WO2016099044A1 - Module de capteur tactile et son procédé de production - Google Patents

Module de capteur tactile et son procédé de production Download PDF

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Publication number
WO2016099044A1
WO2016099044A1 PCT/KR2015/012672 KR2015012672W WO2016099044A1 WO 2016099044 A1 WO2016099044 A1 WO 2016099044A1 KR 2015012672 W KR2015012672 W KR 2015012672W WO 2016099044 A1 WO2016099044 A1 WO 2016099044A1
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WO
WIPO (PCT)
Prior art keywords
touch sensor
layer
film
adhesive layer
sensor module
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PCT/KR2015/012672
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English (en)
Korean (ko)
Inventor
최봉진
안명용
Original Assignee
동우화인켐 주식회사
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Publication of WO2016099044A1 publication Critical patent/WO2016099044A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a touch sensor module and a method of manufacturing the same.
  • the touch sensor detects the press-in by a human finger or the like, and the micro strain is temporarily generated by the stress applied at the touch, and the micro strain is repeatedly generated by the repeated use of the touch panel, and the touch sensor layer is also stressed. It may be added repeatedly.
  • Korean Patent Laid-Open Publication No. 2012-0111607 has a graphene pattern formed on top and bottom of a piezoelectric material film and changes the electrical conductivity of graphene by using the piezoelectric effect generated when pressure is applied.
  • a touch sensor capable of controlling the amount of polarization through the piezoelectric effect according to the applied and applied pressure strength is disclosed, but it does not provide an alternative to the aforementioned problem.
  • a second protective layer disposed on the touch sensor layer
  • It includes an adhesive layer for the film disposed on the second protective layer,
  • the adhesive layer for the film is a touch sensor module, the adhesive force is greater than the separation layer for adhesion to the carrier substrate, the elastic modulus is 1 ⁇ 10 7 to 9 ⁇ 10 9 Pa.
  • the adhesive layer for the film is subjected to an additional photocuring process, the touch sensor module.
  • a carrier substrate adhesive separation layer, a first protective layer, a touch sensor layer, a second protective layer, and an adhesive layer for a film are sequentially disposed on the carrier substrate.
  • the adhesive layer for the film has a larger adhesion than the separation layer for adhesion of the carrier substrate, the elastic modulus is 1 ⁇ 10 7 to 9 ⁇ 10 9 Pa, the manufacturing method of the touch sensor module.
  • the adhesion of the adhesive layer for the film is 1N / 25mm to 20 N / 25mm, the manufacturing method of the touch sensor module.
  • the elastic modulus of the adhesive layer for the film is 1 ⁇ 10 7 Pa to 1 ⁇ 10 9 Pa, the manufacturing method of the touch sensor module.
  • the manufacturing method of the touch sensor module of the present invention can minimize the cracks that may occur upon separation from the carrier substrate.
  • FIG. 1 is a schematic cross-sectional view of a touch sensor module according to an embodiment of the present invention.
  • the present invention is a carrier substrate adhesive separation layer; A first protective layer on the carrier substrate adhesive separation layer; A touch sensor layer disposed on the first protective layer; A second protective layer disposed on the touch sensor layer; And an adhesive layer for film disposed on the second protective layer, wherein the adhesive layer for film has an adhesive strength greater than that of the separation layer for adhesion to the carrier substrate, and an elastic modulus of 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa.
  • the present invention relates to a touch sensor module capable of minimizing the occurrence of cracks due to its excellent resistance to external shock.
  • the present invention is a carrier substrate adhesive separation layer; A first protective layer on the carrier substrate adhesive separation layer; A touch sensor layer disposed on the first protective layer; A second protective layer disposed on the touch sensor layer; And an adhesive layer for film disposed on the second protective layer, wherein the adhesive layer for film has an adhesive force greater than that of the separation layer for adhesion of the carrier substrate, and an elastic modulus is 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa.
  • a touch sensor module Provides a touch sensor module.
  • FIG. 1 briefly illustrates a touch sensor module according to an embodiment of the present invention.
  • a manufacturing process is performed on the carrier substrate, and the manufactured touch sensor module is manufactured by separating the carrier substrate from the carrier substrate. Layer is formed.
  • thermosetting or photocurable adhesive known in the art may be used without limitation, and specifically, thermosetting such as polyester, polyether, urethane, epoxy, silicone, acrylic, or the like.
  • thermosetting such as polyester, polyether, urethane, epoxy, silicone, acrylic, or the like.
  • a photocurable adhesive can be mentioned.
  • the adhesion of the separation layer for carrier substrate adhesion is not particularly limited, and may be, for example, 0.01 to 1.00 N / 25 mm. When the adhesion is within the above range, it can be effectively adhered to the carrier substrate, it is possible to prevent damage to the touch sensor module when peeling from the carrier substrate.
  • the first protective layer may be a polymer film, for example, a silicone-based polymer such as polydimethylsiloxane (PDMS) or polyorganosiloxane (POS); Polyimide-based polymers; It may be made of a polyurethane-based polymer, but is not limited thereto. These can be used individually or in mixture of 2 or more types. In addition, an organic or inorganic insulating material known in the art may be used.
  • PDMS polydimethylsiloxane
  • POS polyorganosiloxane
  • Polyimide-based polymers It may be made of a polyurethane-based polymer, but is not limited thereto. These can be used individually or in mixture of 2 or more types.
  • an organic or inorganic insulating material known in the art may be used.
  • the touch sensor layer is disposed on the first protective layer and includes a sensing electrode for touch sensing.
  • the sensing electrode may be used without limitation as long as it is a conductive material.
  • the sensing electrode may be formed of two or more layers, and may include an insulating film between each layer.
  • the second protective layer is disposed on the touch sensor layer.
  • the second protective layer may cover the touch sensor layer to protect the touch sensor layer and prevent malfunction due to static electricity.
  • the adhesive layer for films is disposed on the second protective layer.
  • the adhesive layer for films is a layer formed for adhesion with the base film when the touch sensor module of the present invention further comprises a base film. In addition, it serves to suppress cracking of the first and second protective layers and the touch sensor layer by mitigating stress against external shock that may be applied to the touch sensor module during the manufacturing process, transportation, or use.
  • the adhesive layer refers to an adhesive layer, an adhesive layer, or both.
  • the adhesive layer for films has a larger adhesive force than the separation layer for carrier substrate adhesion.
  • the touch sensor module of the present invention can be obtained by separating the laminate having the above configurations from the carrier substrate while having the above configurations. At this time, when the adhesive force of the adhesive layer for films is lower than the adhesive force of the separation layer for carrier substrate adhesion, the adhesive layer for films or the substrate film to be described later is peeled off at the time of peeling from the carrier substrate, or the first and second protective layers and The touch sensor layer may be damaged and separation from the carrier substrate itself may not be possible.
  • the adhesion of the adhesive layer for films is not particularly limited as long as it is greater than the adhesion of the separation layer for adhesion of the carrier substrate.
  • the adhesion of the adhesive layer for films may be 1 to 20 N / 25mm. Preferably it may be 5 to 20 N / 25 mm, more preferably 10 to 20 N / 25 mm.
  • the adhesion of the adhesive layer for the film is within the above range can be maximized the effect of preventing cracks during peeling.
  • the pressure-sensitive adhesive for films has an elastic modulus of 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa, preferably 1 ⁇ 10 7 to 1 ⁇ 10 9 Pa.
  • the modulus of elasticity means storage modulus.
  • thermosetting or photocurable pressure-sensitive adhesives known in the art may be used without limitation as long as the adhesion and elastic modulus ranges are satisfied.
  • the acrylic copolymer according to the present invention can be used without limitation acrylic copolymers commonly used in the art, for example (meth) acrylate monomer having an alkyl group having 1 to 12 carbon atoms and crosslinkable monomer copolymerizable with the May be copolymerized.
  • (meth) acrylate means both acrylate and methacrylate.
  • the (meth) acrylate monomer having an alkyl group having 1 to 12 carbon atoms may be polymerized by including 80 to 99% by weight, preferably 90 to 95% by weight, based on the total weight of the monomers used to prepare the acrylic copolymer. Sufficient adhesive force can be exhibited within the said range, and the fall of cohesion force can be prevented.
  • Monovalent acids such as (meth) acrylic acid and a crotonic acid; Diacids such as maleic acid, itaconic acid and fumaric acid, and monoalkyl esters thereof; 3- (meth) acryloylpropionic acid; Succinic anhydride ring-opening adduct of 2-hydroxyalkyl (meth) acrylate with 2-3 carbon atoms of an alkyl group, Succinic anhydride ring opening adduct of hydroxyalkylene glycol (meth) acrylate with 2-4 carbon atoms of an alkylene group And a compound obtained by ring-opening addition of succinic anhydride to a caprolactone adduct of 2-hydroxyalkyl (meth) acrylate having 2 to 3 carbon atoms of an alkyl group, among which (meth) acrylic acid is preferred.
  • the crosslinkable monomer is preferably 0.05 to 10% by weight, preferably 0.1 to 8% by weight, based on the total weight of the monomers used to prepare the acrylic copolymer.
  • the cohesive force of the pressure-sensitive adhesive may be high to improve durability.
  • polymerizable monomers in addition to the monomers may be further included in a range that does not lower the adhesion, such as 10% by weight or less.
  • the production method of the copolymer is not particularly limited, and may be prepared using a method such as bulk polymerization, solution polymerization, emulsion polymerization or suspension polymerization, which are commonly used in the art, and solution polymerization is preferable.
  • a solvent a polymerization initiator, a chain transfer agent for molecular weight control, and the like, which are usually used in the polymerization, may be used.
  • the acrylic copolymer preferably has a weight average molecular weight (polystyrene equivalent, Mw) measured by gel permeation chromatography (GPC) of 50,000 to 2 million, more preferably 400,000 to 2 million. Within this range, the adhesion durability and processability during coating are excellent.
  • Mw weight average molecular weight measured by gel permeation chromatography
  • the polymerizable monomer is not particularly limited as long as it is a monomer commonly used in the art within the scope of not impairing the object of the present invention, specifically, polyfunctional acrylic monomers, styrene monomers, epoxy monomers and the like. have.
  • the polyfunctional acrylic monomer improves the cohesive force of the adhesive composition, thereby suppressing bubble generation under heat-resistant conditions, thereby improving heat resistance.
  • the kind of the polyfunctional acrylic monomer is not particularly limited, and for example, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, di Pentaerythritol tri (meth) acrylate, propionic acid-modified trimethylolpropane tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tree (meth Trifunctional monomers such as acrylate, tris (meth) acryloxyethyl isocyanurate, and glycerol tri (meth) acrylate; Tetrafunctional monomers such as diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra
  • a melamine type compound can be used individually or in mixture of 2 or more types with the said isocyanate type compound or an epoxy type compound in the range which does not impair the objective of this invention.
  • Hexamethylol melamine, hexamethoxymethylmelamine, hexabutoxymethylmelamine, etc. are mentioned as a melamine type compound.
  • a base film made of a material widely used in the art may be used without limitation, and for example, a cellulose ester such as cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate propionate , And nitrocellulose), polyimide, polycarbonate, polyester (e.g. polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene 1,2-diphenoxyethane-4, 4 ⁇ -dicarboxylate and polybutylene terephthalate, polystyrene (e.g. syndiotactic polystyrene), polyolefins (e.g.
  • the adhesive layer for film may be subjected to an additional heat curing process.
  • the adhesive layer for the film may be subjected to an additional photocuring process.
  • the carrier substrate adhesive separation layer, the first protective layer, the touch sensor layer, the second protective layer and the film adhesive layer are sequentially disposed on the carrier substrate. .
  • the carrier substrate may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little influence on heat or chemical treatment.
  • glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.
  • the carrier layer adhesive separation layer may be formed of the above-mentioned pressure-sensitive adhesive.
  • an additional curing process may be further processed.
  • the hardening method of the separation layer for carrier substrate adhesion is not specifically limited, Photocuring or thermosetting, or both said methods can be used.
  • the order in which both photocuring and thermosetting are performed is not specifically limited.
  • a first protective layer is formed on the carrier substrate adhesive separation layer.
  • the first protective layer may be formed of the material described above, and a method of forming the same may be used without particular limitation so long as it is generally used in the art without departing from the object of the present invention.
  • the touch sensor layer includes sensing electrodes for touch sensing.
  • the sensing electrode may be formed of a material such as metal oxides, metals, metal nanowires, carbon-based materials, and polymer materials.
  • the formation method of the sensing electrode is not particularly limited, and for example, physical vapor deposition, chemical vapor deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodic oxidation, cluster ion beam deposition, screen printing, gravure printing, or pla It may be by a method known in the art, such as a flexographic printing method, an offset printing method, an inkjet coating method, a dispenser printing method.
  • the second protective layer may be formed of the same material as the first protective layer, but is not limited thereto.
  • an adhesive layer for film is formed on the second protective layer.
  • the adhesive layer for film may be formed in the same manner as the separation layer for adhesion of the carrier substrate, but is not limited thereto.
  • the adhesive layer for films has an elastic modulus of 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa, preferably 1 ⁇ 10 7 Pa to 1 ⁇ 10 9 .
  • any one satisfying the above range may be used without limitation, and a pressure-sensitive adhesive composition known in the art may be used, for example, the pressure-sensitive adhesive composition described above.
  • the present invention may further include the step of further heat curing the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film.
  • the order of the additional heat curing step is not particularly limited, and may be performed before, during or after adhesion of the base film.
  • the present invention may further include the step of further heat curing the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film.
  • the order of the further photocuring step is not particularly limited, and may be performed before, during or after the adhesion of the base film.
  • Photocuring conditions are not particularly limited, and may be performed, for example, by irradiating ultraviolet rays of 10 to 100 mw / cm 2 for 1 to 15 seconds.
  • the further photocuring may be carried out such that the adhesive layer for the film is fully or incompletely cured.
  • Sodium lime glass having a thickness of 700 ⁇ m is used as a carrier substrate, and 50 parts by weight of melamine and 50 parts by weight of cinnamic acid are propylene glycol monomethyl ether acetate at a concentration of 10% on the carrier substrate.
  • the separation layer composition diluted in acetate, PGMEA) was applied by spin coating to a thickness of 300 nm and dried at 150 ° C. for 30 minutes to form a separation layer for carrier substrate adhesion on the carrier substrate.
  • a first protective layer composition was prepared by mixing 40 parts by weight of a polyfunctional acrylic monomer and 60 parts by weight of an epoxy binder in a solvent mixed with 40 parts by weight and 30 parts by weight. At this time, the solid content was to have a proportion of 20 parts by weight of the total weight of the composition.
  • ITO was deposited to a thickness of 135 nm on the first protective layer to form a touch sensor layer.
  • CEL2021P (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate) as a polymerizable monomer on the second protective layer
  • 10 parts by weight of 1,6-hexanedioldiacrylate 5 parts by weight of trimethylolpropane triacrylate
  • 20 parts by weight of neopentyl glycol diglycidyl ether as a crosslinking agent
  • 4.5 parts by weight of polymerization initiator SP500 0.25 parts by weight of leveling agent KRM230, 10 parts by weight of adhesion agent KRM0273, solvent 4-
  • a pressure-sensitive adhesive composition containing 7 parts by weight of hydroxybutyl vinyl ether was applied between the 60 ⁇ m TAC film and the touch sensor with a dropper and pressed by a roll lamination method so that the thickness of the adhesive layer was 2 ⁇ m.
  • the touch sensor module was manufactured in the same manner as in Example 1, except that the additional thermosetting process was not performed.
  • a touch sensor module was manufactured in the same manner as in Example 1, except that 50 seconds of additional ultraviolet ray was irradiated.
  • the touch sensor module was manufactured in the same manner as in Example 3, except that the additional thermosetting process was not performed.
  • a touch sensor module was manufactured in the same manner as in Example 1, except that ultraviolet ray of 10 mW / cm 2 intensity was irradiated for 80 seconds at the time of additional photocuring.
  • Example 1 100 parts by weight of 2-ethylhexyl acrylate, 0.9 parts by weight of 8-hydroxyoctyl acrylate, 0.5 part by weight of acrylic acid, 3 parts by weight of polyethylene glycol monoacrylate, 5 parts by weight of N-vinylpyrrolidone and 60 parts by weight of ethyl acetate
  • the pressure-sensitive adhesive composition prepared by mixing and reacting dropwise 0.1 parts by weight of azobisisobutyronitrile over 2 hours was used as a polymerization initiator, and no further photocuring step was performed.
  • the touch sensor module was manufactured.
  • a touch sensor module was prepared by applying a polyethylene film coated with 25 ⁇ m of 3146's 8146-1 pressure-sensitive adhesive on a second protective layer under pressure.
  • the elastic modulus of the adhesive used was evaluated using Anton Paar's MCR301 RHEOMETER, and the evaluation was performed in the strain 1% and the frequency 1 Hz region. The results are shown in Table 1 below.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne un module de capteur tactile et un procédé pour produire le module de capteur tactile, et, de manière plus spécifique, un module de capteur tactile comprenant : une couche de séparation pour une adhérence sur substrat de support ; une première couche de protection disposée sur la couche de séparation pour une adhérence sur substrat de support ; une couche de capteur tactile disposée sur la première couche de protection ; une seconde couche de protection disposée sur la couche de capteur tactile ; et une couche d'adhérence de film disposée sur la seconde couche de protection, la couche d'adhérence de film ayant une adhésivité supérieure à la couche de séparation pour une adhérence sur substrat de support et ayant un module d'élasticité de 1 x 107 Pa à 9 x 109 Pa et ayant une excellente résistance contre un impact externe et pouvant ainsi réduire au minimum l'apparition de fissures.
PCT/KR2015/012672 2014-12-17 2015-11-24 Module de capteur tactile et son procédé de production WO2016099044A1 (fr)

Applications Claiming Priority (2)

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KR10-2014-0182405 2014-12-17
KR1020140182405A KR102184024B1 (ko) 2014-12-17 2014-12-17 터치 센서 모듈 및 이의 제조 방법

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KR101969343B1 (ko) 2016-08-19 2019-04-16 동우 화인켐 주식회사 필름 터치 센서 및 필름 터치 센서용 구조체
CN108062176B (zh) 2016-11-09 2021-07-09 东友精细化工有限公司 触摸传感器层叠体及其制造方法
KR20180052067A (ko) * 2016-11-09 2018-05-17 동우 화인켐 주식회사 터치 센서 적층체 및 이의 제조 방법
KR102121387B1 (ko) * 2017-01-26 2020-06-10 동우 화인켐 주식회사 감응성 발광 조성물

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WO2012138030A1 (fr) * 2011-04-05 2012-10-11 제일모직 주식회사 Film adhésif pour un dispositif électroluminescent organique, composite inclus dans le film adhésif pour un dispositif électroluminescent organique et dispositif d'affichage électroluminescent organique comportant le film adhésif pour un dispositif électroluminescent organique
KR20130010868A (ko) * 2011-07-19 2013-01-29 주식회사 엘지화학 터치 패널
KR20140023624A (ko) * 2012-08-16 2014-02-27 (주)엘지하우시스 터치패널용 점착제 조성물, 점착 필름 및 터치 패널
US20140065416A1 (en) * 2012-08-30 2014-03-06 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet, laminate and method for peeling plates
KR20140114257A (ko) * 2013-03-18 2014-09-26 (주)삼원에스티 터치패널센서용 적층필름

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JP5529720B2 (ja) * 2010-12-15 2014-06-25 日東電工株式会社 粘着剤層付き透明導電性フィルム、その製造方法及びタッチパネル
KR20120111607A (ko) 2011-04-01 2012-10-10 광주과학기술원 압전 효과를 이용한 그래핀 터치 센서

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WO2012138030A1 (fr) * 2011-04-05 2012-10-11 제일모직 주식회사 Film adhésif pour un dispositif électroluminescent organique, composite inclus dans le film adhésif pour un dispositif électroluminescent organique et dispositif d'affichage électroluminescent organique comportant le film adhésif pour un dispositif électroluminescent organique
KR20130010868A (ko) * 2011-07-19 2013-01-29 주식회사 엘지화학 터치 패널
KR20140023624A (ko) * 2012-08-16 2014-02-27 (주)엘지하우시스 터치패널용 점착제 조성물, 점착 필름 및 터치 패널
US20140065416A1 (en) * 2012-08-30 2014-03-06 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet, laminate and method for peeling plates
KR20140114257A (ko) * 2013-03-18 2014-09-26 (주)삼원에스티 터치패널센서용 적층필름

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KR20160073735A (ko) 2016-06-27
TW201624229A (zh) 2016-07-01

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