WO2017187728A1 - Sheet edge detection device for molten metal plating facility and sheet edge detection method - Google Patents

Sheet edge detection device for molten metal plating facility and sheet edge detection method Download PDF

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Publication number
WO2017187728A1
WO2017187728A1 PCT/JP2017/006039 JP2017006039W WO2017187728A1 WO 2017187728 A1 WO2017187728 A1 WO 2017187728A1 JP 2017006039 W JP2017006039 W JP 2017006039W WO 2017187728 A1 WO2017187728 A1 WO 2017187728A1
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Prior art keywords
plate
metal plating
steel plate
edge
molten metal
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PCT/JP2017/006039
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French (fr)
Japanese (ja)
Inventor
隆 米倉
正雄 丹原
吉川　雅司
山田　昌弘
晋司 難波
Original Assignee
Ｐｒｉｍｅｔａｌｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｊａｐａｎ株式会社
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Publication of WO2017187728A1 publication Critical patent/WO2017187728A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/40—Plates; Strips
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/50—Controlling or regulating the coating processes
    • C23C2/52—Controlling or regulating the coating processes with means for measuring or sensing
    • C23C2/524—Position of the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/04—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness specially adapted for measuring length or width of objects while moving

Definitions

  • the present invention relates to a plate edge detection device and a plate edge detection method for a molten metal plating facility.
  • the steel sheet that is continuously transported is immersed in a molten metal plating bath and pulled up, and then a gas jet is blown from both wiping nozzles to both surfaces of the steel sheet to cause excessive adhesion to the steel sheet.
  • the metal is removed.
  • a gas jet is sprayed on both surfaces of the metal plating plate, if the gas jets injected from the opposing wiping nozzles interfere with each other at the plate end of the metal plating plate, A phenomenon occurs in which the removal performance is lowered and the thickness of the end of the metal plating plate becomes thicker than the thickness of the central portion.
  • a plurality of light emitting elements are arranged in a detection direction that intersects the moving direction of the steel strip, and a region through which the edge portion of the steel strip passes is provided.
  • a plurality of light receiving elements are arranged to face each light emitting element, and the position of the edge part of the steel strip is detected by receiving light emitted from the light emitting element and not shielded by the steel strip by the light receiving element.
  • Edge detection means are known (see, for example, Patent Document 1 below).
  • a belt-like material position detection device in which both edges of a steel plate are imaged using a CCD linear image sensor, and the boundary between the bright and dark portions of the acquired image is detected as the edge of the steel plate (for example, see Patent Document 2 below).
  • the hot dipping equipment is composed of optical sensors that are displaceable along the plate width direction of the metal band on both sides of the upper part of the wiping nozzle in order to detect the positions of both ends of the metal band.
  • optical sensors that are displaceable along the plate width direction of the metal band on both sides of the upper part of the wiping nozzle in order to detect the positions of both ends of the metal band.
  • an edge detection sensor that detects the position of the end of a metal strip by one of the optical sensors that emits an optical signal and the other of the opposing optical sensors receives the optical signal (for example, the following patent document) 3).
  • the amount of adhesion of the molten metal is adjusted by gas blowing, and then to measure the degree of alloying of the steel strip through the alloying furnace,
  • an alloying degree measuring apparatus in which an illuminating device and an ITV camera are arranged in the vicinity of the roll on the exit side of the alloying furnace so that the optical axis faces the steel strip on the roll, an image signal taken by the ITV camera by the edge detection unit Is also known in which the luminance information for one line is read to detect the edge positions at both ends of the steel strip (see, for example, Patent Document 4 below).
  • the edge detection means described in Patent Documents 1 and 3 require the use of a high-performance light-emitting element and light-receiving element, and there is a problem that the apparatus cost is increased.
  • the light-emitting element and the light-receiving element are sandwiched between metal plating plates. Therefore, there is a problem that the arrangement of related electric wires and supporting members becomes complicated.
  • the edge detection part described in patent document 4 can detect the edge position of the both ends of a steel strip at the exit side of an alloying processing furnace, it is the metal plating board immediately after leaving a molten metal plating bath.
  • edge position detection there is a problem that it is difficult to detect edge positions at both ends of the steel strip. This is because, as described above, the metal plating plate immediately after passing through the molten metal plating bath has a mirror shape, and the light irradiated from the lighting device is specularly reflected.
  • Patent Document 4 shows that reflected light is not only specularly reflected but also broadly reflected, that is, irregularly reflected.
  • FIG. 3 shows that the surface of the steel strip serving as the reflecting surface is mirror-like. I understand that there is no. In the detection of the reflected light targeting a non-mirror surface, the reflected light can be received from a wide angle, so there is no problem that it is difficult to capture the reflected light, and the light source is not a means for the mirror surface.
  • the present invention provides a plate edge detecting device and a plate edge of a molten metal plating facility capable of detecting a plate end of a steel plate immersed and pulled up in a molten metal tank with a simple configuration with high accuracy.
  • An object is to provide a detection method.
  • a plate edge detection device for a molten metal plating facility for detecting a plate edge position of a steel plate pulled up from a molten metal tank, A light source that extends along the plate width direction of the steel plate and is disposed opposite to the steel plate, A light receiving portion that is disposed on the same side as the light source with respect to the steel plate, and receives specularly reflected light of the light source that is specularly reflected by a region including at least a plate edge of the steel plate; And an analysis unit that identifies, as an edge position of the steel plate, a position where the specularly reflected light of the light source that is specularly reflected by the steel plate is interrupted based on information received by the light receiving unit.
  • a light receiving portion for receiving the regular reflection light of the light source The position at which the specularly reflected light of the light source that is specularly reflected by the steel plate is interrupted based on the information received by the light receiving unit is specified as the edge position of the steel plate.
  • the plate edge of the steel plate immersed and pulled up in the molten metal tank can be detected with a simple configuration with high accuracy.
  • FIG. 6A is a schematic diagram illustrating an example of an image acquired by the camera
  • FIG. 6B is a schematic diagram illustrating another example of an image acquired by the camera.
  • FIG. 8A is a schematic diagram illustrating an example of an image acquired by the camera
  • FIG. 8B is a schematic diagram illustrating another example of an image acquired by the camera. It is a side view of the board edge detection apparatus of the molten metal plating equipment which concerns on Example 3 of this invention.
  • FIG. 10A is a schematic diagram illustrating an example of an image acquired by a camera
  • FIG. 10B is a schematic diagram illustrating another example of an image acquired by the camera.
  • FIG. 12A is a schematic diagram illustrating an example of an image acquired by the camera
  • FIG. 12B is a schematic diagram illustrating another image acquired by the camera.
  • a continuously conveyed steel plate 1 ′ is immersed in a hot molten metal 13 stored in a molten metal plating bath (molten metal tank) 11. After that, the transport direction is changed vertically upward by the sink roll 12 disposed in the molten metal plating bath 11 and pulled upward. Thereafter, the plated steel plate (hereinafter referred to as a metal plating plate) 1 is removed of excess molten metal adhering to the gas ejected from the wiping device 15 while vibration is suppressed by the vibration damping device 14.
  • the vibration damping device 14 includes a plurality of electromagnets (non-contact type plate shape) arranged in the upper and lower pairs and in the plate width direction W of the metal plating plate 1 as shown in FIGS. Correction device) 14a and an eddy current type displacement sensor (plate shape sensor) 14b as a plate thickness direction position detecting means are provided and arranged above wiping device 15.
  • the wiping device 15 includes a wiping nozzle that controls the amount of plating adhesion by blowing gas to the front and back surfaces of the metal plating plate 1 that travels upward from the molten metal plating bath 11.
  • the molten metal plating facility includes two cameras (light receiving units) 16, a line illumination (light source) 17, and an image processing unit (plate processing) as plate edge detection devices as shown in FIGS. Analysis unit) 18 is provided.
  • the camera 16 includes, for example, a CCD camera and a lens, and photographs the plate edge 1A of the metal plating plate 1 and its periphery from the front side of the metal plating plate 1 (position facing the front surface or the back surface of the metal plating plate 1). Installed. For example, the camera 16 is disposed at a position spaced apart from the metal plating plate 1 by about 1500 to 2300 [mm]. The two cameras 16 are installed on the same side with respect to the metal plating plate 1 at the same height and different from the line illumination 17. The camera 16 photographs the specularly reflected light of the line illumination 17 that is specularly reflected by the metal plating plate 1.
  • the line illumination 17 is configured to obtain line-shaped illumination light by arranging a plurality of LEDs 17a in a line.
  • the line illumination 17 is installed on the same side as the camera 16 with respect to the metal plating plate 1 so that the longitudinal direction is along the plate width direction W of the metal plating plate 1.
  • the line illumination 17 is a regular reflected light of the line illumination 17 in the image taken by the camera 16 up to the plate edge 1A of the metal plating plate 1 on the outer side in the plate width direction and to the end of the image on the center side in the plate width direction. The length and position are set so that the image is captured.
  • the line illumination 17 needs to be arranged so that the specularly reflected light from the plate edge 1A of the metal plating plate 1 of the illumination light irradiated from at least the end in the plate width direction of the line illumination 17 enters the camera 16. .
  • the metal plating plate 1 has a straight line L ⁇ b> 1 connecting the camera 16 and the plate edge 1 ⁇ / b> A of the metal plating plate 1.
  • the line illumination 17 may be arranged from the outside in the plate width direction toward the center side in the plate width direction with respect to the straight line L1 ′ that is symmetric with respect to the straight line La perpendicular to the plate edge 1A.
  • the line illumination 17 is illuminated to the plate edge 1 ⁇ / b> A of the metal plating plate 1 in the image captured by the camera 16 as shown in FIG.
  • the light is projected, and the position (hereinafter referred to as the plate edge position) 1a of the plate edge 1A of the metal plating plate 1 can be detected.
  • the plate edge 1A of the metal plating plate 1 is curved away from the camera 16 as shown in FIG. 5, the camera 16 and the metal plating plate 1 as shown by the broken line in the drawing.
  • the straight line L2 connecting the plate edge 1A of the metal plate 1 with respect to the straight line L2 'symmetrical to the straight line Lb perpendicular to the plate edge 1A across the plate edge 1A the plate width direction outer side from the plate width direction outer side It is necessary to arrange the line illumination 17 toward the front.
  • the line illumination extends further to the outside in the plate width direction than the position at which the camera 16 can capture the specularly reflected light reflected by the plate edge 1A of the flat plate-like metal plating plate 1 that is not curved. 17 is arranged. Thereby, even if the plate edge 1A of the metal plating plate 1 is curved in a direction away from the line illumination 17, the regular reflection reflected by the plate edge 1A of the metal plating plate 1 as shown in FIG. The light can be reliably imaged by the camera 16.
  • the image processing unit 18 obtains the plate edge position 1a of the metal plating plate 1 based on the information of the image as shown in FIG. That is, in the image photographed by the camera 16, the plate edge position 1a appears as a position where the light of the line illumination 17 is interrupted.
  • the image processing unit 18 obtains the plate edge position 1a of the metal plating plate 1 by converting the position where the light of the line illumination 17 in the image is interrupted into real coordinates by a known method.
  • FIG. 8A shows an example of an image obtained when the metal plating plate 1 is located at a distance d from the camera 16 as shown by a solid line in FIG. 7, and FIG.
  • the example of an image acquired when the metal plating plate 1 exists in the position of distance d '(d'> d) from the camera 16 is shown.
  • the plate edge position 1a on the image shown in FIG. 8B appears to move to the center side in the plate width direction W with respect to the plate edge position 1a on the image shown in FIG.
  • an error may occur in the detection result of the plate edge position 1a obtained by the image processing unit 18 depending on the positional relationship between the metal plating plate 1 and the camera 16.
  • a shown in FIG. 8 is regular reflection light of the line illumination 17.
  • the displacement sensor 14b of the vibration damping device 14 is used to detect the metal plating plate 1 in the thickness direction.
  • the image processing unit 18 corrects the detection result of the plate edge position 1a obtained from the image.
  • the regular reflected light of the line illumination 17 that is specularly reflected on the surface of the metal plated plate 1 is imaged by the camera 16. It is possible to detect the plate edge position 1a of the metal plating plate 1 from the obtained image.
  • the metal plating plate 1 is in a mirror state and has very little scattered light, the regular reflection light of the line illumination 17 by the metal plating plate 1 is clearly displayed in the image captured by the camera 16. That is, in the image, the reflected light of the line illumination 17 is projected as a strong signal (bright signal) on the metal plated plate 1 portion, and the weak signal (dark signal) even if the reflected light of the line illumination 17 is projected on the background portion. Therefore, the difference between the metal plated plate 1 portion and the background portion becomes clear. Accordingly, it is possible to detect the plate edge position 1a of the metal plating plate 1 using an inexpensive light source and light receiving unit that are easily available without using a high-performance light emitting element or light receiving element.
  • the camera 16 and the line illumination 17 are arranged on the same surface side with respect to the metal plating plate 1, the arrangement of the electric wires connected to these and the supporting members that support them becomes simple and inexpensive, and the retrofit Construction and maintenance become easy.
  • the information of the detected plate edge position 1a can be used as information useful for control.
  • the position of the vibration damping device 14 using the electromagnet 14a as disclosed in Japanese Patent No. 5632596 can be controlled to be moved to the position of the plate edge 1A of the metal plating plate 1 with high accuracy. Become.
  • the position of the electromagnet 14a of the vibration damping device 14 can be made to follow the plate edge 1A in response to the change in the plate width or the meandering of the plate. Thereby, the board curvature of the metal plating plate 1 can be reduced, and a uniform plating thickness can be achieved.
  • the wiping device 15 may cause the wiping gas on the front and back to collide to increase the plating thickness of the plate edge 1A (plate edge splash), and noise may be generated due to the collision of the wiping gas on the front and back.
  • a method of causing a baffle plate or a variable width mask to follow the plate edge 1A of the metal plating plate 1 is known.
  • the boundary position control of the gas ejection area by the baffle plate or variable width mask can be performed with high accuracy, and the occurrence of plate edge splash and noise can be reduced.
  • the distance between the metal plating plate 1 and the nozzle of the wiping device 15 can be reduced, thereby improving the wiping capability and producing a uniform thin metal plating plate at a high line speed. It leads to improvement and cost reduction.
  • the position of the metal plating plate 1 that has been lifted and moved upward may slightly shift depending on the operation state of the equipment or the state of the metal plating plate 1 itself. If the plate edge position 1a is specified based only on the information of the images taken by the left and right cameras 16 without considering such a shift, a position slightly shifted in the left-right direction from the actual position is output as the plate edge position 1a. Can be considered. On the other hand, in this embodiment, a more accurate plate edge position 1a is obtained by correcting the plate edge position 1a based on the position information in the plate thickness direction of the metal plated plate 1 detected by the displacement sensor 14b. Can do.
  • the plate edge detection device of the molten metal plating facility of this embodiment has an advantage that it can be easily retrofitted to existing facilities, such as being able to correct the position information of the edge of the metal plating plate 1.
  • the plate thickness direction position detecting means is not limited to the above-described displacement sensor 14b, and the plate thickness direction position of the metal plating plate 1 can be detected in a non-contact manner such as a laser displacement meter and an ultrasonic displacement meter. A displacement meter can be used.
  • the metal plating plate 1 may be inclined or curved in the plate thickness direction.
  • the position of the end of the line illumination 17 is the case where the metal plating plate 1 is flat and not curved.
  • the specularly reflected light at the end of the line illumination 17 is just reflected by the plate edge 1A and incident on the camera 16 (see FIG. 4), and is further arranged to the outside in the plate width direction.
  • the plate edge position 1a of the metal plating plate 1 can be reliably detected regardless of whether the edge portion of the metal plating plate 1 is not inclined or curved, or when there is some inclination or curvature.
  • the light receiving unit and the light source are not limited to the camera 16 and the line illumination 17 described above.
  • the light receiving unit is a general-purpose camera, and the light source is a fluorescent lamp or a cold cathode tube.
  • the line illumination 17 Various changes can be made without departing from the spirit of the invention. If an illumination device with high illuminance is used as the line illumination 17, the exposure time of the camera 16 can be shortened, and the metal plating plate 1 that moves at high speed can be suitably handled.
  • a plate edge detection apparatus and a plate edge detection method for a molten metal plating facility according to Embodiment 2 of the present invention will be described with reference to FIGS.
  • the plate edge detection device and the plate edge detection method of the molten metal plating facility according to the present embodiment are replaced with the line illumination 17 as shown in FIG. 9 as the plate thickness direction position detection means, instead of the displacement sensor 14b of the first embodiment.
  • the camera 16 are spaced apart by a predetermined distance H in the vertical direction.
  • FIG. 10A shows an example of an image obtained when the metal plating plate 1 is located at the position indicated by the solid line in FIG. 9.
  • FIG. 10B shows the metal plating plate 1 located at the position indicated by the alternate long and short dash line in FIG. The example of the image acquired when there exists is shown.
  • the height of the regular reflection light A of the line illumination 17 displayed in the image changes according to the distance of the metal plated plate 1 from the camera 16.
  • the image processing unit 18 in the image processing unit 18, from the distance H between the line illumination 17 and the camera 16 and the height position of the regular reflection light of the line illumination 17 in the image taken by the camera 16. The position in the plate thickness direction of the metal plating plate 1 is calculated, and the detection result of the plate edge position 1a obtained from the image is corrected based on the calculated position.
  • the plate edge detection device and the plate edge detection method of the molten metal plating facility configured as described above, as compared with the invention according to the first embodiment, as the light receiving unit, not only in the left-right direction,
  • a camera 16 that can also obtain information in the vertical direction, and disposing the camera 16 and the line illumination 17 at positions different from each other by a predetermined distance H in the vertical direction, the specularly reflected light from the metal plating plate 1 is converted into the metal plating plate.
  • the width of the metal-plated plate 1 can be obtained without providing a plate thickness direction detection means separately from the camera 16 by utilizing the vertical displacement in the image (within the field of view of the camera 16) according to the distance from the one camera 16.
  • position information in the thickness direction can be acquired.
  • the plate edge detection apparatus of the molten metal plating facility replaces the displacement sensor 14b of the first embodiment with both sides of the metal plating plate 1 as the plate thickness direction position detecting means.
  • a second camera 19 is provided for each plate edge 1A.
  • the second camera 19 is the same as the first camera 16, and in the present embodiment, these two cameras 16 and 19 are placed along the plate width direction W in the metal plated plate 1.
  • the plate edge 1A is installed at positions corresponding to both ends of the fluctuation range w of the plate edge 1A caused by the change of the plate width or the meandering of the metal plating plate 1.
  • the cameras 16 and 19 have the same height, and are arranged so that the optical axes of the cameras 16 and 19 are flat and not orthogonal to the plate surface of the metal plating plate 1. Thus, if the optical axes of the cameras 16 and 19 are orthogonal to the plate surface of the metal plating plate 1, the sensor resolution in the plate width direction W can be improved.
  • the image processing unit 18 uses the stereo method, which is a known method, to capture the plate edge positions 1a and 1b based on the information of the images shown in FIGS. 12 (a) and 12 (b), respectively.
  • the position in the plate thickness direction is detected.
  • a shown in FIG. 12 is regular reflection light of the line illumination 17.
  • the plate edge 1A of the metal plating plate 1 is simultaneously photographed by the two cameras 16 and 19, and the position of the metal plating plate 1 in the plate thickness direction and the plate edge position 1a using a known stereo method. Are simultaneously measured, the error of the plate edge position 1a due to the displacement of the position of the metal plated plate 1 in the plate thickness direction is reduced.
  • the cameras 16 and 19 are used as the light receiving portions with respect to the respective edge portions of the metal plated plate 1. Since two units are provided along the direction W, position information in the thickness direction of the metal plating plate 1 can be acquired based on a so-called stereo method.
  • the image processing unit 18 performs processing under conditions determined for each position of the cameras 16 and 19 on the assumption that the metal plating plate 1 is not displaced in the thickness direction.
  • the present invention can be applied to a plate edge detection device and a plate edge detection method of a molten metal plating facility.

Abstract

The purpose of the invention is to provide a sheet edge detection device for a molten metal plating facility and a sheet edge detection method with which the position of a sheet edge of a metal plated sheet can be detected with high accuracy with a simple configuration. Disclosed is a sheet edge detection device for a molten metal plating facility, the sheet edge detection device detecting the position of an edge of a metal plated sheet (1) which has been pulled up from a molten metal tank (11), and comprising: a line illumination (17) that extends along the sheet width direction (W) of the metal plated sheet (1) and that is arranged in opposition to the metal plated sheet (1); a camera (16) that is arranged in opposition to the metal plated sheet (1) on the same side as the line illumination (17), the camera receiving regular reflection light of the line illumination (17) which is specularly reflected by a region of the metal plated sheet (1) including at least an edge; and an image processing unit (18) that specifies, as the position of the edge of the metal plated sheet (1), a position where the regular reflection light of the line illumination (17) specularly reflected by the metal plated sheet (1) is interrupted on the basis of information on light received by the camera (16).

Description

溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法Plate edge detection apparatus and plate edge detection method for molten metal plating equipment
　本発明は、溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法に関する。 The present invention relates to a plate edge detection device and a plate edge detection method for a molten metal plating facility.
　溶融金属めっき設備においては、連続的に搬送される鋼板を溶融金属めっき浴中に浸漬させて引き上げた後、該鋼板の両面に対してワイピングノズルからガスジェットを吹き付けて鋼板に余剰に付着した溶融金属を除去している。このような溶融金属めっき設備では、金属めっき板の両面に対してガスジェットを吹き付ける際、金属めっき板の板端において、対向するワイピングノズルから噴射されたガスジェットが相互に干渉すると、溶融金属の除去性能が低下して金属めっき板の板端の板厚が中央部の板厚より厚くなる現象が生じる。 In molten metal plating equipment, the steel sheet that is continuously transported is immersed in a molten metal plating bath and pulled up, and then a gas jet is blown from both wiping nozzles to both surfaces of the steel sheet to cause excessive adhesion to the steel sheet. The metal is removed. In such a molten metal plating facility, when a gas jet is sprayed on both surfaces of the metal plating plate, if the gas jets injected from the opposing wiping nozzles interfere with each other at the plate end of the metal plating plate, A phenomenon occurs in which the removal performance is lowered and the thickness of the end of the metal plating plate becomes thicker than the thickness of the central portion.
　このような問題に対し、鋼板の板端の外側にバッフルプレートを配置し、このバッフルプレートを鋼板の板端に追従させることにより、対向するワイピングノズルから噴射されたガスジェットが相互に干渉することを回避するようにしたガスワイピング装置や、ワイピングノズルに対し、鋼板の板幅方向の両外側に位置する部分をマスクで覆うことによりワイピングノズルから吹き付けられたワイピングガスが鋼板の板幅方向の両外側で衝突することを回避するようにしたものがあり、鋼板の板端の位置を検出することが重要となっている。 For such problems, a baffle plate is arranged outside the plate edge of the steel plate, and by making this baffle plate follow the plate end of the steel plate, gas jets injected from the opposing wiping nozzles interfere with each other. The wiping gas blown from the wiping nozzle is covered in both the sheet width direction of the steel sheet by covering the portions located on both outer sides in the sheet width direction of the steel sheet with a mask with respect to the gas wiping device and the wiping nozzle. There is one that avoids collision outside, and it is important to detect the position of the plate edge of the steel plate.
　従来、鋼板の板端の位置を検出するものとして、ワイピング装置に設けられ、鋼帯の移動方向と交差する検出方向に複数の発光素子を配置すると共に、鋼帯のエッジ部分が通過する領域を挟んで複数の受光素子を各発光素子に対向して配置して、発光素子から投光され鋼帯によって遮光されなかった光を受光素子により受光することで鋼帯のエッジ部分の位置を検出するエッジ検出手段が公知となっている（例えば、下記特許文献１参照）。 Conventionally, as a device for detecting the position of the plate edge of a steel plate, a plurality of light emitting elements are arranged in a detection direction that intersects the moving direction of the steel strip, and a region through which the edge portion of the steel strip passes is provided. A plurality of light receiving elements are arranged to face each light emitting element, and the position of the edge part of the steel strip is detected by receiving light emitted from the light emitting element and not shielded by the steel strip by the light receiving element. Edge detection means are known (see, for example, Patent Document 1 below).
　また、ＣＣＤリニアイメージセンサを用いて鋼板の両縁部を撮像し、取得した画像の明部と暗部との境界を鋼板の縁部として検出する帯状材の位置検出装置も公知となっている（例えば、下記特許文献２参照）。 In addition, a belt-like material position detection device is known in which both edges of a steel plate are imaged using a CCD linear image sensor, and the boundary between the bright and dark portions of the acquired image is detected as the edge of the steel plate ( For example, see Patent Document 2 below).
　また、溶融めっき設備に設けられ、金属帯の両端の位置を検出するために、ワイピングノズルの上部両側において金属帯の板幅方向に沿って変位可能に設けられた光学式センサによって構成され、対向する光学式センサの一方が光信号を発し、対向する光学式センサの他方が光信号を受けることにより金属帯の端部の位置を検出するエッジ検出センサも知られている（例えば、下記特許文献３参照）。 In addition, it is provided in the hot dipping equipment and is composed of optical sensors that are displaceable along the plate width direction of the metal band on both sides of the upper part of the wiping nozzle in order to detect the positions of both ends of the metal band. Also known is an edge detection sensor that detects the position of the end of a metal strip by one of the optical sensors that emits an optical signal and the other of the opposing optical sensors receives the optical signal (for example, the following patent document) 3).
　また、溶融亜鉛浴（溶融金属めっき浴）を通った後、ガスの吹付けによって溶融金属の付着量が調整され、その後合金化処理炉を通った鋼帯の合金化程度を測定するために、合金化処理炉出側のロールの近傍に照明装置とＩＴＶカメラを光軸がロール上の鋼帯に向くように配置した合金化度測定装置において、エッジ検出部によりＩＴＶカメラによって撮影した画像の信号から１ライン分の輝度情報を読み込んで鋼帯の両端のエッジ位置を検出するものも公知となっている（例えば、下記特許文献４参照）。 In addition, after passing through a molten zinc bath (molten metal plating bath), the amount of adhesion of the molten metal is adjusted by gas blowing, and then to measure the degree of alloying of the steel strip through the alloying furnace, In an alloying degree measuring apparatus in which an illuminating device and an ITV camera are arranged in the vicinity of the roll on the exit side of the alloying furnace so that the optical axis faces the steel strip on the roll, an image signal taken by the ITV camera by the edge detection unit Is also known in which the luminance information for one line is read to detect the edge positions at both ends of the steel strip (see, for example, Patent Document 4 below).
特開２００４－２６９９８４号公報JP 2004-269984 A 特開平５－３３２７２８号公報JP-A-5-332728 特開２０１４－１８１３７８号公報JP 2014-181378 A 特開平５－９９８４７号公報JP-A-5-99847
　しかしながら、特許文献１，３に記載されたエッジ検出手段は、高性能な発光素子及び受光素子を用いる必要があり、装置コストが掛かるという問題、また、金属めっき板を挟んで発光素子と受光素子とを配置するため、関連する電線や支持部材の配置が煩雑になるといった問題があった。 However, the edge detection means described in Patent Documents 1 and 3 require the use of a high-performance light-emitting element and light-receiving element, and there is a problem that the apparatus cost is increased. In addition, the light-emitting element and the light-receiving element are sandwiched between metal plating plates. Therefore, there is a problem that the arrangement of related electric wires and supporting members becomes complicated.
　また、特許文献２に記載された帯状材の位置検出装置は、溶融金属めっき浴に浸漬されめっき処理された鋼板（以下、金属めっき板と称する）の板端を検出するために用いる場合、溶融金属めっき浴を通った直後の金属めっき板は鏡面状となっていることから、金属めっき板と背景との区別がつきにくく、高精度に金属めっき板のエッジ位置を検出することが難しいという問題があった。 Moreover, when the position detection apparatus of the strip | belt-shaped material described in patent document 2 is used in order to detect the plate | board end of the steel plate (henceforth a metal plating plate) immersed and immersed in the molten metal plating bath, Since the metal plating plate immediately after passing through the metal plating bath has a mirror shape, it is difficult to distinguish the metal plating plate from the background, and it is difficult to detect the edge position of the metal plating plate with high accuracy. was there.
　また、特許文献４に記載されたエッジ検出部は、合金化処理炉の出側で鋼帯の両端のエッジ位置を検出することはできるものの、溶融金属めっき浴を出た直後の金属めっき板のエッジ位置検出に適用した場合、鋼帯の両端のエッジ位置を検出することが困難であるという問題があった。これは、上述した通り溶融金属めっき浴を通った直後の金属めっき板は鏡面状となっており、照明装置から照射された光が鏡面反射されるためである。すなわち、照明装置として一般的に使用されるスポット照明等を用いた場合にはその正反射光が画像中に点状で現れ、金属めっき板のエッジ部分で反射された照明装置の光の正反射光をＩＴＶカメラで撮像することが困難となるのである。また、特許文献４は、反射光が正反射のみでなく広がりをもった反射光、すなわち、乱反射していることが図３に示されており、反射面となる鋼帯の表面が鏡面状ではないことが分かる。鏡面ではないものを対象にした反射光の検出では、広い角度から反射光を受光できるため、反射光が撮像し難いという課題を持たず、光源も鏡面を対象とした手段となっていない。 Moreover, although the edge detection part described in patent document 4 can detect the edge position of the both ends of a steel strip at the exit side of an alloying processing furnace, it is the metal plating board immediately after leaving a molten metal plating bath. When applied to edge position detection, there is a problem that it is difficult to detect edge positions at both ends of the steel strip. This is because, as described above, the metal plating plate immediately after passing through the molten metal plating bath has a mirror shape, and the light irradiated from the lighting device is specularly reflected. That is, when spot illumination or the like generally used as an illuminating device is used, the specularly reflected light appears as dots in the image, and the specular reflection of the light from the illuminating device reflected at the edge portion of the metal plating plate This makes it difficult to capture light with an ITV camera. Patent Document 4 shows that reflected light is not only specularly reflected but also broadly reflected, that is, irregularly reflected. FIG. 3 shows that the surface of the steel strip serving as the reflecting surface is mirror-like. I understand that there is no. In the detection of the reflected light targeting a non-mirror surface, the reflected light can be received from a wide angle, so there is no problem that it is difficult to capture the reflected light, and the light source is not a means for the mirror surface.
　このようなことから本発明は、溶融金属槽中に浸漬され引き上げられた鋼板の板端を簡素な構成で高精度に検出することを可能とした溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法を提供することを目的とする。 Accordingly, the present invention provides a plate edge detecting device and a plate edge of a molten metal plating facility capable of detecting a plate end of a steel plate immersed and pulled up in a molten metal tank with a simple configuration with high accuracy. An object is to provide a detection method.
　上記の課題を解決するための本発明に係る溶融金属めっき設備の板エッジ検出装置は、
　溶融金属槽から引き上げられた鋼板の板エッジ位置を検出する溶融金属めっき設備の板エッジ検出装置であって、
　前記鋼板の板幅方向に沿って延び、前記鋼板に対向配置される光源と、
　前記鋼板に対して前記光源と同一側に配置され、前記鋼板の少なくとも板エッジを含む領域によって鏡面反射される前記光源の正反射光を受光する受光部と、
　前記受光部により受光した情報に基づき前記鋼板により鏡面反射される前記光源の正反射光が途切れる位置を前記鋼板のエッジ位置として特定する解析部と
を備える
ことを特徴とする。 In order to solve the above problems, a plate edge detection device for a molten metal plating facility according to the present invention,
A plate edge detection device for a molten metal plating facility for detecting a plate edge position of a steel plate pulled up from a molten metal tank,
A light source that extends along the plate width direction of the steel plate and is disposed opposite to the steel plate,
A light receiving portion that is disposed on the same side as the light source with respect to the steel plate, and receives specularly reflected light of the light source that is specularly reflected by a region including at least a plate edge of the steel plate;
And an analysis unit that identifies, as an edge position of the steel plate, a position where the specularly reflected light of the light source that is specularly reflected by the steel plate is interrupted based on information received by the light receiving unit.
　また、上記の課題を解決するための本発明に係る溶融金属めっき設備の板エッジ検出方法は、
　溶融金属槽から引き上げられた鋼板の板エッジ位置を検出する溶融金属めっき設備の板エッジ検出方法であって、
　前記鋼板の板幅方向に沿って延び、前記鋼板に対向配置される光源と、前記鋼板に対して前記光源と同一側に対向されて前記鋼板の少なくとも板エッジを含む領域によって鏡面反射される前記光源の正反射光を受光する受光部とを設け、
　前記受光部により受光した情報に基づき前記鋼板により鏡面反射される前記光源の正反射光が途切れる位置を前記鋼板のエッジ位置として特定する
ことを特徴とする。 Moreover, the plate edge detection method of the molten metal plating equipment according to the present invention for solving the above problems is
A plate edge detection method of a molten metal plating facility for detecting a plate edge position of a steel plate pulled up from a molten metal tank,
The light source that extends along the plate width direction of the steel plate and is disposed opposite to the steel plate, and is specularly reflected by a region that is opposed to the light source on the same side as the light source and includes at least a plate edge of the steel plate. A light receiving portion for receiving the regular reflection light of the light source;
The position at which the specularly reflected light of the light source that is specularly reflected by the steel plate is interrupted based on the information received by the light receiving unit is specified as the edge position of the steel plate.
　本発明に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法によれば、溶融金属槽中に浸漬され引き上げられた鋼板の板端を簡素な構成で高精度に検出することができる。 According to the plate edge detection apparatus and the plate edge detection method of the molten metal plating facility according to the present invention, the plate edge of the steel plate immersed and pulled up in the molten metal tank can be detected with a simple configuration with high accuracy.
本発明の実施例１に係る溶融金属めっき設備の板エッジ検出装置の設置例を示す模式図である。It is a schematic diagram which shows the example of installation of the plate edge detection apparatus of the molten metal plating equipment which concerns on Example 1 of this invention. 本発明の実施例１に係る溶融金属めっき設備の板エッジ検出装置を模式的に示す側面図である。It is a side view which shows typically the board edge detection apparatus of the molten metal plating equipment which concerns on Example 1 of this invention. 本発明の実施例１に係る溶融金属めっき設備の板エッジ検出装置を模式的に示す上面図である。It is a top view which shows typically the plate edge detection apparatus of the molten metal plating equipment which concerns on Example 1 of this invention. 本発明の実施例１におけるライン照明とカメラの位置関係を説明する模式図である。It is a schematic diagram explaining the positional relationship of the line illumination and camera in Example 1 of this invention. 本発明の実施例１におけるライン照明とカメラの位置関係を説明する他の模式図である。It is another schematic diagram explaining the positional relationship of the line illumination and camera in Example 1 of this invention. 図６（ａ）はカメラによって取得した画像の一例を示す模式図、図６（ｂ）はカメラによって取得した画像の他の例を示す模式図である。FIG. 6A is a schematic diagram illustrating an example of an image acquired by the camera, and FIG. 6B is a schematic diagram illustrating another example of an image acquired by the camera. 本発明の実施例２に係る溶融金属めっき設備の板エッジ検出装置の上面図である。It is a top view of the plate edge detection apparatus of the molten metal plating equipment which concerns on Example 2 of this invention. 図８（ａ）はカメラによって取得した画像の一例を示す模式図、図８（ｂ）はカメラによって取得した画像の他の例を示す模式図である。FIG. 8A is a schematic diagram illustrating an example of an image acquired by the camera, and FIG. 8B is a schematic diagram illustrating another example of an image acquired by the camera. 本発明の実施例３に係る溶融金属めっき設備の板エッジ検出装置の側面図である。It is a side view of the board edge detection apparatus of the molten metal plating equipment which concerns on Example 3 of this invention. 図１０（ａ）はカメラによって取得した画像の一例を示す模式図、図１０（ｂ）はカメラによって取得した画像の他の例を示す模式図である。FIG. 10A is a schematic diagram illustrating an example of an image acquired by a camera, and FIG. 10B is a schematic diagram illustrating another example of an image acquired by the camera. 本発明の実施例４に係る溶融金属めっき設備の板エッジ検出装置の上面図である。It is a top view of the plate edge detection apparatus of the molten metal plating equipment which concerns on Example 4 of this invention. 図１２（ａ）はカメラによって取得した画像の一例を示す模式図、図１２（ｂ）はカメラによって取得した他の画像を示す模式図である。FIG. 12A is a schematic diagram illustrating an example of an image acquired by the camera, and FIG. 12B is a schematic diagram illustrating another image acquired by the camera.
　以下、図面を用いて本発明に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法について説明する。 Hereinafter, a plate edge detection apparatus and a plate edge detection method of a molten metal plating facility according to the present invention will be described with reference to the drawings.
　図１から図１０を用いて本発明の実施例１に係る溶融金属めっき設備の板エッジ検出装置の詳細を説明する。 Details of the plate edge detection apparatus of the molten metal plating facility according to Embodiment 1 of the present invention will be described with reference to FIGS.
　図１に示すように、本実施例の溶融金属めっき設備において、連続的に搬送される鋼板１’は溶融金属めっき浴（溶融金属槽）１１内に貯留された高温の溶融金属１３中に浸漬された後、溶融金属めっき浴１１内に配設されたシンクロール１２によって鉛直上方に搬送方向を転換され、上方に引き上げられる。その後、めっき処理された鋼板（以下、金属めっき板と称する）１は、制振装置１４によって振動を抑制された状態で、ワイピング装置１５から噴出されるガスにより余剰に付着した溶融金属を除去される。 As shown in FIG. 1, in the molten metal plating facility of this embodiment, a continuously conveyed steel plate 1 ′ is immersed in a hot molten metal 13 stored in a molten metal plating bath (molten metal tank) 11. After that, the transport direction is changed vertically upward by the sink roll 12 disposed in the molten metal plating bath 11 and pulled upward. Thereafter, the plated steel plate (hereinafter referred to as a metal plating plate) 1 is removed of excess molten metal adhering to the gas ejected from the wiping device 15 while vibration is suppressed by the vibration damping device 14. The
　ここで、本実施例において制振装置１４は、図１及び図２に示すように上下対でかつ金属めっき板１の板幅方向Ｗに複数個配設された電磁石（非接触式の板形状矯正装置）１４ａおよび板厚方向位置検出手段としての渦電流式の変位センサ（板形状センサ）１４ｂを備え、ワイピング装置１５の上方に配置されている。 Here, in the present embodiment, the vibration damping device 14 includes a plurality of electromagnets (non-contact type plate shape) arranged in the upper and lower pairs and in the plate width direction W of the metal plating plate 1 as shown in FIGS. Correction device) 14a and an eddy current type displacement sensor (plate shape sensor) 14b as a plate thickness direction position detecting means are provided and arranged above wiping device 15.
　また、ワイピング装置１５は、溶融金属めっき浴１１から出て上方に向けて走行する金属めっき板１の表，裏面にガスを吹き付けてめっき付着量を制御するワイピングノズルを備えている。 Further, the wiping device 15 includes a wiping nozzle that controls the amount of plating adhesion by blowing gas to the front and back surfaces of the metal plating plate 1 that travels upward from the molten metal plating bath 11.
　さらに本実施例において、溶融金属めっき設備には、図１～図３に示すように板エッジ検出装置として二台のカメラ（受光部）１６と、ライン照明（光源）１７と、画像処理部（解析部）１８とが設けられている。 Further, in the present embodiment, the molten metal plating facility includes two cameras (light receiving units) 16, a line illumination (light source) 17, and an image processing unit (plate processing) as plate edge detection devices as shown in FIGS. Analysis unit) 18 is provided.
　カメラ１６は、例えば、ＣＣＤカメラとレンズとを備え、金属めっき板１の板エッジ１Ａおよびその周囲を金属めっき板１の正面側（金属めっき板１の表面又は裏面に対向する位置）から撮影するように設置される。カメラ１６は、例えば、金属めっき板１から１５００～２３００［ｍｍ］程度離間した位置に配置される。なお、二台のカメラ１６は、金属めっき板１に対して同じ側に相互に同一の高さであって且つライン照明１７とは異なる高さに設置される。カメラ１６は、金属めっき板１によって鏡面反射されたライン照明１７の正反射光を撮影する。 The camera 16 includes, for example, a CCD camera and a lens, and photographs the plate edge 1A of the metal plating plate 1 and its periphery from the front side of the metal plating plate 1 (position facing the front surface or the back surface of the metal plating plate 1). Installed. For example, the camera 16 is disposed at a position spaced apart from the metal plating plate 1 by about 1500 to 2300 [mm]. The two cameras 16 are installed on the same side with respect to the metal plating plate 1 at the same height and different from the line illumination 17. The camera 16 photographs the specularly reflected light of the line illumination 17 that is specularly reflected by the metal plating plate 1.
　また、本実施例においてライン照明１７は、複数のＬＥＤ１７ａを一列に並べることによってライン状の照明光が得られるように構成されたものとする。当該ライン照明１７は、金属めっき板１に対してカメラ１６と同じ側に、長手方向が金属めっき板１の板幅方向Ｗに沿うように設置される。また、ライン照明１７は、カメラ１６によって撮影した画像中、板幅方向外側については金属めっき板１の板エッジ１Ａまで、板幅方向中央側については画像の端部までライン照明１７の正反射光が撮像されるようにその長さ及び位置を設定される。 Further, in the present embodiment, the line illumination 17 is configured to obtain line-shaped illumination light by arranging a plurality of LEDs 17a in a line. The line illumination 17 is installed on the same side as the camera 16 with respect to the metal plating plate 1 so that the longitudinal direction is along the plate width direction W of the metal plating plate 1. Further, the line illumination 17 is a regular reflected light of the line illumination 17 in the image taken by the camera 16 up to the plate edge 1A of the metal plating plate 1 on the outer side in the plate width direction and to the end of the image on the center side in the plate width direction. The length and position are set so that the image is captured.
　以下、図４及び図５を用いてライン照明１７の設置位置についてより詳しく説明する。ライン照明１７は、少なくとも当該ライン照明１７の板幅方向外側の端部から照射された照明光の金属めっき板１の板エッジ１Ａによる正反射光がカメラ１６に入射するように配置する必要がある。 Hereinafter, the installation position of the line illumination 17 will be described in more detail with reference to FIGS. 4 and 5. The line illumination 17 needs to be arranged so that the specularly reflected light from the plate edge 1A of the metal plating plate 1 of the illumination light irradiated from at least the end in the plate width direction of the line illumination 17 enters the camera 16. .
　すなわち、図４に示すように金属めっき板１が平板状であり湾曲していないと仮定した場合、カメラ１６と金属めっき板１の板エッジ１Ａとを結ぶ直線Ｌ１に対し、金属めっき板１の板エッジ１Ａに垂直な直線Ｌａに線対称な直線Ｌ１'よりも板幅方向外側から板幅方向中央側へ向けてライン照明１７を配置すればよい。これにより、カメラ１６で金属めっき板１の板エッジ１Ａを撮像した際、図６（ａ）に示すようにカメラ１６によって撮像した画像に、金属めっき板１の板エッジ１Ａまでライン照明１７の照明光が映し出され、金属めっき板１の板エッジ１Ａの位置（以下、板エッジ位置という）１ａを検出することができる。 That is, when it is assumed that the metal plating plate 1 is flat and not curved as shown in FIG. 4, the metal plating plate 1 has a straight line L <b> 1 connecting the camera 16 and the plate edge 1 </ b> A of the metal plating plate 1. The line illumination 17 may be arranged from the outside in the plate width direction toward the center side in the plate width direction with respect to the straight line L1 ′ that is symmetric with respect to the straight line La perpendicular to the plate edge 1A. As a result, when the plate edge 1 </ b> A of the metal plating plate 1 is imaged by the camera 16, the line illumination 17 is illuminated to the plate edge 1 </ b> A of the metal plating plate 1 in the image captured by the camera 16 as shown in FIG. The light is projected, and the position (hereinafter referred to as the plate edge position) 1a of the plate edge 1A of the metal plating plate 1 can be detected.
　これに対し、図５に示すように金属めっき板１の板エッジ１Ａがカメラ１６から離反する方向に湾曲していると仮定した場合、図中破線で示すように、カメラ１６と金属めっき板１の板エッジ１Ａとを結ぶ直線Ｌ２に対し、金属めっき板１の板エッジ１Ａを挟んで板エッジ１Ａに垂直な直線Ｌｂに線対称な直線Ｌ２'よりも板幅方向外側から板幅方向中央側へ向けてライン照明１７を配置する必要がある。これは、ライン照明１７を図中実線で示す位置に配置した場合、図６（ｂ）に示すように、カメラ１６によって撮像した画像中、ライン照明１７の端部が金属めっき板１の板エッジ位置１ａよりも板幅方向中央側に映し出されることとなり、金属めっき板１の板エッジ位置１ａを検出することができないためである。 On the other hand, when it is assumed that the plate edge 1A of the metal plating plate 1 is curved away from the camera 16 as shown in FIG. 5, the camera 16 and the metal plating plate 1 as shown by the broken line in the drawing. With respect to the straight line L2 connecting the plate edge 1A of the metal plate 1 with respect to the straight line L2 'symmetrical to the straight line Lb perpendicular to the plate edge 1A across the plate edge 1A, the plate width direction outer side from the plate width direction outer side It is necessary to arrange the line illumination 17 toward the front. This is because, when the line illumination 17 is arranged at a position indicated by a solid line in the figure, the end of the line illumination 17 is the plate edge of the metal plating plate 1 in the image captured by the camera 16 as shown in FIG. This is because the image is projected closer to the center in the plate width direction than the position 1a, and the plate edge position 1a of the metal plated plate 1 cannot be detected.
　そのため、本実施例では平板状で湾曲していない状態の金属めっき板１の板エッジ１Ａによって反射される正反射光をカメラ１６によって撮像することができる位置よりもさらに板幅方向外側までライン照明１７を配置するものとする。これにより、金属めっき板１の板エッジ１Ａがライン照明１７から離反する方向に湾曲していたとしても、図６（ａ）に示すように金属めっき板１の板エッジ１Ａによって反射される正反射光をカメラ１６によって確実に撮像することができる。 For this reason, in this embodiment, the line illumination extends further to the outside in the plate width direction than the position at which the camera 16 can capture the specularly reflected light reflected by the plate edge 1A of the flat plate-like metal plating plate 1 that is not curved. 17 is arranged. Thereby, even if the plate edge 1A of the metal plating plate 1 is curved in a direction away from the line illumination 17, the regular reflection reflected by the plate edge 1A of the metal plating plate 1 as shown in FIG. The light can be reliably imaged by the camera 16.
　また、画像処理部１８は、カメラ１６によって撮影された図６（ａ）に示すような画像の情報に基づいて金属めっき板１の板エッジ位置１ａを求める。すなわち、カメラ１６によって撮影した画像には、板エッジ位置１ａが、ライン照明１７の光が途切れる位置として現れる。画像処理部１８は、この画像中のライン照明１７の光が途切れる位置を既知の手法により実座標に変換することで、金属めっき板１の板エッジ位置１ａを求める。 Further, the image processing unit 18 obtains the plate edge position 1a of the metal plating plate 1 based on the information of the image as shown in FIG. That is, in the image photographed by the camera 16, the plate edge position 1a appears as a position where the light of the line illumination 17 is interrupted. The image processing unit 18 obtains the plate edge position 1a of the metal plating plate 1 by converting the position where the light of the line illumination 17 in the image is interrupted into real coordinates by a known method.
　なお、例えば図７に示すように、金属めっき板１の板厚方向の位置がずれると、実際には板幅方向Ｗの板エッジ位置１ａが同一であったとしても、金属めっき板１の板厚方向の位置によって板エッジ位置１ａの画像上の位置が変化する。 For example, as shown in FIG. 7, if the position of the metal plating plate 1 in the plate thickness direction is shifted, even if the plate edge position 1 a in the plate width direction W is actually the same, the plate of the metal plating plate 1. The position of the plate edge position 1a on the image changes depending on the position in the thickness direction.
　図８（ａ）に図７に実線で示すように金属めっき板１がカメラ１６から距離ｄの位置にある場合に取得した画像例、図８（ｂ）に図７に一点鎖線で示すように金属めっき板１がカメラ１６から距離ｄ’（ｄ’＞ｄ）の位置にある場合に取得した画像例を示す。図８（ａ）に示す画像上の板エッジ位置１ａに対し、図８（ｂ）に示す画像上の板エッジ位置１ａは、板幅方向Ｗの中央側に移動して見える。このように金属めっき板１の板厚方向の位置にずれが生じると、金属めっき板１とカメラ１６との位置関係によっては画像処理部１８によって求める板エッジ位置１ａの検出結果に誤差が生じる場合がある。なお、図８中に示すＡは、ライン照明１７の正反射光である。 FIG. 8A shows an example of an image obtained when the metal plating plate 1 is located at a distance d from the camera 16 as shown by a solid line in FIG. 7, and FIG. The example of an image acquired when the metal plating plate 1 exists in the position of distance d '(d'> d) from the camera 16 is shown. The plate edge position 1a on the image shown in FIG. 8B appears to move to the center side in the plate width direction W with respect to the plate edge position 1a on the image shown in FIG. When the position of the metal plating plate 1 in the thickness direction is displaced as described above, an error may occur in the detection result of the plate edge position 1a obtained by the image processing unit 18 depending on the positional relationship between the metal plating plate 1 and the camera 16. There is. Note that A shown in FIG. 8 is regular reflection light of the line illumination 17.
　そのため本実施例では、カメラ１６と金属めっき板１との板厚方向の距離が計測誤差に影響を及ぼすことを防止するため、制振装置１４の変位センサ１４ｂから金属めっき板１の板厚方向の位置を取得し、画像処理部１８において画像から求めた板エッジ位置１ａの検出結果の補正を行う。 Therefore, in this embodiment, in order to prevent the distance in the thickness direction between the camera 16 and the metal plating plate 1 from affecting the measurement error, the displacement sensor 14b of the vibration damping device 14 is used to detect the metal plating plate 1 in the thickness direction. And the image processing unit 18 corrects the detection result of the plate edge position 1a obtained from the image.
　以上に説明した本実施例に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法によれば、金属めっき板１の表面で鏡面反射されるライン照明１７の正反射光をカメラ１６によって撮像した画像から、金属めっき板１の板エッジ位置１ａを検出することが可能となる。 According to the plate edge detecting device and the plate edge detecting method of the molten metal plating facility according to the present embodiment described above, the regular reflected light of the line illumination 17 that is specularly reflected on the surface of the metal plated plate 1 is imaged by the camera 16. It is possible to detect the plate edge position 1a of the metal plating plate 1 from the obtained image.
　ここで、金属めっき板１は鏡面状態となっており散乱光が極めて少ないため、カメラ１６によって撮像した画像には金属めっき板１によるライン照明１７の正反射光が鮮明に映し出される。すなわち、画像中、金属めっき板１部分にはライン照明１７の反射光が強い信号（明るい信号）として映し出され、背景部分にはライン照明１７の反射光が映し出されたとしても弱い信号（暗い信号）となるため、金属めっき板１部分と背景部分の相違が明確になる。これにより、高性能の発光素子や受光素子を用いることなく、入手しやすい安価な光源及び受光部を用いて金属めっき板１の板エッジ位置１ａを検出することが可能になる。 Here, since the metal plating plate 1 is in a mirror state and has very little scattered light, the regular reflection light of the line illumination 17 by the metal plating plate 1 is clearly displayed in the image captured by the camera 16. That is, in the image, the reflected light of the line illumination 17 is projected as a strong signal (bright signal) on the metal plated plate 1 portion, and the weak signal (dark signal) even if the reflected light of the line illumination 17 is projected on the background portion. Therefore, the difference between the metal plated plate 1 portion and the background portion becomes clear. Accordingly, it is possible to detect the plate edge position 1a of the metal plating plate 1 using an inexpensive light source and light receiving unit that are easily available without using a high-performance light emitting element or light receiving element.
　また、金属めっき板１に対して、同一面側にカメラ１６及びライン照明１７を配置するため、これらに接続される電線やこれらを支持する支持部材の配置が簡便且つ安価となり、さらに、後付工事やメンテナンスが容易になる。 Further, since the camera 16 and the line illumination 17 are arranged on the same surface side with respect to the metal plating plate 1, the arrangement of the electric wires connected to these and the supporting members that support them becomes simple and inexpensive, and the retrofit Construction and maintenance become easy.
　さらに加えて、金属めっき板１の板エッジ位置１ａを高精度に検出することができるため、検出した板エッジ位置１ａの情報を制御上有用な情報として利用することができる。
　例えば、特開2015-218345号公報に開示されているようなワイピング装置１５のワイピングノズルの気流吹き出しを適切な幅で行うよう制御することが可能になる。
　また、例えば特許第5632596号公報に開示されているような電磁石１４ａを利用した制振装置１４の位置を高精度に金属めっき板１の板エッジ１Ａの位置に移動させるよう制御することが可能になる。また、板幅変更や板の蛇行に対応して制振装置１４の電磁石１４ａの位置を確実に板エッジ１Ａに追従させることができる。これにより、金属めっき板１の板反りが低減し、均一なめっき厚にすることが可能となる。 In addition, since the plate edge position 1a of the metal plating plate 1 can be detected with high accuracy, the information of the detected plate edge position 1a can be used as information useful for control.
For example, it is possible to perform control so that the airflow blowing of the wiping nozzle of the wiping device 15 as disclosed in JP-A-2015-218345 is performed with an appropriate width.
In addition, for example, the position of the vibration damping device 14 using the electromagnet 14a as disclosed in Japanese Patent No. 5632596 can be controlled to be moved to the position of the plate edge 1A of the metal plating plate 1 with high accuracy. Become. Further, the position of the electromagnet 14a of the vibration damping device 14 can be made to follow the plate edge 1A in response to the change in the plate width or the meandering of the plate. Thereby, the board curvature of the metal plating plate 1 can be reduced, and a uniform plating thickness can be achieved.
　また、ワイピング装置１５において表裏のワイピング用ガスが衝突することにより板エッジ１Ａのめっき厚が厚くなったり（板エッジスプラッシュ）、表裏のワイピング用ガスが衝突することにより騒音が発生したりすることを防止するために、例えば特許第5552415号公報に開示されているように、金属めっき板１の板エッジ１Ａにバッフルプレートや可変幅マスクを追従させる手法が公知となっている。本実施例では、このような場合にバッフルプレートや可変幅マスクによるガス噴出し領域の境界位置制御を高精度に行うことが可能となり、板エッジスプラッシュや騒音の発生を低減することができる。 Further, the wiping device 15 may cause the wiping gas on the front and back to collide to increase the plating thickness of the plate edge 1A (plate edge splash), and noise may be generated due to the collision of the wiping gas on the front and back. In order to prevent this, for example, as disclosed in Japanese Patent No. 5552415, a method of causing a baffle plate or a variable width mask to follow the plate edge 1A of the metal plating plate 1 is known. In this embodiment, in such a case, the boundary position control of the gas ejection area by the baffle plate or variable width mask can be performed with high accuracy, and the occurrence of plate edge splash and noise can be reduced.
　また、金属めっき板１とワイピング装置１５のノズルとの間の距離を小さくすることができ、これによりワイピング能力が向上し、均一な薄金属めっき板を高ライン速度で製造できることとなり、生産性の向上及びコストダウンにもつながる。 In addition, the distance between the metal plating plate 1 and the nozzle of the wiping device 15 can be reduced, thereby improving the wiping capability and producing a uniform thin metal plating plate at a high line speed. It leads to improvement and cost reduction.
　また、上方に引き上げられ移動している金属めっき板１は、設備の運転状態や金属めっき板１自体の状態によって、板厚方向の位置がわずかにずれることがある。このようなずれを考慮しない状態で、左右のカメラ１６によって撮影した画像の情報のみで板エッジ位置１ａを特定すると、実際よりも左右方向に僅かにずれた位置を板エッジ位置１ａとして出力することが考えられる。これに対し、本実施例では変位センサ１４ｂにより検出される金属めっき板１の板厚方向の位置情報に基づいて板エッジ位置１ａを補正することにより、より正確な板エッジ位置１ａを取得することができる。更に、本実施例のように、制振装置１４として電磁石１４ａと変位センサ１４ｂとを組み合わせた装置がすでに設けてある設備では、その制振装置１４の変位センサ１４ｂからの位置情報に基づいて、金属めっき板１のエッジの位置情報を補正することができるなど、本実施例の溶融金属めっき設備の板エッジ検出装置は、既存の設備に後付けしやすいという利点もある。 Further, the position of the metal plating plate 1 that has been lifted and moved upward may slightly shift depending on the operation state of the equipment or the state of the metal plating plate 1 itself. If the plate edge position 1a is specified based only on the information of the images taken by the left and right cameras 16 without considering such a shift, a position slightly shifted in the left-right direction from the actual position is output as the plate edge position 1a. Can be considered. On the other hand, in this embodiment, a more accurate plate edge position 1a is obtained by correcting the plate edge position 1a based on the position information in the plate thickness direction of the metal plated plate 1 detected by the displacement sensor 14b. Can do. Further, as in the present embodiment, in a facility in which a device combining the electromagnet 14a and the displacement sensor 14b is already provided as the vibration damping device 14, based on the position information from the displacement sensor 14b of the vibration damping device 14, The plate edge detection device of the molten metal plating facility of this embodiment has an advantage that it can be easily retrofitted to existing facilities, such as being able to correct the position information of the edge of the metal plating plate 1.
　なお、板厚方向位置検出手段としては、上述した変位センサ１４ｂに限らず、レーザ変位計、超音波変位計などの非接触で金属めっき板１の板厚方向の位置を検出することが可能な変位計を用いることができる。 Note that the plate thickness direction position detecting means is not limited to the above-described displacement sensor 14b, and the plate thickness direction position of the metal plating plate 1 can be detected in a non-contact manner such as a laser displacement meter and an ultrasonic displacement meter. A displacement meter can be used.
　また、金属めっき板１全体が板厚方向や板幅方向Ｗにずれること以外に、金属めっき板１が板厚方向に傾斜をもったり、湾曲したりする場合がある。本実施例では金属めっき板１の板エッジ１Ａ部分が傾斜したり曲がったりすることを想定して、ライン照明１７の端部の位置を、金属めっき板１が平板状であり湾曲していない場合にライン照明１７の端部の正反射光がちょうど板エッジ１Ａにより反射されてカメラ１６に入射する位置（図４参照）に対し、さらに板幅方向外側まで配置する構成としている。これにより、金属めっき板１のエッジ部分に傾斜や湾曲がない場合も、傾斜や湾曲が多少ある場合も、確実に金属めっき板１の板エッジ位置１ａを検出することができる。 In addition to the fact that the entire metal plating plate 1 is displaced in the plate thickness direction or the plate width direction W, the metal plating plate 1 may be inclined or curved in the plate thickness direction. In this embodiment, assuming that the plate edge 1A portion of the metal plating plate 1 is inclined or bent, the position of the end of the line illumination 17 is the case where the metal plating plate 1 is flat and not curved. In addition, the specularly reflected light at the end of the line illumination 17 is just reflected by the plate edge 1A and incident on the camera 16 (see FIG. 4), and is further arranged to the outside in the plate width direction. As a result, the plate edge position 1a of the metal plating plate 1 can be reliably detected regardless of whether the edge portion of the metal plating plate 1 is not inclined or curved, or when there is some inclination or curvature.
　なお、受光部及び光源としては、上述したカメラ１６、ライン照明１７に限定されるものではなく、例えば、受光部は汎用的なカメラ、光源は蛍光灯や冷陰極管とするなど、本発明の趣旨を逸脱しない範囲で種々の変更が可能である。ライン照明１７として照度の高い照明機器を用いれば、カメラ１６の露光時間が短くて済み、高速で移動する金属めっき板１により好適に対応することができる。 The light receiving unit and the light source are not limited to the camera 16 and the line illumination 17 described above. For example, the light receiving unit is a general-purpose camera, and the light source is a fluorescent lamp or a cold cathode tube. Various changes can be made without departing from the spirit of the invention. If an illumination device with high illuminance is used as the line illumination 17, the exposure time of the camera 16 can be shortened, and the metal plating plate 1 that moves at high speed can be suitably handled.
　図９および図１０を用いて本発明の実施例２に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法について説明する。 A plate edge detection apparatus and a plate edge detection method for a molten metal plating facility according to Embodiment 2 of the present invention will be described with reference to FIGS.
　本実施例に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法は、板厚方向位置検出手段として、実施例１の変位センサ１４ｂに代えて、図９に示すように、ライン照明１７とカメラ１６とを上下方向に所定距離Ｈだけ離間して配置するものである。 The plate edge detection device and the plate edge detection method of the molten metal plating facility according to the present embodiment are replaced with the line illumination 17 as shown in FIG. 9 as the plate thickness direction position detection means, instead of the displacement sensor 14b of the first embodiment. And the camera 16 are spaced apart by a predetermined distance H in the vertical direction.
　図１０（ａ）に、図９に実線で示す位置に金属めっき板１がある場合に取得される画像の例、図１０（ｂ）に、図９に一点鎖線で示す位置に金属めっき板１がある場合に取得される画像の例を示す。図１０（ａ）及び図１０（ｂ）に示すように、金属めっき板１のカメラ１６からの距離に応じて画像中に映し出されるライン照明１７の正反射光Ａの高さは変化する。 FIG. 10A shows an example of an image obtained when the metal plating plate 1 is located at the position indicated by the solid line in FIG. 9. FIG. 10B shows the metal plating plate 1 located at the position indicated by the alternate long and short dash line in FIG. The example of the image acquired when there exists is shown. As shown in FIGS. 10A and 10B, the height of the regular reflection light A of the line illumination 17 displayed in the image changes according to the distance of the metal plated plate 1 from the camera 16.
　このことを利用して、本実施例では画像処理部１８において、ライン照明１７とカメラ１６との距離Ｈ、及び、カメラ１６によって撮影した画像中におけるライン照明１７の正反射光の高さ位置から金属めっき板１の板厚方向の位置を算出し、算出した位置に基づいて画像から求めた板エッジ位置１ａの検出結果の補正を行う。 By utilizing this, in the present embodiment, in the image processing unit 18, from the distance H between the line illumination 17 and the camera 16 and the height position of the regular reflection light of the line illumination 17 in the image taken by the camera 16. The position in the plate thickness direction of the metal plating plate 1 is calculated, and the detection result of the plate edge position 1a obtained from the image is corrected based on the calculated position.
　その他の構成は実施例１において説明したものと概ね同様であり、実施例１と重複する説明は省略する。 Other configurations are substantially the same as those described in the first embodiment, and the description overlapping with the first embodiment is omitted.
　このように構成される本実施例に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法によれば、実施例１に係る発明に比較して、受光部として、左右方向だけでなく、上下方向の情報も得られるカメラ１６を採用し、カメラ１６とライン照明１７とを上下方向で所定距離Ｈだけ異なる位置に配置することにより、金属めっき板１からの正反射光が、金属めっき板１のカメラ１６からの距離に応じて画像中（カメラ１６の視野内）で上下にずれることを利用して、カメラ１６とは別に板厚方向検出手段を設けることなく、金属めっき板１の幅方向の位置情報に加えて板厚方向の位置情報をも取得することが可能になる。 According to the plate edge detection device and the plate edge detection method of the molten metal plating facility according to the present embodiment configured as described above, as compared with the invention according to the first embodiment, as the light receiving unit, not only in the left-right direction, By adopting a camera 16 that can also obtain information in the vertical direction, and disposing the camera 16 and the line illumination 17 at positions different from each other by a predetermined distance H in the vertical direction, the specularly reflected light from the metal plating plate 1 is converted into the metal plating plate. The width of the metal-plated plate 1 can be obtained without providing a plate thickness direction detection means separately from the camera 16 by utilizing the vertical displacement in the image (within the field of view of the camera 16) according to the distance from the one camera 16. In addition to the position information in the direction, position information in the thickness direction can be acquired.
　図１１および図１２を用いて本発明の実施例３に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法について詳細を説明する。 Details of the plate edge detection apparatus and the plate edge detection method of the molten metal plating facility according to the third embodiment of the present invention will be described with reference to FIGS.
　図１１に示すように、本実施例に係る溶融金属めっき設備の板エッジ検出装置は、実施例１の変位センサ１４ｂに代えて、板厚方向位置検出手段として金属めっき板１の板幅方向両側の各板エッジ１Ａに対し、一台目のカメラ１６に加えて二台目のカメラ１９を設けるものである。 As shown in FIG. 11, the plate edge detection apparatus of the molten metal plating facility according to the present embodiment replaces the displacement sensor 14b of the first embodiment with both sides of the metal plating plate 1 as the plate thickness direction position detecting means. In addition to the first camera 16, a second camera 19 is provided for each plate edge 1A.
　具体的には、二台目のカメラ１９は一台目のカメラ１６と同一のものとし、本実施例ではこれら二台のカメラ１６，１９を、板幅方向Ｗに沿って、金属めっき板１の板幅の変更や金属めっき板１の蛇行によって生じる板エッジ１Ａの変動範囲ｗの両端に対応する位置に設置する。カメラ１６，１９は同一の高さで、当該カメラ１６，１９の光軸が平板状で湾曲していない状態の金属めっき板１の板表面に直交するように配設される。このようにカメラ１６，１９の光軸を金属めっき板１の板表面に直交させれば、板幅方向Ｗのセンサ分解能を向上させることができる。 Specifically, the second camera 19 is the same as the first camera 16, and in the present embodiment, these two cameras 16 and 19 are placed along the plate width direction W in the metal plated plate 1. The plate edge 1A is installed at positions corresponding to both ends of the fluctuation range w of the plate edge 1A caused by the change of the plate width or the meandering of the metal plating plate 1. The cameras 16 and 19 have the same height, and are arranged so that the optical axes of the cameras 16 and 19 are flat and not orthogonal to the plate surface of the metal plating plate 1. Thus, if the optical axes of the cameras 16 and 19 are orthogonal to the plate surface of the metal plating plate 1, the sensor resolution in the plate width direction W can be improved.
　そして、画像処理部１８において、既知の手法であるステレオ法を用いてカメラ１６，１９によってそれぞれ撮影した図１２（ａ），図１２（ｂ）に示す画像の情報に基づき、板エッジ位置１ａ及び板厚方向の位置を検出する。なお、図１２中に示すＡは、ライン照明１７の正反射光である。 Then, the image processing unit 18 uses the stereo method, which is a known method, to capture the plate edge positions 1a and 1b based on the information of the images shown in FIGS. 12 (a) and 12 (b), respectively. The position in the plate thickness direction is detected. In addition, A shown in FIG. 12 is regular reflection light of the line illumination 17.
　すなわち、本実施例では、二台のカメラ１６，１９により金属めっき板１の板エッジ１Ａを同時に撮影し、既知のステレオ法を用いて金属めっき板１の板厚方向の位置と板エッジ位置１ａとを同時に計測することにより、金属めっき板１の板厚方向の位置の変位による板エッジ位置１ａの誤差を低減する。 That is, in this embodiment, the plate edge 1A of the metal plating plate 1 is simultaneously photographed by the two cameras 16 and 19, and the position of the metal plating plate 1 in the plate thickness direction and the plate edge position 1a using a known stereo method. Are simultaneously measured, the error of the plate edge position 1a due to the displacement of the position of the metal plated plate 1 in the plate thickness direction is reduced.
　その他の構成は実施例１において説明したものと概ね同様であり、実施例１と重複する説明は省略する。 Other configurations are substantially the same as those described in the first embodiment, and the description overlapping with the first embodiment is omitted.
　このように構成される本実施例に係る溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法によれば、受光部としてカメラ１６，１９を金属めっき板１の各エッジ部分に対して板幅方向Ｗに沿って二台設けたので、いわゆるステレオ法に基づいて、金属めっき板１の板厚方向の位置情報を取得できる。 According to the plate edge detecting apparatus and the plate edge detecting method of the molten metal plating facility according to the present embodiment configured as described above, the cameras 16 and 19 are used as the light receiving portions with respect to the respective edge portions of the metal plated plate 1. Since two units are provided along the direction W, position information in the thickness direction of the metal plating plate 1 can be acquired based on a so-called stereo method.
　また、仮に一台のカメラ１６又は１９が故障した場合でも、金属めっき板１の板厚方向のずれに基づく補正はできなくなるものの、大きなずれが生じていない限り、緊急対応として、残りの一台のカメラ１９又は１６だけでも、一定レベルの精度での金属めっき板１の板エッジ位置１ａの情報を得ることができる。なお、画像処理部１８は、金属めっき板１が板厚方向にずれがないことを前提とした場合に、それぞれのカメラ１６，１９の位置ごとに決まる条件で処理を行う。 Also, even if one camera 16 or 19 fails, correction based on the displacement in the thickness direction of the metal plating plate 1 cannot be performed, but as long as there is no significant displacement, the remaining one is used as an emergency response. Only the camera 19 or 16 can obtain information on the plate edge position 1a of the metal plating plate 1 with a certain level of accuracy. Note that the image processing unit 18 performs processing under conditions determined for each position of the cameras 16 and 19 on the assumption that the metal plating plate 1 is not displaced in the thickness direction.
　本発明は、溶融金属めっき設備の板エッジ検出装置及び板エッジ検出方法に適用することができる。 The present invention can be applied to a plate edge detection device and a plate edge detection method of a molten metal plating facility.
　１　金属めっき板
　１Ａ　板エッジ
　１ａ　板エッジ位置
　１’　鋼板
　１１　溶融金属めっき浴（溶融金属槽）
　１２　シンクロール
　１３　溶融金属
　１４　制振装置
　１４ａ　電磁石
　１４ｂ　変位センサ（板厚方向位置検出手段）
　１５　ワイピング装置
　１６，１９　カメラ（受光部）
　１７　ライン照明（光源）
　１８　画像処理部（解析部） DESCRIPTION OF SYMBOLS 1 Metal plating board 1A Board edge 1a Board edge position 1 'Steel plate 11 Molten metal plating bath (molten metal tank)
12 Sink roll 13 Molten metal 14 Damping device 14a Electromagnet 14b Displacement sensor (plate thickness direction position detecting means)
15 Wiping device 16, 19 Camera (light receiving part)
17 line lighting (light source)
18 Image processing unit (analysis unit)

Claims (7)

  1. 　溶融金属槽から引き上げられた鋼板の板エッジ位置を検出する溶融金属めっき設備の板エッジ検出装置であって、
    　前記鋼板の板幅方向に沿って延び、前記鋼板に対向配置される光源と、
    　前記鋼板に対して前記光源と同一側に配置され、前記鋼板の少なくとも板エッジを含む領域によって鏡面反射される前記光源の正反射光を受光する受光部と、
    　前記受光部により受光した情報に基づき前記鋼板により鏡面反射される前記光源の正反射光が途切れる位置を前記鋼板のエッジ位置として特定する解析部と
    を備える
    ことを特徴とする溶融金属めっき設備の板エッジ検出装置。     A plate edge detection device for a molten metal plating facility for detecting a plate edge position of a steel plate pulled up from a molten metal tank,
    A light source that extends along the plate width direction of the steel plate and is disposed opposite to the steel plate,
    A light receiving portion that is disposed on the same side as the light source with respect to the steel plate, and receives specularly reflected light of the light source that is specularly reflected by a region including at least a plate edge of the steel plate;
    A plate of a molten metal plating facility, comprising: an analysis unit that identifies, as an edge position of the steel plate, a position where specular reflection light of the light source that is specularly reflected by the steel plate is interrupted based on information received by the light receiving unit Edge detection device.
  2. 　前記鋼板の板厚方向の位置を検出する板厚方向位置検出手段を備え、
    　前記解析部が、前記板厚方向位置検出手段から取得した鋼板の板厚方向の位置に基づいて、鋼板の幅方向の板エッジ位置を補正する
    ことを特徴とする請求項１記載の溶融金属めっき設備の板エッジ検出装置。     A plate thickness direction position detecting means for detecting a position in the plate thickness direction of the steel plate,
    2. The molten metal plating according to claim 1, wherein the analysis unit corrects the plate edge position in the width direction of the steel plate based on the position in the plate thickness direction of the steel plate acquired from the plate thickness direction position detection unit. Equipment edge detection equipment.
  3. 　前記板厚方向位置検出手段が、前記鋼板の走行領域を挟んで対向配置され、前記鋼板の制振を行う電磁石を有する制振装置に設けられた変位センサである
    ことを特徴とする請求項２記載の溶融金属めっき設備の板エッジ検出装置。     3. The displacement sensor provided in the damping device which has the electromagnet which controls the said plate | board thickness direction position detection means on both sides of the travel area of the said steel plate, and controls the said steel plate is characterized by the above-mentioned. The plate edge detection apparatus of the molten metal plating equipment of description.
  4. 　前記板厚方向位置検出手段が、上下に異なる位置に配置された前記光源と前記受光部とであり、
    　前記受光部が前記光源の正反射光の上下方向の位置情報を取得可能であり、
    　前記解析部が、前記光源と前記受光部との位置関係および前記受光部によって取得した前記光源の正反射光の上下方向の位置に基づいて前記鋼板の板エッジ位置を求める
    ことを特徴とする請求項２記載の溶融金属めっき設備の板エッジ検出装置。     The plate thickness direction position detecting means is the light source and the light receiving unit arranged at different positions in the vertical direction,
    The light receiving unit is capable of acquiring position information in the vertical direction of the regular reflection light of the light source,
    The said analysis part calculates | requires the board edge position of the said steel plate based on the positional relationship of the said light source and the said light-receiving part, and the position of the up-down direction of the regular reflection light of the said light source acquired by the said light-receiving part. Item 3. A plate edge detection device for a molten metal plating facility according to item 2.
  5. 　前記板厚方向位置検出手段が、前記鋼板の板エッジ位置を挟んで板幅方向に沿って設けられた二台の前記受光部であり、
    　前記解析部が、二台の前記受光部の位置関係および二台の前記受光部により受光した情報に基づいてそれぞれ取得した前記鋼板の板エッジ位置からステレオ法により前記鋼板の板厚方向の位置を検出する
    ことを特徴とする請求項２記載の溶融金属めっき設備の板エッジ検出装置。     The plate thickness direction position detecting means is the two light receiving units provided along the plate width direction across the plate edge position of the steel plate,
    The position of the steel plate in the plate thickness direction is determined by the stereo method from the plate edge position of the steel plate acquired based on the positional relationship between the two light receiving units and the information received by the two light receiving units. The apparatus for detecting a plate edge of a molten metal plating facility according to claim 2, wherein the detection is performed.
  6. 　前記光源が、前記鋼板が平板状である場合に前記受光部に前記鋼板のエッジによって反射される前記光源の正反射光が入射する位置を含みさらに前記鋼板の幅方向外側まで延設されている
    ことを特徴とする請求項１から請求項５のいずれか１項に記載の溶融金属めっき設備の板エッジ検出装置。     The light source includes a position where regular reflection light of the light source reflected by an edge of the steel plate is incident on the light receiving portion when the steel plate is flat, and further extends to the outside in the width direction of the steel plate. The plate edge detection apparatus of the hot-dip metal plating equipment of any one of Claims 1-5 characterized by the above-mentioned.
  7. 　溶融金属槽から引き上げられた鋼板の板エッジ位置を検出する溶融金属めっき設備の板エッジ検出方法であって、
    　前記鋼板の板幅方向に沿って延び、前記鋼板に対向配置される光源と、前記鋼板に対して前記光源と同一側に対向されて前記鋼板の少なくとも板エッジを含む領域によって鏡面反射される前記光源の正反射光を受光する受光部とを設け、
    　前記受光部により受光した情報に基づき前記鋼板により鏡面反射される前記光源の正反射光が途切れる位置を前記鋼板のエッジ位置として特定する
    ことを特徴とする溶融金属めっき設備の板エッジ検出方法。     A plate edge detection method of a molten metal plating facility for detecting a plate edge position of a steel plate pulled up from a molten metal tank,
    The light source that extends along the plate width direction of the steel plate and is disposed opposite to the steel plate, and is specularly reflected by a region that is opposed to the light source on the same side as the light source and includes at least a plate edge of the steel plate. A light receiving portion for receiving the regular reflection light of the light source;
    A plate edge detection method for a molten metal plating facility, wherein a position where specular reflection light of the light source specularly reflected by the steel plate is interrupted based on information received by the light receiving unit is specified as an edge position of the steel plate.
PCT/JP2017/006039 2016-04-28 2017-02-20 Sheet edge detection device for molten metal plating facility and sheet edge detection method WO2017187728A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11183398A (en) * 1997-12-25 1999-07-09 Nkk Corp Surface flaw inspecting device and method
JP2001235424A (en) * 2000-02-23 2001-08-31 Nkk Corp Surface inspection device
JP2002188907A (en) * 2000-10-03 2002-07-05 Nkk Corp Sheet shape control device and manufacturing method for plated sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11183398A (en) * 1997-12-25 1999-07-09 Nkk Corp Surface flaw inspecting device and method
JP2001235424A (en) * 2000-02-23 2001-08-31 Nkk Corp Surface inspection device
JP2002188907A (en) * 2000-10-03 2002-07-05 Nkk Corp Sheet shape control device and manufacturing method for plated sheet

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