WO2017128475A1 - 封装组件及其封装方法 - Google Patents

封装组件及其封装方法 Download PDF

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Publication number
WO2017128475A1
WO2017128475A1 PCT/CN2016/074641 CN2016074641W WO2017128475A1 WO 2017128475 A1 WO2017128475 A1 WO 2017128475A1 CN 2016074641 W CN2016074641 W CN 2016074641W WO 2017128475 A1 WO2017128475 A1 WO 2017128475A1
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WO
WIPO (PCT)
Prior art keywords
glass
glue
laser
glass substrate
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/074641
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English (en)
French (fr)
Inventor
刘亚伟
吕伯彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US15/025,253 priority Critical patent/US10615365B2/en
Publication of WO2017128475A1 publication Critical patent/WO2017128475A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose

Definitions

  • the present invention relates to the field of packaging technologies, and in particular, to a packaging method and a package assembly packaged using the packaging method.
  • flat panel display technology including at least LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) has gradually replaced CRT (Cathode Ray Tube) displays.
  • Light source technology is a new type of light source, and its technology research and development is close to the market mass production level.
  • the bonding and soldering of two flat glass sheets is an important technology, and its packaging effect will be directly Affect the performance of the device.
  • Ultraviolet light-free adhesive curing technology is the earliest technology used in LCD/OLED packaging. It has the following characteristics: no solvent or a small amount of solvent, which reduces solvent pollution to the environment; low energy consumption, low temperature curing, suitable for heat sensitivity
  • the material has a fast curing speed and high efficiency, and can be used in a high-speed production line, and the curing equipment has a small footprint.
  • the shadowless glue is an organic material, the molecular gap is large after curing, and water vapor and oxygen are relatively easy to pass through the medium to reach the inner sealing region. Therefore, it is more suitable for applications that are less sensitive to moisture and oxygen, such as LCDs.
  • the OLED technology is sensitive to water vapor and oxygen.
  • the use of ultraviolet light to cure the package technology is easy to reach the inner sealing area of the OLED through the medium, which affects the display quality of the OLED.
  • Glass plastic packaging technology is a new flat glass packaging technology currently under development. It is a solution in which glass frit is formulated into a certain viscosity, coated on a glass substrate, heated to remove the solvent, and then bonded to the glass substrate to be used, and the glass powder is instantaneously burned to melt by a laser, thereby bonding the two flat glass sheets to each other. together. Because of its inorganic packaging medium, glass-encapsulated technology has a strong ability to block water vapor and oxygen. Particularly suitable for OLED technology sensitive to water vapor and oxygen.
  • the invention provides a package assembly and a packaging method thereof, so as to solve the technical problems in the prior art that the ultraviolet light is used to cure the encapsulation technology of the shadowless adhesive, and it is easy to pass through the medium to reach the inner sealing region of the OLED, thereby affecting the display quality of the OLED.
  • a technical solution adopted by the present invention is to provide a glass packaging method, the method comprising the steps of: providing a glass cover plate and a glass substrate; coating a glass glue on the glass cover plate; The outside of the glass glue is coated with a ring of outer frame glue, wherein the outer frame glue is coated with the glass glue; a inner frame glue is coated on the inner side of the glass glue; a filling material is added inside the inner frame rubber; The cavity is filled with nitrogen; the glass substrate and the glass cover are placed in the cavity to be paired so that the glass substrate is in close contact with the glass cover, and the outer frame is filled with nitrogen; the laser is irradiated with laser to make the glass pass The glue welds the glass substrate to the glass cover.
  • the step of irradiating the glass glue with the laser comprises: adjusting parameters of the laser irradiation of the laser to match the focal spot size of the laser with the glass glue; moving the focal spot on the glass glue to weld the glass substrate to the glass cover.
  • moving the focal spot on the glass glue to solder the glass substrate to the glass cover plate comprises: cutting the corresponding glass substrate and the glass cover plate on the outer side of the glass glue; and cutting the edge of the rear glass substrate and the glass cover plate Grinding.
  • the step of irradiating the glass glue with a laser comprises: irradiating the outer plastic frame with ultraviolet light to cure the outer plastic frame.
  • the step of irradiating the glass glue with a laser comprises: emitting a laser to irradiate the glass glue using a carbon dioxide laser.
  • one technical solution adopted by the present invention is to provide another glass packaging method, which comprises the steps of: providing a glass cover plate and a glass substrate; coating a glass glue on the glass cover plate; The outside of the glass glue is coated with a ring of outer frame glue, wherein the outer frame glue is coated with the glass glue; the filling material is added inside the glass glue; the glass substrate is attached to the glass cover plate; the glass glue is irradiated with a laser to pass The glass substrate glass glue will be welded to the glass cover.
  • the step of coating a ring of outer frame glue on the outer side of the glass glue comprises: coating a ring of inner frame glue on the inner side of the glass glue.
  • the step of irradiating the glass glue with the laser comprises: adjusting parameters of laser laser irradiation to match the focal spot size of the laser with the glass glue; moving the focal spot on the glass glue to solder the glass substrate In the glass cover.
  • the step of bonding the glass substrate to the glass cover comprises: filling the cavity of the group machine with nitrogen; placing the glass substrate and the glass cover in the cavity to form a pair, so that the glass substrate is attached to the glass cover
  • the plate, as well as the outer frame glue, are filled with nitrogen.
  • moving the focal spot on the glass glue to solder the glass substrate to the glass cover plate comprises: cutting the corresponding glass substrate and the glass cover plate on the outer side of the glass glue; and cutting the edge of the rear glass substrate and the glass cover plate Grinding.
  • moving the focal spot on the glass glue to solder the glass substrate to the glass cover plate comprises: irradiating the outer plastic frame with ultraviolet light to cure the outer plastic frame.
  • the step of coating a ring of glass glue on the glass substrate comprises: baking the glass glue.
  • one technical solution adopted by the present invention is to provide a package assembly including a glass substrate, a glass cover plate, a filling material and a glass glue, the glass substrate is attached to the glass cover plate, and the filling material is placed on the glass. Between the substrate and the glass cover plate; the glass glue is disposed on the outer side of the filler material, wherein the glass cover plate is welded to the glass substrate by the glass glue.
  • the package assembly further includes an inner frame glue and an inner frame glue, and the inner frame is glued between the glass glue and the filling material.
  • a gap is formed between the glass glue and the inner frame glue, and the gap is not less than 100 micrometers.
  • the composition of the glass glue includes glass powder, inorganic filler material and organic solvent, wherein the inorganic filler material is vanadium pentoxide.
  • the glass substrate, the glass cover plate, and the glass glue are enclosed to form a sealed space, wherein the sealed space has nitrogen gas.
  • the inner frame glue is ultraviolet glue.
  • the width of the cross section of the inner frame glue is 0.2 to 5 mm.
  • the invention has the beneficial effects that the present invention provides a package assembly and a packaging method thereof, which comprises coating a glass glue on a glass cover plate and coating a circle on the outer side of the glass glue.
  • the outer frame glue wherein the outer frame glue is coated with the glass glue; the filling material is added inside the glass glue;
  • the glass substrate is attached to the glass cover; the glass paste is irradiated with a laser so that the glass substrate is welded to the glass cover by the glass glue.
  • the laser welding of the glass glue forms a sealed space inside the glass glue, avoids the penetration of oxygen or moisture, and improves the life of the parts disposed on the glass substrate and inside the glass glue; the addition of the filling material improves the mechanical mechanism of the package group. strength.
  • FIG. 1 is a schematic cross-sectional view of a package assembly in accordance with a preferred embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of a package assembly in accordance with another preferred embodiment of the present invention.
  • Figure 2a is a schematic diagram showing the bottom view of the glass glue and the inner frame glue of the package assembly shown in Figure 2;
  • FIG. 3 is a flow chart of a glass encapsulation method in accordance with a preferred embodiment of the present invention.
  • FIG. 4 is a flow chart of a glass encapsulation method in accordance with another preferred embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view of a package assembly in accordance with a preferred embodiment of the present invention.
  • the package assembly of the present invention includes a glass substrate 10, a cover glass 20, a filler material 30, a glass paste 40, and an organic light emitting diode 50.
  • the glass substrate 10 and the glass cover 20 are mainly made of glass, the glass substrate 10 is attached to the glass cover 20; the filling material 30 is placed between the glass substrate 10 and the glass cover 20, and the organic light emitting diode 50 is disposed on the filling material 30.
  • the glass substrate 10 is affixed to the inside of the filling material 30, and may be partially exposed to the filling material 30, and may be partially flush with the outer surface of the filling material 30.
  • the glass glue 40 is disposed outside the filling material 30, wherein The cover glass 20 is welded to the glass substrate 10 by a glass paste 40.
  • the glass paste 40 forms an outer ring on the glass substrate 10, and the filling material 30 is filled in the ring.
  • the filling material 30 may fill the outer ring or may be spaced from the outer ring on the surface of the glass substrate 10.
  • the gas in the sealed space formed by the glass substrate 10, the glass cover 20, and the glass paste 40 is nitrogen gas for preventing outside air from entering the inside of the outer ring.
  • the sealed space is obtained by welding the glass paste 40 between the glass substrate 10 and the cover glass 20 by a carbon dioxide laser or other laser.
  • FIG. 2 is a schematic cross-sectional view of a package assembly according to another preferred embodiment of the present invention.
  • the package assembly of the present embodiment further includes an inner frame glue 60 disposed between the glass glue 40 and the filling material 30.
  • the inner frame glue 60 forms an inner ring on the surface of the glass substrate 10, and the filling material 30 is filled into the inner frame glue 60, and the inner frame glue 60 can further prevent oxygen or moisture from infiltrating into the filling material 30.
  • a first gap 70 is formed between the glass glue 40 and the inner frame glue 60, and the gap is not less than 100 micrometers.
  • the inner frame glue 60 of the present embodiment has a cross section having a width of 0.2 to 5 mm.
  • FIG. 2a is a schematic diagram of a bottom view of the glass glue and the inner frame glue of the package assembly shown in FIG. 2, and the outer or inner ring formed by the glass glue 40 and the inner frame glue 60 respectively.
  • the shape may be square and, of course, may be a circular ring, or may be other regular or irregular shapes, and the shapes of the glass glue 40 and the inner frame glue 60 are also different.
  • the glass glue 40 is a square ring
  • the sealant 60 is a circular ring.
  • the inner frame glue 60 can be an ultraviolet glue, an optical clear adhesive or other adhesive, preferably an ultraviolet glue.
  • the present invention also provides a display device comprising the package assembly described above.
  • FIG. 3 is a flow chart of a glass packaging method according to a preferred embodiment of the present invention.
  • the components of the package assembly are briefly described above.
  • the assembly process is further described.
  • the glass package method of this embodiment includes the following steps:
  • the surface of the glass substrate 10 may be formed with a plurality of components, at least having the organic light emitting diode 50.
  • the glass paste 40 is mainly composed of a glass frit, an inorganic filler, and an organic solvent.
  • the inorganic filler is mainly used for absorbing laser energy, and may be vanadium pentoxide (V 2 O 5 ).
  • the glass glue 40 forms an outer ring on the surface of the glass cover 20, and the organic light emitting diode 50 is disposed in the outer ring.
  • the glass glue 40 is formed in the outer frame glue, and the outer frame glue forms a certain interval with the glass glue 40, that is, the second gap, so that there is a certain space in the following step to cut the outer frame rubber outside the second gap. Improve the accuracy of the removal.
  • the outer frame glue may be an ultraviolet glue, an optical clear adhesive or other adhesive, preferably an ultraviolet glue.
  • the filling material 30 is sprayed into the glass glue 40 by inkjet printing technology, and the filling material 30 can be filled into the entire circumference of the glass glue 40, and the filling material 30 and the inner edge of the glass glue 40 can be formed into a certain gap.
  • the addition of the filler material 30 of the present embodiment can thereby increase the strength of the package structure.
  • the glass cover 20 and the glass substrate 10 can be bonded together using a group machine.
  • the glass paste 40 is irradiated with a laser so that the glass paste 40 welds the glass substrate 10 to the cover glass 20.
  • the glass paste 40 is welded between the glass substrate 10 and the cover glass 20 using a carbon dioxide laser or other laser, so that the glass substrate 10, the cover glass 20, and the glass paste 40 are enclosed to form a sealed space.
  • FIG. 4 is a flow chart of a glass packaging method according to another preferred embodiment of the present invention. This embodiment is substantially the same as the above embodiment. Specifically, the glass packaging method of this embodiment includes the following steps:
  • the surface of the glass substrate 10 may be formed with a plurality of components, at least having the organic light emitting diode 50.
  • the glass paste 40 is mainly composed of glass frit, an inorganic filler and an organic solvent, and the inorganic filler is mainly used for absorbing laser energy, which may be vanadium pentoxide (V 2 O 5 ).
  • the glass paste 40 forms an outer ring on the surface of the cover glass 20, and the organic light emitting diode 50 is formed in the outer ring.
  • the glass cover 20 coated with the glass paste 40 is placed in an oven for baking until the glass paste 40 is completely dried, wherein the temperature of the oven is from 300 ° C to 500 ° C.
  • the glass glue 40 is formed in the outer frame glue, and the outer frame glue forms a certain interval with the glass glue 40, that is, the second gap, so that there is a certain space in the following step to cut the outer frame rubber outside the second gap. Improve the accuracy of the removal.
  • the outer frame glue may be an ultraviolet glue, an optical clear adhesive or other adhesive, preferably an ultraviolet glue.
  • the inner frame glue 60 forms an inner ring on the glass cover 20, the inner ring is spaced apart from the glass glue 40, and the inner frame glue 60 is formed in the inner ring, wherein the glass glue 40 and the inner frame glue 60
  • the distance formed by the first gap 70 is not less than 100 ⁇ m.
  • the inner frame glue 60 of the present embodiment has a cross section having a width of 0.2 to 5 mm.
  • the inner frame glue 60 can be an ultraviolet glue, an optical clear adhesive or other adhesive, preferably an ultraviolet glue.
  • the filling material 30 is sprayed into the inner frame glue 60 by an inkjet printing technique, and the filling material 30 can be filled into the entire inner frame of the inner frame glue 60, and the filling material 30 and the inner edge of the inner frame glue 60 can also be formed. A certain gap.
  • the addition of the filler material 30 of the present embodiment can thereby increase the strength of the package structure.
  • the step is specifically:
  • the process parameters of the group machine should be adjusted, and the minimum set vacuum of the group machine is reduced (for example, from 20000Pa to 1Pa to 10Pa), and the pressure of the group machine is increased (for example, from 1kN). 2kN ⁇ 10kN), or change the above two setting parameters.
  • the glass cover 20 and the glass substrate 10 are sequentially placed in the cavity of the group machine, and the two glasses are bonded together to determine the relative position.
  • the second gap between the outer frame of the outer frame glue and the glass glue 40 The inside becomes an atmospheric pressure nitrogen sealing ring.
  • the gap in the 40-degree glass glue is also filled with nitrogen gas, effectively preventing air from entering, preventing the oxygen in the air from chemically reacting with components such as the organic light emitting diode 60, thereby improving the package. The life of the component.
  • the outer plastic frame is irradiated with ultraviolet light to cure the outer plastic frame.
  • the outer plastic frame and the inner frame adhesive 60 are ultraviolet glue, they need to be ultraviolet cured.
  • Ultraviolet rays are invisible to the naked eye and are a section of electromagnetic radiation other than visible light with a wavelength in the range of 10 to 400 nm.
  • the ultraviolet glue in this embodiment refers to a type of adhesive which must be cured by ultraviolet light irradiation, and can be used as a bonding agent or as a rubber compound for paints, paints, inks, and the like.
  • the ultraviolet light curing is a photoinitiator (or a photosensitizer) in the ultraviolet curing material, which absorbs ultraviolet light to generate active radicals or cations, and initiates polymerization, crosslinking and chemical reaction of the monomers.
  • the adhesive is converted from a liquid state to a solid state in a few seconds, so that the outer plastic frame and the inner frame adhesive 60 further firmly adhere the glass cover 20 to the glass substrate 10.
  • the glass paste 40 is irradiated with a laser so that the glass paste 40 welds the glass substrate 10 to the cover glass 20.
  • the step is specifically:
  • a carbon dioxide laser or other laser is used to adjust the focal length and focal spot size of the laser light emitted therefrom and the laser energy intensity so that the focal spot falls on the glass paste 40.
  • the focal spot of the laser is moved along the glass glue 40 to weld the glass glue 40 to the glass cover 20 and the glass substrate 10.
  • the glass substrate 10 and the glass cover 20 aligned in the vertical direction of the gap may be cut off by using the second gap as a boundary line, thereby Excision to form a package assembly.
  • the edges of the glass substrate 10 and the glass cover 20 after cutting are sharp, the edges thereof are chamfered or ground to improve the quality and safety of use.
  • the invention provides a package assembly and a packaging method thereof, which comprises coating a circle of glass glue 40 on a glass cover 20; coating a frame of outer frame glue on the outside of the glass glue 40, wherein the outer frame glue and the glass glue 40 spacer coating; adding a filling material 30 inside the glass glue 40; bonding the glass substrate 10 to the glass cover 20;
  • the glass paste 40 is irradiated with a laser so that the glass substrate 10 is welded to the glass cover 20 by the glass paste 40.
  • the laser welding of the glass glue 40 forms a sealed space inside the glass glue 40, avoiding the infiltration of oxygen or moisture, and improving the life of the parts disposed on the glass substrate 10 and inside the glass glue 40; the addition of the filling material 30 The mechanical strength of the package group is improved.

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Abstract

一种封装组件及其封装方法，其包括步骤：在玻璃盖板（20）上涂布一圈玻璃胶（40）；在玻璃胶外侧涂布一圈外框胶，其中，外框胶与玻璃胶间隔涂布；在玻璃胶内侧加入填充材料（30）；将玻璃基板贴合于玻璃盖板；使用激光照射玻璃胶，以使得通过玻璃胶将玻璃基板（10）焊接于玻璃盖板。该方法可避免氧气或水汽渗入，提高玻璃胶内零件的寿命。

Description

封装组件及其封装方法 【技术领域】
本发明涉及封装技术领域，特别涉及一种封装方法，以及使用该封装方法封装而成的封装组件。
【背景技术】
在显示技术领域，平板显示技术(至少包括LCD(Liquid Crystal Display，液晶显示器)和OLED(Organic Light-Emitting Diode，有机电激光显示)已经逐步取代CRT(Cathode Ray Tube，阴极射线管)显示器。平面光源技术是新型的光源，其技术研发已经接近市场化量产水平。在平板显示与平面光源技术当中，对于两片平板玻璃的粘结、焊接是一项很重要的技术，其封装效果将直接影响器件的性能。
紫外光对无影胶固化技术是LCD/OLED封装最早采用的技术，其具有如下特点：不用溶剂或少量溶剂，减少了溶剂对环境的污染；耗能少，可低温固化，适用于对热敏感的材料；固化速度快，效率高，可在高速生产线上使用，固化设备占地面积小等。但是，由于无影胶是有机材料，其固化后分子间隙较大，水汽与氧气比较容易透过介质抵达内部密封区域。所以，其比较适合用于对水汽、氧气不太敏感的应用领域，比如LCD。而OLED技术对水汽与氧气比较敏感，使用紫外光对无影胶固化封装技术比较容易透过介质抵达OLED的内部密封区域，影响OLED显示质量。
玻璃胶封装技术是目前正在研发的新型平板玻璃封装技术。它是将玻璃粉配成一定粘度的溶液，涂覆在玻璃基板上，加热除去溶剂，然后与待玻璃基板贴合，利用激光将玻璃粉瞬间烧至融化，从而将两片平板玻璃粘结在一起。玻璃胶封装技术由于是无机封装介质，所以其阻止水汽与氧气的能力很强。特别适合对水汽、氧气敏感的OLED技术。
【发明内容】
本发明提供一种封装组件及其封装方法，以解决现有技术中使用紫外光对无影胶固化封装技术比较容易透过介质抵达OLED的内部密封区域，影响OLED显示质量等技术问题。为解决上述技术问题，本发明采用的一个技术方案是：提供一种玻璃封装方法，其方法包括步骤：提供一玻璃盖板和一玻璃基板；在玻璃盖板上涂布一圈玻璃胶；在玻璃胶外侧涂布一圈外框胶，其中，外框胶与玻璃胶间隔涂布；在玻璃胶内侧涂布一圈内框胶；在内框胶内侧加入填充材料；将对组机台的腔体内充满氮气；将玻璃基板和玻璃盖板置于腔体进行对组，以使得玻璃基板紧贴合于玻璃盖板，以及外框胶以内充满氮气；使用激光照射玻璃胶，以使得通过玻璃胶将玻璃基板焊接于玻璃盖板。
其中，使用激光照射玻璃胶的步骤包括：调整激光器激光照射的参数，以使得激光的焦斑大小与玻璃胶匹配；在玻璃胶上移动焦斑，以将玻璃基板焊接于玻璃盖板。
其中，在玻璃胶上移动焦斑，以将玻璃基板焊接于玻璃盖板的步骤之后包括：将玻璃胶外侧对应的述玻璃基板和玻璃盖板切除；对切除后玻璃基板和玻璃盖板的边缘进行研磨。
其中，使用激光照射玻璃胶的步骤之前包括：使用紫外光照射外胶框，以固化外胶框。
其中，使用激光照射玻璃胶的步骤包括：使用二氧化碳激光器发射激光照射玻璃胶。
为解决上述技术问题，本发明采用的一个技术方案是：提供另一种玻璃封装方法，其包括步骤：提供一玻璃盖板和一玻璃基板；在玻璃盖板上涂布一圈玻璃胶；在玻璃胶外侧涂布一圈外框胶，其中，外框胶与玻璃胶间隔涂布；在玻璃胶内侧加入填充材料；将玻璃基板贴合于玻璃盖板；使用激光照射玻璃胶，以使得通过玻璃基板玻璃胶将焊接于玻璃盖板。
其中，在玻璃胶外侧涂布一圈外框胶的步骤之后包括：在玻璃胶内侧涂布一圈内框胶。
其中，使用激光照射玻璃胶的步骤包括：调整激光器激光照射的参数，以使得激光的焦斑大小与玻璃胶匹配；在玻璃胶上移动焦斑，以将玻璃基板焊接 于玻璃盖板。
其中，将玻璃基板贴合于玻璃盖板的步骤包括：将对组机台的腔体内充满氮气；将玻璃基板和玻璃盖板置于腔体进行对组，以使得玻璃基板贴合于玻璃盖板，以及外框胶以内充满氮气。
其中，在玻璃胶上移动焦斑，以将玻璃基板焊接于玻璃盖板的步骤之后包括：将玻璃胶外侧对应的述玻璃基板和玻璃盖板切除；对切除后玻璃基板和玻璃盖板的边缘进行研磨。
其中，在玻璃胶上移动焦斑，以将玻璃基板焊接于玻璃盖板的步骤之前包括：使用紫外光照射外胶框，以固化外胶框。
其中，在玻璃基板上涂布一圈玻璃胶的步骤之后包括：对玻璃胶进行烘烤。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种封装组件，其包括玻璃基板、玻璃盖板、填充材料以及玻璃胶，玻璃基板贴合于玻璃盖板；填充材料置于玻璃基板与玻璃盖板之间；玻璃胶设于填充材料的外侧，其中，玻璃盖板通过玻璃胶焊接于玻璃基板。
其中，封装组件还包括内框胶和内框胶，内框胶设于玻璃胶与填充材料之间。
其中，玻璃胶与内框胶之间形成一间隙，间隙不小于100微米。
其中，填充材料的化学成份为[R-O-Al＝O]n，其中R为CnH2n+1CO。
其中，玻璃胶的成份包括玻璃粉、无机填充材料以及有机溶剂，其中无机填充材料为五氧化二钒。
其中，玻璃基板、玻璃盖板以及玻璃胶围合形成密闭空间，其中，密闭空间具有氮气。
其中，内框胶为是紫外胶。
其中，内框胶的截面的宽度为0.2～5毫米。
本发明的有益效果是：区别于现有技术的情况，本发明提供了一种封装组件及其封装方法，其包括在玻璃盖板上涂布一圈玻璃胶；在玻璃胶外侧涂布一圈外框胶，其中，外框胶与玻璃胶间隔涂布；在玻璃胶内侧加入填充材料；将 玻璃基板贴合于玻璃盖板；使用激光照射玻璃胶，以使得通过玻璃胶将玻璃基板焊接于玻璃盖板。使用上述方法，玻璃胶的激光焊接使得玻璃胶内部形成密封空间，避免氧气或水汽渗入，提高设于玻璃基板上且圈于玻璃胶内部的零件的寿命；填充材料的加入提高了封装组的机械强度。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本发明一优选实施例的封装组件的截面示意图；
图2是本发明另一优选实施例的封装组件的截面示意图；
图2a是图2中所示的封装组件的玻璃胶和内框胶的仰视结构示意简图；
图3是本发明一优选实施例的玻璃封装方法的流程图；
图4是本发明另一优选实施例的玻璃封装方法的流程图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1是本发明一优选实施例的封装组件的截面示意图。本发明的封装组件包括玻璃基板10、玻璃盖板20、填充材料30玻璃胶40以及有机发光二极管50。玻璃基板10与玻璃盖板20主要由玻璃制成，玻璃基板10贴合于玻璃盖板20；填充材料30置于玻璃基板10与玻璃盖板20之间，有机发光二极管50设于填充材料30内并固定于玻璃基板10，其可以埋藏于填充材料30内部，也可以部分露出于填充材料30，还可以与填充材料30外表面平齐；玻璃胶40设于填充材料30的外侧，其中，玻璃盖板20通过玻璃胶40焊接于玻璃基板10。
具体地，玻璃胶40在玻璃基板10形成一外圈，填充材料30填充于该圈内。当然，填充材料30可以填满该外圈，也可以与该外圈在玻璃基板10表面间隔 设置。值得说明的是，由玻璃基板10、玻璃盖板20以及玻璃胶40围合形成的密闭空间里的气体为氮气，用于以防止外界空气进入外圈的内部。该密闭空间是通过二氧化碳激光器或者其他激光器将玻璃胶40焊接于玻璃基板10与玻璃盖板20之间。
填充材料30为液体干燥剂材料，其具体成份为[R-O-Al＝O]n，其可吸收渗入玻璃胶40内圈中的水份，其中，[R-O-Al＝O]n中的R可以是CnH2n+1CO，[R-O-Al＝O]n与水反应的化学式为：
Figure PCTCN2016074641-appb-000001
请参阅图2，图2是本发明另一优选实施例的封装组件的截面示意图。本实施例与上述实施例大体相同，不同点为本实施例的封装组件还包括内框胶60，内框胶60设于玻璃胶40与填充材料30之间。具体地，内框胶60在玻璃基板10表面形成一内圈，填充材料30填充入内框胶60内，该内框胶60可进一步防止氧气或水汽渗入到填充材料30。
进一步地，玻璃胶40与内框胶60之间形成第一间隙70，间隙不小于100微米。如图2所示，本实施例的内框胶60的截面的宽度为0.2～5毫米。
请一并参阅图2a，图2a是图2中所示的封装组件的玻璃胶和内框胶的仰视结构示意简图，上述的玻璃胶40和内框胶60分别形成的外圈或内圈的形状可以方环形，当然，也可以是圆环形，还可以是其它规则或不规则的形状，玻璃胶40和内框胶60的形状也是不相同，例如，玻璃胶40是方环形，内框胶60是圆环形。内框胶60可以是紫外胶、光学透明胶或其它粘合剂，优选紫外胶。
本发明还提供了一种显示装置，其包括上述的封装组件。
请参阅图3，图3是本发明一优选实施例的玻璃封装方法的流程图。上述简单介绍了封装组件的各部件，现进一步阐述其组装流程，本实施例的玻璃封装方法包括如下步骤：
S10：提供一玻璃盖板20和一玻璃基板10；
具体地，该玻璃基板10表面可形成有多个部件，其中至少具有有机发光二极管50。
S20：在玻璃盖板20上涂布一圈玻璃胶40；
具体地，玻璃胶40主要成份有玻璃粉、无机填充材料以及有机溶剂，无机填充材料主要用于吸收激光能量，其可以为五氧化二钒(V2O5)。玻璃胶40在玻璃盖板20的表面形成一外圈，该有机发光二极管50设于该外圈内。
S30：在玻璃胶40外侧涂布一圈外框胶，其中，外框胶与玻璃胶40间隔涂布；
具体地，玻璃胶40形成于外框胶内，外框胶与玻璃胶40形成一定的间隔，即第二间隙，以便下面步骤中可以有一定的空间将第二间隙以外的外框胶切除，提高切除的精度。该外框胶可以是紫外胶、光学透明胶或其它粘合剂，优选紫外胶。
S40：在玻璃胶40内侧加入填充材料30；
具体地，通过喷墨印刷技术将填充材料30喷入玻璃胶40内，该填充材料30可以填充满玻璃胶40整个圈内，也可以使该填充材料30与玻璃胶40的内边缘形成一定的间隙。本实施例的填充材料30的加入从而可提高封装结构的强度。
S50：将玻璃基板10贴合于玻璃盖板20；
具体地，可使用组机台使玻璃盖板20、玻璃基板10贴合在一起。
S60：使用激光照射玻璃胶40，以使得玻璃胶40将玻璃基板10焊接于玻璃盖板20。
具体地，使用二氧化碳激光器或者其他激光器将玻璃胶40焊接于玻璃基板10与玻璃盖板20之间，从而使得玻璃基板10、玻璃盖板20以及玻璃胶40围合形成密闭空间。
请参阅图4，图4是本发明另一优选实施例的玻璃封装方法的流程图。本实施例与上述实施例在大体相同，具体地，本实施例的玻璃封装方法包括如下步骤：
S10：提供一玻璃盖板20和一玻璃基板10；
具体地，该玻璃基板10表面可形成有多个部件，其中至少具有有机发光二极管50。
S20：在玻璃盖板20上涂布一圈玻璃胶40；
具体地，玻璃胶40主要成份有玻璃粉、无机填充材料以及有机溶剂，无机 填充材料主要用于吸收激光能量，其可以为五氧化二钒(V2O5)。玻璃胶40在玻璃盖板20的表面形成一外圈，该有机发光二极管50形成于该外圈内。
S21：对玻璃胶40进行烘烤。
具体地，将涂布有玻璃胶40的玻璃盖板20置于烤箱中进行烘烤至玻璃胶40完全干燥，其中，该烤箱的温度为300℃～500℃。
S30：在玻璃胶40外侧涂布一圈外框胶，其中，外框胶与玻璃胶40间隔涂布；
具体地，玻璃胶40形成于外框胶内，外框胶与玻璃胶40形成一定的间隔，即第二间隙，以便下面步骤中可以有一定的空间将第二间隙以外的外框胶切除，提高切除的精度。该外框胶可以是紫外胶、光学透明胶或其它粘合剂，优选紫外胶。
S31：在玻璃胶40内侧涂布一圈内框胶60；
具体地，内框胶60在玻璃盖板20形成一内圈，该内圈地与玻璃胶40间隔涂布，内框胶60形成于内圈之内，其中，玻璃胶40与内框胶60形成的第一间隙70的距离不小于100微米。如图2所示，本实施例的内框胶60的截面的宽度为0.2～5毫米。该内框胶60可以是紫外胶、光学透明胶或其它粘合剂，优选紫外胶。
S40：在玻璃胶40内侧加入填充材料30；
具体地，通过喷墨印刷技术将填充材料30喷入内框胶60内，该填充材料30可以填充满内框胶60整个圈内，也可以使该填充材料30与内框胶60的内边缘形成一定的间隙。本实施例的填充材料30的加入从而可提高封装结构的强度。
S50：将玻璃基板10贴合于玻璃盖板20；
具体地，该步骤具体为：
S51：将对组机台的腔体内充满氮气；
S52：将玻璃基板10和玻璃盖板20置于腔体进行对组，以使得玻璃基板10紧贴合于玻璃盖板20，以及外框胶以内充满氮气；
具体地，对组机台工艺参数要进行调整，对组机台最低设定真空度降低(比如，从20000Pa变成1Pa～10Pa)，对组机台设定压力增大(比如，从1kN变成2kN～10kN)，或者同时改变上述两个设定参数。在该参数的真空条件下，依次将上述玻璃盖板20、玻璃基板10置于对组机台的腔体内进行对组，使两块玻璃贴合在一起，以确定相对位置。而最外圈的外框胶与玻璃胶40之间的第二间隙 内部变成一个大气压的氮气密封圈，同样的，玻璃胶40圈内的空隙亦充满氮气，有效地防止空气进入，避免空气中的氧气与有机发光二极管60等零部件发生化学反应，从而提高封装组件的寿命。
S60：使用紫外光照射外胶框，以固化外胶框。
具体地，在外胶框和内框胶60为紫外胶时，需对其进行紫外固化。紫外线是肉眼看不见的，是可见光以外的一段电磁辐射，波长在10～400nm的范围。本实施例中的紫外胶是指必须通过紫外线光照射才能固化的一类胶粘剂，它可以作为粘接剂使用，也可作为油漆、涂料、油墨等的胶料使用。本实施例对紫外胶固化是紫外固化材料中的光引发剂(或光敏剂)在紫外线的照射下吸收紫外光后产生活性自由基或阳离子，引发单体聚合、交联和接支化学反应，使粘合剂在数秒钟内由液态转化为固态，从而使外胶框、内框胶60将玻璃盖板20进一步稳固地粘于玻璃基板10上。
S70：使用激光照射玻璃胶40，以使得玻璃胶40将玻璃基板10焊接于玻璃盖板20。
具体地，该步骤具体为：
S71：调整激光器激光照射的参数，以使得激光的焦斑大小与玻璃胶40匹配；
具体地，使用二氧化碳激光器或者其他激光器，调整其出射的激光的焦距与焦斑大小及激光能量强度，使焦斑刚好落在玻璃胶40上。沿着玻璃胶40移动激光器的焦斑，使玻璃胶40与玻璃盖板20、玻璃基板10焊接在一起。
S72：在玻璃胶40上移动焦斑，以将玻璃基板10焊接于玻璃盖板20。
S80：将外框胶外侧对应的玻璃基板10和玻璃盖板20切除；
具体地，由于外框胶与玻璃间形成有第二间隙，可以以该第二间隙为边界线，对间隙垂直方向上对齐的该玻璃基板10和玻璃盖板20进行切除，从而将外框胶切除，从而形成封装组件。
S90：对切除后玻璃基板10和玻璃盖板20的边缘进行研磨。
具体地，由于切除后的玻璃基板10和玻璃盖板20边缘较锋利，需对其边缘进行倒角或研磨，提高其质量与使用的安全性。
本发明提供的一种封装组件及其封装方法，其包括在玻璃盖板20上涂布一圈玻璃胶40；在玻璃胶40外侧涂布一圈外框胶，其中，外框胶与玻璃胶40间隔涂布；在玻璃胶40内侧加入填充材料30；将玻璃基板10贴合于玻璃盖板20； 使用激光照射玻璃胶40，以使得通过玻璃胶40将玻璃基板10焊接于玻璃盖板20。使用上述的方法，玻璃胶40的激光焊接使得玻璃胶40内部形成密封空间，避免氧气或水汽渗入，提高设于玻璃基板10上且圈于玻璃胶40内部的零件的寿命；填充材料30的加入提高了封装组的机械强度。
需要指出的是，在本发明实施例中如果提到“第一”、“第二”“上”、“下”、“左”、“右”等用语，其仅是根据需要采用的文字符号，在实务中并不限于此，并且文字符号可以互换使用。
以上仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种玻璃封装方法，其中，所述玻璃封装方法包括步骤：
    提供一玻璃盖板和一玻璃基板；
    在所述玻璃盖板上涂布一圈玻璃胶；
    在所述玻璃胶外侧涂布一圈外框胶，其中，所述外框胶与所述玻璃胶间隔涂布；
    在所述玻璃胶内侧涂布一圈内框胶；
    在所述内框胶内侧加入填充材料；
    将对组机台的腔体内充满氮气；
    将所述玻璃基板和所述玻璃盖板置于所述腔体进行对组，以使得所述玻璃基板紧贴合于所述玻璃盖板，以及所述外框胶以内充满氮气；
    使用激光照射所述玻璃胶，以使得通过所述玻璃胶将所述玻璃基板焊接于所述玻璃盖板。
  2. 根据权利要求1所述的玻璃封装方法，其中，所述使用激光照射所述玻璃胶的步骤包括：
    调整激光器激光照射的参数，以使得激光的焦斑大小与所述玻璃胶匹配；
    在所述玻璃胶上移动所述焦斑，以将所述玻璃基板焊接于所述玻璃盖板。
  3. 根据权利要求2所述的玻璃封装方法，其中，所述在所述玻璃胶上移动所述焦斑，以将所述玻璃基板焊接于所述玻璃盖板的步骤之后包括：
    将所述玻璃胶外侧对应的述玻璃基板和所述玻璃盖板切除；
    对切除后所述玻璃基板和所述玻璃盖板的边缘进行研磨。
  4. 根据权利要求1所述的玻璃封装方法，其中，所述使用激光照射所述玻璃胶的步骤之前包括：
    使用紫外光照射所述外胶框，以固化所述外胶框。
  5. 根据权利要求1所述的玻璃封装方法，其中，所述使用激光照射所述玻璃胶的步骤包括：
    使用二氧化碳激光器发射激光照射所述玻璃胶。
  6. 一种玻璃封装方法，其中，所述玻璃封装方法包括步骤：
    提供一玻璃盖板和一玻璃基板；
    在所述玻璃盖板上涂布一圈玻璃胶；
    在所述玻璃胶外侧涂布一圈外框胶，其中，所述外框胶与所述玻璃胶间隔涂布；
    在所述玻璃胶内侧加入填充材料；
    将所述玻璃基板贴合于所述玻璃盖板；
    使用激光照射所述玻璃胶，以使得通过所述玻璃胶将所述玻璃基板焊接于所述玻璃盖板。
  7. 根据权利要求6所述的玻璃封装方法，其中，所述在所述玻璃胶外侧涂布一圈外框胶的步骤之后包括：
    在所述玻璃胶内侧涂布一圈内框胶。
  8. 根据权利要求7所述的玻璃封装方法，其中，所述使用激光照射所述玻璃胶的步骤包括：
    调整激光器激光照射的参数，以使得激光的焦斑大小与所述玻璃胶匹配；
    在所述玻璃胶上移动所述焦斑，以将所述玻璃基板焊接于所述玻璃盖板。
  9. 根据权利要求6所述的玻璃封装方法，其中，所述将所述玻璃基板贴合于所述玻璃盖板的步骤包括：
    将对组机台的腔体内充满氮气；
    将所述玻璃基板和所述玻璃盖板置于所述腔体进行对组，以使得所述玻璃基板紧贴合于所述玻璃盖板，以及所述外框胶以内充满氮气。
  10. 根据权利要求8所述的玻璃封装方法，其中，所述在所述玻璃胶上移动所述焦斑，以将所述玻璃基板焊接于所述玻璃盖板的步骤之后包括：
    将所述玻璃胶外侧对应的述玻璃基板和所述玻璃盖板切除；
    对切除后所述玻璃基板和所述玻璃盖板的边缘进行研磨。
  11. 根据权利要求6所述的玻璃封装方法，其中，所述使用激光照射所述玻璃胶的步骤之前包括：
    使用紫外光照射所述外胶框，以固化所述外胶框。
  12. 根据权利要求8所述的玻璃封装方法，其中，所述在所述玻璃盖板上涂布一圈玻璃胶的步骤之后包括：
    对所述玻璃胶进行烘烤。
  13. 一种封装组件，其中，所述封装组件包括：
    玻璃盖板；
    玻璃基板，贴合于所述玻璃盖板；
    填充材料，置于所述玻璃基板与所述玻璃盖板之间；
    玻璃胶，设于所述填充材料的外侧，其中，所述玻璃盖板通过所述玻璃胶焊接于所述玻璃基板。
  14. 根据权利要求13所述的封装组件，其中，所述封装组件还包括内框胶，所述内框胶设于所述玻璃胶与所述填充材料之间。
  15. 根据权利要求14所述的封装组件，其中，所述玻璃胶与所述内框胶之间形成一间隙，所述间隙不小于100微米。
  16. 根据权利要求13所述的玻璃封装方法，其中，所述填充材料的化学成份为[R-O-Al＝O]n，其中所述R为CnH2n+1CO。
  17. 根据权利要求13所述的玻璃封装方法，其中，所述玻璃胶的成份包括玻璃粉、无机填充材料以及有机溶剂，其中所述无机填充材料为五氧化二钒。
  18. 根据权利要求13所述的玻璃封装方法，其中，所述玻璃基板、所述玻璃盖板以及所述玻璃胶围合形成密闭空间，其中，所述密闭空间具有氮气。
  19. 根据权利要求14所述的玻璃封装方法，其中，所述内框胶为是紫外胶。
  20. 根据权利要求14所述的玻璃封装方法，其中，所述内框胶的截面的宽度为0.2～5毫米。
PCT/CN2016/074641 2016-01-29 2016-02-26 封装组件及其封装方法 Ceased WO2017128475A1 (zh)

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