WO2017107875A1

WO2017107875A1 - Led chip capable of preventing movement during mounting

Info

Publication number: WO2017107875A1
Application number: PCT/CN2016/110566
Authority: WO
Inventors: 张威威
Original assignee: 张威威
Priority date: 2015-12-25
Filing date: 2016-12-17
Publication date: 2017-06-29
Also published as: CN205452262U

Abstract

Disclosed is an LED chip capable of preventing movement during mounting, comprising a memory chip body (1) fabricated by grinding, wherein electronic elements and pins are welded onto the front side of the memory chip body (1), an adhesive layer (2) is arranged on the back side of the memory chip body (1), and a plurality of horizontal fibre membrane strips (3) and longitudinal fibre membrane strips (4) are bonded onto a lower surface of the adhesive layer (2), with equal distances between adjacent horizontal fibre membrane strips (3) and equal distances between adjacent longitudinal fibre membrane strips (4). The fibre membrane strips can increase friction, thus preventing the chip from moving during mounting and affecting the mounting precision of the chip.

Description

An LED chip capable of preventing movement during installation

Technical field

The utility model belongs to the field of mobile storage technologies, and in particular relates to a chip for mobile storage.

Background technique

The chip generally refers to the carrier of the integrated circuit, and is also the result of the integrated circuit after being designed, manufactured, packaged, and tested. It is usually an independent whole that can be used immediately. The chip also has its own unique place. In a broad sense, as long as it is a semiconductor wafer manufactured by microfabrication, it can be called a chip, and there is no circuit inside. For example, a semiconductor light source chip; for example, a mechanical chip such as a MEMS gyroscope; or a biochip such as a DNA chip. In communication and information technology, when the range is limited to silicon integrated circuits, the intersection of the chip and the integrated circuit is on the "circuit on the silicon wafer." According to the "LED chip" disclosed in Chinese Patent Application No. 201420163608.1, a white film layer is mainly disposed on the back surface of the LED chip. The disadvantage of such an LED chip is that since the lower surface of the white film layer is smooth, slippage is liable to occur during chip mounting.

Utility model content

In order to overcome the deficiencies in the prior art, the present invention provides an LED chip capable of preventing movement during installation.

The utility model is realized by the following technical solutions:

An LED chip capable of preventing movement during installation, comprising a memory chip body obtained by grinding, electronic components and pins are soldered on a front surface of the memory chip body, and adhesive is disposed on a back surface of the memory chip body a layer, a plurality of transverse fiber membrane strips and longitudinal fiber membrane strips are bonded to the lower surface of the adhesive layer, and the distance between adjacent two transverse fiber membrane strips is equal, and two adjacent longitudinal fiber membranes The distances of the bars are equal.

As a preferred technical solution of the present invention, the thickness of the memory chip body after polishing is 100 μm-120 μm.

As a preferred technical solution of the present invention, the transverse fiber membrane strip and the longitudinal fiber membrane strip have the same thickness, both of which are from 90 μm to 100 μm.

As a preferred technical solution of the present invention, the transverse fiber membrane strip and the longitudinal fiber membrane strip have the same width.

As a preferred technical solution of the present invention, the transverse fiber membrane strips are four, and the longitudinal fiber membrane strips are two.

Compared with the prior art, the utility model has the advantages that the utility model has the advantages of simple structure and reasonable design. In the processing, the chip is first ground to a thickness of 120 μm by using a grinder, and polished, and then the memory chip body is wiped. The back side so as not to affect the adhesion of the adhesive layer. The front surface of the memory chip body is placed on the surface of the ceramic heating plate at a temperature of 90 ° C for a heating time of less than 2 minutes, and then the transverse fiber film strip and the longitudinal fiber film strip are bonded to the adhesive layer, which can increase Friction can prevent the chip from moving during installation and affect the mounting accuracy of the memory chip.

DRAWINGS

Figure 1 is a schematic view of the structure of the present invention.

detailed description

In order to make the objects, technical solutions and advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Please refer to FIG. 1. FIG. 1 is a schematic structural view of the present invention.

The LED chip capable of preventing movement during installation, including grinding and storage The memory chip body 1 has electronic components and leads soldered to the front surface of the memory chip body 1, and the thickness of the memory chip body 1 after polishing is 100 μm to 120 μm.

An adhesive layer 2 is disposed on the back surface of the memory chip body 1, and a plurality of transverse fiber film strips 3 and longitudinal fiber film strips 4 are bonded to the lower surface of the adhesive layer 2, and two adjacent transverse fibers are bonded. The distance between the strips 3 is equal and the distance between the adjacent two longitudinal fiber strips 4 is equal. The transverse fiber membrane strips 3 and the longitudinal fiber membrane strips 4 have the same thickness, both of which are from 90 μm to 100 μm, and the transverse fibrous membrane strips 3 and the longitudinal fibrous membrane strips 4 have the same width, both of which are from 90 μm to 100 μm.

In the present embodiment, the transverse fiber membrane strips 3 are four, and the longitudinal fiber membrane strips 4 are two.

At the time of processing, the chip was first ground to a thickness of 120 μm using a grinder, and polished, and then the back surface of the memory chip body was wiped to avoid affecting the viscosity of the adhesive layer. The front surface of the memory chip body is placed on the surface of the ceramic heating plate at a temperature of 90 ° C for a heating time of less than 2 minutes, and then the transverse fiber film strip and the longitudinal fiber film strip are bonded to the adhesive layer, which can increase Friction can prevent the chip from moving during installation and affect the mounting accuracy of the memory chip.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the present invention. The scope of protection of utility models.

Claims

An LED chip capable of preventing movement during installation, comprising a memory chip body (1) obtained by grinding, and an electronic component and a pin are soldered on a front surface of the memory chip body (1), characterized in that: An adhesive layer (2) is disposed on a back surface of the memory chip body (1), and a plurality of transverse fiber film strips (3) and longitudinal fiber film strips (4) are bonded to a lower surface of the adhesive layer (2). And the distance between the adjacent two transverse fiber membrane strips (3) is equal, and the distance between the adjacent two longitudinal fiber membrane strips (4) is equal.
An LED chip capable of preventing movement during mounting according to claim 1, wherein the thickness of the memory chip body (1) after polishing is from 100 μm to 120 μm.
An LED chip capable of preventing movement during mounting according to claim 1, wherein the transverse fiber membrane strip (3) and the longitudinal fiber membrane strip (4) have the same thickness, each of 90 μm - 100 μm .
An LED chip capable of preventing movement during mounting according to claim 3, characterized in that the transverse fiber membrane strip (3) and the longitudinal fiber membrane strip (4) have the same width.
An LED chip capable of preventing movement during mounting according to claim 4, characterized in that the transverse fiber membrane strips (3) are four and the longitudinal fiber membrane strips (4) are two.