WO2017178234A1

WO2017178234A1 - Method for producing an organic light-emitting component, and organic light-emitting component

Info

Publication number: WO2017178234A1
Application number: PCT/EP2017/057419
Authority: WO
Inventors: Sebastian Wittmann; Arne FLEISSNER; Erwin Lang
Original assignee: Osram Oled Gmbh
Priority date: 2016-04-13
Filing date: 2017-03-29
Publication date: 2017-10-19
Also published as: DE102016106847A1

Abstract

The invention relates to a method for producing an organic light-emitting component (100), the method comprising the following steps: A) providing a substrate (1); B) applying a first electrode (2) on the substrate (1); C) applying at least one organic functional layer stack (5) that is designed for emitting radiation and is arranged above at least the first electrode (2); D) applying a second electrode (6) above the organic functional layer stack (5); and E) applying perhydropolysilazane (4) by means of wet-chemical methods, and curing perhydropolysilazane (4) for generating at least one planarization layer (3) that is arranged between the first electrode (2) and the substrate (1) and/or above the second electrode (6). In step E), a layer structure having at least one layer pair (10) is generated, and each layer pair is shaped from the planarization layer (3) and from a layer (9) produced by means of atomic layer deposition methods or chemical vapor deposition, wherein the layer (9) produced by means of atomic layer deposition methods or chemical vapor deposition entirely surrounds both a surface facing away from the substrate (1) and lateral surfaces of the planarization layer (3).

Description

description

Process for producing an organic

light emitting device and organic

light-emitting component

The invention relates to a method for producing an organic light-emitting component. Furthermore, the invention relates to an organic light-emitting component.

A substrate of organic light emitting devices, for example, flexible substrates of organic

Light-emitting diodes usually have to be planarized, since the surface quality is usually not sufficient to be able to process an organic functional layer stack thereon. Furthermore, such substrates must be compared

Moisture and environmental factors, such as oxygen and water, are protected. In addition, such substrates must also be at least partially electrically insulating. Currently used solutions often include organic polymers for planarization, encapsulation or isolation

use. However, these polymers usually show poor adhesion to, in particular, inorganic layers, high permeability to water and oxygen, and significant outgassing behavior at elevated operating temperatures. Thus, such organic polymers are not sufficiently compatible for applications in demanding environments such as

for example in the automobile. An object to be solved is to provide a method for

To provide an organic light emitting device having improved protection.

In particular, the organic light-emitting component easy to produce. It is another object of the invention to provide an organic light emitting device which is easy to manufacture. These objects are achieved by the subject matters with the features of the independent claims. advantageous

Embodiments and further developments of the objects are characterized in the dependent claims and will become apparent from the following description and the drawings.

In at least one embodiment, the method of fabricating an organic light emitting device comprises the steps of: A) providing a substrate;

B) applying a first electrode to the substrate,

C) applying at least one organic functional

Layer stack, which is set up to emit radiation and is arranged at least over the first electrode,

D) applying a second electrode over the organic functional layer stack, and

E) applying perhydropolysilazane by wet-chemical methods and curing perhydropolysilazane to produce at least one planarization layer. The

Planarisierungsschicht is arranged in particular between the first electrode and the substrate. Alternatively or additionally, the planarization layer is arranged over the second electrode. Instead of perhydropolysilazane, in process step E), polysilazane can also be used here and in the following as an alternative. In addition, in step E), a layer structure with at least one layer pair can be produced and each layer pair of the planarization layer and one by means

Atomic layer deposition or chemical

Formed vapor-deposited layer.

In addition, the layer produced by atomic layer deposition or chemical vapor deposition may have both a surface facing away from the substrate and

Completely surrounded side surfaces of the planarization layer.

In accordance with at least one embodiment, the means

Atomic layer deposition or chemical

Gas phase deposition produced another layer

Planarisierungsschicht arranged downstream, the side surfaces as well as a substrate facing away from the surface by means of Atomlagenabscheideverfahren or chemical

Gas phase deposition layer produced positively and cohesively surrounds. In accordance with at least one embodiment, the organic light-emitting component is formed as an organic light-emitting diode (OLED).

According to at least one embodiment of the method, this has a step A), providing a substrate. The substrate may, for example, one or more

Have materials in the form of a layer, a plate, a foil or a laminate, which are selected from glass, Quartz, plastic, metal, silicon wafers, ceramics, coated paper. The substrate may comprise or consist of glass, for example in the form of a glass layer, glass foil or glass plate. Preferably, the substrate comprises a metal or a plastic film.

In accordance with at least one embodiment, the substrate is flexibly shaped. In particular, the substrate is flexible if this is a metal foil or polymer film. As metal foils are for example copper foils,

Aluminum foils or SUS foils (SUS = Steel Use Stainless = stainless steel) into consideration. Other possibilities are e.g. low carbon steel and anodised

Aluminum foil (with, for example, magnesium to improve mechanical properties), copper, nickel and alloys thereof. As polymer films are, for example, polyethylene naphthalate (PEN),

Polyetheretherketone (PEEK), polyethylene terephthalate (PET) or polyimide (PI) in question.

According to at least one embodiment of the method, this has a step B), applying a first

Electrode on the substrate. In accordance with at least one embodiment, the organic light-emitting component has a first and a second one

Electrode on. In particular, at least one of

Electrodes are transparent. With transparent here and below a layer is called, the

is transparent to visible light. It can the

transparent layer to be clear translucent or at least partially light-scattering and / or partially light-absorbing, so that the transparent layer, for example, also diffuse or milky translucent. Particularly preferred is a layer referred to as transparent as translucent as possible, so that in particular the

Absorption of light generated in the operation of the organic light emitting device in the organic functional layer stack is as low as possible.

Alternatively, both electrodes can be transparent

be formed. In this way, the radiation generated in the at least one organic functional layer stack can be radiated in both directions, ie through both electrodes. In the event that the organic

light-emitting component having a substrate, this means that the radiation can be emitted both through the substrate, which is then likewise transparent, and in the direction away from the substrate. Furthermore, in this case, all layers of the

be formed transparent organic light-emitting device, so that the organic light-emitting device forms a transparent OLED. In addition, it may also be possible that one of the two electrodes, between which the organic functional layer stack is arranged, is not transparent and preferably

is formed reflecting, so that the radiation generated in the organic functional layer stack can be emitted only in one direction through the transparent electrode. Is the electrode disposed on the substrate

transparent, the substrate is also transparent, so it is also called a so-called bottom emitter, while in the case that the electrode arranged facing away from the electrode is transparent, speaks of a so-called top emitter. As a material for a transparent electrode, for example, a transparent, conductive oxide (TCO

Transparent Conductive Oxide), such as ITO,

be used.

Transparent, electrically conductive oxides (TCO) are

transparent, electrically conductive materials, usually metal oxides, such as zinc oxide, tin oxide,

Cadmium oxide, titanium oxide, indium oxide, indium tin oxide (ITO) or aluminum zinc oxide (AZO). In addition to binary

Metal oxygen compounds such as ZnO, SnO 2 or Ιη 2θ 3 also include ternary metal oxygen compounds such as Zn 2 SnO 2, Cd Sn 3, Zn SnO 3, Mngln 20zi, GalnO 3, 2ηηηθ or In 4 Sn 30, 2 or mixtures of different transparent, conductive oxides into the group of TCOs.

Furthermore, the TCOs do not necessarily correspond to one

stoichiometric composition and may also be p- or n-doped. Furthermore, a transparent electrode may also be a

Metal layer with a metal or an alloy

have, for example, one or more of the following materials: silver, platinum, gold, magnesium or an alloy of silver and magnesium. In addition, other metals are possible. The metal layer has such a small thickness that it is at least partially permeable to that of the organic functional

Layer stack generated light is, for example, a thickness of less than or equal to 50 nm.

As a material for a reflective electrode can

For example, a metal may be used, which may be selected from aluminum, barium, indium, silver, gold, Magnesium, calcium and lithium, and compounds, combinations and alloys thereof. In particular, a reflective electrode may comprise silver, aluminum or alloys with these, for example Ag: Mg, Ag: Ca, Mg: Al.

According to at least one embodiment, the first electrode is formed as an anode, then the second electrode is formed as a cathode. Alternatively, the first electrode may be formed as a cathode, then the second electrode is formed as an anode.

The electrodes may also have in combination at least one or more TCO layers and at least one or more metal layers.

In accordance with at least one embodiment, at least one organic functional layer stack is arranged above the first electrode and / or the substrate. The fact that a layer or a stack is arranged or applied "on" or "above" another layer or stack may mean here and below that the one layer or the one stack is directly in direct mechanical and / or electrical contact the other layer or the other stack is arranged. Furthermore, it can also mean that the one layer is arranged indirectly on or above the other layer or the other stack. In this case, further layers or stacks can then be arranged between the one and the other layer or stack. According to at least one embodiment of the method, this has a step C), applying at least one organic functional layer stack which is set up to emit radiation and at least over the first Electrode is arranged. In particular, the organic light-emitting component has exactly one organic

functional layer stack on. During operation of the organic light-emitting component, radiation is generated in the organic functional layer stack. A

Wavelength of the radiation or the wavelength maximum is preferably in the infrared and / or ultraviolet and / or visible spectral range, in particular at wavelengths between 420 nm and 680 nm inclusive.

The organic functional layer stack may include layers of organic polymers, organic oligomers,

organic monomers, organic small non-polymeric molecules ("small molecules") or combinations thereof. The organic functional layer stack may additionally have further functional layers, which are designed as a hole transport layer, in order to achieve an effective

Hole injection into the at least one organic

to enable functional layer stacks. For example, tertiary amines, carbazole derivatives, polyaniline doped with camphorsulfonic acid, or polyethylenedioxythiophene doped with polystyrenesulfonic may prove advantageous as materials for a hole transport layer. The organic functional layer stack can furthermore have at least one functional layer which can be used as a

Electron transport layer is formed. In general, the organic functional layer stack may be additional

Have layers that are selected from

Hole injection layers, hole transport layers,

Electron injection layers, electron transport layers, hole blocking layers and electron blocking layers.

In particular, the layers of the organic

functional layer stack completely or at least predominantly organic functional layers. In addition, it may also be possible that individual layers of the organic functional layer stack also comprise or are formed from inorganic materials.

In accordance with at least one embodiment, the method comprises a method step D), application of a second electrode over the organic functional layer stack. In accordance with at least one embodiment, the method comprises a step E), applying perhydropolysilazane or polysilazane by wet-chemical methods and curing perhydropolysilazane to produce at least one

Planarization layer. The planarization layer is in particular arranged between the first electrode and the substrate. Alternatively or additionally, the

Planarisierungsschicht arranged over the second electrode.

According to at least one embodiment, the curing in step E) takes place at a temperature of greater than or equal to 80 ° C or 85 ° C, in particular at a temperature less than or equal to 80 ° C or 75 ° C. In particular, the curing takes place in step E) at a temperature of> 85 ° C and a water vapor atmosphere, beispielswe.LSG 85%.

In accordance with at least one embodiment, the curing in step E) takes place by means of UV light. In particular, the UV light is a xenon light having a wavelength of 172 nm with a tolerance of 3 nm from this value.

The planarization layer can therefore by means of low

Temperatures and cured under UV irradiation to an inorganic glass. Depending on the curing condition you get a silicon oxynitride-like amorphous material (SiON). A silica (Si0 ₂ ) -like amorphous material is obtained by curing PHPS at elevated temperature and

Humidity .

According to at least one embodiment, the

Planarisierungsschicht structured applied. In particular, the structuring can take place by means of the wet-chemical method described above. In other words, by using the wet chemical method, the

Perhydropolysilazan be applied in a structured manner, without a subsequent etching back must be made.

Alternatively, the planarization layer can also be applied over the entire surface. Full surface means here and in the

Below that the planarization layer is applied unstructured, so the lateral extent of

Planarisierungsschicht the lateral extent of the substrate corresponds. Accordingly, a structured means

Application of the planarization layer that the lateral extent of the planarization layer is smaller than the lateral extent of the substrate.

The perhydropolysilazane is used in particular as

Applied coating solution. The coating solution comprises or consists of polysilazane and its derivatives and / or of perhydropolysilazane and derivatives thereof. In addition, solvents may be included, for example

Diethyl ether or dibutyl ether. In the

Planarization layer can be a thin layer with a layer thickness of 5 nm to 500 nm or a thick layer with a layer thickness of 500 nm to 50 ym and several cohesive layers. In particular, according to one embodiment, a planarization layer with a layer thickness of less than 2 μm, in particular with a layer thickness between 200 nm and 1200 nm, for example 800 nm, is produced. Repeated application allows multiples of the value to be obtained. Depending on the substrate and roughness used, the final values for a planarization layer may range from 300 nm to several ym. In the UV curing of PHPS can be obtained layers of about 300 nm. In the case of temperature curing, layers of up to 1.2 μm can be obtained. For example, in the case of UV curing, a planarization layer in the range of 50 nm to 500 nm and / or in the case of temperature hardening

Planarisierungsschicht be generated in the range of 50 nm - 1200 nm. Particularly preferred may be in UV curing a

Planarization layer in the range of 200 nm - 300 nm

and / or when temperature-hardening a planarization layer in the range of 800 - 1200 nm are generated.

The planarization layer may optionally consist of several layers, for example buffer layers of polymer between two layers of PHPS are conceivable. This can lead to improved bendability of the layers.

Polysilazanes are polymeric compounds in which silicon and nitrogen atoms form the basic chemical framework in an alternating arrangement. Frequently, each silicon atom is bound to two nitrogen atoms and each nitrogen atom to two silicon atoms, so that preferably form molecular chains and / or rings of the formula [R _] _R2Si-nR3] _n . R _] _ to R3 can be hydrogen atoms or organic radicals. If exclusively H atoms are present as substituents, the polymer is referred to as perhydropolysilazane having the formula [H2Si-nH] _n . Often, perhydropolysilazane is also called Polyperhydrosilazane or inorganic polysilazane referred. If hydrocarbon radicals are bonded to the silicon, it is referred to here and below as organopolysilazane. Polysilazanes are one or more

Basic units, the monomers, built. By

Sequence of these basic units of monomers formed differently sized chains and / or rings and

Three-dimensionally crosslinked macromolecules with a more or less broad molecular weight distribution.

According to at least one embodiment, the

Planarisierungsschicht SiOx, wherein SiOx with elimination of ammonia of the solution to be produced

Planarisierungsschicht is generated. In the presence of air and / or moisture and / or polar surfaces,

For example, OH groups, a condensation reaction takes place in which ammonia (NH3) escapes. SiOx means here and below the oxides of silicon oxide. Preferably, herein is meant the divalent silica.

Alternatively or additionally, a

Silicon oxide nitride-like material can be produced from perhydropolysilazane. Curing can be done at 172 nm and reduced O 2 atmosphere of ~ 5 ppm O 2. Since SiON is better in terms of water and oxygen diffusion, conversion would be the method of choice.

According to at least one embodiment, the polysilazane provided is a perhydropolysilazane, that is to say a polysilazane which is saturated only with hydrogen and has no organic radical. An advantage of the perhydropolysilazane can be seen in the fact that it can harden to a SiOx network. The network is then preferably free of nitrogen and carbon. SiOx is glassy in one embodiment. The x in SiOx is a maximum of 2. As a rule, x is less than 2. If, for example, x is less than 2, then the remainder to 2 is lost to the OH groups. SiOx is insensitive to moisture. As a result, a layer of SiOx also loses its barrier-insulating or protective function

Moisture influence not.

According to at least one embodiment, the

Planarization layer formed as a barrier. In other words, the barrier is densely formed. Dense here means that the planarization layer has a permeation rate of less than or equal to 0.1 g of water / m 2 per day,

For example, 10 ^~ g H20 / m2 per day. In particular, the planarization layer has these permeation rates

Combination with an ALD layer, for example from A1203. The ALD layer may e.g. Alumina, zirconia and titania. According to at least one embodiment, the

Planarization layer formed as a barrier. The

Planarization layer can be made of materials that are generated by a CVD process. Suitable materials are, for example, SiN, SiO 2 or SiC. Alternatively, materials can also be considered using MLD, PECVD and

Sputtering are generated.

According to at least one embodiment, the

Planarisierungsschicht a laterally low permeability to water. Preferably, the WVTR value is 10- ^ q / m ^ for a layer thickness of 200 nm. In accordance with at least one embodiment, the planarization layer produced after step E) is completely cured, has a vitreous structure and does not exhibit any outgassing of VOCs (Volatile Organic Compounds).

According to at least one embodiment, this cures

Perhydropolysilazane or polysilazane to a glassy shaped body. In particular, the shaped body is a

Planarisierungsschicht and, for example, on the surface of a first electrode or a second electrode

arranged. In particular, the planarization layer has a larger one in a direction parallel to the layer plane

Expansion as in the thickness direction. In this order, more preferably, at least 1,000, 20,000 times expansion. Typical dimensions of a structured

Planarization range from a few mm to several cm, for example 20 cm to 60 cm.

In accordance with at least one embodiment, the wet chemical process is selected from a group comprising slot coating, spray coating, inkjet, screen printing, spin coating, gravure printing, flexographic printing and stencil printing.

Alternatively, the perhydropolysilazane or polysilazane can be applied by means of dispensing or spin coating. Spin Coating allows a uniform thin film,

for example, with a layer thickness of 300 nm. According to at least one embodiment, a layer stack for encapsulation, which comprises the planarization layer, is applied over the second electrode. According to at least one embodiment, the

Planarisierungsschicht arranged directly between the first electrode and the substrate. With direct is here

meant direct mechanical contact. In other words, there are no further layers or elements between the planarization layer and the first electrode and / or between the planarization layer and the substrate

arranged. According to at least one embodiment, the

Planarisierungsschicht applied structured, so that the planarization layer has a smaller lateral extent in cross-section than the substrate. In particular, the component additionally has an encapsulation, wherein the

Planarisierungsschicht, the encapsulation and the substrate is a diffusion barrier to environmental influences.

Preferably, the planarization layer is part of the encapsulation layer or part of the substrate. In accordance with at least one embodiment, the method produces a layer structure which has at least one layer pair. In particular, each layer pair of the

Planarisierungsschicht or another

Planarisierungsschicht and a means

Atomschichtabscheideverfahren produced layer or another produced by atomic layer deposition method (ALD: "Atomic Layer Deposition") layer, wherein the at least one pair of layers another

Planarisierungsschicht is subordinate, so that a

alternating sequence of planarization layer or another planarization layer and means

Atomschichtabscheideverfahren produced layer or further produced by atomic layer deposition method Layer is generated. Alternatively, the layer made by ALD may be chemical

Gas phase deposition (CVD), plasma enhanced chemical vapor deposition (PECVD) or sputtering can be applied. Alternatively, the ALD layer can also be applied by means of MLD method (MLD: "Molecular Layer

Deposition ").

In accordance with at least one embodiment of the method, a layer structure having at least one layer pair is produced, wherein each layer pair consists of the planarization layer or of a further planarization layer and one of

Atomschichtabscheideverfahren produced layer or another produced by atomic layer deposition process layer is formed, wherein the at least one

Layer pair is further subordinate layer produced by Atomlagenabscheideverfahren, so that a

Atomschichtabscheideverfahren produced layer or other produced by atomic layer deposition process layer is produced.

In accordance with at least one embodiment, the layer structure is part of an encapsulation.

According to at least one embodiment, the layer structure more than two pairs of layers, wherein the means

Each of layers produced by atomic layer deposition methods is formed of a metal oxide or metal nitride or comprises at least one metal oxide, carbide, nitride or metal nitride. Suitable metal oxides are, for example, aluminum oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, zinc oxide and lanthanum oxide. The ALD layer may turn off a combination of the aforementioned materials in alternation, ie a nanolaminate. As a metal nitride or nitride, for example, silicon nitride comes into question. Carbide, for example, is silicon carbide.

By applying the layer pairs of ALD layers and planarization layers, the barrier effect can be increased. Furthermore, by the very good

Planarization properties of the planarization layer, the ALD layers are grown with low defects. The

Planarisierungsschicht can in conjunction with a

hermetically sealed flexible substrate, such as a plastic film with a barrier layer or in particular a metal foil, are applied in a structured manner.

By combining one or more

Planarization layers and using ALD or PECVD

Applied layers, the polymer film can also

On the substrate side, they are very well encapsulated with respect to moisture and oxygen, so that they can be used in applications such as

organic light-emitting components, in particular in OLEDs can be used.

The inventors have recognized that the method described herein can provide a more favorable process with faster clock cycles over inorganic metal oxide approaches. Furthermore, the curing produces an inorganic planarization layer. These

inorganic planarization layer becomes low

Temperatures or generated by means of UV radiation.

In addition, the planarization layer by means of

Liquid phase processing can be easily produced. The advantages of liquid phase processing, such as the Speed, or simple structured deposition with advantages of the inorganic planarization layer, such as lack of outgassing of organic materials can be realized. In addition, a cost-effective, robust and flexible organic light-emitting component, in particular an OLED, can be provided.

The layers in the component are compared to many

Polymer and silicon nitride silicon carbide materials or their layer combinations formed transparently, since polymers usually already in the visible spectrum show a significant absorption behavior. For example, when metal foils are used, the metallic impression also remains in the edge region of an organic one

received light emitting device, the for

Automotive manufacturer is desired. In addition, at

Use of polymer films does not adversely affect the transparency of the organic light-emitting device. The planarization layers have a lower thermal compared to polymeric insulation layers

Expansion coefficient, resulting in a better stability of an organic light-emitting device at

Temperature load leads. In particular, better interaction with inorganic encapsulation, e.g. A1203 possible.

The hardened planarization layer has a very good planarizing effect, so that deposited metal layers give a nearly perfect mirror. A perfect mirror effect is highly desirable for automotive manufacturers even with flexible organic light emitting devices, as this effect of components on Glass substrates is known and considered extremely high quality

is classified. This is not always the case, for example, when using screen-printed polymeric planarization insulation layers.

In addition, the adhesion of, for example, metallizations on the planarization layer is ensured. The flexible

Substrate becomes compatible with the materials that can also be used in the manufacture of glass-based rigid OLEDs.

It will continue to be an organic light-emitting

Component specified. Preferably, the organic

light-emitting device with the above-described

Method available. That is, all embodiments and definitions of the method are also valid for the organic light emitting device and vice versa.

In accordance with at least one embodiment, the organic light-emitting component has a substrate. The device has a first electrode overlying the substrate

is arranged. The component has at least one

organic functional layer stack on which to

Emission of radiation is established and arranged at least over the first electrode. The component has a second electrode, which is arranged above the organic functional layer stack and in particular is formed as a cathode. The device has a

Planarisierungsschicht on. The planarization layer is in particular arranged between the first electrode and the substrate, preferably in direct mechanical contact with the electrode and the substrate. Alternatively or additionally, the planarization layer is above the second electrode, especially as part of the encapsulation. The

Planarization layer is produced from perhydropolysilazane or polysilazane. In addition, the device may have a layer structure with at least one pair of layers (10), each one

Layer pair from the planarization layer and one by means of atom layer deposition method or chemical

In this case, the layer produced by atomic layer deposition or chemical vapor deposition has both a surface facing away from the substrate and a layer that faces away from the substrate

Completely surrounds side surfaces of the planarization layer. In conjunction with a top encapsulation, a hermetically encapsulated flexible OLED can be formed, wherein the

Substrate, which is particularly flexible due to

Glass layer is fully compatible with the materials that are also used in the manufacture of glass-based rigid OLEDs, such as metallization.

In accordance with at least one embodiment, the organic light-emitting component has a planarization layer, wherein the planarization layer is structured.

In accordance with at least one embodiment, the organic light-emitting component has a layer structure, the layer structure comprising at least one layer pair (10), each layer pair consisting of the planarization layer (3) or another planarization layer (31) and one by means of atomic layer deposition or chemical

Gas phase deposition produced layer (9) or another by atomic layer deposition method or chemical A further planarization layer (31) is arranged downstream of the at least one layer pair, so that an alternating sequence of planarization layer (3) or another planarization layer (31) and by means of atomic layer deposition or chemical

Gas phase deposition produced layer (9) or further by means of atomic layer deposition method or chemical

Gas phase deposition produced layer (91, 92) is produced.

According to at least one embodiment, the

Planarisierungsschicht the organic light emitting device has an RMS value of less than 200 nm, preferably less than 50 nm, more preferably less than 10 nm. RMS denotes the square roughness and can be determined by force measurement or atomic force microscopy (AFM). In particular, the planarization layer reduces the roughness.

Further advantages and embodiments and developments will become apparent from the following in connection with the

Figures described embodiments. Show it:

FIGS. 1A to 5B each show a schematic illustration of an organic light-emitting component according to an embodiment.

In the exemplary embodiments and figures, identical, identical or identically acting elements can each be provided with the same reference numerals. The illustrated Elements and their proportions are not to be regarded as true to scale. Rather, individual elements such as layers, components, components and areas for exaggerated representability and / or better understanding may be exaggerated.

FIG. 1A shows a schematic side view of an organic light-emitting component 100 according to an embodiment. The device 100 was produced in particular by the method described above. The component has a substrate 1. In particular, the substrate 1 has a rough surface. Above the substrate 1 is a

Planarisierungsschicht 3 arranged, consisting of

Perhydropolysilazane or polysilazane is produced. The planarization layer 3 can be applied by means of spin coating, slot coating, spray coating or inkjet printing. Depending on the curing condition, different results

Material properties. The planarization layer can be cured by means of UV, for example with xenon light having a wavelength of 172 nm. This results in a very dense silicon oxynitride-like layer. Alternatively, the planarization layer can also be cured by means of temperature, wherein a less dense silicon dioxide-like

Layer arises in comparison to the silicon oxynitride-like layer. Above the planarization layer 3, a first electrode 2, an organic functional layer stack 5 and a second electrode 6 are arranged.

FIG. 1B shows a schematic side view of an organic light-emitting component 100 according to an embodiment. The device 100 of Figure 1B

differs from the device 100 of Figure 1A in that it additionally has an encapsulation 7. The encapsulation 7 preferably has a further planarization layer 31. Also these others

Planarization layer 31 can be applied by spin coating, slot coating, spray coating or inkjet printing. Preferably, all statements made for the planarization layer 3 also apply to the others

Planarisierungsschicht 31 or the others

Planarization layers 31, 32, 33. In other words, a device 100 can be provided which has both a planarization layer 3 between the substrate 1 and the first electrode 2 and also over the second electrode 6. The

Planarization layers 3, 31 can act for planarization or as a barrier. The encapsulation 7 may have, in addition to the further planarization layer 31, further layers produced by means of ALD or CVD.

FIG. 2 shows a schematic side view of an organic light-emitting component 100 in accordance with FIG

Embodiment. The device 100 has a substrate 1. In particular, the substrate 1 is a metal foil or a plastic foil and is hermetically sealed. Above the substrate 1, a planarization layer 3 is applied in a structured manner. The planarization layer 3 has a smaller lateral extent in cross-section than the substrate 1. Above the planarization layer 3, a first electrode 2 and metallizations 8 are arranged. Insulation is arranged between the first electrode 2 and the second electrode 6 to avoid a short circuit (not shown here). Above the first electrode 2 are an organic functional layer stack 5 and above a second electrode 6

arranged. The device 100 of Figure 2 also has a Encapsulation 7 on. The component 100 of FIG. 2 may have a further planarization layer 31, which may also be part of the encapsulation 7. The encapsulation 7 and the substrate 1 protect at least the organic functional layer stack 5 from environmental influences and form a hermetically sealed encapsulation. By applying the planarization layer 3 to the substrate surface 1, the substrate is compatible with other materials that are also used in the manufacture of glass-based rigid devices. For example, there are now no adhesion problems between the metallization 8 and the planarization layer 3.

In addition, the planarization layer 3 by means of

wet-chemical process are applied so that no restructure is necessary.

FIGS. 3A to 3D each show a layer structure according to an embodiment. The layer structure has a planarization and a barrier effect simultaneously.

FIG. 3A shows a layer structure of a pair of layers 3 and 9. The layer pair 10 has a

Planarisierungsschicht 3 and a means

Atomschichtabscheideverfahren produced layer 9, which has in particular a metal oxide on. Above the

Metal oxide layer is arranged another planarization layer 31. Only one layer pair 10 is shown in FIG. 3B, the layer 9 produced by means of atom layer deposition processes being arranged above the planarization layer 3. FIG. 3C shows the opposite case, whereby the layer 9 produced by means of atomic layer deposition processes is arranged below the planarization layer 3. However, the layer 9 produced by means of atomic layer deposition can also be produced by another method, for example PVD or PECVD or by sputtering. Preferably, ALD is used, as it allows a homogeneous layer growth with a very good barrier effect can be achieved.

In Figure 3D, the structured application of a

Planarisierungsschicht 3, wherein subsequently produced by means of atom layer deposition process layer 9 is applied. The layer 9 produced by atomic layer deposition completely surrounds both the surface and the side surfaces of the planarization layer 3. The layer 9 produced by means of atomic layer deposition process is followed by a further planarization layer 31, which the side surfaces and the surfaces of the means of

Atomschichtabscheideverfahren produced layer 9 positively and cohesively surrounds.

By structuring, a lateral penetration of environmental influences can be avoided or prevented.

FIG. 4A shows a schematic side view of a layer pair according to an embodiment. In comparison with the layer pair 10 of FIG. 3A, the layer pair 10 of FIG. 4A shows a layer pair of a planarization layer 9 and a layer 9 produced by means of atom layer deposition processes, the planarization layer 3 being between the layer 9 produced by means of atomic layer deposition processes and another layer 91 produced by atomic layer deposition method.

In FIG. 4B, in comparison to FIG. 4A, it is shown that the planarization layer 3 is applied in a structured manner.

FIGS. 5A and 5B each show a layer structure according to an embodiment. Both figures show two

Layer pairs 10 from a planarization layer 3 and a layer 9 produced by means of atom layer deposition process or a further planarization layer 31 and another by means of atom layer deposition process

Layer 91 which is produced by means of atom layer deposition processes is arranged downstream of the two layer pairs 10, so that an alternating arrangement of planarization layer and by means of

Atomschichtabscheideverfahren produced layer is produced. The layer structure of FIG. 5B differs from the layer structure of FIG. 5A in that the

Planarisierungsschichten 3 and 31 are applied structured. In other words, the planarizing layers have a smaller lateral extent in cross section compared to those by means of atomic layer deposition methods

produced layers 9, 91 and 92.

There may also be more than two pairs of layers, for example three, four, five, six, seven, eight, nine or ten

Layer pairs are generated as a layer structure. Thus, a layer structure can be generated, in addition to the

Planarization also has a very good barrier effect. The ones described in connection with the figures

Embodiments and their features can also be combined with each other according to further embodiments, even if such combinations are not explicitly shown in the figures. Furthermore, in conjunction with the

Figures embodiments described additional or alternative features as described in the general part. The invention is not by the description based on the

Embodiments limited to these. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes any combination of features in the patent claims, even if this feature or combination itself is not explicitly described in the claims

Claims or embodiments is given.

This patent application claims the priority of German Patent Application 10 2016 106 847.0, the disclosure of which is hereby incorporated by reference.

Reference sign list

1 substrate

10 layer pair

100 organic light emitting device

2 first electrode

3 PIanarization layer

31 additional planarization layer

4 perhydropolysilazane or polysilazane

5 organic functional layer stacks

6 second electrode

7 encapsulation

8 metallization

9 shows a layer made by ALD

91, a further layer produced by ALD

Claims

claims

1. A process for producing an organic

light emitting device (100) comprising the steps of:

A) providing a substrate (1),

B) applying a first electrode (2) to the substrate

(1) ,

C) applying at least one organic functional

Layer stack (5), which is responsible for the emission of radiation

is arranged and arranged at least over the first electrode (2),

D) applying a second electrode (6) over the

organic functional layer stack (5), and

E) application of perhydropolysilazane (4) by means of

wet chemical method and curing of

Perhydropolysilazane (4) for producing at least one

Planarisierungsschicht (3) between the first electrode

(2) and the substrate (1) and / or over the second electrode (6) is arranged,

wherein in step E) a layer structure with at least one

Layer pair (10) is generated and each layer pair of the planarization layer (3) and a means

Atomic layer deposition or chemical

Gas phase deposition produced layer (9) is formed, and

wherein the layer (9) produced by means of atomic layer deposition or chemical vapor deposition completely surrounds both a surface facing away from the substrate (1) and side surfaces of the planarization layer (3).

2. The method according to claim 1,

wherein the layer produced by atomic layer deposition method or chemical vapor deposition layer (9) another Planarisierungsschicht (31) is arranged downstream of the side surfaces and one the substrate (9)

Surface of the layer produced by means of Atomlagenabscheideverfahren or chemical vapor deposition layer (9) positively and cohesively surrounds.

3. Method according to at least one of the preceding

Claims,

wherein the wet chemical process is selected from the group consisting of coating, coating, spray coating, inkjet, screen printing, spin coating, gravure printing, flexographic printing and stencil printing.

4. Method according to at least one of the preceding

Claims,

wherein over the second electrode (6), a layer stack is applied to the encapsulation (7), the

Planarisierungsschicht (3).

5. The method according to at least one of the preceding

Claims,

wherein the curing in step E) takes place at a temperature of greater than or equal to 80 ° C.

6. Method according to at least one of the preceding

Claims 1 to 4,

wherein the curing in step E) takes place by means of UV light.

7. The method according to claim 6,

wherein the UV light is xenon light having a wavelength of 172 +/- 3 nm.

8. Method according to at least one of the preceding

Claims,

wherein the planarization layer (3) is disposed directly between the first electrode (2) and the substrate (1).

9. Method according to at least one of the preceding

Claims,

wherein the planarization layer (3) is applied in a structured manner such that the planarization layer (3) has a smaller lateral extent than the substrate in cross section, wherein the component has an encapsulation (7), the planarization layer (3), the encapsulation (7). and the substrate (1) faces a diffusion barrier

Environmental influences is.

10. The method according to at least one of the preceding

Claims,

wherein a layer structure with at least one layer pair (10) is produced, wherein each layer pair of the

Planarisierungsschicht (3) or another

Planarisierungsschicht (31) and a means of

Atomic layer deposition or chemical

Gas phase deposition produced layer (9) or another produced by atomic layer deposition or chemical vapor deposition layer (91, 92, 93) is formed, wherein the at least one pair of layers is arranged downstream of another planarization layer (31), so that an alternating sequence of planarization layer (3) or another planarization layer (31) and by means of atomic layer deposition or chemical

Gas phase deposition produced layer (9) or further by means of atomic layer deposition method or chemical Gas phase deposition produced layer (91, 92) is produced.

11. The method according to at least one of the preceding

Claims,

Planarisierungsschicht (3) or another

Planarisierungsschicht (31) and a means of

Atomschichtabscheideverfahren produced layer (9) or another means of Atomlagenabscheideverfahren

formed layer (91, 92, 93) is formed, wherein the at least one pair of layers another means

Atomschichtabscheideverfahren produced layer (91, 92, 93) is arranged downstream, so that an alternating sequence of planarization layer (3) or another

Planarisierungsschicht (31) and means

Atomschichtabscheideverfahren produced layer (9) or other produced by atomic layer deposition method layer (91, 92) is produced.

12. The method according to claim 10 or 11,

wherein the layer structure is part of an encapsulation.

13. The method according to claim 10, 11 or 12,

wherein the layer structure has more than two pairs of layers (10) and by means of Atomlagenabscheideverfahren

each formed of a metal oxide, carbide, nitride or metal nitride are formed.

14. Method according to at least one of the preceding

Claims,

wherein the substrate (1) is flexible.

15. Organic light-emitting component (100)

including

a substrate (1),

a first electrode (2) arranged above the substrate (1),

- At least one organic functional layer stack (5), which is set up for the emission of radiation and

at least above the first electrode (2) is arranged

- A second electrode (6), which is above the organic

functional layer stack (5) is arranged,

a planarization layer (3) arranged between the first electrode (2) and the substrate (1) and / or over the second electrode (6), wherein the

Planarisierungsschicht (3) of Perhydropolysilazan (4) is generated,

a layer structure comprising at least one layer pair (10), each layer pair being formed from the planarization layer (3) and a layer (9) produced by means of atomic layer deposition or chemical vapor deposition, and

16. Component according to claim 15,

wherein the planarization layer (3) is structured.

17. Component according to claim 15 or 16,

wherein a layer structure has at least one layer pair (10), each layer pair being made of the

Planarisierungsschicht (3) or another

Planarisierungsschicht (31) and a means of Atomic layer deposition or chemical

A further planarization layer (31) is produced downstream of the at least one layer pair, so that an alternating sequence of planarization layer (3) is formed downstream of the layer (9) produced by atomic layer deposition or chemical vapor deposition. or another planarization layer (31) and by means of atomic layer deposition or chemical

Gas phase deposition produced layer (91, 92) is produced.

18. The device according to at least one of claims 15 to 17, wherein the planarization layer (3) has an RMS value of less than 200 nm.