WO2017056226A1 - Endoscope, module d'imagerie, et procédé de production de module d'imagerie - Google Patents

Endoscope, module d'imagerie, et procédé de production de module d'imagerie Download PDF

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Publication number
WO2017056226A1
WO2017056226A1 PCT/JP2015/077718 JP2015077718W WO2017056226A1 WO 2017056226 A1 WO2017056226 A1 WO 2017056226A1 JP 2015077718 W JP2015077718 W JP 2015077718W WO 2017056226 A1 WO2017056226 A1 WO 2017056226A1
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WO
WIPO (PCT)
Prior art keywords
bumps
imaging module
bump
optical member
light receiving
Prior art date
Application number
PCT/JP2015/077718
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English (en)
Japanese (ja)
Inventor
純平 米山
Original Assignee
オリンパス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2015/077718 priority Critical patent/WO2017056226A1/fr
Priority to JP2017542587A priority patent/JPWO2017056226A1/ja
Publication of WO2017056226A1 publication Critical patent/WO2017056226A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation

Definitions

  • the present invention relates to an endoscope having an imaging module in which an optical member is bonded to the light receiving surface of the imaging element, an imaging module in which an optical member is bonded to the light receiving surface of the imaging element, and an optical member bonded to the light receiving surface of the imaging element.
  • the present invention relates to a method for manufacturing an imaging module.
  • Japanese Laid-Open Patent Publication No. 2002-343949 discloses that dummy bumps dedicated for positioning are used as height adjusting means in order to ensure the accuracy of positioning in the vertical direction.
  • An embodiment of the present invention is an endoscope having an imaging module at the distal end portion of an insertion portion in which an optical member is accurately positioned and bonded to the light receiving surface of the image pickup device, and the optical member accurately on the light receiving surface of the image pickup device It is an object of the present invention to provide an imaging module that is positioned and bonded, and a method for manufacturing an imaging module in which an optical member is accurately positioned and bonded to a light receiving surface of an imaging element.
  • An endoscope is an endoscope having an imaging module, wherein the imaging module has a rectangular parallelepiped transparent member and the transparent so that light is incident on the light receiving unit via the transparent member.
  • An image sensor in which a member is bonded via an adhesive layer so as to cover the light receiving portion, and a plurality of bumps having the same configuration are disposed around the light receiving portion, and a wiring having a plurality of flying leads A side surface of two or more first bumps of the plurality of bumps, or two or more first ones of the plurality of flying leads.
  • the side surface that is in contact with the tip of the flying lead and is orthogonal to the one side surface is the side surface of at least one second bump of the plurality of bumps, or the plurality of flying leads. Little of them Are both in contact with the side surface of one second flying lead, and at least one of the plurality of first bumps or the plurality of first flying leads is electrically connected to the light receiving unit. Has been.
  • the imaging module is bonded to the optical member via an adhesive layer so as to cover the light receiving unit so that light is incident on the light receiving unit via the optical member.
  • an imaging module comprising: an imaging element having a plurality of bumps disposed in a peripheral portion of the light receiving unit; and a wiring board having a plurality of flying leads, wherein a side surface of the optical member includes the plurality of Are in contact with the side surfaces of two or more first bumps.
  • the imaging module is bonded to the optical member via an adhesive layer so as to cover the light receiving unit so that light is incident on the light receiving unit via the optical member.
  • an imaging module comprising: an imaging element having a plurality of bumps disposed in a peripheral portion of the light receiving unit; and a wiring board having a plurality of flying leads, wherein a side surface of the optical member includes the plurality of Are in contact with the tips of two or more first flying leads.
  • the manufacturing method of the imaging module of another embodiment produces an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads.
  • the optical member has a side surface of two or more first bumps of the plurality of bumps, or two or more first flying leads of the plurality of flying leads, and A step of positioning so as to abut, and a step of curing an adhesive interposed between the optical member and the imaging element in the positioned state.
  • an endoscope having an imaging module at the distal end portion of the insertion portion with an optical member accurately positioned and bonded to the light receiving surface of the imaging device, and the optical member on the light receiving surface of the imaging device. It is possible to provide an imaging module in which the optical member is accurately positioned and bonded, and a method for manufacturing the imaging module in which the optical member is accurately positioned and bonded to the light receiving surface of the imaging element.
  • the imaging module 1 of the present embodiment includes a cover glass 10 that is an optical member, an imaging element 20, and a wiring board 30.
  • the drawings based on each embodiment are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, the relative angle, and the like are actual. It should be noted that there is a case where portions having different dimensional relationships and ratios are included in the drawings.
  • the Z axis direction is the up-down direction, and for example, the X axis direction is the X direction.
  • the cover glass 10 is, for example, a rectangular parallelepiped transparent member having a planar view dimension (XY in-plane dimension) of 2 mm square and a thickness (Z direction dimension) of 400 ⁇ m.
  • the transparent member may be a rectangular parallelepiped resin member.
  • the imaging element 20 has a thickness of 300 ⁇ m and a plan view size of 2.5 mm ⁇ 3.5 mm, for example.
  • a 1.8 mm square rectangular light receiving portion 21 is formed on the light receiving surface 20SA of the image pickup device 20.
  • a plurality of bumps 22 are arranged in the periphery of the light receiving unit 21.
  • the plurality of bumps 22 have the same configuration (shape, size, and material).
  • the electrode pads 23 on which the bumps 22 are disposed are conductive terminals that are electrically connected to the light receiving unit 21 via wiring (not shown).
  • the wiring board 30 has a plurality of flying leads 31 protruding from the end face.
  • the flying lead 31, which is also called an inner lead in the lead frame, is a rod-shaped metal conductor formed by selectively peeling off the insulating layer around the wiring of the wiring board 30.
  • the flying lead 31 has a length of 250 ⁇ m, a thickness of 20 ⁇ m, and a width of 50 ⁇ m.
  • the wiring board 30 may be a double-sided wiring board, a multilayer wiring board, or a component built-in wiring board.
  • the flying lead 31 of the wiring board 30 and the bump 22 of the image sensor 20 are, for example, ultrasonically bonded.
  • the wiring board 30 is joined to a signal cable, and the image sensor 20 transmits and receives electrical signals via the wiring board 30.
  • the cover glass 10 and the image sensor 20 are bonded via a transparent adhesive layer 15. That is, the cover glass 10 is bonded through the adhesive layer 15 so as to cover the light receiving unit 21 so that light enters the light receiving unit 21 through the cover glass 10.
  • the adhesive layer 15 is, for example, an ultraviolet curable resin and is in a liquid state before being cured.
  • the cover glass 10 is bonded via a frame-shaped light-blocking adhesive layer arranged around the light receiving unit 21. May be.
  • the side surface 10S1 of the cover glass 10 is in contact with the side surfaces 22S of the plurality of bumps 22.
  • the arrangement direction of the plurality of bumps 22 is referred to as a Y direction.
  • the Y direction is a direction parallel to the side surface of the image sensor 20 and also a direction parallel to one side of the light receiving unit 21.
  • the bumps 22 made of gold are stud bumps, plating bumps, ball bumps or the like having a height of 10 ⁇ m to 100 ⁇ m.
  • the image sensor 20 is manufactured by cutting a semiconductor wafer on which a plurality of image sensors (CCD or CMOS elements) are manufactured.
  • the positions of the electrode pads 23 on which the bumps 22 are disposed are defined by a photolithographic method at the wafer level when the imaging device 20 is manufactured together with the light receiving unit 21. For this reason, the relative positions of the light receiving unit 21 and the plurality of bumps 22 are accurately defined.
  • the position in the X direction of the cover glass 10 bonded to the image pickup device 20 is accurately defined by a plurality of bumps 22 whose side surfaces are in contact.
  • the X direction is a direction orthogonal to the Y direction, which is the major axis direction of the flying lead 31.
  • the bump 22 with which the side surface of the cover glass 10 is in contact is referred to as a first bump 22A for positioning in the X direction.
  • all the bumps 22 are the first bumps 22A.
  • the first bump 22A is not a member arranged only for positioning in the X direction.
  • Conductive bumps 22 that are essential components in the conventional imaging module for external connection are used as the first bumps 22A for positioning in the X direction in the imaging module 1.
  • the first bump 22 ⁇ / b> A is electrically connected to the light receiving portion 21, joined to the flying lead 31, and has a function of the conductive bump 22 that connects the light receiving portion 21 and the wiring board 30.
  • the imaging module 1 Since it is not necessary to dispose positioning bumps only for positioning in addition to the conductive bumps 22, the imaging module 1 is easy to manufacture.
  • the position of the cover glass 10 is moved in the X direction by the curing process. There is no fear of moving.
  • the flying leads 31 of the wiring board 30 are joined to the bumps 22.
  • the manufacturing method of the imaging module 1 includes the steps of manufacturing an optical member, an imaging element in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, A step of positioning an optical member so that a side surface thereof contacts a side surface of two or more first bumps of the plurality of bumps; and in the positioned state, the optical member and the imaging element A step of curing the intervening adhesive, and a step of bonding the bump and the flying lead.
  • the cover glass 10 it is easy for the cover glass 10 to be accurately positioned and bonded to the light receiving surface 20SA of the imaging element 20.
  • the image sensor 20 is manufactured by cutting a semiconductor wafer on which a plurality of image sensors are manufactured.
  • the semiconductor wafer is cut into an element group in which a plurality of imaging elements 20 are connected in the horizontal direction (Y direction), and positioning bumps (22A, 22B, 22C) of any imaging element or dummy imaging element included in the element group. It may be used to position / adhere the elongated cover glass and then singulate into individual image sensors 20. In this manufacturing method, it is not necessary that positioning bumps are provided on all image pickup devices.
  • an imaging module according to a modification of the first embodiment will be described. Since the imaging module of the modification is similar to the imaging module 1 and has the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the cover glass 10 is in contact only with the two first bumps 22A that are the X-direction positioning bumps of the imaging element 20A. If the cover glass 10 is in contact with at least two first bumps 22A, the position in the X direction can be defined.
  • the two first bumps 22A that are in contact with the cover glass 10 are preferably separated from each other in order to facilitate positioning.
  • ⁇ Modification 2 of the first embodiment> In addition to the conductive bumps 22, two first bumps 22AA and 22AB for positioning in the X direction are arranged on the image pickup device 20B of the image pickup module 1B according to the second modification of the first embodiment shown in FIG. The first bumps 22AA and 22AB are not joined to the flying lead 31.
  • the first bump 22AA is disposed on one electrode pad 23 bonded to the flying lead 31 together with one conductive bump 22. That is, it is not necessary to provide an electrode pad for the first bump 22AA.
  • the first bump 22AB is disposed on an electrode pad different from the conductive bump.
  • the first bump 22AB is a dummy bump that is not connected to the light receiving unit 21. Both are simultaneously disposed on the same light receiving surface 20SA of the image pickup device 20B with the same configuration as the conductive bump 22 joined to the flying lead 31.
  • the two first bumps 22AA and 22AB that are in contact with the cover glass 10 are preferably disposed outside the plurality of conductive bumps 22 in order to facilitate positioning.
  • the first bump 22AA for positioning can be arranged simultaneously with the conductive bump 22 for electrical connection, and there is a gap between the tip of the flying lead 31 and the side surface of the cover glass. Easy to join.
  • the first bump 22AA for positioning may be different in shape from the conductive bump 22.
  • the height of the first bump 22A1 shown in FIG. In some cases, the thickness of the adhesive layer 15 is large, and it is not easy for the conductive bumps 22 to contact the side surface 10S1 of the cover glass 10 stably. However, the height of the first bump 22A1 can be set according to the thickness of the adhesive layer 15.
  • the first bump 22A1 is preferably a multi-stage bump including a lower bump having the same configuration as the conductive bump 22.
  • the lower bump of the first bump 22A1 having the same configuration is disposed at the same time.
  • the first bump 22A1 can be easily manufactured by disposing the upper bump on the lower bump.
  • an upper plating bump or an upper stud bump may be disposed on the lower plating bump, or two stud bumps may be stacked.
  • the first bump 22A2 having another shape shown in FIG. 6 is higher in height than the conductive bump 22, and the size of the upper part is larger than that of the lower part.
  • the first bump 22A2 is a two-stage bump in which an upper bump having a larger diameter is disposed on the same lower bump as the conductive bump 22.
  • the cover glass is fixed with the side surface in contact with the upper part of the first bump 22A2. At this time, a gap is generated between the side surface of the lower bump of the first bump 22A2 and the side surface of the cover glass. Similarly, a gap t is generated between the side surface of the conductive bump 22 arranged in line with the first bump 22A2 and the side surface of the cover glass.
  • the imaging element 20 ⁇ / b> C of the imaging module 1 ⁇ / b> C according to the third modification of the first embodiment includes a second bump 22 ⁇ / b> B for positioning in the Y direction in addition to the first bump 22 ⁇ / b> A for positioning in the X direction. Is arranged.
  • all the first bumps 22 ⁇ / b> A are conductive bumps 22.
  • the second bumps 22B are arranged on a line in the X-axis direction perpendicular to the arrangement direction (Y-axis direction) of the first bumps 22A, and are arranged on the outer side of the side surface of the light receiving unit 21. ing.
  • the side surface 10S2 orthogonal to the side surface 10S1 in contact with the conductive bump 22 (22A) is in contact with the side surface of the second bump 22B.
  • the cover glass 10 is positioned in the XY biaxial directions with respect to the imaging element 20C by the first bump 22A and the second bump 22B.
  • the imaging module 1C is easy to manufacture.
  • At least one second bump 22B for positioning in the Y direction may be disposed in the X direction orthogonal to the Y-axis direction, but two or more are in contact with the side surface 10S2. , May be arranged in the X direction.
  • the cover glass 10 is accurately positioned and adhered in the XY direction to the light receiving surface 20SA of the imaging element 20C. Since the positioning is performed by the first bump 22A and the second bump 22B that are manufactured at the same time with the same configuration as the conductive bump 22 for connection, manufacturing is easy.
  • the second bump 22B may be a deformed bump such as the first bump 22A1, 22A2.
  • the side surface 10S3 facing the side surface 10S2 of the cover glass 10 is in contact with the side surface of the second bump 22B2 of the imaging element 20D. That is, the cover glass 10 has two side surfaces 10S2 and 10S3 sandwiched between two second bumps 22B and 22B2 for positioning in the Y direction.
  • the cover glass 10 is uniquely positioned in the Y direction. For this reason, the cover glass 10 is bonded in an accurately positioned state.
  • the first bump 22AA for positioning in the X direction is different from the conductive bump 22 joined to the flying lead 31.
  • the second bump 22B for positioning in the Y direction is a conductive bump to which the flying lead 31D is joined.
  • the first bump 22AA and the second bump 22B may or may not be joined to the flying lead 31.
  • the imaging element 20E of the imaging module 1E of Modification 5 of the first embodiment shown in FIGS. 9 and 10 has a third bump 22C for positioning in the Z direction. That is, the back surface 10SB of the cover glass 10 is in contact with the upper surfaces of the three third bumps 22C that are lower in height than the other bumps (22, 22A, 22B).
  • the cover glass 10 is positioned in the three-axis directions of XYZ with respect to the imaging element 20E.
  • a bump having the same height as the third bump 22C is disposed, and a multi-stage bump having a bump disposed thereon becomes another bump (22, 22A, 22B).
  • the height of the third bump 22C strictly speaking, the height including the thickness of the electrode pad 23 is the thickness of the adhesive layer 15. Further, the back surface 10SB of the cover glass 10 whose position in the Z direction is defined by three or more third bumps 22C is not inclined with respect to the light receiving surface 20SA of the image sensor 20E, and has high parallelism.
  • a fourth bump 22D having the function of the first bump 22A and the function of the third bump 22C may be used.
  • a part of the upper surface of the bump 22D is plastically deformed by being pressed by the crimping jig 29.
  • the plastically deformed lower step surface 22SB contacts the back surface 10SB of the cover glass 10, and the plastically deformed side surface 22S contacts the side surface 10S1 of the cover glass 10.
  • a multi-stage bump may be used as the fourth bump 22D.
  • the fourth bump 22D may also function as the second bump 22B for positioning in the Y direction and the third bump 22C for positioning in the Z direction.
  • the lens unit 11 is bonded as an optical member to the light receiving surface 20SA of the imaging element 20F.
  • the lens 10A is fixed to a frame member 10B which is a lens unit frame.
  • the lens unit 11 has a position in the in-plane direction and a vertical direction (XYZ direction), that is, a position in the triaxial direction, defined by the four fourth bumps 22D of the imaging element 20F.
  • the position in the XY direction can be defined even with two X-direction positioning bumps (first bump 22A) or two Y-direction positioning bumps (second bump 22B).
  • the cylindrical lens unit 11 can be positioned in the XYZ triaxial directions by the three fourth bumps 22D.
  • the positioning bumps are not limited to the positioning of the cover glass 10 or the lens unit 11 that is a transparent member, but are positioned under various optical members, for example, the lens, the prism, or the cover glass. It can also be used for positioning a frame-like spacer.
  • the prism 12 is bonded as an optical member to the light receiving surface 20SA of the imaging element 20F.
  • a prism 12A having a support prism as an optical member is bonded to the light receiving surface 20SA of the imaging element 20F.
  • a metal film is formed on the reflecting surface of the prism 12A. The prism 12A with the support prism is easier to handle than the prism 12.
  • the imaging module 1G of the second embodiment will be described. Since the imaging module 1G is similar to the imaging modules 1 to 1G already described and has the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
  • one side surface 10 ⁇ / b> S ⁇ b> 1 of the cover glass 10 is in contact with the distal end surface 31 ⁇ / b> SA of the first flying lead 31 ⁇ / b> A for positioning in the X direction among the plurality of flying leads 31.
  • the flying lead 31 with which the side surface 10S1 of the cover glass 10 is in contact is referred to as a first flying lead 31A.
  • all the flying leads 31 are the first flying leads 31A.
  • the cover glass 10 is positioned with respect to the imaging element 20 in the X direction.
  • the flying leads 31 are bonded to the plurality of bumps 22 of the imaging element 20 before the cover glass 10 is bonded. At this time, the leading end of the flying lead 31 is bonded so as to be positioned, for example, about 10 ⁇ m to 100 ⁇ m ahead of the bonding portion.
  • the cover glass 10 can be accurately positioned on the image sensor 20.
  • the tips of the plurality of flying leads 31 are arranged in parallel to the side surface of the image sensor 20 (Y direction), that is, in parallel to one side of the light receiving unit 21. Then, adhesion and curing are performed while the side surface 10S1 of the cover glass 10 is brought into contact with the front end surface 31SA of the flying lead 31.
  • the position of the cover glass 10 in one direction (X direction) in the plane is accurately defined by the tip position of the flying lead 31.
  • the flying lead 31 is not a member provided only for positioning.
  • the flying lead 31 that is an essential component in the conventional imaging module for external connection is used as the first flying lead 31A for positioning in the X direction in the imaging module 1G. For this reason, the imaging module 1G is easy to manufacture.
  • the position of the cover glass 10 may be moved by the curing process by performing a curing process of the adhesive layer 15, for example, ultraviolet irradiation.
  • a curing process of the adhesive layer 15 for example, ultraviolet irradiation.
  • the cover glass 10 is accurately positioned and bonded to the light receiving surface 20SA of the imaging element 20.
  • the manufacturing method of the imaging module 1G includes a step of manufacturing an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, and the bumps and flying.
  • a step of curing an adhesive interposed between the optical member and the imaging device is a step of manufacturing an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, and the bumps and flying.
  • imaging modules 1H and 1I according to modifications of the second embodiment will be described. Since the imaging modules 1H and 1I are similar to the imaging module 1G and have the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the second flying lead 31B of the plurality of flying leads 31 is used for positioning in the Y direction (the major axis direction of the flying lead).
  • the second flying lead 31B is longer than the first flying lead 31A, and the side surface 10S2 orthogonal to the side surface 10S1 of the cover glass 10 is in contact with the side surface of the second flying lead 31B.
  • the cover glass 10 is positioned in the in-plane direction (XY direction) with respect to the imaging element 20.
  • the second flying lead 31B is not a conductive flying lead electrically connected to the light receiving unit 21, but a dedicated member for positioning in the Y direction.
  • the second flying lead 31 ⁇ / b> B is manufactured at the same time as the other flying leads 31. For this reason, the imaging module 1H is easy to manufacture, and the cover glass 10 that is accurately positioned on the light receiving surface 20SA of the imaging element 20 is bonded.
  • the second flying lead 31B may be bonded to a conductive bump or dummy bump having a low height disposed on the side surface of the light receiving unit 21. Since the side position of the second flying lead 31B bonded to the bump is fixed, the position in the Y direction can be more accurately defined.
  • the side surface facing the side surface 10S2 of the cover glass 10 may be in contact with the side surface of each second flying lead.
  • the cover glass 10 sandwiched between the two second flying leads is uniquely defined in the Y direction. For this reason, the cover glass 10 is bonded in a state where it is positioned more accurately.
  • the imaging module 1I according to the second modification of the second embodiment illustrated in FIG. 20 has a back surface 10SB of the cover glass 10 that is the other of the plurality of bumps 22 of the imaging element 20I. It is in contact with four dummy bumps 22C that are lower than the bumps (22, 22A, 22B).
  • the cover glass 10 in which the upper surface of the three or more dummy bumps 22C and the back surface 10SB are in contact with each other has a position in the vertical direction (Z direction) with respect to the light receiving surface of the image sensor 20I. 10SB is arranged in parallel.
  • the cover glass 10 is accurately adhered to the light receiving surface 20SA of the imaging element 20I in the XYZ directions. That is, in the imaging module 1HI, the cover glass 10 is accurately positioned and adhered to the imaging element 20I in the three-axis directions of XYZ.
  • the endoscope system 71 includes an endoscope 2, a processor 75A, a light source device 75B, and a monitor 75C.
  • the endoscope 2 takes an in-vivo image of the subject and outputs an imaging signal by inserting the insertion portion 73 into the body cavity of the subject.
  • the operation unit 74 has a treatment instrument insertion port 74A of a channel 73H for inserting treatment instruments such as a biological forceps, an electric knife and an inspection probe into the body cavity of the subject.
  • the insertion portion 73 includes, for example, a distal end portion 73A where the imaging module 1C is disposed, a bendable bending portion 73B continuously provided on the proximal end side of the distal end portion 73A, and a proximal end side of the bending portion 73B. It is comprised by the flexible tube part 73C provided continuously. The bending portion 73B is bent by the operation of the operation unit 74.
  • the signal cable 75 connected to the imaging module 1 at the distal end 73A is inserted through the universal cord 74B disposed on the base end side of the operation unit 74.
  • the universal cord 74B is connected to the processor 75A and the light source device 75B via the connector 74C.
  • the processor 75A controls the entire endoscope system 71, performs signal processing on the imaging signal output by the imaging module 1, and outputs it as an image signal.
  • the monitor 75C displays an image signal output from the processor 75A.
  • the endoscope 2 having the imaging module 1C in which the optical member is accurately positioned and bonded to the light receiving surface of the imaging element at the distal end portion 73A is easy to manufacture.
  • endoscopes having the imaging modules 1, 1A, 1B, 1D to 1I and the like already described also have the effects of the respective imaging modules 1.
  • the endoscope according to the embodiment is not limited to the flexible endoscope including the flexible tube portion 73C, and may be a rigid endoscope or a capsule endoscope.

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Abstract

La présente invention porte sur un endoscope (2) qui est pourvu : d'un élément d'imagerie (20) relié à une pièce de lamelle couvre-objet (10) par une couche adhésive (15) de telle sorte que la lamelle couvre-objet (10) recouvre une section de réception de lumière (21), ledit élément d'imagerie (20) comprenant une pluralité de bosses (22) disposées autour de la section de réception de lumière (21) ; et d'une carte de câblage (30) comprenant une pluralité de conducteurs volants (31). La pointe (73A) d'une section d'insertion (73) comprend un module d'imagerie (1C) dans lequel une surface latérale (10S1) de la lamelle couvre-objet (10) est en contact avec les surfaces latérales d'au moins deux premières bosses (22A) parmi la pluralité de bosses (22), et dans lequel une autre surface latérale (10S2) de la lamelle couvre-objet (10) est en contact avec la surface latérale d'au moins une deuxième bosse (22B) parmi la pluralité de bosses (22).
PCT/JP2015/077718 2015-09-30 2015-09-30 Endoscope, module d'imagerie, et procédé de production de module d'imagerie WO2017056226A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/077718 WO2017056226A1 (fr) 2015-09-30 2015-09-30 Endoscope, module d'imagerie, et procédé de production de module d'imagerie
JP2017542587A JPWO2017056226A1 (ja) 2015-09-30 2015-09-30 内視鏡、撮像モジュール、および撮像モジュールの製造方法

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Application Number Priority Date Filing Date Title
PCT/JP2015/077718 WO2017056226A1 (fr) 2015-09-30 2015-09-30 Endoscope, module d'imagerie, et procédé de production de module d'imagerie

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WO2017056226A1 true WO2017056226A1 (fr) 2017-04-06

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JP2019102636A (ja) * 2017-12-01 2019-06-24 スタンレー電気株式会社 発光装置

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JP2001257937A (ja) * 2000-03-13 2001-09-21 Olympus Optical Co Ltd 固体撮像装置
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JP2001257937A (ja) * 2000-03-13 2001-09-21 Olympus Optical Co Ltd 固体撮像装置
JP2008177364A (ja) * 2007-01-18 2008-07-31 Denso Corp 半導体装置の製造方法及び半導体装置
JP2009188260A (ja) * 2008-02-07 2009-08-20 Sanyo Electric Co Ltd 半導体装置および実装基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019102636A (ja) * 2017-12-01 2019-06-24 スタンレー電気株式会社 発光装置
JP7080625B2 (ja) 2017-12-01 2022-06-06 スタンレー電気株式会社 発光装置

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