WO2017135227A1

WO2017135227A1 - Organic el display device

Info

Publication number: WO2017135227A1
Application number: PCT/JP2017/003335
Authority: WO
Inventors: 通園田; 剛平瀬; 亨妹尾; 越智　貴志; 石田　守
Original assignee: シャープ株式会社
Priority date: 2016-02-01
Filing date: 2017-01-31
Publication date: 2017-08-10

Abstract

A base resin substrate layer (10), an organic EL element layer (20), a ground layer (28), and a hard coat layer (29) constituting part of an organic EL display device (100aa) have residual strain ratios κ₁, κ₂, κ₃, and κ₄ respectively, have thickness d₁, d₂, d₃, and d₄ respectively, have Young's modulus E₁, E₂, E₃, E₄ respectively, and have stress distribution coefficient α₁, α₂, α₃, and α₄,respectively. The relational expression (κ₁α₁d₁/E₁ + κ₂α₂d₂/E₂ + κ₃α₃d₃/E₃ + κ₄α₄d₄/E₄) ≤ 0.4 µm is satisfied, where σ is the pressure applied to the surface of the hard coat layer (29).

Description

Organic EL display device

The present invention relates to an organic EL display device.

In recent years, a self-luminous organic EL display device using an organic EL (electroluminescence) element has attracted attention as a display device that replaces a liquid crystal display device. In this organic EL display device, there has been proposed an organic EL display device that can be bent repeatedly by adopting a structure in which an organic EL element and various films are laminated on a flexible resin substrate. In such an organic EL display device that can be bent repeatedly, for example, a hard coat layer is provided so that permanent plastic deformation (scratches) does not easily occur on the display screen even when a pencil or the like is pressed on the display screen. A structure provided on the outermost surface has been proposed.

For example, in Patent Document 1, a hard coat layer having a pencil hardness of 3H to 5H is formed on at least one surface of a plastic substrate film having a pencil hardness of HB to 2H, and the entire film has a pencil hardness of 4H to 8H. A film is disclosed.

JP 2000-326447 A

By the way, even in the organic EL display device in which the hard coat layer is provided on the outermost surface (surface), if the pressure applied to the hard coat layer is increased, plastic deformation generated in the underlying layer below the hard coat layer is caused. This may cause permanent plastic deformation (scratches) in the outermost hard coat layer. In this case, reflected light of external light incident on the display screen and light emitted from the organic EL element are scattered by scratches generated on the surface of the hard coat layer, so that the display quality of the organic EL display device is deteriorated.

The present invention has been made in view of such a point, and an object thereof is to suppress plastic deformation of the hard coat layer in the organic EL display device provided with the hard coat layer on the surface.

In order to achieve the above object, an organic EL display device according to the present invention includes a base resin substrate layer, an organic EL element layer provided on the base resin substrate layer, and a bottom provided on the organic EL element layer. An organic EL display device comprising a base layer and a hard coat layer provided on the base layer, wherein the base resin substrate layer has a residual strain ratio κ ₁ , a thickness d ₁ (μm), and a Young's modulus E ₁ (Pa) and a stress dispersion coefficient α ₁ , and the organic EL element layer has a residual strain ratio κ ₂ , a thickness d ₂ (μm), a Young's modulus E ₂ (Pa), and a stress dispersion coefficient α ₂ . The underlayer has a residual strain ratio κ ₃ , a thickness d ₃ (μm), a Young's modulus E ₃ (Pa), and a stress dispersion coefficient α ₃ , and the hard coat layer has a residual strain ratio κ ₄ , Having a thickness d ₄ (μm), a Young's modulus E ₄ (Pa) and a stress dispersion coefficient α ₄ , Assuming that the pressure applied to the surface of the hard coat layer opposite to the base layer is σ (Pa), σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm is satisfied.

According to the present invention, since the total plastic deformation amount of each layer constituting the organic EL display device is 0.4 μm or less, in the organic EL display device provided with the hard coat layer on the surface, the plastic deformation of the hard coat layer is performed. Can be suppressed.

1 is a plan view showing a pixel structure of an organic EL display device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the organic EL display device taken along line II-II in FIG. 1 is an equivalent circuit diagram of an organic EL element layer constituting an organic EL display device according to a first embodiment of the present invention. It is sectional drawing of the organic electroluminescent layer which comprises the organic electroluminescent display apparatus which concerns on the 1st Embodiment of this invention. In the organic electroluminescence display which concerns on the 1st Embodiment of this invention, it is a schematic diagram for demonstrating the distance from the surface of the hard-coat layer at the time of calculating | requiring a stress dispersion coefficient. 5 is a table showing the contents of Example 1 specifically performed in the organic EL display device according to the first embodiment of the present invention. It is sectional drawing of the modification of the organic electroluminescence display which concerns on the 1st Embodiment of this invention. 6 is a table showing the contents of Example 2 specifically performed in the organic EL display device of the modification according to the first embodiment of the present invention. It is sectional drawing of the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is a table | surface which shows the content of Example 3 specifically performed in the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the modification of the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is a table | surface which shows the content of Example 4 specifically performed in the organic electroluminescence display of the modification which concerns on the 2nd Embodiment of this invention. It is a table | surface which shows the content of the comparative example 1 performed concretely in the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is a table | surface which shows the content of the comparative example 2 performed concretely in the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is a table | surface which shows the content of the comparative example 3 performed concretely in the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is a table | surface which shows the content of the comparative example 4 performed concretely in the organic electroluminescence display which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the organic electroluminescence display which concerns on the 3rd Embodiment of this invention. It is a table | surface which shows the content of Example 5 specifically performed in the organic electroluminescence display which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the modification of the organic electroluminescence display which concerns on the 3rd Embodiment of this invention. It is a table | surface which shows the content of Example 6 specifically performed in the organic electroluminescence display of the modification which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the organic electroluminescence display which concerns on the 4th Embodiment of this invention. It is a table | surface which shows the content of Example 7 specifically performed in the organic electroluminescence display which concerns on the 4th Embodiment of this invention. It is sectional drawing of the modification of the organic electroluminescence display which concerns on the 4th Embodiment of this invention. It is a table | surface which shows the content of Example 8 specifically performed in the organic electroluminescence display of the modification which concerns on the 4th Embodiment of this invention. It is sectional drawing of the organic electroluminescence display which concerns on the 5th Embodiment of this invention. It is a table | surface which shows the content of Example 9 specifically performed in the organic electroluminescence display which concerns on the 5th Embodiment of this invention. It is sectional drawing of the modification of the organic electroluminescence display which concerns on the 5th Embodiment of this invention. It is a table | surface which shows the content of Example 10 specifically performed in the organic electroluminescence display of the modification which concerns on the 5th Embodiment of this invention. It is a table | surface which shows the content of Example 11 specifically performed in the organic electroluminescence display of the modification which concerns on the 5th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

<< First Embodiment >>
1 to 8 show a first embodiment of an organic EL display device according to the present invention. Here, FIG. 1 is a plan view showing a pixel structure of the organic EL display device 100aa of the present embodiment. FIG. 2 is a cross-sectional view of the organic EL display device 100aa along the line II-II in FIG. FIG. 3 is an equivalent circuit diagram of the organic EL element layer 20 constituting the organic EL display device 100aa. FIG. 4 is a cross-sectional view of the organic EL layer 17 constituting the organic EL display device 100aa. FIG. 5 is a schematic diagram for explaining the distance from the surface of the hard coat layer 29 when the stress dispersion coefficient α is obtained in the organic EL display device 100aa. FIG. 6 is a table showing the contents of Example 1 specifically performed in the organic EL display device 100aa. FIG. 7 is a cross-sectional view of an organic EL display device 100ab which is a modification of the organic EL display device 100aa. FIG. 8 is a table showing the contents of Example 2 specifically performed in the organic EL display device 100ab.

As shown in FIG. 2, the organic EL display device 100aa includes, for example, a base resin substrate layer 10 made of polyimide resin, a stress adjustment layer 8 provided on the lower surface of the base resin substrate layer 10 in the figure, a base An organic EL element layer 20 provided on the upper surface of the resin substrate layer 10 in the figure, a base layer 28 provided on the organic EL element layer 20, and a hard coat layer 29 provided on the base layer 28. I have. Here, in the display area (not shown) of the organic EL display device 100aa, as shown in FIG. 1, a plurality of sub-pixels P are arranged in a matrix. Further, in the display area of the organic EL display device 100aa, as shown in FIG. 1, the sub-pixel P having a red light emitting area Lr for performing red gradation display, and the green light emitting area for performing green gradation display. A sub pixel P having Lg and a sub pixel P having a blue light emitting region Lb for performing blue gradation display are provided adjacent to each other. Note that, in the display area of the organic EL display device 100aa, one pixel is configured by three adjacent sub-pixels P each having a red light emitting area Lr, a green light emitting area Lg, and a blue light emitting area Lb.

The stress adjustment layer 8 is configured to control the position of the neutral surface of the bending stress in the organic EL display device 100aa. Here, the stress adjustment layer 8 is made of, for example, a plastic film such as polyethylene terephthalate, polyethylene naphthalate, (meth) acrylate, or triacetyl cellulose. In addition, between the base resin substrate layer 10 and the stress adjustment layer 8, for example, a photocurable adhesive sheet, a UV curable adhesive, a thermosetting adhesive, an epoxy adhesive, a cyanoacrylate instantaneous adhesive, and the like. A back side adhesive layer 9 is provided.

As shown in FIGS. 1 and 3, the organic EL element layer 20 includes a plurality of gate lines 11 provided on the base resin substrate layer 10 so as to extend parallel to each other in the horizontal direction in the drawing, and in the vertical direction in the drawing. A plurality of source lines 12a provided so as to extend in parallel to each other, and a plurality of power supply lines 12b provided adjacent to each source line 12a in the vertical direction in the drawing so as to extend in parallel with each other. In addition, a moisture-proof layer made of a single layer film or a laminated film such as a silicon nitride film, a silicon oxide film, or a silicon oxynitride film is provided between the base resin substrate layer 10 and the gate layer such as each gate line 11. It has been.

Further, as shown in FIG. 3, the organic EL element layer 20 includes a plurality of first TFTs 13 a provided for each sub-pixel P, a plurality of second TFTs 13 b provided for each sub-pixel P, and each sub-pixel P. And a plurality of capacitors 13c provided for each pixel P. Here, as shown in FIG. 3, the first TFT 13a is connected to the corresponding gate line 11 and source line 12a. Further, as shown in FIG. 3, the second TFT 13b is connected to the corresponding first TFT 13a and the power supply line 12b. The first TFT 13a and the second TFT 13b are, for example, a gate electrode provided on the base resin substrate layer 10 through the moisture-proof layer, a gate insulating film provided to cover the gate electrode, and a gate insulating film. A semiconductor layer is provided so as to overlap with the gate electrode, and a source electrode and a drain electrode provided on the semiconductor layer so as to face each other. Further, as shown in FIG. 3, the capacitor 13c is connected to the corresponding first TFT 13a and the power supply line 12b. The capacitor 13c includes, for example, one electrode formed in the same layer with the same material as the gate line 11, the other electrode formed in the same layer with the same material as the source line 12a, and a pair of these electrodes. And a gate insulating film provided therebetween. In this embodiment, the bottom gate type first TFT 13a and the second TFT 13b are illustrated, but the first TFT 13a and the second TFT 13b may be top gate type TFTs.

Further, as shown in FIG. 2, the organic EL element layer 20 is an interlayer insulating film provided so as to substantially cover each first TFT 13a (see FIG. 3), each second TFT 13b and each capacitor 13c (see FIG. 3). 14 and a plurality of first electrodes 15 provided as an anode for each sub-pixel P on the interlayer insulating film 14 and connected to the corresponding second TFT 13b. Here, as shown in FIG. 2, the interlayer insulating film 14 is provided so as to cover a portion other than a part of the drain electrode of each second TFT 13b. The interlayer insulating film 14 is made of, for example, a photosensitive acrylic resin, a photosensitive polyimide resin, a photosensitive polysiloxane resin, or the like. The plurality of first electrodes 15 are provided in a matrix on the interlayer insulating film 14 so as to correspond to the plurality of subpixels P. In each sub-pixel P, the first electrode 15 is connected to the drain electrode of the second TFT 13b through a contact hole formed in the interlayer insulating film 14, as shown in FIG. The first electrode 15 has a function of injecting holes into the organic EL layer 17 described later. The first electrode 15 is more preferably formed of a material having a high work function in order to improve the efficiency of hole injection into the organic EL layer 17. Examples of the material constituting the first electrode 15 include silver (Ag), aluminum (Al), vanadium (V), cobalt (Co), nickel (Ni), tungsten (W), gold (Au), Calcium (Ca), Titanium (Ti), Yttrium (Y), Sodium (Na), Ruthenium (Ru), Manganese (Mn), Indium (In), Magnesium (Mg), Lithium (Li), Ytterbium (Yb), etc. The metal material is mentioned. The material constituting the first electrode 15 is, for example, magnesium (Mg) / copper (Cu), magnesium (Mg) / silver (Ag), sodium (Na) / potassium (K), astatine (At) / oxidation. Astatine (AtO ₂ ), lithium (Li) / aluminum (Al), lithium (Li) / calcium (Ca) / aluminum (Al), lithium fluoride (LiF) / calcium (Ca) / aluminum (Al), etc. An alloy may be used. Further, the material constituting the first electrode 15 is, for example, a conductive oxide such as tin oxide (SnO), zinc oxide (ZnO), indium tin oxide (ITO), indium zinc oxide (IZO), or the like. There may be. The first electrode 15 may be formed by laminating a plurality of layers made of the above materials, such as ITO / Ag, IZO / Ag, and IZO / Al. Examples of materials having a high work function among conductive oxides include indium tin oxide (ITO) and indium zinc oxide (IZO).

Further, as shown in FIG. 2, the organic EL element layer 20 includes an edge cover 16 provided in a lattice shape so as to cover the edge of each first electrode 15, and the first electrode 15 exposed from the edge cover 16. And an organic EL layer 17 provided so as to cover the surface. Here, as a material constituting the edge cover 16, for example, silicon oxide (SiO ₂ ), silicon nitride such as trisilicon tetranitride (Si ₃ N ₄ ) (SiNx (x is a positive number)), silicon oxynite Examples thereof include inorganic films such as ride (SiNO), or organic films such as (photosensitive) polyimide resin, (photosensitive) acrylic resin, (photosensitive) polysiloxane resin, and novolak resin. Further, as shown in FIG. 4, the organic EL layer 17 includes a hole injection layer 1, a hole transport layer 2, a light emitting layer 3, an electron transport layer 4, and an electron injection layer 5 that are sequentially provided on the first electrode 15. It has.

The hole injection layer 1 is also called an anode buffer layer, and has a function of improving the efficiency of hole injection from the first electrode 15 to the organic EL layer 17 by bringing the energy levels of the first electrode 15 and the organic EL layer 17 closer to each other. Have. Here, as a material constituting the hole injection layer 1, for example, a triazole derivative, an oxadiazole derivative, an imidazole derivative, a polyarylalkane derivative, a pyrazoline derivative, a phenylenediamine derivative, an oxazole derivative, a styrylanthracene derivative, a fluorenone derivative, Examples include hydrazone derivatives and stilbene derivatives.

The hole transport layer 2 has a function of improving the hole transport efficiency from the first electrode 15 to the organic EL layer 17. Here, examples of the material constituting the hole transport layer 2 include porphyrin derivatives, aromatic tertiary amine compounds, styrylamine derivatives, polyvinylcarbazole, poly-p-phenylene vinylene, polysilane, triazole derivatives, oxadiazole. Derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amine-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, hydrogenated amorphous silicon, Examples include hydrogenated amorphous silicon carbide, zinc sulfide, and zinc selenide.

The light emitting layer 3 is injected with holes and electrons from the first electrode 15 and the second electrode 18 when a voltage is applied by the first electrode 15 and the second electrode 18 described later, and the holes and electrons are regenerated. This is the area to be joined. Here, the light emitting layer 3 is formed of a material having high light emission efficiency. Examples of the material constituting the light emitting layer 3 include metal oxinoid compounds [8-hydroxyquinoline metal complexes], naphthalene derivatives, anthracene derivatives, diphenylethylene derivatives, vinylacetone derivatives, triphenylamine derivatives, butadiene derivatives, and coumarin derivatives. Benzoxazole derivatives, oxadiazole derivatives, oxazole derivatives, benzimidazole derivatives, thiadiazole derivatives, benzthiazole derivatives, styryl derivatives, styrylamine derivatives, bisstyrylbenzene derivatives, tristyrylbenzene derivatives, perylene derivatives, perinone derivatives, aminopyrene derivatives, Pyridine derivatives, rhodamine derivatives, acuidine derivatives, phenoxazone, quinacridone derivatives, rubrene, poly-p-phenylene vinyle , Polysilane, and the like.

The electron transport layer 4 has a function of efficiently moving electrons to the light emitting layer 3. Here, examples of the material constituting the electron transport layer 4 include organic compounds such as oxadiazole derivatives, triazole derivatives, benzoquinone derivatives, naphthoquinone derivatives, anthraquinone derivatives, tetracyanoanthraquinodimethane derivatives, diphenoquinone derivatives, and fluorenone derivatives. , Silole derivatives, metal oxinoid compounds and the like.

The electron injection layer 5 has a function of bringing the energy levels of the second electrode 18 and the organic EL layer 17 closer to each other, and improving the efficiency with which electrons are injected from the second electrode 18 to the organic EL layer 17. The drive voltage of the organic EL element layer 20 can be lowered. The electron injection layer 5 is also called a cathode buffer layer. Here, as a material constituting the electron injection layer 5, for example, lithium fluoride (LiF), magnesium fluoride (MgF ₂ ), calcium fluoride (CaF ₂ ), strontium fluoride (SrF ₂ ), barium fluoride. Inorganic alkali compounds such as (BaF ₂ ), aluminum oxide (Al ₂ O ₃ ), strontium oxide (SrO), and the like can be given.

Further, as shown in FIG. 2, the organic EL element layer 20 is provided so as to cover the second electrode 18 provided as a cathode so as to cover the organic EL layer 17 and the edge cover 16, and the second electrode 18. And a sealing film 19. Here, the second electrode 18 has a function of injecting electrons into the organic EL layer 17. The second electrode 18 is more preferably composed of a material having a small work function in order to improve the efficiency of electron injection into the organic EL layer 17. Examples of the material constituting the second electrode 18 include silver (Ag), aluminum (Al), vanadium (V), cobalt (Co), nickel (Ni), tungsten (W), gold (Au), Calcium (Ca), Titanium (Ti), Yttrium (Y), Sodium (Na), Ruthenium (Ru), Manganese (Mn), Indium (In), Magnesium (Mg), Lithium (Li), Ytterbium (Yb), etc. Is mentioned. The second electrode 18 is formed of, for example, magnesium (Mg) / copper (Cu), magnesium (Mg) / silver (Ag), sodium (Na) / potassium (K), astatine (At) / oxidized astatine (AtO _2). ), Lithium (Li) / aluminum (Al), lithium (Li) / calcium (Ca) / aluminum (Al), lithium fluoride (LiF) / calcium (Ca) / aluminum (Al), etc. May be. The second electrode 18 may be formed of a conductive oxide such as tin oxide (SnO), zinc oxide (ZnO), indium tin oxide (ITO), indium zinc oxide (IZO), or the like. . The second electrode 18 may be formed by laminating a plurality of layers made of the above materials, for example, ITO / Ag. Examples of materials having a small work function include magnesium (Mg), lithium (Li), magnesium (Mg) / copper (Cu), magnesium (Mg) / silver (Ag), and sodium (Na) / potassium (K). ), Lithium (Li) / aluminum (Al), lithium (Li) / calcium (Ca) / aluminum (Al), lithium fluoride (LiF) / calcium (Ca) / aluminum (Al), and the like. Further, the sealing film 19 has a function of protecting the organic EL layer 17 from moisture and oxygen. The material constituting the sealing film 19 is, for example, silicon nitride (SiNx (x)) such as silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), or trisilicon tetranitride (Si ₃ N ₄ ). Are positive numbers)), inorganic materials such as silicon carbonitride (SiCN), and organic materials such as acrylate, polyurea, parylene, polyimide, and polyamide.

As shown in FIG. 2, the base layer 28 includes a front-side first adhesive layer 21, a counter resin substrate layer 22, a front-side second adhesive layer 23, a polarizing plate 24, and a front-side third adhesive that are sequentially provided on the sealing film 19. A layer 25, a touch panel 26, and a front-side fourth adhesive layer 27.

The front-side first adhesive layer 21 is composed of, for example, a UV delayed curable adhesive, a thermosetting adhesive, an epoxy adhesive, an acrylic adhesive, a polyolefin adhesive, or the like.

The counter resin substrate layer 22 is made of, for example, a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate.

The front side second adhesive layer 23, the front side third adhesive layer 25, and the front side fourth adhesive layer 27 are, for example, a photocurable adhesive sheet, a UV curable adhesive, a thermosetting adhesive, an epoxy adhesive, and a cyanoacrylate type. The instant adhesive is used.

The polarizing plate 24 includes a polarizer layer obtained by uniaxially stretching a polyvinyl alcohol film on which iodine is adsorbed, and a pair of protective films sandwiching the polarizer layer, and constitutes the pair of protective films. Is the main component.

The touch panel 26 includes, for example, a base film and a capacitive touch panel layer provided on the base film, and includes polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, (meth) acrylate, and the like constituting the base film. The plastic film is the main component. Here, the touch panel layer has metal wiring patterned in a lattice shape, but is excluded from the calculation of the amount of plastic deformation because the Young's modulus of the metal wiring is high and the film thickness is as thin as 1 μm or less.

2 and 5, the hard coat layer 29 includes a first hard coat layer 29a provided on the front-side fourth adhesive layer 27 and a second hard coat provided on the first hard coat layer 29a. Layer 29b.

The first hard coat layer 29a is made of a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate.

The second hard coat layer 29b is made of, for example, a UV curable organosilicon resin, a thermosetting resin, an acrylic resin, a urethane resin, a polysiloxane resin, or the like.

In the organic EL display device 100aa configured as described above, in each sub-pixel P, a gate signal is input to the first TFT 13a via the gate line 11 to turn on the first TFT 13a, and the gate of the second TFT 13b via the source line 12a. A predetermined voltage corresponding to the source signal is written into the electrode and capacitor 13c, the magnitude of the current from the power supply line 12b is defined based on the gate voltage of the second TFT 13b, and the defined current is supplied to the light emitting layer 3 Thus, the light emitting layer 3 emits light and is configured to display an image. In the organic EL display device 100aa, even when the first TFT 13a is turned off, the gate voltage of the second TFT 13b is held by the capacitor 13c, so that the light emitting layer 3 emits light until the gate signal of the next frame is input. Maintained.

Moreover, the organic EL display device 100aa of the present embodiment forms, for example, the organic EL element layer 20 on the surface of the base resin substrate layer 10 formed on the glass substrate by using a well-known method. After the base layer 28 and the hard coat layer 29 are laminated on the substrate 20, the back side adhesive layer 9 and the stress adjustment layer 8 are formed on the back surface of the base resin substrate layer 10 from which the glass substrate has been peeled off. it can.

In the present embodiment, the organic EL display device 100aa provided with the stress adjustment layer 8 is illustrated, but as shown in FIG. 7, the organic EL display in which the stress adjustment layer 8 (and the back side adhesive layer 9) is omitted. The apparatus 100ab may be used.

Further, in the organic EL display device 100aa of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less, that is,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
It is comprised so that the relational expression may be satisfied. Here, the base resin substrate layer 10 has a residual strain ratio κ ₁ , a thickness d ₁ (μm), a Young's modulus E ₁ (Pa), and a stress dispersion coefficient α ₁ , and the organic EL element layer 20 has a residual strain. It has a ratio κ ₂ , a thickness d ₂ (μm), a Young's modulus E ₂ (Pa), and a stress dispersion coefficient α ₂ , and the underlayer 28 has a residual strain ratio κ ₃ , a thickness d ₃ (μm), and a Young's modulus. E ₃ (Pa) and a stress dispersion coefficient α ₃ , and the hard coat layer 29 has a residual strain ratio κ ₄ , a thickness d ₄ (μm), a Young's modulus E ₄ (Pa), and a stress dispersion coefficient α ₄ . The stress adjustment layer 8 has a residual strain ratio κ ₅ , a thickness d ₅ (μm), a Young's modulus E ₅ (Pa), and a stress dispersion coefficient α ₅ , and the hard coat layer 29 (second hard coat layer 29b). ) Is a pressure applied to the surface (upper surface) on the opposite side to the underlayer 28. _{_{Incidentally, σ (κ 1 α 1 d}} 1 / E 1 + κ 2 α 2 d 2 / E 2 + κ 3 α 3 d 3 / E 3 + κ 4 α 4 d 4 / E 4 + κ 5 α 5 d 5 / E 5) In the case of> 0.4 μm, semi-permanent plastic deformation (scratches) on the surface of the second hard coat layer 29b is easily visible.

The residual strain ratio κ of each layer is determined by the change Δh _max in the maximum indentation depth h _max when the load is changed in the range of 1 mN to 10 mN by the nanoindentation method (ISO 14577) and the depth of the permanent depression h _p and measuring the amount of change Delta] h _p, defined by the ratio Δh p _/ Δh _max variation Delta] h _p of the depth h _p depressions permanently against variation Delta] h _max of the maximum indentation depth h _max.

The Young's modulus E of each layer is defined by the indentation elastic modulus measured by the nanoindentation method.

The stress dispersion coefficient α of each layer is defined as x (μm) when the distance from the surface (upper surface) opposite to the base layer 28 of the hard coat layer 29 to the center position in the thickness direction of the layer is
When x ≦ 300,
α = −1.5 × 10 ⁻⁷ x ³ + 8.6 × 10 ⁻⁵ x ² −1.7 × 10 ⁻² x + 1.45
If x> 300,
α = 0
It is prescribed by the formula of Here, the distance x from the upper surface of the hard coat layer 29 to the center position in the thickness direction of the layer, for example, will be described with reference to FIG. 5, the second hard coat layer 29b having a thickness d _b, x _b = d _b / 2, and in the first hard coat layer 29a having the thickness d _a , x _b = d _b + d _a / 2.

In addition, about the structure which has laminated structures, such as the organic EL element layer 20, the base layer 28, and the hard-coat layer 29, residual-strain ratio (kappa), thickness d, Young's modulus E, and stress of each structure layer which comprises it The dispersion coefficient α is obtained, and the amount of plastic deformation is calculated from these values and combined.

On the other hand, in the organic EL display device 100ab of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less.
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm
It is comprised so that the relational expression may be satisfied. If σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ )> 0.4 μm, Semi-permanent plastic deformation (scratches) on the surface of the second hard coat layer 29b is easily visually recognized.

Next, a specific experiment will be described.

As an example (Example 1) of the present embodiment, an organic EL display device 100aa having the following configuration was manufactured (see the table in FIG. 6). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjusting layer 8: Polyethylene terephthalate film with a thickness of 10.0 μm Back side adhesive layer 9: Photocurable adhesive sheet with a thickness of 10.0 μm (UVP series manufactured by Toagosei Co., Ltd.)
Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film, front side first adhesive layer 21: 5.0 μm thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Opposite resin substrate layer 22: aramid film having a thickness of 25.0 μm Front side second adhesive layer 23: epoxy resin adhesive having a thickness of 5.0 μm (manufactured by Arteco)
Polarizing plate 24: Triacetyl cellulose having a thickness of 35.0 μm Front side third adhesive layer 25: Epoxy resin adhesive having a thickness of 5.0 μm (manufactured by Arteco)
Touch panel 26: Aramid film with a thickness of 25.0 μm Front side fourth adhesive layer 27: Epoxy resin adhesive with a thickness of 5.0 μm (manufactured by Arteco)
The first hard coat layer 29a: aramid film second hard coat layer having a thickness of 25.0 29 b: thickness 10.0μm organosilicon resin wherein the UV-curable, the variation of the maximum indentation depth h _max Delta] h _max , measured by the nanoindentation method variation Delta] h _p and indentation modulus of the permanent indentation depth h _p, for the film was stuck to more than 10μm onto a glass substrate, for coating object is a glass substrate And a thickness of 10 μm or more. The pressure σ applied to the upper surface of the second hard coat layer 29b was 90 MPa. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 6, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 6, the manufactured organic EL display device 100aa has a total plastic deformation amount of 0.394 μm, and even after the upper surface of the second hard coat layer 29b is pressed with a pressure of 90 MPa, Semi-permanent plastic deformation (scratches) on the device surface (the surface of the second hard coat layer 29b) was hardly visually recognized.

In addition, as an example (Example 2) of the present embodiment, an organic EL display device 100ab having the following configuration was manufactured (see the table in FIG. 8). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film, front side first adhesive layer 21: 5.0 μm thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Opposite resin substrate layer 22: aramid film having a thickness of 25.0 μm Front side second adhesive layer 23: epoxy resin adhesive having a thickness of 5.0 μm (manufactured by Arteco)
Polarizing plate 24: Triacetyl cellulose having a thickness of 35.0 μm Front side third adhesive layer 25: Epoxy resin adhesive having a thickness of 5.0 μm (manufactured by Arteco)
Touch panel 26: Aramid film with a thickness of 25.0 μm Front side fourth adhesive layer 27: Epoxy resin adhesive with a thickness of 5.0 μm (manufactured by Arteco)
First hard coat layer 29a: aramid film with a thickness of 25.0 μm Second hard coat layer 29b: a UV curable organosilicon resin with a thickness of 10.0 μm Here, the pressure applied to the upper surface of the second hard coat layer 29b σ was set to 90 MPa. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 8, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 8, the manufactured organic EL display device 100ab has a total plastic deformation amount of 0.366 μm, and even after pressing the upper surface of the second hard coat layer 29b with a pressure of 90 MPa, Semi-permanent plastic deformation (scratches) on the device surface (the surface of the second hard coat layer 29b) was hardly visually recognized.

As described above, according to the organic EL display device 100aa of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 28, the hard coat layer 29, and the stress adjustment layer 8 have residual strain ratios κ ₁ , κ ₂ , κ ₃ , κ ₄ and κ ₅ , respectively. And d ₁ , d ₂ , d ₃ , d ₄ and d ₅ respectively, Young's modulus E _1, E _2, E ₃ , E ₄ and E ₅ respectively, and stress distribution coefficients α ₁ , α ₂ , α ₃ , α _4, and α ₅ respectively, and σ is a pressure applied to the surface of the hard coat layer 29,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
Therefore, the plastic deformation of the hard coat layer 29 can be suppressed in the organic EL display device 100aa provided with the hard coat layer 29 on the surface. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100aa and the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 29 is suppressed, so that the organic EL display device 100aa Display quality can be maintained.

Further, according to the organic EL display device 100ab of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 28, and the hard coat layer 29 have residual strain ratios κ ₁ , κ ₂ , κ ₃ and κ ₄ , respectively, and have thicknesses d ₁ , d ₂ , d. ₃ and d ₄ respectively, Young's modulus E _1, E _2, E ₃ and E ₄ respectively, stress dispersion coefficients α ₁ , α ₂ , α ₃ and α ₄ respectively, and hard coat layer 29 If the pressure applied to the surface of σ is σ,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ +) ≦ 0.4 μm
Therefore, in the organic EL display device 100ab provided with the hard coat layer 29 on the surface, plastic deformation of the hard coat layer 29 can be suppressed. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100ab and the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 29 is suppressed. Display quality can be maintained.

<< Second Embodiment >>
9 to 16 show a second embodiment of the organic EL display device according to the present invention. Here, FIG. 9 is a cross-sectional view of the organic EL display device 100ba of the present embodiment. FIG. 10 is a table showing the contents of Example 3 specifically performed in the organic EL display device 100ba. FIG. 11 is a cross-sectional view of an organic EL display device 100bb which is a modification of the organic EL display device 100ba. FIG. 12 is a table showing the contents of Example 4 specifically performed in the organic EL display device 100bb. FIGS. 13 to 16 are tables showing the contents of Comparative Examples 1 to 4 specifically performed in the organic EL display device 100ba. In the following embodiments, the same parts as those in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the first embodiment, the organic EL display device 100aa including the polarizing plate 24 is illustrated. However, in the present embodiment, the organic EL display device 100ba including the color filter 32 is illustrated instead of the polarizing plate 24.

As shown in FIG. 9, the organic EL display device 100 ba includes a base resin substrate layer 10, a stress adjustment layer 8 provided on the lower surface of the base resin substrate layer 10, and a diagram of the base resin substrate layer 10. An organic EL element layer 20 provided on the middle upper surface, a base layer 37 provided on the organic EL element layer 20, and a hard coat layer 38 provided on the base layer 37 are provided. The structure of the pixels arranged in the display area of the organic EL display device 100ba is substantially the same as the structure of the pixels arranged in the display area of the organic EL display device 100aa of the first embodiment.

As shown in FIG. 7, the base layer 37 includes a front-side first adhesive layer 31, a color filter 32, a counter resin substrate layer 33, a front-side second adhesive layer 34, a touch panel 35, and a front-side provided on the sealing film 19 in order. A third adhesive layer 36 is provided.

The front side first adhesive layer 31 is made of, for example, a UV delayed curable adhesive, a thermosetting adhesive, an epoxy adhesive, an acrylic adhesive, a polyolefin adhesive, or the like.

The color filter 32 includes, for example, a black matrix layer provided in a lattice shape, a plurality of color resist layers of a red layer, a green layer, and a blue layer provided so as to correspond to each sub-pixel P, and a black matrix layer And an overcoat layer provided so as to cover each color resist layer, and a photosensitive acrylic resin, a photosensitive polyimide resin, a photosensitive polysiloxane resin or the like is a main component. The color filter 32 is formed on the counter resin substrate layer 33.

The counter resin substrate layer 33 is made of, for example, a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate.

The front side second adhesive layer 34 and the front side third adhesive layer 36 are composed of, for example, a photocurable adhesive sheet, a UV curable adhesive, a thermosetting adhesive, an epoxy adhesive, a cyanoacrylate instantaneous adhesive, or the like. Has been.

The touch panel 35 includes, for example, a base film and a capacitive touch panel layer provided on the base film, and includes polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, (meth) acrylate, and the like constituting the base film. The plastic film is the main component.

The hard coat layer 38 includes a first hard coat layer provided on the front side third adhesive layer 36 and a second hard coat layer provided on the first hard coat layer. Here, the first hard coat layer is made of, for example, a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate. The second hard coat layer is made of, for example, a UV curable organosilicon resin, a thermosetting resin, an acrylic resin, a urethane resin, or a polysiloxane resin.

Similar to the organic EL display device 100aa of the first embodiment, the organic EL display device 100ba having the above configuration is configured to display an image by appropriately emitting light from the light emitting layer 3 in each sub-pixel P. . In the organic EL display device 100aa of the first embodiment, since the color filter (32) is not disposed, each of the sub-pixels P includes the light emitting layer 3 that emits three colors that are separately applied to three colors of RGB. However, the organic EL display device 100ba of this embodiment includes the light emitting layer 3 that emits white light in all the subpixels P because the color filter 32 is disposed.

Further, the organic EL display device 100ba of the present embodiment can be manufactured by appropriately changing the manufacturing method of the organic EL display device 100aa of the first embodiment.

In the present embodiment, the organic EL display device 100ba provided with the stress adjustment layer 8 is exemplified. However, as shown in FIG. 11, the organic EL display in which the stress adjustment layer 8 (and the back side adhesive layer 9) is omitted. It may be the device 100bb.

Further, in the organic EL display device 100ba of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less, that is,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
It is comprised so that the relational expression may be satisfied. Here, the base resin substrate layer 10 has a residual strain ratio κ ₁ , a thickness d ₁ (μm), a Young's modulus E ₁ (Pa), and a stress dispersion coefficient α ₁ , and the organic EL element layer 20 has a residual strain. It has a ratio κ ₂ , a thickness d ₂ (μm), a Young's modulus E ₂ (Pa), and a stress dispersion coefficient α _{2. The} underlayer 37 has a residual strain ratio κ ₃ , a thickness d ₃ (μm), and a Young's modulus. E ₃ (Pa) and a stress dispersion coefficient α ₃ , and the hard coat layer 38 has a residual strain ratio κ ₄ , a thickness d ₄ (μm), a Young's modulus E ₄ (Pa), and a stress dispersion coefficient α ₄ . The stress adjusting layer 8 has a residual strain ratio κ ₅ , a thickness d ₅ (μm), a Young's modulus E ₅ (Pa), and a stress dispersion coefficient α ₅ , and is opposite to the base layer 37 of the hard coat layer 38. Let σ (Pa) be the pressure applied to the surface (upper surface). _{_{Incidentally, σ (κ 1 α 1 d}} 1 / E 1 + κ 2 α 2 d 2 / E 2 + κ 3 α 3 d 3 / E 3 + κ 4 α 4 d 4 / E 4 + κ 5 α 5 d 5 / E 5) When> 0.4 μm, semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 38 is easily visually recognized.

The stress dispersion coefficient α of each layer is defined as x (μm) when the distance from the surface (upper surface) opposite to the base layer 37 of the hard coat layer 38 to the center position in the thickness direction of the layer is
When x ≦ 300,
α = −1.5 × 10 ⁻⁷ x ³ + 8.6 × 10 ⁻⁵ x ² −1.7 × 10 ⁻² x + 1.45
If x> 300,
α = 0
It is prescribed by the formula of

In addition, about the structure which has laminated structures, such as the organic EL element layer 20, the base layer 37, and the hard-coat layer 38, the residual strain ratio (kappa), thickness d, Young's modulus E, and stress of each structure layer which comprises it The dispersion coefficient α is obtained, and the amount of plastic deformation is calculated from these values and combined.

On the other hand, in the organic EL display device 100bb of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less.
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm
It is comprised so that the relational expression may be satisfied. If σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ )> 0.4 μm, Semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 38 is easily visually recognized.

Next, a specific experiment will be described.

As an example (Example 3) of the present embodiment, an organic EL display device 100ba having the following configuration was manufactured (see the table in FIG. 10). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjustment layer 8: Polyethylene terephthalate film with a thickness of 10.0 μm Back side adhesive layer 9: Epoxy resin adhesive with a thickness of 10.0 μm (manufactured by Arteco)
Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer 31: 5.0 μm thick UV delayed-curing adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 32: Photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer 33: 10.0 μm thick non-photosensitive coating type polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer 34: 5.0 μm thick epoxy resin adhesive (manufactured by Arteco)
Touch panel 35: Aramid film with a thickness of 25.0 μm Front side third adhesive layer 36: Epoxy resin adhesive with a thickness of 5.0 μm (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. Since the total amount of plastic deformation is hardly affected, it is omitted in the table of FIG.

As shown in the table of FIG. 10, the manufactured organic EL display device 100ba has a total plastic deformation amount of 0.361 μm, and even after the upper surface of the hard coat layer 38 is pressed with a pressure of 90 MPa, the surface of the device Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 38) was hardly visually recognized.

Further, as an example (Example 4) of the present embodiment, an organic EL display device 100bb having the following configuration was manufactured (see the table in FIG. 12). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer 31: 5.0 μm thick UV delayed-curing adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 32: Photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer 33: 10.0 μm thick non-photosensitive coating type polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer 34: 5.0 μm thick epoxy resin adhesive (manufactured by Arteco)
Touch panel 35: Aramid film with a thickness of 25.0 μm Front side third adhesive layer 36: Epoxy resin adhesive with a thickness of 5.0 μm (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 12, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 12, the manufactured organic EL display device 100bb had a total plastic deformation amount of 0.318 μm, and even after the upper surface of the hard coat layer 38 was pressed with a pressure of 90 MPa, the device surface Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 38) was hardly visually recognized.

Further, as Comparative Example 1 of the present embodiment, an organic EL display device having the following configuration corresponding to the organic EL display device 100ba was manufactured (see the table in FIG. 13). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjustment layer: Polyethylene terephthalate film with a thickness of 40.0 μm Back side adhesive layer: Pressure sensitive adhesive with a thickness of 15.0 μm Base resin substrate layer: Non-photosensitive coating type polyimide resin with a thickness of 10.0 μm (Hitachi Kasei DuPont Micro PIQ (registered trademark) series manufactured by Systems Co., Ltd.)
Moisture-proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT, etc .: Including a wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film: Photosensitive acrylic resin with a thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode: 0.1 μm thick ITO / Ag multilayer film formed by a general TFT process Edge cover: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) series manufactured by JSR Corporation) )
Organic EL layer: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film: Thickness formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer: 5.0 μm thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter: Photosensitive color filter resin with a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer: 10.0 μm thick non-photosensitive coated polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer: Pressure sensitive adhesive with a thickness of 15.0 μm Touch panel: Transparent polyimide resin with a thickness of 15.0 μm (SPIRAREA (registered trademark) TP series manufactured by Somaar Co., Ltd.)
Front side third adhesive layer: pressure sensitive adhesive with a thickness of 15.0 μm First hard coat layer: triacetyl cellulose film with a thickness of 30.0 μm Second hard coat layer: UV curable organosilicon with a thickness of 10.0 μm Resin Here, the pressure σ applied to the upper surface of the second hard coat layer was 90 MPa. For the moisture-proof layer, the first TFT, etc. constituting the organic EL element layer, the first electrode, the organic EL layer, the second electrode, and the sealing film have a plastic deformation amount due to the film thickness, Young's modulus, etc. Since the sum is hardly affected, it is omitted in the table of FIG.

As shown in the table of FIG. 13, the produced organic EL display device has a total plastic deformation amount of 4.010 μm. When the upper surface of the hard coat layer is pressed with a pressure of 90 MPa, the surface of the device (the surface of the hard coat layer) Semi-permanent plastic deformation (scratches) was observed.

Further, as Comparative Example 2 of the present embodiment, an organic EL display device having the following configuration corresponding to the organic EL display device 100ba was manufactured (see the table in FIG. 14). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjustment layer: Polyethylene terephthalate film with a thickness of 40.0 μm Back side adhesive layer: UV curable adhesive with a thickness of 15.0 μm (Aronix (registered trademark) series manufactured by Toagosei Co., Ltd.)
Base resin substrate layer: 10.0 μm thick non-photosensitive coated polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture-proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT, etc .: Including a wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film: Photosensitive acrylic resin with a thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode: 0.1 μm thick ITO / Ag multilayer film formed by a general TFT process Edge cover: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) series manufactured by JSR Corporation) )
Organic EL layer: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film: Thickness formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer: 5.0 μm thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter: Photosensitive color filter resin with a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer: 10.0 μm thick non-photosensitive coated polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer: 15.0 μm thick UV curable adhesive (Aronix (registered trademark) series manufactured by Toagosei Co., Ltd.)
Touch panel: Transparent polyimide resin with a thickness of 15.0 μm (SPIRAREA (registered trademark) TP series manufactured by Somar Corporation)
Front side third adhesive layer: 15.0 μm thick UV curable adhesive (Aronix (registered trademark) series manufactured by Toagosei Co., Ltd.)
First hard coat layer: 30.0 μm thick triacetyl cellulose film Second hard coat layer: 10.0 μm thick UV curable organosilicon resin Here, the pressure σ applied to the upper surface of the second hard coat layer Was 90 MPa. For the moisture-proof layer, the first TFT, etc. constituting the organic EL element layer, the first electrode, the organic EL layer, the second electrode, and the sealing film have a plastic deformation amount due to the film thickness, Young's modulus, etc. Since the total is hardly affected, it is omitted in the table of FIG.

The produced organic EL display device has a total plastic deformation amount of 0.800 μm as shown in the table of FIG. 14, and when the upper surface of the hard coat layer is pressed with a pressure of 90 MPa, the surface of the device (the surface of the hard coat layer) Semi-permanent plastic deformation (scratches) was observed.

Further, as Comparative Example 3 of the present embodiment, an organic EL display device having the following configuration corresponding to the organic EL display device 100ba was manufactured (see the table in FIG. 15). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

As shown in the table of FIG. 15, the produced organic EL display device has a total plastic deformation amount of 0.602 μm. When the upper surface of the hard coat layer is pressed with a pressure of 90 MPa, the surface of the device (the surface of the hard coat layer) Semi-permanent plastic deformation (scratches) was observed.

Further, as Comparative Example 4 of the present embodiment, an organic EL display device having the following configuration corresponding to the organic EL display device 100ba was produced (see the table in FIG. 16). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjustment layer: 10.0 μm thick polyethylene terephthalate film Back side adhesive layer: 10.0 μm thick epoxy resin adhesive (manufactured by Arteco)
Base resin substrate layer: 10.0 μm thick non-photosensitive coated polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture-proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT, etc .: Including a wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film: Photosensitive acrylic resin with a thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode: 0.1 μm thick ITO / Ag multilayer film formed by a general TFT process Edge cover: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) series manufactured by JSR Corporation) )
Organic EL layer: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film: Thickness formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer: 5.0 μm thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter: Photosensitive color filter resin with a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer: 10.0 μm thick non-photosensitive coated polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer: 5.0 μm thick epoxy resin adhesive (manufactured by Arteco)
Touch panel: Polyethylene terephthalate film with a thickness of 25.0 μm Front side third adhesive layer: Epoxy resin adhesive with a thickness of 5.0 μm (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. For the moisture-proof layer, the first TFT, etc. constituting the organic EL element layer, the first electrode, the organic EL layer, the second electrode, and the sealing film have a plastic deformation amount due to the film thickness, Young's modulus, etc. Since the sum is hardly affected, it is omitted in the table of FIG.

The produced organic EL display device has a total plastic deformation amount of 0.441 μm as shown in the table of FIG. 16, and when the upper surface of the hard coat layer is pressed with a pressure of 90 MPa, the surface of the device (the surface of the hard coat layer) Semi-permanent plastic deformation (scratches) was observed.

As described above, according to the organic EL display device 100ba of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 37, the hard coat layer 38, and the stress adjustment layer 8 have residual strain ratios κ ₁ , κ ₂ , κ ₃ , κ ₄ and κ ₅ , respectively. And d ₁ , d ₂ , d ₃ , d ₄ and d ₅ respectively, Young's modulus E _1, E _2, E ₃ , E ₄ and E ₅ respectively, and stress distribution coefficients α ₁ , α ₂ , α ₃ , α _4, and α ₅ respectively, and σ is a pressure applied to the surface of the hard coat layer 38,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
Therefore, in the organic EL display device 100ba having the hard coat layer 38 provided on the surface, plastic deformation of the hard coat layer 38 can be suppressed. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100ba and the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 38 is suppressed, so that the organic EL display device 100ba Display quality can be maintained.

Further, according to the organic EL display device 100bb of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 37, and the hard coat layer 38 have residual strain ratios κ ₁ , κ ₂ , κ _3, and κ ₄ , respectively, and have thicknesses d ₁ , d ₂ , d ₃ and d ₄ respectively, Young's modulus E _1, E _2, E ₃ and E ₄ respectively, stress dispersion coefficients α ₁ , α ₂ , α ₃ and α ₄ respectively, and hard coat layer 29 If the pressure applied to the surface of σ is σ,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ +) ≦ 0.4 μm
Therefore, in the organic EL display device 100bb having the hard coat layer 38 provided on the surface, plastic deformation of the hard coat layer 38 can be suppressed. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100bb and the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 38 is suppressed, so that the organic EL display device 100bb Display quality can be maintained.

<< Third Embodiment >>
17 to 20 show a third embodiment of the organic EL display device according to the present invention. Here, FIG. 17 is a cross-sectional view of the organic EL display device 100ca of the present embodiment. FIG. 18 is a table showing the contents of Example 5 specifically performed in the organic EL display device 100ca. FIG. 19 is a cross-sectional view of an organic EL display device 100cb which is a modification of the organic EL display device 100ca. FIG. 20 is a table showing the contents of Example 6 specifically performed in the organic EL display device 100cb.

In the first and second embodiments, the organic EL display devices 100aa (100ab) and 100ba (100bb) including the counter resin substrate layers 22 and 33 are illustrated. However, in the present embodiment, the organic resin in which the counter resin substrate layer is omitted is illustrated. An EL display device 100ca is illustrated.

As shown in FIG. 17, the organic EL display device 100 ca includes a base resin substrate layer 10, a stress adjustment layer 8 provided on the lower surface of the base resin substrate layer 10 in the drawing, and a diagram of the base resin substrate layer 10. An organic EL element layer 20 provided on the middle upper surface, a base layer 45 provided on the organic EL element layer 20, and a hard coat layer 46 provided on the base layer 45 are provided. Here, the structure of the pixels arranged in the display area of the organic EL display device 100ca is substantially the same as the structure of the pixels arranged in the display area of the organic EL display device 100aa of the first embodiment.

As shown in FIG. 17, the base layer 45 includes a front-side first adhesive layer 41, a color filter 42, a touch panel 43, and a front-side second adhesive layer 44 that are sequentially provided on the sealing film 19.

The front-side first adhesive layer 41 is made of, for example, a UV delayed curable adhesive, a thermosetting adhesive, an epoxy adhesive, an acrylic adhesive, a polyolefin adhesive, or the like.

The color filter 42 includes, for example, a black matrix layer provided in a lattice shape, a plurality of color resist layers of a red layer, a green layer, and a blue layer provided so as to correspond to each subpixel P, and a black matrix layer And an overcoat layer provided so as to cover each color resist layer, and a photosensitive acrylic resin, a photosensitive polyimide resin, a photosensitive polysiloxane resin or the like is a main component. The color filter 42 is formed on the touch panel 43.

The touch panel 43 includes, for example, a base film and a capacitive touch panel layer provided on the base film, and includes polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, (meth) acrylate, and the like constituting the base film. The plastic film is the main component.

The front-side second adhesive layer 44 is made of, for example, a photocurable adhesive sheet, a UV curable adhesive, a thermosetting adhesive, an epoxy adhesive, a cyanoacrylate instantaneous adhesive, or the like.

The hard coat layer 46 includes a first hard coat layer provided on the third adhesive layer 44 and a second hard coat layer provided on the first hard coat layer. Here, the first hard coat layer is made of, for example, a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate. The second hard coat layer is made of, for example, a UV curable organosilicon resin, a thermosetting resin, an acrylic resin, a urethane resin, or a polysiloxane resin.

Similar to the organic EL display device 100aa of the first embodiment, the organic EL display device 100ca having the above configuration is configured to display an image by appropriately emitting light from the light emitting layer 3 in each sub-pixel P. .

Further, the organic EL display device 100ca of the present embodiment can be manufactured by appropriately changing the manufacturing method of the organic EL display device 100aa of the first embodiment.

In the present embodiment, the organic EL display device 100ca provided with the stress adjustment layer 8 is exemplified. However, as shown in FIG. 19, the organic EL display in which the stress adjustment layer 8 (and the back side adhesive layer 9) is omitted. The device 100cb may be used.

Further, in the organic EL display device 100ca of the present embodiment, the total amount of plastic deformation of each layer constituting the organic EL display device 100ca is 0.4 μm or less.
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
It is comprised so that the relational expression may be satisfied. Here, the base resin substrate layer 10 has a residual strain ratio κ ₁ , a thickness d ₁ (μm), a Young's modulus E ₁ (Pa), and a stress dispersion coefficient α ₁ , and the organic EL element layer 20 has a residual strain. It has a ratio κ ₂ , a thickness d ₂ (μm), a Young's modulus E ₂ (Pa), and a stress dispersion coefficient α _{2. The} underlayer 45 has a residual strain ratio κ ₃ , a thickness d ₃ (μm), and a Young's modulus. E ₃ (Pa) and a stress dispersion coefficient α ₃ , and the hard coat layer 46 has a residual strain ratio κ ₄ , a thickness d ₄ (μm), a Young's modulus E ₄ (Pa), and a stress dispersion coefficient α ₄ . The stress adjusting layer 8 has a residual strain ratio κ ₅ , a thickness d ₅ (μm), a Young's modulus E ₅ (Pa), and a stress dispersion coefficient α ₅ , and is opposite to the base layer 45 of the hard coat layer 46. Let σ (Pa) be the pressure applied to the surface (upper surface). _{_{Incidentally, σ (κ 1 α 1 d}} 1 / E 1 + κ 2 α 2 d 2 / E 2 + κ 3 α 3 d 3 / E 3 + κ 4 α 4 d 4 / E 4 + κ 5 α 5 d 5 / E 5) When> 0.4 μm, semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 46 is easily visually recognized.

The stress dispersion coefficient α of each layer is defined as x (μm) where the distance from the surface (upper surface) opposite to the base layer 45 of the hard coat layer 46 to the center position in the thickness direction of the layer is
When x ≦ 300,
α = −1.5 × 10 ⁻⁷ x ³ + 8.6 × 10 ⁻⁵ x ² −1.7 × 10 ⁻² x + 1.45
If x> 300,
α = 0
It is prescribed by the formula of

In addition, about the structure which has laminated structures, such as the organic EL element layer 20, the base layer 45, and the hard-coat layer 46, residual-strain ratio (kappa), thickness d, Young's modulus E, and stress of each structure layer which comprises it The dispersion coefficient α is obtained, and the amount of plastic deformation is calculated from these values and combined.

On the other hand, in the organic EL display device 100cb of the present embodiment, the total amount of plastic deformation of each constituent layer is 0.4 μm or less.
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm
It is comprised so that the relational expression may be satisfied. If σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ )> 0.4 μm, Semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 46 is easily visible.

Next, a specific experiment will be described.

As an example (Example 5) of the present embodiment, an organic EL display device 100ca having the following configuration was manufactured (see the table in FIG. 18). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjustment layer 8: Polyethylene terephthalate film with a thickness of 10.0 μm Back side adhesive layer 9: Epoxy resin adhesive with a thickness of 10.0 μm (manufactured by Arteco)
Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer 41: 5.0 μm thick UV delayed curing adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 42: photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Touch panel 43: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer 44: 5.0 μm thick epoxy resin adhesive (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 18, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 18, the manufactured organic EL display device 100ca has a total plastic deformation amount of 0.313 μm, and even after the upper surface of the hard coat layer 46 is pressed with a pressure of 90 MPa, the device surface Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 46) was hardly visually recognized.

Further, as an example (Example 6) of the present embodiment, an organic EL display device 100cb having the following configuration was manufactured (see the table in FIG. 20). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm thick silicon nitride film Front side first adhesive layer 41: 5.0 μm thick UV delayed curing adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 42: photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Touch panel 43: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer 44: 5.0 μm thick epoxy resin adhesive (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 20, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 20, the manufactured organic EL display device 100cb has a total plastic deformation amount of 0.256 μm, and even after the upper surface of the hard coat layer 46 is pressed with a pressure of 90 MPa, the device surface Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 46) was hardly visually recognized.

As described above, according to the organic EL display device 100ca of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the underlayer 45, the hard coat layer 46, and the stress adjustment layer 8 have residual strain ratios κ ₁ , κ ₂ , κ ₃ , κ ₄ and κ ₅ , respectively. And d ₁ , d ₂ , d ₃ , d ₄ and d ₅ respectively, Young's modulus E _1, E _2, E ₃ , E ₄ and E ₅ respectively, and stress distribution coefficients α ₁ , α ₂ , α ₃ , α _4, and α ₅ respectively, and σ is a pressure applied to the surface of the hard coat layer 46,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
Therefore, in the organic EL display device 100ca having the hard coat layer 46 provided on the surface, plastic deformation of the hard coat layer 46 can be suppressed. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100ca and the light of the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 46 is suppressed. Display quality can be maintained.

Further, according to the organic EL display device 100cb of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the underlayer 45, and the hard coat layer 46 have residual strain ratios κ ₁ , κ ₂ , κ _3, and κ ₄ , respectively, and have thicknesses d ₁ , d ₂ , d ₃ and d ₄ respectively, Young's modulus E _1, E _2, E ₃ and E ₄ respectively, stress dispersion coefficients α ₁ , α ₂ , α ₃ and α ₄ respectively, and hard coat layer 46 If the pressure applied to the surface of σ is σ,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ +) ≦ 0.4 μm
Therefore, the plastic deformation of the hard coat layer 46 can be suppressed in the organic EL display device 100cb provided with the hard coat layer 46 on the surface. Thereby, since the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100cb and the light emitted from the organic EL element layer 20 on the surface of the hard coat 46 is suppressed, the display of the organic EL display device 100cb The quality can be maintained.

Further, in the organic EL display devices 100ca and 100cb, the touch panel 43 also serves as the counter resin substrate layers 22 and 33 of the first and second embodiments, so that the organic EL display devices 100ca and 100cb can be thinned. The member cost and the manufacturing cost can be reduced.

<< Fourth Embodiment >>
21 to 24 show a fourth embodiment of the organic EL display device according to the present invention. Here, FIG. 21 is a cross-sectional view of the organic EL display device 100da of the present embodiment. FIG. 22 is a table showing the contents of Example 7 specifically performed in the organic EL display device 100da. FIG. 23 is a cross-sectional view of an organic EL display device 100db which is a modification of the organic EL display device 100da. FIG. 24 is a table showing the contents of Example 8 specifically performed in the organic EL display device 100db.

In the second embodiment, the organic EL display device 100ba (100bb) in which the touch panel 35 is provided on the opposite side to the base resin substrate layer 10 of the counter resin substrate layer 33 is exemplified. However, in this embodiment, the touch panel 52 is the base resin. The organic EL display device 100da provided between the substrate layer 10 and the counter resin substrate layer 54 is illustrated.

As shown in FIG. 21, the organic EL display device 100 da includes a base resin substrate layer 10, a stress adjustment layer 8 provided on the lower surface of the base resin substrate layer 10 in the drawing, and a diagram of the base resin substrate layer 10. An organic EL element layer 20 provided on the middle upper surface, a base layer 56 provided on the organic EL element layer 20, and a hard coat layer 57 provided on the base layer 56 are provided. Here, the structure of the pixels arranged in the display area of the organic EL display device 100da is substantially the same as the structure of the pixels arranged in the display area of the organic EL display device 100aa of the first embodiment.

As shown in FIG. 21, the base layer 56 includes a front-side first adhesive layer 51, a touch panel 52, a color filter 53, a counter resin substrate layer 54, and a front-side second adhesive layer 55 that are sequentially provided on the sealing film 19. ing.

The front-side first adhesive layer 51 is composed of, for example, a UV delayed curable adhesive, a thermosetting adhesive, an epoxy adhesive, an acrylic adhesive, a polyolefin adhesive, or the like.

The touch panel 52 includes, for example, a base film and a capacitive touch panel layer provided on the base film, and includes polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, (meth) acrylate, and the like constituting the base film. The plastic film is the main component.

The color filter 53 includes, for example, a black matrix layer provided in a lattice shape, a plurality of color resist layers of a red layer, a green layer, and a blue layer provided so as to correspond to each sub-pixel P, and a black matrix layer And an overcoat layer provided so as to cover each color resist layer, and a photosensitive acrylic resin, a photosensitive polyimide resin, a photosensitive polysiloxane resin or the like is a main component.

The counter resin substrate layer 54 is made of, for example, a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate.

The front-side second adhesive layer 55 is made of, for example, a photocurable adhesive sheet, a UV curable adhesive, a thermosetting adhesive, an epoxy adhesive, a cyanoacrylate instantaneous adhesive, or the like.

The hard coat layer 57 includes a first hard coat layer provided on the third adhesive layer 55 and a second hard coat layer provided on the first hard coat layer. Here, the first hard coat layer is made of, for example, a plastic film such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, or (meth) acrylate. The second hard coat layer is made of, for example, a UV curable organosilicon resin, a thermosetting resin, an acrylic resin, a urethane resin, or a polysiloxane resin.

Similar to the organic EL display device 100aa of the first embodiment, the organic EL display device 100da having the above configuration is configured to display an image by appropriately emitting light from the light emitting layer 3 in each sub-pixel P. .

Moreover, the organic EL display device 100da of the present embodiment can be manufactured by appropriately changing the manufacturing method of the organic EL display device 100aa of the first embodiment.

In the present embodiment, the organic EL display device 100da provided with the stress adjustment layer 8 is illustrated, but as shown in FIG. 23, the organic EL display in which the stress adjustment layer 8 (and the back side adhesive layer 9) is omitted. The device 100db may be used.

Further, in the organic EL display device 100da of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less, that is,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
It is comprised so that the relational expression may be satisfied. Here, the base resin substrate layer 10 has a residual strain ratio κ ₁ , a thickness d ₁ (μm), a Young's modulus E ₁ (Pa), and a stress dispersion coefficient α ₁ , and the organic EL element layer 20 has a residual strain. It has a ratio κ ₂ , a thickness d ₂ (μm), a Young's modulus E ₂ (Pa), and a stress dispersion coefficient α ₂ , and the underlayer 56 has a residual strain ratio κ ₃ , a thickness d ₃ (μm), and a Young's modulus. E ₃ (Pa) and a stress dispersion coefficient α ₃ , and the hard coat layer 57 has a residual strain ratio κ ₄ , a thickness d ₄ (μm), a Young's modulus E ₄ (Pa), and a stress dispersion coefficient α ₄ . The stress adjusting layer 8 has a residual strain ratio κ ₅ , a thickness d ₅ (μm), a Young's modulus E ₅ (Pa), and a stress dispersion coefficient α ₅ , and is opposite to the base layer 56 of the hard coat layer 57. Let σ (Pa) be the pressure applied to the surface (upper surface). _{_{Incidentally, σ (κ 1 α 1 d}} 1 / E 1 + κ 2 α 2 d 2 / E 2 + κ 3 α 3 d 3 / E 3 + κ 4 α 4 d 4 / E 4 + κ 5 α 5 d 5 / E 5) When> 0.4 μm, semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 57 is easily visually recognized.

The stress dispersion coefficient α of each layer is defined as x (μm) when the distance from the surface (upper surface) opposite to the base layer 56 of the hard coat layer 57 to the center position in the thickness direction of the layer is
When x ≦ 300,
α = −1.5 × 10 ⁻⁷ x ³ + 8.6 × 10 ⁻⁵ x ² −1.7 × 10 ⁻² x + 1.45
If x> 300,
α = 0
It is prescribed by the formula of

In addition, about the structure which has laminated structures, such as the organic EL element layer 20, the base layer 56, and the hard-coat layer 57, the residual strain ratio (kappa), thickness d, Young's modulus E, and stress of each structure layer which comprises it The dispersion coefficient α is obtained, and the amount of plastic deformation is calculated from these values and combined.

On the other hand, in the organic EL display device 100db of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less.
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm
It is comprised so that the relational expression may be satisfied. If σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ )> 0.4 μm, Semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 57 is easily visually recognized.

Next, a specific experiment will be described.

As an example (Example 7) of the present embodiment, an organic EL display device 100da having the following configuration was manufactured (see the table in FIG. 22). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Stress adjustment layer 8: Polyethylene terephthalate film with a thickness of 10.0 μm Back side adhesive layer 9: Epoxy resin adhesive with a thickness of 10.0 μm (manufactured by Arteco)
Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm-thick silicon nitride film, front side first adhesive layer 51: 5.0 μm-thick UV delayed-curing adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Touch panel 52: photosensitive acrylic resin having a thickness of 15.0 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
Color filter 53: Photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer 54: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer 55: epoxy resin adhesive having a thickness of 5.0 μm (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 22, this is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 22, the manufactured organic EL display device 100da has a total plastic deformation amount of 0.345 μm, and even after the upper surface of the hard coat layer 57 is pressed with a pressure of 90 MPa, Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 57) was hardly visually recognized.

Further, as an example (Example 8) of the present embodiment, an organic EL display device 100db having the following configuration was manufactured (see the table in FIG. 24). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 μm-thick silicon nitride film, front side first adhesive layer 51: 5.0 μm-thick UV delayed-curing adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Touch panel 52: photosensitive acrylic resin having a thickness of 15.0 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
Color filter 53: Photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer 54: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Front side second adhesive layer 55: epoxy resin adhesive having a thickness of 5.0 μm (manufactured by Arteco)
First hard coat layer: aramid film having a thickness of 25.0 μm Second hard coat layer: UV-curable organosilicon resin having a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the second hard coat layer is 90 MPa. It was. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 24, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 24, the manufactured organic EL display device 100db had a total plastic deformation amount of 0.295 μm, and even after the upper surface of the hard coat layer 57 was pressed with a pressure of 90 MPa, Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 57) was hardly visually recognized.

As described above, according to the organic EL display device 100da of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 56, the hard coat layer 57 and the stress adjustment layer 8 have residual strain ratios κ ₁ , κ ₂ , κ ₃ , κ ₄ and κ ₅ , respectively. And d ₁ , d ₂ , d ₃ , d ₄ and d ₅ respectively, Young's modulus E _1, E _2, E ₃ , E ₄ and E ₅ respectively, and stress distribution coefficients α ₁ , α ₂ , α ₃ , α _4, and α ₅ respectively, and σ is a pressure applied to the surface of the hard coat layer 57,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ + κ ₅ α ₅ d ₅ / E ₅ ) ≦ 0 .4 μm
Therefore, in the organic EL display device 100da having the hard coat layer 57 provided on the surface, plastic deformation of the hard coat layer 57 can be suppressed. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100da and the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 57 is suppressed, so that the organic EL display device 100da Display quality can be maintained.

Further, according to the organic EL display device 100db of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 56 and the hard coat layer 57 have residual strain ratios κ ₁ , κ ₂ , κ ₃ and κ ₄ , respectively, and have thicknesses d ₁ , d ₂ , d ₃ and d ₄ respectively, Young's modulus E _1, E _2, E ₃ and E ₄ respectively, stress dispersion coefficients α ₁ , α ₂ , α ₃ and α ₄ respectively, and hard coat layer 57 If the pressure applied to the surface of σ is σ,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ +) ≦ 0.4 μm
Therefore, in the organic EL display device 100db provided with the hard coat layer 57 on the surface, plastic deformation of the hard coat layer 57 can be suppressed. Thereby, since the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100db and the light emitted from the organic EL element layer 20 on the surface of the hard coat 57 is suppressed, the display of the organic EL display device 100db is performed. The quality can be maintained.

In the organic EL display devices 100da and 100db, since the touch panel 52 is provided between the base resin substrate layer 10 and the counter resin substrate layer 54, the touch panel 52 is formed on the counter resin substrate layer 54 together with the color filter 53. Manufacturing cost can be reduced.

<< Fifth Embodiment >>
25 to 29 show a fifth embodiment of the organic EL display device according to the present invention. Here, FIG. 25 is a sectional view of the organic EL display device 100ea of the present embodiment. FIG. 26 is a table showing the contents of Example 9 specifically performed in the organic EL display device 100ea. FIG. 27 is a cross-sectional view of an organic EL display device 100eb which is a modification of the organic EL display device 100ea. FIG. 28 and FIG. 29 are tables showing the contents of Example 10 and Example 11 specifically performed in the organic EL display device 100eb.

In the first to fourth embodiments, the organic EL display devices 100aa to 100da in which the stress adjusting layer 8 is provided on the back surface side of the base resin substrate layer 10 are basically exemplified. However, in this embodiment, the stress adjusting layer is omitted. An example of the organic EL display device 100ea is illustrated.

As shown in FIG. 25, the organic EL display device 100ea includes a base resin substrate layer 10, an organic EL element layer 20 provided on the upper surface of the base resin substrate layer 10, and an organic EL element layer 20 on the surface. The base layer 64a provided and the hard coat layer 65 provided on the base layer 64a are provided. Here, the structure of the pixels arranged in the display area of the organic EL display device 100ea is substantially the same as the structure of the pixels arranged in the display area of the organic EL display device 100aa of the first embodiment.

As shown in FIG. 25, the base layer 64a includes an adhesive layer 61, a color filter 62, and a touch panel 63a provided in this order on the sealing film 19.

The adhesive layer 61 is made of, for example, a UV delayed curable adhesive, a thermosetting adhesive, an epoxy adhesive, an acrylic adhesive, a polyolefin adhesive, or the like.

The color filter 62 includes, for example, a black matrix layer provided in a lattice shape, a plurality of color resist layers of a red layer, a green layer, and a blue layer provided so as to correspond to each subpixel P, and a black matrix layer And an overcoat layer provided so as to cover each color resist layer, and a photosensitive acrylic resin, a photosensitive polyimide resin, a photosensitive polysiloxane resin or the like is a main component. The color filter 62 is formed on the touch panel 63a.

The touch panel 63a includes, for example, a base film and a capacitive touch panel layer provided on the base film, and includes polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, (meth) acrylate, and the like constituting the base film. The plastic film is the main component.

The hard coat layer 65 is made of, for example, a UV curable organosilicon resin, a thermosetting resin, an acrylic resin, a urethane resin, a polysiloxane resin, a silicon nitride film, or the like.

Similar to the organic EL display device 100aa of the first embodiment, the organic EL display device 100ea having the above configuration is configured to display an image by appropriately emitting light from the light emitting layer 3 in each sub-pixel P. .

Further, the organic EL display device 100ea according to the present embodiment can be manufactured by appropriately changing the manufacturing method of the organic EL display device 100aa according to the first embodiment.

In the present embodiment, the organic EL display device 100ea provided with the base layer 64a including the touch panel 63a is illustrated, but as shown in FIG. 27, the organic layer provided with the base layer 64b including the counter resin substrate layer 63b. It may be an EL display device 100eb. Here, in the organic EL display device 100eb, the color filter 62 is formed on the counter resin substrate layer 63b.

Further, in the organic EL display device 100ea (100eb) of the present embodiment, the total amount of plastic deformation of each layer constituting the layer is 0.4 μm or less, that is,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm
It is comprised so that the relational expression may be satisfied. Here, the base resin substrate layer 10 has a residual strain ratio κ ₁ , a thickness d ₁ (μm), a Young's modulus E ₁ (Pa), and a stress dispersion coefficient α ₁ , and the organic EL element layer 20 has a residual strain. It has a ratio κ ₂ , a thickness d ₂ (μm), a Young's modulus E ₂ (Pa), and a stress dispersion coefficient α ₂ , and the underlayer 64a (64b) has a residual strain ratio κ ₃ and a thickness d ₃ (μm). , Young's modulus E ₃ (Pa) and stress dispersion coefficient α ₃ , and the hard coat layer 65 has a residual strain ratio κ ₄ , thickness d ₄ (μm), Young's modulus E ₄ (Pa), and stress dispersion coefficient α. ₄ and the pressure applied to the surface (upper surface) of the hard coat layer 65 opposite to the base layer 64 is σ (Pa). If σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ )> 0.4 μm, Semi-permanent plastic deformation (scratches) on the surface of the hard coat layer 65 is easily visible.

The stress dispersion coefficient α of each layer is defined as x (μm) when the distance from the surface (upper surface) of the hard coat layer 65 opposite to the base layer 64a (64b) to the center position in the thickness direction of the layer is
When x ≦ 300,
α = −1.5 × 10 ⁻⁷ x ³ + 8.6 × 10 ⁻⁵ x ² −1.7 × 10 ⁻² x + 1.45
If x> 300,
α = 0
It is prescribed by the formula of

In addition, about the structure which has laminated structures like the organic EL element layer 20 and the base layer 64a (64b), the residual strain ratio (kappa), thickness d, Young's modulus E, and stress dispersion coefficient of each structure layer which comprises it α is obtained, and the plastic deformation amount is calculated from these values and added together.

Next, a specific experiment will be described.

As an example (Example 9) of the present embodiment, an organic EL display device 100ea having the following configuration was manufactured (see the table in FIG. 26). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 10.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 [mu] m thick silicon nitride film Adhesive layer 61: 5.0 [mu] m thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 62: photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Touch panel 63a: 10.0 μm-thick non-photosensitive polyimide resin (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Hard coat layer 65: UV curable organosilicon resin with a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the hard coat layer 65 was 90 MPa. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. In the table of FIG. 26, it is omitted because it hardly affects the total amount of plastic deformation.

As shown in the table of FIG. 26, the manufactured organic EL display device 100ea has a total plastic deformation amount of 0.169 μm, and even after the upper surface of the hard coat layer 65 is pressed with a pressure of 90 MPa, the device surface Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 65) was hardly visually recognized.

Also, as an example (Example 10) of the present embodiment, an organic EL display device 100eb having the following configuration was manufactured (see the table in FIG. 28). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 12.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 [mu] m thick silicon nitride film Adhesive layer 61: 5.0 [mu] m thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 62: photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer 63b: Non-photosensitive coating type polyimide resin having a thickness of 12.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Hard coat layer 65: silicon nitride film having a thickness of 3.0 μm Here, the pressure σ applied to the upper surface of the hard coat layer 65 was 90 MPa. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. Since it hardly affects the total amount of plastic deformation, it is omitted in the table of FIG.

As shown in the table of FIG. 28, the manufactured organic EL display device 100eb had a total plastic deformation amount of 0.189 μm, and even after the upper surface of the hard coat layer 65 was pressed with a pressure of 90 MPa, Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 65) was hardly visually recognized.

In addition, as an example (Example 11) of the present embodiment, an organic EL display device 100eb having the following configuration was manufactured (see the table in FIG. 29). In addition, the following material names are the names of materials used when determining the actual residual strain ratio κ, thickness d, Young's modulus E, and stress dispersion coefficient α.

Base resin substrate layer 10: Non-photosensitive coating type polyimide resin having a thickness of 12.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Moisture proof layer: 1.0 μm thick silicon nitride film formed by plasma CVD (chemical vapor deposition) method First TFT 13a, etc .: including wiring layer made of Ti / Al / Ti or Al / Ti laminated film, total thickness Configuration of 0.3 μm General Bottom Gate TFT Interlayer Insulating Film 14: Photosensitive Acrylic Resin with a Thickness of 2.5 μm (Optomer (registered trademark) series manufactured by JSR Corporation)
First electrode 15: 0.1 μm thick ITO / Ag laminated film formed by a general TFT process Edge cover 16: 1.5 μm thick photosensitive acrylic resin (Optomer (registered trademark) manufactured by JSR Corporation) )series)
Organic EL layer 17: Configuration of a general organic EL element having a total thickness of 0.2 μm Second electrode 18: Ag film having a thickness of 0.1 μm formed by a vapor deposition method Sealing film 19: formed by a low temperature plasma CVD method 3.0 [mu] m thick silicon nitride film Adhesive layer 61: 5.0 [mu] m thick UV delayed curable adhesive (Photorec (registered trademark) E series manufactured by Sekisui Chemical Co., Ltd.)
Color filter 62: photosensitive color filter resin having a thickness of 5.0 μm (COLOR MOSAIC (registered trademark) series manufactured by Fuji Film Co., Ltd.)
Opposite resin substrate layer 63b: Non-photosensitive coating type polyimide resin having a thickness of 12.0 μm (PIQ (registered trademark) series manufactured by Hitachi Chemical DuPont Microsystems)
Hard coat layer 65: UV curable organosilicon resin with a thickness of 10.0 μm Here, the pressure σ applied to the upper surface of the hard coat layer 65 was 90 MPa. In addition, about the moisture proof layer which comprises the organic EL element layer 20, 1st TFT13a, etc., about the 1st electrode 15, the organic EL layer 17, the 2nd electrode 18, and the sealing film 19, it originates in the film thickness, Young's modulus, etc. Since it hardly affects the total amount of plastic deformation, it is omitted in the table of FIG.

As shown in the table of FIG. 29, the manufactured organic EL display device 100eb had a total plastic deformation amount of 0.179 μm, and even after the upper surface of the hard coat layer 65 was pressed with a pressure of 90 MPa, the device surface Semi-permanent plastic deformation (scratches) in (the surface of the hard coat layer 65) was hardly visually recognized.

As described above, according to the organic EL display device 100ea (100eb) of the present embodiment, the following effects can be obtained.

The base resin substrate layer 10, the organic EL element layer 20, the base layer 64 a (64 b), and the hard coat layer 65 have residual strain ratios κ ₁ , κ ₂ , κ _3, and κ ₄ , respectively, and have thicknesses d ₁ , d ₂ , d ₃ and d ₄ , respectively, Young's modulus E _1, E _2, E ₃ and E ₄ respectively, stress dispersion coefficients α ₁ , α ₂ , α ₃ and α ₄ respectively, When the pressure applied to the surface of the coat layer 65 is σ,
σ (κ ₁ α ₁ d ₁ / E ₁ + κ ₂ α ₂ d ₂ / E ₂ + κ ₃ α ₃ d ₃ / E ₃ + κ ₄ α ₄ d ₄ / E ₄ ) ≦ 0.4 μm
Therefore, in the organic EL display device 100ea (100eb) having the hard coat layer 65 provided on the surface, plastic deformation of the hard coat layer 65 can be suppressed. Thereby, the scattering of the reflected light of the external light incident on the display screen of the organic EL display device 100ea (100eb) and the light emitted from the organic EL element layer 20 on the surface of the hard coat layer 65 is suppressed, so that the organic EL display The display quality of the device 100ea (100eb) can be maintained.

Further, in the organic EL display device 100ea (100eb), the counter resin substrate layer and the stress adjustment layer are omitted, and the hard coat layer 65 is formed as a single layer. Therefore, the organic EL display device 100ea (100eb) is thinned. In addition, the member cost and the manufacturing cost can be reduced.

<< Other Embodiments >>
In each of the above embodiments, an organic EL layer having a five-layer structure of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer has been exemplified. A three-layer structure of a layer / hole transport layer, a light emitting layer, and an electron transport layer / electron injection layer may be employed.

In each of the above embodiments, the organic EL display device using the first electrode as an anode and the second electrode as a cathode has been exemplified. However, the present invention reverses the stacked structure of the organic EL layers and uses the first electrode as a cathode. The present invention can also be applied to an organic EL display device using the second electrode as an anode.

In each of the above embodiments, the organic EL display device using the TFT electrode connected to the first electrode as the drain electrode has been exemplified. However, in the present invention, the TFT electrode connected to the first electrode is used as the source electrode. It can also be applied to an organic EL display device called.

Further, in each of the above embodiments, the organic EL display devices 100aa (100ab) to 100ea (100eb) have been exemplified, but the present invention has a stacked structure of the exemplified organic EL display devices 100aa (100ab) to 100ea (100eb). Combinations can also be applied freely.

As described above, the present invention is useful for flexible organic EL display devices.

8 Stress Adjustment Layer 10 Base Resin Substrate Layer 20 Organic EL Element Layers 22, 33, 54 Opposite Resin Substrate Layer 24

Polarizing Plate

26, 35, 43, 52, 63

Touch Panel

28, 37, 45, 56, 64a,

64b Base Layer

29 , 38, 46, 57, 65 Hard coat layers 32, 42, 53, 62 Color filters 100aa, 100ab, 100ba, 100bb, 100ca, 100cb, 100da, 100db, 100ea, 100eb Organic EL display device

Claims

A base resin substrate layer;
An organic EL element layer provided on the base resin substrate layer;
An underlayer provided on the organic EL element layer;
An organic EL display device comprising a hard coat layer provided on the underlayer,
The base resin substrate layer has a residual strain ratio κ 1 , a thickness d 1 (μm), a Young's modulus E 1 (Pa), and a stress dispersion coefficient α 1 .
The organic EL element layer has a residual strain ratio κ 2 , a thickness d 2 (μm), a Young's modulus E 2 (Pa), and a stress dispersion coefficient α 2 .
The underlayer has a residual strain ratio κ 3 , a thickness d 3 (μm), a Young's modulus E 3 (Pa), and a stress dispersion coefficient α 3 .
The hard coat layer has a residual strain ratio κ 4 , a thickness d 4 (μm), a Young's modulus E 4 (Pa), and a stress dispersion coefficient α 4 .
When the pressure applied to the surface of the hard coat layer opposite to the base layer is σ (Pa),
σ (κ 1 α 1 d 1 / E 1 + κ 2 α 2 d 2 / E 2 + κ 3 α 3 d 3 / E 3 + κ 4 α 4 d 4 / E 4 ) ≦ 0.4 μm
An organic EL display device satisfying the relational expression:
On the opposite side of the base resin substrate layer from the organic EL element layer, a stress adjustment layer is provided,
The stress adjustment layer has a residual strain ratio κ 5 , a thickness d 5 (μm), a Young's modulus E 5 (Pa), and a stress dispersion coefficient α 5 .
When the pressure applied to the surface of the hard coat layer opposite to the base layer is σ (Pa),
σ (κ 1 α 1 d 1 / E 1 + κ 2 α 2 d 2 / E 2 + κ 3 α 3 d 3 / E 3 + κ 4 α 4 d 4 / E 4 + κ 5 α 5 d 5 / E 5 ) ≦ 0 .4 μm
The organic EL display device according to claim 1, wherein:
The residual strain ratio κ of each layer includes a change amount Δh max of the maximum indentation depth h max and a change amount Δh of the permanent depression depth h p when the load is changed in the range of 1 mN to 10 mN by the nanoindentation method. were measured and p, defined by the ratio Δh p / Δh max variation Delta] h p of the depth h p recess the permanent with respect to the change amount Delta] h max of said maximum indentation depth h max,
The Young's modulus E of each layer is defined by the indentation elastic modulus measured by the nanoindentation method,
The stress dispersion coefficient α of each layer is defined as x (μm), where x (μm) is the distance from the surface of the hard coat layer opposite to the base layer to the center position in the thickness direction of the layer.
When x ≦ 300,
α = −1.5 × 10 −7 x 3 + 8.6 × 10 −5 x 2 −1.7 × 10 −2 x + 1.45
If x> 300,
α = 0
The organic EL display device according to claim 1, wherein the organic EL display device is defined by:
4. The organic EL display device according to claim 1, wherein the underlayer includes a polarizing plate.
The organic EL display device according to any one of claims 1 to 3, wherein the base layer includes a color filter.
The said base layer is provided with the opposing resin substrate layer provided so as to oppose the said base resin substrate layer, and the touchscreen adhere | attached on this opposing resin substrate layer, The Claim 5 characterized by the above-mentioned. Organic EL display device.
The underlayer includes a counter resin substrate layer provided to face the base resin substrate layer, and a touch panel provided between the counter resin substrate layer and the base resin substrate layer. The organic EL display device according to claim 5.
The organic EL display device according to claim 5, wherein the base layer includes a touch panel provided with the color filter so as to face the base resin substrate layer.