WO2017081975A1 - 受電装置及び非接触給電システム - Google Patents
受電装置及び非接触給電システム Download PDFInfo
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- WO2017081975A1 WO2017081975A1 PCT/JP2016/080248 JP2016080248W WO2017081975A1 WO 2017081975 A1 WO2017081975 A1 WO 2017081975A1 JP 2016080248 W JP2016080248 W JP 2016080248W WO 2017081975 A1 WO2017081975 A1 WO 2017081975A1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/60—Circuit arrangements or systems for wireless supply or distribution of electric power responsive to the presence of foreign objects, e.g. detection of living beings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
-
- H04B5/79—
Definitions
- the present invention relates to a power receiving device and a non-contact power feeding system.
- NFC Near Field Communication
- 13.56 MHz 13.56 MHz
- a technique for performing non-contact power feeding by a magnetic field resonance method using a coil used for NFC communication has also been proposed.
- a power transmission side resonance circuit including a power transmission side coil is disposed in a power transmission device and a power reception side resonance circuit including a power reception side coil is disposed in the power reception device, and the resonance frequency of those resonance circuits is set. Set to a common reference frequency. Then, an alternating current of the reference frequency is generated in the power transmission side coil by passing an alternating current through the power transmission side coil. Then, this alternating magnetic field is transmitted to the power receiving side resonance circuit that resonates at the reference frequency, and an alternating current flows through the power receiving side coil. That is, power is transmitted from the power transmission side resonance circuit including the power transmission side coil to the power reception side resonance circuit including the power reception side coil.
- a member that affects the characteristics and operation of the power receiving resonance circuit may be arranged.
- a metal plate made of aluminum or the like may be provided for a casing of an electronic device, or a magnetic sheet made of ferrite or the like may be provided for shielding an unnecessary magnetic field to an electronic circuit.
- the characteristics and operation of the power receiving resonance circuit can be affected through magnetic coupling with the power receiving coil.
- the above-described member may be magnetically coupled to the power transmission side coil and affect the characteristics and operation of the power transmission side resonance circuit.
- the non-ideal operation of some circuits in the power receiving apparatus may adversely affect the realization of the desired operation to be achieved by the non-contact power supply system.
- an object of the present invention is to provide a power receiving device and a non-contact power feeding system that contribute to realization of proper operation.
- a power receiving device is a power receiving device capable of receiving the power by a magnetic field resonance method from a power transmitting device having a power transmitting side resonance circuit including a power transmitting side coil for transmitting power.
- the power receiving device further includes a metal plate provided at a position that affects a resonance frequency of the power receiving side resonance circuit, and when the alternating magnetic field is linked to the auxiliary coil, the power receiving device uses the metal plate.
- a current that cancels a change in the resonance frequency of the power receiving side resonance circuit may flow in the auxiliary resonance circuit.
- the metal plate may be made of aluminum or an aluminum alloy.
- the power receiving device further includes a magnetic body portion provided at a position that affects a resonance frequency of the power receiving side resonance circuit, and when the alternating magnetic field is linked to the auxiliary coil, It is preferable that a current that cancels a change in the resonance frequency of the power-receiving-side resonance circuit by the body part flows in the auxiliary resonance circuit.
- the magnetic part may be composed of ferrite.
- the auxiliary resonance circuit may be a resonance circuit formed including the auxiliary coil and an auxiliary capacitor whose capacitance can be changed.
- the auxiliary resonant circuit further includes an auxiliary resistor, and the auxiliary resistor may be connected in parallel to a parallel circuit of the auxiliary coil and the auxiliary capacitor, or the auxiliary coil and the auxiliary coil The auxiliary resistor may be inserted in series with the series circuit with the auxiliary capacitor.
- a non-contact power feeding system includes the power receiving device and a power transmitting device having a power transmitting side resonance circuit including a power transmitting side coil for transmitting power, and can transmit and receive the power by a magnetic resonance method. It is characterized by being.
- the power transmission device includes a power transmission circuit capable of supplying an AC voltage to the power transmission side resonance circuit, a detection circuit that detects an amplitude of a current flowing through the power transmission side coil, And a control circuit that performs power transmission control of the power by controlling the power transmission circuit based on an amplitude detection value of the detection circuit.
- the power receiving device changes the resonance frequency of the power reception side resonance circuit from the resonance frequency at the time of power reception prior to power reception from the power transmission device, or the power reception side coil
- the power transmission side control unit performs a change in the resonance frequency of the power reception side resonance circuit or a short circuit of the power reception side coil in the power reception device in accordance with a signal transmitted from the power transmission device.
- a first processing unit that controls the power transmission circuit so that a predetermined test magnetic field is generated by the power transmission side coil prior to the power transmission, and the detection circuit when the test magnetic field is generated.
- a second processing unit that determines whether or not the power transmission can be performed based on an amplitude detection value; and a power transmission magnetic field that is larger than the test magnetic field after determining that the power transmission can be performed.
- a third processing unit that realizes the power transmission by controlling the power transmission circuit so as to be generated by the power transmission side coil.
- the power reception side resonance circuit has a current amplitude of the power transmission side coil. It is preferable that a current that counteracts the influence flows in the auxiliary resonance circuit.
- the power receiving device further includes a power receiving side control unit capable of stopping a resonance operation of the auxiliary resonance circuit caused by an alternating magnetic field interlinking with the auxiliary coil.
- the power reception side control unit may stop the resonance operation of the auxiliary resonance circuit when the power is transmitted and received.
- the auxiliary coil is between the power transmission side coil and the power reception side coil. It is good to arrange
- an object of the present invention is to provide a power receiving device and a non-contact power feeding system that contribute to the realization of a normal operation.
- FIG. 4 is a partial configuration diagram of a power supply device including an internal block diagram of an IC in the power supply device according to the first embodiment of the present invention.
- FIG. 3 is a partial configuration diagram of an electronic device including an internal block diagram of an IC in the electronic device according to the first embodiment of the present invention.
- FIG. 8 is a waveform diagram of a voltage drop of a sense resistor in the load detection circuit of FIG. 7. These are circuit diagrams which show an example of the resonance state change circuit which concerns on 1st Embodiment of this invention. These are circuit diagrams which show the other example of the resonance state change circuit which concerns on 1st Embodiment of this invention.
- (A) And (b) is the schematic external view and schematic internal block diagram of the foreign material which concern on 1st Embodiment of this invention.
- (A)-(d) is a figure which illustrates the arrangement
- FIG. 1 shows the 1st example and 2nd example of the cancellation circuit based on 2nd Embodiment of this invention.
- FIG. 1 shows the 1st example and 2nd example of the cancellation circuit based on 2nd Embodiment of this invention.
- A) And (b) is related with 2nd Embodiment of this invention, and is a schematic perspective view and sectional drawing of the power transmission side coil in a reference
- (A) And (b) is related with 2nd Embodiment of this invention, and is the rough perspective view and sectional drawing of the power transmission side coil in a reference
- (A) And (b) concerns on 2nd Embodiment of this invention, and is a schematic perspective view and sectional drawing of a power transmission side coil and a coil of a foreign material.
- FIGS. 1-10 These are the perspective views of the metal cases which can be provided in an electronic device concerning 2nd Embodiment of this invention. These are figures for demonstrating the magnitude
- FIG. 1 A)-(c) is a figure which shows the relationship of the electric current which concerns on 2nd Embodiment of this invention, and flows into a metal plate, a power transmission side coil, and a receiving side coil.
- FIG. 1B Example
- (A) And (b) is a figure which concerns on one Example (EX2_2A) of 2nd Embodiment of this invention, and shows the relationship of the electric current which flows into a power transmission side coil, a power receiving side coil, and a magnetic body board.
- FIG. 1A and 1B are schematic external views of a power supply device 1 and an electronic device 2 according to the first embodiment of the present invention.
- FIG. 1A is an external view of the power supply device 1 and the electronic device 2 when they are in a separated state
- FIG. 1B is a state where the power supply device 1 and the electronic device 2 are in a reference arrangement state. It is the external view of those times. The significance of the separation state and the reference arrangement state will be described in detail later.
- a contactless power supply system is formed by the power supply device 1 and the electronic device 2.
- the power supply device 1 includes a power plug 11 for receiving commercial AC power and a power supply base 12 formed of a resin material.
- FIG. 2 shows a schematic internal configuration diagram of the power supply device 1 and the electronic device 2.
- the power supply device 1 generates an AC / DC conversion unit 13 that generates and outputs a DC voltage having a predetermined voltage value from a commercial AC voltage input via the power plug 11, and outputs the output voltage of the AC / DC conversion unit 13.
- a power transmission side IC 100 (hereinafter also referred to as IC 100), which is an integrated circuit that is used and driven, and a power transmission side resonance circuit TT (hereinafter also referred to as resonance circuit TT) connected to the IC 100 are provided.
- the AC / DC conversion unit 13, the power transmission side IC 100, and the resonance circuit TT can be arranged in the power supply base 12.
- a circuit that is driven using the output voltage of the AC / DC conversion unit 13 may be provided in the power supply device 1 in addition to the IC 100.
- the electronic device 2 includes a power receiving side IC 200 that is an integrated circuit (hereinafter also referred to as IC 200), a power receiving side resonance circuit RR that is connected to the IC 200 (hereinafter also referred to as resonant circuit RR), and a battery 21 that is a secondary battery. And a functional circuit 22 that is driven based on the output voltage of the battery 21.
- the IC 200 can supply charging power to the battery 21.
- the IC 200 may be driven by the output voltage of the battery 21 or may be driven based on a voltage from a voltage source other than the battery 21.
- a DC voltage obtained by rectifying a signal for NFC communication (details will be described later) received from the power supply device 1 may be the driving voltage of the IC 200.
- the IC 200 can be driven even if the remaining capacity of the battery 21 runs out.
- the electronic device 2 may be any electronic device, such as a mobile phone (including a mobile phone classified as a smart phone), a portable information terminal, a tablet personal computer, a digital camera, an MP3 player, a pedometer, or , A Bluetooth® headset.
- the functional circuit 22 realizes an arbitrary function that the electronic device 2 should realize. Therefore, for example, if the electronic device 2 is a smart phone, the functional circuit 22 transmits / receives information to / from other devices via a call processing unit for realizing a call with the counterpart device and a network. Including a communication processing unit.
- the functional circuit 22 includes a drive circuit that drives the image sensor, an image processing circuit that generates image data from an output signal of the image sensor, and the like.
- the functional circuit 22 may be considered as a circuit provided in an external device of the electronic device 2.
- the resonant circuit TT includes a capacitor T C is a coil T L and the power transmitting side capacitor as the power transmission coil, the resonant circuit RR is the power-receiving-side capacitor and the coil R L is a receiver coil And a capacitor RC .
- the power transmission coil T L and a resonant circuit TT by the power transmission side capacitor T C are connected in parallel to each other are formed as a parallel resonance circuit, and the power receiving side coil It is assumed that the resonance circuit RR is formed as a parallel resonance circuit by connecting R L and the power receiving side capacitor RC in parallel.
- the resonant circuit TT by transmitting coil T L and the power-transmitting-side capacitor T C is connected in series with each other may be formed as a series resonant circuit
- the power receiving side coil R L and the power-receiving-side capacitor R C each other The resonance circuit RR may be formed as a series resonance circuit by being connected in series.
- NFC communication Near field communication wireless communication
- the frequency of the communication carrier wave is 13.56 MHz (megahertz).
- 13.56 MHz is referred to as a reference frequency. Since NFC communication between the devices 1 and 2 is performed by a magnetic field resonance method using the resonance circuits TT and RR, the resonance frequencies of the resonance circuits TT and RR are both set to the reference frequency.
- the inductance value and the inductance value and the capacitance value of the power receiving side capacitor R C of the resonance frequency and the power receiving coil R L of the resonance circuit TT determined by the capacitance value of the power transmission capacitor T C of the power transmission coil T L The resonance frequency of the resonance circuit RR determined by is coincident with the reference frequency. However, as will be described later, the resonance frequency of the resonance circuit RR can be temporarily changed from the reference frequency.
- the power transmission and power reception between the devices 1 and 2 are power transmission by NFC from the power supply device 1 to the electronic device 2 and power reception by NFC in the electronic device 2.
- This power transmission and power reception are collectively referred to as NFC power transmission or simply power transmission.
- NFC power transmission By transmitting the power from the coil T L with respect to the coil R L by magnetic field resonance method, the power transmission is achieved in a non-contact manner.
- the state in which the electronic device 2 is placed in a predetermined power transmission area on the power supply stand 12 (the power supply device 1 and the electronic device 2 are in a predetermined positional relationship) and the above-described NFC communication and power transmission can be realized is a reference arrangement state. (Refer to FIG. 1B).
- a state in which the electronic device 2 is sufficiently separated from the power supply stand 12 and cannot realize the above-described NFC communication and power transmission is referred to as a separated state (see FIG. 1A).
- the surface of the power supply base 12 shown in FIG. 1A is flat, a depression or the like that matches the shape of the electronic device 2 to be placed may be formed in the power supply base 12. .
- the reference arrangement state is a state in which the electronic device 2 exists in a predetermined power transmission region (in other words, a region for performing power transmission and power reception) in which power can be transmitted and received between the power supply device 1 and the electronic device 2.
- the belonging and separated state may be understood as belonging to a state in which the electronic device 2 does not exist in the power transmission area.
- FIG. 4 shows a partial configuration diagram of the power supply device 1 including an internal block diagram of the IC 100.
- the IC 100 is provided with each part referred to by reference numerals 110, 120, 130, 140, 150 and 160.
- FIG. 5 shows a configuration diagram of a part of the electronic device 2 including an internal block diagram of the IC 200.
- the IC 200 is provided with each part referred to by reference numerals 210, 220, 230, 240 and 250.
- the capacitor 23 that outputs the driving voltage of the IC 200 may be connected to the IC 200.
- the capacitor 23 can output a DC voltage obtained by rectifying a signal for NFC communication received from the power supply device 1.
- the switching circuit 110 connects either the NFC communication circuit 120 or the NFC power transmission circuit 130 to the resonance circuit TT under the control of the control circuit 160.
- the switching circuit 110 can be configured by a plurality of switches interposed between the resonance circuit TT and the circuits 120 and 130. Any switch described herein may be formed using a semiconductor switching element such as a field effect transistor.
- the switching circuit 210 connects the resonance circuit RR to either the NFC communication circuit 220 or the NFC power receiving circuit 230 under the control of the control circuit 250.
- the switching circuit 210 can be configured by a plurality of switches interposed between the resonance circuit RR and the circuits 220 and 230.
- the state where the resonance circuit TT is connected to the NFC communication circuit 120 via the switching circuit 110 and the resonance circuit RR is connected to the NFC communication circuit 220 via the switching circuit 210 is called a communication connection state.
- NFC communication is possible in the communication connection state.
- the NFC communication circuit 120 can supply an AC signal (AC voltage) having a reference frequency to the resonance circuit TT.
- NFC communication between the devices 1 and 2 is performed in a half-duplex manner.
- NFC communication circuit 220 may transmit any information signal (response signal) from the coil R L of the resonance circuit RR to the coil T L of the resonance circuit TT.
- this transmission is based on the ISO standard (for example, ISO 14443 standard), and is based on a load modulation method that changes the impedance of the coil R L (electronic device side antenna coil) viewed from the coil T L (power supply device side antenna coil). Realized.
- the information signal transmitted from the electronic device 2 is extracted by the NFC communication circuit 120.
- the state where the resonance circuit TT is connected to the NFC power transmission circuit 130 via the switching circuit 110 and the resonance circuit RR is connected to the NFC power reception circuit 230 via the switching circuit 210 is referred to as a power supply connection state.
- the NFC power transmission circuit 130 can perform a power transmission operation, and the NFC power reception circuit 230 can perform a power reception operation.
- Power transmission is realized by power transmission operation and power reception operation.
- the power transmission circuit 130 supplies a power transmission magnetic field (power transmission alternating magnetic field) to the power transmission side coil TL by supplying a power transmission AC signal (power transmission AC voltage) to the resonance circuit TT.
- a power transmission AC signal power transmission AC voltage
- electric power is transmitted from the resonance circuit TT (power transmission side coil T L ) to the resonance circuit RR by the magnetic field resonance method.
- the power received by the power receiving coil RL based on the power transmission operation is sent to the power receiving circuit 230.
- the power receiving circuit 230 In the power receiving operation, the power receiving circuit 230 generates and outputs arbitrary DC power from the received power.
- the battery 21 can be charged with the output power of the power receiving circuit 230.
- the magnetic field strength in the NFC communication is within a predetermined range.
- the lower limit value and the upper limit value of the range are determined by NFC standards, and are 1.5 A / m and 7.5 A / m, respectively.
- the strength of the magnetic field generated in the power transmission coil TL (magnetic field strength of the power transmission magnetic field) in power transmission is larger than the above upper limit, for example, about 45 to 60 A / m. .
- NFC communication and power transmission can be performed alternately, and the state of the magnetic field strength at that time is shown in FIG.
- FIG. 7 shows a relationship among the power transmission circuit 130, the load detection circuit 140, and the resonance circuit TT in the power supply connection state. In FIG. 7, the switching circuit 110 is not shown.
- the power transmission circuit 130 amplifies the sine wave signal generated by the signal generator 131 and the signal generator 131 that generates a sine wave signal of a reference frequency, and the amplified sine wave signal is lined with the potential of the line 134 as a reference.
- An amplifier (power amplifier) 132 that outputs between 134 and 135 and a capacitor 133 are provided.
- the load detection circuit 140 includes a sense resistor 141, an envelope detector 142, an amplifier 143, and an A / D converter 144.
- the signal intensity of the sine wave signal generated by the signal generator 131 is fixed to a constant value, but the amplification factor of the amplifier 132 is variably set by the control circuit 160.
- One end of the capacitor 133 is connected to the line 135.
- the other end of the capacitor 133 are connected in common to one ends of the capacitor T C and coil T L, and the coil T L at the other end another line 134 and the capacitor T C via the sense resistor 141 Commonly connected to the ends.
- the power transmission operation is realized by supplying an AC signal (AC voltage for power transmission) from the amplifier 132 to the resonance circuit TT via the capacitor 133.
- an AC signal from the amplifier 132 is supplied to the resonance circuit TT in the power supply connection state, an AC current having a reference frequency flows in the power transmission side coil TL .
- an AC voltage drop occurs in the sense resistor 141.
- a solid line waveform in FIG. 8 is a voltage waveform of a voltage drop in the sense resistor 141.
- the envelope detector 142 outputs an analog voltage signal proportional to the voltage v in FIG. 8 by detecting the envelope of the voltage drop signal in the sense resistor 141.
- the amplifier 143 amplifies and outputs the output signal of the envelope detector 142.
- the A / D converter 144 outputs a digital voltage value V D by converting the output voltage signal of the amplifier 143 into a digital signal.
- the voltage value V D has a value proportional to the amplitude of the current flowing through the sense resistor 141 (and hence the amplitude of the current flowing through the power transmission side coil TL ) (increase in the amplitude). Along with this, the voltage value V D also increases).
- the load detection circuit 140 is a current amplitude detection circuit that detects the amplitude of the current flowing through the power transmission side coil TL , and it can be considered that the amplitude detection value is the voltage value V D.
- the envelope detector 142 may be provided after the amplifier 143. However, as shown in FIG. 7, it is advantageous to provide the envelope detector 142 in front of the amplifier 143 because it is possible to adopt the amplifier 143 having a lower response performance to a high frequency.
- the load detection circuit 140 detects the magnitude of the load by the output voltage value V D, and can be considered.
- the magnitude of the load here can be said to be the magnitude of the load on the power transmission side coil TL at the time of power transmission, and can also be said to be the magnitude of the load of the electronic device 2 as viewed from the power feeding device 1 at the time of power transmission.
- the sense resistor 141 may be provided inside the IC 100 or may be provided outside the IC 100.
- the memory 150 (see FIG. 4) is composed of a nonvolatile memory, and stores arbitrary information in a nonvolatile manner.
- the control circuit 160 comprehensively controls the operation of each part in the IC 100.
- the control performed by the control circuit 160 includes, for example, control of switching operation of the switching circuit 110, content control and execution presence / absence control of communication operation and power transmission operation by the communication circuit 120 and power transmission circuit 130, operation control of the load detection circuit 140, memory 150 storage controls and read controls are included.
- the control circuit 160 has a built-in timer (not shown) and can measure the time length between arbitrary timings.
- the electronic device 2 in the resonance state changing circuit 240 (see FIG. 5), the other predetermined frequency f M can be changed to a resonant frequency changing circuit from the reference frequency to the resonant frequency of the resonant circuit RR, or the power receiving side coil in the resonance circuit RR This is a coil short circuit capable of short-circuiting RL .
- a resonance frequency changing circuit 240 ⁇ / b> A in FIG. 9 is an example of a resonance frequency changing circuit as the resonance state changing circuit 240.
- the resonance frequency changing circuit 240A includes a series circuit of a capacitor 241 and a switch 242, and one end of the series circuit is commonly connected to one end of each of the capacitor RC and the coil RL , while the other end of the series circuit is the capacitor R. C and the other end of the coil RL are commonly connected.
- the switch 242 is turned on or off under the control of the control circuit 250.
- the resonance circuit RR is formed by only the coil RL and the capacitor RC if the parasitic inductance and the parasitic capacitance are ignored.
- the resonance frequency of the resonance circuit RR matches the reference frequency. That is, when the switch 242 is off, the power receiving side capacitance that determines the resonance frequency of the resonance circuit RR is the capacitor RC itself. Since the capacitor 241 is connected in parallel to the capacitor RC when the switch 242 is on, the resonance circuit RR is formed by the coil RL and the combined capacitance of the capacitors RC and 241. As a result, the resonance circuit RR resonance frequency is low frequency f M than the reference frequency.
- the power receiving side capacitance that determines the resonance frequency of the resonance circuit RR is the above-described combined capacitance.
- the frequency f M is such that the resonance circuit RR does not function as a load on the power transmission side coil TL (ie, enough magnetic resonance does not occur between the resonance circuits TT and RR). It is assumed that it is far from the reference frequency.
- the resonance frequency (that is, the frequency f M ) of the resonance circuit RR when the switch 242 is on is several hundred kHz to 1 MHz.
- the resonance frequency change circuit as changing circuit 240 is not limited to the resonance frequency change circuit 240A, the frequency f M may be higher than the reference frequency.
- the circuit switching the unconnected When the connection is not established, the resonance frequency (>> reference frequency) of the resonance circuit RR is determined by the coil RL and the parasitic capacitance of the wiring).
- the power receiving side resonance circuit RR can be a series resonance circuit.
- the power reception side resonance circuit RR has a parallel circuit or series circuit of a power reception side coil (R L ) and a power reception side capacitance, and the resonance frequency of the power reception side resonance circuit RR when the power reception side capacitance matches a predetermined reference capacitance. f O matches the reference frequency.
- the resonance frequency changing circuit increases or decreases the power receiving side capacitance from the reference capacitance at a necessary timing.
- a parallel circuit or a series circuit is formed by the power receiving side coil (R L ) and the power receiving side capacitance larger or smaller than the reference capacity, and as a result, the resonance frequency of the power receiving side resonance circuit RR.
- f O is changed from the reference frequency.
- a coil short circuit 240B in FIG. 10 is an example of a coil short circuit as the resonance state changing circuit 240.
- the coil short circuit 240B a node where one end of the capacitor RC and one end of the coil RL in the resonance circuit RR are commonly connected, and the other end of the capacitor RC and the other end of the coil RL in the resonance circuit RR are commonly connected.
- the switch 243 is connected (inserted) between the nodes.
- the switch 243 is turned on or off under the control of the control circuit 250. When the switch 243 is turned on, the coil RL in the resonance circuit RR is short-circuited (more specifically, both ends of the coil RL are short-circuited).
- the power receiving side resonance circuit RR does not exist (a state equivalent to a state where the power receiving side resonance circuit RR does not exist). Therefore, while the power receiving coil RL is short-circuited, the load on the power transmitting coil TL is sufficiently lightened (that is, as if the electronic device 2 does not exist on the power supply base 12). As long as the power receiving coil RL can be short-circuited, the coil short-circuit as the changing circuit 240 is not limited to the coil short-circuit 240B.
- the operation of changing the resonance frequency f O of the power reception side resonance circuit RR from the reference frequency in a predetermined frequency f M is called the resonant frequency changing operation, the operation of short-circuit power receiving coil R L by using a coil short circuit This is called a coil short-circuit operation.
- the resonance frequency changing operation or the coil short-circuiting operation may be referred to as f O changing / short-circuiting operation.
- the control circuit 250 comprehensively controls the operation of each part in the IC 200.
- the control performed by the control circuit 250 includes, for example, control of switching operation of the switching circuit 210, content control and execution presence / absence control of communication operation and power reception operation by the communication circuit 220 and power reception circuit 230, and operation control of the change circuit 240. .
- the control circuit 250 has a built-in timer (not shown) and can measure the time length between arbitrary timings. For example, a timer in the control circuit 250, f O changes / short operation due to the resonance frequency f O of the change or the power receiving side time measuring the short-circuit of the coil R L is maintained to a predetermined frequency f M (i.e. below the time T M Measurement; see step S207 in FIG. 19).
- the control circuit 160 of the power supply device 1 can determine whether or not there is a foreign object on the power supply stand 12 and can control the power transmission circuit 130 to perform a power transmission operation only when there is no foreign object.
- the foreign matter in the present embodiment has a current (based on the magnetic field generated by the power transmitting side coil TL when approaching the power feeding device 1. This includes objects that can generate a current in a foreign object.
- the presence of foreign matter may be understood to mean that the foreign matter is present at a position where a non-negligible current flows in the foreign matter based on the magnetic field generated by the power transmission coil TL. .
- the current that has flowed in the foreign matter based on the magnetic field generated by the power transmission side coil TL generates an electromotive force (or counter electromotive force) in the coil ( TL or RL ) that faces and couples to the foreign matter. This can have a non-negligible effect on the characteristics of the circuit including the coil.
- FIG. 11A shows a schematic external view of a foreign material 3 which is a kind of foreign material
- FIG. 11B shows a schematic internal configuration diagram of the foreign material 3.
- the foreign object 3 includes a resonance circuit JJ composed of a parallel circuit of a coil J L and a capacitor J C , and a foreign substance circuit 300 connected to the resonance circuit JJ.
- the resonance frequency of the resonance circuit JJ is set to the reference frequency.
- the foreign material 3 is a device that does not correspond to the power supply device 1.
- the foreign material 3 is an object (such as a non-contact IC card) having a wireless IC tag having an antenna coil (coil J L ) of 13.56 MHz that does not respond to NFC communication.
- the foreign object 3 is an electronic device that has the NFC communication function itself but is disabled.
- a smartphone that has an NFC communication function but whose function is turned off by software setting can be a foreign object 3.
- a smart phone in which the NFC communication function is valid a smart phone that does not have a power receiving function is classified as the foreign object 3.
- a strong magnetic field for example, a magnetic field strength of 12 A / m or more generated by the power transmission side coil TL is generated.
- the foreign matter 3 may be destroyed by the magnetic field having For example, a strong magnetic field during the transmission operation, also have to increase the terminal voltage of the coil J L foreign material 3 on the feeding table 12 up to 100 V ⁇ 200V, foreign body 3 is formed to withstand such a high voltage If not, the foreign material 3 is destroyed.
- FIG. 12 is a flowchart of foreign object detection processing (hereinafter referred to as pFOD processing) executed by the power supply device 1 before power transmission.
- the control circuit 160 When executing the pFOD process, the power transmission circuit 130 is connected to the resonance circuit TT.
- the control circuit 160 first sets the magnetic field strength H by the power transmission side coil TL to a predetermined test strength in step S11.
- the magnetic field strength H is a magnetic field strength generated by the power transmission side coil TL , and more specifically indicates a magnetic field strength of an alternating magnetic field that vibrates at a reference frequency generated by the power transmission side coil TL . Setting the magnetic field strength H to the test strength means that the power transmission circuit 130 is controlled so that a predetermined test AC signal (test AC voltage) is supplied to the resonance circuit TT, thereby having the test strength and the reference frequency.
- the control circuit 160 can variably set the magnetic field strength H by controlling the amplification factor of the amplifier 132 (see FIG. 7).
- a predetermined test AC voltage is supplied to and applied to the resonance circuit TT when the test magnetic field is generated, and a predetermined amplitude having a larger amplitude than the test AC voltage is generated when the power transmission magnetic field is generated.
- the amplification factor of the amplifier 132 may be controlled so that the AC voltage for power transmission is supplied and applied to the resonance circuit TT.
- step S12 the control circuit 160 uses the load detection circuit 140 to acquire the voltage value V D when the test magnetic field is generated as the current amplitude detection value V pFOD .
- Current amplitude detection value V PFOD has a value corresponding to the amplitude of the current flowing through the power transmitting coil T L when to generate a test magnetic field to the power transmission coil T L.
- f O changes / short operation in the electronic apparatus 2 in accordance with an instruction from the power supply apparatus 1 via the NFC communication (resonance frequency change operation or coil short circuit operation) is being performed . Therefore, the resonance circuit RR (power reception side coil R L ) does not substantially function as a load of the power transmission side coil T L and causes no or almost no decrease in the current amplitude detection value V pFOD .
- step S13 the control circuit 160 determines whether or not the current amplitude detection value V pFOD is within a predetermined pFOD normal range.
- the control circuit 160 determines that the foreign material 3 does not exist on the power supply base 12 (step S14). This determination is referred to as foreign object determination.
- the control circuit 160 determines that the foreign material 3 exists on the power supply base 12 (step S15). This determination is referred to as a foreign object determination.
- the control circuit 160 determines that the power transmission operation by the power transmission circuit 130 is possible, permits the power transmission operation (power transmission using the resonance circuit TT), and determines whether there is a foreign object. If it has been established, it is determined that the power transmission operation by the power transmission circuit 130 is impossible, and the execution of the power transmission operation is prohibited. When it is determined that the power transmission operation can be performed, in the power transmission operation, the control circuit 160 can control the power transmission circuit 130 such that a predetermined power transmission magnetic field is generated in the power transmission side coil TL .
- the pFOD normal range is a range that is not less than a predetermined lower limit value V pREFL and not more than a predetermined upper limit value V pREFH (0 ⁇ V pREFL ⁇ V pREFH ). Therefore, when the determination inequality “V pREFL ⁇ V pFOD ⁇ V pREFH ” is satisfied, the foreign object determination is made, and otherwise, the foreign object determination is made.
- the resonance circuit JJ (coil J L ) of the foreign matter 3 functions as a load of the power transmission side coil TL.
- the current amplitude detection value V pFOD is decreased as compared with the case where no foreign matter 3 exists in FIG.
- the foreign material 3a (not shown) different from the foreign material 3 is also considered as a foreign material.
- the foreign material 3a is, for example, a metal body (aluminum foil or aluminum plate) formed including aluminum or a metal body formed including copper.
- the current amplitude detection value V pFOD is less than the lower limit value V pREFL , and the foreign object 3a is present on the power supply table 12. If the current amplitude detection value V pFOD exceeds the upper limit value V pREFH and no foreign matter (3 or 3a) is present on the power supply base 12, the current amplitude detection value V pFOD is pFOD.
- the lower limit value V pREFL and the upper limit value V pREFH are set in advance and stored in the memory 150 through experiments or the like so as to be within the normal range.
- the magnetic field for power transmission is generated in a state where the foreign object 3a exists on the power supply stand 12, the power is absorbed by the foreign object 3a, and the foreign object 3a may generate heat.
- the reference frequency as the carrier frequency of power transmission is 13.56 MHz, it can be said that the possibility of such heat generation is sufficiently small. Therefore, the presence of foreign matter is determined only when the current amplitude detection value V pFOD falls below the lower limit value V pREFL without considering the presence of the foreign matter 3a, and the current amplitude detection value V pFOD is greater than or equal to the lower limit value V pREFL.
- the foreign object non- existence determination may be performed (that is, the upper limit value V pREFH may be eliminated).
- the reference frequency in the invention according to the present embodiment is not limited to 13.56 MHz, in the case where the reference frequency, for example, about several 100kHz, because fear of heat generation of the foreign matter 3a is higher, only the lower limit value V PREFL It is desirable to adopt the above-described method in which the upper limit value V pREFH is set to the normal range of pFOD.
- FIG. 13 is an operation flowchart of the initial setting process.
- the initial setting process is executed by the IC 100 under the following initial setting environment.
- the initial setting process may be performed at the time of manufacturing or shipping the power supply device 1. However, if the initial setting environment can be secured, the initial setting process can be performed at an arbitrary timing.
- the power transmission circuit 130 When executing the initial setting process, the power transmission circuit 130 is connected to the resonance circuit TT. Then, in step S21, the magnetic field strength H by the power transmission side coil TL is set to a predetermined test strength, and in the subsequent step S22, the voltage value V D acquired from the A / D converter 144 in the set state is set as the voltage. Obtained as the value V DO . In subsequent step S23, lower limit value V pREFL based on voltage value V DO is stored in memory 150. The lower limit value V pREFL is set to a value lower than the voltage value V DO so that the presence of foreign matter is determined in the pFOD process only in the presence of the foreign matter 3.
- k is a coefficient having a positive predetermined value less than 1. Note that the voltage value V D that would be obtained when the magnetic field strength H is set to a predetermined test strength in the initial setting environment can be estimated at the design stage. Based on the value derived by this estimation, the lower limit value V pREFL may be determined and stored in the memory 150 without performing the initial setting process.
- the load on the power transmission side coil T L is sufficiently lightly (That is, it is as if the electronic device 2 does not exist on the power supply stand 12), and the current amplitude detection value V pFOD becomes sufficiently large to determine that there is no foreign object.
- the resonance frequency of the resonance circuit RR is changed to the frequency f M or the power reception side coil RL is short-circuited, the foreign matter 3 continues to exist as a load of the power transmission side coil TL. For this reason (because the resonance frequency of the resonance circuit JJ of the foreign material 3 remains the reference frequency), the current amplitude detection value V pFOD becomes sufficiently small and foreign matter determination is made.
- the power supply device 1 can determine whether or not the electronic device 2 that can support power transmission exists on the power supply base 12 by NFC communication.
- the state in which the foreign object 3 is present on the power supply base 12 is not limited to the state in which the foreign object 3 is in direct contact with the power supply base 12. For example, as shown in FIG. 15, a foreign object presence determination is also made in a state where the electronic device 2 exists in direct contact with the power supply stand 12 and the foreign material 3 exists on the electronic device 2. As long as the foreign object 3 exists on the power supply stand 12, it belongs.
- the power supply device 1 is a transmission side and the electronic device 2 is a reception side, and the power supply device 1 (IC 100) transmits an inquiry signal 510 to a device on the power supply base 2 (hereinafter also referred to as a power supply target device) by NFC communication.
- the power supply target device includes the electronic device 2 and may include the foreign material 3.
- the inquiry signal 510 is, for example, a signal for inquiring unique identification information of a power supply target device, a signal for inquiring whether the power supply target device is in a state where NFC communication can be performed, and whether the power supply target device can receive power or transmit power. It includes a signal that asks if you are seeking
- the electronic device 2 (IC 200) that has received the inquiry signal 510 transmits a response signal 520 that answers the inquiry content of the inquiry signal 510 to the power supply device 1 by NFC communication.
- the power supply device 1 (IC 100) that has received the response signal 520 analyzes the response signal 520, and if the power supply target device is capable of NFC communication and can receive power or requests power transmission, a test request
- the signal 530 is transmitted to the power supply target device by NFC communication.
- the electronic device 2 (IC 200) as the power supply target device that has received the test request signal 530 transmits a response signal 540 to the test request signal 530 to the power supply device 1 by NFC communication, and then promptly changes the f O / A short-circuit operation (resonance frequency changing operation or coil short-circuit operation) is executed.
- the test request signal 530 is a signal for requesting and instructing execution of the f O change / short circuit operation
- the control circuit 250 of the electronic device 2 receives the test request signal 530 as an opportunity to change / short circuit the f O.
- the operation is executed by the resonance state changing circuit 240.
- the f O change / short-circuit operation is not executed.
- f O changes / short test request signal 530 if the trigger for the execution of the operation may be any signal, or may be contained in the inquiry signal 510.
- the power supply apparatus 1 (IC 100) that has received the response signal 540 executes the above-described pFOD process.
- the electronic device 2 (IC 200) continues to execute the f 2 O change / short-circuit operation.
- the electronic device 2 (IC 200) is built-in timer with, f O changes / short since maintaining the execution of only f O changes / short operation time corresponding to the length of the execution period of pFOD process Stop operation.
- the power supply device 1 transmits an authentication signal 550 to the power supply target device by NFC communication.
- the authentication signal 550 includes, for example, a signal for notifying the power supply target device that power transmission will be performed from now on.
- the electronic device 2 (IC 200) that has received the authentication signal 550 transmits a response signal 560 corresponding to the authentication signal 550 to the power supply device 1 by NFC communication.
- the response signal 560 includes, for example, a signal notifying that the content indicated by the authentication signal 550 has been recognized or a signal giving permission to the content indicated by the authentication signal 550.
- the power supply device 1 (IC 100) that has received the response signal 560 executes the power transmission operation by connecting the power transmission circuit 130 to the resonance circuit TT, thereby realizing the power transmission 570.
- the power transmission 570 is executed according to the above flow. However, in the second case of FIG. 14B, the process proceeds until the transmission / reception of the response signal 540. Since it is determined that there is a foreign object on the power supply stand 12 in the pFOD process, the power transmission 570 is not executed.
- One power transmission 570 may be performed only for a predetermined time, and a series of processing from transmission of the inquiry signal 510 to power transmission 570 may be repeatedly executed.
- NFC communication, pFOD processing, and power transmission NFC power transmission
- NFC power transmission can be executed sequentially and repeatedly. That is, in the non-contact power supply system, the operation of performing NFC communication, the operation of performing pFOD processing, and the operation of performing power transmission (NFC power transmission) can be repeatedly performed in order in a time division manner.
- FIG. 18 is an operation flowchart of the power supply device 1. The operations of the communication circuit 120 and the power transmission circuit 130 are executed under the control of the control circuit 160.
- step S101 the control circuit 160 connects the communication circuit 120 to the resonance circuit TT through the control of the switching circuit 110.
- the control circuit 160 transmits an inquiry signal 510 to the power supply target device by NFC communication using the communication circuit 120 and the resonance circuit TT, and then waits for reception of the response signal 520 in step S103.
- the control circuit 160 analyzes the response signal 520, and the power supply target device is capable of NFC communication and can receive power or request power transmission.
- step S104 Y in step S104
- the process proceeds to step S105. Otherwise (N in step S104), the process returns to step S102.
- step S105 the control circuit 160 transmits the test request signal 530 to the power supply target device by NFC communication using the communication circuit 120 and the resonance circuit TT, and then waits for reception of the response signal 540 in step S106.
- the control circuit 160 connects the power transmission circuit 130 to the resonance circuit TT through the control of the switching circuit 110, and in the subsequent step S108, the above-described pFOD process is performed. Do.
- step S109 the control circuit 160 connects the communication circuit 120 to the resonance circuit TT through the control of the switching circuit 110, and proceeds to step S110.
- step S108 if foreign matter determination is made, the process returns from step S110 to step S102, but if foreign matter non-judgment is made, the process proceeds from step S110 to step S111.
- step S111 the control circuit 160 transmits the authentication signal 550 to the power supply target device by NFC communication using the communication circuit 120 and the resonance circuit TT, and then waits for reception of the response signal 560 in step S112.
- step S113 the control circuit 160 connects the power transmission circuit 130 to the resonance circuit TT through the control of the switching circuit 110, and proceeds to step S114.
- the control circuit 160 sets the power transmission permission flag to ON in step S114, starts the power transmission operation and the mFOD process, and then proceeds to step S115.
- step S115 the presence or absence of a foreign object during power transmission is detected by the mFOD process, and when a foreign object is detected, the power transmission permission flag is turned off.
- the control circuit 160 measures the elapsed time from the start time of the power transmission operation, and compares the elapsed time with a predetermined time t A (for example, 10 minutes) and checks the state of the power transmission permission flag in step S115. When the elapsed time reaches a predetermined time t A or when the power transmission permission flag is set to OFF by the mFOD process, the process proceeds to step S116.
- step S116 the control circuit 160 switches the power transmission permission flag from ON to OFF or maintains the power transmission permission flag OFF, stops the power transmission operation and the mFOD process, and then returns to step S101.
- FIG. 19 is an operation flowchart of the electronic device 2, and the process starting from step S201 is executed in conjunction with the operation of the power supply device 1 shown in FIG.
- the operations of the communication circuit 220 and the power receiving circuit 230 are executed under the control of the control circuit 250.
- step S201 the control circuit 250 connects the communication circuit 220 to the resonance circuit RR through the control of the switching circuit 210.
- the f O change / short-circuit operation is not executed when the electronic device 2 is activated.
- step S202 control circuit 250 uses communication circuit 220 and waits for reception of inquiry signal 510.
- step S203 the control circuit 250 analyzes the inquiry signal 510 to generate a response signal 520, and generates the response signal 520 by NFC communication using the communication circuit 220. Transmit to the power supply device 1.
- the control circuit 250 confirms the state of the battery 21, and if the battery 21 is not fully charged and no abnormality is recognized in the battery 21, a signal for receiving power or requesting power transmission is sent to the response signal 520. include. On the other hand, if battery 21 is fully charged or if abnormality is recognized in battery 21, a signal indicating that power cannot be received is included in response signal 520.
- step S205 the control circuit 250 transmits a response signal 540 to the feeding apparatus 1 by the NFC communication using the communication circuit 220, perform a f O changes / short operation using a resonance state changing circuit 240 at the subsequent step S206 To do. That is, short-circuiting or the power receiving coil R L changes from the reference frequency of the resonance frequency f O to the frequency f M.
- the control circuit 250 measures the time elapsed from the start of the f O changes / short operation (step S207), and stops the f O changes / short operation when the elapsed time reaches the predetermined time t M ( Step S208).
- the resonance frequency f O is returned to the reference frequency or the short circuit of the power receiving coil RL is eliminated. Thereafter, the process proceeds to step S209.
- f O changes / short run operations is maintained, promptly f O changes / short the end of that time operation time t M as stopped is preset.
- the time t M may be specified in the test request signal 530.
- step S209 the control circuit 250 waits for reception of the authentication signal 550 using the communication circuit 220.
- the control circuit 250 transmits a response signal 560 to the authentication signal 550 to the power supply device 1 by NFC communication using the communication circuit 220 in step S 210. If a foreign object exists on the power supply stand 12, the authentication signal 550 is not transmitted from the power supply device 1 (see step S110 in FIG. 18). Therefore, if the authentication signal 550 is not received for a predetermined time in step S209. It is good to return to step S201.
- step S211 the control circuit 250 connects the power reception circuit 230 to the resonance circuit RR through the control of the switching circuit 210, and starts a power reception operation using the power reception circuit 230 in step S212.
- the control circuit 250 measures the time elapsed from the start of the power receiving operation, and compares the elapsed time with a predetermined time t B (step S213). Then, the elapsed time reaches the time t B (Y in step S213), in step S214, the control circuit 250, a power receiving operation is stopped and the flow returns to step S201.
- the time t B is predetermined or specified in the authentication signal 550 so that the period during which the power receiving operation is performed substantially coincides with the period during which the power transmission operation is performed in the power supply device 1. .
- the control circuit 250 monitors the charging current to the battery 21 and determines that the power transmission operation is terminated when the charging current value becomes equal to or lower than the predetermined value. You may make it perform transfer to.
- a foreign object may be placed on the power supply stand 12 after the power transmission operation is started.
- the mFOD process functions as a foreign object detection process during power transmission, and the presence or absence of a foreign object is continuously monitored during power transmission by the mFOD process.
- FIG. 20 is an operation flowchart of the mFOD process.
- the control circuit 160 repeatedly executes the mFOD process in FIG. 20 during the period during which the power transmission operation is performed.
- the control circuit 160 first acquires the latest voltage value V D as the current amplitude detection value V MFOD step S51.
- Current amplitude detection value V MFOD has a value corresponding to the amplitude of the current flowing through the power transmitting coil T L when is generating power for the magnetic field to the power transmission coil T L.
- the control circuit 160 determines whether or not the current amplitude detection value V mFOD belongs to a predetermined mFOD normal range.
- step S53 If the current amplitude detection value V mFOD belongs to the mFOD normal range, the foreign object non-determination is determined (step S53), the process returns to step S51, and the processing of steps S51 and S52 is repeated, but the current amplitude detection value V mFOD is mFOD.
- the foreign matter presence determination is made in step S54, and the power transmission permission flag is set to OFF.
- the power transmission permission flag is a flag managed by the control circuit 160 and is set to ON or OFF. When the power transmission permission flag is ON, the control circuit 160 permits the execution of the power transmission operation, and when the power transmission permission flag is OFF, the control circuit 160 prohibits the execution of the power transmission operation or stops the power transmission operation.
- the mFOD normal range is a range not less than a predetermined lower limit value V mREFL and not more than a predetermined upper limit value V mREFH (0 ⁇ V mREFL ⁇ V mREFH ). Therefore, when the determination inequality “V mREFL ⁇ V mFOD ⁇ V mREFH ” is satisfied, the foreign object determination is made, and otherwise, the foreign object determination is made.
- the foreign material 3 formed as a non-contact IC card is inserted between the power supply base 12 of the power supply device 1 and the electronic device 2.
- the coil J L of the power receiving coil R L and foreign substances 3 of the electronic device 2 is magnetically coupled, resonant frequency is the reference frequency of the resonant circuit RR of the electronic device 2 together with the resonance frequency of the resonance circuit JJ foreign matter 3 Deviation from (13.56 MHz).
- the power received by the power receiving side coil RL decreases, and the load of power transmission viewed from the power transmitting side coil TL becomes lighter.
- the upper limit value V mREFH may be determined so that “V mREFH ⁇ V mFOD ”.
- a foreign material 3 b as an iron plate or a ferrite sheet is inserted between the power supply base 12 of the power supply device 1 and the electronic device 2.
- a current flows in the foreign matter 3b through the electrical and magnetic action, and as a result, the amplitude of the current flowing in the power transmission side coil TL is reduced (in this case, the lower limit is such that “V mFOD ⁇ V mREFL ”).
- the value V mREFL may be determined).
- the current amplitude detection value V mFOD changes depending on the presence or absence of the foreign matter including the foreign matters 3 and 3b.
- the lower limit value V MREFL and the upper limit value V MREFH may be stored in the memory 150. Further, it is estimated by theoretical calculation how much the current amplitude detection value V mFOD changes due to the presence of a foreign substance during power transmission, and based on the estimation result, the lower limit value V mREFL is not required.
- the upper limit value V mREFH may be determined and stored in the memory 150. At this time, for example, an object that changes the current amplitude detection value V mFOD by a predetermined change rate or more with reference to the center value of the mFOD normal range may be defined as a foreign object.
- the amplification factor of the amplifier 143 shown in FIG. 7 is variable.
- the amplitude of the current flowing through the power transmitting coil T L is than when performing pFOD treatment, is much To larger when performing the power transmission operation and mFOD process. Therefore, the control circuit 160 sets the amplification factor of the amplifier 143 smaller when performing the mFOD process than when performing the pFOD process, thereby setting the input signal range of the A / D converter 144 between the pFOD process and the mFOD process. Same level.
- the envelope detector 142 and the A / D converter 144 may be inserted between the two.
- amplitude information obtained by performing high-frequency reduction processing in other words, averaging processing or low-pass filtering
- V D voltage value
- the high-frequency reduction process is a process for reducing (attenuating) a relatively high frequency signal component while allowing a relatively low frequency signal component in the voltage drop signal of the sense resistor 141 to pass.
- a high-frequency reduction process is performed on the voltage value V D generated by the output signal of the A / D converter 144.
- the voltage value V D after the high-frequency reduction process may be used as the current amplitude detection value V mFOD (the same may be applied to the current amplitude detection value V pFOD in the pFOD process).
- the high frequency reduction processing by calculation is processing executed by the control circuit 160, and passes a relatively low frequency signal component in the output signal of the A / D converter 144, while relatively high frequency signal component. This is a process for reducing (attenuating).
- the role of the mFOD process is not limited only to the presence / absence determination of foreign matter.
- the mFOD process has a role of turning off the power transmission permission flag under any circumstances inappropriate for continuation of the power transmission operation such that the current amplitude detection value V mFOD deviates from the mFOD normal range.
- the power transmission permission flag is turned OFF (step S54 in FIG. 20).
- control circuit 160 controls whether or not the power transmission is continued by monitoring whether or not the current amplitude detection value V mFOD is out of the mFOD normal range when power is being transmitted by the power transmission operation. To do. As a result, since the power transmission operation is stopped through the mFOD process in a situation inappropriate for the continuation of the power transmission operation, such as when a foreign object is placed on the power supply stand 12 after the power transmission operation is started, the foreign material due to the continuation of the power transmission operation is stopped. Can be avoided.
- Second Embodiment A second embodiment of the present invention will be described.
- the second embodiment and the third embodiment to be described later are embodiments based on the first embodiment, and matters not specifically described in the second and third embodiments are the same as those in the first embodiment unless there is a contradiction.
- the description also applies to the second and third embodiments.
- an X axis, a Y axis, and a Z axis that are orthogonal to each other are defined.
- a plane parallel to the X axis and the Y axis, a plane parallel to the Y axis and the Z axis, and a plane parallel to the Z axis and the X axis may be referred to as an XY plane, a YZ plane, and a ZX plane, respectively.
- the X axis and the Y axis are parallel to the mounting surface of the power supply table 12, and therefore the Z axis is orthogonal to the mounting surface of the power supply table 12.
- the mounting surface of the power supply base 12 is a surface on which the electronic device 2 is to be mounted, and the electronic device 2 and a foreign object can be mounted on the mounting surface.
- the electronic device 2 is mounted on the mounting surface of the power supply base 12 in the standard arrangement state. To do. In the reference arrangement state, the power supply device 1 and the electronic device 2 are in a predetermined positional relationship for transmitting and receiving power.
- the electronic device 2 is often provided with a metal plate formed of aluminum or the like, or a magnetic plate (magnetic sheet) formed of ferrite. It may adversely affect transmission and foreign object detection.
- the electronic device 2 according to the second embodiment is provided with a cancel circuit (auxiliary resonance circuit) GG for suppressing such influence.
- FIGS. 24A and 24B show cancel circuits GG1 and GG2, which are a first example and a second example of the cancel circuit GG.
- Cancellation circuit GG1 is a parallel resonance circuit constituted by parallel connection of capacitor G C is a coil G L and cancellation capacitor is canceling coil
- cancellation circuit GG2 is series coils G L and the capacitor G C It is a series resonance circuit configured by connection.
- the s husband cancellation circuit GG1 and GG2 are also provided resistance G R as a canceling resistance.
- resistance G R are connected in parallel to the parallel circuit of a coil G L and the capacitor G C.
- resistance G R is inserted and connected in series to the series circuit of the coil G L and the capacitor G C.
- the canceling coil GL is an independent coil separated from the power receiving side coil RL .
- the cancel circuit GG may be either the cancel circuit GG1 or GG2. However, in the following, it is assumed that the cancel circuit GG is a cancel circuit GG1 as a parallel resonance circuit, and the resonance circuits TT and RR are also parallel resonance circuits, unless otherwise specified.
- Capacitor G C for cancellation is a capacitor capable of changing the capacitance of its own, for example, manually adjustable change the capacitance by a trimmer capacitor or the capacitance by the difference of the voltage applied to its own It is a changing varicap (variable capacitor).
- immutable capacitor capacitance as a cancellation capacitor G C.
- Resistance G R may be a fixed resistor the resistance of itself is fixed. However, it may be capable of changing a variable resistance the resistance value of itself used as the resistor G R.
- the cancel circuit GG is insulated from any circuit in the electronic device 2 including the power receiving side resonance circuit RR. However, in the case of constituting the capacitor G C for canceling a varicap provides a voltage signal to the varicap, circuitry in the electronic device 2 is connected to the cancel capacitor G C. In any case, it can be said that the cancel circuit GG is insulated from the power receiving resonance circuit RR at least in terms of alternating current (in terms of high frequency).
- Resonant frequency of the cancellation circuit GG uses a capacitor G C for cancellation, basically, the reference frequency (and therefore the resonant frequency of the resonant circuit TT and RR) but will be set to a higher or lower frequency than, its The operation will be described later.
- the coil GL shown in FIGS. 25 (a) and 25 (b) in the reference arrangement state, the coil GL is used for cancellation between the power transmission side coil TL and the power reception side coil RL .
- the coil GL is disposed (that is, the coils GL , GL , and TL are arranged in this order along the Z-axis direction).
- FIGS. 26A and 26B the arrangement method of the coil GL shown in FIGS. 26A and 26B (hereinafter referred to as a rear surface arrangement method), the canceling coil GL is disposed on the back surface of the power receiving side coil RL .
- the reference arrangement state, canceling coil G L in the opposite position is located to the position of the power transmission coil T L as viewed from the power receiving side coil R L (hence , Coils G L , R L , T L are arranged in this order along the Z-axis direction).
- the coil G L for canceling the generated magnetic field is interlinked with the coil G L for canceling
- the canceling coil GL is arranged at a position where a significant current flows through the.
- FIG. 27A and 27B show the coils T L and J in the power supply device 1 and the foreign material 3 in a state where the foreign material 3 represented by the non-contact IC card is placed on the mounting surface of the power supply table 12.
- 2 is a schematic perspective view and a sectional view of L.
- FIGS. 25 (a), 26 (a) and 27 (a) the windings of the coils T L , R L , G L and J L are doubled to simplify the illustration and prevent complication. (The same applies to FIG. 28C and the like described later).
- a line segment extending laterally from a double circle representing the coil represents a lead wire of the coil.
- the cross sections in the cross-sectional views of FIGS. 25B, 26B, and 27B are parallel to the YZ plane.
- Each of the coils T L , R L , G L and J L forms a loop antenna.
- the coil T L, the loop plane of the loop antenna as R L and G L (i.e., the surface coil T L, the winding of the R L and G L are arranged) is parallel to the XY plane
- the central axes of the coils T L , R L and GL are parallel to the Z axis.
- Coil T L is formed by winding (copper wire) is wound around the central axis of its own (the coil R L, also applies to G L and J L).
- the loop plane of the loop antenna as a coil J L i.e., the surface coil windings J L is located
- the central axis of the coil J L is parallel to the Z axis.
- the coils T L and R L have the same shape on the XY plane (however, they may have different shapes).
- the shape of the coil is a concept including the size of the coil.
- the size of the coil may be considered to represent the area occupied by the outer periphery of the coil in the direction orthogonal to the central axis of the coil.
- the area of the portion surrounded by the coil winding on the loop surface of the loop antenna (that is, the surface on which the coil winding is disposed) is It corresponds to the size of the coil.
- the binding between the binding and the coil R L and G L between coils T L and G L, between coils T L and R L in order to the weaker than the bond may be a shape of the coil G L made different from each shape of the coil T L and R L on the XY plane.
- the outer peripheral shape (in other words, the outer shape) of the coils T L , R L , G L and J L is a circle, but the coils T L , R In each of L 1 , G L, and J L , the outer peripheral shape of the coil is not limited to a circle, and may be an ellipse or a polygon (such as a rectangle), and a straight line and a curve are mixed in the outer peripheral shape of the coil. Also good.
- Example EX2_1A Example EX2_1A will be described. In order to clearly describe the operation of the cancel circuit GG in Example EX2_1B to be described later, in Example EX2_1A, it is assumed that the cancel circuit GG is not provided in the electronic device 2 for convenience.
- the power receiving side metal part MT 2 may constitute all or part of the casing of the electronic device 2. That is, for example, the power receiving side metal part MT 2 may be a box-shaped metal case as a casing of the electronic device 2. Alternatively, for example, the housing of the electronic device 2 and the power-receiving-side metal section MT 2 is formed of a resin material may be fixed in the housing of the electronic device 2. Power-receiving-side metal section MT 2 is mainly example, it is provided to enhance the structural strength and texture of the electronic device 2.
- Metal constituting the power-receiving-side metal section MT 2 is assumed to be aluminum.
- Metal constituting the power-receiving-side metal section MT 2 is an alloy of aluminum and other metals, may be i.e. aluminum alloy (e.g., duralumin serving as an alloy of aluminum and copper).
- aluminum alloy e.g., duralumin serving as an alloy of aluminum and copper.
- the metal constituting the power-receiving-side metal section MT 2 is other than aluminum or aluminum alloy But it ’s okay.
- Power-receiving-side metal section MT 2 is any shape may have a but is assumed to have a metal plate 270 such, having an opening 271 as shown in FIG. 28 (a).
- the metal plate 270 is parallel to the XY plane.
- the opening 271 is a hole that is provided in the metal plate 270 and penetrates in the Z-axis direction. Therefore, no metal exists in the opening 271.
- the opening 271 forms a closed region on the XY plane, and there is no contact between the opening 271 and the outer periphery of the metal plate 270. Therefore, an electric circuit (current loop) made of aluminum is formed around the opening 271 in the XY plane.
- the opening 271 can be sealed with a material other than a metal such as a resin material.
- the resin material is, for example, polycarbonate or polypropylene.
- the outer shape of the metal plate 270 is a rectangle on the XY plane.
- the outer shape of the metal plate 270 is not limited to this on the XY plane, and may include a curve, or a straight line and a curve may be mixed in the outer shape of the metal plate 270.
- the shape of the opening 271 on the XY plane is assumed to be a circle (a cylindrical shape when considered in three dimensions).
- the shape of the opening 271 is not limited to a circle on the XY plane, and may be an ellipse or many shapes. It may be a square (rectangular or the like), and a straight line and a curve may be mixed in the shape of the opening 271.
- Power-receiving-side metal section MT 2 in addition to the metal plate 270 may also include other metal parts. That is, for example, as shown in FIG. 29, when the power-receiving-side metal section MT 2 is a box-shaped metal case CS MT2 as a housing of the electronic device 2, the metal plate 270 is one side of the metal case CS MT2 ( Bottom surface).
- FIG. 28A is a perspective view of the metal plate 270 in the reference arrangement state
- FIG. 28B is a transparent view of some components of the power supply device 1 and the electronic device 2 in the reference arrangement state
- FIG. 28C is a plan view of the metal plate 270 and the power receiving side coil RL in the reference arrangement state viewed from the Z-axis direction.
- Opening 271 is provided in (a position opposite with respect to the arrangement position of the power receiving coil R L) position opposing the arrangement position of the power receiving coil R L, the reference arrangement, the opening 271 and the coil T L Located between R L , the coils T L and R L face each other through the opening 271.
- the size of the opening 271 is larger than the size of the coils T L and R L , and when the coil R L , the opening 271, and the coil T L are viewed along the Z-axis direction, the coils R overlapping each other.
- the outer peripheries of L and T L are enclosed in the opening 271.
- the shape of the opening 271 and the outer peripheral shapes of the coils R L and T L are all circles, the centers of these circles are located on one straight line parallel to the Z axis, and as shown in FIG. radius of the circle as the shape of the opening 271 r1 will greater than the coil R L and T L radius r2 of the circle as the outer peripheral shape of the.
- the power transmission using the coils T L and R L can be satisfactorily realized with some loss.
- the loss ratio seen from the case without the metal plate 270 is about 10 to 20%.
- the power transmission side coil TL is magnetically coupled to the metal plate 270 having the opening 271.
- an alternating current I 1 flows through the power transmission side coil TL
- an alternating current in the opposite direction ie, 180 degrees out of phase
- the current I 31 flows through the electric circuit around the opening 271 in the metal plate 270.
- the coupling coefficient between the power transmission side coil TL and the metal plate 270 is K 13
- the power receiving side coil RL is also magnetically coupled to the metal plate 270 having the opening 271.
- the current I 32 flows through the electric circuit around the opening 271 in the metal plate 270.
- FIG. 31C shows the currents I 1 , I 2 , I 31 and I 32 on the complex plane.
- K 12 is the coupling coefficient between coils T L and R L in the standard arrangement
- Q is Q of the power receiving coil R L
- j is an imaginary.
- the phase of the current I 2 is delayed by 90 degrees with respect to the current I 1 .
- the presence of the metal plate 270 that can generate the current I 31 is equivalent to reducing the inductance of the power transmission side coil TL (in other words, the inductance constituting the resonance circuit TT). As a result, it acts to increase the resonant frequency of the resonant circuit TT.
- the resonance frequency of the resonance circuit RR the presence of the metal plate 270 that can generate the current I 32 is equivalent to reducing the inductance of the power receiving side coil RL (in other words, the inductance constituting the resonance circuit RR). As a result, it acts to increase the resonant frequency of the resonant circuit RR.
- the resonance frequency of the resonance circuits TT and RR shifts in an increasing direction from the reference frequency due to the presence of the metal plate 270. This shift can bring about an influence such as a decrease in efficiency of power transmission using magnetic resonance.
- the voltage based on the current flowing through the metal plate 270 by magnetic field generated by the transmitting coil T L is generated in the power transmitting coil T L, its voltage transmission It acts to increase the amplitude of the current flowing through the side coil TL .
- the metal plate 270 may be mistaken as a foreign object (the metal plate 270 is a component of the electronic device 2 and, of course, should not be recognized as a foreign object).
- the upper limit value in the normal range of pFOD or mFOD is set higher, but such setting leads to a deterioration in detection performance of a foreign object to be truly detected.
- the upper limit value in the normal range of pFOD or mFOD is set higher, but such setting leads to a deterioration in detection performance of a foreign object to be truly detected.
- the current amplitude of TL increases due to the influence of the metal plate 270, the increase functions as noise with respect to observation of a decrease in current amplitude due to the presence of the foreign material 3, and it becomes difficult to detect the foreign material 3.
- Example EX2_1B Example EX2_1B will be described.
- the example EX2_1B is an example in which the cancel circuit GG is provided in the electronic device 2 with the example EX2_1A as a reference.
- the resonance circuits TT, RR, and GG are considered to be parallel resonance circuits here.
- the resonance circuits TT, RR, and GG are series resonance circuits, “advance” and “delay” of phases described below are reversed.
- the reactance of the resonance circuit TT becomes inductive, and the voltage of the reference frequency (corresponding to e in FIG. 32) applied to the resonance circuit TT.
- the phase of the current (corresponding to i in FIG. 32) flowing through the entire resonance circuit TT is delayed with respect to the phase.
- the resonance frequency of the resonance circuit RR becomes higher than the reference frequency due to the presence of the metal plate 270, the same phenomenon occurs in the resonance circuit RR. If the phase delay of the current in the resonance circuits TT and RR caused by the metal plate 270 can be canceled, the resonance frequency of the resonance circuits TT and RR increased from the reference frequency by the metal plate 270 matches the reference frequency. Or get closer.
- the influence of the metal plate 270 on the resonance circuits TT and RR is opposite to that on the resonance circuits TT and RR.
- the cancellation circuit GG may have a resonance frequency higher than the reference frequency).
- Such cancellation circuit GG is acting via a coil G L for canceling power-transmitting-side coil T L, the magnetic coupling between the receiver coil R L, to advance the phase of the current flowing through the entire resonance circuit TT, RR (See FIG. 32).
- FIG. 33 summarizes the actions of the metal plate 270 and the cancel circuit GG according to Example EX2_1B.
- Magnetic field generated in the power transmitting coil T L by the flow of alternating current I 1 at the transmitting coil T L acts to flow the current I 31 in the metal plate 270 (see FIG. 31 (a) and (c))
- the presence of the metal plate 270 that generates the current I 31 acts to increase the resonance frequency of the resonance circuit TT as a result so as to reduce the inductance of the power transmission side coil TL equivalently.
- the magnetic field generated in the power transmitting coil T L by the flow of alternating current I 1 at the transmitting coil T L acts to flow the current I G1 cancellations coil G L, current I G1 is caused to occur
- the presence of the cancel circuit GG that acts as an equivalent increases the inductance of the power transmission side coil TL and consequently reduces the resonant frequency of the resonant circuit TT.
- the current I G1 flowing through the cancellation coils G L by generating the alternating magnetic field of the power transmission coil T L based on the AC current I 1 is interlinks the coil G L for cancellation is dependent on the resonant frequency of the cancellation circuit GG
- the phase acts to cancel the deviation of the resonant frequency of the resonant circuit TT from the reference frequency caused by the metal plate 270.
- Magnetic field generated in the receiver coil R L by the flow of alternating current I 2 on the power receiving side coil R L acts to flow the current I 32 in the metal plate 270 (see FIG. 31 (b) and (c))
- the presence of the metal plate 270 that can generate the current I 32 acts to increase the resonance frequency of the resonance circuit RR so as to reduce the inductance of the power receiving coil RL equivalently.
- the magnetic field generated in the receiver coil R L by the flow of alternating current I 2 on the power receiving side coil R L acts to flow the current I G2 cancellations coil G L, current I G2 is allowed to occur
- the presence of the cancel circuit GG that acts as an equivalent increases the inductance of the power receiving coil RL and consequently decreases the resonance frequency of the resonance circuit RR.
- generation alternating magnetic field of the power receiving coil R L based on the AC current I 2 is the current I G2 flowing through the cancellation coils G L by which interlinks the coil G L for cancellation depends on the resonant frequency of the cancellation circuit GG
- the phase acts to cancel the deviation of the resonance frequency of the resonance circuit RR from the reference frequency caused by the metal plate 270.
- the voltage based on the current I G1 flowing in cancellation coil G L by magnetic field generated by the transmitting coil T L is generated in the power transmitting coil T L
- the generated voltage acts to reduce the amplitude of the current flowing in the power transmission side coil TL , as can be seen from the fact that the influence on the resonance circuit TT is opposite between the currents I 31 and I G1. .
- the cancel circuit GG exerts an action opposite to that of the metal plate 270 on the resonance circuits TT and RR. Therefore, the cancel circuit GG cancels the influence on the resonance circuits TT and RR due to the presence of the metal plate 270. Can be reduced.
- the cancellation is ideally a complete cancellation of an object to be canceled, but can also be a partial cancellation. Therefore, cancellation also means a reduction in objects to be canceled (the same applies to other embodiments described later).
- the degree of cancellation also changes depending on the change in size. Therefore, when the well when the degree of cancellation determines the resistance value of the cancel resistor G R to optimize, cancel resistor G R is formed as a variable resistor, the degree of cancellation is optimized it is preferable to adjust the resistance value of the cancel resistor G R to so that.
- the change in the resonance frequency of the resonance circuit RR caused by the presence of the metal plate 270 is canceled by the cancel circuit GG, and the resonance of the resonance circuit TT caused by the presence of the metal plate 270 in the reference arrangement state. Since the change in frequency is canceled by the cancel circuit GG, the influence of the shift in the resonance frequency is eliminated. Further, since the increase in the current amplitude of the power transmission coil TL caused by the presence of the metal plate 270 is canceled by the action of the cancel circuit GG, the influence based on the increase in the current amplitude is also eliminated. Therefore, in the non-contact power feeding system of Example EX2_1B, the same operation as that of the first embodiment can be performed only by providing the cancel circuit GG for the presence of the metal plate 270.
- the above-described intermediate arrangement method (see FIGS. 25A and 25B) is adopted, and the canceling coil GL is interposed between the power receiving side coil RL and the opening 271. It is good to place.
- Example EX2_1B the above-described rear surface arrangement method (see FIGS. 26 (a) and (b)) is adopted, and the arrangement positions of the opening 271 and the power transmission side coil TL as viewed from the power reception side coil RL. It is also possible to arrange the canceling coil GL at the opposite position. However, in this case, the influence of the cancel circuit GG on the power transmission side resonance circuit TT is considerably weaker than the influence of the metal plate 270 on the power transmission side resonance circuit TT, and the effect of the cancellation on the power transmission side resonance circuit TT is weakened. Therefore, it is preferable to adopt the intermediate arrangement method as shown in FIG. 34 rather than the rear arrangement method.
- Example EX2_2A Example EX2_2A will be described. In order to clearly describe the operation of the cancel circuit GG in Example EX2_2B to be described later, in Example EX2_2A, for convenience, it is assumed that the cancel circuit GG is not provided in the electronic device 2.
- Magnetic portion MG 2 is composed of any magnetic material exhibiting a high magnetic permeability, and at for example ferrite. Magnetic portion MG 2, in the reference arrangement state (i.e., at the time when the power supply device 1 and the electronic apparatus 2 is in a predetermined positional relationship for transmitting and receiving electric power), a position that affects the resonant frequency of the resonant circuit RR Or provided at a position that affects the resonance frequency of both the resonance circuits TT and RR.
- the magnetic plate 281 (corresponding to the dot area in FIG. 35) is provided as the magnetic body portion MG 2 It illustrates the effect due to the presence of the magnetic body portion MG 2.
- the magnetic material plate 281 affects the resonance frequency of both the resonance circuits TT and RR.
- the power transmitting coil T L is magnetically coupled to the magnetic material portion MG 2 (magnetic plate 281), the power-transmitting-side alternating current I 1 to a coil T L flows, whereby the power transmission coil T L based on the magnetic field generated by, as shown in FIG. 36 (a), (having i.e. alternating current I 1 and the same phase) alternating current I 1 in the same direction of the AC current I 41 flows through the magnetic body portion MG 2.
- the current I 41 is a current in the opposite direction to the current I 31 (see FIG. 31A) flowing in the metal plate 270 assumed in the examples EX2_1A and EX2_1B. Therefore, the magnetic body part MG 2 gives the opposite action to the metal plate 270 to the power transmission side resonance circuit TT. That is, the presence of the magnetic part MG 2 that can generate the current I 41 is equivalent to increasing the inductance of the power transmission side coil TL on the contrary to the metal plate 270 having the opening 271 (in other words, As a result, the resonance component of the resonance circuit TT is increased), and as a result, the resonance frequency of the resonance circuit TT is decreased, and the amplitude of the current flowing through the power transmission side coil TL is decreased. .
- the power receiving side coil RL when the power receiving side coil RL is magnetically coupled to the magnetic body part MG 2 (magnetic material plate 281), and an alternating current I 2 flows through the power receiving side coil RL , power is received thereby.
- the alternating current I (having i.e. same phase as the alternating current I 2) 2 in the same direction of the AC current I 42 is the magnetic body portion MG 2 flows.
- the current I 42 is a current in the opposite direction to the current I 32 (see FIG. 31B) flowing in the metal plate 270 assumed in the examples EX2_1A and EX2_1B. Therefore, the magnetic body part MG 2 gives an action opposite to that of the metal plate 270 to the power receiving side resonance circuit RR. That is, the presence of the magnetic part MG 2 that can generate the current I 42 is equivalent to increasing the inductance of the power receiving side coil RL , in contrast to the metal plate 270 having the opening 271 (in other words, As a result, it acts to decrease the resonance frequency of the resonance circuit RR and to reduce the amplitude of the current flowing through the power receiving coil RL. .
- Example EX2_2B Example EX2_2B will be described.
- the example EX2_2B is an example in which the cancel circuit GG is provided in the electronic device 2 with the example EX2_2A as a reference.
- the resonance circuits TT, RR, and GG are considered to be parallel resonance circuits here.
- the resonance circuits TT, RR, and GG are series resonance circuits, “advance” and “delay” of phases described below are reversed.
- the reactance of the resonant circuit TT becomes capacitive, corresponding to e of the voltage ( Figure 37 of the reference frequency applied to the resonant circuit TT ), The phase of the current (corresponding to i in FIG. 37) flowing through the entire resonance circuit TT advances.
- the resonance frequency of the resonance circuit RR becomes lower than the reference frequency due to the presence of the magnetic part MG2, the same phenomenon occurs in the resonance circuit RR.
- a cancel circuit GG having a resonance frequency higher than the reference frequency may be provided (if the resonance circuits TT, RR and GG are series resonance circuits, the cancel circuit GG may have a resonance frequency lower than the reference frequency. Just fine).
- Such a cancel circuit GG delays the phase of the current flowing through the resonance circuits TT and RR through the magnetic coupling between the cancel coil GL , the power transmission side coil T L , and the power reception side coil RL. (See FIG. 37)
- Figure 38 summarizes the effect of the magnetic body portion MG 2 and cancellation circuit GG according to Example EX2_2B.
- Magnetic field generated in the power transmitting coil T L by the flow of alternating current I 1 at the transmitting coil T L acts to flow the current I 41 (see FIG. 36 (a)) to the magnetic material portion MG 2, current
- the presence of the magnetic part MG 2 that generates I 41 acts to increase the inductance of the power transmission coil TL equivalently, and consequently to decrease the resonance frequency of the resonance circuit TT.
- the power transmission side magnetic field generated in the power transmitting coil T L by the flow of alternating current I 1 in the inductor T L is 'acts to flow the current I G1' current I G1 cancellations coil G L is
- the presence of the cancel circuit GG that is generated acts to increase the resonance frequency of the resonance circuit TT as a result so as to reduce the inductance of the power transmission side coil TL equivalently.
- an alternating current current generator alternating magnetic field of the power transmission coil T L based on I 1 flows through the cancellation coils G L by which interlinks the coil G L for canceling I G1 'is independent of the resonant frequency of the cancellation circuit GG
- the phase is provided by the magnetic body portion MG 2, it acts to cancel the deviation from a reference frequency of the resonant frequency of the resonant circuit TT.
- Magnetic field generated in the receiver coil R L by the flow of alternating current I 2 on the power receiving side coil R L acts to flow the current I 42 (see FIG. 36 (b)) to the magnetic material portion MG 2, current
- the presence of the magnetic body portion MG 2 that generates I 42 acts to increase the inductance of the power receiving coil RL equivalently and consequently to decrease the resonance frequency of the resonance circuit RR.
- the magnetic field generated in the receiver coil R L by the flow of alternating current I 2 on the power receiving side coil R L is 'acts to flow the current I G2' current I G2 cancellations coil G L is
- the existence of the cancel circuit GG that is generated acts to increase the resonance frequency of the resonance circuit RR as a result so as to reduce the inductance of the power receiving side coil RL equivalently.
- an alternating current current generator alternating magnetic field of the power receiving coil R L based on the I 2 flows through the cancellation coils G L by which interlinks the coil G L for canceling I G2 'is independent of the resonant frequency of the cancellation circuit GG
- the phase is provided by the magnetic body portion MG 2, it acts to cancel the deviation from the reference frequency of the resonant frequency of the resonant circuit RR.
- the voltage based on the current I G1 'flowing to the cancellation coils G L by magnetic field generated by the transmitting coil T L is generated in the power transmitting coil T L
- the influence of the generated voltage on the resonance circuit TT is opposite between the currents I 41 and I G1 ′, the amplitude of the current flowing in the power transmission side coil TL is increased.
- the cancel circuit GG has an effect opposite to that of the magnetic body part MG 2 with respect to the resonance circuits TT and RR, so that the influence on the resonance circuits TT and RR due to the presence of the magnetic body part MG 2 is canceled. It can be canceled (reduced) by the circuit GG.
- the capacitance value of the cancel capacitor G C By changing the capacitance value of the cancel capacitor G C, and the phase of the current I G1 'and I G2', the relationship between the currents I 1, I 2, the phase of the I 41 and I 42 is changed, the The degree of cancellation changes according to the change in the relationship. Therefore, it is preferable degree of cancellation to adjust the capacitance value of the cancel capacitor G C to optimize (maximize).
- the degree of cancellation determines the resistance value of the cancel resistor G R to optimize, cancel resistor G R is formed as a variable resistor, the degree of cancellation is optimized it is preferable to adjust the resistance value of the cancel resistor G R to so that.
- Example EX2_2B With changes in the resonant frequency of the resonant circuit RR caused by the presence of the magnetic body portion MG 2 is canceled by canceling circuit GG, caused by the presence of the magnetic body portion MG 2 at reference arrangement state resonance Since the change in the resonance frequency of the circuit TT is canceled by the cancel circuit GG, the influence of the shift in the resonance frequency is eliminated. Further, since the current amplitude reduction of the power transmission coil T L caused by the presence of the magnetic body portion MG 2 is canceled by the action of the cancellation circuit GG, influence is eliminated based on the current amplitude decreases. Thus, the contactless power supply system of the embodiment EX2_2B, only by providing a cancellation circuit GG to the presence of the magnetic body portion MG 2, it is possible to perform the same operation as the first embodiment.
- the magnetic portion MG 2 when present between the power transmitting coil T L and the power receiving coil R L is intermediate arrangement method (the above figures 25 (a) and (b)), and a canceling coil GL may be disposed between the power receiving side coil RL and the magnetic body part MG 2 (magnetic body plate 281), or alternatively, the power receiving side A magnetic part MG 2 (magnetic plate 281) may be disposed between the coil RL and the canceling coil GL .
- FIG. 39 there is an intermediate disposition method (FIGS. 25 (a) and (b) refer) and rear placement method (FIG. 26 Either (a) or (b)) may be employed.
- Figure 40 in a case where the magnetic plates 282 as the magnetic body portion MG 2 is and rear placement method is provided is employed, the coil T L in the reference arrangement, the positional relationship of the R L and G L and the magnetic plates 282 Is shown.
- the magnetic material plate 282 is provided on the position opposite the position of the power transmission coil T L as viewed from the power receiving side coil R L, and, with the power receiving coil R L and the magnetic plate 282 A canceling coil GL is disposed between them. That is, in the reference arrangement state, the magnetic plate 282, the canceling coil G L , the power receiving side coil R L , and the power transmitting side coil T L are arranged in this order along the Z-axis direction.
- the magnetic portion MG 2 as a magnetic material plate 282 of the resonant circuit TT and RR, also to possible that only affect the resonant frequency of the resonant circuit RR, the power transmission coil T It may not have an effect of reducing the current amplitude of L. That is, due to the presence of the magnetic body portion MG 2, current amplitude reduction of the change in the resonant frequency of the power transmission side resonance circuit TT and transmission coil T L is also smaller that negligibly.
- cancel circuit GG exclusively, it can be said that the magnetic body portion MG 2 is provided for the purpose of canceling the effect of the power reception side resonance circuit RR.
- FIG. 41 shows an example of using the magnetic plate 282.
- the electronic device 2 is provided with a substrate SUB on which an electronic circuit EL including an integrated circuit such as a power receiving side IC 200 is mounted.
- the magnetic plate 282 is inserted between the electronic circuit EL and the power receiving coil RL, and along the Z-axis direction, the electronic circuit EL, the magnetic plate 282, the canceling coil GL , The side coil R L and the power transmission side coil T L are arranged in this order.
- the electronic circuit EL may be mounted on the component surface of the substrate SUB, and a magnetic plate (magnetic sheet) 282 may be attached to the surface opposite to the component surface of the substrate SUB.
- the magnetic field generated unwanted coil R L or T L for the operation of the electronic circuit EL is absorbed by the magnetic plate 282, suppressing malfunction of an electronic circuit EL is achieved.
- the magnetic plate 282 is often provided in the electronic device 2 for the purpose of blocking the magnetic field to the electronic circuit EL.
- the cancel circuit GG is useful for canceling the undesirable effects that such a magnetic plate 282 may have on power transmission, foreign object detection, and the like.
- the magnetic body part MG 2 (the magnetic body plate 281 in FIG. 35) is replaced with the metal plate 270.
- a method of fitting in the opening 271 is also useful. According to this, without the cancellation circuit GG, dress to offset the effect of the magnetic body portion MG 2 and the metal plate 270.
- the degree of the effect by this method depends on the shape and arrangement position of the magnetic body part MG 2 and the metal plate 270, and changing the shape and the like just because the effect is not optimal is a structural constraint. In addition, it is often not easy.
- the cancellation circuit GG can be easily adjusted by using a trimmer capacitor.
- Example EX2_3A The example EX2_3A will be described. In order to clearly explain the operation of the cancel circuit GG in Example EX2_3B described later, in Example EX2_3A, for convenience, it is assumed that the cancel circuit GG is not provided in the electronic device 2.
- a resonance state changing circuit 240 (the resonant frequency change operation or coil short circuit operation)
- the resonant circuit RR does not function at all as a load of the power transmission coil T L
- a situation similar to the absence of the resonant circuit RR is achieved.
- the resonance frequency of the resonance circuit RR after the change by the resonance frequency changing operation is not sufficiently separated from the reference frequency, or the change of the resonance frequency of the resonance circuit RR or the short circuit of the power receiving side coil RL is non-linear.
- FIG. 42 shows an example of a resonance state changing circuit 240 configured to realize a coil short-circuit operation.
- the resonance circuit RR is a parallel resonance circuit
- the resonance state change circuit 240 includes a transistor SS and a resistor R SS .
- the transistor SS is formed as an N-channel type MOSFET.
- the rectifier circuit DD is a full-wave rectifier circuit composed of diodes (rectifier elements) D1 to D4.
- a circuit including the rectifier circuit DD, the transistor SS, and the resistor R SS can be provided between the resonance circuit RR and the communication circuit 220 or between the resonance circuit RR and the power reception circuit 230.
- the switching circuit 210 (see FIG. 5) to be interposed between the resonance circuit RR and the rectifier circuit DD is not shown in FIG.
- one end of the power receiving side coil RL and one end of the power receiving side capacitor RC are commonly connected to the line LN1, while the other end of the power receiving side coil RL and the other end of the power receiving side capacitor RC are connected to the line.
- the line LN1 is commonly connected to the anode of the diode D1 and the cathode of the diode D3, and the line LN2 is commonly connected to the anode of the diode D2 and the cathode of the diode D4.
- the cathodes of the diodes D1 and D2 are commonly connected to the line LN3, and the anodes of the diodes D3 and D4 are commonly connected to the line LN4.
- the drain is connected to the line LN3, the source is connected to the line LN4, and the gate is connected to the line LN4 via the resistor R SS .
- the control circuit 250 of the electronic device 2 turns on or off the transistor SS by controlling the gate voltage of the transistor SS.
- an alternating current flows through the power receiving coil RL based on the magnetic field generated by the power transmitting coil TL , and power based on the alternating current is propagated between the lines LN3 and LN4 through rectification in the rectifier circuit DD.
- the A power receiving operation or the like can be performed by the power propagated between the lines LN3 and LN4.
- the transistor SS when the transistor SS is on, the power receiving coil RL is short-circuited via the rectifier circuit DD (more specifically, via the combination of the diodes D1 and D4 or the combination of the diodes D2 and D3). No voltage is generated between LN3 and LN4 (for the sake of simplicity, the drain-source voltage of the transistor SS is assumed to be zero).
- the transistor SS in FIG. 42 corresponds to the switch 243 in FIG. 10. However, in the circuit in FIG. ) Is interposed.
- the diodes D1 to D4 are non-conductive, and even if the transistor SS is turned on, the power receiving side coil RL is not short-circuited. A power- reception-side unnecessary current flows through L.
- Example EX2_3B Example EX2_3B will be described.
- the example EX2_3B is an example in which the cancel circuit GG is provided in the electronic device 2 with the example EX2_3A as a reference.
- the cancel circuit GG of the embodiment EX2_3B is a circuit corresponding to the fact that the f O change / short-circuit operation is not ideal.
- the f O change / short-circuit operation is executed in the pFOD process, and is not executed during power transmission. Therefore, in the embodiment EX2_3B, the control circuit 250 gives an ON control signal or an OFF control signal to the cancel circuit GG as shown in FIG. 43 in conjunction with the execution / non-execution of the f O change / short circuit operation.
- cancellation circuit GG When the on control signal is provided to cancellation circuit GG, in cancellation circuit GG, a coil G L, the parallel resonant circuit or a series resonant circuit by parallel connection or series connection of capacitor G C and resistance G R is formed, therefore, the coil When an alternating magnetic field is linked to GL , a resonance operation is performed in the cancel circuit GG (current flows through the coil GL ).
- the cancellation circuit GG leave insert a switch in series on the wiring connecting the coils G L and the capacitor G C, when subjected to ON control signal while turning on the switch, OFF control signal coil G L by turning off the switch when subjected to, it is preferable to cut off the connection between the capacitor G C and resistance G R.
- a switch is connected in parallel to the coil GL , and when the on-control signal is received, the switch is turned off, while when the off-control signal is received
- the coil GL may be short-circuited by turning on the switch.
- the control circuit 250 outputs an ON control signal to the cancel circuit GG only during a period in which the resonance state change circuit 240 performs the f O change / short-circuit operation, and other periods (NFC communication and NFC power transmission are performed). In this case, the resonance operation of the cancel circuit G is stopped by outputting an off control signal to the cancel circuit GG.
- FIG. i A represents a power-reception-side unnecessary current that has flowed to the power-receiving-side coil RL based on the magnetic field generated by the power-transmission-side coil TL under the execution of the f O change / short-circuit operation.
- i B represents the current that flows through the canceling coil GL based on the magnetic field generated by the power transmission side coil T L under the execution of the f O change / short circuit operation.
- currents i A and i B are represented as current vectors on the complex plane.
- the currents i A and i B are in opposite directions (that is, if the phases of the currents i A and i B are 180 degrees different from each other), the currents i A and i B In order to provide the reverse effect, the influence of the power reception unnecessary current i A on the current amplitude of the power transmission coil TL is canceled (reduced). Furthermore, if the magnitudes of the currents i A and i B are the same, the influence of the power reception side unnecessary current i A on the current amplitude of the power transmission side coil TL is completely canceled by the current i B.
- the capacitance value of the cancel capacitor G C By changing the capacitance value of the cancel capacitor G C, the phase relationship changes between current I A and I B, by a change in the phase relationship, the degree of cancellation the changes. Therefore, it is preferable degree of cancellation to adjust the capacitance value of the cancel capacitor G C to optimize (maximize).
- the magnitude of the current I B changes through changes in Q value of the resonance circuit as a cancellation circuit GG, even by a change in the magnitude of the current I B
- the degree of cancellation changes. Therefore, when the well when the degree of cancellation determines the resistance value of the cancel resistor G R to optimize, cancel resistor G R is formed as a variable resistor, the degree of cancellation is optimized it is preferable to adjust the resistance value of the cancel resistor G R to so that.
- Example EX2_4 will be described.
- Figure 45 shows the position relationship of the power receiving coil R L and cancellation coil G L in the XY plane.
- the outer peripheral shapes of the coils RL and GL are rectangular, and the windings of the coils RL and GL are made into a double rectangle in order to simplify the illustration and prevent complication. Is expressed.
- the line extending from the double rectangle to the side represents the lead wire of the coil.
- the canceling coil GL is provided to counteract the influence of the metal plate 270, and there is little need to increase the degree of magnetic coupling with the power receiving side coil RL . Further, when considering the coupling with the metal plate 270, the degree of coupling does not change at all or almost no matter how the canceling coil GL is rotated around the Z-axis (the magnetic plate 281 or 282 also). The same).
- the coil R L and G L are rectangular, to weaken the coupling between the coils R L and G L, the coil R L and G L It is preferable that the major axes of the outer peripheral shapes are directed in different directions (eg, orthogonal to each other).
- the outer peripheral shape of the power receiving side coil RL is a rectangle
- the outer peripheral shape of the power transmitting side coil TL is also the same rectangle, and in the reference arrangement state, the coupling between the coils TL and RL is made.
- the major axes of the outer peripheral shapes of the coils T L and R L are oriented in the same direction.
- the shape of the coil G L may be the shape of the coil G L made different from each shape of the coil T L and R L on the XY plane.
- control circuit 160 in the power supply device 1 is set to the operation mode set by setting any one of a plurality of modes including the normal mode and the test mode as its own operation mode.
- control circuit 250 in the electronic device 2 operates in an operation mode set by setting any one of a plurality of modes including the normal mode and the test mode as its own operation mode.
- the plurality of modes for the control circuit 160 and the plurality of modes for the control circuit 250 may be the same or different from each other.
- the plurality of modes for the control circuit 160 and the control circuit 250 can include modes other than the normal mode and the test mode, but only the normal mode and the test mode will be noted below.
- the operations of the power supply device 1 and the electronic device 2 described in the first and second embodiments are all operations when the operation mode of the control circuits 160 and 250 is set to the normal mode (however, initial setting processing) except for).
- the control circuit 160 of the power supply device 1 changes its operation mode only when receiving a predetermined test mode setting instruction at the time of starting the power supply device 1 or at any timing after the power supply device 1 is started. Set to test mode, otherwise set own operation mode to normal mode. Similarly, the control circuit 250 of the electronic device 2 only has its own input when a predetermined test mode setting instruction is input when the electronic device 2 is activated or at any timing after the electronic device 2 is activated. The operation mode is set to the test mode, otherwise the operation mode is set to the normal mode.
- power supply device 1 has an input receiving unit 170 for receiving input of various instructions including a test mode setting instruction, and electronic device 2 receives input of various instructions including a test mode setting instruction.
- the input receiving unit 170 may be configured with a push button switch, a touch panel, or the like for receiving an input of a test mode setting instruction from an operator.
- the input receiving unit 170 may be configured with a communication port capable of receiving a signal transmitted from an external device. In this case, receiving a predetermined test mode transition request signal from an external device at the communication port of the input receiving unit 170 corresponds to inputting a test mode setting instruction to the power supply device 1 and the input receiving unit 170, When the test mode transition request signal is received, the operation mode of the control circuit 160 is set to the test mode.
- the external device is a device different from the power supply device 1 and the electronic device 2, and may be, for example, a computer device 4 (see FIG. 47) described later.
- the input receiving unit 270 may be configured with a push button switch, a touch panel, or the like for receiving an input of a test mode setting instruction from the operator.
- the input receiving unit 270 may be configured with a communication port capable of receiving a signal transmitted from an external device. In this case, receiving a predetermined test mode transition request signal from an external device at the communication port of the input receiving unit 270 corresponds to inputting a test mode setting instruction to the electronic device 2 and the input receiving unit 270.
- the operation mode of the control circuit 250 is set to the test mode.
- the operation mode After the operation mode is set to the test mode in the control circuit 160 of the power supply device 1, when the power supply device 1 is turned off and the power supply device 1 is restarted, the operation mode becomes the normal mode.
- the control circuit 160 sets its own operation mode to the test mode and then satisfies a predetermined condition (for example, when receiving an input of a normal mode transition instruction different from the test mode setting instruction at the input receiving unit 170) It may be possible to shift the operation mode to the normal mode.
- the operation mode becomes the normal mode when the power of the electronic device 2 is turned off and the electronic device 2 is restarted. Further, the control circuit 250 itself sets the operation mode to the test mode and then establishes a predetermined condition (for example, when the input reception unit 270 receives an input of a normal mode transition instruction different from the test mode setting instruction). It may be possible to shift the operation mode to the normal mode.
- FIG. 47 shows the external appearance of the computer device 4 as an example of the external device together with the external appearance of the power supply device 1.
- FIG. FIG. 48 is a schematic internal block diagram of the computer apparatus 4.
- the computer device 4 includes parts referred to by reference numerals 41 to 44.
- the arithmetic processing unit 41 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like.
- the arithmetic processing unit 41 executes various arithmetic processes and supervises the operation of each part in the computer device 4.
- the display unit 42 includes a liquid crystal display panel and the like, and displays arbitrary information as a video under the control of the arithmetic processing unit 41.
- the recording unit 43 includes a magnetic disk and a semiconductor memory, and records arbitrary information.
- the communication processing unit 44 performs wireless or wired communication between the computer apparatus 4 and a different device.
- wired communication in accordance with a predetermined wired communication standard (for example, USB (Universal Serial Bus) standard) is possible between the power supply device 1 and the computer apparatus 4, and a communication port provided in the power supply device 1.
- a communication port provided in the computer device 4 are connected by a predetermined communication cable, so that any information can be bidirectionally communicated between the power supply device 1 and the computer device 4.
- the power supply device 1 has a function of performing wireless communication with the computer device 4
- the communication between the power supply device 1 and the computer device 4 may be wireless communication.
- control circuit 160 can generate a test magnetic field in the power transmission side coil TL through control to the switching circuit 110 and the power transmission circuit 130, and the control circuit 250 can generate the resonance state change circuit 240. Can be used to perform the f O change / short-circuit operation.
- the first test form and the second test form shown in FIGS. 49A and 49B are assumed.
- the control circuit 160 is set to the test mode and a test magnetic field is generated in the power transmission side coil TL , and the above-described initial setting environment is prepared (that is, the electronic circuit is placed on the power supply base 12). Neither equipment 2 nor foreign objects are placed).
- the control circuit 160 is set to the test mode and the test magnetic field is generated in the power transmission side coil TL
- the control circuit 250 is set to the test mode and the f O change / A short-circuit operation is performed, and the electronic device 2 is placed on the power supply base 12 in the reference arrangement state.
- Figure 50 utilizes a test mode, is a flowchart of a process for adjusting the capacitance value of the cancel capacitor G C. When performing this processing, it is assumed that they are connected so that communication between the power supply device 1 and the computer apparatus 4 is possible.
- step S11 the operation mode of the control circuits 160 and 250 is set to the test mode by giving a test mode setting instruction to the power supply device 1 and the electronic device 2. Further, if the capacitor G C for cancellation is formed by the trimmer capacitor, moderator state that allows manual adjustment of the capacitance value of the cancel capacitor G C is trimmed.
- the first test form is prepared, and the control circuit 160 obtains the voltage value V D in the first test form.
- the voltage value V D acquired in the first test configuration is referred to as a detection value and is represented by V TEST1 .
- the second test mode is prepared, and the control circuit 160 acquires the voltage value V D in the second test mode.
- the voltage value V D acquired in the second test form is referred to as a detected value and is represented by V TEST2 .
- the detection values V TEST1 and V TEST2 may be sent to the computer device 4.
- a test processing unit (not shown) is provided in the control circuit 160 of the power supply device 1 or the arithmetic processing unit 41 of the computer apparatus 4.
- step S15 the test processing unit, "(V TEST2 -V TEST1) >0" to determine the success or failure of, "(V TEST2 -V TEST1) >0" at the time of establishment outputs the resonance frequency reduction instruction at step S16 Then, the process returns to step S13.
- a resonance frequency increase instruction is output in step S17, and then the process returns to step S13.
- the resonance frequency reduction instruction is an instruction that prompts the adjuster to manually operate the trimmer capacitor in a direction in which the resonance frequency of the cancel circuit GG decreases. For example, an image representing the instruction is displayed on the display unit 42.
- the resonance frequency increase instruction is an instruction that prompts the adjuster to manually operate the trimmer capacitor in a direction in which the resonance frequency of the cancel circuit GG increases. For example, an image representing the instruction is displayed on the display unit 42.
- Canceling capacitor G C is formed by a varicap, if the capacitance value of the cancel capacitor G C is adjusted irrespective of the manual operation, the resonant frequency reduction instruction and the resonance frequency increases instruction electrons by the NFC It is given to the device 2.
- the power supply device 1 and the electronic device 2 are in a state capable of NFC communication, and a signal indicating a resonance frequency decrease instruction or a resonance frequency increase instruction by NFC communication. Is transmitted from the power supply device 1 to the electronic device 2.
- the control circuit 250 has a function of varying the voltage applied to the varicap.
- the control circuit 250 sets the voltage applied to the varicap so that the resonance frequency of the cancel circuit GG decreases.
- the voltage applied to the varicap is changed by a predetermined amount in the direction in which the resonance frequency of the cancel circuit GG increases.
- the current amplitude of the power transmission side coil TL increases due to the action of the metal plate 270 (as a result, “(V TEST2 ⁇ V TEST1 )> 0”.
- the cancel circuit GG has a resonance frequency lower than the reference frequency, the current amplitude of the power transmission side coil TL is reduced by the action of the cancel circuit GG, and the current amplitude The action of the metal plate 270 and the cancel circuit GG cancels each other. Therefore, when “(V TEST2 ⁇ V TEST1 )> 0”, an instruction to decrease the resonance frequency is output.
- the magnetic portion MG 2 is provided in the electronic device 2, and vice versa. Further, by bringing
- the detection value V TEST2 being equal means that the cancel circuit GG appropriately cancels the action of changing the resonance frequency from the reference frequency by the metal plate 270 or the like.
- the power receiving device W 1 can receive the power by a magnetic field resonance method from a power transmitting device having a power transmitting side resonance circuit (TT) including a power transmitting side coil (T L ) for transmitting power.
- a power receiving side resonance circuit (RR) including a power receiving side coil (R L ) for receiving the power
- an auxiliary resonance circuit (GG) including an auxiliary coil (G L ) different from the power receiving side coil
- the auxiliary coil is arranged at a position where a current flows through the auxiliary coil based on a magnetic field generated by the power transmission side coil or the power reception side coil.
- the power receiving device may be provided with a member (such as a metal plate) that affects the characteristics and operation of the power receiving side resonance circuit.
- a member such as a metal plate
- the above auxiliary resonance circuit may be provided to cancel the influence. As a result, an appropriate power receiving operation or the like can be performed.
- the power receiving side coil RL given as an example of the power receiving side coil in each embodiment
- the canceling coil GL given as an example of the auxiliary coil.
- the former can form the power receiving side resonance circuit RR and the latter can form the cancel circuit GG, the coil RL
- the specific configuration method of GL is arbitrary.
- the circuits RR and GG may have a relationship as shown in FIG.
- the circuit RR and GG are formed together as a parallel resonant circuit, a coil G L, line commonly connecting the respective one end of the capacitor G C and a resistor G R (interconnection), coils R L and capacitor line commonly connecting the one end of each of R C and (wiring) but although a common line LL1, coil G L, and line LL2 commonly connecting the other ends of the capacitors G C and a resistor G R, coil
- the line LL3 that commonly connects the other ends of the RL and the capacitor RC is a separate line, and a current loop (closed circuit) passing through the lines LL1 to LL3 is not formed.
- Coil G L and the power receiving coil R L for canceling in the circuit configuration of FIG. 51 naturally, a different coils mutually, it can be said that the coils separated from each other provided separately.
- most of the windings forming the canceling coil GL and most of the windings forming the power receiving side coil RL are separate windings, but the former winding It is possible that a part and a part of the latter winding are shared (the shared part may be a wiring part that cannot be called a part of the winding). It can be said that the working coil GL and the power receiving side coil RL are different from each other.
- the illustrated cancellation resistor G R in FIG. 52 is omitted.
- the power receiving side coil RL is provided as the first pattern coil on the first surface of the substrate (printed substrate) mounted on the electronic device 2, while being opposite to the first surface of the substrate.
- the canceling coil GL may be provided as a second pattern coil different from the first pattern coil on the second surface on the side.
- Non-contact power supply system W 2 in accordance with an aspect of the present invention includes a power receiving apparatus W 1, a power transmission apparatus having a transmission side resonance circuit including a power transmission coil for transmitting power, and the at magnetic resonance method The power transmission / reception is possible.
- the power transmitting device in the contactless power supply system W 2, the power transmitting device, the power transmission side transmission circuit capable of supplying a resonance circuit to an AC voltage, a detection circuit for detecting the amplitude of the current flowing through the power transmission coil And a control circuit that performs power transmission control of the power by controlling the power transmission circuit based on the amplitude detection value of the detection circuit.
- the power reception device changes the resonance frequency of the power reception side resonance circuit from the resonance frequency at the time of power reception or short-circuits the power reception side coil before receiving power from the power transmission device.
- the power transmission side control unit is in a state in which the power reception device changes the resonance frequency of the power reception side resonance circuit or the power reception side coil is short-circuited in accordance with a signal by communication from the power transmission device.
- the power transmission circuit Prior to power transmission, the power transmission circuit is controlled based on a first processing unit that controls the power transmission circuit so that a predetermined test magnetic field is generated by the power transmission side coil, and an amplitude detection value by the detection circuit when the test magnetic field is generated.
- the power reception side resonance circuit based on the magnetic field generated by the power transmission side coil Some current may flow through the coil, and this current may generate a magnetic field and change the current amplitude of the coil on the power transmission side. This change is not preferable for the determination of whether or not power transmission can be performed based on the current amplitude of the power transmission side coil. According to the above configuration, such a change is canceled out by the function of the auxiliary resonance circuit, so that it is possible to appropriately determine whether or not to perform power transmission.
- the electric power feeder 1 itself in each above-mentioned embodiment may function as a power transmission apparatus which concerns on this invention, and a part of electric power feeder 1 in each above-mentioned embodiment functions as a power transmission apparatus which concerns on this invention. Also good.
- the electronic device 2 itself in each of the above-described embodiments may function as a power receiving device according to the present invention, or a part of the electronic device 2 in each of the above-described embodiments functions as a power receiving device according to the present invention. May be.
- the frequency and resonance frequency of various signals are set to 13.56 MHz as a reference frequency.
- 13.56 MHz is a setting target value, and those in an actual device.
- the frequency includes an error.
- the reference frequency is 13.56 MHz.
- the reference frequency may be other than 13.56 MHz.
- the communication and power transmission between the power supply device and the electronic device to which the present invention is applied may be communication and power transmission according to a standard other than NFC.
- the reference frequency of the non-contact power feeding system according to the present invention is set to a frequency other than 13.56 MHz (for example, 6.78 MHz), and the resonance frequency of the resonance circuit JJ in the foreign object 3 formed as a non-contact IC card is 13 If it is .56MHz also, when the foreign object 3 is placed on the feeding table 12, since the corresponding change in the amount of the voltage value V D at pFOD treatment or mFOD process is observed, even in such a case, The foreign material 3 can be detected by the method described above.
- the target device which is a power receiving device or a power transmitting device according to the present invention can be configured by hardware such as an integrated circuit or a combination of hardware and software.
- Arbitrary specific functions that are all or part of the functions realized by the target device may be described as a program, and the program may be stored in a flash memory that can be mounted on the target device. Then, the specific function may be realized by executing the program on a program execution device (for example, a microcomputer that can be mounted on the target device).
- the program can be stored and fixed on an arbitrary recording medium.
- the recording medium for storing and fixing the program may be mounted or connected to a device (such as a server device) different from the target device.
Abstract
Description
本発明の第1実施形態を説明する。図1(a)及び(b)は、本発明の第1実施形態に係る給電機器1及び電子機器2の概略外観図である。但し、図1(a)は、給電機器1及び電子機器2が離間状態にあるときのそれらの外観図であり、図1(b)は、給電機器1及び電子機器2が基準配置状態にあるときのそれらの外観図である。離間状態及び基準配置状態の意義については後に詳説する。給電機器1及び電子機器2によって非接触給電システムが形成される。給電機器1は、商用交流電力を受けるための電源プラグ11と、樹脂材料にて形成された給電台12と、を備える。
図12を参照し、異物の存否を検出するための異物検出処理を説明する。図12は、電力伝送前に給電機器1により実行される異物検出処理(以下、pFOD処理という)のフローチャートである。
図16を参照して、電力伝送が行われるまでの機器1及び2間の信号のやりとりを説明する。以下では、特に記述無き限り、電子機器2が基準配置状態(図1(b))にて給電台12上に存在していることを想定する。
次に、給電機器1の動作の流れを説明する。図18は、給電機器1の動作フローチャートである。通信回路120及び送電回路130の動作は、制御回路160の制御の下で実行される。
送電動作の開始後に異物が給電台12上に置かれることもある。mFOD処理は、電力伝送中の異物検出処理として機能し、mFOD処理により電力伝送中において異物の存否が継続監視される。
本発明の第2実施形態を説明する。第2実施形態及び後述の第3実施形態は第1実施形態を基礎とする実施形態であり、第2及び第3実施形態において特に述べない事項に関しては、矛盾の無い限り、第1実施形態の記載が第2及び第3実施形態にも適用される。
実施例EX2_1Aを説明する。キャンセル回路GGの作用を後述の実施例EX2_1Bにて明確に説明すべく、実施例EX2_1Aでは、便宜上、電子機器2にキャンセル回路GGが設けられていないことを想定する。
図31(a)を参照し、基準配置状態では、送電側コイルTLが開口部271を有する金属板270と磁気的に結合する。送電側コイルTLに交流電流I1が流れると、それにより送電側コイルTLにて発生した磁界に基づき、電磁誘導によって交流電流I1と逆方向の(即ち180度位相のずれた)交流電流I31が金属板270内の開口部271周りの電路に流れる。送電側コイルTL及び金属板270間の結合係数をK13とおくと、交流電流I31は“I31=K13×I1”にて表される。一方、
図31(b)を参照し、電子機器2内においては、受電側コイルRLも開口部271を有する金属板270と磁気的に結合する。受電側コイルRLに交流電流I2が流れると、それにより受電側コイルRLにて発生した磁界に基づき、電磁誘導によって交流電流I2と逆方向の(即ち180度位相のずれた)交流電流I32が金属板270内の開口部271周りの電路に流れる。受電側コイルRL及び金属板270間の結合係数をK23とおくと、交流電流I32は“I32=K23×I2”にて表される。
図31(c)は、電流I1、I2、I31及びI32を複素平面上に示したものである。交流電流I2は、交流電流I1に基づき受電側コイルRLに流れる共振電流であり、“I2=jQK12×I1”にて表される。ここで、K12は基準配置状態におけるコイルTL及びRL間の結合係数であり、Qは受電側コイルRLのQであり、jは虚数である。電流I2は電流I1に対して位相が90度遅れることになる。
共振回路RRの共振周波数に関して考えると、電流I32が発生せしめられる金属板270の存在は、受電側コイルRLのインダクタンスを等価的に減少させるように(換言すれば共振回路RRを構成するインダクタンス成分を減少させるように)、結果、共振回路RRの共振周波数を増大させるように作用する。
実施例EX2_1Bを説明する。実施例EX2_1Bは、実施例EX2_1Aを基準として、キャンセル回路GGを電子機器2に設けた実施例である。
一方で、送電側コイルTLでの交流電流I1の流れにより送電側コイルTLに発生した磁界は、キャンセル用コイルGLに電流IG1を流すように作用し、電流IG1が発生せしめられるキャンセル回路GGの存在は、送電側コイルTLのインダクタンスを等価的に増大させるように、結果、共振回路TTの共振周波数を減少させるように作用する。
つまり、交流電流I1に基づく送電側コイルTLの発生交番磁界がキャンセル用コイルGLを鎖交したことでキャンセル用コイルGLに流れる電流IG1は、キャンセル回路GGの共振周波数に依存する位相を持つことになるが、その位相は、金属板270によってもたらされる、共振回路TTの共振周波数の基準周波数からのずれを打ち消すように作用する。
一方で、受電側コイルRLでの交流電流I2の流れにより受電側コイルRLに発生した磁界は、キャンセル用コイルGLに電流IG2を流すように作用し、電流IG2が発生せしめられるキャンセル回路GGの存在は、受電側コイルRLのインダクタンスを等価的に増大させるように、結果、共振回路RRの共振周波数を減少させるように作用する。
つまり、交流電流I2に基づく受電側コイルRLの発生交番磁界がキャンセル用コイルGLを鎖交したことでキャンセル用コイルGLに流れる電流IG2は、キャンセル回路GGの共振周波数に依存する位相を持つことになるが、その位相は、金属板270によってもたらされる、共振回路RRの共振周波数の基準周波数からのずれを打ち消すように作用する。
実施例EX2_2Aを説明する。キャンセル回路GGの作用を後述の実施例EX2_2Bにて明確に説明すべく、実施例EX2_2Aでは、便宜上、電子機器2にキャンセル回路GGが設けられていないことを想定する。
実施例EX2_2Bを説明する。実施例EX2_2Bは、実施例EX2_2Aを基準として、キャンセル回路GGを電子機器2に設けた実施例である。
一方で、送電側コイルTLでの交流電流I1の流れにより送電側コイルTLに発生した磁界は、キャンセル用コイルGLに電流IG1’を流すように作用し、電流IG1’が発生せしめられるキャンセル回路GGの存在は、送電側コイルTLのインダクタンスを等価的に減少させるように、結果、共振回路TTの共振周波数を増大させるように作用する。
つまり、交流電流I1に基づく送電側コイルTLの発生交番磁界がキャンセル用コイルGLを鎖交したことでキャンセル用コイルGLに流れる電流IG1’は、キャンセル回路GGの共振周波数に依存する位相を持つことになるが、その位相は、磁性体部MG2によってもたらされる、共振回路TTの共振周波数の基準周波数からのずれを打ち消すように作用する。
一方で、受電側コイルRLでの交流電流I2の流れにより受電側コイルRLに発生した磁界は、キャンセル用コイルGLに電流IG2’を流すように作用し、電流IG2’が発生せしめられるキャンセル回路GGの存在は、受電側コイルRLのインダクタンスを等価的に減少させるように、結果、共振回路RRの共振周波数を増大させるように作用する。
つまり、交流電流I2に基づく受電側コイルRLの発生交番磁界がキャンセル用コイルGLを鎖交したことでキャンセル用コイルGLに流れる電流IG2’は、キャンセル回路GGの共振周波数に依存する位相を持つことになるが、その位相は、磁性体部MG2によってもたらされる、共振回路RRの共振周波数の基準周波数からのずれを打ち消すように作用する。
実施例EX2_3Aを説明する。キャンセル回路GGの作用を後述の実施例EX2_3Bにて明確に説明すべく、実施例EX2_3Aでは、便宜上、電子機器2にキャンセル回路GGが設けられていないことを想定する。
実施例EX2_3Bを説明する。実施例EX2_3Bは、実施例EX2_3Aを基準として、キャンセル回路GGを電子機器2に設けた実施例である。
キャンセル回路GGにオフ制御信号が与えられたとき、キャンセル回路GGにおいて、コイルGL、コンデンサGC及び抵抗GR間の接続が遮断され又はコイルGLが短絡され、これによって並列共振回路又は直列共振回路が形成されなくなり、結果、コイルGLに交番磁界が鎖交してもキャンセル回路GGで共振動作が行われなくなる(コイルGLに電流が流れない)。
実施例EX2_4を説明する。図45に、XY面上における受電側コイルRLとキャンセル用コイルGLの配置位置関係を示す。尚、図45では、コイルRL及びGLの外周形状が長方形であると仮定しており、図示の簡略化及び煩雑化防止のため、コイルRL及びGLの巻線を二重長方形にて表現している。二重長方形から側方に伸びる線分はコイルの引き出し線を表している。
本発明の第3実施形態を説明する。第3実施形態では、キャンセル用コンデンサGCの静電容量値の調整及び決定方法について説明する。第3実施形態で述べる方法を、第2実施形態の非接触給電システムに適用できる。
第1テスト形態では、制御回路160がテストモードに設定されていて且つテスト磁界が送電側コイルTLにて発生せしめられ、また、上述の初期設定環境が整えられる(即ち給電台12上に電子機器2も異物も置かない)。
第2テスト形態では、制御回路160がテストモードに設定されていて且つテスト磁界が送電側コイルTLにて発生せしめられる一方で、制御回路250がテストモードに設定されていて且つfO変更/短絡動作が実行され、また、電子機器2が基準配置状態にて給電台12上に載置される。
上述の各実施形態にて具体化された本発明について考察する。
本発明の実施形態は、特許請求の範囲に示された技術的思想の範囲内において、適宜、種々の変更が可能である。以上の実施形態は、あくまでも、本発明の実施形態の例であって、本発明ないし各構成要件の用語の意義は、以上の実施形態に記載されたものに制限されるものではない。上述の説明文中に示した具体的な数値は、単なる例示であって、当然の如く、それらを様々な数値に変更することができる。上述の実施形態に適用可能な注釈事項として、以下に、注釈1~注釈3を記す。各注釈に記載した内容は、矛盾なき限り、任意に組み合わせることが可能である。
上述の実施形態では、各種の信号の周波数や共振周波数を、基準周波数としての13.56MHzに設定することを述べたが、13.56MHzは設定の目標値であって、実際の機器における、それらの周波数には誤差が含まれる。
本発明をNFCの規格に沿って具現化したものを実施形態中に示したため、基準周波数が13.56MHzであると述べたが、基準周波数は13.56MHz以外でも構わない。これに関連するが、本発明が適用される給電機器及び電子機器間の通信及び電力伝送は、NFC以外の規格に沿った通信及び電力伝送であっても良い。
本発明に係る受電装置又は送電装置である対象装置を、集積回路等のハードウェア、或いは、ハードウェアとソフトウェアの組み合わせによって構成することができる。対象装置にて実現される機能の全部又は一部である任意の特定の機能をプログラムとして記述して、該プログラムを対象装置に搭載可能なフラッシュメモリに保存しておいても良い。そして、該プログラムをプログラム実行装置(例えば、対象装置に搭載可能なマイクロコンピュータ)上で実行することによって、その特定の機能を実現するようにしてもよい。上記プログラムは任意の記録媒体に記憶及び固定されうる。上記プログラムを記憶及び固定する記録媒体は対象装置と異なる機器(サーバ機器等)に搭載又は接続されても良い。
2 電子機器
130 NFC送電回路
140 負荷検出回路
160 制御回路
270 金属板
271 開口部
281、282 磁性体板
TT 送電側共振回路
TL 送電側コイル
TC 送電側コンデンサ
RR 受電側共振回路
RL 受電側コイル
RC 受電側コンデンサ
GG キャンセル回路
GL キャンセル用コイル
GC キャンセル用コンデンサ
Claims (12)
- 電力を送電するための送電側コイルを含む送電側共振回路を有する送電装置から磁界共鳴方式で前記電力を受電可能な受電装置において、
前記電力を受電するための受電側コイルを含む受電側共振回路と、
前記受電側コイルと異なる補助コイルを含む補助共振回路と、を備え、
前記送電側コイル又は前記受電側コイルの発生磁界に基づき前記補助コイルに電流が流れる位置に、前記補助コイルが配置される
ことを特徴とする受電装置。 - 前記受電側共振回路の共振周波数に影響を与える位置に設けられた金属板を更に備え、
前記補助コイルに交番磁界が鎖交したとき、前記金属板による前記受電側共振回路の共振周波数の変化を打ち消す電流が前記補助共振回路に流れる
ことを特徴とする請求項1に記載の受電装置。 - 前記金属板は、アルミニウム又はアルミニウム合金にて構成される
ことを特徴とする請求項2に記載の受電装置。 - 前記受電側共振回路の共振周波数に影響を与える位置に設けられた磁性体部を更に備え、
前記補助コイルに交番磁界が鎖交したとき、前記磁性体部による前記受電側共振回路の共振周波数の変化を打ち消す電流が前記補助共振回路に流れる
ことを特徴とする請求項1に記載の受電装置。 - 前記磁性体部は、フェライトにて構成される
ことを特徴とする請求項4に記載の受電装置。 - 前記補助共振回路は、前記補助コイルと静電容量を変更可能な補助コンデンサとを含んで形成される共振回路である
ことを特徴とする請求項1~5の何れかに記載の受電装置。 - 前記補助共振回路は補助抵抗を更に含み、
前記補助コイルと前記補助コンデンサとの並列回路に対して並列に前記補助抵抗が接続される、又は、前記補助コイルと前記補助コンデンサとの直列回路に対して直列に前記補助抵抗が挿入される
ことを特徴とする請求項6に記載の受電装置。 - 請求項1~7の何れかに記載の受電装置と、
電力を送電するための送電側コイルを含む送電側共振回路を有する送電装置と、を備え、磁界共鳴方式で前記電力の送受電が可能である
ことを特徴とする非接触給電システム。 - 前記送電装置は、
前記送電側共振回路に交流電圧を供給可能な送電回路と、
前記送電側コイルに流れる電流の振幅を検出する検出回路と、
前記検出回路の振幅検出値に基づき前記送電回路を制御することで前記電力の送電制御を行う送電側制御部と、を備える
ことを特徴とする請求項8に記載の非接触給電システム。 - 前記受電装置は、前記送電装置からの電力の受電に先立ち、前記受電側共振回路の共振周波数を前記受電の際の共振周波数から変更する又は前記受電側コイルを短絡する変更/短絡回路を備え、
前記送電側制御部は、前記送電装置からの通信による信号に従い前記受電装置にて前記受電側共振回路の共振周波数の変更又は前記受電側コイルの短絡が行われている状態で、前記送電に先立ち所定のテスト磁界が前記送電側コイルで発生されるよう前記送電回路を制御する第1処理部と、前記テスト磁界が発生されているときの前記検出回路による振幅検出値に基づき前記送電の実行可否を判断する第2処理部と、前記送電を実行可能と判断した後に前記テスト磁界よりも大きな送電用磁界が前記送電側コイルで発生されるよう前記送電回路を制御することで前記送電を実現する第3処理部と、を有し、
前記状態において、前記受電側共振回路が前記送電側コイルの電流振幅に与える影響を打ち消す電流が前記補助共振回路に流れる
ことを特徴とする請求項9に記載の非接触給電システム。 - 前記受電装置は、前記補助コイルに交番磁界が鎖交することによって生じる前記補助共振回路の共振動作を停止させることが可能な受電側制御部と、を更に備え、
前記受電側制御部は、前記電力の送受電が行われるときにおいて前記補助共振回路の共振動作を停止させる
ことを特徴とする請求項10に記載の非接触給電システム。 - 前記送電装置及び前記受電装置が前記電力の送受電を行うための所定位置関係にあるとき、
前記補助コイルは、前記送電側コイルと前記受電側コイルの間に配置される、又は、前記受電側コイルから見て前記送電側コイルの配置位置とは反対側の位置に配置される
ことを特徴とする請求項8~11の何れかに記載の非接触給電システム。
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JP2015202025A (ja) * | 2014-03-31 | 2015-11-12 | ローム株式会社 | 受電装置、送電装置及び非接触給電システム |
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WO2020149037A1 (ja) * | 2019-01-18 | 2020-07-23 | オムロン株式会社 | 非接触給電装置 |
JP2020120434A (ja) * | 2019-01-18 | 2020-08-06 | オムロン株式会社 | 非接触給電装置 |
JP7088040B2 (ja) | 2019-01-18 | 2022-06-21 | オムロン株式会社 | 非接触給電装置 |
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DE112016004763T5 (de) | 2018-07-12 |
US10700554B2 (en) | 2020-06-30 |
JPWO2017081975A1 (ja) | 2018-08-23 |
JP6452844B2 (ja) | 2019-01-16 |
US20180331575A1 (en) | 2018-11-15 |
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