WO2017183687A1 - Composition sans plomb à point de fusion bas, matériau d'étanchéité, matériau conducteur et composant électronique - Google Patents

Composition sans plomb à point de fusion bas, matériau d'étanchéité, matériau conducteur et composant électronique Download PDF

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WO2017183687A1
WO2017183687A1 PCT/JP2017/015866 JP2017015866W WO2017183687A1 WO 2017183687 A1 WO2017183687 A1 WO 2017183687A1 JP 2017015866 W JP2017015866 W JP 2017015866W WO 2017183687 A1 WO2017183687 A1 WO 2017183687A1
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atoms
moles
group
composition
sum
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PCT/JP2017/015866
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English (en)
Japanese (ja)
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拓朗 池田
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日本山村硝子株式会社
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Priority to CN201780023979.6A priority Critical patent/CN109071322B/zh
Priority to JP2018513211A priority patent/JP6887420B2/ja
Publication of WO2017183687A1 publication Critical patent/WO2017183687A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
    • C03C3/247—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron containing fluorine and phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/253—Silica-free oxide glass compositions containing germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

Definitions

  • the present invention relates to an inorganic composition, and more specifically to a lead-free low melting point composition, a lead-free low melting point sealing material and a conductive material containing the composition, and an electronic component using these.
  • Various inorganic low melting point compositions are used in various applications in the electrical and electronic equipment industry.
  • a low melting point for example, 250 ° C.
  • Au—Sn alloy solder paste or sealing glass frit is applied to these parts.
  • patterned electrodes and wirings are formed on electrical and electronic parts such as solar cell panels.
  • conductive paste or the like in which metal powder and low-melting glass powder are mixed is used. Yes.
  • Au-Sn alloy (Patent Document 1) is a material that has been used for some time and is reliable, but it is very expensive because it contains gold as a component.
  • PbO glass and V 2 O 5 glass are also known as low melting point glass used for the preparation of the sealing material.
  • PbO-based glass Patent Document 2
  • V 2 O 5 glass Patent Document 3
  • Patent Document 4 a sealing material that can be used at 300 to 330 ° C., which contains silver oxide and / or silver halide and another metal oxide (which may be Pb or V) is known (Patent Document 4). .
  • Patent Documents 5 and 6 a sealing material containing silver oxide, phosphorus pentoxide and silver iodide is also known.
  • One object of the present invention is applied to a sealing object having a surface made of a metal and / or an inorganic oxide, and heat-treated in the air at a low temperature range not exceeding 350 ° C., preferably not exceeding 300 ° C. When they are spread well with good wettability to their surfaces, and then cooled and solidified, they can be sealed (adhered to) the surfaces, and can be sealed. It is an object of the present invention to provide a lead-free inorganic low-melting-point composition that can also be bonded. It is a further object of the present invention to provide a low melting point composition suitable for selectively sealing a metal surface.
  • a further object of the present invention is to provide a low-melting-point sealing material and a conductive material containing such a composition.
  • a still further object of the present invention is to provide an electronic component sealed, bonded or wired with such a sealing material or conductive material.
  • the inventor has one or two constituent elements selected from the group consisting of Mo and P, and Mg, Ca, Sr, Ba, Y, lanthanoid, Ti, Zr, Nb, Ta, Mn, Fe, and Co. , Zn, B, Ga, In, Si, Ge, Sn, Bi, and Te, one or more components selected from the group consisting of Te, and Ag, I, and O in a ratio within a predetermined range was found to have a low melting point.
  • these low-melting-point compositions exhibit good flowability (the property of being easy to flow and spread) in the above-mentioned temperature range in the atmosphere, and these compositions are sealed with an inorganic oxide surface or a metal surface.
  • the present invention After being heat-treated and melted in such a temperature range, it can be cooled and solidified so that it can be sealed tightly to those surfaces, and the composition can be adjusted to select the metal surface. It has been found that a typical sealing is possible.
  • the present invention has been completed by further studying these findings. That is, the present invention provides the following.
  • One or more components to be A low melting point composition comprising components Ag, I, and O, In a predetermined mass of the composition;
  • a low melting point composition comprising components Ag, I, and O, In a predetermined mass of the composition;
  • the ratio of the total number of moles of atoms belonging to the group M1 to the sum of the number of moles of all atoms having a positive ion valence is 5 to 30%, and the ratio of the number of moles of Ag atoms is 69 to 92 %, (Total number of moles of atoms belonging to group M3) / (total number of moles of atoms belonging to group M1) is 0.01 to 0.7
  • (b) The proportion of moles of I atoms is 15 to 65% and the proportion of moles of O atoms is 35 to
  • a low melting point sealing material comprising the low melting point composition according to any one of the above 1 to 4.
  • a conductive material comprising a metal powder, a solvent, and a powder of any one of the low melting point compositions 1 to 4 above.
  • the low melting point composition comprising the low melting point composition is applied to a surface made of an inorganic oxide and / or metal to be sealed, and has a wide temperature range of 350 ° C. or lower in the atmosphere. Sealing with good adhesion to the surface can be achieved by heating and melting in the region and spreading it appropriately, followed by cooling and solidification.
  • the wettability with respect to metal is particularly high, which makes it particularly suitable for sealing a sealing target including an inorganic oxide surface.
  • it because it has good wettability to the metal surface, it can also be used as a sintering aid for metal powders, which makes it especially useful for conducting materials for low-temperature firing and for creating circuits on oxide substrates. Suitable for manufacturing materials.
  • the low melting point composition of 2 of the present invention can also be used for sealing in a wide temperature range not exceeding 350 ° C. in the atmosphere as a low melting point sealing material containing the composition.
  • the sealing material exhibits a higher wettability with respect to a metal than with an inorganic oxide during melting. For this reason, when trying to join only the metal surfaces to be sealed with a sealing material, even if an inorganic oxide surface exists around the joint, the sealing material applied to the metal surface is not an inorganic oxide. It can be prevented from flowing and spreading on the surface, and enables selective sealing on the metal surface with high reliability.
  • composition of the present invention can provide a conductive material that can be fired at a low temperature by being mixed with metal powder as a sintering aid.
  • the low melting point composition of 3 of the present invention can also be used for sealing in a wide temperature range not exceeding 350 ° C. in the atmosphere as a low melting point sealing material containing the composition.
  • the sealing material exhibits good wettability to both the inorganic oxide surface and the metal surface when melted. For this reason, bonding by sealing between a member having an inorganic oxide surface and a member having a metal surface (dissimilar material bonding) Can be achieved with high reliability.
  • FIG. 1 is a schematic diagram showing the contact angle ⁇ of a droplet and the parameters used to calculate ⁇ .
  • FIG. 2 is a drawing-substituting photograph showing the metal cap in a state where the low melting point composition of composition 2 is adhered.
  • FIG. 3 is a drawing-substituting photograph showing a metal cap sealed with a low melting point composition of composition 2 and also fixed to quartz glass.
  • FIG. 4 is a schematic view showing the structure of a crystal resonator using a sealing material in an exploded state.
  • FIG. 5 is a schematic view showing a cross section of a solar cell using a conductive material.
  • the term “low melting point” means that the melting point does not exceed 350 ° C., more preferably, the melting point does not exceed 300 ° C.
  • the composition of this invention can be used for the use suitable for the melting
  • a composition having a melting point of 250 to 300 ° C. can be used as an inexpensive alternative material for an Au—Sn alloy sealing material.
  • a composition having a melting point not exceeding 250 ° C. can be advantageously used for further sealing an electronic component for which an Au—Sn alloy solder has already been used.
  • the term “predetermined mass” of the composition means that the term “predetermined mass” does not mean a specific fixed mass, but an arbitrary mass. It's okay.
  • the present invention relates to the number of moles of the specific atom (one or more) with respect to the sum of the number of moles of all atoms having the same ionic valence as that atom. This is because the ratio (%) may be obtained.
  • the ratio of the number of moles of a specific atom (one or more) having the same sign ionic valence to the sum of the moles of all atoms having a positive ionic valence is It is also called “% cation” of a specific atom. In the case of an atom having a negative ionic valence, it is also referred to as “anion%”.
  • the composition of the present invention comprises: One or two components selected from the group M1 consisting of Mo and P; Selected from the group M2 consisting of Mg, Ca, Sr, Ba, Y, lanthanoid, Ti, Zr, Nb, Ta, Mn, Fe, Co, Zn, B, Ga, In, Si, Ge, Sn, Bi, and Te One or more components, and A low melting point composition comprising components Ag, I, and O, In a predetermined mass of the composition; (a) The ratio of the total number of moles of atoms belonging to group M1 to the sum of the number of moles of all atoms having a positive ionic valence is 5 to 30%, and the ratio of moles of Ag atoms is 69 to 92%, (Total number of moles of atoms belonging to group M2) / (total number of moles of atoms belonging to group M1) is 0.01 to 0.7, (b) The proportion of moles of I atoms is 15 to 65% and the proportion of mo
  • the composition has good flowability in a temperature range not exceeding 350 ° C., preferably not exceeding 300 ° C. Therefore, by applying the composition to a surface made of a metal or inorganic oxide to be sealed, for example in the form of particles (eg powder) and heating to the temperature of such a region, the surface to be sealed Therefore, by cooling and solidifying it, it can be sealed tightly to the surface to be sealed.
  • a surface made of a metal or inorganic oxide to be sealed for example in the form of particles (eg powder) and heating to the temperature of such a region, the surface to be sealed Therefore, by cooling and solidifying it, it can be sealed tightly to the surface to be sealed.
  • Ag is an essential component of the composition of the present invention. Ag has the effect of lowering the liquidus temperature of the composition and the effect of forming a glass phase. In order to utilize these effects, the Ag content is preferably 69 to 92 cation%, more preferably 73 to 89 cation%, and still more preferably 75 to 87 cation%.
  • the component selected from the group M1 consisting of Mo and P has the effect of lowering the liquidus temperature of the composition and the effect of forming a glass phase. In order to use these effects, one or two of the groups M1 are contained.
  • the total content of the constituent elements belonging to the group M1 is preferably 5 to 30 cation%, more preferably 8 to 28 cation%, still more preferably 10 to 25 cation%.
  • the component to be formed has an effect of changing the contact angle of the composition of the present invention, and in particular, an effect of reducing the contact angle to the metal surface (that is, improving wettability). In order to use this effect, one or more of the constituent elements belonging to the group M2 are contained.
  • total number of moles of atoms belonging to group M2) / (total number of moles of atoms belonging to group M1) is preferably 0.01 to 0.7, more preferably 0.02 to 0.6, More preferably, it is 0.03 to 0.5.
  • the component selected from the group M3 is weak in reducing the contact angle with the inorganic oxide surface. Therefore, when joining metal parts on the surfaces to be sealed, if it is desired to suppress the low melting point composition from flowing to the inorganic oxide surface when the inorganic oxide surface is present around the joint, It is preferable to contain one or more of the constituent elements belonging to M3 in preference to other constituent elements belonging to the group M2 (lanthanoids other than La, Ga, Bi).
  • the component selected from the group M4 consisting of Ce, Ga and Bi has a low contact angle to the oxide. Therefore, in the case where the inorganic oxide surface and the metal surface are joined, it is preferable to contain one or more of the constituent elements belonging to the group M4 in preference to the other constituent elements belonging to the group M2. .
  • I is an essential component of the composition of the present invention. I has the effect of lowering the liquidus temperature of the composition and the effect of forming a glass phase.
  • the content of I in the composition of the present invention is preferably 15 to 65 anion%, more preferably 17 to 60 anion%, still more preferably 20 to 57 anion%.
  • O is an essential component of the composition of the present invention.
  • O has the effect of dramatically improving the water resistance of the composition and the adhesion to the surface of the inorganic oxide or the metal.
  • the content of O is preferably 35 to 85 anion%, more preferably 40 to 83 anion%, and still more preferably 43 to 80 anion%.
  • the total content of I and O is preferably 80 anion% or more, more preferably 90 anion% or more, and further preferably 99 anion% or more.
  • composition of the present invention is substantially free of Pb.
  • Pb is a component harmful to the environment.
  • substantially does not contain Pb means that the content of Pb is less than 1000 ppm even when a trace amount is mixed as an impurity.
  • the content of Pb is more preferably less than 100 ppm.
  • composition of the present invention is substantially free of F and Cl. These elements may cause corrosion when the surface to be sealed is a metal.
  • substantially does not contain F and Cl means that the content is less than 1000 ppm, even if they are mixed in a trace amount as impurities.
  • the contents of F and Cl are more preferably less than 100 ppm each.
  • Br is an optional component of the composition of the present invention.
  • Br has an effect of increasing the solidus temperature of the composition and further improving the wettability with respect to the inorganic oxide. Therefore, it enables sealing at a relatively low temperature while increasing the heat resistance temperature of the composition.
  • Br is a component that hardly volatilizes from the low melting point composition of the present invention in halogen.
  • Br is a component that is unlikely to cause corrosion of the metal material in the object to be sealed.
  • the content of Br is preferably 0 to 10 anion%.
  • the composition of the present invention may contain atoms having positive ionic valences other than those belonging to Ag, group M1 and group M2 described above. If these atoms are contained in a small amount, the effect of lowering the solidus temperature and liquidus temperature of the composition of the present invention can be expected, but the wettability may be deteriorated. For this reason, the total content thereof is preferably 14.5 cation% or less, more preferably 7 cation% or less, and still more preferably 3 cation% or less.
  • the composition of the present invention may be provided in the form of a mixture of various raw material reagent powders prepared in advance so as to give the desired low melting point composition by heating and melting. Moreover, it can also be set as the material of the form in which the solid solution, the double halide, and the glass phase which are obtained by heating, melting, and cooling such a mixture are formed. When a solid solution, a double halide, or a glass phase is formed, it becomes a composition that is easily melted by heating in a shorter time, and thus a composition in such a form is more preferable.
  • the composition of the present invention can also be produced by reacting and precipitating an aqueous solution containing an acid, base, or salt.
  • the composition of the present invention can be processed into powder, beads, sheets, rods, etc. and used as a sealing material. From the viewpoint of improving workability, it can be mixed with water, an organic solvent, a dispersant, a thickener and the like and used as a paste-like sealing material.
  • the organic solvent terpineol, cellosolve, isobornylcyclohexanol and the like can be used.
  • a form including a filler can also be used.
  • a conductive filler such as a metal (for example, metallic silver) or carbon nanotube, and high in order to impart thermal conductivity.
  • a filler having a thermal conductivity for example, aluminum nitride, silicon carbide, etc.
  • a filler having a low coefficient of thermal expansion for example, ZrW 2 O 8 And invar alloys, etc.
  • heat resistant organic polymer materials for example, polyimide, silicone, polytetrafluoroethylene, polyphenylene sulfide, (A fluororubber or the like).
  • these fillers are consistently solid particles both in the heat treatment for sealing and in the usage environment of the objects to be sealed (electronic devices, etc.) after sealing. Therefore, the positive or negative ionic valence of the atoms constituting the filler does not contribute to the definition of the composition of the present invention.
  • the surface to be sealed is composed of various metals and nonmetals (oxides, fluorides, nitrides, carbides, organic polymer materials, etc.). Can be. Since the composition of the present invention has a property of wetting metal, it is particularly preferable to use it when at least a part of the object to be sealed is metal.
  • composition of the present invention can be selected as follows according to the material of the surface to be sealed and the purpose of sealing.
  • composition of the present invention When the composition of the present invention is applied to a metal surface: the composition satisfies the following condition A.
  • Condition A The contact angle to the Kovar plate at 250 ° C. is 40 ° or less, or the contact angle to the Kovar plate at 300 ° C. is 20 ° or less.
  • composition of the present invention When the composition of the present invention is applied to a sealing object having both a surface made of inorganic oxide and a surface made of metal, the composition applied to the metal surface flows to the surface of the inorganic oxide.
  • Condition B The contact angle to the Kovar plate at 250 ° C. is 40 ° or less, and the difference between the contact angle to the glass plate and the contact angle to the Kovar plate ( ⁇ glass-Kovar) is more than 5 °, or 300
  • the contact angle to the Kovar plate at 20 ° C. is 20 ° or less, and the difference between the contact angle to the glass plate and the contact angle to the Kovar plate ( ⁇ glass-Kovar) exceeds 5 °
  • Condition A is satisfied, but condition B is not satisfied It must be a composition.
  • the working atmosphere may or may not contain oxygen.
  • pressure can be applied to the object to be sealed to further enhance the adhesion, and vibration such as ultrasonic waves can be applied to the sealing material to promote melting.
  • the sealing material of the present invention can be used for sealing various electronic components.
  • it can be used for a crystal resonator, a semiconductor element, a SAW element, and an organic EL element.
  • the low melting point composition of the present invention has good wettability to metal
  • a conductive material for electrical wiring and circuit formation can be obtained by adding and mixing it with metal powder.
  • a composition containing a metal powder, a low melting point composition powder of about 0.5 to 5% by volume, and a solvent in an amount corresponding to the intended viscosity can be used as the conductive material. You may make this contain a binder resin as needed.
  • those having good wettability to inorganic oxides can be suitably used for electrical wiring and circuit formation on an oxide substrate such as an alumina substrate.
  • silver, copper, and aluminum can be particularly preferably used as the metal powder, but are not limited thereto.
  • the conductive material of the present invention can be used for electrode formation and wiring of various electronic parts such as silicon solar cells and piezoelectric elements.
  • FIG. 4 schematically shows the structure of a crystal resonator using the sealing material 12 of the present invention in an exploded state.
  • FIG. 5 is a schematic view showing a cross section of a solar cell using the conductive material of the present invention as an electrode.
  • compositions 1 to 39 According to Tables 1-1 to 1-3, the raw materials were weighed and blended so that the blending proportions indicated for each composition were 5 g in total, and pulverized and mixed in a mortar to obtain powder. 5 g of the obtained powder was put in a magnetic crucible. The crucible was put in a furnace heated to the melting temperature (500 ° C. or 600 ° C.) shown in the table in the atmosphere and held for 10 minutes to melt the raw material mixture. Each composition was obtained as a bulk by pouring the melt onto a graphite plate at room temperature and allowing it to cool.
  • compositions 1 to 39 were cut into a cylindrical shape having a diameter of 3 mm and a height of 5 mm to obtain samples. Each sample was placed on a non-tin surface (surface on the air side during the production of float glass) of a 25 mm square, 1.3 mm thick glass plate (soda lime glass) and placed in an electric furnace. The temperature was raised to 250 ° C. or 300 ° C. at 5 ° C./minute, then held at that temperature for 1 hour, heating was stopped, and the sample was allowed to cool. The shape of the sample on the glass plate was observed, each parameter shown in FIG. 1 was measured, and the contact angle ⁇ was calculated by the ⁇ / 2 method using them.
  • compositions 2 to 10, 12 to 13, 16 to 18, 20 to 26, 29 to 30, 32, 36, 38 to 39 also satisfies the above condition A.
  • any of the compositions of these examples can be suitably used for metal sealing.
  • the wettability to metal is good, it can be used as a sintering aid for metal powder and also for the production of conductive materials that can be fired at low temperature.
  • compositions 1, 11, 14 to 15, 19, 27 to 28, 31, 33 to 35, and 37 (comparative example) have a large contact angle to the Kovar plate and are preferable as a sealing material for the metal surface. Absent.
  • compositions 2 to 7, 9 to 10, 12 to 13, 16 to 18, 20 to 21, 23 to 26, 30, 32, 36, and 38 to 39 are the above-mentioned conditions B Meet. This is because when the compositions of these examples are used to seal metal surfaces to be sealed together, even if an inorganic oxide surface exists around the joint, a low melting point is present on the surface of the inorganic oxide. It shows that the composition can be prevented from flowing.
  • compositions 8, 22 and 29 make it possible to perform highly reliable sealing in the dissimilar material bonding between the inorganic oxide and the metal.
  • He leak evaluation method For the He leak test, the vacuum spray method defined in JIS Z 2331: 2006 was used. HELIOT700 (manufactured by ULVAC) was used as the leak detector. This indicates that the composition adhered to both the Kovar (metal) surface and the glass (inorganic oxide) surface without any gaps, creating an excellent sealed state.
  • the low-melting-point composition of the present invention can be used for a sealing material used for electric and electronic parts such as a crystal resonator and an LED element, and is useful.
  • a conductive material used for patterning electrodes and wiring can be produced by mixing a low melting point composition with a metal as a sintering aid, which is useful.

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Abstract

L'invention concerne une composition sans plomb à bas point de fusion avec laquelle il est possible de sceller de manière satisfaisante une surface métallique ou à la fois une surface métallique et une surface d'oxyde inorganique par traitement thermique dans une plage de basses températures. La composition comprend : un ou plusieurs éléments sélectionnés dans un groupe M1 constitué de Mo et P ; un ou plusieurs éléments sélectionnés dans un groupe M2 constitué de Mg, Ca, Sr, Ba, Y, des lanthanides, de Ti, Zr, Nb, Ta, Mn, Fe, Co, Zn, b, Ga, In, Si, Ge, Sn, Bi et Te ; de l'Ag ; de l'I ; et de l'O, la composition étant conçue de telle sorte que (a) la proportion du nombre total de moles d'atomes appartenant au groupe M1 est de 5 à 30 % et la proportion du nombre de moles d'atomes d'Ag est de 69 à 92 % par rapport à la somme du nombre de moles de tous les atomes ayant une valence ionique positive, et le rapport (nombre total de moles d'atomes appartenant au groupe M2)/ (nombre total de moles d'atomes appartenant au groupe M1) est de 0,01 à 0,7, (b) la proportion du nombre de moles d'atomes d'I est de 15 à 65 % et la proportion du nombre de moles d'atomes d'O est de 35 à 85 % par rapport au nombre total de moles d'atomes ayant une valence ionique négative, (c) la proportion du nombre total de moles de chacun des atomes d'I et d'O étant d'au moins 90 % par rapport au nombre total de moles d'atomes ayant une valence ionique négative, et (d) chacune de la teneur en atomes de Pb, de la teneur en atomes de F et de la teneur en atomes de Cl étant inférieure à 1 000 ppm.
PCT/JP2017/015866 2016-04-21 2017-04-20 Composition sans plomb à point de fusion bas, matériau d'étanchéité, matériau conducteur et composant électronique WO2017183687A1 (fr)

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CN201780023979.6A CN109071322B (zh) 2016-04-21 2017-04-20 无铅低熔点组合物、密封材料、导电用材料以及电子部件
JP2018513211A JP6887420B2 (ja) 2016-04-21 2017-04-20 無鉛低融点組成物，封止材，導電用材料及び電子部品

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JP2016-085642 2016-04-21
JP2016085642 2016-04-21

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