WO2017092429A1 - 电路板及其制作方法 - Google Patents

电路板及其制作方法 Download PDF

Info

Publication number
WO2017092429A1
WO2017092429A1 PCT/CN2016/096933 CN2016096933W WO2017092429A1 WO 2017092429 A1 WO2017092429 A1 WO 2017092429A1 CN 2016096933 W CN2016096933 W CN 2016096933W WO 2017092429 A1 WO2017092429 A1 WO 2017092429A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
cpu
interface
circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/096933
Other languages
English (en)
French (fr)
Inventor
李兴旺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Le Holdings Beijing Co Ltd
Leshi Zhixin Electronic Technology Tianjin Co Ltd
Original Assignee
Le Holdings Beijing Co Ltd
Leshi Zhixin Electronic Technology Tianjin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Le Holdings Beijing Co Ltd, Leshi Zhixin Electronic Technology Tianjin Co Ltd filed Critical Le Holdings Beijing Co Ltd
Publication of WO2017092429A1 publication Critical patent/WO2017092429A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/049PCB for one component, e.g. for mounting onto mother PCB

Definitions

  • the embodiments of the present application relate to the field of communications, and in particular, to a circuit board and a manufacturing method thereof.
  • PCB Printed Circuit Board
  • PCB is an important electronic component, it is the support of electronic components, and is the carrier of electrical connection of electronic components. After the PCB is used in electronic products, due to the consistency of similar PCBs, manual wiring errors are avoided, and electronic components can be automatically inserted or mounted, automatically soldered, and automatically detected to ensure the quality of electronic products and improve labor. Productivity, reduced costs, and ease of maintenance.
  • the complexity of the PCB often depends on the CPU's exit. The more powerful the CPU, the more PCB layers and orders are needed. The more layers and orders of the PCB, the more precise the design and production, the higher the production cost.
  • EMC Electro Magnetic Compatibility
  • EMC is an important measure of the quality of electronic products. EMC is the ability of a device or system to operate in its electromagnetic environment and to produce unacceptable electromagnetic interference to any device in its environment. Therefore, EMC includes two requirements: on the one hand, the electromagnetic interference generated by the equipment in the normal operation process cannot exceed a certain limit; on the other hand, the device has certain electromagnetic interference in the environment. The degree of immunity, ie electromagnetic sensitivity.
  • PCBA Print Circuit Board Assembly
  • the purpose of the embodiment of the present application is to provide a circuit board and a manufacturing method thereof, which can reduce the modification cost of the product and reduce the difficulty of product upgrade.
  • the embodiment of the present application provides a circuit board, which includes an interface board and a CPU board.
  • the interface board is a first printed circuit board on which an interface circuit is placed, and the CPU board is a CPU and a CPU related circuit. a second printed wiring board, the CPU board being detachably connected to the interface board.
  • circuit board may further have the following feature, the CPU board and the interface board are connected by a peripheral component interconnect extension standard PCIE interface.
  • circuit board may further have the following features, and the CPU board is fixed to the interface board by screws.
  • the above circuit board may further have the following features: the number of layers of the first printed wiring board is 2 layers or 4 layers.
  • the above circuit board may further have the following features: the number of layers of the second printed wiring board is 8 or more.
  • the frequently upgraded CPU and its related circuits and the less upgraded interface circuit are placed on two independent PCBs, so that the modification or upgrade of one of the two only needs to modify the corresponding PCB. Without having to modify the PCB of the entire product, the cost of the product is greatly reduced, and the modification time can be saved, saving human resources.
  • an embodiment of the present application further provides a method for fabricating a circuit board based on the foregoing, including:
  • the CPU board is detachably connected to the interface board.
  • the detachably connecting the CPU board to the interface board includes:
  • the CPU board and the interface board are connected by an external component interconnect extension standard PCIE interface.
  • the CPU board is detachably coupled to the The interface board connection also includes:
  • the CPU board is fixed to the interface board by screws.
  • the above method may further have the following feature, the number of layers of the first printed wiring board is 2 layers or 4 layers.
  • the above method may further have the following features: the number of layers of the second printed wiring board PCB is more than 8 layers.
  • the frequently upgraded CPU and its related circuit and the less upgraded interface circuit are placed on two independent PCBs, so that only one modification or upgrade of the two needs to be modified.
  • the corresponding PCB does not have to modify the PCB of the entire product, thus greatly reducing the cost of the product, and saving modification time and saving human resources.
  • FIG. 1 is a schematic structural view of a circuit board according to Embodiment 1 of the present application.
  • FIG. 2 is a schematic structural diagram of a circuit board in Embodiment 2 of the present application.
  • FIG. 3 is an exploded perspective view of an interface board and a CPU board in Embodiment 2 of the present application;
  • FIG. 4 is a flow chart of a method for fabricating a circuit board according to Embodiment 3 of the present application.
  • Modifications to electronic product PCBA are often focused on the parts that need to be upgraded. Among them, update The most frequent is the CPU part, and the upgrade of the interface part is slow. Therefore, the present application implements the CPU part and the interface part of the electronic product by using one PCB respectively, so that in the case that most of the interface parts do not need to be modified, only the PCB where the CPU part to be upgraded is located is modified, which can greatly reduce the product. Cost, and can save modification time and save human resources.
  • FIG. 1 is a schematic structural diagram of a circuit board according to Embodiment 1 of the present application.
  • the circuit board 100 can include an interface board 110 and a CPU board 120.
  • the interface board 110 is a first printed circuit board on which an interface circuit is placed, and the CPU board 120 is a CPU and a CPU related circuit.
  • the second printed circuit board, the CPU board 120 is detachably connected to the interface board 110.
  • the first printed circuit board and the second printed circuit board are two mutually independent PCBs, and one of the damages or modifications does not affect the availability of the other.
  • the detachable connection of the CPU board 120 to the interface board 110 means that the CPU board 120 and the interface board 110 are mutually independent parts, and the two can be connected together to implement communication, and the connection can also be disconnected and disconnected.
  • the connection has no effect on the individual CPU board 120 and the separate interface board 110, only the communication between the two is disconnected.
  • the CPU board 120 and the interface board 110 need to be connected, the two can be connected. Together, to achieve communication.
  • "removably connected” is like a connection between a USB flash drive and a USB interface.
  • the circuit board 100 in this embodiment when only the CPU part needs to be upgraded, and the interface part is not required to be modified, only the CPU board 120 needs to be detached from the interface board 110, a new CPU board is created, and the new one is replaced.
  • the CPU board can be mounted on the interface board 110.
  • the interface part needs to be upgraded, and the CPU part is not required to be modified
  • only the CPU board 120 needs to be detached from the interface board 110, a new interface board is created, and the original CPU board 120 is installed on the new interface board. .
  • the number of layers of the first printed wiring board may be 2 layers or 4 layers.
  • the number of layers of the second printed wiring board may be 8 or more.
  • the frequently upgraded CPU and its related circuits and the less upgraded interface circuit are placed on two independent PCBs, so that the modification or upgrade of one of the two only needs to modify the corresponding PCB. Without having to modify the PCB of the entire product, the cost of the product is greatly reduced, and the modification time can be saved, saving human resources.
  • the circuit board 200 may include an interface board 210 and a CPU board 220.
  • the interface board 210 is a first printed circuit board on which an interface circuit is placed, and the CPU board 220 is a CPU and a CPU.
  • a second printed circuit board of the CPU-related circuit, the CPU board 220 is detachably connected to the interface board 210.
  • the CPU board 220 and the interface board 210 can be connected through a PCIE (Peripheral Component Interface Express) interface 230.
  • the PCIE interface facilitates the connection between the interface board 210 and the CPU board 220, and implements communication between the interface board 210 and the CPU board 220.
  • the CPU board 220 can also be fixed on the interface board 210 by screws 240.
  • the screw 240 can strengthen the connection of the interface board 210 and the ground of the CPU board 220 while fixing the CPU board 220 to enhance the reliability of the product.
  • the frequently upgraded CPU and its related circuits and the less upgraded interface circuit are placed on two independent PCBs, so that the modification or upgrade of one of the two only needs to modify the corresponding PCB. Without having to modify the PCB of the entire product, the cost of the product is greatly reduced, and the modification time can be saved, saving human resources.
  • the circuit board can be a circuit board in any of the foregoing embodiments of the present application.
  • the manufacturing method of the circuit board may include the following steps:
  • Step S301 placing an interface circuit on the first printed circuit board to form an interface board
  • the number of layers of the first printed wiring board may be 2 layers or 4 layers.
  • Step S302 placing the CPU and the CPU related circuit on the second printed circuit board to form a CPU board;
  • the number of PCB layers of the second printed circuit board may be more than 8 layers.
  • the first printed wiring board and the second printed wiring board are two mutually independent PCBs, and damage or modification of one of them does not affect the usability of the other.
  • Step S303 the CPU board is detachably connected to the interface board.
  • the CPU board is detachably connected to the interface board, that is, the CPU board and the interface board are mutually exclusive
  • the vertical part, the two can be connected together to realize communication, the connection can also be disconnected, and the disconnection has no effect on the separate CPU board and the separate interface board, only the communication between the two is disconnected.
  • the CPU board and the interface board need to be connected, the two can be connected together for communication.
  • the detachably connecting the CPU board to the interface board may include: connecting the CPU board and the interface board through the PCIE interface.
  • the CPU board when the CPU board and the interface board are connected through the PCIE interface, the CPU board may be further fixed to the interface board by screws.
  • the frequently upgraded CPU and its related circuit and the less upgraded interface circuit are placed on two independent PCBs, so that only one modification or upgrade of the two needs to be modified.
  • the corresponding PCB does not have to modify the PCB of the entire product, thus greatly reducing the cost of the product, and saving modification time and saving human resources.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板及其制作方法,电路板包括接口板(110,210)和CPU板(120,220),接口板为放置接口电路的第一印刷线路板,CPU板为放置CPU及CPU相关电路的第二印刷线路板,CPU板可拆卸地与接口板相连。将升级频繁的CPU及其相关电路与升级较少的接口电路放置在相互独立的两块PCB上,使得对两者之一的修改或升级只需要修改相应的PCB,而不必修改整个产品的PCB,因此大大降低了产品的成本,并且能够节约修改时间,节省人力资源。

Description

电路板及其制作方法 技术领域
本申请实施例涉及通信领域,尤其涉及一种电路板及其制作方法。
背景技术
当今时代,人们的生活离不开各种各样的电子产品,而这些电子产品的制作都离不开PCB(Printed Circuit Board,印刷线路板)。PCB是重要的电子部件,它是电子元器件的支撑体,是电子元器件电气连接的载体。电子产品采用PCB后,由于同类PCB的一致性,从而避免了人工接线的差错,并可以实现电子元器件自动插装或贴装、自动焊锡、自动检测,保证了电子产品的质量,提高了劳动生产率、降低了成本,并便于维修。
PCB的复杂程度往往取决于CPU的出线情况。越强大的CPU需要的PCB层数和阶数也越多,PCB的层数和阶数越多,也就需要越精密的设计和生产,生产成本也就越高。
EMC(Electro Magnetic Compatibility,电磁兼容性)是衡量电子产品质量的一个重要标准。EMC是指设备或系统在其电磁环境中符合要求运行并不对其环境中的任何设备产生无法忍受的电磁干扰的能力。因此,EMC包括两个方面的要求:一方面是指设备在正常运行过程中对所在环境产生的电磁干扰不能超过一定的限值;另一方面是指器件对所在环境中存在的电磁干扰具有一定程度的抗扰度,即电磁敏感性。
电子产品由于追求更好的EMC效果,都需要有完整接地,往往都使用一整块PCB。产品设计的PCBA(Printed Circuit Board Assembly,印刷线路板装配)问题往往都是随着测试的时间和人数的增多慢慢暴露出来的。而解决PCBA问题往往又需要重新制作新的PCB或者修改新的BOM(Bill of Materials,物料清单)。这样,每次修改都要重新制作整个产品的PCB,导致产品的成本高居不下,并且耗费时间和人力资源。随着产品更新换代的频率越来越快,这个问题越来越突出。
发明内容
本申请实施例的目的在于提供一种电路板及其制作方法,降低产品的修改成本,减小产品升级难度。
为实现上述目的,本申请实施例提出了一种电路板,包括接口板和CPU板,所述接口板为放置接口电路的第一印刷线路板,所述CPU板为放置CPU及CPU相关电路的第二印刷线路板,所述CPU板可拆卸地与所述接口板相连。
进一步地,上述电路板还可具有以下特点,所述CPU板与所述接口板通过外设部件互连扩展标准PCIE接口相连。
进一步地,上述电路板还可具有以下特点,所述CPU板通过螺丝固定在所述接口板上。
进一步地,上述电路板还可具有以下特点,所述第一印刷线路板的层数为2层或4层。
进一步地,上述电路板还可具有以下特点,所述第二印刷线路板的层数为8层以上。
本申请实施例的电路板,将升级频繁的CPU及其相关电路与升级较少的接口电路放置在相互独立的两块PCB上,使得对两者之一的修改或升级只需要修改相应的PCB,而不必修改整个产品的PCB,因此大大降低了产品的成本,并且能够节约修改时间,节省人力资源。
为实现上述目的,本申请实施例还提出了一种基于上述的电路板的制作方法,包括:
将接口电路放置在第一印刷线路板上,形成接口板;
将CPU及CPU相关电路放置在第二印刷线路板上,形成CPU板;
将所述CPU板可拆卸地与所述接口板相连。
进一步地,上述方法还可具有以下特点,所述将所述CPU板可拆卸地与所述接口板相连包括:
将所述CPU板与所述接口板通过外设部件互连扩展标准PCIE接口相连。
进一步地,上述方法还可具有以下特点,所述将所述CPU板可拆卸地与所 述接口板相连还包括:
将所述CPU板通过螺丝固定在所述接口板上。
进一步地,上述方法还可具有以下特点,所述第一印刷线路板的层数为2层或4层。
进一步地,上述方法还可具有以下特点,所述第二印刷线路板PCB层数为8层以上。
本申请实施例的电路板的制作方法,将升级频繁的CPU及其相关电路与升级较少的接口电路放置在相互独立的两块PCB上,使得对两者之一的修改或升级只需要修改相应的PCB,而不必修改整个产品的PCB,因此大大降低了产品的成本,并且能够节约修改时间,节省人力资源。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明,这些示例性说明并不构成对实施例的限定,附图中具有相同参考数字标号的元件表示为类似的元件,除非有特别申明,附图中的图不构成比例限制。
图1为本申请实施例一中电路板的结构示意图;
图2为本申请实施例二中电路板的结构示意图;
图3为本申请实施例二中接口板和CPU板的分解示意图;
图4为本申请实施例三中电路板的制作方法的流程图。
具体实施方式
以下结合附图对本申请的原理和特征进行描述,所举实施例只用于解释本申请,并非用于限定本申请的范围。对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,根据本申请精神所获得的所有实施例,都属于本申请的保护范围。
电子产品PCBA的修改往往只是集中在需要升级的部分。其中,更新换代 频率最高的是CPU部分,而接口部分的升级比较缓慢。因此,本申请将电子产品的CPU部分和接口部分分别用一块PCB实现,这样,在大多数接口部分不需要修改的情况下,只修改需要升级的CPU部分所在的PCB,这样可以大大降低产品的成本,而且能够节约修改时间,节省人力资源。
图1为本申请实施例一中电路板的结构示意图。如图1所示,本实施例中,电路板100可以包括接口板110和CPU板120,其中,接口板110为放置接口电路的第一印刷线路板,CPU板120为放置CPU及CPU相关电路的第二印刷线路板,CPU板120可拆卸地与接口板110相连。
其中,第一印刷线路板和第二印刷线路板是两块相互独立的PCB,其中一个的损坏或修改不影响另一个的可用性。
其中,CPU板120可拆卸地与接口板110相连是指,CPU板120和接口板110两者为相互独立的部分,两者能够连接在一起,实现通信,该连接也可以断开,断开连接对单独的CPU板120和单独的接口板110都不产生影响,只使这两者之间的通信断开,当需要将CPU板120和接口板110连接时,这两者又可以连接在一起,实现通信。举例来说,“可拆卸地连接”就如同U盘与USB接口之间的连接一样。
对于本实施例中的电路板100来说,当只需要升级CPU部分,而不需要修改接口部分时,只需要将CPU板120从接口板110拆卸下来,制作新的CPU板,再将该新的CPU板安装到接口板110上即可。当只需要升级接口部分,而不需要修改CPU部分时,只需要将CPU板120从接口板110拆卸下来,制作新的接口板,再将原CPU板120安装到该新的接口板上即可。这样就不必每次修改都制作全部电路的PCB,从而降低了产品的成本,而且能够节约修改时间,节省人力资源。
其中,第一印刷线路板的层数可以为2层或4层。
其中,第二印刷线路板的层数可以为8层以上。
本申请实施例的电路板,将升级频繁的CPU及其相关电路与升级较少的接口电路放置在相互独立的两块PCB上,使得对两者之一的修改或升级只需要修改相应的PCB,而不必修改整个产品的PCB,因此大大降低了产品的成本,并且能够节约修改时间,节省人力资源。
图2为本申请实施例二中电路板的结构示意图,图3为本申请实施例二中接口板和CPU板的分解示意图。如图2和图3所示,本实施例中,电路板200可以包括接口板210和CPU板220,其中,接口板210为放置接口电路的第一印刷线路板,CPU板220为放置CPU及CPU相关电路的第二印刷线路板,CPU板220可拆卸地与接口板210相连。
再参见图2,本实施例中,CPU板220与接口板210可以通过PCIE(Peripheral Component Interface Express,外设部件互连扩展标准)接口230相连。PCIE接口方便接口板210和CPU板220的连接,实现接口板210和CPU板220的通信。
再参见图2,本实施例中,CPU板220还可以通过螺丝240固定在接口板210上。螺丝240能够加强接口板210和CPU板220的地的连接,同时固定CPU板220,增强产品的可靠性。
本申请实施例的电路板,将升级频繁的CPU及其相关电路与升级较少的接口电路放置在相互独立的两块PCB上,使得对两者之一的修改或升级只需要修改相应的PCB,而不必修改整个产品的PCB,因此大大降低了产品的成本,并且能够节约修改时间,节省人力资源。
图4为本申请实施例三中电路板的制作方法的流程图。该电路板可以是本申请前述任一实施例中的电路板。
如图4所示,本实施例中,电路板的制作方法可以包括如下步骤:
步骤S301,将接口电路放置在第一印刷线路板上,形成接口板;
其中,第一印刷线路板的层数可以为2层或4层。
步骤S302,将CPU及CPU相关电路放置在第二印刷线路板上,形成CPU板;
其中,第二印刷线路板PCB层数可以为8层以上。
第一印刷线路板和第二印刷线路板是两块相互独立的PCB,其中一个的损坏或修改不影响另一个的可用性。
步骤S303,将CPU板可拆卸地与接口板相连。
其中,CPU板可拆卸地与接口板相连是指,CPU板和接口板两者为相互独 立的部分,两者能够连接在一起,实现通信,该连接也可以断开,断开连接对单独的CPU板和单独的接口板都不产生影响,只使这两者之间的通信断开,当需要将CPU板和接口板连接时,这两者又可以连接在一起,实现通信。
在本申请实施例中,将CPU板可拆卸地与接口板相连可以包括:将CPU板与接口板通过PCIE接口相连。
在本申请实施例中,在将CPU板与接口板通过PCIE接口相连的情况下,还可以进一步将将CPU板通过螺丝固定在接口板上。
本申请实施例的电路板的制作方法,将升级频繁的CPU及其相关电路与升级较少的接口电路放置在相互独立的两块PCB上,使得对两者之一的修改或升级只需要修改相应的PCB,而不必修改整个产品的PCB,因此大大降低了产品的成本,并且能够节约修改时间,节省人力资源。
以上所述仅为本申请的较佳实施例,并不用以限制本申请,凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种电路板,其特征在于,包括接口板和CPU板,所述接口板为放置接口电路的第一印刷线路板,所述CPU板为放置CPU及CPU相关电路的第二印刷线路板,所述CPU板可拆卸地与所述接口板相连。
  2. 根据权利要求1所述的电路板,其特征在于,所述CPU板与所述接口板通过外设部件互连扩展标准PCIE接口相连。
  3. 根据权利要求2所述的电路板,其特征在于,所述CPU板通过螺丝固定在所述接口板上。
  4. 根据权利要求1所述的电路板,其特征在于,所述第一印刷线路板的层数为2层或4层。
  5. 根据权利要求1所述的电路板,其特征在于,所述第二印刷线路板的层数为8层以上。
  6. 一种基于权利要求1所述的电路板的制作方法,其特征在于,包括:
    将接口电路放置在第一印刷线路板上,形成接口板;
    将CPU及CPU相关电路放置在第二印刷线路板上,形成CPU板;
    将所述CPU板可拆卸地与所述接口板相连。
  7. 根据权利要求6所述的电路板的制作方法,其特征在于,所述将所述CPU板可拆卸地与所述接口板相连包括:
    将所述CPU板与所述接口板通过外设部件互连扩展标准PCIE接口相连。
  8. 根据权利要求7所述的电路板的制作方法,其特征在于,所述将所述CPU板可拆卸地与所述接口板相连还包括:
    将所述CPU板通过螺丝固定在所述接口板上。
  9. 根据权利要求6所述的电路板的制作方法,其特征在于,所述第一印刷线路板的层数为2层或4层。
  10. 根据权利要求6所述的电路板的制作方法,其特征在于,所述第二印刷线路板PCB层数为8层以上。
PCT/CN2016/096933 2015-12-02 2016-08-26 电路板及其制作方法 Ceased WO2017092429A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510872739.6A CN105873364A (zh) 2015-12-02 2015-12-02 电路板及其制作方法
CN201510872739.6 2015-12-02

Publications (1)

Publication Number Publication Date
WO2017092429A1 true WO2017092429A1 (zh) 2017-06-08

Family

ID=56623998

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/096933 Ceased WO2017092429A1 (zh) 2015-12-02 2016-08-26 电路板及其制作方法

Country Status (2)

Country Link
CN (1) CN105873364A (zh)
WO (1) WO2017092429A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105873364A (zh) * 2015-12-02 2016-08-17 乐视致新电子科技(天津)有限公司 电路板及其制作方法
CN111447734B (zh) * 2020-03-27 2022-05-10 绍兴上虞锴达电子有限公司 一种便捷式线路板
CN112654146A (zh) * 2020-12-11 2021-04-13 深圳市关维科技有限公司 一种标准pcb板与pcb板间的链接装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1867234A (zh) * 2006-06-26 2006-11-22 株洲南车时代电气股份有限公司 一种机车/车辆控制模块结构
CN2888803Y (zh) * 2006-05-09 2007-04-11 株洲南车时代电气股份有限公司 一种电力机车idd装置
KR20110020559A (ko) * 2009-08-24 2011-03-03 노틸러스효성 주식회사 금융 자동화기기의 임베디드 메인보드
CN203251499U (zh) * 2013-03-29 2013-10-23 江苏友奥电器有限公司 一种用于家电的电路板
CN105873364A (zh) * 2015-12-02 2016-08-17 乐视致新电子科技(天津)有限公司 电路板及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2888803Y (zh) * 2006-05-09 2007-04-11 株洲南车时代电气股份有限公司 一种电力机车idd装置
CN1867234A (zh) * 2006-06-26 2006-11-22 株洲南车时代电气股份有限公司 一种机车/车辆控制模块结构
KR20110020559A (ko) * 2009-08-24 2011-03-03 노틸러스효성 주식회사 금융 자동화기기의 임베디드 메인보드
CN203251499U (zh) * 2013-03-29 2013-10-23 江苏友奥电器有限公司 一种用于家电的电路板
CN105873364A (zh) * 2015-12-02 2016-08-17 乐视致新电子科技(天津)有限公司 电路板及其制作方法

Also Published As

Publication number Publication date
CN105873364A (zh) 2016-08-17

Similar Documents

Publication Publication Date Title
WO2017092429A1 (zh) 电路板及其制作方法
US20180368259A1 (en) Surface mount technology (smt) pad design having contact strips with converging narrowing contact surfaces
CN205029975U (zh) 一种pcb板的定位工装辅具
CN105376945B (zh) 电路板的过孔自动调整方法及系统
CN110996512B (zh) 一种印制电路板及其制作方法、终端
CN103685885A (zh) 触控屏与摄像模组集成装置
CN205016799U (zh) 一种usb座固定机构及终端
US9451719B2 (en) U form-factor intelligent electronic device (IED) hardware platform with matching of IED wiring, from a non U form-factor IED hardware platform using adapter structure
WO2016131379A1 (zh) 天线的带宽调试处理方法及装置
TW201301960A (zh) 電路板及其製作方法及採用該電路板的電子產品
CN206272738U (zh) 电视主板及电视机
EP3082330A1 (en) Mainboard structure and terminal
CN202940422U (zh) 电路转接装置及使用该电路转接装置的电子机箱
CN207752194U (zh) 一种光收发组件固定装置
US10667052B2 (en) Speaker module, and audio compensation method and apparatus
CN104768358A (zh) 屏蔽罩
CN212255506U (zh) 一种主板usb测试电路
US20120307438A1 (en) Electronic device having multifunctional network interface port
WO2017101341A1 (zh) 调谐器单元模组、调谐器及电子设备
CN105163013B (zh) 一种摄像头模组标准器件及其组装方法
CN205377951U (zh) 电子设备及其屏蔽框、屏蔽罩
CN206411562U (zh) 可选配可升级的无屏电脑
CN105898989A (zh) 一种可进行功能扩展的pcb装置,模块板及方法
CN206962689U (zh) 一种模组定位结构
CN205070991U (zh) 时分双工噪声抑制电路及移动终端

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16869740

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16869740

Country of ref document: EP

Kind code of ref document: A1