WO2017193684A1 - 一种高密度错层搭叠pcb板连接装置及其实现方法 - Google Patents

一种高密度错层搭叠pcb板连接装置及其实现方法 Download PDF

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Publication number
WO2017193684A1
WO2017193684A1 PCT/CN2017/075914 CN2017075914W WO2017193684A1 WO 2017193684 A1 WO2017193684 A1 WO 2017193684A1 CN 2017075914 W CN2017075914 W CN 2017075914W WO 2017193684 A1 WO2017193684 A1 WO 2017193684A1
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Prior art keywords
area
contact
bellow
pcb board
cornice
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PCT/CN2017/075914
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English (en)
French (fr)
Inventor
吴江红
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浪潮电子信息产业股份有限公司
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Publication of WO2017193684A1 publication Critical patent/WO2017193684A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/06—Connectors or connections adapted for particular applications for computer periphery

Definitions

  • the present invention relates to the field of server storage and switch hardware development, and more particularly to a high-density split-layer stack PCB board connecting device and an implementation method thereof.
  • Patent No. CN 1988 681 B discloses a double-sided card backplane with a front-to-back layer, which requires that the front-inserted board and the rear-inserted board are up and down in a vertical position. height.
  • the front board connector and the rear board connector on the backplane are identical connectors.
  • the front board connector and the rear board connector are arranged in the same order and direction on the front and back sides of the back panel. It is exactly the same, the single relative position is vertically up and down, and is inserted between each other.
  • this technical solution cannot meet the requirements of high-density signal transmission of PCB boards.
  • the technical task of the present invention is to provide a high-density split-layer stack PCB board connecting device and an implementation method thereof, to solve how to realize a PCB board without increasing the connector width and the connector height.
  • a high-density split-layer laminated PCB board connecting device comprising a line end connector and a board end connector, and the line end connector is connected with the board end connector.
  • a signal transmission channel of the PCB wherein the line end connector uses a PCB board, and the PCB board is provided with an area and H 2 Area, the thickness of the area is less than the thickness of the 11 2 area,
  • the front side contacts the gold finger on both sides of the area, and the rear end contacts the gold finger on both sides of the H 2 area;
  • the board end connector includes four rows of contact terminals, and the outer two rows of contact terminals form the front row contact bellow 2 port area, the inner side The two rows of contact terminals form the rear row contact bellow, the cornice area, the front row contact bellow 2 mouth area, the mouth width is larger than the rear row contact bellow, the mouth area of the cornice width;
  • the port area is snap-fitted so that the front end contacts the gold finger and the rear row contacts the bellow, the port area is connected to conduct, and the signal transmission between the PCB boards is realized, and the rear end contacts the gold finger and the front row contacts the bellow 2 port area. Fit, make the back end contact the gold finger and the front row contact bellow 2
  • the port area is connected and turned on to realize signal transmission between PCB boards.
  • the line end connector is used as a male end
  • the end connector is used as a female end
  • the line end connector is connected with the board end connector to realize conduction of the PCB layer which is overlapped by the layer, and the signal is transmitted.
  • the connecting finger is computer hardware such as: (between the memory module and the memory slot, the graphics card and the graphics card slot, etc.), all signals are transmitted by the golden finger.
  • the gold finger consists of a number of golden conductive contacts. Because the surface is gold-plated and the conductive contacts are arranged like fingers, it is called "golden finger”.
  • the PCB board has a convex shape.
  • an arc is disposed between the region and the ⁇ 2 ⁇ domain, and a smooth transition between the region and the ⁇ 2 region is realized by the arc to ensure convenient installation and connection.
  • a method for implementing a high-density split-layer stacking PCB board connecting device comprising the following steps: [0010] (1), the line end connector adopts a PCB board, and the PCB board is formed into a split layer structure. That is, there are two different thickness areas on the PCB, which are the area and the ⁇ 2 area, respectively! ⁇ The thickness of the area is smaller than the thickness of the area, the front side is contacted with the gold finger on both sides of the area, and the rear end is contacted with the gold finger on both sides of the ⁇ 2 area;
  • the board end connector comprises four rows of contact terminals, the outer two rows of contact terminals form a front row contact bell ow 2 port area, and the inner two rows of contact terminals form a rear row contact bellow,
  • the width of the cornice in the front row of the bellow 2 mouth area is greater than the width of the back row contact bellow!
  • the width of the cornice in the cornice area; the size of the cornice in the front row contacting the bellow 2 mouth area is the same as the total thickness of the gold finger in the front end of the H, the area is installed on the H; the front side is in contact with the bellow, the cornice area Mouth size and H 2 area
  • the total thickness of the field and the rear end contact gold fingers mounted on both sides of the H 2 area are the same;
  • a high-density split-layer PCB board connecting device and an implementation method thereof have the following advantages: [0014] 1.
  • the present invention utilizes a layer-by-layer stacking method on the same PCB board without increasing the connector width. Only a small increase in the thickness of a single PCB, but more signal transmission channels can be added; a PCB board can achieve twice the number of connection channels, which can increase the port density, save board space and reduce cable costs, in order to facilitate the motherboard Space saving and cable structure simplification and cost reduction can also achieve higher density transmission signals;
  • the invention improves the input and output density of the signal connection system, increases the cable structure, and reduces the cost of the cable assembly without increasing the layout space of the motherboard package;
  • the traditional way to improve the transmission density of the port and cable connection is to increase the number of pins in the horizontal direction, so that the connector must be widened to occupy more space on the motherboard, and the other is to increase the connector longitudinally.
  • the height is made into a 2-layer structure to increase the pin number of the transmitted signal, so that the interleaved line ends need to use two PCBs, and the advantages of the present invention are as follows: (1) Using a PCB board to make an error layer structure to meet higher density (2), a PCB board structure makes the cable end structure simple, reliability is enhanced, and the cost is reduced; (3), the board end connector does not need to increase the width, saving board space;
  • the invention has the characteristics of reasonable design, simple structure, easy processing, small volume, convenient use, multi-purpose, and the like, and thus has good popularization and use value.
  • 1 is a schematic structural view of a high-density split-layer stacked PCB board connecting device.
  • wire end connector 2, board end connector, 3, PCB board, 4, H, area, 5, H 2 area, 6, front touch gold fingers, 7, back contact gold Finger, 8, front row contact bellow 2 mouth area, 9, rear end contact bellow i mouth area, 10, contact terminal.
  • a high-density split-layer PCB board connector of the present invention comprises a line end connector 1 and a board end connector 2, and the line end connector 1 is connected to the board end.
  • the device 2 is connected to form a signal transmission channel of the PCB board 3; wherein, the line end connector 1 uses a PCB board 3, and the PCB board 3 has a convex shape.
  • the PCB board 3 is provided with H, the area 4 and the H 2 area 5, H, and the arc between the area 4 and the H 2 area 5 is provided, and a smooth transition between H, the area 4 and the H 2 area 5 is achieved by the arc.
  • the thickness of the H i region 4 is smaller than the thickness of the H 2 region 5, H, the front side of the region 4 is provided with a front end contact gold finger 6, and the H 2 region 5 is provided with a rear end contact gold finger 7 on both sides;
  • the board end connector 2 includes Four rows of contact terminals 10, the outer two rows of contact terminals 10 form a front row contact bellow 2 port area 8, and the inner two rows of contact terminals 10 form a rear row contact bellow,
  • the width of the cornice of the front row contact bellow 2 mouth region 8 is larger than the width of the cornice of the rear row contact bellow i mouth region 9; the front end contact gold finger 6 and the rear row contact bellow, the cornice region 9 is connected Cooperate, the front end contact gold finger 6 and the rear row contact bellow, the mouth area 9 is connected to conduct, realize the signal transmission between the PCB board 3, the back end contact gold finger 7 and the front row contact bellow 2 port area 8 card fit , the rear end contact gold finger 7 is connected with the front row contact bellow 2 port area 8 to realize signal transmission between the PCB boards 3.
  • a method for implementing a high-density split-layer stack PCB board connecting device of the present invention comprising the following steps:
  • the wire end connector 1 adopts a PCB board 3, and the PCB board 3 is formed into a split layer structure, that is, two different thickness regions are arranged on the PCB board 3, which are respectively the area ⁇ 2 area 5,
  • the thickness of the region 4 is less than the thickness of the region 11 of the region 2
  • the front end of the region 4 is mounted with the front end contacting the gold finger 6, and the two sides of the region 5 are mounted with the rear end contacting the gold finger 7;
  • the board end connector 2 includes four rows of contact terminals 10, the outer two rows of contact terminals 10 form a front row contact bellow 2 port area 8, and the inner two rows of contact terminals 10 form a rear row contact bellow 1 In the cornice area 9, the front row contacts the bellow 2 cornice area 8 and the mouth width is larger than the rear row contact bellow!
  • the width of the cornice of the cornice area 9; the size of the cornice of the front row contacting the bellow 2 cornice area 9 is the same as the total thickness of the gold finger 6 which is mounted on the front side of the H and the area 4; the rear row contacts the bellow , Jian Jian port size of port region 9 and a rear end in contact with the H 2 H installed in regions on both sides of the second region 5 5 7 Goldfinger same total thickness;
  • the cornice region 9 is in contact with the front end contact gold finger 6 to form a connection conduction PCB board 3 and transmits a signal; the back end contact gold finger 7 reaches the front row contact bellow 2 port area 8, and the front row contacts the bellow 2 port area 8 Contact with the rear end contact gold finger 7 forms a connection to the conductive PCB 3 and transmits a signal.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种高密度错层搭叠PCB板连接装置及其实现方法，属于服务器存储及交换机硬件研发领域。该高密度错层搭叠PCB板连接装置包括线端连接器（1）和板端连接器（2），线端连接器（1）采用一块PCB板（3），PCB板（3）上设置有H 1区域（4）和H 2区域（5），H 1区域（4）两侧设置有前端接触金手指（6），H 2区域（5）两侧设置有后端接触金手指（7）；板端连接器（2）包括四排接触端子（10），外侧的两排接触端子形成前排接触bellow 2开口区域（8），内侧的两排接触端子形成后排接触bellow 1开口区域（9）；前端接触金手指（6）与后排接触bellow 1开口区域（9）卡接配合，后端接触金手指（7）与前排接触bellow 2开口区域（8）卡接配合。该连接装置及其实现方法实现了在不增加连接器宽度和连接器高度的情况下PCB板的高密度信号传输。

Description

一种高密度错层搭叠 PCB板连接装置及其实现方法 技术领域
[0001] 本发明涉及服务器存储及交换机硬件研发领域， 具体地说是一种高密度错层搭 叠 PCB板连接装置及其实现方法。
背景技术
[0002] 现有高速线接口线端很多使用 PCB板的方式和板端连接器做接触互联， 而 PCB 板现在多为正反两面插入端有接触金手指 pin (引脚） ， 受限于 PCB金手指 pin间 距的影响， 如果要增加多口密度或希望有更多的传输通道， 又不希望增加额外 的连接器宽度， 现在一般采取做两块堆叠起来， 形成双层 PCB板， 要么增加连接 器宽度， 要么增加连接器高度， 利用两块 PCB板形成上下层结构来满足高密度的 信号传输， 例如 mini SAS HD系列产品， 但是这样结构比较复杂且成本较高。
[0003] 专利号 CN 1988681 B专利文献公幵了一种前后错层的双面插板背板， 该双面 插背板要求前插单板和后插单板在垂直位置上下错幵一定的高度。 背板上前插 板连接器和后插板连接器是完全相同的连接器， 前插板连接器和后插板连接器 在背板正面和背面的布置顺序和方向完全相同， 插针定义也完全相同， 单相对 位置垂直上下错幵， 相互间插。 但是该技术方案不能实现 PCB板高密度信号传输 的要求。
技术问题
[0004] 本发明的技术任务是提供一种高密度错层搭叠 PCB板连接装置及其实现方法， 来解决如何能够实现在不增加连接器宽度和连接器高度的情况下， 实现 PCB板的 高密度信号传输的问题。
问题的解决方案
技术解决方案
[0005] 本发明的技术任务是按以下方式实现的， 一种高密度错层搭叠 PCB板连接装置 ， 包括线端连接器和板端连接器， 线端连接器与板端连接器连接形成 PCB板的信 号传输通道； 其中， 线端连接器采用一块 PCB板， PCB板上设置有 区域和 H 2 区域， 区域的厚度小于11 2区域的厚度，
区域两侧设置有前端接触金手指， H 2区域两侧设置有后端接触金手指； 板端连 接器包括四排接触端子， 外侧的两排接触端子形成前排接触 bellow 2幵口区域， 内侧的两排接触端子形成后排接触 bellow ,幵口区域， 前排接触 bellow 2幵口区域 的幵口宽度大于后排接触 bellow ,幵口区域的幵口宽度； 前端接触金手指与后排 接触 bellow ,幵口区域卡接配合， 使前端接触金手指与后排接触 bellow ,幵口区域 连接导通， 实现 PCB板间的信号传输， 后端接触金手指与前排接触 bellow 2幵口 区域卡接配合， 使后端接触金手指与前排接触 bellow 2
幵口区域连接导通， 实现 PCB板间的信号传输。 其中， 线端连接器作为公头， 板 端连接器作为母头， 线端连接器与板端连接器连接实现错层搭叠的 PCB板的导通 ， 进行信号的传输。
[0006] 金手指 （connecting finger) 是电脑硬件如： （内存条上与内存插槽之间、 显卡 与显卡插槽等） ， 所有的信号都是通过金手指进行传送的。 金手指由众多金黄 色的导电触片组成， 因其表面镀金而且导电触片排列如手指状， 所以称为"金手 指，，。
[0007] 作为优选， 所述 PCB板呈凸字形。
[0008] 作为优选， 所述 区域与 Η 2β域之间设置有圆弧， 通过弧形实现 区域和 Η 2 区域之间的平滑过渡， 确保安装连接方便。
[0009] 一种高密度错层搭叠 PCB板连接装置的实现方法， 该实现方法包括如下步骤： [0010] ( 1) 、 线端连接器采用一块 PCB板， PCB板制作成错层结构， 即在 PCB板上设 置有两种厚度不同的区域， 分别为 区域和 Η 2区域， ！^区域的厚度小于 区 域的厚度， 区域两侧安装有前端接触金手指， Η 2区域两侧安装有后端接触金 手指；
[0011] (2) 、 板端连接器包括四排接触端子， 外侧的两排接触端子形成前排接触 bell ow 2幵口区域， 内侧的两排接触端子形成后排接触 bellow ,
幵口区域， 前排接触 bellow 2幵口区域的幵口宽度大于后排接触 bellow！幵口区域 的幵口宽度； 前排接触 bellow 2幵口区域的幵口大小与 H ,区域和安装在 H ,区域两 侧前端接触金手指的总厚度相同； 后排接触 bellow ,幵口区域的幵口大小与 H 2区 域和安装在 H 2区域两侧的后端接触金手指的总厚度相同；
[0012] (3) 、 当线端连接器插入板端连接器吋， 线端连接器的前端接触金手指经过 板端连接器前排接触 bellow 2幵口区域后， 到达后端接触 bellow ,幵口区域， 后端 接触 bellow ,幵口区域与前端接触金手指接触形成连接导通 PCB板并传输信号； 同吋后端接触金手指到达前排接触 bellow 2幵口区域， 前排接触 bellow 2幵口区域 与后端接触金手指接触形成连接导通 PCB板并传输信号。
发明的有益效果
有益效果
[0013] 本发明的一种高密度错层搭叠 PCB板连接装置及其实现方法具有以下优点： [0014] 1、 本发明在同一块 PCB板上利用错层叠加方式， 无需增加连接器宽度， 仅稍 许增加单块 PCB厚度， 而可以增加更多的信号传输通道； 一块 PCB板上可以实现 两倍的连接通道数量， 从而可以提高端口密度， 节约主板空间和减低线缆成本 ， 以利于主板空间的节省和线缆结构简化及成本的降低， 也可以实现更高的密 度传输信号；
[0015] 2、 本发明在不增加主板封装布局空间的情况， 提高信号连接系统输入输出的 密度， 简化线缆结构， 并有利于降低线缆组件的成本；
[0016] 3、 传统的提高端口及线缆连接的传输密度方式一种为横向增加连接器 pin数， 这样连接器必然变宽会占据主板更多的空间， 另一种或是纵向增加连接器高度 做成 2层结构以增加传输信号的 pin数， 这样互配的线端需要使用两块 PCB,而本发 明的优点： （1) 、 利用一块 PCB板做出错层的结构， 满足更高密度的信号传输 要求； （2) 、 一块 PCB板结构使线缆端结构简单， 可靠性增强， 成本降低； （3 ) 、 板端连接器无需增加宽度， 节约主板空间；
[0017] 本发明具有设计合理、 结构简单、 易于加工、 体积小、 使用方便、 一物多用等 特点， 因而， 具有很好的推广使用价值。
对附图的简要说明
附图说明
[0018] 下面结合附图对本发明进一步说明。
[0019] 附图 1为一种高密度错层搭叠 PCB板连接装置的结构示意图。 [0020] 图中： 1、 线端连接器， 2、 板端连接器， 3、 PCB板， 4、 H ,区域， 5、 H 2区域 ， 6、 前端接触金手指， 7、 后端接触金手指, 8、 前排接触 bellow 2幵口区域， 9、 后端接触 bellow i幵口区域， 10、 接触端子。
本发明的实施方式
[0021] 参照说明书附图和具体实施例对本发明的一种高密度错层搭叠 PCB板连接装置 及其实现方法作以下详细地说明。
[0022] 实施例 1 :
[0023] 如附图 1所示， 本发明的一种高密度错层搭叠 PCB板连接器,其结构包括线端连 接器 1和板端连接器 2， 线端连接器 1与板端连接器 2连接形成 PCB板 3的信号传输 通道； 其中， 线端连接器 1采用一块 PCB板 3， PCB板 3呈凸字形。 PCB板 3上设置 有 H ,区域 4和 H 2区域 5， H ,区域 4与 H 2区域 5之间设置有圆弧， 通过弧形实现 H , 区域 4和 H 2区域 5之间的平滑过渡， H i区域 4的厚度小于 H 2区域 5的厚度， H ,区 域 4两侧设置有前端接触金手指 6， H 2区域 5两侧设置有后端接触金手指 7; 板端 连接器 2包括四排接触端子 10， 外侧的两排接触端子 10形成前排接触 bellow 2幵口 区域 8， 内侧的两排接触端子 10形成后排接触 bellow ,
幵口区域 9， 前排接触 bellow 2幵口区域 8的幵口宽度大于后排接触 bellow i幵口区 域 9的幵口宽度； 前端接触金手指 6与后排接触 bellow ,幵口区域 9卡接配合， 使前 端接触金手指 6与后排接触 bellow ,幵口区域 9连接导通， 实现 PCB板 3间的信号传 输， 后端接触金手指 7与前排接触 bellow 2幵口区域 8卡接配合， 使后端接触金手 指 7与前排接触 bellow 2幵口区域 8连接导通， 实现 PCB板 3间的信号传输。
[0024] 实施例 2:
[0025] 本发明的一种高密度错层搭叠 PCB板连接装置的实现方法， 该实现方法包括如 下步骤：
[0026] (1) 、 线端连接器 1采用一块 PCB板 3， PCB板 3制作成错层结构， 即在 PCB板 3 上设置有两种厚度不同的区域， 分别为 区域 ΠΗ 2区域 5， 区域 4的厚度小 于11 2区域 5的厚度， 区域 4两侧安装有前端接触金手指 6， Η 2区域 5两侧安装有 后端接触金手指 7; [0027] (2) 、 板端连接器 2包括四排接触端子 10， 外侧的两排接触端子 10形成前排接 触 bellow 2幵口区域 8， 内侧的两排接触端子 10形成后排接触 bellow 1幵口区域 9， 前排接触 bellow 2幵口区域 8的幵口宽度大于后排接触 bellow！幵口区域 9的幵口宽 度； 前排接触 bellow 2幵口区域 9的幵口大小与 H ,区域 4和安装在 H ,区域 4两侧前 端接触金手指 6的总厚度相同； 后排接触 bellow ,幵口区域 9的幵口大小与 H 2 区域 5和安装在 H 2区域 5两侧的后端接触金手指 7的总厚度相同；
[0028] (3) 、 当线端连接器 1插入板端连接器 2吋， 线端连接器 1的前端接触金手指 6 经过板端连接器 2前排接触 bellow 2幵口区域 8后， 到达后端接触 bellow , 幵口区域 9， 后端接触 bellow ,
幵口区域 9与前端接触金手指 6接触形成连接导通 PCB板 3并传输信号； 同吋后端 接触金手指 7到达前排接触 bellow 2幵口区域 8， 前排接触 bellow 2幵口区域 8与后 端接触金手指 7接触形成连接导通 PCB板 3并传输信号。
[0029] 通过上面具体实施方式， 所述技术领域的技术人员可容易的实现本发明。 但是 应当理解， 本发明并不限于上述的两种具体实施方式。 在公幵的实施方式的基 础上， 所述技术领域的技术人员可任意组合不同的技术特征， 从而实现不同的 技术方案。
[0030] 除说明书所述的技术特征外， 均为本专业技术人员的已知技术。

Claims

权利要求书
[权利要求 1] 一种高密度错层搭叠 PCB板连接装置， 其特征在于： 包括线端连接器 和板端连接器， 线端连接器与板端连接器连接形成 PCB板的信号传输 通道； 其中， 线端连接器采用一块 PCB板， PCB板上设置有 区域和 H 2区域， H ,区域的厚度小于 H 2区域的厚度， H ,区域两侧设置 有前端接触金手指， H 2区域两侧设置有后端接触金手指； 板端连接 器包括四排接触端子， 外侧的两排接触端子形成前排接触 bellow 2幵 口区域， 内侧的两排接触端子形成后排接触 bellow ,幵口区域， 前排 接触 bellow 2幵口区域的幵口宽度大于后排接触 bellow！幵口区域的幵 口宽度； 前端接触金手指与后排接触 bellow ,幵口区域卡接配合， 后 端接触金手指与前排接触 bellow 2幵口区域卡接配合。
[权利要求 2] 根据权利要求 1所述的一种高密度错层搭叠 PCB板连接装置， 其特征 在于： 所述 PCB板呈凸字形。
[权利要求 3] 根据权利要求 1所述的一种高密度错层搭叠 PCB板连接装置， 其特征 在于： 所述 H ,区域与 H 2区域之间设置有圆弧。
[权利要求 4] 一种高密度错层搭叠 PCB板连接装置的实现方法， 其特征在于： 该实 现方法包括如下步骤：
(1) 、 线端连接器采用一块 PCB板， PCB板制作成错层结构， 即在 P CB板上设置有两种厚度不同的区域， 分别为 区域和 H 2区域， H , 区域的厚度小于11 2区域的厚度， H ,区域两侧安装有前端接触金手指
， H 2区域两侧安装有后端接触金手指；
(2) 、 板端连接器包括四排接触端子， 外侧的两排接触端子形成前 排接触 bellow 2幵口区域， 内侧的两排接触端子形成后排接触 bellow , 幵口区域， 前排接触 bellow 2幵口区域的幵口宽度大于后排接触 bellow 1幵口区域的幵口宽度； 前排接触 bellow 2幵口区域的幵口大小与 H ,区 域和安装在 H ,
区域两侧前端接触金手指的总厚度相同； 后排接触 bellow ,幵口区域 的幵口大小与 H 2区域和安装在 H 2区域两侧的后端接触金手指的总厚 度相同；
(3) 、 当线端连接器插入板端连接器吋， 线端连接器的前端接触金 手指经过板端连接器前排接触 bellow 2
幵口区域后， 到达后端接触 bellow i幵口区域， 后端接触 bellow！幵口 区域与前端接触金手指接触形成连接导通 PCB板并传输信号； 同吋后 端接触金手指到达前排接触 bellow 2幵口区域， 前排接触 bellow 2幵口 区域与后端接触金手指接触形成连接导通 PCB板并传输信号。
PCT/CN2017/075914 2016-05-09 2017-03-08 一种高密度错层搭叠pcb板连接装置及其实现方法 WO2017193684A1 (zh)

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