WO2017061651A1 - Broche de contact pour le test d'une borne électrique - Google Patents

Broche de contact pour le test d'une borne électrique Download PDF

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Publication number
WO2017061651A1
WO2017061651A1 PCT/KR2015/010695 KR2015010695W WO2017061651A1 WO 2017061651 A1 WO2017061651 A1 WO 2017061651A1 KR 2015010695 W KR2015010695 W KR 2015010695W WO 2017061651 A1 WO2017061651 A1 WO 2017061651A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
inner body
spring
contact end
contact pin
Prior art date
Application number
PCT/KR2015/010695
Other languages
English (en)
Korean (ko)
Inventor
장용일
Original Assignee
넥슨전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 넥슨전자주식회사 filed Critical 넥슨전자주식회사
Publication of WO2017061651A1 publication Critical patent/WO2017061651A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • the present invention relates to a contact pin for electrical terminal test, the contact pin for electrical terminal test for testing the electrical terminal provided on the PCB substrate.
  • Pogo pins also known as spring pins, are used in semiconductor testing and IT applications. Pogo pins are probes used to test inspection equipment such as semiconductor wafers, LCD modules, camera modules, image sensors and semiconductor packages.
  • Conventional pogo pins as shown in FIG. 1, include a spring 14 for applying an elastic force to the upper probe 12, the lower probe 13, the upper probe 12 and the lower probe 13, and the upper probe ( 12 and a cylindrical body 11 for receiving the top 14 of the lower probe 13 and the spring 14.
  • One end of the upper probe 12 and the lower probe 13 is caught by the cylindrical body 11 to prevent departure from the cylindrical body 11 to the outside, and between the upper probe 12 and the lower probe 13 The elastic force is received by the spring 14 installed.
  • Figure 2 is a cross-sectional view showing a plurality of pogo pins accommodated in one insulating body, illustrating a semiconductor package inspection socket.
  • the socket for inspecting a semiconductor package 20 includes a plurality of pogo pins 6 and an insulating body 1 for accommodating the plurality of pogo pins at predetermined intervals.
  • the plurality of pogo pins 6 allows the upper probe 12 to protrude on the top surface of the insulating body 1 and the lower probe 13 to protrude on the bottom surface of the insulating body 1, the spacing between the pogo pins being the upper probe
  • the insulating body (1) is equal to the interval of the external terminal (3a) of the semiconductor package 3 in contact with (12) and the same distance as the contact pad (5a) of the test board (5) in contact with the lower probe (13). Is accommodated in 1).
  • the external terminals 3a of the semiconductor package contact the upper probe 12 of the pogo pin 6, and the lower probe 13 is connected to the test board 5.
  • the contact pads 5a of the pogo pins 6 so that the upper probes 12 and the lower probes 13 are elastically supported by the springs 14 inside the pogo pins 6. ) Can be accurately connected to the semiconductor package.
  • Existing pogo pins are manufactured by assembling each of the parts after the parts are manufactured by cylindrical machining and then joining them. That is, the cylindrical body, the upper probe, the lower probe, and the spring are separately manufactured through cylindrical processing such as lathe milling machine processing, and these are then assembled into the cylindrical body, the upper probe, the lower probe, and the spring to form a final pogo pin. The production is complete.
  • cylindrical machining has a limitation in manufacturing various types of bodies, an upper probe, a lower probe, and a spring. There is also the hassle of having to reassemble these parts after each machining.
  • An object of the present invention is to provide a contact pin for an electrical terminal test for testing the electrical terminal provided on the PCB substrate. It is also an object of the present invention to provide a contact pin for integrated electrical terminal testing, in which the components are not completed as individual processing or assembly by standard products.
  • the contact pin for electrical terminal test which is embodiment of this invention is provided with the contact end and the spring in the outer surface, and has an inner body which can support the said contact end and the spring inside, The said contact end, a spring, and an inner body Can be manufactured in one piece.
  • the electrical contact test contact pin may include an inner body that is a first pillar body; A second pillar, wherein an inner surface of the second pillar surrounds a circumferential surface of one end of the inner body; A third pillar, the lower contact end having an inner surface of the third pillar surrounding the peripheral surface of the other end of the inner body; A spring member integrally connected between the upper and lower contact ends; And one or more connecting members integrally connecting the inner surface of the second pillar and the surface of one end of the inner body.
  • the contact pin made of a single piece by pressing the plate material of a single material.
  • the inner body, the upper contact end, the lower contact end, the spring member, and the connecting member may be made of a single material made of the same single body.
  • the single material constituting the contact pin for the electrical terminal test may include a BeCu material.
  • various types of contact pins may be manufactured by manufacturing the inner body, the upper contact end, the lower contact end, the connection member, and the spring member in one unitary material.
  • unlike conventional cylindrical machining it does not require a separate assembly process, simplifying the production work.
  • the present invention can be supported through the inner body, and has a structure in which the upper contact end, the lower contact end, the connecting member, and the spring member exist in the outer body, thereby simplifying the production work have.
  • 1 is a cross-sectional view of a conventional pogo pin.
  • FIG. 2 is a cross-sectional view of a socket for semiconductor package inspection using a conventional pogo pin.
  • FIG. 3 is a schematic conceptual diagram of a manufacturing process of a contact pin for electrical terminal test according to an embodiment of the present invention
  • FIG. 4 is a conceptual diagram illustrating an example in which a contact pin for electrical terminal test is manufactured through a press working in a sheet according to an embodiment of the present invention.
  • FIG. 5 is a front perspective view of a contact pin for electrical terminal test according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view in the A direction of the upper contact end of the contact pin for an electrical terminal test according to an embodiment of the present invention.
  • Fig. 9 is a cross-sectional view in the direction of B of a holder portion of a contact pin for electrical terminal test according to an embodiment of the present invention.
  • FIG. 10 is a perspective view of a contact pin for electrical terminal test produced by varying the interval in the spring according to an embodiment of the present invention.
  • FIG 11 illustrates various types of lower contact ends in accordance with an embodiment of the present invention.
  • Figure 3 is a schematic conceptual diagram of the manufacturing process of the electrical terminal test contact pin according to an embodiment of the present invention
  • Figure 4 is a contact pin for electrical terminal test is produced through the press working in the plate according to an embodiment of the present invention
  • the contact pin 10 for an electrical terminal test has a contact end and a spring provided on an outer surface thereof, and has an inner body capable of supporting the contact end and the spring therein.
  • a flat material of a single material hereinafter referred to as "plate material” is press-processed so that the contact end, the spring, and the inner body are made in one piece. Since it is manufactured in one piece, it is possible to manufacture various types of contact pins. In addition, unlike conventional cylindrical machining, it does not require a separate assembly process, simplifying the production work.
  • a flat plate is pressed to produce a contact pin 10 for electric terminal test.
  • the press working refers to a method of processing by cutting and bending the plate.
  • an inner part, an upper part 200, a lower part 300, and a spring member 400 which will be cut into a plate and become an inner body 100.
  • the inner member is rolled to form a columnar inner body 100, and in turn the outer member is cut and processed to the upper contact end 200,
  • the lower contact end 300 and the spring member 400 may be made to finally manufacture the contact pin 10 for the electrical terminal test.
  • the inner body 100, the upper contact end 200, the lower contact end 300, the spring member 400, and the connection member 250 forming the contact pin 10 for the final electrical terminal test are integrally formed. It is made of the same single material.
  • the inner body 100 When the inner body 100 is formed using an inner member, various shapes such as rolling round, or folding or cutting in a 'c' shape, or rolling in a '@' shape according to the outer diameter may be used. By processing to a shape it can be produced the inner body 100 of various forms. In addition, it will be apparent that the upper contact end 200 and the lower contact end 300 may also have various types of contact end structures.
  • the plate various materials having conductivity may be used.
  • the plate may be formed of a beryllium cooper (BeCu) material having conductivity and elasticity.
  • the conductive material may be used without being limited to beryllium cooper (BeCu) material.
  • a contact pin is a pogo pin for inspecting a semiconductor wafer, an LCD module, a camera module, an image sensor, and a semiconductor package, as well as various connection pins such as various sockets and battery connection terminals of a mobile phone. It can include any electrically conductive pin that can be used in the.
  • FIG. 5 is a front perspective view of a contact pin for electrical terminal test according to an embodiment of the present invention
  • Figure 6 is a side perspective view of a contact pin for electrical terminal test according to an embodiment of the present invention
  • Figure 7 is an embodiment of the present invention
  • A is a cross-sectional view in the A direction of the upper contact end of the contact pin for electrical terminal according to the present invention
  • Figure 8 is a cross-sectional view in the A direction of the upper contact end of another form of the contact pin for electrical terminal test according to an embodiment of the present invention
  • Figure 9 is B direction sectional drawing of the holder part of the contact pin for electrical terminal tests which concerns on embodiment of this invention.
  • the inner body 100 Since the inner body 100 is manufactured by press working, it may be manufactured in various forms. For example, as shown in FIG. 8 (a), the cross section of the pillar body of the inner body 100 may have a branch line shape, or may have a rectangular shape as shown in FIG. 8 (b).
  • the upper contact end 200 is wrapped and positioned on one surface of the inner body 100, and the lower contact end 300 is wrapped and positioned on the other end surface of the inner body 100.
  • the upper contact end 200 is a columnar body (hereinafter, referred to as a 'second pillar'), and the inner surface of the second pillar is positioned on the circumferential surface of one end of the inner body 100.
  • the upper contact end 200 is integrally connected with the inner body 100 by the connection member 250.
  • the lower contact end 300 contacts the electrical terminal of the test object and transmits a signal of the electrical terminal to the test diagnostic apparatus through the upper contact end 200.
  • the reverse may be used.
  • the spring member 400 is integrally connected between the upper contact end 200 and the lower contact end 300 and is a member including a spiral.
  • the spring member 400 includes a spiral upper spring 410 connected to the upper contact end 200, a spiral lower spring 430 connected to the lower contact end 300, an upper spring 410 and a lower spring 430. It may include a holder member 420 in the form of a pillar to connect. The spiral of the upper spring 410 and the lower spring 430 may be manufactured by press working.
  • the carrier member 440 may be a member coupled to the holder member 420 to protrude.
  • the carrier part 440 is a member that allows the holder part 420 to be easily gripped from the outside.
  • connection member 250 is a member produced by press working in which the inner surface of the second pillar body and the surface of one end of the inner body 100 are integrally connected.
  • the inner body 100 which is an inner member, and the outer member (the upper contact end 200, the lower contact end 300, and the spring member 400) may be integrally connected through the connection member 250.
  • One or more of the connection members 250 may be provided to connect the inner surface of the second pillar and the surface of one end of the inner body 100.
  • the contact pin 10 for testing various types of electrical terminals can be easily manufactured, and the shape of the spring can be varied, and the spacing in the spring can be varied as shown in FIG. 10.
  • the structure of the lower contact end 300 may be manufactured in various forms. Conventional cylindrical machining is difficult to process the linear lower contact end 300, but can be produced in various forms the structure of the lower contact end 300 through the press working as in the present invention.
  • the length of the spring may be variously manufactured, but the length of the spring may be changed to be longer or shorter than the length of the spring of FIG. 12 (a).
  • the length of the spring can be made long.
  • the carrier member 440 may be manufactured to be placed at various positions, and the lower contact end as shown in FIGS. 13 (b) and (c) at the position of the carrier member 440 of FIG. 13 (a) described in the embodiment of the present invention.
  • the 300 may be omitted and the position of the carrier member 440 may be provided at another position.

Abstract

Un mode de réalisation de la présente invention peut comprendre : un corps intérieur qui est une première colonne ; une extrémité de contact supérieure qui est une deuxième colonne, une surface intérieure de la deuxième colonne recouvrant une surface circonférentielle d'une extrémité du corps intérieur ; une extrémité de contact inférieure qui est une troisième colonne, une surface intérieure de la troisième colonne recouvrant une surface circonférentielle de l'autre extrémité du corps intérieur ; un élément de ressort intégré entre l'extrémité de contact supérieure et l'extrémité de contact inférieure ; et au moins un élément de raccordement reliant intégralement la surface intérieure de la deuxième colonne et une surface d'une extrémité du corps intérieur.
PCT/KR2015/010695 2015-10-06 2015-10-08 Broche de contact pour le test d'une borne électrique WO2017061651A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150140365A KR101577396B1 (ko) 2015-10-06 2015-10-06 전기 단자 테스트용 컨택 핀
KR10-2015-0140365 2015-10-06

Publications (1)

Publication Number Publication Date
WO2017061651A1 true WO2017061651A1 (fr) 2017-04-13

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PCT/KR2015/010695 WO2017061651A1 (fr) 2015-10-06 2015-10-08 Broche de contact pour le test d'une borne électrique

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KR (1) KR101577396B1 (fr)
WO (1) WO2017061651A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111293448A (zh) * 2018-12-07 2020-06-16 朴商亮 压接结构的一体型弹簧针

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170119469A (ko) * 2016-04-19 2017-10-27 장용일 전기 단자 테스트용 메쉬형 컨택 핀
JP7374037B2 (ja) * 2020-03-27 2023-11-06 東京エレクトロン株式会社 ポゴブロック
KR20230102167A (ko) 2021-12-30 2023-07-07 넥슨전자주식회사 전기 단자 테스트용 z형 절연바렐 컨텍핀

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006266869A (ja) * 2005-03-24 2006-10-05 Enplas Corp コンタクトピン及び電気部品用ソケット
KR20100105360A (ko) * 2009-03-18 2010-09-29 이홍대 반도체 제조장비용 포고핀
KR20110076855A (ko) * 2011-05-25 2011-07-06 박상량 반도체 검사용 소켓
KR20130037699A (ko) * 2013-03-27 2013-04-16 박상량 저가형 고성능 포고핀 및 그 제조방법
KR101348205B1 (ko) * 2013-01-08 2014-01-10 주식회사 아이에스시 탐침장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006266869A (ja) * 2005-03-24 2006-10-05 Enplas Corp コンタクトピン及び電気部品用ソケット
KR20100105360A (ko) * 2009-03-18 2010-09-29 이홍대 반도체 제조장비용 포고핀
KR20110076855A (ko) * 2011-05-25 2011-07-06 박상량 반도체 검사용 소켓
KR101348205B1 (ko) * 2013-01-08 2014-01-10 주식회사 아이에스시 탐침장치
KR20130037699A (ko) * 2013-03-27 2013-04-16 박상량 저가형 고성능 포고핀 및 그 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111293448A (zh) * 2018-12-07 2020-06-16 朴商亮 压接结构的一体型弹簧针

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