圈引线与电路板3的导通。当壳体呈长方体型时，所述两个第二焊盘部20可设置在所述壳体1的长边侧面或/和短边侧面上。
在本发明一个优选的实施方式中，所述电路板3为FPCB板，所述FPCB板包括上下两边近似平行的长条段，所述长条段上依次设有两个第三焊盘部30，所述第三焊盘部30分别与壳体1侧面上的两个第二焊盘部20电连接。采用该形状的FPCB板，使得在制作的时候，可以紧凑地排版，从而节省了成本。
在注塑的时候，本发明的第二焊盘部20可以与壳体1的侧壁齐平，参考图6、图7。本发明优选的是，在所述壳体1侧面上与两个第二焊盘部20位置对应之处设有凹槽4，所述第二焊盘部20由所述凹槽4底面上露出。通过该凹槽4，从而可以简化制作工艺，从而可以保证第二焊盘部20的外表面可以不高出壳体1的侧面。
例如在注塑的时候，所述第二焊盘部20的厚度方向上的全部或者至 少一部分嵌入所述壳体1内，所述第二焊盘部20的外表面与所述凹槽4的底面齐平或者所述第二焊盘部20的外表面高出所述凹槽4的底面但不高于所述壳体1的侧面。
还可以是，所述第二焊盘部20的内表面与所述凹槽4的底面齐平，且所述第二焊盘部20的外表面不高于所述壳体1的侧面。
通过上述结构的设计，使得第二焊盘部20的外表面低于壳体1的侧面，在第二焊盘部20上焊接电路板3之后，可以保证整个扬声器的结构紧凑，使得电路板3与第二焊盘部20焊接的位置不会占用过多的空间。
本发明的扬声器，通过露出壳体端面的第一焊盘部来连接音圈的引线，通过露出壳体侧壁的第二焊盘部来连接电路板，由此将音圈与电路板导通在一起；本发明的连接结构可将电路板贴合在壳体的侧壁上，从而增大了操作的空间，降低了操作的风险。将电路板贴合在壳体的侧壁上，还可以减小电路板对终端天线的干扰，减少电路板参与的后腔振动，这在一定程度上提高了扬声器单体的性能。
本发明还提供了一种扬声器模组，其包括外壳组件以及安装于所述外壳组件中的上述的扬声器。通过将上述的扬声器安装在外壳组件内，可降低扬声器模组的尺寸。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器，其特征在于：包括壳体(1)以及安装在壳体(1)上的两个电连接片(2)，所述每个电连接片(2)包括露出壳体(1)侧面的第二焊盘部(20)，所述第二焊盘部(20)与所述壳体(1)侧壁平行设置；
    还包括贴合在所述壳体(1)侧面的电路板(3)，所述电路板(3)与所述第二焊盘部(20)电连接在一起。
  2. 根据权利要求1所述的扬声器，其特征在于：所述电路板(3)为FPCB板，所述FPCB板包括上下两边近似平行的长条段，所述长条段上依次设有两个第三焊盘部(30)，所述第三焊盘部(30)分别与壳体(1)侧面上的两个第二焊盘部(20)电连接。
  3. 根据权利要求1所述的扬声器，其特征在于：所述壳体(1)呈长方体型，所述两个第二焊盘部(20)位于所述壳体(1)的长边侧面或/和短边侧面上。
  4. 根据权利要求2所述的扬声器，其特征在于：所述电连接片(2)与所述壳体(1)注塑结合在一起。
  5. 根据权利要求4所述的扬声器，其特征在于：在所述壳体(1)侧面上与两个第二焊盘部(20)位置对应之处设有凹槽(4)，所述第二焊盘部(20)由所述凹槽(4)底面上露出。
  6. 根据权利要求5所述的扬声器，其特征在于：所述第二焊盘部(20)的厚度方向上的全部或者至少一部分嵌入所述壳体(1)内，所述第二焊盘部(20)的外表面与所述凹槽(4)的底面齐平或者所述第二焊盘部(20)的外表面高出所述凹槽(4)的底面但不高于所述壳体(1)的侧面。
  7. 根据权利要求5所述的扬声器，其特征在于：所述第二焊盘部(20)的内表面与所述凹槽(4)的底面齐平，且所述第二焊盘部(20)的外表面不高于所述壳体(1)的侧面。
  8. 根据权利要求4-7任一所述的扬声器，其特征在于：所述电连接片(2)还包括：
    露出壳体(1)端面内侧的第一焊盘部(21)，所述第一焊盘部(21)与扬声器中的音圈的引线电连接在一起；
    连接所述第一焊盘部(21)、第二焊盘部(20)的弯折部(22)，所述弯折部(22)注塑于所述壳体(1)内。
  9. 根据权利要求8所述的扬声器，其特征在于：所述第一焊盘部(21)、第二焊盘部(20)处于近似垂直的两个平面上。
  10. 一种扬声器模组，其特征在于：包括外壳组件以及安装于所述外壳组件中的如权利要求1至9任一项所述的扬声器。
PCT/CN2016/110299 2016-06-29 2016-12-16 一种扬声器及扬声器模组 Ceased WO2018000757A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/084,493 US10575077B2 (en) 2016-06-29 2016-12-16 Speaker and speaker module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610498618.4A CN105959887B (zh) 2016-06-29 2016-06-29 一种扬声器模组
CN201610498618.4 2016-06-29

Publications (1)

Publication Number Publication Date
WO2018000757A1 true WO2018000757A1 (zh) 2018-01-04

Family

ID=56901686

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/110299 Ceased WO2018000757A1 (zh) 2016-06-29 2016-12-16 一种扬声器及扬声器模组

Country Status (3)

Country Link
US (1) US10575077B2 (zh)
CN (1) CN105959887B (zh)
WO (1) WO2018000757A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020258212A1 (zh) * 2019-06-28 2020-12-30 瑞声声学科技(深圳)有限公司 一种扬声器箱
WO2021000112A1 (zh) * 2019-06-29 2021-01-07 瑞声声学科技(深圳)有限公司 一种扬声器箱

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105959887B (zh) 2016-06-29 2022-02-01 歌尔股份有限公司 一种扬声器模组
CN106255017B (zh) * 2016-09-27 2022-07-19 歌尔股份有限公司 扬声器模组
CN106622923A (zh) * 2017-01-04 2017-05-10 歌尔股份有限公司 一种振动模组以及振动模块
CN107222816B (zh) * 2017-06-27 2023-08-04 歌尔股份有限公司 发声装置模组
CN108810767B (zh) * 2018-08-03 2020-11-17 瑞声科技(新加坡)有限公司 扬声器及扬声器的制作方法
US11652688B2 (en) * 2020-11-25 2023-05-16 International Business Machines Corporation Predicting usage pattern of serverless environment via machine learning

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150063607A1 (en) * 2012-03-31 2015-03-05 Goertek Inc Micro loudspeaker and electronic device using same
CN204498303U (zh) * 2015-03-31 2015-07-22 歌尔声学股份有限公司 一种扬声器模组
CN205249477U (zh) * 2015-12-30 2016-05-18 歌尔声学股份有限公司 一种扬声器
CN105959887A (zh) * 2016-06-29 2016-09-21 歌尔股份有限公司 一种扬声器及扬声器模组
CN205912248U (zh) * 2016-06-29 2017-01-25 歌尔股份有限公司 一种扬声器及扬声器模组

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070169387A1 (en) * 2006-01-20 2007-07-26 Glass Brett R Multiple message audio gift card holder
CN202535530U (zh) * 2012-03-31 2012-11-14 歌尔声学股份有限公司 微型扬声器
KR101983792B1 (ko) * 2012-07-30 2019-05-29 삼성전자주식회사 휴대용 단말기의 스피커 모듈
CN202799133U (zh) * 2012-08-29 2013-03-13 歌尔声学股份有限公司 扬声器装置
US9769572B2 (en) * 2013-05-08 2017-09-19 Goertek Inc. Tablet woofer and electronic device using same
CN103337942A (zh) * 2013-07-19 2013-10-02 金龙机电股份有限公司 一种薄型扁平直线振动电机
CN103401394B (zh) * 2013-08-13 2015-09-02 金龙机电股份有限公司 一种改进的薄型扁平直线振动电机
KR20150060017A (ko) * 2013-11-25 2015-06-03 (주)아이넷테크 선택적 양방향성 진동자
CN203708472U (zh) * 2013-12-26 2014-07-09 歌尔声学股份有限公司 发声器件
CN104185126B (zh) * 2014-09-01 2018-07-06 歌尔股份有限公司 扬声器模组及其组装方法
CN204119512U (zh) * 2014-10-31 2015-01-21 歌尔声学股份有限公司 一种扬声器装置
CN204948347U (zh) * 2015-06-13 2016-01-06 歌尔声学股份有限公司 微型扬声器
CN205029865U (zh) * 2015-10-27 2016-02-10 歌尔声学股份有限公司 扬声器
CN205142511U (zh) * 2015-11-06 2016-04-06 深圳立讯电声科技有限公司 扬声器模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150063607A1 (en) * 2012-03-31 2015-03-05 Goertek Inc Micro loudspeaker and electronic device using same
CN204498303U (zh) * 2015-03-31 2015-07-22 歌尔声学股份有限公司 一种扬声器模组
CN205249477U (zh) * 2015-12-30 2016-05-18 歌尔声学股份有限公司 一种扬声器
CN105959887A (zh) * 2016-06-29 2016-09-21 歌尔股份有限公司 一种扬声器及扬声器模组
CN205912248U (zh) * 2016-06-29 2017-01-25 歌尔股份有限公司 一种扬声器及扬声器模组

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020258212A1 (zh) * 2019-06-28 2020-12-30 瑞声声学科技(深圳)有限公司 一种扬声器箱
WO2021000112A1 (zh) * 2019-06-29 2021-01-07 瑞声声学科技(深圳)有限公司 一种扬声器箱

Also Published As

Publication number Publication date
CN105959887B (zh) 2022-02-01
US10575077B2 (en) 2020-02-25
CN105959887A (zh) 2016-09-21
US20190082246A1 (en) 2019-03-14

Similar Documents

Publication Publication Date Title
WO2018000757A1 (zh) 一种扬声器及扬声器模组
CN108307277B (zh) 扬声器箱
WO2017128858A1 (zh) 一种音腔结构及终端
KR101748344B1 (ko) 스피커 모듈
US20160323003A1 (en) Speaker Casing with Integrally Formed Electrical Conductors
WO2014180140A1 (zh) 扬声器模组声孔处遮挡件及其装配方法、扬声器模组
CN101227766A (zh) 动圈式电声转换器
CN205596335U (zh) 扬声器模组
CN108988613B (zh) 电源转换器及其电连接器模块
CN205912248U (zh) 一种扬声器及扬声器模组
TW201414318A (zh) 具有揚聲器的電子裝置
US10074946B2 (en) Receptacle connector and electronic device
CN112468908B (zh) 扬声器箱及其装配方法
CN205232449U (zh) 扬声器单体
CN104396352A (zh) 具有集成印刷电路板的注模的线路载体
JP2012015874A (ja) ボイスコイルスピーカー
CN205029865U (zh) 扬声器
JP6703163B1 (ja) 金属ストリップを利用して成形された内部モジュール
CN202551329U (zh) 扬声器装置
CN208285537U (zh) 发声装置
US8467565B2 (en) Inductive electroacoustic transducer
WO2019041403A1 (zh) 发声装置及将连接弹片嵌设于发声装置中的方法
CN202077173U (zh) 扬声器连接器组件
CN204668455U (zh) 天线结构
WO2020220710A1 (zh) 扬声器模组

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16907144

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16907144

Country of ref document: EP

Kind code of ref document: A1