WO2016099044A1 - Touch sensor module and production method therefor - Google Patents

Touch sensor module and production method therefor Download PDF

Info

Publication number
WO2016099044A1
WO2016099044A1 PCT/KR2015/012672 KR2015012672W WO2016099044A1 WO 2016099044 A1 WO2016099044 A1 WO 2016099044A1 KR 2015012672 W KR2015012672 W KR 2015012672W WO 2016099044 A1 WO2016099044 A1 WO 2016099044A1
Authority
WO
WIPO (PCT)
Prior art keywords
touch sensor
layer
film
adhesive layer
sensor module
Prior art date
Application number
PCT/KR2015/012672
Other languages
French (fr)
Korean (ko)
Inventor
최봉진
안명용
Original Assignee
동우화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동우화인켐 주식회사 filed Critical 동우화인켐 주식회사
Publication of WO2016099044A1 publication Critical patent/WO2016099044A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a touch sensor module and a method of manufacturing the same.
  • the touch sensor detects the press-in by a human finger or the like, and the micro strain is temporarily generated by the stress applied at the touch, and the micro strain is repeatedly generated by the repeated use of the touch panel, and the touch sensor layer is also stressed. It may be added repeatedly.
  • Korean Patent Laid-Open Publication No. 2012-0111607 has a graphene pattern formed on top and bottom of a piezoelectric material film and changes the electrical conductivity of graphene by using the piezoelectric effect generated when pressure is applied.
  • a touch sensor capable of controlling the amount of polarization through the piezoelectric effect according to the applied and applied pressure strength is disclosed, but it does not provide an alternative to the aforementioned problem.
  • a second protective layer disposed on the touch sensor layer
  • It includes an adhesive layer for the film disposed on the second protective layer,
  • the adhesive layer for the film is a touch sensor module, the adhesive force is greater than the separation layer for adhesion to the carrier substrate, the elastic modulus is 1 ⁇ 10 7 to 9 ⁇ 10 9 Pa.
  • the adhesive layer for the film is subjected to an additional photocuring process, the touch sensor module.
  • a carrier substrate adhesive separation layer, a first protective layer, a touch sensor layer, a second protective layer, and an adhesive layer for a film are sequentially disposed on the carrier substrate.
  • the adhesive layer for the film has a larger adhesion than the separation layer for adhesion of the carrier substrate, the elastic modulus is 1 ⁇ 10 7 to 9 ⁇ 10 9 Pa, the manufacturing method of the touch sensor module.
  • the adhesion of the adhesive layer for the film is 1N / 25mm to 20 N / 25mm, the manufacturing method of the touch sensor module.
  • the elastic modulus of the adhesive layer for the film is 1 ⁇ 10 7 Pa to 1 ⁇ 10 9 Pa, the manufacturing method of the touch sensor module.
  • the manufacturing method of the touch sensor module of the present invention can minimize the cracks that may occur upon separation from the carrier substrate.
  • FIG. 1 is a schematic cross-sectional view of a touch sensor module according to an embodiment of the present invention.
  • the present invention is a carrier substrate adhesive separation layer; A first protective layer on the carrier substrate adhesive separation layer; A touch sensor layer disposed on the first protective layer; A second protective layer disposed on the touch sensor layer; And an adhesive layer for film disposed on the second protective layer, wherein the adhesive layer for film has an adhesive strength greater than that of the separation layer for adhesion to the carrier substrate, and an elastic modulus of 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa.
  • the present invention relates to a touch sensor module capable of minimizing the occurrence of cracks due to its excellent resistance to external shock.
  • the present invention is a carrier substrate adhesive separation layer; A first protective layer on the carrier substrate adhesive separation layer; A touch sensor layer disposed on the first protective layer; A second protective layer disposed on the touch sensor layer; And an adhesive layer for film disposed on the second protective layer, wherein the adhesive layer for film has an adhesive force greater than that of the separation layer for adhesion of the carrier substrate, and an elastic modulus is 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa.
  • a touch sensor module Provides a touch sensor module.
  • FIG. 1 briefly illustrates a touch sensor module according to an embodiment of the present invention.
  • a manufacturing process is performed on the carrier substrate, and the manufactured touch sensor module is manufactured by separating the carrier substrate from the carrier substrate. Layer is formed.
  • thermosetting or photocurable adhesive known in the art may be used without limitation, and specifically, thermosetting such as polyester, polyether, urethane, epoxy, silicone, acrylic, or the like.
  • thermosetting such as polyester, polyether, urethane, epoxy, silicone, acrylic, or the like.
  • a photocurable adhesive can be mentioned.
  • the adhesion of the separation layer for carrier substrate adhesion is not particularly limited, and may be, for example, 0.01 to 1.00 N / 25 mm. When the adhesion is within the above range, it can be effectively adhered to the carrier substrate, it is possible to prevent damage to the touch sensor module when peeling from the carrier substrate.
  • the first protective layer may be a polymer film, for example, a silicone-based polymer such as polydimethylsiloxane (PDMS) or polyorganosiloxane (POS); Polyimide-based polymers; It may be made of a polyurethane-based polymer, but is not limited thereto. These can be used individually or in mixture of 2 or more types. In addition, an organic or inorganic insulating material known in the art may be used.
  • PDMS polydimethylsiloxane
  • POS polyorganosiloxane
  • Polyimide-based polymers It may be made of a polyurethane-based polymer, but is not limited thereto. These can be used individually or in mixture of 2 or more types.
  • an organic or inorganic insulating material known in the art may be used.
  • the touch sensor layer is disposed on the first protective layer and includes a sensing electrode for touch sensing.
  • the sensing electrode may be used without limitation as long as it is a conductive material.
  • the sensing electrode may be formed of two or more layers, and may include an insulating film between each layer.
  • the second protective layer is disposed on the touch sensor layer.
  • the second protective layer may cover the touch sensor layer to protect the touch sensor layer and prevent malfunction due to static electricity.
  • the adhesive layer for films is disposed on the second protective layer.
  • the adhesive layer for films is a layer formed for adhesion with the base film when the touch sensor module of the present invention further comprises a base film. In addition, it serves to suppress cracking of the first and second protective layers and the touch sensor layer by mitigating stress against external shock that may be applied to the touch sensor module during the manufacturing process, transportation, or use.
  • the adhesive layer refers to an adhesive layer, an adhesive layer, or both.
  • the adhesive layer for films has a larger adhesive force than the separation layer for carrier substrate adhesion.
  • the touch sensor module of the present invention can be obtained by separating the laminate having the above configurations from the carrier substrate while having the above configurations. At this time, when the adhesive force of the adhesive layer for films is lower than the adhesive force of the separation layer for carrier substrate adhesion, the adhesive layer for films or the substrate film to be described later is peeled off at the time of peeling from the carrier substrate, or the first and second protective layers and The touch sensor layer may be damaged and separation from the carrier substrate itself may not be possible.
  • the adhesion of the adhesive layer for films is not particularly limited as long as it is greater than the adhesion of the separation layer for adhesion of the carrier substrate.
  • the adhesion of the adhesive layer for films may be 1 to 20 N / 25mm. Preferably it may be 5 to 20 N / 25 mm, more preferably 10 to 20 N / 25 mm.
  • the adhesion of the adhesive layer for the film is within the above range can be maximized the effect of preventing cracks during peeling.
  • the pressure-sensitive adhesive for films has an elastic modulus of 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa, preferably 1 ⁇ 10 7 to 1 ⁇ 10 9 Pa.
  • the modulus of elasticity means storage modulus.
  • thermosetting or photocurable pressure-sensitive adhesives known in the art may be used without limitation as long as the adhesion and elastic modulus ranges are satisfied.
  • the acrylic copolymer according to the present invention can be used without limitation acrylic copolymers commonly used in the art, for example (meth) acrylate monomer having an alkyl group having 1 to 12 carbon atoms and crosslinkable monomer copolymerizable with the May be copolymerized.
  • (meth) acrylate means both acrylate and methacrylate.
  • the (meth) acrylate monomer having an alkyl group having 1 to 12 carbon atoms may be polymerized by including 80 to 99% by weight, preferably 90 to 95% by weight, based on the total weight of the monomers used to prepare the acrylic copolymer. Sufficient adhesive force can be exhibited within the said range, and the fall of cohesion force can be prevented.
  • Monovalent acids such as (meth) acrylic acid and a crotonic acid; Diacids such as maleic acid, itaconic acid and fumaric acid, and monoalkyl esters thereof; 3- (meth) acryloylpropionic acid; Succinic anhydride ring-opening adduct of 2-hydroxyalkyl (meth) acrylate with 2-3 carbon atoms of an alkyl group, Succinic anhydride ring opening adduct of hydroxyalkylene glycol (meth) acrylate with 2-4 carbon atoms of an alkylene group And a compound obtained by ring-opening addition of succinic anhydride to a caprolactone adduct of 2-hydroxyalkyl (meth) acrylate having 2 to 3 carbon atoms of an alkyl group, among which (meth) acrylic acid is preferred.
  • the crosslinkable monomer is preferably 0.05 to 10% by weight, preferably 0.1 to 8% by weight, based on the total weight of the monomers used to prepare the acrylic copolymer.
  • the cohesive force of the pressure-sensitive adhesive may be high to improve durability.
  • polymerizable monomers in addition to the monomers may be further included in a range that does not lower the adhesion, such as 10% by weight or less.
  • the production method of the copolymer is not particularly limited, and may be prepared using a method such as bulk polymerization, solution polymerization, emulsion polymerization or suspension polymerization, which are commonly used in the art, and solution polymerization is preferable.
  • a solvent a polymerization initiator, a chain transfer agent for molecular weight control, and the like, which are usually used in the polymerization, may be used.
  • the acrylic copolymer preferably has a weight average molecular weight (polystyrene equivalent, Mw) measured by gel permeation chromatography (GPC) of 50,000 to 2 million, more preferably 400,000 to 2 million. Within this range, the adhesion durability and processability during coating are excellent.
  • Mw weight average molecular weight measured by gel permeation chromatography
  • the polymerizable monomer is not particularly limited as long as it is a monomer commonly used in the art within the scope of not impairing the object of the present invention, specifically, polyfunctional acrylic monomers, styrene monomers, epoxy monomers and the like. have.
  • the polyfunctional acrylic monomer improves the cohesive force of the adhesive composition, thereby suppressing bubble generation under heat-resistant conditions, thereby improving heat resistance.
  • the kind of the polyfunctional acrylic monomer is not particularly limited, and for example, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, di Pentaerythritol tri (meth) acrylate, propionic acid-modified trimethylolpropane tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tree (meth Trifunctional monomers such as acrylate, tris (meth) acryloxyethyl isocyanurate, and glycerol tri (meth) acrylate; Tetrafunctional monomers such as diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra
  • a melamine type compound can be used individually or in mixture of 2 or more types with the said isocyanate type compound or an epoxy type compound in the range which does not impair the objective of this invention.
  • Hexamethylol melamine, hexamethoxymethylmelamine, hexabutoxymethylmelamine, etc. are mentioned as a melamine type compound.
  • a base film made of a material widely used in the art may be used without limitation, and for example, a cellulose ester such as cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate propionate , And nitrocellulose), polyimide, polycarbonate, polyester (e.g. polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene 1,2-diphenoxyethane-4, 4 ⁇ -dicarboxylate and polybutylene terephthalate, polystyrene (e.g. syndiotactic polystyrene), polyolefins (e.g.
  • the adhesive layer for film may be subjected to an additional heat curing process.
  • the adhesive layer for the film may be subjected to an additional photocuring process.
  • the carrier substrate adhesive separation layer, the first protective layer, the touch sensor layer, the second protective layer and the film adhesive layer are sequentially disposed on the carrier substrate. .
  • the carrier substrate may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little influence on heat or chemical treatment.
  • glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.
  • the carrier layer adhesive separation layer may be formed of the above-mentioned pressure-sensitive adhesive.
  • an additional curing process may be further processed.
  • the hardening method of the separation layer for carrier substrate adhesion is not specifically limited, Photocuring or thermosetting, or both said methods can be used.
  • the order in which both photocuring and thermosetting are performed is not specifically limited.
  • a first protective layer is formed on the carrier substrate adhesive separation layer.
  • the first protective layer may be formed of the material described above, and a method of forming the same may be used without particular limitation so long as it is generally used in the art without departing from the object of the present invention.
  • the touch sensor layer includes sensing electrodes for touch sensing.
  • the sensing electrode may be formed of a material such as metal oxides, metals, metal nanowires, carbon-based materials, and polymer materials.
  • the formation method of the sensing electrode is not particularly limited, and for example, physical vapor deposition, chemical vapor deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodic oxidation, cluster ion beam deposition, screen printing, gravure printing, or pla It may be by a method known in the art, such as a flexographic printing method, an offset printing method, an inkjet coating method, a dispenser printing method.
  • the second protective layer may be formed of the same material as the first protective layer, but is not limited thereto.
  • an adhesive layer for film is formed on the second protective layer.
  • the adhesive layer for film may be formed in the same manner as the separation layer for adhesion of the carrier substrate, but is not limited thereto.
  • the adhesive layer for films has an elastic modulus of 1 ⁇ 10 7 Pa to 9 ⁇ 10 9 Pa, preferably 1 ⁇ 10 7 Pa to 1 ⁇ 10 9 .
  • any one satisfying the above range may be used without limitation, and a pressure-sensitive adhesive composition known in the art may be used, for example, the pressure-sensitive adhesive composition described above.
  • the present invention may further include the step of further heat curing the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film.
  • the order of the additional heat curing step is not particularly limited, and may be performed before, during or after adhesion of the base film.
  • the present invention may further include the step of further heat curing the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film.
  • the order of the further photocuring step is not particularly limited, and may be performed before, during or after the adhesion of the base film.
  • Photocuring conditions are not particularly limited, and may be performed, for example, by irradiating ultraviolet rays of 10 to 100 mw / cm 2 for 1 to 15 seconds.
  • the further photocuring may be carried out such that the adhesive layer for the film is fully or incompletely cured.
  • Sodium lime glass having a thickness of 700 ⁇ m is used as a carrier substrate, and 50 parts by weight of melamine and 50 parts by weight of cinnamic acid are propylene glycol monomethyl ether acetate at a concentration of 10% on the carrier substrate.
  • the separation layer composition diluted in acetate, PGMEA) was applied by spin coating to a thickness of 300 nm and dried at 150 ° C. for 30 minutes to form a separation layer for carrier substrate adhesion on the carrier substrate.
  • a first protective layer composition was prepared by mixing 40 parts by weight of a polyfunctional acrylic monomer and 60 parts by weight of an epoxy binder in a solvent mixed with 40 parts by weight and 30 parts by weight. At this time, the solid content was to have a proportion of 20 parts by weight of the total weight of the composition.
  • ITO was deposited to a thickness of 135 nm on the first protective layer to form a touch sensor layer.
  • CEL2021P (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate) as a polymerizable monomer on the second protective layer
  • 10 parts by weight of 1,6-hexanedioldiacrylate 5 parts by weight of trimethylolpropane triacrylate
  • 20 parts by weight of neopentyl glycol diglycidyl ether as a crosslinking agent
  • 4.5 parts by weight of polymerization initiator SP500 0.25 parts by weight of leveling agent KRM230, 10 parts by weight of adhesion agent KRM0273, solvent 4-
  • a pressure-sensitive adhesive composition containing 7 parts by weight of hydroxybutyl vinyl ether was applied between the 60 ⁇ m TAC film and the touch sensor with a dropper and pressed by a roll lamination method so that the thickness of the adhesive layer was 2 ⁇ m.
  • the touch sensor module was manufactured in the same manner as in Example 1, except that the additional thermosetting process was not performed.
  • a touch sensor module was manufactured in the same manner as in Example 1, except that 50 seconds of additional ultraviolet ray was irradiated.
  • the touch sensor module was manufactured in the same manner as in Example 3, except that the additional thermosetting process was not performed.
  • a touch sensor module was manufactured in the same manner as in Example 1, except that ultraviolet ray of 10 mW / cm 2 intensity was irradiated for 80 seconds at the time of additional photocuring.
  • Example 1 100 parts by weight of 2-ethylhexyl acrylate, 0.9 parts by weight of 8-hydroxyoctyl acrylate, 0.5 part by weight of acrylic acid, 3 parts by weight of polyethylene glycol monoacrylate, 5 parts by weight of N-vinylpyrrolidone and 60 parts by weight of ethyl acetate
  • the pressure-sensitive adhesive composition prepared by mixing and reacting dropwise 0.1 parts by weight of azobisisobutyronitrile over 2 hours was used as a polymerization initiator, and no further photocuring step was performed.
  • the touch sensor module was manufactured.
  • a touch sensor module was prepared by applying a polyethylene film coated with 25 ⁇ m of 3146's 8146-1 pressure-sensitive adhesive on a second protective layer under pressure.
  • the elastic modulus of the adhesive used was evaluated using Anton Paar's MCR301 RHEOMETER, and the evaluation was performed in the strain 1% and the frequency 1 Hz region. The results are shown in Table 1 below.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention relates to a touch sensor module and a method for producing the touch sensor module and, more specifically, to a touch sensor module comprising: a separation layer for carrier substrate adhesion; a first protection layer disposed on the separation layer for carrier substrate adhesion; a touch sensor layer disposed on the first protection layer; a second protection layer disposed on the touch sensor layer; and a film adhesion layer disposed on the second protection layer, wherein the film adhesion layer has greater adhesiveness than the separation layer for carrier substrate adhesion and has an elastic modulus of 1×107 Pa to 9×109 Pa and has excellent resistance against an external impact and can thereby minimize the occurrence of cracks.

Description

터치 센서 모듈 및 이의 제조 방법Touch sensor module and manufacturing method thereof
본 발명은 터치 센서 모듈 및 이의 제조 방법에 관한 것이다.The present invention relates to a touch sensor module and a method of manufacturing the same.
터치입력방식이 차세대 입력방식으로 각광받으면서 좀더 다양한 전자기기에 터치입력방식을 도입하려는 시도들이 이루어지고 있으며, 따라서 다양한 환경에 적용할 수 있고 정확한 터치인식이 가능한 터치 센서에 대한 연구개발도 활발히 이루어지고 있다.As the touch input method has been spotlighted as the next generation input method, attempts have been made to introduce touch input methods to a variety of electronic devices. Therefore, research and development on touch sensors that can be applied to various environments and enable accurate touch recognition are also actively conducted. have.
한편, 터치 센서는 사람의 손가락 등에 의한 압입을 감지하는 바, 터치 시에 가해지는 응력에 의해 일시적으로 미소 변형이 생기고 터치 패널의 반복 사용에 의해 상기 미소 변형이 반복해서 생기며 터치 센서층에도 응력이 반복하여 가해지기도 한다. On the other hand, the touch sensor detects the press-in by a human finger or the like, and the micro strain is temporarily generated by the stress applied at the touch, and the micro strain is repeatedly generated by the repeated use of the touch panel, and the touch sensor layer is also stressed. It may be added repeatedly.
또한, 입체 면으로 이루어진 버튼의 외면에 터치 센서를 부착하는 경우 압력이나 열에 의해 터치 센서층에 변형이 생기거나 터치 센서층 및 보호층에 크랙이 발생하기도 하는 문제점이 있는 바, 상기와 같은 문제점들을 해결할 것이 요구된다.In addition, when the touch sensor is attached to the outer surface of the button consisting of a three-dimensional surface there is a problem that the deformation occurs in the touch sensor layer due to pressure or heat, or cracks may occur in the touch sensor layer and the protective layer. It is required to solve.
한국공개특허 제2012-0111607호는 압전 물질막의 상, 하부에 그래핀 패턴을 형성하고, 압력을 인가하는 경우에 발생하는 압전 효과를 이용하여 그래핀의 전기 전도도를 변화시킴으로써 압력 인가 지점의 인식이 가능하고 인가되는 압력 세기에 따른 압전 효과를 통해 분극량을 조절할 수 있는 터치 센서에 대해 개시하고 있으나 전술한 문제점에 대한 대안을 제시하지 못하였다.Korean Patent Laid-Open Publication No. 2012-0111607 has a graphene pattern formed on top and bottom of a piezoelectric material film and changes the electrical conductivity of graphene by using the piezoelectric effect generated when pressure is applied. A touch sensor capable of controlling the amount of polarization through the piezoelectric effect according to the applied and applied pressure strength is disclosed, but it does not provide an alternative to the aforementioned problem.
[선행기술문헌][Preceding technical literature]
[특허문헌][Patent Documents]
한국공개특허 제2012-0111607호Korean Patent Publication No. 2012-0111607
본 발명은 크랙을 최소화 할 수 있는 터치 센서 모듈을 제공하는 것을 목적으로 한다.An object of the present invention is to provide a touch sensor module that can minimize cracks.
또한, 본 발명은 상기의 터치 센서 모듈을 제조할 수 있는 터치 센서 모듈의 제조 방법을 제공하는 것을 목적으로 한다.In addition, an object of the present invention is to provide a method of manufacturing a touch sensor module that can manufacture the touch sensor module.
1. 캐리어 기판 점착용 분리층;1. Separation layer for carrier substrate adhesion;
상기 캐리어 기판 점착용 분리층 상에 배치된 제1 보호층;A first protective layer on the carrier substrate adhesive separation layer;
상기 제1 보호층 상에 배치된 터치 센서층;A touch sensor layer disposed on the first protective layer;
상기 터치센서층 상에 배치된 제2 보호층; 및A second protective layer disposed on the touch sensor layer; And
상기 제2 보호층 상에 배치된 필름용 점접착층을 포함하며,It includes an adhesive layer for the film disposed on the second protective layer,
상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크고, 탄성률이 1×107 내지 9×109 Pa인, 터치 센서 모듈.The adhesive layer for the film is a touch sensor module, the adhesive force is greater than the separation layer for adhesion to the carrier substrate, the elastic modulus is 1 × 10 7 to 9 × 10 9 Pa.
2. 위 1에 있어서, 상기 필름용 점접착층의 밀착력은 1 내지 20 N/25mm인, 터치 센서 모듈.2. In the above 1, the adhesive force of the adhesive layer for the film is 1 to 20 N / 25mm, touch sensor module.
3. 위 1에 있어서, 상기 필름용 점접착층의 탄성률이 1×107 내지 1×109 Pa인, 터치 센서 모듈.3. In the above 1, the elastic modulus of the adhesive layer for the film is 1 × 10 7 to 1 × 10 9 Pa, touch sensor module.
4. 위 1에 있어서, 상기 필름용 점접착층은 아크릴계 공중합체 및 중합성 단량체 중 적어도 하나인 반응성 화합물; 및 가교제;를 포함하는 점착제 조성물로 형성되는, 터치 센서 모듈.4. In the above 1, wherein the adhesive layer for the film is at least one of an acrylic copolymer and a polymerizable monomer; And a crosslinking agent; formed of an adhesive composition comprising a touch sensor module.
5. 위 1에 있어서, 상기 필름용 점접착층 상에 점착된 기재 필름을 더 포함하며, 상기 필름용 점접착층은 추가 열경화 공정을 거친 것인, 터치 센서 모듈.5. according to the above 1, further comprising a base film adhered on the adhesive layer for the film, the adhesive layer for the film is subjected to an additional heat curing process, the touch sensor module.
6. 위 5에 있어서, 상기 열경화는 50 내지 100℃로 수행되는, 터치 센서 모듈.6. In the above 5, wherein the thermal curing is carried out at 50 to 100 ℃, touch sensor module.
7. 위 1에 있어서, 상기 필름용 점접착층 상에 점착된 기재 필름을 더 포함하며, 상기 필름용 점접착층은 추가 광경화 공정을 거친 것인, 터치 센서 모듈.7. In the above 1, further comprising a base film adhered on the adhesive layer for the film, the adhesive layer for the film is subjected to an additional photocuring process, the touch sensor module.
8. 캐리어 기판 상에 캐리어 기판 점착용 분리층, 제1 보호층, 터치 센서층, 제2 보호층 및 필름용 점접착층을 순차로 배치하며,8. A carrier substrate adhesive separation layer, a first protective layer, a touch sensor layer, a second protective layer, and an adhesive layer for a film are sequentially disposed on the carrier substrate.
상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크고, 탄성률이 1×107 내지 9×109 Pa인, 터치 센서 모듈의 제조 방법.The adhesive layer for the film has a larger adhesion than the separation layer for adhesion of the carrier substrate, the elastic modulus is 1 × 10 7 to 9 × 10 9 Pa, the manufacturing method of the touch sensor module.
9. 위 8에 있어서, 상기 필름용 점접착층의 밀착력은 1N/25mm 내지 20 N/25mm인, 터치 센서 모듈의 제조 방법.9. In the above 8, the adhesion of the adhesive layer for the film is 1N / 25mm to 20 N / 25mm, the manufacturing method of the touch sensor module.
10. 위 8에 있어서, 상기 필름용 점접착층의 탄성률이 1×107 Pa 내지 1×109Pa인, 터치 센서 모듈의 제조 방법.10. In the above 8, the elastic modulus of the adhesive layer for the film is 1 × 10 7 Pa to 1 × 10 9 Pa, the manufacturing method of the touch sensor module.
11. 위 8에 있어서, 상기 필름용 점접착층의 추가 열경화 단계 및 상기 필름용 점접착층 상에 기재 필름을 점착하는 단계를 더 포함하는, 터치 센서 모듈의 제조 방법.11. In the above 8, further comprising the step of further heat curing the adhesive layer for the film and the adhesive film for the base film on the adhesive layer for the film, the manufacturing method of the touch sensor module.
12. 위 11에 있어서, 상기 추가 열경화는 50 내지 100℃로 수행되는, 터치 센서 모듈의 제조 방법.12. In the above 11, wherein the additional thermal curing is carried out at 50 to 100 ℃, manufacturing method of the touch sensor module.
13. 위 8에 있어서, 상기 필름용 점접착층의 추가 광경화 단계 및 상기 필름용 점접착층 상에 기재 필름을 점착하는 단계를 더 포함하는, 터치 센서 모듈의 제조 방법.13. In the above 8, further comprising the photo-curing step of the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film, the manufacturing method of the touch sensor module.
본 발명의 터치 센서 모듈은 외부 충격에 대한 내성이 우수하여 크랙의 발생을 최소화할 수 있다.The touch sensor module of the present invention is excellent in resistance to external impact and can minimize the occurrence of cracks.
본 발명의 터치 센서 모듈의 제조 방법은 캐리어 기판으로부터의 분리시에 발생할 수 있는 크랙을 최소화할 수 있다.The manufacturing method of the touch sensor module of the present invention can minimize the cracks that may occur upon separation from the carrier substrate.
도 1은 본 발명의 일 구현예에 따른 터치 센서 모듈의 개략적인 단면도이다.1 is a schematic cross-sectional view of a touch sensor module according to an embodiment of the present invention.
본 발명은 캐리어 기판 점착용 분리층; 상기 캐리어 기판 점착용 분리층 상에 배치된 제1 보호층; 상기 제1 보호층 상에 배치된 터치 센서층; 상기 터치센서층 상에 배치된 제2 보호층; 및 상기 제2 보호층 상에 배치된 필름용 점접착층을 포함하며, 상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크고, 탄성률이 1×107 Pa 내지 9×109Pa로써, 외부 충격에 대한 내성이 우수하여 크랙의 발생을 최소화 할 수 있는 터치 센서 모듈에 관한 것이다.The present invention is a carrier substrate adhesive separation layer; A first protective layer on the carrier substrate adhesive separation layer; A touch sensor layer disposed on the first protective layer; A second protective layer disposed on the touch sensor layer; And an adhesive layer for film disposed on the second protective layer, wherein the adhesive layer for film has an adhesive strength greater than that of the separation layer for adhesion to the carrier substrate, and an elastic modulus of 1 × 10 7 Pa to 9 × 10 9 Pa. The present invention relates to a touch sensor module capable of minimizing the occurrence of cracks due to its excellent resistance to external shock.
이하, 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.
<터치 센서 모듈><Touch Sensor Module>
본 발명은 캐리어 기판 점착용 분리층; 상기 캐리어 기판 점착용 분리층 상에 배치된 제1 보호층; 상기 제1 보호층 상에 배치된 터치 센서층; 상기 터치센서층 상에 배치된 제2 보호층; 및 상기 제2 보호층 상에 배치된 필름용 점접착층을 포함하고, 상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크고, 탄성률이 1×107 Pa 내지 9×109Pa인 터치 센서 모듈을 제공한다.The present invention is a carrier substrate adhesive separation layer; A first protective layer on the carrier substrate adhesive separation layer; A touch sensor layer disposed on the first protective layer; A second protective layer disposed on the touch sensor layer; And an adhesive layer for film disposed on the second protective layer, wherein the adhesive layer for film has an adhesive force greater than that of the separation layer for adhesion of the carrier substrate, and an elastic modulus is 1 × 10 7 Pa to 9 × 10 9 Pa. Provides a touch sensor module.
도 1에는 본 발명의 일 구현예에 따른 터치 센서 모듈을 간략히 나타내었다.1 briefly illustrates a touch sensor module according to an embodiment of the present invention.
본 발명의 터치 센서 모듈은 캐리어 기판 상에서 제조 공정이 진행되고, 제조된 터치 센서 모듈을 캐리어 기판으로부터 분리하여 제조되는 것으로서, 캐리어 기판 점착용 분리층은 공정 진행을 위한 캐리어 기판과의 점착 및 분리를 위해 형성되는 층이다.In the touch sensor module of the present invention, a manufacturing process is performed on the carrier substrate, and the manufactured touch sensor module is manufactured by separating the carrier substrate from the carrier substrate. Layer is formed.
또한, 제조 공정, 운송 또는 사용 중에 터치 센서 모듈에 가해질 수 있는 외부 충격에 대한 스트레스를 완화하여 후술할 제1 보호층과 터치 센서층의 크랙을 억제하는 역할을 한다.In addition, by reducing the stress on the external shock that may be applied to the touch sensor module during the manufacturing process, transportation or use serves to suppress cracks of the first protective layer and the touch sensor layer to be described later.
상기 캐리어 기판 점착용 분리층으로는 당 분야에 공지된 열경화 또는 광경화성 점착제를 제한 없이 사용할 수 있고, 구체적으로는 폴리에스테르계, 폴리에테르계, 우레탄계, 에폭시계, 실리콘계, 아크릴계 등의 열경화성 또는 광경화성 점착제를 예로 들 수 있다.As the separation layer for adhesion of the carrier substrate, a thermosetting or photocurable adhesive known in the art may be used without limitation, and specifically, thermosetting such as polyester, polyether, urethane, epoxy, silicone, acrylic, or the like. A photocurable adhesive can be mentioned.
캐리어 기판 점착용 분리층의 밀착력은 특별히 한정되지 않으며, 예를 들면 0.01 내지 1.00 N/25mm 일 수 있다. 밀착력이 상기 범위 내인 경우 캐리어 기판에 효과적으로 점착될 수 있으며, 캐리어 기판으로부터의 박리시에 터치 센서 모듈에 가해지는 손상을 방지할 수 있다.The adhesion of the separation layer for carrier substrate adhesion is not particularly limited, and may be, for example, 0.01 to 1.00 N / 25 mm. When the adhesion is within the above range, it can be effectively adhered to the carrier substrate, it is possible to prevent damage to the touch sensor module when peeling from the carrier substrate.
제1 보호층은 상기 캐리어 기판 점착용 분리층 상에 배치된다.The first protective layer is disposed on the carrier substrate adhesion separation layer.
제1 보호층은 터치 센서층을 피복하여 터치 센서층을 보호하며, 터치 센서층에 대한 기판으로서 역할을 한다.The first protective layer covers the touch sensor layer to protect the touch sensor layer and serves as a substrate for the touch sensor layer.
제1 보호층은 고분자막일 수 있으며, 예를 들면 폴리디메틸실록산(PDMS), 폴리오르가노실록산(POS) 등의 실리콘계 고분자; 폴리이미드계 고분자; 폴리우레탄계 고분자 등으로 제조된 것일 수 있으나, 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다. 그 외 당분야에 공지된 유기 또는 무기 절연막 소재를 사용할 수도 있다.The first protective layer may be a polymer film, for example, a silicone-based polymer such as polydimethylsiloxane (PDMS) or polyorganosiloxane (POS); Polyimide-based polymers; It may be made of a polyurethane-based polymer, but is not limited thereto. These can be used individually or in mixture of 2 or more types. In addition, an organic or inorganic insulating material known in the art may be used.
터치 센서층은 제1 보호층 상에 배치되는 것으로서, 터치 감지를 위한 감지 전극을 포함한다.The touch sensor layer is disposed on the first protective layer and includes a sensing electrode for touch sensing.
감지 전극으로는 전도성 물질이라면 제한되지 않고 사용될 수 있으며, 예를 들면 인듐틴옥사이드(ITO), 인듐징크옥사이드(IZO), 인듐징크틴옥사이드(IZTO), 알루미늄징크옥사이드(AZO), 갈륨징크옥사이드(GZO), 플로린틴옥사이드(FTO), 인듐틴옥사이드-은-인듐틴옥사이드(ITO-Ag-ITO), 인듐징크옥사이드-은-인듐징크옥사이드(IZO-Ag-IZO), 인듐징크틴옥사이드-은-인듐징크틴옥사이드(IZTO-Ag-IZTO) 및 알루미늄징크옥사이드-은-알루미늄징크옥사이드(AZO-Ag-AZO)로 이루어진 군에서 선택된 금속산화물류; 금(Au), 은(Ag), 구리(Cu), 몰리브덴(Mo) 및 APC로 이루어진 군에서 선택된 금속류; 금, 은, 구리 및 납으로 이루어진 군에서 선택된 금속의 나노 와이어; 탄소나노튜브(CNT) 및 그래핀 (graphene)으로 이루어진 군에서 선택된 탄소계 물질류; 및 폴리(3,4-에틸렌디옥시티오펜)(PEDOT) 및 폴리아닐린(PANI)으로 이루어진 군에서 선택된 전도성 고분자 물질류에서 선택된 재료로 형성될 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The sensing electrode may be used without limitation as long as it is a conductive material. For example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), and gallium zinc oxide ( GZO), Florin Tin Oxide (FTO), Indium Tin Oxide-Silver-Indium Tin Oxide (ITO-Ag-ITO), Indium Zinc Oxide-Silver-Indium Zinc Oxide (IZO-Ag-IZO), Indium Zinc Tin Oxide-Silver Metal oxides selected from the group consisting of -indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO); Metals selected from the group consisting of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), and APC; Nanowires of metals selected from the group consisting of gold, silver, copper and lead; Carbon-based materials selected from the group consisting of carbon nanotubes (CNT) and graphene; And conductive polymer materials selected from the group consisting of poly (3,4-ethylenedioxythiophene) (PEDOT) and polyaniline (PANI). These can be used individually or in mixture of 2 or more types.
필요에 따라, 감지 전극은 2개 이상의 층으로 형성되고, 각 층 사이에 절연막을 포함할 수 있다.If necessary, the sensing electrode may be formed of two or more layers, and may include an insulating film between each layer.
절연막은 복수층의 감지 전극을 서로 전기적으로 절연시키는 역할을 하는 것으로서, 당 분야에 공지된 유기 또는 무기 절연막 소재가 제한 없이 사용될 수 있다.The insulating film serves to electrically insulate the plurality of sensing electrodes from each other, and an organic or inorganic insulating material known in the art may be used without limitation.
제2 보호층은 상기 터치 센서층 상에 배치된다.The second protective layer is disposed on the touch sensor layer.
제2 보호층은 마찬가지로 터치 센서층을 피복하여 터치 센서층을 보호하고, 정전기 등으로 인한 오작동을 방지할 수 있다.Similarly, the second protective layer may cover the touch sensor layer to protect the touch sensor layer and prevent malfunction due to static electricity.
제2 보호층은 전술한 제1 보호층과 동일한 소재로 형성된 것일 수 있으나, 이에 제한되는 것은 아니다.The second protective layer may be formed of the same material as the above-described first protective layer, but is not limited thereto.
필름용 점접착층은 상기 제2 보호층 상에 배치된다.The adhesive layer for films is disposed on the second protective layer.
필름용 점접착층은 본 발명의 터치 센서 모듈이 기재 필름을 더 포함하는 경우 기재 필름과의 점착을 위해 형성되는 층이다. 뿐만 아니라, 제조 공정, 운송 또는 사용 중에 터치 센서 모듈에 가해질 수 있는 외부 충격에 대한 스트레스를 완화하여 제1 및 제2 보호층과 터치 센서층의 크랙을 억제하는 역할을 한다. 본 발명에 있어서, 점접착층이란 점착층, 접착층 또는 이 둘 모두를 지칭한다.The adhesive layer for films is a layer formed for adhesion with the base film when the touch sensor module of the present invention further comprises a base film. In addition, it serves to suppress cracking of the first and second protective layers and the touch sensor layer by mitigating stress against external shock that may be applied to the touch sensor module during the manufacturing process, transportation, or use. In the present invention, the adhesive layer refers to an adhesive layer, an adhesive layer, or both.
필름용 점접착층은 캐리어 기판 점착용 분리층보다 큰 밀착력을 갖는다.The adhesive layer for films has a larger adhesive force than the separation layer for carrier substrate adhesion.
본 발명의 터치 센서 모듈은 상기 구성들을 구비하면서, 캐리어 기판으로부터 상기 구성들을 갖는 적층체를 분리함으로써 얻어질 수 있다. 이때, 필름용 점접착층의 밀착력이 캐리어 기판 점착용 분리층의 밀착력보다 낮은 경우에는, 캐리어 기판으로부터의 박리 시에 필름용 점접착층 또는 후술할 기재 필름이 박리되거나, 제1, 제2 보호층 및 터치 센서층이 손상될 수 있고, 캐리어 기판으로부터의 분리 자체가 불가능할 수도 있다.The touch sensor module of the present invention can be obtained by separating the laminate having the above configurations from the carrier substrate while having the above configurations. At this time, when the adhesive force of the adhesive layer for films is lower than the adhesive force of the separation layer for carrier substrate adhesion, the adhesive layer for films or the substrate film to be described later is peeled off at the time of peeling from the carrier substrate, or the first and second protective layers and The touch sensor layer may be damaged and separation from the carrier substrate itself may not be possible.
필름용 점접착층의 밀착력은 상기 캐리어 기판 점착용 분리층의 밀착력보다 큰 것이라면 특별히 제한되지 않으며, 예를 들면 상기 필름용 점접착층의 밀착력은 1 내지 20 N/25mm 일 수 있다. 바람직하게는 5 내지 20 N/25mm, 보다 바람직하게는 10 내지 20N/25mm 일 수 있다. 상기 필름용 점접착층의 밀착력이 상기 범위 내인경우 박리시 크랙 발생 방지 효과가 극대화될 수 있다. The adhesion of the adhesive layer for films is not particularly limited as long as it is greater than the adhesion of the separation layer for adhesion of the carrier substrate. For example, the adhesion of the adhesive layer for films may be 1 to 20 N / 25mm. Preferably it may be 5 to 20 N / 25 mm, more preferably 10 to 20 N / 25 mm. When the adhesion of the adhesive layer for the film is within the above range can be maximized the effect of preventing cracks during peeling.
또한, 상기 필름용 점착제는 1×107 Pa 내지 9×109 Pa, 바람직하게는1×107 내지 1×109 Pa 의 탄성률을 갖는다. 본 명세서 상에서 탄성률이란 저장 탄성률(storage modulus)을 의미한다.In addition, the pressure-sensitive adhesive for films has an elastic modulus of 1 × 10 7 Pa to 9 × 10 9 Pa, preferably 1 × 10 7 to 1 × 10 9 Pa. In this specification, the modulus of elasticity means storage modulus.
탄성률이 1×107 Pa 미만인 경우 필름용 점접착층의 응집력이 강해져 밀착력이 저하되고, 탄성률이 9×109 Pa를 초과하는 경우 밀착력이 발현되지 않아 점접착층으로 사용이 불가한 문제가 있다.If elastic modulus of 1 × 10 7 Pa is less than the cohesive strength of the adhesive film that for stronger adhesive force is lowered, the modulus of elasticity there is a problem in the adhesive force is not being expressed can not be used in that the adhesive layer, if it exceeds 9 × 10 9 Pa.
필름용 점접착층으로는 상기 밀착력 및 탄성률 범위를 만족시키는 것이라면 당 분야에 공지된 열경화성 또는 광경화성 점착제가 제한 없이 사용될 수 있다.As the adhesive layer for the film, thermosetting or photocurable pressure-sensitive adhesives known in the art may be used without limitation as long as the adhesion and elastic modulus ranges are satisfied.
구체적인 예로는 아크릴계 공중합체 및 중합성 단량체 중 적어도 하나인 반응성 화합물 및 가교제를 포함하는 점착제 조성물을 들 수 있다.Specific examples include a pressure-sensitive adhesive composition containing a reactive compound which is at least one of an acrylic copolymer and a polymerizable monomer and a crosslinking agent.
본 발명에 따른 아크릴계 공중합체는 당 분야에 통상적으로 사용되는 아크릴계 공중합체가 제한 없이 사용될 수 있으며, 예를 들면 탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴레이트계 단량체 및 이와 공중합 가능한 가교성 단량체가 공중합된 것일 수 있다. 여기서, (메타)아크릴레이트는 아크릴레이트 및 메타크릴레이트 모두를 의미한다.The acrylic copolymer according to the present invention can be used without limitation acrylic copolymers commonly used in the art, for example (meth) acrylate monomer having an alkyl group having 1 to 12 carbon atoms and crosslinkable monomer copolymerizable with the May be copolymerized. Here, (meth) acrylate means both acrylate and methacrylate.
탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴레이트계 단량체로는 n-부틸(메타)아크릴레이트, 2-부틸(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 에틸(메타)아크릴레이트, 메틸(메타)아크릴레이트, 메틸에틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, 이소프로필(메타)아크릴레이트, 펜틸(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, 노닐(메타)아크릴레이트, 데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트 등을 들 수 있으며, 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다. 이 중에서 n-부틸아크릴레이트, 2-에틸헥실아크릴레이트 또는 이들의 혼합물이 바람직하다.As a (meth) acrylate type monomer which has a C1-C12 alkyl group, n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) ) Acrylate, ethyl (meth) acrylate, methyl (meth) acrylate, methyl ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, pentyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, and the like. It can be mixed and used. Among these, n-butyl acrylate, 2-ethylhexyl acrylate, or a mixture thereof is preferable.
탄소수 1-12의 알킬기를 갖는 (메타)아크릴레이트계 단량체는 아크릴계 공중합체의 제조에 사용되는 단량체 총 중량 중 80 내지 99중량%, 바람직하게 90 내지 95중량% 포함되어 중합될 수 있다. 상기 범위 내에서 충분한 점착력이 발휘될 수 있고 응집력 저하를 방지할 수 있다.The (meth) acrylate monomer having an alkyl group having 1 to 12 carbon atoms may be polymerized by including 80 to 99% by weight, preferably 90 to 95% by weight, based on the total weight of the monomers used to prepare the acrylic copolymer. Sufficient adhesive force can be exhibited within the said range, and the fall of cohesion force can be prevented.
가교성 단량체는 화학 결합에 의해 점착제 조성물의 응집력 또는 점착 강도를 보강하여 내구성과 절단성을 부여하기 위한 성분으로서, 예컨대 히드록시기를 갖는 단량체, 카르복시기를 갖는 단량체, 아미드기를 갖는 단량체, 3차 아미노기를 갖는 단량체 등을 들 수 있으며, 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The crosslinkable monomer is a component for reinforcing the cohesive force or adhesive strength of the pressure-sensitive adhesive composition by chemical bonding and imparting durability and cutting property, such as a monomer having a hydroxy group, a monomer having a carboxyl group, a monomer having an amide group, and a tertiary amino group. A monomer etc. can be mentioned, These can be used individually or in mixture of 2 or more types.
히드록시기를 갖는 단량체로는 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 2-히드록시에틸렌글리콜(메타), 아크릴레이트, 2-히드록시프로필렌글리콜(메타)아크릴레이트, 알킬렌기의 탄소수가 2 내지 4인 히드록시알킬렌글리콜(메타)아크릴레이트, 4-히드록시부틸비닐에테르, 5-히드록시펜틸비닐에테르, 6-히드록시헥실비닐에테르, 7-히드록시헵틸비닐에테르, 8-히드록시옥틸비닐에테르, 9-히드록시노닐비닐에테르, 10-히드록시데실비닐에테르 등을 들 수 있으며, 이들 중에서 4-히드록시부틸비닐에테르가 바람직하다.As a monomer which has a hydroxyl group, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 2-hydroxyethylene glycol (meth), acrylate, 2-hydroxypropylene glycol (meth) acrylate, hydroxyalkylene glycol having 2 to 4 carbon atoms of an alkylene group (Meth) acrylate, 4-hydroxybutyl vinyl ether, 5-hydroxypentyl vinyl ether, 6-hydroxyhexyl vinyl ether, 7-hydroxyheptyl vinyl ether, 8-hydroxyoctyl vinyl ether, 9-hydroxy Nonyl vinyl ether, 10-hydroxydecyl vinyl ether, etc. are mentioned, Among these, 4-hydroxybutyl vinyl ether is preferable.
카르복시기를 갖는 단량체로는 (메타)아크릴산, 크로톤산 등의 1가산; 말레인산, 이타콘산, 푸마르산 등의 2가산 및 이들의 모노알킬에스테르; 3-(메타)아크릴로일프로피온산; 알킬기의 탄소수가 2-3인 2-히드록시알킬(메타)아크릴레이트의 무수호박산 개환 부가체, 알킬렌기의 탄소수가 2-4인 히드록시알킬렌글리콜(메타)아크릴레이트의 무수 호박산 개환 부가체, 알킬기의 탄소수가 2-3인 2-히드록시알킬(메타)아크릴레이트의 카프로락톤 부가체에 무수 호박산을 개환 부가시킨 화합물 등을 들 수 있으며, 이들 중에서 (메타)아크릴산이 바람직하다.As a monomer which has a carboxy group, Monovalent acids, such as (meth) acrylic acid and a crotonic acid; Diacids such as maleic acid, itaconic acid and fumaric acid, and monoalkyl esters thereof; 3- (meth) acryloylpropionic acid; Succinic anhydride ring-opening adduct of 2-hydroxyalkyl (meth) acrylate with 2-3 carbon atoms of an alkyl group, Succinic anhydride ring opening adduct of hydroxyalkylene glycol (meth) acrylate with 2-4 carbon atoms of an alkylene group And a compound obtained by ring-opening addition of succinic anhydride to a caprolactone adduct of 2-hydroxyalkyl (meth) acrylate having 2 to 3 carbon atoms of an alkyl group, among which (meth) acrylic acid is preferred.
아미드기를 갖는 단량체로는 (메타)아크릴아미드, N-이소프로필아크릴아미드, N-3차부틸아크릴아미드, 3-히드록시프로필(메타)아크릴아미드, 4-히드록시부틸(메타)아크릴아미드, 6-히드록시헥실(메타)아크릴아미드, 8-히드록시옥틸(메타)아크릴아미드, 2-히드록시에틸헥실(메타)아크릴아미드 등을 들 수 있으며, 이들중에서 (메타)아크릴아미드가 바람직하다.Examples of the monomer having an amide group include (meth) acrylamide, N-isopropylacrylamide, N-tert-butylacrylamide, 3-hydroxypropyl (meth) acrylamide, 4-hydroxybutyl (meth) acrylamide, 6 -Hydroxyhexyl (meth) acrylamide, 8-hydroxyoctyl (meth) acrylamide, 2-hydroxyethylhexyl (meth) acrylamide, etc. are mentioned, Among these, (meth) acrylamide is preferable.
3차 아미노기를 갖는 단량체로는 N,N-(디메틸아미노)에틸(메타)아크릴레이트, N,N-(디에틸아미노)에틸(메타)아크릴레이트, N,N-(디메틸아미노)프로필(메타)아크릴레이트 등을 들 수 있다.As monomers having a tertiary amino group, N, N- (dimethylamino) ethyl (meth) acrylate, N, N- (diethylamino) ethyl (meth) acrylate, N, N- (dimethylamino) propyl (meth ) Acrylates and the like.
가교성 단량체는 아크릴계 공중합체의 제조에 사용되는 단량체 총 중량 중 0.05 내지 10중량%, 바람직하게는 0.1 내지 8중량%인 것이 좋다. 상기 범위 내에서 점착제의 응집력이 높아 내구성을 향상시킬 수 있다.The crosslinkable monomer is preferably 0.05 to 10% by weight, preferably 0.1 to 8% by weight, based on the total weight of the monomers used to prepare the acrylic copolymer. Within the above range, the cohesive force of the pressure-sensitive adhesive may be high to improve durability.
또한, 상기 단량체들 이외에 다른 중합성 단량체가 점착력을 저하시키지 않는 범위, 예컨대 10중량% 이하로 더 포함될 수 있다.In addition, other polymerizable monomers in addition to the monomers may be further included in a range that does not lower the adhesion, such as 10% by weight or less.
공중합체의 제조방법은 특별히 한정되지 않으며, 당 분야에서 통상적으로 사용되는 괴상중합, 용액중합, 유화중합 또는 현탁중합 등의 방법을 이용하여 제조할 수 있으며, 용액중합이 바람직하다. The production method of the copolymer is not particularly limited, and may be prepared using a method such as bulk polymerization, solution polymerization, emulsion polymerization or suspension polymerization, which are commonly used in the art, and solution polymerization is preferable.
또한, 중합 시 통상 사용되는 용매, 중합개시제, 분자량 제어를 위한 연쇄이동제 등을 사용할 수 있다.In addition, a solvent, a polymerization initiator, a chain transfer agent for molecular weight control, and the like, which are usually used in the polymerization, may be used.
아크릴계 공중합체는 겔투과크로마토그래피(Gel permeation chromatography, GPC)에 의해 측정된 중량평균분자량(폴리스티렌 환산, Mw)이 5만 내지 200만인 것이 바람직하며, 보다 바람직하기로는 40만 내지 200만인 것이 좋다. 상기 범위 내에서 점착 내구성 및 도공 시 공정성이 우수하다.The acrylic copolymer preferably has a weight average molecular weight (polystyrene equivalent, Mw) measured by gel permeation chromatography (GPC) of 50,000 to 2 million, more preferably 400,000 to 2 million. Within this range, the adhesion durability and processability during coating are excellent.
한편, 중합성 단량체는 본 발명의 목적을 해치지 않는 범위 내에서 당 분야에서 통상적으로 사용되는 단량체라면 특별한 제한은 없고, 구체적으로는 다관능 아크릴계 단량체, 스티렌계 단량체, 에폭시계 단량체 등을 예로 들 수 있다.On the other hand, the polymerizable monomer is not particularly limited as long as it is a monomer commonly used in the art within the scope of not impairing the object of the present invention, specifically, polyfunctional acrylic monomers, styrene monomers, epoxy monomers and the like. have.
다관능 아크릴계 단량체는 접착제 조성물의 응집력을 개선하여, 내열 조건에서 기포 발생을 억제하므로 내열성을 개선한다.The polyfunctional acrylic monomer improves the cohesive force of the adhesive composition, thereby suppressing bubble generation under heat-resistant conditions, thereby improving heat resistance.
상기 다관능 아크릴계 단량체의 종류는 특별히 한정되지 않으며, 예를 들면 1,6-헥산디올디(메타)아크릴레이트, 트리메틸올프로판트리(메타)아크릴레이트, 펜타에리트리톨트리(메타)아크릴레이트, 디펜타에리트리톨트리(메타)아크릴레이트, 프로피온산 변성 트리메틸올프로판트리(메타)아크릴레이트, 프로필렌옥사이드 변성 트리메틸올프로판트리(메타)아크릴레이트, 트리스(2-히드록시에틸)이소시아누레이트트리(메타)아크릴레이트, 트리스(메타)아크릴옥시에틸이소시아누레이트, 글리세롤트리(메타)아크릴레이트 등의 3관능성 단량체; 디글리세린테트라(메타)아크릴레이트, 펜타에리트리톨테트라(메타)아크릴레이트, 디트리메틸올프로판테트라(메타)아크릴레이트, 테트라메틸올프로판테트라(메타)아크릴레이트 등의 4관능성 단량체; 디펜타에리트리톨펜타(메타)아크릴레이트, 프로피온산 변성 디펜타에리트리톨펜타(메타)아크릴레이트 등의 5관능성 단량체; 디펜타에리트리톨헥사(메타)아크릴레이트, 카프로락톤 변성 디펜타에리트리톨헥사(메타)아크릴레이트, 이소시아네이트 변성 우레탄헥사(메타)아크릴레이트 등의 6관능성 단량체 등을 들 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The kind of the polyfunctional acrylic monomer is not particularly limited, and for example, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, di Pentaerythritol tri (meth) acrylate, propionic acid-modified trimethylolpropane tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tree (meth Trifunctional monomers such as acrylate, tris (meth) acryloxyethyl isocyanurate, and glycerol tri (meth) acrylate; Tetrafunctional monomers such as diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and tetramethylolpropane tetra (meth) acrylate; Pentafunctional monomers such as dipentaerythritol penta (meth) acrylate and propionic acid-modified dipentaerythritol penta (meth) acrylate; 6-functional monomers, such as dipentaerythritol hexa (meth) acrylate, caprolactone modified dipentaerythritol hexa (meth) acrylate, and isocyanate-modified urethane hexa (meth) acrylate, etc. are mentioned. These can be used individually or in mixture of 2 or more types.
상기 스티렌계 단량체의 종류는 특별히 한정되지 않으며, 예를 들면 스티렌, 비닐톨루엔, α-메틸스티렌, 디메틸스티렌, 클로로스티렌, 브로모스티렌, t-부틸스티렌, 메톡시스티렌, 시아노스티렌 등을 들 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The kind of the styrene monomer is not particularly limited, and examples thereof include styrene, vinyltoluene, α-methylstyrene, dimethyl styrene, chlorostyrene, bromostyrene, t-butyl styrene, methoxy styrene and cyano styrene. Can be. These can be used individually or in mixture of 2 or more types.
상기 에폭시계 단량체의 종류는 특별히 한정되지 않으며, 예를 들면, 방향족 에폭시 화합물, 지환족 에폭시 화합물, 지방족 에폭시 화합물 등일 수 있다. The kind of said epoxy monomer is not specifically limited, For example, it may be an aromatic epoxy compound, an alicyclic epoxy compound, an aliphatic epoxy compound, etc.
상기 방향족 에폭시 화합물은 구체적으로는 비스페놀A의 디글리시딜에테르, 비스페놀F의 디클리시딜에테르, 페녹시 글리시딜에테르 등일 수 있고, 지환족 에폭시 화합물은 구체적으로는 디시클로펜타디엔디옥시드, 리모넨디옥시드, 4-비닐시클로헥센디옥시드, 3,4-에폭시시클로헥실메틸 3,4-에폭시시클로헥산카르복실레이트, 비스(3,4-에폭시시클로헥실메틸)아디페이트로 에폭시화시클로헥실기를 가지는 화합물 등일 수 있으며, 상기 지방족 에폭시 화합물은 1,6-헥산디올디글리시딜에테르, 1,4-부탄디올디글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 펜타에리트리톨테트라글리시딜에테르, 폴리테트라메틸렌글리콜디글리시딜에테르 등일 수 있으나 이에 제한되는 것은 아니다. 이들은 각각 단독 또는 2종 이상 혼합하여 사용할 수 있다.Specifically, the aromatic epoxy compound may be diglycidyl ether of bisphenol A, diclidyl ether of bisphenol F, phenoxy glycidyl ether, or the like, and the alicyclic epoxy compound is specifically dicyclopentadiene dioxide. , Cyclomonhexoxide, 4-vinylcyclohexenedioxide, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate The aliphatic epoxy compound may be 1,6-hexanediol diglycidyl ether, 1,4-butanediol diglycidyl ether, trimethylolpropanetriglycidyl ether, pentaerythritol tetraglycidyl ether, etc. Diethyl ether, polytetramethylene glycol diglycidyl ether, and the like, but is not limited thereto. These can be used individually or in mixture of 2 or more types, respectively.
가교제는 공중합체를 적절히 가교함으로써 점착제의 응집력을 강화하기 위한 성분이다.A crosslinking agent is a component for strengthening the cohesion force of an adhesive by crosslinking a copolymer suitably.
본 발명에 따른 가교제의 종류는 특별히 한정되지 않고 당 분야에 공지된 가교제가 사용될 수 있으며, 예를 들면 이소시아네이트계 화합물, 에폭시계 화합물 등을 들 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The type of crosslinking agent according to the present invention is not particularly limited, and a crosslinking agent known in the art may be used, and examples thereof include an isocyanate compound and an epoxy compound. These can be used individually or in mixture of 2 or more types.
이소시아네이트계 화합물로는 톨릴렌디이소시아네이트, 자일렌디이소시아네이트, 2,4-디페닐메탄디이소시아네트, 4,4-디페닐메탄디이소시아네트, 헥사메틸렌디이소시아네이트, 이소포론디이소시아네이트, 테트라메틸자일렌디이소시아네이트, 나프탈렌디이소시아네이트 등의 디이소시아네이트 화합물; 트리메틸올프로판 등의 다가 알콜계 화합물 1당량에 디이소시아네이트 화합물 3당량을 반응시킨 부가체, 디이소시아네이트 화합물 3당량을 자기 축합시킨 이소시아누레이트체, 디이소시아네이트 화합물 3당량 중 2당량으로부터 얻어지는 디이소시아네이트 우레아에 나머지 1당량의 디이소시아네이트가 축합된 뷰렛체, 트리페닐메탄트리이소시아네이트, 메틸렌비스트리이소시아네이트 등의 3개의 관능기를 함유하는 다관능 이소시아네이트 화합물; 등을 들 수 있으나, 이에 제한되는 것은 아니다.As the isocyanate compound, tolylene diisocyanate, xylene diisocyanate, 2,4-diphenylmethane diisocyanate, 4,4-diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, tetramethyl xylene diisocyanate Diisocyanate compounds such as naphthalene diisocyanate; Diisocyanate obtained from 2 equivalents of an adduct obtained by reacting 3 equivalents of a diisocyanate compound with 1 equivalent of a polyhydric alcohol compound such as trimethylolpropane, an isocyanurate having 3 equivalents of a diisocyanate compound, and 3 equivalents of a diisocyanate compound Polyfunctional isocyanate compound containing three functional groups, such as a biuret body, triphenylmethane triisocyanate, and methylene bistriisocyanate which the remaining 1 equivalent of diisocyanate condensed in urea; And the like, but is not limited thereto.
에폭시계 화합물로는 에틸렌글리콜디글리시딜에테르, 디에틸렌글리콜디글리시딜에테르, 폴리에틸렌글리콜디글리시딜에테르, 프로필렌글리콜디글리시딜에테르, 트리프로필렌글리콜디글리시딜에테르, 폴리프로필렌글리콜디글리시딜에테르, 네오펜틸글리콜디글리시딜에테르, 1,6-헥산디올디글리시딜에테르, 폴리테트라메틸렌글리콜디글리시딜에테르, 글리세롤디글리시딜에테르, 글리세롤트리글리시딜에테르, 디글리세롤폴리글리시딜에테르, 폴리글리세롤폴리글리시딜에테르, 레졸신디글리시딜에테르, 2,2-디브로모네오펜틸글리콜디글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 펜타에리트리톨폴리글리시딜에테르, 소르비톨폴리글리시딜에테르, 아디핀산디글리시딜에스테르, 프탈산디글리시딜에스테르, 트리스(글리시딜)이소시아누레이트, 트리스(글리시독시에틸)이소시아누레이트, 1,3-비스(N,N-글리시딜아미노메틸)시클로헥산, N,N,N',N'-테트라글리시딜-m-자일릴렌디아민 등을 들 수 있으나, 이에 제한되는 것은 아니다.Examples of the epoxy compound include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, and polypropylene glycol. Diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, polytetramethylene glycol diglycidyl ether, glycerol diglycidyl ether, glycerol triglycidyl ether, Diglycerol polyglycidyl ether, polyglycerol polyglycidyl ether, resorcin diglycidyl ether, 2,2-dibromoneopentyl glycol diglycidyl ether, trimethylolpropanetriglycidyl ether, pentaerythritol Polyglycidyl ether, sorbitol polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, tris (glycidyl) isocyanur Tris (glycidoxyethyl) isocyanurate, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, N, N, N ', N'-tetraglycidyl-m- Xylylenediamine and the like, but are not limited thereto.
또한, 본 발명의 목적을 해치지 않는 범위 내에서, 상기 이소시아네이트계 화합물 또는 에폭시계 화합물과 함께 멜라민계 화합물을 단독 또는 2종 이상 혼합하여 추가로 사용할 수 있다. 멜리민계 화합물로는 헥사메틸올멜라민, 헥사메톡시메틸멜라민, 헥사부톡시메틸멜라민 등을 들 수 있다.Moreover, a melamine type compound can be used individually or in mixture of 2 or more types with the said isocyanate type compound or an epoxy type compound in the range which does not impair the objective of this invention. Hexamethylol melamine, hexamethoxymethylmelamine, hexabutoxymethylmelamine, etc. are mentioned as a melamine type compound.
본 발명의 터치 센서 모듈은 상기 필름용 점접착층 상에 점착된 기재 필름을 더 포함할 수 있다.The touch sensor module of the present invention may further include a base film adhered on the adhesive layer for the film.
기재 필름으로는 당 분야에 널리 사용되는 소재로 제조된 기재 필름이 제한되지 않고 사용될 수 있으며, 예를 들면, 셀룰로오스 에스테르(예: 셀룰로오스 트리아세테이트, 셀룰로오스 프로피오네이트, 셀룰로오스 부티레이트, 셀룰로오스 아세테이트 프로피오네이트, 및 니트로셀룰로오스), 폴리이미드, 폴리카보네이트, 폴리에스테르(예: 폴리에틸렌테레프탈레이트, 폴리에틸렌나프탈레이트, 폴리-1,4-시클로헥산디메틸렌테레프탈레이트, 폴리에틸렌 1,2-디페녹시에탄-4,4´-디카르복실레이트 및 폴리부틸렌테레프탈레이트, 폴리스티렌(예: 신디오택틱(syndiotactic) 폴리스티렌), 폴리올레핀(예: 폴리프로필렌, 폴리에틸렌 및 폴리메틸펜텐), 폴리술폰, 폴리에테르 술폰, 폴리아릴레이트, 폴리에테르-이미드, 폴리메틸메타아크릴레이트, 폴리에테르 케톤, 폴리비닐알코올 및 폴리염화비닐로 이루어진 군으로부터 선택된 단독 또는 이들의 혼합물로 제조된 필름일 수 있다.As the base film, a base film made of a material widely used in the art may be used without limitation, and for example, a cellulose ester such as cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate propionate , And nitrocellulose), polyimide, polycarbonate, polyester (e.g. polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene 1,2-diphenoxyethane-4, 4´-dicarboxylate and polybutylene terephthalate, polystyrene (e.g. syndiotactic polystyrene), polyolefins (e.g. polypropylene, polyethylene and polymethylpentene), polysulfones, polyether sulfones, polyarylenes , Polyether-imide, polymethyl methacrylate, polyether ketone, poly It may be a polyvinyl alcohol and polyvinyl film made of a single or a mixture selected from the group consisting of chloride.
필름용 점접착층 상에 기재 필름이 점착되는 경우, 상기 필름용 점접착층은 추가 열경화 공정을 거친 것일 수 있다.When the base film is adhered on the adhesive layer for film, the adhesive layer for film may be subjected to an additional heat curing process.
본 명세서에서 추가 열경화 공정은 점착제 조성물의 도포 및 경화에 의해 필름용 점접착층을 형성한 이후에 별도로 더 수행되는 열경화 공정을 의미한다.In the present specification, the additional thermosetting process means a thermosetting process which is further performed separately after forming the adhesive layer for film by applying and curing the pressure-sensitive adhesive composition.
추가 열경화는 예를 들면 50 내지 100℃의 온도로 수행될 수 있다. 상기 온도 범위 내에서 열경화가 진행되는 경우 필름용 점접착층이 충분히 밀착될 수 있고, 필름의 컬발생 또는 변형을 방지할 수 있다.Further thermosetting can be carried out, for example, at a temperature of 50 to 100 ° C. When the thermal curing is performed within the temperature range, the adhesive layer for the film may be sufficiently in contact with each other, and curling or deformation of the film may be prevented.
또한, 필름용 점접착층 상에 기재 필름이 점착되는 경우, 상기 필름용 점접착층은 추가 광경화 공정을 거친 것일 수 있다.In addition, when the base film is adhered on the adhesive layer for the film, the adhesive layer for the film may be subjected to an additional photocuring process.
본 명세서에서 추가 광경화 공정은 점착제 조성물의 도포 및 경화에 의해 필름용 점접착층을 형성한 이후에 별도로 더 수행되는 광경화 공정을 의미한다. 추가 광경화 공정을 거친 필름용 점접착층은 완전 경화 또는 불완전 경화된 것일 수 있다. 불완전 경화는 광경화에 의해 탄성률의 최대값이 되기 전의 상태를 의미한다.In the present specification, the additional photocuring process means a photocuring process that is further performed separately after forming the adhesive layer for film by applying and curing the pressure-sensitive adhesive composition. The adhesive layer for the film, which has undergone an additional photocuring process, may be fully cured or incompletely cured. Incomplete hardening means the state before it reaches the maximum value of an elasticity modulus by photocuring.
<터치 센서 모듈의 제조 방법><Manufacturing Method of Touch Sensor Module>
또한, 본 발명은 상기 터치 센서 모듈의 제조 방법을 제공한다.In addition, the present invention provides a method of manufacturing the touch sensor module.
이하 본 발명의 일 구현예에 따른 터치 센서 모듈의 제조 방법을 상세히 설명한다.Hereinafter, a method of manufacturing a touch sensor module according to an embodiment of the present invention will be described in detail.
본 발명의 터치 센서 모듈의 제조 방법의 일 구현예에 따르면, 캐리어 기판 상에 캐리어 기판 점착용 분리층, 제1 보호층, 터치 센서층, 제2 보호층 및 필름용 점접착층을 순차로 배치한다.According to one embodiment of the manufacturing method of the touch sensor module of the present invention, the carrier substrate adhesive separation layer, the first protective layer, the touch sensor layer, the second protective layer and the film adhesive layer are sequentially disposed on the carrier substrate. .
캐리어 기판으로는 공정 중에 쉽게 휘거나 뒤틀리지 않고 고정될 수 있도록 적정 강도를 제공하며 열이나 화학 처리에 영향이 거의 없는 재료라면 특별한 제한이 없이 사용될 수 있다. 예를 들면 글라스, 석영, 실리콘 웨이퍼, 서스 등이 사용될 수 있으며, 바람직하게는 글라스가 사용될 수 있다.The carrier substrate may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little influence on heat or chemical treatment. For example, glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.
캐리어 기판 점착용 분리층은 전술한 점착제로 형성될 수 있다.The carrier layer adhesive separation layer may be formed of the above-mentioned pressure-sensitive adhesive.
상기 캐리어 기판 점착용 분리층의 형성 방법은 특별히 한정되지 않고, 슬릿 코팅법, 나이프 코팅법, 스핀 코팅법, 캐스팅법, 마이크로 그라비아 코팅법, 그라비아 코팅법, 바 코팅법, 롤 코팅법, 와이어 바 코팅법, 딥 코팅법, 스프레이 코팅법, 스크린 인쇄법, 그라비아 인쇄법, 플렉소 인쇄법, 오프셋 인쇄법, 잉크젯 코팅법, 디스펜서 인쇄법, 노즐 코팅법, 모세관 코팅법 등의 당 분야에 공지된 방법에 의할 수 있다.The formation method of the carrier substrate adhesion separation layer is not particularly limited, and the slit coating method, knife coating method, spin coating method, casting method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar Known in the art such as coating method, dip coating method, spray coating method, screen printing method, gravure printing method, flexographic printing method, offset printing method, inkjet coating method, dispenser printing method, nozzle coating method, capillary coating method It can be by method.
전술한 방법에 의해 캐리어 기판 점착용 분리층을 형성한 이후에, 추가적인 경화 공정을 더 거칠 수 있다.After the formation of the carrier substrate adhesion separation layer by the above-described method, an additional curing process may be further processed.
캐리어 기판 점착용 분리층의 경화 방법은 특별히 한정되지 않고 광경화 또는 열경화에 의하거나, 상기 2가지 방법을 모두 사용 가능하다. 광경화 및 열경화를 모두 수행시 그 순서는 특별히 한정되지 않는다.The hardening method of the separation layer for carrier substrate adhesion is not specifically limited, Photocuring or thermosetting, or both said methods can be used. The order in which both photocuring and thermosetting are performed is not specifically limited.
이후에, 상기 캐리어 기판 점착용 분리층 상에 제1 보호층을 형성한다.Thereafter, a first protective layer is formed on the carrier substrate adhesive separation layer.
제1 보호층은 전술한 소재로 형성될 수 있으며, 그 형성 방법도 당 분야에 일반적으로 사용되는 것으로서 본 발명의 목적에 벗어나지 않는 범위 내라면 그 방법에 특별한 제한 없이 사용될 수 있다.The first protective layer may be formed of the material described above, and a method of forming the same may be used without particular limitation so long as it is generally used in the art without departing from the object of the present invention.
이후에, 제1 보호층 상에 터치 센서층을 형성한다.Thereafter, a touch sensor layer is formed on the first protective layer.
터치 센서층은 터치 감지를 위한 감지 전극을 포함한다.The touch sensor layer includes sensing electrodes for touch sensing.
감지 전극은 전술한 금속산화물류, 금속류, 금속 나노와이어, 탄소계 물질류, 고분자 물질류 등의 소재로 형성될 수 있다.The sensing electrode may be formed of a material such as metal oxides, metals, metal nanowires, carbon-based materials, and polymer materials.
감지 전극의 형성 방법은 특별히 한정되지 않으며, 예를 들면, 물리적 증착법, 화학적 증착법, 플라즈마 증착법, 플라즈마 중합법, 열 증착법, 열 산화법, 양극 산화법, 클러스터 이온빔 증착법, 스크린 인쇄법, 그라비아 인쇄법, 플렉소 인쇄법, 오프셋 인쇄법, 잉크젯 코팅법, 디스펜서 인쇄법 등의 당 분야에 공지된 방법에 의할 수 있다.The formation method of the sensing electrode is not particularly limited, and for example, physical vapor deposition, chemical vapor deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodic oxidation, cluster ion beam deposition, screen printing, gravure printing, or pla It may be by a method known in the art, such as a flexographic printing method, an offset printing method, an inkjet coating method, a dispenser printing method.
이후, 상기 터치 센서층 상에 제2 보호층을 형성한다.Thereafter, a second protective layer is formed on the touch sensor layer.
제2 보호층은 제1 보호층과 동일한 소재로 형성될 수 있으나, 이에 제한되는 것은 아니다.The second protective layer may be formed of the same material as the first protective layer, but is not limited thereto.
이후, 상기 제2 보호층 상에 필름용 점접착층을 형성한다.Thereafter, an adhesive layer for film is formed on the second protective layer.
필름용 점접착층은 캐리어 기판 점착용 분리층과 동일한 방법으로 형성될 수 있으나, 이에 제한되는 것은 아니다.The adhesive layer for film may be formed in the same manner as the separation layer for adhesion of the carrier substrate, but is not limited thereto.
필름용 점접착층은 상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크다. 구체적으로, 밀착력이 1N/25mm 내지 20 N/25mm, 바람직하게는 5 N/25mm 내지 20 N/25mm, 보다 바람직하게는 10 내지 20 N/25mm일 수 있다.In the adhesive layer for film, the adhesive layer for the film has a larger adhesion than the separation layer for adhesion of the carrier substrate. Specifically, the adhesion may be 1 N / 25 mm to 20 N / 25 mm, preferably 5 N / 25 mm to 20 N / 25 mm, more preferably 10 to 20 N / 25 mm.
또한, 필름용 점접착층은 탄성률이 1×107 Pa 내지 9×109 Pa이고, 바람직하게는 1×107 Pa 내지 1×109 일 수 있다.In addition, the adhesive layer for films has an elastic modulus of 1 × 10 7 Pa to 9 × 10 9 Pa, preferably 1 × 10 7 Pa to 1 × 10 9 .
필름용 점접착층으로는 상기 범위를 만족하는 것이라면 당 분야에 공지된 점착제 조성물이 제한 없이 사용될 수 있고, 예를 들면 전술한 점착제 조성물을 사용할 수 있다.As the adhesive layer for a film, any one satisfying the above range may be used without limitation, and a pressure-sensitive adhesive composition known in the art may be used, for example, the pressure-sensitive adhesive composition described above.
본 발명은 상기 필름용 점접착층의 추가 열경화 단계 및 상기 필름용 점접착층 상에 기재 필름을 점착하는 단계를 더 포함할 수 있다.The present invention may further include the step of further heat curing the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film.
추가 열경화 단계의 순서는 특별히 한정되지 않으며, 기재 필름의 점착 전, 점착 중, 또는 점착 이후에 수행될 수 있다.The order of the additional heat curing step is not particularly limited, and may be performed before, during or after adhesion of the base film.
추가 열경화는 예를 들면 50 내지 100℃로 수행될 수 있다. 상기 온도 범위 내에서 열경화가 진행되는 경우 필름용 점접착층이 충분히 밀착될 수 있고, 필름의 컬발생 또는 변형을 방지할 수 있다.Further thermosetting can be carried out, for example, at 50 to 100 ° C. When the thermal curing is performed within the temperature range, the adhesive layer for the film may be sufficiently in contact with each other, and curling or deformation of the film may be prevented.
또한, 본 발명은 상기 필름용 점접착층의 추가 열경화 단계 및 상기 필름용 점접착층 상에 기재 필름을 점착하는 단계를 더 포함할 수 있다.In addition, the present invention may further include the step of further heat curing the adhesive layer for the film and the step of adhering the base film on the adhesive layer for the film.
추가 광경화 단계의 순서는 특별히 한정되지 않으며, 기재 필름의 점착 전, 점착 중, 또는 점착 이후에 수행될 수 있다.The order of the further photocuring step is not particularly limited, and may be performed before, during or after the adhesion of the base film.
추가 광경화 조건은 특별히 한정되지 않으며, 예를 들면 강도 10 내지 100mw/cm2의 자외선을 1 내지 15초간 조사함으로써 수행될 수 있다.Further photocuring conditions are not particularly limited, and may be performed, for example, by irradiating ultraviolet rays of 10 to 100 mw / cm 2 for 1 to 15 seconds.
상기 추가 광경화는 필름용 점접착층이 완전 경화 또는 불완전 경화되도록 수행될 수 있다.The further photocuring may be carried out such that the adhesive layer for the film is fully or incompletely cured.
이하, 본 발명을 구체적으로 설명하기 위해 실시예를 들어 상세하게 설명하기로 한다. Hereinafter, the present invention will be described in detail with reference to Examples.
실시예 1Example 1
두께 700㎛의 소다 라임 글래스(Soda lime Glass)를 캐리어 기판으로 사용하고, 상기 캐리어 기판 상에 멜라민 50중량부, 신나믹산 50중량부를 10%의 농도로 프로필렌글리콜 모노메틸에테르아세테이트(Propylene glycol monomethyl ether acetate, PGMEA)에 희석한 분리층 조성물을 두께 300nm로 스핀코팅법으로 도포하고 150℃에서 30분간 건조 처리하여 캐리어 기판상에 캐리어 기판 점착용 분리층을 형성하였다.Sodium lime glass having a thickness of 700 μm is used as a carrier substrate, and 50 parts by weight of melamine and 50 parts by weight of cinnamic acid are propylene glycol monomethyl ether acetate at a concentration of 10% on the carrier substrate. The separation layer composition diluted in acetate, PGMEA) was applied by spin coating to a thickness of 300 nm and dried at 150 ° C. for 30 minutes to form a separation layer for carrier substrate adhesion on the carrier substrate.
후에, 디에틸렌글리콜메틸에틸에테르(Diethylene Glycol Methyl Ethyl Ether, MEDG), 프로필렌글리콜모노메틸에테르아세테이트(Propylene glycol monomethyl ether acetate, PGMEA) 및 3-메톡시부탄올(3-MethoxyButanol)을 각각 30중량부, 40중량부, 30중량부로 혼합된 용매에 다관능 아크릴 단량체 40중량부, 에폭시 바인더 60중량부를 섞어 제1 보호층 조성물을 제조하였다. 이 때, 고형분이 조성물 총 중량 중 20중량부의 비율을 가지도록 하였다.Then, 30 parts by weight of diethylene glycol methyl ethyl ether (MEDG), propylene glycol monomethyl ether acetate (PGMEA) and 3-methoxybutanol (3-MethoxyButanol), respectively, A first protective layer composition was prepared by mixing 40 parts by weight of a polyfunctional acrylic monomer and 60 parts by weight of an epoxy binder in a solvent mixed with 40 parts by weight and 30 parts by weight. At this time, the solid content was to have a proportion of 20 parts by weight of the total weight of the composition.
제조된 제1 보호층 조성물을 두께 2㎛로 스핀코팅법으로 도포하고 UV를 200mJ/cm2로 조사하여 광경화를 실시하고 이후 230℃에서 30분간 건조경화하여 상기 캐리어 기판 점착용 분리층 상에 제1 보호층을 형성하였다.The prepared first protective layer composition was applied by spin coating to a thickness of 2 μm and irradiated with UV at 200 mJ / cm 2 to perform photocuring, followed by dry curing at 230 ° C. for 30 minutes on the carrier substrate adhesive separation layer. The first protective layer was formed.
후에, 상기 제1 보호층 상에 ITO를 135nm 두께로 증착하여 터치 센서층을 형성하였다.Subsequently, ITO was deposited to a thickness of 135 nm on the first protective layer to form a touch sensor layer.
후에, 상기 터치 센서층 상에 제1 보호층과 같은 조성으로 제조된 제2 보호층 조성물을 두께 2㎛로 스핀코팅법으로 도포하고 UV를 200mJ/cm2로 조사하여 광경화를 실시하고 이후 230℃에서 30분간 건조경화하여 제2 보호층을 형성하였다.Subsequently, the second protective layer composition prepared in the same composition as the first protective layer on the touch sensor layer by applying a spin coating method to a thickness of 2 ㎛ and irradiated with UV at 200mJ / cm 2 to perform a photocuring after 230 Dry curing was carried out at 30 ° C. for 30 minutes to form a second protective layer.
후에, 상기 제2 보호층 상에 중합성 단량체로 CEL2021P(3,4-에폭시시클로헥실메틸 3,4-에폭시시클로헥산카르복실레이트) 50중량부, 1,6-헥산디올디아크릴레이트 10중량부, 트리메틸올프로판트리아크릴레이트 5중량부, 가교제로 네오펜틸글리콜디글리시딜에테르 20중량부, 중합개시제 SP500 4.5 중량부, 레벨링제 KRM230 0.25 중량부, 밀착부여제 KRM0273 10중량부, 용매 4-하이드록시부틸비닐에테르 7중량부를 포함하는 점착제 조성물을 60㎛ TAC 필름과 터치 센서 사이에 스포이드로 도포하고 롤 라미네이션법으로 압착하여 점접착층의 두께가 2㎛가 되도록 하였다.Subsequently, 50 parts by weight of CEL2021P (3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate) as a polymerizable monomer on the second protective layer, 10 parts by weight of 1,6-hexanedioldiacrylate , 5 parts by weight of trimethylolpropane triacrylate, 20 parts by weight of neopentyl glycol diglycidyl ether as a crosslinking agent, 4.5 parts by weight of polymerization initiator SP500, 0.25 parts by weight of leveling agent KRM230, 10 parts by weight of adhesion agent KRM0273, solvent 4- A pressure-sensitive adhesive composition containing 7 parts by weight of hydroxybutyl vinyl ether was applied between the 60 μm TAC film and the touch sensor with a dropper and pressed by a roll lamination method so that the thickness of the adhesive layer was 2 μm.
이후에, 상기 필름용 점접착층을 50℃로 60초간 가열하여 추가 열경화한 후 25℃로 냉각시키고 10mW/cm2 세기의 자외선을 100초간 조사하여 추가 광경화하였다.Thereafter, the film adhesive layer was further heated to 50 ° C. for 60 seconds, further cooled to 25 ° C., and further photocured by irradiating 10 mW / cm 2 of ultraviolet light for 100 seconds.
실시예 2Example 2
추가 열경화 공정을 수행하지 않은 것을 제외하고는, 실시예 1과 동일한 방법으로 터치 센서 모듈을 제조하였다.The touch sensor module was manufactured in the same manner as in Example 1, except that the additional thermosetting process was not performed.
실시예 3Example 3
추가 광경화 시 자외선을 50초간 조사한 것을 제외하고는, 실시예 1과 동일한 방법으로 터치 센서 모듈을 제조하였다.A touch sensor module was manufactured in the same manner as in Example 1, except that 50 seconds of additional ultraviolet ray was irradiated.
실시예 4Example 4
추가 열경화 공정을 수행하지 않은 것을 제외하고는, 실시예 3과 동일한 방법으로 터치 센서 모듈을 제조하였다.The touch sensor module was manufactured in the same manner as in Example 3, except that the additional thermosetting process was not performed.
실시예 5 Example 5
추가 광경화시 10mW/cm2 세기의 자외선을 80초간 조사한 것을 제외하고는, 실시예 1과 동일한 방법으로 터치 센서 모듈을 제조하였다.A touch sensor module was manufactured in the same manner as in Example 1, except that ultraviolet ray of 10 mW / cm 2 intensity was irradiated for 80 seconds at the time of additional photocuring.
비교예 1Comparative Example 1
2-에틸헥실아크릴레이트 100중량부, 8-히드록시옥틸아크릴레이트 0.9중량부, 아크릴산 0.5중량부, 폴리에틸렌글리콜모노아크릴레이트 3중량부, N-비닐피롤리돈 5중량부 및 에틸아세테이트을 60중량부를 혼합하고, 중합 개시제로서 아조비스이소부티로니트릴 0.1중량부를 2시간에 걸쳐 적하 반응시켜 제조된 점착제 조성물을 사용하고, 추가 광경화 공정은 수행하지 않은 것을 제외하고는, 실시예 1과 동일한 방법으로 터치 센서 모듈을 제조하였다.100 parts by weight of 2-ethylhexyl acrylate, 0.9 parts by weight of 8-hydroxyoctyl acrylate, 0.5 part by weight of acrylic acid, 3 parts by weight of polyethylene glycol monoacrylate, 5 parts by weight of N-vinylpyrrolidone and 60 parts by weight of ethyl acetate In the same manner as in Example 1, except that the pressure-sensitive adhesive composition prepared by mixing and reacting dropwise 0.1 parts by weight of azobisisobutyronitrile over 2 hours was used as a polymerization initiator, and no further photocuring step was performed. The touch sensor module was manufactured.
비교예 2Comparative Example 2
추가 열경화 공정도 수행하지 않은 것을 제외하고는, 비교예 1과 동일한 방법으로 샘플을 제작하였다.Samples were prepared in the same manner as in Comparative Example 1 except that no additional thermosetting process was also performed.
비교예 3Comparative Example 3
실시예 1에 따라 제2 보호층까지 제조한 후, 제2 보호층 상에 점접착층이 없이, 폴리에틸렌 필름을 압력을 가하여 눌러 정전기적 밀착력을 이용하여 부착하여 터치 센서 모듈을 제조하였다.After preparing to the second protective layer according to Example 1, there was no adhesive layer on the second protective layer, a polyethylene film was pressed by applying pressure by using an electrostatic adhesive force to prepare a touch sensor module.
비교예 4Comparative Example 4
실시예 1에 따라 제2 보호층까지 제조한 후, 제2 보호층 상에 3M사의 8146-1 점착제 25㎛가 도포된 폴리에틸렌 필름을 압력을 가하여 부착하여 터치 센서 모듈을 제조하였다.After preparing to the second protective layer according to Example 1, a touch sensor module was prepared by applying a polyethylene film coated with 25 μm of 3146's 8146-1 pressure-sensitive adhesive on a second protective layer under pressure.
실험예 1: 밀착력 평가Experimental Example 1: Evaluation of Adhesion
Autograph 장비에서 25mm폭으로 샘플을 부착하고 4mm/min의 속도로 Test하여 결과를 확보하였다. 그 결과는 하기 표 1과 같다.In the Autograph equipment, the sample was attached at 25mm width and tested at 4mm / min to secure the result. The results are shown in Table 1 below.
실험예 2 : 탄성률 평가Experimental Example 2 Evaluation of Elastic Modulus
Anton Paar사의 MCR301 RHEOMETER를 이용하여 사용된 점착제의 탄성률을 평가하였으며, Strain 1%, Frequency 1Hz영역에서 평가를 실시하였다.그 결과는 하기 표 1과 같다.The elastic modulus of the adhesive used was evaluated using Anton Paar's MCR301 RHEOMETER, and the evaluation was performed in the strain 1% and the frequency 1 Hz region. The results are shown in Table 1 below.
실험예 3 : 크랙 발생 여부 평가Experimental Example 3 Evaluation of Crack Generation
실시예 및 비교예에서 얻어진 터치 센서 모듈에서 90° 박리기를 이용하여 필름용 점접착층 및 캐리어 기판 점착용 분리층을 박리하여 크랙 발생여부를 육안으로 관찰하였으며, 그 결과는 하기 표 1과 같다.In the touch sensor modules obtained in Examples and Comparative Examples, the film adhesive layer and the carrier substrate adhesive separation layer were peeled off using a 90 ° peeler, and cracks were visually observed. The results are shown in Table 1 below.
평가기준Evaluation standard
○: 80% 이상 크랙 발생○: cracks more than 80%
△: 50% 이상 80% 미만 크랙 발생△: more than 50% less than 80% cracks
△△: 20% 이상 50% 미만 크랙 발생△△: more than 20% less than 50% cracks
X: 20% 미만 크랙 발생X: less than 20% cracking
표 1
Figure PCTKR2015012672-appb-T000001
 Table 1
Figure PCTKR2015012672-appb-T000001
상기 표 1을 참고하면, 점착용 분리층의 밀착력보다 필름용 점접착층의 밀착력이 높을 경우 박리는 쉽게 이루어지나, 점접착층의 탄성률에 따라 크랙 발생 여부는 다르게 나타남을 확인할 수 있었다. Referring to Table 1, when the adhesion of the adhesive layer for the film is higher than the adhesion of the adhesive separation layer is easily peeled, it can be seen that the crack occurs differently depending on the elastic modulus of the adhesive layer.
또한, 비교예 1,2 및 4와 같이 필름용 점접착층의 탄성률이1×107 Pa 미만일 경우 모두 크랙이 발생하였다. In addition, as in Comparative Examples 1 and 2 and 4, cracks occurred in all cases when the elastic modulus of the adhesive layer for films was less than 1 × 10 7 Pa.
한편, 점접착층을 구비하지 않은 비교예 3의 경우, 박리가 불가하였고, 필름용 점접착층의 밀착력이 캐리어 기판 점착용 분리층보다 작으면서 점접착층의 탄성률이 9×109 를 초과하는 경우는 점접착층으로의 사용이 불가함을 확인할 수 있었다.On the other hand, in the case of Comparative Example 3 without the adhesive layer, peeling was impossible, and when the adhesive force of the adhesive layer for film was smaller than that of the carrier substrate adhesive separation layer, the elastic modulus of the adhesive layer exceeded 9 × 10 9 . It was confirmed that use as an adhesive layer was impossible.

Claims (13)

  1. 캐리어 기판 점착용 분리층;Separation layer for carrier substrate adhesion;
    상기 캐리어 기판 점착용 분리층 상에 배치된 제1 보호층;A first protective layer on the carrier substrate adhesive separation layer;
    상기 제1 보호층 상에 배치된 터치 센서층;A touch sensor layer disposed on the first protective layer;
    상기 터치센서층 상에 배치된 제2 보호층; 및A second protective layer disposed on the touch sensor layer; And
    상기 제2 보호층 상에 배치된 필름용 점접착층을 포함하며,It includes an adhesive layer for the film disposed on the second protective layer,
    상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크고, 탄성률이 1×107 내지 9×109 Pa인, 터치 센서 모듈.The adhesive layer for the film is a touch sensor module, the adhesive force is greater than the separation layer for adhesion to the carrier substrate, the elastic modulus is 1 × 10 7 to 9 × 10 9 Pa.
  2. 청구항 1에 있어서, 상기 필름용 점접착층의 밀착력은 1 내지 20 N/25mm인, 터치 센서 모듈.The touch sensor module according to claim 1, wherein the adhesive force of the adhesive layer for films is 1 to 20 N / 25 mm.
  3. 청구항 1에 있어서, 상기 필름용 점접착층의 탄성률이 1×107 내지 1×109 Pa인, 터치 센서 모듈.The touch sensor module according to claim 1, wherein an elastic modulus of the adhesive layer for films is 1 × 10 7 to 1 × 10 9 Pa.
  4. 청구항 1에 있어서, 상기 필름용 점접착층은 아크릴계 공중합체 및 중합성 단량체 중 적어도 하나인 반응성 화합물; 및 가교제;를 포함하는 점착제 조성물로 형성되는, 터치 센서 모듈.The method according to claim 1, wherein the adhesive layer for film is a reactive compound which is at least one of an acrylic copolymer and a polymerizable monomer; And a crosslinking agent; formed of an adhesive composition comprising a touch sensor module.
  5. 청구항 1에 있어서, 상기 필름용 점접착층 상에 점착된 기재 필름을 더 포함하며, 상기 필름용 점접착층은 추가 열경화 공정을 거친 것인, 터치 센서 모듈.The touch sensor module according to claim 1, further comprising a base film adhered on the adhesive layer for the film, wherein the adhesive layer for the film is subjected to an additional heat curing process.
  6. 청구항 5에 있어서, 상기 열경화는 50 내지 100℃로 수행되는, 터치 센서 모듈.The touch sensor module of claim 5, wherein the thermosetting is performed at 50 to 100 ° C. 7.
  7. 청구항 1에 있어서, 상기 필름용 점접착층 상에 점착된 기재 필름을 더 포함하며, 상기 필름용 점접착층은 추가 광경화 공정을 거친 것인, 터치 센서 모듈.The touch sensor module of claim 1, further comprising a base film adhered on the adhesive layer for the film, wherein the adhesive layer for the film undergoes an additional photocuring process.
  8. 캐리어 기판 상에 캐리어 기판 점착용 분리층, 제1 보호층, 터치 센서층, 제2 보호층 및 필름용 점접착층을 순차로 배치하며,On the carrier substrate, a carrier substrate adhesive separation layer, a first protective layer, a touch sensor layer, a second protective layer, and an adhesive layer for a film are sequentially disposed,
    상기 필름용 점접착층은 밀착력이 상기 캐리어 기판 점착용 분리층보다 크고, 탄성률이 1×107 내지 9×109 Pa인, 터치 센서 모듈의 제조 방법.The adhesive layer for the film has a larger adhesion than the separation layer for adhesion of the carrier substrate, the elastic modulus is 1 × 10 7 to 9 × 10 9 Pa, the manufacturing method of the touch sensor module.
  9. 청구항 8에 있어서, 상기 필름용 점접착층의 밀착력은 1N/25mm 내지 20 N/25mm인, 터치 센서 모듈의 제조 방법.The method according to claim 8, wherein the adhesion of the adhesive layer for the film is 1N / 25mm to 20 N / 25mm, the manufacturing method of the touch sensor module.
  10. 청구항 8에 있어서, 상기 필름용 점접착층의 탄성률이 1×107 Pa 내지 1×109Pa인, 터치 센서 모듈의 제조 방법.The method of manufacturing a touch sensor module according to claim 8, wherein the elastic modulus of the adhesive layer for films is 1 × 10 7 Pa to 1 × 10 9 Pa.
  11. 청구항 8에 있어서, 상기 필름용 점접착층의 추가 열경화 단계 및 상기 필름용 점접착층 상에 기재 필름을 점착하는 단계를 더 포함하는, 터치 센서 모듈의 제조 방법.The method of manufacturing a touch sensor module according to claim 8, further comprising the step of further heat curing the adhesive layer for the film and adhering the base film onto the adhesive layer for the film.
  12. 청구항 11에 있어서, 상기 추가 열경화는 50 내지 100℃로 수행되는, 터치 센서 모듈의 제조 방법.The method of claim 11, wherein the additional thermal curing is performed at 50 to 100 ° C. 13.
  13. 청구항 8에 있어서, 상기 필름용 점접착층의 추가 광경화 단계 및 상기 필름용 점접착층 상에 기재 필름을 점착하는 단계를 더 포함하는, 터치 센서 모듈의 제조 방법.The method of manufacturing a touch sensor module according to claim 8, further comprising the step of further photocuring the adhesive layer for the film and adhering the base film onto the adhesive layer for the film.
PCT/KR2015/012672 2014-12-17 2015-11-24 Touch sensor module and production method therefor WO2016099044A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140182405A KR102184024B1 (en) 2014-12-17 2014-12-17 Touch sensor module and manufaturing method the same
KR10-2014-0182405 2014-12-17

Publications (1)

Publication Number Publication Date
WO2016099044A1 true WO2016099044A1 (en) 2016-06-23

Family

ID=56126868

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/012672 WO2016099044A1 (en) 2014-12-17 2015-11-24 Touch sensor module and production method therefor

Country Status (3)

Country Link
KR (1) KR102184024B1 (en)
TW (1) TW201624229A (en)
WO (1) WO2016099044A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101969343B1 (en) * 2016-08-19 2019-04-16 동우 화인켐 주식회사 Film touch sensor and structure including the same
CN108062176B (en) 2016-11-09 2021-07-09 东友精细化工有限公司 Touch sensor laminate and method for manufacturing same
KR20180052067A (en) * 2016-11-09 2018-05-17 동우 화인켐 주식회사 Touch sensor laminate and method of manufacturing the same
KR102121387B1 (en) * 2017-01-26 2020-06-10 동우 화인켐 주식회사 Sensitive luminescence composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138030A1 (en) * 2011-04-05 2012-10-11 제일모직 주식회사 Adhesive film for an organic el device, composite included in the adhesive film for an organic el device, and organic el display device including the adhesive film for an organic el device
KR20130010868A (en) * 2011-07-19 2013-01-29 주식회사 엘지화학 Touch panel
KR20140023624A (en) * 2012-08-16 2014-02-27 (주)엘지하우시스 Adhesive composition for touch panel, adhesive film and touch panel
US20140065416A1 (en) * 2012-08-30 2014-03-06 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet, laminate and method for peeling plates
KR20140114257A (en) * 2013-03-18 2014-09-26 (주)삼원에스티 Layered film for touch panel sensor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5529720B2 (en) * 2010-12-15 2014-06-25 日東電工株式会社 Transparent conductive film with pressure-sensitive adhesive layer, method for producing the same, and touch panel
KR20120111607A (en) 2011-04-01 2012-10-10 광주과학기술원 Graphene touch sensor using piezoelectric effect

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138030A1 (en) * 2011-04-05 2012-10-11 제일모직 주식회사 Adhesive film for an organic el device, composite included in the adhesive film for an organic el device, and organic el display device including the adhesive film for an organic el device
KR20130010868A (en) * 2011-07-19 2013-01-29 주식회사 엘지화학 Touch panel
KR20140023624A (en) * 2012-08-16 2014-02-27 (주)엘지하우시스 Adhesive composition for touch panel, adhesive film and touch panel
US20140065416A1 (en) * 2012-08-30 2014-03-06 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet, laminate and method for peeling plates
KR20140114257A (en) * 2013-03-18 2014-09-26 (주)삼원에스티 Layered film for touch panel sensor

Also Published As

Publication number Publication date
KR102184024B1 (en) 2020-11-27
TW201624229A (en) 2016-07-01
KR20160073735A (en) 2016-06-27

Similar Documents

Publication Publication Date Title
WO2016099044A1 (en) Touch sensor module and production method therefor
WO2011037440A2 (en) Touch panel
WO2011126263A2 (en) Adhesive composition, adhesive sheet, and touch panel
WO2018159923A1 (en) Window film, window film laminate comprising same and image display device
WO2018208049A1 (en) Optical laminate and flexible display comprising same
WO2018159918A1 (en) Window substrate and image display device comprising same
WO2013012273A2 (en) Touch panel
WO2009145564A2 (en) Protective film
WO2012111963A2 (en) Substrate film and method for manufacturing same
WO2012053831A2 (en) Adhesive composition for touch panel
WO2013012274A2 (en) Touch panel
WO2017052177A1 (en) Film touch sensor and method for manufacturing same
WO2017217627A1 (en) Heating element and manufacturing method therefor
WO2016153192A1 (en) Method and apparatus for fabricating film touch sensor
WO2014204250A1 (en) Adhesive composition
WO2018135865A1 (en) Oled panel lower part protection film, and organic light-emitting display apparatus comprising same
WO2016093557A1 (en) Film touch sensor and manufacturing method therefor
WO2018101540A1 (en) Method for manufacturing flexible transparent electrode having pattern
WO2012138030A1 (en) Adhesive film for an organic el device, composite included in the adhesive film for an organic el device, and organic el display device including the adhesive film for an organic el device
WO2016159645A1 (en) Polarizing plate and optical display device including same
WO2012002706A2 (en) Protective film
WO2016153184A1 (en) Film touch sensor and method for manufacturing same
WO2015023161A1 (en) Conductive film and production method therefor
WO2016129853A1 (en) Film touch sensor
WO2017171200A1 (en) Flexible color filter

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15870212

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15870212

Country of ref document: EP

Kind code of ref document: A1