WO2017065552A1 - Light emitting diode module and light emitting diode lighting equipment comprising same - Google Patents

Light emitting diode module and light emitting diode lighting equipment comprising same Download PDF

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Publication number
WO2017065552A1
WO2017065552A1 PCT/KR2016/011548 KR2016011548W WO2017065552A1 WO 2017065552 A1 WO2017065552 A1 WO 2017065552A1 KR 2016011548 W KR2016011548 W KR 2016011548W WO 2017065552 A1 WO2017065552 A1 WO 2017065552A1
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Prior art keywords
light emitting
emitting diode
substrate
substrates
auxiliary
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PCT/KR2016/011548
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French (fr)
Korean (ko)
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배진우
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로렌스 주식회사
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Publication of WO2017065552A1 publication Critical patent/WO2017065552A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks

Definitions

  • the present invention relates to a light emitting diode module and a light emitting diode lighting device comprising the same.
  • the light emitting diode lighting apparatus includes a light emitting diode module, a lamp, an optical cover, etc., in which a plurality of light emitting diode chips are mounted on a printed circuit board.
  • the light emitting diode module has a structure in which a light emitting diode chip is disposed on a flat printed circuit board. In this case, there is a problem in that it is difficult to send light to the side and the rear by the straightness of the light generated by the light emitting diode chip.
  • the problem to be solved by the present invention is to provide a light emitting diode lighting device that can be bent a portion of the substrate of the light emitting diode lighting device without the problem of breakdown of the insulating layer or cutting of the copper foil.
  • Another problem to be solved by the present invention is to provide a light emitting diode lighting apparatus having a curved substrate that can be manufactured without using a substrate of expensive material.
  • a light emitting diode module includes a plurality of substrates, a plurality of light emitting diode chips installed on the substrate, and a connection for connecting the plurality of substrates to be fixed at a predetermined angle. Member.
  • connection member may include a first portion and a second portion constituting the predetermined angle, and the first portion and the second portion may be fixed to the substrates connected to each other.
  • the light emitting diode module according to the embodiment of the present invention may further include an electrical connection for electrically connecting the substrates connected to each other.
  • the auxiliary substrate may be provided in plurality, and the plurality of auxiliary substrates may be disposed adjacent to an edge of the main substrate in a state of forming the predetermined angle.
  • the main substrate may have a circular shape, and the plurality of auxiliary substrates may be disposed adjacent to an edge of the main substrate so as to form an equal interval.
  • the substrate is made of a relatively inexpensive material without the need to manufacture the substrate from an expensive metal material that does not cause cracks when bent It can be manufactured, thereby reducing the manufacturing cost.
  • the angle, size, etc. of the connection member by adjusting the angle, size, etc. of the connection member, the position, mutual angle, and the like of the surface on which the light emitting diode chip is installed can be freely set.
  • FIG. 1 is a view schematically showing a light emitting diode lighting fixture according to an embodiment of the present invention.
  • FIG. 2 is a front view of a light emitting diode module according to an embodiment of the present invention.
  • FIG 3 is a rear perspective view of a light emitting diode module according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. 3.
  • FIG. 5 is a view showing the electrical connection of the light emitting diode module according to an embodiment of the present invention.
  • the light emitting diode lighting apparatus 100 may include a light emitting diode module 1, and the light emitting diode module 1 may be fixed to the frame 120. In this case, the light emitted from the light emitting diode module 1 may pass through the optical cover 110 and move forward, side, and backward.
  • the frame 120 may be provided with an AC-DC converter (for example, a switching mode power supply (SMPS) for generating a DC power source to be used in the light emitting diode module 1). .
  • SMPS switching mode power supply
  • the light emitting diode module 1 includes a plurality of substrates 11 and 13.
  • the plurality of substrates 11 and 13 may be printed circuit boards having circuit wirings, and may have various shapes and arrangements as necessary.
  • the substrate indicated by reference numeral 11 will be referred to as a main substrate and the substrate indicated by reference numeral 13 will be referred to as an auxiliary substrate.
  • the main substrate 11 has a circular plate shape and the auxiliary substrate 13 has a substantially rectangular shape
  • the shape of the substrates 11 and 13 is not limited thereto and may be variously changed.
  • the plurality of substrates 11 and 13 are disposed adjacent to each other.
  • the plurality of auxiliary substrates 13 may be disposed at equal intervals in the circumferential direction while being disposed adjacent to the outer side of the edge of the main substrate 11.
  • the light emitting diode chip 15 is provided on the substrates 11 and 13. As shown in the figure, the light emitting diode chip 15 is installed on the auxiliary substrate 13 as well as the main substrate 11. The number and position of the light emitting diode chips 15 may be variously changed.
  • the substrates 11 and 13 may not be bent, but may be formed of materials such as FR4, CEM1, and CEM3, which are inexpensive.
  • the light emitting diode lighting apparatus can send light not only in front of the reference surface of the main substrate 11 but also laterally and rearward.
  • the connection member 20 may include a first portion 21 and a second portion 23 at a predetermined angle.
  • the connection member 20 may be formed of a metal material such as aluminum.
  • the first portion 21 may be fixed to be in close contact with the rear surface opposite to the surface on which the light emitting diode chip 15 of the main substrate 11 is installed, and the second portion 23 may be fixed to the auxiliary substrate. It may be fixed in a state in close contact with the rear of the (13).
  • the first and second portions 21 and 23 may be fastened to the main substrate 11 and the auxiliary substrate 13 by fastening means 25 such as screws and rivets, respectively.
  • an electrical connection part 30 may be provided to electrically connect the circuit wiring of the main board 11 and the auxiliary board 13.
  • the electrical connection portion 30 may be any means capable of electrically connecting the circuit wiring of the main substrate 11 and the auxiliary substrate 13.
  • the electrical connection part 3 may be a wire harness as shown in the drawing, and both ends of the wire harness are provided with connectors 31 and 33, respectively, so that the main board 11 and the auxiliary board ( It may be electrically connected to the circuit wiring of 13) respectively.
  • the electrical connection unit 30 may be implemented by various means such as a flexible PCB as well as a wire harness.

Abstract

A light emitting diode module comprises: a plurality of substrates; a plurality of light emitting diode chips mounted on the substrates; and connecting members for connecting the plurality of substrates so that the plurality of substrates are fixed at a predetermined angle. The plurality of substrates may be fixedly connected at a predetermined angle by separate connecting members, thereby being capable of manufacturing a substrate with a relatively inexpensive material without having to manufacture the substrate with an expensive metal material that does not cause cracking when bent and, accordingly reducing manufacturing costs. Further, the angles, sizes, and the like of the connecting members may be adjusted, thereby being capable of freely setting the positions, mutual angles, and the like of the surface on which light emitting diode chips are mounted.

Description

발광다이오드 모듈 및 이를 포함하는 발광다이오드 조명 기구Light emitting diode module and light emitting diode lighting device including the same
본 발명은 발광다이오드 모듈 및 이를 포함하는 발광다이오드 조명 기구에 관한 것이다.The present invention relates to a light emitting diode module and a light emitting diode lighting device comprising the same.
최근 발광다이오드를 이용한 발광다이오드 조명 기구가 널리 사용되고 있다. 발광다이오드 조명 기구는 인쇄회로기판 상에 다수의 발광다이오드 칩이 실장되어 이루어지는 발광다이오드 모듈, 등기구, 광학 커버 등을 포함한다. 통상적으로 발광다이오드 모듈은 평평한 형태의 인쇄회로기판 상에 발광다이오드 칩을 배치하는 구조를 가지며, 이 경우 발광다이오드 칩에 의해 생성되는 빛의 직진성에 의해 측방과 후방으로 빛을 보내기 어려운 문제가 있다.Recently, light emitting diode lighting apparatuses using light emitting diodes have been widely used. The light emitting diode lighting apparatus includes a light emitting diode module, a lamp, an optical cover, etc., in which a plurality of light emitting diode chips are mounted on a printed circuit board. In general, the light emitting diode module has a structure in which a light emitting diode chip is disposed on a flat printed circuit board. In this case, there is a problem in that it is difficult to send light to the side and the rear by the straightness of the light generated by the light emitting diode chip.
이러한 문제를 해결하기 위해 인쇄회로기판 상에 발광다이오드 칩을 실장한 후 인쇄회로기판의 가장자리가 측방을 향하도록 휘는 방법이 소개된 바 있다. 그러나 인쇄회로기판을 휘기 위해서는 기판의 재질로 가격이 상대적으로 비싼 금속(주로 알루미늄)이 사용되어야 하며, 또한 휘는 각도가 커지는 경우 기판에 크랙(crack)이 발생할 수 있다. 기판에 크랙이 발생하면, 절연층이 파괴되거나 동박이 끊어지는 문제가 있기 때문에, 휘는 각도가 제한될 수 밖에 없다.In order to solve this problem, a method has been introduced in which an LED chip is mounted on a printed circuit board and then the edge of the printed circuit board is bent toward the side. However, in order to bend a printed circuit board, a relatively expensive metal (mainly aluminum) must be used as the material of the substrate, and when the bending angle is increased, cracks may occur in the substrate. If a crack occurs in the substrate, there is a problem that the insulating layer is broken or the copper foil is broken, so the bending angle is inevitably limited.
본 발명이 해결하고자 하는 과제는 절연층 파괴나 동박의 절단 문제가 없이 발광다이오드 조명 기구의 기판의 일부가 휘어지도록 할 수 있는 발광다이오드 조명 기구를 제공하는 것이다.The problem to be solved by the present invention is to provide a light emitting diode lighting device that can be bent a portion of the substrate of the light emitting diode lighting device without the problem of breakdown of the insulating layer or cutting of the copper foil.
나아가 본 발명이 해결하고자 하는 다른 과제는 고가 재질의 기판을 사용하지 않고도 제조될 수 있는 휘어진 형태의 기판을 가지는 발광다이오드 조명 기구를 제공하는 것이다.Furthermore, another problem to be solved by the present invention is to provide a light emitting diode lighting apparatus having a curved substrate that can be manufactured without using a substrate of expensive material.
본 발명의 실시예에 따른 발광다이오드 모듈은 복수의 기판, 상기 기판 상에 설치되는 복수의 발광다이오드 칩, 그리고 상기 복수의 기판이 미리 정해진 각도를 이루는 상태로 고정되도록 상기 복수의 기판을 연결하는 연결 부재를 포함한다.A light emitting diode module according to an embodiment of the present invention includes a plurality of substrates, a plurality of light emitting diode chips installed on the substrate, and a connection for connecting the plurality of substrates to be fixed at a predetermined angle. Member.
한편, 본 발명의 다른 실시예에 따른 발광다이오드 모듈은 하나 이상의 발광다이오드 칩이 설치되는 메인 기판, 하나 이상의 발광다이오드 칩이 설치되며 상기 메인 기판에 인접하게 배치되는 보조 기판, 그리고 상기 메인 기판과 상기 보조 기판이 미리 정해진 각도를 이루는 상태로 고정되도록 상기 메인 기판과 상기 보조 기판을 연결하는 연결 부재를 포함한다.Meanwhile, a light emitting diode module according to another embodiment of the present invention may include a main substrate on which one or more light emitting diode chips are installed, an auxiliary substrate on which one or more light emitting diode chips are installed and disposed adjacent to the main substrate, and the main substrate and the And a connecting member connecting the main substrate and the auxiliary substrate so that the auxiliary substrate is fixed at a predetermined angle.
상기 연결 부재는 상기 미리 정해진 각도를 이루는 제1 부분과 제2 부분을 포함할 수 있고, 상기 제1 부분과 상기 제2 부분은 상기 서로 연결되는 기판에 각각 고정될 수 있다.The connection member may include a first portion and a second portion constituting the predetermined angle, and the first portion and the second portion may be fixed to the substrates connected to each other.
상기 연결 부재는 상기 기판의 양면 중 상기 발광다이오드 칩이 설치되는 면의 반대 면에 고정될 수 있다.The connection member may be fixed to a surface opposite to a surface on which the light emitting diode chip is installed, on both surfaces of the substrate.
본 발명의 실시예에 따른 발광다이오드 모듈은 상기 서로 연결되는 기판을 서로 전기적으로 연결하기 위한 전기적 연결부를 더 포함할 수 있다.The light emitting diode module according to the embodiment of the present invention may further include an electrical connection for electrically connecting the substrates connected to each other.
상기 보조 기판은 복수로 구비될 수 있고, 상기 복수의 보조 기판은 상기 미리 정해진 각도를 이루는 상태로 상기 메인 기판의 가장자리에 인접하게 배치될 수 있다.The auxiliary substrate may be provided in plurality, and the plurality of auxiliary substrates may be disposed adjacent to an edge of the main substrate in a state of forming the predetermined angle.
상기 메인 기판은 원 형태를 가질 수 있고, 상기 복수의 보조 기판은 등간격을 이루도록 상기 메인 기판의 가장자리에 인접하게 배치될 수 있다.The main substrate may have a circular shape, and the plurality of auxiliary substrates may be disposed adjacent to an edge of the main substrate so as to form an equal interval.
한편, 본 발명의 실시예에 따른 발광다이오드 조명 기구는 상기한 본 발명의 실시예에 따른 발광다이오드 모듈, 프레임 그리고 상기 발광다이오드 모듈에서 발산된 광이 통과하도록 설치되는 광학 커버를 포함한다.On the other hand, the light emitting diode lighting apparatus according to the embodiment of the present invention includes a light emitting diode module, a frame according to the embodiment of the present invention and an optical cover which is installed to pass the light emitted from the light emitting diode module.
본 발명에 의하면, 복수의 기판을 별도의 연결 부재에 의해 미리 정해진 각도로 고정적으로 연결함으로써, 휘어질 때 크랙이 발생하지 않는 고가의 금속 재질로 기판을 제조할 필요가 없이 상대적으로 저렴한 재질로 기판을 제조할 수 있으며, 그에 따라 제조 원가를 절감할 수 있다. 또한 연결 부재의 각도, 크기 등을 조절함으로써, 발광다이오드 칩이 설치되는 면의 위치, 상호 각도 등을 자유롭게 설정할 수 있다.According to the present invention, by connecting a plurality of substrates fixedly at a predetermined angle by a separate connection member, the substrate is made of a relatively inexpensive material without the need to manufacture the substrate from an expensive metal material that does not cause cracks when bent It can be manufactured, thereby reducing the manufacturing cost. In addition, by adjusting the angle, size, etc. of the connection member, the position, mutual angle, and the like of the surface on which the light emitting diode chip is installed can be freely set.
도 1은 본 발명의 실시예에 따른 발광다이오드 조명 기구를 개략적으로 보여주는 도면이다.1 is a view schematically showing a light emitting diode lighting fixture according to an embodiment of the present invention.
도 2는 본 발명의 실시예에 따른 발광다이오드 모듈의 정면도이다.2 is a front view of a light emitting diode module according to an embodiment of the present invention.
도 3은 본 발명의 실시예에 따른 발광다이오드 모듈의 배면 사시도이다.3 is a rear perspective view of a light emitting diode module according to an embodiment of the present invention.
도 4는 도 3의 Ⅳ-Ⅳ선을 따라 절개한 단면도이다.4 is a cross-sectional view taken along the line IV-IV of FIG. 3.
도 5는 본 발명의 실시예에 따른 발광다이오드 모듈의 전기적 연결부를 보여주는 도면이다.5 is a view showing the electrical connection of the light emitting diode module according to an embodiment of the present invention.
이하에서 첨부된 도면을 참조하여 본 발명의 실시예에 대해 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.
도 1을 참조하면, 본 발명의 실시예에 따른 발광다이오드 조명 기구(100)는 광학 커버(110)를 포함하며, 광학 커버(110)는 프레임(120)에 고정될 수 있다. 예를 들어, 광학 커버(110)는 광을 통과시킬 수 있는 재질로 형성될 수 있으며, 광 확산 특성을 가지는 합성수지 재질, 프리즘 시트 등으로 형성될 수 있다.Referring to FIG. 1, the LED lighting apparatus 100 according to the embodiment of the present invention includes an optical cover 110, and the optical cover 110 may be fixed to the frame 120. For example, the optical cover 110 may be formed of a material capable of passing light, and may be formed of a synthetic resin material, a prism sheet, or the like having light diffusing characteristics.
한편, 발광다이오드 조명 기구(100)는 발광다이오드 모듈(1)을 포함하고, 발광다이오드 모듈(1)은 프레임(120)에 고정될 수 있다. 이때, 발광다이오드 모듈(1)에서 발산되는 광은 광학 커버(110)을 통과하여 전방, 측방, 후방으로 진행할 수 있다. 한편, 도면에는 명시되지 않았으나, 프레임(120)에는 발광다이오드 모듈(1)에서 사용될 직류 전원을 생성하기 위한 교류-직류 변환 장치(예를 들어, SMPS(switching mode power supply))가 구비될 수 있다.Meanwhile, the light emitting diode lighting apparatus 100 may include a light emitting diode module 1, and the light emitting diode module 1 may be fixed to the frame 120. In this case, the light emitted from the light emitting diode module 1 may pass through the optical cover 110 and move forward, side, and backward. On the other hand, although not shown in the drawings, the frame 120 may be provided with an AC-DC converter (for example, a switching mode power supply (SMPS) for generating a DC power source to be used in the light emitting diode module 1). .
도 2 및 도 3을 참조하면, 본 발명의 실시예에 따른 발광다이오드 모듈(1)은 복수의 기판(11, 13)을 구비한다. 복수의 기판(11, 13)은 회로 배선을 가지는 인쇄회로기판일 수 있으며, 필요에 따라 다양한 형태 및 배치를 가질 수 있다. 이하에서, 도면부호 11에 의해 지시된 기판을 메인 기판으로 칭하고 도면부호 13에 의해 지시된 기판을 보조 기판이라고 칭하기로 한다.2 and 3, the light emitting diode module 1 according to the embodiment of the present invention includes a plurality of substrates 11 and 13. The plurality of substrates 11 and 13 may be printed circuit boards having circuit wirings, and may have various shapes and arrangements as necessary. Hereinafter, the substrate indicated by reference numeral 11 will be referred to as a main substrate and the substrate indicated by reference numeral 13 will be referred to as an auxiliary substrate.
도면에는 메인 기판(11)이 원형 플레이트의 형태를 가지고 보조 기판(13)이 대략 사각형 형태를 가지는 것으로 도시되어 있으나, 기판(11, 13)의 형태가 이에 한정되는 것은 아니고 다양하게 변경될 수 있다. 복수의 기판(11, 13)은 서로 인접하게 배치된다. 예를 들어, 도면에 도시된 바와 같이 복수의 보조 기판(13)이 메인 기판(11)의 가장자리 외측에 인접하게 배치되면서 원주 방향으로 등간격으로 배치될 수 있다.Although the main substrate 11 has a circular plate shape and the auxiliary substrate 13 has a substantially rectangular shape, the shape of the substrates 11 and 13 is not limited thereto and may be variously changed. . The plurality of substrates 11 and 13 are disposed adjacent to each other. For example, as shown in the drawing, the plurality of auxiliary substrates 13 may be disposed at equal intervals in the circumferential direction while being disposed adjacent to the outer side of the edge of the main substrate 11.
발광다이오드 칩(15)이 기판(11, 13)에 설치된다. 도면에 도시된 바와 같이, 발광다이오드 칩(15)은 메인 기판(11)뿐만 아니라 보조 기판(13)에도 설치된다. 발광다이오드 칩(15)의 개수 및 위치는 다양하게 변경될 수 있다.The light emitting diode chip 15 is provided on the substrates 11 and 13. As shown in the figure, the light emitting diode chip 15 is installed on the auxiliary substrate 13 as well as the main substrate 11. The number and position of the light emitting diode chips 15 may be variously changed.
연결 부재(20)는 기판(11, 13)이 미리 정해진 각도를 이루는 상태로 서로 고정되도록 복수의 기판(11, 13)을 연결한다. 이에 의해, 메인 기판(11)의 발광다이오드 칩(15)이 설치된 면과 보조 기판(13)의 발광다이오드 칩(15)이 설치된 면이 미리 정해진 각도를 이루는 상태로 고정될 수 있다. 여기서, 미리 정해진 각도는 조명 기구의 용도, 조명 범위 등을 고려하여 적절히 선택될 수 있다. 연결 부재(20)를 이용하여 복수의 기판(11, 13)을 미리 정해진 각도를 가지도록 서로 연결함으로써, 발광다이오드 칩이 설치되는 면이 단일 방향을 향하는 것이 아니라 원하는 각도를 이루도록 할 수 있으며, 나아가 단일의 기판을 휘어서 정해진 각도를 만드는 것이 아니기 때문에 기판을 휠 때 생길 수 있는 크랙의 문제가 원천적으로 차단되며 이로 인해 상대적으로 저렴한 재질로 기판을 제조할 수 있다. 예를 들어, 기판(11, 13)은 휘어질 수는 없으나 가격이 저렴한 FR4, CEM1, CEM3 등의 재질로 형성될 수 있다.The connection member 20 connects the plurality of substrates 11 and 13 so that the substrates 11 and 13 are fixed to each other at a predetermined angle. As a result, the surface on which the light emitting diode chip 15 of the main substrate 11 is installed and the surface on which the light emitting diode chip 15 of the auxiliary substrate 13 is installed may be fixed at a predetermined angle. Here, the predetermined angle may be appropriately selected in consideration of the use of the lighting fixture, the lighting range, and the like. By connecting the plurality of substrates 11 and 13 to each other using a connection member 20 to have a predetermined angle, the surface on which the light emitting diode chip is installed may be formed at a desired angle instead of facing a single direction. Since a single substrate is not bent at a predetermined angle, the problem of cracking when the substrate is bent is fundamentally prevented, which makes it possible to manufacture the substrate using a relatively inexpensive material. For example, the substrates 11 and 13 may not be bent, but may be formed of materials such as FR4, CEM1, and CEM3, which are inexpensive.
이에 따라, 본 발명의 실시예에 따른 발광다이오드 조명 기구는, 도 1에 도시된 바와 같이, 메인 기판(11)의 기준면의 전방뿐만 아니라 측방 및 후방으로도 빛을 보낼 수 있다.Accordingly, the light emitting diode lighting apparatus according to the embodiment of the present invention, as shown in Figure 1, can send light not only in front of the reference surface of the main substrate 11 but also laterally and rearward.
연결 부재(20)는 미리 정해진 각도를 이루는 제1 부분(21)과 제2 부분(23)을 포함할 수 있다. 예를 들어, 연결 부재(20)는 알루미늄과 같은 금속 재질로 형성될 수 있다. 예를 들어, 제1 부분(21)은 메인 기판(11)의 발광다이오드 칩(15)이 설치되는 면의 반대 면인 후면에 밀착되는 상태로 고정될 수 있고, 제2 부분(23)은 보조 기판(13)의 후면에 밀착되는 상태로 고정될 수 있다. 이때, 제1 및 제2 부분(21, 23)은 나사, 리벳과 같은 체결 수단(25)에 의해 메인 기판(11)과 보조 기판(13)에 각각 체결될 수 있다.The connection member 20 may include a first portion 21 and a second portion 23 at a predetermined angle. For example, the connection member 20 may be formed of a metal material such as aluminum. For example, the first portion 21 may be fixed to be in close contact with the rear surface opposite to the surface on which the light emitting diode chip 15 of the main substrate 11 is installed, and the second portion 23 may be fixed to the auxiliary substrate. It may be fixed in a state in close contact with the rear of the (13). In this case, the first and second portions 21 and 23 may be fastened to the main substrate 11 and the auxiliary substrate 13 by fastening means 25 such as screws and rivets, respectively.
한편, 도 4를 참조하면, 메인 기판(11)과 보조 기판(13)의 회로 배선의 전기적 연결을 위한 전기적 연결부 (30)가 구비될 수 있다. 전기적 연결부(30)는 메인 기판(11)과 보조 기판(13)의 회로 배선을 전기적으로 연결할 수 있는 임의의 수단일 수 있다. 예를 들어, 전기적 연결부(3)는 도면에 도시된 바와 같은 와이어 하네스(wire harness)일 수 있으며, 와이어 하네스의 양단에는 각각 커넥터(31, 33)가 구비되어 메인 기판(11) 및 보조 기판(13)의 회로 배선에 각각 전기적으로 연결될 수 있다. 이 외에도 전기적 연결부(30)는 와이어 하네스 뿐만 아니라 플렉서블 PCB 등 다양한 수단으로 구현될 수 있다.Meanwhile, referring to FIG. 4, an electrical connection part 30 may be provided to electrically connect the circuit wiring of the main board 11 and the auxiliary board 13. The electrical connection portion 30 may be any means capable of electrically connecting the circuit wiring of the main substrate 11 and the auxiliary substrate 13. For example, the electrical connection part 3 may be a wire harness as shown in the drawing, and both ends of the wire harness are provided with connectors 31 and 33, respectively, so that the main board 11 and the auxiliary board ( It may be electrically connected to the circuit wiring of 13) respectively. In addition, the electrical connection unit 30 may be implemented by various means such as a flexible PCB as well as a wire harness.
이상에서 본 발명의 실시예를 설명하였으나, 본 발명의 권리범위는 이에 한정되지 아니하며 본 발명의 실시예로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 용이하게 변경되어 균등한 것으로 인정되는 범위의 모든 변경 및 수정을 포함한다.Although the embodiments of the present invention have been described above, the scope of the present invention is not limited thereto, and it is recognized that the present invention is easily changed and equivalent by those skilled in the art to which the present invention pertains. Includes all changes and modifications to the scope of the matter.
본 발명은 발광다이오드 모듈에 관한 것으로 발광다이오드 램프에 적용될 수있어 산업상 이용가능성이 있다.The present invention relates to a light emitting diode module and can be applied to a light emitting diode lamp has industrial applicability.

Claims (8)

  1. 복수의 기판,Multiple substrates,
    상기 기판 상에 설치되는 복수의 발광다이오드 칩, 그리고A plurality of light emitting diode chips provided on the substrate, and
    상기 복수의 기판이 미리 정해진 각도를 이루는 상태로 고정되도록 상기 복수의 기판을 연결하는 연결 부재를 포함하는 발광다이오드 모듈.And a connection member connecting the plurality of substrates to fix the plurality of substrates at a predetermined angle.
  2. 하나 이상의 발광다이오드 칩이 설치되는 메인 기판,A main substrate on which one or more light emitting diode chips are installed;
    하나 이상의 발광다이오드 칩이 설치되며 상기 메인 기판에 인접하게 배치되는 보조 기판, 그리고An auxiliary substrate provided with at least one light emitting diode chip and disposed adjacent to the main substrate, and
    상기 메인 기판과 상기 보조 기판이 미리 정해진 각도를 이루는 상태로 고정되도록 상기 메인 기판과 상기 보조 기판을 연결하는 연결 부재를 포함하는 발광다이오드 모듈.And a connection member connecting the main substrate and the auxiliary substrate to fix the main substrate and the auxiliary substrate at a predetermined angle.
  3. 제1항 또는 제2항에서,The method of claim 1 or 2,
    상기 연결 부재는 상기 미리 정해진 각도를 이루는 제1 부분과 제2 부분을 포함하고,The connecting member includes a first portion and a second portion constituting the predetermined angle,
    상기 제1 부분과 상기 제2 부분은 상기 서로 연결되는 기판에 각각 고정되는 발광다이오드 모듈.The first portion and the second portion of the light emitting diode module is fixed to the substrate connected to each other.
  4. 제3항에서,In claim 3,
    상기 연결 부재는 상기 기판의 양면 중 상기 발광다이오드 칩이 설치되는 면의 반대 면에 고정되는 발광다이오드 모듈.The connection member is a light emitting diode module of the both sides of the substrate is fixed to the opposite side of the surface on which the light emitting diode chip is installed.
  5. 제1항 또는 제2항에서,The method of claim 1 or 2,
    상기 서로 연결되는 기판을 서로 전기적으로 연결하기 위한 전기적 연결부를 더 포함하는 발광다이오드 모듈.The LED module further comprises an electrical connection for electrically connecting the substrates connected to each other.
  6. 제2항에서,In claim 2,
    상기 보조 기판은 복수로 구비되고,The auxiliary substrate is provided in plurality,
    상기 복수의 보조 기판은 상기 미리 정해진 각도를 이루는 상태로 상기 메인 기판의 가장자리에 인접하게 배치되는 발광다이오드 모듈.The plurality of auxiliary substrates are disposed adjacent to the edge of the main substrate to form the predetermined angle.
  7. 제6항에서,In claim 6,
    상기 메인 기판은 원 형태를 가지고,The main substrate has a circular shape,
    상기 복수의 보조 기판은 등간격을 이루도록 상기 메인 기판의 가장자리에 인접하게 배치되는 발광다이오드 모듈.The plurality of auxiliary substrates are disposed adjacent to the edge of the main substrate to be equally spaced apart.
  8. 제1항 또는 제2항에 따른 발광다이오드 모듈,The light emitting diode module according to claim 1,
    상기 발광다이오드 모듈이 설치되는 프레임, 그리고A frame in which the light emitting diode module is installed, and
    상기 발광다이오드 모듈에서 발산된 광이 통과하도록 설치되는 광학 커버를 포함하는 발광다이오드 조명 기구.Light emitting diode lighting fixture comprising an optical cover which is installed to pass the light emitted from the light emitting diode module.
PCT/KR2016/011548 2015-10-16 2016-10-14 Light emitting diode module and light emitting diode lighting equipment comprising same WO2017065552A1 (en)

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KR20150144694 2015-10-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220572A (en) * 2006-02-20 2007-08-30 Stanley Electric Co Ltd Lighting system
KR20100100727A (en) * 2008-01-15 2010-09-15 주식회사 웰라이트 Lighting apparatus using light emitting diode
KR20110102047A (en) * 2010-03-10 2011-09-16 (주)드림휴텍 Adjusting apparatus for irradiated angle of lighting device for led circuit board
JP2012134083A (en) * 2010-12-24 2012-07-12 Sanyu Kogyo Kk Light emitting diode lighting fixture, and lighting method
JP2015032361A (en) * 2013-07-31 2015-02-16 Ntn株式会社 Lighting base plate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220572A (en) * 2006-02-20 2007-08-30 Stanley Electric Co Ltd Lighting system
KR20100100727A (en) * 2008-01-15 2010-09-15 주식회사 웰라이트 Lighting apparatus using light emitting diode
KR20110102047A (en) * 2010-03-10 2011-09-16 (주)드림휴텍 Adjusting apparatus for irradiated angle of lighting device for led circuit board
JP2012134083A (en) * 2010-12-24 2012-07-12 Sanyu Kogyo Kk Light emitting diode lighting fixture, and lighting method
JP2015032361A (en) * 2013-07-31 2015-02-16 Ntn株式会社 Lighting base plate

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