WO2017191779A1 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
WO2017191779A1
WO2017191779A1 PCT/JP2017/016282 JP2017016282W WO2017191779A1 WO 2017191779 A1 WO2017191779 A1 WO 2017191779A1 JP 2017016282 W JP2017016282 W JP 2017016282W WO 2017191779 A1 WO2017191779 A1 WO 2017191779A1
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WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
conductive film
conductive particles
repeating unit
film
Prior art date
Application number
PCT/JP2017/016282
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
恭志 阿久津
怜司 塚尾
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017085743A external-priority patent/JP7274810B2/ja
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020187021396A priority Critical patent/KR102228112B1/ko
Priority to US16/096,606 priority patent/US10854571B2/en
Priority to KR1020217007174A priority patent/KR20210031536A/ko
Priority to CN201780025129.XA priority patent/CN109417233B/zh
Publication of WO2017191779A1 publication Critical patent/WO2017191779A1/ja

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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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Definitions

  • the present invention relates to an anisotropic conductive film.
  • anisotropic conductive film in which conductive particles are dispersed in an insulating resin binder is widely used when an electronic component such as an IC chip is mounted on a wiring board or the like.
  • anisotropic conductive films by narrowing the pitch of bumps due to high-density mounting of electronic components, it is strongly required to improve the trapping property of conductive particles in the bumps and avoid short circuit between adjacent bumps. .
  • Patent Literature 1 In response to such a request, it has been proposed to arrange the conductive particles in the anisotropic conductive film in a grid-like arrangement and to incline the arrangement axis with respect to the longitudinal direction of the anisotropic conductive film (patent) Literature 1, Patent Literature 2).
  • the bump layout corresponds to the inclination angle of the arrangement axis and the distance between the conductive particles. Therefore, if the bumps have a narrow pitch, the distance between the conductive particles must be reduced, the number density of the conductive particles increases, and the manufacturing cost of the anisotropic conductive film increases.
  • an object of the present invention is to deal with a narrow pitch bump and to reduce the number density of conductive particles as compared with a conventional anisotropic conductive film.
  • the present inventor does not arrange the conductive particles in a plan view of the anisotropic conductive film, but repeatedly arranges the conductive particles vertically and horizontally by repeating polygonal units composed of a plurality of conductive particles.
  • the inventors have found that the above-mentioned problems can be solved by obliquely intersecting the sides of the rectangular shape with respect to the longitudinal direction or the short direction of the anisotropic conductive film, and have conceived the present invention.
  • the present invention is an anisotropic conductive film in which conductive particles are arranged in an insulating resin binder, In a plan view, polygonal repeating units formed by sequentially connecting the centers of a plurality of conductive particles are repeatedly arranged, Provided is an anisotropic conductive film in which the polygons of the repeating unit have sides oblique to the longitudinal direction or the short direction of the anisotropic conductive film.
  • the conductive particles are not arranged in a simple lattice pattern, but the repeating units formed by a plurality of conductive particles are repeatedly arranged.
  • the narrowed part exists uniformly throughout the film.
  • the polygon of the repeating unit has a side that is oblique to the longitudinal direction or the short direction of the anisotropic conductive film, the trapping property of the conductive particles in the bump is high. Therefore, it is possible to connect bumps having a narrow pitch without causing a short circuit.
  • the portion where the interparticle distance of the conductive particles is increased is uniformly present throughout the film, so that the number density of the conductive particles in the entire anisotropic conductive film is increased. It can suppress and the increase in the manufacturing cost accompanying the increase in the number density of electroconductive particle can be suppressed. Further, by suppressing an increase in the number density of the conductive particles, an increase in thrust required for the pressing jig at the time of anisotropic conductive connection can be suppressed. Therefore, the pressure applied to the electronic component from the pressing jig during the anisotropic conductive connection can be reduced, and deformation of the electronic component can be prevented.
  • FIG. 1A is a plan view illustrating the arrangement of conductive particles of the anisotropic conductive film 1A of the example.
  • FIG. 1B is a plan view illustrating the arrangement of the conductive particles of the anisotropic conductive film 1A of the example.
  • FIG. 1C is a cross-sectional view of the anisotropic conductive film 1A of the example.
  • FIG. 2A is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1Ba of the example.
  • FIG. 2B is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1Bb of the example.
  • FIG. 1A is a plan view illustrating the arrangement of conductive particles of the anisotropic conductive film 1A of the example.
  • FIG. 1B is a plan view illustrating the arrangement of the conductive particles of the anisotropic conductive film 1A of the example.
  • FIG. 1B is a plan view illustrating the arrangement of the
  • FIG. 3A is a plan view illustrating the arrangement of conductive particles of the anisotropic conductive film 1Ca of the example.
  • FIG. 3B is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1Cb of the example.
  • FIG. 4A is a plan view illustrating the arrangement of conductive particles of the anisotropic conductive film 1Da of the example.
  • FIG. 4B is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1Db of the example.
  • FIG. 5A is a plan view illustrating the arrangement of conductive particles of the anisotropic conductive film 1Ea of the example.
  • FIG. 5B is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1Eb of the example.
  • FIG. 6 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1F of the example.
  • FIG. 7 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1G of the example.
  • FIG. 8 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1H of the example.
  • FIG. 9 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1I of the example.
  • FIG. 10 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1J of the example.
  • FIG. 11 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1K of the example.
  • FIG. 12 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1L of the example.
  • FIG. 13 is a plan view for explaining the arrangement of the conductive particles of the anisotropic conductive film 1M of the example.
  • FIG. 14 is a cross-sectional view of the anisotropic conductive film 1a of the example.
  • FIG. 15 is a cross-sectional view of the anisotropic conductive film 1b of the example.
  • FIG. 16 is a cross-sectional view of the anisotropic conductive film 1c of the example.
  • FIG. 17 is a cross-sectional view of the anisotropic conductive film 1d of the example.
  • FIG. 18 is a cross-sectional view of the anisotropic conductive film 1e of the example.
  • FIG. 1A is a plan view showing the arrangement of conductive particles of an anisotropic conductive film 1A according to an embodiment of the present invention
  • FIG. 1C is a cross-sectional view thereof.
  • the anisotropic conductive film 1A has a structure in which the conductive particles 2 are arranged in a single layer on the surface of the insulating resin binder 3 or in the vicinity thereof, and the insulating adhesive layer 4 is laminated thereon.
  • the anisotropic conductive film of the present invention may have a configuration in which the insulating adhesive layer 4 is omitted and the conductive particles 2 are embedded in the insulating resin binder 3.
  • the electroconductive particle 2 what is used in the well-known anisotropic conductive film can be selected suitably, and can be used.
  • examples thereof include metal particles such as nickel, copper, silver, gold, and palladium, and metal-coated resin particles in which the surfaces of resin particles such as polyamide and polybenzoguanamine are coated with a metal such as nickel.
  • the size of the conductive particles to be arranged is preferably 1 ⁇ m or more and 30 ⁇ m or less, more preferably 1 ⁇ m or more and 10 ⁇ m or less, and further preferably 2 ⁇ m or more and 6 ⁇ m or less.
  • the average particle diameter of the conductive particles 2 can be measured by an image type or laser type particle size distribution meter. You may obtain
  • the surface of the conductive particles 2 is preferably covered with an insulating coat or an insulating particle treatment. Such a coating is easy to peel off from the surface of the conductive particles 2 and does not interfere with the anisotropic conductive connection. Further, protrusions may be provided on the entire surface or a part of the surface of the conductive particles 2. The height of the protrusion is preferably within 20% of the conductive particle diameter, and preferably within 10%.
  • FIG. 1A to FIG. 7 below will describe an example of the arrangement of repeating units when the polygonal repeating unit 5 is a trapezoid.
  • the arrangement of the conductive particles 2 in a plan view of the anisotropic conductive film 1A shown in FIG. 1A is such that the polygonal repeating unit 5 formed by sequentially connecting the centers of the plurality of conductive particles 2a, 2b, 2c, and 2d is orthogonal. This is repeated in two directions (X direction and Y direction), and is disposed on one surface of the anisotropic conductive film 1 (that is, entirely).
  • the anisotropic conductive film of this invention can have the area
  • the conductive particles are arranged on a part of the apex of the regular triangle when the regular triangles are arranged without gaps (or the apex of the regular hexagon when the regular hexagons are arranged without gaps).
  • the conductive particles at the predetermined lattice points are regularly removed from the arrangement in which the conductive particles exist at each lattice point of the hexagonal lattice. Therefore, the trapezoidal apex of the repeating unit 5 composed of the conductive particles 2a, 2b, 2c, and 2d is a part of a regular hexagon that is a combination of regular triangles, and exists at lattice points of a hexagonal lattice.
  • the sides 2c and 2d overlap with the sides 2g and 2h of the adjacent trapezoidal repeating unit (that is, the repeating unit including the conductive particles 2e, 2f, 2g, and 2h). .
  • a regular hexagonal repeating unit 5x composed of the conductive particles 2p, 2q, 2r, 2s, 2t, and 2u has one side in the X direction.
  • the repeat unit in the present invention is a polygon composed of four or more conductive particles, It is preferable to regard the polygon as the smallest unit that is repeated in the vertical and horizontal directions of the anisotropic conductive film without overlapping the sides of the square.
  • Each side of the trapezoid of the repeating unit 5 (FIG. 1A) is oblique to the longitudinal direction and the lateral direction of the anisotropic conductive film 1A.
  • the outer tangent L1 of the conductive particle 2a in the longitudinal direction of the anisotropic conductive film penetrates the conductive particle 2b adjacent to the conductive particle 2a in the longitudinal direction of the anisotropic conductive film.
  • the outer tangent L2 of the conductive particle 2a in the short direction of the anisotropic conductive film penetrates the conductive particle 2d adjacent to the conductive particle 2a in the short direction of the anisotropic conductive film.
  • the polygonal side of the repeating unit 5 is the longitudinal direction or the short direction of the anisotropic conductive film 1A.
  • the trapping property of the conductive particles 2 can be improved.
  • the repeating unit does not necessarily have all sides thereof obliquely crossed with the longitudinal direction or the short direction of the anisotropic conductive film, but the short direction of each bump is anisotropically conductive.
  • the longitudinal direction of a film it is preferable that each side of a repeating unit crosses the longitudinal direction or short direction of an anisotropic conductive film from the point of the capture
  • the polygon forming the repeating unit has a side in the longitudinal direction or the lateral direction of the anisotropic conductive film.
  • the bump arrangement pattern may be radial (for example, JP 2007-19550 A, JP 2015-232660 A, etc.). In this case, the angle formed by the longitudinal direction of each bump and the longitudinal direction and short direction of the anisotropic conductive film changes gradually.
  • the repeating unit 5 can be arranged with respect to the longitudinal edges of the individual bumps arranged radially.
  • the sides of the polygon are oblique. Therefore, it is possible to avoid a phenomenon in which most of the conductive particles applied to the edge of the bump at the time of anisotropic conductive connection are not captured by the bump and the capturing property of the conductive particle is lowered.
  • the polygon which makes the repeating unit 5 has the side of the longitudinal direction or a transversal direction of an anisotropic conductive film from the point which makes easy confirmation of the quality of a connection state by the impression after anisotropic conductive connection.
  • the polygon forming the repeating unit 5 has a side in the longitudinal direction or the short direction of the anisotropic conductive film, and a symmetrical shape having the short direction or the longitudinal direction of the anisotropic conductive film as the axis of symmetry.
  • the repeating unit 5 is repeatedly arrange
  • the trapezoid of the repeating unit 5 is a trapezoid having an axis of symmetry in the short direction of the anisotropic conductive film, and the bottom and upper sides thereof are the length of the anisotropic conductive film.
  • the base and top of a similar trapezoidal repeating unit may be parallel to the lateral direction of the anisotropic conductive film, as in the anisotropic conductive film 1Bb shown in FIG. 2B.
  • the arrangement of the conductive particles 2 in the repeating unit 5 and the vertical and horizontal repeating pitches of the repeating unit 5 can be changed as appropriate according to the shape and pitch of the terminals to be connected for anisotropic conductive connection. Therefore, as compared with the case where the conductive particles 2 are arranged in a simple lattice pattern, the entire anisotropic conductive film can achieve high trapping properties with a small number of conductive particles. For example, in order to increase the number density of the conductive particles in the longitudinal direction of the anisotropic conductive film with respect to the above-described anisotropic conductive film 1Ba, a trapezoidal repeating unit 5 like the anisotropic conductive film 1Ca shown in FIG. 3A.
  • the trapezoidal repeating unit 5 and the trapezoidal repeating unit were inverted with respect to the longitudinal axis of the film in the longitudinal direction of the anisotropic conductive film. It is good also as arrangement
  • the anisotropic conductive film 1Cb shown in FIG. In the longitudinal direction of the conductive conductive film, the trapezoidal repeating unit 5 is repeated in its shape, and in the width direction of the anisotropic conductive film, the repeating unit 5 and the repeating unit are arranged in the short direction of the anisotropic conductive film. It is good also as arrangement
  • different repeating units 5, 5B are used as in the anisotropic conductive film 1Ea shown in FIG. 5A.
  • the interval between the repeating rows in the longitudinal direction of the anisotropic conductive film may be widened, and the repeating unit 5 as shown in the anisotropic conductive film 1Eb shown in FIG. 5B in order to reduce the number density in the longitudinal direction of the anisotropic conductive film.
  • the interval between the repeating rows in the width direction of the anisotropic conductive film of 5B may be widened.
  • the repeat pitch in the Y direction of the repeat unit 5 may be increased with respect to the arrangement of the conductive particles of the anisotropic conductive film 1A shown in FIG. 1A.
  • each conductive particle 2 overlaps one of the vertices of the regular hexagon when the regular hexagons are arranged without gaps.
  • the arrangement of the conductive particles shown in FIG. It differs from the arrangement of the conductive particles shown in FIG. 1A in that not all the conductive particles are necessarily the apexes of a regular hexagon when regular hexagons are arranged without gaps.
  • the repetition pitch in the Y direction may be further expanded, and the single conductive particles 2p may be arranged between the repeating units 5 adjacent in the Y direction. These repeating units may be arranged.
  • the repeating pitch in the X direction of the repeating unit 5 may be appropriately changed, and a single conductive particle or a separate repeating unit may be arranged between the repeating pitches in the X direction.
  • the trapezoidal repeating unit 5 or the repeating unit 5B obtained by inverting it is repeated in the short or long direction of the anisotropic conductive film.
  • a row of single conductive particles 2p may be disposed between the row in the width direction of the anisotropic conductive film and the row in the width direction of the anisotropic conductive film of the repeating unit 5B.
  • the conductive particles 2 are arranged in an orthorhombic lattice, and the single conductive particle 2p is present at the center of the unit lattice.
  • the repeating unit 5 itself may be formed in a diamond shape as in the anisotropic conductive film 1I shown in FIG.
  • the conductive particles 2 are inclined with respect to the longitudinal direction and the short direction of the anisotropic conductive film and to them. Since it exists in the direction, it becomes easy to improve both the capturing property of the conductive particles and the suppression of the short circuit at the time of anisotropic conductive connection.
  • the particle arrangement is the same as that of the anisotropic conductive film 1J in FIG. Also good.
  • the repeating unit is not limited to the arrangement in which the conductive particles occupy a part of the apexes of the regular hexagon (that is, the lattice points of the hexagonal lattice) when the regular triangles are arranged without gaps.
  • the conductive particles may occupy a part of the lattice points of the square lattice.
  • FIG. 5A shows an arrangement in which a trapezoid similar to the arrangement of conductive particles shown in FIG. 5A and a repeating unit 5B in which the same trapezoid is inverted are alternately repeated in the longitudinal direction and the short direction of the anisotropic conductive film. 12 can be formed on lattice points of a tetragonal lattice like the anisotropic conductive film 1L shown in FIG.
  • the number of vertices forming the polygon of the repeating unit is not limited to four, but may be five or more, six or more, or seven or more. However, in order to make it easy to recognize the shape of the repeating unit in the design and production process of manufacturing the anisotropic conductive film, it is preferable that the number of vertices of the repeating unit is an even number.
  • the polygonal shape forming the repeating unit may be a regular polygon or may not be a regular polygon, but a shape having an axis of symmetry is preferable from the viewpoint of easily recognizing the shape of the repeating unit.
  • each conductive particle constituting the repeating unit may not be present at a lattice point of a hexagonal lattice or a tetragonal lattice.
  • the repeating unit 5 may be configured from conductive particles positioned at the apex of a regular octagon.
  • the polygonal shape of the repeating unit is the shape of the bump or terminal for anisotropic conductive connection, the pitch, the inclination angle of the bump or terminal in the longitudinal direction with respect to the film longitudinal direction of the anisotropic conductive film, and the insulation in the anisotropic conductive film. It can be appropriately determined according to the resin composition of the conductive resin binder.
  • the arrangement of the conductive particles in the present invention is not limited to the illustrated arrangement of repeating units, and for example, the illustrated arrangement of repeating units may be inclined.
  • an aspect in which the film is inclined by 90 °, that is, a mode in which the longitudinal direction and the short direction of the film are interchanged is also included.
  • interval of the electrically-conductive particle in a repeating unit may be used.
  • the shortest interparticle distance of the conductive particles is preferably 0.5 times or more the average particle diameter of the conductive particles both between the adjacent conductive particles in the repeating unit and between the adjacent conductive particles between the repeating units. If this distance is too short, a short circuit is likely to occur due to contact between the conductive particles.
  • the upper limit of the distance between adjacent conductive particles is determined according to the bump shape and bump pitch. For example, when the bump width is 200 ⁇ m and the space between the bumps is 200 ⁇ m, when at least one conductive particle is present in either the bump width or the space between the bumps, the shortest distance between the conductive particles is less than 400 ⁇ m. From the viewpoint of ensuring the trapping property of the conductive particles, the thickness is preferably less than 200 ⁇ m.
  • the number density of the conductive particles is a conductive material because it suppresses the manufacturing cost of the anisotropic conductive film and prevents the thrust required for the pressing jig used for anisotropic conductive connection from becoming excessively large.
  • the average particle diameter of the particles is less than 10 ⁇ m, 50000 / mm 2 or less is preferable, 35000 / mm 2 or less is more preferable, and 30000 / mm 2 or less is more preferable.
  • the number density of the conductive particles is preferably 300 / mm 2 or more, more preferably 500 / mm 2 or more, since there is a concern about poor conduction due to insufficient capture of the conductive particles at the terminal if the number density is too small. 800 / mm 2 or more is more preferable.
  • the average particle size of conductive particles is not less than 10 [mu] m, preferably from 15 / mm 2 or higher, more preferably 50 / mm 2 or higher, more preferably 160 / mm 2 or higher. This is because as the conductive particle diameter increases, the occupied area ratio of the conductive particles also increases. For the same reason, it is preferably 1800 pieces / mm 2 or less, more preferably 1100 pieces / mm 2 or less, and still more preferably 800 pieces / mm 2 or less.
  • the number density of the conductive particles may be locally deviated (for example, 200 ⁇ m ⁇ 200 ⁇ m) from the number density described above.
  • thermopolymerizable composition As the insulating resin binder 3, a thermopolymerizable composition, a photopolymerizable composition, a photothermal combined polymerizable composition, etc. that are used as an insulating resin binder in a known anisotropic conductive film are appropriately selected and used. can do.
  • thermo polymerizable composition a thermal radical polymerizable resin composition containing an acrylate compound and a thermal radical polymerization initiator, a thermal cationic polymerizable resin composition containing an epoxy compound and a thermal cationic polymerization initiator, and an epoxy compound And a thermal anion polymerization initiator containing a thermal anion polymerization initiator, and the photopolymerizable composition includes a photo radical polymerizable resin composition containing an acrylate compound and a photo radical polymerization initiator.
  • a plurality of types of polymerizable compositions may be used in combination. Examples of the combination include the combined use of a thermal cationic polymerizable composition and a thermal radical polymerizable composition.
  • the photopolymerization initiator a plurality of types that react to light having different wavelengths may be contained. Accordingly, the wavelength used for the photocuring of the resin constituting the insulating resin layer during the production of the anisotropic conductive film and the photocuring of the resin for bonding the electronic components to each other during the anisotropic conductive connection. Can be used properly.
  • the insulating resin binder 3 When the insulating resin binder 3 is formed using a photopolymerizable composition, all or part of the photopolymerizable compound contained in the insulating resin binder 3 is obtained by photocuring during the production of the anisotropic conductive film. Can be photocured. By this photocuring, the arrangement of the conductive particles 2 in the insulating resin binder 3 is maintained or fixed, and it is expected that the short circuit is suppressed and the capture is improved. Moreover, the viscosity of the insulating resin layer in the manufacturing process of an anisotropic conductive film can be adjusted by adjusting the conditions of this photocuring.
  • the blending amount of the photopolymerizable compound in the insulating resin binder 3 is preferably 30% by mass or less, more preferably 10% by mass or less, and still more preferably less than 2% by mass. This is because when the amount of the photopolymerizable compound is too large, the thrust applied to the indentation at the time of anisotropic conductive connection increases.
  • the heat-polymerizable composition contains a heat-polymerizable compound and a heat-polymerization initiator.
  • the heat-polymerizable compound one that also functions as a photopolymerizable compound may be used.
  • you may make a thermopolymerizable composition contain a photopolymerizable initiator while containing a photopolymerizable compound separately from a thermopolymerizable compound.
  • a photopolymerizable compound and a photopolymerization initiator are contained separately from the thermally polymerizable compound.
  • a thermal cationic polymerization initiator is used as the thermal polymerization initiator
  • an epoxy resin is used as the thermopolymerizable compound
  • a photoradical initiator is used as the photopolymerization initiator
  • an acrylate compound is used as the photopolymerizable compound.
  • the insulating binder 3 may include a cured product of these polymerizable compositions.
  • acrylate compound used as the heat or photopolymerizable compound a conventionally known thermal polymerization type (meth) acrylate monomer can be used.
  • a monofunctional (meth) acrylate monomer or a bifunctional or higher polyfunctional (meth) acrylate monomer can be used.
  • the epoxy compound used as the polymerizable compound forms a three-dimensional network structure and imparts good heat resistance and adhesion, and it is preferable to use a solid epoxy resin and a liquid epoxy resin in combination.
  • the solid epoxy resin means an epoxy resin that is solid at room temperature.
  • the liquid epoxy resin means an epoxy resin that is liquid at room temperature.
  • the normal temperature means a temperature range of 5 to 35 ° C. defined by JIS Z 8703.
  • two or more epoxy compounds can be used in combination.
  • an oxetane compound may be used in combination.
  • the solid epoxy resin is not particularly limited as long as it is compatible with a liquid epoxy resin and is solid at room temperature, and includes a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a polyfunctional type epoxy resin, a dicyclopentadiene type epoxy resin, A novolak phenol type epoxy resin, a biphenyl type epoxy resin, a naphthalene type epoxy resin, and the like are listed, and one of these can be used alone, or two or more can be used in combination. Among these, it is preferable to use a bisphenol A type epoxy resin.
  • the liquid epoxy resin is not particularly limited as long as it is liquid at normal temperature, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac phenol type epoxy resin, naphthalene type epoxy resin, and the like. Can be used alone or in combination of two or more. In particular, it is preferable to use a bisphenol A type epoxy resin from the viewpoint of film tackiness and flexibility.
  • thermal radical polymerization initiators examples include organic peroxides and azo compounds.
  • an organic peroxide that does not generate nitrogen that causes bubbles can be preferably used.
  • the amount of the thermal radical polymerization initiator used is preferably 2 to 60 parts by weight, more preferably 100 parts by weight of the (meth) acrylate compound. 5 to 40 parts by mass.
  • thermal cationic polymerization initiator those known as thermal cationic polymerization initiators for epoxy compounds can be employed.
  • thermal cationic polymerization initiators for epoxy compounds.
  • iodonium salts, sulfonium salts, phosphonium salts, ferrocenes, etc. that generate an acid by heat are used.
  • an aromatic sulfonium salt showing a good potential with respect to temperature can be preferably used.
  • the amount of the thermal cationic polymerization initiator used is preferably 2 to 60 mass relative to 100 parts by mass of the epoxy compound. Part, more preferably 5 to 40 parts by weight.
  • thermal anionic polymerization initiator commonly used known ones can be used.
  • organic acid dihydrazide, dicyandiamide, amine compound, polyamidoamine compound, cyanate ester compound, phenol resin, acid anhydride, carboxylic acid, tertiary amine compound, imidazole, Lewis acid, Bronsted acid salt, polymercaptan curing agent , Urea resin, melamine resin, isocyanate compound, block isocyanate compound, and the like one kind can be used alone, or two or more kinds can be used in combination.
  • it is preferable to use a microcapsule type latent curing agent having an imidazole-modified product as a core and a surface thereof coated with polyurethane.
  • the film-forming resin corresponds to, for example, a high-molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation.
  • the film-forming resin include various resins such as phenoxy resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, polyimide resin, and butyral resin. These may be used alone or in combination of two or more. May be used. Among these, it is preferable to use a phenoxy resin from the viewpoints of film formation state, connection reliability, and the like.
  • the thermal polymerizable composition may contain an insulating filler for adjusting the melt viscosity.
  • an insulating filler for adjusting the melt viscosity. Examples of this include silica powder and alumina powder.
  • the size of the insulating filler is preferably 20 to 1000 nm, and the blending amount is preferably 5 to 50 parts by mass with respect to 100 parts by mass of a thermally polymerizable compound (photopolymerizable compound) such as an epoxy compound. .
  • fillers softeners, accelerators, anti-aging agents, colorants (pigments, dyes), organic solvents, ion catchers and the like different from the above-described insulating fillers may be contained.
  • a stress relaxation agent examples include a hydrogenated styrene-butadiene block copolymer and a hydrogenated styrene-isoprene block copolymer.
  • the silane coupling agent examples include epoxy, methacryloxy, amino, vinyl, mercapto sulfide, and ureido.
  • the inorganic filler examples include silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like.
  • the insulating resin binder 3 can be formed by forming a coating composition containing the above-described resin into a film by a coating method and drying it, or by further curing it, or by previously forming a film by a known method.
  • the insulating resin binder 3 may be obtained by laminating a resin layer as necessary.
  • the insulating resin binder 3 is preferably formed on a release film such as a release-treated polyethylene terephthalate film.
  • the minimum melt viscosity of the insulating resin binder 3 can be appropriately determined according to the manufacturing method of the anisotropic conductive film.
  • the insulating resin binder is a film.
  • the minimum melt viscosity of the resin is preferably 1100 Pa ⁇ s or more.
  • a recess 3b is formed around the exposed portion of the conductive particles 2 pushed into the insulating resin binder 3 as shown in FIG. 14 or 15, or an insulating resin binder as shown in FIG.
  • the minimum melt viscosity is preferably 1500 Pa ⁇ s or more, more preferably 2000 Pa ⁇ s or more, and still more preferably 3000 to 15000 Pa ⁇ s, particularly from the point of forming a recess 3 c directly above the conductive particles 2 pushed into the 3. 3000 to 10000 Pa ⁇ s.
  • This minimum melt viscosity is obtained by using a rotary rheometer (TA instrument) as an example, using a measuring plate having a temperature rising rate of 10 ° C./min, a measuring pressure of 5 g, and a diameter of 8 mm. Can do. Further, when the step of pushing the conductive particles 2 into the insulating resin binder 3 is preferably performed at 40 to 80 ° C., more preferably 50 to 60 ° C., 60 ° C. from the viewpoint of forming the recesses 3b or 3c as described above.
  • the lower limit of the viscosity is preferably 3000 Pa ⁇ s or more, more preferably 4000 Pa ⁇ s or more, still more preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s or less, more preferably 15000 Pa ⁇ s or less, and further Preferably, it is 10,000 Pa ⁇ s or less.
  • the conductive particles 2 are sandwiched between connection objects such as opposing electronic components when the anisotropic conductive film is used.
  • connection objects such as opposing electronic components
  • the conductive particles 2 in the anisotropic conductive film can be prevented from flowing due to the flow of the molten insulating resin binder 3.
  • the thickness La of the insulating resin binder 3 is preferably 1 ⁇ m to 60 ⁇ m, more preferably 1 ⁇ m to 30 ⁇ m, and still more preferably 2 ⁇ m to 15 ⁇ m. Further, regarding the thickness La of the insulating resin binder 3, the ratio (La / D) thereof is preferably 0.6 to 10 in relation to the average particle diameter D of the conductive particles 2. If the thickness La of the insulating resin binder 3 is too large, the conductive particles are likely to be misaligned during anisotropic conductive connection, and the trapping property of the conductive particles at the terminal is lowered. This tendency is remarkable when La / D exceeds 10.
  • La / D is preferably 8 or less, and more preferably 6 or less.
  • the thickness La of the insulating resin binder 3 is too small and La / D is less than 0.6, it is difficult to maintain the conductive particles in a predetermined particle dispersion state or a predetermined arrangement by the insulating resin binder 3.
  • the ratio (La / D) between the layer thickness La of the insulating resin binder 3 and the particle diameter D of the conductive particles 2 is preferably 0.8-2.
  • the embedded state of the conductive particles 2 in the insulating resin binder 3 is not particularly limited, but when anisotropic conductive connection is performed by sandwiching an anisotropic conductive film between opposing parts and heating and pressing, As shown in FIGS. 14 and 15, the conductive particles 2 are partially exposed from the insulating resin binder 3, and are in contact with the tangent plane 3 p of the surface 3 a of the insulating resin binder in the central portion between the adjacent conductive particles 2.
  • a recess 3b is formed around the exposed portion of the conductive particle 2, or the insulating resin binder portion directly above the conductive particle 2 pushed into the insulating resin binder 3 as shown in FIG.
  • a recess 3c is formed with respect to the similar tangential plane 3p so that undulation is present on the surface of the insulating resin binder 3 immediately above the conductive particles 2.
  • the conductive particles 2 have the recesses 3b shown in FIGS.
  • the resistance received from the insulating resin binder 3 is reduced as compared with the case where there is no recess 3b. For this reason, the conductive particles 2 are easily sandwiched between the opposing electrodes, and the conduction performance is improved.
  • the depression 3c (FIG. 16) is formed on the surface of the resin just above the conductive particles 2, so that heating and pressurization are performed as compared with the case where there is no depression 3c.
  • the pressure at that time is easily concentrated on the conductive particles 2, and the conductive particles 2 are easily sandwiched between the electrodes, so that the conduction performance is improved.
  • (Le / D) is preferably less than 50%, more preferably less than 30%, and still more preferably 20 to 25%, and the recess 3b around the exposed portion of the conductive particles 2 (the maximum diameter in FIGS. 14 and 15).
  • the ratio (Ld / D) between Ld and the average particle diameter D of the conductive particles 2 is preferably 100% or more, more preferably 100 to 150%, and the dent 3c in the resin immediately above the conductive particles 2 (FIG. 14).
  • the ratio (Lf / D) between the maximum depth Lf and the average particle diameter D of the conductive particles 2 is preferably greater than 0, preferably less than 10%, more preferably less than 5%.
  • the diameter Lc of the exposed portion of the conductive particles 2 can be made equal to or smaller than the average particle diameter D of the conductive particles 2, and is preferably 10 to 90% of the particle diameter D.
  • the conductive particles 2 may be exposed at one point on the top 2t of the conductive particles 2, or the conductive particles 2 may be completely embedded in the insulating resin binder 3 so that the diameter Lc becomes zero.
  • the ratio (Lb) between the distance Lb of the deepest part of the conductive particles 2 from the tangential plane 3p (hereinafter referred to as the embedding amount) Lb and the average particle diameter D of the conductive particles 2 / D) is preferably 60% or more and 105% or less.
  • an insulating adhesive layer 4 having a viscosity and adhesiveness different from those of the resin constituting the insulating resin binder 3 is laminated. It may be.
  • the insulating adhesive layer 4 has the dent 3b formed in the insulating resin binder 3 as in the anisotropic conductive film 1d shown in FIG. It may be laminated on the surface on which the dent 3b is formed, or may be laminated on the surface opposite to the surface on which the dent 3b is formed, like the anisotropic conductive film 1e shown in FIG. The same applies when the indentation 3c is formed in the insulating resin binder 3.
  • an anisotropic conductive film is used to anisotropically connect an electronic component, the space formed by the electrodes and bumps of the electronic component is filled to improve adhesion. Can do.
  • the insulating adhesive layer 4 is an IC chip or the like regardless of whether the insulating adhesive layer 4 is on the formation surface of the recesses 3b and 3c. It is preferable that it is on the first electronic component side (in other words, the insulating resin binder 3 is on the second electronic component side such as a substrate). By doing so, unintentional movement of the conductive particles can be avoided, and the trapping property can be improved.
  • the first electronic component such as an IC chip is on the pressing jig side
  • the second electronic component such as a substrate is on the stage side
  • the anisotropic conductive film is temporarily bonded to the second electronic component
  • the first electronic component is The component and the second electronic component are subjected to main pressure bonding.
  • the first electronic component and the second electronic component may be temporarily bonded after the anisotropic conductive film is temporarily attached to the first electronic component. Crimp the parts.
  • the insulating adhesive layer 4 a material used as an insulating adhesive layer in a known anisotropic conductive film can be appropriately selected and used.
  • the insulating adhesive layer 4 may have a viscosity adjusted to be lower by using the same resin as the insulating resin binder 3 described above. As the minimum melt viscosity between the insulating adhesive layer 4 and the insulating resin binder 3 is different, the space formed by the electrodes and bumps of the electronic component is more easily filled with the insulating adhesive layer 4, and the electronic components are bonded to each other. The effect which improves property can be expected.
  • the minimum melt viscosity ratio between the insulating adhesive layer 4 and the insulating resin binder 3 is preferably 2 or more, more preferably 5 or more, and still more preferably 8 or more.
  • this ratio is too large, when a long anisotropic conductive film is used as a wound body, there is a possibility that the resin protrudes or blocks, so that it is preferably 15 or less in practice.
  • the preferable minimum melt viscosity of the insulating adhesive layer 4 more specifically satisfies the above-mentioned ratio and is 3000 Pa ⁇ s or less, more preferably 2000 Pa ⁇ s or less, and particularly 100 to 2000 Pa ⁇ s.
  • a coating composition containing a resin similar to the resin forming the insulating resin binder 3 is formed by coating and dried, further cured, or known in advance. It can form by forming into a film by the method of.
  • the thickness of the insulating adhesive layer 4 is preferably 1 ⁇ m or more and 30 ⁇ m or less, more preferably 2 ⁇ m or more and 15 ⁇ m or less.
  • the minimum melt viscosity of the whole anisotropic conductive film combining the insulating resin binder 3 and the insulating adhesive layer 4 depends on the thickness ratio of the insulating resin binder 3 and the insulating adhesive layer 4, it is practically used. May be 8000 Pa ⁇ s or less, and may be 200 to 7000 Pa ⁇ s, and preferably 200 to 4000 Pa ⁇ s to facilitate filling between the bumps.
  • an insulating filler such as silica fine particles, alumina, or aluminum hydroxide may be added to the insulating resin binder 3 and the insulating adhesive layer 4 as necessary. It is preferable that the compounding quantity of an insulating filler shall be 3 to 40 mass parts with respect to 100 mass parts of resin which comprises those layers. Thereby, even if the anisotropic conductive film melts at the time of anisotropic conductive connection, it is possible to suppress unnecessary movement of the conductive particles by the molten resin.
  • a transfer mold for arranging conductive particles in a predetermined arrangement is manufactured, a conductive particle is filled in a recess of the transfer mold, and formed on a release film.
  • the conductive particles 2 are transferred onto the insulating resin binder 3 by applying the pressure by covering the insulating resin binder 3 and pressing the conductive particles 2 into the insulating resin binder 3.
  • an insulating adhesive layer 4 is further laminated on the conductive particles 2.
  • the anisotropic conductive film 1A can be obtained.
  • an insulating resin binder is placed thereon, the conductive particles are transferred from the transfer mold to the surface of the insulating resin binder, and the conductive particles on the insulating resin binder are insulated.
  • An anisotropic conductive film may be manufactured by pushing into a conductive resin binder.
  • the embedding amount (Lb) of the conductive particles can be adjusted by the pressing force, temperature, etc. at the time of the pressing. Further, the shape and depth of the recesses 3b and 3c can be adjusted by the viscosity of the insulating resin binder during pressing, the pressing speed, the temperature, and the like.
  • the lower limit of the viscosity of the insulating resin binder when the conductive particles are pushed in is preferably 3000 Pa ⁇ s or more, more preferably 4000 Pa ⁇ s or more, further preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s.
  • the upper limit is preferably 20000 Pa ⁇ s.
  • such a viscosity is preferably obtained at 40 to 80 ° C., more preferably 50 to 60 ° C. More specifically, when manufacturing the anisotropic conductive film 1a having the recess 3b shown in FIG.
  • the viscosity of the insulating resin binder when the conductive particles are pushed in is 8000 Pa ⁇ s (
  • the viscosity of the insulating resin binder when the conductive particles are pushed in is 4500 Pa ⁇ s (50 to 60 ° C.). 60 ° C.).
  • a fine adhesive may be applied to the top surface of the convex portions so that the conductive particles adhere to the top surface.
  • transfer molds can be manufactured by using and applying known techniques such as machining, photolithography, and printing.
  • a method for arranging the conductive particles in a predetermined arrangement a method using a biaxially stretched film or the like may be used instead of a method using a transfer mold.
  • the anisotropic conductive film is preferably a film wound body wound on a reel in order to continuously provide for connection of electronic components.
  • the length of the film wound body should just be 5 m or more, and it is preferable that it is 10 m or more. Although there is no particular upper limit, it is preferably 5000 m or less, more preferably 1000 m or less, and even more preferably 500 m or less, from the viewpoint of handleability of the shipment.
  • the film winding body may be one in which anisotropic conductive films shorter than the entire length are connected and connected with a tape. There may be a plurality of connected locations, may exist regularly, or may exist randomly.
  • the thickness of the connecting tape is not particularly limited as long as it does not hinder the performance, but if it is too thick, it affects the protrusion and blocking of the resin, and is preferably 10 to 40 ⁇ m.
  • the width of the film is not particularly limited, but is 0.5 to 5 mm as an example.
  • continuous anisotropic conductive connection can be performed, which can contribute to cost reduction of the connection body.
  • the anisotropic conductive film of the present invention is formed by heat or light between a first electronic component such as an FPC, an IC chip, or an IC module and a second electronic component such as an FPC, a rigid substrate, a ceramic substrate, a glass substrate, or a plastic substrate. It can be preferably applied when anisotropic conductive connection is made. Further, the first electronic components can be anisotropically conductively connected by stacking IC chips or IC modules. The connection structure thus obtained and the manufacturing method thereof are also part of the present invention.
  • the interface on the side where the conductive particles are present in the thickness direction of the anisotropic conductive film is temporarily attached to a second electronic component such as a wiring board.
  • the first electronic component such as an IC chip is mounted on the temporarily attached anisotropic conductive film and thermocompression-bonded from the first electronic component side from the viewpoint of improving connection reliability.
  • it can also connect using photocuring.
  • it is preferable to match the longitudinal direction of the terminals of the electronic component with the short direction of the anisotropic conductive film.
  • Experimental Example 1 to Experimental Example 8 (Preparation of anisotropic conductive film) Regarding the anisotropic conductive film used for the COG connection, the influence of the resin composition of the insulating resin binder and the arrangement of the conductive particles on the film forming ability and the conduction characteristics was examined as follows.
  • blending shown in Table 1 was prepared, respectively.
  • the minimum melt viscosity of the resin composition was adjusted according to the preparation conditions of the insulating resin composition.
  • a resin composition for forming an insulating resin binder is coated on a PET film having a film thickness of 50 ⁇ m with a bar coater, dried in an oven at 80 ° C. for 5 minutes, and insulated with a thickness La shown in Table 2 on the PET film.
  • a functional resin binder layer was formed.
  • an insulating adhesive layer was formed on a PET film with a thickness shown in Table 2.
  • a metal mold was prepared so that the arrangement of the conductive particles in plan view was as shown in Table 2, and the distance between the centers of the closest conductive particles in the repeating unit was 6 ⁇ m.
  • a known transparent resin pellet was poured into the mold in a melted state, and cooled and hardened to form a resin mold having recesses arranged as shown in Table 2.
  • the conductive particles are arranged in a hexagonal lattice arrangement (number density 32,000 / mm 2 ), and one of the lattice axes is inclined 15 ° with respect to the longitudinal direction of the anisotropic conductive film. .
  • metal-coated resin particles (Sekisui Chemical Co., Ltd., AUL703, average particle diameter of 3 ⁇ m) are prepared, and the conductive particles are filled in the resin-type dents, and the above-mentioned insulating resin binder is put thereon. It was stuck by pressing at 60 ° C. and 0.5 MPa. Then, the insulating resin binder is peeled from the mold, and the conductive particles on the insulating resin binder are pressed into the insulating resin binder by pressing (pressing conditions: 60 to 70 ° C., 0.5 Mpa). A film was prepared in which conductive particles were embedded in the binder in the state shown in Table 2.
  • the embedded state of the conductive particles was controlled by the indentation condition.
  • Experimental Example 4 the film shape was not maintained after the conductive particles were pushed in, but in other experimental examples, a film in which the conductive particles were embedded could be produced.
  • a dent was recognized around the exposed portion of the embedded conductive particles or directly above the embedded conductive particles as shown in Table 2.
  • Table 4 shows the dent most clearly for each experimental example. The measured value of what was observed was shown.
  • An anisotropic conductive film having a two-layered resin layer was prepared by laminating an insulating adhesive layer on the side of the film embedded with conductive particles into which the conductive particles were pressed.
  • Experimental Example 4 since the film shape was not maintained after the conductive particles were pushed in, the subsequent evaluation was not performed.
  • the terminal characteristics of the IC for conducting characteristic evaluation and the glass substrate correspond to each other, and the sizes are as follows. Further, when connecting the evaluation IC and the glass substrate, the longitudinal direction of the anisotropic conductive film and the short direction of the bump were matched.
  • Evaluation criteria for initial conduction resistance (no problem if it is less than 2 ⁇ for practical use) A: Less than 0.4 ⁇ B: 0.4 ⁇ or more and less than 0.8 ⁇ C: 0.8 ⁇ or more
  • connection object for evaluation produced in (a) is placed in a thermostatic bath at a temperature of 85 ° C. and a humidity of 85% RH for 500 hours, and the subsequent conduction resistance is the same as the initial conduction resistance. And evaluated according to the following three evaluation criteria.
  • Conduction reliability evaluation criteria (practically no problem if less than 5 ⁇ ) A: Less than 1.2 ⁇ B: 1.2 ⁇ or more and less than 2 ⁇ C: 2 ⁇ or more
  • Table 2 shows that in Experimental Example 4 where the minimum melt viscosity of the insulating resin layer is 800 Pa ⁇ s, it is difficult to form a film having a dent in the insulating resin binder near the conductive particles.
  • the minimum melt viscosity of the insulating resin binder is 1500 Pa ⁇ s or more, it is possible to form a convex portion in the vicinity of the conductive particles of the insulating resin binder by adjusting the conditions at the time of embedding the conductive particles.
  • the anisotropic conductive film has good conduction characteristics for COG.
  • the anisotropic conductive connection can be performed at a lower pressure.
  • IC for evaluating short-circuit occurrence rate (7.5 ⁇ m space comb tooth TEG (test element group): Outline 15 x 13mm Thickness 0.5mm Bump specifications Size 25 ⁇ 140 ⁇ m, distance between bumps 7.5 ⁇ m, bump height 15 ⁇ m
  • the short is less than 50 ppm, it is practically preferable, and the anisotropic conductive films of Experimental Examples 1 to 3 and 5 to 8 are all less than 50 ppm.
  • a resin composition for forming an insulating resin binder and an insulating adhesive layer with the composition shown in Table 3 was prepared, and an anisotropic conductive film was prepared in the same manner as in Experimental Example 1 using these.
  • Table 4 shows the arrangement of the conductive particles and the distance between the centers of the closest conductive particles in this case.
  • the conductive particles were arranged in a hexagonal lattice arrangement (number density 15000 / mm 2 ), and one of the lattice axes was inclined 15 ° with respect to the longitudinal direction of the anisotropic conductive film.
  • Non-alkali glass substrate Electrode ITO wiring thickness 0.7mm
  • Evaluation criteria for initial conduction resistance A Less than 1.6 ⁇ B: 1.6 ⁇ or more and less than 2.0 ⁇ C: 2.0 ⁇ or more
  • Table 4 shows that it is difficult to form a film having a dent in Experimental Example 12 where the minimum melt viscosity of the insulating resin layer is 800 Pa ⁇ s.
  • the minimum melt viscosity of the insulating resin layer is 1500 Pa ⁇ s or more
  • a recess can be formed in the vicinity of the conductive particles of the insulating resin binder by adjusting the conditions at the time of embedding the conductive particles. It can be seen that the anisotropic conductive film has good conduction characteristics for FOG.
  • (C) Short-circuit occurrence rate The number of shorts of the connection object for evaluation whose initial conduction resistance was measured was measured, and the short-circuit occurrence rate was obtained from the measured number of shorts and the number of gaps of the connection object for evaluation. If the short-circuit occurrence rate is less than 100 ppm, there is no practical problem. In all of Experimental Examples 9 to 11 and 13 to 16, the short-circuit occurrence rate was less than 100 ppm.

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PCT/JP2017/016282 2016-05-05 2017-04-25 異方性導電フィルム WO2017191779A1 (ja)

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KR1020217007174A KR20210031536A (ko) 2016-05-05 2017-04-25 이방성 도전 필름
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WO2021161936A1 (ja) * 2020-02-12 2021-08-19 デクセリアルズ株式会社 擬似ランダムドットパターン及びその作成方法
WO2021161934A1 (ja) * 2020-02-12 2021-08-19 デクセリアルズ株式会社 擬似ランダムドットパターン及びその作成方法

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JP2009076431A (ja) * 2007-01-31 2009-04-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
JP2016066573A (ja) * 2013-11-19 2016-04-28 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

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JP2015079586A (ja) 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム
JP6331776B2 (ja) * 2014-06-30 2018-05-30 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
CN112421262B (zh) 2014-11-17 2023-06-20 迪睿合株式会社 各向异性导电膜、连接结构体及其制造方法
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JP2007080522A (ja) * 2005-09-09 2007-03-29 Sumitomo Bakelite Co Ltd 異方導電性フィルムおよび電子・電機機器
JP2009076431A (ja) * 2007-01-31 2009-04-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
JP2016066573A (ja) * 2013-11-19 2016-04-28 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

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WO2021161936A1 (ja) * 2020-02-12 2021-08-19 デクセリアルズ株式会社 擬似ランダムドットパターン及びその作成方法
WO2021161934A1 (ja) * 2020-02-12 2021-08-19 デクセリアルズ株式会社 擬似ランダムドットパターン及びその作成方法

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