Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
  • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
  • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
  • B03B—SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
  • B03B9/00—General arrangement of separating plant, e.g. flow sheets
  • B03B9/06—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
  • B03B9/061—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse the refuse being industrial
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/17—Post-manufacturing processes
  • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
  • Y02W30/00—Technologies for solid waste management
  • Y02W30/50—Reuse, recycling or recovery technologies
  • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

• the present invention relates to a method, process and a system for salvaging the recyclable and reusable components of electronic waste. More particularly, it relates to a method for salvaging the recyclable and reusable parts of E-Waste.
• the proposed invention minimizes E-waste by re-processing and enhancing re-usability.
• E-waste management is an important requirement for ecologically sustainable development in many countries.
• E-waste comprises of the components that can either be reused or recycled as per their functional state. Taking out such functional components from e-waste for the purpose of reuse and recycling might be employed as an effective waste management and skilled approach. The economic value of waste is best realized when it is segregated.
• E-waste Despite of the malfunctioned nature of E-waste, it comprises embedded components that can independently perform their inherent functions. Therefore, safe removal/segregation thereof can serve as a cost effective approach by making them available for reuse purpose. Such an approach can be termed as a salvage process for the functional, recyclable, and reusable components.
• a salvage process may include a single step or comprises of a series of unit operations and that need to accomplish by retaining full functionality of components or parts. Salvaging requires safe removal of embedded components that are properly fixed on the devices or boards to perform a specific function. Sometimes, salvage process become a complex task, due to such tight bonding of such parts to their corresponding parent part(s) or devices, assemblies and the like depending upon the type of e-waste.
• U.S. Pat. No. 3,557,430 shows an apparatus for removing a component from a substrate to which it has been soldered utilizing a concentrated source of heat encompassing the solder connections.
• the substrate is located approximate to the heat source and a tension device is secured to the component and removes the component when the solder connections are exposed to the heat source.
• U.S. Pat. No. 3,684,151 disclosing a soldering machine for removing IC's from printed circuit boards.
• the apparatus includes a closed bath of molten solder having a passage leading from the bath.
• the printed circuit board is secured in a positioning frame at the open end of the passage and guided by a template so that the circuit element has the soldered leads positioned over the opening.
• a plunger displaces a portion of the solder and the molten solder level in the passage rises to contact the leads to facilitate removal of the leads.
• CN101444784A discloses a method and a device for high-efficiency recovery of waste circuit boards in a vacuum.
• the waste circuit board is arranged in a vacuum vessel and heated for pyrolysis, wherein, most of the pyrolysis volatile matter is cooled and liquefied into liquid oil, and the rest is taken into a gas collector; a centrifuge device separates soldering tin from the circuit board during the pyrolysis; substrates and electronic components of the paralyzed circuit board are assorted and collected to be further separated and recovered.
• the main disadvantage of this method is that the heating involved in the pyrolysis process might affect the functionality of working components even pyrolysis take place under vacuum condition.
• the main object of the present invention is to provide an effective method, process and a system for salvaging functional components of E-wastes.
• Yet another object of the present invention is to provide a salvaging method and a process that segregates all the functional components embedded in the e-waste without hampering their functionality and physical endurance.
• Yet another object of the present invention is to provide a salvaging approach that rescue sensitive parts from high temperatures and prevent damage of the components due to high temperatures.
• Yet another object of the present invention is to provide a system for salvaging functional components from e-waste.
• the present invention relates to a method and a process for salvaging the functional components from e-waste.
• the method involves plurality of component spot quality checks for identifying candidate(s) for salvage process. These checks also identify components requiring mechanical repair (MR), electrical repair (ER) and Solder with iron &
• the component(s) in good working condition is disassembled from the waste product using an appropriate segregation means depending on the nature of fixing and the type of embedded component(s). If required, the components are cleaned and demagnetized using an ionized air gun or any deionization means. The components removed are segregated, labelled and stored in separate ESD safe bags/containers wherein they are again checked for functionality. The parts in good working condition are cleaned and laminated to avoid scratches.
• FIG. 1 is a basic process flow diagram elucidating the general steps in salvaging process of electrical and mechanical parts of an e-waste according to an embodiment of the present invention.
• FIG. 2 is a process flow diagram elucidating the general steps in salvaging process of surface mount parts of an e-waste according to an embodiment of the present invention.
• FIG. 1 is a process flow diagram elucidating the general steps involved in the salvage process of electrical and mechanical parts according to an embodiment of the present invention.
• the waste material is received and sent for an initial level of spot quality check wherein the waste materials like mother-boards, printed circuit boards, integrated circuit and the like go through a visual check for determining physical appearance and integrity of the components.
• the parts are then sent for micro level screenings to evaluate quality of small sized embedded components. Once functional parts are identified, they are removed from the e-waste for execution of further steps of salvage process.
• the removed components are cleaned, demagnetized with the help of ionized air gun.
• the parts are then segregated to collect similar parts, followed by labelling and storing them into the ESD safe bags/containers.
• a process flow elucidating salvaging of surface mount components from the e-waste The parts like mother boards, printed circuit boards, integrated circuits wherein the components are mounted or placed directly onto the surface are collected and placed in an oven or in any means wherein the baking of parts can take place. Parts are removed from the baking environment after a predetermined period of time depending upon the nature of the part to be baked. A typical part comprising a circuit board is placed for 1-2 hours at 240°C. Once, the parts are baked, the functional components mounted on the surface are removed, cleaned and stored in ESD safe storage bags/containers. The parts so obtained are then dispatched for reuse purpose.
• the method conveys all the components for various checks to determine components in good working condition, said checks may include several tests that can be executed by any suitable testing means depending upon the type of the component and thereby provide an approach to separate functional components from non functional one.
• the method of salvaging the electrical and mechanical components from e-waste of the present invention basically comprises steps of collection, visual inspection, micro level inspection of e-waste followed by extraction of functional components.
• the extracted components are cleaned and thereafter demagnetized with the help of any demagnetizing means preferably ionized air gun.
• the components are subjected to segregation to collect components of the same type and labelled.
• the labelled components are stored in separate ESD safe bags/containers followed by their dispatch for reuse purpose.
• a method to salvage the surface mount parts is provided.
• the method comprises steps of collecting e-waste like waste motherboards, printed circuit boards, integrated circuits and the like.
• the boards are exposed to a baking environment up to a temperature required for bake the embedded components.
• the functional surface mount components can be extracted thereafter the baking process is done or when the baking temperature is reached at the solder joints.
• the extracted surface mount components are then cleaned, segregated to get components of similar fashion and labelled followed by their storage in separate ESD safe bags/containers. The components are then dispatched for reuse.
• the present invention provides a system for salvaging the functional component(s) from e-waste, the system comprising: a testing zone to receive a batch of e-waste substrate/device containing functional component(s); an inspection zone to scrutinize said e-waste substrate/device to identify the functional components; a means for demagnetization of the functional components; a means for baking circuit boards of substrate/device; a means to remove the surface mount components from baked circuit boards under a fume controlled environment; a cleaning zone to clean the rust and corrosion from the components; and a means for further processing of said functional component(s) to render them as a suitable candidate for reuse purpose; the testing zone comprises a testing bench provided for conducting various scrutiny checks on the components.
• the components are sent to the inspection zone that comprises a visual inspection region to determine the physical appearance and integrity of the components and a micro-level inspection region for a micro level scrutiny of the components in order to identify the functional components from the batch; the functional components are separated, demagnetized, and stored into electrostatic discharge safe bags; the circuit boards are exposed to a baking environment at a temperature ranges from 230- 260 °C for atleast 2-3 hours to salvage surface mount components.
• the proposed invention provides a fume free salvage method and system thereof to minimize the electronic waste by re-processing and enhancing its re-usability.

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• Engineering & Computer Science (AREA)
• Environmental & Geological Engineering (AREA)
• Processing Of Solid Wastes (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=59055892

Family Applications (1)

Country Status (2)

Cited By (1)

Citations (3)

• 2016
  • 2016-12-19 WO PCT/IB2016/057774 patent/WO2017103902A1/en active Application Filing
  • 2016-12-19 TW TW105142046A patent/TW201726286A/zh unknown

Patent Citations (3)

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