WO2017075842A1

WO2017075842A1 - Mov device structure fixed by means of a fastener

Info

Publication number: WO2017075842A1
Application number: PCT/CN2015/094163
Authority: WO
Inventors: 曾清隆; 陈泽同
Original assignee: 隆科电子(惠阳)有限公司
Priority date: 2015-11-05
Filing date: 2015-11-10
Publication date: 2017-05-11

Abstract

An MOV device structure fixed by means of a fastener, comprising an upper electrode clamping plate (1), a lower electrode clamping plate (4) and at least one MOV chip (2) and at least one extraction electrode (3) alternately provided between the upper clamping plate and the lower electrode clamping plate, the upper electrode clamping plate and the lower electrode clamping plate being fixed by means of a fastener (5). As to the device structure, it is unnecessary to use a high-temperature welding process for the extraction electrode, preventing high-temperature invisible damage being caused to the chip; the upper clamping plate, the lower electrode clamping plate and the extraction electrode are used as a chip fin, enhancing the pulse throughflow withstand capability and the frequent low-current impact withstand capability of the MOV chip, and also improving the temporary overvoltage withstand capability of the MOV, providing time to exit the operation in time; the use of the chip performance is maximized, saving resources; and the manufacturing procedure of the MOV device structure fixed by means of the fastener is simple, omits a fluxer, omits a cleaning agent, and has no environmental pollution; the cost composition is low and the subsequent processing is convenient and efficient.

Description

MOV component structure fixed by fasteners

Technical field

The invention relates to the technical field of metal oxide varistor, in particular to a structure of an MOV component fixed by a fastener.

Background technique

The zinc oxide varistor (Metal Oxide Varistors) has special nonlinear current-voltage characteristics. The applied environment is subject to lightning strikes, electromagnetic field interference, frequent power switch operation, and power system failure, causing a sudden increase in voltage on the line and exceeding the varistor. The turn-on voltage of the device will enter the conduction region. Due to the nonlinear characteristics of the MOV, its impedance will become low, only a few ohms, causing the overvoltage to form a surge current to protect the connected electronic products or expensive. Electronic components.

In the case of abnormal conditions, the continuous conduction of the MOV will cause excessive heat generation of the chip, causing thermal collapse, and sudden thermal collapse will cause it to be out of operation and cause an accident.

The existing MOV device, after the ceramic chip is made, needs to be soldered to lead the foot, and the high temperature processing process such as epoxy encapsulation and curing is performed, which not only brings inconvenience to the post process of the chip, but also high temperature process. Invisible damage to the chip is also not negligible.

Summary of the invention

In view of the deficiencies of the above prior art, the technical problem to be solved by the present invention is to provide a MOV component structure fixed by a fastener without high temperature damage, strong overvoltage withstand capability, low cost, and easy processing.

In order to solve the above technical problem, the technical solution adopted by the present invention is:

The invention provides an MOV component structure fixed by a fastener, characterized in that: The electrode plate, the lower electrode plate, and at least one MOV chip and the at least one extraction electrode alternately disposed between the upper and lower electrode plates, the upper electrode plate and the lower electrode plate are fixed by fasteners.

The MOV chip 2 is also referred to as a valve plate, and the positions of the upper and

lower electrode plates

1, 4 are interchangeable. The lead electrode 3 and the

electrode plates

1, 4 are extended in accordance with the installation of the surge protector SPD.

Further, two MOV chips and one extraction electrode are alternately arranged between the upper and lower electrode plates, and the equivalent circuit is two parallel two-electrode structures.

Further, two MOV chips and three extraction electrodes are alternately arranged between the upper and lower electrode plates, and the equivalent circuit is a two-piece three-electrode common mode structure.

Further, two MOV chips and one extraction electrode are alternately arranged between the two upper electrode plates at the two ends and the middle lower electrode plate, and the equivalent circuit is a four-parallel three-electrode structure.

Further, a plurality of sets of at least one MOV chip and at least one extraction electrode alternately disposed between the upper and lower electrode plates are disposed, and an isolation plate is disposed between the adjacent two sets of extraction electrodes.

Further, the surface area of the upper and lower electrode plates is larger than the surface area of the MOV chip, the upper electrode plate is provided with a protruding edge of the upper electrode plate, and the lower electrode plate is provided with a protruding edge of the lower electrode plate, the upper surface A through hole or a threaded hole is provided in the protruding edge of the electrode plate and the protruding edge of the lower electrode plate.

Further, the fastener is a metal or non-metal rivet or screw, and the length of the fastener is not less than the thickness of the upper electrode plate to the lower electrode plate.

Further, the surface area of the extraction electrode is larger than the surface area of the MOV chip, and at least one extraction leg is drawn on the extraction electrode, and the extraction leg is taken out axially or radially.

Further, the MOV chip is set to a different shape as needed.

Further, the fastener-fixed MOV component can be treated with an insulating layer.

Further, the electrode splint is an aluminum splint, a copper splint or an aluminum alloy splint, and a copper alloy splint.

The product formed by the MOV component structure is installed in a surge protector SPD module cavity, wherein the lead electrode can be connected with a trip spring, and the electrode clip connection terminal can form an SPD module, or the MOV. The lead-out electrode of the component structure forming product can be connected with a temperature-safe component or a low-temperature alloy fuse to form a thermal protection varistor TMOV device.

The beneficial effects of the invention are:

(1) The invention fixes the MOV chip and the extraction electrode by the fastener, and does not need to adopt the high temperature process of the extraction electrode to avoid the high temperature invisible damage to the chip;

(2) The invention utilizes the upper and lower electrode clamping plates and the extraction electrode as the chip heat sink, improves the pulse flow endurance capability of the MOV chip and the impact tolerance of the small current and multiple frequencies, and also improves the temporary overvoltage withstand capability of the MOV. To win time in order to get out of the exit operation in a timely manner; to maximize the performance of the chip and save resources;

(3) The MOV component structure fixed by the fastener of the invention has simple processing steps, no flux, no cleaning agent, no environmental pollution, low cost, and convenient and quick processing.

DRAWINGS

Figure 1-1 is an exploded view of the structure of the MOV component in Embodiment 1;

1-2 is a combination diagram of the structure of the MOV component in the embodiment 1;

1-3 is a combination diagram of another structure of the MOV component structure in Embodiment 1;

1-4 are equivalent diagrams of the structure of the MOV component in the embodiment 1;

2-1 is an exploded view of the structure of the MOV component in Embodiment 2;

2-2 is a combination diagram of the structure of the MOV component in the second embodiment;

2-3 is an equivalent diagram of the structure of the MOV component in the second embodiment;

3-1 is an exploded view of the structure of the MOV component in Embodiment 3;

3-2 is a combination diagram of the structure of the MOV component in the third embodiment;

3-3 is a combination diagram of another structure of the MOV component structure in Embodiment 3;

3-4 is an equivalent diagram of the structure of the MOV component in the third embodiment;

Figure 4-1 is an exploded view of the structure of the MOV component in Embodiment 4;

4-2 is an equivalent diagram of the structure of the MOV component in Embodiment 4;

5-1 is an exploded view of the first structure of the MOV component structure in Embodiment 5;

Figure 5-2 is a combination diagram of the first structure of the MOV component structure in Embodiment 5;

5-3 is an exploded view of a second structure of the MOV component structure in Embodiment 5;

5-4 is a combination diagram of a second structure of the MOV component structure in Embodiment 5;

5-5 is an equivalent diagram of the structure of the MOV component in the embodiment 5;

Figure 6-1 is an exploded view of the structure of the MOV component in Embodiment 6;

[Correct according to Rule 26 01.06.2016]
6-2 is an equivalent diagram of the structure of the MOV component in Embodiment 6;

Figure 7-1 is an exploded view of the structure of the MOV component in Embodiment 7;

Fig. 7-2 is an equivalent diagram of the structure of the MOV component in the seventh embodiment.

detailed description

The embodiments of the present invention are exemplified in the following with reference to the accompanying drawings, which are for the purpose of illustration and description.

Example 1

As shown in FIGS. 1-1 to 1-4, the present embodiment provides an MOV component structure fixed by a fastener, including an upper electrode clamping plate 1, an MOV chip 2, an extraction electrode 3, and a lower electrode clamping plate 4. The upper electrode plate 1 and the lower electrode plate 4 are fixed by a fastener 5, and the MOV chip 2 and the extraction electrode 3 are alternately disposed between the upper electrode plate 1 and the lower electrode plate 4, and the upper and lower electrode plates 1 The surface area of 4 is larger than the surface area of the MOV chip 2, and the upper electrode plate 1 is provided with two upper electrode plate protruding edges 11, and the lower electrode plate 4 is provided with two lower electrode plate convex plates. The upper edge 41 is provided with a through hole 12, the lower electrode plate 4 is provided with a threaded hole 42, and the extraction electrode 3 is provided with an extraction electrode lead 31.

lower electrode plates

1, 4 are interchangeable. The lead electrode 3 and the

electrode plates

In this embodiment, an MOV chip 2 and an extraction electrode 3 are alternately disposed between the upper and lower electrode plates. As shown in FIG. 1-4, the equivalent circuit is a single-piece two-electrode structure, and the lead-out leg 31 of the lead-out electrode 3 is The positive electrode L ends, the upper and

lower electrode plates

1 and 4 are the negative N ends. The positive L terminal and the negative N terminal can be connected to a temperature protection mechanism such as a thermal detachment mechanism or a temperature fuse.

In this embodiment, the fastener 5 is a non-metallic screw, such as a nylon screw or other insulating screw. The length of the screw is greater than or equal to the sum of the thickness of the upper and

lower electrode plates

1, 4, the thickness of the MOV chip 2 held, and the thickness of the extraction electrode 3. The fastener 5 can also be a non-metallic rivet, screw.

In this embodiment, the surface area of the extraction electrode 3 is larger than the surface area of the MOV chip 2, and is in a full coverage state. One or two lead-out legs are drawn from the extraction electrode 3, and the lead-out leg is a linear or sheet-type lead-out leg, as shown in FIG. -2, 1-3, the lead legs are axially led out or radially extracted. The lead-out leg of the lead-out electrode 3 provides a large heat-dissipating area for facilitating the extraction or connection of the tripping device. The lead-out electrode 3 is made of a conductive material such as aluminum or copper or an aluminum alloy or a copper alloy, and is made of a metal material having a good thermal conductivity. 0.3 to 1.5 mm.

The MOV chip is set to a different shape as needed, such as a circular, rectangular or irregular shape (irregular shape), and the MOV component fixed by the fastener may be treated with an insulating layer.

Example 2

The difference between this embodiment and the embodiment 1 is that, as shown in FIGS. 2-1 to 2-3, two MOV chips 2 and one extraction electrode 3 are alternately disposed between the upper and lower electrode plates, and the extraction electrode 3 is disposed at In the middle of the two MOV chips 2, the upper and lower electrode clamps are clamped, and the non-metallic screws 5 pass through the through holes 12 in the convex edge 11 of the upper electrode clamp plate 1 and are fastened to the screw holes 42 in the convex edge 41 of the lower electrode clamp plate 4. Inside, a two-piece parallel connection method is formed, and a single tripping and two-electrode mounting manner is formed after being connected to the SPD trip device. As shown in Figure 2-3, the equivalent circuit is a two-piece parallel two-electrode structure. The lead pin 31 of the lead electrode 3 is the positive electrode L end, and the upper and lower

electrode plate plates

1 and 4 are the negative electrode N end.

Example 3

The difference between this embodiment and the embodiment 1 is that, as shown in FIGS. 3-1 to 3-4, two MOV chips 2 and three extraction electrodes 3 are alternately disposed between the upper and lower electrode plates, and the MOV chip is provided. 2 two sheets are stacked, three lead electrodes 3 are arranged in the middle and on both sides, and are clamped by the upper and

lower electrode plates

1, 4, and the non-metal non-screws 5 pass through the through holes 12 in the protruding edges 11 of the upper electrode plate, and are fastened to The lower electrode clamping plate 41 protrudes from the threaded hole 42 in the side, and the three-piece three-outlet legs form three electrodes of L-PE-N, which constitute a single-mode common mode protection mode, and if the two-side lead-out electrode lead-out leg 31 is connected The tripping device of the SPD forms a double-tripper three-electrode single-phase common mode protection module. If a component is added at the PE end according to requirements, a Y-connected single-phase full-mode protection mode can be formed, wherein, as shown in Fig. 3-2. As shown in 3-3, the lead-out leg 31 of the lead-out electrode 3 can be taken out axially or radially. As shown in Figure 3-4, the equivalent circuit is a two-electrode common-mode structure. The lead-out pin 31 of the lead-out electrode 3 in the middle is the ground PE end, and the lead-out pins 31 of the lead-out electrodes 3 on the two sides are respectively the positive L-end and N terminal of the negative electrode.

Example 4

The present embodiment is different from the first embodiment in that three MOV chips 2 and two extraction electrodes 3 are alternately disposed between the upper and

lower electrode plates

1 and 4 as shown in FIGS. 4-1 to 4-3. The MOV chip 2 is stacked three by three, and two lead electrodes 3 are disposed between the three MOV chips, and are clamped by the upper and

lower electrode plates

1, 4, and the non-screws 5 pass through the through holes 12 in the protruding edge 11 of the upper electrode plate. Fixed in the threaded hole 42 in the convex edge 41 of the lower electrode plate, a triangular protection circuit with three terminals of three terminals is formed by one end of the electrode plate and two lead legs, and the three terminals are all positive L ends; if the lead electrode is to be taken out The lead pin 31 is connected to the trip device of the SPD to form a double trip three-electrode angle connection protection module.

Example 5

The difference between this embodiment and the first embodiment is that, as shown in FIGS. 5-1 and 5-2, two MOV chips 2 are alternately arranged between the two upper electrode plate plates 1 at the two ends and the lower electrode plate 4 in the middle. And an extraction electrode 3, an extraction electrode 3 is arranged between the two MOV chips 2 to form a combined structure, The lower electrode plate 4 is disposed between the group combination structures, and the two sets of MOV chips 2 are sandwiched by the two upper electrode plates 1 , and each of the upper electrode plates 1 passes through the upper electrode with two or more non-screws 5 in a mutually wrong manner. The through hole 12 in the protruding edge 11 of the clamping plate is fastened in the threaded hole 42 in the protruding edge 41 of the lower electrode clamping plate disposed in the two sets of combined structures, thereby forming the four-chip 2 parallel and three-extracting electrode 3 The structure can obtain the common mode structure of L, N to PE in the access circuit, and the L terminal and the N terminal of the two extraction electrodes can be connected in parallel via internal or external to form a four-chip full parallel mode.

As shown in FIGS. 5-3 and 5-4, another protruding edge 40 is disposed on the side of the lower electrode clamping plate, and the protruding edge 40 is provided with another threaded hole 400 at a corresponding position of the two upper electrode clamping plates 1. Another through hole is provided through the through hole and the threaded hole 400 through another screw, thereby making the fastening effect better.

As shown in Figure 5-5, the equivalent circuit is a four-piece, three-parallel, three-electrode structure.

Example 6

The present embodiment is different from Embodiment 1 in that, as shown in FIGS. 6-1 to 6-2, the MOV assembly mechanism of the present invention includes two sets of at least one MOV chip and at least one alternately disposed between the upper and lower electrode pads. The electrode is taken out, and an insulating plate is arranged between the two adjacent electrodes. In this embodiment, two MOV chips and two extraction electrodes are disposed in the first group, and one MOV chip and one extraction electrode are disposed in the second group. The MOV chip, the extraction electrode, the MOV chip, the extraction electrode, the isolation plate, the extraction electrode, and the MOV chip are sequentially stacked, and then clamped by the upper and

lower electrode plates

1, 4, and the non-metal screw 5 passes through the convex edge 11 of the upper electrode plate. The through hole 12 is fastened in the threaded hole 42 in the protruding edge 41 of the lower electrode clamping plate, and three five-electrode structures are formed by the two ends of the electrode clamping plate and the three leading legs, and the first and third lead electrode lead legs are connected to form Single-phase full-mode or three-phase half-mode protection mode, if one or three lead-out electrodes are connected to the SPD trip device, a double-tripper five-electrode single-phase full-protection or three-phase semi-protection module is formed.

Example 7

The present embodiment is different from Embodiment 6 in that, as shown in FIGS. 7-1 to 7-2, the MOV assembly mechanism of the present invention includes two sets of at least one MOV chip alternately disposed between the upper and lower electrode pads and at least An extraction electrode is provided with an isolation plate between the adjacent two sets of extraction electrodes. In this embodiment, two MOV chips and one extraction electrode are disposed in the first group and the second group, and the extraction electrode 3 is disposed in the middle of the two MOV chips, and is clamped by the upper electrode plate 1 and the lower electrode plate 4, and the non-metal The screw 5 passes through the through hole 12 in the protruding edge 11 of the upper electrode clamping plate, is fastened in the threaded hole 42 in the protruding edge 41 of the lower electrode clamping plate, and connects the two sets of the intermediate leading electrode leading pin 3 to form an access circuit. The N-electrode in the middle, the upper and

lower electrode plates

1, 4 and the lead-out electrode on both sides of the insulating plate 6 form the four electrodes L1, L2, L3 and PE, which is a typical four-module protection circuit. The two sets of intermediate lead-out electrodes are connected to the tripping device of the SPD to form a four-electrode double-tripping mode of L1, L2, L3, N, and PE. To increase the flow rate, you can also form a two-piece or single-group four-piece parallel mode by reconnecting the electrode lead-out pins.

The product formed by the MOV component structure is installed in a surge protector SPD module cavity, wherein the lead electrode can be connected with a trip spring, the electrode clip plate connection terminal can form an SPD module, or the MOV component structure forms a product The lead-out electrode can be connected to a temperature-safe component or a low-temperature alloy fuse to form a thermally protected varistor TMOV device.

The above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes made by the scope of the present invention remain within the scope of the present invention.

Claims

An MOV component structure fixed by a fastener, comprising: an upper electrode plate, a lower electrode plate, and at least one MOV chip and at least one extraction electrode alternately disposed between the upper and lower electrode plates, the upper electrode plate The lower electrode plate is fixed by a fastener.
The MOV component structure fixed by the fastener according to claim 1, wherein two MOV chips and one extraction electrode are alternately arranged between the upper and lower electrode plates, and the equivalent circuit is two parallel circuits. Electrode structure.
The MOV component structure fixed by a fastener according to claim 1, wherein two MOV chips and three extraction electrodes are alternately arranged between the upper and lower electrode plates, and the equivalent circuit is two pieces. Electrode common mode structure.
The MOV component structure fixed by the fastener according to claim 1, wherein two MOV chips and one extraction electrode are alternately arranged between the two upper electrode clamping plates at the two ends and the middle lower electrode clamping plate respectively. The equivalent circuit is a four-piece dual parallel three-electrode structure.
The MOV component structure fixed by a fastener according to claim 1, comprising: a plurality of sets of at least one MOV chip and at least one extraction electrode alternately disposed between the upper and lower electrode pads, adjacent to the two groups An isolation plate is provided between the extraction electrodes.
The MOV component structure fixed by a fastener according to any one of claims 1 to 5, wherein a surface area of the upper and lower electrode plates is larger than a surface area of the MOV chip, and the upper electrode plate is disposed. There is a protruding edge of the upper electrode plate, the lower electrode plate is provided with a protruding edge of the lower electrode plate, and the protruding edge of the upper electrode plate and the protruding edge of the lower electrode plate are provided with a through hole or a threaded hole.
A MOV component structure fixed by a fastener according to any one of claims 1 to 5, wherein the fastener is a metal or non-metal rivet or screw, the fastener The length is not less than the thickness of the upper electrode plate to the lower electrode plate.
The MOV component structure fixed by a fastener according to any one of claims 1 to 5, wherein a surface area of the extraction electrode is larger than a surface area of the MOV chip, and the extraction electrode has at least a lead-out electrode An take-up foot that is axially led out or radially extracted.
The MOV component structure fixed by a fastener according to claim 1, wherein the MOV chip is set to a different shape as needed.
The MOV component structure fixed by a fastener according to claim 1, wherein the electrode splint is an aluminum splint, a copper splint or an aluminum alloy splint, and a copper alloy splint.