WO2018000586A1 - Procédé et dispositif de traitement au laser destiné à éliminer une couche mince ou un revêtement - Google Patents

Procédé et dispositif de traitement au laser destiné à éliminer une couche mince ou un revêtement Download PDF

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Publication number
WO2018000586A1
WO2018000586A1 PCT/CN2016/099046 CN2016099046W WO2018000586A1 WO 2018000586 A1 WO2018000586 A1 WO 2018000586A1 CN 2016099046 W CN2016099046 W CN 2016099046W WO 2018000586 A1 WO2018000586 A1 WO 2018000586A1
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WO
WIPO (PCT)
Prior art keywords
laser
coating
film
power
thickness
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PCT/CN2016/099046
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English (en)
Chinese (zh)
Inventor
陶沙
赵晓杰
秦国双
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深圳英诺激光科技有限公司
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Application filed by 深圳英诺激光科技有限公司 filed Critical 深圳英诺激光科技有限公司
Publication of WO2018000586A1 publication Critical patent/WO2018000586A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Definitions

  • the invention relates to the field of film removal technology, in particular to a laser processing method and device for removing a film or a coating by using a laser.
  • Process requirements for film or coating removal are often encountered during processing, such as by removing portions of the film or coating to create marks; by removing portions of the film or coating to achieve certain properties of the workpiece (eg, conductive, Insulation, light transmission, etc.; or coating a film or coating for protection during processing, the film or coating needs to be removed after some processes are completed. Since the film or coating is generally thin and has strong adhesion, it is difficult to achieve efficient and accurate removal by conventional mechanical means. The emergence of laser processing has solved this problem to a certain extent, but because the thickness of the film or coating is difficult to measure accurately, or the film itself is not uniform, it is difficult to ensure uniform thickness in every place, which leads to the film. Layers or coatings are difficult to remove efficiently and accurately.
  • a laser processing method for removing a film or coating according to the present invention comprises the following steps:
  • the laser is turned on and the first and second steps are repeated to scan the laser or the surface of the coating until the film or coating is removed.
  • the method further comprises: presetting a certain thickness value as a detection reference, using a uniform laser parameter, performing preliminary removal on the film or the coating, and detecting the feedback signal in real time until the film or the coating thickness The step of reaching the preset value and then adjusting the machining parameters according to the preset value for fine machining.
  • obtaining the thickness value in the first step comprises the following steps:
  • the power P of the laser before entering the film or coating and the power P' of the outgoing laser after being refracted from the film or coating are measured by a power detector;
  • the power ratio of the power of the outgoing laser to the incident laser is calculated:
  • R 1 is the incident surface reflectance of the incident laser
  • R 2 is the reflectance of the reflective surface of the film or coating
  • R 3 is the exit surface reflectance of the exiting laser
  • L is the transmission distance of the laser in the film or coating
  • ⁇ is the laser The absorption coefficient of the beam within the film or coating;
  • the thickness value t is calculated according to the L value obtained in the second step, Where ⁇ is the incident angle of the laser, n 1 is the refractive index of the air medium, and n 2 is the refractive index of the film or coating.
  • the obtaining the thickness value in the first step comprises the following steps:
  • a dual-wavelength laser is selected to obtain the power ratio r of the output laser light of the dual-wavelength laser beam and the incident laser, respectively, which are denoted as r 1 and r 2 ;
  • the reflectivity is similar, so In this way, the L value can be obtained, and then the thickness value t can be calculated, wherein ⁇ 1 and ⁇ 2 are the absorption coefficients of the dual-wavelength laser in the film or the coating, respectively;
  • the detecting beam used may be from a laser light source for processing, or may be a light source of any wavelength. That is, the probe beam is of any wavelength and may be the same as or different from the processed laser wavelength.
  • the processing laser needs to be selected according to the removed film or coating.
  • a laser processing apparatus for removing a film or a coating using the laser processing method for removing a film or a coating according to any of the above comprising: a laser, an industrial computer controlling the laser, and sequentially arranged along a laser emission direction a beam expander, a galvanometer and a lens system; wherein the industrial computer is further provided with a power detector for detecting the laser light from the film or the coating in real time, and the power value obtained by the industrial computer according to the power detector is Calculate the thickness of the film or coating and adjust the laser parameters in real time to allow the laser to quickly and accurately remove the film or coating.
  • the X-Y platform for placing the workpiece to be processed is further included, and the X-Y platform drives the workpiece to be moved to complete the removal of the surface film or coating of the workpiece to be processed.
  • the laser is further provided with a power detector for detecting the power of the laser to emit laser light in real time, and transmitting the power value to the industrial computer.
  • the industrial computer adjusts the laser parameters of the laser, including: the output laser power, the laser frequency, the galvanometer scanning speed, the platform moving speed, and the processing times.
  • the laser processing method and equipment for removing film or coating of the invention can measure the laser parameters according to the thickness by real-time measuring the thickness of the film or the coating, so as to achieve the optimal removal effect, fast and accurate.
  • Figure 1 is a block diagram showing the structure of a laser processing apparatus for removing a film or a coating of the present invention.
  • FIG. 2 is a flow chart of a laser processing method for removing a film or coating of the present invention.
  • FIG. 3 is a schematic view showing the principle of obtaining thickness values of a laser processing method for removing a film or a coating according to the present invention.
  • the laser processing method for removing a film or a coating comprises the following steps:
  • the thickness value of the film or the coating is obtained by measuring; that is, the thickness of the film or the coating at different positions is obtained in real time by means of measurement or the like;
  • the parameters of the laser are adjusted according to the thickness obtained in the first step;
  • the parameters for adjusting the laser in the step include laser output laser power, laser frequency, galvanometer scanning speed, platform moving speed, processing times, etc., according to Thickness
  • a third step S3 the laser is turned on, and the first step S1 and the second step S2 are repeated to scan the laser or the surface of the coating until the film or coating is removed. Since the thickness of the film or coating is inconsistent, the steps of detecting the thickness and adjusting the parameters need to be repeated throughout the removal process.
  • the method further includes: setting a certain thickness value as a detection reference in advance. Using a uniform laser parameter, the film or coating is initially removed and the feedback signal is detected in real time until the thickness of the film or coating reaches a preset value, and then the processing parameters are adjusted according to preset values for fine processing. That is, the high-power is used to quickly remove the entire film or coating on the surface of the sample until the preset value is reached, so as to avoid the problem of long removal time and low efficiency due to repeated detection adjustment.
  • one is to obtain the thickness of the film before or during the processing through the information of the negative feedback, and then set the processing parameters to complete the processing; secondly, preset a negative feedback value, The value corresponds to the thickness of the remaining film.
  • the high-speed processing is first performed, and the negative feedback signal is detected in real time.
  • the measured negative feedback signal value is consistent with the preset value, the final fine of the processing parameter is adjusted. machining.
  • the obtaining of the thickness value in the first step may be performed in the following two manners. Please refer to the schematic diagram of the laser removal principle in FIG.
  • Wavelength selection medium 2 in a known refractive index n 1 and a refractive index n of the film or coating 3 under conditions of 2.
  • the reflectance and absorptivity of the beam at a selected wavelength at each film or coating interface are known.
  • the type of the probe beam used for obtaining the thickness value in the first step may be from a laser light source for processing, or may be any wavelength light source, that is, other non-laser light sources.
  • the power P of the incident beam is transmitted through the transmission medium 2 to the interface of the medium 2 and the film layer or the coating layer 3, and the interface is the interface A, wherein the reflectance of the interface A is R 1 and the transmitted beam power is (1) R 1 )P.
  • the distance of the outgoing beam in the film or coating 3 is L until it reaches the interface B of the film layer or the bottom of the coating 3 with other media.
  • the reflectivity of the interface B is R 2 , and the intensity of the reflected beam is (1).
  • ⁇ is the absorption coefficient of the light beam in the film layer or coating 3.
  • the reflected beam is transmitted through the distance of L to the interface C of the film layer or the top of the coating 3 and the transmission medium 2, wherein the reflectance of the interface C is R 3 and the energy of the outgoing beam is (1-R 1 )R 2 (1- R 3 )P exp(-2 ⁇ L).
  • the power P of the incident beam and the power P' of the outgoing laser beam can be directly obtained by the power detector, so that the thickness t of the film or coating can be directly calculated.
  • the first method includes the following steps:
  • the power P of the incident beam before entering the film or coating and the power P' of the outgoing beam after being refracted from the film or coating are measured by a power detector;
  • the ratio of the power of the outgoing beam to the power of the incident beam is calculated: R 1 is the incident surface reflectivity of the incident beam, R 2 is the reflection surface reflectance of the film or coating, R 3 is the exit surface reflectance of the outgoing beam, and L is the transmission distance of the beam within the film or coating;
  • the thickness value t is calculated according to the L value obtained in the second step, Where ⁇ is the incident angle of the incident beam, n 1 is the refractive index of the air medium, and n 2 is the refractive index of the film or coating.
  • the second acquisition method selects a dual-wavelength laser for processing, and separately calculates a power ratio of two wavelengths, and the obtained thickness value includes the following steps:
  • the first step selection of two-wavelength light sources for obtaining the two-wavelength beam outgoing power to the incident power ratio r, denoted as r 1 and r 2; absorption coefficient of separate light beams of two wavelengths within the film or coating, respectively, Is ⁇ 1 and ⁇ 2 ; the second step, when the selected double wavelengths are close, the reflectance is similar, so In this way, the L value can be obtained, and then the thickness value t is calculated;
  • the embodiment further discloses a laser processing apparatus for removing a film or a coating using a laser processing method for removing a film or a coating as described above, comprising: a laser 2 for controlling the laser 2
  • the industrial computer 1 and the beam expanding device 3, the galvanometer and the lens system 4 are sequentially disposed along the laser emitting direction; wherein the industrial computer is further provided with a power for detecting the light beam emerging from the film or the coating in real time.
  • Detector 5 the industrial computer is based on the power value obtained by the power detector Calculate the thickness of the film or coating and adjust the laser parameters in real time to allow the laser to quickly and accurately remove the film or coating.
  • an X-Y platform 6 for placing the workpiece to be processed, and the X-Y platform 6 drives the workpiece to be moved to complete the removal of the surface film or coating of the workpiece to be processed.
  • the laser 2 is further provided with a power detector for detecting the power of the laser to emit laser light in real time, and transmitting the power value to the industrial computer.
  • the industrial computer 1 adjusts the laser parameters of the laser, including: the output laser power, the laser frequency, the galvanometer scanning speed, the platform moving speed, and the processing times.
  • the laser beam is set to have a fixed angle ⁇ with the workpiece to be processed, wherein the power of the incident beam can be measured by a real-time monitoring module in the laser; the output beam power can be monitored in real time by an external power detector.
  • the machining of the entire workpiece or required area can be realized by the movement of the X-Y platform 6 during the machining process.
  • the laser 2 exiting laser light is transmitted to the galvanometer and lens system 4 through the beam expanding device 3, and the angle ⁇ between the incident laser beam and the substitute workpiece is determined by changing the processing position, and the entire waiting is realized by the movement of the platform during the processing. Processing of workpieces.
  • a power detecting device is arranged inside the laser, and the laser output laser power can be displayed on the computer interface of the industrial computer in real time, and the beam power P incident on the workpiece to be processed can be calculated by the attenuation relationship, and the laser power detecting device is disposed on the laser platform. Real-time monitoring of the power P' of the outgoing beam through the film or coating, and can be displayed on the computer interface of the industrial computer.
  • the thickness value of the film or coating can be obtained by the above two methods.
  • the wavelengths of the two lasers ⁇ 1 ⁇ ⁇ 2 can be measured by measuring the power ratios r 1 and r 2 of the two lasers.
  • Calculate the laser transmission distance L, according to The thickness t of the film layer can be calculated. If the thickness of the film or coating is not uniform, the film thickness or coating thickness at different locations can be tested according to the position of the incident beam, and then the desired laser processing parameters can be selected according to the measurement results to be more uniform, clean and accurate. Remove the film or coating.
  • the relationship between laser processing parameters and film or coating thickness is established, and appropriate laser processing parameters are selected based on this relationship and the currently measured film or coating thickness.
  • the removal can be done at one time, and if it is thick, it can be removed multiple times.
  • the high-power laser can be used for initial rapid removal, and the feedback signal can be detected in real time until the thickness of the film or coating reaches a preset value, and then the processing parameters are adjusted according to preset values for fine processing. .

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un procédé de traitement au laser destiné à éliminer une couche mince ou un revêtement, comprenant les étapes suivantes : une première étape (S1) consistant à acquérir une valeur d'épaisseur d'une couche mince ou d'un revêtement par mesure; une deuxième étape (S2) consistant à régler, en fonction de la valeur d'épaisseur acquise lors de la première étape (S1), un paramètre d'un laser; et une troisième étape (S3) consistant à démarrer un dispositif laser (2) et à réaliser de façon répétée la première (S1) et la deuxième étape (S2), de sorte que le laser balaie la surface de la couche mince ou du revêtement, jusqu'à ce que la couche mince ou le revêtement soit éliminé. Une certaine valeur d'épaisseur ou une valeur de quantité physique associée est prédéfinie comme référence et un traitement préliminaire est effectué; et, lorsque l'épaisseur mesurée d'une couche mince ou d'un revêtement ou la quantité physique associée est conforme à une valeur prédéfinie, un paramètre de traitement est réglé pour réaliser un traitement fin, jusqu'à ce que la couche mince ou le revêtement soit éliminé. Par rapport aux antériorités, le procédé et le dispositif de traitement au laser selon l'invention permettent de mesurer en temps réel l'épaisseur d'une couche mince ou d'un revêtement et de régler en conséquence un paramètre laser, de sorte à obtenir un effet d'élimination optimal ainsi que de bonnes performances de rapidité et de précision.
PCT/CN2016/099046 2016-06-28 2016-09-14 Procédé et dispositif de traitement au laser destiné à éliminer une couche mince ou un revêtement WO2018000586A1 (fr)

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CN201610486956.6A CN106077956B (zh) 2016-06-28 2016-06-28 一种去除薄膜或涂层的激光加工方法及设备
CN201610486956.6 2016-06-28

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PCT/CN2017/084447 WO2018000974A1 (fr) 2016-06-28 2017-05-16 Procédé et dispositif de traitement au laser permettant d'éliminer un film mince ou un revêtement

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CN107378255B (zh) * 2017-07-14 2019-03-15 中国科学院微电子研究所 一种激光加工晶圆的方法及装置
CN108592804A (zh) * 2017-12-29 2018-09-28 宁国市裕华电器有限公司 一种基于激光反射的薄膜厚度检测系统
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CN114083112A (zh) * 2021-10-20 2022-02-25 泰德激光惠州有限公司 激光消融系统的控制方法、装置及计算机可读存储介质
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