WO2017056226A1 - Endoscope, imaging module, and method for producing imaging module - Google Patents

Endoscope, imaging module, and method for producing imaging module Download PDF

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Publication number
WO2017056226A1
WO2017056226A1 PCT/JP2015/077718 JP2015077718W WO2017056226A1 WO 2017056226 A1 WO2017056226 A1 WO 2017056226A1 JP 2015077718 W JP2015077718 W JP 2015077718W WO 2017056226 A1 WO2017056226 A1 WO 2017056226A1
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WO
WIPO (PCT)
Prior art keywords
bumps
imaging module
bump
optical member
light receiving
Prior art date
Application number
PCT/JP2015/077718
Other languages
French (fr)
Japanese (ja)
Inventor
純平 米山
Original Assignee
オリンパス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2015/077718 priority Critical patent/WO2017056226A1/en
Priority to JP2017542587A priority patent/JPWO2017056226A1/en
Publication of WO2017056226A1 publication Critical patent/WO2017056226A1/en

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation

Definitions

  • the present invention relates to an endoscope having an imaging module in which an optical member is bonded to the light receiving surface of the imaging element, an imaging module in which an optical member is bonded to the light receiving surface of the imaging element, and an optical member bonded to the light receiving surface of the imaging element.
  • the present invention relates to a method for manufacturing an imaging module.
  • Japanese Laid-Open Patent Publication No. 2002-343949 discloses that dummy bumps dedicated for positioning are used as height adjusting means in order to ensure the accuracy of positioning in the vertical direction.
  • An embodiment of the present invention is an endoscope having an imaging module at the distal end portion of an insertion portion in which an optical member is accurately positioned and bonded to the light receiving surface of the image pickup device, and the optical member accurately on the light receiving surface of the image pickup device It is an object of the present invention to provide an imaging module that is positioned and bonded, and a method for manufacturing an imaging module in which an optical member is accurately positioned and bonded to a light receiving surface of an imaging element.
  • An endoscope is an endoscope having an imaging module, wherein the imaging module has a rectangular parallelepiped transparent member and the transparent so that light is incident on the light receiving unit via the transparent member.
  • An image sensor in which a member is bonded via an adhesive layer so as to cover the light receiving portion, and a plurality of bumps having the same configuration are disposed around the light receiving portion, and a wiring having a plurality of flying leads A side surface of two or more first bumps of the plurality of bumps, or two or more first ones of the plurality of flying leads.
  • the side surface that is in contact with the tip of the flying lead and is orthogonal to the one side surface is the side surface of at least one second bump of the plurality of bumps, or the plurality of flying leads. Little of them Are both in contact with the side surface of one second flying lead, and at least one of the plurality of first bumps or the plurality of first flying leads is electrically connected to the light receiving unit. Has been.
  • the imaging module is bonded to the optical member via an adhesive layer so as to cover the light receiving unit so that light is incident on the light receiving unit via the optical member.
  • an imaging module comprising: an imaging element having a plurality of bumps disposed in a peripheral portion of the light receiving unit; and a wiring board having a plurality of flying leads, wherein a side surface of the optical member includes the plurality of Are in contact with the side surfaces of two or more first bumps.
  • the imaging module is bonded to the optical member via an adhesive layer so as to cover the light receiving unit so that light is incident on the light receiving unit via the optical member.
  • an imaging module comprising: an imaging element having a plurality of bumps disposed in a peripheral portion of the light receiving unit; and a wiring board having a plurality of flying leads, wherein a side surface of the optical member includes the plurality of Are in contact with the tips of two or more first flying leads.
  • the manufacturing method of the imaging module of another embodiment produces an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads.
  • the optical member has a side surface of two or more first bumps of the plurality of bumps, or two or more first flying leads of the plurality of flying leads, and A step of positioning so as to abut, and a step of curing an adhesive interposed between the optical member and the imaging element in the positioned state.
  • an endoscope having an imaging module at the distal end portion of the insertion portion with an optical member accurately positioned and bonded to the light receiving surface of the imaging device, and the optical member on the light receiving surface of the imaging device. It is possible to provide an imaging module in which the optical member is accurately positioned and bonded, and a method for manufacturing the imaging module in which the optical member is accurately positioned and bonded to the light receiving surface of the imaging element.
  • the imaging module 1 of the present embodiment includes a cover glass 10 that is an optical member, an imaging element 20, and a wiring board 30.
  • the drawings based on each embodiment are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, the relative angle, and the like are actual. It should be noted that there is a case where portions having different dimensional relationships and ratios are included in the drawings.
  • the Z axis direction is the up-down direction, and for example, the X axis direction is the X direction.
  • the cover glass 10 is, for example, a rectangular parallelepiped transparent member having a planar view dimension (XY in-plane dimension) of 2 mm square and a thickness (Z direction dimension) of 400 ⁇ m.
  • the transparent member may be a rectangular parallelepiped resin member.
  • the imaging element 20 has a thickness of 300 ⁇ m and a plan view size of 2.5 mm ⁇ 3.5 mm, for example.
  • a 1.8 mm square rectangular light receiving portion 21 is formed on the light receiving surface 20SA of the image pickup device 20.
  • a plurality of bumps 22 are arranged in the periphery of the light receiving unit 21.
  • the plurality of bumps 22 have the same configuration (shape, size, and material).
  • the electrode pads 23 on which the bumps 22 are disposed are conductive terminals that are electrically connected to the light receiving unit 21 via wiring (not shown).
  • the wiring board 30 has a plurality of flying leads 31 protruding from the end face.
  • the flying lead 31, which is also called an inner lead in the lead frame, is a rod-shaped metal conductor formed by selectively peeling off the insulating layer around the wiring of the wiring board 30.
  • the flying lead 31 has a length of 250 ⁇ m, a thickness of 20 ⁇ m, and a width of 50 ⁇ m.
  • the wiring board 30 may be a double-sided wiring board, a multilayer wiring board, or a component built-in wiring board.
  • the flying lead 31 of the wiring board 30 and the bump 22 of the image sensor 20 are, for example, ultrasonically bonded.
  • the wiring board 30 is joined to a signal cable, and the image sensor 20 transmits and receives electrical signals via the wiring board 30.
  • the cover glass 10 and the image sensor 20 are bonded via a transparent adhesive layer 15. That is, the cover glass 10 is bonded through the adhesive layer 15 so as to cover the light receiving unit 21 so that light enters the light receiving unit 21 through the cover glass 10.
  • the adhesive layer 15 is, for example, an ultraviolet curable resin and is in a liquid state before being cured.
  • the cover glass 10 is bonded via a frame-shaped light-blocking adhesive layer arranged around the light receiving unit 21. May be.
  • the side surface 10S1 of the cover glass 10 is in contact with the side surfaces 22S of the plurality of bumps 22.
  • the arrangement direction of the plurality of bumps 22 is referred to as a Y direction.
  • the Y direction is a direction parallel to the side surface of the image sensor 20 and also a direction parallel to one side of the light receiving unit 21.
  • the bumps 22 made of gold are stud bumps, plating bumps, ball bumps or the like having a height of 10 ⁇ m to 100 ⁇ m.
  • the image sensor 20 is manufactured by cutting a semiconductor wafer on which a plurality of image sensors (CCD or CMOS elements) are manufactured.
  • the positions of the electrode pads 23 on which the bumps 22 are disposed are defined by a photolithographic method at the wafer level when the imaging device 20 is manufactured together with the light receiving unit 21. For this reason, the relative positions of the light receiving unit 21 and the plurality of bumps 22 are accurately defined.
  • the position in the X direction of the cover glass 10 bonded to the image pickup device 20 is accurately defined by a plurality of bumps 22 whose side surfaces are in contact.
  • the X direction is a direction orthogonal to the Y direction, which is the major axis direction of the flying lead 31.
  • the bump 22 with which the side surface of the cover glass 10 is in contact is referred to as a first bump 22A for positioning in the X direction.
  • all the bumps 22 are the first bumps 22A.
  • the first bump 22A is not a member arranged only for positioning in the X direction.
  • Conductive bumps 22 that are essential components in the conventional imaging module for external connection are used as the first bumps 22A for positioning in the X direction in the imaging module 1.
  • the first bump 22 ⁇ / b> A is electrically connected to the light receiving portion 21, joined to the flying lead 31, and has a function of the conductive bump 22 that connects the light receiving portion 21 and the wiring board 30.
  • the imaging module 1 Since it is not necessary to dispose positioning bumps only for positioning in addition to the conductive bumps 22, the imaging module 1 is easy to manufacture.
  • the position of the cover glass 10 is moved in the X direction by the curing process. There is no fear of moving.
  • the flying leads 31 of the wiring board 30 are joined to the bumps 22.
  • the manufacturing method of the imaging module 1 includes the steps of manufacturing an optical member, an imaging element in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, A step of positioning an optical member so that a side surface thereof contacts a side surface of two or more first bumps of the plurality of bumps; and in the positioned state, the optical member and the imaging element A step of curing the intervening adhesive, and a step of bonding the bump and the flying lead.
  • the cover glass 10 it is easy for the cover glass 10 to be accurately positioned and bonded to the light receiving surface 20SA of the imaging element 20.
  • the image sensor 20 is manufactured by cutting a semiconductor wafer on which a plurality of image sensors are manufactured.
  • the semiconductor wafer is cut into an element group in which a plurality of imaging elements 20 are connected in the horizontal direction (Y direction), and positioning bumps (22A, 22B, 22C) of any imaging element or dummy imaging element included in the element group. It may be used to position / adhere the elongated cover glass and then singulate into individual image sensors 20. In this manufacturing method, it is not necessary that positioning bumps are provided on all image pickup devices.
  • an imaging module according to a modification of the first embodiment will be described. Since the imaging module of the modification is similar to the imaging module 1 and has the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the cover glass 10 is in contact only with the two first bumps 22A that are the X-direction positioning bumps of the imaging element 20A. If the cover glass 10 is in contact with at least two first bumps 22A, the position in the X direction can be defined.
  • the two first bumps 22A that are in contact with the cover glass 10 are preferably separated from each other in order to facilitate positioning.
  • ⁇ Modification 2 of the first embodiment> In addition to the conductive bumps 22, two first bumps 22AA and 22AB for positioning in the X direction are arranged on the image pickup device 20B of the image pickup module 1B according to the second modification of the first embodiment shown in FIG. The first bumps 22AA and 22AB are not joined to the flying lead 31.
  • the first bump 22AA is disposed on one electrode pad 23 bonded to the flying lead 31 together with one conductive bump 22. That is, it is not necessary to provide an electrode pad for the first bump 22AA.
  • the first bump 22AB is disposed on an electrode pad different from the conductive bump.
  • the first bump 22AB is a dummy bump that is not connected to the light receiving unit 21. Both are simultaneously disposed on the same light receiving surface 20SA of the image pickup device 20B with the same configuration as the conductive bump 22 joined to the flying lead 31.
  • the two first bumps 22AA and 22AB that are in contact with the cover glass 10 are preferably disposed outside the plurality of conductive bumps 22 in order to facilitate positioning.
  • the first bump 22AA for positioning can be arranged simultaneously with the conductive bump 22 for electrical connection, and there is a gap between the tip of the flying lead 31 and the side surface of the cover glass. Easy to join.
  • the first bump 22AA for positioning may be different in shape from the conductive bump 22.
  • the height of the first bump 22A1 shown in FIG. In some cases, the thickness of the adhesive layer 15 is large, and it is not easy for the conductive bumps 22 to contact the side surface 10S1 of the cover glass 10 stably. However, the height of the first bump 22A1 can be set according to the thickness of the adhesive layer 15.
  • the first bump 22A1 is preferably a multi-stage bump including a lower bump having the same configuration as the conductive bump 22.
  • the lower bump of the first bump 22A1 having the same configuration is disposed at the same time.
  • the first bump 22A1 can be easily manufactured by disposing the upper bump on the lower bump.
  • an upper plating bump or an upper stud bump may be disposed on the lower plating bump, or two stud bumps may be stacked.
  • the first bump 22A2 having another shape shown in FIG. 6 is higher in height than the conductive bump 22, and the size of the upper part is larger than that of the lower part.
  • the first bump 22A2 is a two-stage bump in which an upper bump having a larger diameter is disposed on the same lower bump as the conductive bump 22.
  • the cover glass is fixed with the side surface in contact with the upper part of the first bump 22A2. At this time, a gap is generated between the side surface of the lower bump of the first bump 22A2 and the side surface of the cover glass. Similarly, a gap t is generated between the side surface of the conductive bump 22 arranged in line with the first bump 22A2 and the side surface of the cover glass.
  • the imaging element 20 ⁇ / b> C of the imaging module 1 ⁇ / b> C according to the third modification of the first embodiment includes a second bump 22 ⁇ / b> B for positioning in the Y direction in addition to the first bump 22 ⁇ / b> A for positioning in the X direction. Is arranged.
  • all the first bumps 22 ⁇ / b> A are conductive bumps 22.
  • the second bumps 22B are arranged on a line in the X-axis direction perpendicular to the arrangement direction (Y-axis direction) of the first bumps 22A, and are arranged on the outer side of the side surface of the light receiving unit 21. ing.
  • the side surface 10S2 orthogonal to the side surface 10S1 in contact with the conductive bump 22 (22A) is in contact with the side surface of the second bump 22B.
  • the cover glass 10 is positioned in the XY biaxial directions with respect to the imaging element 20C by the first bump 22A and the second bump 22B.
  • the imaging module 1C is easy to manufacture.
  • At least one second bump 22B for positioning in the Y direction may be disposed in the X direction orthogonal to the Y-axis direction, but two or more are in contact with the side surface 10S2. , May be arranged in the X direction.
  • the cover glass 10 is accurately positioned and adhered in the XY direction to the light receiving surface 20SA of the imaging element 20C. Since the positioning is performed by the first bump 22A and the second bump 22B that are manufactured at the same time with the same configuration as the conductive bump 22 for connection, manufacturing is easy.
  • the second bump 22B may be a deformed bump such as the first bump 22A1, 22A2.
  • the side surface 10S3 facing the side surface 10S2 of the cover glass 10 is in contact with the side surface of the second bump 22B2 of the imaging element 20D. That is, the cover glass 10 has two side surfaces 10S2 and 10S3 sandwiched between two second bumps 22B and 22B2 for positioning in the Y direction.
  • the cover glass 10 is uniquely positioned in the Y direction. For this reason, the cover glass 10 is bonded in an accurately positioned state.
  • the first bump 22AA for positioning in the X direction is different from the conductive bump 22 joined to the flying lead 31.
  • the second bump 22B for positioning in the Y direction is a conductive bump to which the flying lead 31D is joined.
  • the first bump 22AA and the second bump 22B may or may not be joined to the flying lead 31.
  • the imaging element 20E of the imaging module 1E of Modification 5 of the first embodiment shown in FIGS. 9 and 10 has a third bump 22C for positioning in the Z direction. That is, the back surface 10SB of the cover glass 10 is in contact with the upper surfaces of the three third bumps 22C that are lower in height than the other bumps (22, 22A, 22B).
  • the cover glass 10 is positioned in the three-axis directions of XYZ with respect to the imaging element 20E.
  • a bump having the same height as the third bump 22C is disposed, and a multi-stage bump having a bump disposed thereon becomes another bump (22, 22A, 22B).
  • the height of the third bump 22C strictly speaking, the height including the thickness of the electrode pad 23 is the thickness of the adhesive layer 15. Further, the back surface 10SB of the cover glass 10 whose position in the Z direction is defined by three or more third bumps 22C is not inclined with respect to the light receiving surface 20SA of the image sensor 20E, and has high parallelism.
  • a fourth bump 22D having the function of the first bump 22A and the function of the third bump 22C may be used.
  • a part of the upper surface of the bump 22D is plastically deformed by being pressed by the crimping jig 29.
  • the plastically deformed lower step surface 22SB contacts the back surface 10SB of the cover glass 10, and the plastically deformed side surface 22S contacts the side surface 10S1 of the cover glass 10.
  • a multi-stage bump may be used as the fourth bump 22D.
  • the fourth bump 22D may also function as the second bump 22B for positioning in the Y direction and the third bump 22C for positioning in the Z direction.
  • the lens unit 11 is bonded as an optical member to the light receiving surface 20SA of the imaging element 20F.
  • the lens 10A is fixed to a frame member 10B which is a lens unit frame.
  • the lens unit 11 has a position in the in-plane direction and a vertical direction (XYZ direction), that is, a position in the triaxial direction, defined by the four fourth bumps 22D of the imaging element 20F.
  • the position in the XY direction can be defined even with two X-direction positioning bumps (first bump 22A) or two Y-direction positioning bumps (second bump 22B).
  • the cylindrical lens unit 11 can be positioned in the XYZ triaxial directions by the three fourth bumps 22D.
  • the positioning bumps are not limited to the positioning of the cover glass 10 or the lens unit 11 that is a transparent member, but are positioned under various optical members, for example, the lens, the prism, or the cover glass. It can also be used for positioning a frame-like spacer.
  • the prism 12 is bonded as an optical member to the light receiving surface 20SA of the imaging element 20F.
  • a prism 12A having a support prism as an optical member is bonded to the light receiving surface 20SA of the imaging element 20F.
  • a metal film is formed on the reflecting surface of the prism 12A. The prism 12A with the support prism is easier to handle than the prism 12.
  • the imaging module 1G of the second embodiment will be described. Since the imaging module 1G is similar to the imaging modules 1 to 1G already described and has the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
  • one side surface 10 ⁇ / b> S ⁇ b> 1 of the cover glass 10 is in contact with the distal end surface 31 ⁇ / b> SA of the first flying lead 31 ⁇ / b> A for positioning in the X direction among the plurality of flying leads 31.
  • the flying lead 31 with which the side surface 10S1 of the cover glass 10 is in contact is referred to as a first flying lead 31A.
  • all the flying leads 31 are the first flying leads 31A.
  • the cover glass 10 is positioned with respect to the imaging element 20 in the X direction.
  • the flying leads 31 are bonded to the plurality of bumps 22 of the imaging element 20 before the cover glass 10 is bonded. At this time, the leading end of the flying lead 31 is bonded so as to be positioned, for example, about 10 ⁇ m to 100 ⁇ m ahead of the bonding portion.
  • the cover glass 10 can be accurately positioned on the image sensor 20.
  • the tips of the plurality of flying leads 31 are arranged in parallel to the side surface of the image sensor 20 (Y direction), that is, in parallel to one side of the light receiving unit 21. Then, adhesion and curing are performed while the side surface 10S1 of the cover glass 10 is brought into contact with the front end surface 31SA of the flying lead 31.
  • the position of the cover glass 10 in one direction (X direction) in the plane is accurately defined by the tip position of the flying lead 31.
  • the flying lead 31 is not a member provided only for positioning.
  • the flying lead 31 that is an essential component in the conventional imaging module for external connection is used as the first flying lead 31A for positioning in the X direction in the imaging module 1G. For this reason, the imaging module 1G is easy to manufacture.
  • the position of the cover glass 10 may be moved by the curing process by performing a curing process of the adhesive layer 15, for example, ultraviolet irradiation.
  • a curing process of the adhesive layer 15 for example, ultraviolet irradiation.
  • the cover glass 10 is accurately positioned and bonded to the light receiving surface 20SA of the imaging element 20.
  • the manufacturing method of the imaging module 1G includes a step of manufacturing an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, and the bumps and flying.
  • a step of curing an adhesive interposed between the optical member and the imaging device is a step of manufacturing an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, and the bumps and flying.
  • imaging modules 1H and 1I according to modifications of the second embodiment will be described. Since the imaging modules 1H and 1I are similar to the imaging module 1G and have the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the second flying lead 31B of the plurality of flying leads 31 is used for positioning in the Y direction (the major axis direction of the flying lead).
  • the second flying lead 31B is longer than the first flying lead 31A, and the side surface 10S2 orthogonal to the side surface 10S1 of the cover glass 10 is in contact with the side surface of the second flying lead 31B.
  • the cover glass 10 is positioned in the in-plane direction (XY direction) with respect to the imaging element 20.
  • the second flying lead 31B is not a conductive flying lead electrically connected to the light receiving unit 21, but a dedicated member for positioning in the Y direction.
  • the second flying lead 31 ⁇ / b> B is manufactured at the same time as the other flying leads 31. For this reason, the imaging module 1H is easy to manufacture, and the cover glass 10 that is accurately positioned on the light receiving surface 20SA of the imaging element 20 is bonded.
  • the second flying lead 31B may be bonded to a conductive bump or dummy bump having a low height disposed on the side surface of the light receiving unit 21. Since the side position of the second flying lead 31B bonded to the bump is fixed, the position in the Y direction can be more accurately defined.
  • the side surface facing the side surface 10S2 of the cover glass 10 may be in contact with the side surface of each second flying lead.
  • the cover glass 10 sandwiched between the two second flying leads is uniquely defined in the Y direction. For this reason, the cover glass 10 is bonded in a state where it is positioned more accurately.
  • the imaging module 1I according to the second modification of the second embodiment illustrated in FIG. 20 has a back surface 10SB of the cover glass 10 that is the other of the plurality of bumps 22 of the imaging element 20I. It is in contact with four dummy bumps 22C that are lower than the bumps (22, 22A, 22B).
  • the cover glass 10 in which the upper surface of the three or more dummy bumps 22C and the back surface 10SB are in contact with each other has a position in the vertical direction (Z direction) with respect to the light receiving surface of the image sensor 20I. 10SB is arranged in parallel.
  • the cover glass 10 is accurately adhered to the light receiving surface 20SA of the imaging element 20I in the XYZ directions. That is, in the imaging module 1HI, the cover glass 10 is accurately positioned and adhered to the imaging element 20I in the three-axis directions of XYZ.
  • the endoscope system 71 includes an endoscope 2, a processor 75A, a light source device 75B, and a monitor 75C.
  • the endoscope 2 takes an in-vivo image of the subject and outputs an imaging signal by inserting the insertion portion 73 into the body cavity of the subject.
  • the operation unit 74 has a treatment instrument insertion port 74A of a channel 73H for inserting treatment instruments such as a biological forceps, an electric knife and an inspection probe into the body cavity of the subject.
  • the insertion portion 73 includes, for example, a distal end portion 73A where the imaging module 1C is disposed, a bendable bending portion 73B continuously provided on the proximal end side of the distal end portion 73A, and a proximal end side of the bending portion 73B. It is comprised by the flexible tube part 73C provided continuously. The bending portion 73B is bent by the operation of the operation unit 74.
  • the signal cable 75 connected to the imaging module 1 at the distal end 73A is inserted through the universal cord 74B disposed on the base end side of the operation unit 74.
  • the universal cord 74B is connected to the processor 75A and the light source device 75B via the connector 74C.
  • the processor 75A controls the entire endoscope system 71, performs signal processing on the imaging signal output by the imaging module 1, and outputs it as an image signal.
  • the monitor 75C displays an image signal output from the processor 75A.
  • the endoscope 2 having the imaging module 1C in which the optical member is accurately positioned and bonded to the light receiving surface of the imaging element at the distal end portion 73A is easy to manufacture.
  • endoscopes having the imaging modules 1, 1A, 1B, 1D to 1I and the like already described also have the effects of the respective imaging modules 1.
  • the endoscope according to the embodiment is not limited to the flexible endoscope including the flexible tube portion 73C, and may be a rigid endoscope or a capsule endoscope.

Abstract

An endoscope 2 is provided with: an imaging element 20 joined with a piece of cover glass 10 via an adhesive layer 15 so that the cover glass 10 covers a light-receiving section 21, said imaging element 20 comprising a plurality of bumps 22 arranged around the light-receiving section 21; and a wiring board 30 comprising a plurality of flying leads 31. The tip 73A of an insertion section 73 comprises an imaging module 1C in which a side surface 10S1 of the cover glass 10 is in contact with the side surfaces of two or more first bumps 22A among the plurality of bumps 22, and in which another side surface 10S2 of the cover glass 10 is in contact with the side surface of at least one second bump 22B among the plurality of bumps 22.

Description

内視鏡、撮像モジュール、および撮像モジュールの製造方法Endoscope, imaging module, and imaging module manufacturing method
　本発明は、撮像素子の受光面に光学部材が接着された撮像モジュールを有する内視鏡、撮像素子の受光面に光学部材が接着された撮像モジュール、および撮像素子の受光面に光学部材が接着された撮像モジュールの製造方法に関する。 The present invention relates to an endoscope having an imaging module in which an optical member is bonded to the light receiving surface of the imaging element, an imaging module in which an optical member is bonded to the light receiving surface of the imaging element, and an optical member bonded to the light receiving surface of the imaging element. The present invention relates to a method for manufacturing an imaging module.
　半導体ウエハに多数の受光部等を形成し、切断し個片化することで平面視寸法の小さな多数の撮像素子を一括して作製できる。個片化された撮像素子の受光面には、カバーガラス等の光学部材が接着される。しかし、超小型の撮像素子の場合には、光学部材を正確に位置決めして接着することは容易ではない。 By forming a large number of light-receiving portions on a semiconductor wafer, cutting them into individual pieces, a large number of image sensors with small dimensions in plan view can be manufactured at once. An optical member such as a cover glass is bonded to the light receiving surface of the separated image sensor. However, in the case of an ultra-small image sensor, it is not easy to accurately position and bond the optical member.
　例えば、受光面が２ｍｍ×３ｍｍで、受光部が１．５ｍｍ角の撮像素子に、１．８ｍｍ角のカバーガラスを接着する場合、面内方向の位置決め精度は０．０５ｍｍ以下が要求される。さらに接着剤を硬化処理するときに接着剤の収縮により位置がずれることもある。 For example, when a 1.8 mm square cover glass is bonded to an image sensor having a light receiving surface of 2 mm × 3 mm and a light receiving portion of 1.5 mm square, positioning accuracy in the in-plane direction is required to be 0.05 mm or less. Further, when the adhesive is cured, the position may be shifted due to shrinkage of the adhesive.
　また、面内方向だけでなく、垂直方向の位置決め、すなわち、カバーガラスの裏面と撮像素子の受光面との距離および両者の平行度の正確性が要求される場合もある。 Also, not only the in-plane direction but also the vertical positioning, that is, the distance between the back surface of the cover glass and the light receiving surface of the image sensor and the accuracy of the parallelism between them may be required.
　日本国特開２００２－３４３９４９号公報には、上記垂直方向の位置決めの正確性を担保するために、位置決め専用のダミーバンプを高さ調整手段として用いることが開示されている。 Japanese Laid-Open Patent Publication No. 2002-343949 discloses that dummy bumps dedicated for positioning are used as height adjusting means in order to ensure the accuracy of positioning in the vertical direction.
特開２００２－３４３９４９号公報JP 2002-343949 A
　本発明の実施形態は、撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュールを挿入部の先端部に有する内視鏡、撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュール、および撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュールの製造方法を提供することを目的とする。 An embodiment of the present invention is an endoscope having an imaging module at the distal end portion of an insertion portion in which an optical member is accurately positioned and bonded to the light receiving surface of the image pickup device, and the optical member accurately on the light receiving surface of the image pickup device It is an object of the present invention to provide an imaging module that is positioned and bonded, and a method for manufacturing an imaging module in which an optical member is accurately positioned and bonded to a light receiving surface of an imaging element.
　本発明の実施形態の内視鏡は撮像モジュールを有する内視鏡であって、前記撮像モジュールが、直方体の透明部材と、光が前記透明部材を介して受光部に入射するように、前記透明部材が前記受光部を覆うように接着層を介して接着されており、前記受光部の周辺部に、同じ構成の複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を具備し、前記透明部材の一の側面が、前記複数のバンプのうちの２つ以上の第１のバンプの側面、または前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端、と当接しており、かつ、前記一の側面と直交している側面が、前記複数のバンプのうちの少なくとも１つの第２のバンプの側面、または、前記複数のフライングリードのうちの少なくとも１つの第２のフライングリードの側面、と当接しており、かつ、前記複数の第１のバンプまたは前記複数の第１のフライングリードのうちの少なくとも１つが、前記受光部と電気的に接続されている。 An endoscope according to an embodiment of the present invention is an endoscope having an imaging module, wherein the imaging module has a rectangular parallelepiped transparent member and the transparent so that light is incident on the light receiving unit via the transparent member. An image sensor in which a member is bonded via an adhesive layer so as to cover the light receiving portion, and a plurality of bumps having the same configuration are disposed around the light receiving portion, and a wiring having a plurality of flying leads A side surface of two or more first bumps of the plurality of bumps, or two or more first ones of the plurality of flying leads. The side surface that is in contact with the tip of the flying lead and is orthogonal to the one side surface is the side surface of at least one second bump of the plurality of bumps, or the plurality of flying leads. Little of them Are both in contact with the side surface of one second flying lead, and at least one of the plurality of first bumps or the plurality of first flying leads is electrically connected to the light receiving unit. Has been.
　また、別の実施形態の撮像モジュールは、光学部材と、光が前記光学部材を介して受光部に入射するように、前記光学部材が前記受光部を覆うように接着層を介して接着されており、前記受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を具備する撮像モジュールであって、前記光学部材の側面が、前記複数のバンプのうちの２つ以上の第１のバンプの側面と当接している。 In another embodiment, the imaging module is bonded to the optical member via an adhesive layer so as to cover the light receiving unit so that light is incident on the light receiving unit via the optical member. And an imaging module comprising: an imaging element having a plurality of bumps disposed in a peripheral portion of the light receiving unit; and a wiring board having a plurality of flying leads, wherein a side surface of the optical member includes the plurality of Are in contact with the side surfaces of two or more first bumps.
　また、別の実施形態の撮像モジュールは、光学部材と、光が前記光学部材を介して受光部に入射するように、前記光学部材が前記受光部を覆うように接着層を介して接着されており、前記受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を具備する撮像モジュールであって、前記光学部材の側面が、前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端と当接している。 In another embodiment, the imaging module is bonded to the optical member via an adhesive layer so as to cover the light receiving unit so that light is incident on the light receiving unit via the optical member. And an imaging module comprising: an imaging element having a plurality of bumps disposed in a peripheral portion of the light receiving unit; and a wiring board having a plurality of flying leads, wherein a side surface of the optical member includes the plurality of Are in contact with the tips of two or more first flying leads.
　さらに、別の実施形態の撮像モジュールの製造方法は、光学部材と、受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を作製する工程と、前記光学部材が、側面が前記複数のバンプのうちの２つ以上の第１のバンプの側面、または前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端、と当接するように位置決めされる工程と、位置決めされた状態で、前記光学部材と前記撮像素子との間に介在する接着剤を硬化する工程と、を具備する。 Furthermore, the manufacturing method of the imaging module of another embodiment produces an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads. And the optical member has a side surface of two or more first bumps of the plurality of bumps, or two or more first flying leads of the plurality of flying leads, and A step of positioning so as to abut, and a step of curing an adhesive interposed between the optical member and the imaging element in the positioned state.
　本発明の実施形態によれば、撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュールを挿入部の先端部に有する内視鏡、撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュール、および撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュールの製造方法を提供できる。 According to the embodiment of the present invention, an endoscope having an imaging module at the distal end portion of the insertion portion with an optical member accurately positioned and bonded to the light receiving surface of the imaging device, and the optical member on the light receiving surface of the imaging device. It is possible to provide an imaging module in which the optical member is accurately positioned and bonded, and a method for manufacturing the imaging module in which the optical member is accurately positioned and bonded to the light receiving surface of the imaging element.
第１実施形態の撮像モジュールの断面図である。It is sectional drawing of the imaging module of 1st Embodiment. 第１実施形態の撮像モジュールの上面図である。It is a top view of the imaging module of a 1st embodiment. 第１実施形態の変形例１の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 1 of 1st Embodiment. 第１実施形態の変形例２の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 2 of 1st Embodiment. 変形例の第１のバンプを含む撮像モジュールの断面図である。It is sectional drawing of the imaging module containing the 1st bump | vamp of a modification. 変形例の第１のバンプを含む撮像モジュールの断面図である。It is sectional drawing of the imaging module containing the 1st bump | vamp of a modification. 第１実施形態の変形例３の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 3 of 1st Embodiment. 第１実施形態の変形例４の撮像モジュールの上面図である。It is a top view of the imaging module of modification 4 of a 1st embodiment. 第１実施形態の変形例５の撮像モジュールの側面図である。It is a side view of the imaging module of the modification 5 of 1st Embodiment. 第１実施形態の変形例５の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 5 of 1st Embodiment. 変形例の第４のバンプの作製方法を説明するための断面図である。It is sectional drawing for demonstrating the production method of the 4th bump of a modification. 変形例の第４のバンプの作製方法を説明するための断面図である。It is sectional drawing for demonstrating the production method of the 4th bump of a modification. 変形例の第４のバンプの作製方法を説明するための断面図である。It is sectional drawing for demonstrating the production method of the 4th bump of a modification. 変形例の第４のバンプを含む撮像モジュールの断面図である。It is sectional drawing of the imaging module containing the 4th bump of a modification. 第１実施形態の変形例６の撮像モジュールの側面図である。It is a side view of the imaging module of the modification 6 of 1st Embodiment. 第１実施形態の変形例６の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 6 of 1st Embodiment. 第１実施形態の変形例７の撮像モジュールの側面図である。It is a side view of the imaging module of the modification 7 of 1st Embodiment. 第１実施形態の変形例８の撮像モジュールの側面図である。It is a side view of the imaging module of the modification 8 of 1st Embodiment. 第２実施形態の撮像モジュールの断面図である。It is sectional drawing of the imaging module of 2nd Embodiment. 第２実施形態の撮像モジュールの上面図である。It is a top view of the imaging module of a 2nd embodiment. 第２実施形態の変形例１の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 1 of 2nd Embodiment. 第２実施形態の変形例２の撮像モジュールの上面図である。It is a top view of the imaging module of the modification 2 of 2nd Embodiment. 実施形態の内視鏡を含む内視鏡システムの斜視図である。1 is a perspective view of an endoscope system including an endoscope according to an embodiment.
＜第１実施形態＞
　図１および図２に示すように、本実施形態の撮像モジュール１は、光学部材であるカバーガラス１０と、撮像素子２０と、配線板３０と、を具備する。 <First Embodiment>
As shown in FIGS. 1 and 2, the imaging module 1 of the present embodiment includes a cover glass 10 that is an optical member, an imaging element 20, and a wiring board 30.
　なお、以下の説明において、各実施の形態に基づく図面は、模式的なものであり、各部分の厚さと幅との関係、夫々の部分の厚さの比率および相対角度などは現実のものとは異なることに留意すべきであり、図面の相互間においても互いの寸法の関係や比率が異なる部分が含まれている場合がある。また、Ｘ軸、Ｙ軸およびＺ軸からなる直交座標系において、Ｚ軸方向を上下方向とし、例えば、Ｘ軸方向をＸ方向という。 In the following description, the drawings based on each embodiment are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, the relative angle, and the like are actual. It should be noted that there is a case where portions having different dimensional relationships and ratios are included in the drawings. In the orthogonal coordinate system including the X axis, the Y axis, and the Z axis, the Z axis direction is the up-down direction, and for example, the X axis direction is the X direction.
　カバーガラス１０は、例えば、平面視寸法（ＸＹ面内寸法）が２ｍｍ角で厚さ（Ｚ方向寸法）が４００μｍの直方体の透明部材である。透明部材は、直方体の樹脂部材でもよい。 The cover glass 10 is, for example, a rectangular parallelepiped transparent member having a planar view dimension (XY in-plane dimension) of 2 mm square and a thickness (Z direction dimension) of 400 μm. The transparent member may be a rectangular parallelepiped resin member.
　撮像素子２０は、例えば、厚さが３００μｍで平面視寸法が、２．５ｍｍ×３．５ｍｍである。撮像素子２０の受光面２０ＳＡには、１．８ｍｍ角の矩形の受光部２１が形成されている。受光部２１の周辺部には複数のバンプ２２が列設されている。複数のバンプ２２は、構成（形状、大きさ、および材料）が同じである。バンプ２２が配設されている電極パッド２３は、図示しない配線を介して受光部２１と電気的に接続されている導通端子である。 The imaging element 20 has a thickness of 300 μm and a plan view size of 2.5 mm × 3.5 mm, for example. A 1.8 mm square rectangular light receiving portion 21 is formed on the light receiving surface 20SA of the image pickup device 20. A plurality of bumps 22 are arranged in the periphery of the light receiving unit 21. The plurality of bumps 22 have the same configuration (shape, size, and material). The electrode pads 23 on which the bumps 22 are disposed are conductive terminals that are electrically connected to the light receiving unit 21 via wiring (not shown).
　配線板３０は端面から突出している複数のフライングリード３１を有する。フライングリード３１は、リードフレームではインナーリードとも呼ばれているが、配線板３０の配線の周囲の絶縁層等を選択的に剥離することにより形成される棒状の金属導体である。例えば、フライングリード３１は、長さ２５０μｍ、厚さ２０μｍ、幅５０μｍである。配線板３０は両面配線板、多層配線板または部品内蔵配線板であってもよい。 The wiring board 30 has a plurality of flying leads 31 protruding from the end face. The flying lead 31, which is also called an inner lead in the lead frame, is a rod-shaped metal conductor formed by selectively peeling off the insulating layer around the wiring of the wiring board 30. For example, the flying lead 31 has a length of 250 μm, a thickness of 20 μm, and a width of 50 μm. The wiring board 30 may be a double-sided wiring board, a multilayer wiring board, or a component built-in wiring board.
　配線板３０のフライングリード３１と撮像素子２０のバンプ２２とは、例えば超音波接合されている。図示しないが配線板３０は信号ケーブルと接合されており、撮像素子２０は配線板３０を介して電気信号を送受信する。 The flying lead 31 of the wiring board 30 and the bump 22 of the image sensor 20 are, for example, ultrasonically bonded. Although not shown, the wiring board 30 is joined to a signal cable, and the image sensor 20 transmits and receives electrical signals via the wiring board 30.
　カバーガラス１０と撮像素子２０とは透明な接着層１５を介して接着されている。すなわち、光がカバーガラス１０を介して受光部２１に入射するように、カバーガラス１０が受光部２１を覆うように接着層１５を介して接着されている。接着層１５は例えば、紫外線硬化型樹脂であり、硬化前は液状である。なお、受光部２１に複数のマイクロレンズが配設されている撮像素子の場合には、受光部２１の周囲に配設された額縁状の遮光性接着層を介してカバーガラス１０が接着されていてもよい。 The cover glass 10 and the image sensor 20 are bonded via a transparent adhesive layer 15. That is, the cover glass 10 is bonded through the adhesive layer 15 so as to cover the light receiving unit 21 so that light enters the light receiving unit 21 through the cover glass 10. The adhesive layer 15 is, for example, an ultraviolet curable resin and is in a liquid state before being cured. In the case of an image pickup device in which a plurality of microlenses are arranged in the light receiving unit 21, the cover glass 10 is bonded via a frame-shaped light-blocking adhesive layer arranged around the light receiving unit 21. May be.
　そして、撮像モジュール１では、カバーガラス１０の側面１０Ｓ１が、複数のバンプ２２の側面２２Ｓと当接している。以下、図２等に示すように、複数のバンプ２２の列設方向をＹ方向という。Ｙ方向は、撮像素子２０の側面に平行な方向であり、受光部２１の一辺に平行な方向でもある。 In the imaging module 1, the side surface 10S1 of the cover glass 10 is in contact with the side surfaces 22S of the plurality of bumps 22. Hereinafter, as shown in FIG. 2 and the like, the arrangement direction of the plurality of bumps 22 is referred to as a Y direction. The Y direction is a direction parallel to the side surface of the image sensor 20 and also a direction parallel to one side of the light receiving unit 21.
　例えば金からなるバンプ２２は、高さが１０μｍから１００μｍの、スタッドバンプ、めっきバンプまたはボールバンプ等である。 For example, the bumps 22 made of gold are stud bumps, plating bumps, ball bumps or the like having a height of 10 μm to 100 μm.
　撮像素子２０は、複数の撮像素子（ＣＣＤまたはＣＭＯＳ素子）が作製された半導体ウエハを切断することで作製される。バンプ２２が配設されている電極パッド２３は、受光部２１とともに撮像素子２０を作製するときに、ウエハレベルでフォトリソグラフィ法により位置が規定されている。このため、受光部２１と複数のバンプ２２の相対位置は正確に規定されている。 The image sensor 20 is manufactured by cutting a semiconductor wafer on which a plurality of image sensors (CCD or CMOS elements) are manufactured. The positions of the electrode pads 23 on which the bumps 22 are disposed are defined by a photolithographic method at the wafer level when the imaging device 20 is manufactured together with the light receiving unit 21. For this reason, the relative positions of the light receiving unit 21 and the plurality of bumps 22 are accurately defined.
　撮像素子２０に接着されたカバーガラス１０のＸ方向の位置は、側面が当接している複数のバンプ２２により、正確に規定されている。なお、Ｘ方向とはフライングリード３１の長軸方向であるＹ方向と直交する方向である。以下、カバーガラス１０の側面が当接しているバンプ２２を、Ｘ方向位置決め用の第１のバンプ２２Ａという。撮像モジュール１では、全てのバンプ２２が、第１のバンプ２２Ａである。 The position in the X direction of the cover glass 10 bonded to the image pickup device 20 is accurately defined by a plurality of bumps 22 whose side surfaces are in contact. The X direction is a direction orthogonal to the Y direction, which is the major axis direction of the flying lead 31. Hereinafter, the bump 22 with which the side surface of the cover glass 10 is in contact is referred to as a first bump 22A for positioning in the X direction. In the imaging module 1, all the bumps 22 are the first bumps 22A.
　第１のバンプ２２ＡはＸ方向位置決めのためだけに配設されている部材ではない。外部接続のために従来の撮像モジュールでも必須の構成要素である導通バンプ２２を、撮像モジュール１ではＸ方向位置決めのための第１のバンプ２２Ａとして用いている。言い替えれば、第１のバンプ２２Ａは受光部２１と電気的に接続され、フライングリード３１と接合されており、受光部２１と配線板３０とを接続する導通バンプ２２の機能を有する。 The first bump 22A is not a member arranged only for positioning in the X direction. Conductive bumps 22 that are essential components in the conventional imaging module for external connection are used as the first bumps 22A for positioning in the X direction in the imaging module 1. In other words, the first bump 22 </ b> A is electrically connected to the light receiving portion 21, joined to the flying lead 31, and has a function of the conductive bump 22 that connects the light receiving portion 21 and the wiring board 30.
　導通バンプ２２に加えて更に位置決めのためだけに位置決めバンプを配設する必要がないため、撮像モジュール１は製造が容易である。 Since it is not necessary to dispose positioning bumps only for positioning in addition to the conductive bumps 22, the imaging module 1 is easy to manufacture.
　さらに、カバーガラス１０の側面１０Ｓ１とバンプ２２の側面２２Ｓとを当接した状態で接着層１５の硬化処理、例えば、紫外線照射を行うことで、カバーガラス１０の位置が、硬化処理によってＸ方向に移動するおそれもない。 Further, by performing a curing process of the adhesive layer 15 in a state where the side surface 10S1 of the cover glass 10 and the side surface 22S of the bump 22 are in contact with each other, for example, ultraviolet irradiation, the position of the cover glass 10 is moved in the X direction by the curing process. There is no fear of moving.
　なお、撮像モジュール１では、カバーガラス１０と撮像素子２０とを接着した後に、配線板３０のフライングリード３１が、バンプ２２と接合される。 In the imaging module 1, after the cover glass 10 and the imaging element 20 are bonded, the flying leads 31 of the wiring board 30 are joined to the bumps 22.
　すなわち、撮像モジュール１の製造方法は、光学部材と、受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を作製する工程と、前記光学部材が、側面が前記複数のバンプのうちの２つ以上の第１のバンプの側面と当接するように位置決めされる工程と、前記位置決めされた状態で、前記光学部材と前記撮像素子との間に介在する接着剤を硬化する工程と、前記バンプと前記フライングリードとを接合する工程と、を具備する。 That is, the manufacturing method of the imaging module 1 includes the steps of manufacturing an optical member, an imaging element in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, A step of positioning an optical member so that a side surface thereof contacts a side surface of two or more first bumps of the plurality of bumps; and in the positioned state, the optical member and the imaging element A step of curing the intervening adhesive, and a step of bonding the bump and the flying lead.
　そして、撮像モジュール１の製造方法によれば、撮像素子２０の受光面２０ＳＡにカバーガラス１０が正確に位置決めして接着することが容易である。 Then, according to the method for manufacturing the imaging module 1, it is easy for the cover glass 10 to be accurately positioned and bonded to the light receiving surface 20SA of the imaging element 20.
　なお、すでに説明したように、撮像素子２０は、複数の撮像素子が作製された半導体ウエハを切断することで作製される。半導体ウエハを、複数の撮像素子２０が横方向（Ｙ方向）につながった素子群に切断し、素子群に含まれるいずれかの撮像素子またはダミー撮像素子の位置決めバンプ（２２Ａ、２２Ｂ、２２Ｃ）を用いて、細長いカバーガラスの位置決め／接着を行い、その後、個々の撮像素子２０に個片化してもよい。この製造方法では全ての撮像素子に位置決めバンプが配設されている必要はない。 As already described, the image sensor 20 is manufactured by cutting a semiconductor wafer on which a plurality of image sensors are manufactured. The semiconductor wafer is cut into an element group in which a plurality of imaging elements 20 are connected in the horizontal direction (Y direction), and positioning bumps (22A, 22B, 22C) of any imaging element or dummy imaging element included in the element group. It may be used to position / adhere the elongated cover glass and then singulate into individual image sensors 20. In this manufacturing method, it is not necessary that positioning bumps are provided on all image pickup devices.
＜第１実施形態の変形例＞
　次に、第１実施形態の変形例の撮像モジュールについて説明する。変形例の撮像モジュールは、撮像モジュール１と類似し同じ効果を有するので、同じ構成要素には同じ符号を付し説明は省略する。 <Modification of First Embodiment>
Next, an imaging module according to a modification of the first embodiment will be described. Since the imaging module of the modification is similar to the imaging module 1 and has the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
＜第１実施形態の変形例１＞
　撮像モジュール１では、６個の導通バンプ２２の全てが第１のバンプ２２Ａであった。 <Variation 1 of the first embodiment>
In the imaging module 1, all of the six conductive bumps 22 are the first bumps 22A.
　これに対して、図３に示す変形例１の撮像モジュール１Ａではカバーガラス１０は撮像素子２０ＡのＸ方向位置決め用バンプである２つの第１のバンプ２２Ａとだけ当接している。カバーガラス１０は、少なくとも２つの第１のバンプ２２Ａと当接していれば、Ｘ方向の位置が規定できる。なお、カバーガラス１０と当接する２つの第１のバンプ２２Ａは、位置決めを容易にするために、距離が離れていることが好ましい。 On the other hand, in the imaging module 1A of Modification 1 shown in FIG. 3, the cover glass 10 is in contact only with the two first bumps 22A that are the X-direction positioning bumps of the imaging element 20A. If the cover glass 10 is in contact with at least two first bumps 22A, the position in the X direction can be defined. The two first bumps 22A that are in contact with the cover glass 10 are preferably separated from each other in order to facilitate positioning.
＜第１実施形態の変形例２＞
　図４に示す第１実施形態の変形例２の撮像モジュール１Ｂの撮像素子２０Ｂには、導通バンプ２２とは別にＸ方向位置決め用の２つの第１のバンプ２２ＡＡ、２２ＡＢが配設されている。そして、第１のバンプ２２ＡＡ、２２ＡＢはフライングリード３１とは接合されていない。 <Modification 2 of the first embodiment>
In addition to the conductive bumps 22, two first bumps 22AA and 22AB for positioning in the X direction are arranged on the image pickup device 20B of the image pickup module 1B according to the second modification of the first embodiment shown in FIG. The first bumps 22AA and 22AB are not joined to the flying lead 31.
　第１のバンプ２２ＡＡは、１つの導通バンプ２２とともに、フライングリード３１と接合されている１つの電極パッド２３の上に配設されている。すなわち、第１のバンプ２２ＡＡのために、電極パッドを配設する必要はない。一方、第１のバンプ２２ＡＢは導通バンプとは異なる電極パッドの上に配設されている。第１のバンプ２２ＡＢは受光部２１とは接続されていないダミーバンプである。両者は、フライングリード３１と接合されている導通バンプ２２と同じ構成で撮像素子２０Ｂの同一の受光面２０ＳＡに同時に配設されている。 The first bump 22AA is disposed on one electrode pad 23 bonded to the flying lead 31 together with one conductive bump 22. That is, it is not necessary to provide an electrode pad for the first bump 22AA. On the other hand, the first bump 22AB is disposed on an electrode pad different from the conductive bump. The first bump 22AB is a dummy bump that is not connected to the light receiving unit 21. Both are simultaneously disposed on the same light receiving surface 20SA of the image pickup device 20B with the same configuration as the conductive bump 22 joined to the flying lead 31.
　すなわち、全ての第１のバンプが、受光部２１と接続されている導通バンプと同じ機能を有している必要はない。なお、カバーガラス１０と当接する２つの第１のバンプ２２ＡＡ、２２ＡＢは、位置決めを容易にするために、複数の導通バンプ２２よりも外側に配設されていることが好ましい。 That is, it is not necessary for all the first bumps to have the same function as the conductive bumps connected to the light receiving unit 21. Note that the two first bumps 22AA and 22AB that are in contact with the cover glass 10 are preferably disposed outside the plurality of conductive bumps 22 in order to facilitate positioning.
　撮像モジュール１Ｂは、位置決めのための第１のバンプ２２ＡＡが電気的接続のための導通バンプ２２と同時に配設でき、かつ、フライングリード３１の先端とカバーガラスの側面との間に間隙があるため接合が容易である。 In the imaging module 1B, the first bump 22AA for positioning can be arranged simultaneously with the conductive bump 22 for electrical connection, and there is a gap between the tip of the flying lead 31 and the side surface of the cover glass. Easy to join.
＜異形バンプ＞
　なお、位置決め用の第１のバンプ２２ＡＡは、導通バンプ２２と形状が異なっていてもよい。 <Deformed bump>
Note that the first bump 22AA for positioning may be different in shape from the conductive bump 22.
　例えば、図５に示す第１のバンプ２２Ａ１は、導通バンプ２２よりも高さが高い。接着層１５の厚さが厚く、導通バンプ２２では、カバーガラス１０の側面１０Ｓ１を安定して当接することが容易ではない場合がある。しかし、第１のバンプ２２Ａ１は接着層１５の厚さに応じて高さを設定できる。 For example, the height of the first bump 22A1 shown in FIG. In some cases, the thickness of the adhesive layer 15 is large, and it is not easy for the conductive bumps 22 to contact the side surface 10S1 of the cover glass 10 stably. However, the height of the first bump 22A1 can be set according to the thickness of the adhesive layer 15.
　なお、第１のバンプ２２Ａ１は、導通バンプ２２と同じ構成の下段バンプを含む多段バンプであることが好ましい。バンプ２２を配設するときに同時に同じ構成の第１のバンプ２２Ａ１の下段バンプが配設される。そして、下段バンプの上に上段バンプを配設することで、第１のバンプ２２Ａ１は、容易に作製できる。例えば、めっき下段バンプの上に、さらにめっき上段バンプまたはスタッド上段バンプを配設してもよいし、スタッドバンプを２段重ねて作製してもよい。 Note that the first bump 22A1 is preferably a multi-stage bump including a lower bump having the same configuration as the conductive bump 22. When the bump 22 is disposed, the lower bump of the first bump 22A1 having the same configuration is disposed at the same time. The first bump 22A1 can be easily manufactured by disposing the upper bump on the lower bump. For example, an upper plating bump or an upper stud bump may be disposed on the lower plating bump, or two stud bumps may be stacked.
　図６に示す、別の形状の第１のバンプ２２Ａ２は、導通バンプ２２よりも高さが高く、上部の大きさが下部よりも大きい。例えば、第１のバンプ２２Ａ２は導通バンプ２２と同じ下部バンプの上に、より大きな径の上部バンプが配設された２段バンプである。 The first bump 22A2 having another shape shown in FIG. 6 is higher in height than the conductive bump 22, and the size of the upper part is larger than that of the lower part. For example, the first bump 22A2 is a two-stage bump in which an upper bump having a larger diameter is disposed on the same lower bump as the conductive bump 22.
　カバーガラスは側面が第１のバンプ２２Ａ２の上部と当接した状態で固定される。このとき、第１のバンプ２２Ａ２の下部バンプの側面とカバーガラスの側面との間には、隙間が生じる。同様に、第１のバンプ２２Ａ２と列設されている導通バンプ２２の側面とカバーガラスの側面との間には、隙間ｔが生じる。 The cover glass is fixed with the side surface in contact with the upper part of the first bump 22A2. At this time, a gap is generated between the side surface of the lower bump of the first bump 22A2 and the side surface of the cover glass. Similarly, a gap t is generated between the side surface of the conductive bump 22 arranged in line with the first bump 22A2 and the side surface of the cover glass.
　このため、第１のバンプ２２Ａ２を位置決めバンプとして用いた撮像モジュールは、フライングリードを導通バンプ２２と接合することが、容易である。 Therefore, in the imaging module using the first bump 22A2 as the positioning bump, it is easy to join the flying lead to the conductive bump 22.
＜第１実施形態の変形例３＞
　図７に示すように、第１実施形態の変形例３の撮像モジュール１Ｃの撮像素子２０Ｃには、Ｘ方向位置決め用の第１のバンプ２２Ａに加えて、Ｙ方向位置決め用の第２のバンプ２２Ｂが配設されている。なお、撮像モジュール１Ｃでは、第１のバンプ２２Ａは全て導通バンプ２２である。 <Modification 3 of the first embodiment>
As shown in FIG. 7, the imaging element 20 </ b> C of the imaging module 1 </ b> C according to the third modification of the first embodiment includes a second bump 22 </ b> B for positioning in the Y direction in addition to the first bump 22 </ b> A for positioning in the X direction. Is arranged. In the imaging module 1 </ b> C, all the first bumps 22 </ b> A are conductive bumps 22.
　第２のバンプ２２Ｂは、第１のバンプ２２Ａの列設方向（Ｙ軸方向）に対して直交するＸ軸方向の線上に配設されており、受光部２１の側面の外辺に配設されている。 The second bumps 22B are arranged on a line in the X-axis direction perpendicular to the arrangement direction (Y-axis direction) of the first bumps 22A, and are arranged on the outer side of the side surface of the light receiving unit 21. ing.
　そして、カバーガラス１０は、導通バンプ２２（２２Ａ）と当接している側面１０Ｓ１と直交している側面１０Ｓ２が、第２のバンプ２２Ｂの側面と当接している。 In the cover glass 10, the side surface 10S2 orthogonal to the side surface 10S1 in contact with the conductive bump 22 (22A) is in contact with the side surface of the second bump 22B.
　撮像モジュール１Ｃは、第１のバンプ２２Ａおよび第２のバンプ２２Ｂにより、カバーガラス１０が、撮像素子２０Ｃに対して、ＸＹの２軸方向に位置決めされている。 In the imaging module 1C, the cover glass 10 is positioned in the XY biaxial directions with respect to the imaging element 20C by the first bump 22A and the second bump 22B.
　第２のバンプ２２Ｂは、導通バンプの機能を有する第１のバンプ２２Ａ（２２）と同じ構成で、第１のバンプ２２Ａと同時に配設されているため、撮像モジュール１Ｃは製造が容易である。 Since the second bump 22B has the same configuration as the first bump 22A (22) having the function of a conductive bump and is disposed at the same time as the first bump 22A, the imaging module 1C is easy to manufacture.
　なお、Ｙ方向の位置決め様の第２のバンプ２２Ｂは、Ｙ軸方向に対して直交するＸ方向に、少なくとも１つ配設されていればよいが、２つ以上が側面１０Ｓ２と当接するように、Ｘ方向に列設されていてもよい。 Note that at least one second bump 22B for positioning in the Y direction may be disposed in the X direction orthogonal to the Y-axis direction, but two or more are in contact with the side surface 10S2. , May be arranged in the X direction.
　撮像モジュール１Ｃは、撮像素子２０Ｃの受光面２０ＳＡにカバーガラス１０が、ＸＹ方向に正確に位置決めして接着されている。そして、接続用の導通バンプ２２と同じ構成で、同時に作製される第１のバンプ２２Ａおよび第２のバンプ２２Ｂにより位置決めが行われるため、製造が容易である。 In the imaging module 1C, the cover glass 10 is accurately positioned and adhered in the XY direction to the light receiving surface 20SA of the imaging element 20C. Since the positioning is performed by the first bump 22A and the second bump 22B that are manufactured at the same time with the same configuration as the conductive bump 22 for connection, manufacturing is easy.
　なお、第２のバンプ２２Ｂは、第１のバンプ２２Ａ１、２２Ａ２のような異形バンプであってもよい。 Note that the second bump 22B may be a deformed bump such as the first bump 22A1, 22A2.
＜第１実施形態の変形例４＞
　図８に示す第２実施形態の変形例４の撮像モジュール１Ｄでは、カバーガラス１０の側面１０Ｓ２と対向している側面１０Ｓ３が、撮像素子２０Ｄの第２のバンプ２２Ｂ２の側面と当接している。すなわち、カバーガラス１０は、２つの側面１０Ｓ２、１０Ｓ３が、２つのＹ方向位置決め用の第２のバンプ２２Ｂ、２２Ｂ２で挾まれている。 <Modification 4 of the first embodiment>
In the imaging module 1D of Modification 4 of the second embodiment shown in FIG. 8, the side surface 10S3 facing the side surface 10S2 of the cover glass 10 is in contact with the side surface of the second bump 22B2 of the imaging element 20D. That is, the cover glass 10 has two side surfaces 10S2 and 10S3 sandwiched between two second bumps 22B and 22B2 for positioning in the Y direction.
　撮像モジュール１Ｄでは、カバーガラス１０はＹ方向が一義的に位置決めされている。このため、カバーガラス１０は正確に位置決めした状態で接着されている。 In the imaging module 1D, the cover glass 10 is uniquely positioned in the Y direction. For this reason, the cover glass 10 is bonded in an accurately positioned state.
　なお、Ｘ方向位置決め用の第１のバンプ２２ＡＡは、フライングリード３１と接合されている導通バンプ２２とは別である。これに対して、Ｙ方向位置決め用の第２のバンプ２２Ｂはフライングリード３１Ｄが接合されている導通バンプである。 Note that the first bump 22AA for positioning in the X direction is different from the conductive bump 22 joined to the flying lead 31. In contrast, the second bump 22B for positioning in the Y direction is a conductive bump to which the flying lead 31D is joined.
　すなわち、第１のバンプ２２ＡＡおよび第２のバンプ２２Ｂは、フライングリード３１と接合されていてもよいし、いなくともよい。ただし、少なくとも１つの第１のバンプ２２Ａはフライングリード３１と接合されている導通バンプであることが好ましい。 That is, the first bump 22AA and the second bump 22B may or may not be joined to the flying lead 31. However, it is preferable that at least one first bump 22 </ b> A is a conductive bump joined to the flying lead 31.
＜第１実施形態の変形例５＞
　図９および図１０に示す第１実施形態の変形例５の撮像モジュール１Ｅの撮像素子２０Ｅは、Ｚ方向位置決め用の第３のバンプ２２Ｃを有する。すなわち、カバーガラス１０の裏面１０ＳＢが、他のバンプ（２２、２２Ａ、２２Ｂ）よりも高さの低い、３つの第３のバンプ２２Ｃの上面と当接している。 <Modification 5 of the first embodiment>
The imaging element 20E of the imaging module 1E of Modification 5 of the first embodiment shown in FIGS. 9 and 10 has a third bump 22C for positioning in the Z direction. That is, the back surface 10SB of the cover glass 10 is in contact with the upper surfaces of the three third bumps 22C that are lower in height than the other bumps (22, 22A, 22B).
　撮像モジュール１Ｅは、カバーガラス１０が、撮像素子２０Ｅに対して、ＸＹＺの３軸方向に位置決めされている。 In the imaging module 1E, the cover glass 10 is positioned in the three-axis directions of XYZ with respect to the imaging element 20E.
　例えば、第３のバンプ２２Ｃと同じ高さのバンプを配設し、その上に更にバンプを配設した多段バンプが他のバンプ（２２、２２Ａ、２２Ｂ）となる。 For example, a bump having the same height as the third bump 22C is disposed, and a multi-stage bump having a bump disposed thereon becomes another bump (22, 22A, 22B).
　第３のバンプ２２Ｃの高さ、厳密には、電極パッド２３の厚さを含めた高さは、接着層１５の厚さとなる。また、３つ以上の第３のバンプ２２ＣによりＺ方向の位置が規定されているカバーガラス１０の裏面１０ＳＢは、撮像素子２０Ｅの受光面２０ＳＡに対して傾斜することがなく、平行度が高い。 The height of the third bump 22C, strictly speaking, the height including the thickness of the electrode pad 23 is the thickness of the adhesive layer 15. Further, the back surface 10SB of the cover glass 10 whose position in the Z direction is defined by three or more third bumps 22C is not inclined with respect to the light receiving surface 20SA of the image sensor 20E, and has high parallelism.
＜第４のバンプ＞
　例えば、第１のバンプ２２Ａの機能と第３のバンプ２２Ｃの機能とを有する第４のバンプ２２Ｄを用いてもよい。 <4th bump>
For example, a fourth bump 22D having the function of the first bump 22A and the function of the third bump 22C may be used.
　例えば、図１１Ａ～図１１Ｃに示すように、バンプ２２Ｄの上面の一部を、圧着治具２９で押圧することで塑性変形する。塑性変形した下段面２２ＳＢが、カバーガラス１０の裏面１０ＳＢと当接し、塑性変形した側面２２Ｓが、カバーガラス１０の側面１０Ｓ１と当接する。 For example, as shown in FIGS. 11A to 11C, a part of the upper surface of the bump 22D is plastically deformed by being pressed by the crimping jig 29. The plastically deformed lower step surface 22SB contacts the back surface 10SB of the cover glass 10, and the plastically deformed side surface 22S contacts the side surface 10S1 of the cover glass 10.
　塑性変形加工に替えて、多段バンプを第４のバンプ２２Ｄとして用いてもよい。また、第４のバンプ２２Ｄが、Ｙ方向位置決め用の第２のバンプ２２ＢとＺ方向位置決め用の第３のバンプ２２Ｃとの機能を、兼ねていてもよい。 Instead of plastic deformation, a multi-stage bump may be used as the fourth bump 22D. Further, the fourth bump 22D may also function as the second bump 22B for positioning in the Y direction and the third bump 22C for positioning in the Z direction.
＜第１実施形態の変形例６＞
　図１３および図１４に示す第１実施形態の変形例６の撮像モジュール１Ｆでは、撮像素子２０Ｆの受光面２０ＳＡに、光学部材としてレンズユニット１１が接着されている。円柱形のレンズユニット１１は、レンズ１０Ａがレンズユニット枠である枠部材１０Ｂに固定されている。 <Modification 6 of the first embodiment>
In the imaging module 1F of Modification 6 of the first embodiment shown in FIGS. 13 and 14, the lens unit 11 is bonded as an optical member to the light receiving surface 20SA of the imaging element 20F. In the cylindrical lens unit 11, the lens 10A is fixed to a frame member 10B which is a lens unit frame.
　そして、撮像素子２０Ｆの４つの第４のバンプ２２Ｄにより、レンズユニット１１は、面内方向および垂直方向（ＸＹＺ方向）の位置、すなわち、３軸方向の位置が規定されている。なお、光学部材が円柱形の場合には、Ｘ方向位置決めバンプ（第１のバンプ２２Ａ）またはＹ方向位置決めバンプ（第２のバンプ２２Ｂ）が２つでもＸＹ方向の位置が規定可能である。なお、円柱形のレンズユニット１１は、３つの第４のバンプ２２Ｄにより、ＸＹＺの３軸方向の位置決めが可能である。 The lens unit 11 has a position in the in-plane direction and a vertical direction (XYZ direction), that is, a position in the triaxial direction, defined by the four fourth bumps 22D of the imaging element 20F. When the optical member is cylindrical, the position in the XY direction can be defined even with two X-direction positioning bumps (first bump 22A) or two Y-direction positioning bumps (second bump 22B). The cylindrical lens unit 11 can be positioned in the XYZ triaxial directions by the three fourth bumps 22D.
　なお、位置決めバンプは、透明部材であるカバーガラス１０またはレンズユニット１１の位置決めに限定されるものではなく、各種の光学部材の位置決め、例えば、レンズ、プリズム、または、カバーガラスの下に配設された額縁状のスペーサー等の位置決め等にも用いることができる。 The positioning bumps are not limited to the positioning of the cover glass 10 or the lens unit 11 that is a transparent member, but are positioned under various optical members, for example, the lens, the prism, or the cover glass. It can also be used for positioning a frame-like spacer.
　例えば、図１５に示す第１実施形態の変形例７の撮像モジュール１Ｆ１では、撮像素子２０Ｆの受光面２０ＳＡに、光学部材としてプリズム１２が接着されている。また、図１６に示す第１実施形態の変形例８の撮像モジュール１Ｆ２では、撮像素子２０Ｆの受光面２０ＳＡに、光学部材としてサポートプリズムが付いているプリズム１２Ａが接着されている。プリズム１２Ａの反射面には例えば金属膜が成膜されている。サポートプリズムが付いているプリズム１２Ａは、プリズム１２よりも取り扱いが容易である。 For example, in the imaging module 1F1 of Modification 7 of the first embodiment shown in FIG. 15, the prism 12 is bonded as an optical member to the light receiving surface 20SA of the imaging element 20F. Further, in the imaging module 1F2 of Modification 8 of the first embodiment shown in FIG. 16, a prism 12A having a support prism as an optical member is bonded to the light receiving surface 20SA of the imaging element 20F. For example, a metal film is formed on the reflecting surface of the prism 12A. The prism 12A with the support prism is easier to handle than the prism 12.
＜第２実施形態＞
　次に、第２実施形態の撮像モジュール１Ｇについて説明する。撮像モジュール１Ｇは、すでに説明した撮像モジュール１～１Ｇと類似し同じ効果を有するため、同じ構成要素には同じ符号を付し説明は省略する。 Second Embodiment
Next, the imaging module 1G of the second embodiment will be described. Since the imaging module 1G is similar to the imaging modules 1 to 1G already described and has the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
　図１７に示すように、撮像モジュール１Ｇでは、カバーガラス１０の一の側面１０Ｓ１が、複数のフライングリード３１のうちのＸ方向位置決め用の第１のフライングリード３１Ａの先端面３１ＳＡと当接している。逆に言えば、カバーガラス１０の側面１０Ｓ１が当接しているフライングリード３１を、第１のフライングリード３１Ａという。撮像モジュール１Ｇでは全てのフライングリード３１が第１のフライングリード３１Ａである。 As shown in FIG. 17, in the imaging module 1 </ b> G, one side surface 10 </ b> S <b> 1 of the cover glass 10 is in contact with the distal end surface 31 </ b> SA of the first flying lead 31 </ b> A for positioning in the X direction among the plurality of flying leads 31. . In other words, the flying lead 31 with which the side surface 10S1 of the cover glass 10 is in contact is referred to as a first flying lead 31A. In the imaging module 1G, all the flying leads 31 are the first flying leads 31A.
　撮像モジュール１Ｇは、カバーガラス１０が、撮像素子２０に対して、Ｘ方向が位置決めされている。 In the imaging module 1G, the cover glass 10 is positioned with respect to the imaging element 20 in the X direction.
　撮像モジュール１Ｇでは、カバーガラス１０の接着前に、撮像素子２０の複数のバンプ２２に、それぞれフライングリード３１が接合される。このとき、フライングリード３１の先端が、接合部よりも、例えば１０μｍ～１００μｍ程度、前に位置するように接合される。 In the imaging module 1G, the flying leads 31 are bonded to the plurality of bumps 22 of the imaging element 20 before the cover glass 10 is bonded. At this time, the leading end of the flying lead 31 is bonded so as to be positioned, for example, about 10 μm to 100 μm ahead of the bonding portion.
　なお、２つ以上の第１のフライングリード３１Ａがあれば、撮像素子２０にカバーガラス１０を正確に位置決めできる。 If there are two or more first flying leads 31 </ b> A, the cover glass 10 can be accurately positioned on the image sensor 20.
　複数のフライングリード３１の先端は、撮像素子２０の側面に平行方向（Ｙ方向）、すなわち、受光部２１の一辺に平行に列設されている。そして、フライングリード３１の先端面３１ＳＡにカバーガラス１０の側面１０Ｓ１を当接しながら接着、硬化が行われる。 The tips of the plurality of flying leads 31 are arranged in parallel to the side surface of the image sensor 20 (Y direction), that is, in parallel to one side of the light receiving unit 21. Then, adhesion and curing are performed while the side surface 10S1 of the cover glass 10 is brought into contact with the front end surface 31SA of the flying lead 31.
　撮像モジュール１Ｇは、フライングリード３１の先端位置によりカバーガラス１０が、面内の一方向（Ｘ方向）の位置が正確に規定されている。また、フライングリード３１は位置決めのためだけに配設されている部材ではない。外部接続のために従来の撮像モジュールでも必須の構成要素であるフライングリード３１を、撮像モジュール１ＧではＸ方向位置決めのための第１のフライングリード３１Ａとして用いている。このため、撮像モジュール１Ｇは製造が容易である。 In the imaging module 1G, the position of the cover glass 10 in one direction (X direction) in the plane is accurately defined by the tip position of the flying lead 31. Further, the flying lead 31 is not a member provided only for positioning. The flying lead 31 that is an essential component in the conventional imaging module for external connection is used as the first flying lead 31A for positioning in the X direction in the imaging module 1G. For this reason, the imaging module 1G is easy to manufacture.
　さらに、カバーガラス１０の側面１０Ｓ１とフライングリード３１の先端面とを当接した状態で接着層１５の硬化処理、例えば、紫外線照射を行うことで、カバーガラス１０の位置が硬化処理により移動するおそれもない。 Furthermore, when the side surface 10S1 of the cover glass 10 and the leading end surface of the flying lead 31 are in contact with each other, the position of the cover glass 10 may be moved by the curing process by performing a curing process of the adhesive layer 15, for example, ultraviolet irradiation. Nor.
　すなわち、撮像モジュール１Ｇは、撮像素子２０の受光面２０ＳＡにカバーガラス１０が正確に位置決めして接着されている。 That is, in the imaging module 1G, the cover glass 10 is accurately positioned and bonded to the light receiving surface 20SA of the imaging element 20.
　撮像モジュール１Ｇの製造方法は、光学部材と、受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を作製する工程と、バンプとフライングリードとを接合する工程と、前記光学部材が、側面が前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端と当接するように位置決めされる工程と、前記位置決めされた状態で、前記光学部材と前記撮像素子との間に介在する接着剤を硬化する工程と、を具備する。 The manufacturing method of the imaging module 1G includes a step of manufacturing an optical member, an imaging device in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads, and the bumps and flying. A step of bonding the lead, a step of positioning the optical member such that a side surface abuts a tip of two or more first flying leads of the plurality of flying leads, and the positioned state And a step of curing an adhesive interposed between the optical member and the imaging device.
＜第２実施形態の変形例＞
　次に、第２実施形態の変形例の撮像モジュール１Ｈ、１Ｉについて説明する。撮像モジュール１Ｈ、１Ｉは、撮像モジュール１Ｇと類似し同じ効果を有するため、同じ構成要素には同じ符号を付し説明は省略する。 <Modification of Second Embodiment>
Next, imaging modules 1H and 1I according to modifications of the second embodiment will be described. Since the imaging modules 1H and 1I are similar to the imaging module 1G and have the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.
＜第２実施形態の変形例１＞
　図１９に示す第２実施形態の変形例１の撮像モジュール１Ｈは、複数のフライングリード３１のうちの第２のフライングリード３１ＢがＹ方向（フライングリードの長軸方向）の位置決めに用いられる。第２のフライングリード３１Ｂは、第１のフライングリード３１Ａよりも長く、カバーガラス１０の側面１０Ｓ１と直交している側面１０Ｓ２が、第２のフライングリード３１Ｂの側面と当接している。 <Modification Example 1 of Second Embodiment>
In the imaging module 1H of Modification 1 of the second embodiment shown in FIG. 19, the second flying lead 31B of the plurality of flying leads 31 is used for positioning in the Y direction (the major axis direction of the flying lead). The second flying lead 31B is longer than the first flying lead 31A, and the side surface 10S2 orthogonal to the side surface 10S1 of the cover glass 10 is in contact with the side surface of the second flying lead 31B.
　撮像モジュール１Ｈは、カバーガラス１０が、撮像素子２０に対して、面内方向（ＸＹ方向）が位置決めされている。 In the imaging module 1H, the cover glass 10 is positioned in the in-plane direction (XY direction) with respect to the imaging element 20.
　撮像モジュール１Ｈでは、第２のフライングリード３１Ｂは、受光部２１と電気的に接続されている導通フライングリードではなく、Ｙ方向の位置決めのための専用部材である。しかし、配線板３０の製造時において、第２のフライングリード３１Ｂは他のフライングリード３１と同時に一括して作製される。このため、撮像モジュール１Ｈは製造が容易で、かつ、撮像素子２０の受光面２０ＳＡに正確に位置決めされたカバーガラス１０が接着されている。 In the imaging module 1H, the second flying lead 31B is not a conductive flying lead electrically connected to the light receiving unit 21, but a dedicated member for positioning in the Y direction. However, at the time of manufacturing the wiring board 30, the second flying lead 31 </ b> B is manufactured at the same time as the other flying leads 31. For this reason, the imaging module 1H is easy to manufacture, and the cover glass 10 that is accurately positioned on the light receiving surface 20SA of the imaging element 20 is bonded.
　なお、第２のフライングリード３１Ｂが、受光部２１の側面に配設されている高さが低い導通バンプまたはダミーバンプと接合されていてもよい。バンプと接合されている第２のフライングリード３１Ｂは、側面位置が固定されているため、より正確にＹ方向の位置を規定できる。 Note that the second flying lead 31B may be bonded to a conductive bump or dummy bump having a low height disposed on the side surface of the light receiving unit 21. Since the side position of the second flying lead 31B bonded to the bump is fixed, the position in the Y direction can be more accurately defined.
　また、カバーガラス１０の側面１０Ｓ２と対向する側面とが、それぞれの第２のフライングリードの側面と当接していてもよい。２本の第２のフライングリードに挾まれているカバーガラス１０は、一義的にＹ方向の配設位置が規定されている。このため、カバーガラス１０は、より正確に位置決めした状態で接着されている。 Further, the side surface facing the side surface 10S2 of the cover glass 10 may be in contact with the side surface of each second flying lead. The cover glass 10 sandwiched between the two second flying leads is uniquely defined in the Y direction. For this reason, the cover glass 10 is bonded in a state where it is positioned more accurately.
＜第２実施形態の変形例２＞
　図２０に示す第２実施形態の変形例２の撮像モジュール１Ｉは、撮像モジュール１Ｈの構成に加えて、さらにカバーガラス１０の裏面１０ＳＢが、撮像素子２０Ｉの複数のバンプ２２のうちの、他のバンプ（２２、２２Ａ、２２Ｂ）よりも高さの低い４つのダミーバンプ２２Ｃと当接している。 <Modification 2 of the second embodiment>
In addition to the configuration of the imaging module 1H, the imaging module 1I according to the second modification of the second embodiment illustrated in FIG. 20 has a back surface 10SB of the cover glass 10 that is the other of the plurality of bumps 22 of the imaging element 20I. It is in contact with four dummy bumps 22C that are lower than the bumps (22, 22A, 22B).
　３つ以上のダミーバンプ２２Ｃの上面と、裏面１０ＳＢとが当接しているカバーガラス１０は、撮像素子２０Ｉの受光面に対する垂直方向（Ｚ方向）の位置が規定されており、さらに、受光面と裏面１０ＳＢとが平行に配置されている。 The cover glass 10 in which the upper surface of the three or more dummy bumps 22C and the back surface 10SB are in contact with each other has a position in the vertical direction (Z direction) with respect to the light receiving surface of the image sensor 20I. 10SB is arranged in parallel.
　撮像モジュール１Ｉは、撮像素子２０Ｉの受光面２０ＳＡにカバーガラス１０がＸＹＺ方向に正確に接着されている。すなわち、撮像モジュール１ＨＩでは、カバーガラス１０が撮像素子２０Ｉに対して、ＸＹＺの３軸方向が正確に位置決めされ接着されている。 In the imaging module 1I, the cover glass 10 is accurately adhered to the light receiving surface 20SA of the imaging element 20I in the XYZ directions. That is, in the imaging module 1HI, the cover glass 10 is accurately positioned and adhered to the imaging element 20I in the three-axis directions of XYZ.
＜第３実施形態＞
　次に第３実施形態の内視鏡２について説明する。 <Third Embodiment>
Next, the endoscope 2 according to the third embodiment will be described.
　図２１に示すように、内視鏡システム７１は、内視鏡２と、プロセッサ７５Ａと、光源装置７５Ｂと、モニタ７５Ｃと、を具備する。内視鏡２は、挿入部７３を被検体の体腔内に挿入することによって、被検体の体内画像を撮像し撮像信号を出力する。 As shown in Fig. 21, the endoscope system 71 includes an endoscope 2, a processor 75A, a light source device 75B, and a monitor 75C. The endoscope 2 takes an in-vivo image of the subject and outputs an imaging signal by inserting the insertion portion 73 into the body cavity of the subject.
　内視鏡２の挿入部７３の基端側には、内視鏡２を操作する各種ボタン類が設けられた操作部７４が配設されている。操作部７４には、被検体の体腔内に生体鉗子、電気メスおよび検査プローブ等の処置具を挿入するチャンネル７３Ｈの処置具挿入口７４Ａがある。 On the proximal end side of the insertion portion 73 of the endoscope 2, an operation portion 74 provided with various buttons for operating the endoscope 2 is disposed. The operation unit 74 has a treatment instrument insertion port 74A of a channel 73H for inserting treatment instruments such as a biological forceps, an electric knife and an inspection probe into the body cavity of the subject.
　挿入部７３は、例えば、撮像モジュール１Ｃが配設されている先端部７３Ａと、先端部７３Ａの基端側に連設された湾曲自在な湾曲部７３Ｂと、この湾曲部７３Ｂの基端側に連設された可撓管部７３Ｃとによって構成される。湾曲部７３Ｂは、操作部７４の操作によって湾曲する。 The insertion portion 73 includes, for example, a distal end portion 73A where the imaging module 1C is disposed, a bendable bending portion 73B continuously provided on the proximal end side of the distal end portion 73A, and a proximal end side of the bending portion 73B. It is comprised by the flexible tube part 73C provided continuously. The bending portion 73B is bent by the operation of the operation unit 74.
　操作部７４の基端部側に配設されたユニバーサルコード７４Ｂには、先端部７３Ａの撮像モジュール１と接続された信号ケーブル７５が挿通している。 The signal cable 75 connected to the imaging module 1 at the distal end 73A is inserted through the universal cord 74B disposed on the base end side of the operation unit 74.
　ユニバーサルコード７４Ｂは、コネクタ７４Ｃを介してプロセッサ７５Ａおよび光源装置７５Ｂに接続される。プロセッサ７５Ａは内視鏡システム７１の全体を制御するとともに、撮像モジュール１が出力する撮像信号に信号処理を行い画像信号として出力する。モニタ７５Ｃは、プロセッサ７５Ａが出力する画像信号を表示する。 The universal cord 74B is connected to the processor 75A and the light source device 75B via the connector 74C. The processor 75A controls the entire endoscope system 71, performs signal processing on the imaging signal output by the imaging module 1, and outputs it as an image signal. The monitor 75C displays an image signal output from the processor 75A.
　撮像素子の受光面に光学部材が正確に位置決めして接着されている撮像モジュール１Ｃを先端部７３Ａに有する内視鏡２は、製造が容易である。 The endoscope 2 having the imaging module 1C in which the optical member is accurately positioned and bonded to the light receiving surface of the imaging element at the distal end portion 73A is easy to manufacture.
　なお、すでに説明した撮像モジュール１、１Ａ、１Ｂ、１Ｄ～１Ｉ等を有する内視鏡も、それぞれの撮像モジュール１の効果を有することは言うまでも無い。 Needless to say, endoscopes having the imaging modules 1, 1A, 1B, 1D to 1I and the like already described also have the effects of the respective imaging modules 1.
　また、実施形態の内視鏡としては可撓管部７３Ｃを含む軟性鏡に限られるものではなく、硬性鏡でもよいし、カプセル型内視鏡でもよい。 Further, the endoscope according to the embodiment is not limited to the flexible endoscope including the flexible tube portion 73C, and may be a rigid endoscope or a capsule endoscope.
　本発明は、上述した実施形態および変形例等に限定されるものではなく、発明の趣旨を逸脱しない範囲内において種々の変更、組み合わせおよび応用が可能である。 The present invention is not limited to the above-described embodiments and modifications, and various modifications, combinations, and applications are possible without departing from the spirit of the invention.
１、１Ａ～１Ｉ・・・撮像モジュール
２・・・内視鏡
１０・・・カバーガラス
１０Ａ・・・レンズ
１５・・・接着層
２０・・・撮像素子
２１・・・受光部
２２・・・バンプ
２２Ａ・・・第１のバンプ
２２Ｂ・・・第２のバンプ
２２Ｃ・・・第３のバンプ
２２Ｄ・・・第４のバンプ
２３・・・電極パッド
２９・・・圧着治具
３０・・・配線板
３１・・・フライングリード
３１Ａ・・・第１のフライングリード
３１Ｂ・・・第２のフライングリード
７１・・・内視鏡システム DESCRIPTION OF SYMBOLS 1, 1A-1I ... Imaging module 2 ... Endoscope 10 ... Cover glass 10A ... Lens 15 ... Adhesive layer 20 ... Imaging element 21 ... Light-receiving part 22 ... Bump 22A ... First bump 22B ... Second bump 22C ... Third bump 22D ... Fourth bump 23 ... Electrode pad 29 ... Crimping jig 30 ... Wiring board 31 ... Flying lead 31A ... First flying lead 31B ... Second flying lead 71 ... Endoscope system

Claims (16)

  1. 　撮像モジュールを有する内視鏡であって、
    　前記撮像モジュールが、
    　直方体の透明部材と、
    　光が前記透明部材を介して受光部に入射するように、前記透明部材が前記受光部を覆うように接着層を介して接着されており、前記受光部の周辺部に、同じ構成の複数のバンプが配設されている撮像素子と、
    　複数のフライングリードを有する配線板と、を具備し、
    　前記透明部材の一の側面が、前記複数のバンプのうちの２つ以上の第１のバンプの側面、または前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端、と当接しており、かつ、
    　前記一の側面と直交している側面が、前記複数のバンプのうちの少なくとも１つの第２のバンプの側面、または、前記複数のフライングリードのうちの少なくとも１つの第２のフライングリードの側面、と当接しており、かつ、
    　前記複数の第１のバンプまたは前記複数の第１のフライングリードのうちの少なくとも１つが、前記受光部と電気的に接続されていることを特徴とする内視鏡。     An endoscope having an imaging module,
    The imaging module is
    A rectangular parallelepiped transparent member;
    The transparent member is bonded via an adhesive layer so as to cover the light receiving portion so that light is incident on the light receiving portion through the transparent member, and a plurality of the same configuration is provided around the light receiving portion. An image sensor on which bumps are disposed;
    A wiring board having a plurality of flying leads,
    One side surface of the transparent member is in contact with a side surface of two or more first bumps of the plurality of bumps, or a tip of two or more first flying leads of the plurality of flying leads. Touching, and
    A side surface orthogonal to the one side surface is a side surface of at least one second bump of the plurality of bumps, or a side surface of at least one second flying lead of the plurality of flying leads; Abut, and
    An endoscope, wherein at least one of the plurality of first bumps or the plurality of first flying leads is electrically connected to the light receiving unit.
  2. 　光学部材と、
    　光が前記光学部材を介して受光部に入射するように、前記光学部材が前記受光部を覆うように接着層を介して接着されており、前記受光部の周辺部に複数のバンプが配設されている撮像素子と、
    　複数のフライングリードを有する配線板と、を具備する撮像モジュールであって、
    　前記光学部材の側面が、前記複数のバンプのうちの２つ以上の第１のバンプの側面と当接していることを特徴とする撮像モジュール。     An optical member;
    The optical member is bonded via an adhesive layer so as to cover the light receiving portion so that light is incident on the light receiving portion through the optical member, and a plurality of bumps are disposed on the periphery of the light receiving portion. An image sensor,
    An imaging module comprising a wiring board having a plurality of flying leads,
    The imaging module, wherein a side surface of the optical member is in contact with a side surface of two or more first bumps of the plurality of bumps.
  3. 　少なくとも１つの前記第１のバンプが、前記受光部と電気的に接続され前記フライングリードと接合されていることを特徴とする請求項２に記載の撮像モジュール。 3. The imaging module according to claim 2, wherein at least one of the first bumps is electrically connected to the light receiving unit and joined to the flying lead.
  4. 　前記複数のバンプが、前記第１のバンプと、前記受光部と電気的に接続され前記フライングリードと接合されている導通バンプと、を含むことを特徴とする請求項３に記載の撮像モジュール。 4. The imaging module according to claim 3, wherein the plurality of bumps include the first bump and a conductive bump that is electrically connected to the light receiving unit and joined to the flying lead.
  5. 　前記第１のバンプと前記導通バンプとが、同じ構成であることを特徴とする請求項４に記載の撮像モジュール。 The imaging module according to claim 4, wherein the first bump and the conductive bump have the same configuration.
  6. 　前記第１のバンプが、前記導通バンプと同じ構成の下段バンプを含む多段バンプであることを特徴とする請求項４に記載の撮像モジュール。 The imaging module according to claim 4, wherein the first bump is a multi-stage bump including a lower bump having the same configuration as the conductive bump.
  7. 　前記光学部材が、直方体で、
    　前記光学部材の前記第１のバンプの側面と当接している側面に対して直交している側面が、前記複数のバンプのうちの少なくとも１つの第２のバンプの側面と当接していることを特徴とする請求項２から請求項６のいずれか１項に記載の撮像モジュール。     The optical member is a rectangular parallelepiped,
    The side surface orthogonal to the side surface of the optical member that is in contact with the side surface of the first bump is in contact with the side surface of at least one second bump of the plurality of bumps. The imaging module according to any one of claims 2 to 6, wherein the imaging module is characterized.
  8. 　前記光学部材が、円柱形であることを特徴とする請求項２から請求項６のいずれか１項に記載の撮像モジュール。 The imaging module according to any one of claims 2 to 6, wherein the optical member has a cylindrical shape.
  9. 　前記光学部材の裏面が、前記複数のバンプのうちの、他のバンプよりも高さの低い３つ以上の第３のバンプの上面と当接していることを特徴とする請求項２から請求項８のいずれか１項に記載の撮像モジュール。 The back surface of the optical member is in contact with the upper surface of three or more third bumps having a lower height than the other bumps among the plurality of bumps. 9. The imaging module according to any one of 8.
  10. 　光学部材と、
    　光が前記光学部材を介して受光部に入射するように、前記光学部材が前記受光部を覆うように接着層を介して接着されており、前記受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を具備する撮像モジュールであって、
    　前記光学部材の側面が、前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端と当接していることを特徴とする撮像モジュール。     An optical member;
    The optical member is bonded via an adhesive layer so as to cover the light receiving portion so that light is incident on the light receiving portion through the optical member, and a plurality of bumps are disposed on the periphery of the light receiving portion. An imaging module comprising: an imaging element being configured; and a wiring board having a plurality of flying leads,
    The imaging module, wherein a side surface of the optical member is in contact with a tip of two or more first flying leads of the plurality of flying leads.
  11. 　少なくとも１つの前記第１のフライングリードが、前記受光部と電気的に接続されていることを特徴とする請求項１０に記載の撮像モジュール。 The imaging module according to claim 10, wherein at least one of the first flying leads is electrically connected to the light receiving unit.
  12. 　前記光学部材が直方体で、
    　前記光学部材の前記第１のフライングリードの先端と当接している側面と直交している側面が、前記複数のフライングリードのうちの少なくとも１つの第２のフライングリードの側面と当接していることを特徴とする請求項１１に記載の撮像モジュール。     The optical member is a rectangular parallelepiped,
    The side surface of the optical member that is orthogonal to the side surface that is in contact with the tip of the first flying lead is in contact with the side surface of at least one second flying lead of the plurality of flying leads. The imaging module according to claim 11.
  13. 　前記光学部材が、円柱形であることを特徴とする請求項１１に記載の撮像モジュール。 The imaging module according to claim 11, wherein the optical member has a cylindrical shape.
  14. 　前記光学部材の裏面が、前記複数のバンプのうちの、他のバンプよりも高さの低い、少なくとも３つのダミーバンプの上面と当接していることを特徴とする請求項１２または請求項１３に記載の撮像モジュール。 The back surface of the optical member is in contact with the upper surface of at least three dummy bumps having a lower height than the other bumps among the plurality of bumps. Imaging module.
  15. 　前記光学部材が、カバーガラス、プリズム、レンズ、レンズユニット枠、またはスペーサーであることを特徴とする請求項２から請求項１４のいずれか１項に記載の撮像モジュール。 The imaging module according to any one of claims 2 to 14, wherein the optical member is a cover glass, a prism, a lens, a lens unit frame, or a spacer.
  16. 　光学部材と、受光部の周辺部に複数のバンプが配設されている撮像素子と、複数のフライングリードを有する配線板と、を作製する工程と、
    　前記光学部材が、側面が前記複数のバンプのうちの２つ以上の第１のバンプの側面、または前記複数のフライングリードのうちの２つ以上の第１のフライングリードの先端、と当接するように位置決めされる工程と、
    　位置決めされた状態で、前記光学部材と前記撮像素子との間に介在する接着剤を硬化する工程と、を具備することを特徴とする撮像モジュールの製造方法。     A step of producing an optical member, an imaging element in which a plurality of bumps are disposed in the periphery of the light receiving unit, and a wiring board having a plurality of flying leads;
    The optical member has a side surface that comes into contact with a side surface of two or more first bumps of the plurality of bumps or a tip of two or more first flying leads of the plurality of flying leads. A process positioned on
    And a step of curing an adhesive interposed between the optical member and the imaging element in a positioned state.
PCT/JP2015/077718 2015-09-30 2015-09-30 Endoscope, imaging module, and method for producing imaging module WO2017056226A1 (en)

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JP2001257937A (en) * 2000-03-13 2001-09-21 Olympus Optical Co Ltd Solid-state image pickup device
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JP2001257937A (en) * 2000-03-13 2001-09-21 Olympus Optical Co Ltd Solid-state image pickup device
JP2008177364A (en) * 2007-01-18 2008-07-31 Denso Corp Method of manufacturing semiconductor device, and semiconductor device
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