WO2017181741A1 - 触控基板制造方法、触控基板和触控显示屏 - Google Patents

触控基板制造方法、触控基板和触控显示屏 Download PDF

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Publication number
WO2017181741A1
WO2017181741A1 PCT/CN2017/070396 CN2017070396W WO2017181741A1 WO 2017181741 A1 WO2017181741 A1 WO 2017181741A1 CN 2017070396 W CN2017070396 W CN 2017070396W WO 2017181741 A1 WO2017181741 A1 WO 2017181741A1
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Prior art keywords
touch
substrate
strengthening layer
surface strengthening
touch control
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PCT/CN2017/070396
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English (en)
French (fr)
Inventor
陈秀云
邵喜斌
王洁琼
尹大根
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京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Priority to US15/545,191 priority Critical patent/US20180157348A1/en
Publication of WO2017181741A1 publication Critical patent/WO2017181741A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the invention relates to a method for manufacturing a touch substrate, and a touch substrate and a touch display screen prepared by the manufacturing method.
  • touch substrates such as a One Glass Solution (OGS) touch substrate have been increasingly used in display screens.
  • OGS One Glass Solution
  • a touch display including an OGS touch substrate in order to prevent the OGS touch substrate from being damaged by an external force, it is usually necessary to surface-enhance the touch substrate.
  • Two methods of surface strengthening are known: one is to cut a large-sized mother substrate into a sub-substrate, and then perform full-surface strengthening of the sub-substrate. In this method, since the number of sub-substrates is large, the execution of the intensification process time is remarkably increased. On the other hand, since the strengthened small-sized sub-substrate also needs to separately perform the touch electrode patterning process, this also increases the time and cost of the patterning process.
  • Another method for surface enhancement of the touch substrate is to first perform full surface enhancement on the mother substrate, form a compressive stress layer on the mother substrate, and then perform a touch electrode patterning process on the mother substrate, and then cut the mother substrate into sub-substrates.
  • This method saves time and cost in performing surface strengthening and patterning processes, but cutting the mother substrate by this method will leave more edge cracks at the cutting edges. Therefore, the OGS touch display made by this method is extremely vulnerable to impact by external force, and there are risks in product assembly, handling, and customer use.
  • the existing OGS touch substrate is only attached to the liquid crystal module through the optical transparent resin, the OGS touch substrate is supported only by the optical transparent resin, and there is no other reinforcing device, so it is generally only suitable for small-sized electronic products below 27 inches.
  • the product cannot meet the needs of providing large size and large size display screens.
  • a method for manufacturing a touch substrate includes the steps of: forming a surface strengthening layer on a surface of a touch mother substrate, and cutting a touch mother substrate formed with a surface strengthening layer to form a plurality of touch electrodes a substrate, the surface enhancement layer of the peripheral region of the touch sub-substrate is removed, such that the surface enhancement layer of the touch sub-substrate has an area smaller than a surface area of the touch sub-substrate, and the surface enhancement layer covers at least the touch sub-substrate The display area forms a touch substrate.
  • the surface strengthening layer of the peripheral region of the touch sub-substrate is removed by a grinding process.
  • the surface strengthening layer comprises a compressive stress layer.
  • the touch electrode substrate is subjected to a touch electrode patterning process.
  • the thickness of the surface strengthening layer is set to 40 ⁇ m.
  • a touch substrate is manufactured, which is manufactured by the manufacturing method described above.
  • the surface strengthening layer has a thickness of 40 ⁇ m.
  • the touch substrate is a monolithic touch substrate.
  • a touch display screen wherein the touch display screen includes the touch substrate described above, and a display panel, the display panel and the touch substrate are bonded by The agents are bonded to each other.
  • the touch display screen further includes a frame surrounding the touch substrate and the periphery of the display panel to further fix the touch substrate and the display panel.
  • the binder is an optically clear resin.
  • FIG. 1 is a flow chart of a method of manufacturing a touch substrate according to an embodiment of the present invention
  • FIG. 2 is a schematic view showing a touch substrate formed by various steps of a method of manufacturing a touch substrate according to an embodiment of the invention
  • FIG. 3 is a top plan view of a touch mother substrate and a touch sub-substrate according to an embodiment of the invention
  • FIG. 4 is a cross-sectional view of an OGS touch display screen in accordance with one embodiment of the present invention.
  • FIG. 5 is a top plan view of an OGS touch substrate in accordance with an embodiment of the present invention.
  • a method for manufacturing a touch substrate includes the steps of: forming a surface strengthening layer on a surface of a touch mother substrate, and cutting a touch mother substrate formed with a surface strengthening layer to form a plurality of touches
  • the surface of the surface of the touch sub-substrate is smaller than the surface area of the touch sub-substrate, and the surface enhancement layer covers at least the touch
  • the display area of the sub-substrate forms a touch substrate.
  • FIG. 1 is a flow chart of a method for manufacturing a touch substrate according to an embodiment of the present invention
  • FIG. 2 is a schematic view showing a touch substrate formed by various steps of a method for manufacturing a touch substrate according to an embodiment of the present invention
  • 3 is a top plan view of a touch mother substrate and a touch sub-substrate according to an embodiment of the invention.
  • a surface strengthening layer is formed on the surface of the touch mother substrate; in step S200, the touch mother substrate on which the surface strengthening layer is formed is cut to form a plurality of touch sub-substrate; in step S300 The surface enhancement layer of the peripheral region of the touch sub-substrate is removed such that the area of the surface enhancement layer of the touch sub-substrate is smaller than the surface area of the touch sub-substrate, and the surface enhancement layer covers at least the touch sensor.
  • the display area of the substrate For example, as shown in FIGS. 2 and 3, a surface strengthening layer 12 is formed on the surface of the touch mother substrate 10 as shown in FIG. 2(a).
  • the touch mother substrate 10 on which the surface strengthening layer 12 is formed is cut along the broken line in FIG. 3 to form a plurality of touch sub-substrates 20, as shown in FIG. 2(c).
  • the surface enhancement layer 12 of the peripheral region AA of the touch sub-substrate 20 is removed such that the area of the surface enhancement layer 12 ′ of the touch sub-substrate 20 is smaller than the surface area of the touch sub-substrate 20 , and the surface enhancement layer 12 ′ is at least covered.
  • the display area of the touch sub-substrate is as shown in FIG. 2(d).
  • step S300 the surface strengthening layer of the peripheral region of the touch sub-substrate is removed by a polishing process.
  • the surface strengthening layer may be a compressive stress layer.
  • the method before the step S200 of forming the plurality of touch sub-substrates by cutting the touch mother substrate formed with the surface enhancement layer, the method further includes performing touch electrodes on the touch mother substrate. Step S50 of the patterning process. In this way, a batch touch electrode patterning process can be performed on the touch sub-substrate. For example, as shown in FIG. 2( b ), the touch electrode substrate 10 is subjected to a touch electrode patterning process to form the touch electrode pattern 14 .
  • the thickness of the surface strengthening layer is set to 40 ⁇ m.
  • the removal depth of the surface strengthening layer in the peripheral region of the touch sub-substrate in step S300 is also 40 ⁇ m. That is, the surface strengthening layer of the peripheral region of the touch sub-substrate is completely removed.
  • a touch substrate manufactured by the foregoing manufacturing method and a touch display screen including the touch substrate are provided.
  • 4 is a cross-sectional view of a large size OGS touch display screen in accordance with one embodiment of the present invention.
  • the touch display panel includes a touch substrate 100 including a sub-substrate 102, a surface strengthening layer 101 disposed on one surface of the sub-substrate 102, and another surface disposed on the sub-substrate 102.
  • the black matrix 103; the display panel 300, the display panel 300 is bonded to the touch substrate 100 by an adhesive 200; the display panel 300 may include a plurality of layers such as a polarizing layer, a filter layer, and the like.
  • the area of the surface strengthening layer 101 is smaller than the area of the touch substrate 100, and the surface strengthening layer 101 at least completely covers the display area.
  • the surface strengthening layer 101 may be a stress compressing layer.
  • the thickness of the surface strengthening layer 101 is generally 40 ⁇ m.
  • the display panel 300 is bonded to the side of the touch substrate 100 having the black matrix 103 by the adhesive 200.
  • the binder may be an optically clear resin.
  • FIG. 5 is a top plan view of an OGS touch substrate 100 in accordance with an embodiment of the present invention.
  • the black matrix 103 covers the non-display area BB of the touch substrate 100 .
  • the peripheral area AA of the surface strengthening layer 101 is removed by grinding, and the width of the peripheral area AA is smaller than the width of the non-display area BB. Therefore, the area of the surface strengthening layer 101 is smaller than the area of the touch substrate 100, and the surface strengthening layer 101 at least completely covers the display area. Domain (the area enclosed by the dotted line in Figure 5).
  • the peripheral region AA of the surface strengthening layer 101 is removed by grinding, the stress of the crack formed by the cutting is released only in a small area around the periphery, thereby preventing the entire touch substrate from being broken, and ensuring the touch area in the display portion of the central portion. Has normal touch function.
  • the touch display screen may further include a backlight 400 disposed on a side of the display panel 300 opposite to the touch substrate 100 .
  • the touch display screen may further include a frame 500 surrounding the periphery of the combination of the touch substrate 100, the display panel 300, and the backlight 400. And covering the non-display area of the periphery of the touch substrate 100.
  • the protection of the periphery of the touch substrate 100 is increased, and the direct impact of the external force on the side of the touch substrate 100 is reduced.
  • the touch substrate 100 is not only subjected to the adhesive fixing function of the optical transparent resin adhesive 200 but also supported by the frame 500. Therefore, the stability of the assembly of the touch substrate 100 is effectively improved, and the size of the touch substrate 100 can be significantly improved. Increase.
  • the touch substrate of the embodiment of the invention may be a monolithic touch substrate.
  • the touch substrate of the present invention since the peripheral region of the surface strengthening layer is polished and removed, the stress release of the peripheral crack occurs only in the small peripheral region, and the entire touch substrate is prevented from being broken, thereby ensuring the touch function of the display region in the center of the panel. .
  • a surface strengthening layer is first formed on the surface of the touch mother substrate, and/or a touch electrode patterning process is performed on the touch mother substrate; then the touch mother substrate formed with the surface strengthening layer is cut and formed. Multiple touch sub-substrates. Therefore, the time and cost of performing the surface strengthening and patterning process can be greatly saved, so that the low-cost, high-volume production of the touch display screen can be realized.
  • Performance parameter Conventional touch substrate Touch substrate of the present invention Fragmentation rate that occurs when pasting 16%, (penetrating cracks) 2%, (local cracks appear) Fragmentation rate that occurs during assembly 31%, (penetrating cracks) ⁇ 1%, (peripheral cracks appear) Fragmentation rate during transportation 10%, (penetrating cracks) ⁇ 1%, (local cracks appear)
  • the ratio of the number of broken panels of the touch substrate of the present invention to the total number of panels (referred to as the fragmentation rate) when pasting, assembling or transporting ) are significantly lower.
  • the cracks appear in conventional touch substrates, and the cracks are very destructive. It is easy to cause the entire panel to be broken.
  • the cracks generated by the touch substrate of the present invention are small local cracks, and are concentrated at the periphery, and have no influence on the display portion of the central portion, and are not likely to cause the entire panel to be broken.
  • the peripheral region is separated from the display region, so that the stress release of the peripheral crack only occurs in the In the small surrounding area, the entire touch substrate is prevented from being broken, and the touch function of the display area in the center of the panel is ensured.

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Abstract

一种触控基板的制造方法，其中，在触控母基板表面形成表面强化层（S100），将形成有表面强化层的触控母基板切割形成多个触控子基板（S200），去除所述触控子基板周边区域的表面强化层（S300），使得所述触控子基板的表面强化层的面积小于触控子基板的表面积，并且所述表面强化层至少覆盖触控子基板的显示区域，从而形成触控基板。

Description

触控基板制造方法、触控基板和触控显示屏
本申请要求于2016年4月20日递交中国专利局的、申请号为201610248985.9的中国专利申请的权益，该申请的全部公开内容以引用方式并入本文。
技术领域
本发明涉及一种触控基板的制造方法，以及由所述制造方法制成的触控基板和触控显示屏。
背景技术
近年来，随着显示屏对触控功能的需求，诸如单片式(One Glass Solution，OGS)触控基板之类的触控基板越来越多地应用于显示屏中。
在包括OGS触控基板的触控显示屏中，为了防止OGS触控基板受到外力冲击而被损坏，通常需要对触控基板进行表面强化。已知两种表面强化的方法：一种是将大尺寸的母基板切割成子基板后，再对子基板进行全表面强化。这种方法，由于子基板的数量很多，使得执行强化工艺时间显著增加。另一方面，由于被强化的小尺寸的子基板在后续还需要分别进行触控电极构图工艺，这也增加了构图工艺的时间及成本。另一种触控基板表面强化的方法是首先对母基板进行全表面强化，在母基板上形成压缩应力层，然后在母基板上进行触控电极构图工艺，然后将母基板切割为子基板。这种方法节约了执行表面强化和构图工艺的时间及成本，但是，采用这种方法对母基板的切割将会在切割边处留下较多的边沿裂纹。因此，由这种方法制作的OGS触控显示屏极易受外力冲击而破碎，在产品组装、搬运以及客户使用等过程中存在风险。
此外，由于现有的OGS触控基板仅仅通过光学透明树脂贴在液晶模组上，OGS触控基板仅靠光学透明树脂支撑，没有其他任何加固装置，因此通常仅适用于27inch以下的小尺寸电子产品，不能满足提供大尺寸及超大尺寸的显示屏的需求。
发明内容
本发明的目的是至少解决或减轻上述现有技术中的问题和缺陷的至少一个方面。
根据本发明的一个方面，提供一种触控基板的制造方法，包括以下步骤：在触控母基板表面形成表面强化层，将形成有表面强化层的触控母基板切割形成多个触控子基板，去除所述触控子基板周边区域的表面强化层，使得所述触控子基板的表面强化层的面积小于触控子基板的表面积，并且，所述表面强化层至少覆盖触控子基板的显示区域，从而形成触控基板。
可选地，通过研磨工艺去除所述触控子基板周边区域的表面强化层。
可选地，所述表面强化层包括压缩应力层。
可选地，将形成有表面强化层的触控母基板切割形成多个触控子基板的步骤之前，对触控母基板进行触控电极构图工艺。
可选地，将所述表面强化层的厚度设置为40μm。
根据本发明的另一个方面，提供一种触控基板，所述触控基板由上文所述的制造方法制造而成。
可选地，所述表面强化层的厚度为40μm。
可选地，所述触控基板为单片式触控基板。
根据本发明的另一个方面，提供一种触控显示屏，其中，该触控显示屏包括上文所述的触控基板，以及显示面板，所述显示面板和所述触控基板通过粘合剂相互粘合。
可选地，所述触控显示屏还包括边框，所述边框包围触控基板和显示面板的周边，以将触控基板和显示面板进一步地固定。
可选地，所述粘合剂是光学透明树脂。
附图说明
图1是根据本发明的实施例的触控基板的制造方法的流程图；
图2是示出根据本发明的实施例的触控基板的制造方法的各个步骤形成的触控基板的示意图；
图3是根据本发明实施例的触控母基板和触控子基板的俯视示意图；
图4是根据本发明的一个实施例的OGS触控显示屏的剖视示意图；以及
图5是根据本发明的一个实施例的OGS触控基板的俯视示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
根据本发明总体上的发明构思，提供一种触控基板的制造方法，包括以下步骤：在触控母基板表面形成表面强化层，将形成有表面强化层的触控母基板切割形成多个触控子基板，去除所述触控子基板周边区域的表面强化层，使得所述触控子基板的表面强化层的面积小于触控子基板的表面积，并且，所述表面强化层至少覆盖触控子基板的显示区域，从而形成触控基板。
图1是根据本发明的一个实施例的触控基板的制造方法的流程图；图2是示出根据本发明的实施例的触控基板的制造方法的各个步骤形成的触控基板的示意图；图3是根据本发明实施例的触控母基板和触控子基板的俯视示意图。
如图1所示，在步骤S100中，在触控母基板表面形成表面强化层；在步骤S200中，将形成有表面强化层的触控母基板切割形成多个触控子基板；在步骤S300中，去除所述触控子基板周边区域的表面强化层，以使得所述触控子基板的表面强化层的面积小于触控子基板的表面积，并且，所述表面强化层至少覆盖触控子基板的显示区域。例如，结合图2和3所示，在触控母基板10的表面形成表面强化层12，如图2(a)所示。将形成有表面强化层12的触控母基板10沿图3中的虚线切割形成多个触控子基板20，如图2(c)所示。去除触控子基板20周边区域AA的表面强化层12，以使得触控子基板20的表面强化层12’的面积小于触控子基板20的表面积，并且，所述表面强化层12’至少覆盖触控子基板的显示区域，如图2(d)所示。
具体地，在步骤S300中，通过研磨工艺去除所述触控子基板周边区域的表面强化层。所述表面强化层可以是压缩应力层。
根据一个实施例，如图1的虚线框所示，在将形成有表面强化层的触控母基板切割形成多个触控子基板的步骤S200之前，还包括对触控母基板进行触控电极构图工艺的步骤S50。如此，可以对触控子基板进行批量触控电极构图工艺。例如，如图2(b)所示，对触控母基板10进行触控电极构图工艺，以形成触控电极图案14。
可选地，将所述表面强化层的厚度设置为40μm。相应地，步骤S300中去除所述触控子基板周边区域的表面强化层的去除深度也为40μm。即，将触控子基板周边区域的表面强化层完全去除。
根据本发明的另一个方面，提出一种由前述制造方法制造而成的触控基板和包括所述触控基板的触控显示屏。图4是根据本发明的一个实施例的大尺寸OGS触控显示屏的剖视示意图。其中，触控显示屏包括：触控基板100，所述触控基板100包括子基板102、设置在子基板102的一个表面上的表面强化层101、和设置在子基板102的另一个表面上的黑矩阵103；显示面板300，所述显示面板300通过粘合剂200与触控基板100粘结在一起；所述显示面板300可以包括偏光层、滤光层等多个层。所述表面强化层101的面积小于触控基板100的面积，且所述表面强化层101至少完全覆盖显示区域。所述表面强化层101可以是应力压缩层。所述表面强化层101的厚度一般为40μm。所述显示面板300通过粘合剂200与触控基板100的具有黑矩阵103的一侧粘结在一起。所述粘合剂可以是光学透明树脂。
图5是根据本发明的一个实施例的OGS触控基板100的俯视示意图。如图5所示，所述黑矩阵103覆盖触控基板100的非显示区域BB。表面强化层101的周边区域AA被研磨去除，周边区域AA的宽度小于非显示区域BB的宽度。因此，所述表面强化层101的面积小于触控基板100的面积，且所述表面强化层101至少完全覆盖显示区 域(即图5中虚线包围的区域)。由于表面强化层101的周边区域AA被研磨去除，周边由于切割而形成的裂纹的应力仅在周边的小区域内释放，避免触控基板整体碎裂，确保在中央部分的显示区域的触控区域内具有正常的触控功能。
另外，如图4所示，所述触控显示屏还可以包括背光源400，所述背光源400设置在显示面板300的与触控基板100相反的一侧。
此外，根据本发明的一个实施例，如图4所示，触控显示屏还可以包括边框500，所述边框500包围所述触控基板100、显示面板300以及背光源400的组合体的周边，并覆盖在所述触控基板100的周边的非显示区域上。以此方式，增加了对触控基板100的周边的保护，减小外力对触控基板100的侧边的直接冲击。同时，触控基板100不仅受到光学透明树脂胶200的粘性固定作用，还受到边框500的支撑作用，因此，有效提高了触控基板100组装的稳定性，使得触控基板100的尺寸可以被显著增大。
本发明实施例的触控基板可以为单片式触控基板。
根据本发明的触控基板，由于表面强化层的周边区域被研磨去除，使得周边裂纹应力释放仅发生在周边小区域内，而避免触控基板整体的破裂，确保面板中央的显示区域的触控功能。
并且，根据本发明的实施例，首先在触控母基板表面形成表面强化层，和/或对触控母基板进行触控电极构图工艺；然后将形成有表面强化层的触控母基板切割形成多个触控子基板。因此，可以极大地节约执行表面强化和构图工艺的时间及成本，从而可以实现触控显示屏的低成本、大批量生产。
下文表格1中对常规的触控基板与根据本发明实施例的触控基板的相关性能进行了比较。
表格1破片率以及裂纹比较
性能参数 常规触控基板 本发明的触控基板
粘贴时发生的破片率 16％，(出现穿透裂纹) 2％，(出现局部裂纹)
组装时发生的破片率 31％，(出现穿透裂纹) ＜1％，(出现周边裂纹)
运输时发生的破片率 10％，(出现穿透裂纹) ＜1％，(出现局部裂纹)
从上表可以看出，和常规触控基板相比，不论是在粘贴、组装还是运输时，本发明的触控基板的发生破碎的面板的数量与总的面板数量的比例(称为破片率)都明显更低。此外，常规的触控基板中出现的都是穿透裂纹，这种裂纹的破坏性非常大，容 易导致面板整体破碎。与此相反，本发明的触控基板所产生的裂纹都是小的局部裂纹，并且集中在周边，对中央部分的显示区域没有影响，不易导致面板整体破碎。
根据本发明的触控基板的制造方法及其制造的触控基板和显示屏，由于去除了触控基板周边区域的表面强化层，将周边区域与显示区域隔离，使得周边裂纹应力释放仅发生在周边小区域内，而避免触控基板整体的破裂，确保面板中央的显示区域的触控功能。
以上说明了本发明的具体实施例，但是，应理解的是，以上所述仅为示例的目的，并不用于限制本发明，凡在本发明的精神和原则之内，对实施例所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
应注意，措词“包括”不排除其它组件或步骤，措词“一”或“一个”不排除多个。另外，权利要求的任何组件标号不应理解为限制本发明的范围。

Claims (11)

  1. 一种触控基板的制造方法，包括以下步骤：
    在触控母基板表面形成表面强化层，
    将形成有表面强化层的触控母基板切割形成多个触控子基板，以及
    去除所述触控子基板周边区域的表面强化层，使得所述触控子基板的表面强化层的面积小于触控子基板的表面积，并且，所述表面强化层至少覆盖触控子基板的显示区域，从而形成触控基板。
  2. 根据权利要求1所述的制造方法，其中，通过研磨工艺去除所述触控子基板周边区域的表面强化层。
  3. 根据权利要求1或2所述的制造方法，其中，所述表面强化层包括压缩应力层。
  4. 根据权利要求1-3中任一项所述的制造方法，其中，在将形成有表面强化层的触控母基板切割形成多个触控子基板的步骤之前，对触控母基板进行触控电极构图工艺。
  5. 根据权利要求1-4中任一项所述的制造方法，其中，将所述表面强化层的厚度设置为40μm。
  6. 一种触控基板，所述触控基板由根据权利要求1-5中任一项所述的制造方法制造而成。
  7. 根据权利要求6所述的触控基板，其中，所述表面强化层的厚度为40μm。
  8. 根据权利要求6或7所述的触控基板，其中，所述触控基板为单片式触控基板。
  9. 一种触控显示屏，其中，该触控显示屏包括根据权利要求6-8中任一项所述的触控基板，以及显示面板，所述显示面板和所述触控基板通过粘合剂相互粘合。
  10. 根据权利要求9所述的触控显示屏，其中，所述触控显示屏还包括边框，所述边框包围触控基板和显示面板的周边，以将触控基板和显示面板进一步地固定。
  11. 根据权利要求9所述的触控显示屏，其中，所述粘合剂是光学透明树脂。
PCT/CN2017/070396 2016-04-20 2017-01-06 触控基板制造方法、触控基板和触控显示屏 WO2017181741A1 (zh)

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