WO2016093519A1 - Capteur tactile à film et son procédé de fabrication - Google Patents

Capteur tactile à film et son procédé de fabrication Download PDF

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Publication number
WO2016093519A1
WO2016093519A1 PCT/KR2015/012836 KR2015012836W WO2016093519A1 WO 2016093519 A1 WO2016093519 A1 WO 2016093519A1 KR 2015012836 W KR2015012836 W KR 2015012836W WO 2016093519 A1 WO2016093519 A1 WO 2016093519A1
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WO
WIPO (PCT)
Prior art keywords
layer
polymer
protective layer
touch sensor
film
Prior art date
Application number
PCT/KR2015/012836
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English (en)
Korean (ko)
Inventor
유병묵
윤억근
최용석
Original Assignee
동우화인켐 주식회사
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Application filed by 동우화인켐 주식회사 filed Critical 동우화인켐 주식회사
Publication of WO2016093519A1 publication Critical patent/WO2016093519A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a film touch sensor and a manufacturing method thereof.
  • an ultra-thin flexible display that achieves ultralight weight, low power, and improved portability has been attracting attention as a next generation display, and development of a touch sensor applicable to such a display has been required.
  • a flexible display means a display manufactured on a flexible substrate that can bend, bend, or roll without loss of properties, and technology development is in progress in the form of a flexible LCD, a flexible OLED, and an electronic paper.
  • a touch sensor having excellent bending and resilience and excellent flexibility and elasticity is required.
  • a wiring forming step of forming a metal wiring on the substrate a laminating step of applying and drying a transparent resin solution to cover the metal wiring to form a transparent resin substrate, and a peeling process of peeling the transparent resin substrate from the substrate.
  • an inorganic peeling material such as an organic peeling material such as a silicone resin or a fluororesin, a diamond like carbon thin film (DLC) thin film or a zirconium oxide thin film is applied to the surface of the substrate.
  • DLC diamond like carbon thin film
  • the method proposed in Korean Patent No. 10-1191865 includes a sacrificial layer, a metal wiring, and a metal layer, which may be removed by light or a solvent in the manufacturing of a flexible substrate having a metal wiring embedded therein. After the polymer material (flexible substrate) is formed on the substrate, the metal wiring and the polymer material (flexible substrate) are peeled off from the substrate by removing the sacrificial layer using light or a solvent.
  • An object of the present invention is to provide a film touch sensor and a method of manufacturing the same, in which a process proceeds on a carrier substrate to facilitate formation of a pattern layer or the like.
  • An object of the present invention is to provide a film touch sensor which is easily peeled from a carrier substrate and a method of manufacturing the same.
  • a first protective layer on the separation layer
  • an electrode pattern layer including a sensing electrode formed in the sensing region on the first protective layer and a pad electrode formed in the pad region.
  • the separation layer is a polyimide-based polymer, polyvinyl alcohol-based polymer, polyamic acid-based polymer, polyamide-based polymer, polyethylene (polyethylene) ) Polymer, polystylene polymer, polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide Polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine ( It is made of a polymer selected from the group consisting of phthalimidine-based polymers, chalc (chalcone) -based polymers, aromatic acetylene-based polymers, the film touch sensor.
  • the film touch sensor In the above 1, wherein the separation layer is first formed on the carrier substrate and separated from it, the film touch sensor.
  • the film touch sensor In the above 3, wherein the separation layer has a peel force of less than 1N / 25mm to the carrier substrate, the film touch sensor.
  • the film touch sensor In the above 3, wherein the separation layer has a peel force of less than 0.1N / 25mm to the carrier substrate, the film touch sensor.
  • the film touch sensor 7. In the above 1, wherein the first protective layer covers at least a portion of the side of the separation layer, the film touch sensor.
  • the film touch sensor 8. In the above 1, wherein the pad electrode has a surface energy difference of 20 mN / m or less with the separation layer and the first protective layer, the film touch sensor.
  • the electrode pattern layer is formed of at least one material selected from the group consisting of metal oxides, metals, metal nanowires, carbon-based materials and conductive polymer materials, film touch sensor.
  • the electrode pattern layer further comprises a second protective layer located on the first protective layer, film touch sensor.
  • the first protective layer and the second protective layer has a modulus of elasticity difference of less than 300MPa at 25 °C, film touch sensor.
  • the second protective layer and the adhesive layer has a modulus of elasticity difference of less than 300MPa at 25 °C, the film touch sensor.
  • the touch sensor film is a polarizing plate or a transparent film.
  • the touch sensor of claim 1 further comprising a circuit board electrically connected to the pad electrode.
  • Touch screen panel comprising the film touch sensor of any one of the above 1 to 15.
  • the separation layer is a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, polyethylene ) Polymer, polystylene polymer, polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide Polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine (
  • the film touch sensor is formed of a polymer selected from the group consisting of a phthalimidine polymer, a chalcone polymer, and an aromatic acetylene polymer. Manufacturing method.
  • the anisotropic conductive film having a conductive ball in the pad area on the separation layer is placed and then heated and pressurized, so that the conductive ball is connected to the pad electrode through the separation layer, the circuit board is anisotropic.
  • the present invention proceeds a process such as forming a pattern layer for implementing a film touch sensor on the carrier substrate, and then attach the base film, thereby preventing heat damage of the base film.
  • the separation layer is also peeled from the carrier substrate at the time of peeling from the carrier substrate, so that the electrode pattern layer can be protected, and then the electrical connection of the circuit board is easy.
  • a region other than the pad electrode in the pad region on the first protective layer may be filled with the first protective layer material, thereby preventing damage due to exposure to an etchant of the separation layer.
  • FIG. 2 is a plan view of a pad electrode a formed according to the present invention and a pad electrode b otherwise.
  • FIG 3 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
  • 6 to 15 is a schematic process diagram of a method of manufacturing a film touch sensor according to an embodiment of the present invention.
  • the present invention is a separation layer; A first protective layer on the separation layer; And an electrode pattern layer including a sensing electrode formed in the sensing region on the first protective layer and a pad electrode formed in the pad region, wherein a region other than the pad electrode in the pad region on the first protective layer is a first protective layer.
  • the present invention relates to a film touch sensor and a method for manufacturing the same, which can prevent thermal damage to a base film, and can easily form a pattern layer, and prevent damage caused by exposure to an etchant of a separation layer.
  • Film touch sensor includes a separation layer, the first protective layer and the electrode pattern layer.
  • FIGS. 6 to 15 illustrate a process of manufacturing a film touch sensor.
  • the separation layer 20 is a layer formed for separation from the carrier substrate 10, and covers the electrode pattern layers 40 and 50 to protect the electrode pattern layers 40 and 50.
  • the separation layer 20 is easily peeled off from the carrier substrate 10, and the peeling force on the carrier substrate 10 of the material is 1 N so as not to be peeled off from the first protective layer 30 to be described later. It is preferable that the material is / 25 mm or less, more preferably, the material having a peel force of 0.1 N / 25 mm or less on the carrier substrate 10.
  • the carrier substrate 10 may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little effect on heat or chemical treatment.
  • glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.
  • the first protective layer 30 is located on the separation layer 20.
  • the first protective layer 30 covers the electrode pattern layers 40 and 50 to be described later to protect the electrode pattern layers 40 and 50, and the manufacturing process of the film touch sensor of the present invention.
  • the separation layer 20 serves to prevent exposure to the etchant for forming the electrode pattern layers 40 and 50.
  • the first protective layer 30 a polymer known in the art may be used without limitation, and for example, may be made of an organic insulating layer.
  • the first passivation layer 30 may cover at least a portion of the side surface of the separation layer 20 so as to minimize the side surface of the separation layer 20 being exposed to an etchant during a process of patterning patterns to be described later.
  • the first protective layer 30 may preferably cover the entire side of the separation layer 20.
  • Electrode pattern layers 40 and 50 are disposed on the first passivation layer 30.
  • the electrode pattern layers 40 and 50 include the sensing electrode 50 and the pad electrode 40.
  • the sensing electrode 50 may be located in the sensing area on the first protective layer, and the pad electrode 40 may be located in the pad area on the first protective layer. However, since the sensing electrode 50 and the pad electrode 40 must be electrically connected, at least a part of the sensing electrode 50 may be located in the pad area, and at least a part of the pad electrode 40 is located in the sensing area. You may.
  • the electrode pattern layers 40 and 50 may be used without limitation as long as it is a conductive material.
  • the unit patterns of the electrode pattern layers 40 and 50 may be, for example, triangular, tetragonal, pentagonal, hexagonal, or polygonal polygonal patterns independently of each other.
  • the electrode pattern layers 40 and 50 may include a regular pattern.
  • a regular pattern means that the pattern form has regularity.
  • the unit patterns may include, independently of each other, a mesh shape such as a rectangle or a square, or a pattern like a hexagon.
  • the electrode pattern layers 40 and 50 may include irregular patterns. Irregular pattern means that the shape of the pattern does not have regularity.
  • the pad electrode 40 may be electrically connected to the circuit board 80 to be described later.
  • FIG. 2 is a plan view immediately after the pad electrode 40 is formed (a red rectangle means a pad area), as illustrated in FIG. 2A, the pad electrode in the pad area on the first protective layer 30. Regions other than 40 are filled with the first protective layer 30 material.
  • the pad electrode 40 may be formed by selectively patterning only a portion where the pad electrode 40 is to be formed in the pad region on the first protective layer 30, but is not limited thereto.
  • the pad area on the first passivation layer 30 is filled with the material of the first passivation layer 30, the pad area of the separation layer 20 is not exposed. Therefore, at the time of forming the electrode pattern layers 40 and 50, the pad region of the separation layer 20 is not exposed to the etchant. As a result, it is possible to obtain an excellent separation layer 20 in which problems such as cracking, peeling, and deterioration do not occur due to chemical impact caused by etchant.
  • the pad electrode 40 is formed by etching the entire pad region as shown in FIG. 2B, the pad region of the separation layer 20 is subsequently exposed to the etchant when the electrode pattern layers 40 and 50 are formed. do.
  • the pad electrode 40 has a surface energy difference of 20 from the separation layer 20 and the first protective layer 30, respectively. mN / m or less.
  • the pad electrode 40 is adjacent to the separation layer 20 and the first protective layer 30, and the separation layer 20 of the pad electrode 40 and
  • the surface energy difference from the first protective layer 30 is 20 mN / m or less (measured according to ASTM D7490)
  • the adhesion of the pad electrode 40 to the separation layer 20 and the first protective layer 30 is reduced. It is excellent and it can suppress that an etchant flows into a clearance gap.
  • the first protective layer 30 and the second protective layer 60 has a modulus of elasticity of 300 MPa or less at 25 ° C. It is preferable from the viewpoint of suppressing crack generation due to the difference in elastic modulus. Modulus of elasticity can be measured with a rheometer or a UTM device.
  • the base film 70 adheres onto the second protective layer 60, otherwise, through the adhesive layer on the second protective layer 60 as illustrated in FIG. 5. Can be.
  • the transparent film may be an isotropic film or a retardation film.
  • the thickness direction retardation (Rth, Rth [(nx + ny) / 2-nz] xd) is preferably -90 nm to +75 nm, preferably -80 nm to +60 nm, particularly -70 nm to +45 nm. desirable.
  • Retardation film is a film produced by the method of uniaxial stretching, biaxial stretching, polymer coating, liquid crystal coating of a polymer film, and is generally used for improving and adjusting optical properties such as viewing angle compensation, color reduction, light leakage improvement, and color control of a display. do.
  • the polarizing plate may be a polarizer protective film is attached to one side or both sides of the polyvinyl alcohol polarizer.
  • a protective film may be used as the base film 70.
  • the protective film may be a film including an adhesive layer on at least one surface of a film made of a polymer resin or a film having a self-adhesive property such as polypropylene, and may be used for protecting the touch sensor surface and improving process resolution.
  • the light transmittance of the base film 70 is preferably 85% or more, more preferably 90% or more. Moreover, it is preferable that the total haze value measured according to JISK7136 is 10% or less, and, as for the said base film 70, it is more preferable that it is 7% or less.
  • the thickness of the said base film 70 is not restrict
  • the film touch sensor of the present invention may further include a circuit board 80.
  • the circuit board 80 may be a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the circuit board 80 may be electrically connected to the pad electrode.
  • the circuit board 80 may be connected to the pad electrode 40 through an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the anisotropic conductive film may have a form in which conductive balls, which are conductive particles, are dispersed in the curable resin.
  • the conductive ball may be nickel, nickel, or a gold alloy
  • the curable resin may be an acrylic or epoxy resin, but is not limited thereto.
  • conductive balls include, for example, the TGP series of H & C High Tech.
  • the film touch sensor of the present invention as described above may be used as a film touch sensor after peeling from the carrier substrate 10.
  • the present invention provides a touch screen panel including the film touch sensor, and an image display device including the same.
  • the separation layer 20 is formed on the carrier substrate 10.
  • the carrier substrate 10 may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little effect on heat or chemical treatment.
  • glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.
  • the formation method of the separation layer 20 is not specifically limited, Slit coating method, knife coating method, spin coating method, casting method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar coating method To methods known in the art such as dip coating, spray coating, screen printing, gravure printing, flexographic printing, offset printing, inkjet coating, dispenser printing, nozzle coating, capillary coating, etc. You can.
  • the hardening method of the separation layer 20 is not specifically limited, either photocuring or thermosetting, or both methods can be used.
  • the order in which both photocuring and thermosetting are performed is not specifically limited.
  • the first protective layer 30 is formed on the separation layer 20.
  • the first protective layer 30 may be formed of the material described above, and the method of forming the first protective layer 30 is not particularly limited, and the same method as the method of forming the separation layer 20 may be used.
  • the first protective layer 30 may be formed to cover at least a part of the side of the separation layer 20 so as to minimize the side surface of the separation layer 20 exposed to an etchant during a process such as patterning patterns to be described later. have. In terms of completely blocking the exposure of the side of the separation layer 20, the first protective layer 30 may be formed to cover all of the side surfaces of the separation layer 20.
  • a pad electrode 40 is formed on the etched portion.
  • the pad electrode 40 may be formed of the above-described metal or metal oxide.
  • the method for forming the pad electrode 40 is not particularly limited, and physical vapor deposition, chemical vapor deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodic oxidation, cluster ion beam deposition, screen printing, gravure printing, flexo It may be by a method known in the art, such as a printing method, an offset printing method, an inkjet coating method, a dispenser printing method.
  • the pad electrode 40 may be formed to have a wider width than the etching area, leaving the etching area, thereby forming the first protective layer 30. It may be formed to further cover some of the pad region of the image.
  • FIG. 11 is a view of the film touch sensor viewed from the pad region side after forming the pad electrode 40.
  • the film touch sensor is etched. You can more reliably prevent the etchant from flowing into the gap.
  • the sensing electrode 50 may be formed of the above-described metal oxides, metals, nanowires, carbon-based materials, polymer materials, and the like.
  • the photoetching method may be used.
  • Photoresist can be divided into positive type photoresist and negative type photoresist. Positive type photoresist is soluble to developer upon UV exposure, and negative type is insoluble to developer upon UV exposure. Photoresist.
  • Conditions for curing the photoresist are not particularly limited, and for example, UV of 0.01 to 10 J / cm 2 can be irradiated for 1 second to 500 seconds, and preferably UV of 0.05 to 1 J / cm 2 for 1 second to 120 seconds. You can investigate.
  • the present invention may further include forming a second protective layer 60 on the first protective layer 30 on which the sensing electrode 50 and the pad electrode 40 are formed.
  • the second protective layer 60 may itself serve as a substrate and a passivation layer.
  • corrosion of the electrode pattern layers 40 and 50 may be prevented, and the surface thereof may be planarized to suppress generation of micro bubbles during adhesion to the base film 70.
  • it may serve as an adhesive layer.
  • the second protective layer 60 may be formed of the aforementioned polymer or the aforementioned adhesive or adhesive.
  • the first protective layer 30 and the second protective layer 60 may have the aforementioned elastic modulus difference.
  • the present invention may further include attaching the base film 70 on the second protective layer 60 as shown in FIG. 14.
  • the base film 70 may be a film made of the aforementioned material, or a polarizing plate, a retardation film, or a protective film.
  • the polarizing plate may be a polarizer protective film is attached to one side or both sides of the polyvinyl alcohol polarizer.
  • the base film 70 may be attached onto the second protective layer 60 through the above-described thermosetting or photocurable adhesive.
  • the second protective layer 60 and the adhesive layer may have the above-described elastic modulus difference.
  • the corona treatment, the flame treatment, the plasma treatment, the ultraviolet ray are applied to the surface to which the base film 70 is attached.
  • Surface treatment such as irradiation, a primer application
  • the separation layer 20 is peeled off from the carrier substrate 10.
  • the separation layer 20 may remain on the side of the film touch sensor without being removed to serve as a coating to protect the electrode pattern layers 40 and 50.
  • the circuit board 80 may be attached to the pad region of the separation layer 20 as shown in FIG. 15.
  • the circuit board 80 is electrically connected to the pad electrode 40.
  • Electrical connection between the circuit board 80 and the pad electrode 40 may be performed through an anisotropic conductive film.
  • the conductive ball may be nickel, nickel, or a gold alloy
  • the curable resin may be an acrylic or epoxy resin, but is not limited thereto.
  • the electrical connection is performed by first placing an anisotropic conductive film having conductive balls in the pad region on the separation layer 20, and then heating and pressing. Then, the conductive ball penetrates through the separation layer 20 and is connected to the pad electrode 40. Then, the circuit board 80 can be electrically connected to the pad electrode 40 by connecting the circuit board 80 with the anisotropic conductive film.
  • the separation layer 20 may be removed from the carrier substrate 10, and then the separation layer 20 of the pad region may be chemically removed.
  • the chemical liquid used for the removal of the separation layer 20 can be used without limitation, the chemical liquid used in the removal of the polymer in the art, for example, basic chemicals such as KOH, TMAH, amines; Acidic chemicals such as phosphoric acid, acetic acid and nitric acid can be used. These can be used individually or in mixture of 2 or more types.
  • the circuit board 80 may be attached to the first protective layer side to be electrically connected to the pad electrode 40.
  • the manufacturing method of the film touch sensor of the present invention including the above step proceeds with the process of forming a pattern layer for implementing the film touch sensor on the carrier substrate 10, and then attaches the base film 70, Heat damage of the base film 70 can be prevented.
  • the present invention is a carrier Since the pattern layer is formed on the substrate 10, the pattern layer can be easily formed without occurrence of such a problem.
  • the separation layer 20 also peels off from the carrier substrate 10 at the time of peeling from the carrier substrate 10, the electrode pattern layers 40 and 50 can be protected, and then the electrical circuit of the circuit board 80 is removed. Easy to connect
  • the pad electrode 40 is formed by selectively etching the pad region on the first passivation layer 30, damage due to exposure to an etchant of the separation layer 20 may be prevented.
  • sensing electrode 60 second protective layer

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

La présente invention concerne un capteur tactile à film et son procédé de fabrication, et plus spécifiquement, un capteur tactile à film et son procédé de fabrication, le capteur tactile à film comprenant : une couche de séparation; une première couche de protection placée sur la couche de séparation; et une couche de motif d'électrode comprenant une électrode de détection et une électrode en forme de pastille, l'électrode de détection formée sur une zone de détection et l'électrode en forme de pastille formée sur une zone de pastille sur la première couche de protection, les zones autres que l'électrode en forme de pastille sur la zone de pastille sur la première couche de protection étant remplies avec le premier matériau de couche de protection, empêchant ainsi une détérioration thermique, etc, d'un film de base, ce qui permet la formation facile d'une couche de motif, et empêchant les dommages de l'exposition à l'agent de gravure, etc, de la couche de séparation.
PCT/KR2015/012836 2014-12-11 2015-11-27 Capteur tactile à film et son procédé de fabrication WO2016093519A1 (fr)

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Application Number Priority Date Filing Date Title
KR1020140178377A KR102211768B1 (ko) 2014-12-11 2014-12-11 필름 터치 센서 및 이의 제조 방법
KR10-2014-0178377 2014-12-11

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WO2016093519A1 true WO2016093519A1 (fr) 2016-06-16

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TW (1) TW201621589A (fr)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108733270B (zh) * 2017-04-25 2024-02-27 东友精细化工有限公司 触控传感器面板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10379617B2 (en) * 2016-12-07 2019-08-13 Lg Display Co., Ltd. Touch sensitive element and display device comprising the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010005200A1 (en) * 1999-12-22 2001-06-28 Daisuke Suzuki Resistance film type touch panel with short circuit preventing structure
KR20110023835A (ko) * 2009-08-28 2011-03-08 이미지랩(주) 혼합식 멀티 터치 패널
US20130122251A1 (en) * 2011-11-11 2013-05-16 Panasonic Corporation Touch panel and method of producing the same
US20140042008A1 (en) * 2012-08-08 2014-02-13 Panasonic Corporation Touch panel
KR20140114261A (ko) * 2013-03-18 2014-09-26 (주)삼원에스티 터치패널센서 및 그 제조방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191865B1 (ko) 2011-04-20 2012-10-16 한국기계연구원 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010005200A1 (en) * 1999-12-22 2001-06-28 Daisuke Suzuki Resistance film type touch panel with short circuit preventing structure
KR20110023835A (ko) * 2009-08-28 2011-03-08 이미지랩(주) 혼합식 멀티 터치 패널
US20130122251A1 (en) * 2011-11-11 2013-05-16 Panasonic Corporation Touch panel and method of producing the same
US20140042008A1 (en) * 2012-08-08 2014-02-13 Panasonic Corporation Touch panel
KR20140114261A (ko) * 2013-03-18 2014-09-26 (주)삼원에스티 터치패널센서 및 그 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108733270B (zh) * 2017-04-25 2024-02-27 东友精细化工有限公司 触控传感器面板

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KR20160071091A (ko) 2016-06-21
TW201621589A (zh) 2016-06-16

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