WO2017182566A1 - Système de commande, système de fixation, ensemble compresseur et procédé de commande d'un ensemble compresseur - Google Patents
Système de commande, système de fixation, ensemble compresseur et procédé de commande d'un ensemble compresseur Download PDFInfo
- Publication number
- WO2017182566A1 WO2017182566A1 PCT/EP2017/059389 EP2017059389W WO2017182566A1 WO 2017182566 A1 WO2017182566 A1 WO 2017182566A1 EP 2017059389 W EP2017059389 W EP 2017059389W WO 2017182566 A1 WO2017182566 A1 WO 2017182566A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling plate
- structural element
- spacer elements
- compressor device
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
- F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/0027—Pulsation and noise damping means
- F04B39/0044—Pulsation and noise damping means with vibration damping supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/06—Cooling; Heating; Prevention of freezing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/12—Casings; Cylinders; Cylinder heads; Fluid connections
- F04B39/121—Casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
- F04C29/04—Heating; Cooling; Heat insulation
- F04C29/047—Cooling of electronic devices installed inside the pump housing, e.g. inverters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2240/00—Components
- F04C2240/30—Casings or housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2240/00—Components
- F04C2240/80—Other components
- F04C2240/803—Electric connectors or cables; Fittings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2240/00—Components
- F04C2240/80—Other components
- F04C2240/808—Electronic circuits (e.g. inverters) installed inside the machine
Definitions
- the present invention relates to a drive arrangement for controlling a compressor device, a mounting arrangement and a compressor device with a drive arrangement. Moreover, the present invention relates to a method for driving a
- Control circuits in particular also boards or circuit boards, which carry a corresponding control electronics to connect to the compressor housing or to integrate.
- Control electronics should be transferred as possible no bending stress.
- the object of the present invention is to provide a convenient mounting option for an electronic
- Compressor device having a housing for a compressed fluid proposed.
- a deformable structural element of the housing is arranged between a first pressure region and a second pressure region of the compressor device.
- the drive assembly includes an electrical power module, a cooling plate for dissipating heat from the electrical power module thermally coupled to the cooling plate, and a mounting arrangement for the cooling plate.
- the mounting arrangement has a plurality of spacer elements, which space the cooling plate from the structural element, wherein the spacer elements are arranged such that a
- the power module is in particular part of an electronic circuit
- Control device for the compressor device may include other electronic components, such as butterhalbeiter, switches, processors, memory and the like.
- Drive device has in embodiments printed circuit boards or boards with traces, which are protected by means of the mounting assembly and the cooling plate against bending stresses on the one hand and thermal stresses on the other hand.
- the cooling plate is so spaced by means of the spacer elements of the structural element, that even with a normal operation of the compressor device maximum deformation or curvature of the structural element no additional force application point between the structural element and the cooling plate is formed.
- Cooling plate - and other mechanically coupled elements - is exposed to no additional bending stress. A deformation in the manner of a curvature of the example planar structural element is then not transferred to the cooling plate, because the deformation of the structural element surface in the axial direction can between the positions of the spacer elements as Evasive movements happen without additional tension in the
- Cooling plate can be generated.
- the cooling plate is in the direction of
- the drive arrangement is so far robust and low cost integrated into or on the housing of the compressor device.
- the first pressure range is, for example, a low pressure range of a
- Compressor, and the second pressure range is an area with
- the structural element can, for example, a
- the pressure in the low pressure region when filling the compressor with a refrigerant is almost zero, so that the pressure in the low pressure region when filling the compressor with a refrigerant is almost zero, so that the
- Structural element or the housing bottom can also deform, deform, deform, buckle or bend in the "other direction" or inward, since the atmospheric pressure is higher
- test pressure 150 MPa or 15 bar.
- the cooling plate is in particular in the axial direction, that is substantially normal to the cooling plate and the surface of the
- the cooling plate can be arranged in particular laterally relative to the spacer elements in particular easily movable.
- the control arrangement can be designed in such a way that a laterally floating mounting of the cooling plate is possible, that is, there are no stresses in the plane of the cooling plate.
- the cooling plate and the particular planar structural element preferably run parallel to one another.
- the cooling plate is preferably an aluminum plate, Aluniniumoxidplatte, ceramic plate, copper plate, DCB board (Direct Bonded Copper - DCB) or laminate plate.
- the electrical power module is preferably a module with an insulated-gate bipolar transistor (IGBT) and / or a metal-oxide-semiconductor field-effect transistor.
- the spacer elements are arranged around a curvature or deformation center such that the spacer elements during the buckling or deforming of the
- Structural element are moved symmetrically, so that the cooling plate undergoes only a translational movement.
- the spacers serve as punctiform support points for the cooling plate.
- Structural element is expected to be arranged.
- the holding plate designed as a cooling plate is preferably made of a
- the spacers are preferably arranged symmetrically about a region of greatest axial or normal deflection of the structural element. Due to the plurality of, for example, symmetrically provided spacer elements, a predetermined distance between the cooling plate and the structural element is kept constant, in particular in the region of the spacer elements. This allows the use of flat
- the electrical power module for dissipating heat from the electric power module to the cooling plate is arranged on a side facing away from the structural element.
- Cooling plate arranged. Consequently, the removal of heat towards the
- Structural element can be realized by means of the cooling plate, without buckling or deformation of the structural element the
- the drive arrangement comprises at least one
- Heat-conducting element which is arranged between the structural element and the cooling plate, so that heat can be dissipated from the cooling plate to the structural element with the aid of the heat-conducting element.
- the heat-conducting element is additionally arranged between the cooling plate and the structural element, this improves the cooling of the power module.
- the heat-conducting element consists of a more flexible material than the cooling plate and / or the structural element. More preferably, the heat-conducting element is designed to be elastic and / or flexible.
- the heat-conducting element is for example at least partially made of one
- the heat-conducting element can be applied to the structural element in the form of a gel, jelly or a paste. This can be done for example with the help of a dispenser.
- the heat-conducting element has a planar geometry with a, in particular centrally arranged, recess, so that a region of the structural element which experiences the greatest deformation, in the region of
- the greatest deformation can also be understood as the greatest shaping, curvature or deformation.
- space is created for the structural element, which can extend into the recess during deformation, deformation or curvature. Consequently, a transmission of the deformation of the structural element is suppressed or kept low on the heat conducting element.
- Heat-conducting element is used gently. Further preferred are
- Displacement spaces provided so that the heat-conducting, which is crushed due to the deformation of the structural element, has space to evade. This can be achieved for example by a subdivision of the heat conducting element or creation of additional spaces. Preferably, a part of the structural element extends into the recess.
- the heat conduction member has recesses through which the spacers extend.
- the provision of the recesses for the spacer elements in the heat-conducting element allows the use of a large heat-conducting element, which is for example longer and / or wider than a distance between the spacer elements. At the same time can be realized relative to the structural element with the help of the recesses a rotation for the heat conducting element.
- the spacer elements extend through the recesses up to the cooling plate.
- the one or more heat-conducting elements may be in the form of pads between the cooling plate and the generally flat structural element.
- the acted upon by a contact force spacers thereby ensure a substantially constant spacing, so that at least in the area, for example around the spacer around a contact between the Päd and the holding plate or cooling plate on the one hand, and the housing bottom or structural element on the other hand guaranteed.
- the housing bottom has one or more recesses for receiving one or more heat-conducting elements.
- the drive arrangement comprises at least one
- the spring element wherein with the aid of the spring element, a contact pressure force is applied from the cooling plate on the spacer elements on the structural element.
- the spring element is designed as an elastomer spring, in particular with a flat geometry.
- the spring element can be arranged in particular on the inside of a housing cover and exert the contact pressure on the rest of the drive arrangement.
- a plurality of spring elements in particular at least three, are provided.
- a spring element is provided on a fastening means which fixes the cooling plate with the structural element.
- the spring element is in particular a plate spring and rests on an upper side of the cooling plate, wherein the structural element in particular has at least one Anschraubdom which extends in particular in a continuous opening of the cooling plate, in particular a fixing, for example a disc, with the aid of a fastening means, eg a screw or a bolt the Anschraubdom is screwed and the cooling plate engages behind, wherein the spring element is biased against the cooling plate and the fixing element.
- a fastening means eg a screw or a bolt
- the cooling plate by means of an axial
- Pressing force held which in particular by means of a screw-lockable or latchable lid of the compressor device, to the
- Structural element is releasably secured, is generated.
- An axial contact force can be transmitted in particular via further holding means.
- both the screw-on dome and the fixing element have a radial clearance within the particular circular opening of the cooling plate, so that slight displacements or movements of the screw-on dome do not induce any stresses in the cooling plate radially to the opening.
- the provision of several Anschraubdome would allow in particular small lateral movements between the structural element and the cooling plate.
- the cooling plate is prestressed in the direction of the structural element, so that in particular a pressing or a displacement of the spacer elements due to a deformation
- the bias equally ensures that a stable contact of the cooling plate is ensured on the spacer elements, in particular no axial play between the cooling plate and the spacer elements prevails.
- the spring element is in particular to be designed so that it the up and
- the structural element forms one, in particular
- the spacer elements for spacing the cooling plate in the edge region of the cooling plate and the particular circular surface of the Structural element provided can be provided at regular angular intervals, in particular 120 °, around the center.
- a stable bearing surface of the cooling plate can be realized on the spacer elements.
- the geometric center point is the point that experiences maximum deformation during the deformation or curvature of the structural element.
- the spacer elements are at least partially cylindrical.
- circular cylinders with a height between 0.1 and 2 mm can be provided.
- the height of the spacer elements specifies at least one distance of the cooling plate to the structural element.
- the spacer elements are integrally formed on the structural element.
- the integral body preferably consists of a material. More preferably, the integral body is cast and / or with the help of machining
- the spacers do not have to be positioned, aligned or fixed in a complex assembly process.
- the spacer elements are integrally formed on the cooling plate. Then there is an integral body of spacers and cooling plate.
- a mounting arrangement for a cooling plate on a deformable structural element which is arranged between a first pressure region and a second pressure region of a compressor device, wherein the cooling plate for dissipating heat from an electrical power module, which is thermally coupled to the cooling plate, is arranged, wherein with the aid of a plurality of spacer elements, the cooling plate is spaced from the structural element, wherein the spacer elements are arranged such that a transmission of the deformation of the structural element is suppressed on the cooling plate.
- a compressor device with a drive arrangement as described above or below, a housing part, which comprises a housing bottom as a structural element, wherein the housing bottom a first pressure range of a second
- Pressure region which has a lower pressure than the first pressure region, separates, wherein the cooling plate is fixed to the low pressure side to the housing bottom in the axial direction by means of the fastening arrangement.
- the pressure difference can be between 3 and 8.5 MPa, so that in the case of a compressor the housing bottom can be curved by a few tenths of a millimeter during operation. Bending of the cooling plate is, however, avoided by the drive arrangement or mounting arrangement.
- the compressor device is configured, for example, to compress CO2 or CFC (chlorofluorocarbon). In embodiments, this is a refrigerant compressor for CO2 as a coolant,
- the housing bottom has a positioning aid, a
- the compressor device has a low pressure area for collecting fluid to be compressed and a high pressure area in which compressed or compressed fluid is held.
- the structural element as housing bottom separates the low-pressure region from the atmospheric pressure present outside the compressor device. In the low pressure chamber, the fluid is usually much cooler than in the
- deformable structural element which is arranged between a high pressure region and a low pressure region of a compressor device proposed.
- the cooling plate is spaced by means of spacer elements of the structural element.
- the method uses in particular a drive arrangement as described above, or a
- the structural element is arranged to move less away from a zero level due to a pressure increase in areas where the spacers are located than in an area between the spacers.
- the structural element bulges in a region between the spacer elements due to a
- the drive arrangement, mounting arrangement or compressor device comprises a printed circuit board, in particular a printed circuit board.
- the power module may be arranged between the cooling plate and the circuit board but also on the cooling plate and the structural element facing away from the circuit board.
- a transfer of the deformation of the structural element is suppressed on the circuit board by means of the cooling plate and its attachment.
- the cooling plate is replaced by a holding plate.
- the support plate only optionally has a heat-dissipating function and serves mainly as holding or support elements for the electronic components and / or a printed circuit board or circuit board.
- the housing bottom has a pressure-tight passage for at least one connecting line from the first pressure region to the second pressure region to the holding plate or cooling plate.
- the holding plate or cooling plate practically always maintains its planar shape. It can be said that the holding plate or cooling plate is attached to the particularly flat structural element
- the structural element is for example a
- thermally conductive material is made. It is conceivable, for example, a
- the structural element may additionally have a cooling function, because in the second
- Operating temperatures of the power semiconductor is.
- line semiconductor chips develop temperatures between 100 and 150 ° C while the refrigerant in the compressor is well below 60 ° C.
- the ones described for the proposed drive arrangement are described for the proposed drive arrangement
- Fig. 1 shows a highly simplified sectional view of a first
- FIG. 2 shows a simplified sectional view of a second embodiment of the drive arrangement
- FIG. 3 shows the drive arrangement according to FIG. 2 in a perspective view
- Fig. 4 shows a plan view of a structural element with a
- Fig. 5 is a perspective view of a heat conduction member
- Fig. 6 shows a perspective view of a cooling plate with a
- Fig. 7 shows a perspective view of a printed circuit board.
- Fig. 1 is a highly simplified sectional view of a first
- Embodiment of a drive arrangement 1 is suitable for regulating or controlling a compressor device which has a housing for a compressed fluid and wherein the fluid is compressed by means of an electric drive.
- the drive arrangement 1 couples via a cooling plate 2 electronic components, such as an electric power module 3 and conductor tracks (not shown) to a particular elastically deformable structural element 4 of the compressor device by means of spacer elements 5, which space the cooling plate 2 from the surface 4A of the structural element 4.
- the structural element 4 is, for example, a housing bottom of a compressor housing for receiving compressed fluid.
- Compressor device for example, in an electric or
- the cooling plate 2 may alternatively as a holding plate for electronic components and / or a board of an electronic
- Fig. 1 shows the deformable structural element 4, which has a flat geometry and, for example, the housing bottom of a
- Compressor device can be.
- The, in particular elastically deformable, structural element 4 is arranged between an atmospheric pressure region P and a low pressure region N and separates them from one another.
- Low pressure region N has a higher pressure than atmospheric pressure during operation of the considered compressor device.
- the cooling plate 2 has a
- the structural element 4 has an upper side 4A, which faces the underside 2A of the printed circuit board 6, wherein the
- Power module 3 and the spacer elements 5 are not deformed, curved or deformed and are indicated by dashed outlines to the behavior of the drive assembly 1 during the deformation or buckling of the
- Distance elements 5 are provided, which space the cooling plate 2 of the structural element 4, wherein the spacer elements 5 are arranged such that a transfer of the deformation or curvature of the structural element 4 is largely prevented on the cooling plate 2 but at least reduced.
- the spacer elements 5 are for example such a deformation, a
- Curvature a Völbungshochddling or center of curvature arranged that they move the cooling plate 2 during the corresponding movement due to the deformation preferably only translational and the cooling plate 2 is not exposed to any additional bending or tension.
- the drive arrangement 1 is designed with respect to the spacing such that at maximum deformation, deformation, shaping or bending of the structural element 4, e.g. during operation of the compressor device, no additional pressure point between the structural element 4 and the cooling plate 2 is formed. It is in particular a use of the drive arrangement 1 in one
- FIGS. 2-7 show several illustrations of an embodiment of a compressor device 23 with a drive arrangement in which a cooling plate is fastened as a holding plate by means of a fastening arrangement. 2 and 3, a section of a compressor device 23 is shown in cross section.
- FIG. 4 essentially shows a plan view of one
- Fig. 5 is a perspective view of a
- Fig. 6 shows a part of the compressor device from an oblique perspective view on the top of the cooling plate.
- Fig. 7 is a perspective view of a circuit board.
- FIG. 2 shows a simplified sectional view of a second embodiment of the drive arrangement 1.
- the drive arrangement 1 comprises a heat-conducting element 7 which is arranged between the structure element 4 and the
- Cooling plate 2 is arranged so that heat from the cooling plate 2 to the
- Structural element 4 with the aid of the heat-conducting element 7 can be discharged.
- Heat-conducting element 7 has a planar geometry with a centrally arranged recess, so that a region of the structural element 4 which undergoes the greatest deformation is arranged in the region of the recess. Furthermore, the heat-conducting element 7 recesses, through which the spacer elements 5 extend, which are integrally formed on the structural element 4, so that a
- one-piece integral body 4, 5 of structural element 4 and spacer elements 5 is present.
- the upper side of the integral body 4, 5 is at least partially formed as a negative shape of the heat-conducting element 7.
- the drive arrangement 1 has at least one spring element 8, wherein with the aid of the spring element 8 a contact pressure force is applied from the cooling plate 2 via the spacer elements 5 to the structural element 4.
- Spring element 8 is in particular a plate spring and rests on a top side 2B of the cooling plate 2, wherein the structural element 4 at least one
- Cooling plate 2 extends, wherein a fixing element 11, in particular a disc, is screwed by a screw 12 to the Anschraubdom 9 and the cooling plate 2 engages behind, wherein the spring element 8 is biased against the cooling plate 2 and against the fixing element 11.
- Both the Anschraubdom 9 and the fixing element 11 have a radial clearance within the particular circular opening 10, so that slight displacements or movements of the Anschraubdoms 9 radially to the opening 10 induce no tension in the cooling plate 2.
- the cooling plate 2 is biased in the direction of the structural element 4, so that a pressing or a displacement of the spacer elements 5 due to deformation, deformation, shaping or bending of the
- Structural element 4 by means of compression of the spring element 8 and der
- Spring elements 8 can be compensated.
- the bias is
- Distance elements 5 is ensured, in particular no axial play between the cooling plate 2 and the spacer elements 5 prevails.
- Distance elements 5 are located in other cross-sectional planes of the drive arrangement 1 or are not visible in the plane shown.
- Heat-conducting element 7 consists in particular of a more flexible material than the structural element 4 and / or the cooling plate 2 and / or is in particular a heat-conducting pad.
- the heat-conducting element 7 is made of a flexible and / or elastic material.
- FIG. 3 shows the drive arrangement according to FIG. 2 in a perspective illustration.
- the cooling plate 2 that is equipped with the circuit board or printed circuit board or board 6, mounted on the cooling plate 2.
- the heat-conducting element 7 requires a defined distance to the housing bottom 4, which is filled by the material of the heat-conducting 7.
- the housing bottom 4 is cooled by the refrigerant located in the pressure chamber N.
- FIG. 4 shows a plan view of a structural element 4 with a heat-conducting element 7. There are three spacer elements 5 and three screw-on domes 9 on
- Structural element 4 arranged around a center M at an angular distance of 120 °.
- the spacer elements 5 are distributed symmetrically about the center of the deflection of the structural element 4, in particular of the housing bottom.
- the heat-conducting element 7 has been recessed, since at this point 15, the up and down movement of the structural element 4, in particular of the housing bottom, due to changing pressure load is greatest.
- the structural element 4 or the housing bottom has four
- Fixing elements 22 which are arranged radially outwardly at an angular distance of 90 ° and as a positioning aid for the cooling plate 2, to the
- Fixing elements 22 corresponding omissions 21, are provided.
- the fixing elements 22 are designed in particular as fixing mandrels and extend in the axial direction, that is to say essentially normal to the cooling plate 2 in the installed position.
- the heat-conducting element 7 shows a perspective view of the heat-conducting element 7 from FIG. 4.
- the heat-conducting element 7 has an annular geometry.
- the recesses 16 for the spacer 5 have an angular distance of 120 ° with each other on.
- the recesses 17 for the Anschraubdome 9 also have one
- Fig. 6 shows a perspective view of a cooling plate 2 with a
- the electric power module 3 is mounted by means of a screw 13 and tabs 20 to the cooling plate 2. Furthermore, four Anschraubdome 14 for the attachment of
- the omissions 21 are at least partially formed as a negative form of the fixing elements 22, so that the cooling plate 2 can rest on the structural element 4 in a form-fitting and torsion-proof manner as soon as the fixing elements 22 engage in the openings 21.
- the omissions 21 are formed as slots.
- Fig. 7 shows a perspective view of a printed circuit board 6.
- the printed circuit board 6 is mounted on the electrical power module 3 and contacted with this.
- the electric power module 3 is connected to the circuit board 6, for example, a circuit board or printed circuit as a carrier for electronic components 18 of the corresponding drive circuit connected.
- handling openings 20 are provided in the printed circuit board 6.
- Air conditioning compressor is on a printed circuit board 6 using electronic
- the board or printed circuit board 6 has in the illustration of FIG. 7 on the upper side electrical components 9. Further, the underside of the board or printed circuit board 6
- Power semiconductors or modules 2 (hidden) arranged, which can develop temperatures between 100 and 150 ° C.
- the present invention has been described in terms of some embodiments, it is modifiable.
- the number of spacer elements can be varied.
- the shape and geometry of the housing bottom is not necessarily circular. Also oval or other shapes are conceivable.
- the structural element need not necessarily be a housing bottom of the compressor device.
- the materials and dimensions mentioned are variable and can be adapted to the respective installation situation of a structural element or a compressor device.
- the pressure indications may also vary and depend on the refrigerant compressed by means of the compressor device.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
L'invention concerne un système de commande (1) conçu pour réguler ou commander un ensemble compresseur, qui comprend un logement destiné à accueillir un fluide comprimé, un élément structural (4) déformable du logement étant disposé entre une première zone de pression (N) et une deuxième zone de pression (P) de l'ensemble compresseur (23). Ce système de commande comprend un module de puissance électrique (3), une plaque de refroidissement (2) conçue pour dissiper la chaleur provenant du module de puissance électrique (3), qui est accouplé thermiquement à la plaque de refroidissement (2), et un système de fixation pour la plaque de refroidissement (2) qui comporte plusieurs éléments espaceurs (5) destinés à espacer la plaque de refroidissement (2) de l'élément structural (4), ces éléments espaceurs (5) étant disposés de manière à réduire l'effet de la déformation de l'élément structural (4) sur la plaque de refroidissement (2). Cette invention concerne en outre un système de fixation, un ensemble compresseur (23) et un procédé pour commander un ensemble compresseur (23).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17720048.2A EP3440354B1 (fr) | 2016-04-20 | 2017-04-20 | Système de commande, système de fixation, ensemble compresseur et procédé de commande d'un ensemble compresseur |
CN201780033091.0A CN109312728B (zh) | 2016-04-20 | 2017-04-20 | 操控系统、紧固系统、压缩机设备和用于操控压缩机设备的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016107289.3A DE102016107289A1 (de) | 2016-04-20 | 2016-04-20 | Ansteueranordnung, Befestigungsanordnung und Kompressorvorrichtung |
DE102016107289.3 | 2016-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017182566A1 true WO2017182566A1 (fr) | 2017-10-26 |
Family
ID=58640850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2017/059389 WO2017182566A1 (fr) | 2016-04-20 | 2017-04-20 | Système de commande, système de fixation, ensemble compresseur et procédé de commande d'un ensemble compresseur |
Country Status (4)
Country | Link |
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EP (1) | EP3440354B1 (fr) |
CN (1) | CN109312728B (fr) |
DE (1) | DE102016107289A1 (fr) |
WO (1) | WO2017182566A1 (fr) |
Families Citing this family (2)
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PL3803119T3 (pl) * | 2018-06-08 | 2023-09-04 | Arçelik Anonim Sirketi | Sposób montowania karty sterującej |
DE102018211413A1 (de) * | 2018-07-10 | 2020-01-16 | Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg | Nebenaggregat |
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US5964579A (en) * | 1997-06-24 | 1999-10-12 | Rheem Manufacturing Company | Prestressed resilient compressor mount apparatus |
JP2003153552A (ja) * | 2001-11-07 | 2003-05-23 | Matsushita Electric Ind Co Ltd | インバータ回路の配設構造と配設方法及び圧縮機 |
US20050011213A1 (en) * | 2003-07-17 | 2005-01-20 | Denso Corporation | Electric-powered compressor |
US20100200290A1 (en) * | 2009-02-12 | 2010-08-12 | Panasonic Corporation | Electronic circuit device for compressor |
US20120113603A1 (en) * | 2010-11-08 | 2012-05-10 | Panasonic Corporation | Electronic circuit device |
DE102012215052A1 (de) * | 2011-09-01 | 2013-03-07 | Infineon Technologies Ag | Elastische Montage von Leistungsmodulen |
US20130108486A1 (en) * | 2011-10-31 | 2013-05-02 | Kabushiki Kaisha Toyota Jidoshokki | Motor-driven compressor |
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SE520661C2 (sv) * | 2001-04-12 | 2003-08-05 | Emerson Energy Systems Ab | Kylapparat samt förfarande för att bilda en sådan apparat |
CN1802069A (zh) * | 2005-01-05 | 2006-07-12 | 照敏企业股份有限公司 | 具高导热基板及其制程 |
DE102005043880B4 (de) * | 2005-09-14 | 2014-10-02 | Continental Automotive Gmbh | Befestigungssystem für Leiterplatten |
CN201966440U (zh) * | 2010-12-07 | 2011-09-07 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件 |
FR2981537B1 (fr) * | 2011-10-12 | 2017-03-24 | Valeo Thermal Systems Japan Corp | Systeme de maintien mecanique, ensemble comprenant un tel systeme et une carte electronique et procede d'assemblage sur une surface d'un tel systeme et d'une telle carte |
-
2016
- 2016-04-20 DE DE102016107289.3A patent/DE102016107289A1/de not_active Withdrawn
-
2017
- 2017-04-20 EP EP17720048.2A patent/EP3440354B1/fr active Active
- 2017-04-20 WO PCT/EP2017/059389 patent/WO2017182566A1/fr active Application Filing
- 2017-04-20 CN CN201780033091.0A patent/CN109312728B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5964579A (en) * | 1997-06-24 | 1999-10-12 | Rheem Manufacturing Company | Prestressed resilient compressor mount apparatus |
JP2003153552A (ja) * | 2001-11-07 | 2003-05-23 | Matsushita Electric Ind Co Ltd | インバータ回路の配設構造と配設方法及び圧縮機 |
US20050011213A1 (en) * | 2003-07-17 | 2005-01-20 | Denso Corporation | Electric-powered compressor |
US20100200290A1 (en) * | 2009-02-12 | 2010-08-12 | Panasonic Corporation | Electronic circuit device for compressor |
US20120113603A1 (en) * | 2010-11-08 | 2012-05-10 | Panasonic Corporation | Electronic circuit device |
DE102012215052A1 (de) * | 2011-09-01 | 2013-03-07 | Infineon Technologies Ag | Elastische Montage von Leistungsmodulen |
US20130108486A1 (en) * | 2011-10-31 | 2013-05-02 | Kabushiki Kaisha Toyota Jidoshokki | Motor-driven compressor |
Also Published As
Publication number | Publication date |
---|---|
CN109312728B (zh) | 2020-07-07 |
DE102016107289A1 (de) | 2017-10-26 |
CN109312728A (zh) | 2019-02-05 |
EP3440354A1 (fr) | 2019-02-13 |
EP3440354B1 (fr) | 2021-03-24 |
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