WO2017211110A1

WO2017211110A1 - Radiometer and manufacturing method thereof

Info

Publication number: WO2017211110A1
Application number: PCT/CN2017/079047
Authority: WO
Inventors: 费跃; 王旭洪; 张颖
Original assignee: 上海新微技术研发中心有限公司
Priority date: 2016-06-07
Filing date: 2017-03-31
Publication date: 2017-12-14
Also published as: CN107478343A; CN107478343B

Abstract

A radiometer and manufacturing method thereof. The radiometer comprises: a radiometer unit (402) comprising: a substrate (100) having a first surface (100a) and a second surface (100b) configured opposite thereto; a first recess (101) located at an end of the first surface (100a) of the substrate (100); a suspending beam (300) comprising a beam arm (301) and an anchor (302), wherein the beam arm (301) suspends above the first recess (101), and the anchor (302) is located on the first surface (100a) of the substrate (100); an absorption layer located at a side wall surface of the beam arm (301); and a second recess (102) located at an end of the second surface (100b) of the substrate (100). The first recess (101) and the second recess (102) communicates with each other. The second recess (102) is located in an orthogonal projection of the beam arm (301). The radio meter is compact in size.

Description

Radiometer and its manufacturing method

Technical field

The present invention relates to the field of MEMS technology, and in particular, to a radiometer and a method of fabricating the same.

Background technique

The Crookes radiometer is a device for detecting light and heat radiation. A sealed glass bulb, including a part of the vacuum, is provided with an upright shaft with the upper and lower glass pits as bearings in the glass body, the upper part of the shaft. A blade made of a metal piece parallel to the main axis separated by 90°, is vertically connected to the main shaft by a thin steel wire, and the two sides of the metal piece are respectively white and black, when there is sufficient strong light or heat radiation to the blade. The blades begin to rotate about the vertical axis, and the stronger the radiation, the faster the speed.

According to the radiation theory, the black surface absorbs heat and light radiation, and the white surface reflects heat and light radiation. Since the blade heats the gas molecules near its surface, the gas temperature near the black surface is higher, so the molecular motion speed is larger. Since the reaction force of the gas molecules on the surface of the black blade is larger than that of the white surface, the blade is rotated, and the direction of rotation is black to the white side.

Traditional Crooks radiometers are bulky, have fewer application scenarios, and are susceptible to damage from external forces. Therefore, the volume of existing radiometers needs to be further reduced.

Summary of the invention

The technical problem to be solved by the present invention is to provide a radiometer and a method of manufacturing the same to manufacture a small-sized radiometer.

In order to solve the above problems, the present invention provides a radiometer comprising: a radiometer, comprising: a radiometer unit, the radiometer unit comprising: a substrate, the substrate having an opposite first a surface and a second surface; a first groove on a side of the first surface of the substrate; a cantilever beam comprising a cantilever beam and an anchor point suspended above the first groove, the anchor point being located on the substrate An absorbing layer on a side wall surface of the side of the cantilever; a second groove on a side of the second surface of the substrate, the first groove and the second groove penetrating, the second The groove is located within the longitudinal projection of the cantilever.

Optionally, the radiometer unit further includes two stoppers respectively located on two sides of the beam arm, the stopper portion being located on the first surface of the substrate and partially on the surface of the sacrificial layer.

Optionally, the cross-sectional pattern of the first groove parallel to the first surface of the substrate is semi-circular, square, rectangular or fan-shaped.

Optionally, the beam arm has a width of 0.5 μm to 10 μm.

Optionally, the absorbing layer has a thickness of 10 nm to 1 μm.

Optionally, the material of the absorbing layer comprises amorphous carbon, chromium or manganese.

Optionally, the second surface of the substrate is disposed above the image sensor, and the second groove is located above the photosensitive area of the image sensor.

Optionally, the method further includes: a beam splitter disposed above the first surface of the substrate for reflecting visible light.

Optionally, the beam splitter has an angle of 45° with the first surface of the substrate.

Optionally, a package housing is further included, and the substrate is located in the package housing, and the pressure in the package housing is 0.1 Pa to 100 Pa.

Optionally, a lens embedded in the top of the package housing is also included.

Optionally, a plurality of radiometer units are included, the plurality of radiometer units being distributed in an array.

The technical solution of the present invention also provides a method for manufacturing a radiometer, comprising: providing a lining a substrate having opposite first and second surfaces; etching the substrate from the first surface, forming a first recess in the substrate; forming a sacrifice in the first recess a layer, the surface of the sacrificial layer being flush with the first surface of the substrate; forming a cantilever beam, the cantilever beam comprising a cantilever beam and an anchor point, the beam arm being located on a surface of the sacrificial layer, the anchor point being located on the first surface of the substrate; Forming an absorption layer on a side wall of one side of the beam arm; etching the substrate from the second surface, forming a second groove in the substrate, the first groove and the second groove penetrating through The second groove is located directly below the beam arm and has a width less than or equal to the width of the beam arm; the sacrificial layer is removed to suspend the beam arm.

Optionally, the method for forming the cantilever beam comprises: forming a layer of a cantilever material on the first surface of the substrate and the surface of the sacrificial layer; and patterning the layer of the cantilever material to form the cantilever beam.

Optionally, while the cantilever material layer is patterned to form the cantilever beam, two stoppers are formed, the stopper portion is located on the first surface of the substrate, and is partially located on the surface of the sacrificial layer, and the two stoppers are respectively Located on either side of the beam arm.

In the radiometer of the present invention, the side wall surface of the suspended beam arm has an absorbing layer, and after absorbing the radiation, the beam arm can be bent to expose the second groove below the beam arm, thereby measuring the second groove through The magnitude of the light intensity can determine the amount of radiant energy absorbed by the radiometer, which is small in size and has a wider application scenario.

DRAWINGS

1 to 12 are schematic structural views showing a manufacturing process of a radiometer according to an embodiment of the present invention;

Figure 13 is a schematic view showing the beam arm of the radiometer after being bent according to an embodiment of the present invention;

14 is a schematic structural view of a radiometer according to an embodiment of the present invention;

Figure 15 is a cross section of a beam of a radiometer beam that is not bent according to an embodiment of the present invention. schematic diagram;

16 is a schematic cross-sectional view showing a beam of a beam of a radiometer according to an embodiment of the present invention;

Figure 17 is a schematic view showing the structure of a radiometer according to an embodiment of the present invention.

detailed description

The specific embodiments of the radiometer and the manufacturing method thereof provided by the present invention will be described in detail below with reference to the accompanying drawings.

A specific embodiment of the present invention provides a method of manufacturing a radiometer.

Referring to FIGS. 1 and 2, a substrate 100 is provided having a first surface 100a and a second surface 100b, the substrate 100 being etched from the first surface 100a, formed within the substrate 100 The first groove 101. 2 is a top plan view showing the first groove 101, and FIG. 1 is a schematic cross-sectional view taken along line AA' of FIG. 2. The subsequent drawings are based on FIG. 1 and FIG. 2 and will not be described again.

The material of the substrate 100 includes semiconductor materials such as silicon, germanium, silicon germanium, gallium arsenide, etc., and the semiconductor substrate 100 may also be a composite structure such as silicon on insulator or the like. Those skilled in the art can select the type of the substrate 100 according to the device formed on the substrate 100, and thus the type of the substrate 100 should not limit the scope of protection of the present invention. In this embodiment, the material of the substrate 100 is monocrystalline silicon.

The substrate 100 has opposite first and

second surfaces

100a, 100b, and the substrate 100 is etched from the first surface 100a to form the first recess 101. Specifically, the forming method of the first groove 101 includes: forming a patterned mask layer on the first surface 100a of the substrate 100, the patterned mask layer exposing a portion of the first surface 100a; The patterned mask layer is a mask, and the substrate 100 is etched by a dry etching process to form a first recess 101. The dry etching process may be a plasma etching process using CF ₄ and Cl ₂ as an etching gas.

As a specific embodiment of the present invention, the cross-sectional pattern of the first groove 101 parallel to the first surface 100a is semi-circular. In other embodiments of the present invention, the cross section of the first groove 101 parallel to the first surface 100a may also be square, rectangular or fan shaped.

Referring to FIGS. 3 and 4, a sacrificial layer 201 is formed in the first recess 101 (please refer to FIG. 1), and the surface of the sacrificial layer 201 is flush with the first surface 100a of the substrate 100. Fig. 3 is a schematic cross-sectional view taken along line BB' of Fig. 4.

The material of the sacrificial layer 201 may be a material different from the substrate 100 such as photoresist, silicon oxide, silicon nitride, silicon oxynitride or silicon oxycarbide. In a specific embodiment of the present invention, the material of the sacrificial layer 201 is silicon oxide, and after the silicon oxide layer filling the first recess 101 and covering the first surface 101a of the substrate may be performed by a chemical vapor deposition process. The silicon oxide layer is planarized to remove silicon oxide on the surface of the first surface 101a such that the silicon oxide layer located in the first recess 101 is flush with the surface of the first surface 101a. As another embodiment of the present invention, the material of the sacrificial layer 201 is a photoresist, and the sacrificial layer 201 may be formed by a spin coating process.

Referring to FIGS. 5 and 6, a cantilever beam 300 is formed. The cantilever beam 300 includes a beam arm 301 and an anchor point 302. The beam arm 301 is located on a surface of the sacrificial layer 201, and the anchor point 302 is located on the first surface 100a of the substrate 100. on. Figure 5 is a schematic cross-sectional view taken along line BB' of Figure 6.

The method for forming the cantilever beam 300 includes: forming a cantilever material layer covering the sacrificial layer 201 and the first surface 100a of the substrate 100; etching the cantilever material layer to pattern the cantilever material layer to form The cantilever beam 300.

As a specific embodiment of the present invention, the cantilever beam 300 is elongated, and the width of the beam arm 301 is consistent with the width of the anchor point 302. In other embodiments of the present invention, the width of the anchor point 302 may also be greater than the width of the beam arm 301 to increase the cantilever beam. 300 stability.

If the width of the beam arm 301 is too small, the beam arm 301 is prone to irreversible deformation during the measurement of the heat radiation; if the width of the beam arm 301 is too large, then in the process of measuring the heat radiation, The beam arm 301 is less prone to bending, resulting in a large measurement error. As a specific embodiment of the present invention, the width of the beam arm 301 is 0.5 μm to 10 μm, so that the beam arm 301 is not easy to undergo irreversible deformation, and can be bent in time.

The length of the beam arm 301 is slightly smaller than the radius of the cross section of the first groove 101 (please refer to FIG. 2 ), such that the beam arm 301 is completely located on the surface of the sacrificial layer 201, and after the sacrificial layer 201 is subsequently removed, the cantilever beam 201 It can be completely suspended above the first groove 101.

The material of the cantilever beam 300 is different from that of the substrate 100 and the sacrificial layer 201, and is a material having low thermal conductivity and high thermal insulation performance. As a specific embodiment of the present invention, the material of the cantilever beam 300 is polysilicon. In other embodiments of the present invention, the material of the cantilever beam 300 may also be a metal such as aluminum, nickel or iron.

As a specific embodiment of the present invention, while the cantilever material layer is patterned to form the cantilever beam 300, a stopper 303 is also formed, which is partially located on the first surface 100a of the substrate and partially on the surface of the sacrificial layer 201. As a specific embodiment, the number of the stoppers 303 is two, which are respectively located at two sides of the beam arm 301 for blocking the excessive bending of the beam arm 301. The material of the stopper 303 coincides with the cantilever of the beam arm 301. The bending direction of the beam arm 301 can be set in advance, and the distance between the stopper in the bending direction of the beam arm 301 and the beam arm 301 is large to provide sufficient space for the beam arm 301 to bend.

Referring to FIGS. 7 and 8, an absorbing layer 304 is formed on the side wall surface of one side of the beam arm 301. Fig. 7 is a schematic cross-sectional view taken along line BB' of Fig. 8.

The method of forming the absorbing layer 304 includes: forming an absorbing material layer covering the substrate 100, the sacrificial layer 201, and the cantilever beam 300; patterning the absorbing material layer to ensure The absorbing material layer on the side wall surface of the side of the beam arm 301 serves as the absorbing layer 304. Specifically, the absorbing material layer may be formed by a sputtering process. In the present embodiment, the absorbing layer 304 also covers one side wall of the anchor point 302. In other embodiments of the present invention, the absorbing layer 304 is formed only on one side wall of the beam arm 301.

The absorbing layer 304 has a high absorption capacity for light and heat radiation, and is generally a black substance, and specifically may contain amorphous carbon, chromium or manganese.

Specifically, the absorbing layer 304 is formed on the side wall opposite to the curved direction of the set beam arm 301, that is, the beam arm 301 will be bent from the side having the absorbing layer 304 to the other side. This is because during the measurement of the radiation, the side of the absorption layer 304 will absorb more heat, causing the thermal motion of the gas molecules near the absorption layer 304 to be intensified, striking the beam arm 301, causing the beam arm 301 to occur to the other side. bending.

The absorbing layer 304 needs to have sufficient thickness to absorb sufficient heat in a short time to bend the beam arm 301; at the same time, to avoid excessive stress of the absorbing layer 304, resulting in stress required for the cantilever beam 304 to bend. Larger, less easily measured for lower energy radiation. In a specific embodiment of the present invention, the thickness of the absorbing layer 304 is 10 nm to 1 μm.

Referring to FIG. 9 and FIG. 10, the substrate 100 is etched from the second surface 100b, and a second recess 102 is formed in the substrate 100, and the first recess 101 and the second recess 102 are penetrated. The second groove 102 is located within the longitudinal projection of the beam arm 301. 9 is a schematic cross-sectional view showing the second recess 102, and FIG. 10 is a top plan view of the second surface 100b after the second recess 102 is formed.

The second surface 100b is etched by a dry etching process to form a second recess 102, and the second recess 102 is penetrated from the first recess 101.

The second groove 102 is located directly below the beam arm 301 and has a width less than or equal to the width of the beam arm 301 such that the second groove 102 is located within the longitudinal projection of the beam arm 301. The beam arm 301 can completely block the second groove 102.

Referring to FIG. 11 and FIG. 12, the sacrificial layer 201 is removed, and the beam arm 301 is suspended.

The sacrificial layer 201 may be removed by a wet etching process, and the wet etching solution may be a hydrofluoric acid solution or a nitric acid solution.

While measuring the energy of the radiation source, a source of visible light can be placed on one side of the radiometer. When the beam arm 301 is irradiated by the radiation source, the absorbing layer 304 of the sidewall of the beam arm 301 receives the radiant energy, the temperature rises, and the beam arm 301 itself has poor thermal conductivity and a low temperature. The gas molecules around the absorbing layer 304 are heated and the movement is intensified, striking the absorbing layer 304, causing the beam arm 301 to bend toward the other side opposite to the absorbing layer 304, exposing the second groove 102, so that visible light can pass through the first For the two grooves 102, please refer to FIG. The greater the energy of the radiation source, the greater the bending of the beam arm 301, and the larger the area of the exposed second groove 102, so that the visible light intensity transmitted by the second groove 102 is greater, so that the transmitted light intensity can be measured. The size of the radiant energy is measured.

Referring to FIG. 14, the second surface 100b of the substrate 100 is disposed above the image sensor 400, and the second groove 102 is located above the photosensitive area of the image sensor 400.

The image sensor 400 may be a CMOS image sensor or a CCD image sensor.

The second groove 102 is located above the photosensitive area of the image sensor 400, and the visible light transmitted through the second groove 102 is irradiated onto the photosensitive area of the image sensor 400, and the optical signal is converted into an electrical signal by the image sensor 400, thereby The electrical signal size measures the amount of visible light intensity. The greater the radiant energy received by the radiometer, the greater the degree of bending of the beam arm 301, the greater the exposure of the second recess 102, such that the greater the intensity of light reaching the image sensor 400 through the second recess 102, The electrical signal output by the image sensor is larger.

Referring to FIG. 15, a beam splitter 500 is disposed over the first surface 100a of the substrate 100, It is used to reflect visible light and filter infrared light.

The beam splitter 500 can transmit infrared light and totally reflect the visible light, so that the incident light can be filtered, and only visible light enters the radiometer to prevent the infrared light from affecting the accuracy of the energy measurement of the radiation source.

As a specific embodiment of the present invention, the beam splitter 500 is at an angle of 45° with the first surface 100a of the substrate, so that the horizontally incident light can vertically illuminate the position of the beam arm 301.

When the radiometer does not receive the radiation, the beam arm 301 blocks the second groove 102, the incident light is blocked from entering the second groove 102; when the radiometer receives the radiation, the beam arm 301 is bent. The second groove 102 is exposed, and the incident light is transmitted through the second groove 102 to the image sensor 400 (refer to FIG. 15).

As a specific embodiment of the present invention, the method further includes performing vacuum packaging such that the substrate 100 and the image sensor 400 and the beam splitter 500 are located in a cavity of the package housing, and the package housing may be a transparent housing. The visible light is incident; or the package housing has a transparent window for transmitting visible light. The pressure in the cavity of the package housing is 0.1 Pa to 100 Pa. If the pressure is too low, the amount of gas molecules in the cavity is too small to impact the beam arm 301 by thermal motion, and the cantilever beam is bent; The pressure inside is large, the number of gas molecules in the cavity is large, and the beam arm 301 is subjected to more gas resistance and cannot be bent.

Referring to FIG. 16, as a specific embodiment of the present invention, a plurality of radiometer units 402 may be fabricated by the above method. The radiometer units 402 are distributed in an array, and the incident light is reflected by the beam splitter 501 to illuminate the visible light. The meter unit 402 can be used to measure the radiant energy of the radiation source 403 of a larger area. The radiant energy of the different positions of the radiation source 403 is different, and the radiant energy received by the radiometer unit 402 at the corresponding different positions is different, thereby transmitting The light intensity of the radiometer unit reaching the image sensor 401 is also not In the same way, the shape of the radiation source 403 and the distribution of the radiant energy can be determined by the electrical signal strength output by the image sensor 401. Further, the image sensor 401 can also image the radiation source 403 according to the received optical signal.

As a specific embodiment of the present invention, a lens may be disposed between the radiometer and the radiation source to concentrate the infrared light or the microwave emitted by the radiation source, so that the radiometer can receive the radiation energy emitted from each position of the radiation source. Specifically, the lens may be mounted on the top of the package housing.

A specific embodiment of the invention also provides a radiometer.

The radiometer comprises a radiometer unit, please refer to FIG. 10 to FIG. 12 for a schematic diagram of the radiometer unit.

The radiometer unit includes: a substrate 100 having opposing first and

second surfaces

100a and 100b; a first recess 101 on a side of the first surface 100a of the substrate 100; and a cantilever 300 The suspension beam 300 includes a beam arm 301 and an anchor point 302 suspended above the first groove 101, the anchor point 302 being located on the first surface 100a of the substrate 100; and a side wall of the cantilever beam 300 The surface of the absorption layer 304; the second groove 102 on the side of the second surface 100b of the substrate 100, the first groove 101 and the second groove 102 penetrate, the second groove 102 is located The beam arm 301 is directly below and has a width less than or equal to the width of the beam arm 301.

The cross-sectional pattern of the first groove 101 parallel to the first surface 100a is semi-circular. In other embodiments of the invention, the first groove 101 is parallel to the first surface 100a The cross section can also be square, rectangular or fan shaped.

As a specific embodiment of the present invention, the cantilever beam 300 is elongated, and the width of the beam arm 301 is consistent with the width of the anchor point 302. In other embodiments of the present invention, the width of the anchor point 302 may also be greater than the width of the beam arm 301 to improve the stability of the cantilever beam 300. If the width of the beam arm 301 is too small, the beam arm 301 is prone to irreversible deformation during the measurement of the heat radiation; if the width of the beam arm 301 is too large, then in the process of measuring the heat radiation, The beam arm 301 is less prone to bending, resulting in a large measurement error. As a specific embodiment of the present invention, the width of the beam arm 301 is 0.5 μm to 10 μm, so that the beam arm 301 is not easy to undergo irreversible deformation, and can be bent in time.

The length of the beam arm 301 is slightly smaller than the radius of the cross section of the first groove 101 such that the cantilever beam 201 can be completely suspended above the first groove 101.

The material of the cantilever beam 300 is a material having low thermal conductivity and high thermal insulation performance. As a specific embodiment of the present invention, the treatment of the cantilever beam 300 is polysilicon. In other embodiments of the present invention, the material of the cantilever beam 300 may also be a metal such as aluminum, nickel or iron.

The radiometer unit further includes a stop 303 that is partially located on the first surface 100a of the substrate 100 and partially suspended. As a specific embodiment, the number of the stoppers 303 is two, which are respectively located at two sides of the beam arm 301 for blocking the excessive bending of the beam arm 301. The material of the stopper 303 coincides with the cantilever of the beam arm 301. The bending direction of the beam arm 301 can be set in advance, and the distance between the stopper in the bending direction of the beam arm 301 and the beam arm 301 is large to provide sufficient space for the cantilever to bend.

Specifically, the absorbing layer 304 is located on a side wall of the beam arm 301 opposite to the bending direction, That is, the beam arm 301 will be bent from the side on which the absorption layer 304 is formed to the other side. This is because during the measurement of the radiation, the side of the absorption layer 304 will absorb more heat, causing the thermal motion of the gas molecules near the absorption layer 304 to be intensified, striking the beam arm 301, causing the beam arm 301 to occur to the other side. bending.

The second groove 102 penetrates the first groove 101, and the second groove 102 is located directly below the beam arm 301, and the width is less than or equal to the width of the beam arm 301, so that the beam arm 301 can be the second concave The slot 102 is completely obscured. Figure 10 is a top plan view of the second surface 100b.

When the beam arm 301 is irradiated by the radiation source, the absorption layer 304 of the sidewall of the beam arm 301 receives the radiation source energy, the temperature rises, and the beam arm 301 itself has poor thermal conductivity and low temperature. The gas molecules around the absorbing layer 304 are heated and the movement is intensified, striking the absorbing layer 304, causing the beam arm 301 to bend toward the other side opposite to the absorbing layer 304, exposing the second groove 102, so that visible light can pass through the first For the two grooves 102, please refer to FIG. The greater the light energy of the radiation source, the greater the degree of bending of the beam arm 301, and the larger the area of the exposed second groove 102.

Referring to FIG. 14 as a specific embodiment of the present invention, the second surface 100b of the substrate 100 is disposed above the image sensor 400, and the second groove 102 is located above the photosensitive area of the image sensor 400.

The image sensor 400 may be a CMOS image sensor or a CCD image sensor.

The second groove 102 is located above the photosensitive area of the image sensor 400, and the visible light transmitted through the second groove 102 is irradiated onto the photosensitive area of the image sensor 400, and the optical signal is converted into an electrical signal by the image sensor 400, thereby The electrical signal size measures the amount of visible light intensity. The greater the radiant energy received by the radiometer, the greater the degree of bending of the beam arm 301, the greater the exposure of the second recess 102, such that the greater the intensity of light reaching the image sensor 400 through the second recess 102, The electrical signal output by the image sensor 400 is larger.

Referring to FIG. 15, a beam splitter 500 disposed over the first surface 100a of the substrate 100 is further included for reflecting visible light.

The beam splitter 500 can transmit infrared light and totally reflect the visible light, so that the incident light can be filtered, and only visible light enters the radiometer to prevent the infrared light from affecting the measurement result.

As a specific embodiment of the present invention, the radiometer further includes a package housing, and the substrate 100 is located in the package housing, and the pressure in the package housing is 0.1 Pa to 100 Pa, so that there is sufficient inside the package housing. The gas molecules can impact the beam arm 301 by thermal motion to bend the beam arm 301; and avoid excessive amounts of gas molecules, so that the beam arm 301 is subjected to more gas resistance and cannot be bent.

Referring to FIG. 16, as a specific embodiment of the present invention, the radiometer further includes a plurality of radiating units 402, and the radiometer units 402 are arranged in an array, and the incident light is transmitted. After being reflected by the optical splitter 501, the visible light is irradiated to the radiometer unit 402, which can be used to measure the radiant energy of the radiation source 403 of a large area. The splitter 501 can also be a complete beam splitter. The radiation energy of different positions of the radiation source 403 is different, and the radiation energy received by the radiometer unit at the corresponding different positions is also different, so that the light intensity reaching the image sensor 401 through the radiometer unit is also different, so that the image sensor can pass through the image sensor. The electrical signal strength output by 401 determines the shape of the radiation source 403 and the distribution of the radiant energy. Further, the image sensor 401 can also image the radiation source 403 according to the received optical signal.

As a specific embodiment of the present invention, a lens is disposed between the radiometer and the radiation source 403 to converge the infrared light or microwave emitted by the radiation source 403, so that the radiometer can receive the position of the radiation source 403. Radiation energy. The lens can be mounted on top of the package housing.

The above description is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. These improvements and retouchings should also be considered. It is the scope of protection of the present invention.

Claims

A radiometer characterized by comprising: a radiometer unit, the radiometer unit comprising:

a substrate having opposing first and second surfaces;

a first groove on a side of the first surface of the substrate;

a suspension beam comprising a beam arm and an anchor point, the beam arm being suspended above the first groove, the anchor point being located on the first surface of the substrate;

An absorbing layer on a side wall of one side of the beam arm;

a second groove on a side of the second surface of the substrate, the first groove being continuous with the second groove, the second groove being located within a longitudinal projection of the beam arm.
The radiometer according to claim 1, wherein said radiometer unit further comprises two stoppers, said two stoppers being respectively located on both sides of the beam arm, said stopper portion being located on the substrate first The surface is partially on the surface of the sacrificial layer.
The radiometer according to claim 1, wherein the cross-sectional pattern of the first groove parallel to the first surface of the substrate is semicircular, square, rectangular or fan-shaped.
The radiometer according to claim 1, wherein the beam arm has a width of 0.5 μm to 10 μm.
The radiometer according to claim 1, wherein the absorbing layer has a thickness of 10 nm to 1 μm.
The radiometer according to claim 5, wherein the material of the absorbing layer comprises amorphous carbon, chromium or manganese.
The radiometer of claim 1 wherein said second surface of said substrate is disposed above said image sensor and said second recess is located above said photosensitive area of said image sensor.
The radiometer of claim 1 further comprising: a beam splitter disposed over the first surface of the substrate for reflecting visible light.
The radiometer according to claim 8, wherein said beam splitter has an angle of 45 with respect to the first surface of the substrate.
The radiometer of claim 1 further comprising a package housing, said substrate being located within the package housing, said pressure within said package housing being between 0.1 Pa and 100 Pa.
The radiometer of claim 1 further comprising a lens mounted on top of the package housing.
The radiometer of claim 1 including a plurality of radiometer units, said plurality of radiometer units being arranged in an array.
A method of manufacturing a radiometer, comprising:

Providing a substrate having opposing first and second surfaces;

Etching the substrate from a first surface, forming a first recess in the substrate;

Forming a sacrificial layer in the first recess, the surface of the sacrificial layer being flush with the first surface of the substrate;

Forming a cantilever beam, the cantilever beam comprising a beam arm and an anchor point, the beam arm being located on a surface of the sacrificial layer, the anchor point being located on the first surface of the substrate;

Forming an absorbing layer on a side wall of one side of the beam arm;

Etching the substrate from a second surface, forming a second recess in the substrate, the first recess being penetrated by a second recess, the second recess being located within a forward projection of the beam arm ;

The sacrificial layer is removed to suspend the beam arms.
The method of manufacturing a radiometer according to claim 13, wherein the method of forming the cantilever beam comprises: forming a layer of a cantilever material on the first surface of the substrate and the surface of the sacrificial layer; and patterning the layer of the cantilever material Forming the cantilever beam.
The method of manufacturing a radiometer according to claim 14, wherein the cantilever material layer is patterned to form a cantilever beam, and two stoppers are formed, the stopper portion being located on the first surface of the substrate, Partially located on the surface of the sacrificial layer, the two stops are respectively located on both sides of the beam arm.