WO2017146465A1

WO2017146465A1 - Method for producing front-end of cauterizing catheter by electroplating

Info

Publication number: WO2017146465A1
Application number: PCT/KR2017/001953
Authority: WO
Inventors: 황창모; 정기석; 진소연; 최재순; 김영학; 남기병
Original assignee: 재단법인 아산사회복지재단
Priority date: 2016-02-22
Filing date: 2017-02-22
Publication date: 2017-08-31
Also published as: KR102099420B1; KR101916332B1; KR20180121468A; KR20170098723A

Abstract

Disclosed is a method for producing a catheter electrode, the method, which is a method for producing a catheter electrode by means of electroplating, comprising the steps of: attaching a wire part to an electroplating member, at least a part of which is conductive; forming a plating layer, the plating layer being formed by electroplating with a conductive element contained in the electroplating member, and the wire part being attached to the plating layer in the electroplating process; and separating the electroplating member from the wire part attached to the plating layer.

Description

Manufacturing method of the tip of the small-acting catheter

Various embodiments of the present invention relate to a method of manufacturing a catheter tip for use in a medical device, and more particularly, to a technique for manufacturing a catheter electrode of the catheter tip by an electroplating method.

Generally, a catheter refers to a tubular medical device used in the surgical field and is also called a catheter. The catheter is usually made of materials such as synthetic resin, plastic rubber, latex, silicone, metal, and the like, specifically, polyurethane, polyethylene, polyimide, polypropylene, polyethylene oxide, polyvinyl chloride (PVC), silicone rubber, latex, etc. And a metal alloy such as stainless steel, gold, silver, platinum, and copper. It may be inserted into the intestines of the body cavity, blood vessels, organs, esophagus, stomach, intestine, gallbladder, kidney, ureter, and bladder, and the contents may be discharged or drugs may be injected.

In addition, the distal end of the catheter may include a catheter electrode that performs an electrical or radio frequency (RF) cauterization function, and the user (eg, a doctor) may use a tube and a wire connected to the catheter electrode to make a desired body. By moving the catheter tip to the site, the body part to be treated can be cauterized (eg retained). Thereby, the user can remove tissue, cautery, hemostasis, etc. using a catheter for a specific body part to be treated.

The catheter electrode and tube for the catheter tip are plated or molded from metal. In general, a process of first machining a catheter electrode and then attaching a wire (for example, a wire for cauterization power and a steel wire for manipulation) to the catheter electrode is performed separately. In addition, the tip of the catheter may be manufactured by coupling a tube to the catheter electrode and the wire.

Since the catheter is a medical device used inside blood vessels, it is often manufactured to be small in order to perform a function within a limited space. Accordingly, a stainless steel wire and an electric wire having an orientation control function at an electrode tip of a catheter tip for flowing electricity Catheter should be assembled with bonded copper wires.

In order to control the direction of the catheter tip, two stainless steel wires are welded to the metal ring or electrode tip for the catheter tip electrode, and each stainless steel wire is pulled to adjust the direction of the catheter tip.

Conventional welding method is mainly used for micro laser welding, the precision of the weld and the strength of the joint should be high. If the strength of the joint is not enough, the catheter assembly or the patient during the procedure has a problem that a lot of time and cost additionally occurs because the site where the stainless steel wire is bonded. In particular, the stainless steel wire that is bonded to the electrode tip of the catheter tip to control the direction sometimes occurs when the joint is separated during the procedure, which has been a problem that greatly affects the quality of the catheter.

In order to solve this problem, it is important to make the joint of the stainless steel wire bonded to the catheter tip electrode tip have high stability.

In addition, since the bonding or bonding process of the catheter electrode and the wire must be additionally performed, there is a problem that the mass production may be difficult due to a large amount of time and cost in the production process of the catheter tip.

Various embodiments of the present invention have been proposed to solve the above problems, and in order to minimize the possibility that the stainless steel wires bonded to the electrode tip and the ring electrode used in the catheter tip are broken, it is possible to conduct the conduction of one stainless steel wire. The present invention relates to a method of simultaneously performing a joining process of a catheter tip electrode and a wire by fixing to a high elastic base and electroplating.

According to various embodiments of the present disclosure, a method for manufacturing an electrode for catheter using electroplating may include: coupling a wire part to an electrode plating member having at least a portion of the conductive property; Forming a plating layer according to the included conductive powder, wherein the wire portion is coupled with the plating layer in the electroplating process, forming a plating layer and separating the electrode plating member from the wire portion coupled to the plating layer It includes a step.

According to various embodiments of the present disclosure, a method for manufacturing an electrode for a catheter may reduce unnecessary processes by deforming a plating layer and a wire by using electroplating.

In addition, the electrode manufacturing method for a catheter according to various embodiments of the present invention can maximize the efficiency of the electrode manufacturing process for the catheter by improving the adhesion and strength between the wire and the plating layer by electroplating.

In addition, a method for manufacturing an electrode for a catheter according to various embodiments of the present invention is an electrode plating member containing a metal component (for example, rubber, urethane, polyethylene, polypropylene, polystyrene, polyacrylonitrile, styrene-acrylonitrile air Copolymer, Acrylonitrile-butadiene-styrene (ABS resin), Polymethyl methacrylate, Polyvinyl chloride, Polyvinylidene chloride, Polytetrafluoroethylene, Polychlorotrifluoroethylene, Polyamide, Polyphthalamide, Polycarbonate , Phenylene-based resins, polyesters, polyphenylene sulfides, polyacetals, polyethylene terephthalates, polybutylene terephthalates, polysulfones, polyetherimides, polymer blends, phenolic resins, epoxy, urea resins, melamine resins, silicon resins , Polyurethane, Ball Saturated Polyester Resin, Silicone Rubber, Styrene-Butadiene Rubber, Part Diene rubber, acrylonitrile-butadiene rubber, nitrile-rubber epiglorohydrin rubber, chloroprene rubber, isobutene-isoprene rubber, ethylene-propylene-diene rubber, polyacrylate rubber, fluorosilicone rubber, vinyl-methyl Silicon electrode, chlorosulfonate polyethylene rubber, fluorocarbon rubber, ethylene-acrylic rubber, epichlorohydrin rubber, latex, aluminum, graphite or a mixture thereof) to form a plating layer on the basis of the electrode for catheter of uniform thickness It can be produced.

In addition, the electrode manufacturing method for a catheter according to various embodiments of the present invention by using the electrode plating member having the elasticity and elasticity during electroplating to easily separate the electrode plating member from the wire portion coupled with the plating layer The effect is that you can make.

In addition, the electrode manufacturing method for a catheter according to various embodiments of the present invention using the electrode plating member of various thermoplastic or thermosetting resin during electroplating using the heat or solvent using the electrode plating member from the plated layer and the combined wire There is an effect that it can be easily removed.

In addition, a method for manufacturing an electrode for a catheter according to various embodiments of the present invention is a metal which can be easily removed by a method that does not affect the electrode and the metal wire electroplated in a solution such as an acid or a base in the post-treatment process. There is an effect that can be used.

In addition, the method for manufacturing a catheter electrode according to various embodiments of the present invention by using a plating member containing a metal component only in a predetermined region (for example, the first region), the region does not contain a metal component in the plating member The plating member can be easily separated from the catheter electrode by holding (eg, the second region).

In addition, according to various embodiments of the present invention, a method for manufacturing an electrode for a catheter is formed by forming an insulating portion having various shapes on the surface of an electrode plating member having an electrically conductive surface to form a portion that is not locally plated. A hole penetrating the inside and outside of the electrode can be formed.

Furthermore, since the wire part of the present invention may be connected in a U-shape inside the plating layer, the wire part may be prevented from being broken inside the plating layer by an impact.

According to the disclosed embodiment, in order to minimize the possibility of breaking the electrode tip used in the catheter tip and the stainless steel wire bonded to the ring electrode, the catheter tip electrode is fixed by electroplating after fixing one stainless steel wire to a highly conductive elastic base. A method of simultaneously performing the joining process of the wires may be used.

Such a method has an advantage that the possibility of disconnection of the steel wire when the direction adjustment is minimized because there is no portion of the stainless steel wire connected to the direction control electrode tip and the ring electrode of the catheter tip. In addition, the plating layer can be used as the catheter tip electrode, it is possible to manufacture without expensive micro laser welding equipment and there is an advantage that the process is simple.

In addition, perfusion is formed by forming a small hole in the catheter tip electrode to form an insulating layer for forming a small hole for supplying physiological saline during arrhythmia mediation procedure so that the plating layer is not formed locally. Micropores may be formed.

1 is a flowchart illustrating a method of manufacturing a catheter electrode according to various embodiments of the present disclosure.

2 is a flowchart illustrating a specific operation of the wire unit coupling step of the present invention.

3A is a front view illustrating a coupling between a plating member and a wire unit according to various embodiments of the present disclosure.

3B is a side view illustrating a coupling between a plating member and a wire unit according to various embodiments of the present disclosure.

Figure 3c is a side view showing the coupling of the plating member and the wire portion according to another embodiment of the present invention.

4 is an exemplary view of forming a plating layer using an electroplating method according to various embodiments of the present disclosure.

5 is an exemplary view illustrating a plating layer according to various embodiments of the present disclosure.

6 is an exemplary view illustrating an operation of detaching an electrode plating member according to various embodiments of the present disclosure.

FIG. 7 relates to a method of forming a hole by forming an insulating layer in a plating member to form micro holes in a catheter electrode according to various embodiments of the present disclosure.

8A and 8B are exemplary views illustrating a catheter electrode in which an electrode plating member is separated.

9 is an exemplary view illustrating an operation of plating a catheter tube according to various embodiments of the present disclosure.

In addition, the coupling of the wire part to the electrode plating member may include coupling the first wire to the surface of the electrode plating member, so that the first wire surrounds at least a portion of the electrode plating member. Coupling the first wire may be included.

The first wire may be a clad wire, and the first wire may be used to perform an operation of the catheter electrode and to supply power to the catheter electrode.

In addition, the coupling of the first wire may include coupling the first wire to the electrode plating member in a U shape.

In addition, the coupling of the wire part to the electrode plating member may further include attaching a second wire to a surface of the electrode plating member.

The first wire may operate the catheter electrode, and the second wire may supply power to the catheter electrode.

In addition, the coupling of the wire part to the electrode plating member may further include attaching a third wire to the surface of the electrode plating member.

In addition, the third wire may be characterized in that for measuring the temperature of the catheter electrode.

In addition, the forming of the plating layer may include forming the plating layer only in the first region of the electrode plating member.

The separating of the electrode plating member from the wire part may include: holding a second region except the first region of the electrode plating member and applying a tension in an extension direction with the second region. Separating the plating member from the wire portion.

In addition, the insulating member may be provided on a part of the surface of the electrode plating member, and the forming of the plating layer may include forming a plating layer having a through hole formed in the portion where the insulating member is provided.

The separating of the electrode plating member from the wire part may include removing the electrode plating member by shrinking it, removing it using a solvent, dissolving it with an acid or a base, or removing it by high thermal incineration. The method may include removing the electrode plating member in a manner that does not affect the plating layer.

In addition, the electrode plating member is rubber, urethane, polyethylene, polypropylene, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene (ABS resin), polymethyl methacrylate , Polyvinyl chloride, polyvinylidene chloride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyamide, polyphthalamide, polycarbonate, phenylene-based resins, polyesters, polyphenylene sulfides, polyacetals, polyethylene terephthalates , Polybutylene terephthalate, polysulfone, polyetherimide, polymer admixture, phenol resin, epoxy, urea resin, melamine resin, silicon resin, polyurethane, ball saturated polyester resin, silicone rubber, styrene-butadiene rubber, butadiene rubber Acrylonitrile-Butadiene Rubber, Nitrile-Rubber, Epiglohydro Rubber, chloroprene rubber, isobutene-isoprene rubber, ethylene-propylene-diene rubber, polyacrylate rubber, fluorosilicone rubber, vinyl-methyl silicone rubber, chlorosulfonate polyethylene rubber, fluorocarbon rubber, ethylene-acryl rubber, Epichlorohydrin rubber, latex, aluminum, graphite or mixtures thereof.

In addition, the method may further include depositing or coating an electrical conductor on the surface of the electrode plating member.

In addition, the forming of the plating layer may be characterized in that for supplying a current for the electroplating using the wire portion.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, terms that are defined in a commonly used dictionary are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, a method of manufacturing the catheter electrode 100 will be described with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a catheter electrode 100 according to various embodiments of the present disclosure, and FIG. 2 is a flowchart illustrating a specific operation of the wire unit 20 coupling step of the present invention. 2 may be one embodiment that may be performed in step S110 of FIG. 1. In addition, it will be described with reference to the exemplary view of Figures 3a to 9 for convenience of description.

First, in operation S110, an electrode plating member and a wire part coupling operation may be performed.

The electrode plating member 10 may be formed of a material having elasticity and elasticity, such as rubber. According to various embodiments, the electrode plating member 10 may contain a metal component (for example, metal or metal powder), and may be formed in a cylindrical shape as shown in FIGS. 3 to 7, but is not limited thereto. As a non-limiting example, the metal component may be formed in the form contained in the electrode plating member 10 or included in the electrode plating member 10 in a manner that is deposited on the surface of the electrode plating member 10.

In addition, the electrode plating member 10 may be formed of a thermoplastic resin, a thermosetting resin, or a rubber material that can be removed with a solvent or heat, and may be a metal material that can be removed after plating without affecting the plating process. The electrode plating member may be rubber, urethane, polyethylene, polypropylene, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene (ABS resin), polymethyl methacrylate, poly Vinyl chloride, polyvinylidene chloride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyamide, polyphthalamide, polycarbonate, phenylene-based resins, polyesters, polyphenylene sulfides, polyacetals, polyethylene terephthalates, poly Butylene terephthalate, Polysulfone, Polyetherimide, Polymer admixture, Phenolic resin, Epoxy, Urea resin, Melamine resin, Silicon resin, Polyurethane, Ball saturated polyester resin, Silicone rubber, Styrene-butadiene rubber, Butadiene rubber, Acrylic Nitrile-Butadiene Rubber, Nitrile-Rubber Epiglorohydrin Rubber , Chloroprene rubber, isobutene-isoprene rubber, ethylene-propylene-diene rubber, polyacrylate rubber, fluorosilicone rubber, vinyl-methyl silicone rubber, chlorosulfonate polyethylene rubber, fluorocarbon rubber, ethylene-acrylic rubber, epi Chlorohydrin rubber, latex, aluminum, graphite, or a mixture thereof may be used to form a plating layer after deposition of a conductive material or to produce a catheter electrode having a uniform thickness by only deposition. According to some embodiments, the electrode plating member 10 may be divided into a first region (a) containing a metal component and a second region (b) containing no metal component, as shown in FIG. A space opened in the extending direction with the two regions b may be formed therein. To this end, the surface of the electrode plating member 10 is formed so that a material having electrical conductivity is contained in a predetermined region (eg, the first region) of the electrode plating member 10, or the predetermined region (eg, the first region). Only one region) may be applied with a metal component. In order to have the same function, a part of the surface of the electrode plating member may be configured to be formed on the surface by a method of coating, adhering, or machining an insulating material in a state in which most of the surface of the electrode plating member is composed of an electrically conductive member.

As such, the electrode plating member 10 may be formed to be limited to a specific region through various methods such as deposition or coating, printing, processing, and adhesion so that the electrically conductive component is exposed to the surface, and the insulating component may be formed on the surface. It may be formed by a method such as vapor deposition, printing, processing, adhesion.

The wire unit 20 may include at least one wire for supplying power to the tip portion (eg, electrode tip or electrode) of the catheter or manipulating the movement of the catheter. Such wire may be made of stainless steel wire or copper wire, silver wire, gold wire, etc., but is not limited to a specific form or article.

In one embodiment, the wire part 20 may include at least one wire for supplying power to the distal end of the catheter and performing all functions for manipulating the movement of the catheter. For example, the wire part 20 is at least one clad wire made by joining a highly conductive metal such as copper, gold or silver used to supply power, and a metal of high strength such as stainless steel for manipulation of movement. (Clad wire) may be included.

The wire part 20 as described above may be primarily coupled to the electrode plating member 10. For example, the wire part 20 may be bonded to the electrode plating member 10 or bonded in a physically caught structure. Specifically, referring to FIG. 2, the first wire bonding step S210 and the second wire bonding step S250 may be performed.

According to some embodiments, the wire part 20 may include a first wire 21 and a second wire 25, and may also include a third wire 26 having additional functions. By way of example, and not limitation, the first wire 21 may perform manipulation (eg, change of direction or movement) of the electrode for small acting catheter, and may be made of a metal wire such as, for example, a stainless steel wire. In addition, the second wire 25 may perform power supply or transfer of an electrical signal of an electrode for a short acting catheter, and may be formed of, for example, a metal wire such as an insulated coated copper wire, a silver wire, a gold wire, or the like. In addition, the third wire 26 may be used for temperature sensing, and may be made of, for example, a temperature sensing wire such as chromel-alumel, platinum-rhodium, chromel-constantan, iron-constantan, or the like.

Although not shown, the first wire 21, the second wire 25, and the third wire 26 may be connected to another configuration of the catheter (eg, a catheter tube or a control handle) or an external power source or temperature sensor. have.

3A to 3C will be described as an example of steps S210 and S250 in which the first wire 21, the second wire 25, and the third wire 26 are coupled to the electrode plating member 10. Do it. Figure 3a is a front view showing the coupling of the electrode plating member 10 and the wire portion 20 according to various embodiments of the present invention, Figure 3b is an electrode plating member 10 and according to various embodiments of the present invention and It is a side view which shows the coupling | bonding of the wire part 20. FIG. 3C is a side view illustrating coupling of the wire part 20 including the third wire 26 and the electrode plating member 10 according to another exemplary embodiment of the present invention.

3A to 3C, the first wire 21 may be coupled to the electrode plating member 10 to surround at least a portion of the electrode plating member 10. For example, the first wire 21 may be formed in a U shape and may be coupled to the electrode plating member 10 to be caught on the top or side surface of the cylindrical electrode plating member 10. In this case, the two first wires 21 protrude to the lower side of the electrode plating member 10, but the first wire 21 is connected to the upper side of the electrode plating member 10. Can be formed. In addition, a predetermined bonding process between the first wire 21 and the electrode plating member 10 may be additionally performed, but is not limited thereto.

Physical force may be frequently applied to the first wire 21 for manipulation (eg, direction control or movement control) of the catheter electrode 100. Therefore, rather than being formed of a plurality of wires corresponding to each direction control, by using the wire operation by using the projections at both ends of the single first wire 21 formed in the U-shape as described above for direction control You can easily prevent the connection.

Also, referring to FIGS. 3A to 3C, the second wire 25 may be coupled to the electrode plating member 10 so that the second wire 25 is adhered to the surface of the electrode plating member 10. For example, the second wire 25 may be adhered to one side of the electrode plating member 10. To this end, an adhesive material may be applied between the second wire 25 and the electrode plating member 10, but is not limited thereto. The second wire 25 and the electrode plating member 10 may be bonded in various ways. Or combinations are possible.

The primary coupling between the electrode plating member 10 and the wire part 20 is an electrode plating member 10 from an electrode plating member combination which is a primary combination between the electrode plating member 10 and the wire part 20. ) May be more weakly coupled than the secondary coupling (for example, the coupling between the wire part 20 and the plating layer 30) to be separated later. To this end, the bonding force between at least one of the first wire 21 and the second wire 25 and the electrode plating member 10 may be adjusted by appropriately varying the type or amount of the adhesive material.

Referring back to FIG. 1, in operation S130, the plating layer 30 forming operation may be performed.

The plating layer 30 may be formed of a metal such as platinum on the surface of a thin metal electrode (eg, the catheter electrode 100). According to various embodiments, the plating layer 30 may be formed using an electro plating method such as electroforming. In addition to the metal, the plating layer 30 may be formed of various raw materials such as carbon, alloy, oxide, or semiconductor.

The forming of the plating layer 30 as described above will be described in detail with reference to FIGS. 4 and 5. 4 is an exemplary view of forming a plating layer 30 by using an electroplating method according to various embodiments of the present disclosure, and FIG. 5 is an exemplary view illustrating a plating layer 30 formed according to various embodiments of the present disclosure.

First, referring to FIG. 4, an electrolyte solution in which a plating member 40 is positioned may be formed of an electrode bonding member assembly (electrode plating member 10, first wire 21, and second wire 25) that is primarily bonded. Add to (45). The plating member 40 is a metal (eg, platinum, nickel, gold, silver) used to generate the plating layer 30 on the surface of the electrode plating member 10 according to the metal component included in the electrode plating member 10. The electrolyte may include ions (eg, platinum ions, nickel ions, gold ions, silver ions) of the plating member 40, but is not limited thereto. Then, when the combination of the electrode plating member to be plated is set as the negative electrode and the plating member 40 is set as the positive electrode and current flows, the plating member 40 is oxidized at the positive electrode and ions of the plating member 40 at the negative electrode. The plating layer 30 is formed as shown in FIG. 5. The plating layer 30 may be uniformly formed in the surface exposed electrically conductive region of the member combination for electrode plating.

For example, assuming that the plating member 40 is a silver (Ag) plate and the electrolyte is K [Ag (CN ₂ ⁻ ), silver (Ag) is oxidized at the anode to generate silver ions, and silver at the cathode. Ions may be reduced to generate a silver plating layer on the member combination for electrode plating.

In addition, the application of the current may be performed through at least one of the first wire 21 and the second wire 25, but is not limited thereto and may be supplied with a current through a separate electric conductor.

According to various embodiments, the forming of the plating layer 30 (S130) may include forming the plating layer 30 only in the first region where the conductive region of the electrode plating member 30 is exposed.

In detail, in the forming of the plating layer 30, only the first region a of the electrode assembly member combination may be immersed in the electrolyte. Here, the first region may be a region corresponding to one surface (eg, top or bottom surface) and a specific outer circumferential surface of the electrode plating member combination (or the electrode plating member 10). Then, the plating layer 30 may be formed only in the first region a, and may not be formed in the region except for the first region a (eg, the second region b). The reason for forming the plating layer 30 by separating only a specific portion of the electrode plating member 10 or the electrode plating member combination as described above is that the electrode plating member 10 is separated in the electrode plating member 10 to be described later. ) Is easily separated from the electrode assembly member bonding.

In another embodiment, referring to FIG. 7, a part of the electrode plating member surface may be formed to form an insulating member 35 having electrical insulation, so that the plating layer is not locally formed. To this end, the shape of the insulating member 35 on the surface of the electrode plating member has a shape having an insulating property by embossing a fine shape with an ink, a polymer, a polymer, or the like having an extremely high electrical resistance that does not pass through the surface, or by printing or bonding. This is to form a through layer so that the plated layer is not generated in the insulating part so that a through hole is formed in the surface of the electrode finally formed by plating.

Forming the plating layer 30 only in the first region of the electrode plating member 30 may not only control the height of the electrode plating member combination soaked in the electrolyte, but also the electrode plating member as described above. It may also be performed by configuring the electrode plating member 30 such that the electrically conductive component is exposed to the surface only in a specific region (eg, the first region) of 30.

In addition, in the forming of the plating layer 30 (S130), secondary bonding between the wire part 20 and the plating layer 30 of the electrode plating member combination may be simultaneously or sequentially formed with the plating layer 30. As a result, since the plating process and the bonding process are performed at the same time, unnecessary processes can be reduced, and adhesion and strength between the wire part 20 and the plating layer 30 can be improved.

According to some embodiments, the forming of the plating layer 30 (S130) may be performed at a time on a plurality of electrode plating member combinations to enable mass production of the small-function catheter electrode 100.

Referring back to FIG. 1, an operation of separating the electrode plating member 10 may be performed in operation S150. For example, the catheter electrode 100 can be configured by separating the electrode plating member 10 from the electrode plating member combination formed in steps S110 and S130. This will be described with reference to FIGS. 6 to 8B. 6 is an exemplary view illustrating an operation of separating the electrode plating member 10 from the electrode plating member combination according to various embodiments of the present disclosure, and FIG. 7 is an electrode for a catheter according to various embodiments of the present disclosure. The present invention relates to a method of forming a hole by forming an insulating layer in the plating member to form a fine hole in the. 8A and 8B are exemplary views illustrating a catheter electrode in which an electrode plating member is separated.

Referring to FIG. 6, there is shown an electrode plating member combination in which an electrode plating member 10, a first wire 21, a second wire 25, and a plating layer 30 are formed. By way of example, and not limitation, the manufacturer may separate the electrode plating member 30 from the electrode plating member combination in the direction of the arrow. For example, the manufacturer can remove the electrode plating member 10 from the electrode plating member combination by bending and pulling the empty electrode plating member 30 inside.

Separation of the electrode formed by the plating shown in Figure 6 and the electrode plating member 10 can be made according to the characteristics of the electrode plating member, the electrode plating member is a polymer-based plastic rather than an elastic material having the characteristics of a very flexible rubber In this case, it can be removed by adding a high temperature of 400 degrees Celsius or more, or by using a suitable solvent.

As shown in FIG. 7, since the plating layer is not formed at the portion formed by the method of forming, processing, printing, or coating the insulating member 35 formed on the surface of the electrode plating member 10, the electrode plating member as shown in FIG. 8B. The catheter electrode 100 formed by plating after the removal of the member 10 may have a hole 36 penetrating the outer surface and the inner surface.

According to some embodiments, the manufacturer holds the second area b of the electrode plating member 10 and applies the tension in a direction extending to the second area b (eg, an arrow direction). The plating member 10 may be separated from the wire part 20 coupled to the plating layer 30. In this case, only the secondary bond between the wire portion 20 and the plating layer 30 remains while the primary bond between the electrode plating member 10 and the wire portion 20 is released. As a result, as shown in FIGS. 8A and 8B, the electrode 100 for the small-acting catheter, in which the first wire 21, the second wire 25, and the plating layer 30 are combined, has a void h formed therein. Can be completed.

9 is an exemplary view illustrating an operation of plating a catheter tube according to various embodiments of the present disclosure. The catheter tube may be one of the elements constituting the distal end of the catheter together with the electrode for the catheter, and tubes of various shapes and types may be used, but are not limited thereto. Similar to the method of FIG. 4 described above, in FIG. 9, a plurality of tube plating layers 60 may be formed by using the electroplating method on the catheter tube 50. The tube plating layer 60 is utilized as a tube electrode, the catheter tube 50 can be used as an electrode in the same manner as the above example in which the tube plating layer 60 is formed.

By the method of manufacturing the catheter tip and the tube electrode as described above, it is possible to reduce unnecessary processes by deforming the plating layer and the wire by using the electroplating, and to maximize the efficiency of the electrode manufacturing process for the catheter by improving the adhesion and strength between the wire and the plating layer. can do. In addition, a catheter electrode having a uniform thickness may be manufactured and a manufacturing process suitable for mass production may be performed.

The above embodiments are presented to aid the understanding of the present invention, and do not limit the scope of the present invention, from which it should be understood that various modifications are within the scope of the present invention. The technical protection scope of the present invention should be defined by the technical spirit of the claims, and the technical protection scope of the present invention is not limited to the literary description of the claims per se, but the scope of the technical equivalents is substantially equal. It should be understood that the invention extends to.

Claims

As a method for producing a catheter electrode using electroplating,

Coupling the wire part to an electrode plating member having at least a partial area conductive;

Forming a plating layer according to the conductive powder included in the electrode plating member by using an electroplating method, wherein the wire part is combined with the plating layer in the electroplating process, forming a plating layer; And

And separating the electrode plating member from a wire portion bonded to the plating layer.
The method of claim 1,

Coupling the wire portion to the electrode plating member,

Coupling the first wire to a surface of the electrode plating member, the coupling of the first wire such that the first wire surrounds at least a portion of the electrode plating member. Manufacturing method.
The method of claim 2, wherein the first wire is characterized in that the clad wire (Clad wire),

And the first wire is used to perform an operation of the catheter electrode and to supply power to the catheter electrode.
The method of claim 2,

Joining the first wire,

And coupling the first wire to the electrode plating member in a U-shape.
The method of claim 2,

Coupling the wire portion to the electrode plating member,

A method of manufacturing a catheter electrode, further comprising the step of adhering a second wire to the surface of the electrode plating member.
The method of claim 5,

The first wire performs an operation of the catheter electrode,

The second wire is a method for producing a catheter electrode, characterized in that to supply power to the electrode for the catheter.
The method of claim 5,

Coupling the wire portion to the electrode plating member,

A method of manufacturing a catheter electrode, further comprising the step of adhering a third wire to the surface of the electrode plating member.
The method of claim 7, wherein

The third wire is a method for producing a catheter, characterized in that for measuring the temperature of the electrode for the catheter.
The method of claim 1,

Forming the plating layer,

And forming the plating layer only in a first region of the electrode plating member.
The method of claim 9,

Separating the electrode plating member from the wire portion,

And separating the electrode plating member from the wire part by gripping a second region except the first region of the electrode plating member and applying a tension in a direction extending from the second region. Method of manufacturing the electrode.
The method of claim 9,

An insulating member is provided on a part of the surface of the electrode plating member,

Forming the plating layer,

And forming a plated layer having a through hole formed in a portion where the insulating member is provided.
The method of claim 1,

Separating the electrode plating member from the wire portion,

The electrode plating member is removed in a manner that does not affect the plating layer by shrinking and removing the electrode plating member, removing it using a solvent, dissolving it using an acid or a base, or removing it by high thermal incineration. Comprising a step, the manufacturing method of the electrode for catheter.
The method of claim 12,

The electrode plating member may be rubber, urethane, polyethylene, polypropylene, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene (ABS resin), polymethyl methacrylate, poly Vinyl chloride, polyvinylidene chloride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyamide, polyphthalamide, polycarbonate, phenylene-based resins, polyesters, polyphenylene sulfides, polyacetals, polyethylene terephthalates, poly Butylene terephthalate, Polysulfone, Polyetherimide, Polymer admixture, Phenolic resin, Epoxy, Urea resin, Melamine resin, Silicon resin, Polyurethane, Ball saturated polyester resin, Silicone rubber, Styrene-butadiene rubber, Butadiene rubber, Acrylic Ronitrile-butadiene rubber, nitrile-rubber, epiglorohydrin high , Chloroprene rubber, isobutene-isoprene rubber, ethylene-propylene-diene rubber, polyacrylate rubber, fluorosilicone rubber, vinyl-methyl silicone rubber, chlorosulfonate polyethylene rubber, fluorocarbon rubber, ethylene-acrylic rubber, epi A method for producing an electrode for a catheter, comprising a chlorohydrin rubber, latex, aluminum, graphite, or a mixture thereof.
The method of claim 1,

And depositing or coating an electrical conductor on a surface of the electrode plating member.
The method of claim 1,

Forming the plating layer,

The method for manufacturing a catheter electrode, characterized in that for supplying a current for the electroplating using the wire portion.