WO2017063429A1 - 封框胶、显示面板和显示装置 - Google Patents
封框胶、显示面板和显示装置 Download PDFInfo
- Publication number
- WO2017063429A1 WO2017063429A1 PCT/CN2016/092089 CN2016092089W WO2017063429A1 WO 2017063429 A1 WO2017063429 A1 WO 2017063429A1 CN 2016092089 W CN2016092089 W CN 2016092089W WO 2017063429 A1 WO2017063429 A1 WO 2017063429A1
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- WIPO (PCT)
- Prior art keywords
- display panel
- reflective
- light
- area
- sealant
- Prior art date
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- 239000004033 plastic Substances 0.000 title abstract description 6
- 238000007789 sealing Methods 0.000 title abstract 5
- 239000000463 material Substances 0.000 claims abstract description 53
- 239000000565 sealant Substances 0.000 claims description 45
- 239000002245 particle Substances 0.000 claims description 8
- 239000002210 silicon-based material Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 8
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- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000002207 thermal evaporation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
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- GHITVUOBZBZMND-UHFFFAOYSA-N 1,3,5-tris(bromomethyl)benzene Chemical compound BrCC1=CC(CBr)=CC(CBr)=C1 GHITVUOBZBZMND-UHFFFAOYSA-N 0.000 description 2
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 description 2
- SCZWJXTUYYSKGF-UHFFFAOYSA-N 5,12-dimethylquinolino[2,3-b]acridine-7,14-dione Chemical compound CN1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3N(C)C1=C2 SCZWJXTUYYSKGF-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
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- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 102100028692 T-cell leukemia translocation-altered gene protein Human genes 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
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- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 2
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- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 1
- -1 alkyl benzophenone Chemical compound 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- APLQAVQJYBLXDR-UHFFFAOYSA-N aluminum quinoline Chemical compound [Al+3].N1=CC=CC2=CC=CC=C12.N1=CC=CC2=CC=CC=C12.N1=CC=CC2=CC=CC=C12 APLQAVQJYBLXDR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
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- 239000002041 carbon nanotube Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
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- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Definitions
- Embodiments of the present invention relate to a sealant, a display panel, and a display device.
- OLED Organic Light Emitting Diode Display
- the essence of the substrate mode/waveguide mode is when light is incident from the light-tight medium. In the medium, if the incident angle of the incident light is greater than the critical angle, the incident light will be totally reflected in the display panel, and the light cannot be emitted from the optically dense medium.
- FIG. 1 is a schematic structural view of a display panel.
- the transparent electrode 01 since the transparent electrode 01 is a light-tight medium with respect to the glass substrate 02, the incident angle of incident light rays.
- the angle is larger than the critical angle, the light is totally reflected at the contact surface of the transparent electrode 01 and the glass substrate 02, so that the light cannot be emitted from the glass substrate 02, but is emitted from the frame sealant 03 of the upper and lower substrates of the edge-packaged display panel, thereby reducing the light.
- the light extraction efficiency of the display panel when light is incident on the glass substrate 02 by the transparent electrode 01, since the transparent electrode 01 is a light-tight medium with respect to the glass substrate 02, the incident angle of incident light rays.
- the angle is larger than the critical angle, the light is totally reflected at the contact surface of the transparent electrode 01 and the glass substrate 02, so that the light cannot be emitted from the glass substrate 02, but is emitted from the frame sealant 03 of the upper and lower substrates
- Embodiments of the present invention provide a sealant, a display panel, and a display device to reduce total reflection of light in a display panel, thereby improving light extraction efficiency of the display panel.
- At least one embodiment of the present invention provides a frame sealant, the frame sealant comprising a body material and a reflective material distributed in the body material.
- the reflective material is a reflective particle.
- the reflective particles include a spherical shape and a rod shape.
- the reflective particles comprise a silicon material.
- the host material comprises an epoxy acrylic photocurable resin and an epoxy resin.
- At least one embodiment of the present invention also provides a display panel including the above-mentioned frame sealant.
- the display panel provided by an embodiment of the present invention further includes: a display area disposed from the inside to the outside The area, the virtual area, and the sealant area, wherein the display area includes a light-emitting area and a non-light-emitting area; and the sealant is disposed in the sealant area.
- the display panel according to an embodiment of the present invention further includes: at least one reflective column disposed in the virtual area and/or the non-light emitting area.
- the plurality of reflective columns are disposed in the virtual area, and the heights of the plurality of the reflective columns from the outside to the inside are sequentially reduce.
- a height difference between two adjacent reflective columns is 8 nm to 12 nm.
- the reflective column has a diameter of 10 nm to 20 nm.
- an organic light emitting device is disposed in the display region.
- a plurality of reflective protrusions are disposed on a surface of at least one of the reflective columns.
- At least one embodiment of the present invention also provides a display device including the display panel described above.
- 1 is a schematic structural view of a display panel
- FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
- FIG. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
- FIG. 4 is a schematic plan view showing the display panel of FIG. 3.
- This embodiment provides a frame sealant, the frame sealant comprising: a body material and a reflective material distributed in the body material.
- the reflective material includes a particulate silicon material including a pure silicon material or an oxide of silicon, a nitride of silicon, such as silicon dioxide, silicon nitride, or the like.
- a particulate silicon material including a pure silicon material or an oxide of silicon, a nitride of silicon, such as silicon dioxide, silicon nitride, or the like.
- the scattering effect of the granular silicon material is good, and in addition, when the silicon material is used in the sealant, the support strength of the sealant can be improved.
- the granules include a spherical shape and a rod shape.
- both spherical and rod-shaped particles are tiny particles that reflect light and do not allow light to escape due to the transparent nature of the material itself.
- the host material includes an epoxy acrylate photocurable resin, an epoxy resin, and the host material further includes a photoinitiator, a thermosetting agent, a coupling agent, and an organic powder.
- the percentage content of each component is: 60% to 70% of low viscosity epoxy acrylic photocurable resin; 1% to 5% of epoxy resin, 0.5% to 1% of photoinitiator; Curing agent 5% ⁇ 10%; coupling agent 1% to 2%; organic powder 5% to 10%; reflective material 1% to 5%.
- the photoinitiator may include an alkyl benzophenone such as ⁇ , ⁇ -diethoxyacetophenone, ⁇ -hydroxyalkylphenone or ⁇ -aminoalkylphenone;
- the thermosetting agent may include diaminodiphenyl A polybasic amine such as a methane;
- the coupling agent may include a silane coupling agent KH550, KH560 or KH570 or the like;
- the organic powder resin may include an elastic microsphere or the like; and the inorganic powder may include silica microspheres or the like.
- FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention. As shown in FIG. 2, when light is incident on the display panel, the light is totally reflected and propagates inside the display panel. If the upper and lower substrates of the display panel are packaged by using the sealant in the first embodiment, the frame is sealed. The reflective material is provided in the glue.
- the reflective material of the sealant since the reflective material has a scattering function, the light scattered through it does not continue to propagate along the direction of the original total reflection, so that the originally totally reflected portion Light is emitted from the display panel, thereby improving the light extraction efficiency of the display panel.
- FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention.
- the display panel includes a display area 30 , a virtual area 20 , and a sealant area 10 from the inside to the outside.
- the glue 1 is disposed in the sealant region 10.
- 4 is a schematic plan view of the display panel of FIG. 3.
- the display area 30 includes a light emitting area 301 and a non-light emitting area 302.
- the display panel further includes at least one reflective post 21 disposed within the virtual region 20 and/or within the non-illuminated region.
- the material of the reflective column 21 may be the same as that of the spacer (PS), so that a reflective column can be formed in the process step of forming the spacer, which simplifies the manufacturing process.
- the amount of the reflective material 11 generally placed in the sealant 1 is limited, so the light incident on the sealant 1 is not incident on the reflective material. It is still possible to shoot from the sealant 1 on the 11th.
- the condition that the light is totally reflected is destroyed, so that the light does not totally reflect when it propagates to the upper and lower substrates, thereby improving the light extraction efficiency of the display panel.
- the display panel provided in this embodiment there are a plurality of reflective columns 21, of which multiple The reflection column 21 is disposed in the dummy area 20, and the heights of the plurality of reflection columns 21 from the outside to the inside are sequentially lowered.
- the plurality of reflective columns 21 are disposed in such a manner that the height is sequentially lowered from the outside to the inside, so that most of the light scattered by the light-reflecting material 11 in the sealant 1 can be made, and The light reflected by the outer reflection column 21 is returned to the display area 30 and is emitted from the display area 30, thereby increasing the light extraction rate of the display area 30.
- the height difference between two adjacent reflective columns is 8 nm to 12 nm.
- the reflective column has a diameter of 10 nm to 20 nm.
- an organic light emitting device is disposed in the display region, and the organic light emitting device includes a first substrate 31, a first electrode 32 disposed on the first substrate 31, and the material of the first substrate 31 may be glass or plastic.
- the first electrode 32 may be made of a material having a high work function, such as transparent indium tin oxide (ITO), or transparent carbon nanotubes (CNTs).
- an ITO film may be deposited on the first substrate 31 by a vacuum magnetron sputtering method.
- a hole injection layer 33 is provided on the first electrode 32, and the material of the hole injection layer 33 includes copper phthalocyanine (CuPc) having a good hole injecting ability.
- CuPc copper phthalocyanine
- a hole transport layer 34 is provided on the hole injection layer 33, and the material of the hole transport layer 34 includes TCTA (carbazole-based material) having good hole transporting ability.
- a luminescent material layer 35 is provided on the hole transport layer 34, and a luminescent material layer film may be deposited by vacuum thermal evaporation.
- the luminescent material layer 35 may be a mixed main luminescent layer of TCTA and TAZ co-doped with a green phosphor material Ir(ppy) 3 and a red phosphor material Ir(piq) 2 (acac), or a red luminescent layer of 4, 4'-bis(N-carbazole)-1,1'-biphenyl doped with 5,6,11,12-tetraphenyltetracene, 4,4'-bis(N-carbazole)- The doping ratio of 1,1'-biphenyl to 5,6,11,12-tetraphenyltetracene is 97:3, and the green light-emitting layer is doped with 1,3,5-tris(bromomethyl)benzene.
- the doping ratio of 1,3,5-tris(bromomethyl)benzene to N,N'-dimethylquinacridone is 85:15.
- a blue phosphorescent material FCNIr is used to dope the mCP auxiliary light-emitting layer, and the blue light-emitting layer is doped with 3-tert-butyl-9,10-di(2-naphthalene) anthracene 2,5,8,11-tetra-tert-butyl group.
- FCNIr blue phosphorescent material
- the doping ratio of 3-tert-butyl-9,10-bis(2-naphthalene) anthracene to 2,5,8,11-tetra-tert-butylfluorene was 95:5. According to the principle of colorimetry, in which red, green and blue luminescent materials are mixed in the same luminescent layer, white light is produced by color mixing.
- an electron transport layer 36 is further disposed on the luminescent material layer 35, and the electron transport layer 36 may also be formed by vacuum thermal evaporation deposition.
- the electron transport layer 36 can be formed using aluminum quinoline (Alq 3 ) having good electron transporting ability.
- an electron injection layer 37 is provided on the electron transport layer 36, and the electron injection layer 37 may be formed by vacuum thermal evaporation.
- the electron injection layer 37 can be formed using a low work function material such as lithium fluoride (LiF) having a good electron injecting ability.
- a second electrode 38 is disposed over the electron injection layer 37, the second electrode 38 may be formed by vacuum thermal evaporation, and the second electrode 38 material may include Mg, Al, or an alloy formed by both.
- a voltage is applied between the first electrode 32 and the second electrode 38 through an external circuit, electrons are injected by the second electrode 38 (for example, a cathode), and holes are injected into the second electrode 38 (for example, an anode) to form electrons and holes.
- Excitons are generated when the luminescent material layer 35 meets, thereby exciting the luminescent material to emit light.
- the non-light-emitting region between the second electrode 38 and the second substrate 39 may be provided with a reflective column which simultaneously functions as a spacer to support the upper and lower substrates.
- a structure such as a color resist layer (not shown) is further provided.
- the first electrode 32, the hole injection layer 33, the hole transport layer 34, the luminescent material layer 35, the electron transport layer 36, the electron injection layer 37, and the second electrode 38 are disposed in the display region 30.
- This embodiment mainly shows the case where the above-mentioned frame sealant 1 and/or the reflective pillar 21 and the like are applied to the OLED type display panel.
- the user can apply the frame sealant 1 and/or the reflective pillar 21 to other structures as needed.
- a plurality of reflective projections are disposed on the surface of the at least one reflective post 21, and the plurality of reflective projections may be disposed on any surface to which the light of the reflective pillar 21 can be irradiated, such as a side surface or a top surface of the reflective pillar 21.
- the plurality of reflective protrusions can also scatter light incident on the surface of the reflective column 21, thereby changing the propagation path of the light irradiated to the surface of the reflective column 21 to a greater extent, destroying more light to be totally reflected. Conditions, thereby increasing the amount of light emitted from the display panel.
- the embodiment provides a display device including the display panel in the second embodiment.
- the display device may be a display device such as a liquid crystal display, an electronic paper, an OLED (Organic Light-Emitting Diode) display, or a television or a digital camera including the display device.
- Any product or component with display function such as mobile phones, watches, tablets, laptops, and navigators.
- the display panel provided by the embodiment of the present invention has at least one of the following advantages: the frame sealant is provided with a reflective material, and when the upper and lower substrates of the display panel are encapsulated by the sealant, the light is between the upper and lower substrates of the display panel. Total reflection occurs to propagate inside the display panel and cannot be emitted from the display panel. When the light is incident on the sealant, the light scattered by the reflective material does not follow the light scattering effect of the reflective material in the sealant. The original direction of total reflection propagation continues to propagate, so that the originally totally reflected light is emitted from the display panel, thereby improving the light extraction efficiency of the display panel.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种封框胶、显示面板和显示装置,该封框胶(1)包括:主体材料和分布于主体材料中反光材料(11)。采用该封框胶封装显示面板,当入射光线射入到封框胶时,由于反光材料的散射作用,经过其散射的光线不会沿着原来的传播方向继续传播,使得原本进行全反射的光线从显示面板射出,从而提高了显示面板的光提取效率。
Description
本发明的实施例涉及一种封框胶、显示面板和显示装置。
目前,OLED(有机发光二极管显示器)的光提取效率较低,一部分原因在于OLED内部结构中的衬底模式/波导模式,衬底模式/波导模式的本质是当光从光密介质射入光疏介质时,若入射光线的入射角大于临界角,入射光线将在显示面板中发生全反射,光线无法从光密介质射出。
图1为一种显示面板的结构示意图,如图1所示,当光线由透明电极01射入玻璃基底02时,由于透明电极01相对于玻璃基底02为光密介质,当入射光线的入射角大于临界角时,光线会在透明电极01与玻璃基底02的接触面发生全反射,进而光线无法从玻璃基底02射出,而是从边缘封装显示面板上下基板的封框胶03射出,从而降低了显示面板的光提取效率。
发明内容
本发明的实施例提供了一种封框胶、显示面板和显示装置,以减少光线在显示面板中的全反射,从而提高显示面板的光提取效率。
本发明至少一实施例提供一种封框胶,所述封框胶包括主体材料和分布于所述主体材料中的反光材料。
例如,在本发明一实施例提供的封框胶中,所述反光材料为反光颗粒。
例如,在本发明一实施例提供的封框胶中,所述反光颗粒包括球状、棒状。
例如,在本发明一实施例提供的封框胶中,所述反光颗粒包括硅材料。
例如,在本发明一实施例提供的封框胶中,所述主体材料包括环氧丙烯酸光固化树脂、环氧树脂。
本发明至少一实施例还提供一种显示面板,包括上述中的封框胶。
例如,本发明一实施例提供的显示面板还包括:由内到外设置的显示区
域、虚拟区域和封框胶区域,其中,所述显示区域包括发光区域和非发光区域;所述封框胶设置在所述封框胶区域内。
例如,本发明一实施例提供的显示面板还包括:至少一个反射柱,所述反射柱设置在所述虚拟区域和/或所述非发光区域内。
例如,在本发明一实施例提供的显示面板中,所述反射柱为多个,多个所述反射柱设置在所述虚拟区域内,且由外到内多个所述反射柱的高度依次降低。
例如,在本发明一实施例提供的显示面板中,相邻两个所述反射柱的高度差为8nm至12nm。
例如,在本发明一实施例提供的显示面板中,所述反射柱的直径为10nm至20nm。
例如,在本发明一实施例提供的显示面板中,在所述显示区域中设置有有机发光器件。
例如,在本发明一实施例提供的显示面板中,在至少一个所述反射柱的表面设置有多个反光凸起。
本发明至少一实施例还提供一种显示装置,包括上述中的显示面板。
为了更清楚地说明本发明实施例的技术方案,下面将对实施例的附图作简单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例,而非对本发明的限制。
图1为一种显示面板的结构示意图;
图2为本发明实施例提供的一种显示面板的结构示意图;
图3为本发明实施例提供的一种显示面板的结构示意图;
图4为图3中显示面板的平面结构示意图。
附图标记:
01-透明电极;02-玻璃基底;03-封框胶;10-封框胶区域;11-反光材料;20-虚拟区域;21-反射柱;30-显示区域;301-发光区域;302-非发光区域;31-第一基底;32-第一电极;33-空穴注入层;34-空穴传输层;35-
发光材料层;36-电子传输层;37-电子注入层;38-第二电极;39-第二基底。
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例的附图,对本发明实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。
除非另外定义,本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
实施例一
本实施例提供一种封框胶,该封框胶包括:主体材料和分布于主体材料中的反光材料。
例如,反光材料包括颗粒状的硅材料,硅材料包括纯硅材料或者硅的氧化物、硅的氮化物,例如,二氧化硅、氮化硅等。颗粒状的硅材料的散射效果良好,除此之外,当硅材料用于封框胶中时,还能够提高封框胶的支撑强度。
例如,颗粒状包括球状、棒状。在这里,球状和棒状颗粒都是微小颗粒对光线具有反射作用,不会在因为材料自身的透明性质让光线出射。
例如,该主体材料包括:环氧丙烯酸光固化树脂、环氧树脂,该主体材料还包括光引发剂、热固化剂、偶联剂和有机粉末。
例如,在该封框胶中,各组分的百分比含量为:低粘度环氧丙烯酸光固化树脂60%~70%;环氧树脂1%~5%,光引发剂0.5%~1%;热固化剂5%~
10%;偶联剂1%~2%;有机粉末5%~10%;反光材料1%~5%。
例如,光引发剂可以包括α,α-二乙氧基苯乙酮、α-羟烷基苯酮或α-氨烷基苯酮等烷基苯酮类;热固化剂可以包括二氨基二苯基甲烷等多元脂肪胺类;偶联剂可以包括硅烷偶联剂KH550、KH560或KH570等;有机粉末树脂可以包括弹性微球等;无机粉末可以包括二氧化硅微球等。
实施例二
本实施例提供一种显示面板,该显示面板中的上下基板通过实施例一中的封框胶封装。例如,图2为本发明实施例提供的一种显示面板的结构示意图。如图2所示,当光线入射至显示面板中时,光线会发生全反射而在显示面板内部传播,如果采用实施例一中的封框胶对显示面板的上下基板进行封装,由于该封框胶中设置有反光材料,当光线入射至封框胶的反光材料上时,由于反光材料具有散射功能,经过其散射的光线不会沿着原来全反射的方向继续传播,使得原本全反射的部分光线从显示面板射出,从而可以提高显示面板的光提取效率。
图3为本发明实施例提供的另一种显示面板的结构示意图,如图3所示,该显示面板由内到外包括显示区域30、虚拟区域20和封框胶区域10,其中,封框胶1设置在封框胶区域10内。图4为图3中显示面板的平面结构示意图,如图4所示,显示区域30包括发光区域301和非发光区域302。
例如,如图3所示,该显示面板还包括至少一个反射柱21,该反射柱21设置在虚拟区域20内和/或非发光区域内。反射柱21的材料可以与隔垫物(PS)的材料相同,这样可以在形成隔垫物的工艺步骤中形成反射柱,可以简化制作工艺。
需要说明的是,为了保证封框胶1具有良好的粘结性能,一般在封框胶1中放置的反光材料11的数量有限,所以入射到封框胶1的光线,如果不入射至反光材料11上仍有可能从封框胶1射出。
本实施例通过在虚拟区域20和/或非发光区域内设置至少一个反射柱21,可以使得部分发生全反射的光线在入射到封框胶1之前,照射到反射柱21上并被反射柱反射,从而破坏了光线发生全反射的条件,使得光线在传播到上、下基板时不会发生全反射,从而提高了显示面板的光提取效率。
例如,在本实施例提供的显示面板中,反射柱21为多个,其中,多个
反射柱21设置在虚拟区域20内,且由外到内多个反射柱21的高度依次降低。
例如,由于显示面板的显示区域30设置在最内侧,将多个反射柱21设置为高度由外到内依次降低的形式,可以使得大部分被封框胶1中反光材料11散射的光,以及被外侧反射柱21反射的光返回至显示区域30,并从显示区域30射出,从而提高显示区域30出光率。
例如,相邻两个反射柱的高度差为8nm至12nm。
例如,反射柱的直径为10nm至20nm。
例如,在显示区域中设置有有机发光器件,该有机发光器件包括第一基底31,设置在第一基底31上的第一电极32,第一基底31的材料可以为玻璃,也可以为塑料等透明材料,第一电极32可以选用高功函的材料,例如透明的氧化铟锡(ITO),或者透明的碳纳米管(CNTs)等。
例如,当采用ITO材料制备第一电极时,可以采用真空磁控溅射方法在第一基底31上沉积ITO薄膜。
例如,在第一电极32上设置有空穴注入层33,空穴注入层33的材料包括具有良好空穴注入能力的酞菁铜(CuPc)。
例如,在空穴注入层33上设置有空穴传输层34,空穴传输层34的材料包括具有良好的空穴传输能力的TCTA(咔唑类材料)。
例如,在空穴传输层34上设置有发光材料层35,可以采用真空热蒸镀的方法沉积发光材料层薄膜。例如,发光材料层35可以采用绿光磷光材料Ir(ppy)3与红光磷光材料Ir(piq)2(acac)共掺杂TCTA与TAZ的混合式主发光层,或者红色发光层采用4,4'-双(N-咔唑)-1,1'-联苯掺杂5,6,11,12-四苯基并四苯制成,4,4'-双(N-咔唑)-1,1'-联苯与5,6,11,12-四苯基并四苯的掺杂比例为97:3,绿色发光层采用1,3,5-三(溴甲基)苯掺杂N,N'-二甲基喹吖啶酮制成,1,3,5-三(溴甲基)苯与N,N'-二甲基喹吖啶酮的掺杂比例为85:15。同时使用蓝光磷光材料FCNIr掺杂mCP的辅发光层,蓝色发光层采用3-叔丁基-9,10-二(2-萘)蒽掺杂2,5,8,11-四叔丁基苝制成。3-叔丁基-9,10-二(2-萘)蒽与2,5,8,11-四叔丁基苝的掺杂比例为95:5。根据色度学原理,其中红,绿,蓝三色发光材料参杂于同一发光层中将会通过混色而产生
白光。
例如,在发光材料层35之上还设置有电子传输层36,电子传输层36也可以采用真空热蒸镀法沉积形成。例如,电子传输层36可以采用具备良好的电子传输能力的喹啉铝(Alq3)形成。
例如,在电子传输层36上设置有电子注入层37,电子注入层37也可以采用真空热蒸镀法形成。例如,电子注入层37可以采用具备良好的电子注入能力的氟化锂(LiF)等低功函材料形成。
例如,在电子注入层37之上设置有第二电极38,第二电极38可以采用真空热蒸镀法形成,第二电极38材料包括Mg、Al或者二者形成的合金。在第一电极32和第二电极38之间通过外接电路加上电压,利用第二电极38(例如阴极)注入电子,第二电极38(例如阳极)注入空穴,所形成的电子和空穴在发光材料层35相遇而产生激子,从而激发发光材料发光。
在第二电极38和第二基底39之间的非发光区域可以设置有反射柱,反射柱同时可以起到隔垫物的作用,以支撑上下基板。在第二基底39靠近第二电极38的一侧,还设置有色阻层等结构(图中未示出)。
例如,第一电极32、空穴注入层33、空穴传输层34、发光材料层35、电子传输层36、电子注入层37、第二电极38设置在显示区域30内。
本实施例主要示出了将上述封框胶1和/或反射柱21等结构应用于OLED类型显示面板的情况,用户可以根据需要将封框胶1和/或反射柱21等结构应用于其他类型的显示面板。
例如,在至少一个反射柱21的表面设置有多个反光凸起,该多个反光凸起可以设置在反射柱21的光线能够照射到的任何面,例如反射柱21的侧表面或者顶面。该多个反光凸起,可以使得入射到反射柱21表面的光也发生散射,进而更大程度地改变了照射到反射柱21表面的光的传播路径,破坏了更多的光线发生全反射的条件,从而提高了射出显示面板的光量。
实施例三
本实施例提供一种显示装置,包括实施例二中的显示面板。例如,该显示装置可以为液晶显示器、电子纸、OLED(Organic Light-Emitting Diode,有机发光二极管)显示器等显示器件以及包括这些显示器件的电视、数码相机、
手机、手表、平板电脑、笔记本电脑、导航仪等任何具有显示功能的产品或者部件。
本发明的实施例提供的显示面板具有以下至少一项有益效果:封框胶中设置有反光材料,当用该封框胶封装显示面板的上下基板时,光线会在显示面板的上下基板之间发生全反射以在显示面板的内部传播而无法从显示面板射出,当光线入射到封框胶中后,由于封框胶中反光材料对光线具有散射的作用,经过反光材料散射的光不会沿着原来的全反射传播方向继续传播,使得原本发生全反射的光线从显示面板射出,进而可以提高显示面板的光提取效率。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
以上所述仅是本发明的示范性实施方式,而非用于限制本发明的保护范围,本发明的保护范围由所附的权利要求确定。
本申请要求于2015年10月14日递交的中国专利申请第201510662162.6号的优先权,在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
Claims (14)
- 一种封框胶,包括:主体材料和分布于所述主体材料中的反光材料。
- 根据权利要求1所述的封框胶,其中,所述反光材料为反光颗粒。
- 根据权利要求2所述的封框胶,其中,所述反光颗粒包括球状、棒状。
- 根据权利要求2所述的封框胶,其中,所述反光颗粒包括硅材料。
- 根据权利要求1所述的封框胶,其中,所述主体材料包括环氧丙烯酸光固化树脂、环氧树脂。
- 一种显示面板,包括权利要求1-5中任一项所述的封框胶。
- 根据权利要求6所述的显示面板,还包括:由内到外设置的显示区域、虚拟区域和封框胶区域,其中,所述显示区域包括发光区域和非发光区域;所述封框胶设置在所述封框胶区域内。
- 根据权利要求7所述的显示面板,还包括:至少一个反射柱,所述反射柱设置在所述虚拟区域和/或所述非发光区域内。
- 根据权利要求8所述的显示面板,其中,所述反射柱为多个,多个所述反射柱设置在所述虚拟区域内,且由外到内多个所述反射柱的高度依次降低。
- 根据权利要求9所述的显示面板,其中,相邻两个所述反射柱的高度差为8nm至12nm。
- 根据权利要求8-10中任一项所述的显示面板,其中,所述反射柱的直径为10nm至20nm。
- 根据权利要求7-11中任一项所述的显示面板,其中,在所述显示区域中设置有有机发光器件。
- 根据权利要求8-11中任一项所述的显示面板,其中,在至少一个所述反射柱的表面设置有多个反光凸起。
- 一种显示装置,包括权利要求6-13中任一项所述的显示面板。
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CN109830181A (zh) * | 2017-11-23 | 2019-05-31 | 群创光电股份有限公司 | 显示装置 |
CN109507825A (zh) * | 2018-12-19 | 2019-03-22 | 惠科股份有限公司 | 显示面板和显示面板制造方法 |
CN111158189B (zh) * | 2020-01-06 | 2022-10-25 | 京东方科技集团股份有限公司 | 背光模组及制作方法、显示装置 |
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CN101163358A (zh) * | 2007-11-14 | 2008-04-16 | 清华大学 | 一种显示装置 |
CN104115291A (zh) * | 2012-02-13 | 2014-10-22 | 克利公司 | 改进的发光设备和方法 |
CN105206652A (zh) * | 2015-10-14 | 2015-12-30 | 京东方科技集团股份有限公司 | 封框胶、显示面板和显示装置 |
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AU2001283367A1 (en) * | 2000-08-15 | 2002-02-25 | Emagin Corporation | Organic light emitting diode display devices having barrier structures between sub-pixels |
CN100487072C (zh) * | 2001-05-16 | 2009-05-13 | 积水化学工业株式会社 | 固化树脂组合物及用于显示器的密封剂和封端材料 |
US7521860B2 (en) * | 2005-08-29 | 2009-04-21 | Chunghwa Picture Tubes, Ltd. | Organic electro-luminescence display with multiple protective films |
JP4893378B2 (ja) | 2007-03-07 | 2012-03-07 | ソニー株式会社 | 発光装置、表示装置および表示装置の製造方法 |
US20110134352A1 (en) * | 2008-08-19 | 2011-06-09 | Sharp Kabushiki Kaisha | Liquid crystal display panel |
KR20120076940A (ko) * | 2010-12-30 | 2012-07-10 | 엘지디스플레이 주식회사 | 유기 발광장치 및 제조방법 |
CN103050582A (zh) * | 2011-10-11 | 2013-04-17 | 九江正展光电有限公司 | 具胶墙的发光二极管封装方法 |
KR20140115841A (ko) * | 2013-03-22 | 2014-10-01 | 삼성디스플레이 주식회사 | 조명장치 및 조명유닛 |
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CN1652366A (zh) * | 2004-02-04 | 2005-08-10 | 西铁城电子股份有限公司 | 发光二极管 |
CN101163358A (zh) * | 2007-11-14 | 2008-04-16 | 清华大学 | 一种显示装置 |
CN104115291A (zh) * | 2012-02-13 | 2014-10-22 | 克利公司 | 改进的发光设备和方法 |
CN105206652A (zh) * | 2015-10-14 | 2015-12-30 | 京东方科技集团股份有限公司 | 封框胶、显示面板和显示装置 |
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CN105206652A (zh) | 2015-12-30 |
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