CN205451957U - Through fixed device structure of MOV unit of fastener - Google Patents
Through fixed device structure of MOV unit of fastener Download PDFInfo
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- CN205451957U CN205451957U CN201520881638.0U CN201520881638U CN205451957U CN 205451957 U CN205451957 U CN 205451957U CN 201520881638 U CN201520881638 U CN 201520881638U CN 205451957 U CN205451957 U CN 205451957U
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Abstract
The utility model provides a through fixed device structure of MOV unit of fastener, including last electrode splint, bottom electrode splint and alternative at least one MOV chip and at least one extraction electrode that sets up between powering up and down utmost point splint, last electrode splint, bottom electrode splint pass through the fastener to be fixed. The utility model discloses need not to adopt extraction electrode welding high -temperature technology, avoid causing the stealthy damage of high temperature to the chip, utilize powering up and down utmost point splint and extraction electrode as the chip fin, improved the through -flow endurance of pulse and the inferior impact endurance of undercurrent multifrequency of MOV chip, still improved MOV's temporary overvoltage endurance, withdraw from the time of having won of moving for in time breaking away from, messenger's chip performance obtains the utilization of maximize, resources are saved, the utility model discloses a through fixed device structure of MOV unit of fastener manufacturing procedure is simple, exempt from the scaling powder, exempts from the cleaner, no environmental pollution, low, the follow -up processing convenient and fast of cost structure.
Description
Technical field
This utility model relates to metal-oxide varistor technical field, particularly to a kind of MOV component structure fixing by securing member.
Background technology
Zinc oxide varistor (MetalOxideVaristors) has special nonlinear current-voltage; the environment of application meets with thunderbolt, the interference of electromagnetic field; on and off switch frequent movement, power system failure; make voltage spikes on circuit; exceed the conducting voltage of piezoresistor; conducting district will be entered; nonlinear characteristic due to MOV; its impedance meeting step-down; only have several ohms; make overvoltage form burst current to flow out, use electronic product or expensive electronic building brick that protection is connected.
In the case of unusual service condition, MOV constant conduction can cause chip heating excess, causes thermal runaway, and it is out of service and accidents caused that unexpected thermal runaway can make it have little time.
Existing MOV device, after its ceramic chip is made, need welded copper leading foot, implement the back segment high temperature process operations such as epoxy encapsulating solidification, the most not only the rear operation to chip makes profit of making troubles, and chip is caused stealthy damage to be also very important by high-temperature technology.
Utility model content
The deficiency existed for above-mentioned prior art, technical problem to be solved in the utility model is to provide a kind of, by securing member fixing MOV component structure of low cost, easily processing strong without high-temperature damage, overvoltage tolerance.
In order to solve above-mentioned technical problem, technical solution adopted in the utility model is:
This utility model provides a kind of MOV component structure fixing by securing member, it is characterized in that: including electrode clamping plate, bottom electrode clamping plate and at least one the MOV chip being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, described upper electrode clamping plate, bottom electrode clamping plate are fixed by securing member.
Described MOV chip 2 can exchange also known as valve block, the position of described upper/lower electrode clamping plate 1,4.Extraction electrode 3 and electrode clamping plate 1,4, need special-shaped to extend according to the installation of Surge Protector SPD.
Further, being arranged alternately two MOV chips and an extraction electrode between upper/lower electrode clamping plate, equivalent circuit is two and di-electrode structure.
Further, being arranged alternately two MOV chips and three extraction electrodes between upper/lower electrode clamping plate, equivalent circuit is two three electrode common mode configuration.
Further, in the two panels at two ends, electrode clamping plate respectively and have been arranged alternately two MOV chips and an extraction electrode between middle bottom electrode clamping plate, and equivalent circuit is four two-in-parallel three-electrode structures.
Further, including many groups of at least one MOV chip being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, isolation plate between the extraction electrode of two adjacent groups, it is provided with.
Further, the surface area of described upper/lower electrode clamping plate is more than the surface area of MOV chip, it is provided with electrode clamping plate on described upper electrode clamping plate and protrudes limit, being provided with bottom electrode clamping plate on described bottom electrode clamping plate and protrude limit, described upper electrode clamping plate protrude limit and bottom electrode clamping plate protrude and are provided with through hole or screwed hole on limit.
Further, described securing member is metal or nonmetallic rivet or screw, and the length of described securing member is not less than the thickness of described upper electrode clamping plate to bottom electrode clamping plate.
Further, the surface area of described extraction electrode, more than the surface area of MOV chip, described extraction electrode leads at least one leading foot, described leading foot axial lead or radially extraction.
Further, described MOV chip is arranged as required to into different shapes.
Further, the MOV components and parts that securing member is fixing, insulating barrier can be applied and process.
Further, described electrode clamping plate are alclad, copper clamping plate or aluminium alloy clamping plate, copper alloy clamping plate.
The product that described MOV component structure is formed loads in Surge Protector SPD cavity block; wherein extraction electrode can connect dropout shell fragment; electrode clamping plate connect terminals can form SPD module; or described MOV component structure forms the extraction electrode of product and can connect temperature safety element or low-temperature alloy fuse, form Thermal protection type varistor TMOV device.
This utility model has the beneficial effects that:
(1) this utility model fixes MOV chip, extraction electrode by securing member, it is not necessary to use extraction electrode welding high-temperature technology, it is to avoid chip causes high temperature stealth damage；
(2) this utility model utilizes upper/lower electrode clamping plate and extraction electrode as chip cooling sheet, improve the through-flow tolerance of pulse and the impact tolerance of the many frequencys of small area analysis of MOV chip, also improve the temporary overvoltage tolerance of MOV, win the time for disengaging is out of service in time；Make chip performance maximize the use, economize on resources；
(3) the MOV component structure manufacturing procedure fixing by securing member of the present utility model is simple, exempt from scaling powder, No clean agent, and non-environmental-pollution, cost structure are low, following process is convenient and swift.
Accompanying drawing explanation
Fig. 1-1 is the explosive view of MOV component structure in embodiment 1；
Fig. 1-2 is the constitutional diagram of MOV component structure in embodiment 1；
Fig. 1-3 is the constitutional diagram of the another kind of structure of MOV component structure in embodiment 1；
Fig. 1-4 is the isoboles of MOV component structure in embodiment 1；
Fig. 2-1 is the explosive view of MOV component structure in embodiment 2；
Fig. 2-2 is the constitutional diagram of MOV component structure in embodiment 2；
Fig. 2-3 is the isoboles of MOV component structure in embodiment 2；
Fig. 3-1 is the explosive view of MOV component structure in embodiment 3；
Fig. 3-2 is the constitutional diagram of MOV component structure in embodiment 3；
Fig. 3-3 is the constitutional diagram of the another kind of structure of MOV component structure in embodiment 3；
Fig. 3-4 is the isoboles of MOV component structure in embodiment 3；
Fig. 4-1 is the explosive view of MOV component structure in embodiment 4；
Fig. 4-2 is the isoboles of MOV component structure in embodiment 4；
Fig. 5-1 is the explosive view of the first structure of MOV component structure in embodiment 5；
Fig. 5-2 is the constitutional diagram of the first structure of MOV component structure in embodiment 5；
Fig. 5-3 is the explosive view of the second structure of MOV component structure in embodiment 5；
Fig. 5-4 is the constitutional diagram of the second structure of MOV component structure in embodiment 5；
Fig. 5-5 is the isoboles of MOV component structure in embodiment 5；
Fig. 6-1 is the explosive view of MOV component structure in embodiment 6；
Fig. 6-2 is the isoboles of MOV component structure in embodiment 6；
Fig. 7-1 is the explosive view of MOV component structure in embodiment 7；
Fig. 7-2 is the isoboles of MOV component structure in embodiment 7.
Detailed description of the invention
The most specifically illustrating embodiment of the present utility model, accompanying drawing is only for reference and explanation uses, and does not constitute the restriction to this utility model scope of patent protection.
Embodiment 1
nullIf Fig. 1-1 is to shown in 1-4，The present embodiment provides a kind of MOV component structure fixing by securing member，Including upper electrode clamping plate 1、MOV chip 2、Extraction electrode 3、Bottom electrode clamping plate 4，Described upper electrode clamping plate 1、Bottom electrode clamping plate 4 are fixed by securing member 5，Described MOV chip 2 and extraction electrode 3 are disposed alternately between described upper electrode clamping plate 1 and described bottom electrode clamping plate 4，Described upper/lower electrode clamping plate 1、The surface area of 4 is more than the surface area of MOV chip 2，In all standing state，It is provided with two upper electrode clamping plate on described upper electrode clamping plate 1 and protrudes limit 11，It is provided with two bottom electrode clamping plate on described bottom electrode clamping plate 4 and protrudes limit 41，It is provided with through hole 12 on described upper electrode clamping plate，It is provided with screwed hole 42 on described bottom electrode clamping plate 4，It is provided with extraction electrode leading foot 31 on described extraction electrode 3.
Described MOV chip 2 can exchange also known as valve block, the position of described upper/lower electrode clamping plate 1,4.Extraction electrode 3 and electrode clamping plate 1,4, need special-shaped to extend according to the installation of Surge Protector SPD.
In the present embodiment, being arranged alternately a MOV chip 2 and an extraction electrode 3 between upper/lower electrode clamping plate, as Figure 1-4, equivalent circuit is monolithic two electrode structure, and the leading foot 31 of extraction electrode 3 is positive pole L end, and upper/lower electrode clamping plate 1,4 are negative pole N end.Positive pole L end, negative pole N end can jointing temp protection mechanism, such as hot detachment mechanism or Thermal Cutoffs etc..
In the present embodiment, described securing member 5 is nonmetal screw, such as nylon screw or other insulated screw.The length of screw is more than or equal to the thickness of upper/lower electrode clamping plate 1,4, the thickness of clamped MOV chip 2, the summation of extraction electrode 3 thickness.Described securing member 5 can also is that nonmetallic rivet, screw.
In the present embodiment, the surface area of extraction electrode 3 is more than the surface area of MOV chip 2, in all standing state, one to two leading foot is led on described extraction electrode 3, leading foot is line style or flap-type leading foot, as shown in Fig. 1-2,1-3, and described leading foot axial lead or radially extraction.The leading foot of extraction electrode 3 provides big area of dissipation, convenient draw or connects trip gear, and extraction electrode 3 material is aluminum or copper or the electric conductivity such as aluminium alloy or copper alloy, and the metal material that heat conductivity is good is made, and its thickness is 0.3～1.5mm.
Described MOV chip is arranged as required to into different shapes, as being arranged to circle, rectangle or abnormity (irregularly shaped) etc., and the MOV components and parts that securing member is fixing, insulating barrier can be applied and process.
Embodiment 2
The present embodiment is with the difference of embodiment 1: if Fig. 2-1 is to shown in 2-3, two MOV chips 2 and an extraction electrode 3 it has been arranged alternately between upper/lower electrode clamping plate, extraction electrode 3 is arranged in the middle of two MOV chips 2, clamp with upper/lower electrode clamping plate, nonmetal screw 5 protrudes the through hole 12 in limit 11 through upper electrode clamping plate 1, it is anchored in the screwed hole 42 that bottom electrode clamping plate 4 protrude in limit 41, form biplate parallel way, after accessing SPD trip gear, form single dropout, bipolar electrode mounting means.As Figure 2-3, equivalent circuit is two and di-electrode structure.The leading foot 31 of extraction electrode 3 is positive pole L end, and upper/lower electrode clamping plate 1,4 are negative pole N end.
Embodiment 3
nullThe present embodiment is with the difference of embodiment 1: if Fig. 3-1 is to shown in 3-4，Two MOV chips 2 and three extraction electrodes 3 it have been arranged alternately between upper/lower electrode clamping plate，Described MOV chip 2 biplate is stacked，Middle and both sides arrange three extraction electrodes 3 altogether，With upper/lower electrode clamping plate 1、4 clampings，Nonmetal non-screw 5 protrudes the through hole 12 in limit 11 through upper electrode clamping plate，It is anchored on the screwed hole 42 that bottom electrode clamping plate 41 protrude in limit，Three leading foots of biplate form tri-electrodes of L-PE-N，Constitute single-phase common mode protected mode over the ground，If the extraction electrode leading foot 31 by both sides accesses the trip gear of SPD，Form double three electrode single-phase common mode protection modules of threading off，If adding a components and parts by demand at PE end more can form the single-phase full mould protected mode of Y connection，Wherein，Such as Fig. 3-2、Shown in 3-3，The leading foot 31 of extraction electrode 3 can be drawn with axial lead or radially.As shown in Figure 3-4, equivalent circuit is two three electrode common mode configuration, and the leading foot 31 of middle extraction electrode 3 is ground connection PE end, and the leading foot 31 of the extraction electrode 3 of both sides is respectively positive pole L end and negative pole N end.
Embodiment 4
The present embodiment is with the difference of embodiment 1: such as Fig. 4-1, shown in 4-2, at upper/lower electrode clamping plate 1, three MOV chips 2 and two extraction electrodes 3 it have been arranged alternately between 4, described MOV chip 2 three is stacked, two extraction electrodes 3 are set between three MOV chips, with upper/lower electrode clamping plate 1, 4 clampings, non-screw 5 protrudes the through hole 12 in limit 11 through upper electrode clamping plate, it is anchored in the screwed hole 42 that bottom electrode clamping plate protrude in limit 41, the triangle protection circuit of three three exits of chip is formed by electrode clamping plate one end and two leading foots, three exits are positive pole L end；If extraction electrode leading foot 31 to be accessed the trip gear of SPD, form double three electrode dihedral connection protection modules of threading off.
Embodiment 5
nullThe present embodiment is with the difference of embodiment 1: such as Fig. 5-1、Shown in 5-2，In the two panels at two ends, electrode clamping plate 1 respectively and have been arranged alternately two MOV chips 2 and an extraction electrode 3 between middle bottom electrode clamping plate 4，One extraction electrode 3 is set between two MOV chips 2 and forms one group of combinative structure，Between two groups of combinative structurees, bottom electrode clamping plate 4 are set，Two groups of MOV chips 2 are clamped with two pieces of upper electrode clamping plate 1，Each upper electrode clamping plate 1 protrude above through hole 12 in limit 11 through upper electrode clamping plate with two or above non-screw 5 in the way of the most wrong，It is anchored on the bottom electrode clamping plate put among two groups of combinative structurees to protrude in the screwed hole 42 in limit 41，Four chips 2 are formed in parallel with this、The structure of three extraction electrodes 3，L in access circuit can be obtained，The N common mode configuration to PE，Can also be by two extraction electrode L ends and N end via interiorly or exteriorly in parallel，Form the four full paralleling models of chip.
As shown in Fig. 5-3,5-4, being provided with another at bottom electrode clamping plate side and protrude limit 40, this protrusion limit 40 is provided with another screwed hole 400, and on two, the correspondence position of electrode clamping plate 1 arranges another through hole, by another screw through described through hole and screwed hole 400, so that fastening effect is more preferably.
As illustrated in fig. 5-5, equivalent circuit is four two-in-parallel three-electrode structures.
Embodiment 6
The present embodiment is with the difference of embodiment 1: if Fig. 6-1 is to shown in 6-2, MOV combined mechanism of the present utility model includes two groups of at least one MOV chips being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, is provided with isolation plate between the extraction electrode of two adjacent groups.In the present embodiment, first group is provided with two MOV chips and two extraction electrodes, second group is provided with a MOV chip and an extraction electrode.By MOV chip, extraction electrode, MOV chip, extraction electrode, isolation plate, extraction electrode, MOV chip is sequentially stacked, again with upper/lower electrode clamping plate 1, 4 clampings, nonmetal screw 5 protrudes the through hole 12 in limit 11 through upper electrode clamping plate, it is anchored in the screwed hole 42 that bottom electrode clamping plate protrude in limit 41, three five electrode structures are formed by electrode clamping plate two end and three leading foots, connect one, three extraction electrode leading foots, single-phase full mould or three-phase half module protected mode can be formed, if by one, three extraction electrode leading foots access the trip gear of SPD, form double dropout five single-phase full guard of electrode or three-phase partly protects module.
Embodiment 7
The present embodiment is with the difference of embodiment 6: if Fig. 7-1 is to shown in 7-2, MOV combined mechanism of the present utility model includes two groups of at least one MOV chips being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, is provided with isolation plate between the extraction electrode of two adjacent groups.In the present embodiment, first group and second group is provided with two MOV chips and an extraction electrode, extraction electrode 3 is disposed in the middle of two MOV chips, clamp with electrode clamping plate 1 and bottom electrode clamping plate 4, nonmetal screw 5 protrudes above the through hole 12 in limit 11 through upper electrode clamping plate, tighten in the screwed hole 42 in bottom electrode clamping plate protrude above limit 41, extraction electrode leading foot 3 in the middle of connecting two groups, form the N electrode accessed in circuit, upper/lower electrode clamping plate 1, 4 and the extraction electrode leading foot formation L1 on isolation plate 6 both sides, L2, tetra-electrodes of L3 and PE, it is four module protection circuits of allusion quotation shape.Two groups of middle extraction electrode leading foots are accessed the trip gear of SPD, forms L1, the double tripping-mode of tetra-five electrodes of L2, L3, N, PE.To increase through-current capacity, also often two or Dan Zusi sheet paralleling models of group can be formed by reconnecting electrode lead-out pins.
The product that described MOV component structure is formed loads in Surge Protector SPD cavity block; wherein extraction electrode can connect dropout shell fragment; electrode clamping plate connect terminals can form SPD module; or described MOV component structure forms the extraction electrode of product and can connect temperature safety element or low-temperature alloy fuse, form Thermal protection type varistor TMOV device.
Above disclosed only preferred embodiment of the present utility model, it is impossible to limit rights protection scope of the present utility model, the equivalent variations therefore made according to this utility model claim with this, still belong to the scope that this utility model is contained.
Claims (10)
1. the MOV component structure fixed by securing member, it is characterized in that: including electrode clamping plate, bottom electrode clamping plate and at least one the MOV chip being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, described upper electrode clamping plate, bottom electrode clamping plate are fixed by securing member.
A kind of MOV component structure fixing by securing member the most according to claim 1, it is characterised in that: being arranged alternately two MOV chips and an extraction electrode between upper/lower electrode clamping plate, equivalent circuit is two and di-electrode structure.
A kind of MOV component structure fixing by securing member the most according to claim 1, it is characterised in that: being arranged alternately two MOV chips and three extraction electrodes between upper/lower electrode clamping plate, equivalent circuit is two three electrode common mode configuration.
A kind of MOV component structure fixing by securing member the most according to claim 1, it is characterized in that: in the two panels at two ends, electrode clamping plate respectively and have been arranged alternately two MOV chips and an extraction electrode between middle bottom electrode clamping plate, and equivalent circuit is four two-in-parallel three-electrode structures.
A kind of MOV component structure fixing by securing member the most according to claim 1, it is characterized in that: include many groups of at least one MOV chip being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, between the extraction electrode of two adjacent groups, be provided with isolation plate.
6. according to a kind of MOV component structure fixing by securing member according to any one of claim 1-5, it is characterized in that: the surface area of described upper/lower electrode clamping plate is more than the surface area of MOV chip, it is provided with electrode clamping plate on described upper electrode clamping plate and protrudes limit, being provided with bottom electrode clamping plate on described bottom electrode clamping plate and protrude limit, described upper electrode clamping plate protrude limit and bottom electrode clamping plate protrude and are provided with through hole or screwed hole on limit.
7. according to a kind of MOV component structure fixing by securing member according to any one of claim 1-5, it is characterized in that: described securing member is metal or nonmetallic rivet or screw, and the length of described securing member is not less than the thickness of described upper electrode clamping plate to bottom electrode clamping plate.
8. according to a kind of MOV component structure fixing by securing member according to any one of claim 1-5, it is characterized in that: the surface area of described extraction electrode is more than the surface area of MOV chip, at least one leading foot, described leading foot axial lead or radially extraction is led on described extraction electrode.
The MOV component structure fixing by securing member the most according to claim 1, it is characterised in that: described MOV chip is arranged as required to into different shapes.
The MOV component structure fixing by securing member the most according to claim 1, it is characterised in that: described electrode clamping plate are alclad, copper clamping plate or aluminium alloy clamping plate, copper alloy clamping plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520881638.0U CN205451957U (en) | 2015-11-05 | 2015-11-05 | Through fixed device structure of MOV unit of fastener |
| PCT/CN2015/094163 WO2017075842A1 (en) | 2015-11-05 | 2015-11-10 | Mov device structure fixed by means of a fastener |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520881638.0U CN205451957U (en) | 2015-11-05 | 2015-11-05 | Through fixed device structure of MOV unit of fastener |
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| CN205451957U true CN205451957U (en) | 2016-08-10 |
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| CN201520881638.0U Active CN205451957U (en) | 2015-11-05 | 2015-11-05 | Through fixed device structure of MOV unit of fastener |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105469915A (en) * | 2015-11-05 | 2016-04-06 | 隆科电子(惠阳)有限公司 | Metal oxide varistors (MOV) component structure fixed by fastening element |
| CN107342145A (en) * | 2017-07-10 | 2017-11-10 | 隆科电子(惠阳)有限公司 | A kind of compound MOV for inserting GDT |
-
2015
- 2015-11-05 CN CN201520881638.0U patent/CN205451957U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105469915A (en) * | 2015-11-05 | 2016-04-06 | 隆科电子(惠阳)有限公司 | Metal oxide varistors (MOV) component structure fixed by fastening element |
| CN107342145A (en) * | 2017-07-10 | 2017-11-10 | 隆科电子(惠阳)有限公司 | A kind of compound MOV for inserting GDT |
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