WO2017202050A1 - 一种框架、壳体组件和终端 - Google Patents

一种框架、壳体组件和终端 Download PDF

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Publication number
WO2017202050A1
WO2017202050A1 PCT/CN2017/071932 CN2017071932W WO2017202050A1 WO 2017202050 A1 WO2017202050 A1 WO 2017202050A1 CN 2017071932 W CN2017071932 W CN 2017071932W WO 2017202050 A1 WO2017202050 A1 WO 2017202050A1
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WO
WIPO (PCT)
Prior art keywords
frame
terminal
components
shielding
back cover
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Application number
PCT/CN2017/071932
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English (en)
French (fr)
Inventor
贺景松
Original Assignee
深圳市金立通信设备有限公司
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Publication date
Application filed by 深圳市金立通信设备有限公司 filed Critical 深圳市金立通信设备有限公司
Publication of WO2017202050A1 publication Critical patent/WO2017202050A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06—Receivers
    • H04B1/10—Means associated with receiver for limiting or suppressing noise or interference

Definitions

  • the embodiments of the present invention relate to the field of electronic technologies, and in particular, to a frame, a housing assembly, and a terminal.
  • the components of the prior art smartphone are generally stacked on the support board, and the components also need to be provided with a plurality of shields, the thickness between the shield and the components, and the required between the shield and the adjacent panel of the terminal.
  • the gap makes the thickness of the terminal inevitably thicker, and the prior art generally uses ultra-thin components or thinned casings to reduce the thickness.
  • smartphones produced by the above methods are generally costly and have low reliability.
  • the embodiments of the present invention provide a frame, a housing assembly and a terminal, which can reduce the thickness of the entire terminal.
  • the embodiment of the present invention provides a frame, which is divided into a hollow first body and a hollowed second body, the first body is for accommodating a battery, and the second body is provided with at least one shield
  • the wall forms a plurality of sub-areas, and the plurality of sub-areas are used to separate the receiving components.
  • An embodiment of the present invention further provides a housing assembly including a partition plate and a frame, wherein the partition plate is made of a signal shielding material, and the partition plate is laminated and connected to the frame, and the partition plate abuts The portion on the second body and the sub-region form a plurality of first shields, and the first shield is configured to receive the components.
  • An embodiment of the present invention further provides a terminal, including a battery, a circuit board, and a housing assembly, the battery being received in the first body; and the circuit board is disposed on an opposite side of the partition The first component, the circuit board is disposed on the second body, and the plurality of the first components are respectively received in the first shielding cover.
  • the frame provided by the embodiment of the present invention is divided into a hollow first body and a second body, so that the inside of the first body and the second body can be used for accommodating components, reducing the thickness of components disposed on the frame, and At least one shielding wall is disposed in the interior of the second body to form a plurality of sub-regions, so that components that need to be shielded from each other can be shielded by the shielding wall, and the thickness of the terminal is increased without additionally shielding the electronic component.
  • the housing assembly and the terminal provided by the embodiment of the present invention form a first shielding cover by the cooperation of the frame and the spacer, without increasing the thickness of the terminal without additionally shielding the electronic component, thereby providing a capability A housing assembly and terminal that reduce the thickness of the terminal.
  • FIG. 1 is an exploded perspective view of a terminal provided by an embodiment of the present invention.
  • Figure 2 is an exploded perspective view showing another angle of the terminal shown in Figure 2;
  • FIG 3 is a schematic illustration of the housing assembly in the terminal shown in Figure 1;
  • FIG. 4 is a schematic illustration of a frame in the housing assembly shown in FIG.
  • the terminal 100 may be any device having communication and storage functions, such as a tablet computer, a mobile phone, an e-reader, a remote controller, and a personal computer (Personal Computer, PCs, laptops, in-vehicle devices, Internet TVs, wearable devices, and other smart devices with network capabilities.
  • a tablet computer such as a tablet computer, a mobile phone, an e-reader, a remote controller, and a personal computer (Personal Computer, PCs, laptops, in-vehicle devices, Internet TVs, wearable devices, and other smart devices with network capabilities.
  • a terminal 100 includes a battery 2 , a circuit board 3 , and a housing assembly 1 .
  • the housing assembly 1 includes a partition 12 and a frame 11 .
  • the frame 11 is divided into a hollow first body 112 and a hollow second body 113.
  • the battery 2 is received in the first body 112, and the interior of the second body 113 is provided with at least one shielding wall 113a to form a plurality of sub-frames.
  • the spacer 12 is made of a signal shielding material, and the spacer 12 is laminated and connected to the frame 11.
  • the portion of the spacer 12 abutting on the second body 113 is
  • the sub-area 113b is formed with a plurality of first shields 13.
  • a plurality of first components 31 are disposed on a side of the circuit board 3 opposite to the partitions 12, and the circuit board 3 is disposed on the second body 113. And a plurality of the first components 31 are respectively received in the first shielding cover 13 . .
  • the interiors of the first body 112 and the second body 113 can be used to accommodate components, reducing the thickness of the components disposed on the frame 11, and
  • the inside of the second body 113 is provided with at least one shielding wall 113a to form a plurality of sub-regions 113b, so that components that need to be shielded from each other can be shielded by the shielding wall 113a, and the partition 12 and the frame 11 are closely fitted to form the first shielding cover 13, There is no need to additionally shield the electronic component to increase the thickness of the terminal 100, thereby providing a housing assembly 1 and a terminal 100 capable of reducing the thickness of the terminal 100.
  • the frame 11 is used to support components in the terminal 100.
  • the frame 11 includes four frame arms 111 that are sequentially enclosed, that is, the frame 11 is rectangular, and the inner space of the terminal 100 is used to carry the components to the greatest extent.
  • the four frame arms 111 of the frame 11 are made of a material having a relatively high strength as the main beam of the frame 11 to reinforce the strength of the frame 11 and improve the reliability of the terminal 100.
  • the first body 112 and the second body 113 are disposed adjacent to each other along the height direction of the frame 11 , wherein the first body 112 is located below the second body 113 , which is more suitable for the reasonable layout of the components inside the terminal 100 .
  • the first body 112 and the second body 113 may also be disposed adjacent to each other along the width direction of the frame 11, or may be correspondingly disposed according to actual conditions.
  • the area of the first body 112 is larger than the area of the second body 113, and the size of the first body 112 is substantially the same as the size of the battery 2 carried thereon.
  • the interior of the second body 113 is partitioned into a plurality of sub-regions 113b by a plurality of shielding walls 113a. Specifically, the interior of the second body 113 has five sub-regions 113b, and the five sub-regions 113b are subjected to various components such as an audio box according to actual needs.
  • the RF antenna or the like passes through, and since the sub-regions 113b are separated by the shield wall 113a, the components in the adjacent two sub-regions 113b can interfere with each other.
  • the shielding wall 113a is made of a signal shielding material such as metal.
  • the frame 11 is hollowed out so that the components disposed thereon are not stacked on the surface, but the thickness of the stack can be reduced by the hollowed-out structure.
  • the actual number of sub-regions 113b is corresponding to the actual shielding required to correspond to the shielding wall 113a of the second body 113.
  • the spacer 12 has a rectangular plate shape, and the material of the spacer 12 is a signal shielding material.
  • the material of the spacer 12 is metal, which can achieve a better shielding effect.
  • the partition plate 12 is laminated and connected to the frame 11 such that the shield wall 113a in the second body 113 and the partition plate 12 form the first shield cover 13, that is, the shield wall 113a surrounding the sub-area 113b corresponds to the side of the first shield cover 13.
  • the frame, the portion of the partition 12 covering the sub-area 113b corresponds to the top of the first shield cover 13.
  • the frame 11 and the partition 12 cooperate to form the housing assembly 1.
  • the housing assembly 1 eliminates the need for additional components to provide the first shield cover 13, saving space and thereby reducing the thickness of the terminal 100.
  • the back cover 4 may also be stainless steel.
  • components can be disposed on both sides of the circuit board 3.
  • the components on the circuit board 3 disposed on one side of the spacer 12 are referred to as a first component 31, and the circuit board 3 is
  • the component provided on one side of the spacer 12 on the upper back is referred to as a second component 32.
  • the circuit board 3 is attached to the second body 113, and the first component 31 on the circuit board 3 can pass through the sub-area 113b.
  • the second component 32 faces away from the partition 12, and is hollowed out.
  • the sub-region 113b prevents the first component 31 from being stacked on the surface of the frame 11, and further reduces the terminal by passing through the sub-region 113b.
  • the thickness of 100 It can be understood that when the frame 11 is closely attached to the partition 12, the components passing through the sub-area 113b are located in the shield, and the signals between the components do not interfere with each other, thereby improving the reliability of the terminal 100.
  • the battery 2 since the battery 2 emits heat, the battery 2 is disposed on the side facing away from the partition 12. That is, the battery 2 is carried on the first body 112, and is closely abutted on other components of the terminal 100 (such as the battery 2 cover) through the first body 112 to fix the battery 2.
  • the terminal 100 On the circuit board 3, a plurality of components are mounted by SMT.
  • the terminal 100 further includes a back cover 4, the back cover 4 is made of a signal shielding material, and the frame 11 is sandwiched by the Between the partition plate 12 and the back cover 4, a plurality of shielding ribs are formed on the inner side surface of the back cover 4 to form a plurality of second shielding covers, and the circuit board 3 is disposed on an opposite side of the back cover 4. There are a plurality of second components 32, and the second component 32 is received in the second shield.
  • the second component 32 of the circuit board 3 facing the back cover 4 can also protrude into the back cover 4 and the circuit board 3 when the frame 11 and the circuit board 3 are closely matched. In the second shield, the thickness of the terminal 100 is further reduced.
  • the back cover 4 may be a cover body having a side frame, or may be a cover body without a side frame.
  • the material of the back cover 4 is a signal shielding material.
  • the back cover 4 is made of metal.
  • the metal texture of the terminal 100 is achieved.
  • the frame 11 is in close contact with the inner side of the back cover 4, and the back cover 4 is correspondingly provided with a plurality of second shields corresponding to the second component 32.
  • the back cover 4 may also be stainless steel.
  • a plurality of blocking walls 112a are respectively protruded from the two frame arms 111 of the first body 112.
  • the battery 2 is further limited to improve the reliability of the terminal 100.
  • the retaining wall 112a abuts against the inner side surface of the back cover 4.
  • the two barrier walls 112a are respectively protruded from the frame arms 111 on the left and right sides of the first body 112, and the strength of the frame arms 111 on the left and right sides of the first body 112 can be further enhanced, and the back cover 4 can be formed. Better space will The battery 2 is housed therein.
  • the two barrier walls 112a may be respectively protruded from the frame arms 111 on the upper and lower sides of the first body 112, or the number of the barrier walls 112a may be four, respectively, which are respectively disposed at the first The circumference of the body 112.
  • the frame arm 111 and/or the shielding wall 113a of the second body 113 defines a connection hole 113c.
  • connection hole 113c in the frame arm 111 and/or the shield wall 113a of the second body 113 By providing the connection hole 113c in the frame arm 111 and/or the shield wall 113a of the second body 113, the connection strength of the second body 113 to the components fixed thereto can be further ensured.
  • the circuit board 3 is disposed on the second body 113 by screws through the connecting hole 113c, so that the circuit board 3 can be preferably fixed on the frame 11.
  • the circuit board 3 is not easily displaced, thereby further improving the reliability of the terminal 100.
  • the circuit board 3 can also be snapped or bonded to the second body 113.
  • the terminal 100 further includes a panel assembly 5 stacked on the partition 12 .
  • the partition plate 12 and the panel assembly 5 are sequentially laminated and connected to the frame 11 and disposed opposite to the back cover 4.
  • the partition 12 is also capable of separating the heat on the panel assembly 5 from the frame 11 to ensure the reliability of the terminal 100.
  • the circuit board 3 provided with a plurality of components is first screwed to the second body 113, and the plurality of components are respectively passed through the sub-area 113b, and the battery 2 is carried on the first body 112. Then, the inner side of the back cover 4 is closely attached to the frame 11, so that the second component 32 is received in each of the second shields, and the battery 2 is fixed in the space formed by the barrier wall 112a and the back cover 4;
  • the board 12 and the panel assembly 5 are sequentially laminated and coupled to the frame 11 such that the first component 31 is housed in the first shield case 13 formed by the spacer 12 and the sub-area 113b.
  • the terminal 100 provided by the embodiment of the present invention divides the frame 11 into the hollow first body 112 and the second body 113, so that the inside of the first body 112 and the second body 113 can be used for accommodating components, and components are reduced.
  • the thickness is set on the frame 11, and the inside of the second body 113 is provided with at least one shielding wall 113a to form a plurality of sub-regions 113b, so that components that need to be shielded from each other can be shielded by the shielding wall 113a, and the spacer 12 is tightly close to the frame 11.
  • a terminal 100 capable of reducing the thickness of the terminal 100 is provided.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
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Abstract

本实用新型实施例提供了一种框架，用于终端中，框架分隔成镂空的第一本体和镂空的第二本体，第一本体用于容置电池，第二本体的内部设置至少一条屏蔽墙形成若干个子区域，若干个子区域用于分隔容置元器件。本实用新型实施例提供的框架分隔成镂空的第一本体和第二本体，使得第一本体和第二本体的内部可以用于容纳元器件，降低了元器件设置于框架上的厚度，并且第二本体的内部设置至少一条屏蔽墙形成若干个子区域，使得需要相互屏蔽的元器件能够通过屏蔽墙屏蔽开，无须在电子元器件上另外罩设屏蔽罩而增加终端的厚度。本实用新型实施例还提供了一种壳体组件和终端。

Description

一种框架、壳体组件和终端 技术领域
本实用新型实施例涉及电子技术领域，尤其涉及一种框架、壳体组件和终端。
背景技术
随着科技的发展，市场上智能手机的市场份额争夺得愈来愈激烈，厂家需要更多考虑用户的需求，而用户愈来愈追求轻薄化的智能手机。现有技术中一般通过选用超薄元器件或者减薄壳体等方式来实现。
现有技术中的智能手机的元器件一般堆叠于支撑板上，并且元器件还需要设置若干个屏蔽罩，屏蔽罩与元器件之间的厚度、屏蔽罩与终端相邻的面板之间所需的间隙使得终端厚度不可避免就会较厚，而现有技术一般是选用超薄元器件或者减薄壳体等方式来减轻厚度。但是通过上述方式生产出来的智能手机一般成本较高且可靠性较低。
实用新型内容
本实用新型实施例提供一种框架、壳体组件和终端，能够减少终端整体的厚度。
本实用新型实施例提供了一种框架，所述框架分隔成镂空的第一本体和镂空的第二本体，所述第一本体用于容置电池，所述第二本体的内部设置至少一条屏蔽墙形成若干个子区域，若干个所述子区域用于分隔容置元器件。
本发明实施例还提供了一种壳体组件，包括隔板和框架，所述隔板为信号屏蔽材料制成，所述隔板层叠连接于所述框架上，所述隔板之抵接于所述第二本体上的部分与所述子区域形成若干个第一屏蔽罩，所述第一屏蔽罩用于容置所述元器件。
本发明实施例还提供了一种终端，包括电池、电路板和壳体组件，所述电池容置于所述第一本体中；所述电路板与所述隔板相对的一面上设置有多个第一元器件，所述电路板设置于所述第二本体上，且多个所述第一元器件分别容置于所述第一屏蔽罩中。
终端本实用新型实施例提供的框架分隔成镂空的第一本体和第二本体，使得第一本体和第二本体的内部可以用于容纳元器件，降低了元器件设置于框架上的厚度，并且第二本体的内部设置至少一条屏蔽墙形成若干个子区域，使得需要相互屏蔽的元器件能够通过屏蔽墙屏蔽开，无须在电子元器件上另外罩设屏蔽罩而增加终端的厚度。
本实用新型实施例提供的壳体组件和终端通过框架与隔板的配合，形成第一屏蔽罩，而无须在电子元器件上另外罩设屏蔽罩而增加终端的厚度，从而提供了一种能够降低终端厚度的壳体组件和终端。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简要介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本实用新型实施例提供的终端的分解示意图；
图2是图2所示的终端的另一角度的分解示意图；
图3是图1所示的终端中的壳体组件的示意图；
图4是图3所示的壳体组件中的框架的示意图。
具体实施方式
下面将结合本实用新型实施方式中的附图，对本实用新型实施方式中的技术方案进行清楚、完整地描述。
本实用新型实施例涉及的终端100可以是任何具备通信和存储功能的设备，例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer， PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
本实用新型实施例的描述中，需要理解的是，术语“上”“下”“左”“右”“长度”“宽度”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本实用新型实施例和简化描述，而不是暗示或指示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本实用新型的限制。
请参考图1至图4，为本实用新型实施例提供的一种终端100，包括电池2、电路板3和壳体组件1，其中，壳体组件1包括隔板12和框架11，所述框架11分隔成镂空的第一本体112和镂空的第二本体113，所述电池2容置于所述第一本体112中，所述第二本体113的内部设置至少一条屏蔽墙113a形成若干个子区域113b，所述隔板12为信号屏蔽材料制成，所述隔板12层叠连接于所述框架11上，所述隔板12之抵接于所述第二本体113上的部分与所述子区域113b形成若干个第一屏蔽罩13，所述电路板3与所述隔板12相对的一面上设置有多个第一元器件31，所述电路板3设置于所述第二本体113上，且多个所述第一元器件31分别容置于所述第一屏蔽罩13中。。
通过将框架11分隔成镂空的第一本体112和第二本体113，使得第一本体112和第二本体113的内部可以用于容纳元器件，降低了元器件设置于框架11上的厚度，并且第二本体113的内部设置至少一条屏蔽墙113a形成若干个子区域113b，使得需要相互屏蔽的元器件能够通过屏蔽墙113a屏蔽开，并且隔板12与框架11紧密贴合形成第一屏蔽罩13，而无须在电子元器件上另外罩设屏蔽罩而增加终端100的厚度，从而提供了一种能够降低终端100厚度的壳体组件1和终端100。
在本实施例中，框架11用于支撑终端100中的元器件。可以理解的，框架11包括四条依次围接的框臂111，即框架11为矩形，最大的限度的利用终端100的内部空间来承载元器件。框架11的四条框臂111采用强度较大的材料制成，作为框架11的主梁，以加强框架11的强度，提高终端100的可靠性。 可以理解的，第一本体112和第二本体113沿着框架11的高度方向相邻设置，其中，第一本体112位于第二本体113的下方，更符合终端100内部元器件的合理布局。当然，在其它实施例中，第一本体112和第二本体113还可以沿着框架11的宽度方向相邻设置，或者根据实际所述而相应设置。
在本实施例中，第一本体112的面积大于第二本体113的面积，第一本体112的尺寸与承载于其上的电池2的尺寸大致相同。第二本体113的内部通过多条屏蔽墙113a隔成多个子区域113b，具体的，第二本体113的内部具有五个子区域113b，五个子区域113b根据实际所需被各种元器件如音频box、射频天线等穿过，由于各个子区域113b之间利用屏蔽墙113a隔开，因此相邻两个子区域113b中的元器件能够互不干扰。可以理解的是，屏蔽墙113a采用信号屏蔽材料制成，比如金属。该框架11通过镂空的结构，使得设置于上面的元器件不至于堆叠在表面，而是能够利用镂空的结构减少堆叠的厚度。当然，在其它实施例中，子区域113b的实际数量根据实际所需而对应在第二本体113的设置相应的屏蔽墙113a以实现。
在本实施例中，隔板12为矩形板状，隔板12的材质为信号屏蔽材料，优选的，隔板12的材质为金属，能够实现较佳的屏蔽作用。隔板12层叠连接于框架11上，使得第二本体113中的屏蔽墙113a与隔板12形成第一屏蔽罩13，即围成子区域113b的屏蔽墙113a相当于第一屏蔽罩13的侧框，隔板12遮盖于该子区域113b的部分相当于第一屏蔽罩13的罩顶。上述框架11与隔板12配合形成壳体组件1，壳体组件1使得元器件不用额外再设置第一屏蔽罩13，节省了空间，从而减少终端100的厚度。当然，在其它实施例中，背盖4还可以为不锈钢。
在本实施例中，电路板3上的双面皆可以设置元器件，可以理解的，将电路板3上相对隔板12的一面设置的元器件称为第一元器件31，将电路板3上背对隔板12的一面设置的元器件称为第二元器件32。其中，将电路板3贴设于第二本体113上，且电路板3上的第一元器件31能够对应穿过子区域113b，相应的，第二元器件32背对隔板12，镂空的子区域113b使得第一元器件31避免堆叠在框架11的表面上，通过穿过子区域113b的方式进一步减少终端 100的厚度。可以理解的，当框架11紧密贴设于隔板12上时，穿过子区域113b的元器件位于屏蔽罩中，各个元器件之间的信号不会相互干扰，提高终端100可靠性。
在本实施例中，由于电池2会发出热量，将电池2布设于背对隔板12的一面上。即将电池2承载于第一本体112上，且通过第一本体112紧密抵接于终端100的其它组件上(比如电池2盖)，以将电池2固定住。电路板3上通过SMT贴装多个元器件，为了更进一步的改进，所述终端100还包括背盖4，所述背盖4为信号屏蔽材料制成，所述框架11夹设于所述隔板12与所述背盖4之间，所述背盖4的内侧面突设多条屏蔽筋形成多个第二屏蔽罩，所述电路板3与所述背盖4相对的一面上设置有多个第二元器件32，所述第二元器件32容置于所述第二屏蔽罩中。
通过在背盖4上设置屏蔽条，使得电路板3上正对背盖4的第二元器件32亦能够在框架11与电路板3紧密配合时伸入背盖4与电路板3形成的第二屏蔽罩中，进一步减少终端100的厚度。
在本实施例中，背盖4可以为具有侧边框的盖体，也可以为无侧边框的盖体，背盖4的材质为信号屏蔽材料，优选的，背盖4的材质为金属，能够实现终端100的金属质感。框架11紧贴于背盖4的内侧面上，背盖4对应第二元器件32相应设置若干个第二屏蔽罩。当框架11与背盖4紧密配合，第二元器件32不用额外再设置屏蔽罩，可以直接伸入电路板3与背盖4形成的第二屏蔽罩中，节省了空间，从而减少终端100的厚度。当然，在其它实施例中，背盖4还可以为不锈钢。
为了更进一步的改进，所述第一本体112相对设置的两个框臂111上分别凸设一挡壁112a。
通过设置两个相对设置的挡壁112a，对电池2进行进一步的限位，提高终端100的可靠性。
在本实施例中，挡壁112a抵接于所述背盖4的内侧面。其中，两个挡壁112a分别凸设于第一本体112的左右两侧的框臂111上，既可以进一步加强第一本体112左右两侧框臂111的强度，又可以与背盖4形成一个空间更好的将 电池2容置于其中。当然，在其它实施例中，两个挡壁112a还可以分别凸设于第一本体112的上下两侧的框臂111上，或者挡壁112a的数量还可以为四个，分别设置于第一本体112的四周。
为了更进一步的改进，所述第二本体113的框臂111和/或屏蔽墙113a上开设连接孔113c。
通过在第二本体113的框臂111和/或屏蔽墙113a上开设连接孔113c，能够进一步保证第二本体113与固定于其上的元器件的连接强度。
在本实施例中，将电路板3通过螺丝穿过连接孔113c的方式设置于第二本体113上，使得电路板3能够较佳的固定于框架11上，终端100跌落或受到碰撞时，电路板3不容易移位，从而进一步提高终端100的可靠性。当然，在其它实施例中，电路板3还可以卡扣或者粘接于第二本体113上。
为了更进一步的改进，所述终端100还包括面板组件5，所述面板组件5层叠设置于所述隔板12上。
在本实施例中，隔板12和面板组件5依次层叠连接于框架11上，且与背盖4相背设置。隔板12还能够将面板组件5上的热量与框架11隔开，保证终端100的可靠性。
当终端100开始装配时，首先将设置有多个元器件的电路板3螺丝连接于第二本体113上，并且使多个元器件分别穿过子区域113b，将电池2承载于第一本体112上；接着将背盖4的内侧面紧贴框架11，使得第二元器件32容置于各个第二屏蔽罩中，电池2固定于挡壁112a与背盖4形成的空间中；接着将隔板12和面板组件5依次层叠连接于框架11上，使得第一元器件31容置于隔板12与子区域113b形成的第一屏蔽罩13中。
本实用新型实施例提供的终端100通过将框架11分隔成镂空的第一本体112和第二本体113，使得第一本体112和第二本体113的内部可以用于容纳元器件，降低了元器件设置于框架11上的厚度，并且第二本体113的内部设置至少一条屏蔽墙113a形成若干个子区域113b，使得需要相互屏蔽的元器件能够通过屏蔽墙113a屏蔽开，并且隔板12与框架11紧密贴合形成第一屏蔽罩13，而无须在电子元器件上另外罩设屏蔽罩而增加终端100的厚度，从而 提供了一种能够降低终端100厚度的终端100。
以上是本实用新型的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本实用新型原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本实用新型的保护范围。

Claims (9)

  1. 一种框架，其特征在于，所述框架分隔成镂空的第一本体和镂空的第二本体，所述第一本体用于容置电池，所述第二本体的内部设置至少一条屏蔽墙形成若干个子区域，若干个所述子区域用于分隔容置元器件。
  2. 根据权利要求1所述的框架，其特征在于，所述框架包括四条依次围接的框臂。
  3. 根据权利要求2所述的框架，其特征在于，所述第一本体和所述第二本体相邻设置。
  4. 根据权利要求2所述的框架，其特征在于，所述第一本体相对设置的两个框臂上分别凸设一挡壁。
  5. 根据权利要求1～4任意一项所述的框架，其特征在于，所述第二本体的框臂和/或屏蔽墙上开设连接孔。
  6. 一种壳体组件，其特征在于，包括隔板和如权利要求1～5任意一项所述的框架，所述隔板为信号屏蔽材料制成，所述隔板层叠连接于所述框架上，所述隔板之抵接于所述第二本体上的部分与所述子区域形成若干个第一屏蔽罩，所述第一屏蔽罩用于容置所述元器件。
  7. 根据权利要求6所述的壳体组件，其特征在于，所述隔板的材质为金属。
  8. 一种终端，其特征在于，包括电池、电路板和如权利要求6～7任意一项所述的壳体组件，所述电池容置于所述第一本体中；所述电路板与所述隔板相对的一面上设置有多个第一元器件，所述电路板设置于所述第二本体上，且多个所述第一元器件分别容置于所述第一屏蔽罩中。
  9. 根据权利要求8所述的终端，其特征在于，所述终端还包括背盖，所述背盖为信号屏蔽材料制成，所述框架夹设于所述隔板与所述背盖之间，所述背盖的内侧面突设多条屏蔽筋形成多个第二屏蔽罩，所述电路板与所述背盖相对的一面上设置有多个第二元器件，所述第二元器件容置于所述第二屏蔽罩中。
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