WO2017164527A3 - 반도체 발광소자 제조방법 - Google Patents

반도체 발광소자 제조방법 Download PDF

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Publication number
WO2017164527A3
WO2017164527A3 PCT/KR2017/002004 KR2017002004W WO2017164527A3 WO 2017164527 A3 WO2017164527 A3 WO 2017164527A3 KR 2017002004 W KR2017002004 W KR 2017002004W WO 2017164527 A3 WO2017164527 A3 WO 2017164527A3
Authority
WO
WIPO (PCT)
Prior art keywords
emitting device
semiconductor light
device manufacturing
substrate
moving
Prior art date
Application number
PCT/KR2017/002004
Other languages
English (en)
French (fr)
Other versions
WO2017164527A2 (ko
Inventor
백준승
황광석
이용준
Original Assignee
우리이앤엘 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160033423A external-priority patent/KR101768503B1/ko
Priority claimed from KR1020160033420A external-priority patent/KR101768502B1/ko
Priority claimed from KR1020160033429A external-priority patent/KR101768505B1/ko
Priority claimed from KR1020160033427A external-priority patent/KR101768504B1/ko
Application filed by 우리이앤엘 주식회사 filed Critical 우리이앤엘 주식회사
Publication of WO2017164527A2 publication Critical patent/WO2017164527A2/ko
Publication of WO2017164527A3 publication Critical patent/WO2017164527A3/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

본 개시는 반도체 발광소자 제조방법에 있어서, 적어도 하나 이상의 반도체 발광소자 칩이 구비된 기판을 준비하는 단계; 배출관을 통해 봉지재를 기판 위에 배출하는 단계;그리고, 배출관과 동일한 방향을 향하고, 일정한 높이로 움직이는 제1 블레이드가 봉지재 위를 지나가는 단계;를 포함하는 것을 특징으로 하는 반도체 발광소자 제조방법에 관한 것이다.
PCT/KR2017/002004 2016-03-21 2017-02-23 반도체 발광소자 제조방법 WO2017164527A2 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR10-2016-0033427 2016-03-21
KR1020160033423A KR101768503B1 (ko) 2016-03-21 2016-03-21 반도체 발광소자 제조방법
KR1020160033420A KR101768502B1 (ko) 2016-03-21 2016-03-21 반도체 발광소자 제조장치
KR1020160033429A KR101768505B1 (ko) 2016-03-21 2016-03-21 반도체 발광소자 제조방법
KR10-2016-0033423 2016-03-21
KR10-2016-0033420 2016-03-21
KR10-2016-0033429 2016-03-21
KR1020160033427A KR101768504B1 (ko) 2016-03-21 2016-03-21 반도체 발광소자 제조방법

Publications (2)

Publication Number Publication Date
WO2017164527A2 WO2017164527A2 (ko) 2017-09-28
WO2017164527A3 true WO2017164527A3 (ko) 2018-08-02

Family

ID=59900608

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/002004 WO2017164527A2 (ko) 2016-03-21 2017-02-23 반도체 발광소자 제조방법

Country Status (1)

Country Link
WO (1) WO2017164527A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000235986A (ja) * 1999-02-15 2000-08-29 Toshiba Microelectronics Corp 樹脂封止装置及び半導体装置の製造方法
JP2011003853A (ja) * 2009-06-22 2011-01-06 Stanley Electric Co Ltd 発光装置の製造方法、発光装置および発光装置搭載用基板
JP2011056666A (ja) * 2009-09-04 2011-03-24 Optnics Precision Co Ltd スキージ及びスキージ組立て体
KR20110102256A (ko) * 2007-07-03 2011-09-16 도오꾜오까고오교 가부시끼가이샤 세정 장치, 세정 방법, 예비 토출 장치 및 도포 장치
JP2015099911A (ja) * 2013-10-18 2015-05-28 株式会社エルム 蛍光体分離構造を備えた蛍光体含有フィルムおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000235986A (ja) * 1999-02-15 2000-08-29 Toshiba Microelectronics Corp 樹脂封止装置及び半導体装置の製造方法
KR20110102256A (ko) * 2007-07-03 2011-09-16 도오꾜오까고오교 가부시끼가이샤 세정 장치, 세정 방법, 예비 토출 장치 및 도포 장치
JP2011003853A (ja) * 2009-06-22 2011-01-06 Stanley Electric Co Ltd 発光装置の製造方法、発光装置および発光装置搭載用基板
JP2011056666A (ja) * 2009-09-04 2011-03-24 Optnics Precision Co Ltd スキージ及びスキージ組立て体
JP2015099911A (ja) * 2013-10-18 2015-05-28 株式会社エルム 蛍光体分離構造を備えた蛍光体含有フィルムおよびその製造方法

Also Published As

Publication number Publication date
WO2017164527A2 (ko) 2017-09-28

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