CN205028892U

CN205028892U - Memory chip

Info

Publication number: CN205028892U
Application number: CN201520805005.1U
Authority: CN
Inventors: 肖辉强
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-10-19
Filing date: 2015-10-19
Publication date: 2016-02-10
Anticipated expiration: 2025-10-19

Abstract

The utility model relates to a memory chip, include and grind the memory chip body that makes the front welding of memory chip body has electronic components, pin, the back of memory chip body is provided with the mucigel the below of mucigel is provided with the fibre thin layer, just regular pit distributes on the surface of fibre thin layer, pit distribution area accounts for the 40% -60% of the surface area of fibre thin layer. Through being provided with fibre thin layer and mucigel, can prevent that the chip is impaired among the process of lapping breaks, improves the life of yields and chip, and through the regular pit of outer surface machining at the fibre thin layer, increase frictional force can prevent that the fibre thin layer from taking place the removal when the installation, influence memory chip's installation accuracy.

Description

A kind of storage chip

Technical field

the utility model belongs to mobile storage technical field, particularly relates to a kind of storage chip.

Background technology

chip generally refers to the carrier of integrated circuit, is also the result of integrated circuit after design, manufacture, encapsulation, test, normally can use immediately independently overall.Chip also has the place of its uniqueness, and broadly, as long as use the produced semiconductor slice, thin piece of microfabrication means, can be called chip, might not there be circuit the inside.Such as semiconductor light source chips; Such as mechanical chip, as MEMS gyro instrument; Or biochip is as DNA chip.In communication and information technology, when limit to silicon integrated circuit time, the common factor of chip and integrated circuit is exactly on " circuit on silicon wafer ".

as everyone knows, along with the development of integrated circuit, the size of storage chip of the prior art is more and more less, breaks by commitment positions for the ease of follow-up sliver technique chips, and chip thickness needs to be reduced by grinding.After thickness reduces easily there is fragmentation problem in chip, reduces the yields of chip, greatly reduce the useful life of chip.

Utility model content

the utility model, in order to overcome deficiency of the prior art, provides a kind of storage chip, by being provided with fiber thin rete and mucigel in the side of storage chip, can prevent that process of lapping chips is impaired breaks, and improves the useful life of yields and chip.

the utility model is achieved through the following technical solutions:

a kind of storage chip, comprise the storage chip body that grinding is obtained, electronic devices and components, pin is connected at the face bonding of described storage chip body, the back side of described storage chip body is provided with mucigel, the below of described mucigel is provided with fiber thin rete, and well-regulated pit that the outer surface of described fiber thin rete distributes, described pit distribution area accounts for the 40%-60% of the surface area of fiber thin rete.

further, the thickness after described storage chip body grinding is 100 μm-120 μm, and the thickness of described fiber thin rete is 90 μm-100 μm.

further, the shape of described pit is circular or regular polygon, and the degree of depth of pit is 35 μm-50 μm.

further, the thickness of described mucigel is 40 μm-50 μm.

further, the length of described storage chip body, mucigel and fiber thin rete is identical with width.

adding man-hour, first using grinder chip to be ground to thickness is 120 μm, and carry out polishing, then the back side of wiping storage chip body, in order to avoid affect the viscosity of mucigel, then the front of storage chip body is placed in ceramic heating plate to heat on the surface, then mucigel is bonded in the back side of storage chip body, then fiber thin rete is bonded in the lower surface of mucigel, alveolately can not exist between fiber thin rete and mucigel, finally process well-regulated pit at the outer surface of fiber thin rete.

compared with prior art, the beneficial effects of the utility model are: the utility model structure is simple, reasonable in design, by being provided with fiber thin rete and mucigel, can prevent that process of lapping chips is impaired breaks, improve the useful life of yields and chip, by processing well-regulated pit at the outer surface of fiber thin rete, increasing friction force, fiber thin rete can be prevented to be moved when mounted, to affect the installation accuracy of storage chip.

Accompanying drawing explanation

fig. 1 is structural representation of the present utility model;

fig. 2 is the structural representation of the utility model fiber thin rete.

Embodiment

in order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.

refer to Fig. 1 and Fig. 2, Fig. 1 is structural representation of the present utility model, and Fig. 2 is the structural representation of the utility model fiber thin rete.

described a kind of storage chip, comprise the storage chip body 1 that grinding is obtained, electronic devices and components 2, pin 3 is connected at the face bonding of described storage chip body 1, the back side of described storage chip body 1 is provided with mucigel 4, the below of described mucigel 4 is provided with fiber thin rete 5, and the length of described storage chip body 1, mucigel 4 and fiber thin rete 5 is identical with width.Thickness after described storage chip body 1 grinds is 100 μm-120 μm, the thickness of described mucigel 4 is 40 μm-50 μm, the thickness of described fiber thin rete 5 is 90 μm-100 μm, and the shape of described pit 6 is circular or regular polygon, and the degree of depth of pit 6 is 35 μm-50 μm.By being provided with fiber thin rete and mucigel, can prevent that process of lapping chips is impaired breaks, improving the useful life of yields and chip.

the outer surface of described fiber thin rete 5 distributes well-regulated pit 6, and described pit 6 distribution area accounts for the 40%-60% of the surface area of fiber thin rete 5.By processing well-regulated pit 6 at the outer surface of fiber thin rete 5, increasing friction force, fiber thin rete 5 can be prevented to be moved when mounted, to affect the installation accuracy of storage chip.

the foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.

Claims

1. a storage chip, comprise the storage chip body (1) that grinding is obtained, electronic devices and components (2), pin (3) is connected at the face bonding of described storage chip body (1), it is characterized in that: the back side of described storage chip body (1) is provided with mucigel (4), the below of described mucigel (4) is provided with fiber thin rete (5), and well-regulated pit (6) that the outer surface of described fiber thin rete (5) distributes, described pit (6) distribution area accounts for the 40%-60% of the surface area of fiber thin rete (5).

2. a kind of storage chip according to claim 1, is characterized in that: the thickness after described storage chip body (1) grinding is 100 μm-120 μm, and the thickness of described fiber thin rete (5) is 90 μm-100 μm.

3. a kind of storage chip according to claim 2, is characterized in that: the shape of described pit (6) is circular or regular polygon, and the degree of depth of pit (6) is 35 μm-50 μm.

4. a kind of storage chip according to claim 2, is characterized in that: the thickness of described mucigel (4) is 40 μm-50 μm.

5. a kind of storage chip according to claim 1 or 3, is characterized in that: the length of described storage chip body (1), mucigel (4) and fiber thin rete (5) is identical with width.