WO2017171269A1 - Filtre coloré souple intégré à un capteur de toucher, et dispositif d'affichage à cristaux liquides souple et son procédé de fabrication - Google Patents

Filtre coloré souple intégré à un capteur de toucher, et dispositif d'affichage à cristaux liquides souple et son procédé de fabrication Download PDF

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Publication number
WO2017171269A1
WO2017171269A1 PCT/KR2017/002714 KR2017002714W WO2017171269A1 WO 2017171269 A1 WO2017171269 A1 WO 2017171269A1 KR 2017002714 W KR2017002714 W KR 2017002714W WO 2017171269 A1 WO2017171269 A1 WO 2017171269A1
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Prior art keywords
layer
color filter
flexible
thin film
film transistor
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PCT/KR2017/002714
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English (en)
Korean (ko)
Inventor
윤억근
윤주인
박용수
최용석
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동우화인켐 주식회사
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Priority to CN201780021095.7A priority Critical patent/CN108885364B/zh
Publication of WO2017171269A1 publication Critical patent/WO2017171269A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133357—Planarisation layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper

Definitions

  • the present invention relates to a flexible liquid crystal display, and more particularly, to a flexible color filter in which a touch sensor is integrated, a flexible liquid crystal display in which a touch sensor, a color filter, and a thin film transistor array are integrated, and a method of manufacturing the same.
  • Flexible (flexible) display means a display fabricated on a flexible substrate that can bend, bend or roll without loss of properties, and technologies are being developed in the form of flexible LCDs, flexible OLEDs, and electronic paper.
  • an application invention related to "a method of manufacturing a flexible color filter and a flexible color display device" is disclosed in Korean Patent Laid-Open No. 10-2014-0126681.
  • the invention disclosed in Korean Patent Application Laid-Open No. 10-2014-0126681 provides a bonding substrate comprising a rigid support substrate and a carrier removing adhesive layer disposed on the support substrate, and providing a flexible substrate on the carrier removing adhesive layer. Bonding, forming a color filter layer on the flexible substrate to form a color filter module, and separating the flexible substrate from the support substrate by placing the color filter module at -20 ° C to 20 ° C for 3 to 40 minutes. To perform a cooling process to produce a flexible color filter.
  • the exemplified application publication is a technique of manufacturing a flexible color filter in a film form by adhering a film layer, such as a flexible substrate, onto a substrate to form a color filter layer, and then peeling the film layer through a cooling process.
  • a main object of the present invention is a flexible color filter in which a touch sensor is integrated without using a film layer, a flexible liquid crystal display including the same, and a manufacturing thereof.
  • another object of the present invention is to provide a flexible color filter and a flexible liquid crystal display including the same, in which a touch sensor is integrated, which can improve production yield compared to a conventional method of manufacturing a color filter by adhering a film layer on a substrate. In providing.
  • the present invention provides a highly reliable flexible liquid crystal display device without deformation of the product components even in the high temperature process of the manufacturing process, and provides a flexible liquid crystal display device and a method of manufacturing the integrated touch sensor and color filter, as well as touch
  • Another object of the present invention is to provide a flexible liquid crystal display and a method of manufacturing the same, in which a sensor, a color filter, and a thin film transistor array are integrated.
  • a flexible liquid crystal display device is provided.
  • a flexible color filter array module in which a touch sensor and a color filter array are integrally formed on a first substrate film;
  • a thin film transistor array module having a first separation layer and a capping layer formed on the substrate layer, and a thin film transistor array formed on the capping layer;
  • the flexible color filter array module and the thin film transistor array module are bonded to each other so that the thin film transistor array and the color filter array formed on the flexible color filter array module face each other, and a liquid crystal layer formed on the bonding surface.
  • the flexible color filter array module includes
  • the flexible color filter integrated with the touch sensor according to the embodiment of the present invention is formed on a glass substrate without using a film layer, even if a high temperature process is applied, the base material for forming the touch sensor and color filter (That is, there is no fear of deformation of the illustrated prior art film layer), there is an advantage that can produce a reliable product, that is, a flexible color filter in which the touch sensor is integrated,
  • the present invention does not use a separate film layer for forming the touch sensor and the color filter, there is also an advantage that can improve the production yield compared to the disclosed invention exemplified in the prior art literature.
  • the present invention provides a flexible liquid crystal display device including a flexible color filter array and a thin film transistor array without deformation of product components even at a high temperature process in a manufacturing process, but using a flexible liquid crystal display device in which a touch sensor is integrated together. It is a useful invention that can be produced.
  • FIG. 1 is an exemplary cross-sectional view of a flexible color filter incorporating a touch sensor according to an exemplary embodiment of the present invention.
  • FIG. 2 is a view for explaining the effect of the step difference caused by the electrode pattern constituting the touch sensor when forming the color filter array on the protective layer.
  • FIG. 3 is a flow chart illustrating a manufacturing process of the flexible color filter integrated with a touch sensor according to an embodiment of the present invention.
  • 4 and 5 are cross-sectional view illustrating the manufacturing process of the flexible color filter according to an embodiment of the present invention.
  • FIG. 6 is an enlarged partial view of a flexible color filter according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view illustrating a flexible color filter array module (a) and a thin film transistor array module (b) constituting a flexible liquid crystal display device according to an exemplary embodiment of the present invention.
  • FIG. 8 is a view illustrating a bonding state of a flexible liquid crystal display device manufactured by bonding the flexible color filter array module and the thin film transistor array module shown in FIG. 7.
  • FIG. 9 is a flow chart illustrating a manufacturing process of a thin film transistor array module according to an embodiment of the present invention.
  • FIGS. 10 and 11 are cross-sectional views illustrating intermediate products of manufacturing processes of a thin film transistor array module according to an exemplary embodiment of the present invention.
  • FIG. 1 illustrates a cross-sectional structure of a flexible color filter incorporating a touch sensor according to an exemplary embodiment of the present invention.
  • the flexible color filter integrated with the touch sensor forms a separation layer on a glass substrate without using a film layer to prevent deformation of the film layer by a high temperature process.
  • the manufacturing method by adhering the base film (100).
  • an electrode pattern layer for constructing or implementing a touch sensor includes a first electrode pattern 131 arranged in a first direction (for example, the x-axis direction) and a second direction (for example, the y-axis direction).
  • the electrode pattern layers include the first and second electrode patterns 131 and 132, the insulating layer 133, and the bridge electrode pattern 135.
  • reference numeral 110 represents an adhesive applied to one surface of the base film 100.
  • the color filter layer constituting the color filter array is denoted by reference numeral 160, and reference numeral 170 denotes an ITO common electrode constituting the color filter array.
  • a protective layer may be further formed between the separation layer 120 and the electrode pattern layers 131, 132, 133, and 135.
  • the protective layer is illustrated using the reference numeral 125 in FIG. 4.
  • color distortion may occur due to pixel deformation of the color filter due to a step generated by an electrode pattern constituting the touch sensor. have.
  • the thickness of the planarization layer 150 is preferably 2 ⁇ m or more, and the planarization layer 150 may be formed of an organic insulating material.
  • the surface level (roughness) thickness of the planarization layer 150 is 0.1 ⁇ m or less, color distortion of the color filter may be prevented.
  • FIG. 2 illustrates a screen visually recognized as a stain due to color shift due to the surface leveler step difference when the surface step thickness is 0.1 ⁇ m or more, and FIG. The graph comparing the characteristics of the panel is illustrated.
  • the surface step thickness is 0.1 ⁇ m or less, color distortion of the color filter can be prevented normally, so that the surface step thickness is preferably 0.1 ⁇ m or less.
  • FIG. 3 is a flow chart illustrating a manufacturing process of a flexible color filter integrated with a touch sensor according to an embodiment of the present invention
  • FIGS. 4 and 5 are cross-sectional views of manufacturing processes of a flexible color filter integrated with a touch sensor according to an embodiment of the present invention
  • 6 illustrates a partial enlarged view of a flexible color filter in which a touch sensor according to an exemplary embodiment of the present invention is integrated.
  • a polymer organic film is coated on a glass substrate, which is a carrier substrate, to form a separation layer 120 as illustrated in FIG. 4A (S10).
  • the separation layer 120 is a layer formed to separate the touch sensor TS and the color filter array CF from the glass substrate to be formed on the glass substrate, and the separation layer 120 is formed on the electrode pattern layers 131, 132, 133, and 135. ) To cover and insulate it.
  • a method of applying the separation layer may use a known coating method such as spin coating, die coating, spray coating, or the like.
  • the peel force of the separation layer 120 is not particularly limited, but may be, for example, 0.01 to 1 N / 25 mm, and preferably 0.01 to 0.2 N / 25 mm. When the above range is satisfied, the separation layer 120 may be easily peeled off from the glass substrate in the manufacturing process, and curls and cracks due to tension generated during peeling may be reduced.
  • the thickness of the separation layer 120 is not particularly limited, but may be, for example, 10 to 1,000 nm, preferably 50 to 500 nm. When the said range is satisfied, peeling force is stable and a uniform pattern can be formed.
  • the material of the separation layer 120 is a polyimide polymer, a polyvinyl alcohol polymer, a polyamic acid polymer, a polyamide polymer, a polyethylene polymer, a polystyrene polymer, a polynorbornene polymer, a phenylmaleimide copolymer (phenylmaleimide It may be made of a polymer such as a copolymer-based polymer, polyazobenzene-based polymer, it can be used alone or mixed two or more kinds.
  • the curing process for forming the separation layer 120 may be used alone or in combination with thermosetting or UV curing, thermosetting and UV curing in combination.
  • a protective layer 125 (which may be referred to as a first protective layer) may be further formed on the separation layer 120.
  • This protective layer 125 is an optional component that can be omitted as needed.
  • the protective layer 125 covers and protects the electrode pattern layers 131, 132, 133, and 135, which will be described later, together with the separation layer 120.
  • the protective layer 125 may be formed to cover at least a portion of the side surface (edge sidewall) of the separation layer 120. In terms of completely blocking side exposure of the separation layer 120, the protective layer 125 is preferably configured to cover all of the side surfaces of the separation layer 120.
  • the electrode pattern layer forming step (S30) a process of forming the electrode pattern layers 131, 132, 133, and 135 on the protective layer 125 or the separation layer 120 is performed.
  • the electrode pattern layers 131, 132, 133, and 135 are components for detecting a touch signal input by a user, that is, a first electrode pattern 131 for detecting x coordinates, and a second electrode pattern 132 for detecting y coordinates. ), A bridge electrode pattern 135 for connecting the second electrode pattern 132, and an insulating layer 133 for insulating the electrode pattern and the bridge electrode pattern 135. Since the process of forming the electrode pattern layers 131, 132, 133, and 135 and the forming materials are already known, the following descriptions will be omitted. In FIGS. 4C, 4D, and 1E, the first and second layers may be formed on the protective layer 125.
  • a cross-sectional structure for each manufacturing process is illustrated in which electrode patterns 131 and 132 are formed, insulating layers 133 are formed on the first and second electrode patterns 131 and 132, and bridge electrode patterns 135 are formed on the insulating layer 133. It was.
  • the thickness and the number of layers of the electrode pattern layers 131, 132, 133, and 135 are not particularly limited, but are preferably thin films in consideration of flexibility of the touch sensor.
  • a protective layer 140 (also referred to as a second protective layer) is formed to cover the electrode pattern layers 131, 132, 133, and 135 as illustrated in FIG. 5F (S40). do.
  • the passivation layer 140 may be formed to have a flat surface on the opposite side of the contact surface of the electrode pattern layers 131, 132, 133, and 135.
  • the passivation layer 140 may be formed of a single layer or a plurality of layers or more. It is preferable to form a material or material having the same refractive index as the layer 133.
  • the planarization layer 150 is formed on the passivation layer 150 (S50). As described above, the planarization layer 150 is formed to prevent color distortion due to pixel deformation of the color filter due to the step generated by the electrode pattern.
  • the thickness of the planarization layer 150 is preferably 2 ⁇ m or more, and the material for forming the planarization layer 150 is preferably formed of an organic insulating material.
  • the pixel of the color filter may be caused by the generation of the step S due to the electrode pattern of the touch sensor. Since there is no deformation, color shifting can be prevented.
  • a color filter array CF is formed on the planarization layer 150 as illustrated in FIG. 5H (S60).
  • the color filter array CF may include a light blocking layer, color filter (R, G, and B) layers 160, and an ITO common electrode 170.
  • the light blocking layers are spaced apart from each other to form a matrix, which is referred to as a black matrix layer.
  • the color filter (R, G, B) layer 160 is formed between the light blocking layers, and the ITO common electrode 170 is formed again on the color filter (R, G, B) layer 160.
  • the protective film coated on one surface of the adhesive layer is then bonded onto the color filter array CF through a transfer process (step S70). do.
  • the glass substrate is separated from the separation layer 120 (S80 step). That is, the separation layer 120 in which the touch sensor and the color filter are integrated may be separated from the glass substrate by using a method of peeling.
  • the peeling method may include a lift-off or peel-off method, but is not limited thereto.
  • step S90 the base film 100 coated with the adhesive 110 is applied to one surface of the separation layer 120 separated from the glass substrate (step S90), and the protective film bonded on the color filter array CF is removed (step S100).
  • the flexible color filter in which the touch sensor having the cross-sectional structure as shown in FIG. 1 is integrated can be manufactured.
  • the flexible color filter manufactured according to the above-described manufacturing process is formed on a glass substrate without using a film layer, even if a high temperature process is applied, the base material for forming the touch sensor and the color filter (that is, There is no fear of deformation of the film layer) and thus a reliable product, that is, a flexible color filter in which a touch sensor is integrated can be manufactured.
  • the present invention does not use a separate film layer for forming the touch sensor and the color filter, there is also an advantage that can improve the production yield compared to the disclosed invention exemplified in the prior art literature.
  • a separation layer is formed on a glass substrate according to a sales policy, an electrode pattern layer constituting a touch sensor is formed on the separation layer, and a protective layer is formed on the electrode pattern layer.
  • a flattening layer for preventing color distortion of the color filter, and a flexible color filter in which a protective film is bonded on the color filter array after forming a color filter array on the flattening layer may be sold.
  • the planarization layer of the flexible color filter having such a structure is also formed of an organic insulating material, and the thickness of the planarization layer is preferably 2 ⁇ m or more and the surface step is 0.1 ⁇ m or less.
  • a flexible liquid crystal display using a flexible color filter in which a touch sensor that can be manufactured by the manufacturing method described above is integrated and a method of manufacturing the liquid crystal display will be described. More specifically, a flexible color in which the touch sensor is integrated
  • a flexible liquid crystal display device integrating a filter and a thin film transistor array and a manufacturing method thereof will be described.
  • the flexible color filter integrated with the touch sensor manufactured by FIG. 3 may be referred to as "flexible”.
  • the thin film transistor array bonded to the flexible color filter array module "CFAM” and the thin film transistor array module “TFTAM” will be described.
  • CFAM Integrated touch sensor Flexible Color filter array module
  • TFTAM thin film transistor array module
  • FIG. 7 is a cross-sectional structural view of a flexible color filter array module (CFAM) (a) and a thin film transistor array module (TFTAM) (b) constituting a flexible liquid crystal display according to an exemplary embodiment of the present invention.
  • CFAM flexible color filter array module
  • TFTAM thin film transistor array module
  • CFAM thin film transistor array module
  • a flexible color filter array module CFAM in which the touch sensor TS and the color filter array CF are integrally formed on the first substrate film 100;
  • a first separation layer 220 and a capping layer 240 are formed on the base film 200 (which may be a non-flexible substrate as a modified embodiment), and a thin film transistor array (TFT) is formed on the capping layer 240.
  • TFT thin film transistor array
  • the flexible color filter array module CFAM and the thin film transistor array module TFTAM face the thin film transistor array TFT 250 and the color filter array CF formed in the flexible color filter array module CFAM. It is bonded, but includes a liquid crystal layer 270 formed on the bonding surface.
  • the protective layer 230 is disposed between the first separation layer 220 and the capping layer 240 on the second substrate film 200 constituting the thin film transistor array module TFTAM. ) May be further formed.
  • a protective layer may be further formed between the separation layer 120 formed on the first substrate film 100 constituting the flexible color filter array module CFAM and the electrode pattern layer constituting the touch sensor TS.
  • an alignment layer is formed 180 on the color filter array CF, and the alignment layer 180 is formed later by giving an alignment to the alignment layer 180 by an exposure process. It is preferable to arrange the liquid crystal layer 270 in a predetermined direction.
  • FIG. 7A illustrates a state in which an alignment layer 180 is formed on a flexible color filter array module CFAM
  • FIG. 7B illustrates an alignment layer on a thin film transistor array module TFTAM. It shows to the state in which the 260 and the liquid crystal layer 270 are formed.
  • a flexible liquid crystal display device in which a thin film transistor array, a touch sensor, and a color filter array are integrated may be manufactured. This will be described later with reference to FIG. 8.
  • TFT thin film transistor array
  • TFT thin film transistor array
  • TFT thin film transistor array module
  • FIGS. 10 and 11 are cross-sectional views of intermediate products of each manufacturing process of a thin film transistor array module according to an exemplary embodiment of the present invention. It is illustrated.
  • a polymer organic film is coated on a glass substrate to form a separation layer 220 as illustrated in FIG. 10A (S110).
  • the separation layer 220 is a layer formed to separate the thin film transistor array (TFT, 250) formed on the glass substrate from the glass substrate, and the separation layer 220 is formed on the thin film transistor array (TFT, 250). It can also be carried out with the function of wrapping and insulating the insulation.
  • the method of applying the separation layer 220 may be a known coating method such as spin coating, die coating, spray coating and the like.
  • a protective layer 230 may be additionally formed on the separation layer 220 (S120). This protective layer 230 is an optional component that can be omitted as needed.
  • the protective layer 230 covers the thin film transistor array TFT 250 to be described later together with the separation layer 220 to protect the thin film transistor array layer.
  • the protective layer 230 may be formed to cover at least a portion of the side surface of the separation layer 220.
  • the side of the separation layer 220 is an edge sidewall of the separation layer 230.
  • the protective layer 230 is preferably configured to cover all of the side surfaces of the separation layer 220.
  • the capping layer 240 is disposed on the separation layer 220 or on the protection layer 230.
  • the capping layer 240 is formed by forming a capping layer 240 so as to cover the side of the separation layer 220 and the protective layer 230 by depositing a composition for forming a capping layer, preferably an inorganic insulating material such as SiNx, SiOx, or the like. It is desirable to.
  • the capping layer 240 is formed on the separation layer 220 or the protective layer 230, the thin film is sequentially formed on the capping layer 240 as illustrated in FIGS. 10D and 10E and 11.
  • the transistor array TFT 250 is formed (step S140).
  • the thin film transistor array TFT 250 may include a gate layer (gate electrode metal layer 251), a gate insulating layer 253, a semiconductor layer 255, an active layer and an ohmic contact layer, and an S / D layer (source / A drain electrode metal layer 257, a passivation layer 258, and an ITO pixel electrode layer 259 may be included.
  • a gate layer gate electrode metal layer 251
  • a gate insulating layer 253 a semiconductor layer 255
  • an active layer and an ohmic contact layer an S / D layer
  • S / D layer source / A drain electrode metal layer 257, a passivation layer 258, and an ITO pixel electrode layer 259 may be included.
  • the gate layer 251 may be formed of a conductive material such as Mg, Al, Ni, Au, and the like, and as illustrated in FIG. 10E, the gate insulating layer covering the gate layer 251.
  • Reference numeral 253 may be formed of an insulating material layer such as a silicon oxide layer or a silicon nitride layer.
  • an active layer which is one component of the semiconductor layer 255, is formed on the gate insulating layer 253.
  • the active layer overlaps the gate layer 251 to form a channel.
  • a channel is formed between the source / drain electrodes of the S / D layer 257 on the gate layer 251. It can be formed from a polysilicon layer or an amorphous silicon layer as an active layer.
  • the ohmic contact layer constituting the semiconductor layer 255 is formed on the active layer except for the channel portion for ohmic contact with the source / drain electrodes.
  • the source / drain electrodes of the S / D layer 257 are formed to face each other with the channel portion therebetween.
  • a protective layer 258 is formed on the S / D layer 257, and a pixel electrode layer 259 connected to the source / drain electrodes is formed as shown in FIG. 11D.
  • the pixel electrode is formed using an indium tin oxide (ITO) electrode.
  • the protective layer 258 may also be formed of an inorganic insulating material or an organic insulating material. It will be apparent to those skilled in the art that such a thin film transistor array is only one example and may be formed in various known manners.
  • the protective film coated on one surface of the adhesive layer is bonded to the pixel electrode layer 259 (S150).
  • the protective film may be a transparent optical film or a polarizing plate.
  • the transparent optical film may be surface treated as needed. Such surface treatments include, for example, plasma treatments, corona treatments, dry treatments such as primer treatments, and chemical treatments such as alkali treatments including saponification treatments.
  • the transparent optical film may be an isotropic film, a retardation film or a protective film.
  • the glass substrate as the carrier substrate and the separation layer 220 are separated (step S160). That is, the separation layer 220 in which the thin film transistor array TFT 250 is formed may be separated from the organic substrate using a method of peeling.
  • the peeling method may include a lift-off or peel-off method, but is not limited thereto.
  • a thin film transistor array module having a cross-sectional structure as shown in b) may be manufactured.
  • TFT array the protective film positioned on the TFT array is removed, and then the alignment layer 260 and the liquid crystal layer 270 are additionally formed.
  • the thin film transistor array module (TFTAM) is manufactured by the above method, the thin film transistor array is also formed on the glass substrate, so there is no fear of deformation of the base material for forming the semiconductor layer even if a high temperature process for forming the semiconductor layer is applied. Reliable thin film transistor arrays can be fabricated.
  • the alignment layers 180 and 260 are formed on the respective modules TFTAM and CFAM, respectively, to impart alignment properties to prevent distortion of the liquid crystal that may be generated during flexible implementation.
  • the alignment film patterning process for imparting orientation can use a method disclosed in Application No. 10-2010-0025931.
  • the liquid crystal layer 270 is formed on the thin film transistor array TFT above the thin film transistor array module TFTAM, and then on the thin film transistor array module TFTAM.
  • FIG. 8 illustrates a thin film transistor array module TFTAM and a flexible color filter array module CFAM such that the liquid crystal layer 270 formed thereon and the color filter array CF formed on the flexible color filter array module CFAM face each other. Joining as shown in (c) of FIG.
  • a flexible liquid crystal display device in which the thin film transistor array, the color filter, and the touch sensor are integrated may be manufactured.
  • the present invention can manufacture a flexible liquid crystal display device including a flexible color filter array and a thin film transistor array without deformation of product components even at a high temperature process in a manufacturing process, but can manufacture a flexible liquid crystal display device in which a touch sensor is integrated together. It is a useful invention.
  • the flexible liquid crystal display device may be manufactured by bonding an external thin film transistor array module to the flexible color filter array module according to an embodiment of the present invention, and the substrate layer of the thin film transistor array module. May be one of the base film or the non-flexible substrate described in the embodiment of the present invention.

Abstract

La présente invention concerne un filtre coloré souple intégré à un capteur de toucher, et un dispositif d'affichage à cristaux liquides souple intégré à un capteur de toucher, un filtre coloré et un réseau de transistors en couches minces et son procédé de fabrication. La présente invention présente un avantage dans la mesure où, puisqu'un filtre coloré intégré à un réseau de transistors en couches minces ou à un capteur de toucher sur un substrat en verre est formé, il est possible de fabriquer un produit fiable, c'est-à-dire un réseau de transistors en couches minces, un filtre coloré souple intégré à un capteur de toucher, un dispositif d'affichage à cristaux liquides souple intégré à un capteur de toucher, un filtre coloré et un réseau de transistors en couches minces, sans risque de déformation d'un matériau de base nécessaire pour la formation d'une couche semi-conductrice même lorsqu'un processus à température élevée est appliqué pour la formation de la couche semi-conductrice.
PCT/KR2017/002714 2016-03-31 2017-03-14 Filtre coloré souple intégré à un capteur de toucher, et dispositif d'affichage à cristaux liquides souple et son procédé de fabrication WO2017171269A1 (fr)

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CN201780021095.7A CN108885364B (zh) 2016-03-31 2017-03-14 与触摸传感器集成的柔性彩色滤光片、柔性液晶显示器及其制造方法

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KR10-2016-0039760 2016-03-31
KR1020160039760A KR102543630B1 (ko) 2016-03-31 2016-03-31 터치 센서가 일체화된 플렉서블 컬러 필터와 플렉서블 액정 표시 장치 및 그 제조방법

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CN112445015A (zh) * 2019-09-04 2021-03-05 群创光电股份有限公司 电子装置及其制造方法
KR20220006242A (ko) * 2020-07-08 2022-01-17 동우 화인켐 주식회사 터치 센서, 터치 센서 제조방법 및 터치 센서를 포함하는 화상 표시 장치

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KR102543630B1 (ko) 2023-06-14
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TW201741696A (zh) 2017-12-01
CN108885364B (zh) 2022-03-08
KR20170112582A (ko) 2017-10-12

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