WO2020003398A1

WO2020003398A1 - Endoscope and endoscopic imaging device

Info

Publication number: WO2020003398A1
Application number: PCT/JP2018/024336
Authority: WO
Inventors: 和洋吉田
Original assignee: オリンパス株式会社
Priority date: 2018-06-27
Filing date: 2018-06-27
Publication date: 2020-01-02

Abstract

An endoscope 9 that has an endoscopic imaging device 1. The endoscopic imaging device 1 comprises: an imaging unit 20 that has a front surface 20SA and a rear surface 20SB and includes an imaging element 22 that has a light reception surface 22SA and a back surface 22SB, a light reception unit 23 being arranged at the light reception surface 22SA of the imaging element 22, and an external electrode 24 being arranged at the back surface 22SB; a laminate optical unit 10 that has an incidence surface 10SA and an emission surface 10SB and has a plurality of optical members 11–16 adhered thereto, the emission surface 10SB being adhered to the front surface 20SA; and a signal cable 30 that has a core wire 31 that is electrically connected to the external electrode 24. The emission surface 10SB and the front surface 20SA are rectangular, the emission surface 10SB is larger than the front surface 20SA, there is an outer peripheral area A in which the front surface 20SA is not adhered to the emission surface 10SB, and the sides of the front surface 20SA are inclined relative to the sides of the emission surface 10SB.

Description

Endoscope and imaging device for endoscope

The present invention relates to an endoscope having an imaging device for an endoscope including a laminated optical unit, and an imaging device for an endoscope including a laminated optical unit.

内 The endoscope has been reduced in diameter to make it less invasive. On the other hand, an ultra-small diameter endoscope is required for insertion into a very small-diameter lumen, for example, a blood vessel or a bronchiole. However, it is not easy to obtain an ultra-small endoscope having a diameter of, for example, less than 1.5 mm by extending the diameter-reducing technique for less invasiveness.

JP-A-2012-18993 (US Patent Application Publication No. 2012/0008934) discloses an imaging device including a wafer-level laminate. This imaging device is manufactured by cutting a plurality of optical element wafers and an imaging element wafer after joining them.

In the above manufacturing method, if a defective imaging device is included in the imaging device wafer, the manufactured imaging device includes the defective product. For this reason, it is preferable to perform an inspection and manufacture an imaging device using only good quality imaging elements.

撮像 In addition, in the imaging device for an endoscope, since the endoscope is of a small variety and a large variety, it is preferable that a plurality of imaging devices having imaging devices of different specifications can be manufactured at the same time.

JP 2012-18993 A

An object of the embodiments of the present invention is to provide a highly reliable and minimally invasive endoscope and a highly reliable small-diameter endoscope imaging apparatus.

The endoscope of the embodiment has an endoscope imaging device, the endoscope imaging device has a front surface and a rear surface facing the front surface, a light receiving surface and a back surface facing the light receiving surface. And an image sensor having a light receiving unit disposed on the light receiving surface, and an external electrode connected to the light receiving unit disposed on the light receiving surface or the back surface. An imaging unit, having an incident surface on which light is incident and an exit surface facing the incident surface, the exit surface is adhered to the front surface, and a laminated optical unit to which a plurality of optical members are adhered; A signal cable including a core wire and an outer sheath, wherein the core wire is electrically connected to the external electrode, wherein the emission surface and the front surface are rectangular, and the emission surface is larger than the front surface. There is an outer peripheral area where the front surface is not bonded to the exit surface, Edges are inclined to the sides of the exit surface.

The imaging device for an endoscope of an embodiment includes an imaging device having a front surface and a rear surface facing the front surface, and an imaging device having a light receiving surface and a back surface facing the light receiving surface, wherein the imaging device has the light receiving surface. A light receiving unit is disposed, and an external electrode connected to the light receiving unit is disposed on the light receiving surface or the back surface. The imaging unit has a light incident surface and a light incident surface facing the light incident surface. An emission surface, wherein the emission surface is adhered to the front surface, a laminated optical part to which a plurality of optical members are adhered, and a core wire and an outer cover, wherein the core wire is electrically connected to the external electrode. A signal cable connected to the output surface, the output surface and the front surface are rectangular, the output surface is larger than the front surface, and the output surface has an outer peripheral area where the front surface is not bonded, The front side is inclined with respect to the side of the emission surface. That.

According to the embodiment of the present invention, it is possible to provide a highly reliable and minimally invasive endoscope and a highly reliable small-diameter endoscope imaging apparatus.

It is a perspective view of an endoscope of an embodiment. It is a perspective view of an imaging device of a 1st embodiment. FIG. 3 is a cross-sectional view of the imaging device according to the first embodiment, taken along line III-III of FIG. 2. It is a rear surface schematic diagram of the imaging device of 1st Embodiment. It is a rear surface schematic diagram of the imaging device of a comparative example. It is a rear surface schematic diagram of the imaging device of the modification 1 of 1st Embodiment. It is a rear surface schematic diagram of the imaging device of the modification 2 of 1st Embodiment. It is sectional drawing of the imaging device of 2nd Embodiment. It is a rear surface schematic diagram of the imaging device of 2nd Embodiment. It is a rear surface schematic diagram of the imaging device of the modification 1 of 2nd Embodiment. It is sectional drawing of the imaging device of 3rd Embodiment. It is a rear surface schematic diagram of the lamination optical part of the imaging device of 3rd Embodiment. It is a front schematic diagram of the imaging part of the imaging device of 3rd Embodiment. It is sectional drawing of the imaging device of the modification 1 of 3rd Embodiment. FIG. 13 is an exploded cross-sectional view of an imaging device according to a second modification of the third embodiment. FIG. 13 is an exploded perspective view of an imaging device according to a modification 2 of the third embodiment. It is sectional drawing of the imaging device of 4th Embodiment.

<First embodiment>
<Configuration of endoscope>
As shown in FIG. 1, the endoscope system 3 including the endoscope 9 of the present embodiment includes the endoscope 9, a processor 80, a light source device 81, and a monitor 82. For example, in the endoscope 9, the flexible insertion section 90 is inserted into the body cavity of the subject, captures an in-vivo image of the subject, and outputs an imaging signal.

操作 At the base end of the insertion section 90 of the endoscope 9, an operation section (intermediate section) 91 provided with various buttons for operating the endoscope 9 is provided. The operation unit 91 has a treatment tool insertion port of a channel 94 into which a living body forceps, an electric scalpel, an inspection probe, or the like is inserted into a body cavity of the subject.

The insertion section 90 includes a rigid distal end portion 90A in which an imaging device for an endoscope (hereinafter, referred to as an “imaging device”) 1 is disposed, and a freely bendable connected to a base end portion of the distal end portion 90A. It is composed of a curved portion 90B and a flexible flexible portion 90C connected to the base end of the curved portion 90B. The bending section 90 </ b> B is bent by the operation of the operation section 91. The imaging device 1 transmits an imaging signal to the processor 80 via the signal cable 30.

The universal cord 92 extending from the operation unit 91 is connected to the processor 80 and the light source device 81 via the connector 93.

The processor 80 controls the entire endoscope system 3 and performs signal processing on the imaging signal to output the image signal as an image signal. The monitor 82 displays an image signal output by the processor 80.

The light source device 81 has, for example, a white LED. The illumination light emitted from the light source device 81 is guided to an illumination optical system (not shown) at the distal end portion 90A by passing through a universal cord 92 and a light guide (not shown) passing through the insertion portion 90, and illuminates the subject. I do.

As described later, since the imaging device 1 has high reliability and a small dimension in the direction orthogonal to the optical axis, the endoscope 9 having the small-diameter distal end portion 90A has high reliability and is minimally invasive.

The endoscope 9 may be a rigid endoscope, and may be used for medical or industrial purposes.

<Configuration of imaging device>
As shown in FIGS. 2 and 3, the imaging device 1 of the present embodiment includes a laminated optical unit 10, an imaging unit 20, and a signal cable 30.

In the following description, the drawings based on the embodiments are schematic, and the relationship between the thickness and the width of each part, the ratio of the thickness of each part, the relative angle, and the like are actual. It should be noted that the drawings may include portions having different dimensional relationships and ratios between the drawings. In some cases, illustration of some components and addition of reference numerals may be omitted. The direction of the subject is referred to as “front”.

The imaging unit 20 includes a cover glass 21 and an imaging element 22. The cover glass 21 has a front surface 21SA and an adhesive surface 21SB facing the front surface 21SA.
The imaging unit 20 has a front surface 20SA (the front surface 21SA of the cover glass 21) and a rear surface 20SB (the back surface 22SB of the image sensor 22) opposed to the front surface 20SA, and a plurality of external electrodes 24 are provided on the rear surface 20SB. I have. That is, the image sensor 22 has the light receiving surface 22SA and the back surface 22SB facing the light receiving surface 22SA, and the bonding surface 21SB of the cover glass 21 is bonded to the light receiving surface 22SA.

(4) The image sensor 22 has a light receiving part 23 as a light receiving circuit composed of a CCD or a CMOS image pickup circuit on the light receiving surface 22SA, and the light receiving part 23 is connected to a plurality of through wirings (not shown). The image sensor 22 may be either a front-side illuminated image sensor or a back-side illuminated image sensor. The light receiving unit 23 is connected to the plurality of external electrodes 24 on the back surface 22SB via respective through wirings. The plurality of external electrodes 24 are connected to a plurality of signal cables 30 that transmit image signals.

Although not shown, the imaging unit 20 is manufactured by cutting an imaging wafer having an imaging element wafer including a plurality of imaging elements 22 and a cover glass wafer bonded thereto. That is, an imaging element wafer provided with a plurality of light receiving sections 23 and the like is manufactured using a known semiconductor manufacturing technique on a silicon wafer or the like. Peripheral circuits for performing primary processing of output signals of the light receiving unit 23 and processing of drive control signals may be formed on the imaging element wafer.

(4) In order to protect the light receiving portion 23 of the imaging device wafer, a cover glass wafer made of, for example, 250 μm-thick flat glass is bonded to the imaging device wafer, and the imaging wafer is manufactured. The imaging wafer is subjected to, for example, grinding / polishing of the imaging element wafer so as to have a thickness of 300 μm, and then the through wiring connected to the light receiving unit 23 and the external electrode 24 on the rear surface 20SB are formed. . The cover glass wafer seals the entire surface of the light receiving unit 23 to protect the light receiving unit 23, but seals only the periphery of the light receiving unit 23 and forms an air gap (space) facing the light receiving unit 23. May be. Then, the imaging unit 20 is manufactured by cutting the imaging wafer.

It is preferable that an operation test of the imaging device 22 is performed on the imaging device wafer or the imaging wafer, and only the imaging unit 20 determined to be non-defective is used in subsequent steps.

The signal cable 30 includes a core wire 31 and an outer sheath 32, and the core wire 31 is electrically connected to the external electrodes 24 via the relay wiring board 35. Note that the core wire 31 may be joined to the external electrode 24. In order to reduce the dimension of the imaging device 1 in the direction orthogonal to the optical axis, the distal end portions of the relay wiring board 35 and the signal cable 30 are arranged in a space in which the emission surface 10SB (incident surface 10SA) is extended in the optical axis direction. It is preferred that

(4) The laminated optical unit 10 to which the plurality of optical members 11 to 16 are adhered has an incident surface 10SA on which light is incident and an exit surface 10SB facing the incident surface 10SA. The emission surface 10SB of the multilayer optical unit 10 is bonded to the front surface 20SA of the imaging unit 20 by a bonding unit (bonding layer) 19. For example, the bonding portion 19 made of an ultraviolet curable resin forms a fillet having a flared shape in the outer peripheral region A of the emission surface 10SB.

The

optical members

11 and 14 are resin lenses formed by molding resin. Each of the

optical members

11 and 14 may be a hybrid lens made of transparent glass having a parallel flat plate on which a resin lens is provided, or a glass lens formed by molding or injection molding. The optical member 12 is provided with a stop. The optical member 16 is a parallel plate filter made of an infrared ray cut material for removing infrared rays. The

optical members

13 and 15 are spacers.

しない Although not shown, the laminated optical unit 10 is a wafer-level structure manufactured by dicing a laminated wafer to which a plurality of optical wafers each having a plurality of optical members formed are adhered. The type, thickness, number of layers, and stacking order of the plurality of optical wafers can be appropriately changed.

側面 Since the side surface 10SS of the laminated optical unit 10 which is a wafer level laminated body is a cut surface, there is a cut mark in the optical axis direction. The cutting marks are minute linear irregularities on the cut surface generated by dicing.

The laminated wafer may be singulated into the laminated optical unit 10 by, for example, a cutting process by laser dicing, or a process of forming a cutting groove by sandblasting or etching.

出射 Emission surface 10SB (incident surface 10SA) of laminated optical unit 10 and front surface 20SA (rear surface 20SB) of imaging unit 20 are rectangular. And the output surface 10SB is larger than the front surface 20SA. That is, the length of the diagonal line of the rectangular emission surface 10SB is longer than the length of the diagonal line of the rectangular front surface 20SA. In particular, in the imaging device 1, the size of the circle circumscribing the square front surface 20SA is substantially the same as the size of the circle circumscribing the square output surface 10SB.

In the imaging device 1, the side of the front surface 20SA is not parallel to the side of the emission surface 10SB, but is inclined. That is, as shown in FIG. 4, the angle θ between the side 20S of the front surface 20SA and the side 10S of the emission surface 10SB is 45 degrees. On the other hand, in the imaging device 101 of the comparative example shown in FIG. 5, the side 20S of the front surface 20SA and the side 10S of the emission surface 10SB are parallel (θ = 0).

In other words, with respect to the imaging device 101 of the comparative example, in the imaging device 1, the front surface 20SA (the imaging unit 20) is rotated about the optical axis O with respect to the emission surface 10SB (the laminated optical unit 10). The rotation angle θ is 45 degrees.

総 The total area of the outer peripheral region A of the emission surface 10SB to which the front surface 20SA is not bonded is the same for both the imaging device 1 and the imaging device 101 of the comparative example. However, the area C1S of the largest circle C1 inscribed in the outer peripheral area A of the imaging device 1 is five times the area C2S of the largest circle C2 inscribed in the outer peripheral area A of the comparative imaging apparatus 101. That is, the outer peripheral area A of the imaging device 1 has a large area.

前面 The front surface 20SA of the imaging unit 20 is bonded to the emission surface 10SB of the laminated optical unit 10 by the bonding unit 19. Since the circle C1 is large, the maximum length S of the fillet of the bonding portion 19 is longer in the imaging device 1 than in the imaging device 101. The bonding portion 19 having a long fillet has a high bonding strength. The imaging device 1 has higher bonding strength between the imaging unit 20 and the laminated optical unit 10, and therefore has higher reliability than the imaging device 101.

The effect of the present invention is remarkable when the area C1S of the circle C1 of the imaging device 1 is at least twice the area C2S of the circle C2 of the imaging device 101 of the comparative example. The upper limit of the area C1S is not particularly limited, but is, for example, eight times the area C2S.

<Modification of First Embodiment>
In the imaging device 1, the size of the circumscribed circle of the square front surface 20SA was substantially the same as the size of the inscribed circle of the square exit surface 10SB. However, the shapes and relative sizes of the front surface 20SA and the emission surface 10SB can be changed.

では In the imaging device 1A of the first modification of the first embodiment shown in FIG. 6, the inscribed circle of the emission surface 10SB is larger than the circumscribed circle of the front surface 20SA. The exit surface 10SB is a substantially rectangular shape in which a corner is curved and chamfered.

では In the imaging device 1B of the modification 2 of the first embodiment shown in FIG. 7, the emission surface 10SB is a substantially square hexagon whose corners are chamfered by straight lines, and the front surface 20SA is rectangular. The angle (rotation angle) θ between the side 20S of the front surface 20SA and the side 10S of the emission surface 10SB is 35 degrees.

That is, the imaging device in which the emission surface 10SB is larger than the front surface 20SA, there is an outer peripheral area A of the emission surface 10SB to which the front surface 20SA is not bonded, and the side of the front surface 20SA is inclined with respect to the side of the emission surface 10SB, It has the same effect as the imaging device 1. Further, the exit surface 10SB and the front surface 20SA may be rectangles (substantially rectangles) whose corners are chamfered. Further, the emission surface 10SB may not be a square. Also, the front surface 20SA may be a rectangle or a substantially rectangle in which a corner is chamfered. That is, the “rectangle” in the present invention includes “substantially rectangular”.

In addition, with respect to the imaging device 101 of the comparative example in which the side 20S of the front surface 20SA and the side 10S of the emission surface 10SB are parallel, the rotation angle of the front surface 20SA with respect to the emission surface 10SB about the optical axis O is 30 degrees. The effect of the present invention is remarkable for an imaging device having a temperature of 60 degrees or more and 60 degrees or less.

製造 Further, since the imaging device 1 can use only the imaging unit 20 determined to be non-defective, the production yield is high.

<Second embodiment>
The imaging devices of the following embodiments and modified examples are similar to the imaging device 1 and the like, and have the same effects. Therefore, the same reference numerals are given to components having the same functions, and descriptions thereof will be omitted.

As shown in FIGS. 8 and 9, the imaging device 1C of the second embodiment has a relay wiring board 35C connected to the external electrode 24, and the core 31 of the signal cable 30C passes through the relay wiring board 35C. Connected to the external electrode 24. The signal cable 30C is thicker than the signal cable 30.

Although the imaging device 1C includes the thick signal cable 30C, the signal cable 30C is disposed in a space extending in the optical axis direction from the outer peripheral area A of the emission surface 10SB to which the front surface 20SA is not bonded. The dimensions of the orthogonal axis method are small.

In the imaging device 1D of the first modification of the second embodiment shown in FIG. 10, the core 31 of the signal cable 30D is arranged in a space extending from the outer peripheral area A in the optical axis direction. Not placed. However, since only a part of the signal cable 30D of the imaging device 1D protrudes from the space in which the outer peripheral area A extends in the optical axis direction, the dimension of the optical axis orthogonal method is small.

That is, in the

imaging devices

1C and 1D, the largest circle inscribed in the outer peripheral area A is large (the area is large), so that a thick signal cable can be arranged in the outer peripheral area A. The imaging device in which at least the core wire 31 is arranged in a space extending from the outer peripheral area A in the optical axis direction has a small dimension in the optical axis orthogonal direction.

Although not shown, it is needless to say that in the

imaging devices

1C and 1D, it is preferable that the fillet of the bonding portion 19 that bonds the emission surface 10SB and the light receiving surface 20SA spreads in the outer peripheral region.

<Third embodiment>
In the imaging device 1E according to the third embodiment shown in FIG. 11, the imaging element 22E of the imaging unit 20E has the external electrode 24 on the light receiving surface 22SA.

ＡAs shown in FIG. 12A, a wiring pattern 10P is present in the outer peripheral area A of the emission surface 10SB of the laminated optical unit 10E. One end of the wiring pattern 10P is covered by the imaging unit 20, but the other end is extended to the bonding electrode in the outer peripheral area A.

On the other hand, as shown in FIG. 12B, the cover glass 21E has the through wiring 21H connected to the external electrode 24, and the through wiring 21H is exposed on the front surface 20SA.

貫通 The through wiring 21H on the front surface 20SA is connected to one end of the wiring pattern 10P. A joining member 36E is joined to the joining electrode at the other end of the wiring pattern 10P, and the core wire 31 is joined to the joining member 36E.

<Modification 1 of Third Embodiment>
In the imaging device 1F according to the first modification of the third embodiment illustrated in FIG. 13, the imaging unit 20F does not include a cover glass, and includes an imaging element 22A. The external electrode 24 on the light receiving surface 22SA of the imaging element 22A is joined to the wiring pattern 10P.

That is, the cover glass is not an essential component of the imaging device.

<Modification 2 of Third Embodiment>
In an imaging device 1G according to a modification 2 of the third embodiment shown in FIG. 14, a frame portion (frame) 36G having a first main surface 36SA and a second main surface 36SB opposed to the first main surface 36SA is provided. It also has As shown in FIG. 15, the frame portion 36G houses the imaging unit 20E inside, the first main surface 36SA is adhered to the emission surface 10SB, and the frame of the concave portion H36 of the second main surface 36SB. The core wire 31 is joined to the electrode.

The core 31 may be joined to the frame electrode on the second main surface 36SB or the side surface 36SS.

(4) Since the imaging device 1G includes the frame 36G for connecting the imaging unit 20E and the signal cable 30, the manufacturing is easy.

<Fourth embodiment>
In the imaging device 1H according to the fourth embodiment shown in FIG. 16, the imaging unit 20H includes the stacked element 60 that is joined to the imaging element 22. The stacked element 60 has a plurality of semiconductor elements 61 to 64 stacked.

(4) The semiconductor elements 61 to 64 perform primary processing on an image signal output from the image sensor 22 or process a control signal for controlling the image sensor 22. For example, the semiconductor elements 61 to 64 include an AD conversion circuit, a memory, a transmission output circuit, a filter circuit, a thin film capacitor, a thin film inductor, and the like. The number of elements included in the stacked element 60 is, for example, 3 or more and 10 or less. The plurality of semiconductor elements 61 to 64 are electrically connected to each other via the through wiring 69.

In the manufacturing method of the imaging device 1H, in the manufacturing process of the imaging unit 20H, a plurality of element wafers each having a semiconductor element formed thereon are manufactured in addition to the cover glass wafer and the imaging element wafer. The element wafer includes a plurality of semiconductor elements 61 to 64 such as an AD conversion circuit, a memory, a transmission output circuit, a filter circuit, a thin film capacitor, and a thin film inductor.

(4) The imaging unit 20H including the stacked element 60 is manufactured by cutting the cover glass wafer, the imaging element wafer, and the stacked element wafer to which the plurality of element wafers are bonded.

(4) Since the imaging device 1H includes the small stacked element 60 that performs primary processing of the imaging signal, the imaging device 1H has substantially the same size as the imaging device 1, but has higher performance than the imaging device 1.

Needless to say, the endoscope having the imaging devices 1 to 1H has the effect of the endoscope 9 and further has the effect of the imaging devices 1 to 1H.

The present invention is not limited to the above-described embodiments and modified examples, and various changes, combinations, and applications are possible without departing from the spirit of the invention.

1, 1A to 1H ... Endoscope imaging device 3 ... Endoscope system 9 ... Endoscope 10 ... Laminated optical unit 10SA ... Incident surface 10SB ... Exit surface 10SS Side surface 19 Adhesive unit 20 Image pickup unit 20SA Front surface 20SB Rear surface 21 Cover glass 22 Image sensor 22SA Light receiving surface 22SB Back surface 23 ..Light receiving section 24 ... External electrode 30 ... Signal cable 35 ... Relay wiring board 36E ... Joining member 36G ... Frame 36SA ... First main surface 36SB ... Second Main surface 60 of the laminated element

Claims

Having an endoscope imaging device, the endoscope imaging device,
An image sensor having a front surface and a rear surface facing the front surface, including an image sensor having a light receiving surface and a rear surface facing the light receiving surface, wherein the image sensor has a light receiving unit disposed on the light receiving surface, An external electrode connected to a light receiving unit is disposed on the light receiving surface or the back surface, an imaging unit,
A laminated optical unit having an incident surface on which light is incident and an exit surface facing the incident surface, wherein the exit surface is adhered to the front surface, and a plurality of optical members are adhered;
A signal cable comprising a core wire and an outer sheath, wherein the core wire is electrically connected to the external electrode,
The output surface and the front surface are rectangular, the output surface is larger than the front surface, and the output surface has an outer peripheral area where the front surface is not bonded, and the side of the front surface is inclined with respect to the side of the output surface. An endoscope characterized by doing.
An image sensor having a front surface and a rear surface facing the front surface, including an image sensor having a light receiving surface and a rear surface facing the light receiving surface, wherein the image sensor has a light receiving unit disposed on the light receiving surface, An external electrode connected to a light receiving unit is disposed on the light receiving surface or the back surface, an imaging unit,
A laminated optical unit having an incident surface on which light is incident and an exit surface facing the incident surface, wherein the exit surface is adhered to the front surface, and a plurality of optical members are adhered;
A signal cable comprising a core wire and an outer sheath, wherein the core wire is electrically connected to the external electrode,
The output surface and the front surface are rectangular, the output surface is larger than the front surface, and the output surface has an outer peripheral area where the front surface is not bonded, and the side of the front surface is inclined with respect to the side of the output surface. An imaging device for an endoscope.
3. The endoscope according to claim 2, wherein the area of the largest circle inscribed in the outer peripheral region is at least twice as large as the area parallel to the side of the front surface and the side of the emission surface. 4. Imaging device.
The front surface is rotated around the optical axis with respect to the light exit surface with respect to the case where the front surface side is parallel to the light exit surface side, and the rotation angle is 30 degrees or more and 60 degrees or less. The imaging device for an endoscope according to claim 2 or 3, wherein:
5. The endoscope imaging apparatus according to claim 2, wherein a fillet of a bonding portion that bonds the light-emitting surface and the light-receiving surface extends to the outer peripheral region. 6. apparatus.
The imaging device for an endoscope according to any one of claims 2 to 5, wherein the external electrodes of the imaging device are disposed on the back surface.
7. The imaging device according to claim 2, wherein the imaging unit has a cover glass having the front surface and an adhesive surface facing the front surface, and the adhesive surface is adhered to the light receiving surface. The imaging device for an endoscope according to claim 1.
The external electrode of the imaging element is disposed on the light receiving surface,
The imaging device for an endoscope according to claim 7, wherein the cover glass has a through wiring connected to the external electrode.
The endoscope according to any one of claims 2 to 8, wherein at least the core wire of the signal cable is disposed in a space in which the outer peripheral area extends in the optical axis direction. Imaging device.
A bonding electrode electrically connected to the external electrode is provided in the outer peripheral region,
The imaging device for an endoscope according to any one of claims 2 to 9, wherein the core wire is connected to the bonding electrode.
A frame having a first main surface and a second main surface facing the first main surface;
The frame unit accommodates the imaging unit therein, the first main surface is adhered to the emission surface,
The inner core according to any one of claims 2 to 10, wherein the core wire is joined to the second main surface, a concave portion of the second main surface, or a frame electrode on a side surface. Endoscope imaging device.
The imaging unit includes a stacked element including a plurality of semiconductor elements,
The imaging device for an endoscope according to any one of claims 2 to 11, wherein the stacked semiconductor is joined to the imaging element.