WO2017099205A1 - Recovery device and cleaning device - Google Patents

Recovery device and cleaning device Download PDF

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Publication number
WO2017099205A1
WO2017099205A1 PCT/JP2016/086660 JP2016086660W WO2017099205A1 WO 2017099205 A1 WO2017099205 A1 WO 2017099205A1 JP 2016086660 W JP2016086660 W JP 2016086660W WO 2017099205 A1 WO2017099205 A1 WO 2017099205A1
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Prior art keywords
filter plate
metal sludge
processing liquid
liquid
processing
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PCT/JP2016/086660
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French (fr)
Japanese (ja)
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正広 斉藤
研一 中澤
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株式会社ダルトン
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F11/00—Treatment of sludge; Devices therefor
    • C02F11/12—Treatment of sludge; Devices therefor by de-watering, drying or thickening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03B—SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
    • B03B5/00—Washing granular, powdered or lumpy materials; Wet separating

Definitions

  • the present invention relates to a technique for separating and recovering metal sludge peeled from a semiconductor substrate and contained in the processing liquid.
  • a lift-off method is known as a method for producing a metal thin film pattern on a semiconductor substrate.
  • a resist pattern is formed on a semiconductor substrate, a metal thin film is further formed thereon, and then a resist (hereinafter referred to as “metal sludge”) on which the metal thin film is mounted is peeled off from the semiconductor substrate.
  • metal sludge a resist on which the metal thin film is mounted is peeled off from the semiconductor substrate. It is a method of producing a metal thin film pattern by removing.
  • a batch process having a higher processing capacity than the single wafer process is preferably used.
  • This batch process is a technology that removes metal sludge by spraying a treatment liquid after immersing a plurality of semiconductor substrates housed in a cassette in a peeling tank and swelling the resist with ultrasonic waves as necessary. Yes (see, for example, Patent Document 1).
  • the present invention has been made to solve the above problems, and even when a larger amount of metal sludge is contained in the treatment liquid than in the past, the metal sludge is preferably separated and recovered from the treatment liquid.
  • An object of the present invention is to provide a recovery device that can perform the cleaning and a cleaning device including the same.
  • the invention described in claim 1 is a recovery device for separating and recovering metal sludge contained in the processing liquid from the processing liquid, At least one plate-like filter plate having a plurality of slits and being provided so that one end is located below the discharge port of the processing liquid; Provided below the other end of the filter plate, and a collection basket for collecting metal sludge, With The filter plate is inclined at a predetermined inclination angle so as to gradually be positioned downward from one end to the other end. Each of the plurality of slits is formed in a shape that expands downward.
  • Invention of Claim 2 is the collection
  • Each of the plurality of slits is formed so as to extend along a direction orthogonal to a direction from one end portion to the other end portion of the filter plate.
  • Invention of Claim 3 is the collection
  • the inclination angle ⁇ of the filter plate is in a range of 0 ° ⁇ ⁇ 20 °.
  • the invention according to claim 4 is the recovery apparatus according to any one of claims 1 to 3,
  • the filter plate is supported so that the inclination angle can be changed.
  • the invention according to claim 5 is a cleaning device, A treatment tank for cleaning the semiconductor substrate with a treatment liquid to remove metal sludge;
  • the recovery apparatus according to any one of claims 1 to 4, wherein metal sludge is separated and recovered from the processing liquid discharged from the processing tank; It is characterized by providing.
  • At least one filter plate having a plurality of slits moves from one end located below the treatment liquid discharge port toward the other end where the collection basket is installed. It is inclined so as to be positioned downward gradually. As a result, the processing liquid that has fallen on one end of the filter plate is transferred to the other end along the inclination of the filter plate, leaving the metal sludge on the filter plate, and a plurality of processing liquids from which the metal sludge has been separated. Falls downward from the slit. That is, metal sludge is separated.
  • the metal sludge remaining on the filter plate gradually rises as it falls to the other end side, and functions as a bank to dam the treatment liquid flowing from one end side, so that the treatment liquid is collected in the collection basket. And the separation of metal sludge from the treatment liquid is promoted. Furthermore, since each slit of the filter plate is formed in a shape that expands downward, the processing liquid can be dropped downward while suitably leaving the metal sludge on the filter plate. Therefore, even when a large amount of metal sludge is contained in the treatment liquid as compared with the conventional case, the metal sludge can be suitably separated from the treatment liquid and recovered.
  • each slit of a filter board is extended along the direction orthogonal to the direction (namely, direction in which a process liquid flows) which goes to the other end part from the one end part of the said filter board. It is formed as follows. Therefore, it is possible to suppress the metal sludge from falling from the slit, and more preferably to drop the treatment liquid downward while leaving the metal sludge on the filter plate, thereby separating the metal sludge from the treatment liquid.
  • the filter plate since the filter plate is supported so that the inclination angle thereof can be changed, a higher processing capacity can be obtained depending on, for example, the slit width and pitch of the slit, the flow rate of the processing liquid, and the like. Can be adjusted to an optimum inclination angle that can be obtained.
  • FIG. 1 It is a block diagram which shows schematic structure of a washing
  • FIG. 1 is a block diagram showing a schematic configuration of the cleaning apparatus 1.
  • the cleaning apparatus 1 cleans a semiconductor substrate B for forming a metal thin film pattern by a lift-off method with a processing solution of an organic solvent, and a resist (hereinafter referred to as “metal sludge”) on which a metal thin film is placed from the semiconductor substrate B. Is peeled and removed.
  • the processing tank 2, the recovery device 3, the circulation pump 4, and the two filters 5 and 6 are connected by piping in this order, and the piping from the filter 6 is further connected to the processing tank. 2 is connected to a portion below the liquid surface of the processing liquid, so that the processing liquid circulates.
  • the processing tank 2 batch processing for simultaneously cleaning a large number of semiconductor substrates B (only one is shown in FIG. 1) accommodated in the cassette C is performed. Specifically, in the treatment tank 2, the resist on the semiconductor substrate B is swollen by applying ultrasonic vibration to the treatment liquid in which the semiconductor substrate B is immersed as necessary, and then the treatment liquid is directed toward the semiconductor substrate B. The metal sludge is peeled off and removed from the surface of the semiconductor substrate B. The removed metal sludge is discharged from the treatment tank 2 together with the treatment liquid. Further, the processing tank 2 of the present embodiment is provided with an overflow tank 21 for containing the overflowing processing liquid, and a pipe for discharging the processing liquid from the overflow tank 21 is provided from the processing tank 2 to the recovery device 3. It is connected to the piping going to.
  • the metal sludge in the liquid is separated and recovered from the processing liquid discharged from the processing tank 2 by the recovery device 3. Then, after the processing liquid discharged from the recovery device 3 is pressurized by the circulation pump 4, the metal sludge is almost completely removed through the two filters 5 and 6, and then returns to the processing tank 2. ing.
  • a processing solution of 20 to 40 l / min circulates.
  • the filter 5 is a centrifugal filter, and collects metal sludge that could not be recovered by the recovery device 3.
  • the filter 6 is a mesh type filter, and can remove the metal sludge almost completely from the processing liquid.
  • the metal sludge is collected in three stages, such as the large metal sludge is collected by the recovery device 3, the small one is the filter 5, and the smaller one is the filter 6.
  • the pipe from the filter 6 is located below the cassette C in the processing tank 2, and the processing liquid is circulated into the processing tank 2 from the lower side of the semiconductor substrate B.
  • floating substances such as metal sludge floating near the liquid surface of the processing liquid are caused to flow into the overflow tank 21.
  • precipitation and discharge can be performed, and reattachment of the floating substance to the semiconductor substrate can be prevented.
  • FIG. 2 is a side sectional view showing the internal structure of the recovery device 3
  • FIG. 3 is an enlarged view of a portion A in FIG.
  • the following configuration is for more specifically describing the present invention. The present invention is not limited to these embodiments.
  • recovery apparatus 3 is provided with the housing 31 which accommodated each component inside.
  • piping from the processing tank 2 is communicated with the interior of the casing 31, and the periphery of the opening is covered with a rectangular box-shaped discharge section 32.
  • the discharge unit 32 has a discharge port 32a that opens downward, and discharges the processing liquid discharged from the processing tank 2 downward from the discharge port 32a.
  • the bottom plate of the casing 31 is formed in a funnel shape, and has a discharge port 31 a for discharging the processing liquid toward the circulation pump 4 at the center thereof.
  • an opening 31b through which each component inside the housing 31 can be taken out is formed on the upper plate portion of the other end side (right side in FIG. 2) of the housing 31, and this opening 31b can be opened and closed. Blocked by the portion 33.
  • the direction of the other end side (right side of FIG. 2) of the casing 31 is described as “front”, and the direction of one end side (left side of FIG. 2) is described as “rear”. To do.
  • a filter plate 34 Inside the housing 31, a filter plate 34, a first collection basket 35, a second collection basket 36, and a tank net 37 are accommodated.
  • the filter plate 34 is for separating most of the metal sludge from the processing liquid, is formed in a substantially flat plate shape, and is disposed immediately below the discharge portion 32. More specifically, the filter plate 34 is in a state where the discharge port 32a of the discharge unit 32 is located above the rear end portion thereof, and is inclined so as to be gradually positioned downward from the rear end portion toward the front end portion. Has been placed.
  • the inclination angle ⁇ (see FIG. 3) of the filter plate 34 is preferably in the range of 0 ° ⁇ ⁇ 20 °, more preferably in the range of 2 ° ⁇ ⁇ 15 °, and 4 °. More preferably, it is within the range of ⁇ ⁇ ⁇ 10 °.
  • the rear end of the filter plate 34 is supported by a support member 38 having a variable height so that the inclination angle ⁇ can be adjusted.
  • the filter plate 34 is formed with a plurality of slits 34a arranged in the front-rear direction over substantially the entire surface.
  • Each slit 34a extends linearly along a left-right direction (a direction perpendicular to the plane of FIG. 3) perpendicular to the front-rear direction.
  • the slit width W of each slit 34a is preferably 200 ⁇ m or less, more preferably 150 ⁇ m or less, and even more preferably 70 ⁇ m or less.
  • the slit width W should correspond to, for example, the size of the metal sludge.
  • Each slit 34a passes through the filter plate 34 so as to expand downward, and a spatial cross section orthogonal to the extending direction is formed in an isosceles trapezoidal shape.
  • each slit 34a should just be formed in the shape which spreads toward the lower side, and does not need to be a trapezoid shape in a cross section.
  • the first collection basket 35 is for collecting metal sludge separated from the processing liquid by the filter plate 34.
  • the first collection basket 35 is a cage member having a mesh shape (200 mesh in the present embodiment) as a whole, and is disposed below the front end portion of the filter plate 34. More specifically, the first collection basket 35 is disposed so that the front end of the filter plate 34 extends to a position slightly closer to the rear side while overlapping the rear end thereof vertically with the front end of the filter plate 34. Has been. Further, the first collection basket 35 is supported so as to be removable after being moved backward and shifted from the lower side of the filter plate 34, and can be taken out from the opening 31 b above the housing 31 after being removed.
  • the second collection basket 36 and the tank net 37 are for further collecting the remainder of the metal sludge contained in the processing liquid that has passed through the filter plate 34 and the first collection basket 35, and more than the first collection basket 35. It is arranged in this order on the lower side.
  • the second collection basket 36 is a slightly shallow cage member having a mesh shape (200 mesh in this embodiment) as a whole, and below the entire filter plate 34 and the rear half of the first collection basket 35. It is arranged to cover.
  • the tank net 37 is a large cage member having a mesh shape (300 mesh in the present embodiment) as a whole, and covers the lower part of the filter plate 34 and the first collection basket 35 so as to cover the lowermost part of the casing 31. Located at the bottom.
  • the recovery device 3 in the present embodiment separates and recovers metal sludge containing a metal thin film and resist discharged together with the processing liquid during the manufacturing process of the semiconductor substrate B by the lift-off method from the processing liquid. Specifically, as shown in FIG. 4A, when the processing liquid L0 containing the metal sludge M is discharged from the processing tank 2, the processing liquid L0 is discharged from the discharge port 32a of the discharge unit 32 in the recovery device 3. Is discharged downward and falls onto the rear end portion of the upper end of the filter plate 34 located below.
  • the treatment liquid L0 that has fallen on the filter plate 34 travels forward on the filter plate 34 along the inclination of the filter plate 34 while leaving the metal sludge M on the filter plate 34, and the metal sludge M is separated.
  • the processing liquid L1 falls downward from the plurality of slits 34a.
  • each slit 34a of the filter plate 34 is formed in a shape that expands downward, the processing liquid L1 can be dropped downward while preferably leaving the metal sludge M on the filter plate 34.
  • each slit 34a extends along the left-right direction orthogonal to the front-rear direction, that is, extends along the direction orthogonal to the direction in which the processing liquid L0 flows on the filter plate 34.
  • the sludge M can be prevented from falling from the slit 34a, and the processing liquid L1 can be dropped downward while leaving the metal sludge M on the filter plate 34 more preferably.
  • the metal sludge M separated from the treatment liquid L0 by the filter plate 34 gradually accumulates while flowing forward on the filter plate 34 along the inclination of the filter plate 34. Then, as shown in FIG. 4B, it finally falls from the front end portion of the filter plate 34 into the first collection basket 35. At this time, the metal sludge M deposited on the front end portion of the filter plate 34 functions as a bank for damming the processing liquid L0 flowing from the upper side, so that the processing liquid L0 is prevented from flowing to the first collection basket 35. As a result, the separation of the metal sludge M from the treatment liquid L0 is promoted.
  • the filter plate 34 having the plurality of slits 34a is disposed from the rear end portion located below the discharge port 32a of the processing liquid L0 from the first collection basket 35. It inclines so that it may be located below gradually toward the installed front end part. As a result, the processing liquid L0 that has fallen onto the rear end portion of the filter plate 34 propagates forward along the inclination of the filter plate 34, leaving the metal sludge M on the filter plate 34, and the metal sludge M is separated. The treated liquid L1 falls downward from the plurality of slits 34a. That is, the metal sludge M is separated.
  • the metal sludge M remaining on the filter plate 34 rises gradually as it falls to the front side, and functions as a bank for damming the processing liquid flowing from the rear side, so that the processing liquid L0 is recovered. It suppresses flowing to the cage and thus promotes separation of the metal sludge M from the treatment liquid L0. Furthermore, since each slit 34a of the filter plate 34 is formed in a shape that expands downward, the processing liquid L1 can be dropped downward while preferably leaving the metal sludge M on the filter plate 34. Therefore, even when a large amount of metal sludge M is contained in the treatment liquid L0 compared to the conventional case, the metal sludge M can be suitably separated from the treatment liquid L0 and recovered. As a result, the metal sludge M containing the metal thin film and the resist discharged during the manufacturing process of the semiconductor substrate B by the lift-off method can be preferably separated and recovered from the processing liquid L0.
  • each slit 34a of the filter plate 34 is formed so as to extend along a direction orthogonal to the direction from the rear end portion to the front end portion of the filter plate 34 (that is, the direction in which the processing liquid L0 flows). Yes. Accordingly, the metal sludge M is prevented from falling from the slit 34a, and more preferably, the treatment liquid L1 is dropped downward while leaving the metal sludge M on the filter plate 34, thereby separating the metal sludge M from the treatment liquid L0. be able to.
  • the filter plate 34 is supported so that the inclination angle ⁇ can be changed, an optimum processing capacity can be obtained depending on, for example, the slit width W and pitch of the slit 34a, the flow rate of the processing liquid L0, and the like. It is possible to adjust to a proper inclination angle ⁇ .
  • only one filter plate 34 is provided in the recovery device 3, but a plurality of filter plates 34 may be appropriately disposed and used, for example, as shown in FIG.
  • the plates 34 may be used in combination.
  • three filter plates 34 having different height positions are alternately arranged in the front-rear direction, and the direction of the inclination angle ⁇ is set so that the rear two and the front one face each other. Is changing.
  • the lower the three filter plates 34 the narrower the slit width W of each slit 34a, or the larger the inclination angle ⁇ may be. By comprising in this way, the metal sludge M can be more reliably separated from the process liquid L0.
  • the discharge port 32a of the discharge unit 32 is positioned at the left and right center above the rear end of the filter plate 34.
  • the processing liquid L0 discharged from the discharge port 32a.
  • it flows downward (front side) while spreading left and right on the filter plate 34 (indicated by a two-dot chain line in the figure). Therefore, the metal sludge M cannot be suitably separated below the portion where the flow of the processing liquid L0 reaches the left and right sides of the filter plate 34. Therefore, auxiliary plates 34b for directing the processing liquid L0 flowing to the left and right sides of the filter plate 34 toward the center may be provided on the left and right sides of the filter plate 34.
  • the discharge port 32a of the discharge unit 32 is widened to the left and right, for example, to the same extent as the filter plate 34, or the filter plate 34 has a triangular shape in plan view according to the flow of the processing liquid L0 spreading from the discharge port 32a to the left and right. Even if it is formed, the same effect can be expected.
  • the plurality of slits 34a of the filter plate 34 may not have a uniform slit width W.
  • the slit width W may be formed so that the slit width W becomes narrower toward the front side (lower side).
  • the inclination angle ⁇ of the filter plate 34 varies with an optimum value using, for example, the slit width W and pitch of the slits 34a and the flow rate of the processing liquid L0 as parameters.
  • the rear end portion of the filter plate 34 is supported by the support member 38 having a variable height.
  • the filter plate 34 only needs to be supported so that the inclination angle ⁇ can be changed.
  • the portion may be supported with a variable height, or may be configured to be rotatable about a central axis along the left-right direction.
  • the recovery device and the cleaning device according to the present invention are useful for separating and recovering metal sludge suitably from the treatment liquid.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatment Of Sludge (AREA)
  • Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
  • Filtration Of Liquid (AREA)

Abstract

Provided is a recovery device 3 for separating and recovering metal sludge M included in liquid L0 to be treated from the liquid L0 to be treated, wherein the recovery device is provided with: at least one flat plate shaped filter plate 34 that has a back end part provided so as to be positioned below a discharge opening 32a for the liquid L0 to be treated, and has a plurality of slits 34a; and a mesh-shaped first recovery basket 35 that is provided below the front end part of the filter plate 34. The filter plate 34 is inclined at an angle α of inclination so as to be positioned gradually downward moving from the back end part to the front end part, and each slit 34a is formed in a shape that widens toward the downward side.

Description

回収装置及び洗浄装置Recovery device and cleaning device
　本発明は、半導体基板から剥離されて処理液中に含まれた金属スラッジを処理液から分離して回収する技術に関する。 The present invention relates to a technique for separating and recovering metal sludge peeled from a semiconductor substrate and contained in the processing liquid.
　従来、半導体基板上に金属薄膜パターンを作製する方法として、リフトオフ法が知られている。このリフトオフ法は、半導体基板上にレジストパターンを形成してから、さらにその上に金属薄膜を形成した後、金属薄膜が載ったレジスト（以下、「金属スラッジ」という）を半導体基板上から剥離・除去することによって金属薄膜パターンを作製する方法である。 Conventionally, a lift-off method is known as a method for producing a metal thin film pattern on a semiconductor substrate. In this lift-off method, a resist pattern is formed on a semiconductor substrate, a metal thin film is further formed thereon, and then a resist (hereinafter referred to as “metal sludge”) on which the metal thin film is mounted is peeled off from the semiconductor substrate. It is a method of producing a metal thin film pattern by removing.
　金属スラッジの剥離手段としては、１枚毎の枚葉処理に比べて処理能力が高いバッチ処理が好適に用いられる。
　このバッチ処理は、カセットに収納した複数枚の半導体基板を剥離槽に浸漬させ、必要に応じて超音波などによりレジストを膨潤させた後、処理液を噴射することにより金属スラッジを除去する技術である（例えば、特許文献１参照）。 As the metal sludge peeling means, a batch process having a higher processing capacity than the single wafer process is preferably used.
This batch process is a technology that removes metal sludge by spraying a treatment liquid after immersing a plurality of semiconductor substrates housed in a cassette in a peeling tank and swelling the resist with ultrasonic waves as necessary. Yes (see, for example, Patent Document 1).
特開２０１４－２３９１４１号公報JP 2014-239141 A
　しかしながら、上述したバッチ処理では枚葉処理に比べて多量の金属スラッジが排出されるため、この金属スラッジを処理液から分離して回収する回収装置に一般的な遠心分離式のものを単純に適用した場合、排出される金属スラッジの量が回収装置の処理能力を上回ってしまう。その結果、メインフィルタの目詰まりなどの不具合が生じ、ひいては、頻繁な装置メンテナンスの必要性やランニングコストの高騰を招来してしまう。 However, in the batch processing described above, a large amount of metal sludge is discharged compared to the single-wafer processing. Therefore, a general centrifugal type is simply applied to the recovery device that separates and recovers this metal sludge from the processing liquid. In this case, the amount of metal sludge that is discharged exceeds the processing capacity of the recovery device. As a result, problems such as clogging of the main filter occur, and as a result, frequent apparatus maintenance is required and running costs are increased.
　本発明は、上記課題を解決するためになされたもので、従来に比べ、多量の金属スラッジが処理液中に含まれる場合であっても、好適に金属スラッジを処理液から分離して回収することができる回収装置及びこれを備える洗浄装置の提供を目的とする。 The present invention has been made to solve the above problems, and even when a larger amount of metal sludge is contained in the treatment liquid than in the past, the metal sludge is preferably separated and recovered from the treatment liquid. An object of the present invention is to provide a recovery device that can perform the cleaning and a cleaning device including the same.
　上記目的を達成するために、請求項１に記載の発明は、処理液中に含まれた金属スラッジを処理液から分離して回収する回収装置であって、
　前記処理液の吐出口の下方に一端部が位置するように設けられるとともに、複数のスリットを有する少なくとも１つの平板状のフィルター板と、
　前記フィルター板の他端部の下方に設けられ、金属スラッジを回収する回収かごと、
を備え、
　前記フィルター板は、一端部から他端部に向かうに連れて次第に下方に位置するように所定の傾斜角度で傾斜しており、
　前記複数のスリットの各々は、下側に向かって広がる形状に形成されていることを特徴とする。 In order to achieve the above object, the invention described in claim 1 is a recovery device for separating and recovering metal sludge contained in the processing liquid from the processing liquid,
At least one plate-like filter plate having a plurality of slits and being provided so that one end is located below the discharge port of the processing liquid;
Provided below the other end of the filter plate, and a collection basket for collecting metal sludge,
With
The filter plate is inclined at a predetermined inclination angle so as to gradually be positioned downward from one end to the other end.
Each of the plurality of slits is formed in a shape that expands downward.
　請求項２に記載の発明は、請求項１に記載の回収装置において、
　前記複数のスリットの各々は、前記フィルター板の一端部から他端部に向かう方向と直交する方向に沿って延在するように形成されていることを特徴とする。 Invention of Claim 2 is the collection | recovery apparatus of Claim 1,
Each of the plurality of slits is formed so as to extend along a direction orthogonal to a direction from one end portion to the other end portion of the filter plate.
　請求項３に記載の発明は、請求項１または２に記載の回収装置において、
　前記フィルター板の前記傾斜角度αが、０°＜α≦２０°の範囲内であることを特徴とする。 Invention of Claim 3 is the collection | recovery apparatus of Claim 1 or 2,
The inclination angle α of the filter plate is in a range of 0 ° <α ≦ 20 °.
　請求項４に記載の発明は、請求項１～３のいずれか一項に記載の回収装置において、
　前記フィルター板が、前記傾斜角度を変更可能なように支持されていることを特徴とする。 The invention according to claim 4 is the recovery apparatus according to any one of claims 1 to 3,
The filter plate is supported so that the inclination angle can be changed.
　請求項５に記載の発明は、洗浄装置であって、
　半導体基板を処理液で洗浄して金属スラッジを除去する処理槽と、
　前記処理槽から排出された処理液から金属スラッジを分離して回収する請求項１～４のいずれか一項に記載の回収装置と、
を備えることを特徴とする。 The invention according to claim 5 is a cleaning device,
A treatment tank for cleaning the semiconductor substrate with a treatment liquid to remove metal sludge;
The recovery apparatus according to any one of claims 1 to 4, wherein metal sludge is separated and recovered from the processing liquid discharged from the processing tank;
It is characterized by providing.
　請求項１に記載の発明によれば、複数のスリットを有する少なくとも１つのフィルター板が、処理液の吐出口の下方に位置する一端部から、回収かごが設置された他端部に向かうに連れて次第に下方に位置するように傾斜している。
　これにより、フィルター板の一端部上に落下してきた処理液は、フィルター板の傾斜に沿って他端側へ伝いつつ、金属スラッジをフィルター板に残し、当該金属スラッジが分離された処理液が複数のスリットから下方へ落下する。つまり金属スラッジが分離される。
　また、フィルター板上に残った金属スラッジは、他端側へ落ちていくに連れて次第に高く盛り上がっていき、一端側から流れてくる処理液を堰き止める土手として機能するため、処理液が回収かごまで流れてしまうことを抑制し、ひいては処理液からの金属スラッジの分離を促進させる。
　さらに、フィルター板の各スリットが下側に向かって広がる形状に形成されているので、好適に金属スラッジをフィルター板上に残しつつ処理液を下方へ落下させることができる。
　したがって、従来に比べ、多量の金属スラッジが処理液中に含まれる場合であっても、好適に金属スラッジを処理液から分離して回収することができる。 According to the first aspect of the present invention, at least one filter plate having a plurality of slits moves from one end located below the treatment liquid discharge port toward the other end where the collection basket is installed. It is inclined so as to be positioned downward gradually.
As a result, the processing liquid that has fallen on one end of the filter plate is transferred to the other end along the inclination of the filter plate, leaving the metal sludge on the filter plate, and a plurality of processing liquids from which the metal sludge has been separated. Falls downward from the slit. That is, metal sludge is separated.
In addition, the metal sludge remaining on the filter plate gradually rises as it falls to the other end side, and functions as a bank to dam the treatment liquid flowing from one end side, so that the treatment liquid is collected in the collection basket. And the separation of metal sludge from the treatment liquid is promoted.
Furthermore, since each slit of the filter plate is formed in a shape that expands downward, the processing liquid can be dropped downward while suitably leaving the metal sludge on the filter plate.
Therefore, even when a large amount of metal sludge is contained in the treatment liquid as compared with the conventional case, the metal sludge can be suitably separated from the treatment liquid and recovered.
　請求項２に記載の発明によれば、フィルター板の各スリットが、当該フィルター板の一端部から他端部に向かう方向（つまり、処理液が流れる方向）と直交する方向に沿って延在するように形成されている。
　したがって、金属スラッジがスリットから落下することを抑制し、さらに好適に金属スラッジをフィルター板上に残しつつ処理液を下方へ落下させて、金属スラッジを処理液から分離させることができる。 According to invention of Claim 2, each slit of a filter board is extended along the direction orthogonal to the direction (namely, direction in which a process liquid flows) which goes to the other end part from the one end part of the said filter board. It is formed as follows.
Therefore, it is possible to suppress the metal sludge from falling from the slit, and more preferably to drop the treatment liquid downward while leaving the metal sludge on the filter plate, thereby separating the metal sludge from the treatment liquid.
　請求項４に記載の発明によれば、フィルター板がその傾斜角度を変更可能なように支持されているので、例えばスリットのスリット幅やピッチ、処理液の流量などに応じて、より高い処理能力が得られる最適な傾斜角度に調整することができる。 According to the invention described in claim 4, since the filter plate is supported so that the inclination angle thereof can be changed, a higher processing capacity can be obtained depending on, for example, the slit width and pitch of the slit, the flow rate of the processing liquid, and the like. Can be adjusted to an optimum inclination angle that can be obtained.
洗浄装置の概略構成を示すブロック図である。It is a block diagram which shows schematic structure of a washing | cleaning apparatus. 回収装置の側断面図である。It is side sectional drawing of a collection | recovery apparatus. 図２のＡ部の拡大図である。It is an enlarged view of the A section of FIG. 回収装置の動作を説明するための図である。It is a figure for demonstrating operation | movement of a collection | recovery apparatus. 回収装置の動作を説明するための図である。It is a figure for demonstrating operation | movement of a collection | recovery apparatus. 回収装置の変形例を説明するための図である。It is a figure for demonstrating the modification of a collection | recovery apparatus. フィルター板の変形例を説明するための平面図である。It is a top view for demonstrating the modification of a filter board.
　以下、本発明の実施形態について、図面を参照して説明する。
　なお、以下に述べる実施形態には、本発明を実施するために技術的に好ましい種々の限定が付されているが、本発明の範囲を以下の実施形態及び図示例に限定するものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The embodiments described below are given various technically preferable limitations for carrying out the present invention, but the scope of the present invention is not limited to the following embodiments and illustrated examples.
［洗浄装置の構成］
　まず、本実施形態における回収装置３を備える洗浄装置１の構成について説明する。
　図１は、洗浄装置１の概略構成を示すブロック図である。 [Configuration of cleaning equipment]
First, the structure of the washing | cleaning apparatus 1 provided with the collection | recovery apparatus 3 in this embodiment is demonstrated.
FIG. 1 is a block diagram showing a schematic configuration of the cleaning apparatus 1.
　洗浄装置１は、リフトオフ法による金属薄膜パターン形成のための半導体基板Ｂを有機溶剤の処理液で洗浄して、当該半導体基板Ｂから金属薄膜の載ったレジスト（以下、「金属スラッジ」という。）を剥離・除去するものである。
　この洗浄装置１では、図１に示すように、処理槽２、回収装置３、循環ポンプ４及び２つのフィルター５，６がこの順に配管で接続されるとともに、さらにフィルター６からの配管が処理槽２のうち処理液の液面よりも下側の部分に接続されており、処理液が循環するようになっている。 The cleaning apparatus 1 cleans a semiconductor substrate B for forming a metal thin film pattern by a lift-off method with a processing solution of an organic solvent, and a resist (hereinafter referred to as “metal sludge”) on which a metal thin film is placed from the semiconductor substrate B. Is peeled and removed.
In this cleaning device 1, as shown in FIG. 1, the processing tank 2, the recovery device 3, the circulation pump 4, and the two filters 5 and 6 are connected by piping in this order, and the piping from the filter 6 is further connected to the processing tank. 2 is connected to a portion below the liquid surface of the processing liquid, so that the processing liquid circulates.
　処理槽２では、カセットＣに収容された多数の半導体基板Ｂ（図１では一枚のみ図示）を同時に洗浄するバッチ処理が行われる。具体的に、処理槽２では、半導体基板Ｂを浸漬させた処理液に必要に応じて超音波振動を加えることで半導体基板Ｂ上のレジストを膨潤させた後、半導体基板Ｂに向けて処理液を噴射することにより、半導体基板Ｂ表面から金属スラッジが剥離・除去される。除去された金属スラッジは、処理液とともに処理槽２から排出される。
　また、本実施形態の処理槽２には、溢れた処理液を収容するためのオーバーフロー槽２１が付設されており、このオーバーフロー槽２１から処理液を排出させる配管が、処理槽２から回収装置３へ向かう配管に接続されている。 In the processing tank 2, batch processing for simultaneously cleaning a large number of semiconductor substrates B (only one is shown in FIG. 1) accommodated in the cassette C is performed. Specifically, in the treatment tank 2, the resist on the semiconductor substrate B is swollen by applying ultrasonic vibration to the treatment liquid in which the semiconductor substrate B is immersed as necessary, and then the treatment liquid is directed toward the semiconductor substrate B. The metal sludge is peeled off and removed from the surface of the semiconductor substrate B. The removed metal sludge is discharged from the treatment tank 2 together with the treatment liquid.
Further, the processing tank 2 of the present embodiment is provided with an overflow tank 21 for containing the overflowing processing liquid, and a pipe for discharging the processing liquid from the overflow tank 21 is provided from the processing tank 2 to the recovery device 3. It is connected to the piping going to.
　処理槽２から排出された処理液は、回収装置３によって液中の金属スラッジの大部分が分離・回収される。そして、回収装置３から排出された処理液は、循環ポンプ４で加圧された後、２つのフィルター５，６を経て金属スラッジがほぼ完全に除去された後に、処理槽２へ戻るようになっている。なお、本実施形態では、２０～４０ｌ／ｍｉｎの処理液が循環する。フィルター５は遠心分離式のフィルターであり、回収装置３で回収しきれなかった金属スラッジを回収する。フィルター６はメッシュタイプのフィルターであり、金属スラッジを処理液からほぼ完全に除去することができる。つまり、大きな金属スラッジは回収装置３で、小さいものはフィルター５で、さらに小さいものはフィルター６でというように、３段階で金属スラッジを回収するようになっている。
　本実施形態においては、フィルター６からの配管が処理槽２内のカセットＣよりも下側に位置しており、処理液を半導体基板Ｂの下側から処理槽２内に循環させている。このように処理槽２の下側から処理液を循環させ、処理液の液面を上昇させることにより、処理液の液面付近に浮遊した金属スラッジ等の浮遊物をオーバーフロー槽２１内へ流入させ、当該オーバーフロー槽２１内で沈殿・排出させることができ、この浮遊物の半導体基板への再付着を防ぐことができる。 Most of the metal sludge in the liquid is separated and recovered from the processing liquid discharged from the processing tank 2 by the recovery device 3. Then, after the processing liquid discharged from the recovery device 3 is pressurized by the circulation pump 4, the metal sludge is almost completely removed through the two filters 5 and 6, and then returns to the processing tank 2. ing. In the present embodiment, a processing solution of 20 to 40 l / min circulates. The filter 5 is a centrifugal filter, and collects metal sludge that could not be recovered by the recovery device 3. The filter 6 is a mesh type filter, and can remove the metal sludge almost completely from the processing liquid. In other words, the metal sludge is collected in three stages, such as the large metal sludge is collected by the recovery device 3, the small one is the filter 5, and the smaller one is the filter 6.
In the present embodiment, the pipe from the filter 6 is located below the cassette C in the processing tank 2, and the processing liquid is circulated into the processing tank 2 from the lower side of the semiconductor substrate B. In this way, by circulating the processing liquid from the lower side of the processing tank 2 and raising the liquid level of the processing liquid, floating substances such as metal sludge floating near the liquid surface of the processing liquid are caused to flow into the overflow tank 21. In this overflow tank 21, precipitation and discharge can be performed, and reattachment of the floating substance to the semiconductor substrate can be prevented.
［回収装置の構成］
　続いて、回収装置３の構成について説明する。
　図２は、回収装置３の内部構造を示す側断面図であり、図３は、図２のＡ部の拡大図である。
　以下の構成は、本発明をさらに具体的に説明するためのものである。本発明はこれらの実施形態に限定されるものではない。 [Configuration of collection device]
Then, the structure of the collection | recovery apparatus 3 is demonstrated.
FIG. 2 is a side sectional view showing the internal structure of the recovery device 3, and FIG. 3 is an enlarged view of a portion A in FIG.
The following configuration is for more specifically describing the present invention. The present invention is not limited to these embodiments.
　図２に示すように、回収装置３は、各部品を内部に収容した筺体３１を備えている。
　筺体３１の一端側（図２の左側）の側壁上部では、処理槽２からの配管が筺体３１内部に連通されており、その開口部の周囲が矩形箱状の吐出部３２で覆われている。この吐出部３２は、下方に開口した吐出口３２ａを有しており、処理槽２から排出されてきた処理液を吐出口３２ａから下方へ吐出させる。
　筺体３１の底板は、漏斗状に形成されるとともに、循環ポンプ４に向けて処理液を排出させる排出口３１ａをその中央に有している。
　また、筺体３１の他端側（図２の右側）の上板部には、筺体３１内部の各部品を取り出し可能な開口部３１ｂが形成されており、この開口部３１ｂが、開閉可能な蓋部３３で閉塞されている。
　なお、以下では、説明の簡単のために、筺体３１の他端側（図２の右側）の方向を「前」、一端側（図２の左側）の方向を「後」と記載することとする。 As shown in FIG. 2, the collection | recovery apparatus 3 is provided with the housing 31 which accommodated each component inside.
In the upper part of the side wall on one end side (left side in FIG. 2) of the casing 31, piping from the processing tank 2 is communicated with the interior of the casing 31, and the periphery of the opening is covered with a rectangular box-shaped discharge section 32. . The discharge unit 32 has a discharge port 32a that opens downward, and discharges the processing liquid discharged from the processing tank 2 downward from the discharge port 32a.
The bottom plate of the casing 31 is formed in a funnel shape, and has a discharge port 31 a for discharging the processing liquid toward the circulation pump 4 at the center thereof.
Further, an opening 31b through which each component inside the housing 31 can be taken out is formed on the upper plate portion of the other end side (right side in FIG. 2) of the housing 31, and this opening 31b can be opened and closed. Blocked by the portion 33.
In the following, for the sake of simplicity, the direction of the other end side (right side of FIG. 2) of the casing 31 is described as “front”, and the direction of one end side (left side of FIG. 2) is described as “rear”. To do.
　筺体３１の内部には、フィルター板３４と、第一回収かご３５と、第二回収かご３６と、タンクネット３７とが収容されている。 Inside the housing 31, a filter plate 34, a first collection basket 35, a second collection basket 36, and a tank net 37 are accommodated.
　このうち、フィルター板３４は、処理液から大部分の金属スラッジを分離させるためのものであり、略平板状に形成されて、吐出部３２の直下に配置されている。より詳しくは、フィルター板３４は、その後端部の上方に吐出部３２の吐出口３２ａが位置するとともに、この後端部から前端部に向かうに連れて次第に下方に位置するように傾斜した状態に配置されている。このフィルター板３４の傾斜角度α（図３参照）は、０°＜α≦２０°の範囲内であることが好ましく、２°≦α≦１５°の範囲内であることがより好ましく、４°≦α≦１０°の範囲内であることがさらに好ましい。
　また、フィルター板３４は、この傾斜角度αを調整可能なように、高さ可変の支持部材３８によって後端部が支持されている。 Among these, the filter plate 34 is for separating most of the metal sludge from the processing liquid, is formed in a substantially flat plate shape, and is disposed immediately below the discharge portion 32. More specifically, the filter plate 34 is in a state where the discharge port 32a of the discharge unit 32 is located above the rear end portion thereof, and is inclined so as to be gradually positioned downward from the rear end portion toward the front end portion. Has been placed. The inclination angle α (see FIG. 3) of the filter plate 34 is preferably in the range of 0 ° <α ≦ 20 °, more preferably in the range of 2 ° ≦ α ≦ 15 °, and 4 °. More preferably, it is within the range of ≦ α ≦ 10 °.
Further, the rear end of the filter plate 34 is supported by a support member 38 having a variable height so that the inclination angle α can be adjusted.
　フィルター板３４には、図３に示すように、前後方向に配列された複数のスリット３４ａが略全面に亘って形成されている。各スリット３４ａは、前後方向と直交する左右方向（図３の紙面垂直方向）に略沿って直線状に延在している。各スリット３４ａのスリット幅Ｗは、好ましくは２００μｍ以下であり、より好ましくは１５０μｍ以下であり、さらに好ましくは７０μｍ以下である。但し、このスリット幅Ｗが、例えば金属スラッジのサイズなどに対応したものであるべきであるのは勿論である。
　また、各スリット３４ａは、下側に向かって広がるようにフィルター板３４を貫通しており、その延在方向と直交する空間断面が等脚台形状に形成されている。但し、各スリット３４ａは、下側に向かって広がる形状に形成されていればよく、断面等脚台形状でなくともよい。 As shown in FIG. 3, the filter plate 34 is formed with a plurality of slits 34a arranged in the front-rear direction over substantially the entire surface. Each slit 34a extends linearly along a left-right direction (a direction perpendicular to the plane of FIG. 3) perpendicular to the front-rear direction. The slit width W of each slit 34a is preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 70 μm or less. However, it goes without saying that the slit width W should correspond to, for example, the size of the metal sludge.
Each slit 34a passes through the filter plate 34 so as to expand downward, and a spatial cross section orthogonal to the extending direction is formed in an isosceles trapezoidal shape. However, each slit 34a should just be formed in the shape which spreads toward the lower side, and does not need to be a trapezoid shape in a cross section.
　第一回収かご３５は、図２に示すように、フィルター板３４によって処理液から分離された金属スラッジを回収するためのものである。本実施形態においては、この第一回収かご３５は、全体がメッシュ状（本実施形態では２００メッシュ）のかご部材であり、フィルター板３４の前端部の下側に配置されている。より詳しくは、第一回収かご３５は、その後端部をフィルター板３４の前端部と上下に重複させつつ、当該フィルター板３４の前端部が中央やや後側寄りの位置まで延出するように配置されている。
　また、第一回収かご３５は、後方に移動させてフィルター板３４の下側からずらしてから取り外し可能に支持されており、取り外した後に筺体３１上部の開口部３１ｂから取り出すことができる。 As shown in FIG. 2, the first collection basket 35 is for collecting metal sludge separated from the processing liquid by the filter plate 34. In the present embodiment, the first collection basket 35 is a cage member having a mesh shape (200 mesh in the present embodiment) as a whole, and is disposed below the front end portion of the filter plate 34. More specifically, the first collection basket 35 is disposed so that the front end of the filter plate 34 extends to a position slightly closer to the rear side while overlapping the rear end thereof vertically with the front end of the filter plate 34. Has been.
Further, the first collection basket 35 is supported so as to be removable after being moved backward and shifted from the lower side of the filter plate 34, and can be taken out from the opening 31 b above the housing 31 after being removed.
　第二回収かご３６及びタンクネット３７は、フィルター板３４及び第一回収かご３５を通過した処理液中に含まれる金属スラッジの残りをさらに回収するためのものであり、第一回収かご３５よりも下側にこの順に配置されている。
　このうち、第二回収かご３６は、全体がメッシュ状（本実施形態では２００メッシュ）のやや浅めのかご部材であり、フィルター板３４の全体と第一回収かご３５の後側半部との下方を覆うように配置されている。
　一方、タンクネット３７は、全体がメッシュ状（本実施形態では３００メッシュ）の大きめのかご部材であり、フィルター板３４及び第一回収かご３５の全体の下方を覆うように、筺体３１内の最下部に配置されている。 The second collection basket 36 and the tank net 37 are for further collecting the remainder of the metal sludge contained in the processing liquid that has passed through the filter plate 34 and the first collection basket 35, and more than the first collection basket 35. It is arranged in this order on the lower side.
Among these, the second collection basket 36 is a slightly shallow cage member having a mesh shape (200 mesh in this embodiment) as a whole, and below the entire filter plate 34 and the rear half of the first collection basket 35. It is arranged to cover.
On the other hand, the tank net 37 is a large cage member having a mesh shape (300 mesh in the present embodiment) as a whole, and covers the lower part of the filter plate 34 and the first collection basket 35 so as to cover the lowermost part of the casing 31. Located at the bottom.
［回収装置の動作］
　続いて、処理液から金属スラッジを分離・回収する際の回収装置３の動作について説明する。
　図４Ａ及び図４Ｂは、回収装置３の動作を説明するための図である。 [Operation of collection device]
Next, the operation of the recovery device 3 when separating and recovering metal sludge from the treatment liquid will be described.
4A and 4B are diagrams for explaining the operation of the collection device 3.
　本実施形態における回収装置３は、リフトオフ法による半導体基板Ｂの製造過程で処理液とともに排出される金属薄膜やレジストを含んだ金属スラッジを、処理液から分離して回収する。
　具体的には、図４Ａに示すように、金属スラッジＭを含んだ処理液Ｌ０が処理槽２から排出されてくると、回収装置３内では、この処理液Ｌ０が吐出部３２の吐出口３２ａから下方へ吐出され、その下方に位置するフィルター板３４上端の後端部上に落下する。
　フィルター板３４上に落下した処理液Ｌ０は、フィルター板３４の傾斜に沿って当該フィルター板３４上を前側へ伝いつつ、金属スラッジＭをフィルター板３４上に残し、当該金属スラッジＭが分離された処理液Ｌ１が複数のスリット３４ａから下方へ落下する。 The recovery device 3 in the present embodiment separates and recovers metal sludge containing a metal thin film and resist discharged together with the processing liquid during the manufacturing process of the semiconductor substrate B by the lift-off method from the processing liquid.
Specifically, as shown in FIG. 4A, when the processing liquid L0 containing the metal sludge M is discharged from the processing tank 2, the processing liquid L0 is discharged from the discharge port 32a of the discharge unit 32 in the recovery device 3. Is discharged downward and falls onto the rear end portion of the upper end of the filter plate 34 located below.
The treatment liquid L0 that has fallen on the filter plate 34 travels forward on the filter plate 34 along the inclination of the filter plate 34 while leaving the metal sludge M on the filter plate 34, and the metal sludge M is separated. The processing liquid L1 falls downward from the plurality of slits 34a.
　このとき、フィルター板３４の各スリット３４ａが下側に向かって広がる形状に形成されているので、好適に金属スラッジＭをフィルター板３４上に残しつつ処理液Ｌ１を下方へ落下させることができる。
　また、各スリット３４ａが前後方向と直交する左右方向に沿って延在している、つまり、フィルター板３４上を処理液Ｌ０が流れる方向と直交する方向に沿って延在しているので、金属スラッジＭがスリット３４ａから落下することを抑制し、さらに好適に金属スラッジＭをフィルター板３４上に残しつつ処理液Ｌ１を下方へ落下させることができる。 At this time, since each slit 34a of the filter plate 34 is formed in a shape that expands downward, the processing liquid L1 can be dropped downward while preferably leaving the metal sludge M on the filter plate 34.
In addition, each slit 34a extends along the left-right direction orthogonal to the front-rear direction, that is, extends along the direction orthogonal to the direction in which the processing liquid L0 flows on the filter plate 34. The sludge M can be prevented from falling from the slit 34a, and the processing liquid L1 can be dropped downward while leaving the metal sludge M on the filter plate 34 more preferably.
　フィルター板３４によって処理液Ｌ０から分離された金属スラッジＭは、フィルター板３４の傾斜に沿って当該フィルター板３４上を前側へ流動しつつ、徐々に堆く盛り上がっていく。そして、図４Ｂに示すように、遂にはフィルター板３４の前端部から第一回収かご３５内に落下する。
　このとき、フィルター板３４の前端部に堆積した金属スラッジＭは、上側から流れてくる処理液Ｌ０を堰き止める土手として機能するため、処理液Ｌ０が第一回収かご３５まで流れてしまうことを抑制し、ひいては、処理液Ｌ０からの金属スラッジＭの分離を促進させる。 The metal sludge M separated from the treatment liquid L0 by the filter plate 34 gradually accumulates while flowing forward on the filter plate 34 along the inclination of the filter plate 34. Then, as shown in FIG. 4B, it finally falls from the front end portion of the filter plate 34 into the first collection basket 35.
At this time, the metal sludge M deposited on the front end portion of the filter plate 34 functions as a bank for damming the processing liquid L0 flowing from the upper side, so that the processing liquid L0 is prevented from flowing to the first collection basket 35. As a result, the separation of the metal sludge M from the treatment liquid L0 is promoted.
　こうして、処理液Ｌ０中の大部分の金属スラッジＭは、第一回収かご３５内に回収される。
　そして、この大部分の金属スラッジＭが分離された処理液Ｌ１は、フィルター板３４から落下した後、その下方の第二回収かご３６及びタンクネット３７によって、さらに金属スラッジＭが回収された後に、筺体３１の排出口３１ａから排出される。 Thus, most of the metal sludge M in the treatment liquid L0 is recovered in the first recovery basket 35.
Then, after the treatment liquid L1 from which most of the metal sludge M has been separated falls from the filter plate 34, the metal sludge M is further recovered by the second recovery basket 36 and the tank net 37 below it, It is discharged from the discharge port 31a of the housing 31.
［効果］
　以上のように、本実施形態における回収装置３によれば、複数のスリット３４ａを有するフィルター板３４が、処理液Ｌ０の吐出口３２ａの下方に位置する後端部から、第一回収かご３５が設置された前端部に向かうに連れて次第に下方に位置するように傾斜している。
　これにより、フィルター板３４の後端部上に落下してきた処理液Ｌ０は、フィルター板３４の傾斜に沿って前側へ伝いつつ、金属スラッジＭをフィルター板３４に残し、当該金属スラッジＭが分離された処理液Ｌ１が複数のスリット３４ａから下方へ落下する。つまり金属スラッジＭが分離される。
　また、フィルター板３４上に残った金属スラッジＭは、前側へ落ちていくに連れて次第に高く盛り上がっていき、後側から流れてくる処理液を堰き止める土手として機能するため、処理液Ｌ０が回収かごまで流れてしまうことを抑制し、ひいては処理液Ｌ０からの金属スラッジＭの分離を促進させる。
　さらに、フィルター板３４の各スリット３４ａが下側に向かって広がる形状に形成されているので、好適に金属スラッジＭをフィルター板３４上に残しつつ処理液Ｌ１を下方へ落下させることができる。
　したがって、従来に比べ、多量の金属スラッジＭが処理液Ｌ０中に含まれる場合であっても、好適に金属スラッジＭを処理液Ｌ０から分離して回収することができる。
　ひいては、リフトオフ法による半導体基板Ｂの製造過程で排出される、金属薄膜やレジストを含んだ金属スラッジＭを、好適に処理液Ｌ０から分離して回収することができる。 [effect]
As described above, according to the collection device 3 in the present embodiment, the filter plate 34 having the plurality of slits 34a is disposed from the rear end portion located below the discharge port 32a of the processing liquid L0 from the first collection basket 35. It inclines so that it may be located below gradually toward the installed front end part.
As a result, the processing liquid L0 that has fallen onto the rear end portion of the filter plate 34 propagates forward along the inclination of the filter plate 34, leaving the metal sludge M on the filter plate 34, and the metal sludge M is separated. The treated liquid L1 falls downward from the plurality of slits 34a. That is, the metal sludge M is separated.
Further, the metal sludge M remaining on the filter plate 34 rises gradually as it falls to the front side, and functions as a bank for damming the processing liquid flowing from the rear side, so that the processing liquid L0 is recovered. It suppresses flowing to the cage and thus promotes separation of the metal sludge M from the treatment liquid L0.
Furthermore, since each slit 34a of the filter plate 34 is formed in a shape that expands downward, the processing liquid L1 can be dropped downward while preferably leaving the metal sludge M on the filter plate 34.
Therefore, even when a large amount of metal sludge M is contained in the treatment liquid L0 compared to the conventional case, the metal sludge M can be suitably separated from the treatment liquid L0 and recovered.
As a result, the metal sludge M containing the metal thin film and the resist discharged during the manufacturing process of the semiconductor substrate B by the lift-off method can be preferably separated and recovered from the processing liquid L0.
　また、フィルター板３４の各スリット３４ａが、当該フィルター板３４の後端部から前端部に向かう方向（つまり、処理液Ｌ０が流れる方向）と直交する方向に沿って延在するように形成されている。
　したがって、金属スラッジＭがスリット３４ａから落下することを抑制し、さらに好適に金属スラッジＭをフィルター板３４上に残しつつ処理液Ｌ１を下方へ落下させて、金属スラッジＭを処理液Ｌ０から分離させることができる。 Further, each slit 34a of the filter plate 34 is formed so as to extend along a direction orthogonal to the direction from the rear end portion to the front end portion of the filter plate 34 (that is, the direction in which the processing liquid L0 flows). Yes.
Accordingly, the metal sludge M is prevented from falling from the slit 34a, and more preferably, the treatment liquid L1 is dropped downward while leaving the metal sludge M on the filter plate 34, thereby separating the metal sludge M from the treatment liquid L0. be able to.
　また、フィルター板３４がその傾斜角度αを変更可能なように支持されているので、例えばスリット３４ａのスリット幅Ｗやピッチ、処理液Ｌ０の流量などに応じて、より高い処理能力が得られる最適な傾斜角度αに調整することができる。 Further, since the filter plate 34 is supported so that the inclination angle α can be changed, an optimum processing capacity can be obtained depending on, for example, the slit width W and pitch of the slit 34a, the flow rate of the processing liquid L0, and the like. It is possible to adjust to a proper inclination angle α.
［変形例］
　なお、本発明を適用可能な実施形態は、上述した実施形態に限定されることなく、本発明の趣旨を逸脱しない範囲で適宜変更可能である。 [Modification]
The embodiments to which the present invention can be applied are not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit of the present invention.
　例えば、上記実施形態では、回収装置３に１つのフィルター板３４のみを設けることとしたが、複数のフィルター板３４を適宜配置して用いてもよく、例えば図５に示すように、複数のフィルター板３４を組み合わせて用いてもよい。
　具体的に、図５の例では、高さ位置の異なる３つのフィルター板３４を前後方向に互い違いに配列するとともに、後側の２つと前側の１つとで互いに対向するように傾斜角度αの方向を変えている。また、３つのフィルター板３４は、下側のものほど、各スリット３４ａのスリット幅Ｗが狭くなっていたり、傾斜角度αが大きくなっていたりしてもよい。
　このように構成することにより、より確実に金属スラッジＭを処理液Ｌ０から分離させることができる。 For example, in the above embodiment, only one filter plate 34 is provided in the recovery device 3, but a plurality of filter plates 34 may be appropriately disposed and used, for example, as shown in FIG. The plates 34 may be used in combination.
Specifically, in the example of FIG. 5, three filter plates 34 having different height positions are alternately arranged in the front-rear direction, and the direction of the inclination angle α is set so that the rear two and the front one face each other. Is changing. Further, the lower the three filter plates 34, the narrower the slit width W of each slit 34a, or the larger the inclination angle α may be.
By comprising in this way, the metal sludge M can be more reliably separated from the process liquid L0.
　また、吐出部３２の吐出口３２ａがフィルター板３４後端部上方の左右中央に位置することとしたが、この場合には、図６に示すように、吐出口３２ａから吐出された処理液Ｌ０が、フィルター板３４上で左右に広がりつつ下側（前側）へ流れていく（図中に二点鎖線で示す）。そのため、この処理液Ｌ０の流れがフィルター板３４の左右両側部に到達した部分よりも下側では、金属スラッジＭを好適に分離できなくなってしまう。
　そこで、フィルター板３４の左右両側部へ流れてきた処理液Ｌ０を中央側に向けるための補助板３４ｂを、フィルター板３４の左右両側部に設けてもよい。これにより、さらに確実に金属スラッジＭを処理液Ｌ０から分離させることができる。
　なお、吐出部３２の吐出口３２ａを、例えばフィルター板３４と同程度にまで左右に広くしたり、吐出口３２ａから左右に広がる処理液Ｌ０の流れに合わせてフィルター板３４を平面視三角形状に形成したりしても、同様の効果が期待できる。 In addition, the discharge port 32a of the discharge unit 32 is positioned at the left and right center above the rear end of the filter plate 34. In this case, as shown in FIG. 6, the processing liquid L0 discharged from the discharge port 32a. However, it flows downward (front side) while spreading left and right on the filter plate 34 (indicated by a two-dot chain line in the figure). Therefore, the metal sludge M cannot be suitably separated below the portion where the flow of the processing liquid L0 reaches the left and right sides of the filter plate 34.
Therefore, auxiliary plates 34b for directing the processing liquid L0 flowing to the left and right sides of the filter plate 34 toward the center may be provided on the left and right sides of the filter plate 34. Thereby, the metal sludge M can be more reliably separated from the treatment liquid L0.
The discharge port 32a of the discharge unit 32 is widened to the left and right, for example, to the same extent as the filter plate 34, or the filter plate 34 has a triangular shape in plan view according to the flow of the processing liquid L0 spreading from the discharge port 32a to the left and right. Even if it is formed, the same effect can be expected.
　また、フィルター板３４の複数のスリット３４ａは、スリット幅Ｗが均一でなくともよく、例えば前側（下側）のものほど当該スリット幅Ｗが狭くなるように形成されていてもよい。 The plurality of slits 34a of the filter plate 34 may not have a uniform slit width W. For example, the slit width W may be formed so that the slit width W becomes narrower toward the front side (lower side).
　また、フィルター板３４の傾斜角度αは、例えばスリット３４ａのスリット幅Ｗやピッチ、処理液Ｌ０の流量などをパラメータとして最適な値が変化することは勿論である。 Of course, the inclination angle α of the filter plate 34 varies with an optimum value using, for example, the slit width W and pitch of the slits 34a and the flow rate of the processing liquid L0 as parameters.
　また、フィルター板３４の後端部が高さ可変の支持部材３８によって支持されていることとしたが、このフィルター板３４は、傾斜角度αを変更可能に支持されていればよく、例えば、前端部が高さ可変に支持されていてもよいし、左右方向に沿った中心軸回りに回転可能に構成されていてもよい。 In addition, the rear end portion of the filter plate 34 is supported by the support member 38 having a variable height. However, the filter plate 34 only needs to be supported so that the inclination angle α can be changed. The portion may be supported with a variable height, or may be configured to be rotatable about a central axis along the left-right direction.
産業上の利用の可能性Industrial applicability
　以上のように、本発明に係る回収装置及び洗浄装置は、金属スラッジを好適に処理液から分離して回収するのに有用である。 As described above, the recovery device and the cleaning device according to the present invention are useful for separating and recovering metal sludge suitably from the treatment liquid.
１　　　　洗浄装置
３　　　　回収装置
３２　　　吐出部
　３２ａ　吐出口
３４　　　フィルター板
　α　　　傾斜角度
　３４ａ　スリット
　　Ｗ　　スリット幅
３５　　　第一回収かご
３６　　　第二回収かご
３７　　　タンクネット
３８　　　支持部材
Ｌ０　　　処理液（金属スラッジを含むもの）
Ｌ１　　　処理液（大部分の金属スラッジが分離されたもの）
Ｍ　　　　金属スラッジ DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 3 Collection | recovery apparatus 32 Discharge part 32a Discharge port 34 Filter board (alpha) Inclination angle 34a Slit W Slit width 35 First collection basket 36 Second collection basket 37 Tank net 38 Support member L0 Treatment liquid (thing containing metal sludge)
L1 treatment liquid (with most of the metal sludge separated)
M metal sludge

Claims (5)

  1. 　処理液中に含まれた金属スラッジを処理液から分離して回収する回収装置であって、
    　前記処理液の吐出口の下方に一端部が位置するように設けられるとともに、複数のスリットを有する少なくとも１つの平板状のフィルター板と、
    　前記フィルター板の他端部の下方に設けられ、金属スラッジを回収する回収かごと、
    を備え、
    　前記フィルター板は、一端部から他端部に向かうに連れて次第に下方に位置するように所定の傾斜角度で傾斜しており、
    　前記複数のスリットの各々は、下側に向かって広がる形状に形成されていることを特徴とする回収装置。     A recovery device for separating and recovering metal sludge contained in the processing liquid from the processing liquid,
    At least one plate-like filter plate having a plurality of slits and being provided so that one end is located below the discharge port of the processing liquid;
    Provided below the other end of the filter plate, and a collection basket for collecting metal sludge,
    With
    The filter plate is inclined at a predetermined inclination angle so as to gradually be positioned downward from one end to the other end.
    Each of the plurality of slits is formed in a shape that expands downward.
  2. 　前記複数のスリットの各々は、前記フィルター板の一端部から他端部に向かう方向と直交する方向に沿って延在するように形成されていることを特徴とする請求項１に記載の回収装置。 2. The recovery device according to claim 1, wherein each of the plurality of slits is formed to extend along a direction orthogonal to a direction from one end portion to the other end portion of the filter plate. .
  3. 　前記フィルター板の前記傾斜角度αが、０°＜α≦２０°の範囲内であることを特徴とする請求項１または２に記載の回収装置。 3. The recovery device according to claim 1, wherein the inclination angle α of the filter plate is within a range of 0 ° <α ≦ 20 °.
  4. 　前記フィルター板が、前記傾斜角度を変更可能なように支持されていることを特徴とする請求項１～３のいずれか一項に記載の回収装置。 The collection device according to any one of claims 1 to 3, wherein the filter plate is supported so that the inclination angle can be changed.
  5. 　半導体基板を処理液で洗浄して金属スラッジを除去する処理槽と、
    　前記処理槽から排出された処理液から金属スラッジを分離して回収する請求項１～４のいずれか一項に記載の回収装置と、
    を備えることを特徴とする洗浄装置。     A treatment tank for cleaning the semiconductor substrate with a treatment liquid to remove metal sludge;
    The recovery apparatus according to any one of claims 1 to 4, wherein metal sludge is separated and recovered from the processing liquid discharged from the processing tank;
    A cleaning apparatus comprising:
PCT/JP2016/086660 2015-12-11 2016-12-09 Recovery device and cleaning device WO2017099205A1 (en)

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CN111111904B (en) * 2019-12-31 2021-12-10 河南理工大学 Device and method capable of adapting to regulation and control of different fine-grained minerals interference settling separation flow fields
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